Preparation method of display panel, display panel and electronic equipment

Abstract

The embodiment of the invention provides a preparation method of a display panel, the display panel and electronic equipment, and relates to the technical field of display. In the preparation method, before the light-emitting device is manufactured in the second isolation opening, the second side wall, facing the second isolation opening, of the first isolation part is subjected to surface roughness enhancement treatment, so that the surface roughness of the second side wall can be increased, and the bonding area between the packaging unit and the second side wall and the acting force between the packaging unit and the second side wall are increased; therefore, the situation that the second side wall and the packaging unit are separated to form a gap when the temperature changes is avoided, the packaging effect of the second light-emitting device is ensured, and the display effect of the display panel is ensured.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and in particular, to a method for manufacturing a display panel, a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) is considered to be the next-generation display technology after liquid crystal display technology. It has been widely used in various consumer electronic products such as smartphones, TVs, laptops, desktop computers, in-vehicle displays, and wearable devices due to its excellent color and image quality, and has become the mainstream technology in display panels.

[0003] In the process of manufacturing traditional display panels, the light-emitting pixel patterning is usually achieved through a Fine Metal Mask (FMM). The FMM technology is mature and has rich mass production experience. However, the FMM technology also has problems such as limited precision, high development cost, and long development cycle. The fine metal maskless technology eliminates the limitations of the traditional OLED process on the display screen size, resolution, and other screen body performances, and has the advantages of high performance, full-domain size, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, CN118781966A record the relevant content of the fine metal maskless technology for reference.

[0004] However, the process performance of current OLED display products still needs to be further improved. Summary of the Invention

[0005] In order to overcome the technical problems mentioned in the above technical background, the present application provides a method for manufacturing a display panel, a display panel, and an electronic device.

[0006] In the first aspect of the present application, a method for manufacturing a display panel is provided, and the method includes: Providing a substrate; Fabricating an isolation structure and a plurality of isolation openings formed by the isolation structure surrounding on the substrate, wherein the isolation structure includes a first isolation portion and a second isolation portion stacked in sequence, a positive projection of the first isolation portion on the substrate is located within a positive projection of the second isolation portion on the substrate, and the isolation openings include a first isolation opening and a second isolation opening; A light-emitting device with a different emission color and a packaging unit for packaging the corresponding light-emitting device are sequentially fabricated in the first isolation opening and the second isolation opening. Before fabricating the light-emitting device in the second isolation opening, a surface roughness enhancement treatment is performed on the second sidewall of the first isolation portion facing the second isolation opening. Among them, the light-emitting device includes a first light-emitting device and a second light-emitting device with different emission colors. At least a part of the first light-emitting device is located in the first isolation opening, and at least a part of the second light-emitting device is located in the second isolation opening.

[0007] In a possible implementation manner of the present application, the step of sequentially fabricating a light-emitting device with a different emission color and a packaging unit for packaging the corresponding light-emitting device in the first isolation opening and the second isolation opening, and performing a surface roughness enhancement treatment on the second sidewall of the first isolation portion facing the second isolation opening before fabricating the light-emitting device in the second isolation opening includes: A first device film layer of the first light-emitting device and a first packaging material layer are formed on the entire surface of one side of the substrate where the isolation structure is provided. Patterning the first device film layer and the first packaging material layer to form the first light-emitting device and the packaging unit for packaging the first light-emitting device in the first isolation opening, and at least etching and removing the first device film layer and the first packaging material layer in the second isolation opening. Placing the substrate in an electrolyte for reaction to form protrusions on the second sidewall. A second device film layer of the second light-emitting device and a second packaging material layer are formed on the entire surface of one side of the substrate where the isolation structure is provided. Patterning the second device film layer and the second packaging material layer to form the second light-emitting device and the packaging unit for packaging the second light-emitting device in the second isolation opening.

[0008] In a possible implementation manner of the present application, the isolation structure further includes a third isolation portion. In the direction away from the substrate, the third isolation portion, the first isolation portion, and the second isolation portion are sequentially stacked. The step of placing the substrate in an electrolyte for reaction to form protrusions on the second sidewall includes: Placing the substrate in an electrolyte to form an electrolytic cell with the first isolation portion as the cathode and the third isolation portion as the anode. Metal ions in the electrolyte obtain electrons on the second sidewall, are reduced to form metal atoms, and are deposited to obtain the protrusions.

[0009] In a possible implementation manner of the present application, after the step of placing the substrate in the electrolyte for reaction to form protrusions on the second sidewall, the method further includes: Taking the substrate out of the electrolyte and cleaning the substrate.

[0010] In a possible implementation manner of the present application, the material of the second isolation part includes metallic aluminum, and the electrolyte contains aluminum ions; Wherein, the concentration range of aluminum ions in the electrolyte is 0.08 mol / L to 0.12 mol / L.

[0011] In a possible implementation manner of the present application, the electrolyte includes aluminum trichloride solution; The solution temperature of the electrolyte is 25°C to 50°C.

[0012] In a possible implementation manner of the present application, the isolation opening further includes a third isolation opening, the light-emitting device further includes a third light-emitting device having a different light-emitting color from the first light-emitting device and the second light-emitting device. After the step of patterning the second device film layer and the second encapsulation material layer to form the second light-emitting device and the encapsulation unit for encapsulating the second light-emitting device in the second isolation opening, the method further includes: Placing the substrate in the electrolyte for reaction, performing surface roughness enhancement treatment on the third sidewall of the first isolation part facing the third isolation opening, and forming protrusions on the third sidewall; Forming a third device film layer and a third encapsulation material layer of the third light-emitting device on the entire surface of one side of the substrate where the isolation structure is provided; Patterning the third device film layer and the third encapsulation material layer to form the third light-emitting device and the encapsulation unit for encapsulating the third light-emitting device in the third isolation opening.

[0013] In a second aspect of the present application, there is also provided a display panel, the display panel includes: A substrate; An isolation structure, located on the substrate and enclosing a plurality of isolation openings on the substrate; A plurality of light-emitting devices, at least partially located in the isolation openings, the light-emitting devices include a first light-emitting device and a second light-emitting device with different light-emitting colors, the isolation openings include a first isolation opening and a second isolation opening, wherein, at least part of the first light-emitting devices are located in the first isolation opening, and at least part of the second light-emitting devices are located in the second isolation opening; A plurality of encapsulation units, respectively used for encapsulating the light-emitting devices corresponding to the isolation openings; Among them, the isolation structure includes a first isolation part and a second isolation part which are stacked in sequence. The orthographic projection of the first isolation part on the substrate is located within the orthographic projection of the second isolation part on the substrate. The first side wall of the first isolation part facing the first isolation opening has a first roughness, and the second side wall of the first isolation part facing the second isolation opening has a second roughness. Among them, the first roughness is less than or equal to the second roughness.

[0014] In a possible implementation manner of the present application, the side wall of the first isolation part facing the corresponding isolation opening has protrusions, and the density of the protrusions on the first side wall is less than or equal to the density of the protrusions on the second side wall; and / or, The protrusion height of the protrusions on the first side wall is less than or equal to the protrusion height of the protrusions on the second side wall.

[0015] In a possible implementation manner of the present application, the encapsulation unit is in contact with the protrusions on the side wall of the first isolation part facing the corresponding isolation opening; The bonding force per unit area between the encapsulation unit and the first side wall is less than or equal to the bonding force per unit area between the encapsulation unit and the second side wall.

[0016] In a possible implementation manner of the present application, the isolation opening further includes a third isolation opening, and the light-emitting device further includes a third light-emitting device having a different light-emitting color from the first light-emitting device and the second light-emitting device. At least part of the third light-emitting device is located within the third isolation opening; The third side wall of the first isolation part facing the third isolation opening has a third roughness. Among them, the first roughness is less than or equal to the third roughness.

[0017] In a possible implementation manner of the present application, the side wall of the first isolation part facing the corresponding isolation opening has protrusions, and the density of the protrusions on the first side wall is less than or equal to the density of the protrusions on the third side wall; and / or, The protrusion height of the protrusions on the first side wall is less than or equal to the protrusion height of the protrusions on the third side wall.

[0018] In a possible implementation manner of the present application, the isolation structure further includes a third isolation part. In the direction away from the substrate, the third isolation part, the first isolation part, and the second isolation part are stacked in sequence; the material of the first isolation part includes aluminum metal; the material of the third isolation part includes molybdenum metal.

[0019] In a possible implementation manner of the present application, the protrusion includes a protrusion main body and a surface layer located on the surface of the protrusion main body. The material of the protrusion main body includes aluminum metal, and the material of the surface layer includes aluminum oxide.

[0020] In a possible implementation manner of the present application, the protrusion includes burrs.

[0021] In a possible implementation manner of the present application, the display panel further includes a pixel defining layer, the pixel defining layer is located on a side of the isolation structure facing the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate; The pixel defining layer includes a plurality of pixel openings, a positive projection of the pixel openings on the substrate is located within a positive projection of the corresponding isolation openings on the substrate, and at least part of the light-emitting devices are located within the pixel openings; Preferably, the pixel defining layer is an inorganic pixel defining layer; Preferably, the pixel defining layer is a single-layer structure of silicon oxide or silicon nitride, or a stacked structure formed by alternating silicon oxide and silicon nitride; Preferably, in a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting material layer, and a second electrode stacked; wherein, the second electrode is connected to the isolation structure; The first electrode is disposed on a side of the pixel defining layer close to the substrate, and at least part of the first electrode is exposed by the pixel opening.

[0022] In a third aspect of the present application, a display panel is further provided, and the display panel includes: A substrate; An isolation structure, located on the substrate, and enclosing a plurality of isolation openings on the substrate; A plurality of light-emitting devices, at least part of which are located within the isolation openings, the light-emitting devices include a first light-emitting device and a second light-emitting device with different emission colors, the isolation openings include a first isolation opening and a second isolation opening, wherein, at least part of the first light-emitting devices are located within the first isolation opening, and at least part of the second light-emitting devices are located within the second isolation opening; A plurality of encapsulation units for encapsulating the light-emitting devices located within the corresponding isolation openings; Wherein, the isolation structure includes a first isolation portion and a second isolation portion stacked in sequence, a positive projection of the first isolation portion on the substrate is located within a positive projection of the second isolation portion on the substrate, a first side wall of the first isolation portion facing the first isolation opening has a first unit area bonding force with the encapsulation unit, and a first side wall of the first isolation portion facing the second isolation opening has a second unit area bonding force with the encapsulation unit, wherein, the first unit area bonding force is less than or equal to the second unit area bonding force.

[0023] In a fourth aspect of the present application, an electronic device is further provided. The electronic device includes a display panel prepared by any of the possible implementation manners in the first aspect, or a display panel in any of the possible implementation manners in the second aspect and the third aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the technical solutions of the embodiments of the present application, the accompanying drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 A schematic flowchart of a method for preparing a display panel provided in this embodiment is illustrated; Figure 2 For Figure 1 The corresponding process chart; Figure 3 Illustrate Figure 1 A schematic flowchart of sub-steps of step S130 in; Figure 4a And Figure 4b For Figure 3 The corresponding process chart; Figure 5a And Figure 5b Illustrate other partial process charts of the method for preparing a display panel provided in this embodiment; Figure 6 A schematic diagram of the positional relationship between the isolation structure and the isolation opening provided in this embodiment is illustrated; Figure 7 Illustrate Figure 6 One of the cross-sectional views at the AA position in; Figure 8 Illustrate Figure 6 Another cross-sectional view at the AA position in; Figure 9 Illustrate Figure 6 A third cross-sectional view at the AA position in; Figure 10 Illustrate Figure 6 A fourth cross-sectional view at the AA position in.

[0026] Icon: 1 - Display panel; 11 - Substrate; 12 - Isolation structure; 1201 - Isolation opening; 1201a - First isolation opening; 1201b - Second isolation opening; 1201c - Third isolation opening; 1202a - First sidewall; 1202b - Second sidewall; 1202c - Third sidewall; 121 - First isolation part; 1211 - Protrusion; 12111 - Protrusion main body; 12112 - Surface layer; 122 - Second isolation part; 123 - Third isolation part; 13 - Light-emitting device; 13a - First light-emitting device; 13b - Second light-emitting device; 13c - Third light-emitting device; 131 - First electrode; 132 - Light-emitting material layer; 133 - Second electrode; 14 - Pixel defining layer; 1401 - Pixel opening; 1611 - Encapsulation unit; 162 - First encapsulation layer; 163 - Second encapsulation layer; 21 - First device film layer; 22 - Second device film layer; 23 - Third device film layer; 31 - First encapsulation material layer; 32 - Second encapsulation material layer; 33 - Third encapsulation material layer. Detailed implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. The components of the embodiments of the present application described and illustrated herein can be arranged and designed in various different configurations.

[0028] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this application is usually placed during use. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0029] Improving the density of light-emitting devices (i.e., pixel density) in a display panel is an important way to improve the display effect. However, currently, the display panel made by the Fine Metal Mask (FMM) technology is limited by technology and cannot further increase the density of light-emitting devices. Through long-term research, it is found that to solve the technical problem that the density of light-emitting devices cannot be further improved, an isolation structure is provided in some display panels. When the light-emitting material layer and the cathode are deposited in a whole layer, the light-emitting material layer and the cathode can be disconnected at the position of the isolation structure. Different color light-emitting devices can be formed in different isolation openings through multiple deposition and multiple etching processes. The above process is also called light-emitting device patterning.

[0030] In the above display panel, the post-fabricated light-emitting devices are prone to the problem of dark spots, which seriously affects the display effect of the display panel.

[0031] Research has found that the main reason for the above technical problems is the failure of the encapsulation of the post-fabricated light-emitting devices. Moisture invades the light-emitting devices, resulting in dark spots in the light-emitting devices. Further research has found that the failure of the encapsulation of the post-fabricated light-emitting devices is due to the fact that the encapsulation unit should originally be closely attached to the isolation structure. However, due to the small force between the two, under the influence of the external environment, the encapsulation unit and the isolation structure are separated, forming a gap through which moisture can invade.

[0032] To solve the above technical problems, the following technical solutions are innovatively designed. The specific implementation solutions of this application will be described in detail below with reference to the accompanying drawings. It should be noted that the defects existing in the above prior art solutions are all the results obtained through practice and careful research during the invention and creation process. Therefore, the discovery process of the above technical problems and the solutions proposed by this embodiment below for the above problems should be regarded as contributions to this application, rather than being understood as well-known technical content in the art.

[0033] Please refer to Figure 1 and Figure 2 , where Figure 1 illustrates the flowchart of the manufacturing method of the display panel provided in this embodiment, Figure 2 illustrates Figure 1 the corresponding process chart. The following will introduce in detail the process of how this embodiment solves the above technical problems through process improvement in combination with Figure 1 and Figure 2 .

[0034] Step S110: Provide a substrate 11.

[0035] In this embodiment, the substrate 11 is a multi-layer structure. The substrate 11 at least includes a plurality of conductive layers and insulating layers located between adjacent conductive layers. A pixel circuit for providing a driving signal for the light-emitting device can be formed in the substrate 11.

[0036] Step S120: Fabricate an isolation structure 12 on the substrate 11 and a plurality of isolation openings 1201 surrounded by the isolation structure 12 on the substrate 11.

[0037] In this embodiment, the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 which are stacked in sequence. The orthographic projection of the first isolation portion 121 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11. That is, the second isolation portion 122 extends towards the corresponding isolation opening 1201 relative to the first isolation portion 121. The first isolation portion 121 and the second isolation portion 122 form an undercut structure, so as to form independent light-emitting devices in each isolation opening 1201 when the device film layer of the light-emitting device is deposited over the entire surface. The isolation opening 1201 includes a first isolation opening 1201a and a second isolation opening 1201b. The first isolation opening 1201a can be multiple, and the second isolation opening 1201b can also be multiple.

[0038] Step S130, light-emitting devices 13 with different light-emitting colors and encapsulation units 1611 for encapsulating the corresponding light-emitting devices 13 are sequentially fabricated in the first isolation opening 1201a and the second isolation opening 1201b. Before fabricating the light-emitting device 13 in the second isolation opening 1201b, the surface roughness of the second sidewall of the first isolation portion 121 facing the second isolation opening 1201b is enhanced.

[0039] In other embodiments of this embodiment, the surface roughness of the first sidewall of the first isolation portion 121 facing the first isolation opening 1201a can also be enhanced before fabricating the light-emitting device 13 in the first isolation opening 1201a.

[0040] The light-emitting device 13 includes a first light-emitting device 13a and a second light-emitting device 13b with different light-emitting colors. At least part of the first light-emitting device 13a is located within the first isolation opening 1201a, and at least part of the second light-emitting device 13b is located within the second isolation opening 1201b.

[0041] In this embodiment, the surface roughness enhancement treatment refers to increasing the surface area of the sidewall, that is, the bonding area (contact area) between the sidewall and the encapsulation unit 1611 can be increased, thereby increasing the acting force between the first isolation portion 121 and the encapsulation unit 1611. Among them, the rougher the surface of the sidewall, the larger the contact area between the sidewall and the encapsulation unit 1611, and the greater the acting force between the first isolation portion 121 and the encapsulation unit 1611. When affected by the external environment, the possibility of the first isolation portion 121 and the encapsulation unit 1611 separating to form a gap is smaller.

[0042] It is found that during the process of fabricating the isolation opening 1201 in step S120, the side of the first isolation portion 121 facing the corresponding isolation opening 1201 will form a sidewall with a certain roughness due to the deposition of metal ions in the etching solution on it during the etching process. When fabricating the first light-emitting device 13a, the device film layer and the encapsulation material layer of the first light-emitting device 13a are formed over the entire surface. During the patterning process of the device film layer and the encapsulation material layer, it is necessary to etch away the device film layer and the encapsulation material layer within the second isolation opening 1201b. During the etching process, in order to completely etch away the device film layer and the encapsulation material layer within the second isolation opening 1201b, it is inevitable to over-etch the sidewall of the first isolation portion 121 facing the second isolation opening 1201b, making the originally rough sidewall flat. When fabricating the second light-emitting device 13b in the second isolation opening 1201b, the force (bonding force) between the encapsulation unit 1611 for encapsulating the second light-emitting device 13b and the second sidewall 1202b of the first isolation portion 121 facing the second isolation opening 1201b will become smaller, less than the force between the encapsulation unit 1611 for encapsulating the first light-emitting device 13a and the first sidewall 1202a of the first isolation portion 121 facing the first isolation opening 1201a. When affected by the external environment, the encapsulation unit 1611 for encapsulating the second light-emitting device 13b is likely to separate from the first isolation portion 121 to form a gap through which moisture can invade, resulting in dark spot defects in the second light-emitting device 13b.

[0043] In this embodiment, before fabricating the light-emitting device 13 in the second isolation opening 1201b, performing a surface roughness enhancement treatment on the second sidewall 1202b of the first isolation portion 121 facing the second isolation opening 1201b can increase the surface roughness of the second sidewall 1202b, increase the contact area between the encapsulation unit 1611 and the second sidewall 1202b and the force between them, thereby avoiding the situation where the second sidewall 1202b and the encapsulation unit 1611 separate to form a gap when the temperature changes, ensuring the encapsulation effect of the second light-emitting device 13b, and guaranteeing the display effect of the display panel 1.

[0044] Further, please refer to Figure 3 、 Figure 4a and Figure 4b , in this embodiment, step S130 can be implemented in the following manner.

[0045] Step S1301, form the first device film layer 21 and the first encapsulation material layer 31 of the first light-emitting device over the entire surface on one side of the substrate 11 where the isolation structure 12 is provided.

[0046] Among them, the first device film layer 21 of the first light-emitting device can be formed into a film on the entire surface by evaporation, and the first encapsulation material layer 31 can be fabricated on the entire surface by Chemical Vapor Deposition (CVD).

[0047] Step S1302: Pattern the first device film layer 21 and the first encapsulation material layer 31 to form the first light-emitting device 13a and the encapsulation unit 1611 for encapsulating the first light-emitting device 13a within the first isolation opening 1201a, and etch and remove at least the first device film layer 21 and the first encapsulation material layer 31 within the second isolation opening 1201b.

[0048] Step S1303: Place the substrate 11 in an electrolyte for reaction to form a protrusion 1211 on the second sidewall 1202b.

[0049] That is, in this embodiment, the surface roughness of the second sidewall 1202b is mainly increased by forming the protrusion 1211 on the second sidewall 1202b.

[0050] Specifically, the isolation structure 12 further includes a third isolation portion (not shown in the figure). In the direction away from the substrate 11, the third isolation portion, the first isolation portion 121, and the second isolation portion 122 are stacked in sequence. Step S1303 can be implemented in the following manner. Place the substrate 11 in the electrolyte to form an electrolytic cell with the first isolation portion 121 as the cathode and the third isolation portion as the anode; the metal ions in the electrolyte obtain electrons on the second sidewall 1202b, are reduced to form metal atoms, and are deposited to obtain the protrusion 1211.

[0051] After step S1303, the method for manufacturing the display panel provided in this embodiment further includes taking out the substrate 11 from the electrolyte and cleaning the substrate 11.

[0052] Optionally, the density and height of the protrusion 1211 deposited on the second sidewall 1202b can be controlled by controlling the reaction duration of the substrate 11 in the electrolyte.

[0053] In this embodiment, the surface roughness of the second sidewall 1202b can be made greater than or equal to the surface roughness of the first sidewall 1202a by controlling the reaction duration, that is, the density of the protrusion 1211 on the second sidewall 1202b is greater than or equal to the density of the protrusion 1211 on the first sidewall 1202a, and the height of the protrusion 1211 on the second sidewall 1202b is greater than or equal to the height of the protrusion 1211 on the first sidewall 1202a.

[0054] In a possible implementation, the material of the first isolation part 121 includes metallic aluminum, and the electrolyte contains aluminum ions (Al 3+ ), wherein the concentration range of aluminum ions in the electrolyte is 0.08 mol / L to 0.12 mol / L. Exemplarily, the concentration of aluminum ions in the electrolyte includes 0.08 mol / L, 0.085 mol / L, 0.088 mol / L, 0.094 mol / L, 0.1 mol / L, 0.105 mol / L, 0.109 mol / L, 0.114 mol / L, or 0.12 mol / L, etc.

[0055] Optionally, the electrolyte may include an aluminum trichloride (AlCl3) solution, and the solution temperature of the electrolyte is 25°C to 50°C. Exemplarily, the solution temperature of the electrolyte includes 25°C, 27°C, 31°C, 38°C, 41°C, 43°C, 45°C, 48°C, or 50°C, etc. Among them, the higher the temperature of the electrolyte, the more intense the electrochemical reaction.

[0056] Step S1304, on one entire surface of the isolation structure 12 provided on the substrate 11, form a second device film layer 22 of the second light-emitting device and a second encapsulation material layer 32.

[0057] Step S1305, perform a patterning process on the second device film layer 22 and the second encapsulation material layer 32, and form a second light-emitting device 13b and an encapsulation unit 1611 for encapsulating the second light-emitting device 13b within the second isolation opening 1201b.

[0058] Furthermore, in this embodiment, please refer to Figure 5a and Figure 5b , the isolation opening 1201 further includes a third isolation opening 1201c. A plurality of third isolation openings 1201c may be provided. The light-emitting device 13 further includes a third light-emitting device 13c having a different light-emitting color from that of the first light-emitting device 13a and the second light-emitting device 13b. After step S1305, the method further includes the following steps.

[0059] First, place the substrate 11 in the electrolyte for reaction, perform a surface roughness enhancement treatment on the third sidewall 1202c of the first isolation part 121 facing the third isolation opening 1201c, and form protrusions on the third sidewall 1202c.

[0060] Specifically, the manner of performing the surface roughness enhancement treatment on the third sidewall 1202c is the same as the manner of performing the surface roughness enhancement treatment on the second sidewall 1202b described above, and thus will not be elaborated here.

[0061] Next, on one entire surface of the isolation structure 12 provided on the substrate 11, form a third device film layer 23 of the third light-emitting device and a third encapsulation material layer 33.

[0062] Then, the third device film layer 23 and the third encapsulation material layer 33 are patterned to form a third light-emitting device 13c and an encapsulation unit 1611 for encapsulating the third light-emitting device 13c within the third isolation opening 1201c.

[0063] In this embodiment, the isolation structure 12 may further include a third isolation portion 123. In the direction away from the substrate 11, the third isolation portion 123, the first isolation portion 121, and the second isolation portion 122 are sequentially stacked. The orthographic projection of the third isolation portion 123 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11. Exemplarily, the material of the third isolation portion 123 may include molybdenum. When the substrate 11 is placed in an aluminum trichloride solution, the third isolation portion 123 may form the anode of the electrolytic cell, and the first isolation portion 121 may form the cathode of the electrolytic cell. Exemplarily, the third isolation portion 123 can be made the anode of the electrolytic cell and the first isolation portion 121 can be made the cathode of the electrolytic cell by connecting an external power supply; alternatively, the third isolation portion 123 can be made the anode of the electrolytic cell and the first isolation portion 121 can be made the cathode of the electrolytic cell by the voltage formed by static electricity on the substrate 11.

[0064] The following electrochemical reaction can occur on the first isolation portion 121.

[0065] Al 3+ +3e-=Al↓ 2H + +2e-=H2↑ The following electrochemical reaction can occur on the third isolation portion 123.

[0066] Mo-6e-+7H2O=MoO4 2- +14H + In the above electrochemical reaction, the difference in the local concentration of the electrolyte causes the migration speed of some cations to be different from that of other cations. Therefore, different concentration gradients are formed near the cathode. According to the Monroe-Newman model, the difference in the concentration gradient causes the rate of conversion of Al 3+ to Al to be different, and it will select the nearest path for deposition, and finally accumulate into Al burrs. That is, the shape of the protrusion may include burrs.

[0067] Based on the same inventive concept, this embodiment also provides a display panel, where the display panel can be prepared by the foregoing method for preparing a display panel. The specific structure of the display panel 1 will be described in detail below with reference to the drawings. Please refer to Figure 6 and Figure 7 , where Figure 6 illustrates a schematic diagram of the distribution of the isolation structure and the isolation opening. Figure 7illustrates Figure 6 A schematic cross-sectional view of the AA position in Figure 6 . In this embodiment, the display panel 1 includes a substrate 11, an isolation structure 12, a light-emitting device 13, and a packaging unit 1611. Among them, the substrate 11 can be a multi-layer film structure, and the substrate 11 at least includes a plurality of conductive layers and insulating layers located between adjacent conductive layers. A pixel circuit for providing a driving signal for the light-emitting device 13 is formed in the substrate 11, and the conductive layer can be a metal conductive layer.

[0068] The isolation structure 12 is located on one side of the substrate 11, and the isolation structure 12 encloses an isolation opening 1201 on the substrate 11. In the direction away from the substrate 11, the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 arranged in a stacked manner. The orthographic projection of the first isolation portion 121 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11. The second isolation portion 122 protrudes toward the corresponding isolation opening 1201 relative to the first isolation portion 121 to form an undercut structure. Through this undercut structure, the light-emitting device layer (such as a light-emitting material layer, an electrode layer) deposited over the entire surface can be disconnected at this position, so as to independently form the film layer of the light-emitting device in different isolation openings 1201.

[0069] At least part of the light-emitting device 13 is disposed in the isolation opening 1201. The light-emitting device 13 includes a first light-emitting device 13a and a second light-emitting device 13b with different emission colors. The isolation opening 1201 includes a first isolation opening 1201a and a second isolation opening 1201b. Among them, at least part of the first light-emitting device 13a is located in the first isolation opening 1201a, and at least part of the second light-emitting device 13b is located in the second isolation opening 1201b.

[0070] The packaging unit 1611 is located on the side of the light-emitting device 13 away from the substrate 11. The packaging unit 1611 extends from the surface of the light-emitting device 13 through the first isolation portion 121 to the side of the second isolation portion 122 away from the substrate 11, that is, the packaging unit 1611 will be attached to the side wall of the first isolation portion 121 facing the isolation opening 1201.

[0071] The first side wall 1202a of the first isolation portion 121 facing the first isolation opening 1201a has a first roughness, and the second side wall 1202b of the first isolation portion 121 facing the second isolation opening 1201b has a second roughness. Among them, the first roughness is less than or equal to the second roughness.

[0072] In this embodiment, the first light-emitting device 13a and the second light-emitting device 13b are fabricated in the first isolation opening 1201a and the second isolation opening 1201b in sequence. By making the first roughness less than or equal to the second roughness, the bonding area between the encapsulation unit 1611 and the second sidewall 1202b and the acting force therebetween are increased, thereby avoiding the situation that the second sidewall 1202b and the encapsulation unit 1611 are separated to form a gap when affected by the external environment, ensuring the encapsulation effect of the second light-emitting device 13b, and guaranteeing the display effect of the display panel 1.

[0073] Further, the sidewall of the first isolation portion 121 facing the corresponding isolation opening 1201 has a protrusion 1211, and the sidewall roughness of the first isolation portion 121 can be changed by controlling the density and / or height of the protrusion 1211. The larger the sidewall roughness of the first isolation portion 121, the larger the bonding area between it and the encapsulation unit 1611, and the greater the acting force therebetween, and the smaller the probability that the two are separated to form a gap through which moisture can invade when affected by the external environment.

[0074] In this embodiment, the density of the protrusions 1211 on the first sidewall 1202a is less than or equal to the density of the protrusions 1211 on the second sidewall 1202b; and / or, The protrusion height of the protrusions 1211 on the first sidewall 1202a is less than or equal to the protrusion height of the protrusions 1211 on the second sidewall 1202b.

[0075] In this embodiment, the encapsulation unit 1611 contacts the protrusions on the sidewall of the first isolation portion 121 facing the corresponding isolation opening 1201. Specifically, the bonding force per unit area between the encapsulation unit 1611 and the first sidewall 1202a is less than or equal to the bonding force per unit area between the encapsulation unit 1611 and the second sidewall 1202b.

[0076] Further, please refer to Figure 8 , the isolation opening 1201 further includes a third isolation opening 1201c, the light-emitting device 13 further includes a third light-emitting device 13c having a different light-emitting color from the first light-emitting device 13a and the second light-emitting device 13b, and at least a part of the third light-emitting device 13c is located in the third isolation opening 1201c, wherein the third light-emitting device 13c is fabricated in the third isolation opening 1201c after the second light-emitting device 13b is fabricated in the second isolation opening 1201b.

[0077] Optionally, in this embodiment, the third sidewall 1202c of the first isolation portion 121 facing the third isolation opening 1201c has a third roughness, and the first roughness is less than or equal to the third roughness. In this way, the bonding area between the encapsulation unit 1611 and the third sidewall 1202c and the acting force therebetween can be increased, thereby avoiding the situation that a gap is formed due to the separation of the third sidewall 1202c and the encapsulation unit 1611 when the temperature changes, ensuring the encapsulation effect of the third light-emitting device 13c, and guaranteeing the display effect of the display panel 1.

[0078] Specifically, the density of the protrusions 1211 on the first sidewall 1202a is less than or equal to the density of the protrusions 1211 on the third sidewall 1202c; and / or, the protrusion height of the protrusions 1211 on the first sidewall 1202a is less than or equal to the protrusion height of the protrusions 1211 on the third sidewall 1202c.

[0079] Please refer to again Figure 8 , the isolation structure 12 further includes a third isolation portion 123. In the direction away from the substrate 11, the third isolation portion 123, the first isolation portion 121, and the second isolation portion 122 are sequentially stacked. The orthographic projection of the third isolation portion 123 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11. The materials of the third isolation portion 123 and the first isolation portion 121 are both metals. When the substrate 11 is placed in the etching solution, the first isolation portion 121 can serve as the cathode, and the third isolation portion 123 can serve as the anode to form an electrolytic cell.

[0080] Furthermore, in this embodiment, please refer to again Figure 7 , the material of the first isolation portion 121 includes aluminum metal, the material of the third isolation portion 123 includes molybdenum metal, the protrusion 1211 includes a protrusion main body 12111 and a surface layer 12112 located on the surface of the protrusion main body 12111. The material of the protrusion main body 12111 includes aluminum metal, and the material of the surface layer 12112 includes aluminum oxide.

[0081] Exemplarily, the protrusion 1211 may include burrs. The formation process of the protrusion 1211 can refer to the relevant description in the foregoing display panel manufacturing method and will not be elaborated herein.

[0082] Furthermore, please refer to Figure 9, the display panel 1 further includes a pixel defining layer 14, the pixel defining layer 14 is located on one side of the substrate 11, and the isolation structure 12 is located on the side of the pixel defining layer 14 away from the substrate 11. The pixel defining layer 14 includes a plurality of pixel openings 1401, at least part of the light emitting device 13 is located in the pixel opening 1401, and the pixel opening 1401 is connected to the isolation opening 1201. Exemplarily, the orthographic projection of the pixel opening 1401 on the substrate 11 is located within the orthographic projection of the corresponding isolation opening 1201 on the substrate 11. The orthographic projection of the pixel opening 1401 on the substrate 11 is located within the orthographic projection of the isolation opening 1201 on the substrate 11. In this embodiment, the pixel defining layer 14 may be an organic pixel defining layer or an inorganic pixel defining layer. Preferably, the pixel defining layer 14 is an inorganic pixel defining layer. When the pixel defining layer 14 is an inorganic pixel defining layer, the pixel defining layer 14 may be a single-layer structure of silicon oxide (SiOx) or silicon nitride (SiNx), or a stacked structure formed alternately of silicon oxide and silicon nitride.

[0083] Please refer again Figure 9 In the direction away from the substrate 11, the light emitting device 13 includes a first electrode 131, a light emitting material layer 132 and a second electrode 133 which are stacked in sequence, at least a portion of the first electrode 131 is exposed from the pixel opening 1401, and the second electrode 133 extends from the pixel opening 1401 through the pixel defining layer 14 to the side wall of the isolation structure 12 facing the isolation opening 1201, wherein the second electrode 133 may overlap with the third isolation portion 123, may overlap with the first isolation portion 121, or may overlap with both the third isolation portion 123 and the first isolation portion 121. Exemplarily, the first electrode 131 may be the anode of the light emitting device 13, and the second electrode 133 may be the cathode of the light emitting device 13.

[0084] In this embodiment, the isolation structure 12 can enclose a plurality of isolation openings 1201. The setting of the isolation structure 12 can form film layers of light-emitting devices of different colors in different isolation openings 1201 without the need for a fine metal mask, thereby reducing the manufacturing cost of the display panel. The isolation structure 12 can isolate the light-emitting material layer 132 and the second electrode 133 in the light-emitting device 13, so that different light-emitting devices 13 are independent of each other, so as to improve the crosstalk between adjacent light-emitting devices 13 and enhance the display effect. Adjacent light-emitting devices 13 can be independently packaged to improve the packaging yield. At the same time, due to the existence of the isolation structure 12, the light-emitting material layer 132 and the second electrode 133 in the light-emitting device 13 of each color in the display panel can be first prepared on the entire surface and then patterned, thereby eliminating the fine metal mask to save the manufacturing cost of the display panel.

[0085] For further information, please refer to Figure 10, the display panel 1 further includes a first encapsulation layer 162, which is located on the side of the encapsulation unit 1611 away from the substrate 11, and the first encapsulation layer 162 at least covers the encapsulation unit 1611. Optionally, the first encapsulation layer 162 includes a flat surface on the side away from the substrate 11.

[0086] Furthermore, the display panel 1 further includes a second encapsulation layer 163, which is located on the side of the first encapsulation layer 15 away from the substrate 11.

[0087] Optionally, the encapsulation unit 1611 and the second encapsulation layer 163 include inorganic materials, and the first encapsulation layer 162 includes organic materials, that is, the encapsulation unit 1611 and the second encapsulation layer 163 can be inorganic encapsulation layers, and the first encapsulation layer 162 can be an organic encapsulation layer. For example, the encapsulation unit 1611 and the second encapsulation layer 163 can be formed by chemical vapor deposition (CVD), and the first encapsulation layer 162 can be formed by ink-jet printing (IJP).

[0088] It can be understood that the display panel 1 may further include film layers such as a touch function layer, an optical adhesive layer, a polarizer, and a cover plate that are sequentially stacked on the side of the second encapsulation layer 163 away from the substrate 11. The above-mentioned film layers are conventional film layers of the display panel, and will not be elaborated here.

[0089] Based on the same inventive concept, the embodiment of the present application also provides an electronic device, which includes the display panel provided by the present application, or includes the display panel prepared by the preparation method of the display panel provided by this embodiment. The electronic device may include smart phones, tablet computers, in-vehicle display devices, smart wearable devices, televisions, laptop computers, and other devices with display functions.

[0090] The embodiment of the present application provides a preparation method of a display panel, a display panel, and an electronic device. In the preparation method, before manufacturing the light-emitting device in the second isolation opening, the surface roughness of the second side wall of the first isolation portion facing the second isolation opening is enhanced, which can increase the surface roughness of the second side wall, increase the bonding area and the acting force between the encapsulation unit and the second side wall, and further avoid the situation that the second side wall and the encapsulation unit are separated to form a gap when the temperature changes, ensure the encapsulation effect of the second light-emitting device, and guarantee the display effect of the display panel.

[0091] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application may have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; An isolation structure and a plurality of isolation openings formed by the isolation structure on the substrate are manufactured on the substrate, wherein the isolation structure comprises a first isolation portion and a second isolation portion which are stacked in sequence, an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate, and the isolation openings comprise a first isolation opening and a second isolation opening; Light-emitting devices with different luminous colors and packaging units for packaging corresponding light-emitting devices are sequentially manufactured in the first isolation opening and the second isolation opening, and the second side wall of the first isolation portion facing the second isolation opening is subjected to surface roughness enhancement treatment before the light-emitting device is manufactured in the second isolation opening; wherein the light-emitting device comprises a first light-emitting device and a second light-emitting device with different luminous colors, at least part of the first light-emitting device is located in the first isolation opening, and at least part of the second light-emitting device is located in the second isolation opening.

2. The method for preparing a display panel according to claim 1, wherein: The step of sequentially manufacturing light-emitting devices with different luminous colors and packaging units for packaging corresponding light-emitting devices in the first isolation opening and the second isolation opening, and performing surface roughness enhancement treatment on the second side wall of the first isolation portion facing the second isolation opening before manufacturing the light-emitting device in the second isolation opening comprises: Forming a first device film layer and a first packaging material layer of a first light-emitting device on the entire surface of one side of the substrate where the isolation structure is provided; Performing patterning on the first device film layer and the first packaging material layer to form the first light-emitting device and a packaging unit for packaging the first light-emitting device in the first isolation opening, and etching and removing at least the first device film layer and the first packaging material layer in the second isolation opening; placing the substrate in an electrolyte for reaction to form a protrusion on the second side wall; Forming a second device film layer and a second packaging material layer of a second light-emitting device on the entire surface of one side of the substrate where the isolation structure is provided; The second device film layer and the second packaging material layer are patterned to form the second light-emitting device and a packaging unit for packaging the second light-emitting device in the second isolation opening.

3. The method for preparing a display panel according to claim 2, wherein: The isolation structure further includes a third isolation portion, and in a direction away from the substrate, the third isolation portion, the first isolation portion and the second isolation portion are sequentially stacked, and the step of placing the substrate in an electrolyte for reaction to form a protrusion on the second side wall includes: placing the substrate in an electrolyte to form an electrolytic cell with the first separator as a cathode and the third separator as an anode; The metal ions in the electrolyte obtain electrons on the second side wall, are reduced to form metal atoms, and are deposited to obtain the protrusion.

4. The method for preparing a display panel according to claim 3, wherein: After the step of placing the substrate in an electrolyte for reaction to form a protrusion on the second side wall, the method further includes: The substrate is taken out from the electrolyte and cleaned.

5. The method for preparing a display panel according to claim 2, wherein: The material of the first isolation portion includes metal aluminum, and the electrolyte contains aluminum ions; Wherein, the concentration range of aluminum ions in the electrolyte is 0.08 mol / L~0.12 mol / L.

6. The method for preparing a display panel according to claim 5, wherein: The electrolyte includes aluminum chloride solution; The solution temperature of the electrolyte is 25°C to 50°C.

7. The method for preparing a display panel according to claim 2, wherein: The isolation opening further includes a third isolation opening, the light-emitting device further includes a third light-emitting device having a light-emitting color different from that of the first light-emitting device and the second light-emitting device, and after the step of patterning the second device film layer and the second packaging material layer to form the second light-emitting device and a packaging unit for packaging the second light-emitting device in the second isolation opening, the method further includes: Placing the substrate in an electrolyte for reaction, performing surface roughness enhancement treatment on a third side wall of the first isolation portion facing the third isolation opening, and forming a protrusion on the third side wall; Forming a third device film layer and a third packaging material layer of a third light-emitting device on the entire surface of one side of the substrate where the isolation structure is provided; The third device film layer and the third packaging material layer are patterned to form the third light-emitting device and a packaging unit for packaging the third light-emitting device in the third isolation opening.

8. A display panel, characterized in that: The display panel comprises: substrate; An isolation structure is located on the substrate and encloses a plurality of isolation openings on the substrate; A plurality of light emitting devices, at least partly located in the isolation opening, the light emitting devices comprising a first light emitting device and a second light emitting device emitting light of different colors, the isolation opening comprising a first isolation opening and a second isolation opening, wherein at least part of the first light emitting device is located in the first isolation opening, and at least part of the second light emitting device is located in the second isolation opening; A plurality of packaging units, respectively used to package the light-emitting devices corresponding to the isolation openings; Among them, the isolation structure includes a first isolation part and a second isolation part which are stacked in sequence, the orthographic projection of the first isolation part on the substrate is located within the orthographic projection of the second isolation part on the substrate, the first side wall of the first isolation part facing the first isolation opening has a first roughness, and the second side wall of the first isolation part facing the second isolation opening has a second roughness, wherein the first roughness is less than or equal to the second roughness.

9. The display panel according to claim 8, wherein: The first isolation portion has a protrusion on a side wall facing the isolation opening, and the density of the protrusions on the first side wall is less than or equal to the density of the protrusions on the second side wall; and / or, The protrusion height of the protrusion on the first side wall is less than or equal to the protrusion height of the protrusion on the second side wall.

10. The display panel according to claim 8, wherein: The packaging unit contacts a protrusion on a side wall of the first isolation portion toward the isolation opening; A binding force per unit area between the encapsulation unit and the first side wall is less than or equal to a binding force per unit area between the encapsulation unit and the second side wall.

11. The display panel according to claim 8, wherein: The isolation opening further includes a third isolation opening, the light emitting device further includes a third light emitting device having a light emission color different from that of the first light emitting device and the second light emitting device, and at least part of the third light emitting device is located in the third isolation opening; A third sidewall of the first isolation portion facing the third isolation opening has a third roughness, wherein the first roughness is less than or equal to the third roughness.

12. The display panel according to claim 11, wherein: The first isolation portion has a protrusion on a side wall facing the isolation opening, and the density of the protrusions on the first side wall is less than or equal to the density of the protrusions on the third side wall; and / or, The protrusion height of the protrusion on the first side wall is less than or equal to the protrusion height of the protrusion on the third side wall.

13. The display panel according to claim 9, wherein: The isolation structure also includes a third isolation part. In the direction away from the substrate, the third isolation part, the first isolation part and the second isolation part are stacked in sequence; the material of the first isolation part includes metal aluminum; the material of the third isolation part includes metal molybdenum.

14. The display panel according to claim 13, wherein: The protrusion comprises a protrusion body and a surface layer located on the surface of the protrusion body. The material of the protrusion body comprises metal aluminum, and the material of the surface layer comprises aluminum oxide.

15. The display panel according to any one of claims 8 to 14, characterized in that: The display panel further comprises a pixel defining layer, wherein the pixel defining layer is located on a side of the isolation structure facing the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate; The pixel defining layer comprises a plurality of pixel openings, the orthographic projections of the pixel openings on the substrate are located within the orthographic projections of the corresponding isolation openings on the substrate, and at least part of the light emitting devices are located within the pixel openings.

16. A display panel, characterized in that: The display panel comprises: substrate; An isolation structure is located on the substrate and encloses a plurality of isolation openings on the substrate; A plurality of light emitting devices, at least partly located in the isolation opening, the light emitting devices comprising a first light emitting device and a second light emitting device emitting light of different colors, the isolation opening comprising a first isolation opening and a second isolation opening, wherein at least part of the first light emitting device is located in the first isolation opening, and at least part of the second light emitting device is located in the second isolation opening; A plurality of packaging units, used for packaging the light-emitting devices located in the corresponding isolation openings; Among them, the isolation structure includes a first isolation part and a second isolation part which are stacked in sequence, the orthographic projection of the first isolation part on the substrate is located within the orthographic projection of the second isolation part on the substrate, the first isolation part has a first unit area binding force with the packaging unit toward the first side wall of the first isolation opening, and the first isolation part has a second unit area binding force with the packaging unit toward the first side wall of the second isolation opening, wherein the first unit area binding force is less than or equal to the second unit area binding force.

17. An electronic device, characterized in that: The electronic device comprises a display panel prepared by the method for preparing a display panel according to any one of claims 1 to 7, or a display panel according to any one of claims 8 to 15.

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