Electroplating liquid backflow control system and control method

Abstract

The invention discloses an electroplating liquid backflow control system and a control method. The electroplating liquid backflow control system comprises a process cavity, a liquid storage tank, a backflow pipeline, a backflow control valve, an image acquisition device and a control device, a backflow opening is formed in the bottom of the overflow tank, the backflow control valve is arranged on the backflow pipeline, and the image acquisition device is arranged above the backflow opening and used for acquiring image information of a backflow opening area and controlling the image information to be transmitted to the process cavity. The image information is sent to the control device; the control device is used for comparing the image information with pre-stored reference image information and adjusting the opening degree of the backflow control valve according to the comparison result. Bubbles generated in the process that the electroplating liquid flows back to the liquid storage tank from the process cavity are effectively reduced or even eliminated, the stability of the electroplating liquid is improved, and then the efficiency of the electroplating process and the process stability are improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and particularly to an electroplating solution reflux control system and a control method thereof. Background Art

[0002] In the electroplating process, the stability of the electroplating solution is crucial for the electroplating effect, directly affecting the quality and uniformity of the coating. The control of bubbles in the electroplating solution is a key factor affecting the stability of the electroplating solution and the electroplating process. If bubbles are mixed into the electroplating solution, on the one hand, since the bubbles contain oxygen, it may cause the additives in the electroplating solution to oxidize and decompose, resulting in unstable plating solution and affecting the electroplating rate; on the other hand, the bubbles enter the electroplating process chamber along with the circulation system. During wafer electroplating, voids that hinder metal deposition will appear at the positions where the bubbles are in contact, that is, it is difficult to effectively electroplate at the positions with bubbles on the wafer.

[0003] In the electroplating process, it is very easy to introduce air and generate bubbles during the process of the electroplating solution flowing back from the electroplating process chamber to the storage tank. Therefore, it is necessary to design an electroplating solution reflux control system and a control method to effectively reduce or even eliminate the bubbles generated during the process of the electroplating solution flowing back from the electroplating process chamber to the storage tank, improve the stability of the electroplating solution, and thus improve the efficiency and process stability of the electroplating process. Summary of the Invention

[0004] In view of the above-mentioned disadvantages of the prior art, the purpose of the present invention is to provide an electroplating solution reflux control system and a control method thereof, which are used to solve the problems that in the electroplating process of the prior art, air bubbles are easily introduced during the process of the electroplating solution flowing back from the electroplating process chamber to the storage tank, resulting in low efficiency and process stability of the electroplating process.

[0005] To achieve the above purpose and other related purposes, the present invention provides an electroplating solution reflux control system, including: a process chamber, a storage tank, a reflux pipeline, a reflux control valve, an image acquisition device, and a control device; wherein, the process chamber includes a reaction tank and an overflow tank, the overflow tank is arranged outside the reaction tank and is used to receive the electroplating solution overflowing from the reaction tank; a reflux port is arranged at the bottom of the overflow tank, the reflux pipeline is used to connect the reflux port and the storage tank to reflux the electroplating solution in the overflow tank to the storage tank; the reflux control valve is arranged on the reflux pipeline; the image acquisition device is arranged above the reflux port and is used to acquire the image information of the reflux port area and send the image information to the control device; the control device is used to compare the image information with the pre-stored reference image information, and adjust the opening degree of the reflux control valve according to the comparison result, so as to adjust the flow rate of the reflux pipeline.

[0006] The present invention provides another electroplating solution reflux control system, including a process chamber, a liquid storage tank, a reflux pipeline, a reflux control valve, an image acquisition device and a control device; wherein, the process chamber includes a reaction tank and an overflow tank, the overflow tank is arranged around the reaction tank and is used for receiving the electroplating solution overflowing from the reaction tank; a reflux port is arranged at the bottom of the overflow tank, and the reflux pipeline is used for connecting the reflux port and the liquid storage tank to reflux the electroplating solution in the overflow tank to the liquid storage tank; the reflux control valve is arranged on the reflux pipeline; the image acquisition device is arranged above the overflow tank and is used for acquiring the image information in the overflow tank and sending the image information to the control device; the control device is used for comparing the image information with the pre-stored reference image information and adjusting the opening degree of the reflux control valve according to the comparison result.

[0007] The present invention also provides an electroplating solution reflux control method, including:

[0008] S1. The process in the process chamber starts, the electroplating solution overflows from the reaction tank to the overflow tank, and then flows into the liquid storage tank through the reflux pipeline;

[0009] S2. The image acquisition device acquires the image information of the reflux port area and sends the image information to the control device;

[0010] S3. The control device compares the image information with the pre-stored reference image information;

[0011] S4. The control device adjusts the opening degree of the reflux control valve according to the comparison result.

[0012] The present invention also provides an electroplating solution reflux control method, including:

[0013] S10. The process in the process chamber starts, the electroplating solution overflows from the reaction tank to the overflow tank, and then flows into the liquid storage tank through the reflux pipeline;

[0014] S20. The image acquisition device acquires the image information in the overflow tank and sends the image information to the control device;

[0015] S30. The control device compares the image information with the pre-stored reference image information;

[0016] S40. The control device adjusts the opening degree of the reflux control valve according to the comparison result.

[0017] As described above, a plating solution reflux control system and a control method provided by the present invention are configured such that an image acquisition device is disposed above the reflux port to acquire image information of the reflux port area and send the image information to a control device. The control device is used to compare the image information with pre-stored reference image information and adjust the opening degree of the reflux control valve of the reflux pipeline according to the comparison result, effectively reducing or even eliminating the bubbles generated during the process of the plating solution refluxing from the electroplating process chamber to the liquid storage tank, improving the stability of the plating solution, and further enhancing the efficiency and process stability of the electroplating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It shows a schematic diagram of a plating solution reflux system;

[0019] Figure 2 It shows a schematic diagram of the plating solution reflux control system in Embodiment 1 of the present invention;

[0020] Figure 3 It shows a schematic diagram of the process chamber structure in Embodiments 1 and 2 of the present invention;

[0021] Figure 4 It shows a schematic diagram of the plating solution reflux control system in Embodiment 2 of the present invention;

[0022] Figure 5 It shows a schematic diagram of the corresponding relationship between different volumes of the plating solution in the overflow tank and the morphology of the plating solution in the reflux port area in Embodiments 1 and 2 of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] The following uses specific examples to illustrate the embodiments of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0024] It should be noted that the drawings of the present disclosure only illustrate the basic concept of the present invention in a schematic manner. Although only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape, and size of the components in actual implementation, the morphology, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout morphology may also be more complex.

[0025] When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. On the contrary, they are only examples of devices consistent with some aspects of the present invention as detailed in the appended claims.

[0026] The terms used in this disclosure are for the purpose of describing particular embodiments only and are not intended to limit the disclosure. The singular forms "a", "the", and "said" used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0027] In the description of this disclosure, unless otherwise specified and defined, it should be noted that the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the communication inside two elements. It can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0028] It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other.

[0029] In the description of this disclosure, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0030] As Figure 1 shown, it is a schematic diagram of an electroplating solution reflux system. The system includes a process chamber 10, a reflux pipeline 20, and a liquid storage tank 30. The reflux pipeline 20 communicates the process chamber 10 and the liquid storage tank 30. Specifically, in one embodiment, the process chamber 10 is located above the liquid storage tank 30. The upper end of the reflux pipeline 20 is connected to the process chamber 10, and the lower end of the reflux pipeline 20 is connected to the liquid storage tank 30. It should be understood that in the wafer manufacturing process, multi-chamber electroplating equipment is usually adopted to improve production capacity, Figure 1 and only one electroplating process chamber 10 in the electroplating equipment is shown. The process chamber 10 includes a reaction tank 110 and an overflow tank 120 located outside the reaction tank 110. The electroplating solution 130 is supplied from the liquid storage tank 30 to the reaction tank 110, and then overflows from the reaction tank 110 to the overflow tank 120. A reflux port is provided at the bottom of the overflow tank 120 so that the electroplating solution 130 can flow back to the liquid storage tank 30 from the reflux port and through the reflux pipeline 20.

[0031] To provide a certain buffering effect on the electroplating solution 130 in the reflux pipeline 20, a liquid collecting funnel 200 is usually arranged on the reflux pipeline 20. That is, the reflux pipeline 20 includes a liquid collecting funnel 200 and a pipeline main body 201. The liquid collecting funnel 200 includes a liquid collecting pipe 2001 at its top and a liquid discharge port on its side wall or bottom. The liquid collecting pipe 2001 is communicated with the reflux port of the overflow tank 120, and the liquid discharge port is communicated with the upper end of the pipeline main body 201. The electroplating solution 130 in the overflow tank 120 first flows into the liquid collecting funnel 200 from the reflux port, and then flows through the pipeline main body 201 by the liquid collecting funnel 200 to the storage tank 30. Since the overflow tank 120 is an open tank, therefore, as Figure 1 shown, when the electroplating solution 130 in the overflow tank 120 is too little, air 40 will be mixed in, forming a large number of bubbles. The bubbles will enter the storage tank 30 along the reflux pipeline 20 and enter the process chamber 10 with the electroplating solution circulation, affecting the stability of the electroplating solution 130, and further affecting the process efficiency and process stability.

[0032] Through repeated research and experiments, the inventor found that in the electroplating process, there is a connection between the bubble control in the reflux pipeline 20 and the image information of the overflow tank 120 obtained from above the overflow tank 120. Therefore, an electroplating solution reflux control system and a control method are provided. By obtaining and analyzing the image information of the overflow tank 120, the opening degree of the reflux control valve 23 on the reflux pipeline 20 is adjusted to reduce or even eliminate the bubbles generated during the electroplating solution reflux process, thereby improving the efficiency and process stability of the electroplating process.

[0033] Embodiment 1

[0034] One aspect of the present invention provides an electroplating solution reflux control system. Refer to Figure 2 , which shows a schematic diagram of the electroplating solution reflux control system in Embodiment 1 of the present invention. The electroplating solution reflux control system includes a process chamber 1, a storage tank 3, a reflux pipeline 2, a reflux control valve 23, an image acquisition device 5 and a control device 6. The process chamber 1 includes a reaction tank 11 and an overflow tank 12. The overflow tank 12 is arranged outside the reaction tank 11 and is used to receive the electroplating solution 13 overflowing from the reaction tank 11. A reflux port 122 is provided at the bottom of the overflow tank 12. The reflux pipeline 2 is used to connect the reflux port 122 and the storage tank 3 to reflux the electroplating solution 13 in the overflow tank 12 to the storage tank 3. The reflux control valve 23 is arranged on the reflux pipeline 2. The image acquisition device 5 is arranged above the reflux port 122 and is used to obtain the image information of the reflux port 122 area in real time, that is, obtain the real-time image information of the reflux port 122 area and send the real-time image information to the control device 6; the control device 6 is used to compare the real-time image information with the pre-stored reference image information and adjust the opening degree of the reflux control valve 23 according to the comparison result, so as to adjust the flow rate of the electroplating solution 13 in the reflux pipeline 2.

[0035] It should be understood that in this embodiment, the image acquisition device 5 acquires real-time image information of the reflux port 122 area. In other embodiments of the present invention, the image acquisition device 5 can also periodically acquire image information of the reflux port 122 area. For example, it acquires image information of the reflux port 122 area once every 1 second or every 2 seconds, etc.

[0036] Refer to Figure 3 , which shows a schematic diagram of the process chamber in the first embodiment of the present invention. An installation hole 15 is provided in the area of the process chamber 1 corresponding to the reflux port 122, and the image acquisition device 5 is installed in the installation hole 15 to acquire real-time image information of the reflux port 122 area. Exemplarily, the image acquisition device 5 can be a device that can acquire images, such as a camera or a camera.

[0037] Since in the electroplating process, the process chamber 1 usually also needs to be used as a cleaning chamber after electroplating, therefore, as Figure 3 shown, a water receiving edge 14 is provided above the reaction tank 11. The water receiving edge 14 surrounds the inner wall of the process chamber 1 and extends along an inclined upward direction from the inner wall of the process chamber 1. When the process chamber 1 is used as a cleaning chamber after electroplating, the cleaning liquid can be discharged from the process chamber 1 along the water receiving edge 14.

[0038] Since the water receiving edge 14 is between the image acquisition device 5 and the reflux port 122, the water receiving edge 14 is configured to be transparent to avoid affecting the image acquisition device 5 from acquiring real-time image information of the reflux port 122 area.

[0039] In this embodiment, the control device 6 pre-stores reference image information, and the reference image information includes the first form, the second form, and the third form of the electroplating solution 13 in the reflux port 122 area.

[0040] During the electroplating process, the image acquisition device 5 acquires real-time image information of the electroplating solution 13 in the reflux port 122 area and sends it to the control device 6. The control device 6 compares the real-time image information with the first form, the second form, and the third form respectively, and adjusts the opening degree of the reflux control valve 23 according to the corresponding relationship shown in Table 1. Exemplarily, the reflux control valve 23 can be an automatic ball valve.

[0041] Table 1

[0042] Comparison result Conforms to the first form Conforms to the second form Conforms to the third form Return control valve operates Maintain the current opening degree Increase the opening degree Decrease the opening degree

[0043] If the comparison result shows that the real-time image information of the electroplating solution 13 in the reflux port 122 area conforms to the first form, the current opening degree of the reflux control valve 23 is maintained; if the comparison result shows that the real-time image information of the electroplating solution 13 in the reflux port 122 area conforms to the second form, the opening degree of the reflux control valve 23 is increased; if the comparison result shows that the real-time image information of the electroplating solution 13 in the reflux port 122 area conforms to the third form, the opening degree of the reflux control valve 23 is decreased.

[0044] The inventor found through research and experiments that during the electroplating process, compared with Figure 1 the electroplating solution reflux system shown, if the opening degree of the reflux control valve 23 is adjusted to keep the electroplating solution 13 in the reflux port 122 area in a swirling state, that is, the area above the reflux port 122 is covered by the electroplating solution 13 and the electroplating solution 13 presents a swirling form, then no large bubbles or even no bubbles will appear in the reflux pipeline 2.

[0045] In addition, only when the volume of the electroplating solution 13 in the overflow tank 12 is within a certain range, will the electroplating solution 13 in the reflux port 122 area be in a swirling state, that is, when the electroplating solution 13 in the overflow tank 12 is too much or too little, the electroplating solution 13 in the reflux port 122 area will not be in a swirling state. When the electroplating solution 13 in the overflow tank 12 is too little and the electroplating solution 13 in the reflux port 122 area does not show a swirling state, the electroplating solution 13 flows into the reflux pipeline 2 along the periphery of the reflux port 122, the reflux port 122 is largely exposed to the air, and air enters the reflux pipeline 2 from the overflow tank 12, forming a large number of bubbles in the reflux pipeline 2; when the electroplating solution 13 in the overflow tank 12 is too much and the electroplating solution 13 in the reflux port 122 area does not show a swirling state, although air cannot enter the reflux pipeline 2 from the overflow tank 12, it may cause the electroplating solution 13 in the overflow tank 12 to not flow into the storage tank 3 from the reflux pipeline 2 in time, but as Figure 2 shown by the dotted arrow in, it directly overflows from the top of the overflow tank 12, posing a safety hazard.

[0046] It should be noted that "no swirling state" refers to the state where the electroplating solution 13 in the reflux port 122 area does not present a swirling form or the swirling form is not obvious due to the smooth reflux of the electroplating solution 13.

[0047] Therefore, in this embodiment, the first form includes the form in which the electroplating solution 13 in the reflux port 122 area shows a swirling state; the second form includes the form in which no swirling state occurs in the reflux port 122 area due to the excessive electroplating solution 13 in the overflow tank 12; the third form includes the form in which no swirling state occurs in the reflux port 122 area due to the insufficient electroplating solution 13 in the overflow tank 12.

[0048] Specifically, before performing the electroplating process, the operator can simulate the electroplating process according to the steps of the electroplating process, so that the control device 6 pre-stores the reference image information.

[0049] The following gives an exemplary step for the control device 6 to pre-store the reference image information.

[0050] First, adjust the opening degree of the reflux control valve 23 to 100%, so that the electroplating solution 13 circulates in the electroplating solution reflux control system.

[0051] Then, reduce the opening degree of the reflux control valve 23, so that the electroplating solution 13 in the overflow tank 12 gradually accumulates. When a vortex appears in the area of the reflux port 122, the image acquisition device 5 acquires the first image information and sends the first image information to the control device 6, and the control device 6 stores the first image information as the first form.

[0052] Let the electroplating solution 13 in the overflow tank 12 continue to accumulate until there is no vortex in the area of the reflux port 122. The image acquisition device 5 acquires the second image information and sends the second image information to the control device 6, and the control device 6 stores the second image information as the second form.

[0053] Increase the opening degree of the reflux control valve 23, so that the electroplating solution 13 in the overflow tank 12 gradually decreases until there is no vortex in the area of the reflux port 122 again. The image acquisition device 5 acquires the third image information and sends the third image information to the control device 6, and the control device 6 stores the third image information as the third form.

[0054] During the electroplating process, the image acquisition device 5 acquires the real-time image information of the area of the reflux port 122, sends the real-time image information to the control device 6, and the control device 6 compares the real-time image information with the pre-stored first, second, and third forms respectively, and then controls the loop control valve 23 to perform corresponding actions according to the corresponding relationship in Table 1, so that the electroplating solution 13 in the area of the reflux port 122 always has a vortex, thereby reducing or even eliminating the generation of bubbles during the electroplating solution reflux process of the electroplating process, and thus improving the efficiency and process stability of the electroplating process.

[0055] It should be understood that in this embodiment, the control device 6 can be a computer, and can analyze the first, second, and third image information sent by the image acquisition device 5 through computer algorithms, for example, analyze through a binary image algorithm, obtain the characteristic values of the first, second, and third image information, and respectively store the first, second, and third forms correspondingly.

[0056] Similarly, the control device 6 can analyze the real-time image information sent by the image acquisition device 5 in the same way, obtain the eigenvalue of the real-time image information, compare the eigenvalue of the real-time image information with the eigenvalues of the first, second, and third image information respectively, and set a similarity threshold. Exemplarily, the similarity threshold is set to 90%. If the eigenvalue of the real-time image information is greater than or equal to 90% similar to one of the eigenvalues of the first, second, and third image information, for example, the first image information, it can be determined that the real-time image information conforms to the first form. It should be understood that those skilled in the art can reasonably set the similarity threshold according to the actual situation.

[0057] Optionally, since the second and third forms are both forms without vortices, in order to avoid misjudgment by the control device 6 during comparison, as Figure 3 shown, in this embodiment, the electroplating solution reflux control system further includes a reference color layer 16, and the reference color layer 16 is provided on the bottom wall inside the overflow tank 12. Exemplarily, the color reference layer 16 can be a red coating. When the volume of the electroplating solution 13 in the overflow tank 12 is different, the images obtained from above the reflux port 122 area will show more obvious color depth differences, which can improve the accuracy of comparison.

[0058] Optionally, to improve the accuracy of comparison, in other implementation manners of this embodiment, the first, second, and third forms can also respectively correspond to multiple image information. Taking the first form as an example, when a vortex appears in the reflux port 122 area, the image acquisition device 5 acquires multiple first image information and sends the multiple first image information to the control device 6. The control device 6 analyzes the multiple first image information to obtain multiple first image information eigenvalues, and stores all the multiple first image information eigenvalues corresponding to the first form.

[0059] It should be understood that the above image information comparison method is only exemplary. In other implementation manners of this embodiment, other known computer algorithms or other methods can also be used for image information comparison.

[0060] Optionally, to avoid possible safety risks, that is, the electroplating solution 13 in the overflow tank 12 is too much and overflows from the top of the side wall of the overflow tank 12 into the process chamber 1, and to increase the reliability and safety of the electroplating solution reflux control system, as Figure 2 shown, in this embodiment, it further includes an overflow pipeline 4. An overflow port 124 is provided in a predetermined height area on the side wall of the overflow tank 12, and the overflow pipeline 4 is used to connect the overflow port 124 and the liquid storage tank 3. When the electroplating solution 13 in the overflow tank 12 is too much and cannot flow into the liquid storage tank 3 through the reflux pipeline 2 in time, it can flow into the liquid storage tank 3 through the overflow port 124.

[0061] Optionally, at least for the purpose of buffering the electroplating solution 13 in the return pipeline 2 to a certain extent, as Figure 2 shown, the return pipeline 2 includes a liquid collecting funnel 21 and a pipeline main body 22. The liquid collecting funnel 21 includes a liquid collecting pipe 211 located at its top and a liquid discharging port located at its side wall or bottom. The liquid collecting pipe 211 is communicated with the return port 122, and the liquid discharging port is communicated with the upper end of the pipeline main body 22. In the electroplating equipment with multiple process chambers 1, each liquid collecting funnel 21 can have two liquid collecting pipes 211. At this time, the liquid collecting funnel 21 communicates with two process chambers 1 and becomes a common return area in the return systems of the two process chambers 1. It should be understood that in the initial state of the electroplating process, not only the opening degree of the return control valve 23 needs to be adjusted so that the electroplating solution 13 in the area of the return port 122 shows a vortex, but also the liquid collecting funnel 21 needs to be filled with the electroplating solution 13 to avoid air in the liquid collecting funnel 21 during the electroplating process.

[0062] In this embodiment, when the electroplating solution return control system works normally, the system will automatically adjust the opening degree of the return control valve 23 so that the electroplating solution 13 in the area of the return port 122 always shows a vortex, thereby reducing or even eliminating the generation of bubbles during the electroplating solution return process of the electroplating process, and thus improving the efficiency and process stability of the electroplating process.

[0063] Embodiment 2

[0064] Compared with Embodiment 1, the main difference in this embodiment is that the reference image information corresponding to the first, second, and third forms in this embodiment is different from that in Embodiment 1.

[0065] The inventor further studied and experimented and found that during the electroplating solution return process, when the electroplating solution 13 in the area of the return port 122 shows a vortex, different vortex forms also correspond to different bubble control results in the return pipeline 2. When there are no bubbles in the return pipeline 2, the vortex form of the electroplating solution 13 in the area of the return port 122 shows certain characteristics.

[0066] Exemplarily, the differences among the first vortex form, the second vortex form, and the third vortex form can be characterized by the size of the vortex. Since the vortex is roughly circular, the size of the vortex can be characterized by the diameter of the vortex. During the process of the volume of the electroplating solution 13 in the overflow tank 12 decreasing from more to less, the size of the vortex also shows a change from small to large, that is, from the perspective of the size of the vortex, the third vortex form > the first vortex form > the second vortex form.

[0067] Therefore, in order to more effectively reduce or even eliminate the bubbles in the reflux pipeline 2 during the electroplating solution reflux process of the electroplating process, in this embodiment, the first form includes the first vortex form of the electroplating solution 13 in the reflux port 122 area when there are no bubbles in the reflux pipeline 2; the second form includes the second vortex form of the electroplating solution 13 in the reflux port 122 area when the electroplating solution 13 in the overflow tank 12 is more than the electroplating solution 13 corresponding to the first vortex form; the third form includes the third vortex form of the electroplating solution 13 in the reflux port 122 area when the electroplating solution 13 in the overflow tank 12 is less than the electroplating solution 13 corresponding to the first vortex form.

[0068] Specifically, before the electroplating process, the operator can perform a simulated electroplating process according to the steps of the electroplating process, so that the control device 6 pre-stores the reference image information.

[0069] The following gives an exemplary step for the control device 6 to pre-store the reference image information.

[0070] First, adjust the opening degree of the reflux control valve 23 to 100%, and let the electroplating solution 13 circulate in the electroplating solution reflux control system. Then gradually reduce the opening degree of the reflux pipeline 2, so that the electroplating solution 13 in the overflow tank 12 gradually accumulates. When a vortex appears in the reflux port 122 area and there are no bubbles in the reflux pipeline 2, the image acquisition device 5 acquires the first vortex form and sends the first vortex form to the control device 6, and the control device 6 stores the first vortex form as the first form. Among them, a bubble detection device can be used to judge whether there are bubbles in the reflux pipeline 2. The specific details will be described later.

[0071] Let the electroplating solution 13 in the overflow tank 12 continue to accumulate until the electroplating solution 13 in the reflux port 122 area presents a vortex form different from the first vortex form. The image acquisition device 5 acquires the second vortex form and sends the second vortex form to the control device 6, and the control device 6 stores the second vortex form as the second form.

[0072] Increase the opening degree of the reflux control valve 23, so that the electroplating solution 13 in the overflow tank 12 gradually decreases. After the electroplating solution 13 in the reflux port 122 area presents the first vortex form again, let the electroplating solution 13 in the overflow tank 12 continue to decrease until the electroplating solution 13 in the reflux port 122 area presents a vortex form different from the first vortex form and the second vortex form. The image acquisition device 5 acquires the third vortex form and sends the third vortex form to the control device 6, and the control device 6 stores the third vortex form as the third form.

[0073] During the electroplating process, the image acquisition device 5 acquires the real-time image information of the reflux port 122 area, sends the real-time image information to the control device 6, and the control device 6 compares the real-time image information with the first, second, and third forms stored in advance respectively, and then controls the reflux control valve 23 to perform corresponding actions according to the corresponding relationship in Table 1.

[0074] See Figure 5 , which shows a schematic diagram of the corresponding relationship between the volumes of different electroplating solutions 13 in the overflow tank 12 and the forms of the electroplating solution 13 in the reflux port 122 area. Among them, A represents the first vortex form in Embodiment 2, A2 represents the second vortex form in Embodiment 2, A3 represents the third vortex form in Embodiment 2, and B2 represents that no vortex appears in the reflux port 122 area due to excessive electroplating solution 13 in the overflow tank 12, corresponding to the second form in Embodiment 1; B3 represents that no vortex appears in the reflux port 122 area due to too little electroplating solution 13 in the overflow tank 12, corresponding to the third form in Embodiment 1.

[0075] As Figure 5 shown, compared with Embodiment 1, in this embodiment, the opening adjustment of the reflux pipeline 2 is more accurate and sensitive.

[0076] In Embodiment 1, when the electroplating solution reflux control system is working properly, the system will automatically adjust the opening of the reflux pipeline 2 to make the volume of the electroplating solution 13 in the overflow tank 12 between B3 and B2, so that the electroplating solution 13 in the reflux port 122 area always has a vortex. In Embodiment 2, when the electroplating solution reflux control system is working properly, at the initial state of the electroplating process, the opening of the reflux pipeline 2 is adjusted so that the electroplating solution 13 in the reflux port 122 area has a vortex until the vortex form in this area conforms to the first vortex form. Then as long as the vortex form in this area changes and deviates from the first vortex form, the control device 6 will adjust the opening of the reflux control valve 23 to make the volume of the electroplating solution 13 in the overflow tank 12 between A3 and A2 until the first vortex form appears. This can not only make the electroplating solution 13 in the reflux port 122 area always have a vortex, but also the vortex form that appears fluctuates between the second vortex form and the third vortex form and is maintained at the first vortex form as much as possible.

[0077] Optionally, in another implementation manner of this embodiment, the image information corresponding to the second and third forms can be further expanded.

[0078] Specifically, taking the second form as an example, in addition to corresponding to the second vortex form, the second image information in the area of the return port 122 where no vortex appears due to excessive electroplating solution 13 in the overflow tank 12 can also be stored as the second form in this embodiment. That is, the second form also includes the form where no vortex appears in the area of the return port 122 due to excessive electroplating solution 13 in the overflow tank 12. Similarly, in addition to corresponding to the third vortex form, the third image information in the area of the return port 122 where no vortex appears due to too little electroplating solution 13 in the overflow tank 12 can also be stored as the third form in this embodiment. That is, the third form also includes the form where no vortex appears in the area of the return port 122 due to too little electroplating solution 13 in the overflow tank 12. In this way, when the electroplating solution return control system is working properly, at the initial state of the electroplating process, the electroplating solution 13 in the area of the return port 122 always forms a vortex, and the opening degree of the return control valve 23 can be automatically adjusted until the first vortex form appears.

[0079] Optionally, as Figure 4 shown, in this embodiment, a bubble detection device 24 is further included. The bubble detection device 24 is arranged between the return port 122 and the return control valve 23, and is used to detect whether there are bubbles in the electroplating solution 13 flowing through the bubble detection device 24, and feed back the detection result to the control device 6. The control device 6 is further used for: when there is no vortex in the electroplating solution 13 in the area of the return port 122 and the detection result is no bubbles, increasing the opening degree of the return control valve 23; when there is no vortex in the electroplating solution 13 in the area of the return port 122 and the detection result is there are bubbles, decreasing the opening degree of the return control valve 23. In this way, even at the initial state of the electroplating process, the system can automatically adjust the opening degree of the return control valve 23 to make the electroplating solution 13 in the area of the return port 122 always form a vortex, and can automatically adjust the opening degree of the return control valve 23 until the first vortex form appears.

[0080] It should be understood that the bubble detection device 24 can also be used for bubble detection when storing reference information. For example, in the step of storing the first vortex form described above.

[0081] Optionally, in other implementation manners of this embodiment, in order to improve the accuracy of comparison, the first, second, and third forms can also respectively correspond to multiple vortex forms. Taking the first form as an example, in the case where there are no bubbles in the return pipeline 2, the image acquisition device 5 acquires multiple first vortex forms and sends the multiple first vortex forms to the control device 6, and the control device 6 stores the multiple first vortex forms as the first form. For example, the control device 6 analyzes the multiple first vortex forms to obtain multiple first vortex form characteristic values, and stores the multiple first vortex form characteristic values as the first form correspondingly.

[0082] In this embodiment, when the electroplating solution reflux control system is working properly, the system will automatically adjust the opening degree of the reflux control valve 23 so that the electroplating solution 13 in the area of the reflux port 122 always forms a vortex, and can automatically adjust the opening degree of the reflux control valve 23 until the first vortex form appears, thereby more effectively reducing or even eliminating the generation of bubbles during the reflux process of the electroplating solution in the electroplating process, and thus improving the efficiency and process stability of the electroplating process.

[0083] Embodiment Three

[0084] Compared with Embodiment One and Embodiment Two, the main difference in this embodiment is that the image information obtained by the image acquisition device 5 in this embodiment is different from the reference image information stored in Embodiment One and Embodiment Two.

[0085] The inventor further studied and experimented and found that during the reflux process of the electroplating solution in the electroplating process, in addition to the different forms of the electroplating solution 13 in the area of the reflux port 122 corresponding to different bubble control results in the reflux pipeline 2, there is also a corresponding relationship between the color information in the image information in the overflow tank 12 and the bubble control results in the reflux pipeline 2.

[0086] Therefore, in this embodiment, the color depth information in the image information in the overflow tank 12 is used as the reference image information. The image acquisition device 5 is arranged above the overflow tank 12 and is used to acquire the image information in the overflow tank 12 and send the acquired image information to the control device 6, instead of corresponding the position of the image acquisition device 5 to the reflux port 122 as in Embodiment One and Embodiment Two.

[0087] The electroplating solution 13 contains metal cations and various additives and is usually a colored transparent liquid. In the overflow tank 12, for different volumes of the electroplating solution 13, there are differences in the presented color depth. Moreover, the larger the volume of the electroplating solution in the overflow tank 12, the deeper the color presented. Therefore, a corresponding relationship between the volume of the electroplating solution 13 in the overflow tank 12 and the color depth can be established, and the opening degree of the reflux control valve 23 can be adjusted in real time or periodically according to this corresponding relationship so that the volume of the electroplating solution 13 in the overflow tank 12 is maintained within a relatively stable range, maintaining a good liquid sealing effect on the overflow tank 12, thereby reducing or even eliminating the generation of bubbles during the reflux process of the electroplating solution in the electroplating process, and thus improving the efficiency and process stability of the electroplating process.

[0088] In this embodiment, the control device 6 is used to: compare the acquired image information in the overflow tank 12 with the pre-stored color depth information. The color depth information includes the first color depth. The corresponding relationship between the comparison result and the actions executed by the reflux control valve 23 is shown in Table 2:

[0089] Table 2

[0090]

[0091] If the comparison result shows that the image information in the overflow tank 12 conforms to the first color depth, the current opening degree of the reflux control valve 23 is maintained; if the comparison result shows that the color depth in the image information in the overflow tank 12 is greater than the first color depth, the opening degree of the reflux control valve 23 is increased; if the comparison result shows that the color depth in the image information in the overflow tank 12 is less than the first color depth, the opening degree of the reflux control valve 23 is decreased.

[0092] Specifically, before the electroplating process, the operator can perform a simulated electroplating process according to the steps of the electroplating process, so that the control device 6 pre-stores the color depth information.

[0093] The following gives an exemplary step for the control device 6 to pre-store the reference image information in this embodiment.

[0094] First, adjust the opening degree of the reflux control valve 23 to 100%, and let the electroplating solution 13 circulate in the electroplating solution reflux control system. Then gradually reduce the opening degree of the reflux control valve 23, so that the electroplating solution 13 in the overflow tank 12 gradually accumulates until it reaches the preset electroplating solution volume, for example, 5L. When the volume of the electroplating solution 13 in the overflow tank 12 reaches this preset electroplating solution volume, the electroplating solution 13 can play a good liquid sealing role for the overflow tank 12 and prevent air from mixing into the reflux pipeline 2 to form bubbles. The image acquisition device 5 acquires the image information corresponding to the preset electroplating solution volume and sends it to the control device 6. The control device 6 analyzes this image information, obtains the color depth characteristic value of this image information, and stores this color depth characteristic value as the first color depth.

[0095] For example, it can be that the control device 6 (such as a computer) analyzes the image information through a computer algorithm to obtain the gray value corresponding to the image information. The smaller the gray value, the darker the color of the image at this time. Exemplarily, the computer correspondingly stores the gray value of the image when the volume of the electroplating solution 13 in the overflow tank 12 reaches the preset electroplating solution volume as the first color depth. In this way, when the process chamber 1 executes the process, the control device 6 analyzes the image information obtained from the image acquisition device 5, obtains the corresponding gray value, compares this gray value with the gray value corresponding to the first color depth, and then controls the reflux control valve 23 to perform corresponding actions according to the corresponding relationship in Table 2.

[0096] It should be understood that in this embodiment, the preset electroplating solution volume should satisfy the condition that it can liquid-seal the overflow tank 12 and ensure that the electroplating solution 13 does not exceed the upper limit height of the overflow tank 12. The upper limit height is preset manually or set automatically by the system, which refers to the limit height that may cause the electroplating solution 13 to overflow from the top of the overflow tank 12 into the process chamber 1, or in a system with an overflow pipeline 4, the height of the overflow port 124.

[0097] Optionally, in order to improve the accuracy and fault tolerance of comparison, in other implementation manners of this embodiment, a preset electroplating solution volume range can be set, for example, 5L - 7L. When the electroplating solution 13 is within the preset electroplating solution volume range, it can play a good liquid sealing role for the overflow tank 12 and prevent air from mixing into the return pipeline 2 to form bubbles. The image acquisition device 5 acquires a plurality of image information corresponding to within the preset electroplating solution volume range, for example, acquires image information once every 100 milliliters (ml), and sends it to the control device 6. The control device 6 analyzes the plurality of image information to obtain the color depth feature values of the plurality of image information, and stores the plurality of color depth feature values as the first color depth.

[0098] During the electroplating process, the image acquisition device 5 acquires the real-time image information in the overflow tank 12, sends the real-time image information to the control device 6. The control device 6 compares the color depth feature value of the real-time image information with the first color depth stored in advance, and then controls the return control valve 23 to perform corresponding actions according to the corresponding relationship in Table 2, automatically adjusts the opening degree of the return control valve 23, and further automatically adjusts the volume of the electroplating solution 13 in the overflow tank 12 to keep it within the preset electroplating solution volume (or electroplating solution volume range) or fluctuate around the preset electroplating solution volume (or electroplating solution volume range), maintaining a good liquid sealing effect on the overflow tank 12, thereby reducing or even eliminating the bubbles generated during the electroplating solution return process of the electroplating process, and thus improving the efficiency and process stability of the electroplating process.

[0099] Optionally, in this embodiment, a reference color device is further included. The reference color device is used to provide a reference color for the image information of the overflow tank acquired by the image acquisition device. Exemplarily, as Figure 3 shown, the reference color device includes a reference color layer 16, and the reference color layer 16 is arranged on the bottom wall inside the overflow tank 12. In this way, the color depth difference presented by the electroplating solution 13 at different electroplating solution volumes can be increased, and even if the color of the electroplating solution 13 itself is relatively light, relatively accurate color depth feature values can be extracted.

[0100] Embodiment 4

[0101] This embodiment provides an electroplating solution return control method, which is applied to the electroplating solution return control system in Embodiment 1, and includes the following steps:

[0102] S1. The process chamber 1 starts to execute the process. The electroplating solution 13 overflows from the reaction tank 11 to the overflow tank 12, and then flows into the storage tank 3 through the return pipeline 2;

[0103] S2. The image acquisition device 5 acquires the image information of the return port 122 area and sends the image information to the control device 6;

[0104] S3. The control device 6 compares the image information with the pre-stored reference image information;

[0105] S4. The control device 6 adjusts the opening degree of the reflux control valve 23 according to the comparison result.

[0106] Furthermore, in this embodiment, the reference image information includes the first form, the second form, and the third form of the electroplating solution in the reflux port 122 area.

[0107] Step S3 includes: The control device 6 compares the image information with the first form, the second form, and the third form respectively.

[0108] Step S4 includes:

[0109] S41. If the control device 6 determines that the image information conforms to the first form according to the comparison result, the current opening degree of the reflux control valve 23 is maintained;

[0110] S42. If the control device 6 determines that the image information conforms to the second form according to the comparison result, the opening degree of the reflux control valve 23 is increased;

[0111] S43. If the control device 6 determines that the image information conforms to the third form according to the comparison result, the opening degree of the reflux control valve 23 is decreased.

[0112] Optionally, before step S1, it further includes that the control device 6 pre-stores the reference image information. The exemplary steps for the control device 6 to pre-store the reference image information include:

[0113] S140. Adjust the opening degree of the reflux control valve 23 to 100%, and let the electroplating solution 13 circulate in the electroplating solution reflux control system;

[0114] S141. Decrease the opening degree of the reflux control valve 23, and let the electroplating solution 13 in the overflow tank 12 gradually accumulate. When a vortex appears in the reflux port 122 area, the image acquisition device 5 acquires the first image information and sends the first image information to the control device 6. The control device 6 stores the first image information as the first form;

[0115] S142. Let the electroplating solution 13 in the overflow tank 12 continue to accumulate until there is no vortex in the reflux port 122 area. The image acquisition device 5 acquires the second image information and sends the second image information to the control device 6. The control device 6 stores the second image information as the second form;

[0116] S143. Increase the opening degree of the reflux control valve 23, and let the electroplating solution 13 in the overflow tank 12 gradually decrease until there is no vortex in the reflux port 122 area again. The image acquisition device 5 acquires the third image information and sends the third image information to the control device 6. The control device 6 stores the third image information as the third form.

[0117] Optionally, in order to improve the accuracy of comparison, in other implementation manners of this embodiment, the first, second, and third forms may also respectively correspond to multiple pieces of image information. Taking the first form as an example, when a vortex appears in the reflux port 122 area, the image acquisition device 5 is controlled to acquire multiple pieces of first image information, the multiple pieces of first image information are analyzed to obtain multiple first image information feature values, and the multiple first image information feature values are all correspondingly stored as the first form.

[0118] Embodiment Five

[0119] This embodiment provides a method for controlling the reflux of electroplating solution, which is applied to the electroplating solution reflux control system in Embodiment Two. Compared with Embodiment Four, the main difference in this embodiment is that the reference image information corresponding to the first, second, and third forms in this embodiment is different from that in Embodiment Four. The same parts of this embodiment and Embodiment Four will not be described in detail here, and only the differences between this embodiment and Embodiment Four will be described below.

[0120] Optionally, in this embodiment, before step S1, the control device 6 further includes pre-storing reference image information. The exemplary steps for the control device 6 to pre-store reference image information include:

[0121] S150, adjust the opening degree of the reflux control valve 23 to 100%, and let the electroplating solution 13 circulate in the electroplating solution reflux control system;

[0122] S151, reduce the opening degree of the reflux control valve 23, and let the electroplating solution 13 in the overflow tank 12 gradually accumulate until a vortex appears in the reflux port 122 area and there are no bubbles in the reflux pipeline 2. At this time, the image acquisition device 5 acquires the first vortex form and sends the first vortex form to the control device 6, and the control device 6 stores the first vortex form as the first form;

[0123] S152, let the electroplating solution 13 in the overflow tank 12 continue to accumulate until the electroplating solution 13 in the reflux port 122 area presents a vortex form different from the first vortex form. At this time, the image acquisition device 5 acquires the second vortex form and sends the second vortex form to the control device 6, and the control device 6 stores the second vortex form as the second form;

[0124] S153, increase the opening degree of the reflux control valve 23, and let the electroplating solution 13 in the overflow tank 12 gradually decrease. After the electroplating solution 13 in the reflux port 122 area presents the first vortex form again, let the electroplating solution 13 in the overflow tank 12 continue to decrease until the electroplating solution 13 in the reflux port 122 area presents a vortex form different from the first vortex form and the second vortex form. At this time, the image acquisition device 5 acquires the third vortex form and sends the third vortex form to the control device 6, and the control device 6 stores the third vortex form as the third form.

[0125] Optionally, in another implementation manner of this embodiment, the image information corresponding to the second and third forms can be further expanded. The second form further includes the form in which no vortex appears in the reflux port 122 area due to excessive electroplating solution 13 in the overflow tank 12, that is, the second form can further include the second image information; the third form further includes the form in which no vortex appears in the reflux port 122 area due to too little electroplating solution in the overflow tank 12, that is, the third form can further include the third image information.

[0126] In this way, when the electroplating solution reflux control system is working properly, at the initial state of the electroplating process, the system can automatically adjust the opening degree of the reflux control valve 23 to make the electroplating solution 13 in the reflux port 122 area always form a vortex, and can automatically adjust the opening degree of the reflux control valve 23 until the first vortex form appears.

[0127] Optionally, in the method of this embodiment, after step 2, it further includes:

[0128] S21. If the control device 6 determines that the image information of the reflux port area shows a vortex, then step S3 is executed; if the control device 6 determines that the image information of the reflux port area shows no vortex, then step S22 is executed;

[0129] S22. Detect whether there are bubbles in the electroplating solution 13 in the reflux pipeline 2 between the reflux port and the reflux control valve 23, and the control device 6 obtains the detection information; if the detection information shows no bubbles, then the opening degree of the reflux control valve 23 is increased and step S21 is returned; if the detection result shows there are bubbles, then the opening degree of the reflux control valve 23 is decreased and step S21 is returned.

[0130] In this way, even at the initial state of the electroplating process, the system can automatically adjust the opening degree of the reflux pipeline 2 to make the electroplating solution 13 in the reflux port 122 area always form a vortex, and can automatically adjust the opening degree of the reflux control valve 23 until the first vortex form appears.

[0131] Optionally, in order to improve the accuracy of comparison, in other implementation manners of this embodiment, the first, second, and third forms can also respectively correspond to multiple pieces of image information. Taking the first form as an example, gradually reduce the opening degree of the reflux pipeline 2 to gradually accumulate the electroplating solution 13 in the overflow tank 12 until a vortex appears in the reflux port 122 area and there are no bubbles in the reflux pipeline 2, then control the image acquisition device 5 to acquire multiple first vortex forms, and the control device 6 stores the multiple first vortex forms as the first form. For example, the control device 6 analyzes the multiple first vortex forms to obtain multiple first vortex form characteristic values, and stores all the multiple first vortex form characteristic values as the first form.

[0132] Embodiment Six

[0133] This embodiment provides a method for controlling the reflux of electroplating solution, which is applied to the electroplating solution reflux control system in Embodiment 3. The main difference between this embodiment and Embodiments 4 and 5 is that the image information acquired by the image acquisition device 5 and the stored reference image information are different from those in Embodiments 4 and 5.

[0134] The method for controlling the reflux of electroplating solution in this embodiment includes:

[0135] S10. The process chamber 1 starts to execute the process. The electroplating solution 13 overflows from the reaction tank 11 to the overflow tank 12, and then flows into the liquid storage tank 3 through the reflux pipeline 2;

[0136] S20. The image acquisition device 5 acquires the image information in the overflow tank 12 and sends the image information to the control device 6;

[0137] S30. The control device 6 compares the image information with the pre-stored reference image information;

[0138] S40. The control device 6 adjusts the opening degree of the reflux control valve 23 according to the comparison result.

[0139] Further, in this embodiment, the reference image information includes the first color depth of the image information in the overflow tank 12;

[0140] Step S30 includes: The control device 6 compares the color depth of the image information with the first color depth.

[0141] Step S40 includes:

[0142] S401. If the comparison result is that the color depth of the image information conforms to the first color depth, the current opening degree of the reflux control valve 23 is maintained;

[0143] S402. If the comparison result is that the color depth of the image information is greater than the first color depth, the opening degree of the reflux control valve 23 is increased;

[0144] S403. If the comparison result is that the color depth of the image information is less than the first color depth, the opening degree of the reflux control valve 23 is decreased.

[0145] Optionally, before step S10, it further includes that the control device 6 pre-stores the reference image information. The exemplary steps for the control device 6 to pre-store the reference image information include:

[0146] S1060. Adjust the opening degree of the reflux control valve 23 to 100%, and let the electroplating solution 13 circulate in the electroplating solution reflux control system;

[0147] S1061. Decrease the opening degree of the reflux control valve 23 to let the electroplating solution 13 in the overflow tank 12 gradually accumulate;

[0148] S1062. When the volume of the electroplating solution 13 in the overflow tank 12 reaches the preset electroplating solution volume, the image acquisition device 5 acquires the image information corresponding to the preset electroplating solution volume and sends it to the control device 6. The control device 6 analyzes the image information, obtains the color depth characteristic value of the image information, and stores the color depth characteristic value as the first color depth.

[0149] Optionally, in order to improve the accuracy and fault tolerance of the comparison, in other implementation manners of this embodiment, step S1062 may also be: when the electroplating solution 13 in the overflow tank 12 reaches within the preset electroplating solution volume range, the image acquisition device 5 acquires multiple pieces of image information corresponding to within the preset electroplating solution volume range. For example, image information is acquired once for every 100 milliliters (ml), and is sent to the control device 6. The control device 6 analyzes the multiple pieces of image information, obtains the color depth characteristic values of the multiple pieces of image information, and stores the multiple color depth characteristic values as the first color depth.

[0150] The above embodiments merely illustrate the principles and effects of the present invention, rather than limiting the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. An electroplating solution reflux control system, characterized in that, Comprising: A process chamber, a liquid storage tank, a reflux pipeline, a reflux control valve, an image acquisition device, and a control device; wherein, The process chamber includes a reaction tank and an overflow tank, and the overflow tank is arranged around the reaction tank for receiving the electroplating solution overflowing from the reaction tank; A reflux port is provided at the bottom of the overflow tank, and the reflux pipeline is used to connect the reflux port and the liquid storage tank to reflux the electroplating solution in the overflow tank to the liquid storage tank; The reflux control valve is arranged on the reflux pipeline; The image acquisition device is arranged above the reflux port for acquiring image information of the reflux port area and sending the image information to the control device; The control device is used to compare the image information with pre-stored reference image information, and adjust the opening degree of the reflux control valve according to the comparison result, so as to adjust the flow rate of the reflux pipeline.

2. The electroplating solution reflux control system according to claim 1, wherein The reference image information includes the first form, the second form, and the third form of the electroplating solution in the reflux port area; The control device is used for: Comparing the image information with the first form, the second form, and the third form respectively, If the comparison result is that the image information conforms to the first form, maintaining the current opening degree of the reflux control valve; If the comparison result is that the image information conforms to the second form, increasing the opening degree of the reflux control valve; If the comparison result is that the image information conforms to the third form, decreasing the opening degree of the reflux control valve.

3. The electroplating solution reflux control system according to claim 2, wherein The first form includes the form in which a vortex appears in the electroplating solution in the reflux port area; The second form includes the form in which no vortex appears in the reflux port area due to excessive electroplating solution in the overflow tank; The third form includes the form in which no vortex appears in the reflux port area due to too little electroplating solution in the overflow tank.

4. The electroplating solution reflux control system according to claim 1, wherein It further includes a reference color device, The reference color device is used to provide a reference color for the image information of the reflux port area acquired by the image acquisition device.

5. The electroplating solution reflux control system according to claim 4, wherein The reference color device includes a reference color layer, The reference color layer is arranged on the bottom wall inside the overflow tank.

6. The electroplating solution reflux control system according to claim 2, wherein The first form includes the first vortex form of the electroplating solution in the reflux port area when a vortex appears in the electroplating solution in the reflux port area and there are no bubbles in the reflux pipeline; The second form includes the second vortex form of the electroplating solution in the reflux port area when the electroplating solution in the overflow tank is more than the electroplating solution corresponding to the first vortex form; The third form includes the third vortex form of the electroplating solution in the reflux port area when the electroplating solution in the overflow tank is less than the electroplating solution corresponding to the first vortex form.

7. The electroplating solution reflux control system according to claim 6, wherein The second form further includes a form in which no vortex appears in the reflux port area due to excessive electroplating solution in the overflow tank; and / or The third form further includes a form in which no vortex appears in the reflux port area due to insufficient electroplating solution in the overflow tank.

8. The electroplating solution reflux control system according to claim 6, wherein it further includes a bubble detection device; The bubble detection device is arranged between the reflux port and the reflux control valve, and is used to detect whether there are bubbles in the electroplating solution flowing through the bubble detection device, and feed back the detection result to the control device; The control device is further configured to: when there is no vortex in the electroplating solution in the reflux port area and the detection result is no bubbles, increase the opening degree of the reflux control valve; When there is no vortex in the electroplating solution in the reflux port area and the detection result is bubbles, decrease the opening degree of the reflux control valve.

9. The electroplating solution reflux control system according to claim 1, wherein The reflux pipeline includes a liquid collecting funnel and a pipeline main body. The liquid collecting funnel includes a liquid collecting pipe and a liquid discharging port. The liquid collecting pipe is communicated with the reflux port, and the liquid discharging port is communicated with the pipeline main body.

10. The electroplating solution reflux control system according to claim 1, wherein it further includes an overflow pipeline, An overflow port is arranged at a predetermined height on the side wall of the overflow tank, and the overflow pipeline is used to connect the overflow port and the liquid storage tank.

11. An electroplating solution reflux control system, characterized in that, It includes: A process chamber, a liquid storage tank, a reflux pipeline, a reflux control valve, an image acquisition device and a control device; wherein, The process chamber includes a reaction tank and an overflow tank. The overflow tank is arranged outside the reaction tank and is used to receive the electroplating solution overflowing from the reaction tank; A reflux port is arranged at the bottom of the overflow tank, and the reflux pipeline is used to connect the reflux port and the liquid storage tank to reflux the electroplating solution in the overflow tank to the liquid storage tank; The reflux control valve is arranged on the reflux pipeline; The image acquisition device is arranged above the overflow tank and is used to acquire the image information in the overflow tank and send the image information to the control device; The control device is used to compare the image information with the pre-stored reference image information and adjust the opening degree of the reflux control valve according to the comparison result.

12. The electroplating solution reflux control system according to claim 11, wherein The reference image information includes the first color depth in the overflow tank; The control device is used to: If the comparison result is that the color depth of the image information conforms to the first color depth, keep the current opening degree of the reflux control valve; If the comparison result is that the color depth of the image information is greater than the first color depth, increase the opening degree of the reflux control valve; If the comparison result is that the color depth of the image information is less than the first color depth, decrease the opening degree of the reflux control valve.

13. The electroplating solution reflux control system according to claim 11, wherein it further includes a reference color device, The reference color device is used to provide a reference color for the image information in the overflow tank acquired by the image acquisition device.

14. The electroplating solution reflux control system according to claim 13, wherein the reference color device includes a reference color layer, and the reference color layer is disposed on the bottom wall inside the overflow tank.

15. A method for controlling the reflux of electroplating solution, characterized in that, Comprising: S1. The process chamber starts to execute a process. The electroplating solution overflows from the reaction tank to the overflow tank, and then flows into the liquid storage tank through the reflux pipeline; S2. The image acquisition device acquires image information of the reflux port area and sends the image information to the control device; S3. The control device compares the image information with pre-stored reference image information; S4. The control device adjusts the opening degree of the reflux control valve according to the result of the comparison.

16. The electroplating solution reflux control method according to claim 15, wherein the reference image information includes the first form, the second form, and the third form of the electroplating solution in the reflux port area; The step S3 includes: The control device compares the image information with the first form, the second form, and the third form respectively; The step S4 includes: S41. If the control device concludes from the result of the comparison that the image information conforms to the first form, the current opening degree of the reflux control valve is maintained; S42. If the control device concludes from the result of the comparison that the image information conforms to the second form, the opening degree of the reflux control valve is increased; S43. If the control device concludes from the result of the comparison that the image information conforms to the third form, the opening degree of the reflux control valve is decreased.

17. The electroplating solution reflux control method according to claim 16, wherein before the step S1, the control device pre-stores the reference image information, including: S140. Adjust the opening degree of the reflux control valve to 100%, and let the electroplating solution circulate in the electroplating solution reflux control system; S141. Decrease the opening degree of the reflux control valve, and let the electroplating solution in the overflow tank gradually accumulate. When a vortex appears in the reflux port area, the image acquisition device acquires first image information and sends the first image information to the control device, and the control device stores the first image information as the first form; S142. Let the electroplating solution in the overflow tank continue to accumulate until there is no vortex in the reflux port area. The image acquisition device acquires second image information and sends the second image information to the control device, and the control device stores the second image information as the second form; S143. Increase the opening degree of the reflux control valve, and let the electroplating solution in the overflow tank gradually decrease until there is no vortex in the reflux port area again. The image acquisition device acquires third image information and sends the third image information to the control device, and the control device stores the third image information as the third form.

18. The electroplating solution reflux control method according to claim 16, wherein before the step S1, the control device pre-stores the reference image information, including: S150. Adjust the opening degree of the reflux control valve to 100%, and let the electroplating solution circulate in the electroplating solution reflux control system; S151. Reduce the opening degree of the reflux control valve, so that the electroplating solution in the overflow tank gradually accumulates. When a vortex appears in the reflux port area and there are no bubbles in the reflux pipeline, the image acquisition device acquires the first vortex form and sends the first vortex form to the control device, and the control device stores the first vortex form as the first form; S152. Let the electroplating solution in the overflow tank continue to accumulate. When the electroplating solution in the reflux port area shows a second vortex form different from the first vortex form, the image acquisition device acquires the second vortex form and sends the second vortex form to the control device, and the control device stores the second vortex form as the second form; S153. Increase the opening degree of the reflux control valve, so that the electroplating solution in the overflow tank gradually decreases. After the electroplating solution in the reflux port area shows the first vortex form again, let the electroplating solution in the overflow tank continue to decrease. When the electroplating solution in the reflux port area shows a third vortex form different from the first vortex form and the second vortex form, the image acquisition device acquires the third vortex form and sends the third vortex form to the control device, and the control device stores the third vortex form as the third form.

19. The electroplating solution reflux control method according to claim 18, characterized in that, After the step S152, it further includes: S1521. Let the electroplating solution in the overflow tank continue to accumulate until there is no vortex in the reflux port area. The image acquisition device acquires the second image information and sends the second image information to the control device, and the control device also stores the second image information as the second form; and / or After the step S153, it further includes: S1531. Let the electroplating solution in the overflow tank continue to decrease until there is no vortex in the reflux port area again. The image acquisition device acquires the third image information and sends the third image information to the control device, and the control device also stores the third image information as the third form.

20. The electroplating solution reflux control method according to claim 19, characterized in that, After the step 2, it further includes: S21. If the control device determines that the image information in the reflux port area shows a vortex, execute step S3; if the control device determines that the image information in the reflux port area does not show a vortex, execute step S22; S22. Detect whether there are bubbles in the electroplating solution in the reflux pipeline between the reflux port and the reflux control valve, and the control device acquires the detection information; If the detection information is no bubbles, increase the opening degree of the reflux control valve and return to step S21; If the detection result is bubbles, reduce the opening degree of the reflux control valve and return to step S21.

21. A method for controlling the reflux of electroplating solution, characterized in that, It includes: S10. The process chamber starts to execute the process. The electroplating solution overflows from the reaction tank to the overflow tank, and then flows into the liquid storage tank through the reflux pipeline; S20. The image acquisition device acquires the image information in the overflow tank and sends the image information to the control device; S30. The control device compares the image information with the pre-stored reference image information; S40. The control device adjusts the opening degree of the reflux control valve according to the result of the comparison.

22. The electroplating solution reflux control method according to claim 21, wherein the reference image information includes the first color depth of the image information in the overflow tank; Step S30 includes: the control device compares the color depth of the image information with the first color depth; Step S40 includes: S401. If the comparison result is that the color depth of the image information conforms to the first color depth, the current opening degree of the reflux control valve is maintained; S402. If the comparison result is that the color depth of the image information is greater than the first color depth, the opening degree of the reflux control valve is increased; S403. If the comparison result is that the color depth of the image information is less than the first color depth, the opening degree of the reflux control valve is decreased.

23. The electroplating solution reflux control method according to claim 22, wherein before the step S10, the control device pre-stores the reference image information, including: S1060. Adjust the opening degree of the reflux control valve to 100%, and let the electroplating solution circulate in the electroplating solution reflux control system; S1061. Decrease the opening degree of the reflux control valve to gradually accumulate the electroplating solution in the overflow tank; S1062. When the volume of the electroplating solution in the overflow tank reaches the preset electroplating solution volume, the image acquisition device acquires the image information corresponding to the preset electroplating solution volume and sends it to the control device. The control device analyzes the image information to obtain the color depth characteristic value of the image information, and stores the color depth characteristic value as the first color depth.

24. The electroplating solution reflux control method according to claim 22, wherein before the step S10, the control device pre-stores the reference image information, including: S1060. Adjust the opening degree of the reflux control valve to 100%, and let the electroplating solution circulate in the electroplating solution reflux control system; S1061. Decrease the opening degree of the reflux control valve to gradually accumulate the electroplating solution in the overflow tank; S1062. When the volume of the electroplating solution in the overflow tank reaches within the preset electroplating solution volume range, the image acquisition device acquires multiple pieces of image information corresponding to the preset electroplating solution volume range and sends them to the control device. The control device analyzes the multiple pieces of image information to obtain multiple color depth characteristic values of the multiple pieces of image information, and stores the multiple color depth characteristic values as the first color depth.

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