Composition for encapsulating organic light emitting element and display device using same

Abstract

The present invention relates to a composition for encapsulating an organic light-emitting element and a display device using the same, and more specifically, to a composition for encapsulating an organic light-emitting element comprising a photoinitiator, a first photocurable monomer, and a second photocurable monomer, the first and second photocurable monomers not containing silicon and aromatic hydrocarbons, according to the invention, the packaging composition with low dielectric constant and high film hardness is prepared according to an ink jet technology, so that a display device with a high-sensitivity touch sensor is provided.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefits of Korean Patent Applications Nos. 10 - 2023 - 0187786 and 10 - 2024 - 0085852, the entire contents of which are incorporated herein by reference. Technical field

[0003] The present invention relates to a composition for encapsulating an organic light - emitting element and an organic light - emitting element display device prepared therefrom. Background art

[0004] An organic light - emitting element display device, as a display device that emits light by itself when an electric current is applied, has its light - emitting characteristics reduced and its lifespan shortened when it comes into contact with external moisture or oxygen. Therefore, it is necessary to use a packaging material to protect the light - emitting substance from external moisture and oxygen.

[0005] The packaging material is a multi - layer structure composed of an inorganic layer and an organic layer. The inorganic layer can be formed by chemical vapor deposition using plasma, atomic layer deposition, or physical sputtering, and the organic layer can be formed by inkjet or vacuum evaporation deposition.

[0006] The role of the organic layer is to prevent or cover defects or particles generated when forming the inorganic layer. Recently, this organic layer is formed by an inkjet or photocuring process. Therefore, the viscosity, diffusivity, and vapor pressure of the photocuring composition used for the organic layer are important. When the encapsulation layer is formed under the touch sensor of the display device, the performance of the touch sensor is determined by the dielectric constant of the encapsulation layer. In particular, the low dielectric constant of the material used for the organic layer with a relatively high dielectric constant is emphasized. Since it functions as a packaging material, it is required to have a film hardness of a certain level or more.

[0007]

Prior art documents

[0008]

Patent documents

[0009] (Patent Document 1) Chinese Registered Patent No. 107155328 Summary of the invention

[0010] Problems to be solved

[0011] An object of an embodiment of the present invention is to provide a packaging composition having a low dielectric constant suitable for an inkjet process and a high film hardness, thereby providing an organic light - emitting element display device having a highly sensitive touch sensor.

[0012] Solutions to the problems

[0013] Preferably, the encapsulating composition of the present invention contains a photoinitiator; a first photocurable monomer represented by the following Chemical Formula 1 and a second photocurable monomer represented by Chemical Formula 2.

[0014] [Chemical Formula 1]

[0015] Y1-X1-Y2

[0016] In the above Chemical Formula 1,

[0017] X1 is an alkylene group having 2 to C 30 ,

[0018] Y1 and Y2 are Chemical Formula 3,

[0019] [Chemical Formula 2]

[0020]

[0021] In the above Chemical Formula 2,

[0022] Y3 is Chemical Formula 3,

[0023] Z is an -O- or -NH- group,

[0024] X2 is an alkylene group having 1 to C 30 ,

[0025] A is an aliphatic cyclic group having 3 to C 30 ,

[0026] B is a cyclic group containing at least one C -3 to C 30 double bond,

[0027] The A ring and the B ring are fused to each other,

[0028] n1 is an integer from 0 to 5,

[0029] [Chemical Formula 3]

[0030]

[0031] In the above Chemical Formula 3,

[0032] * represents the connecting site,

[0033] R1 is hydrogen or methyl ester,

[0034] Preferably, X1, X2, Y1 to Y3, and R1 may each be further substituted with one or more substituents selected from the group consisting of: deuterium; halogen; C1 to C 30an alkyl group; a boron group; a germanium group; a cyano group; an amino group; a nitro group; C1-C 30 an alkylthio group; C1-C 30 an alkoxy group; a fluorenyl group; C2-C 30 a heterocyclyl group containing at least one heteroatom selected from the group consisting of O, N, S, Si, and P; C3-C 30 an aliphatic cyclic group; and combinations thereof, and a ring may be formed between adjacent substituents.

[0035] Preferably, the first photocurable monomer includes 1,2-ethylene glycol diacrylate, 1,3-propanediol diacrylate, 1,4-butanediol diacrylate, 1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, 1,7-heptanediol diacrylate, 1,8-octanediol diacrylate, 1,9-nonanediol diacrylate, 1,10-decanediol diacrylate, 1,11-undecanediol diacrylate, 1,12-dodecanediol diacrylate, 1,13-tridecanediol diacrylate, 1,14-tetradecanediol diacrylate, 1,15-pentadecanediol diacrylate, 1,2-ethylene glycol dimethacrylate, 1,3-propanediol dimethacrylate, 1,4-butanediol dimethacrylate, 1,5-pentanediol dimethacrylate, 1,6-hexanediol dimethacrylate, 1,7-heptanediol dimethacrylate, 1,8-octanediol dimethacrylate, 1,9-nonanediol dimethacrylate, 1,10-decanediol dimethacrylate, 1,11-undecanediol dimethacrylate, 1,12-dodecanediol dimethacrylate, 1,13-tridecanediol dimethacrylate, 1,14-tetradecanediol dimethacrylate, 1,15-pentadecanediol dimethacrylate, 2,3-propanediol diacrylate, 2,4-butanediol diacrylate, 3,4-butanediol diacrylate, 2,5-pentanediol diacrylate, 4,5-pentanediol diacrylate, 2,6-hexanediol diacrylate, 4,6-hexanediol diacrylate, 2,7-heptanediol diacrylate, 5,7-heptanediol diacrylate, 2,8-octanediol diacrylate, 6,8-octanediol diacrylate, 2,9-nonanediol diacrylate, 7,9-nonanediol diacrylate, 2,10-decanediol diacrylate, 8,10-decanediol diacrylate, 3,12-dodecanediol diacrylate, 11,12-

[0036] Dodecanediol diacrylate, 5,15 - pentadecanediol diacrylate, 10,15 -

[0037] pentadecanediol diacrylate, 2,3 - propanediol dimethacrylate, 2,4 - butanediol dimethacrylate, 3,4 - butanediol dimethacrylate, 2,5 - pentanediol dimethacrylate, 4,5 - pentanediol dimethacrylate, 2,6 - hexanediol dimethacrylate, 4,6 - hexanediol dimethacrylate, 2,7 - heptanediol dimethacrylate, 5,7 - heptanediol dimethacrylate, 2,8 - octanediol dimethacrylate, 6,8 - octanediol dimethacrylate, 2,9 - nonanediol dimethacrylate, 7,9 - nonanediol dimethacrylate, 2,10 - decanediol dimethacrylate, 8,10 - decanediol dimethacrylate, 2,12 - dodecanediol dimethacrylate, 6,12 - dodecanediol dimethacrylate, 10,12 - dodecanediol dimethacrylate, 2,15 - pentadecanediol dimethacrylate, 7,15 - pentadecanediol dimethacrylate, 12,15 - pentadecanediol dimethacrylate, or a combination thereof.

[0038] In the second photocurable monomer, the A ring contains an aliphatic ring group selected from 3 - to 6 - membered rings; the B ring contains a carbocyclic group having at least one double bond in the ring and selected from 3 - to 6 - membered rings, and the A ring and the B ring may further contain one or more substituents selected as alkyl groups of C1 - C 30 and preferably, a ring may be formed between adjacent substituents.

[0039] Preferably, the second photocurable monomer contains the following T - 1 to T - 50 or a combination thereof.

[0040]

[0041]

[0042]

[0043] Preferably, the encapsulating composition further contains hollow silica particles.

[0044] Preferably, in the encapsulating composition, the content of the hollow silica particles is 0.1 wt% to 10 wt%.

[0045] Preferably, the size of the hollow silica particles is 30 nm to 100 nm.

[0046] Preferably, in 100 parts by weight (total amount) of the encapsulating composition, the content of the first photocurable monomer is 40 to 80 parts by weight.

[0047] Preferably, in 100 parts by weight (total amount) of the encapsulating composition, the content of the second photocurable monomer is 20 to 60 parts by weight.

[0048] Preferably, the surface tension of the encapsulating composition is 20 to 40 mN / m.

[0049] Another aspect of the present invention can provide an encapsulating film formed by coating and curing the encapsulating composition by light curing.

[0050] Preferably, the encapsulating film uses an ink head that ink - jets the encapsulating composition of the present invention with a droplet size of 2 to 40 pL (picoliters).

[0051] Preferably, the thickness of the encapsulating film is 3 to 15 μm.

[0052] Preferably, at a wavelength of 550 nm, the transmittance of the encapsulating film is 90% to 99%.

[0053] Preferably, at a frequency of 1 kHz to 300 kHz, the dielectric constant of the encapsulating film is 0.1 to 3.2 F / m.

[0054] Preferably, the modulus of the encapsulating film is 1000 Mpa to 5000 Mpa.

[0055] Another aspect of the present invention can provide an organic barrier layer containing the encapsulating composition.

[0056] Another aspect of the present invention can provide a display device including the organic barrier layer.

[0057] Another aspect of the present invention can provide an electronic device including the display device and a control unit for driving the display device.

[0058] Advantages of the Invention

[0059] The photocurable monomer of the present invention satisfies the following conditions: does not contain a silicon group, does not contain aromatic hydrocarbons, and at 1 kHz, 100 kHz, and 300 kHz, the dielectric constant is 3.2 F / m or less, the modulus is 1000 Mpa or more, and at a wavelength of 550 nm, the transmittance is 90% or more, thereby providing an organic light - emitting element display device with a highly sensitive touch sensor.

[0060] That is, when the modulus is lower than 1000 Mpa, due to the low hardness, external impact will cause cracks, and the resulting penetration of moisture and oxygen will affect the organic light-emitting element; when the dielectric constant exceeds 3.2 F / m, the sensitivity of the touch sensor will decrease. Detailed implementation mode

[0061] Hereinafter, implementation examples of the present invention will be described in detail. However, this is only a description for example and will not limit the present invention, which is only defined by the scope of the appended claims. Hereinafter, various components will be specifically described.

[0062] Preferably, the encapsulation composition of the present invention contains a photoinitiator; a first photocurable monomer represented by the following Chemical Formula 1 and a second photocurable monomer represented by Chemical Formula 2.

[0063] (1) Photocurable monomer

[0064] In the present invention, the first photocurable monomer may be a photocurable monomer represented by the following Chemical Formula 1, and the second photocurable monomer may be a photocurable monomer represented by Chemical Formula 2.

[0065] [Chemical Formula 1]

[0066] Y1-X1-Y2

[0067] In the above Chemical Formula 1,

[0068] X1 is an alkylene group having 2 to C 30 and

[0069] Y1 and Y2 are Chemical Formula 3,

[0070] [Chemical Formula 2]

[0071]

[0072] In the above Chemical Formula 2,

[0073] Y3 is Chemical Formula 3,

[0074] Z is an -O- or -NH- group,

[0075] X2 is an alkylene group having 1 to C 30 and

[0076] A is an aliphatic cyclic group having 3 to C 30 and

[0077] B is a cyclic group containing at least one C -3 to C 30 double bond,

[0078] Ring A and Ring B are fused to each other,

[0079] n1 is an integer from 0 to 5,

[0080] [Chemical formula 3]

[0081]

[0082] In the above Chemical formula 3,

[0083] * represents the connected position,

[0084] R1 is hydrogen or methyl ester,

[0085] Preferably, the X1, X2, Y1 to Y3 and R1 may each be further substituted with one or more substituents selected from the group consisting of: deuterium; halogen; C1-C 30 alkyl group; boron group; germanium group; cyano group; amino group; nitro group; C1-C 30 alkylthio group; C1-C 30 alkoxy group; fluorenyl group; C2-C 30 heterocyclyl group containing at least one heteroatom selected from the group consisting of O, N, S, Si and P; C3-C 30 aliphatic ring group; and combinations thereof, and rings may be formed between adjacent substituents.

[0086] For example, the first photocurable monomer having the structure shown in Chemical Formula 1 may include: 1,2-ethylene glycol diacrylate, 1,3-propanediol diacrylate, 1,4-butanediol diacrylate, 1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, 1,7-heptanediol diacrylate, 1,8-octanediol diacrylate, 1,9-nonanediol diacrylate, 1,10-decanediol diacrylate, 1,11-undecanediol diacrylate, 1,12-dodecanediol diacrylate, 1,13-tridecanediol diacrylate, 1,14-tetradecanediol diacrylate, 1,15-pentadecanediol diacrylate, 1,2-ethylene glycol dimethacrylate, 1,3-propanediol dimethacrylate, 1,4-butanediol dimethacrylate, 1,5-pentanediol dimethacrylate, 1,6-hexanediol dimethacrylate, 1,7-heptanediol dimethacrylate, 1,8-octanediol dimethacrylate, 1,9-nonanediol dimethacrylate, 1,10-decanediol dimethacrylate, 1,11-undecanediol dimethacrylate, 1,12-dodecanediol dimethacrylate, 1,13-tridecanediol dimethacrylate, 1,14-tetradecanediol dimethacrylate, 1,15-pentadecanediol dimethacrylate, 2,3-propanediol diacrylate, 2,4-butanediol diacrylate, 3,4-butanediol diacrylate, 2,5-pentanediol diacrylate, 4,5-pentanediol diacrylate, 2,6-hexanediol diacrylate, 4,6-hexanediol diacrylate, 2,7-heptanediol diacrylate, 5,7-heptanediol diacrylate, 2,8-octanediol diacrylate, 6,8-octanediol diacrylate, 2,9-nonanediol diacrylate, 7,9-nonanediol diacrylate, 2,10-decanediol diacrylate, 8,10-decanediol diacrylate, 3,12-dodecanediol diacrylate, 11,12-dodecanediol diacrylate, 5,15-pentadecanediol diacrylate, 10,15-pentadecanediol diacrylate, 2,3-propanediol dimethacrylate, 2,4-butanediol dimethacrylate, 3,4-butanediol dimethacrylate, 2,5-pentanediol dimethacrylate, 4,5-pentanediol dimethacrylate, 2,6-hexanediol dimethacrylate, 4,6-hexanediol dimethacrylate, 2,7-heptanediol dimethacrylate, 5,7-heptanediol dimethacrylate, 2,8-octanediol dimethacrylate, 6,8-octanediol dimethacrylate, 2,9-nonanediol dimethacrylate, 7,9-nonanediol dimethacrylate, 2,10-decanediol dimethacrylate, 8,10-decanediol dimethacrylate, 2,12-dodecanediol dimethacrylate, 6,12-dodecanediol dimethacrylate, 10,12-dodecanediol dimethacrylate, 2,15 - pentanediol dimethacrylate, 7,15 - pentanediol dimethacrylate, 12,15 - pentanediol dimethacrylate, or a combination thereof. Preferably, it may include: 1,2 - ethylene glycol diacrylate, 1,3 - propanediol diacrylate, 1,4 - butanediol diacrylate, 1,5 - pentanediol diacrylate, 1,6 - hexanediol diacrylate, 1,7 - heptanediol diacrylate, 1,8 - octanediol diacrylate, 1,9 - nonanediol diacrylate, 1,10 - decanediol diacrylate, 1,11 - undecanediol diacrylate, 1,12 - dodecanediol diacrylate, 1,13 - tridecanediol diacrylate, 1,14 - tetradecanediol diacrylate, 1,15 - pentanediol diacrylate, 1,2 - ethylene glycol dimethacrylate, 1,3 - propanediol dimethacrylate, 1,4 - butanediol dimethacrylate, 1,5 - pentanediol dimethacrylate, 1,6 - hexanediol dimethacrylate, 1,7 - heptanediol dimethacrylate, 1,8 - octanediol dimethacrylate, 1,9 - nonanediol dimethacrylate, 1,10 - decanediol dimethacrylate, 1,11 - undecanediol dimethacrylate, 1,12 - dodecanediol dimethacrylate, 1,13 - tridecanediol dimethacrylate, 1,14 - tetradecanediol dimethacrylate, 1,15 - pentanediol dimethacrylate, or a combination thereof, but is not limited thereto.,

[0087] In the second photocurable monomer, the A ring includes an aliphatic ring group selected from 3 - to 6 - membered rings; the B ring includes a carbocyclic group containing at least one double bond in the ring and selected from 3 - to 6 - membered rings. The A ring and the B ring may further include one or more substituents selected as alkyl groups of C1 - C 30 and may preferably form a ring between adjacent substituents.

[0088] Examples of the photocurable monomer having the structure shown in Chemical Formula 2 may include the following T - 1 to T - 50 or a combination thereof, but are not limited thereto.

[0089]

[0090]

[0091] The "alkylene group" contains 1 to 30 carbons connected by single bonds, representing a radical of a saturated aliphatic functional group typified by a straight-chain alkyl group, a branched-chain alkyl group, a cycloalkyl (alicyclic) group, an alkyl-substituted cycloalkyl group, and a cycloalkyl-substituted alkyl group.

[0092] Unless otherwise described, the "aliphatic" represents an aliphatic hydrocarbon having 1 to 30 carbons, but is not limited thereto.

[0093] The "vinyl" represents a -CH=CH2- functional group.

[0094] The first photocurable monomer and the second photocurable monomer of the encapsulation composition described in the present invention do not contain silicon and aromatic hydrocarbons. The photocurable monomer without silicon has an aromatic group and a high dielectric constant, but the photocurable monomer without an aromatic group is difficult to form a sufficiently high film hardness. The photocurable composition of the encapsulation material for an organic light-emitting device described in the present invention can simultaneously employ the first photocurable monomer and the second photocurable monomer having the structures shown in Chemical Formula 1 and Chemical Formula 2 above to have a low dielectric constant and sufficient film hardness.

[0095] In 100 parts by weight of the encapsulation composition, the content of the first photocurable monomer is 40 to 80 parts by weight, preferably 40 to 75 parts by weight, and more preferably 50 to 75 parts by weight.

[0096] In 100 parts by weight of the encapsulation composition, the content of the second photocurable monomer is 20 to 60 parts by weight, preferably 20 to 50 parts by weight, and more preferably 20 to 40 parts by weight.

[0097] The encapsulation composition may further contain hollow silica particles.

[0098] In the total amount of the encapsulation composition, the content of the hollow silica particles may be 0.1 to 10% by weight.

[0099] Preferably, the size of the hollow silica particles is 30 to 100 nm.

[0100] In order to achieve the diffusibility and ejectability of the encapsulation composition, at 25°C, the surface tension is 20 to 40 mN / m, and preferably, it can be 25 to 38 mN / m.

[0101] (2) Photoinitiator

[0102] To achieve photocuring, a free radical photoinitiator needs to be used. The photoinitiator can be used alone or in combination of two or more.

[0103] The photopolymerization initiator can include triazine-based, acetophenone-based, benzophenone-based, thioxanthone-based, benzoin-based, phosphorus-based, oxime-based, or a mixture thereof.

[0104] For example, the triazine-based compounds include: 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-4-trichloromethyl(piperonyl)-6-triazine, 2-4-trichloromethyl(4'-methoxystyryl)-6-triazine, etc.

[0105] For example, the acetophenone-based compounds include: 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloroacetophenone, p-t-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc.

[0106] For example, the benzophenone-based compounds include: benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

[0107] For example, the thioxanthone compounds include: thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, etc.

[0108] For example, the benzoin compounds include: benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, etc.

[0109] For example, the phosphorus-based one can be diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, benzyl(diphenyl)phosphine oxide TPO (BASF) or a mixture thereof. For example, when using a phosphorus-based initiator, the composition of the present invention exhibits better initiation performance at long-wavelength UV.

[0110] For example, the oxime compounds include: 1-[4-(phenylthio)phenyl]-1,2-octanedione-2-(O-benzoyl oxime), 1-[({1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethylidene}amino)oxy]-1-(O-acetyl oxime)ethanol, 1-[ethyl-6-{2-methyl-4-(2,2-dimethyl-1,3-dioxolan-4-yl)methoxybenzoyl}-9H-carbazol-3-yl]ethane, 1-[4-[3-[4-[[2-acetoxy]ethyl]sulfonyl]-2-methylbenzoyl]-6-[1-[(acetoxy)imino]ethyl]-9H-carbazol-9-yl]phenyl-1-(O-acetyl oxime)n-octanol, 1-[9-ethyl-6-(2-methyl-4-tetrahydrofuranylmethoxybenzoyl)-9H-carbazol-3-yl]-1-(O-acetyl oxime)ethanol, etc.

[0111] In addition to the compounds, the photoinitiator can also be a carbazole-based compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a non-imidazole compound, etc.

[0112] As a free radical polymerization initiator, the initiator can be a peroxide-based compound, an azo-based compound, etc.

[0113] For example, the peroxide-based compounds include: peroxoketones such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methyl cyclohexanone peroxide, acetylacetone peroxide; diperoxyacyls such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, bis-3,5,5-trimethylhexanoyl peroxide; hydroperoxides such as 2,4,4-trimethylpentan-2-yl hydroperoxide, cumene hydroperoxide, isopropylbenzene hydroperoxide, t-butyl hydroperoxide; dialkyl peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, 1,3-bis(t-butoxyisopropyl)benzene, n-butyl t-butylperoxyvalerate; alkyl succinate esters such as 2,4,4-trimethylpentyl phenoxyacetate peroxide, α-cumyl neodecanoate peroxide, t-butyl peroxybenzoate, di-t-butyl peroxide trimethyladipate; percarbonates such as bis-3-methoxybutyl peroxydicarbonate, bis-2-ethylhexyl peroxydicarbonate, bis-4-t-cyclohexylbutyl peroxydicarbonate, diisopropyl peroxydicarbonate, acetyl cyclohexylsulfonyl peroxide, t-aryl carbonate butyl peroxide, etc.

[0114] For example, the azo-based compounds include: 1,1'-azobis(cyclohexane-1-carbonitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(isobutyl methyl ester), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutyronitrile), 4,4'-azobis(4-cyanovaleric acid), etc.

[0115] After the initiator absorbs light and undergoes a transition to the excited state, it transfers its energy and is thus used together with the photosensitizer that undergoes a chemical reaction. For example, the photosensitizers include: triethylene glycol bis-3-mercaptopropionate, pentaerythritol tetra-3-mercaptopropionate, dipentaerythritol tetra-3-mercaptopropionate, etc.

[0116] In 100 parts by weight of the encapsulating composition, the content of the photoinitiator can be 0.01 to 10% by weight, preferably 0.5 to 8% by weight.

[0117] When the photoinitiator is included within the above range, excellent film hardness can be obtained, and during the photocuring process, sufficient curing is initiated. Therefore, the reliability is excellent, and outgassing caused by unreacted initiator can also be prevented.

[0118] The photoinitiator absorbs light in actinic rays of 254 nm to 450 nm.

[0119] On the other hand, the present invention can provide an encapsulating composition for coating and forming a coating; and an encapsulating film formed by photocuring.

[0120] Preferably, the encapsulation film is formed by coating and layering using an ink head, which ink - jets the encapsulation composition of the present invention in a droplet size of 2 to 40 pL (picoliters).

[0121] In the photo - curing step of the encapsulation composition, light in the wavelength range of 254 nm to 450 nm is irradiated at an intensity of 10 to 500 mW / cm 2 for 1 second to 50 seconds to achieve curing.

[0122] The preparation of the encapsulation layer film includes the photo - curing step, and the encapsulation layer film has a low dielectric constant and excellent film hardness.

[0123] Preferably, the thickness of the encapsulation film is 3 μm to 15 μm.

[0124] At a wavelength of 550 nm, the transmittance of the encapsulation film is 90% to 99%, and preferably, it can be 93% to 99%.

[0125] At a frequency of 1 kHz to 300 kHz, the dielectric constant of the encapsulation film is 0.1 to

[0126] 3.2 F / m. Preferably, at a frequency of 1 kHz to 300 kHz, the dielectric constant can be 0.1 to 3.0 F / m.

[0127] Preferably, at 1 kHz, the dielectric constant of the encapsulation film is 0.1 to 3.2 F / m, at 100 kHz, the dielectric constant is 0.1 to 3.2 F / m, or at 300 kHz, the dielectric constant can be 0.1 to 3.2 F / m. Further preferably, at 1 kHz, the dielectric constant can be 0.1 to 3.0 F / m, at 100 kHz, the dielectric constant can be 0.1 to 3.0 F / m, or at 300 kHz, the dielectric constant can be 0.1 to 3.0 F / m.

[0128] The modulus of the encapsulation film is 1000 Mpa to 5000 Mpa, and preferably, it can be

[0129] 1100 Mpa to 4000 Mpa. Further preferably, it can be 1100 Mpa to 3500 Mpa.

[0130] Another aspect of the present invention provides a display including the encapsulation film.

[0131] The display device may include a light - emitting diode. The light - emitting diode may include an organic light - emitting diode (OLED) or an inorganic light - emitting diode (ILED), but is not limited thereto.

[0132] The electroluminescent diode may include a cathode electrode, an anode electrode, and an intermediate layer located between the cathode electrode and the anode electrode. The intermediate layer may include the above-mentioned light-scattering thin film. The electroluminescent diode may further include one or more of functional layers such as a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer, a light-emitting layer, and an organic barrier layer.

[0133] When describing the display device according to the embodiments of the present disclosure, unless otherwise specifically described, the content of the encapsulation composition is the same as the description of the encapsulation composition in the above embodiments of the present disclosure, and thus, it may be omitted. The encapsulation composition according to the embodiments of the present disclosure exhibits a low dielectric constant and excellent film hardness characteristics. Therefore, an electroluminescent diode including the same may have a highly sensitive touch sensor.

[0134] On the other hand, an embodiment of the present disclosure provides an electronic device, which includes a display device having an optical film and a control unit for driving the display device.

[0135] When describing the electronic device according to the embodiments of the present disclosure, unless otherwise specifically described, the content of the display device is the same as the description of the display device in the above embodiments of the present disclosure, and thus, it may be omitted.

[0136] For example, the electronic device may include a display device, a lighting device, a solar cell, a portable or mobile terminal (e.g., a smart phone, a tablet computer, a PDA, an electronic dictionary, a PMP, etc.), a navigation terminal, a game console, various TVs, various computer monitors, etc., but is not limited thereto, and any device in any form may be included as long as it includes the (several) components.

[0137] Hereinafter, preparation examples of the encapsulation composition and a method for preparing an encapsulation film according to the present disclosure will be specifically described by way of examples. However, the present disclosure is not limited by the following examples.

[0138] I. Preparation of the encapsulation composition

[0139] Hereinafter, an encapsulation composition was prepared with the components shown in Table 1 below.

[0140] Specifically, a photoinitiator was dissolved in a photocurable monomer of Chemical Formula 1 and a photocurable monomer of Chemical Formula 2, and then, other additives were added and stirred at room temperature. Then, the product was filtered to remove impurities, and an encapsulation composition was prepared.

[0141]

Table 1

[0142] Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 M122 (Miura Chemical Co., Ltd.) 37.2 37.2 M200 (Miura Chemical Co., Ltd.) 55.8 55.8 55.8 A-NODN' (Shin-Nakamura) 55.8 55.8 55.8 M1142 (Miura Chemical Co., Ltd.) 37.2 37.2 M1140 (Miura Chemical Co., Ltd.) 37.2 37.2 TPO (BASF) 7.0 7.0 7.0 7.0 7.0 7.0

[0143]

Table 2

[0144]

[0145]

[0146]

Table 3

[0147] Example 7 Example 8 Example 9 Example 10 Example 11 Example 12 A-NODN (Shin-Nakamura) 55.8 55.8 55.8 55.8 55.8 55.8 T-40 37.2 T-41 37.2 T-46 37.2 T-47 37.2 T-49 37.2 T-50 37.2 TPO (BASF) 7.0 7.0 7.0 7.0 7.0 7.0

[0148]

Table 4

[0149]

[0150]

Table 5

[0151]

[0152] The photocurable monomers and initiators used in the comparative examples and examples are as follows. The photocurable monomer is represented by Chemical Formula 1 and contains an alkylene group having 6 or more carbons. As the photocurable monomer containing aliphatic cyclic groups shown in Chemical Formula 2, lauryl acrylate (M122 / Miwon Chemical Co., Ltd.), 1,6 - hexanediol diacrylate (M200 / Miwon Chemical Co., Ltd.), 1,9 - nonanediol diacrylate (A - NODN / SHIN - NAKAMURA Co., Ltd.), isobornyl acrylate (M1140 / Miwon Chemical Co., Ltd.), the aromatic hydrocarbon photocurable monomer biphenyloxyethyl acrylate (M1142 / Miwon Chemical Co., Ltd.), and T - 4 (ethyl 2 - ((1,2,3,3a,4,5 - hexahydroxy - 1,3 - methylpentadien - 2 - yl)oxy)acrylate), T - 5 (ethyl 2 - ((1,2,3,3a,4,5 - hexahydroxy - 1,3 - methylpentadien - 2 - yl)amino)acrylate), T - 8 (1,2,3,3a,4,6a - hexahydroxybicyclopentadien - 2 - yl - acrylate), T - 16 (3a,4,5,6,7,7a - hexahydroxy - 1H - 4,7 - methanoinden - 6 - yl - acrylate), T - 28 (ethyl 2 - ((3a,4,5,6,7,7a - hexahydroxy - 1H - 4,7 - methanoinden - 6 - yl)oxy)acrylate), T - 29 (ethyl 2 - ((3a,4,5,6,7,7a - hexahydroxy - 1H - 4,7 - methanoinden - 6 - yl)oxy)methylacrylate), T - 40 (ethyl 2 - ((3a,4,5,6,7,7a - hexahydroxy - 1H - 4,7 - methanoinden - 6 - yl)amino)acetate), T - 41 (ethyl 2 - ((3a,4,5,6,7,7a - hexahydroxy - 1H - 4,7 - methanoinden - 6 - yl)amino)acrylate), T - 46 (2 - ((2 -

[0153] ((3a,4,5,6,7,7a - Hexahydroxy - 1H - 4,7 - methanoinden - 5 - yl)amino)ethyl)amino)ethyl acrylate), T - 47(ethyl 2 - (2 - (2 - ((3a,4,5,6,7,7a - hexahydroxy - 1H,4,7 - methanoinden - 5 - yl)oxy - ethoxy - ethoxy)acrylate), T - 49(ethyl 2 - ((2 - ((2 - ((3a,4,5,6,7,7a - hexahydroxy - 1H - 4,7 - methanoinden - 6 - yl)amino)ethyl)amino)ethyl)amino)ethyl)acrylate) and T - 50(14 - ((3a,4,5,6,7,7a - hexahydroxy - 1H - 4,7 - methanoinden - 6 - yl)oxy - 3,6,9,12 - tetraoxatetradecyl acrylate), and a phosphorus - based initiator (TPO / BASF) was also used. The components of Examples 1 - 1 to 12 - 1 were the same as those of Examples 1 to 12. On this basis, Hallow silica was added, and the dielectric constant, hardness and modulus were detected.

[0154] 7.0 g of the initiator, 37.2 g of lauryl acrylate (M122), and 55.8 g of hexanediol diacrylate (M200) were charged into a 125 mL brown polypropylene bottle and mixed at room temperature for 3 hours using a shaker to prepare the encapsulation composition of Comparative Example 1. Using the same method as in Comparative Example 1, Comparative Examples 2 to 6 and Examples 1 to 12, 1 - 1 to 12 - 1 were also prepared with the components and contents shown in Table 1 above.

[0155] The dielectric constant, hardness and modulus were detected according to the following analysis conditions.

[0156] II. Preparation of Encapsulation Film and Organic Barrier Layer

[0157] The method for preparing the organic barrier layer using the inkjet encapsulation composition is as follows.

[0158] (1) Coating and Coating Step

[0159] For the organic light - emitting element encapsulation composition described in the examples of the present invention, coating (coating), curing, etc. were combined to form an organic barrier layer. For example, the encapsulation composition was added to an inkjet head of 2 to 40 pL (picoliters) of droplets from Konica Minolta, and coated to a thickness of 3 μm to 15 μm to form a thin film.

[0160] (2) Photo - curing Step

[0161] For the coated encapsulation composition thin film, light in the wavelength range of 254 nm to 450 nm was irradiated at an intensity of 10 to 500 mW / cm 2 for 1 second to 50 seconds to achieve curing.

[0162] (3) Detection of dielectric constant

[0163] On a 50x50 mm substrate, the encapsulation film was prepared with a thickness of 11 μm, and then, a platinum electrode was coated with a thickness of 0.1 μm, and the coating area was the same as that of the encapsulation film to prepare a test piece. Using the detection equipment LCR meter E4980A (Keysight), the CP value was detected at 1, 100, and 300 kHz, and then, the dielectric constant was calculated.

[0164] (4) Detection of hardness and modulus

[0165] For the cured encapsulation film, using a nano-counter

[0166] HM2000 (FISCHERSCOPE), the modulus in Loading force (2 mN), Loading time (10 sec), and Creep time (5 sec) was detected through a Vickers indenter.

[0167]

Table 6

[0168]

[0169]

[0170] As a result of confirmation after photocuring the encapsulation material composition, Chemical Formula 1 includes 6 to 9 carbon chains. Comparative Examples 1 to 2 used monomers with 12 carbon chains to replace Chemical Formula 2, and their dielectric properties were low, but the modulus was below 1000 Mpa. Comparative Examples 3 to 4 used aromatic hydrocarbons to replace Chemical Formula 2, and their modulus properties ensured above 1000 Mpa, but upon detection, the dielectric constant was above 3.2 F / m. Comparative Examples 5 to 6 included monomers containing an aliphatic cyclic group, and their modulus ensured above 1000 Mpa, and upon detection, the dielectric constant was above 3.2 F / m.

[0171] Chemical Formula 1 of Examples 1 to 12 includes 9 carbon chains and includes the aliphatic cyclic group of Chemical Formula 2. It was confirmed that when a monomer with one or more double bonds must be used, the dielectric constant is below 3.2 F / m and the modulus is above 1000 Mpa.

[0172] Moreover, when including one or more double bonds in Chemical Formula 2, the curing rate increases, and it was confirmed that compared with Comparative Examples 4 to 6, the modulus increased by more than 700 Mpa. The more the content of ethylene oxide in Chemical Formula 2 increases, the dielectric constant will increase slightly and the modulus will decrease slightly.

[0173] Compared with Examples 1 to 12, Examples 1-1 to 12-1 include hollow silica particles. It has been confirmed that as inorganic particles are included, the modulus and surface hardness tend to become harder and increase, while the dielectric constant tends to decrease.

[0174] The above description merely illustrates the present invention. As long as those of ordinary skill in the technical field to which the present invention pertains can make various modifications without departing from the essential characteristics of the present invention.

[0175] Therefore, the embodiments disclosed in this specification are used to describe the present invention, rather than to limit the present invention. The idea and scope of the present invention are not limited by such embodiments. The scope of the claims of the present invention should be construed according to the appended claims, and should be construed to include all technologies within the same scope as falling within the scope of the claims of the present invention.

Claims

1. A composition for encapsulation, characterized in that: include: Photoinitiator; A first photocurable monomer represented by the following chemical formula 1 and a second photocurable monomer represented by the following chemical formula 2, [Chemical formula 1] Y1-X1-Y2 In the above chemical formula 1, X1 is C2~C 30 The alkylene group, Y1 and Y2 are chemical formula 3, [Chemical formula 2] In the above chemical formula 2, Y3 is the chemical formula 3, Z is an -O- or -NH- group, X2 is C1~C 30 The alkylene group, A is C3~C 30 The aliphatic ring group, B contains at least one C -3 ~C 30 Double bond ring group, Ring A and ring B are fused to each other. n1 is an integer from 0 to 5, [Chemical formula 3] In the above chemical formula 3, *Indicates connected parts. R1 is hydrogen or methyl ester, The X1, X2, Y1 to Y3 and R1 may be further substituted with one or more substituents selected from the group consisting of the following components: deuterium; halogen; C1-C 30 Alkyl group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group; C1~C 30 Alkoxy group; fluorenyl group; C2~C 30 A heterocyclic group comprising at least one heteroatom selected from the group consisting of O, N, S, Si and P; C3~C 30 and combinations thereof, and adjacent substituents may form a ring.

2. The encapsulation composition according to claim 1, characterized in that: The first photocurable monomer includes: 1,2-ethylene glycol diacrylate, 1,3-propylene glycol diacrylate, 1,4-butylene glycol diacrylate, 1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, 1,7-heptanediol diacrylate, 1,8-octanediol diacrylate, 1,9-nonanediol diacrylate, 1,10-decanediol diacrylate, 1,11-undecanediol diacrylate, 1,12-dodecanediol diacrylate, 1,13-tridecanediol diacrylate, 1,14-tetradecanediol diacrylate, 1,15-pentadecanediol diacrylate, 1,2-ethylene glycol dimethacrylate, 1,3-propylene glycol dimethacrylate, 1,4- Butanediol dimethacrylate, 1,5-pentanediol dimethacrylate, 1,6-hexanediol dimethacrylate, 1,7-heptanediol dimethacrylate, 1,8-octanediol dimethacrylate, 1,9-nonanediol dimethacrylate, 1,10-decanediol dimethacrylate, 1,11-undecanediol dimethacrylate, 1,12-dodecanediol dimethacrylate, 1,13-tridecanediol dimethacrylate, 1,14-tetradecanediol dimethacrylate, 1,15-pentadecanediol dimethacrylate, 2,3-propylene glycol dimethacrylate, 2,4-butanediol dimethacrylate, 3,4-butanediol dimethacrylate, 2,5-pentanediol dimethacrylate, 4, 5-Pentanediol diacrylate, 2,6-Hexanediol diacrylate, 4,6-Hexanediol diacrylate, 2,7-Heptanediol diacrylate, 5,7-Heptanediol diacrylate, 2,8-Octanediol diacrylate, 6,8-Octanediol diacrylate, 2,9-Nonanediol diacrylate, 7,9-Nonanediol diacrylate, 2,10-Decanediol diacrylate, 8,10-Decanediol diacrylate, 3,12-Dodecanediol diacrylate, 11,12-Dodecanediol diacrylate, 5,15-Pentadecanediol diacrylate, 10,15-Pentadecanediol diacrylate, 2,3-Propanediol dimethacrylate, 2,4-Butanediol dimethacrylate, 3,4-Butanediol dimethacrylate, 2,5-pentanediol dimethacrylate, 4,5-pentanediol dimethacrylate, 2,6-hexanediol dimethacrylate, 4,6-hexanediol dimethacrylate, 2,7-heptanediol dimethacrylate, 5,7-heptanediol dimethacrylate, 2,8-octanediol dimethacrylate, 6,8-octanediol dimethacrylate, 2,9-nonanediol dimethacrylate, 7,9-nonanediol dimethacrylate, 2,10-decanediol dimethacrylate, 8,10-decanediol dimethacrylate, 2,12-dodecanediol dimethacrylate, 6,12-dodecanediol dimethacrylate, 10,12-dodecanediol dimethacrylate, 2,15-pentadecanediol dimethacrylate, 7,15-pentadecanediol dimethacrylate, 12,15-pentadecanediol dimethacrylate or a combination thereof.

3. The encapsulation composition according to claim 1, characterized in that: In the second photocurable monomer, the A ring includes an aliphatic ring group selected from 3 to 6 members; the B ring includes a carbon ring group selected from 3 to 6 members and containing at least one double bond in the ring, and the A ring and the B ring may further include a C1-C 30 One or more substituents of an alkyl group, adjacent substituents form a ring.

4. The encapsulation composition according to claim 1, characterized in that: The second photocurable monomer comprises the following T-1 to T-50 or a combination thereof 5. The encapsulation composition according to claim 1, characterized in that: Further included are hollow silica particles.

6. The encapsulation composition according to claim 1, characterized in that: At 25°C, the surface tension is 20 to 40 mN / m.

7. A coating and encapsulation film prepared by applying the encapsulation composition according to claim 1 and photocuring the encapsulation composition.

8. The encapsulation film according to claim 11, characterized in that: The coating and coating uses an ink head that jets ink with a droplet size of 2 to 40 pL.

9. The encapsulation film according to claim 11, characterized in that: The thickness is 3μm to 15μm.

10. The encapsulation film according to claim 11, characterized in that: The dielectric constant is 0.1 to 3.2 F / m in the frequency range of 1 kHz to 300 kHz.

11. The encapsulation film according to claim 11, characterized in that: The modulus is 1,000Mpa to 5,000Mpa.

12. The encapsulation film according to claim 11, characterized in that: At a wavelength of 550nm, the transmittance is 90% to 99%.

13. An organic barrier layer comprising the encapsulation composition according to claim 1.

14. A display device comprising the organic barrier layer according to claim 13.

15. An electronic device comprising the display device according to claim 14 and a control unit for driving the display device.

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