Display panel manufacturing method, display panel and electronic equipment

Abstract

Embodiments of the present application provide a method for manufacturing a display panel, a display panel, and an electronic device, relating to the field of display technology. In the manufacturing method, before fabricating a light-emitting device in a second isolation opening, a surface roughness enhancement treatment is performed on the second sidewall of the first isolation portion facing the second isolation opening. This increases the surface roughness of the second sidewall, thereby increasing the bonding area and the force between the packaging unit and the second sidewall. This prevents the second sidewall and the packaging unit from separating and forming a gap when the temperature changes, thereby ensuring the packaging effect of the second light-emitting device and the display effect of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for manufacturing a display panel, a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) is considered to be the next generation display technology after liquid crystal display technology. Due to its excellent color and image quality, it is widely used in various consumer electronic products such as smartphones, TVs, laptops, desktop computers, car displays, wearable devices, etc., and has become the mainstream technology in display panels.

[0003] In traditional display panel manufacturing, pixel patterning is typically achieved using a fine metal mask (FMM). FMM technology is mature and boasts extensive mass production experience. However, FMM also presents challenges such as limited precision, high development costs, and long development cycles. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-area scalability, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe FMM-free technology for reference.

[0004] However, the process performance of current OLED display products needs to be further improved. Summary of the Invention

[0005] In order to overcome the technical problems mentioned in the above technical background, the present application provides a method for manufacturing a display panel, a display panel, and an electronic device.

[0006] In a first aspect of the present application, a method for manufacturing a display panel is provided, the method comprising:

[0007] providing a substrate;

[0008] Fabricating an isolation structure and a plurality of isolation openings formed on the substrate by the isolation structure on the substrate, wherein the isolation structure includes a first isolation portion and a second isolation portion stacked in sequence, the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate, and the isolation openings include a first isolation opening and a second isolation opening;

[0009] Light-emitting devices with different luminous colors and encapsulation units for encapsulating corresponding light-emitting devices are sequentially manufactured in the first isolation opening and the second isolation opening, and before the light-emitting device is manufactured in the second isolation opening, the second side wall of the first isolation portion facing the second isolation opening is subjected to surface roughness enhancement treatment; wherein the light-emitting device includes a first light-emitting device and a second light-emitting device with different luminous colors, at least part of the first light-emitting device is located in the first isolation opening, and at least part of the second light-emitting device is located in the second isolation opening.

[0010] In one possible implementation of the present application, the step of sequentially manufacturing light-emitting devices having different luminous colors and encapsulation units for encapsulating the corresponding light-emitting devices in the first isolation opening and the second isolation opening, and performing a surface roughness enhancement treatment on a second sidewall of the first isolation portion facing the second isolation opening before manufacturing the light-emitting device in the second isolation opening includes:

[0011] Forming a first device film layer and a first packaging material layer of a first light-emitting device on the entire surface of one side of the substrate where the isolation structure is provided;

[0012] Performing patterning on the first device film layer and the first packaging material layer to form the first light-emitting device and an encapsulation unit for encapsulating the first light-emitting device in the first isolation opening, and etching away at least the first device film layer and the first packaging material layer in the second isolation opening;

[0013] placing the substrate in an electrolyte to react and form a protrusion on the second sidewall;

[0014] forming a second device film layer and a second packaging material layer of a second light-emitting device on the entire surface of one side of the substrate where the isolation structure is provided;

[0015] The second device film layer and the second packaging material layer are patterned to form the second light-emitting device and a packaging unit for packaging the second light-emitting device in the second isolation opening.

[0016] In one possible implementation of the present application, the isolation structure further includes a third isolation portion, and in a direction away from the substrate, the third isolation portion, the first isolation portion, and the second isolation portion are stacked in sequence. The step of placing the substrate in an electrolyte for reaction to form a protrusion on the second sidewall includes:

[0017] placing the substrate in an electrolyte to form an electrolytic cell with the first separator serving as a cathode and the third separator serving as an anode;

[0018] The metal ions in the electrolyte obtain electrons on the second side wall, are reduced to form metal atoms, and are deposited to form the protrusion.

[0019] In a possible implementation of the present application, after the step of placing the substrate in an electrolyte for reaction to form a protrusion on the second sidewall, the method further includes:

[0020] The substrate is taken out from the electrolyte and cleaned.

[0021] In a possible implementation of the present application, the material of the second isolation portion includes metallic aluminum, and the electrolyte contains aluminum ions;

[0022] Wherein, the concentration range of aluminum ions in the electrolyte is 0.08 mol / L~0.12 mol / L.

[0023] In one possible implementation of the present application, the electrolyte includes an aluminum chloride solution;

[0024] The electrolyte solution temperature is 25°C to 50°C.

[0025] In one possible implementation manner of the present application, the isolation opening further includes a third isolation opening, the light-emitting device further includes a third light-emitting device having a different luminous color from the first light-emitting device and the second light-emitting device, and after the step of patterning the second device film layer and the second encapsulation material layer to form the second light-emitting device and an encapsulation unit for encapsulating the second light-emitting device in the second isolation opening, the method further includes:

[0026] placing the substrate in an electrolyte for reaction, performing surface roughness enhancement treatment on a third sidewall of the first isolation portion facing the third isolation opening, and forming a protrusion on the third sidewall;

[0027] forming a third device film layer and a third packaging material layer of a third light-emitting device on the entire surface of one side of the substrate where the isolation structure is provided;

[0028] The third device film layer and the third packaging material layer are patterned to form the third light-emitting device and a packaging unit for packaging the third light-emitting device in the third isolation opening.

[0029] In a second aspect of the present application, a display panel is further provided, comprising:

[0030] substrate;

[0031] An isolation structure is located on the substrate and encloses a plurality of isolation openings on the substrate;

[0032] a plurality of light-emitting devices, at least partially located in the isolation opening, the light-emitting devices including a first light-emitting device and a second light-emitting device emitting different colors, the isolation opening including a first isolation opening and a second isolation opening, wherein at least part of the first light-emitting device is located in the first isolation opening, and at least part of the second light-emitting device is located in the second isolation opening;

[0033] a plurality of packaging units, each used to package a light-emitting device corresponding to the isolation opening;

[0034] In which, the isolation structure includes a first isolation part and a second isolation part stacked in sequence, the orthographic projection of the first isolation part on the substrate is located within the orthographic projection of the second isolation part on the substrate, the first side wall of the first isolation part facing the first isolation opening has a first roughness, and the second side wall of the first isolation part facing the second isolation opening has a second roughness, wherein the first roughness is less than or equal to the second roughness.

[0035] In one possible implementation manner of the present application, the first isolation portion has a protrusion on a sidewall facing the isolation opening, and a density of the protrusions on the first sidewall is less than or equal to a density of the protrusions on the second sidewall; and / or,

[0036] The protrusion height of the protrusion on the first side wall is less than or equal to the protrusion height of the protrusion on the second side wall.

[0037] In a possible implementation manner of the present application, the packaging unit contacts a protrusion on a side wall of the first isolation portion that faces the isolation opening;

[0038] A unit area bonding force between the packaging unit and the first side wall is less than or equal to a unit area bonding force between the packaging unit and the second side wall.

[0039] In one possible implementation manner of the present application, the isolation opening further includes a third isolation opening, the light-emitting device further includes a third light-emitting device having a different light-emitting color from the first light-emitting device and the second light-emitting device, and at least a portion of the third light-emitting device is located within the third isolation opening;

[0040] A third sidewall of the first isolation portion facing the third isolation opening has a third roughness, wherein the first roughness is less than or equal to the third roughness.

[0041] In one possible implementation manner of the present application, the first isolation portion has a protrusion on a sidewall facing the isolation opening, and a density of the protrusions on the first sidewall is less than or equal to a density of the protrusions on the third sidewall; and / or,

[0042] The protrusion height of the protrusion on the first side wall is less than or equal to the protrusion height of the protrusion on the third side wall.

[0043] In a possible embodiment of the present application, the isolation structure also includes a third isolation portion, and in the direction away from the substrate, the third isolation portion, the first isolation portion and the second isolation portion are stacked in sequence; the material of the first isolation portion includes metal aluminum; and the material of the third isolation portion includes metal molybdenum.

[0044] In a possible implementation of the present application, the protrusion includes a protrusion body and a surface layer located on the surface of the protrusion body. The material of the protrusion body includes metallic aluminum, and the material of the surface layer includes aluminum oxide.

[0045] In a possible implementation of the present application, the protrusion includes a burr.

[0046] In one possible implementation of the present application, the display panel further includes a pixel defining layer, wherein the pixel defining layer is located on a side of the isolation structure facing the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate;

[0047] The pixel defining layer includes a plurality of pixel openings, wherein the orthographic projections of the pixel openings on the substrate are located within the orthographic projections of the corresponding isolation openings on the substrate, and at least part of the light emitting devices are located within the pixel openings;

[0048] Preferably, the pixel defining layer is an inorganic pixel defining layer;

[0049] Preferably, the pixel defining layer is a single-layer structure of silicon oxide or silicon nitride, or a stacked-layer structure formed alternately of silicon oxide and silicon nitride;

[0050] Preferably, in a direction away from the substrate, the light-emitting device comprises a first electrode, a light-emitting material layer, and a second electrode that are stacked; wherein the second electrode is connected to the isolation structure;

[0051] The first electrode is disposed on a side of the pixel definition layer close to the substrate, and at least a portion of the first electrode is exposed from the pixel opening.

[0052] According to a third aspect of the present application, a display panel is provided, comprising:

[0053] substrate;

[0054] An isolation structure is located on the substrate and encloses a plurality of isolation openings on the substrate;

[0055] a plurality of light-emitting devices, at least partially located in the isolation opening, the light-emitting devices including a first light-emitting device and a second light-emitting device emitting different colors, the isolation opening including a first isolation opening and a second isolation opening, wherein at least part of the first light-emitting device is located in the first isolation opening, and at least part of the second light-emitting device is located in the second isolation opening;

[0056] a plurality of packaging units, used for packaging the light-emitting devices located in the corresponding isolation openings;

[0057] In which, the isolation structure includes a first isolation part and a second isolation part stacked in sequence, the orthographic projection of the first isolation part on the substrate is located within the orthographic projection of the second isolation part on the substrate, the first isolation part has a first unit area binding force with the packaging unit toward the first side wall of the first isolation opening, and the first isolation part has a second unit area binding force with the packaging unit toward the first side wall of the second isolation opening, wherein the first unit area binding force is less than or equal to the second unit area binding force.

[0058] In a fourth aspect of the present application, an electronic device is further provided, comprising a display panel prepared by any possible implementation method in the first aspect, or a display panel in any possible implementation method in the second aspect and the third aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0060] Figure 1 A schematic diagram illustrating a process of a method for manufacturing a display panel provided in this embodiment;

[0061] Figure 2 for Figure 1 Corresponding process flow chart;

[0062] Figure 3 Example Figure 1 Schematic diagram of the sub-step flow of step S130;

[0063] Figure 4a and Figure 4b for Figure 3 Corresponding process flow chart;

[0064] Figure 5a and Figure 5bIllustrate other process flow charts of the method for manufacturing a display panel provided in this embodiment;

[0065] Figure 6 A schematic diagram illustrating the positional relationship between the isolation structure and the isolation opening provided in this embodiment is provided;

[0066] Figure 7 Example Figure 6 One of the cross-sectional diagrams at the AA position;

[0067] Figure 8 Example Figure 6 The second cross-sectional diagram at the AA position;

[0068] Figure 9 Example Figure 6 The third cross-sectional diagram at the AA position;

[0069] Figure 10 Example Figure 6 The fourth cross-sectional diagram at the AA position.

[0070] Icons: 1-display panel; 11-substrate; 12-isolation structure; 1201-isolation opening; 1201a-first isolation opening; 1201b-second isolation opening; 1201c-third isolation opening; 1202a-first sidewall; 1202b-second sidewall; 1202c-third sidewall; 121-first isolation portion; 1211-protrusion; 12111-protrusion body; 12112-surface layer; 122-second isolation portion; 123-third isolation portion; 13-light-emitting device; 13a-first light-emitting device; 13b-second light-emitting device; 13c-third light-emitting device; 131-first electrode; 132-light-emitting material layer; 133-second electrode; 14-pixel defining layer; 1401-pixel opening; 1611-packaging unit; 162-first packaging layer; 163-second packaging layer; 21-first device film layer; 22-second device film layer; 23-third device film layer; 31-first packaging material layer; 32-second packaging material layer; 33-third packaging material layer. DETAILED DESCRIPTION

[0071] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0072] In the description of this application, it should be noted that the terms "upper" and "lower" etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. These are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.

[0073] Increasing the density of light-emitting devices (i.e., pixel density) in display panels is an important way to improve display quality. However, current display panels manufactured using fine metal mask (FMM) technology are limited by technical limitations and cannot further increase the density of light-emitting devices. Long-term research has revealed that, to address this technical issue, some display panels incorporate an isolation structure. During the full-layer vapor deposition of the light-emitting material layer and cathode, the two layers can be disconnected at the isolation structure. Multiple vapor deposition and etching processes can be used to form light-emitting devices of different colors in different isolation openings. This process is also known as light-emitting device patterning.

[0074] In the above display panel, the light-emitting devices manufactured later are prone to dark spot problems, which seriously affect the display effect of the display panel.

[0075] Research has found that the main cause of the above technical problems is the failure of the subsequent light-emitting device packaging, which allows water vapor to enter the light-emitting device, resulting in dark spots. Further research has found that the failure of the subsequent light-emitting device packaging is caused by the packaging unit and the isolation structure being separated due to the weak interaction force between the two, which is supposed to be tightly fitted. The external environment causes the packaging unit and the isolation structure to separate, forming a gap for water vapor to enter.

[0076] In order to solve the above technical problems, the following technical solutions are innovatively designed. The specific implementation solutions of this application will be described in detail below with reference to the accompanying drawings. It should be noted that the defects existing in the solutions in the above prior art are the results obtained after practice and careful research during the invention process. Therefore, the discovery process of the above technical problems and the solutions proposed in the following embodiments for the above problems should be regarded as contributions to this application and should not be understood as technical contents known to those skilled in the art.

[0077] Please refer to Figure 1 and Figure 2 ,in Figure 1 The flowchart of the method for manufacturing the display panel provided in this embodiment is shown in FIG. Figure 2 Example Figure 1 The corresponding process diagram is combined with the following Figure 1 and Figure 2 A detailed introduction is given to how this implementation solves the above technical problems through process technology improvements.

[0078] In step S110 , a substrate 11 is provided.

[0079] In this embodiment, the substrate 11 is a multi-layer structure, including at least a plurality of conductive layers and an insulating layer between adjacent conductive layers. A pixel circuit for providing a driving signal for the light-emitting device may be formed in the substrate 11 .

[0080] In step S120 , an isolation structure 12 and a plurality of isolation openings 1201 formed on the substrate 11 and enclosed by the isolation structure 12 are formed on the substrate 11 .

[0081] In this embodiment, the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 stacked in sequence. The orthographic projection of the first isolation portion 121 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11. That is, the second isolation portion 122 extends relative to the first isolation portion 121 toward the corresponding isolation opening 1201. The first isolation portion 121 and the second isolation portion 122 form an undercut structure to facilitate the formation of independent light-emitting devices in each isolation opening 1201 during full-surface vapor deposition of the device film layer of the light-emitting device. The isolation openings 1201 include a first isolation opening 1201a and a second isolation opening 1201b. There may be multiple first isolation openings 1201a and multiple second isolation openings 1201b.

[0082] In step S130, light-emitting devices 13 with different luminous colors and packaging units 1611 for packaging corresponding light-emitting devices 13 are sequentially manufactured in the first isolation opening 1201a and the second isolation opening 1201b. Before manufacturing the light-emitting device 13 in the second isolation opening 1201b, the second side wall of the first isolation portion 121 facing the second isolation opening 1201b is subjected to surface roughness enhancement treatment.

[0083] In other implementations of this embodiment, the surface roughness enhancement treatment may also be performed on the first sidewall of the first isolation portion 121 facing the first isolation opening 1201 a before the light emitting device 13 is manufactured in the first isolation opening 1201 a .

[0084] The light emitting device 13 includes a first light emitting device 13a and a second light emitting device 13b emitting different colors. At least part of the first light emitting device 13a is located in the first isolation opening 1201a , and at least part of the second light emitting device 13b is located in the second isolation opening 1201b .

[0085] In this embodiment, surface roughness enhancement treatment increases the surface area of ​​the sidewall surface, thereby increasing the contact area (contact area) between the sidewall and the packaging unit 1611, thereby increasing the interaction force between the first isolation portion 121 and the packaging unit 1611. The greater the roughness of the sidewall surface, the greater the contact area between the sidewall and the packaging unit 1611, and the greater the interaction force between the first isolation portion 121 and the packaging unit 1611. This reduces the likelihood of separation between the first isolation portion 121 and the packaging unit 1611, forming a gap, when affected by the external environment.

[0086] Research has found that during the process of forming the isolation opening 1201 in step S120, the side of the first isolation portion 121 facing the corresponding isolation opening 1201 will form a sidewall with a certain degree of roughness due to the deposition of metal ions in the etching solution during the etching process. When forming the first light-emitting device 13a, the device film layer and packaging material layer of the first light-emitting device 13a will be formed on the entire surface. During the process of patterning the device film layer and packaging material layer, it is necessary to etch and remove the device film layer and packaging material layer within the second isolation opening 1201b. During the etching process, in order to completely etch and remove the device film layer and packaging material layer within the second isolation opening 1201b, the sidewall of the first isolation portion 121 facing the second isolation opening 1201b will inevitably be over-etched, thereby smoothing the originally rough sidewall. When manufacturing the second light-emitting device 13b within the second isolation opening 1201b, the force (bonding force) between the encapsulating unit 1611 encapsulating the second light-emitting device 13b and the second sidewall 1202b of the first isolation portion 121 facing the second isolation opening 1201b becomes smaller, becoming smaller than the force between the encapsulating unit 1611 encapsulating the first light-emitting device 13a and the first sidewall 1202a of the first isolation opening 1201a facing the first isolation opening 1201a. Under external environmental influences, the encapsulating unit 1611 encapsulating the second light-emitting device 13b can easily separate from the first isolation portion 121, forming a gap that allows moisture to intrude, resulting in dark spots in the second light-emitting device 13b.

[0087] In this embodiment, before manufacturing the light-emitting device 13 in the second isolation opening 1201b, the surface roughness enhancement treatment is performed on the second side wall 1202b of the first isolation portion 121 facing the second isolation opening 1201b. This can increase the surface roughness of the second side wall 1202b, increase the contact area between the packaging unit 1611 and the second side wall 1202b and the force between the two, and thereby avoid the second side wall 1202b and the packaging unit 1611 from separating to form a gap when the temperature changes, thereby ensuring the packaging effect of the second light-emitting device 13b and the display effect of the display panel 1.

[0088] For further information, please refer to Figure 3 、 Figure 4a and Figure 4b In this embodiment, step S130 can be implemented in the following manner.

[0089] Step S1301 : forming a first device film layer 21 and a first packaging material layer 31 of a first light-emitting device on the entire surface of a side of the substrate 11 where the isolation structure 12 is provided.

[0090] The first device film layer 21 of the first light-emitting device can be formed on the entire surface by evaporation, and the first packaging material layer 31 can be manufactured on the entire surface by chemical vapor deposition (CVD).

[0091] In step S1302, the first device film layer 21 and the first packaging material layer 31 are patterned to form a first light-emitting device 13a and a packaging unit 1611 for packaging the first light-emitting device 13a in the first isolation opening 1201a, and at least the first device film layer 21 and the first packaging material layer 31 in the second isolation opening 1201b are etched away.

[0092] Step S1303 : placing the substrate 11 in an electrolyte for reaction to form a protrusion 1211 on the second sidewall 1202 b .

[0093] That is, in this embodiment, the surface roughness of the second side wall 1202 b is increased mainly by forming the protrusion 1211 on the second side wall 1202 b.

[0094] Specifically, the isolation structure 12 further includes a third isolation portion (not shown in the figure). In a direction away from the substrate 11, the third isolation portion, the first isolation portion 121 and the second isolation portion 122 are stacked in sequence. Step S1303 can be implemented in the following manner:

[0095] The substrate 11 is placed in an electrolyte to form an electrolytic cell with the first isolating portion 121 as a cathode and the third isolating portion as an anode; the metal ions in the electrolyte obtain electrons on the second side wall 1202b, are reduced to form metal atoms and deposited to obtain a protrusion 1211.

[0096] After step S1303 , the method for manufacturing a display panel provided in this embodiment further includes taking the substrate 11 out of the electrolyte and cleaning the substrate 11 .

[0097] Optionally, the density and height of the protrusions 1211 deposited on the second sidewall 1202 b can be controlled by controlling the reaction time of the substrate 11 in the electrolyte.

[0098] In this embodiment, the surface roughness of the second side wall 1202b can be greater than or equal to the surface roughness of the first side wall 1202a by controlling the reaction time, that is, the density of the protrusions 1211 on the second side wall 1202b is greater than or equal to the density of the protrusions 1211 on the first side wall 1202a, and the height of the protrusions 1211 on the second side wall 1202b is greater than or equal to the height of the protrusions 1211 on the first side wall 1202a.

[0099] In a possible embodiment, the material of the first isolation portion 121 includes metal aluminum, and the electrolyte contains aluminum ions (Al 3+ ), wherein the concentration of aluminum ions in the electrolyte ranges from 0.08 mol / L to 0.12 mol / L. For example, the concentration of aluminum ions in the electrolyte includes 0.08 mol / L, 0.085 mol / L, 0.088 mol / L, 0.094 mol / L, 0.1 mol / L, 0.105 mol / L, 0.109 mol / L, 0.114 mol / L, or 0.12 mol / L.

[0100] Optionally, the electrolyte may include an aluminum chloride (AlCl3) solution, and the solution temperature of the electrolyte is 25°C~50°C. Exemplarily, the solution temperature of the electrolyte includes 25°C, 27°C, 31°C, 38°C, 41°C, 43°C, 45°C, 48°C or 50°C, etc., wherein the higher the temperature of the electrolyte, the more intense the electrochemical reaction.

[0101] Step S1304 : forming a second device film layer 22 and a second packaging material layer 32 of a second light-emitting device on the entire surface of the substrate 11 on the side where the isolation structure 12 is provided.

[0102] Step S1305 : patterning the second device film layer 22 and the second packaging material layer 32 to form a second light-emitting device 13 b and a packaging unit 1611 for packaging the second light-emitting device 13 b in the second isolation opening 1201 b .

[0103] Further, in this embodiment, please refer to Figure 5a and Figure 5b The isolation opening 1201 further includes a third isolation opening 1201c, and a plurality of third isolation openings 1201c may be provided. The light-emitting device 13 further includes a third light-emitting device 13c having a different light-emitting color from the first light-emitting device 13a and the second light-emitting device 13b. After step S1305, the method further includes the following steps.

[0104] First, the substrate 11 is placed in an electrolyte for reaction, and a surface roughness enhancement treatment is performed on the third sidewall 1202c of the first isolation portion 121 facing the third isolation opening 1201c to form a protrusion on the third sidewall 1202c.

[0105] Specifically, the method for enhancing the surface roughness of the third side wall 1202 c is the same as the method for enhancing the surface roughness of the second side wall 1202 b described above, and will not be repeated here.

[0106] Next, a third device film layer 23 and a third packaging material layer 33 of the third light-emitting device are formed on the entire surface of the substrate 11 on the side where the isolation structure 12 is provided.

[0107] Then, the third device film layer 23 and the third packaging material layer 33 are patterned to form a third light-emitting device 13 c and a packaging unit 1611 for packaging the third light-emitting device 13 c in the third isolation opening 1201 c .

[0108] In this embodiment, the isolation structure 12 may further include a third isolation portion 123. In a direction away from the substrate 11, the third isolation portion 123, the first isolation portion 121, and the second isolation portion 122 are stacked in sequence, and the orthographic projection of the third isolation portion 123 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11. Exemplarily, the material of the third isolation portion 123 may include metallic molybdenum. When the substrate 11 is placed in an aluminum chloride solution, the third isolation portion 123 may form an anode of the electrolytic cell, and the first isolation portion 121 may form a cathode of the electrolytic cell. Exemplarily, the third isolation portion 123 may serve as the anode of the electrolytic cell, and the first isolation portion 121 may serve as the cathode of the electrolytic cell, by means of an external power supply; or the third isolation portion 123 may serve as the anode of the electrolytic cell, and the first isolation portion 121 may serve as the cathode of the electrolytic cell, by means of a voltage generated by static electricity on the substrate 11.

[0109] The following electrochemical reaction may occur on the first separator 121 .

[0110] Al 3+ +3e-=Al↓

[0111] 2H + +2e-=H2↑

[0112] The following electrochemical reaction may occur on the third separator 123 .

[0113] Mo-6e-+7H2O=MoO4 2- +14H +

[0114] In the above electrochemical reaction, the difference in local electrolyte concentration causes the movement speed of some cations to be different from that of other cations, thus forming different concentration gradients near the cathode. According to the Monroe-Newman model, the concentration gradient difference causes Al 3+The conversion rate to Al is different, and the shortest path will be selected for deposition, eventually accumulating into Al burrs. That is, the shape of the protrusion may include burrs.

[0115] Based on the same inventive concept, this embodiment also provides a display panel, wherein the display panel can be prepared by the above-mentioned display panel preparation method. The specific structure of the display panel 1 is described in detail below with reference to the accompanying drawings. Figure 6 and Figure 7 ,in, Figure 6 The schematic diagram of the distribution of the isolation structure and the isolation opening is shown as an example. Figure 7 Example Figure 6 Schematic cross-sectional view taken at position AA in FIG. In this embodiment, the display panel 1 includes a substrate 11, an isolation structure 12, a light-emitting device 13, and an encapsulation unit 1611. The substrate 11 may be a multi-layer structure, including at least a plurality of conductive layers and an insulating layer between adjacent conductive layers. A pixel circuit for providing a drive signal to the light-emitting device 13 is formed within the substrate 11. The conductive layers may be metal conductive layers.

[0116] The isolation structure 12 is located on one side of the substrate 11 and encloses an isolation opening 1201 on the substrate 11. In the direction away from the substrate 11, the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 arranged in a stacked manner. The orthographic projection of the first isolation portion 121 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11. The second isolation portion 122 extends relative to the first isolation portion 121 toward the corresponding isolation opening 1201 to form an undercut structure. This undercut structure allows the entire surface-evaporated light-emitting device layer (such as the light-emitting material layer and the electrode layer) to be disconnected at this location, facilitating the independent formation of the light-emitting device film layer in different isolation openings 1201.

[0117] At least part of the light-emitting device 13 is arranged in the isolation opening 1201, and the light-emitting device 13 includes a first light-emitting device 13a and a second light-emitting device 13b with different light-emitting colors. The isolation opening 1201 includes a first isolation opening 1201a and a second isolation opening 1201b, wherein at least part of the first light-emitting device 13a is located in the first isolation opening 1201a, and at least part of the second light-emitting device 13b is located in the second isolation opening 1201b.

[0118] The packaging unit 1611 is located on the side of the light-emitting device 13 away from the substrate 11. The packaging unit 1611 extends from the surface of the light-emitting device 13 through the first isolation portion 121 toward the side wall of the isolation opening 1201 to the side of the second isolation portion 122 away from the substrate 11, that is, the packaging unit 1611 will be attached to the side wall of the first isolation portion 121 toward the isolation opening 1201.

[0119] The first sidewall 1202a of the first isolation portion 121 facing the first isolation opening 1201a has a first roughness, and the second sidewall 1202b of the first isolation portion 121 facing the second isolation opening 1201b has a second roughness, wherein the first roughness is less than or equal to the second roughness.

[0120] In this embodiment, the first light-emitting device 13a and the second light-emitting device 13b are manufactured in the first isolation opening 1201a and the second isolation opening 1201b in sequence. By making the first roughness less than or equal to the second roughness, the fitting area between the packaging unit 1611 and the second side wall 1202b and the force between the two are increased, thereby avoiding the situation where the second side wall 1202b and the packaging unit 1611 are separated to form a gap when affected by the external environment, thereby ensuring the packaging effect of the second light-emitting device 13b and the display effect of the display panel 1.

[0121] Furthermore, the sidewall of the first isolation portion 121 facing the corresponding isolation opening 1201 has protrusions 1211, and the sidewall roughness of the first isolation portion 121 can be adjusted by controlling the density and / or height of the protrusions 1211. The greater the sidewall roughness of the first isolation portion 121, the larger the contact area between it and the packaging unit 1611, the greater the interaction force between the two, and the lower the probability of separation between the two when affected by the external environment, forming a gap for water vapor intrusion.

[0122] In this embodiment, the density of the protrusions 1211 on the first side wall 1202a is less than or equal to the density of the protrusions 1211 on the second side wall 1202b; and / or,

[0123] The protrusion 1211 on the first side wall 1202a has a height less than or equal to the protrusion 1211 on the second side wall 1202b.

[0124] In this embodiment, the packaging unit 1611 contacts the protrusion on the sidewall of the first isolation portion 121 facing the corresponding isolation opening 1201. Specifically, the binding force per unit area of ​​the packaging unit 1611 and the first sidewall 1202a is less than or equal to the binding force per unit area of ​​the packaging unit 1611 and the second sidewall 1202b.

[0125] For further information, please refer to Figure 8 The isolation opening 1201 also includes a third isolation opening 1201c, and the light-emitting device 13 also includes a third light-emitting device 13c having a light-emitting color different from that of the first light-emitting device 13a and the second light-emitting device 13b. At least part of the third light-emitting device 13c is located in the third isolation opening 1201c, wherein the third light-emitting device 13c is manufactured in the third isolation opening 1201c after the second light-emitting device 13b is manufactured in the second isolation opening 1201b.

[0126] Optionally, in this embodiment, the third sidewall 1202c of the first isolation portion 121 facing the third isolation opening 1201c has a third roughness, and the first roughness is less than or equal to the third roughness. This can increase the contact area and the interaction force between the packaging unit 1611 and the third sidewall 1202c, thereby preventing the third sidewall 1202c and the packaging unit 1611 from separating and forming a gap when the temperature changes, thereby ensuring the packaging effect of the third light-emitting device 13c and the display effect of the display panel 1.

[0127] Specifically, the density of the protrusions 1211 on the first sidewall 1202a is less than or equal to the density of the protrusions 1211 on the third sidewall 1202c; and / or,

[0128] The protrusion 1211 on the first side wall 1202a has a height less than or equal to the protrusion 1211 on the third side wall 1202c.

[0129] Please refer again Figure 8 The isolation structure 12 further includes a third isolation portion 123. In a direction away from the substrate 11, the third isolation portion 123, the first isolation portion 121, and the second isolation portion 122 are stacked in sequence. The orthographic projection of the third isolation portion 123 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11. Both the third isolation portion 123 and the first isolation portion 121 are made of metal. When the substrate 11 is placed in an etching solution, the first isolation portion 121 can serve as a cathode and the third isolation portion 123 can serve as an anode to form an electrolytic cell.

[0130] Further, in this embodiment, please refer to Figure 7 The material of the first isolation portion 121 includes metal aluminum, the material of the third isolation portion 123 includes metal molybdenum, the protrusion 1211 includes a protrusion body 12111 and a surface layer 12112 located on the surface of the protrusion body 12111, the material of the protrusion body 12111 includes metal aluminum, and the material of the surface layer 12112 includes aluminum oxide.

[0131] Exemplarily, the protrusion 1211 may include a burr, wherein the formation process of the protrusion 1211 may refer to the relevant description in the above display panel manufacturing method, and will not be repeated here.

[0132] For further information, please refer to Figure 9The display panel 1 also includes a pixel defining layer 14, which is located on one side of the substrate 11. The isolation structure 12 is located on a side of the pixel defining layer 14 away from the substrate 11. The pixel defining layer 14 includes a plurality of pixel openings 1401. At least some of the light-emitting devices 13 are located within the pixel openings 1401. The pixel openings 1401 communicate with the isolation openings 1201. For example, the orthographic projections of the pixel openings 1401 on the substrate 11 are located within the orthographic projections of the corresponding isolation openings 1201 on the substrate 11. The orthographic projections of the pixel openings 1401 on the substrate 11 are located within the orthographic projections of the isolation openings 1201 on the substrate 11. In this embodiment, the pixel defining layer 14 can be an organic pixel defining layer or an inorganic pixel defining layer. Preferably, the pixel defining layer 14 is an inorganic pixel defining layer. When the pixel defining layer 14 is an inorganic pixel defining layer, it can be a single layer structure of silicon oxide (SiOx) or silicon nitride (SiNx), or a stacked structure consisting of alternating layers of silicon oxide and silicon nitride.

[0133] Please refer again Figure 9 In a direction away from substrate 11, light-emitting device 13 includes a first electrode 131, a light-emitting material layer 132, and a second electrode 133, which are stacked in sequence. At least a portion of first electrode 131 is exposed at the pixel opening 1401. Second electrode 133 extends from pixel opening 1401 through pixel defining layer 14 to the sidewall of isolation structure 12 facing isolation opening 1201. Second electrode 133 may overlap third isolation portion 123, first isolation portion 121, or both. For example, first electrode 131 may be the anode of light-emitting device 13, and second electrode 133 may be the cathode of light-emitting device 13.

[0134] In this embodiment, the isolation structure 12 can enclose a plurality of isolation openings 1201. The provision of the isolation structure 12 enables the formation of film layers of light-emitting devices of different colors in different isolation openings 1201 without the need for a fine metal mask, thereby reducing the manufacturing cost of the display panel. The isolation structure 12 can isolate the light-emitting material layer 132 and the second electrode 133 in the light-emitting device 13, thereby making different light-emitting devices 13 independent of each other, thereby improving crosstalk between adjacent light-emitting devices 13 and enhancing the display effect. Adjacent light-emitting devices 13 are independent of each other and can be independently packaged to improve the packaging yield. At the same time, due to the presence of the isolation structure 12, the light-emitting material layer 132 and the second electrode 133 in the light-emitting device 13 of each color in the display panel can be first prepared on the entire surface and then patterned, thereby eliminating the need for a fine metal mask and saving the manufacturing cost of the display panel.

[0135] For further information, please refer to Figure 10The display panel 1 further includes a first encapsulation layer 162, which is located on a side of the encapsulation unit 1611 away from the substrate 11 and covers at least the encapsulation unit 1611. Optionally, the first encapsulation layer 162 includes a flat surface on a side away from the substrate 11.

[0136] Furthermore, the display panel 1 further includes a second encapsulation layer 163 . The second encapsulation layer 163 is located on a side of the first encapsulation layer 15 away from the substrate 11 .

[0137] Optionally, encapsulation unit 1611 and second encapsulation layer 163 include an inorganic material, and first encapsulation layer 162 includes an organic material. That is, encapsulation unit 1611 and second encapsulation layer 163 may be inorganic encapsulation layers, and first encapsulation layer 162 may be an organic encapsulation layer. For example, encapsulation unit 1611 and second encapsulation layer 163 may be formed by chemical vapor deposition (CVD), and first encapsulation layer 162 may be formed by inkjet printing (IJP).

[0138] It is understandable that the display panel 1 may also include a touch function layer, an optical adhesive layer, a polarizer, a cover plate and other film layers stacked in sequence on the side of the second packaging layer 163 away from the substrate 11. The above film layers are conventional film layers of the display panel and will not be described in detail here.

[0139] Based on the same inventive concept, an embodiment of the present application also provides an electronic device, which includes the display panel provided in the present application, or includes a display panel prepared by the display panel preparation method provided in the present embodiment. The electronic device may include a smart phone, a tablet computer, a car display device, a smart wearable device, a television, a laptop computer, and other devices with display functions.

[0140] The embodiments of the present application provide a method for preparing a display panel, a display panel, and an electronic device. In the preparation method, before manufacturing a light-emitting device in the second isolation opening, the second side wall of the first isolation portion facing the second isolation opening is subjected to surface roughness enhancement treatment. This can increase the surface roughness of the second side wall, increase the bonding area between the packaging unit and the second side wall, and increase the force between the two, thereby avoiding the situation where the second side wall and the packaging unit separate to form a gap when the temperature changes, thereby ensuring the packaging effect of the second light-emitting device and the display effect of the display panel.

[0141] The foregoing description is merely a preferred embodiment of the present application and is not intended to limit the present application. Persons skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; An isolation structure and a plurality of isolation openings formed by the isolation structure on the substrate are fabricated on the substrate, wherein the isolation structure includes a first isolation portion and a second isolation portion stacked in sequence, an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate, and the isolation openings include a first isolation opening and a second isolation opening; Light-emitting devices with different luminous colors and packaging units for packaging corresponding light-emitting devices are sequentially manufactured in the first isolation opening and the second isolation opening. After the light-emitting device and the packaging unit are manufactured in the first isolation opening and before the light-emitting device is manufactured in the second isolation opening, the second side wall of the first isolation portion facing the second isolation opening is subjected to surface roughness enhancement treatment; wherein the light-emitting device includes a first light-emitting device and a second light-emitting device with different luminous colors, at least part of the first light-emitting device is located in the first isolation opening, and at least part of the second light-emitting device is located in the second isolation opening.

2. The method for manufacturing a display panel according to claim 1, wherein: The step of sequentially manufacturing light-emitting devices having different luminous colors and packaging units for packaging corresponding light-emitting devices in the first isolation opening and the second isolation opening, and performing a surface roughness enhancement treatment on a second side wall of the first isolation portion facing the second isolation opening after manufacturing the light-emitting device and the packaging unit in the first isolation opening and before manufacturing the light-emitting device in the second isolation opening comprises: Forming a first device film layer and a first packaging material layer of a first light-emitting device on the entire surface of one side of the substrate where the isolation structure is provided; Performing patterning on the first device film layer and the first packaging material layer to form the first light-emitting device and an encapsulation unit for encapsulating the first light-emitting device in the first isolation opening, and etching away at least the first device film layer and the first packaging material layer in the second isolation opening; placing the substrate in an electrolyte to react and form a protrusion on the second sidewall; forming a second device film layer and a second packaging material layer of a second light-emitting device on the entire surface of one side of the substrate where the isolation structure is provided; The second device film layer and the second packaging material layer are patterned to form the second light-emitting device and a packaging unit for packaging the second light-emitting device in the second isolation opening.

3. The method for manufacturing a display panel according to claim 2, wherein: The isolation structure further includes a third isolation portion, and in a direction away from the substrate, the third isolation portion, the first isolation portion, and the second isolation portion are stacked in sequence. The step of placing the substrate in an electrolyte for reaction to form a protrusion on the second sidewall includes: placing the substrate in an electrolyte to form an electrolytic cell with the first separator serving as a cathode and the third separator serving as an anode; The metal ions in the electrolyte obtain electrons on the second side wall, are reduced to form metal atoms, and are deposited to form the protrusion.

4. The method for manufacturing a display panel according to claim 3, wherein: After the step of placing the substrate in an electrolyte for reaction to form a protrusion on the second sidewall, the method further includes: The substrate is taken out from the electrolyte and cleaned.

5. The method for manufacturing a display panel according to claim 2, wherein: The material of the first isolation portion includes metallic aluminum, and the electrolyte contains aluminum ions; Wherein, the concentration range of aluminum ions in the electrolyte is 0.08 mol / L~0.12 mol / L.

6. The method for manufacturing a display panel according to claim 5, wherein: The electrolyte includes aluminum chloride solution; The electrolyte solution temperature is 25°C to 50°C.

7. The method for manufacturing a display panel according to claim 2, wherein: The isolation opening further includes a third isolation opening, the light-emitting device further includes a third light-emitting device having a different light-emitting color from the first light-emitting device and the second light-emitting device, and after the step of patterning the second device film layer and the second encapsulation material layer to form the second light-emitting device and an encapsulation unit for encapsulating the second light-emitting device in the second isolation opening, the method further includes: placing the substrate in an electrolyte for reaction, performing surface roughness enhancement treatment on a third sidewall of the first isolation portion facing the third isolation opening, and forming a protrusion on the third sidewall; forming a third device film layer and a third packaging material layer of a third light-emitting device on the entire surface of one side of the substrate where the isolation structure is provided; The third device film layer and the third packaging material layer are patterned to form the third light-emitting device and a packaging unit for packaging the third light-emitting device in the third isolation opening.

8. A display panel, characterized in that: The display panel is prepared by the method for preparing a display panel according to any one of claims 1 to 7, and the display panel comprises: substrate; An isolation structure is located on the substrate and encloses a plurality of isolation openings on the substrate; a plurality of light-emitting devices, at least partially located in the isolation opening, the light-emitting devices including a first light-emitting device and a second light-emitting device emitting different colors, the isolation opening including a first isolation opening and a second isolation opening, wherein at least part of the first light-emitting device is located in the first isolation opening, and at least part of the second light-emitting device is located in the second isolation opening; a plurality of packaging units, each used to package a light-emitting device corresponding to the isolation opening; In which, the isolation structure includes a first isolation part and a second isolation part stacked in sequence, the orthographic projection of the first isolation part on the substrate is located within the orthographic projection of the second isolation part on the substrate, the first side wall of the first isolation part facing the first isolation opening has a first roughness, and the second side wall of the first isolation part facing the second isolation opening has a second roughness, wherein the first roughness is less than or equal to the second roughness.

9. The display panel according to claim 8, wherein: The first isolation portion has a protrusion on a side wall facing the isolation opening, and the density of the protrusions on the first side wall is less than or equal to the density of the protrusions on the second side wall; and / or, The protrusion height of the protrusion on the first side wall is less than or equal to the protrusion height of the protrusion on the second side wall.

10. The display panel according to claim 8, wherein The packaging unit contacts a protrusion on a side wall of the first isolation portion facing the isolation opening; A unit area bonding force between the packaging unit and the first side wall is less than or equal to a unit area bonding force between the packaging unit and the second side wall.

11. The display panel according to claim 8, wherein The isolation opening further includes a third isolation opening, the light emitting device further includes a third light emitting device having a light emission color different from that of the first light emitting device and the second light emitting device, and at least a portion of the third light emitting device is located in the third isolation opening; A third sidewall of the first isolation portion facing the third isolation opening has a third roughness, wherein the first roughness is less than or equal to the third roughness.

12. The display panel according to claim 11, wherein: The first isolation portion has a protrusion on a side wall facing the isolation opening, and the density of the protrusions on the first side wall is less than or equal to the density of the protrusions on the third side wall; and / or, The protrusion height of the protrusion on the first side wall is less than or equal to the protrusion height of the protrusion on the third side wall.

13. The display panel according to claim 9, wherein: The isolation structure also includes a third isolation part. In the direction away from the substrate, the third isolation part, the first isolation part and the second isolation part are stacked in sequence; the material of the first isolation part includes metal aluminum; the material of the third isolation part includes metal molybdenum.

14. The display panel according to claim 13, wherein: The protrusion includes a protrusion body and a surface layer located on the surface of the protrusion body. The material of the protrusion body includes metal aluminum, and the material of the surface layer includes aluminum oxide.

15. The display panel according to any one of claims 8 to 14, wherein: The display panel further includes a pixel defining layer, wherein the pixel defining layer is located on a side of the isolation structure facing the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate; The pixel defining layer includes a plurality of pixel openings, the orthographic projections of the pixel openings on the substrate are located within the orthographic projections of the corresponding isolation openings on the substrate, and at least part of the light emitting devices are located within the pixel openings.

16. A display panel, characterized in that: The display panel is prepared by the method for preparing a display panel according to any one of claims 1 to 7, and the display panel comprises: substrate; An isolation structure is located on the substrate and encloses a plurality of isolation openings on the substrate; a plurality of light-emitting devices, at least partially located in the isolation opening, the light-emitting devices including a first light-emitting device and a second light-emitting device emitting different colors, the isolation opening including a first isolation opening and a second isolation opening, wherein at least part of the first light-emitting device is located in the first isolation opening, and at least part of the second light-emitting device is located in the second isolation opening; a plurality of packaging units, used for packaging the light-emitting devices located in the corresponding isolation openings; In which, the isolation structure includes a first isolation part and a second isolation part stacked in sequence, the orthographic projection of the first isolation part on the substrate is located within the orthographic projection of the second isolation part on the substrate, the first isolation part has a first unit area binding force with the packaging unit toward the first side wall of the first isolation opening, and the first isolation part has a second unit area binding force with the packaging unit toward the first side wall of the second isolation opening, wherein the first unit area binding force is less than or equal to the second unit area binding force.

17. An electronic device, characterized in that: The electronic device comprises a display panel prepared by the method for preparing a display panel according to any one of claims 1 to 7, or a display panel according to any one of claims 8 to 15.

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