Power equipment and photovoltaic system

Abstract

The invention provides power equipment and a photovoltaic system, which are used for improving the heat dissipation performance of the power equipment and further improving the use reliability of the power equipment. The power equipment comprises a shell and a heat dissipation device, the shell is internally provided with a partition plate, the partition plate divides the shell into a first cavity and a second cavity, and the partition plate is provided with a first opening and a second opening which communicate the first cavity with the second cavity; a device to be cooled is arranged in the first cavity, an air inlet and an air outlet are formed in the second cavity, and the air inlet and the air outlet are oppositely arranged in the first direction; the heat dissipation device comprises a first fin arranged in the second cavity, a channel is formed in the first fin and penetrates through the first fin in the second direction, and the two ends of the channel communicate with the first opening and the second opening correspondingly; the minimum included angle between the second direction and the first direction is larger than 0 degree and smaller than or equal to 90 degrees.

Description

[0001] This application is a divisional application. The application number of the original application is 202211056306.X, the original application date is August 31, 2022, and the entire content of the original application is incorporated herein by reference. Technical Field

[0002] This application relates to the technical field of heat dissipation, and particularly to a power device and a photovoltaic system. Background Art

[0003] As the power of inverters increases, the heat generated by single boards, on-board components, and cables inside the inverter chassis also increases. Since thermosensitive components such as electrolytic capacitors are arranged inside the chassis, the temperature rise inside the chassis directly determines the performance of these components. Currently, the inverter chassis mainly relies on natural heat dissipation through the chassis wall to the outside. However, this heat dissipation method has limited heat dissipation capacity, resulting in ineffective cooling inside the chassis, thus affecting the lifespan and reliability of internal components, and further affecting the overall service life of the inverter. Summary of the Invention

[0004] This application provides a power device and a photovoltaic system to improve the heat dissipation performance of the power device and thus enhance the reliability of its use.

[0005] In a first aspect, this application provides a power device, which may include a housing and a heat dissipation device. A partition is provided inside the housing, and the partition can divide the housing into a first cavity and a second cavity. The partition is provided with a first opening and a second opening, and the first opening and the second opening respectively communicate the first cavity and the second cavity. A device to be cooled is arranged in the first cavity, and the second cavity is provided with an air inlet and an air outlet, and the air inlet and the air outlet can be oppositely arranged along a first direction. The heat dissipation device may include a first fin arranged in the second cavity, the surface of the first fin faces the partition, and a channel is arranged inside the first fin, and the channel can penetrate through the first fin along a second direction, and both ends of the channel can be respectively communicated with the first opening and the second opening. Among them, the minimum included angle between the first direction and the second direction is greater than 0° and less than or equal to 90°.

[0006] In the above solution, an air circulation loop can be formed between the inside of the first cavity and the channel of the first fin, so that the air in the first cavity can achieve heat exchange with the air flowing through the surface of the first fin during the cyclic flow process, thereby effectively improving the heat dissipation effect inside the first cavity, further reducing the risk of component failure inside the first cavity, and enhancing the reliability of the power device during use.

[0007] Exemplarily, the first direction can be the height direction of the power device, and the second direction can be the width direction of the power device.

[0008] In some possible embodiments, the number of the first fins may be multiple, and an air duct extending in the first direction may be formed between adjacent first fins, which helps to improve the heat exchange efficiency between the first fins and the air entering the second cavity, and thus can improve the heat dissipation effect on the interior of the first cavity.

[0009] In some possible embodiments, the heat dissipation device may further include a first flow guiding member and a second flow guiding member disposed in the second cavity. One end of the first flow guiding member is communicated with the first opening, and the other end is communicated with one end of the channel of the first fin. One end of the second flow guiding member is communicated with the second opening, and the other end is communicated with the other end of the channel of the first fin. In addition to communicating the channel of the first fin with the first cavity, the first flow guiding member and the second flow guiding member can also play a role in supporting and fixing the first fin, thereby improving the structural stability of the heat dissipation device.

[0010] In some possible embodiments, the device to be heat dissipated in the first cavity may include a first device to be heat dissipated, and the first device to be heat dissipated is disposed close to the partition. The heat dissipation device may further include a substrate and a plurality of second fins disposed in the second housing. The substrate is disposed on the partition, and the substrate is in thermal contact with the first device to be heat dissipated. The second fins are disposed on the side of the substrate away from the partition, and the second fins extend in a direction away from the partition. An air duct extending in the first direction may be formed between adjacent two second fins. The heat generated when the first device to be heat dissipated works can be transferred to the substrate, and then transferred to the second fins through the substrate, and further transferred to the air flowing through the surface of the second fins by the second fins, so as to realize the heat dissipation of the first device to be heat dissipated.

[0011] Exemplarily, the first device to be heat dissipated may specifically be a power device.

[0012] In some possible embodiments, the first fins may be disposed on the side of each second fin away from the substrate at the free end, so as to improve the structural compactness of the heat dissipation device.

[0013] In some other possible embodiments, the plurality of second fins may be divided into a first part and a second part. Along the direction away from the substrate, the height of the second fins in the first part is less than the height of the second fins in the second part. At this time, the first fins may be disposed on the side of each second fin away from the substrate at the free end in the first part. This design can also improve the compactness of the heat dissipation device.

[0014] In some possible embodiments, the projection of the outer contour of the substrate on the partition surface may be located between the first opening and the second opening. Alternatively, the area enclosed by the projection of the outer contour of the substrate on the partition surface may cover the first opening and the second opening. In this case, a first avoidance hole and a second avoidance hole may be respectively provided at positions of the substrate corresponding to the first opening and the second opening. The end of the first flow guiding member may pass through the first avoidance hole to communicate with the first opening, and the second flow guiding member may pass through the second avoidance hole to communicate with the second opening. This design can increase the area of the substrate, thereby facilitating the improvement of the heat dissipation effect on the first device to be cooled.

[0015] In some possible embodiments, an opening may be provided at a position on the partition corresponding to the first device to be cooled, and the first device to be cooled may extend into the opening to be in thermal contact with the substrate. This can improve the heat exchange efficiency between the first device to be cooled and the heat dissipation device, and further contribute to the improvement of the heat dissipation effect on the first device to be cooled.

[0016] In some possible embodiments, the heat dissipation device may further include a first fan disposed in the second cavity. The air inlet side of the first fan is arranged towards the air inlet, and the air outlet side of the first fan is arranged towards the air outlet. This can increase the air flow rate in the second cavity, and thus improve the heat dissipation effect of the heat dissipation device.

[0017] In some possible embodiments, the devices to be cooled in the first cavity may further include a second device to be cooled and a third device to be cooled. The heat dissipation device further includes a second fan disposed in the first cavity. The second device to be cooled may be disposed between the first opening and the air inlet side of the second fan, and the third device to be cooled may be disposed between the air outlet side of the second fan and the second opening, and the third device to be cooled is located on the side of the first device to be cooled away from the partition. After the air cooled by heat exchange in the first fin enters the first cavity through the first opening, the low-temperature air may first pass through the second device to be cooled, exchange heat with the second device to be cooled, and then be blown by the second fan towards the third device to be cooled, so as to further exchange heat with the third device to be cooled, and then flow to the first fin through the second opening to complete a cycle, realizing the heat dissipation of each device to be cooled in the first cavity.

[0018] In some possible embodiments, the heat dissipation device may further include a third flow guiding member disposed in the first cavity. The third flow guiding member is communicated with the first opening, and a first air outlet is provided at a position of the third flow guiding member facing the third device to be cooled. The second device to be cooled is disposed in the third flow guiding member, the second fan is disposed at the first air outlet, and the air inlet side of the second fan is disposed opposite to the first air outlet. By providing the third flow guiding member, the second device to be cooled can be restricted in a relatively closed space, reducing the risk of air on the air outlet side of the second fan flowing back to the vicinity of the second device to be cooled, thereby contributing to further improving the heat dissipation effect on the second device to be cooled.

[0019] In some possible embodiments, the heat dissipation device may further include a third fan and a fourth flow guiding member disposed in the first cavity. The fourth flow guiding member is in communication with the second opening, and the fourth flow guiding member is provided with a second air outlet facing the third device to be heat dissipated. The third fan may be disposed at the second air outlet, and the air inlet side of the third fan faces the third device to be heat dissipated, and the air outlet side of the third fan is disposed opposite to the second air outlet. The arrangement of the third fan and the fourth flow guiding member can further reduce the risk of air flowing back to the vicinity of the second device to be heat dissipated, which helps to improve the reliability of use of the second device to be heat dissipated.

[0020] Exemplarily, the second device to be heat dissipated may specifically be an electrolytic capacitor board, and the third device to be heat dissipated may specifically be an output board.

[0021] In some possible embodiments, a fourth device to be heat dissipated may further be disposed in the second cavity. The fourth device to be heat dissipated may be disposed on the side of the first fin facing the air outlet. Exemplarily, the fourth device to be heat dissipated may be a magnetic device. Since the protection requirements for magnetic devices are relatively low, disposing it downstream of the heat dissipation path can also achieve a certain heat dissipation effect on it and ensure its normal operation.

[0022] In a second aspect, the present application further provides a photovoltaic system, which may include a battery panel and a power device in any of the possible embodiments of the first aspect described above. Among them, the battery panel can be used to convert solar energy into electrical energy, and the power device can be used to perform power conversion on the current from the battery panel or perform power conversion on the voltage from the battery panel, so that the output power of the photovoltaic system matches the power of external electrical equipment. Since the power device has good heat dissipation performance, the reliability of the photovoltaic system is also improved. Description of the Drawings

[0023] Figure 1 A side cross-sectional view of a power device provided by an embodiment of the present application;

[0024] Figure 2 is Figure 1 A cross-sectional view of the power device shown in in a top view state;

[0025] Figure 3 is Figure 1 A partial structural schematic diagram of the heat dissipation device shown in ;

[0026] Figure 4 A side cross-sectional view of another power device provided by an embodiment of the present application;

[0027] Figure 5 is Figure 4 A cross-sectional view of the power device shown in in a top view state;

[0028] Figure 6 The Figure 4 first cavity of the power device shown in

[0029] Figure 7 a cross-sectional view of another power device provided by an embodiment of the present application in a top view state;

[0030] Figure 8 The Figure 7 first cavity of the power device shown in

[0031] Figure 9 a cross-sectional view of another power device provided by an embodiment of the present application in a top view state;

[0032] Figure 10 The Figure 9 first cavity of the power device shown in

[0033] Figure 11 a cross-sectional view of another power device provided by an embodiment of the present application in a top view state;

[0034] Figure 12 The Figure 11 first cavity of the power device shown in

[0035] Figure 13 a side cross-sectional view of another power device provided by an embodiment of the present application;

[0036] Figure 14 The Figure 13 cross-sectional view of the power device shown in

[0037] Figure 15 The Figure 14 partial structural schematic diagram of the heat dissipation device shown in

[0038] Figure 16 a side cross-sectional view of another power device provided by an embodiment of the present application;

[0039] Figure 17 The Figure 16 cross-sectional view of the power device shown in

[0040] Figure 18 The Figure 16 partial structural schematic diagram of the heat dissipation device shown in

[0041] Figure 19 a side cross-sectional view of another power device provided by an embodiment of the present application;

[0042] Figure 20 is Figure 19 a cross-sectional view of the power device shown in the top view;

[0043] Figure 21 is Figure 19 a partial structural schematic diagram of the heat dissipation device shown in;

[0044] Figure 22 a side cross-sectional view of another power device provided by an embodiment of the present application;

[0045] Figure 23 is Figure 22 a cross-sectional view of the power device shown in the top view;

[0046] Figure 24 is Figure 22 a partial structural schematic diagram of the heat dissipation device shown in.

[0047] Reference numerals:

[0048] 100 - power device;

[0049] 110 - housing; 111 - partition; 1111 - first opening; 1112 - second opening; 1101 - first side wall; 1102 - second side wall;

[0050] 1103 - third side wall; 1104 - fourth side wall; 1105 - fifth side wall; 1106 - sixth side wall; 112 - first cavity;

[0051] 113 - second cavity; 1131 - air inlet; 1132 - air outlet;

[0052] 120 - heat dissipation device; 121 - first fin; 122 - first fan; 123 - first flow guiding member; 124 - second flow guiding member;

[0053] 125 - substrate; 1251 - first avoidance hole; 1252 - second avoidance hole; 126, 1261, 1262 - second fins;

[0054] 127 - second fan; 128 - third flow guiding member; 129 - third fan; 1210 - fourth flow guiding member; 1211 - mounting plate;

[0055] 1212 - first support member; 1213 - second support member; 131 - first device to be heat dissipated, power device; 132 - power board;

[0056] 133 - second device to be heat dissipated, electrolytic capacitor board; 134 - third device to be heat dissipated, output board;

[0057] 135 - electrolytic capacitor; 136 - fourth device to be heat dissipated. DETAILED DESCRIPTION

[0058] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as being limited to the embodiments described herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated descriptions will be omitted. The words expressing position and direction described in the embodiments of the present application are all illustrated by taking the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings of the embodiments of the present application are only used to illustrate the relative position relationship and do not represent the true proportion.

[0059] It should be noted that specific details are described in the following description to facilitate understanding of the present application. However, the present application can be implemented in a variety of other ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present application. Therefore, the present application is not limited to the specific implementation methods disclosed below.

[0060] The photovoltaic system is a power generation system that uses the photovoltaic effect of semiconductor materials to convert solar energy into electrical energy. Photovoltaic systems usually consist of panels and power devices, where the panels can be used to convert solar energy into electrical energy, and the power devices are used to convert the current from the panels, or can also be used to convert the voltage from the panels, so that the output power of the photovoltaic system matches the power of external electrical equipment. Exemplarily, power devices include but are not limited to inverters, rectifiers, choppers, etc. As the power of power devices increases, the heat generated by components such as single boards, on-board components, and cables inside the chassis of the power equipment also increases, resulting in an increase in the temperature inside the chassis, which is very unfavorable for the components installed inside the chassis, especially some heat-sensitive devices, which have a significantly increased risk of failure under the influence of continuous high temperatures.

[0061] At present, the chassis of power equipment mainly moves the chassis wall to dissipate heat naturally outward. However, the heat dissipation effect of this heat dissipation method is relatively limited, and the inside of the chassis cannot be effectively cooled. Therefore, the life and reliability of the components inside the chassis cannot be guaranteed, which in turn affects the overall service life of the power equipment.

[0062] In view of the above problems, the embodiments of the present application improve the heat dissipation method of the power device, thereby achieving effective heat dissipation inside the power device, thereby reducing the risk of failure of components inside the power device and improving the reliability of the power device. The power device provided in the embodiments of the present application is described in detail below in conjunction with the accompanying drawings.

[0063] For reference Figure 1 and Figure 2 As shown,Figure 1 A side cross-sectional view of a power device 100 provided by an embodiment of the present application Figure 2 is Figure 1 a cross-sectional view of the power device 100 shown in when viewed from above. In this embodiment, the power device 100 may include a housing 110 and a heat dissipation device. A partition 111 may be provided inside the housing 110, and the partition 111 divides the housing 110 into two cavities, namely a first cavity 112 and a second cavity 113. Among them, the first cavity 112 may be a closed cavity, and the second cavity 113 may be a ventilation cavity. In this way, components in the power device 100 with relatively high requirements for waterproof, dustproof, or corrosion protection performance can be arranged in the first cavity 112, while components without such protection requirements or with relatively low protection requirements can be arranged in the second cavity 113.

[0064] Exemplarily, the housing 110 may be generally in a cuboid structure, including a first side wall 1101, a second side wall 1102, a third side wall 1103, a fourth side wall 1104, a fifth side wall 1105, and a sixth side wall 1106. Among them, the first side wall 1101 and the second side wall 1102 may be oppositely arranged along a first direction, the third side wall 1103 and the fourth side wall 1104 may be oppositely arranged along a second direction, and the fifth side wall 1105 and the sixth side wall 1106 may be oppositely arranged along a third direction. Among them, the minimum included angle between the first direction and the second direction may be greater than 0° and less than or equal to 90°, the minimum included angle between the second direction and the third direction may be greater than 0° and less than or equal to 90°, and the minimum included angle between the first direction and the third direction may be greater than 0° and less than or equal to 90°.

[0065] As an embodiment of the present application, the first side wall 1101 is the bottom wall of the power device, the second side wall 1102 is the top wall of the power device, the fifth side wall 1105 is the front side wall of the power device, and the sixth side wall 1106 is the rear side wall of the power device. At this time, the first direction, the second direction, and the third direction may be the height direction, the width direction, and the length direction of the power device 100 respectively, and these three directions are perpendicular to each other in pairs. Along the first direction, both ends of the partition 111 may be connected to the first side wall 1101 and the second side wall 1102 respectively. At this time, the formed first cavity 112 and second cavity 113 are arranged along the third direction. Air inlets 1131 and air outlets 1132 may be respectively provided at positions of the first side wall 1101 and the second side wall 1102 corresponding to the second cavity 113, and the air inlets 1131 and the air outlets 1132 are opposite in position, so as to enable the second cavity 113 to achieve the ventilation function.

[0066] Referring together to Figure 1 、 Figure 2 and Figure 3 , Figure 3 is Figure 1Partial structural schematic diagram of the heat dissipation device 120 shown in the figure. The heat dissipation device 120 may include a first fin 121 located in the second cavity, and the first fin 121 is arranged facing the partition 111. Exemplarily, a channel may be provided inside the first fin 121, and the channel may penetrate the first fin 121 along the second direction. At this time, a first opening 1111 and a second opening 1112 may be provided on the partition 111, and the first opening 1111 and the second opening 1112 communicate the first cavity 112 and the second cavity 113 respectively. One end of the channel of the first fin 121 may communicate with the first opening 1111, and the other end of the channel of the first fin 121 may communicate with the second opening 1112. In this way, an air circulation loop may be formed between the inside of the first cavity 112 and the channel of the first fin 121, so that the air between the two can circulate. When the high-temperature air in the first cavity 112 enters the channel of the first fin 121, it can exchange heat with the low-temperature air flowing through the surface of the first fin 121 in the second cavity 113. The air in the second cavity 113 is discharged from the air outlet 1132 after heat exchange and temperature rise, while the air in the first fin 121 returns to the inside of the first cavity 112 again after heat exchange and temperature drop, thereby realizing the heat dissipation of the inside of the first cavity 112.

[0067] It can be seen from the above description that compared with the prior art method of natural heat dissipation through the cavity wall surface, the embodiment of the present application can realize the circulating flow heat dissipation of the air inside the first cavity 112 while meeting the design requirements of the relevant protection performance of the power device 100, thereby effectively improving the heat dissipation effect of the inside of the first cavity 112, and further reducing the risk of component failure inside the first cavity 112 and improving the use reliability of the power device 100.

[0068] In some embodiments, the number of the first fins 121 may be multiple, and a channel extending along the first direction may be formed between two adjacent first fins 121. That is to say, the air duct direction formed between two adjacent first fins 121 is consistent with the ventilation direction of the second cavity 113, which helps to improve the heat exchange efficiency between the first fins 121 and the air entering the second cavity 113, and further improves the heat dissipation effect of the inside of the first cavity 112. Exemplarily, the multiple first fins 121 may be arranged along the third direction, that is, the multiple first fins 121 may be arranged away from the partition 111 in sequence.

[0069] In addition, the heat dissipation device may further include a first fan 122 (see attached Figure 1) The first fan 122 is disposed in the second cavity 113, and the air inlet side of the first fan 122 faces the air inlet 1131, and the air outlet side of the first fan 122 faces the air outlet 1132, so as to send air to the side of the air outlet 1132, thereby improving the air circulation rate in the second cavity 113, and further improving the heat dissipation effect of the heat dissipation device. Exemplarily, the first fan 122 may be located at one end close to the first side wall 1101, or may also be located at one end close to the second side wall 1102, and the present application does not limit this.

[0070] When connecting the channels of the first fins 121 with the first cavity 112, the heat dissipation device 120 may further include a first guiding member 123 and a second guiding member 124. Both the first guiding member 123 and the second guiding member 124 are disposed in the second cavity 113. One end of the first guiding member 123 is connected to the first opening 1111, and the other end can be connected to one end of each of the first fins 121. One end of the second guiding member 124 is connected to the second opening 1112, and the other end is connected to the other end of each of the first fins 121. In this embodiment, in addition to connecting the channels of the first fins 121 with the inside of the first cavity 112, the first guiding member 123 and the second guiding member 124 can also play a role in supporting and fixing the first fins 121, thereby improving the structural stability of the heat dissipation device 120.

[0071] At the end where the first guiding member 123 is connected to the first opening 1111, the first guiding member 123 can be fixed at the first opening 1111 of the partition 111 by welding, or can also be disposed in the first opening 1111 by means of plugging or other assembly methods, and the present application does not limit this. It should be noted that when the first guiding member 123 is plugged into the first opening 1111, a sealing ring can also be provided between the outer wall of the first guiding member 123 and the inner wall of the first opening 1111 to reduce the risk of air leakage from the first cavity 112 through the first opening 1111. At the end where the first guiding member 123 is connected to the channels of the first fins 121, the first guiding member 123 can be provided with openings corresponding to a plurality of first fins 121 one by one, and each of the first fins 121 can be connected to the corresponding opening by welding or plugging. Similarly, when the first fin 121 is plugged into the opening, a sealing ring can be squeezed between the outer wall of the first fin 121 and the inner wall of the opening to reduce the risk of air leakage at the opening. The connection manners of the second guiding member 124 with the second opening 1112 and each of the first fins 121 can be set with reference to the first guiding member 123, and details are not described herein again.

[0072] In a specific embodiment, the first opening 1111 and the second opening 1112 may be arranged along the second direction. At this time, the first flow guiding member 123 and the second flow guiding member 124 are arranged opposite to each other along the second direction, so as to reduce the obstruction to the air flow in the second cavity 113, and enable the air entering the second cavity 113 to smoothly flow into the air ducts formed by the adjacent first fins 121.

[0073] Please continue to refer to Figure 1 、 Figure 2 and Figure 3 , in some embodiments, the heat dissipation device may further include a substrate 125 and second fins 126. Among them, the substrate 125 may be disposed on the partition 111, and the second fins 126 may be disposed on the side of the substrate 125 facing away from the partition 111, and the second fins 126 extend in a direction away from the substrate 125. Exemplarily, the second fins 126 may be a solid thin sheet structure. In one implementation, the device disposed in the first cavity 112 may include a first device to be heat dissipated 131, which is disposed close to the partition 111 and may be in thermal contact with the substrate 125 located in the second cavity 113, so as to transfer the heat generated during its operation to the substrate 125, and further transfer it to the second fins 126 through the substrate 125. In this way, the external air enters the second cavity 113 through the air inlet 1131, and is discharged from the air outlet 1132 after exchanging heat with the second fins 126, thereby taking away the heat of the second fins 126, and thus the heat dissipation of the first device to be heat dissipated 131 can be realized.

[0074] In some embodiments, the first device to be heat dissipated 131 may be attached to the surface of the partition 111 facing the first cavity 112. At this time, the first device to be heat dissipated 131 and the substrate 125 may be indirectly in thermal contact through the partition 111.

[0075] In some other embodiments, a through hole may be formed in the partition 111 corresponding to the position of the first device to be heat dissipated 131. At this time, the first device to be heat dissipated 131 may at least partially extend into the through hole to achieve direct thermal contact with the substrate 125, which can improve the heat exchange efficiency between the first device to be heat dissipated 131 and the heat dissipation device, and further contribute to improving the heat dissipation effect on the first device to be heat dissipated 131.

[0076] Exemplarily, the first device to be cooled 131 may be a power device. It should be noted that the reference numerals of the power devices hereinafter are the same as those of the first device to be cooled 131. Since the heat generated when the power device 131 operates is relatively large, part of the heat generated can be dissipated into the first cavity 112 and dissipated outward through the first fins 121 communicating with the first cavity 112, and the other part of the heat can be dissipated outward by the second fins 126 in the above-mentioned thermally conductive contact manner, thereby enhancing the heat dissipation effect of the power device 131 and improving the operating reliability of the power device 131.

[0077] In one implementation, the power device 100 may further include a power board 132 disposed in the first cavity 112. The power board 132 may be disposed substantially parallel to the partition 111. The power device 131 may be specifically disposed on the side of the power board 132 facing the partition 111. In addition, the number of power devices 131 may be one or more, and the present application does not limit this. When there are multiple power devices 131, through holes may be respectively disposed at positions corresponding to each power device 131 on the partition 111, so that each power device 131 can dissipate heat through direct thermal contact. Of course, in addition to the power devices 131, other electronic components, such as capacitors, may also be disposed on the power board 132. These electronic components may be disposed on the side of the power board 132 facing the partition 111 or on the side of the power board 132 facing away from the partition 111, and the present application also does not limit this.

[0078] In this embodiment, the projection of the outer contour of the substrate 125 on the surface of the partition 111 may be located between the first opening 1111 and the second opening 1112. Or it can be understood that the projection of the line forming the outer edge of the substrate 125 on the surface of the partition 111 may be located between the first opening 1111 and the second opening 1112. At this time, the first flow guiding member 123 and the second flow guiding member 124 may be respectively located on both sides of the substrate 125 along the second direction. In addition, the number of the second fins 126 may be multiple, and the multiple second fins 126 may be arranged along the second direction. At this time, a channel extending along the first direction may be formed between adjacent second fins 126. That is to say, the air duct direction formed between adjacent second fins 126 is consistent with the ventilation direction of the second cavity 113, which helps to improve the heat exchange efficiency between the second fins 126 and the air entering the second cavity 113, and further improves the heat dissipation effect on the first device to be cooled 131.

[0079] Continue to refer to Figure 1 、 Figure 2 and Figure 3, in a specific embodiment, the first fins 121 may be disposed on a side of the free end of each of the plurality of second fins 126 away from the substrate 125. Herein, the free end of the second fin 126 can be understood as the end of the second fin 126 away from the substrate. Exemplarily, the projections of the plurality of first fins 121 on the surface of the substrate 125 and the projections of the plurality of second fins 126 on the surface of the substrate 125 may overlap. With this design, on the one hand, the structural compactness of the heat dissipation device 120 can be improved, and the occupied space thereof in the power device 100 can be reduced. On the other hand, in the ventilation direction of the second cavity 113, the first fins 121 and the second fins 126 are substantially at the same height. Therefore, the low-temperature air entering the second cavity 113 from the air inlet 1131 can pass through the first fins 121 and the second fins 126 approximately synchronously, so that the temperatures of the two sets of fins can be independent of each other, which helps to improve the heat dissipation effect of the heat dissipation device.

[0080] Referring jointly to Figure 4 and Figure 5 as shown in Figure 4 FIG. is a side cross-sectional view of another power device 100 provided by an embodiment of the present application. Figure 5 is Figure 4 a cross-sectional view of the power device 100 shown in

[0081] After the air that has been cooled through heat exchange inside the first fin 121 enters the first cavity 112 through the first opening 1111, the low-temperature air can first pass through the second device to be heat-dissipated 133, exchange heat with the second device to be heat-dissipated 133, and then be blown by the second fan 127 towards the third device to be heat-dissipated 134, so as to further exchange heat with the third device to be heat-dissipated 134. After that, it flows from the second opening 1112 into the first fin 121 to complete one cycle. Through this setting, the position of the devices to be heat-dissipated in the first cavity 112 can be arranged according to the heat-dissipation priority or heat generation amount of the devices to be heat-dissipated in the first cavity 112. For example, the device with a relatively higher heat-dissipation priority can be placed upstream of the device with a relatively lower heat-dissipation priority, or the device with a relatively smaller heat generation amount can be placed upstream of the device with a relatively larger heat generation amount to ensure the heat-dissipation effect on each device to be heat-dissipated.

[0082] Exemplarily, the second device to be heat-dissipated 133 can be an electrolytic capacitor board, and the third device to be heat-dissipated 134 can be an output board. It should be noted that the label of the electrolytic capacitor board in the following text is the same as the label of the second device to be heat-dissipated 133, and the label of the output board is the same as the label of the third device to be heat-dissipated 134. One or more electrolytic capacitors 135 can be arranged on the electrolytic capacitor board 133, and devices such as relays, common-mode inductors, and capacitors can be arranged on the output board 134. The heat generation amount of the electrolytic capacitor 135 is relatively small. Therefore, it is arranged upstream of the heat-dissipation loop. The low-temperature air entering the first cavity 112 through the first opening 1111 can still be at a relatively low temperature after exchanging heat with it, so that it can still achieve a good heat-dissipation effect on other devices downstream. And since the electrolytic capacitor 135 is a thermosensitive device, placing it at the first opening 1111 can also reduce the risk of the electrolytic capacitor 135 failing due to high temperature, thereby improving the overall reliability of the power device 100.

[0083] In some embodiments, the heat-dissipation device may further include a third flow-guiding member 128. The third flow-guiding member 128 is arranged in the first cavity 112, and one end of the third flow-guiding member 128 can be communicated with the first opening 1111. A first air outlet (not shown in the figure) is arranged at the position of the third flow-guiding member 128 facing the third device to be heat-dissipated 134. At this time, the second device to be heat-dissipated 133 can be arranged in the third flow-guiding member 128, and the second fan 127 can be arranged at the first air outlet of the third flow-guiding member 128, and the air inlet side of the second fan 127 faces the first air outlet to blow the air in the third flow-guiding member 128 towards the third device to be heat-dissipated 134. By arranging the third flow-guiding member 128, the second device to be heat-dissipated 133 can be restricted in a relatively enclosed space, reducing the risk of the air on the air outlet side of the second fan 127 flowing back to the vicinity of the second device to be heat-dissipated 133, thereby helping to further improve the heat-dissipation effect on the second device to be heat-dissipated 133.

[0084] Figure 6 is Figure 4 a cross-sectional view of the first cavity 112 of the power device 100 shown in

[0084] in a plane perpendicular to the third direction. Referring also to Figures 4 to 6 , in this embodiment, the second device to be cooled 133 may be arranged substantially parallel to the third device to be cooled 134. When the second device to be cooled 133 is an electrolytic capacitor board and the third device to be cooled 134 is an output board, the electrolytic capacitor board 133, the output board 134, and the power board 132 may be parallel to each other, and the output board 134 is located on the side of the power board 132 away from the partition 111.

[0085] Referring also to Figure 7 and Figure 8 shown in Figure 7 is a cross-sectional view of another power device 100 provided by an embodiment of the present application in a top view state, Figure 8 is Figure 7 a cross-sectional view of the first cavity 112 of the power device 100 shown in

[0084] in a plane perpendicular to the third direction. In this embodiment, the heat dissipation device of the power device 100 may be arranged with reference to the embodiment shown in Figures 4 to 6 . The difference is that in this embodiment, the second device to be cooled 133 and the third device to be cooled 134 may be arranged substantially perpendicular to each other. When the second device to be cooled 133 is an electrolytic capacitor board and the third device to be cooled 134 is an output board, the electrolytic capacitor board 133 may be arranged parallel to the first direction, and the output board 134 may still be located on the side of the power board 132 away from the partition 111 and be parallel to the power board 132.

[0086] Referring also to Figure 9 and Figure 10 shown in Figure 9 is a cross-sectional view of another power device 100 provided by an embodiment of the present application in a top view state, Figure 10 is Figure 9A cross-sectional view of the first cavity 112 of the power device 100 shown in the figure, taken perpendicular to the third direction. In this embodiment, the heat dissipation device may further include a third fan 129 and a fourth flow guiding member 1210. Both the third fan 129 and the fourth flow guiding member 1210 may be disposed within the first cavity 112 and are arranged near the second opening 1112. One end of the fourth flow guiding member 1210 may communicate with the second opening 1112, and a second air outlet (not shown in the figure) may be provided at a position of the fourth flow guiding member 1210 facing the third device to be heat dissipated 134. The third fan 129 may be disposed at the second air outlet, and the air inlet side of the third fan 129 faces the third device to be heat dissipated 134, and the air outlet side of the third fan 129 is opposite to the second air outlet, so as to send the high-temperature air after heat exchange with the third device to be heat dissipated 134 into the fourth flow guiding member 1210, and further flow through the channel of the first fin 121 by the fourth flow guiding member 1210 for heat exchange and cooling.

[0087] In a specific embodiment, the third fan 129 and the second fan 127 may be respectively arranged on two sides of the first cavity 112 along the second direction. At this time, the fourth flow guiding member 1210 and the third flow guiding member 128 are also arranged opposite to each other substantially along the second direction. On the one hand, the solution of this embodiment can improve the air flow rate within the first cavity 112, and further achieve the purpose of improving the heat dissipation efficiency of each device to be heat dissipated within the first cavity 112. On the other hand, the arrangement of the third fan 129 and the fourth flow guiding member 1210 can further reduce the risk of air flowing back to the vicinity of the second device to be heat dissipated 133, which helps to improve the service reliability of the second device to be heat dissipated 133.

[0088] In addition, in this embodiment, the second device to be heat dissipated 133 and the third device to be heat dissipated 134 may be arranged substantially parallel to each other. When the second device to be heat dissipated 133 is an electrolytic capacitor board and the third device to be heat dissipated 134 is an output board, the electrolytic capacitor board 133, the output board 134, and the power board 132 may be parallel to each other, and the output board 134 is located on a side of the power board 132 away from the partition board.

[0089] Of course, in some other embodiments, reference may also be made to Figure 7 and Figure 8 shown in the figure, so that the second device to be heat dissipated and the third device to be heat dissipated are arranged substantially perpendicular to each other. When the second device to be heat dissipated is an electrolytic capacitor board and the third device to be heat dissipated is an output board, the electrolytic capacitor board may be arranged parallel to the first direction, and the output board may still be located on a side of the power board away from the partition board and parallel to the power board.

[0090] Referring also to Figure 11 and Figure 12 shown in the figure, Figure 11 is a cross-sectional view of another power device 100 provided by an embodiment of the present application in a top view state, Figure 12For Figure 11 A cross-sectional view of the first cavity 112 of the power device 100 shown in FIG. perpendicular to the third direction. Compared with the foregoing Figures 9 to 10 embodiment shown, in this embodiment, the third flow guiding member is omitted. At this time, in order to facilitate the installation of the second fan 127, a mounting plate 1211 may be further provided in the first cavity 112. The mounting plate 1211 is disposed between the second device to be cooled 133 and the third device to be cooled 134, and a third air outlet (not shown in the figure) may be provided on the mounting plate 1211. At this time, the second device to be cooled 133 may be isolated in the space between the side wall of the housing and the mounting plate 1211. The second fan 127 is disposed at the third air outlet of the mounting plate 1211, and the air inlet side of the second fan 127 faces the third air outlet to blow the air between the side wall and the mounting plate 1211 toward the third device to be cooled 134. This solution can also reduce the risk that the air on the air outlet side of the second fan 127 flows back to the vicinity of the second device to be cooled 133, thereby helping to improve the heat dissipation effect on the second device to be cooled 133.

[0091] Similarly, in this embodiment, the second device to be cooled 133 and the third device to be cooled 134 may be disposed substantially parallel to each other. When the second device to be cooled 133 is an electrolytic capacitor board and the third device to be cooled 134 is an output board, the electrolytic capacitor board 133, the output board 134, and the power board 132 may be parallel to each other, and the output board 134 is located on the side of the power board 132 away from the partition board.

[0092] Of course, in some other embodiments, reference may also be made to Figure 7 and Figure 8 shown in the figure, so that the second device to be cooled and the third device to be cooled are disposed substantially perpendicular to each other. When the second device to be cooled is an electrolytic capacitor board and the third device to be cooled is an output board, the electrolytic capacitor board may be disposed parallel to the first direction, and the output board may still be located on the side of the power board away from the partition board and parallel to the power board.

[0093] Referring together to Figure 13 、 Figure 14 and Figure 15 shown, Figure 13 This is a side cross-sectional view of another power device 100 provided by the embodiment of the present application, Figure 14 For Figure 13 a cross-sectional view of the power device 100 shown in FIG. in a top view state, Figure 15 For Figure 14Partial structural schematic diagram of the heat dissipation device 120 shown in the figure. In this embodiment, the heat dissipation device 120 may also include structures such as a first fin 121, a substrate 125, a second fin 126, a first flow guiding member 123, a second flow guiding member 124, and a first fan 122. Different from the foregoing embodiments, a plurality of second fins 126 in this embodiment may be designed into two parts with different heights, namely a first part and a second part, and the two parts of the second fins 126 are arranged along a first direction. Among them, the height of the second fin 1261 located in the first part is less than the height of the second fin 1262 located in the second part. It should be noted that the height direction of the second fin 126 here can be understood as the direction away from the substrate 125, that is, the third direction defined above. At this time, the first fin 121 may be disposed on the side away from the substrate 125 at the free end of each second fin 1261 located in the first part. That is to say, the projections of the plurality of first fins 121 on the surface of the substrate 125 and the projections of the plurality of second fins 1261 located in the first part on the surface of the substrate 125 may overlap, and this design can also achieve the effect of improving the structural compactness of the heat dissipation device.

[0094] In addition, it should be noted that in this embodiment, the third flow guiding member, the fourth flow guiding member 1210, and the second fan and the third fan 129 may be selectively provided according to the heat dissipation requirements in the first cavity. Figure 14 Only the situation of disposing the fourth flow guiding member 1210 and the third fan 129 in the first cavity 112 is schematically shown in the figure.

[0095] Refer to Figure 16 、 Figure 17 and Figure 18 shown in the figure, Figure 16 is a side cross-sectional view of another power device 100 provided by an embodiment of the present application. Figure 17 is Figure 16 a cross-sectional view of the power device 100 shown in the figure in a top view state. Figure 18 is Figure 16Partial structural schematic diagram of the heat dissipation device 120 shown in the figure. In this embodiment, the heat dissipation device 120 can also include structures such as a first fin 121, a substrate 125, a second fin 126, a first flow guiding member 123, a second flow guiding member 124, and a first fan 122. Different from the foregoing embodiments, in this embodiment, the area enclosed by the projection of the outer contour of the substrate 125 on the partition surface can cover the first opening 1111 and the second opening 1112. In other words, the projection of the line forming the outer edge of the substrate 125 on the partition surface can cover the first opening 1111 and the second opening 1112. At this time, in order to connect the first flow guiding member 123 and the second flow guiding member 124 with the first cavity 112, the substrate 125 can be respectively provided with a first avoidance hole 1251 and a second avoidance hole 1252 at positions opposite to the first opening 1111 and the second opening 1112. Exemplarily, the end of the first flow guiding member 123 can pass through the first avoidance hole 1251 to communicate with the first opening 1111, and the end of the second flow guiding member 124 can pass through the second avoidance hole 1252 to communicate with the second opening 1112. This design can increase the area of the substrate 125, thereby facilitating the improvement of the heat dissipation effect on the first device to be cooled 131.

[0096] Refer to together Figure 19 、 Figure 20 and Figure 21 shown, Figure 19 Another side cross-sectional view of the power device 100 provided by the embodiment of the present application, Figure 20 is Figure 19 The cross-sectional view of the power device 100 shown in the figure in the top view state, Figure 21 is Figure 19 The partial structural schematic diagram of the heat dissipation device 120 shown in the figure. In this embodiment, the first fin 121 and the second fin 126 can adopt the Figure 12 and Figure 13 arrangement methods in the embodiments shown, different from the Figure 12 and Figure 13 embodiments shown, in this embodiment, the area enclosed by the projection of the outer contour of the substrate 125 on the partition surface can also cover the first opening 1111 and the second opening 1112, and the first avoidance hole 1251 and the second avoidance hole 1252 are respectively provided at positions on the substrate opposite to the first opening 1111 and the second opening 1112, so as to facilitate the connection of the first flow guiding member 123 and the second flow guiding member 124 with the first cavity 112.

[0097] Refer to together Figure 22 and Figure 23 shown, Figure 22 Another side cross-sectional view of the power device 100 provided by the embodiment of the present application, Figure 23 is Figure 22A cross-sectional view of the power device 100 shown in the top-down state Figure 24 is Figure 22 A partial structural schematic diagram of the heat dissipation device 120 shown in. In this embodiment, the heat dissipation device may include a first fin 121, a substrate 125, a second fin 126, and a first fan 122 structure. The positional relationship of each component can be referred to the description in the foregoing embodiments and will not be elaborated here. Different from the foregoing embodiments, in this embodiment, both the first fin 121 and the second fin 126 can adopt a solid thin sheet structure, and the first fin 121 is no longer in communication with the first cavity 112. At this time, the heat dissipation device may further include a first support member 1212 and a second support member 1213. The first support member 1212 and the second support member 1213 are oppositely arranged along the second direction in the second cavity 113, and one end of the first support member 1212 and the second support member 1213 are respectively fixedly connected to the substrate 125, and the other ends of the first support member 1212 and the second support member 1213 are respectively fixedly connected to both ends of each first fin 121, so as to support the first fin 121 on the side of the second fin 126 away from the substrate 125.

[0098] In this embodiment, after the heat generated by the first device to be cooled 131 during operation is transferred to the substrate 125, part of the heat can be directly transferred from the substrate 125 to the second fin 126, and another part of the heat can be transferred from the substrate 125 to the first support member 1212 and the second support member 1213, and further transferred from the first support member 1212 and the second support member 1213 to the first fin 121. When the external air enters the second cavity 113 through the air inlet 1131, it exchanges heat with the first fin 121 and the second fin 126 respectively, and finally is discharged from the air outlet 1132, thereby taking away the heat of the first fin 121 and the second fin 126. It can be seen that both the first fin 121 and the second fin 126 in this embodiment are used to dissipate heat from the first device to be cooled 131, so as to improve the heat dissipation effect on the first device to be cooled 131.

[0099] In addition, it should be noted that in the above embodiments, a fourth device to be cooled 136 may also be provided in the second cavity 113 of the power device 100. The fourth device to be cooled 136 may be provided on the side of the first fin 121 facing the air outlet 1132, that is, located downstream of the ventilation path of the second cavity 113. In this way, the low-temperature air entering the second cavity 113 can preferentially exchange heat with the first fin 121 and the second fin 126, so as to ensure the heat dissipation effect on the devices in the first cavity 112. And since the protection requirement of the fourth device to be cooled 136 is relatively low, setting it downstream of the heat dissipation path can also achieve a certain heat dissipation effect and ensure its normal operation. Exemplarily, the fourth device to be cooled 136 may be a magnetic device, such as an inductor.

[0100] It should be understood that in the embodiments of the present application, the devices provided in the first cavity are not limited to the first device to be heat-dissipated, the second device to be heat-dissipated, and the third device to be heat-dissipated mentioned above. Similarly, the devices provided in the second cavity are not limited to the fourth device to be heat-dissipated mentioned above. In actual applications, devices that match the specific type of the power device can be set, and details are not elaborated here.

[0101] The above are only the specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present application, and all of them should be covered by the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A power device (100), characterized in that, It comprises a housing (110) and a heat dissipation device (120), wherein: A partition (111) is arranged in the shell (110), the partition (111) divides the shell (110) into a first cavity (112) and a second cavity (113), and the partition (111) is provided with a first opening (1111) and a second opening (1112) for connecting the first cavity (112) with the second cavity (113); a heat dissipation device is arranged in the first cavity (112), and the second cavity (113) is provided with an air inlet (1131) and an air outlet (1132); The heat dissipation device (120) comprises a first fin (121) arranged in the second cavity (113); the surface of the first fin (121) faces the partition (111); a channel is arranged in the first fin (121); the channel penetrates the first fin (121) along the second direction; two ends of the channel are respectively connected to the first opening (1111) and the second opening (1112); The heat dissipation device in the first cavity (112) comprises a first heat dissipation device (131), and the first heat dissipation device (131) is arranged close to the partition (111); The heat dissipation device (120) further comprises a substrate (125) and a plurality of second fins (126); the substrate (125) is arranged on the partition, and the substrate (125) is in thermal contact with the first heat sink (131); the second fins (126) are arranged on a side of the substrate (125) away from the partition (111), and extend in a direction away from the partition (111); and an air duct extending in the first direction is formed between adjacent second fins (126); The minimum angle between the second direction and the first direction is greater than 0° and less than or equal to 90°.

2. The power device (100) according to claim 1, characterized in that, There are a plurality of first fins (121), and an air duct extending along the first direction is formed between adjacent first fins (121).

3. The power device (100) according to claim 1 or 2, characterized in that, The heat dissipation device (120) further comprises a first flow guiding component (123) and a second flow guiding component (124) which are arranged in the second cavity (113); one end of the first flow guiding component (123) is connected to the first opening (1111), and the other end is connected to one end of the channel; one end of the second flow guiding component (124) is connected to the second opening (1112), and the other end is connected to the other end of the channel.

4. The power device (100) according to claim 1, characterized in that, The first fin (121) is arranged on a side of a free end of each of the plurality of second fins (126) that is away from the base plate (125).

5. The power device (100) according to claim 1, characterized in that, The plurality of second fins (126) are divided into a first part and a second part, and along a direction away from the base plate (125), the height of the second fins (1261) located in the first part is smaller than the height of the second fins (1262) located in the second part; The first fin is disposed on a side of the free end of each of the second fins in the first portion away from the base plate.

6. The power device (100) according to any one of claims 1 to 5, characterized in that, The projection of the outer contour of the substrate (125) on the surface of the partition (111) is located between the first opening (1111) and the second opening (1112); or, The outer contour of the substrate (125) covers the first opening (1111) and the second opening (1112) in the area enclosed by the projection of the surface of the partition (111), and the substrate is provided with a first avoidance hole and a second avoidance hole at positions corresponding to the first opening (1111) and the second opening (1112), respectively.

7. The power device (100) according to any one of claims 1 to 6, characterized in that, The partition (111) is provided with an opening at a position corresponding to the first heat dissipation device (131), and the first heat dissipation device (131) extends into the opening to be in thermal contact with the substrate (125).

8. The power device (100) according to any one of claims 1 to 7, characterized in that, The heat dissipation device (120) further comprises a first fan (122) arranged in the second cavity (113), wherein the air inlet side of the first fan (122) is arranged toward the air inlet (1131), and the air outlet side of the first fan (122) is arranged toward the air outlet (1132).

9. The power device (100) according to any one of claims 1 to 7, characterized in that, The heat dissipation device in the first cavity (112) includes a second heat dissipation device (133) and a third heat dissipation device (134); The heat dissipation device (120) further comprises a second fan (127) arranged in the first cavity (112); the second heat dissipation device (133) is arranged between the first opening (1111) and the air inlet side of the second fan (127); the third heat dissipation device (134) is arranged between the air outlet side of the second fan (127) and the second opening (1112); and the third heat dissipation device (134) is located on a side of the first heat dissipation device (131) facing away from the partition (111).

10. The power device (100) according to claim 9, characterized in that, The heat dissipation device (120) further comprises a third flow guiding component (128) arranged in the first cavity (112), the third flow guiding component (128) being in communication with the first opening (1111), and the third flow guiding component (128) being provided with a first air outlet facing the third heat dissipation device (134); The second heat dissipation device (133) is arranged in the third air guide component (128), the second fan (127) is arranged at the first air outlet, and the air inlet side of the second fan (127) is arranged opposite to the first air outlet.

11. The power device (100) according to any one of claims 1 to 10, characterized in that, The heat dissipation device in the first cavity (112) comprises a third heat dissipation device (134), and the third heat dissipation device (134) is arranged between the first opening (1111) and the second opening (1112), and is located on a side of the first heat dissipation device (131) away from the partition (111); The heat dissipation device (120) further includes a third fan (129) and a fourth flow guiding member (1210) disposed in the first cavity (112). The fourth flow guiding member (1210) communicates with the second opening (1112), and the fourth flow guiding member (1210) is provided with a second air outlet facing the third device to be heat dissipated (134). The third fan (129) is disposed at the second air outlet. The air inlet side of the third fan (129) faces the third device to be heat dissipated (134), and the air outlet side of the third fan (129) is disposed opposite to the second air outlet.

12. The power device (100) according to any one of claims 9 to 11, characterized in that, The second device to be heat dissipated (133) is an electrolytic capacitor board; and / or the third device to be heat dissipated (134) is an output board.

13. The power device (100) according to any one of claims 1 to 12, characterized in that, A fourth device to be heat dissipated (136) is disposed in the second cavity (113), and the fourth device to be heat dissipated (136) is disposed on a side of the first fin (121) facing the air outlet (1132).

14. A photovoltaic system, characterized in that, Comprising a battery panel and the power device (100) according to any one of claims 1 to 13, the battery panel is configured to convert solar energy into electric energy, and the power device is configured to convert the current and / or voltage from the battery panel.

Images