Electronic component dispensing and reinforcement method and system

Abstract

The application relates to the technical field of component packaging, and discloses an electronic component dispensing and reinforcing method and system, which comprises the following steps: determining four corners of a shell of an electronic component and at least two symmetrically distributed preset positions on the bottom of the shell as target points; a PCB board of the electronic component is connected with the shell through positioning holes arranged at the four corners; layer-by-layer dispensing and reinforcing is performed between the PCB board and each target point to obtain an electronic component after dispensing and reinforcing; the layer-by-layer dispensing and reinforcing process is as follows: a high-elasticity buffer adhesive layer is coated on the contact surface of the target point and the PCB board, and after the high-elasticity buffer adhesive layer is solidified, a rigid support adhesive layer is coated on the outer surface of the high-elasticity buffer adhesive layer. The application can optimize stress distribution of the electronic component, reduce the risk of component failure caused by stress concentration, and improve the reliability and stability of the electronic component.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of component packaging, in particular to a method and system for dispensing and reinforcing electronic components. BACKGROUND

[0002] At present, multi-pin ceramic four-side lead flat package digital signal processors (hereinafter referred to as components) are widely used in the field of high reliability. However, when the components are subjected to external actions such as high-intensity vibration, impact or temperature cycling, stress will concentrate on the pins of the component shell, leading to component pin breakage and failure. The use of silicone or epoxy glue to reinforce between the four corners of the component shell and the printed circuit board (hereinafter referred to as PCB) cannot provide sufficient protection for the components.

[0003] Therefore, there is an urgent need to provide a technical solution to solve the above problems. SUMMARY

[0004] To solve the above technical problems, the present application provides a method and system for dispensing and reinforcing electronic components.

[0005] In a first aspect, the present application provides a method for dispensing and reinforcing electronic components, and the technical scheme of the method is as follows:

[0006] The four corners of the shell of the electronic component and at least two symmetrically distributed preset positions on the bottom of the shell are determined as target points; wherein the PCB of the electronic component is connected to the shell through the positioning hole arranged at the four corners.

[0007] The PCB and each target point are layered and reinforced by dispensing to obtain a dispensing and reinforcing electronic component; wherein the process of layered dispensing and reinforcing is as follows: first, a high-elasticity buffer glue layer is coated on the contact surface of the target point and the PCB, and then a rigid support glue layer is coated on the outer surface of the high-elasticity buffer glue layer after the high-elasticity buffer glue layer is cured.

[0008] The method of dispensing and reinforcing electronic components has the following beneficial effects:

[0009] The method of the present application can optimize the stress distribution of electronic components, reduce the risk of component failure caused by stress concentration, and improve the reliability and stability of electronic components.

[0010] On the basis of the above-mentioned scheme, the method of dispensing and reinforcing electronic components of the present application can be further improved as follows.

[0011] In an alternative way, the at least two symmetrically distributed preset positions include a bottom center point of the shell and preset points symmetrically distributed on the edge of the middle region of the bottom of the shell.

[0012] In an alternative way, the step of performing layered dispensing reinforcement between the PCB board and each target point to obtain the dispensing-reinforced electronic component includes:

[0013] The layered dispensing reinforcement between the PCB board and each target point is performed by using a double-channel dispensing device to obtain the dispensing-reinforced electronic component; wherein the first channel of the double-channel dispensing device outputs a high-elasticity glue with a temperature in a first temperature range to form the high-elasticity buffer glue layer; and the second channel of the double-channel dispensing device outputs a rigid glue with a temperature in a second temperature range to form the rigid support glue layer in a manner of covering the high-elasticity buffer glue layer.

[0014] In an alternative way, the dispensing material of the double-channel dispensing device is silica gel or epoxy glue, and the elastic modulus of the high-elasticity buffer glue layer is less than that of the rigid support glue layer.

[0015] In an alternative way, the first temperature range is 25-35℃, and the second temperature range is 45-60℃.

[0016] In an alternative way, the electronic component is a digital signal processor.

[0017] In a second aspect, the application provides an electronic component dispensing reinforcement system, and the technical scheme of the system is as follows:

[0018] The system includes a processing module and a running module.

[0019] The processing module is configured to determine the four corners of the shell of an electronic component and at least two symmetrically distributed preset positions on the bottom of the shell as target points; wherein the PCB board of the electronic component is connected to the shell through the positioning holes arranged at the four corners.

[0020] The running module is configured to perform layered dispensing reinforcement between the PCB board and each target point to obtain a dispensing-reinforced electronic component; wherein the process of the layered dispensing reinforcement is as follows: first, a high-elasticity buffer glue layer is coated on the contact surface between the target point and the PCB board, and then, after the high-elasticity buffer glue layer is solidified, a rigid support glue layer is coated on the outer surface of the high-elasticity buffer glue layer.

[0021] The electronic component dispensing reinforcement system of the application has the following beneficial effects:

[0022] The system of the application can optimize the stress distribution of the electronic component, reduce the risk of device failure caused by stress concentration, and improve the reliability and stability of the electronic component.

[0023] Based on the above scheme, the electronic component dispensing and reinforcing system of the present application can be further improved as follows.

[0024] In an alternative way, the at least two symmetrically distributed preset positions include a bottom center point of the shell and preset point positions symmetrically distributed at the edges of the bottom middle region of the shell.

[0025] In an alternative way, the running module is specifically used for:

[0026] The double-channel dispensing equipment is used to perform layer-by-layer dispensing and reinforcing between the PCB and each target point position, so as to obtain the dispensing and reinforcing electronic component; wherein the first channel of the double-channel dispensing equipment outputs high-elasticity glue with a temperature in a first temperature range to form the high-elasticity buffer glue layer; and the second channel of the double-channel dispensing equipment outputs rigid glue with a temperature in a second temperature range to form the rigid support glue layer in a manner of covering the high-elasticity buffer glue layer.

[0027] In an alternative way, the dispensing material of the double-channel dispensing equipment is silica gel or epoxy glue, and the elastic modulus of the high-elasticity buffer glue layer is less than that of the rigid support glue layer.

[0028] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, and to be implemented according to the content of the specification, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0029] The accompanying drawings are included to provide a further understanding of the application, and are incorporated herein and constitute a part of the detailed description. It should be noted that in the accompanying drawings, the same or similar elements are referred to using the same reference numerals. In the drawings:

[0030] Figure 1 The flowchart of an embodiment of the electronic component dispensing and reinforcing method of the present application;

[0031] Figure 2 The principle diagram of electronic component dispensing and reinforcing;

[0032] Figure 3 The principle diagram of electronic component dispensing and reinforcing;

[0033] Figure 4 The structure diagram of an embodiment of the electronic component dispensing and reinforcing system of the present application. DETAILED DESCRIPTION

[0034] Exemplary embodiments of the present application will be described in greater detail below with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it is understood that the present application can be embodied in various forms and should not be limited by the embodiments set forth herein.

[0035] Figure 1 A flowchart of an embodiment of an electronic component dispensing and reinforcing method provided by the present application is shown. As shown in Figure 1 , the method comprises the following steps:

[0036] S1, four corners of a shell of an electronic component and at least two symmetrically distributed preset positions on a bottom of the shell are determined as target point positions.

[0037] In the present embodiment, the electronic component is by default a digital signal processor, specifically a multi-lead ceramic four-side lead flat package digital signal processor, which can also be adjusted according to actual needs, without limitation. The electronic component includes a shell and a PCB (printed circuit board), and the PCB of the electronic component is connected to the shell through positioning holes provided at the four corners. The electronic component in the present embodiment can be applied to fields such as aerospace, military equipment, and high-speed communication.

[0038] The at least two symmetrically distributed preset positions include a center point position on the bottom of the shell and preset point positions symmetrically distributed on the edges of the middle region of the bottom of the shell. It should be noted that the middle region of the bottom is by default the region formed by the center point positions of the bottom to the midpoints of the four corners of the shell, which can also be adjusted according to actual conditions, without limitation. As shown in Figure 2 and Figure 3 , the electronic component includes a total of nine target point positions, i.e., the four corners of the shell, one center point position on the bottom of the shell, and four preset point positions on the edges of the middle region of the bottom of the shell.

[0039] S2, layer-by-layer dispensing and reinforcing is performed between the PCB and each target point position to obtain the electronic component after dispensing and reinforcing.

[0040] The process of layer-by-layer dispensing and reinforcing is as follows: a high-elasticity buffer adhesive layer is first coated on the contact surface of the target point position and the PCB, and after the high-elasticity buffer adhesive layer is cured, a rigid support adhesive layer is coated on the outer surface of the high-elasticity buffer adhesive layer. The thickness of the high-elasticity buffer adhesive layer is 0.2-0.5 mm, and the thickness of the rigid support adhesive layer is 0.8-1.2 mm.

[0041] In an alternative manner, S2 comprises:

[0042] In an alternative manner, S2 comprises:

[0043] The first channel of the double-channel dispensing equipment outputs high-elasticity glue with a temperature in the first temperature range to form a high-elasticity buffer glue layer, and the second channel of the double-channel dispensing equipment outputs rigid glue with a temperature in the second temperature range to form a rigid support glue layer in a manner of covering the high-elasticity buffer glue layer. The dispensing material of the double-channel dispensing equipment is silica gel or epoxy glue, the elastic modulus of the high-elasticity buffer glue layer is less than that of the rigid support glue layer, and a gradient modulus transition interface is formed between the two glue layers. The first temperature range is 25-35℃, and the second temperature range is 45-60℃. It should be noted that, in addition to silica gel and epoxy glue, the dispensing material of the first channel of the double-channel dispensing equipment can also be silicone rubber with an elastic modulus of 0.5-0.8MPa, and the dispensing material of the second channel of the double-channel dispensing equipment can also be carbon fiber reinforced epoxy resin with an elastic modulus of 2.5-3.5GPa. The dispensing material can also be adjusted according to actual conditions, which is not limited here.

[0044] Specifically: ① the first channel of the double-channel dispensing equipment outputs high-elasticity glue to the contact surface of the target point and the PCB board and controls the glue temperature to be 25-35℃, so as to coat a high-elasticity buffer glue layer with a thickness of 0.2-0.5mm on the contact surface; ② after the high-elasticity buffer glue layer is cured, the second channel of the double-channel dispensing equipment outputs rigid glue to the outer surface of the high-elasticity buffer glue layer and heats it to 45-60℃ to reduce the viscosity, and then forms a rigid support glue layer with a thickness of 0.8-1.2mm in a manner of covering the high-elasticity buffer glue layer.

[0045] It should be noted that the double-channel dispensing equipment includes two independently controlled channels for conveying different glues (high-elasticity glue and rigid glue), each channel is equipped with an independent metering pump, a glue barrel and a temperature control module, which ensures that the two glues maintain the preset temperature when output. Each channel is integrated with a temperature adjusting device (such as a heater or a cooler) to independently control the temperature according to the viscosity characteristics of different glues.

[0046] It should be noted that the glue amount of the dispensing reinforcement refers to the accurate control of the glue amount of each target point by adjusting the pressure control system and the motion control system of the dispensing equipment to ensure the reinforcement effect. The glue amount, shape and position of the dispensing reinforcement can be adjusted according to actual needs, which is not limited here.

[0047] The technical solution of this embodiment can optimize the stress distribution of electronic components, reduce the risk of device failure due to stress concentration, and improve the reliability and stability of electronic components. Specifically, this embodiment uses preset positions symmetrically distributed at the four corners and bottom of the housing as target points, and combines a layered dispensing process to first coat a high-elasticity buffer adhesive layer and then cover it with a rigid support adhesive layer. This composite structure achieves optimized stress distribution and synergistic enhancement of mechanical performance. The elastic adhesive layer effectively absorbs vibration and impact energy and compensates for differences in thermal expansion, while the rigid adhesive layer provides stable support and inhibits housing deformation. The combination of the two forms a gradient mechanical transition, significantly reducing stress concentration at the pin roots and improving the fatigue resistance of the device under complex loads. At the same time, the symmetrically distributed reinforcement points construct a multi-directional support network, enhancing the overall connection rigidity between the housing and the PCB board, avoiding the risk of single-point failure, and improving the reliability and stability of electronic components.

[0048] Figure 4 A schematic diagram of an embodiment of an electronic component dispensing reinforcement system 200 provided by the present invention is shown. Figure 4 As shown, the system 200 includes: a processing module 210 and an operation module 220;

[0049] The processing module 210 is used to: determine at least two symmetrically distributed preset positions at the four corners of the housing of the electronic component and at the bottom of the housing as target points; wherein the PCB board of the electronic component is connected to the housing through positioning holes provided at the four corners;

[0050] The operation module 220 is used to: perform layered adhesive dispensing reinforcement between the PCB board and each target point to obtain the electronic components after adhesive dispensing reinforcement; wherein, the layered adhesive dispensing reinforcement process is as follows: first, a high elasticity buffer adhesive layer is applied to the contact surface between the target point and the PCB board, and after the high elasticity buffer adhesive layer is cured, a rigid support adhesive layer is covered on the outer surface of the high elasticity buffer adhesive layer.

[0051] In one alternative approach, the at least two symmetrically distributed preset positions include: the bottom center point of the housing and preset points symmetrically distributed at the edge of the bottom middle region of the housing.

[0052] In an alternative embodiment, the operating module 220 is specifically used for:

[0053] The double-channel dispensing equipment is used to carry out layer-by-layer dispensing reinforcement between the PCB and each target point, so as to obtain the electronic component after dispensing reinforcement; wherein the first channel of the double-channel dispensing equipment outputs high-elasticity glue with a temperature in a first temperature range, so as to form the high-elasticity buffer glue layer; the second channel of the double-channel dispensing equipment outputs rigid glue with a temperature in a second temperature range, so as to form the rigid support glue layer in a manner of covering the high-elasticity buffer glue layer.

[0054] In an alternative way, the dispensing material of the double-channel dispensing equipment is silica gel or epoxy glue, and the elastic modulus of the high-elasticity buffer glue layer is less than that of the rigid support glue layer.

[0055] In an alternative way, the first temperature range is 25-35℃, and the second temperature range is 45-60℃.

[0056] In an alternative way, the electronic component is a digital signal processor.

[0057] It should be noted that the beneficial effects of the electronic component dispensing reinforcement system 200 provided by the above embodiments are the same as those of the electronic component dispensing reinforcement method, and will not be repeated here. In addition, when the system provided by the above embodiments implements its functions, only the division of the above functional modules is exemplified, and in actual application, the above functions can be completed by different functional modules according to the needs, that is, the system is divided into different functional modules according to the actual situation to complete all or part of the above described functions. In addition, the system and method embodiments provided by the above embodiments belong to the same concept, and the specific implementation process is described in the method embodiments, which will not be repeated here.

[0058] In the specification provided herein, a large number of specific details are described. However, it can be understood that the embodiments of the application can be practiced without these specific details. Similarly, in order to simplify the application and help understand one or more of the various inventive aspects, in the above description of the exemplary embodiments of the application, various features of the embodiments of the application are sometimes grouped together into a single embodiment, figure, or description thereof. Among them, the claims following the detailed description are hereby expressly incorporated into the detailed description, wherein each claim itself is a separate embodiment of the application.

[0059] It should be noted that the above-mentioned embodiments illustrate rather than limit the application, and that those skilled in the art will be able to design many alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word 'comprising' does not exclude the presence of elements or steps other than those listed in a claim. The word 'a' or 'an' preceding an element does not exclude the presence of a plurality of such elements. The application can be implemented by means of both hardware and software, and any combination thereof. In a unitary claim, several devices, apparatuses or means can be listed, comprising means for carrying out a certain task. The use of the term'means' in a claim is intended to refer to a combination of devices, apparatuses or means for carrying out a task. The word 'first','second', 'third', etc. do not imply any order. The use of these terms is to be construed as an indication of particular embodiments. Steps in the above-described embodiments, unless otherwise specified, are not to be construed as necessarily limiting the order in which the steps are performed.

Claims

1. An electronic component dispensing reinforcement method, characterized by, The application relates to an electronic component and a manufacturing method thereof. Four corners of a shell of an electronic component and at least two symmetrically distributed preset positions of a bottom of the shell are determined as target points; wherein a PCB board of the electronic component is connected with the shell through positioning holes arranged at the four corners; the at least two symmetrically distributed preset positions include a center point of the bottom of the shell and four preset points symmetrically distributed at edges of a middle region of the bottom of the shell; A double-channel dispensing device is used to perform layered dispensing reinforcement between the PCB board and each target point to obtain the electronic component after dispensing reinforcement; wherein the layered dispensing reinforcement process is as follows: a first channel of the double-channel dispensing device is used to output high-elasticity glue to a contact surface of the target point and the PCB board and control the glue temperature to be 25-35 DEG C, so as to coat a high-elasticity buffer glue layer with a thickness of 0.2-0.5 mm on the contact surface; after the high-elasticity buffer glue layer is solidified, a second channel of the double-channel dispensing device is used to output rigid glue to an outer surface of the high-elasticity buffer glue layer and heat to 45-60 DEG C to reduce the viscosity, so as to form a rigid support glue layer with a thickness of 0.8-1.2 mm in a manner of covering the high-elasticity buffer glue layer.

2. The method of claim 1, wherein, The dispensing material of the double-channel dispensing device is silica gel or epoxy glue, and the elastic modulus of the high-elasticity buffer glue layer is smaller than that of the rigid support glue layer.

3. The electronic component dispensing method according to claim 1 or 2, wherein The electronic component is a digital signal processor.

4. An electronic component dispensing reinforcement system, characterized by, The application relates to an electronic component and a manufacturing method thereof. The processing module is used for determining four corners of a shell of an electronic component and at least two symmetrically distributed preset positions of a bottom of the shell as target points; wherein a PCB board of the electronic component is connected with the shell through positioning holes arranged at the four corners; the at least two symmetrically distributed preset positions include a center point of the bottom of the shell and four preset points symmetrically distributed at edges of a middle region of the bottom of the shell; The running module is used for using a double-channel dispensing device to perform layered dispensing reinforcement between the PCB board and each target point to obtain the electronic component after dispensing reinforcement; wherein the layered dispensing reinforcement process is as follows: a first channel of the double-channel dispensing device is used to output high-elasticity glue to a contact surface of the target point and the PCB board and control the glue temperature to be 25-35 DEG C, so as to coat a high-elasticity buffer glue layer with a thickness of 0.2-0.5 mm on the contact surface; after the high-elasticity buffer glue layer is solidified, a second channel of the double-channel dispensing device is used to output rigid glue to an outer surface of the high-elasticity buffer glue layer and heat to 45-60 DEG C to reduce the viscosity, so as to form a rigid support glue layer with a thickness of 0.8-1.2 mm in a manner of covering the high-elasticity buffer glue layer. The dispensing material of the double-channel dispensing device is silica gel or epoxy glue, and the elastic modulus of the high-elasticity buffer glue layer is smaller than that of the rigid support glue layer.

5. The electronic component dispensing and potting system of claim 4, wherein, ​

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