Imaging lens module, camera module and electronic device

Abstract

The invention provides an imaging lens module, a camera module and an electronic device. The imaging lens module is provided with an optical axis and comprises an optical element, an assembling element and a low-reflection film, the optical axis passes through the optical element, and the assembling element is used for being assembled with the optical element. The low-reflection film is arranged on a part of the surface of the assembly element and comprises a nano-structure layer and a nano-structure matching layer. The nanostructure layer includes a plurality of ridge-shaped protrusions, wherein the ridge-shaped protrusions are arranged in an irregular form. The nanostructure matching layer is arranged between the assembly element and the nanostructure layer and comprises at least two optically thinner dielectric layers and at least one optically denser dielectric layer. The at least one optically denser dielectric layer is stacked between the at least two optically thinner dielectric layers. Therefore, the environmental tolerance can be improved, and stray light can be reduced.

Description

Technical Field

[0001] The present disclosure relates to an imaging lens module and a camera module, and particularly to an imaging lens module and a camera module applied to a portable electronic device. Background Art

[0002] In recent years, portable electronic devices have developed rapidly, such as smart electronic devices, tablet computers, etc., which have flooded into modern people's lives. The camera modules and their imaging lens modules installed on portable electronic devices have also developed vigorously. However, with the increasing progress of technology, users' requirements for the quality of imaging lens modules are also getting higher and higher. Therefore, developing an imaging lens module that can improve environmental tolerance and reduce stray light has become an important and urgent problem in the industry. Summary of the Invention

[0003] The present disclosure provides an imaging lens module, a camera module, and an electronic device, which can make stray light less likely to be generated through a low-reflection film, thereby improving environmental tolerance.

[0004] According to an embodiment of the present disclosure, an imaging lens module has an optical axis and includes an optical element, an assembly element, and a low-reflection film. The optical axis passes through the optical element, and the assembly element is used to assemble and configure with the optical element. The low-reflection film is disposed on a partial surface of the assembly element and includes a nanostructure layer and a nanostructure matching layer. The nanostructure layer includes a plurality of ridge-like protrusions, and the plurality of ridge-like protrusions are arranged in a random form. The nanostructure matching layer is disposed between the assembly element and the nanostructure layer and includes at least two layers of optically thinner media layers and at least one layer of optically denser media layer. At least one layer of optically denser media layer is stacked between at least two layers of optically thinner media layers. Wherein, the thicknesses of at least two layers of optically thinner media layers are respectively greater than 40 nm and less than 100 nm, the thickness of at least one layer of optically denser media layer is greater than 1 nm and less than 33 nm, and the heights of the plurality of ridge-like protrusions are respectively greater than 80 nm and less than 300 nm.

[0005] For the imaging lens module according to the foregoing embodiment, the thicknesses of at least two layers of optically thinner media layers can be respectively greater than 45 nm and less than 95 nm.

[0006] For the imaging lens module according to the foregoing embodiment, the thicknesses of at least two layers of optically thinner media layers can be respectively greater than 48 nm and less than 85 nm.

[0007] For the imaging lens module according to the foregoing embodiment, the thickness of at least one layer of optically denser media layer can be greater than 3 nm and less than 28 nm.

[0008] An imaging lens module according to the embodiment described in the previous paragraph, wherein the thickness of at least one layer of optically dense dielectric layer can be greater than 3 nm and less than 25 nm.

[0009] An imaging lens module according to the embodiment described in the previous paragraph, wherein the optical element can be assembled on the assembly element, and the optical element and the assembly element can have physical contact.

[0010] An imaging lens module according to the embodiment described in the previous paragraph, wherein the assembly element can be made of an opaque plastic material for absorbing light incident on the assembly element.

[0011] An imaging lens module according to the embodiment described in the previous paragraph, wherein at least two layers of optically sparse dielectric layers can contain silicon oxide material.

[0012] An imaging lens module according to the embodiment described in the previous paragraph, wherein at least one layer of optically dense dielectric layer can contain titanium oxide material.

[0013] An imaging lens module according to the embodiment described in the previous paragraph, wherein the plurality of ridge protrusions can contain aluminum oxide material.

[0014] An imaging lens module according to the embodiment described in the previous paragraph can further include an adhesive element, wherein the adhesive element can be disposed on the assembly element to assemble the imaging lens module, and the adhesive element and the low-reflection film can have no direct physical contact.

[0015] An imaging lens module according to the embodiment described in the previous paragraph, wherein the optical reflectivity of the low-reflection film in the visible light band is R, which can satisfy the following conditions: 0.0% ≤ R ≤ 0.6%.

[0016] An imaging lens module according to the embodiment described in the previous paragraph, wherein the optical reflectivity of the low-reflection film in the visible light band is R, which can satisfy the following conditions: 0.0% ≤ R ≤ 0.4%.

[0017] An imaging lens module according to the embodiment described in the previous paragraph, wherein the optical reflectivity of the low-reflection film in the visible light band is R, which can satisfy the following conditions: 0.0% ≤ R ≤ 0.3%.

[0018] An imaging lens module according to the embodiment described in the previous paragraph, wherein one surface of the assembly element is provided with the low-reflection film, and the values in the CIELAB spectral space of the surface can be L*a*b*, where L* is the spectral brightness, a* is the spectral red-green degree, and b* is the spectral yellow-blue degree, which can satisfy the following conditions: 0.2 < L* < 2.7; -1.5 < a* < 2.0; and -4.0 < b* < 2.5.

[0019] According to an embodiment of the present disclosure, a camera module is provided, which includes an imaging lens module as described in the foregoing embodiments and an electronic photosensitive element, wherein the electronic photosensitive element is disposed on an imaging surface of the imaging lens module.

[0020] According to an embodiment of the present disclosure, an electronic device is provided, which includes the camera module as described in the foregoing embodiments. Description of the Drawings

[0021] Figure 1A A schematic diagram showing the camera module according to the first embodiment of the present disclosure;

[0022] Figure 1B Showing according to Figure 1A A scanning electron microscope image of region 1B in the first embodiment;

[0023] Figure 1C Showing according to Figure 1A A schematic diagram showing the low-reflection film and the assembled components in the first embodiment;

[0024] Figure 2 A schematic diagram showing the camera module according to the second embodiment of the present disclosure;

[0025] Figure 3 A schematic diagram showing the camera module according to the third embodiment of the present disclosure;

[0026] Figure 4 A schematic diagram showing the camera module according to the fourth embodiment of the present disclosure;

[0027] Figure 5 A schematic diagram showing the camera module according to the fifth embodiment of the present disclosure;

[0028] Figure 6A A schematic diagram showing the electronic device according to the sixth embodiment of the present disclosure;

[0029] Figure 6B Showing according to Figure 6A Another schematic diagram of the electronic device according to the sixth embodiment;

[0030] Figure 6C Showing according to Figure 6A A schematic diagram of an image captured by the electronic device according to the sixth embodiment;

[0031] Figure 6D Showing according to Figure 6A Another schematic diagram of an image captured by the electronic device according to the sixth embodiment;

[0032] Figure 6E Showing according to Figure 6A Another schematic diagram of an image captured by the electronic device according to the sixth embodiment;

[0033] Figure 7 A schematic diagram showing an electronic device according to the seventh embodiment of the present disclosure;

[0034] Figure 8A A schematic diagram showing a camera module according to the eighth embodiment of the present disclosure applied to a vehicle;

[0035] Figure 8B Showing according to Figure 8A A schematic diagram of the camera module disposed in the vehicle according to the eighth embodiment; and

[0036] Figure 8C Showing according to Figure 8A Another schematic diagram of the camera module disposed in the vehicle according to the eighth embodiment.

[0037]

Symbol Description

[0038] 10, 20: Electronic device

[0039] 100, 200, 300, 400, 500, 31: Camera module

[0040] 11: User interface

[0041] 110, 210, 310, 410, 510: Electronic photosensitive element

[0042] 12, 22a, 22b: Ultra-wide-angle camera module

[0043] 120, 220, 320, 420, 520: Optical element

[0044] 13: High-pixel camera module

[0045] 130, 230, 330, 430, 530: Assembly element

[0046] 131, 231, 331: First assembly part

[0047] 132, 232, 332: Second assembly part

[0048] 14, 24a, 24b, 24c, 24d: Telephoto camera module

[0049] 140, 240, 340, 440, 540: Low-reflection film

[0050] 141: Nanostructure layer

[0051] 142: Nanostructure matching layer

[0052] 143: Ridge protrusion

[0053] 15: Imaging signal processing element

[0054] 151, 152, 251, 252, 351, 352, 353, 450, 550: Adhesive element

[0055] 23a, 23b: Wide-angle camera module

[0056] 26: TOF module

[0057] 27: Flashlight module

[0058] 30: Vehicle

[0059] 321: First optical component

[0060] 322: Second optical component

[0061] 333: Third assembly component

[0062] 334: Fourth assembly component

[0063] X: Optical axis

[0064] θ: Viewing angle

[0065] I1, I2, I3, I4: External space information Detailed implementation

[0066] The present disclosure provides an imaging lens module having an optical axis, which includes an optical element, an assembly element, and a low-reflection thin film. The optical axis passes through the optical element, and the assembly element is used to be assembled and configured with the optical element. The low-reflection thin film is disposed on a partial surface of the assembly element and includes a nanostructure layer and a nanostructure matching layer. The nanostructure layer includes a plurality of ridge-like protrusions, and the plurality of ridge-like protrusions are arranged in a random form. The nanostructure matching layer is disposed between the assembly element and the nanostructure layer and includes at least two layers of optically thinner media layers and at least one layer of optically denser media layer. At least one layer of optically denser media layer is stacked between at least two layers of optically thinner media layers. The thicknesses of at least two layers of optically thinner media layers are respectively greater than 40 nm and less than 100 nm, the thickness of at least one layer of optically denser media layer is greater than 1 nm and less than 33 nm, and the heights of the plurality of ridge-like protrusions are respectively greater than 80 nm and less than 300 nm. Thereby, the nanostructure matching layer can improve the refractive index matching degree between the assembly element and the nanostructure layer, enabling light to more easily enter the assembly element from the outermost nanostructure layer to maintain a low optical reflectivity performance. In addition, the nanostructure layer with ridge-like protrusions arranged in a random form can provide the effect of reducing stray light. Specifically, the present invention provides a high environmental tolerance for the low-reflection thin film through the stacking design of the optically thinner media layer, the optically denser media layer, and the nanostructure layer.

[0067] Specifically, the surface appearance of the assembled component coated with the low-reflection thin film is less vulnerable to damage by external environmental factors. Further, the optically thinner medium layer and the optically denser medium layer in the nanostructure matching layer can be stacked in combination of SiO2, MgF2, TiO2, Ta2O5, Cr2O3, HfO2, ZnO, AlN, Al2O3, Y2O3, CaF2, SiC, MgO, ZrO2, which can improve the tolerance of the low-reflection thin film to volatile substances and optimize the process steps. The refractive index of the optically denser medium layer is greater than that of the optically thinner medium layer. The elemental ratios of the above compounds are not limited to the disclosed values and can vary due to differences in process conditions. In addition, the multiple ridge protrusions will exhibit non-uniform heights, and the heights of the respective ridge protrusions can be different.

[0068] Furthermore, the optical component can be an optical lens component or an optical prism component, but is not limited thereto. The assembled component can be a lens barrel, a lens carrier, a fixing component, or a prism carrier, but is not limited thereto.

[0069] The thicknesses of at least two optically thinner medium layers can be respectively greater than 45 nm and less than 95 nm. Thereby, stacking the optically thinner medium layer and the optically denser medium layer with specific thicknesses can improve the antireflection effect of the low-reflection thin film. In addition, the thicknesses of at least two optically thinner medium layers can be respectively greater than 48 nm and less than 85 nm.

[0070] The thickness of at least one optically denser medium layer can be greater than 3 nm and less than 28 nm. Thereby, stacking the optically thinner medium layer and the optically denser medium layer with specific thicknesses can improve the antireflection effect of the low-reflection thin film. In addition, the thickness of at least one optically denser medium layer can be greater than 3 nm and less than 25 nm.

[0071] The optical component can be assembled on the assembled component, and the optical component and the assembled component can have physical contact. Thereby, the probability of generating non-imaging light between the optical component and the assembled component can be reduced.

[0072] The assembled component can be made of an opaque plastic material to absorb the light incident on the assembled component. Thereby, it helps to improve the optical image quality of the imaging lens module.

[0073] At least two optically thinner medium layers can contain silicon oxide (Si x O y ) material, where the ratios of silicon element and oxygen element are x and y respectively, which can vary due to process conditions. Thereby, a more stable process is provided to ensure mass production of the product.

[0074] At least one optically denser medium layer can contain titanium oxide (Ti x O y) A material, where the proportions of titanium element and oxygen element are x and y respectively, which may vary due to process conditions. Thereby, an optical thin film material with a higher refractive index is provided, which helps to reduce the complexity of film layer design.

[0075] The ridge-like protrusion may include alumina (Al x O y ) material, where the proportions of aluminum element and oxygen element are x and y respectively, which may vary due to process conditions. Thereby, the durability and structural stability of the low-reflection thin film are provided to improve the product yield.

[0076] The imaging lens module may further include an adhesive element, where the adhesive element may be disposed on the assembly element to assemble the imaging lens module, and there is no direct physical contact between the adhesive element and the low-reflection thin film. Thereby, the assembly efficiency of the imaging lens module is improved, and the stability of the assembly is provided.

[0077] The optical reflectivity of the low-reflection thin film in the visible light band is R, which may satisfy the following conditions: 0.0% ≤ R ≤ 0.6%. Thereby, a low-reflection thin film with a higher manufacturing yield is provided. In addition, the optical reflectivity of the low-reflection thin film in the visible light band is R, which may satisfy the following conditions: 0.0% ≤ R ≤ 0.4%. Thereby, the efficiency of the assembly element absorbing stray light is further improved. Furthermore, the optical reflectivity of the low-reflection thin film in the visible light band is R, which may satisfy the following conditions: 0.0% ≤ R ≤ 0.3%. Thereby, the low-reflection thin film is provided with a higher environmental tolerance and the generation of stray light is reduced.

[0078] One surface of the assembly element is provided with a low-reflection thin film, where the values in the CIELAB spectral space of the surface may be L*a*b*, L* is the spectral luminance, a* is the spectral red-green degree, and b* is the spectral yellow-blue degree, which may satisfy the following conditions: 0.2 < L* < 2.7; -1.5 < a* < 2.0; and -4.0 < b* < 2.5. Thereby, the stability of the optical properties of the surface of the assembly element is provided.

[0079] Each technical feature in the imaging lens module of the above disclosure can be combined and configured to achieve the corresponding effects.

[0080] The present disclosure provides a camera module, which includes the aforementioned imaging lens module and an electronic photosensitive element, where the electronic photosensitive element is disposed on an imaging surface of the imaging lens module.

[0081] The present disclosure provides an electronic device, which includes the aforementioned camera module.

[0082] According to the above embodiments, specific examples are presented below and described in detail with the accompanying drawings.

[0083] <First Embodiment>

[0084] Please refer to Figure 1A , which shows a schematic diagram of the camera module 100 according to the first embodiment of the present disclosure. As can be seen from Figure 1A , the camera module 100 includes an imaging lens module (not shown in the figure) and an electronic photosensitive element 110, wherein the electronic photosensitive element 110 is disposed on an imaging surface (not shown in the figure) of the imaging lens module. The imaging lens module has an optical axis X, which includes an optical element 120, an assembly element 130, and a plurality of low-reflection thin films 140. The optical axis X passes through the optical element 120, and the assembly element 130 is used for assembling and configuring with the optical element 120. Specifically, the optical element 120 can be assembled on the assembly element 130, and the optical element 120 and the assembly element 130 can have physical contact. In addition, the assembly element 130 can be made of an opaque plastic material to absorb the light incident on the assembly element 130.

[0085] Furthermore, the assembly element 130 can include a first assembly part 131 and a second assembly part 132. The first assembly part 131 surrounds and positions the optical element 120, and the second assembly part 132 can be a fixing ring, which is located on the image side of the optical element 120. The imaging lens module can further include two adhesive elements 151, 152. The adhesive element 151 can be disposed on the first assembly part 131 of the assembly element 130 to assemble the imaging lens module, and the adhesive element 151 and the low-reflection thin film 140 can have no direct physical contact. The adhesive element 152 is used to position the second assembly part 132 in the first assembly part 131 and on the image side of the optical element 120.

[0086] Specifically, the optical element 120 can be an optical lens element or an optical prism element, but not limited thereto. The assembly element 130 can be a lens barrel, a lens carrier, a fixing element, a prism carrier, but not limited thereto.

[0087] Please refer to Figure 1B and Figure 1C , Figure 1B which shows Figure 1A a scanning electron microscope image of region 1B according to the first embodiment, Figure 1C and Figure 1A shows a schematic diagram of the low-reflection thin film 140 and the assembly element 130 according to the first embodiment. As can be seen from Figures 1A to 1CIt can be known that the low-reflection thin film 140 is disposed on a partial surface of the assembly element 130, specifically, on multiple surfaces facing the object side and one surface facing the image side in the first assembly component 131. Each low-reflection thin film 140 includes a nanostructure layer 141 and a nanostructure matching layer 142. The nanostructure layer 141 includes a plurality of ridge-like protrusions 143, and the ridge-like protrusions 143 are arranged in a random form. In addition, the nanostructure matching layer 142 is disposed between the assembly element 130 and the nanostructure layer 141, and it includes at least two layers of optically thinner media layers and at least one layer of optically denser media layer, and at least one layer of optically denser media layer is stacked between at least two layers of optically thinner media layers. The thickness of each optically thinner media layer is greater than 40 nm and less than 100 nm, the thickness of the optically denser media layer is greater than 1 nm and less than 33 nm, and the height of each ridge-like protrusion 143 is greater than 80 nm and less than 300 nm.

[0088] Specifically, the thickness of each optically thinner media layer can be greater than 45 nm and less than 95 nm. Further, the thickness of each optically thinner media layer can be greater than 48 nm and less than 85 nm. In addition, the thickness of the optically denser media layer can be greater than 3 nm and less than 28 nm. Further, the thickness of the optically denser media layer can be greater than 3 nm and less than 25 nm. Moreover, the optically thinner media layer can include silicon oxide material, the optically denser media layer can include titanium oxide material, and the ridge-like protrusion 143 can include aluminum oxide material. Specifically, the parameters satisfy the conditions in Table 1 below. Table 1 shows the materials and thicknesses of the nanostructure matching layer 142 in the first embodiment of the first implementation manner. Each value in Table 1 is respectively the thickness of each optically thinner media layer and the thickness of the optically denser media layer.

[0089]

[0090] Specifically, the optical reflectance of the low-reflection thin film 140 in the visible light band is R, and it can satisfy the following conditions: 0.0% ≤ R ≤ 0.6%. In addition, the optical reflectance of the low-reflection thin film 140 in the visible light band is R, and it can satisfy the following conditions: 0.0% ≤ R ≤ 0.4%. Further, the optical reflectance of the low-reflection thin film 140 in the visible light band is R, and it can satisfy the following conditions: 0.0% ≤ R ≤ 0.3%.

[0091] On one surface of the assembly element 130 where the low-reflection thin film 140 is disposed, the values in the CIELAB spectral space of the surface can be L*a*b*, where L* is the spectral luminance, a* is the spectral red-green degree, and b* is the spectral yellow-blue degree, and it can satisfy the following conditions: 0.2 < L* < 2.7; -1.5 < a* < 2.0; and -4.0 < b* < 2.5. The parameters satisfy the conditions in Table 2 below. Table 2 shows the values in the CIELAB spectral space of the first embodiment of the first implementation manner.

[0092]

[0093] Please refer to Table 3 below. Table 3 shows the thicknesses of the layers of the nanostructured matching layer 142 of the second embodiment of the first embodiment. Specifically, the materials of the layers of the nanostructured matching layer 142 of the second embodiment of the first embodiment are the same as or similar to those of the first embodiment of the first embodiment, with the difference being the thicknesses of the low-index dielectric layers and the high-index dielectric layers.

[0094]

[0095] Furthermore, Table 4 shows the numerical values in the CIELAB spectral space of the second embodiment of the first embodiment, where the definitions of the parameters are the same as those of the first embodiment of the first embodiment described above, and will not be elaborated here.

[0096]

[0097] Please refer to Table 5 below. Table 5 shows the thicknesses of the layers of the nanostructured matching layer 142 of the third embodiment of the first embodiment. Specifically, the materials of the layers of the nanostructured matching layer 142 of the third embodiment of the first embodiment are the same as or similar to those of the first embodiment of the first embodiment, with the difference being the thicknesses of the low-index dielectric layers and the high-index dielectric layers.

[0098]

[0099]

[0100] Furthermore, Table 6 shows the numerical values in the CIELAB spectral space of the third embodiment of the first embodiment, where the definitions of the parameters are the same as those of the first embodiment of the first embodiment described above, and will not be elaborated here.

[0101]

[0102] Please refer to Table 7 below. Table 7 shows the thicknesses of the layers of the nanostructured matching layer 142 of the fourth embodiment of the first embodiment. Specifically, the materials of the fourth embodiment of the first embodiment are the same as or similar to those of the first embodiment of the first embodiment, with the difference being the thickness ranges of the low-index dielectric layers and the high-index dielectric layers.

[0103]

[0104] Furthermore, Table 8 shows the numerical values in the CIELAB spectral space of the fourth embodiment of the first embodiment, where the definitions of the parameters are the same as those of the first embodiment of the first embodiment described above, and will not be elaborated here.

[0105]

[0106]

[0107] In addition, the second embodiment, the third embodiment, and the fourth embodiment of the first implementation mode are respectively the same as the component structures and configuration relationships of the first embodiment of the first implementation mode, and will not be described in detail herein.

[0108] <Second Embodiment>

[0109] Please refer to Figure 2 , which is a schematic diagram showing the camera module 200 according to the second embodiment of the present disclosure. As can be seen from Figure 2 , the camera module 200 includes an imaging lens module (not shown) and an electronic photosensitive element 210, wherein the electronic photosensitive element 210 is disposed on an imaging surface (not shown) of the imaging lens module. The imaging lens module has an optical axis X, which includes an optical element 220, an assembly element 230, and a plurality of low-reflection films 240, wherein the optical axis X passes through the optical element 220, and the assembly element 230 is used to assemble and configure with the optical element 220.

[0110] Furthermore, the assembly element 230 may include a first assembly part 231 and a second assembly part 232, wherein the first assembly part 231 surrounds and positions the optical element 220, and the second assembly part 232 may be a fixing ring, which is located on the image side of the optical element 220. The imaging lens module may further include two adhesive elements 251, 252, wherein the adhesive element 251 may be disposed on the first assembly part 231 to assemble the imaging lens module, and there is no direct physical contact between the adhesive element 251 and the low-reflection film 240. The adhesive element 252 is used to position the second assembly part 232 in the first assembly part 231 and on the image side of the optical element 220. Moreover, the low-reflection films 240 are disposed on partial surfaces of the assembly element 230, namely, a surface of the first assembly part 231 facing the object side and a surface of the second assembly part 232 facing the image side respectively.

[0111] The remaining component structures and configuration relationships of the second embodiment are the same as or similar to those of the first embodiment, and will not be described in detail herein.

[0112] <Third Embodiment>

[0113] Please refer to Figure 3 , which is a schematic diagram showing the camera module 300 according to the third embodiment of the present disclosure. As can be seen from Figure 3It can be known that the camera module 300 includes an imaging lens module (not shown in the figure) and an electronic photosensitive element 310, wherein the electronic photosensitive element 310 is disposed on an imaging surface (not shown in the figure) of the imaging lens module. The imaging lens module has an optical axis X, which includes an optical element 320, an assembling element 330, and a plurality of low-reflection thin films 340. The optical axis X passes through the optical element 320, and the assembling element 330 is used for assembling and configuring with the optical element 320.

[0114] Furthermore, the optical element 320 may include a first optical component 321 and a second optical component 322. The assembling element 330 may include a first assembling component 331, a second assembling component 332, a third assembling component 333, and a fourth assembling component 334. The first assembling component 331 surrounds the first optical component 321. The second assembling component 332 may be a fixing ring, which is located on the image side of the first optical component 321. The third assembling component 333 is used for positioning the first optical component 321 and the second optical component 322, and the fourth assembling component 334 is located on the image side of the second optical component 322. The imaging lens module may further include three adhesive elements 351, 352, 353. The adhesive element 351 may be disposed on the first assembling component 331. The adhesive element 352 is used for positioning the second assembling component 332 in the first assembling component 331 and on the image side of the first optical component 321. The adhesive element 353 may be disposed on the fourth assembling component 334, thereby assembling the imaging lens module. The adhesive elements 351, 353 and the low-reflection thin film 340 may have no direct physical contact. Moreover, the low-reflection thin film 340 is disposed on partial surfaces of the assembling element 330, which are respectively a surface of the first assembling component 331 facing the image side, a surface of the second assembling component 332 facing the image side, a surface of the third assembling component 333 facing the image side, and a surface of the fourth assembling component 334 facing the object side.

[0115] The element structures and configuration relationships of the third embodiment are the same as those of the first embodiment, and will not be described herein again.

[0116] <Fourth Embodiment>

[0117] Please refer to Figure 4 , which shows a schematic diagram of the camera module 400 according to the fourth embodiment of the present disclosure. From Figure 4It can be known that the camera module 400 includes an imaging lens module (not shown in the figure) and an electronic photosensitive element 410, wherein the electronic photosensitive element 410 is disposed on an imaging surface (not shown in the figure) of the imaging lens module. The imaging lens module has an optical axis X, which includes an optical element 420, an assembly element 430, and a low-reflection thin film 440. The optical axis X passes through the optical element 420, and the assembly element 430 is used for assembling and configuring with the optical element 420. Further, the imaging lens module may further include an adhesive element 450, wherein the adhesive element 450 can be disposed on the assembly element 430 to assemble the imaging lens module, and the adhesive element 450 and the low-reflection thin film 440 may have no direct physical contact. Moreover, the low-reflection thin film 440 is disposed on a partial surface of the assembly element 430, which is a surface of the assembly element 430 facing the object side.

[0118] The element structures and configuration relationships of the fourth embodiment are the same as those of the first embodiment, and will not be described herein again.

[0119] <Fifth Embodiment>

[0120] Please refer to Figure 5 , which shows a schematic diagram of the camera module 500 according to the fifth embodiment of the present disclosure. It can be known from Figure 5 that the camera module 500 includes an imaging lens module (not shown in the figure) and an electronic photosensitive element 510, wherein the electronic photosensitive element 510 is disposed on an imaging surface (not shown in the figure) of the imaging lens module. The imaging lens module has an optical axis X, which includes an optical element 520, an assembly element 530, and a low-reflection thin film 540. The optical axis X passes through the optical element 520, and the assembly element 530 is used for assembling and configuring with the optical element 520. Further, the imaging lens module may further include an adhesive element 550, wherein the adhesive element 550 can be disposed on the assembly element 530 to assemble the imaging lens module, and the adhesive element 550 and the low-reflection thin film 540 may have no direct physical contact. Moreover, the low-reflection thin film 540 is disposed on a partial surface of the assembly element 530, which is a surface of the assembly element 530 facing the object side.

[0121] The element structures and configuration relationships of the fifth embodiment are the same as those of the first embodiment, and will not be described herein again.

[0122] <Sixth Embodiment>

[0123] Please refer to Figure 6A and Figure 6B , Figure 6A which shows a schematic diagram of the electronic device 10 according to the sixth embodiment of the present disclosure, Figure 6B shows another schematic diagram of the electronic device 10 according to Figure 6A the sixth embodiment. It can be known from Figure 6A andFigure 6B It can be seen that the electronic device 10 is a smart phone. The electronic device 10 includes a camera module and a user interface 11. The camera module includes an imaging lens module (not shown in the figure) and an electronic photosensitive element (not shown in the figure). The electronic photosensitive element is disposed on an imaging surface (not shown in the figure) of the imaging lens module, and the imaging lens module includes an optical element, an assembly element, and a low-reflection film. Further, the camera module is an ultra-wide-angle camera module 12, a high-pixel camera module 13, and a telephoto camera module 14, and the user interface 11 is a touch screen, but is not limited thereto. Specifically, each camera module can be the camera module provided by any one of the foregoing first to fifth embodiments, but the disclosure is not limited thereto.

[0124] The user enters the shooting mode through the user interface 11. The user interface 11 is used to display a picture and can be used to manually adjust the shooting angle to switch different camera modules. At this time, the camera module converges the imaging light on the electronic photosensitive element and outputs an electronic signal related to the image to an imaging signal processing element (Image Signal Processor, ISP) 15.

[0125] It can be seen from Figure 6B that in response to the camera specifications of the electronic device 10, the electronic device 10 may further include an optical image stabilization component (not shown in the figure). Further, the electronic device 10 may further include at least one pair of focus assist modules (not shown in the figure) and at least one sensing element (not shown in the figure). The focus assist module can be a flash module (not shown in the figure) for compensating the color temperature, an infrared ranging element, a laser focus module, etc. The sensing element can have the function of sensing physical momentum and actuation energy, such as an accelerometer, a gyroscope, a Hall Effect Element, to sense the shaking and jitter applied by the user's hand or the external environment, thereby facilitating the automatic focus function of the camera module configuration in the electronic device 10 and the performance of the optical image stabilization component, so as to obtain good imaging quality, and helping the electronic device 10 according to the disclosure to have various shooting functions, such as optimized selfies, low-light HDR (High Dynamic Range) imaging, high-resolution 4K (4K Resolution) video recording, etc. In addition, the user can directly view the shooting picture of the camera through the user interface 11 and manually operate the viewing range on the user interface 11 to achieve the automatic focus function of what you see is what you get.

[0126] Furthermore, the camera module, the optical image stabilization component, the sensing element, and the focus assist module can be disposed on a flexible printed circuit board (FPC) (not shown in the figure), and electrically connected to related components such as the imaging signal processing element 15 through a connector (not shown in the figure) to execute the shooting process. Current electronic devices such as smartphones tend to be thin and light. Configuring the camera module and related components on the flexible printed circuit board and then integrating the circuits to the main board of the electronic device through the connector can meet the mechanical design and circuit layout requirements of the limited space inside the electronic device and obtain a greater margin, and also enable the autofocus function of its camera module to be more flexibly controlled through the touch screen of the electronic device. In the sixth embodiment, the electronic device 10 can include multiple sensing elements and multiple focus assist modules. The sensing elements and the focus assist modules are disposed on the flexible printed circuit board and at least one other flexible printed circuit board (not shown in the figure), and electrically connected to related components such as the imaging signal processing element 15 through corresponding connectors to execute the shooting process. In other embodiments (not shown in the figure), the sensing elements and the auxiliary optical elements can also be disposed on the main board of the electronic device or other forms of carrier boards according to the mechanical design and circuit layout requirements.

[0127] In addition, the electronic device 10 can further include, but is not limited to, a display unit, a control unit, a storage unit, a random access memory (RAM), a read-only memory (ROM), or a combination thereof.

[0128] Figure 6C Illustrating according to Figure 6A A schematic diagram of an image captured by the electronic device 10 according to the sixth embodiment. As Figure 6C can be seen, the ultra-wide-angle camera module 12 can capture a larger range of images and has the function of accommodating more scenery.

[0129] Figure 6D Illustrating according to Figure 6A Another schematic diagram of an image captured by the electronic device 10 according to the sixth embodiment. As Figure 6D can be seen, the high-pixel camera module 13 can capture an image with a certain range and high pixels and has the function of high resolution and low distortion.

[0130] Figure 6E Illustrating according to Figure 6A Another schematic diagram of an image captured by the electronic device 10 according to the sixth embodiment. As Figure 6E can be seen, the telephoto camera module 14 has a high magnification function and can capture distant images and magnify them to a high magnification.

[0131] As Figures 6C to 6EIt can be known that by using camera modules with different focal lengths for framing and combining with image processing technology, the function of zooming can be achieved on the electronic device 10.

[0132] <Seventh Embodiment>

[0133] Please refer to Figure 7 , which shows a schematic diagram of an electronic device 20 according to the seventh embodiment of the present disclosure. It can be known from Figure 7 that the electronic device 20 is a smart phone, and the electronic device 20 includes a camera module. The camera module includes an imaging lens module and an electronic photosensitive element. The electronic photosensitive element is disposed on an imaging surface of the imaging lens module, and the imaging lens module includes an optical element, an assembling element, and a low-reflection film. Further, the camera modules are ultra-wide-angle camera modules 22a, 22b, wide-angle camera modules 23a, 23b, telephoto camera modules 24a, 24b, 24c, 24d, and a TOF module (Time-Of-Flight) 26, and the TOF module 26 can alternatively be other types of camera modules, and is not limited to this configuration. Specifically, each camera module can be the camera module provided by any one of the foregoing first to fifth embodiments, but the present disclosure is not limited thereto.

[0134] Furthermore, the telephoto camera modules 24c, 24d are used to bend the optical path, but the present disclosure is not limited thereto.

[0135] In response to the camera specifications of the electronic device 20, the electronic device 20 may further include an optical image stabilization component (not shown in the figure). Further, the electronic device 20 may further include at least one focus assist module (not shown in the figure) and at least one sensing element (not shown in the figure). The focus assist module can be a flash module 27 for compensating color temperature, an infrared ranging element, a laser focus module, etc. The sensing element can have the function of sensing physical momentum and actuation energy, such as an accelerometer, a gyroscope, a Hall element, to sense the shaking and vibration applied by the user's hand or the external environment, thereby facilitating the automatic focus function and the optical image stabilization component of the camera module configuration in the electronic device 20 to obtain good imaging quality, and helping the electronic device 20 according to the present disclosure to have various shooting functions, such as optimized selfies, low-light HDR, high-resolution 4K video recording, etc.

[0136] In addition, the structures and configuration relationships of the remaining components in the seventh embodiment and the sixth embodiment are the same, and will not be described herein again.

[0137] <Eighth Embodiment>

[0138] Please refer to Figures 8A to 8C , Figure 8ASchematic diagram showing the application of the camera module 31 according to the eighth embodiment of the present disclosure to a vehicle 30. Figure 8B Showing according to Figure 8A Schematic diagram of the camera module 31 configured in the vehicle 30 in the eighth embodiment. Figure 8C Showing according to Figure 8A Another schematic diagram of the camera module (not shown in the figure) configured in the vehicle 30 in the eighth embodiment. As can be seen from Figures 8A to 8C It can be seen that the camera module 31 is applied to the vehicle 30, wherein the camera module 31 includes an imaging lens module and an electronic photosensitive element. The electronic photosensitive element is disposed on an imaging surface of the imaging lens module, and the imaging lens module includes an optical element, an assembling element, and a low-reflection film. In the eighth embodiment, the number of the camera modules 31 is six, the camera modules 31 are vehicle-mounted camera modules, and the camera modules can be the camera modules provided by any one of the foregoing first to fifth embodiments, but the present disclosure is not limited thereto.

[0139] As can be seen from Figure 8A And Figure 8B It can be seen that two of the camera modules 31 are respectively located below the left and right rearview mirrors and are used to capture image information of a viewing angle θ. Specifically, the viewing angle θ can satisfy the following condition: 40 degrees < θ < 90 degrees. Thereby, the image information within the range of the left and right adjacent lanes can be captured.

[0140] As can be seen from Figure 8B It can be seen that the other two of the camera modules 31 can be disposed in the space inside the vehicle 30. Specifically, the two camera modules 31 are respectively disposed at positions close to the interior rearview mirror and positions close to the rear window. Furthermore, the other camera modules 31 can be respectively disposed on the non-mirror surfaces of the left and right rearview mirrors of the vehicle 30, but not limited thereto.

[0141] As can be seen from Figure 8C It can be seen that the other two of the camera modules can be disposed at the front end and the rear end of the vehicle 30. By configuring the camera modules at the front end and the rear end of the vehicle 30 and below the left and right rearview mirrors, it helps the driver to obtain external space information outside the cockpit, such as external space information I1, I2, I3, I4, but not limited thereto. Thereby, more viewing angles can be provided to reduce blind spots, which in turn helps to improve driving safety. Furthermore, by disposing the camera modules around the vehicle 30, it helps to identify the road condition information outside the vehicle 30, which helps to implement the function of automatic assisted driving.

[0142] Although the present invention has been disclosed above in embodiments and examples, it is not used to limit the present invention. Any person with ordinary knowledge in the technical field to which the present invention pertains can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope defined in the appended claims.

Claims

1. An imaging lens module, characterized in that: Having an optical axis, comprising: An optical element through which the optical axis passes; An assembly element for assembling and configuring with the optical element; and A low-reflection thin film disposed on a partial surface of the assembly element, comprising: A nanostructure layer including a plurality of ridge-like protrusions, wherein the plurality of ridge-like protrusions are arranged in a random form; and A nanostructure matching layer disposed between the assembly element and the nanostructure layer, comprising: At least two layers of optically thinner media layers; And At least one layer of optically denser media layer stacked between the at least two layers of optically thinner media layers; wherein the thicknesses of the at least two layers of optically thinner media layers are respectively greater than 40 nm and less than 100 nm, the thickness of the at least one layer of optically denser media layer is greater than 1 nm and less than 33 nm, and the heights of the plurality of ridge-like protrusions are respectively greater than 80 nm and less than 300 nm.

2. The imaging lens module according to claim 1, wherein: The thicknesses of the at least two layers of optically thinner media layers are respectively greater than 45 nm and less than 95 nm.

3. The imaging lens module according to claim 2, wherein: The thicknesses of the at least two layers of optically thinner media layers are respectively greater than 48 nm and less than 85 nm.

4. The imaging lens module according to claim 1, wherein: The thickness of the at least one layer of optically denser media layer is greater than 3 nm and less than 28 nm.

5. The imaging lens module according to claim 4, wherein: The thickness of the at least one layer of optically denser media layer is greater than 3 nm and less than 25 nm.

6. The imaging lens module according to claim 1, wherein: The optical element is assembled on the assembly element, and the optical element is in physical contact with the assembly element.

7. The imaging lens module according to claim 1, wherein: The assembly element is made of an opaque plastic material for absorbing light incident on the assembly element.

8. The imaging lens module according to claim 1, wherein: The at least two layers of optically thinner media layers include silicon oxide materials.

9. The imaging lens module according to claim 1, wherein: The at least one layer of optically denser media layer includes titanium oxide materials.

10. The imaging lens module according to claim 1, wherein: The plurality of ridge-like protrusions include aluminum oxide materials.

11. The imaging lens module according to claim 1, wherein: Further comprising: An adhesive element disposed on the assembly element for assembling the imaging lens module, and the adhesive element has no direct physical contact with the low-reflection thin film.

12. The imaging lens module according to claim 1, wherein: The optical reflectivity of the low-reflection thin film in the visible light band is R, which satisfies the following conditions: 0.0％≤R≤0.6％。 13. The imaging lens module according to claim 12, wherein: The optical reflectivity of the low-reflection thin film in the visible light band is R, which satisfies the following conditions: 0.0％≤R≤0.4％。 14. The imaging lens module according to claim 13, wherein: The optical reflectivity of the low-reflection thin film in the visible light band is R, which satisfies the following conditions: 0.0％≤R≤0.3％。 15. The imaging lens module according to claim 1, wherein: A surface of the assembly element where the low-reflection thin film is disposed; Wherein, the values in the CIELAB spectral space of the surface are L*a*b*, L* is the spectral luminance, a* is the spectral red-green degree, b* is the spectral yellow-blue degree, which satisfy the following conditions: 0.2<L*<2.7； -1.5 < a* < 2.0; and -4.0<b*<2.5。 16. A camera module, characterized in that: Comprising: The imaging lens module as described in claim 1; and An electronic photosensitive element disposed on an imaging surface of the imaging lens module.

17. An electronic device, characterized in that: Comprising: The camera module as described in claim 16.

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