Solar cell module and manufacturing method thereof

Abstract

The invention provides a solar cell module and a manufacturing method thereof, and relates to the technical field of solar cells. The solar cell module provided by the invention comprises a plurality of cell pieces, wherein each cell piece is provided with a conductive layer located on the surface of the cell piece and a conductive adhesive tape located on the conductive layer; the interconnection strip assembly is laid on the conducting layers of the battery pieces so as to be electrically connected with the battery pieces, the interconnection strip assembly comprises a main interconnection strip and a plurality of auxiliary interconnection strips connected with the main interconnection strip, the main interconnection strip is connected with the conducting layers through the conducting adhesive tape, and the auxiliary interconnection strips are connected with the conducting layers through the conducting adhesive tape. And the auxiliary interconnection strips are in direct contact with the conductive layer to realize connection. According to the invention, the interconnection of a plurality of battery pieces is realized through the interconnection strip assembly comprising the main interconnection strip and the plurality of auxiliary interconnection strips connected with the main interconnection strip, and the battery pieces do not need to be metalized, so that the battery pieces are prevented from being damaged in the metallization process.

Description

Technical Field

[0001] This application relates to the technical field of solar cells, and particularly to a solar cell module and a manufacturing method thereof. Background Art

[0002] Solar cells have the characteristics of being clean and environmentally friendly, and thus are widely used. There are many types of solar cells, such as Passivated Emitter and Rear Contact cells (PERC), Tunnel Oxide Passivated cells (TOPCon), Interdigitated Back Contact cells (IBC), Heterojunction cells (HJT / HIT), Hole-Transporting Layer-Free Heterojunction cells (HBC), Perovskite Solar Cells (PSCs), etc. Among them, perovskite solar cells have a relatively high theoretical maximum conversion efficiency and low cost. Perovskite solar cells use organometal halides with a perovskite crystal structure as the light-absorbing layer. Perovskite refers to a large class of compounds with the same crystal structure as this type of mineral, and crystals with a similar structure are collectively called perovskite minerals. Its chemical composition is abbreviated as AMX3, where A usually represents an organic molecule, M represents a metal (such as lead or tin), and X represents a halogen (such as iodine or chlorine).

[0003] For the metallization of solar cells, the grid line width is only an apparent index. The paste design needs to consider interface contact, printing performance, adhesion characteristics after sintering / curing, welding characteristics, and the comprehensive cost of processes and materials. Some solar cells (such as TOPCon cells, PERC cells, etc.) can use high-temperature silver paste to obtain grid line electrodes by sintering above 500 °C, while some solar cells (such as HJT cells, perovskite cells, etc.) are not resistant to high temperatures and can only use low-temperature silver paste to make grid line electrodes. In high-temperature silver paste, the glass powder will first melt, etch the SiNx antireflection coating on the silicon wafer surface and drive the rearrangement of silver powder. Therefore, the glass powder is the technical core to help achieve efficient contact and efficient silver powder conductivity. In low-temperature silver paste, since the glass powder is removed, the adhesion of silver powder is mainly achieved by the curing shrinkage of the organic system resin. The sintering temperature is low (such as <200 °C or <120 °C), but too low temperature may affect the resin curing effect, thereby affecting the resistance and curing stability.

[0004] For example, temperature is an important factor affecting the stability of perovskite materials. Relevant research shows that the increase in temperature will cause the decomposition of perovskite materials. The influence of temperature on the perovskite stability varies due to different test environments in each laboratory, resulting in different specific temperature parameters. But generally, it can be summarized that at 100 °C (within 30 minutes), MAPbI3 does not show obvious decay. At 140 - 200 °C, obvious PbI2 peaks will appear in the perovskite observed by XRD, which is a typical characteristic of perovskite decay. Summary of the Invention

[0005] In view of this, the present application provides a solar cell module and a manufacturing method thereof. The battery cells do not need to be metallized, avoiding damage to the battery cells during the metallization process.

[0006] In a first aspect, the present application provides a solar cell module, comprising:

[0007] a plurality of battery cells, each battery cell having a conductive layer on the surface of the battery cell and a conductive tape on the conductive layer;

[0008] an interconnection bar assembly laid on the conductive layers of the plurality of battery cells to electrically connect the plurality of battery cells. The interconnection bar assembly includes a main interconnection bar and a plurality of auxiliary interconnection bars connected to the main interconnection bar. The main interconnection bar is connected to the conductive layer through the conductive tape, and the auxiliary interconnection bars are directly in contact with the conductive layer to achieve connection.

[0009] In a possible implementation, the auxiliary interconnection bar includes a metal wire, and the surface of the metal wire has a conductive coating.

[0010] In a possible implementation, the auxiliary interconnection bar is wound around the main interconnection bar in a spiral manner along the extension direction of the main interconnection bar, and the auxiliary interconnection bar includes a plurality of uniformly arranged and parallel interconnection bar segments, and the extension direction of the interconnection bar segments is perpendicular to the extension direction of the main interconnection bar.

[0011] In a possible implementation, both the starting point and the ending point of the auxiliary interconnection bar are bonded to the main interconnection bar.

[0012] In a possible implementation, the interconnection bar assembly further includes a carrier film, and the main interconnection bar and the auxiliary interconnection bars are attached to the carrier film.

[0013] In a possible implementation, the carrier film is a single-layer barrier film, and the material of the single-layer barrier film includes polyolefins, polyesters, olefin copolymers, fluororesins, or polyamides; or

[0014] the carrier film includes a base material and an adhesive layer, and the main interconnection bar and the auxiliary interconnection bars are disposed on the base material through the adhesive layer; the material of the base material includes polyolefins, polyesters, olefin copolymers, fluororesins, or polyamides, and the material of the adhesive layer includes acrylics or epoxies.

[0015] In a possible implementation, when the carrier film includes a base material and an adhesive layer, the carrier film further includes a coating, and the coating is located on one side of the base material close to the adhesive layer or on one side of the base material far from the adhesive layer, and the material of the coating includes fluorocarbons, acrylics, epoxies, or polyesters.

[0016] In a second aspect, the present application provides a method for manufacturing a solar cell module, including:

[0017] Providing a battery cell, the battery cell having a conductive layer on the surface of the battery cell;

[0018] Providing an interconnection bar assembly, the interconnection bar assembly including a main interconnection bar and a plurality of auxiliary interconnection bars connected to the main interconnection bar;

[0019] Forming a conductive tape at a position on the conductive layer where the main interconnection bar needs to be laid;

[0020] Laying the interconnection bar assembly on the conductive layer such that the main interconnection bar is connected to the conductive layer through the conductive tape, and the auxiliary interconnection bars are directly in contact with the conductive layer to achieve connection, thereby electrically connecting a plurality of the battery cells through the interconnection bar assembly.

[0021] In a possible implementation, the auxiliary interconnection bar includes a metal wire, and the surface of the metal wire has a conductive coating.

[0022] In a possible implementation, the method for manufacturing the interconnection bar assembly includes:

[0023] Winding the auxiliary interconnection bars around the main interconnection bar in a spiral manner along the extending direction of the main interconnection bar to form a plurality of uniformly and parallelly arranged interconnection bar sub-segments, the extending direction of the interconnection bar sub-segments being perpendicular to the extending direction of the main interconnection bar.

[0024] Compared with the prior art, the present application has the following advantages:

[0025] The present application provides a solar cell module and a method for manufacturing the same, relating to the technical field of solar cells. The solar cell module provided by the present application includes: a plurality of battery cells, each battery cell having a conductive layer on the surface of the battery cell and a conductive tape on the conductive layer; an interconnection bar assembly, laid on the conductive layers of the plurality of battery cells to electrically connect the plurality of battery cells, the interconnection bar assembly including a main interconnection bar and a plurality of auxiliary interconnection bars connected to the main interconnection bar, the main interconnection bar being connected to the conductive layer through the conductive tape, and the auxiliary interconnection bars being directly in contact with the conductive layer to achieve connection. The present application realizes the interconnection of a plurality of battery cells through an interconnection bar assembly including a main interconnection bar and a plurality of auxiliary interconnection bars connected to the main interconnection bar, and the battery cells do not need to be metallized, thereby avoiding damage to the battery cells during the metallization process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The inclusion of the drawings is to provide a further understanding of the present application. They are incorporated and constitute a part of the present application. The drawings illustrate embodiments of the present application and, together with this specification, serve to explain the principles of the present application. In the drawings:

[0027] Figure 1 is a schematic flowchart of a manufacturing method of a solar cell module provided by an embodiment of the present application;

[0028] Figure 2 is a partial cross-sectional schematic diagram of a battery chip provided by an embodiment of the present application;

[0029] Figure 3 is a schematic structural diagram of an interconnecting strip assembly provided by an embodiment of the present application;

[0030] Figure 4 is a schematic structural diagram of another interconnecting strip assembly provided by an embodiment of the present application;

[0031] Figures 5A - 5D is a schematic structural diagram of a carrier film provided by an embodiment of the present application;

[0032] Figure 6 is a schematic structural diagram of a conductive tape provided by an embodiment of the present application;

[0033] Figure 7 is a partial structural schematic diagram of a solar cell module provided by an embodiment of the present application;

[0034] Figure 8 is a partial cross-sectional schematic diagram of a solar cell module provided by an embodiment of the present application. Detailed implementation manners

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the accompanying drawings required for the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application. For those of ordinary skill in the art, without creative efforts, the present application can also be applied to other similar scenarios based on these drawings. Unless obvious from the language context or otherwise stated, the same reference numerals in the figures represent the same structure or operation.

[0036] As shown in the present application, unless the context clearly indicates an exceptional situation, words such as "a", "an", "one", and / or "the" are not specifically singular and may also include plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0037] Unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that for the sake of convenience in description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the specification. In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof is not required in subsequent drawings.

[0038] In addition, although the terms used in the present application are selected from well-known and commonly used terms, some of the terms mentioned in the specification of the present application may be selected by the applicant according to his or her judgment, and the detailed meanings thereof are described in the relevant parts of the present description. In addition, it is required to understand the present application not only by the actual terms used, but also by the meanings implied by each term.

[0039] It should be understood that when a component is referred to as being "on another component", "connected to another component", "coupled to another component", or "in contact with another component", it can be directly on, connected to, or coupled to, or in contact with the other component, or there may be an intervening component. In contrast, when a component is referred to as being "directly on another component", "directly connected to", "directly coupled to", or "directly in contact with" another component, there is no intervening component.

[0040] Flowcharts are used in the present application to illustrate the operations performed by the methods according to the embodiments of the present application. It should be understood that the operations before or below do not necessarily have to be performed precisely in order. On the contrary, various steps can be performed in reverse order or simultaneously. At the same time, other operations can be added to these processes, or one or several steps can be removed from these processes.

[0041] The embodiments of the present application achieve the interconnection between multiple battery cells by designing a novel interconnection bar assembly, and achieve current transmission through the interconnection bar assembly. The battery cells do not need to be metallized, thereby avoiding damage to the battery cells during the metallization process.

[0042] Figure 1 It is a schematic flow diagram of the manufacturing method of a solar cell module provided by the embodiments of the present application. As Figure 1 shown, the manufacturing method of the solar cell includes the following steps:

[0043] Step S110: Provide a solar cell.

[0044] The solar cell has a conductive layer on its surface. The solar cell has two opposite surfaces, such as the front and back surfaces in its thickness direction. When the solar cell is working, the front surface faces the sun. The solar cell may have a conductive layer only on the front surface of the solar cell, or only on the back surface of the solar cell, or have conductive layers on both the front and back surfaces of the solar cell.

[0045] In some embodiments, referring to Figure 2 , the solar cell 200 includes a light absorption layer 201, an electron transport layer 211, a hole transport layer 221, and a conductive layer 202. The light absorption layer 201 is used to absorb light energy and convert it into electrical energy, such as an amorphous silicon light absorption layer, a polycrystalline silicon light absorption layer, a perovskite light absorption layer, etc.

[0046] The electron transport layer 211 is used to transport the photo-generated electrons generated by the light absorption layer 201 to the electrode, thereby generating a photocurrent. The electron transport layer 211 is usually composed of an N-type semiconductor material, and the N-type semiconductor material is a semiconductor material doped with an N-type doping element. The electron transport layer 211 can be located on the front surface of the light absorption layer 201 or on the back surface of the light absorption layer 201.

[0047] The hole transport layer 221 is used to transport the photo-generated holes generated by the light absorption layer 201 to the electrode, thereby generating a photocurrent. The hole transport layer 221 is usually composed of a P-type semiconductor material, and the P-type semiconductor material is a semiconductor material doped with a P-type doping element. The hole transport layer 221 can be located on the front surface of the light absorption layer 201 or on the back surface of the light absorption layer 201. For example, the electron transport layer 211 is located on the front surface of the light absorption layer 201, and the hole transport layer 221 is located on the back surface of the light absorption layer 201. Another example is that the electron transport layer 211 is located on the back surface of the light absorption layer 201, and the hole transport layer 221 is located on the front surface of the light absorption layer 201.

[0048] The conductive layer 202 can be used as an electrode. In some embodiments, the conductive layer 202 is a transparent conductive film, such as a transparent conductive oxide (TCO) film, etc. In some other embodiments, the conductive layer 202 can be other types of conductive films. For example, the conductive layer 202 can be composed of one or more of a metal film, an organic conductive film, carbon-based nanotubes, nanosheets, nanowires, conductive doped microcrystalline silicon, conductive doped crystalline silicon, and graphene stacked together.

[0049] It can be understood that the solar cell 200 is not limited to the structure of this embodiment, but can have different variations. For example, some layers can be changed or omitted, or additional layers can be added.

[0050] Step S120: Provide an interconnect strip assembly.

[0051] The interconnection bar assembly includes a main interconnection bar and a plurality of auxiliary interconnection bars connected to the main interconnection bar. The auxiliary interconnection bars can be connected to the main interconnection bar in various ways. In some embodiments, refer to Figures 3 - 4 , the auxiliary interconnection bar 301 is wound around the main interconnection bar 302 in a spiral manner along the extending direction of the main interconnection bar 302 to form a composite interconnection bar 310. For example, one or more auxiliary interconnection bars 301 are wound around the main interconnection bar 302 along the extending direction of the main interconnection bar 302, and the auxiliary interconnection bar 301 extends a certain length in a direction perpendicular to the extending direction of the main interconnection bar 302. That is, the auxiliary interconnection bar 301 includes a plurality of uniformly arranged and parallel interconnected sub-segments, and the extending direction of the interconnected sub-segments is perpendicular to the extending direction of the main interconnection bar 302. It can be understood that the auxiliary interconnection bar can also be connected to the main interconnection bar in other ways, such as a plurality of auxiliary interconnection bars are arranged in parallel and intersect the main interconnection bar perpendicularly.

[0052] Both the main interconnection bar 302 and the auxiliary interconnection bar 301 are made of conductive materials, and the conductive materials can be metals such as copper and aluminum or other types of conductive materials. The cross-sectional shape of the auxiliary interconnection bar 301 can be circular, triangular, square, etc. If the cross-sectional shape of the auxiliary interconnection bar 301 is circular, the engineering property is better. If the cross-sectional shape of the auxiliary interconnection bar 301 is triangular or square, the contact surface between the auxiliary interconnection bar 301 and the conductive layer 202 is increased, and the current collection efficiency is improved.

[0053] In some embodiments, the auxiliary interconnection bar 301 includes a metal wire, and the surface of the metal wire has a conductive coating to increase the contact property. The conductive coating can be a coating of gold, silver, or silver powder dispersed in conductive glue, or a super conductive coating.

[0054] In some embodiments, refer to Figure 4 , the interconnection bar assembly 300 further includes a carrier film 320, and the main interconnection bar 302 and the auxiliary interconnection bar 301 are attached to the carrier film 320. The composite interconnection bar 310 is shaped by the carrier film 320 to ensure the uniformity of the auxiliary interconnection bar 301 and prevent it from being misaligned.

[0055] The carrier film 320 can be a single-layer barrier film or a multi-layer composite film. The materials of the single-layer barrier film include polyolefins, polyesters, olefin copolymers, fluororesins, or polyamides, etc. In some embodiments, refer to Figures 5A - 5D , the carrier film 320 includes a base material 321 and an adhesive layer 322, and the main interconnection bar 302 and the auxiliary interconnection bar 301 are disposed on the base material 321 through the adhesive layer 322. The materials of the base material 321 include polyolefins, polyesters, olefin copolymers, fluororesins, or polyamides, etc., and the materials of the adhesive layer 322 include acrylics or epoxies, etc. The carrier film 320 may further include a coating 323, and the materials of the coating 323 include fluorocarbons, acrylics, epoxies, or polyesters, etc.

[0056] The coating 323 can be located on the side of the substrate 321 close to the adhesive layer 322 or on the side of the substrate 321 away from the adhesive layer 322. As Figure 5B shown, the coating 323 is located on the side of the substrate 321 close to the adhesive layer 322, that is, the coating 323 is located between the substrate 321 and the adhesive layer 322. As Figure 5C shown, the coating 323 is located on the side of the substrate 321 away from the adhesive layer 322, that is, the substrate 321 is located between the adhesive layer 322 and the coating 323. As Figure 5D shown, two coatings 323 are respectively located on the side of the substrate 321 close to the adhesive layer 322 and on the side of the substrate 321 away from the adhesive layer 322, that is, the carrier film 320 includes two coatings 323, one coating 323 is located between the substrate 321 and the adhesive layer 322, and the other coating 323 is located on the side of the substrate 321 away from the adhesive layer 322.

[0057] In an exemplary embodiment, the thickness of the substrate 321 is 30 - 200 μm, for example, it can be 30 μm, 50 μm, 70 μm, 80 μm, 100 μm, 120 μm, 130 μm, 150 μm, 160 μm, 180 μm, 200 μm, and any range between these values. The thickness of the adhesive layer 322 is 30 - 200 μm, for example, it can be 30 μm, 40 μm, 60 μm, 80 μm, 90 μm, 110 μm, 130 μm, 150 μm, 160 μm, 180 μm, 200 μm, and any range between these values. The thickness of the coating 323 is 1 - 20 μm, for example, it can be 1 μm, 2 μm, 5 μm, 6 μm, 7 μm, 10 μm, 11 μm, 13 μm, 15 μm, 17 μm, 20 μm, and any range between these values.

[0058] Step S130: Form a conductive tape at the position on the conductive layer where the main interconnection bar needs to be laid.

[0059] Please refer to Figure 6 , a plurality of conductive tapes 203 are formed on the conductive layer 202 of the battery cell 200, and the positions of the conductive tapes 203 correspond one-to-one to the positions where the main interconnection bars need to be laid. The conductive adhesive used to form the conductive tape 203 is an adhesive with certain conductivity, and the conductive adhesive is mainly composed of a resin matrix, conductive particles, dispersion additives, auxiliaries, etc. Specifically, conductive tapes 203 are formed at the positions on the conductive layer 202 of the battery cell 200 where the main interconnection bars 302 need to be laid, and the conductive tapes 203 correspond one-to-one to the main interconnection bars 302, so that the main interconnection bars 302 are connected to the conductive layer 202 through the conductive tapes 203, reducing the contact resistance and improving the connection reliability.

[0060] Step S140: Lay the interconnection bar assembly on the conductive layer, such that the main interconnection bar is connected to the conductive layer through a conductive tape, and the auxiliary interconnection bar is in direct contact with the conductive layer to achieve connection, thereby electrically connecting multiple solar cells through the interconnection bar assembly.

[0061] A partial structural schematic diagram of the solar module obtained by the above method is as Figure 7 shown. The solar module 700 includes multiple solar cells 200 and an interconnection bar assembly 300. Each solar cell 200 has a conductive layer (not shown in the figure) on the surface of the solar cell and a conductive tape 203 on the conductive layer. The interconnection bar assembly 300 is laid on the conductive layers of multiple solar cells 200 to electrically connect multiple solar cells 200.

[0062] Please refer to Figures 2 - 8 , the surface of the solar cell 200 has a conductive layer 202, and a conductive tape 203 is provided on the conductive layer 202. The interconnection bar assembly 300 includes a composite interconnection bar 310 composed of a main interconnection bar 302 and a plurality of auxiliary interconnection bars 301 connected to the main interconnection bar 302. The interconnection bar assembly 300 is laid on the conductive layer 202. Among them, the main interconnection bar 302 is connected to the conductive layer 202 through the conductive tape 203, and the auxiliary interconnection bar 301 is in direct contact with the conductive layer 202 to achieve connection. In some embodiments, the interconnection bar assembly further includes a carrier film 320, and the main interconnection bar 302 and the auxiliary interconnection bars 301 are attached to the carrier film 320.

[0063] In the embodiment of the present application, current transmission is achieved through the interconnection bar assembly, and the solar cells 200 do not need to be metallized, thereby avoiding damage to the solar cells 200 during the metallization process.

[0064] In an exemplary embodiment, the length of the main interconnection bar 302 (such as Figure 7 the length in the direction B shown) is twice the length of the solar cell 200, and two auxiliary interconnection bars 301 are wound around each main interconnection bar 302, that is, one main interconnection bar 302 can connect two solar cells 200, and one solar cell 200 corresponds to one auxiliary interconnection bar 301. The carrier film 320 is the same as the length and width of the solar cell 200 (such as Figure 7 the width in the direction A shown), that is, the carrier film 320 has the same size as the solar cell 200. The surface of the auxiliary interconnection bar 301 has a conductive coating, and the cross-sectional shape of the auxiliary interconnection bar 301 can be a circular shape, a triangular shape, a square shape, or the like.

[0065] First, the auxiliary interconnection strip 301 is wound around the main interconnection strip 302 in a spiral manner along the extension direction of the main interconnection strip 302 to form a number of uniformly parallel arranged interconnection strip sub-segments. The extension direction of the interconnection strip sub-segments is perpendicular to the extension direction of the main interconnection strip 302, thereby forming a composite interconnection strip 310. Exemplarily, a composite interconnection strip 310 includes one main interconnection strip 302 and two auxiliary interconnection strips 301. One auxiliary interconnection strip 301 is wound around the first half of the main interconnection strip 302, and the other auxiliary interconnection strip 301 is wound around the second half of the main interconnection strip 302. These two auxiliary interconnection strips 301 are respectively laid on two battery cells 200 for respectively collecting the current of these two battery cells 200.

[0066] Then, a number of composite interconnection strips 310 are uniformly arranged side by side on the carrier film 320 along the width direction of the carrier film 320 (such as Figure 7 the direction A shown), such that the extension direction of the main interconnection strip 302 of the composite interconnection strip 310 is parallel to the length direction of the carrier film 320 (such as Figure 7 the direction B shown). The sum of the widths of the auxiliary interconnection strips 301 of the number of composite interconnection strips 310 is substantially equal to the width of the carrier film 320, forming an interconnection strip assembly 300. An interconnection strip assembly 300 includes two carrier films 320 and a number of composite interconnection strips 310, realizing the shaping of the main interconnection strip 302 and the auxiliary interconnection strip 301. Exemplarily, one carrier film 320a is located above the first half of the number of composite interconnection strips 310, and the other carrier film 320b is located below the second half of the number of composite interconnection strips 310.

[0067] Specifically, a number of composite interconnection strips 310 are uniformly and parallelly arranged to connect the two carrier films 320. The first half of the number of composite interconnection strips 310 is attached below one carrier film 320a, and the adhesive layer 322 of the carrier film 320 faces downward and contacts the composite interconnection strip 310. The second half of the number of composite interconnection strips 310 is attached above the other carrier film 320b, and the adhesive layer 322 of the carrier film 320 faces upward and contacts the composite interconnection strip 310. The edges of the two carrier films 320 are close to each other, forming an interconnection strip assembly 300.

[0068] The interconnection strip assembly 300 is laid on the conductive layer 202 of the battery cell 200. The conductive layer 202 has conductive tapes 203 corresponding one by one to the main interconnection strips 302 in the interconnection strip assembly, such that the main interconnection strip 302 is connected to the conductive layer 202 through the conductive tape 203, and the auxiliary interconnection strip 301 is directly in contact with the conductive layer 202 to achieve connection, realizing the current collection of the battery cell 200.

[0069] An interconnection bar assembly 300 connects two solar cells 200, thereby achieving electrical connection of multiple solar cells 200. Exemplarily, one solar cell 200a is located below the front half of the interconnection bar assembly 300, and another solar cell 200b is located above the rear half of the interconnection bar assembly 300. That is, the solar cells 200 are located between two interconnection bar assemblies. On the front side of the solar cell 200, a composite interconnection bar 310 and a carrier film 320 are provided from the inside outwards, and on the back side of the solar cell 200, a composite interconnection bar 310 and a carrier film 320 are also provided from the inside outwards to achieve current transmission. It can be understood that if the polarities of the fronts of the two solar cells connected by an interconnection bar assembly are opposite, then the two solar cells are both located above or below the interconnection bar assembly to achieve electrical connection of the two solar cells.

[0070] The basic concepts have been described above. Obviously, for those skilled in the art, the above invention disclosure is only an example and does not constitute a limitation to this application. Although not explicitly stated here, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are proposed in this application, so such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of this application.

[0071] Meanwhile, specific terms are used in this application to describe the embodiments of this application. Such as "one embodiment", "an embodiment", and / or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that the "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more at different positions in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application can be appropriately combined.

[0072] Similarly, it should be noted that, in order to simplify the description of this application disclosure and thus help the understanding of one or more invention embodiments, in the previous description of the embodiments of this application, sometimes multiple features are merged into one embodiment, drawing, or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned. In fact, the features of the embodiment are less than all the features of the single embodiment disclosed above.

[0073] In some embodiments, numbers are used to describe components and the quantity of attributes. It should be understood that such numbers used in the description of embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise specified, "about", "approximately" or "substantially" indicate that the said numbers allow a variation of ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification are approximate values, which may vary according to the characteristics required by individual embodiments. In some embodiments, the numerical parameters should consider the specified significant digits and adopt the method of retaining general digits. Although the numerical ranges and parameters used to confirm the breadth of the scope in some embodiments of the present application are approximate values, in specific embodiments, such numerical settings are made as precise as possible within the feasible range.

[0074] Although the present application has been described with reference to the current specific embodiments, those of ordinary skill in the art should recognize that the above embodiments are only used to illustrate the present application, and various equivalent changes or substitutions can be made without departing from the spirit of the present application. Therefore, as long as the changes and modifications to the above embodiments are within the scope of the spirit of the present application, they will fall within the scope of the present application.

Claims

1. A solar cell module, characterized in that: include: A plurality of battery cells, each battery cell having a conductive layer located on a surface of the battery cell and a conductive tape located on the conductive layer; An interconnection bar assembly is laid on the conductive layer of the multiple battery cells to electrically connect the multiple battery cells. The interconnection bar assembly includes a main interconnection bar and a plurality of auxiliary interconnection bars connected to the main interconnection bar. The main interconnection bar is connected to the conductive layer through the conductive tape, and the auxiliary interconnection bars are directly in contact with the conductive layer to achieve connection.

2. The solar cell assembly according to claim 1, wherein: The auxiliary interconnection strip includes a metal wire, and a surface of the metal wire has a conductive coating.

3. The solar cell assembly according to claim 1, wherein: The auxiliary interconnection bar is wound around the main interconnection bar in a spiral manner along the extension direction of the main interconnection bar, and the auxiliary interconnection bar includes a plurality of interconnection bar sub-segments arranged uniformly in parallel, and the extension direction of the interconnection bar sub-segments is perpendicular to the extension direction of the main interconnection bar.

4. The solar cell assembly according to claim 3, characterized in that: The starting point and the end point of the auxiliary interconnection strip are both bonded to the main interconnection strip.

5. The solar cell assembly according to any one of claims 1 to 4, characterized in that: The interconnection bar assembly further includes a carrier film, and the main interconnection bar and the auxiliary interconnection bar are attached to the carrier film.

6. The solar cell assembly according to claim 5, characterized in that The carrier film is a single-layer barrier film, and the material of the single-layer barrier film includes polyolefins, polyesters, olefin copolymers, fluororesins, or polyamides; or The carrier film includes a substrate and an adhesive layer, and the main interconnection strips and the auxiliary interconnection strips are arranged on the substrate through the adhesive layer; the material of the substrate includes polyolefins, polyesters, olefin copolymers, fluororesins, or polyamides, and the material of the adhesive layer includes acrylic or epoxy.

7. The solar cell assembly according to claim 6, characterized in that: When the carrier film includes a substrate and an adhesive layer, the carrier film also includes a coating, which is located on a side of the substrate close to the adhesive layer or on a side of the substrate away from the adhesive layer, and the material of the coating includes fluorocarbon, acrylic, epoxy, or polyester.

8. A method for manufacturing a solar cell module, characterized in that: include: Providing a battery cell, wherein the battery cell has a conductive layer located on a surface of the battery cell; Providing an interconnection bar assembly, the interconnection bar assembly comprising a main interconnection bar and a plurality of auxiliary interconnection bars connected to the main interconnection bar; forming a conductive tape at a position on the conductive layer where the main interconnection strip needs to be laid; The interconnection bar assembly is laid on the conductive layer, so that the main interconnection bar is connected to the conductive layer through the conductive tape, and the auxiliary interconnection bar is directly in contact with the conductive layer to achieve connection, thereby electrically connecting the plurality of battery cells through the interconnection bar assembly.

9. The manufacturing method according to claim 8, characterized in that: The auxiliary interconnection strip includes a metal wire, and a surface of the metal wire has a conductive coating.

10. The manufacturing method according to claim 8 or 9, characterized in that: The manufacturing method of the interconnection bar assembly comprises: The auxiliary interconnection bar is wound around the main interconnection bar in a spiral manner along the extension direction of the main interconnection bar to form a plurality of interconnection bar sub-segments arranged uniformly in parallel, wherein the extension direction of the interconnection bar sub-segments is perpendicular to the extension direction of the main interconnection bar.

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