Baking treatment equipment for PCB (Printed Circuit Board) and waste gas treatment method of baking treatment equipment

Abstract

The invention discloses baking treatment equipment of a PCB (Printed Circuit Board) and a waste gas treatment method thereof, which are applied to the technical field of baking treatment of the PCB, and effectively overcome the limitation of the prior art by arranging a waste gas treatment structure and aiming at the problems of limited activated carbon adsorption capacity, poor acid-base gas treatment effect, poor equipment collaboration and the like in a traditional treatment method. The waste gas treatment effect is improved, the operation cost is reduced, standard emission of waste gas is guaranteed, organic solvent volatile matters, resin decomposition products and other organic pollutants in the waste gas can be effectively adsorbed through the adsorption mechanism, the adsorption efficiency is greatly improved, and compared with a traditional single fixed activated carbon adsorption mode, the adsorption efficiency is greatly improved. The problem that waste gas emission exceeds the standard due to insufficient adsorption is remarkably reduced, harmful gas contained in the waste gas can be chemically decomposed through the decomposition mechanism, small-molecular organic matter, soluble acid-base gas and the like which are difficult to remove in a traditional treatment mode can be effectively decomposed, and the depth and comprehensiveness of waste gas treatment are greatly improved.

Description

Technical Field

[0001] The invention belongs to the technical field of PCB board baking treatment, and in particular relates to a PCB board baking treatment device and an exhaust gas treatment method thereof. Background Art

[0002] In the electronics manufacturing industry, the production of printed circuit boards (PCBs) is a crucial link. In the manufacturing process of PCBs, baking is an essential step. It plays a key role in removing moisture from PCBs and ensuring the performance and quality of circuit boards. However, the baking process of PCBs will produce a large amount of waste gas, which contains a variety of harmful substances. If it is not effectively treated and directly discharged into the environment, it will cause serious harm to the environment and human health.

[0003] At present, there are many methods for treating PCB board baking waste gas, but a single treatment method often has obvious limitations. For example, the adsorption method often uses activated carbon for adsorption. Although it can effectively adsorb some organic pollutants, the adsorption capacity of activated carbon is limited and it is easy to be saturated. It needs to be replaced frequently, which increases the treatment cost. In addition, the adsorption effect is not good for some small molecular organic matter and acid-base gases with good solubility. Summary of the invention

[0004] The purpose of the present invention is to provide an existing baking treatment equipment for PCB boards. The invention has the advantages of setting a waste gas treatment structure, and aims at solving the problems of limited adsorption capacity of activated carbon, poor acid-base gas treatment effect, poor equipment synergy, etc. in traditional treatment methods. Through innovative adsorption mechanism and decomposition mechanism design, and optimized combination of various structures, the limitations of the prior art are effectively overcome, the waste gas treatment effect is improved, the operating cost is reduced, and the emission of waste gas meets the standards is guaranteed. The adsorption mechanism can effectively adsorb organic pollutants such as organic solvent volatiles and resin decomposition products, greatly improving the adsorption efficiency. Compared with the traditional single fixed activated carbon adsorption method, the problem of excessive waste gas emissions caused by insufficient adsorption is significantly reduced. In addition, the decomposition mechanism can chemically decompose harmful gases contained in the waste gas, and can effectively decompose small molecular organic matter and soluble acid-base gases that are difficult to remove by traditional treatment methods, greatly improving the depth and comprehensiveness of waste gas treatment.

[0005] The above technical objectives of the present invention are achieved through the following technical solutions: A baking treatment device for a PCB board, comprising a baking device body, the top of the baking device body is connected to an air collecting hood, the top of the air collecting hood is bolted with a fan structure, and the top of the fan structure is connected to an exhaust gas treatment box through a pipeline, and the exhaust gas treatment box is provided with an exhaust gas treatment structure inside; The waste gas treatment structure includes a treatment box, which is bolted to the left side inside the waste gas treatment tank. On both sides inside the treatment box, a primary filter element and a secondary filter element are bolted respectively. The left side of the treatment box is communicated with an intake cylinder, and a spiral groove is formed inside the intake cylinder. A spiral cooling pipe is embedded on the surface of the intake cylinder. On the right side of the treatment box, an adsorption mechanism and a decomposition mechanism are respectively arranged.

[0006] With the above technical solution, by setting up the waste gas treatment structure, the waste gas entering the waste gas treatment tank is cooled by the spiral cooling pipe, and then the particulate matter is removed through the primary filter element and the secondary filter element. This not only facilitates the removal of the contained particulate matter but also facilitates the subsequent adsorption and decomposition treatment. Through the adsorption mechanism, organic pollutants such as organic solvent volatiles and resin decomposition products can be effectively adsorbed, greatly improving the adsorption efficiency. Compared with the traditional single fixed activated carbon adsorption method, the problem of excessive waste gas emissions caused by insufficient adsorption is significantly reduced. And through the decomposition mechanism, harmful gases contained in the waste gas can be chemically decomposed, and small molecule organic substances, soluble acid-base gases, etc. that are difficult to remove by traditional treatment methods can be effectively decomposed, greatly improving the depth and comprehensiveness of waste gas treatment.

[0007] The present invention is further configured as follows: The adsorption mechanism includes a fixed frame, which is bolted to the middle inside the waste gas treatment tank. An annular plate is bolted inside the fixed frame. An adsorption assembly is rotatably arranged inside the annular plate. On both sides of the top of the inner wall of the fixed frame, heating wires are arranged, and the heating wires are used in cooperation with the adsorption assembly. On the left side of the adsorption assembly and at the bottom of the rear side of the left side of the fixed frame, driving wheels are bolted respectively, and a synchronous belt is wound between the two driving wheels.

[0008] With the above technical solution, by setting up the adsorption mechanism, when the waste gas enters the fixed frame, the adsorption assembly rotates driven by the driving wheels and the synchronous belt, so that the adsorption assembly is in full contact with the waste gas to adsorb pollutants. When the adsorption assembly is saturated with adsorption, through heating by the heating wires, the pollutants can be desorbed, realizing the regeneration of the adsorption assembly. Therefore, organic pollutants such as organic solvent volatiles and resin decomposition products can be effectively adsorbed, greatly improving the adsorption efficiency. Compared with the traditional single fixed activated carbon adsorption method, the problem of excessive waste gas emissions caused by insufficient adsorption is significantly reduced.

[0009] The present invention is further configured as follows: The adsorption assembly includes a main shaft, and fixing frames are annularly arranged on the surface of the main shaft. Activated carbon blocks are arranged inside the fixing frames. On both sides of the top of the surface of the main shaft, sleeve shells are rotatably contacted, and the tops of the sleeve shells are connected to the inner wall of the annular plate. The fixing frames are rotatably arranged between the opposite sides of the two sleeve shells.

[0010] With the above technical solution, by setting the adsorption component, the fixed frame is driven to rotate by the main shaft, so that the activated carbon block and the fixed frame rotate within the annular plate, and the casing provides a sealed space for the regeneration of the activated carbon block, ensuring that the activated carbon block can fully contact the heat generated by the heating wire for regeneration treatment. Moreover, the activated carbon blocks enter the interior of the casing one by one, which can ensure the adsorption effect of the activated carbon blocks.

[0011] The present invention is further configured as follows: heat inlet holes are provided on both sides of the top of the annular plate, and the heat inlet holes are respectively used in cooperation with the casing and the heating wire. An air intake fan is bolted to the top inside the fixed frame.

[0012] With the above technical solution, through the setting of the heat inlet holes and the air intake fan, the working environment of the adsorption component is optimized, and the adsorption and regeneration effects are improved.

[0013] The present invention is further configured as follows: support plates are bolted to the rear sides of both sides inside the fixed frame, and one side of the main shaft close to the support plate is rotatably connected thereto. The left side of the main shaft extends to the left side of the left support plate and is connected to a driving wheel.

[0014] With the above technical solution, the setting of the support plates provides stable support for the rotation of the adsorption component, ensuring that the adsorption component can work normally.

[0015] The present invention is further configured as follows: the decomposition mechanism includes a casing, the casing is bolted to the right side inside the waste gas treatment box, a trough is bolted to the bottom inside the casing, and a mounting frame is bolted inside the trough. A flow guiding frame is arranged inside the mounting frame. Orifice plates are bolted to both sides inside the mounting frame, and the flow guiding frame is located between the opposite sides of the two orifice plates. A distributor is bolted to the top of the mounting frame. A liquid pipe is connected to the left side of the distributor, and a liquid pump structure is connected to the bottom of the liquid pipe. The liquid pump structure is bolted inside the trough. A knocking component is rotatably arranged on the left side of the left orifice plate, and the knocking component is used in cooperation with the left orifice plate.

[0016] With the above technical solution, by setting the decomposition mechanism, the treatment liquid can be transported to the distributor through the liquid pipe by the liquid pump structure and then evenly distributed into the mounting frame by the distributor. When the waste gas enters the mounting frame, it fully contacts the treatment liquid under the action of the flow guiding frame and the orifice plates, and the harmful gases are chemically decomposed. It can effectively decompose small molecule organic matters, soluble acid-base gases, etc. that are difficult to remove by traditional treatment methods, greatly improving the depth and comprehensiveness of waste gas treatment. Moreover, during the rotation of the main shaft, the knocking component will be synchronously driven to generate periodic knocking on the orifice plate, which can knock the left orifice plate to prevent the orifice plate and the flow guiding frame from being blocked by impurities or crystallized substances in the treatment liquid, ensuring that the treatment liquid can continuously and stably flow in the mounting frame, maintaining an efficient decomposition effect, and reducing the equipment maintenance frequency.

[0017] The present invention is further configured as follows: The knocking component includes a connecting shaft, the connecting shaft is rotatably connected inside the left orifice plate, a rotating plate is sleeved on the surface of the connecting shaft, a moving rod is slidably arranged inside the other end of the rotating plate, and a movable protrusion is welded on the side of the moving rod close to the left orifice plate. A return spring is sleeved on the surface of the moving rod, and the two sides of the return spring close to the movable protrusion and the rotating plate are respectively connected to the two. A fixed protrusion is annularly welded on the left side of the left orifice plate, and the fixed protrusion is used in cooperation with the movable protrusion.

[0018] With the above technical solution, by arranging the knocking component, when the main shaft rotates, it will drive the connecting shaft and the rotating plate to rotate. When the rotating plate rotates to the fixed protrusion, since the surfaces of the fixed protrusion and the movable protrusion are set as smooth curved surfaces, the movable protrusion will be pushed to move towards the rotating plate and the return spring will contract. When the movable protrusion is separated from the fixed protrusion, the moving rod will, under the action of the return spring, make the movable protrusion knock on the left orifice plate, so that the left orifice plate and the installation frame vibrate, which can prevent the orifice plate and the diversion frame from being blocked. The annularly arranged fixed protrusion can make the movable protrusion periodically knock on the left orifice plate to ensure that the treatment liquid can continuously and stably flow in the installation frame and maintain an efficient decomposition effect.

[0019] The present invention is further configured as follows: A fixing plate is bolted to the rear side of the left side inside the installation frame, and the left side of the connecting shaft penetrates through the inside of the fixing plate and is bolted to the right side of the main shaft.

[0020] With the above technical solution, the setting of the fixing plate provides stable support for the connecting shaft and ensures that the knocking component can work properly.

[0021] The present invention is further configured as follows: The number of the diversion frames is several, and they are arranged in a stacked manner inside the installation frame. The several diversion frames are integrally arranged in a honeycomb shape, and several liquid passing holes are opened inside the diversion frames.

[0022] With the above technical solution, through the special structure and setting mode of the diversion frame, the contact area between the treatment liquid and the waste gas is increased, and the decomposition efficiency is improved. The honeycomb-shaped diversion frame and the internal liquid passing holes make the treatment liquid evenly distributed in the installation frame and fully contact with the waste gas, enhancing the chemical decomposition effect.

[0023] An exhaust gas treatment method for a baking treatment device of a PCB board includes the following steps: S1. The exhaust gas generated when the baking equipment main body performs the baking treatment of the PCB board is extracted through the fan structure and the air collecting hood at the top, and the exhaust gas is sent into the exhaust gas treatment box through a pipeline, and is purified by the exhaust gas treatment structure; S2. The waste gas entering the waste gas treatment tank is first cooled by the intake pipe and the spiral cooling pipe, and the particulate matter contained in the waste gas is removed by the primary filter element and the secondary filter element respectively. The waste gas after filtration enters the adsorption mechanism; S3. The waste gas passing through the adsorption mechanism can physically adsorb the organic pollutants such as volatile organic solvents and resin decomposition products in the waste gas, and finally the harmful gases contained in the waste gas are chemically decomposed by the decomposition mechanism, and the purified waste gas is discharged from the waste gas treatment tank.

[0024] In summary, the present invention has the following beneficial effects: By setting the adsorption mechanism, it can effectively adsorb organic pollutants such as volatile organic solvents and resin decomposition products, greatly improving the adsorption efficiency. Compared with the traditional single fixed activated carbon adsorption method, it significantly reduces the problem of excessive waste gas emissions caused by insufficient adsorption; By setting the decomposition mechanism, it can chemically decompose the harmful gases contained in the waste gas, and can effectively decompose small molecule organic compounds, soluble acid-base gases, etc. that are difficult to remove by traditional treatment methods, greatly improving the depth and comprehensiveness of waste gas treatment. Brief Description of the Drawings

[0025] Figure 1 is the overall structural schematic diagram of the present invention; Figure 2 is the connection schematic diagram of the waste gas treatment tank and the waste gas treatment structure of the present invention; Figure 3 is the structural schematic diagram of the adsorption mechanism of the present invention; Figure 4 is the structural schematic diagram of the adsorption component of the present invention; Figure 5 is the structural schematic diagram of the decomposition mechanism of the present invention; Figure 6 is the structural schematic diagram of the knocking component of the present invention; Figure 7 is the process schematic diagram of the waste gas treatment method of the baking treatment equipment for the PCB board of the present invention.

[0026] Reference numerals: 1, baking equipment main body; 2, air collecting hood; 3, waste gas treatment box; 4, waste gas treatment structure; 41, treatment frame; 42, primary filter element; 43, secondary filter element; 44, intake cylinder; 45, spiral groove; 46, spiral cooling pipe; 47, adsorption mechanism; 471, fixed frame; 472, annular plate; 473, adsorption assembly; 473a, main shaft; 473b, fixing bracket; 473c, activated carbon block; 473d, housing; 474, heating wire; 475, driving wheel; 476, synchronous belt; 48, decomposition mechanism; 481, housing; 482, tank body; 483, mounting frame; 484, diversion frame; 485, orifice plate; 486, distributor; 487, liquid pipe; 488, liquid pump structure; 489, knocking assembly; 489a, connecting shaft; 489b, rotating plate; 489c, moving rod; 489d, movable protrusion; 489e, return spring; 489f, fixed protrusion; 5, heat inlet hole position; 6, intake fan; 7, support plate; 8, fixing plate. Detailed implementation manners

[0027] The present invention will be further described in detail below with reference to the accompanying drawings.

[0028] Embodiment 1: Reference Figures 1-6 , a baking treatment device for a PCB board, including a baking equipment main body 1, the top of the baking equipment main body 1 is communicated with an air collecting hood 2, the top of the air collecting hood 2 is bolted with a fan structure, and the top of the fan structure is communicated with a waste gas treatment box 3 through a pipeline, and a waste gas treatment structure 4 is arranged inside the waste gas treatment box 3; The waste gas treatment structure 4 includes a treatment frame 41, the treatment frame 41 is bolted to the left side inside the waste gas treatment box 3, a primary filter element 42 and a secondary filter element 43 are respectively bolted to both sides inside the treatment frame 41, the left side of the treatment frame 41 is communicated with an intake cylinder 44, and a spiral groove 45 is opened inside the intake cylinder 44, a spiral cooling pipe 46 is embedded on the surface of the intake cylinder 44, an adsorption mechanism 47 and a decomposition mechanism 48 are respectively arranged on the right side of the treatment frame 41. By arranging the waste gas treatment structure 4, the waste gas entering the waste gas treatment box 3 is cooled under the action of the spiral cooling pipe 46, and then the particulate matter is removed through the primary filter element 42 and the secondary filter element 43. It is not only convenient to remove the contained particulate matter, but also convenient for subsequent adsorption and decomposition treatment. The adsorption mechanism 47 can effectively adsorb organic pollutants such as organic solvent volatiles and resin decomposition products therein, greatly improving the adsorption efficiency. Compared with the traditional single fixed activated carbon adsorption method, the problem of excessive waste gas emissions caused by insufficient adsorption is significantly reduced. And through the decomposition mechanism 48, the harmful gases contained in the waste gas can be chemically decomposed, and small molecule organic substances, soluble acid-base gases, etc. that are difficult to remove by traditional treatment methods can be effectively decomposed, greatly improving the depth and comprehensiveness of waste gas treatment.

[0029] Such asFigure 3 As shown in the figure, the adsorption mechanism 47 includes a fixed frame 471, which is bolted to the middle inside the waste gas treatment box 3. An annular plate 472 is bolted inside the fixed frame 471. An adsorption component 473 is rotatably arranged inside the annular plate 472. Electric heating wires 474 are arranged on both sides of the top inner wall of the fixed frame 471, and the electric heating wires 474 are used in cooperation with the adsorption component 473. Driving wheels 475 are bolted to the left side of the adsorption component 473 and the bottom of the left rear side of the fixed frame 471 respectively, and a synchronous belt 476 is wound between the two driving wheels 475. By setting the adsorption mechanism 47, when waste gas enters the fixed frame 471, the adsorption component 473 rotates driven by the driving wheels 475 and the synchronous belt 476, so that the adsorption component 473 is in full contact with the waste gas to adsorb pollutants. When the adsorption component 473 is saturated with adsorption, it can be heated by the electric heating wires 474 to desorb the pollutants, realizing the regeneration of the adsorption component 473. Therefore, it can effectively adsorb organic pollutants such as organic solvent volatiles and resin decomposition products therein, greatly improving the adsorption efficiency. Compared with the traditional single fixed activated carbon adsorption method, the problem of excessive waste gas emissions caused by insufficient adsorption is significantly reduced.

[0030] As Figure 4 As shown in the figure, the adsorption component 473 includes a main shaft 473a. Fixed frames 473b are arranged annularly on the surface of the main shaft 473a. Activated carbon blocks 473c are arranged inside the fixed frames 473b. Sleeves 473d are in rotational contact with both sides of the top surface of the main shaft 473a, and the tops of the sleeves 473d are connected to the inner wall of the annular plate 472. The fixed frames 473b are rotatably arranged between the opposite sides of the two sleeves 473d. By setting the adsorption component 473, the main shaft 473a drives the fixed frames 473b to rotate, so that the activated carbon blocks 473c and the fixed frames 473b rotate inside the annular plate 472, and the sleeves 473d provide a sealed space for the regeneration of the activated carbon blocks 473c, ensuring that the activated carbon blocks 473c can fully contact the heat generated by the electric heating wires 474 for regeneration treatment. And the activated carbon blocks 473c enter the inside of the sleeves 473d one by one, which can ensure the adsorption effect of the activated carbon blocks 473c.

[0031] As Figure 3 and Figure 4 As shown in the figure, heat inlet holes 5 are opened on both sides of the top of the annular plate 472, and the heat inlet holes 5 are used in cooperation with the sleeves 473d and the electric heating wires 474 respectively. An intake fan 6 is bolted to the top inside the fixed frame 471. Through the settings of the heat inlet holes 5 and the intake fan 6, the working environment of the adsorption component 473 is optimized, and the adsorption and regeneration effects are improved.

[0032] As Figure 3As shown, support plates 7 are bolted to the rear sides on both inner sides of the fixed frame 471, and the spindle 473a is rotatably connected to the side close to the support plate 7. The left side of the spindle 473a extends to the left side of the left support plate 7 and is connected to the drive wheel 475. The arrangement of the support plate 7 provides stable support for the rotation of the adsorption assembly 473, ensuring the normal operation of the adsorption assembly 473.

[0033] As Figure 5 shown, the decomposition mechanism 48 includes a housing 481. The housing 481 is bolted to the right side inside the waste gas treatment box 3. A trough 482 is bolted to the bottom inside the housing 481, and a mounting frame 483 is bolted inside the trough 482. A flow guide frame 484 is arranged inside the mounting frame 483. Orifice plates 485 are bolted to both inner sides of the mounting frame 483, and the flow guide frame 484 is located between the opposite sides of the two orifice plates 485. A distributor 486 is bolted to the top of the mounting frame 483. A liquid pipe 487 is connected to the left side of the distributor 486, and the bottom of the liquid pipe 487 is connected to a liquid pump structure 488. The liquid pump structure 488 is bolted inside the trough 482. A knocking assembly 489 is rotatably arranged on the left side of the left orifice plate 485, and the knocking assembly 489 is used in cooperation with the left orifice plate 485. By arranging the decomposition mechanism 48, the treatment liquid can be transported through the liquid pipe 487 to the distributor 486 by the liquid pump structure 488, and then evenly distributed into the mounting frame 483 by the distributor 486. When the waste gas enters the mounting frame 483, it is in full contact with the treatment liquid under the action of the flow guide frame 484 and the orifice plates 485, and the harmful gases are chemically decomposed. It can effectively decompose small molecule organic substances, soluble acid-base gases, etc. that are difficult to remove by traditional treatment methods, greatly improving the depth and comprehensiveness of waste gas treatment. And during the rotation of the spindle 473a, the knocking assembly 489 will be driven synchronously to generate periodic knocking on the orifice plate 485, which can knock the left orifice plate 485 to prevent the orifice plate 485 and the flow guide frame 484 from being blocked by impurities or crystals in the treatment liquid, ensuring that the treatment liquid can continuously and stably flow in the mounting frame 483, maintaining an efficient decomposition effect and reducing the equipment maintenance frequency.

[0034] As Figure 6As shown, the knocking component 489 includes a connecting shaft 489a which is rotatably connected inside the left orifice plate 485. A rotating plate 489b is sleeved on the surface of the connecting shaft 489a. A moving rod 489c is slidably arranged inside the other end of the rotating plate 489b. And a movable protrusion 489d is welded to the side of the moving rod 489c close to the left orifice plate 485. A return spring 489e is sleeved on the surface of the moving rod 489c, and the two sides of the return spring 489e close to the movable protrusion 489d and the rotating plate 489b are respectively connected to the two. A fixed protrusion 489f is annularly welded to the left side of the left orifice plate 485, and the fixed protrusion 489f is used in cooperation with the movable protrusion 489d. By setting the knocking component 489, when the main shaft 473a rotates, it will drive the connecting shaft 489a and the rotating plate 489b to rotate. When the rotating plate 489b rotates to the fixed protrusion 489f, since the surfaces of the fixed protrusion 489f and the movable protrusion 489d are set as smooth curved surfaces, the movable protrusion 489d will push the moving rod 489c to move towards the position of the rotating plate 489b and make the return spring 489e contract. When the movable protrusion 489d is separated from the fixed protrusion 489f, the moving rod 489c, under the action of the return spring 489e, makes the movable protrusion 489d knock the left orifice plate 485, so that the left orifice plate 485 and the mounting frame 483 vibrate, which can prevent the orifice plate 485 and the flow guide frame 484 from being blocked. And the annularly arranged fixed protrusion 489f can make the movable protrusion 489d periodically knock the left orifice plate 485, ensuring that the treatment liquid can continuously and stably flow in the mounting frame 483 and maintaining an efficient decomposition effect.

[0035] As Figure 5 shown, a fixing plate 8 is bolted to the rear side of the left side inside the mounting frame 483. The left side of the connecting shaft 489a penetrates through the inside of the fixing plate 8 and is bolted to the right side of the main shaft 473a. The setting of the fixing plate 8 provides stable support for the connecting shaft 489a, ensuring that the knocking component 489 can work normally.

[0036] As Figure 5 shown, the number of the flow guide frames 484 is several, and they are arranged in a stacked manner inside the mounting frame 483. The several flow guide frames 484 are integrally arranged in a honeycomb shape, and several liquid passing holes are formed inside the flow guide frames 484. Through the special structure and setting mode of the flow guide frames 484, the contact area between the treatment liquid and the waste gas is increased, and the decomposition efficiency is improved. The honeycomb-shaped flow guide frames 484 and the internal liquid passing holes make the treatment liquid evenly distributed in the mounting frame 483, fully contact with the waste gas, and enhance the chemical decomposition effect.

[0037] Brief description of the usage process: When the PCB board is baked in the baking equipment main body 1, waste gas containing complex components such as volatile organic solvents, resin decomposition products, acid-base gases, and particulate matter is generated. The waste gas rises naturally and is collected by the air collection hood 2 set at the top of the baking equipment main body 1. The top fan structure of the air collection hood 2 generates a strong suction force, and the waste gas collected in the air collection hood 2 enters the intake cylinder 44 connected to the left side of the treatment frame 41 through a pipeline. The spiral groove 45 opened inside the intake cylinder 44 guides the waste gas to flow along a specific path. At the same time, the spiral cooling pipe 46 embedded on the surface of the intake cylinder 44 starts to function. The spiral cooling pipe 46 is externally connected to a refrigeration device and coolant is introduced. Through the principle of heat exchange, the temperature of the waste gas is reduced. The cooled waste gas passes through the primary filter element 42 and the secondary filter element 43 in sequence. The primary filter element 42 uses a coarse filter material and can filter out larger particle impurities in the waste gas, such as dust, resin particles, etc. The secondary filter element 43 uses a more refined filter material to further remove tiny particulate matter in the waste gas. Subsequently, the pretreated waste gas enters the adsorption mechanism 47. The adsorption assembly 473 starts to rotate driven by the driving wheel 475 and the synchronous belt 476. The driving wheel 475 is driven by a power device such as a motor. The main shaft 473a rotates accordingly, driving the fixedly arranged fixing frame 473b on the surface to rotate. The activated carbon blocks 473c in the fixing frame 473b also rotate together. During the flow of the waste gas in the fixed frame 471, it comes into full contact with the rotating activated carbon blocks 473c. The activated carbon blocks 473c, relying on their huge specific surface area and rich microporous structure, physically adsorb organic pollutants such as volatile organic solvents and resin decomposition products in the waste gas, effectively reducing the content of organic pollutants in the waste gas. As the adsorption process continues, the activated carbon blocks 473c gradually become saturated with adsorption. At this time, the heating wire 474 is activated. The heat generated by the heating wire 474 is precisely guided through the heat inlet hole position 5 to the activated carbon blocks 473c in the sleeve 473d. The activated carbon blocks 473c are heated in the sleeve 473d, and the adsorbed pollutants desorb. The regenerated activated carbon blocks 473c continue to participate in the adsorption work. The waste gas after adsorption enters the interior of the housing 481, and the liquid pump structure 488 transports the treatment liquid in the tank 482 to the distributor 486 through the liquid pipe 487. The distributor 486 evenly distributes the treatment liquid to the flow guide frames 484 in the installation frame 483. The flow guide frames 484 are numerous and are arranged in a stacked and honeycomb shape, with several liquid passing holes opened inside. The treatment liquid forms a special flow path in the flow guide frames 484 and comes into full contact with the waste gas entering the installation frame 483. Harmful gases in the waste gas, such as small molecule organic substances and soluble acid-base gases, react chemically with the treatment liquid and are decomposed into harmless or easily treatable substances. And when the main shaft 473a rotates, it drives the knocking assembly 489 to work through the connecting shaft 489a. The connecting shaft 489a rotates stably supported by the fixing plate 8. The rotating plate 489b sleeved on the surface of the connecting shaft 489a rotates accordingly. When the rotating plate 489b rotates to the position of the fixed protrusion 489f,Due to the smooth surfaces of the fixed protrusion 489f and the movable protrusion 489d, the movable protrusion 489d pushes the moving rod 489c in the direction of the rotating plate 489b, and the return spring 489e contracts. After the movable protrusion 489d separates from the fixed protrusion 489f, the return spring 489e releases its elastic potential energy, pushing the moving rod 489c to make the movable protrusion 489d strike the left orifice plate 485. The annularly arranged fixed protrusion 489f enables the movable protrusion 489d to periodically strike the left orifice plate 485, and the generated vibration effectively prevents the orifice plate 485 and the diversion frame 484 from being blocked by impurities or crystals in the treatment liquid, ensuring that the treatment liquid can continuously and stably flow in the installation frame 41, maintaining an efficient decomposition effect, and finally the exhaust gas is discharged from the exhaust gas treatment box 3.

[0038] Embodiment 2 As Figure 7 shown, the present invention also provides an exhaust gas treatment method for a baking treatment device of a PCB board, including the following steps: S1. The exhaust gas generated during the baking treatment of the baking device main body 1 is extracted through the fan structure and the air collecting hood 2 at the top and sent into the exhaust gas treatment box 3 through a pipeline, and is purified by the exhaust gas treatment structure 4. S2. The exhaust gas entering the exhaust gas treatment box 3 is first cooled through the intake cylinder 44 and the spiral cooling pipe 46, and the particulate matter contained in the exhaust gas is removed by the primary filter element 42 and the secondary filter element 43 respectively. The filtered exhaust gas enters the adsorption mechanism 47. S3. The exhaust gas passing through the adsorption mechanism 47 can physically adsorb the organic pollutants such as volatile organic solvents and resin decomposition products in the exhaust gas, and finally the harmful gases contained in the exhaust gas are chemically decomposed by the decomposition mechanism 48, and the purified exhaust gas is discharged from the exhaust gas treatment box 3.

[0039] This specific embodiment is only an explanation of the present invention, and it is not a limitation of the present invention. Those skilled in the art can make modifications without creative contributions to this embodiment according to needs after reading this specification, but as long as it is within the scope of the claims of the present invention, it is protected by the patent law.

Claims

1. A baking treatment device for a PCB board, comprising a baking device body (1), characterized in that: The top of the baking equipment body (1) is connected to an air collecting hood (2), the top of the air collecting hood (2) is bolted to a fan structure, and the top of the fan structure is connected to an exhaust gas treatment box (3) through a pipeline, and an exhaust gas treatment structure (4) is arranged inside the exhaust gas treatment box (3); The exhaust gas treatment structure (4) comprises a treatment frame (41), wherein the treatment frame (41) is bolted to the left side of the exhaust gas treatment box (3), and the two sides of the treatment frame (41) are respectively bolted with a primary filter element (42) and a secondary filter element (43), the left side of the treatment frame (41) is connected to an air intake cylinder (44), and a spiral groove (45) is provided inside the air intake cylinder (44), and a spiral cooling pipe (46) is embedded on the surface of the air intake cylinder (44), and an adsorption mechanism (47) and a decomposition mechanism (48) are respectively provided on the right side of the treatment frame (41).

2. The baking treatment equipment for PCB board according to claim 1, characterized in that: The adsorption mechanism (47) comprises a fixed frame (471), the fixed frame (471) is bolted to the middle part of the exhaust gas treatment box (3), an annular plate (472) is bolted to the inside of the fixed frame (471), an adsorption assembly (473) is rotatably arranged inside the annular plate (472), electric heating wires (474) are arranged on both sides of the top of the inner wall of the fixed frame (471), and the electric heating wires (474) are used in conjunction with the adsorption assembly (473), the left side of the adsorption assembly (473) and the bottom of the left rear side of the fixed frame (471) are bolted to driving wheels (475), and a synchronous belt (476) is wound between the insides of the two driving wheels (475).

3. The baking treatment equipment for PCB board according to claim 2, characterized in that: The adsorption component (473) comprises a main shaft (473a), a fixing frame (473b) is arranged in an annular shape on the surface of the main shaft (473a), an activated carbon block (473c) is arranged inside the fixing frame (473b), both sides of the top of the surface of the main shaft (473a) (472) are in rotational contact with a sleeve (473d), and the top of the sleeve (473d) is connected to the inner wall of the annular plate (472), and the fixing frame (473b) is rotatably arranged between the opposite sides of the two sleeves (473d).

4. The baking treatment equipment for PCB board according to claim 3, characterized in that: Heat inlet holes (5) are provided on both sides of the top of the annular plate (472), and the heat inlet holes (5) are used in conjunction with the casing (473d) and the heating wire (474), respectively. An air intake fan (6) is bolted to the top of the interior of the fixed frame (471).

5. The baking treatment equipment for PCB board according to claim 3, characterized in that: The rear sides of both sides of the fixed frame (471) are bolted to support plates (7), and the side of the main shaft (473a) close to the support plate (7) is rotatably connected thereto, and the left side of the main shaft (473a) extends to the left side of the left support plate (7) and is connected to the driving wheel (475).

6. The baking treatment equipment for PCB board according to claim 2, characterized in that: The decomposition mechanism (48) comprises a shell (481), the shell (481) being bolted to the right side of the exhaust gas treatment box (3), a trough (482) being bolted to the bottom of the shell (481), and a mounting frame (483) being bolted to the inside of the trough (482), a guide frame (484) being arranged inside the mounting frame (483), orifice plates (485) being bolted to both sides of the mounting frame (483), and the guide frame (484) being located between the two orifice plates ( 485), a distributor (486) is bolted to the top of the mounting frame (483), a liquid pipe (487) is connected to the left side of the distributor (486), and a liquid pump structure (488) is connected to the bottom of the liquid pipe (487), and the liquid pump structure (488) is bolted to the inside of the tank body (482), and a knocking assembly (489) is rotatably provided on the left side of the left orifice plate (485), and the knocking assembly (489) is used in conjunction with the left orifice plate (485).

7. The baking treatment equipment for PCB board according to claim 6, characterized in that: The knocking assembly (489) includes a connecting shaft (489a), the connecting shaft (489a) is rotatably connected to the inside of the left hole plate (485), the surface of the connecting shaft (489a) is sleeved with a rotating plate (489b), the other end of the rotating plate (489b) is slidably provided with a moving rod (489c), and a movable protrusion (489d) is welded on the side of the moving rod (489c) close to the left hole plate (485), a return spring (489e) is sleeved on the surface of the moving rod (489c), and the side of the return spring (489e) close to the movable protrusion (489d) and the rotating plate (489b) are respectively connected to the two, and a fixed protrusion (489f) is welded in an annular shape on the left side of the left hole plate (485), and the fixed protrusion (489f) is used in conjunction with the movable protrusion (489d).

8. The baking treatment equipment for PCB board according to claim 7, characterized in that: A fixing plate (8) is bolted to the rear side of the left side inside the installation frame (483), and the left side of the connecting shaft (489a) passes through the inside of the fixing plate (8) and is bolted to the right side of the main shaft (473a).

9. The baking treatment equipment for PCB board according to claim 6, characterized in that: The guide frames (484) are multiple in number and are arranged in a stacked manner inside the installation frame (483); the guide frames (484) are arranged in a honeycomb shape as a whole, and a plurality of liquid passage holes are provided inside the guide frames (484).

10. The method for treating waste gas of a baking treatment device for a PCB board according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. The exhaust gas generated by the baking equipment body (1) during the baking process of the PCB board is extracted through the fan structure and the air collecting hood (2) at the top, and is sent to the exhaust gas treatment box (3) through the pipeline, and is purified by the exhaust gas treatment structure (4); S2. The exhaust gas entering the exhaust gas treatment box (3) is first cooled by the air inlet cylinder (44) and the spiral cooling tube (46), and the particulate matter contained in the exhaust gas is removed by the primary filter element (42) and the secondary filter element (43), and the filtered exhaust gas enters the adsorption mechanism (47); S3. The waste gas passing through the adsorption mechanism (47) can physically adsorb organic pollutants such as organic solvent volatiles and resin decomposition products in the waste gas, and finally the harmful gases contained in the waste gas are chemically decomposed by the decomposition mechanism (48), and the purified waste gas is discharged from the waste gas treatment box (3).

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