Multi-layer alignment overlapping equipment and laminating process thereof

By designing a multi-layer alignment and stacking equipment, using a double upper cavity bonding mechanism, a high-precision alignment system and a film tearing mechanism, the problem of existing equipment being difficult to efficiently fit multi-layer lenses is solved, and efficient and accurate multi-layer material bonding is achieved, and production efficiency is improved.

CN120191114APending Publication Date: 2025-06-24XIAMEN LIJU AUTOMATION TECH
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Patent Information

Application Number
CN202510522123.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-24
Publication Date
2025-06-24

AI Technical Summary

Technical Problem

The existing multi-layer alignment stacking equipment is difficult to efficiently fit multi-layer lenses, which can easily lead to contamination and damage to the well-fitted lenses, and the process speed is difficult to meet production needs, reducing production efficiency.

Method used

A multi-layer alignment and stacking device is designed, including a feeding module, a handling module, a bonding module and a film tearing module. It adopts a double upper cavity bonding mechanism, a high-precision alignment system, a film tearing mechanism and a UV pre-curing device to achieve fully automated and high-speed bonding operation.

Benefits of technology

It realizes high-precision and high-efficiency multi-layer material bonding, meets the needs of fully automatic fitting of multi-layer products, improves production efficiency and reduces the risk of product damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides multi-layer alignment overlapping equipment and a laminating process, and relates to the technical field of automatic equipment. Comprising a double-laminating mechanism, a high-precision alignment system, a film tearing mechanism and an automatic feeding and carrying system. By means of the scheme, the multi-layer stacking and laminating process is achieved, the automation degree is high, and efficiency is high.
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Description

Technical Field

[0001] The present invention relates to the technical field of automated equipment, and more particularly, to a multi-layer alignment and lamination device and its lamination process. Background Art

[0002] Flat panel display devices are important components of electronic products that require display functions, such as smartphones, tablets, laptops, wearable electronic devices, TVs, refrigerators, air conditioners, instruments, etc. In recent years, with the rapid expansion of the market demand for emerging consumer electronic products and smart home products represented by large-screen smartphones and wearable electronic devices, the shipment volume of flat panel display devices in China has maintained a continuous and rapid growth, driving the leapfrog development of flat panel display device production equipment.

[0003] Currently, the requirements for the number of film layers on the screen vary. For example, in VR glasses, generally three or even four lenses need to be attached, and three OCAs are required for bonding between the four lenses. During the bonding process, the OCA also needs to be peeled off. The existing multi-layer alignment and lamination devices can at most achieve the lamination of two layers of lenses on one device. When laminating multiple layers of lenses, the laminated lenses need to be taken out, repositioned, cleaned, and then secondarily laminated with two already laminated lenses. In this process, on the one hand, it is easy to contaminate and damage the two laminated lenses, and on the other hand, it is difficult to meet the production requirements in terms of process speed, and manual intervention is required, reducing production efficiency. Summary of the Invention

[0004] The present invention discloses a multi-layer alignment and lamination device, aiming to solve the above-mentioned problems.

[0005] The present invention adopts the following solutions:

[0006] A multi-layer alignment and lamination device includes: a loading module, a handling module, a lamination module, and a film peeling module; wherein,

[0007] The loading module includes a product loading module and an OCA loading module; wherein, the product loading module includes a plurality of loading platforms, a product turning mechanism, and a product cleaning mechanism; the product turning mechanism is provided with a plurality of product adsorption platforms to individually adsorb the products placed on the loading platforms and turn the products over by flipping; the cleaning mechanism is adapted to clean the front and back surfaces of the products; the OCA loading module includes a plurality of OCA loading platforms, an OCA handling mechanism, and an OCA cleaning mechanism, and the OCA handling mechanism is adapted to individually transport the OCA on the OCA loading platforms into the lamination module; the OCA cleaning mechanism is adapted to clean the front and back surfaces of the OCA during transportation;

[0008] The fitting module includes a moving mechanism, a first vacuum fitting module, and a second vacuum fitting module; the first vacuum fitting module includes a first fitting lower cavity and a first fitting upper cavity, and the second vacuum fitting module includes a second fitting lower cavity and a second fitting upper cavity; wherein, the first fitting lower cavity and the second fitting lower cavity are arranged on the moving mechanism and can move between the first fitting upper cavity, the second fitting upper cavity, and the blanking module under the drive of the moving mechanism;

[0009] The first fitting upper cavity is adapted to adsorb a first product from the first fitting lower cavity; the first fitting lower cavity is adapted to place a first OCA and peel off the light film of the first OCA through a film peeling mechanism, and the first fitting upper cavity is adapted to descend to dock with the first fitting lower cavity and form a vacuum fitting space to fit the first OCA on the first product; after fitting, the film peeling mechanism is adapted to peel off the heavy film of the first OCA;

[0010] The second fitting upper cavity is adapted to adsorb a second OCA from the second fitting lower cavity and peel off the light film of the second OCA through a film peeling mechanism; the second fitting lower cavity is adapted to place a second product, and the second fitting upper cavity is adapted to descend to dock with the second fitting lower cavity and form a vacuum fitting space to fit the second OCA on the second product; after fitting, the film peeling mechanism is adapted to peel off the heavy film of the second OCA; and the feeding mechanism is adapted to convey a third product to the second fitting upper cavity again, so that the second product is fitted on one side of the third product through the second OCA;

[0011] The moving mechanism is adapted to drive the second fitting lower cavity to move below the first fitting upper cavity, and the first fitting upper cavity is adapted to cooperate with the second fitting lower cavity to form a closed vacuum fitting space, and the first product on the first fitting upper cavity is fitted on the other side of the third product in the second fitting lower cavity through the first OCA.

[0012] Further, the OCA feeding module further includes a calibration CCD, an OCA transfer platform, and an OCA feeding and flipping platform; wherein,

[0013] The OCA feeding platform includes a first bin, a second bin, and a third bin for stacking OCA film sheets respectively; the first bin, the second bin, and the third bin are provided with XYZ-axis adjustment mechanisms to adjust the position of the OCA; the OCA feeding platform is provided with air blowing ports connected to a plasma device and film sheet detection sensors, and the air blowing ports are arranged on two adjacent sides of the OCA feeding platform to blow and clean the top surface of the film sheet; the film sheet detection sensors are adapted to detect whether an OCA is placed on the OCA feeding platform;

[0014] The OCA handling mechanism includes an OCA material picking structure. The OCA material picking mechanism includes a four-axis motion mechanism and a material picking table connected to the four-axis motion mechanism. The material picking table is adapted to adsorb the OCA film and move it to the calibration CCD for photographing, and correct the angle and position of the picked OCA film according to the shooting result of the calibration CCD. A film shaking cylinder is arranged on the material picking table to make the redundant film material fall off by shaking the material picking table after picking the film.

[0015] The material picking table is adapted to grab the OCA film to the transfer platform. A stacking sensor is arranged on the transfer platform to detect whether stacking occurs. After the detection is completed, the material picking table grabs the film material on the transfer platform to the OCA cleaning lower platform.

[0016] The OCA cleaning lower platform includes a moving X-axis mechanism and a jig platform for placing the OCA film arranged on the moving X-axis mechanism. It is configured to drive the OCA film to move between the material picking platform and the OCA loading and flipping platform. The OCA cleaning mechanism is arranged on the motion track of the OCA cleaning lower platform to clean the OCA film.

[0017] The OCA loading and flipping platform is connected with an XZ-axis motion mechanism. The front and back sides of the OCA loading and flipping platform are respectively provided with a first OCA adsorption platform and a second OCA adsorption platform, which are used to adsorb the OCA film from the jig platform and place the OCA film back on the OCA cleaning lower platform after flipping to clean the other side of the OCA film.

[0018] Furthermore, the product loading module further includes a CCD alignment component arranged above the loading platform.

[0019] Among them, the loading platform is arranged on a moving mechanism. At least four groups of jig platforms for placing products are arranged on the loading platform. A buffer spring is arranged below each jig platform. A alignment platform is arranged at the bottom of the loading platform to perform preliminary correction and alignment according to the shooting data of the CCD alignment component. The moving mechanism is adapted to drive the loading platform to move from the product cleaning mechanism to clean the top surface of the product.

[0020] The product turning mechanism is adapted to move between the loading platform and the downstream end of the product cleaning mechanism. It includes a turning U-axis. Product adsorption platforms adapted to correspond to the jig platforms are respectively arranged on the four sides around the turning U-axis. It is configured to adsorb products from the four groups of jig platforms one by one and turn them, so as to drive the other side of the turned products to move to the product cleaning mechanism for cleaning.

[0021] Further, a handling robot is arranged between the OCA feeding module and the laminating module, and a material-taking suction nozzle is arranged on the handling robot to convey the OCA film into the laminating module; the product feeding module conveys the product into the laminating module through the product turning mechanism.

[0022] Further, the laminating module includes a first vacuum laminating module and a second vacuum laminating module with the same structure. Among them, the first vacuum laminating module includes a first lower laminating cavity and a first upper laminating cavity. A material placing platform and a laminating platform are arranged in the first lower laminating cavity. The height of the material placing platform is lower than that of the laminating platform, and a heating device is arranged on the laminating platform to heat the OCA film; a height measuring sensor is arranged on the side of the first lower laminating cavity to detect the distance between the first product in the first lower laminating cavity and the first OCA in the first upper laminating cavity; a six-axis adjustment platform is arranged below the laminating platform to adjust the parallelism and overlap degree of the first product and the first OCA in the first lower laminating cavity according to the measurement result of the height measuring sensor; the six-axis adjustment platform and the first upper laminating cavity are hermetically connected through a bellows to ensure the vacuum degree of the vacuum space formed by the first upper laminating cavity and the first lower laminating cavity.

[0023] Further, the six-axis adjustment platform includes an XYθ-axis mechanism arranged at the bottom and a horizontal adjustment mechanism. The horizontal adjustment mechanism includes three lifting mechanisms, and the three lifting mechanisms are connected below the laminating platform to adjust the levelness of the laminating platform plane in a three-point positioning manner; the XYθ-axis mechanism is adapted to adjust the position of the laminating platform to make the product in the first lower laminating cavity overlap and align with the product in the first upper laminating cavity.

[0024] Further, the laminating platform includes a mounting part, a laminating fixture, a movable part, a guide rail, a return cylinder, an adjustment screw, a spring part, a pressure sensor, and a standard block; among them, the movable part is movably arranged in the mounting part through the guide rail, the adjustment screw is arranged on the movable part, and a spring part is arranged at the bottom thereof, and a pressure sensor is arranged at the bottom of the spring part, and the initial pressure of the spring part is adjusted through the adjustment screw; the laminating fixture is connected above the movable part, and a plurality of the return cylinders are arranged on the periphery of the mounting part, and the return cylinders are adapted to extend after laminating is completed to drive the laminating fixture and the movable part to reset; a limiting step is arranged on the movable part, and a standard block adapted to the limiting step is arranged in the mounting part, and the movable part is limited upward through the standard surface of the standard block to ensure the levelness of the laminating fixture.

[0025] Further, a bonding upper platform connected to a vacuum device is provided in the first bonding upper cavity. The bonding upper platform is connected to a lifting Z-axis, and a buffer elastic member is provided between the lifting Z-axes and the bonding upper platform. The bonding upper platform includes a heating plate and a bionic adhesion suction cup. The heating plate is adapted to heat the bonding upper platform, and the bionic adhesion suction cup is adapted to adhere to the product in a vacuum environment to prevent the product from falling.

[0026] A silicone head is provided on one side of the bonding upper platform. The silicone head is connected to an extending cylinder, and the silicone head is adapted to press down from the middle of the product after the product is bonded to extrude the bubbles in the bonding surface of the product.

[0027] Further, the film tearing mechanism includes a film tearing feeder and a film tearing device. Among them, the detection sensor is arranged at the film tearing position to detect whether the easy-tear label is torn off. The film tearing feeder includes a take-up reel, a feed reel, and a film pressing cylinder. The feed reel is adapted to drive the tape with the easy-tear label to be transmitted to the take-up reel under the drive of a feed motor. The film pressing cylinder is arranged at the film tearing position and is adapted to press the tape tightly to facilitate the separation of the easy-tear label from the tape.

[0028] The film tearing device includes a film tearing Z-axis, a swing cylinder, a film tearing roller, a film tearing cylinder, and a clamp. Among them, the film tearing Z-axis is adapted to drive the film tearing device to move up and down. A rotating mechanism is arranged on the film tearing Z-axis, and the swing cylinder is connected to the rotating mechanism. The swing cylinder connects the clamp and the film tearing cylinder to drive the clamp and the film tearing cylinder to swing a preset angle during film tearing. The clamp is adapted to pick up the easy-tear label from the film tearing feeder. The film tearing cylinder is inclined above the clamp, and its extending end is connected to the film tearing roller to move synchronously with the film tearing Z-axis during film tearing to gradually tear off the release film of the OCA.

[0029] The present invention also provides a bonding process based on the multi-layer alignment and lamination device, including the following steps:

[0030] S1. Loading:

[0031] (1). After the first product is cleaned by the product cleaning mechanism, it is loaded onto the loading platform in the first bonding lower cavity through the product turning-over mechanism. Then, the first bonding upper cavity moves above the loading platform to adsorb the first product into the first bonding upper cavity. After the first OCA is cleaned by the OCA cleaning mechanism, it is loaded onto the bonding platform in the first bonding lower cavity through the handling robot. Then, the film tearing mechanism tears the light film of the first OCA.

[0032] (2) After the second OCA is cleaned by the COA cleaning mechanism, it is transported by the handling robot to the loading platform in the second laminating lower chamber. The second laminating upper chamber moves to the loading platform to adsorb the second OCA into the second laminating upper chamber, and then the film tearing mechanism tears the light film of the second OCA; after the second product is cleaned by the product cleaning mechanism, it is loaded onto the laminating platform in the second laminating lower chamber through the product turning mechanism;

[0033] S2. First lamination:

[0034] (1) The first laminating upper chamber moves down to connect with the first laminating lower chamber, evacuates to form a vacuum space, and makes the first OCA adhere to the first product in the first laminating upper chamber;

[0035] (2) The second laminating upper chamber moves down to connect with the second laminating lower chamber, evacuates to form a vacuum space, and makes the second OCA adhere to the second product in the second laminating lower chamber;

[0036] (3) The first vacuum laminating module and the second vacuum laminating module cancel the vacuum and separate; the film tearing mechanism tears the heavy film on the other side of the first OCA and the second OCA;

[0037] S3. Second lamination:

[0038] The third product is loaded onto the loading platform of the second laminating lower chamber through the product aspect mechanism, and the second laminating upper chamber moves down to adsorb the third product; then it moves above the second laminating lower chamber and laminates with the second laminating lower chamber, so that the second product adheres to the third product through the second OCA;

[0039] S4. Third lamination:

[0040] The second laminating lower chamber moves below the first laminating upper chamber, and the first laminating upper chamber moves down to dock with the second laminating lower chamber, evacuates to form a vacuum space, and makes the first product adhere above the third product in the second laminating lower chamber through the first OCA;

[0041] S5. nth lamination: When the nth product needs to be laminated again,

[0042] The first laminating upper chamber continues to load the nth product, the first laminating lower chamber loads the OCA, and laminates in the first vacuum laminating module, and then moves the second laminating lower chamber to the first laminating upper chamber to laminate the nth product above the first product through the OCA;

[0043] S6. Unloading.

[0044] Beneficial effects:

[0045] The multi-layer alignment and lamination device provided by the present invention realizes high-precision, high-efficiency, and automated lamination operations through technical means such as a double upper cavity lamination mechanism, a high-precision alignment system, an optimized design of the film tearing mechanism, and a UV pre-curing device, meeting the requirements of multi-layer material lamination. Description of the Drawings

[0046] Figure 1 is a schematic diagram of the overall structure of the multi-layer alignment and lamination device according to an embodiment of the present invention;

[0047] Figure 2 is a schematic diagram of the structure of the loading module of the multi-layer alignment and lamination device according to an embodiment of the present invention;

[0048] Figure 3 is a schematic diagram of the structure of the loading module of the multi-layer alignment and lamination device from another perspective according to an embodiment of the present invention;

[0049] Figure 4 is a schematic diagram of the structure of the lamination module of the multi-layer alignment and lamination device according to an embodiment of the present invention;

[0050] Figure 5 is a schematic diagram of the structure of the lamination module of the multi-layer alignment and lamination device from another perspective according to an embodiment of the present invention;

[0051] Figure 6 is a schematic diagram of the structure of the lower lamination cavity of the lamination module of the multi-layer alignment and lamination device according to an embodiment of the present invention;

[0052] Figure 7 is a schematic cross-sectional structure diagram of the lamination platform of the lamination module of the multi-layer alignment and lamination device according to an embodiment of the present invention;

[0053] Figure 8 is a schematic diagram of the structure of the lamination platform of the lamination module of the multi-layer alignment and lamination device according to an embodiment of the present invention;

[0054] Figure 9 is a schematic diagram of the structure of the upper lamination cavity of the lamination module of the multi-layer alignment and lamination device according to an embodiment of the present invention;

[0055] Figure 10 is a schematic diagram of the structure of the upper lamination platform of the lamination module of the multi-layer alignment and lamination device according to an embodiment of the present invention;

[0056] Figure 11 is a schematic diagram of the structure of the silicone head of the lamination module of the multi-layer alignment and lamination device according to an embodiment of the present invention;

[0057] Figure 12 is a schematic diagram of the lamination process of the lamination module of the multi-layer alignment and lamination device according to an embodiment of the present invention;

[0058] Figure 13It is a schematic structural diagram of the lower film peeling mechanism of the multi-layer alignment and lamination device according to an embodiment of the present invention;

[0059] Figure 14 It is a schematic structural diagram of the film peeling feeder of the multi-layer alignment and lamination device according to an embodiment of the present invention;

[0060] Figure 15 It is a schematic structural diagram of the upper film peeling mechanism of the multi-layer alignment and lamination device according to an embodiment of the present invention;

[0061] Figure 16 It is a schematic diagram of one of the lamination process of the multi-layer alignment and lamination device according to an embodiment of the present invention;

[0062] Reference numerals:

[0063] Feeding module 100, product feeding module 11, feeding platform 111, product turning mechanism 112, flipping U-axis 1121, product adsorption table 1122, moving XZ-axis 1123, product cleaning mechanism 113, USC cleaning device 1131, plasma cleaning device 1132, CCD alignment component 114;

[0064] OCA feeding module 12, OCA feeding platform 121, air blowing port 1211, calibration CCD 1212, transfer platform 122, stacking sensor 1221, OCA feeding flipping platform 123, XZ-axis moving mechanism 1231, first OCA adsorption platform 1232, second OCA adsorption platform 1233, OCA handling mechanism 124, OCA picking structure 1241, four-axis moving mechanism 1242, picking table 1243, film shaking cylinder 1244, OCA cleaning lower platform 125, handling manipulator 126, OCA cleaning mechanism 127;

[0065] Lamination module 200, first lamination lower cavity 21, feeding platform 211, lamination platform 212, installation part 2121, lamination fixture 2122, moving part 2123, limiting step 2124, guide rail 2125, returning cylinder 2126, adjusting screw 2127, spring part 2128, pressure sensor 2129, standard gauge block 2120, height measuring sensor 213, Mark camera 214, six-axis adjustment platform 215, XYθ-axis mechanism 2151, horizontal adjustment mechanism 2152, lifting mechanism 21521, positioning point 21522, bellows 216,

[0066] First lamination upper cavity 22, lamination upper platform 221, lifting Z-axis 222, bionic adhesion suction cup 2211, silica gel head 223, extending cylinder 224, UV line light source 225, second lamination lower cavity 23, second lamination upper cavity 24,

[0067] Film tearing module 300, upper film tearing mechanism 310, lower film tearing mechanism 320, film tearing feeder 31, winding reel 311, unwinding reel 312, film pressing cylinder 313, film tearing device 32, film tearing Z-axis 321, swing cylinder 322, film tearing roller 323, film tearing cylinder 324, gripper 325;

[0068] Blank material discharging module 400, waste film frame 41, blank material discharging platform 42. Specific implementation mode

[0069] Embodiment 1

[0070] Combined with Figure 1 , this embodiment provides a multi-layer alignment and lamination device, including: feeding module 100, handling module, lamination module 200, film tearing module 300; wherein,

[0071] Combined with Figures 1 to 15 As shown, the feeding module 100 includes a product feeding module 11 and an OCA feeding module 12; wherein, the product feeding module 11 includes a plurality of feeding platforms 111, a product turning mechanism 112, and a product cleaning mechanism 113; the product turning mechanism 112 is provided with a plurality of product adsorption platforms 1122 to individually adsorb and place the products on the feeding platforms 111, and turn the products over by flipping; the cleaning mechanism is adapted to clean the front and back sides of the products; the OCA feeding module 12 includes a plurality of OCA feeding platforms 121, an OCA handling mechanism 124, and an OCA cleaning mechanism 127, and the OCA handling mechanism 124 is adapted to individually transport the OCA on the OCA feeding platforms 121 into the lamination module 200; the OCA cleaning mechanism 127 is adapted to clean the front and back sides of the OCA during the transportation process;

[0072] The lamination module 200 includes a moving mechanism and a first vacuum lamination module 200, a second vacuum lamination module 200; the first vacuum lamination module 200 includes a first lamination lower chamber 21 and a first lamination upper chamber 22, and the second vacuum lamination module 200 includes a second lamination lower chamber 23 and a second lamination upper chamber 24; wherein, the first lamination lower chamber 21 and the second lamination lower chamber 23 are arranged on the moving mechanism to move between the first lamination upper chamber 22, the second lamination upper chamber 24, and the blank material discharging module 400 under the drive of the moving mechanism;

[0073] The first lamination upper chamber 22 is adapted to adsorb the first product from the first lamination lower chamber 21; the first lamination lower chamber 21 is adapted to place the first OCA, and tear off the light film of the first OCA through a film tearing mechanism, and the first lamination upper chamber 22 is adapted to descend to dock with the first lamination lower chamber 21 and form a vacuum lamination space to laminate the first OCA on the first product; after lamination, the film tearing mechanism is adapted to tear off the heavy film of the first OCA;

[0074] The second fitting upper cavity 24 is adapted to adsorb the second OCA from the second fitting lower cavity 23 and tear off the light film of the second OCA through a film tearing mechanism; the second fitting lower cavity 23 is adapted to place a second product, and the second fitting upper cavity 24 is adapted to descend to dock with the second fitting lower cavity 23 and form a vacuum fitting space to fit the second OCA on the second product; after fitting, the film tearing mechanism is adapted to tear off the heavy film of the second OCA; and the feeding mechanism is adapted to convey a third product to the second fitting upper cavity 24 again, so that the second product is fitted on one side of the third product through the second OCA.

[0075] The moving mechanism is adapted to drive the second fitting lower cavity 23 to move below the first fitting upper cavity 22, and the first fitting upper cavity 22 is adapted to cooperate with the second fitting lower cavity 23 to form a closed vacuum fitting space, and the first product on the first fitting upper cavity 22 is fitted on the other side of the third product in the second fitting lower cavity 23 through the first OCA.

[0076] When it is necessary to fit another layer of product, only the fourth product and the third OCA need to be loaded again into the first fitting upper cavity 22 and the first fitting lower cavity 21, and the fourth product and the third OCA are fitted in the first vacuum fitting module 200, and then the second fitting lower cavity 23 is moved below the first fitting upper cavity 22 to fit the fourth product above the first product through the third OCA. And so on, multiple layers of products can be fitted on the same device. When it is necessary to fit the nth product below the second product, only the first fitting upper cavity 22 needs to adsorb the fitted product, then the nth product is loaded into the second vacuum fitting module 200, and finally the second fitting lower cavity 23 with the nth product is moved below the first fitting upper cavity 22 again for fitting.

[0077] Through this solution, the full-automatic fitting of multiple layers of products can be realized on one device, greatly improving the fitting efficiency and quality.

[0078] In this embodiment, the products can be the same glass cover plates or different product types. For example, the first product, the second product, and the fourth product can be VID, while the third product can be WG. The OCA can also be replaced by PSA, including but not limited to this.

[0079] Combined with Figures 1 to 3As shown, in this embodiment, the OCA feeding module 12 further includes a calibration CCD 1212, an OCA transfer platform 122, and an OCA feeding and flipping platform 123; wherein, the OCA feeding platform 121 includes a first bin, a second bin, and a third bin for stacking OCA films respectively; the bottoms of the first bin, the second bin, and the third bin are provided with an XYZ-axis adjustment mechanism to adjust the placement position of the OCA, and a blowing port 1211 connected to a plasma device and a film detection sensor are arranged on the OCA feeding platform 121, and the blowing port 1211 is arranged on two adjacent sides of the OCA feeding platform 121 to blow and clean the top surface of the film; the film detection sensor is adapted to detect whether an OCA is placed on the OCA feeding platform 121; by connecting the plasma device to the blowing port 1211, the top surface of the OCA film material can be purged; the film detection sensor can adopt an infrared sensor to detect whether there is a shortage of materials.

[0080] The OCA handling mechanism 124 includes an OCA material picking structure 1241. The OCA material picking mechanism includes a four-axis motion mechanism 1242 and a material picking table 1243 connected to the four-axis motion mechanism 1242. The material picking table 1243 is adapted to adsorb the OCA film and move it to the calibration CCD 1212 for photographing, and correct the angle and position of the picked OCA film according to the shooting results of the calibration CCD 1212. A film shaking cylinder 1244 is arranged on the material picking table 1243 to make the redundant film material fall off by shaking the material picking table 1243 after picking the film. The material picking table 1243 is adapted to grab the OCA film to the transfer platform 122. A stacking sensor 1221 is arranged on the transfer platform 122 to detect whether stacking occurs. After the detection is completed, the material picking table 1243 grabs the film material on the transfer platform 122 to the OCA cleaning lower platform 125. Here, a vacuum suction head is connected to the material picking table 1243 to perform adsorption and handling by means of vacuum suction. The film shaking cylinder 1244 is provided to shake during material picking so that the electrostatically adsorbed overlapping OCA film material falls off, ensuring that only one OCA film is picked each time. Then, detection is performed through the transfer platform 122 to ensure that there is only one OCA film for feeding. The stacking sensor 1221 can adopt a fiber optic sensor, etc., to judge whether there is stacking by the height of the OCA film. If there is a stacking phenomenon, the OCA film is grabbed by the handling manipulator 126 and unloaded at the NG unloading station, and then re-fed. This solution ensures that there is only one OCA film for feeding each time by separating the film by the cylinder shaking + electrostatic eliminator and detecting whether there is a double film by the fiber optic sensor, preventing the bonding failure caused by double film. The calibration CCD can also photograph the outer shape of the OCA film. When it is found that the OCA film is warped, the vacuum on the transfer platform 122 is turned on to adsorb and flatten the product, and then the material picking table 1243 comes to adsorb the OCA film to ensure that the OCA film is flat during calibration photographing. A light load spring is arranged at the bottom of the fixture platform of the transfer platform 122 to prevent the OCA film from being damaged due to excessive pressure during handover material picking.

[0081] The OCA cleaning lower platform 125 includes a moving X-axis mechanism and a fixture platform for placing the OCA film arranged on the moving X-axis mechanism. It is configured to drive the OCA film to move between the material picking platform and the OCA feeding and flipping platform 123. An OCA cleaning mechanism 127 is arranged on the movement track of the OCA cleaning lower platform 125 to clean the OCA film. Here, two fixture platforms are arranged on the OCA cleaning lower platform 125, which can be used to place two OCA films to improve the film supply efficiency.

[0082] The OCA loading and flipping platform 123 is connected to an XZ-axis motion mechanism 1231. The front and back sides of the OCA loading and flipping platform 123 are respectively provided with a first OCA adsorption platform 1232 and a second OCA adsorption platform 1233, which are used to adsorb the OCA film from the fixture platform, flip the OCA film, and then place it back on the OCA cleaning lower platform 125 to clean the other side of the OCA film.

[0083] The OCA cleaning mechanism 127 includes a USC cleaning mechanism. The USC cleaning mechanism is arranged above the moving path of the OCA cleaning lower platform 125, and its height can be adjusted up and down to adjust the cleaning efficiency. In this solution, the OCA cleaning mechanism 127 drives the OCA film to move back and forth below the OCA cleaning mechanism 127, and cooperates with the OCA loading and flipping platform 123 to achieve the cleaning of both sides of the OCA.

[0084] A handling robot 126 is arranged between the OCA loading module 12 and the laminating module 200. A pick-up suction nozzle is arranged on the handling robot 126 to transport the OCA film into the laminating module 200. The handling robot 126 can also transport the unqualified OCA film to the NG unloading station for unloading.

[0085] The product loading module 11 further includes a CCD alignment component 114 arranged above the loading platform 111. Among them, the loading platform 111 is arranged on an X-axis moving mechanism. At least four groups of fixture platforms for placing products are arranged on the loading platform 111. A buffer spring is arranged below each fixture platform. Through the buffer spring, rigid damage to the product is prevented during material taking. And a alignment platform is arranged at the bottom of the loading platform 111 to perform preliminary calibration and alignment according to the shooting data of the CCD alignment component 114. The X-axis moving mechanism can drive the loading platform 111 to move below the product cleaning mechanism 113 to clean the top surface of the product placed on the loading platform 111. The product cleaning mechanism 113 includes a USC cleaning device 1131 and a plasma cleaning device 1132. The USC cleaning device 1131 and the plasma cleaning device 1132 are arranged on the mounting bracket and are arranged front and back to clean the product respectively. After the first side is cleaned, the loading platform 111 resets.

[0086] The product turning mechanism 112 is adapted to move between the upstream platform 111 and the downstream end of the product cleaning mechanism 113. It includes a turning U-axis 1121, and on each of the four surfaces around the turning U-axis 1121, there is a product adsorption table 1122 adapted to correspond to the fixture platform. It is configured to adsorb products from the four groups of fixture platforms one by one and turn them over, so as to drive the other side of the turned-over product to move to the product cleaning mechanism 113 for cleaning. Here, the four product adsorption tables 1122 are respectively arranged on the four surfaces of the product turning mechanism 112, and are arranged in pairs opposite to each other. By rotating the turning U-axis 1121, the product adsorption table 1122 rotates around the turning U-axis 1121. The product turning mechanism 112 is arranged on the moving XZ-axis 1123. By the moving XZ-axis 1123, the turning U-axis 1121 can be driven to move between the upstream platform 111 and the laminating module 200, and the material can be picked up and placed by lifting. The product feeding module 11 transports the product into the laminating module 200 through the product turning mechanism 112.

[0087] Combined with Figures 4 to 12 As shown, the laminating module 200 includes a first vacuum laminating module 200 and a second vacuum laminating module 200. Among them, the first vacuum laminating module 200 includes a first lower laminating chamber 21 and a first upper laminating chamber 22. In the first lower laminating chamber 21, there are a feeding platform 211 and a laminating platform 212. The height of the feeding platform 211 is lower than that of the laminating platform 212, and a heating device is arranged on the laminating platform 212 to be adapted to heat the OCA film. By setting the height of the feeding platform 211 lower than that of the laminating platform 212, it can be ensured that during lamination, the upper laminating chamber will not touch the products or films in the feeding platform 211. Here, the feeding platform 211 can also be used to temporarily store products or films, reducing the cycle of secondary feeding and improving the efficiency of the process. A height measuring sensor 213 is arranged on the side of the first lower laminating chamber 21 to detect the distance between the first product in the first lower laminating chamber 21 and the first OCA in the first upper laminating chamber 22. A six-axis adjustment platform 215 is arranged below the laminating platform 212 to adjust the parallelism and overlap degree of the first product and the first OCA in the first lower laminating chamber 21 according to the measurement result of the height measuring sensor 213. The six-axis adjustment platform 215 and the first upper laminating chamber 22 are hermetically connected by a bellows 216 to ensure the vacuum degree of the vacuum space formed by the first upper laminating chamber 22 and the first lower laminating chamber 21. The second vacuum laminating module 200 includes a second lower laminating chamber 23 and a second upper laminating chamber 24, and the structure of the second lower laminating chamber 23 is the same as that of the first lower laminating chamber 21, and the structure of the second upper laminating chamber 24 is the same as that of the first upper laminating chamber 22.

[0088] In this embodiment, both the first fitting lower cavity 21 and the second fitting lower cavity 23 can cooperate with the first fitting upper cavity 22 and the second fitting upper cavity 24, so that the second fitting lower cavity 23 can move to cooperate with the first fitting upper cavity 22 to form a vacuum space, and the products and diaphragms inside the two can be mutually attached. The first fitting lower cavity 21 and the second fitting lower cavity 23 are arranged on a moving mechanism, and through this moving mechanism, the first fitting lower cavity 21 and the second fitting lower cavity 23 can be driven to approach the feeding station for feeding, be at the fitting station for fitting, and move to the discharging station for discharging. Due to the mutually adapted characteristics of the first vacuum fitting module 200 and the second vacuum fitting module 200, the superimposed fitting of multiple-layer products can be satisfied.

[0089] Height measuring sensors 213 and Mark cameras 214 are arranged on the circumferences of the first fitting lower cavity 21 and the second fitting lower cavity 23. Among them, two height measuring sensors 213 are arranged vertically, which can be respectively used to measure the horizontal heights of the products or diaphragms in the fitting upper cavity and the fitting lower cavity. The Mark camera 214 can photograph and obtain the outer shapes of the products or diaphragms, and analyze the angles of the products or diaphragms through the control system. After obtaining the outer shape information and height information of the products and diaphragms through the height measuring sensors 213 and the Mark cameras 214, the horizontal position of the products in the fitting lower cavity is adjusted through the six-axis adjustment platform 215. By cooperating with the Mark camera 214 and the shape CCD, a registration accuracy of ≤±15 μm can be achieved. Specifically, the six-axis adjustment platform 215 includes an XYθ-axis mechanism 2151 arranged at the bottom and a horizontal adjustment mechanism 2152 arranged on the XYθ-axis mechanism 2151. The horizontal adjustment mechanism 2152 includes three lifting mechanisms 21521. The three lifting mechanisms 21521 are connected below the fitting platform 212 to adjust the levelness of the plane of the fitting platform 212 in a three-point positioning manner. The XYθ-axis mechanism 2151 is adapted to adjust the position of the fitting platform 212 so that the products in the first fitting lower cavity 21 overlap and align with the products in the first fitting upper cavity 22. The three lifting mechanisms 21521 drive a wedge block to slide up and down on another wedge block by means of a linear motor to accurately control the height of each positioning point 21522. The three lifting mechanisms 21521 are respectively connected with a positioning point 21522, and the three positioning points 21522 are arranged in an equilateral triangle orientation. The levelness of the fixture platform arranged on the six-axis adjustment platform 215 can be adjusted by forming a plane with three points. The XYθ-axis mechanism 2151 is adapted to drive the fixture platform to adjust its position in the plane to be adapted to fit with the diaphragm or product on the fitting upper cavity. Here, the position is adjusted through the XYθ-axis mechanism 2151, and the height level is adjusted through the horizontal adjustment mechanism 2152, so as to ensure the alignment of the fitting upper and lower cavities. The six-axis adjustment platform 215 can ensure that the theoretical comprehensive parallelism accuracy reaches 9 μm.

[0090] The bonding jig 2122 is connected to the six-axis adjustment platform 215 through the bonding platform 212. The bonding platform 212 includes a mounting portion 2121, a bonding jig 2122, a movable member 2123, a guide rail 2125, a return cylinder 2126, an adjustment screw 2127, a spring member 2128, a pressure sensor 2129, and a standard gauge block 2120. Among them, the movable member 2123 is movably arranged in the mounting portion 2121 through the guide rail 2125. The adjustment screw 2127 is arranged on the movable member 2123, and a spring member 2128 is arranged at the bottom thereof. The pressure sensor 2129 is arranged at the bottom of the spring member 2128, and the initial pressure of the spring member 2128 is adjusted through the adjustment screw 2127. The bonding jig 2122 is connected above the movable member 2123, and a plurality of the return cylinders 2126 are arranged on the periphery of the mounting portion 2121. The return cylinder 2126 is adapted to extend after the bonding is completed to drive the bonding jig 2122 and the movable member 2123 to return to their original positions. A limiting step 2124 is arranged on the movable member 2123, and the standard gauge block 2120 adapted to the limiting step 2124 is arranged in the mounting portion 2121. The upper limit of the movable member 2123 is carried out through the standard surface of the standard gauge block 2120 to ensure the levelness of the bonding jig 2122. In this embodiment, since the bonding force during bonding is relatively small and there is friction between the movable member 2123 and the mounting portion 2121, the movable member 2123 cannot return to its original position after the bonding is completed. Therefore, by arranging the return cylinder 2126, the movable member 2123 can be driven to return to its original position after the bonding is completed, and then the bonding jig 2122 is driven to return to its original position. The movable member 2123 and the mounting portion 2121 are limited by the limiting step 2124. Since the stepped surface of the mounting portion 2121 is inside and the machining difficulty of the flatness of the plane is relatively large, when directly using the stepped surfaces of the movable member 2123 and the mounting portion 2121 for limiting, there is a problem of insufficient levelness, especially after each bonding, the levelness of the bonding jig 2122 after returning to its original position may be different. Therefore, by arranging a standard gauge block 2120 on the stepped surface of the mounting portion 2121, the standard gauge block 2120 is made by precision machining and has a relatively high surface flatness. The upper limit of the movable member 2123 is carried out through the standard surface of the standard gauge block 2120, so that the levelness of the bonding jig 2122 after each return to its original position is the same, and the difference in the bonding degree of the product caused by the existence of the horizontal error is minimized as much as possible.

[0091] The structures of the first fitting upper cavity 22 and the second fitting upper cavity 24 are basically the same. Both are provided with a fitting upper platform 221 connected to a vacuum device. The fitting upper platform 221 is connected with a lifting Z-axis 222. A buffer elastic member is arranged between the lifting Z-axes 222 and the fitting upper platform 221. The fitting upper platform 221 includes a heating plate and a bionic adhesion suction cup 2211. The heating plate is suitable for heating the fitting upper platform 221. The bionic adhesion suction cup 2211 is suitable for adhering to the product in a vacuum environment to prevent the product from falling. Specifically, the diaphragm can be preheated through the heating plate to improve the fitting effect. By providing the bionic adhesion suction cup 2211, the diaphragm can be effectively prevented from falling after preheating. The fitting upper platform 221 is provided with a fitting fixture 2122. A through hole is arranged in the middle of the fitting fixture 2122. The bionic adhesion suction cup 2211 is arranged at the through hole through a micro telescopic module. The bionic adhesion suction cup 2211 can enter and exit at the through hole through the micro telescopic module, so as to extend when needed to assist in adsorbing the product or the diaphragm. The working temperature of the bionic adhesion suction cup 2211 is between -40°C and 130°C and is not affected by the heating sheet. Preferably, a silica gel head 223 is arranged on one side of the fitting upper platform 221. The silica gel head 223 is connected to an extending cylinder 224. The silica gel head 223 is suitable for pressing down from the middle of the product after the product is fitted to extrude the bubbles in the fitting surface of the product. Here, the shape of the silica gel head 223 is similar to a sphere. After the upper product is fitted to the lower product in a vacuum fitting environment, the upper moving axis moves to make the silica gel head 223 move to directly above the fitted product. The silica gel head 223 presses down, so that the bottom convex points first contact the product, and pressure is applied from the middle area to the periphery to reduce product bubbles. Through the arrangement of the silica gel head 223, on the one hand, the product can be pressed from the middle to the outside to remove bubbles, improving the bubble removal effect. On the other hand, when the product has a curved surface, the silica gel head 223 can also adapt to various curved surface products to assist in fitting. Preferably, a UV line light source 225 is arranged outside the fitting upper cavity to pre-cure the fitted product.

[0092] Combine Figures 13 to 15As shown, the film tearing mechanism includes an upper film tearing mechanism 310 and a lower film tearing mechanism 320, which are respectively used for tearing the OCA film in the lower bonding cavity and the upper bonding cavity. The upper film tearing mechanism 310 and the lower film tearing mechanism 320 have the same structure and are arranged on the moving mechanism, and can be moved to the corresponding lower bonding cavity and upper bonding cavity as needed for film tearing. Specifically, each film tearing mechanism includes a film tearing feeder 31 and a film tearing device 32. Among them, the film tearing feeder 31 includes a winding reel 311, a feeding reel 312, and a film pressing cylinder 313. The feeding reel 312 is adapted to drive the tape with an easy-to-tear sticker to be transmitted to the winding reel 311 under the drive of a feeding motor. The film pressing cylinder 313 is arranged at the film tearing position and is adapted to press the tape tightly to facilitate the easy-to-tear sticker to break away from the tape;

[0093] Continuing to combine with Figures 13 to 15 As shown, the film tearing device 32 includes a film tearing Z-axis 321, a swing cylinder 322, a film tearing roller 323, a film tearing cylinder 324, and a gripper 325. Among them, the film tearing Z-axis 321 is adapted to drive the film tearing device 32 to move up and down. A rotating mechanism is arranged on the film tearing Z-axis 321, and the swing cylinder 322 is connected to the rotating mechanism; the swing cylinder 322 connects the gripper 325 and the film tearing cylinder 324 to drive the gripper 325 and the film tearing cylinder 324 to swing by a preset angle during film tearing; the gripper 325 is adapted to pick up the easy-to-tear sticker from the film tearing feeder 31. The film tearing cylinder 324 is inclined above the gripper 325, and its extending end is connected to the film tearing roller 323 to move synchronously with the film tearing Z-axis 321 during film tearing to gradually tear off the release film of the OCA. The swing cylinder 322 is adapted to drive the gripper 325 to swing synchronously during film tearing to assist in film tearing. By setting the swing cylinder 322 to drive the gripper 325 and the film tearing roller 323 to swing to a preset angle, such as 45°, interference with the vacuum bonding module 200 during film picking or film tearing can be avoided, and the space required for film tearing and film picking can be reduced. At the same time, by setting the film tearing roller 323, it can extend after the easy-to-tear sticker is pasted on the OCA film to press the easy-to-tear sticker tightly on the OCA film, and then drive the film tearing Z-axis 321 and the swing rod to move to drive the gripper 325 away from the OCA film, so as to gradually tear off the release film of the OCA film from one side to the other side. A detection sensor is also arranged at the gripper 325. The detection sensor is arranged on the gripper 325 and is used to detect whether the gripper 325 picks up the easy-to-tear sticker to ensure that the OCA film can be torn, and the film tearing success rate is ≥99.8%.

[0094] This embodiment further includes a blanking mechanism. A waste film frame 41 and a blanking platform 42 are arranged on the blanking mechanism. The product in the bonding module 200 can be transported to the blanking platform 42 by a manipulator, and the waste film frame 41 can collect products or films that do not meet the requirements.

[0095] It should be noted that in this embodiment, a vacuum device is connected to both the jig platform for placing the diaphragm and the product, and the laminating jig 2122 to fix the diaphragm or the product. In this embodiment, each electrical component is connected to the control system and coordinated and controlled by the control system. The involved moving mechanism or motion mechanism can adopt existing motion devices such as mobile devices, cylinders, lead screw mechanisms, motors, etc. which will not be elaborated one by one here.

[0096] Through the solution of this embodiment, the full-automatic lamination of multi-layer products can be realized, and the efficiency is greatly improved. In terms of the lamination position accuracy: ≤±30um (profile alignment), ≤±15um (Mark alignment), mark alignment Rotation: ≤0.03°, outer shape alignment Rotation: ≤0.05°, and the accuracy is greatly improved.

[0097] Embodiment 2

[0098] Combined with Figure 1 and Figure 16 as shown, this embodiment also provides a lamination process based on the multi-layer alignment and lamination equipment, including the following steps:

[0099] S1. Loading:

[0100] (1). After the first product is cleaned by the product cleaning mechanism 113, it is loaded onto the feeding platform 211 in the first lamination lower cavity 21 through the product turning-over mechanism 112. Then, the first lamination upper cavity 22 moves above the feeding platform 211 to adsorb the first product into the first lamination upper cavity 22; after the first OCA is cleaned by the OCA cleaning mechanism 127, it is loaded onto the lamination platform 212 in the first lamination lower cavity 21 through the handling robot 126, and then the film tearing mechanism tears the light film of the first OCA;

[0101] (2) After the second OCA is cleaned by the COA cleaning mechanism, it is transported by the handling robot 126 into the feeding platform 211 in the second lamination lower cavity 23. The second lamination upper cavity 24 moves to the feeding platform 211 to adsorb the second OCA into the second lamination upper cavity 24, and then the film tearing mechanism tears the light film of the second OCA; after the second product is cleaned by the product cleaning mechanism 113, it is loaded into the lamination platform 212 in the second lamination lower cavity 23 through the product turning-over mechanism 112;

[0102] S2. First lamination:

[0103] (1) The first lamination upper cavity 22 moves down to be connected with the first lamination lower cavity 21, and vacuum is pumped to form a vacuum space, and the first OCA is laminated on the first product in the first lamination upper cavity 22;

[0104] (2) The second upper fitting cavity 24 moves downward to connect with the second lower fitting cavity 23, and vacuum is pumped to form a vacuum space, and the second OCA is attached to the second product in the second lower fitting cavity 23;

[0105] (3) The first vacuum fitting module 200 and the second vacuum fitting module 200 cancel the vacuum and separate; the film tearing mechanism tears the heavy film on the other side of the first OCA and the second OCA;

[0106] S3. Secondary fitting:

[0107] The third product is loaded onto the feeding platform 211 of the second lower fitting cavity 23 through the product feeding mechanism, and the second upper fitting cavity 24 moves downward to adsorb the third product; then it moves above the second lower fitting cavity 23 and fits with the second lower fitting cavity 23, so that the second product is attached to the third product through the second OCA;

[0108] S4. Tertiary fitting:

[0109] The second lower fitting cavity 23 moves to the lower part of the first upper fitting cavity 22, and the first upper fitting cavity 22 moves downward to dock with the second lower fitting cavity 23, and vacuum is pumped to form a vacuum space, so that the first product is attached to the upper part of the third product in the second lower fitting cavity 23 through the first OCA;

[0110] S5. The nth fitting: When the nth product needs to be attached again,

[0111] The first upper fitting cavity 22 continues to load the nth product, the first lower fitting cavity 21 loads the OCA, and they are attached in the first vacuum fitting module 200, and then the second lower fitting cavity 23 is moved to the first upper fitting cavity 22 to attach the nth product to the upper part of the first product through the OCA;

[0112] S6. Unloading.

[0113] In this embodiment, during loading, the product and the OCA film can be loaded synchronously and controlled and coordinated according to the control system. Since there is a feeding platform 211 in the fitting lower cavity, the fitting of three products can be achieved in one loading. When four products need to be fitted, since the first lower fitting cavity 21 is idle during the third lifting of the box and can be loaded, the process duration can be shortened. Through the solution of this embodiment, a fully automatic fitting device with higher precision and higher efficiency is provided.

[0114] It should be understood that: the above is only the preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions falling within the idea of the present invention belong to the protection scope of the present invention.

[0115] The above introduction to the accompanying drawings used in the embodiments only shows some embodiments of the present invention and should not be regarded as a limitation of the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

Claims

1. A multi-layer alignment and lamination device, characterized in that: include: Loading module, handling module, laminating module, film tearing module; among them, The feeding module includes a product feeding module and an OCA feeding module; wherein the product feeding module includes a plurality of feeding platforms, a product turning mechanism, and a product cleaning mechanism; the product turning mechanism is provided with a plurality of product adsorption tables to adsorb the products placed on the feeding platform one by one, and turn the products over by turning; the cleaning mechanism is suitable for cleaning the front and back sides of the products; the OCA feeding module includes a plurality of OCA feeding platforms, an OCA conveying mechanism, and an OCA cleaning mechanism, wherein the OCA conveying mechanism is suitable for A is transported one by one into the bonding module; the OCA cleaning mechanism is suitable for cleaning the front and back sides of the OCA during the transportation process; the bonding module includes a moving mechanism and a first vacuum bonding module and a second vacuum bonding module; the first vacuum bonding module includes a first bonding lower chamber and a first bonding upper chamber, and the second vacuum bonding module includes a second bonding lower chamber and a second bonding upper chamber; wherein the first bonding lower chamber and the second bonding lower chamber are arranged on the moving mechanism so as to be able to move between the first bonding upper chamber, the second bonding upper chamber and the unloading module under the drive of the moving mechanism; The first laminating upper chamber is suitable for sucking the first product from the first laminating lower chamber; the first laminating lower chamber is suitable for placing the first OCA, and tearing off the light mold of the first OCA through the film tearing mechanism, the first laminating upper chamber is suitable for descending to dock with the first laminating lower chamber, and forming a vacuum laminating space to laminar the first OCA on the first product; after laminating, the film tearing mechanism is suitable for tearing off the heavy film of the first OCA; The second laminating upper chamber is suitable for sucking the second OCA from the second laminating lower chamber, and tearing off the light mold of the second OCA through the film tearing mechanism; the second laminating lower chamber is suitable for placing the second product, and the second laminating upper chamber is suitable for descending to dock with the second laminating lower chamber, and forming a vacuum laminating space to laminarize the second OCA on the second product; after laminating, the film tearing mechanism is suitable for tearing off the heavy film of the second OCA; and the feeding mechanism is suitable for conveying the third product to the second laminating upper chamber again, so that the second product is laminarized on one side of the third product through the second OCA; The moving mechanism is suitable for driving the second bonding lower chamber to move to the bottom of the first bonding upper chamber, and the first bonding upper chamber is suitable for cooperating with the second bonding lower chamber to form a closed vacuum bonding space, and allowing the first product on the first bonding upper chamber to be bonded to the other side of the third product in the second bonding lower chamber through the first OCA.

2. The multi-layer alignment and lamination equipment according to claim 1, characterized in that: The OCA loading module also includes a calibration CCD, an OCA transfer platform, and an OCA loading flip platform; wherein, The OCA loading platform includes a first material bin, a second material bin and a third material bin for stacking OCA films respectively; the first material bin, the second material bin and the third material bin are provided with XYZ axis adjustment mechanisms to adjust the position of the OCA; the OCA loading platform is provided with an air blowing port connected to a plasma device and a film detection sensor, the air blowing port is provided on two adjacent sides of the OCA loading platform to blow and clean the top surface of the film; the film detection sensor is suitable for detecting whether the OCA is placed on the OCA loading platform; The OCA transport mechanism includes an OCA material picking structure, and the OCA material picking mechanism includes a four-axis motion mechanism and a material picking platform connected to the four-axis motion mechanism, and the material picking platform is suitable for adsorbing and moving the OCA film to the correction CCD for photographing, and correcting the angle and position of the taken OCA film according to the photographing result of the correction CCD; a film shaking cylinder is arranged on the material picking platform to make the excess film material fall off by shaking the material picking platform after taking the film; The material taking platform is suitable for grabbing the OCA film to the transfer platform. The transfer platform is provided with a stacking sensor to detect whether the material is stacked. After the detection is completed, the film material on the transfer platform is grabbed to the OCA cleaning lower platform through the material taking platform; The OCA cleaning lower platform includes a moving X-axis mechanism and a fixture platform for placing the OCA film arranged on the moving X-axis mechanism, which is configured to drive the OCA film to move between the material taking platform and the OCA material loading and turning platform, and the OCA cleaning mechanism is arranged on the motion track of the OCA cleaning lower platform to clean the OCA film; The OCA loading and flipping platform is connected to an XZ axis motion mechanism, and a first OCA adsorption platform and a second OCA adsorption platform are respectively provided on the front and back sides of the OCA loading and flipping platform, which are used to adsorb the OCA film from the jig platform and flip the OCA film and place it back on the OCA cleaning lower platform to clean the other side of the OCA film.

3. The multi-layer alignment and lamination equipment according to claim 1, characterized in that: The product loading module further includes a CCD alignment component disposed above the loading platform; The feeding platform is arranged on a moving mechanism, and at least four sets of fixture platforms for placing products are arranged on the feeding platform, and a buffer spring is arranged under each fixture platform; and an alignment platform is arranged at the bottom of the feeding platform to perform preliminary correction alignment according to the shooting data of the CCD alignment component; the moving mechanism is suitable for driving the feeding platform to move from the product cleaning mechanism to clean the top surface of the product; The product flipping mechanism is suitable for moving between the loading platform and the downstream end of the product cleaning mechanism, and includes a flipping U-axis. A product adsorption table suitable for corresponding to the jig platform is respectively arranged on the four sides around the flipping U-axis. It is configured to adsorb products from the four groups of jig platforms one by one and flip them, so as to drive the other side of the flipped product to move to the product cleaning mechanism for cleaning.

4. The multi-layer alignment and lamination equipment according to claim 1, characterized in that: A transport robot is provided between the OCA loading module and the bonding module, and a material pickup nozzle is provided on the transport robot to transport the OCA film into the bonding module; the product loading module transports the product into the bonding module through the product turning mechanism.

5. The multi-layer alignment and lamination equipment according to claim 4, characterized in that: The bonding module includes a first vacuum bonding module and a second vacuum bonding module with the same structure, wherein the first vacuum bonding module includes a first bonding lower chamber and a first bonding upper chamber, a discharge platform and a bonding platform are arranged in the first bonding lower chamber, the height of the discharge platform is lower than the bonding platform, and a heating device is arranged on the bonding platform to be suitable for heating the OCA film; a height sensor is arranged on the side of the first bonding lower chamber to detect the distance between the first product in the first bonding lower chamber and the first OCA in the first bonding upper chamber; a six-axis adjustment platform is arranged below the bonding platform to adjust the parallelism and overlap of the first product and the first OCA in the first bonding lower chamber according to the measurement result of the height sensor; the six-axis adjustment platform and the first bonding upper chamber are sealed and connected by a bellows to ensure the vacuum degree of the vacuum space formed by the first bonding upper chamber and the first bonding lower chamber.

6. The multi-layer alignment and lamination equipment according to claim 5, characterized in that: The six-axis adjustment platform includes an XYθ axis mechanism and a horizontal adjustment mechanism arranged at the bottom, and the horizontal adjustment mechanism includes three lifting mechanisms. The three lifting mechanisms are connected to the bottom of the bonding platform to adjust the horizontality of the bonding platform plane by three-point positioning; the XYθ axis mechanism is suitable for adjusting the position of the bonding platform so that the product of the first bonding lower cavity and the product of the first bonding upper cavity overlap and align.

7. The multi-layer alignment and lamination equipment according to claim 5, characterized in that: The bonding platform includes a mounting portion, a bonding jig, a movable part, a guide rail, a return cylinder, an adjustment screw, a spring part, a pressure sensor and a standard gauge block; wherein the movable part is movably arranged in the mounting portion through the guide rail, the adjustment screw is arranged on the movable part, and a spring part is arranged at the bottom thereof, a pressure sensor is arranged at the bottom of the spring part, and the initial pressure of the spring part is adjusted by the adjustment screw; the bonding jig is connected to the top of the movable part, and a plurality of return cylinders are arranged on the peripheral side of the mounting portion, and the return cylinders are suitable for extending after the bonding is completed to drive the bonding jig and the movable part to reset; a limiting step is arranged on the movable part, and the standard gauge block adapted to the limiting step is arranged in the mounting portion, and the movable part is upper-positioned by the standard surface of the standard gauge block to ensure the horizontality of the bonding jig.

8. The multi-layer alignment and lamination equipment according to claim 1, characterized in that: A bonding upper platform connected to a vacuum device is arranged in the first bonding upper cavity, the bonding upper platform is connected to a lifting Z axis, and a buffer elastic member is arranged between the lifting Z axis and the bonding upper platform; the bonding upper platform includes a heating plate and a bionic adhesion suction cup, the heating plate is suitable for heating the bonding upper platform, and the bionic adhesion suction cup is suitable for adhering products in a vacuum environment to prevent the products from falling; a silicone head is arranged on one side of the bonding upper platform, the silicone head is connected to the extending cylinder, and the silicone head is suitable for pressing down from the middle of the product after the product is bonded to squeeze out the bubbles in the bonding surface of the product.

9. The multi-layer alignment and lamination equipment according to claim 1, characterized in that: The film tearing mechanism includes a film tearing feeder and a film tearing device, wherein the film tearing feeder includes a material receiving roll, a material unwinding roll, and a film pressing cylinder, wherein the material unwinding roll is suitable for transmitting the material tape with the easy-tear label to the material receiving roll under the drive of the material feeding motor, and the film pressing cylinder is arranged at the film tearing position, and is suitable for pressing the material tape so that the easy-tear label can be separated from the material tape; The film tearing device includes a film tearing Z-axis, a swing cylinder, a film tearing roller, a film tearing cylinder and a gripper, wherein the film tearing Z-axis is suitable for driving the film tearing device to move up and down, a rotating mechanism is arranged on the film tearing Z-axis, and the swing cylinder is connected to the rotating mechanism; the swing cylinder is connected to the gripper and the film tearing cylinder to drive the gripper and the film tearing cylinder to swing at a preset angle when tearing the film; the gripper is suitable for clamping an easy-to-tear label from the film tearing feeder, and the film tearing cylinder is obliquely arranged above the gripper, and its protruding end is connected to the film tearing roller, so as to move synchronously with the film tearing Z-axis when tearing the film, so as to gradually tear off the release film of the OCA.

10. A laminating process based on the multi-layer alignment and lamination equipment according to any one of claims 1 to 9, characterized in that: The steps include: S1. Loading: (1) After the first product is cleaned by the product cleaning mechanism, it is loaded onto the discharge platform in the first laminating lower chamber by the product turning mechanism, and then the first laminating upper chamber moves to above the discharge platform to adsorb the first product into the first laminating upper chamber; After the first OCA is cleaned by the OCA cleaning mechanism, it is loaded onto the bonding platform of the first bonding lower chamber by the transport robot, and then the film tearing mechanism tears off the light film of the first OCA; (2) After the second OCA is cleaned by the COA cleaning mechanism, it is transported to the discharge platform of the second laminating lower chamber by the transport robot. The second laminating upper chamber moves to the discharge platform to adsorb the second OCA into the second laminating upper chamber, and then the film tearing mechanism tears off the film of the second OCA; After the second product is cleaned by the product cleaning mechanism, it is loaded into the bonding platform in the second bonding lower chamber by the product turning mechanism; S2, first fitting: (1) The first upper bonding chamber moves downward to connect with the first lower bonding chamber, and evacuates to form a vacuum space, and the first OCA is bonded to the first product in the first upper bonding chamber; (2) The second upper bonding chamber moves downward to connect with the second lower bonding chamber, and evacuates to form a vacuum space, and the second OCA is bonded to the second product in the second lower bonding chamber; (3) the first vacuum laminating module and the second vacuum laminating module cancel the vacuum and separate; the film tearing mechanism tears off the heavy film on the other side of the first OCA and the second OCA; S3, Secondary bonding: The third product is loaded onto the discharge platform of the second laminating lower chamber through the product side mechanism, and the second laminating upper chamber moves downward to absorb the third product; then it moves to the upper part of the second laminating lower chamber and mates with the second laminating lower chamber, so that the second product is laminated on the third product through the second OCA; S4, three-time lamination: The second laminating lower chamber moves to the bottom of the first laminating upper chamber, the first laminating upper chamber moves downward to dock with the second laminating lower chamber, and vacuum is drawn to form a vacuum space, so that the first product is laminated on the top of the third product in the second laminating lower chamber through the first OCA; S5, nth bonding: When the nth product needs to be bonded again, The first laminating upper chamber continues to load the nth product, the first laminating lower chamber loads the OCA, and lamination is performed in the first vacuum laminating module, and then the second laminating lower chamber is moved to the first laminating upper chamber to laminat the nth product onto the top of the first product through the OCA; S6. Cutting materials.

Citation Information

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