Display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display. In the display panel, the thermal expansion coefficient of the packaging unit and the thermal expansion coefficient of the first isolation part are designed to be equivalent, so that the volume change amounts of the packaging unit and the first isolation part are equivalent even if the temperature changes, that is, the packaging unit and the first isolation part can synchronously expand or contract, and the contact surfaces of the packaging unit and the first isolation part can be always attached together without generating a gap; therefore, the situation that the first isolation part and the packaging unit are separated to form a gap when the temperature changes is avoided, packaging of the light-emitting device does not fail due to the gap between the first isolation part and the packaging unit, and the display effect of the display panel is guaranteed.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and more particularly, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) is considered to be the next generation of display technology after liquid crystal display technology. It has been widely used in various consumer electronic products such as smartphones, TVs, laptop computers, desktop computers, in-vehicle displays, and wearable devices due to its excellent color and picture quality, and has become the mainstream technology in display panels.

[0003] In the process of manufacturing traditional display panels, light-emitting pixel patterning is usually achieved through a Fine Metal Mask (FMM). The FMM technology is mature and has rich mass production experience. However, the FMM technology also has problems such as limited precision, high development cost, and long development cycle. The fine metal maskless technology eliminates the limitations of traditional OLED processes on display screen size, resolution, and other screen body performances, and has the advantages of high performance, full-domain size, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, CN118781966A record the relevant content of the fine metal maskless technology for reference.

[0004] However, the process performance of current OLED display products still needs to be further improved. Summary of the Invention

[0005] In order to overcome the technical problems mentioned in the above technical background, the present application provides a display panel, a method for manufacturing a display panel, and an electronic device.

[0006] In a first aspect of the present application, a display panel is provided, the display panel comprising: a substrate; an isolation structure located on the substrate and enclosing an isolation opening on the substrate, the isolation structure comprising a first isolation portion and a second isolation portion stacked in sequence, and a positive projection of the first isolation portion on the substrate being located within a positive projection of the second isolation portion on the substrate; a light-emitting device, at least part of which is located within the isolation opening; The encapsulation unit is used to encapsulate the light-emitting device in the isolation opening, and the encapsulation unit is attached to the side surface of the first isolation part facing the isolation opening. Among them, the difference in the coefficient of thermal expansion between the first isolation part and the encapsulation unit is within ten percent of the coefficient of thermal expansion of the encapsulation unit.

[0007] In a possible implementation manner of the present application, the material of the first isolation part includes at least one metal material; Preferably, the material of the first isolation part includes two metal materials.

[0008] In a possible implementation manner of the present application, the material of the first isolation part includes a main metal material and a doped metal material. Among them, the mass ratio of the main metal material in the first isolation part is greater than the mass ratio of the doped metal material in the first isolation part.

[0009] In a possible implementation manner of the present application, the main metal material includes aluminum, and the doped metal material includes one of titanium, zirconium, molybdenum or beryllium; or, The main metal material includes copper, and the doped metal material includes tungsten or molybdenum.

[0010] In a possible implementation manner of the present application, the main metal material includes aluminum, the doped metal material includes titanium, and the mass ratio of the doped metal material to the mass of the main metal material is 0.1% - 0.5%.

[0011] In a possible implementation manner of the present application, the main metal material includes aluminum, the doped metal material includes zirconium, and the mass ratio of the doped metal material to the mass of the main metal material is 0.1% - 0.3%.

[0012] In a possible implementation manner of the present application, the main metal material includes aluminum, the doped metal material includes molybdenum, and the mass ratio of the doped metal material to the mass of the main metal material is 0.5% - 2%.

[0013] In a possible implementation manner of the present application, the main metal material includes aluminum, the doped metal material includes beryllium, and the mass ratio of the doped metal material to the mass of the main metal material is 2% - 3%.

[0014] In a possible implementation manner of the present application, the main metal material includes copper, the doped metal material includes tungsten, and the mass ratio of the doped metal material to the mass of the main metal material is 10% - 25%.

[0015] In a possible implementation manner of the present application, the main body metal material includes copper, the doped metal material includes molybdenum, and the mass ratio of the doped metal material to the mass of the main body metal material is 20%-30%.

[0016] In a possible implementation manner of the present application, the display panel further includes a pixel defining layer, the pixel defining layer is located on a side of the isolation structure facing the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate; The pixel defining layer includes a pixel opening, a positive projection of the pixel opening on the substrate is located within a positive projection of the corresponding isolation opening on the substrate, and at least a part of the light-emitting device is located within the pixel opening; Preferably, the pixel defining layer is an inorganic pixel defining layer; Preferably, the pixel defining layer is a single-layer structure of silicon oxide or silicon nitride, or a stacked structure formed by alternating silicon oxide and silicon nitride; Preferably, in a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting material layer, and a second electrode stacked; wherein, the second electrode is electrically connected to the isolation structure; The first electrode is disposed on a side of the pixel defining layer close to the substrate, and at least a part of the first electrode is exposed by the pixel opening; Preferably, the isolation structure further includes a third isolation portion, in a direction away from the substrate, the third isolation portion, the first isolation portion, and the second isolation portion are stacked in sequence, a positive projection of the first isolation portion on the substrate is located within a positive projection of the third isolation portion on the substrate, and a positive projection of the third isolation portion on the substrate is located within a positive projection of the second isolation portion on the substrate.

[0017] In a possible implementation manner of the present application, the display panel further includes a first encapsulation layer, the first encapsulation layer is located on a side of the encapsulation unit away from the substrate, and the first encapsulation layer covers at least the encapsulation unit; Preferably, the first encapsulation layer includes a flat surface on a side away from the substrate; Preferably, the display panel further includes a second encapsulation layer, the second encapsulation layer is located on a side of the first encapsulation layer away from the substrate; Preferably, the encapsulation unit and the second encapsulation layer are inorganic encapsulation layers, and the first encapsulation layer is an organic encapsulation layer.

[0018] In a second aspect of the present application, there is also provided a method for manufacturing a display panel, the method including: Providing a substrate; An isolation structure and an isolation opening are fabricated on the substrate. The isolation structure includes a first isolation portion and a second isolation portion which are stacked in sequence. The orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate. A light-emitting device and a packaging unit for packaging the light-emitting device are fabricated in the isolation opening. The packaging unit is attached to a side surface of the first isolation portion facing the isolation opening. The difference in the coefficient of thermal expansion between the first isolation portion and the packaging unit is within ten percent of the coefficient of thermal expansion of the packaging unit.

[0019] In a possible implementation manner of the present application, the step of fabricating the isolation structure and the isolation opening on the substrate includes: A first isolation material layer and a second isolation material layer are sequentially fabricated on the substrate. The first isolation material layer is fabricated using at least one metal material. The first isolation material layer and the second isolation material layer are patterned to obtain the isolation structure and the isolation opening. The second isolation portion is formed by the etched second isolation material layer, and the first isolation portion is formed by the etched first isolation material layer.

[0020] In a possible implementation manner of the present application, the step of sequentially fabricating the first isolation material layer and the second isolation material layer on the substrate includes: A first isolation material layer formed by doping two different metals with each other is fabricated on the substrate by physical vapor deposition. The second isolation material layer is fabricated on a side of the first isolation material layer away from the substrate.

[0021] In a possible implementation manner of the present application, the step of fabricating the first isolation material layer formed by doping two different metals with each other on the substrate by physical vapor deposition includes: One metal target is used as the main target, and another metal target is used as the doping target. The vaporization of the main target and the doping target is controlled respectively, and the number of gaseous metal particles generated by vaporization on the main target is greater than the number of gaseous metal particles generated by vaporization on the doping target. The first isolation material layer is formed by depositing gaseous metal particles of two different metals on one side of the substrate.

[0022] In a third aspect of the present application, an electronic device is further provided. The electronic device includes a display panel in any one of the possible implementation manners in the first aspect, or a display panel prepared in any one of the possible implementation manners in the second aspect. Description of the Drawings

[0023] To more clearly illustrate the technical solutions of the embodiments of the present application, the accompanying drawings required for the embodiments will be briefly introduced below. It should be understood that the following accompanying drawings only show some embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related accompanying drawings can be obtained based on these drawings without creative efforts.

[0024] Figure 1 Schematic diagram showing the positional relationship between the isolation structure and the isolation opening provided in this embodiment; Figure 2 Illustrates Figure 1 One of the cross-sectional views at a partial AA position in Figure 3 Illustrates Figure 1 Another cross-sectional view at the AA position in Figure 4 Illustrates Figure 1 The third cross-sectional view at the AA position in Figure 5 Illustrates Figure 1 The fourth cross-sectional view at the AA position in

[0025] Figure 6 Schematic flow chart of the manufacturing method of the display panel provided in this embodiment; Figure 7 For Figure 6 The corresponding process chart; Figure 8 Illustrates Figure 6 The sub-step flow chart of step S130 in Figure 9 For Figure 8 The corresponding process chart; Figure 10 Schematic diagram of depositing the first isolation material layer in a vacuum chamber.

[0026] Icons: 1 - display panel; 11 - substrate; 12 - isolation structure; 1201 - isolation opening; 121 - first isolation part; 122 - second isolation part; 123 - third isolation part; 13 - light-emitting device; 131 - first electrode; 132 - light-emitting material layer; 133 - second electrode; 14 - pixel defining layer; 1401 - pixel opening; 1611 - encapsulation unit; 162 - first encapsulation layer; 163 - second encapsulation layer; 21 - first isolation material layer; 22 - second isolation material layer; 20 - vacuum chamber. Detailed implementation manners

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are some, but not all, of the embodiments of this application. Components of the embodiments of this application described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0028] In the description of this application, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the products of this application are customarily placed during use. It is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] Improving the density of light-emitting devices (i.e., pixel density) in a display panel is an important way to improve the display effect. However, currently, display panels fabricated using the Fine Metal Mask (FMM) technology are limited by technology and cannot further increase the density of light-emitting devices. Through long-term research, it has been found that to solve the technical problem of the inability to further increase the density of light-emitting devices, an isolation structure is provided in some display panels. When the light-emitting material layer and the cathode are deposited in one layer, the light-emitting material layer and the cathode can be disconnected at the position of the isolation structure. Different-color light-emitting devices can be formed in different isolation openings through multiple deposition and multiple etching processes. The above process is also referred to as light-emitting device patterning.

[0030] In the above display panel, the light-emitting devices fabricated later are prone to the problem of dark spots, which seriously affects the display effect of the display panel.

[0031] Research has found that the main reason for the above technical problem is the failure of the encapsulation of the light-emitting devices fabricated later. Moisture invades the light-emitting devices, resulting in dark spots in the light-emitting devices. Further research has found that the failure of the encapsulation of the light-emitting devices fabricated later is due to the fact that the encapsulation unit should originally fit tightly with the isolation structure. However, due to the large difference in their thermal expansion coefficients, the encapsulation unit and the isolation structure are separated when the temperature changes, forming a gap through which moisture can invade.

[0032] To solve the above technical problems, the following innovative technical solutions are designed. The specific implementation solutions of this application will be described in detail below with reference to the accompanying drawings. It should be noted that the defects existing in the above prior art solutions are all the results obtained through practice and careful research. Therefore, the discovery process of the above technical problems and the solutions proposed by this embodiment for the above problems should be contributions made to this application during the invention creation process, rather than being understood as technical content known to those skilled in the art.

[0033] Please refer to Figure 1 and Figure 2 , Figure 1 which illustrate a schematic distribution diagram of the isolation structure and the isolation openings, Figure 2 illustrates Figure 1 a cross-sectional view of the position AA in . In this embodiment, the display panel 1 includes a substrate 11, an isolation structure 12, a light-emitting device 13, and a packaging unit 1611. Among them, the substrate 11 can be a multi-layer structure, and the substrate 11 at least includes a plurality of conductive layers and insulating layers located between adjacent conductive layers. A pixel circuit for providing a driving signal for the light-emitting device 13 is formed in the substrate 11. Among them, the conductive layer can be a metal conductive layer.

[0034] The isolation structure 12 is located on one side of the substrate 11, and the isolation structure 12 encloses a plurality of isolation openings 1201 on the substrate 11. In the direction away from the substrate 11, the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 arranged in a stacked manner. The orthographic projection of the first isolation portion 121 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11, that is, the second isolation portion 122 protrudes toward the corresponding isolation opening 1201 relative to the first isolation portion 121 to form an undercut structure. Through this undercut structure, the light-emitting device layer (such as a light-emitting material layer and an electrode layer) deposited over the entire surface can be disconnected at this position, so as to independently form the film layer of the light-emitting device in different isolation openings 1201.

[0035] At least part of the light-emitting devices 13 are arranged in the isolation openings 1201, and the light-emitting devices 13 and the isolation openings 1201 are in one-to-one correspondence, and one light-emitting device 13 is arranged in one isolation opening 1201. The display panel 1 includes light-emitting devices 13 of multiple different light-emitting colors. Exemplarily, the display panel 1 includes a red light-emitting device, a blue light-emitting device, and a green light-emitting device. Among them, adjacent red light-emitting devices, blue light-emitting devices, and green light-emitting devices can form a pixel unit. By controlling the light-emitting brightness of the red light-emitting device, blue light-emitting device, and green light-emitting device in each pixel unit, the display brightness and color of each pixel unit can be controlled, and thus the display of the picture on the display panel 1 can be realized.

[0036] The encapsulation unit 1611 is located on the side of the light-emitting device 13 away from the substrate 11. The encapsulation unit 1611 extends from the surface of the light-emitting device 13 through the first isolation part 121 to the side of the second isolation part 122 away from the substrate 11, that is, the encapsulation unit 1611 will be attached to the side wall of the first isolation part 121 facing the isolation opening 1201.

[0037] It is found that the encapsulation unit 1611 is generally made of an inorganic material, while the first isolation part 121 is generally made of a conductive metal. Generally speaking, the coefficient of thermal expansion of the encapsulation unit 1611 is less than that of the first isolation part 121. When the temperature changes (such as when the temperature decreases), the volume shrinkage of the first isolation part 12 will be greater than that of the encapsulation unit 1611. The encapsulation unit 1611 for encapsulating the light-emitting device 13 is likely to be separated from the first isolation part 121 to form a gap through which moisture can invade, resulting in encapsulation failure and dark spots in the light-emitting device 13.

[0038] In this embodiment, the difference in the coefficient of thermal expansion between the first isolation part 121 and the encapsulation unit 161 is within 10% of the coefficient of thermal expansion of the encapsulation unit 161, including 10%. That is, the coefficients of thermal expansion of the first isolation part 121 and the encapsulation unit 161 are basically the same. With such a design, even when the temperature changes, the volume expansion or volume shrinkage of both is basically the same, that is, both can expand or contract synchronously. In this way, it can be ensured that the surfaces in contact with each other are always attached together without gaps, thereby avoiding the situation where the first isolation part 121 and the encapsulation unit 1611 are separated to form gaps when the temperature changes, ensuring the encapsulation effect of the light-emitting device 13 and guaranteeing the display effect of the display panel 1.

[0039] In this embodiment, the first isolation part 121 is a conductive isolation part, and the material of the first isolation part 121 includes at least one metal material. That is, the first isolation part 121 can be made of a single metal with a coefficient of thermal expansion equivalent to that of the material of the encapsulation unit 1611, or can be obtained by doping multiple metals. It is found that it is easier to achieve by doping two metals with each other on the premise of ensuring that the first isolation part 121 has conductivity.

[0040] Specifically, in this embodiment, the material of the first isolation part 121 includes a main metal material and a doped metal material, where the mass ratio of the main metal material in the first isolation part 121 is greater than the mass ratio of the doped metal material in the first isolation part 121. That is, the main metal material is the main component in the first isolation part 121.

[0041] Exemplarily, the main metal material includes aluminum, and the doped metal material includes one of titanium, zirconium, molybdenum or beryllium; or, the main metal material includes copper, and the doped metal material includes tungsten or molybdenum.

[0042] In the related art, the first isolation part 121 is generally made of metallic aluminum. However, there is a large difference in the coefficient of thermal expansion between metallic aluminum and the encapsulation unit 1611, and it is easy to separate the two when the temperature changes, forming a gap through which water vapor can invade. Therefore, in this embodiment, metallic aluminum can be used as the main metallic material, and the coefficient of thermal expansion of the first isolation part 121 can be changed by doping other metallic materials; or other metallic materials can be used as the main metallic material, and the first isolation part 121 with a coefficient of thermal expansion equivalent to that of the encapsulation unit 1611 can be obtained by doping it with different metallic materials.

[0043] Exemplarily, the main metallic material includes aluminum (Al), and the doping metallic material includes one of titanium (Ti), zirconium (Zr), molybdenum (Mo), or beryllium (Be); or the main metallic material includes copper (Cu), and the doping metallic material includes tungsten (W) or molybdenum (Mo).

[0044] In a possible implementation manner of this embodiment, the main metallic material includes aluminum (Al), and the doping metallic material includes titanium (Ti). In the first isolation part 121, the proportion of the mass of the doping metallic material to the mass of the main metallic material is 0.1% - 0.5%. Exemplarily, the proportion of the mass of the doping metallic material to the mass of the main metallic material includes 0.1%, 0.125%, 0.15%, 0.185%, 0.205%, 0.235%, 0.258%, 0.295%, 0.315%, 0.375%, 0.415%, 0.455%, 0.483%, 0.495%, or 0.5%, etc. Through the doping with the above mass ratio, the coefficient of thermal expansion of the first isolation part 121 is less than that of metallic aluminum. Specifically, the coefficient of thermal expansion of the first isolation part 121 can be 10% - 15% smaller than that of metallic aluminum. Among them, the coefficient of thermal expansion of metallic aluminum is 23.6×10 -6 / K. That is, in this implementation manner, the coefficient of thermal expansion of the first isolation part 121 is 20.06×10 -6 / K - 21.24×10 -6 / K. Exemplarily, the coefficient of thermal expansion of the first isolation part 121 includes 20.06×10 -6 / K, 20.12×10 -6 / K, 20.28×10 -6 / K, 20.37×10 -6 / K, 20.45×10 -6 / K, 20.54×10 -6 / K, 20.67×10 -6 / K, 20.81×10 -6 / K, 20.93×10 -6 / K, 21.03×10 -6 / K, 21.16×10 -6 / K or 21.24×10 -6 / K etc.

[0045] In another possible implementation manner of this embodiment, the main body metal material includes aluminum (Al), and the doped metal material includes zirconium (Zr). In the first isolation part 121, the proportion of the mass of the doped metal material to the mass of the main body metal material is 0.1% - 0.3%. Exemplarily, the proportion of the mass of the doped metal material to the mass of the main body metal material includes 0.1%, 0.115%, 0.125%, 0.145%, 0.183%, 0.192%, 0.2%, 0.205%, 0.221%, 0.25%, 0.265%, 0.273%, 0.283%, 0.296% or 0.3% etc. Through the doping with the above mass ratio, the thermal expansion coefficient of the first isolation part 121 is less than the thermal expansion coefficient of metallic aluminum. Specifically, the thermal expansion coefficient of the first isolation part 121 can be 12% - 15% smaller than the thermal expansion coefficient of metallic aluminum. Among them, the thermal expansion coefficient of metallic aluminum is 23.6×10 -6 / K, that is, in this implementation manner, the thermal expansion coefficient of the first isolation part 121 is 20.06×10 -6 / K ~ 20.77×10 -6 / K. Exemplarily, the thermal expansion coefficient of the first isolation part 121 includes 20.06×10 -6 / K, 20.12×10 -6 / K, 20.23×10 -6 / K, 20.31×10 -6 / K, 20.39×10 -6 / K, 20.43×10 -6 / K, 20.46×10 -6 / K, 20.51×10 -6 / K, 20.56×10 -6 / K, 20.63×10 -6 / K, 20.72×10 -6 / K or 20.77×10 -6 / K etc.

[0046] In another possible implementation manner of this embodiment, the main body metal material includes aluminum (Al), and the doped metal material includes molybdenum (Mo). In the first isolation part 121, the mass ratio of the doped metal material to the main body metal material is 0.5% - 2%. Exemplarily, the mass ratio of the doped metal material to the main body metal material includes 0.5%, 0.55%, 0.65%, 0.78%, 0.83%, 0.92%, 1%, 1.05%, 1.12%, 1.25%, 1.36%, 1.48%, 1.56%, 1.68%, 1.74%, 1.83%, 1.96% or 2%, etc. Through doping with the above mass ratio, the thermal expansion coefficient of the first isolation part 121 is less than that of metallic aluminum. Specifically, the thermal expansion coefficient of the first isolation part 121 can be 5% - 8% smaller than that of metallic aluminum. Among them, the thermal expansion coefficient of metallic aluminum is 23.6×10 -6 / K. That is, in this implementation manner, the thermal expansion coefficient of the first isolation part 121 is 21.71×10 -6 / K - 22.42×10 -6 / K. Exemplarily, the thermal expansion coefficient of the first isolation part 121 includes 21.71×10 -6 / K, 21.74×10 -6 / K, 21.78×10 -6 / K, 21.85×10 -6 / K, 21.91×10 -6 / K, 21.97×10 -6 / K, 22.03×10 -6 / K, 22.08×10 -6 / K, 22.15×10 -6 / K, 22.27×10 -6 / K, 22.36×10 -6 / K or 22.42×10 -6 / K, etc.

[0047] In another possible implementation manner of this embodiment, the main body metal material includes aluminum (Al), and the doped metal material includes beryllium (Be). In the first isolation part 121, the proportion of the mass of the doped metal material to the mass of the main body metal material is 2% - 3%. Exemplarily, the proportion of the mass of the doped metal material to the mass of the main body metal material includes 2%, 2.02%, 2.08%, 2.15%, 2.21%, 2.28%, 2.34%, 2.41%, 2.48%, 2.56%, 2.63%, 2.68%, 2.74%, 2.79%, 2.86%, 2.9%, 2.96% or 3%, etc. Through doping with the above mass ratio, the thermal expansion coefficient of the first isolation part 121 is less than that of metallic aluminum. Specifically, the thermal expansion coefficient of the first isolation part 121 can be 30% - 32% smaller than that of metallic aluminum. Among them, the thermal expansion coefficient of metallic aluminum is 23.6×10 -6 / K. That is, in this implementation manner, the thermal expansion coefficient of the first isolation part 121 is 16.05×10 -6 / K - 16.52×10 -6 / K. Exemplarily, the thermal expansion coefficient of the first isolation part 121 includes 16.05×10 -6 / K, 16.07×10 -6 / K, 16.09×10 -6 / K, 16.13×10 -6 / K, 16.17×10 -6 / K, 16.21×10 -6 / K, 16.26×10 -6 / K, 16.32×10 -6 / K, 16.38×10 -6 / K, 16.45×10 -6 / K, 16.5×10 -6 / K or 16.52×10 -6 / K, etc.

[0048] In another possible implementation manner of this embodiment, the main body metal material includes copper (Cu), and the doped metal material includes tungsten (W). In the first isolation part 121, the proportion of the mass of the doped metal material to the mass of the main body metal material is 10% - 25%. Exemplarily, the proportion of the mass of the doped metal material to the mass of the main body metal material includes 10%, 10.5%, 11.2%, 12.5%, 13.4%, 14.1%, 15.2%, 15.9%, 16.5%, 17.1%, 17.8%, 18.3%, 18.8%, 19.2%, 19.8%, 20%, 21.5%, 23.2%, 24.8% or 25%, etc.

[0049] In yet another possible implementation of this embodiment, the main body metal material includes copper (Cu), and the doped metal material includes tungsten (molybdenum). In the first isolation part 121, the proportion of the mass of the doped metal material to the mass of the main body metal material is 20%-30%. Exemplarily, the proportion of the mass of the doped metal material to the mass of the main body metal material includes 20%, 20.6%, 21.2%, 22.5%, 23.4%, 24.2%, 25.2%, 25.8%, 26.7%, 27.1%, 27.8%, 28.3%, 28.8%, 29.2%, 29.8% or 30%, etc.

[0050] As can be seen from the above implementation, in the first isolation part 121 with the main body metal material being aluminum or copper, the coefficient of thermal expansion of the first isolation part 121 can be controlled by adjusting the mass ratio of the doped metal material. When the material of the encapsulation unit 1611 changes, the coefficient of thermal expansion of the first isolation part 121 can be made substantially equivalent to that of the encapsulation unit 1611 through the above method, thereby avoiding the separation of the two due to the difference in their coefficients of thermal expansion and ensuring that the encapsulation effect of the encapsulation unit 1611 on the light-emitting device 13 is not affected.

[0051] Furthermore, please refer to Figure 3 , the display panel 1 further includes a pixel defining layer 14. The pixel defining layer 14 is located on one side of the substrate 11, and the isolation structure 12 is located on the side of the pixel defining layer 14 away from the substrate 11. The pixel defining layer 14 includes a pixel opening 1401. At least part of the light-emitting device 13 is located in the pixel opening 1401. The pixel opening 1401 communicates with the isolation opening 1201. Exemplarily, the orthographic projection of the pixel opening 1401 on the substrate 11 is located within the orthographic projection of the corresponding isolation opening 1201 on the substrate 11. The orthographic projection of the pixel opening 1401 on the substrate 11 is located within the orthographic projection of the isolation opening 1201 on the substrate 11. In this embodiment, the pixel defining layer 14 can be an organic pixel defining layer or an inorganic pixel defining layer. Preferably, the pixel defining layer 14 is an inorganic pixel defining layer. When the pixel defining layer 14 is an inorganic pixel defining layer, the pixel defining layer 14 can be a single-layer structure of silicon oxide (SiOx) or silicon nitride (SiNx), or a stacked structure formed by alternating silicon oxide and silicon nitride.

[0052] Please refer to again Figure 3, in a direction away from the substrate 11, the light emitting device 13 includes a first electrode 131, a light emitting material layer 132 and a second electrode 133 which are stacked in sequence, at least a portion of the first electrode 131 is exposed from the pixel opening 1401, and the second electrode 133 extends from the pixel opening 1401 through the pixel defining layer 14 to the side wall of the isolation structure 12 facing the isolation opening 1201, wherein the second electrode 133 may overlap the first isolation portion 121. Exemplarily, the first electrode 131 may be an anode of the light emitting device 13, and the second electrode 133 may be a cathode of the light emitting device 13.

[0053] In this embodiment, the isolation structure 12 can enclose a plurality of isolation openings 1201. The setting of the isolation structure 12 can form film layers of light-emitting devices of different colors in different isolation openings 1201 without the need for a fine metal mask, thereby reducing the manufacturing cost of the display panel. The isolation structure 12 can isolate the light-emitting material layer 132 and the second electrode 133 in the light-emitting device 13, so that different light-emitting devices 13 are independent of each other, so as to improve the crosstalk between adjacent light-emitting devices 13 and enhance the display effect. Adjacent light-emitting devices 13 can be independently packaged to improve the packaging yield. At the same time, due to the existence of the isolation structure 12, the light-emitting material layer 132 and the second electrode 133 in the light-emitting device 13 of each color in the display panel can be first prepared on the entire surface and then patterned, thereby eliminating the fine metal mask to save the manufacturing cost of the display panel.

[0054] For further information, please refer to Figure 4 , the isolation structure 12 may also include a third isolation portion 123. In the direction away from the substrate 11, the third isolation portion 123, the first isolation portion 121 and the second isolation portion 122 are stacked in sequence, and the orthographic projection of the third isolation portion 123 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11. In the cross section perpendicular to the plane where the substrate 11 is located and passing through the center of the isolation opening 1201, the cross section of the isolation structure 12 may be I-shaped. The third isolation portion 123 is a conductive isolation portion, and the second electrode 133 may also be electrically connected to the third isolation portion 123. Exemplarily, the second electrode 133 is electrically connected by overlapping with the third isolation portion 123.

[0055] For further information, please refer to Figure 5 The display panel 1 further includes a first encapsulation layer 162, which is located on a side of the encapsulation unit 1611 away from the substrate 11, and at least covers the encapsulation unit 1611. Optionally, the first encapsulation layer 162 includes a flat surface on a side away from the substrate 11.

[0056] Further, please refer again to Figure 4, the display panel 1 further includes a second encapsulation layer 163, and the second encapsulation layer 163 is located on the side of the first encapsulation layer 162 away from the substrate 11.

[0057] Optionally, the encapsulation unit 1611 and the second encapsulation layer 163 include inorganic materials, and the first encapsulation layer 162 includes organic materials, that is, the encapsulation unit 1611 and the second encapsulation layer 163 can be inorganic encapsulation layers, and the first encapsulation layer 162 can be an organic encapsulation layer. For example, the encapsulation unit 1611 and the second encapsulation layer 163 can be formed by Chemical Vapor Deposition (CVD), and the first encapsulation layer 162 can be formed by Ink-jet Printing (IJP).

[0058] It can be understood that the display panel 1 may further include film layers such as a touch function layer, an optical adhesive layer, a polarizer, and a cover plate that are sequentially stacked on the side of the second encapsulation layer 163 away from the substrate 11. The above film layers are conventional film layers of the display panel and will not be elaborated here.

[0059] Based on the same inventive concept, this embodiment also provides a method for manufacturing a display panel. Please refer to Figure 6 and Figure 7 , where Figure 6 illustrates a schematic flow chart of the method for manufacturing the display panel provided in this embodiment, Figure 7 illustrates Figure 6 the corresponding process chart. The following will combine Figure 6 and Figure 7 to introduce in detail the process of how to solve the above technical problems through process improvement in this embodiment.

[0060] Step S110: Provide a substrate 11.

[0061] In this embodiment, the substrate 11 is a multi-film layer structure, and the substrate 11 at least includes a plurality of conductive layers and insulating layers located between adjacent conductive layers. A pixel circuit for providing a driving signal for the light-emitting device can be formed in the substrate 11.

[0062] Step S120: Fabricate an isolation structure 12 and an isolation opening 1201 on the substrate 11.

[0063] In this embodiment, the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122 which are stacked in sequence. The orthographic projection of the first isolation portion 121 on the substrate 11 is located within the orthographic projection of the second isolation portion 122 on the substrate 11. That is, the second isolation portion 122 extends outwards relative to the first isolation portion 121 towards the corresponding isolation opening 1201. The first isolation portion 121 and the second isolation portion 122 form an undercut structure, so as to facilitate forming independent light-emitting devices in each isolation opening when the device film layers of the light-emitting devices are deposited over the entire surface.

[0064] Step S130: Fabricate a light-emitting device 13 and a packaging unit 1611 for packaging the light-emitting device 13 in the isolation opening 1201. The packaging unit 1611 is attached to the side surface of the first isolation portion 121 facing the corresponding isolation opening 1201.

[0065] In this embodiment, the difference in the coefficient of thermal expansion between the first isolation portion 121 and the packaging unit 161 is within ten percent of the coefficient of thermal expansion of the packaging unit 161. That is, the coefficients of thermal expansion of the first isolation portion 121 and the packaging unit 161 are substantially equivalent. In this way, when the temperature changes, the volumes of the first isolation portion 121 and the packaging unit 1611 can basically change synchronously, and the two will not be separated due to the difference in volume change to form a gap through which moisture can invade.

[0066] Further, please refer to Figure 8 and Figure 9 , step S130 can be implemented through the following steps.

[0067] Step S1301: Successively fabricate a first isolation material layer 21 and a second isolation material layer 22 on the substrate 11. Among them, the first isolation material layer 21 is fabricated using at least one metal material.

[0068] In this embodiment, the specific manner of implementing step S1301 can be as follows.

[0069] First, use physical vapor deposition to fabricate the first isolation material layer 21 formed by doping two different metals with each other on the substrate 11.

[0070] Specifically, please refer to Figure 10, two different metal targets (for example, a metal aluminum target and a metal molybdenum target) can be placed in the vacuum chamber 20. First, the substrate 11 is placed in the vacuum chamber 20; then, the metal on the target is converted into a gaseous state by evaporation, sputtering or arc discharge to form two metal gas particles; then, the two metal gas particles are ionized in the vacuum chamber to form two metal plasmas, and the two metal plasmas are uniformly mixed; then, the mixed two metal plasmas can move onto the substrate 11 under the action of an electric field and deposit on the substrate 11 to form the first isolation material layer 21.

[0071] In the process of converting the metal on the metal target into gaseous particles, one metal target is used as the main target, and the other metal target is used as the doping target. The vaporization of the main target and the doping target is controlled respectively, and the number of gaseous metal particles generated by vaporization on the main target is controlled to be greater than the number of gaseous metal particles generated by vaporization on the doping target; for the specific materials and ratios, reference can be made to the previous text and will not be elaborated here.

[0072] The first isolation material layer 21 is deposited on one side of the substrate 11 by gaseous metal particles of two different metals.

[0073] Then, the second isolation material layer 22 is fabricated on the side of the first isolation material layer 21 away from the substrate 11.

[0074] Step S1302, patterning the first isolation material layer 21 and the second isolation material layer 22 to obtain the isolation structure 12 and the isolation opening 1201, wherein, the second isolation part 122 is formed by the etched second isolation material layer 22, and the first isolation part 121 is formed by the etched first isolation material layer 21.

[0075] Based on the same inventive concept, the embodiment of the present application further provides an electronic device. The electronic device includes the display panel provided by the present application, or includes the display panel prepared by the preparation method of the display panel provided by this embodiment. The electronic device can include display function devices such as smart phones, tablet computers, in-vehicle display devices, smart wearable devices, televisions, laptop computers, etc.

[0076] The embodiment of the present application provides a display panel, a preparation method of the display panel and an electronic device. In the display panel, the thermal expansion coefficients of the encapsulation unit and the first isolation part are designed to be equivalent. With such a design, even when the temperature changes, the volume change amounts of the two are equivalent, that is, the two can expand or contract synchronously. In this way, it can be ensured that the surfaces in contact with each other are always in fit and there will be no gaps, thereby avoiding the situation that the first isolation part and the encapsulation unit are separated to form gaps when the temperature changes, and the encapsulation of the light-emitting device will not fail due to the gap between the first isolation part and the encapsulation unit, ensuring the display effect of the display panel.

[0077] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; an isolation structure, located on the substrate and enclosing an isolation opening on the substrate, the isolation structure comprising a first isolation portion and a second isolation portion stacked in sequence, the orthographic projection of the first isolation portion on the substrate being within the orthographic projection of the second isolation portion on the substrate; a light emitting device, at least partially located in the isolation opening; A packaging unit is used to package the light-emitting device in the isolation opening, and the packaging unit is bonded to the side of the first isolation part toward the corresponding isolation opening, wherein the difference in thermal expansion coefficient between the first isolation part and the packaging unit is within ten percent of the thermal expansion coefficient of the packaging unit.

2. The display panel according to claim 1, wherein: The material of the first isolation portion includes at least one metal material.

3. The display panel according to claim 2, wherein: The material of the first isolation portion includes a main metal material and a doped metal material, wherein a mass proportion of the main metal material in the first isolation portion is greater than a mass proportion of the doped metal material in the first isolation portion.

4. The display panel according to claim 3, wherein: The main metal material includes aluminum, and the doped metal material includes one of titanium, rhodium, molybdenum or beryllium; or, The main metal material includes copper, and the doped metal material includes tungsten or molybdenum.

5. The display panel according to claim 4, wherein: The main metal material includes aluminum, the doped metal material includes titanium, and the mass of the doped metal material accounts for 0.1% to 0.5% of the mass of the main metal material.

6. The display panel according to claim 4, wherein: The main metal material includes aluminum, the doped metal material includes aluminum, and the mass of the doped metal material accounts for 0.1% to 0.3% of the mass of the main metal material.

7. The display panel according to claim 4, wherein: The main metal material includes aluminum, the doped metal material includes molybdenum, and the mass of the doped metal material accounts for 0.5% to 2% of the mass of the main metal material.

8. The display panel according to claim 4, wherein: The main metal material includes aluminum, the doped metal material includes beryllium, and the mass of the doped metal material accounts for 2%-3% of the mass of the main metal material.

9. The display panel according to claim 4, wherein: The main metal material includes copper, the doped metal material includes tungsten, and the mass of the doped metal material accounts for 10%-25% of the mass of the main metal material.

10. The display panel according to claim 4, wherein: The main metal material includes copper, the doped metal material includes molybdenum, and the mass of the doped metal material accounts for 20%-30% of the mass of the main metal material.

11. The display panel according to claim 1, wherein: The display panel further comprises a pixel defining layer, wherein the pixel defining layer is located on a side of the isolation structure facing the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate; The pixel defining layer comprises a pixel opening, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate, and at least part of the light emitting device is located within the pixel opening; In a direction away from the substrate, the light emitting device comprises a first electrode, a light emitting material layer and a second electrode which are stacked; wherein the second electrode is electrically connected to the isolation structure; The first electrode is disposed on a side of the pixel definition layer close to the substrate, and at least a portion of the first electrode is exposed from the pixel opening.

12. The display panel according to claim 1, wherein: The isolation structure also includes a third isolation portion. In the direction away from the substrate, the third isolation portion, the first isolation portion and the second isolation portion are stacked in sequence, the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate, and the orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate.

13. The display panel according to claim 1, wherein: The display panel further includes a first encapsulation layer, the first encapsulation layer is located at a side of the encapsulation unit away from the substrate, and the first encapsulation layer at least covers the encapsulation unit; The display panel further comprises a second encapsulation layer, wherein the second encapsulation layer is located on a side of the first encapsulation layer away from the substrate; The encapsulation unit and the second encapsulation layer are inorganic encapsulation layers, and the first encapsulation layer is an organic encapsulation layer.

14. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; Making an isolation structure and an isolation opening on the substrate, wherein the isolation structure comprises a first isolation portion and a second isolation portion which are stacked in sequence, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate; A light-emitting device and a packaging unit for packaging the light-emitting device are formed in the isolation opening, and the packaging unit is bonded to the first isolation portion toward the side corresponding to the isolation opening, wherein the difference in thermal expansion coefficient between the first isolation portion and the packaging unit is within ten percent of the thermal expansion coefficient of the packaging unit.

15. The method for preparing a display panel according to claim 14, wherein: The step of making the isolation structure and the isolation opening on the substrate comprises: Sequentially manufacturing a first isolation material layer and a second isolation material layer on the substrate, wherein the first isolation material layer is made of at least one metal material; The first isolation material layer and the second isolation material layer are patterned to obtain the isolation structure and the isolation opening, wherein the second isolation portion is formed by the second isolation material layer after etching, and the first isolation portion is formed by the first isolation material layer after etching.

16. The method for manufacturing a display panel according to claim 15, wherein: The step of sequentially forming a first isolation material layer and a second isolation material layer on the substrate comprises: A first isolation material layer formed by mutual doping of two different metals is produced on the substrate by physical vapor deposition; The second isolation material layer is formed on a side of the first isolation material layer away from the substrate.

17. The method for manufacturing a display panel according to claim 16, wherein: The step of fabricating a first isolation material layer formed by mutual doping of two different metals on the substrate by physical vapor deposition comprises: Using a target material of one metal as a main target material and another target material of another metal as a doping target material, performing gasification control on the main target material and the doping target material respectively, and controlling the number of gaseous metal particles generated by gasification on the main target material to be greater than the number of gaseous metal particles generated by gasification on the doping target material; The first isolation material layer is formed by depositing gaseous metal particles of two different metals on one side of the substrate.

18. An electronic device, characterized in that: The electronic device comprises the display panel described in any one of claims 1 to 13, or a display panel prepared by the method for preparing a display panel described in any one of claims 14 to 17.

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