High-temperature double-sided tape preparation system

Abstract

The invention discloses a high-temperature double-sided adhesive tape preparation system, and relates to the technical field of double-sided adhesive tape preparation, the high-temperature double-sided adhesive tape preparation system comprises a servicing module, the servicing module is in communication connection with a preparation module, the preparation module is in communication connection with a quality control module, and the quality control module is in communication connection with a processing module. The quality control module transmits a detection result to the processing module after detection, the processing module divides the double-sided adhesive tape into a high-quality double-sided adhesive tape and a low-quality double-sided adhesive tape according to received data, and the processing module is in communication connection with the packaging module; the device has the advantages that the real-time image unit and the quality control module are used for detecting the gluing thickness and the preparation temperature of the adhesive tape in the preparation process, when the two sets of information have large deviation, a warning signal can be transmitted to a mobile phone of a manager to warn the manager to conduct detection, and the production efficiency is improved. And meanwhile, an instruction is sent to the servicing module and the preparation module to slowly decelerate and stop, so that the problem that the quality of the manufactured adhesive tape is unknown due to the fact that a detection mechanism is damaged but equipment still runs is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of double-sided tape preparation, and specifically to a high-temperature double-sided tape preparation system. Background Art

[0002] Tapes are particularly widely used in some 3C electronic products. With the increasing development of technology in current 3C electronic products, electronic products such as mobile phones and tablet computers are gradually becoming thinner and lighter. Some components inside mobile phones are also gradually developing towards a thinner trend. As a result, the remaining space inside mobile phones and electronic products is relatively small, and the remaining space for double-sided tapes used for fixed bonding inside mobile phones and electronic products also becomes relatively smaller. During preparation, tapes of different sizes need to be cut according to requirements. However, the current preparation system only uses a single quality inspection method. If this module fails to detect during practical application, the quality of the tapes manufactured subsequently cannot be detected, and some inferior products will appear. For this reason, we propose a high-temperature double-sided tape preparation system. Summary of the Invention

[0003] The purpose of the present invention is to provide a high-temperature double-sided tape preparation system.

[0004] To solve the problems raised in the above background art, the present invention provides the following technical solution: A high-temperature double-sided tape preparation system includes a preparation module, which is communicatively connected to a manufacturing module, the manufacturing module is communicatively connected to a quality control module, the quality control module is communicatively connected to a processing module. After detection, the quality control module will transmit the detection results to the processing module. The processing module will classify the double-sided tapes into two types: high-quality and inferior according to the received data. The processing module is communicatively connected to a packaging module. The preparation module includes an adhesive selection unit and a base material selection unit. The manufacturing module includes a coating unit, a drying unit, a conveying unit, a cutting unit, and a real-time imaging unit. The quality control module includes a laser thickness measurement unit and a temperature detection unit, where: The real-time imaging unit can be converted into four groups of cameras. The four groups of cameras are respectively installed at the feeding port, discharging port, glue coating position, and cutting position of the tape-making machine. The real-time images captured by the four groups of cameras can be used to detect the normal operation of the machine. At the same time, by introducing video analysis technology, frame-by-frame analysis of the captured real-time images can be carried out to achieve rapid troubleshooting of faults. The laser thickness measurement unit measures the coating thickness of the double-sided tape using a laser and transmits the measurement data to the processing module. The temperature detection unit monitors the temperatures at the glue coating position, curing position, and cutting position in real time and transmits the temperature data to the processing module. A processing module is used to compare the received temperature information and glue coating thickness information with the set standard values. When the temperature is too high, it will turn on the water-cooled heat dissipation structure until the temperature drops to the standard value. When the glue coating thickness is greater than or less than the standard value, it will control the coating unit to adjust the glue coating thickness at this time.

[0005] As a further solution of the present invention: The adhesive selection unit selects a high-temperature resistant adhesive that can maintain stability and adhesion performance in a high-temperature environment through network retrieval and comparison. The substrate selection unit can select a high-temperature resistant substrate and clean the substrate to ensure a clean surface.

[0006] As a further solution of the present invention: The coating unit uses a roller to evenly coat the adhesive on the surface of the substrate, and the height of the roller is adjustable to control the thickness of the glue coating. The drying unit puts the substrate coated with the adhesive into a drying chamber and controls the temperature between 50°C and 150°C to dry and cure the glue layer to ensure that the glue layer is firmly bonded to the substrate and not easily peeled off.

[0007] As a further solution of the present invention: The conveying unit turns over the fixed substrate and then transports it to the coating unit again to coat the adhesive on the other side of the substrate, and repeats the steps of coating and drying and curing to ensure that the glue layers on both sides are uniform.

[0008] As a further solution of the present invention: The cutting unit is used to cut the dried and cured double-sided adhesive material into tape shapes as required, and tapes of different widths and lengths can be set according to needs.

[0009] As a further solution of the present invention: The processing module is communicatively connected to the packaging module, and the processing module sets the temperature to three groups of standard values according to different processes. The standard temperature during glue coating is set to 20°C - 40°C, the standard temperature during curing is set to ≤150°C, and the standard temperature during cutting is set to ≤45°C. The processing module sets the standard thickness value during glue coating to 0.05mm - 0.2mm.

[0010] As a further solution of the present invention: The packaging module is used to package the cut high-temperature double-sided tape to ensure the cleanliness of the product, and at the same time, compressive packaging materials can be selected for convenient transportation and storage.

[0011] As a further solution of the present invention: The real-time imaging unit is communicatively connected to the processing module. The real-time imaging unit can measure the glue coating thickness and the temperatures at the glue coating, curing, and cutting locations through real-time imaging analysis technology, and transmit the data to the processing module for processing.

[0012] As a further solution of the present invention: the double detection of the real-time imaging unit and the quality control module makes the detection result more accurate. The processing module has priority, and the processing module can directly retrieve the real-time images captured by the real-time imaging unit.

[0013] Adopting the above technical solution, compared with the prior art, the beneficial effects of the present invention are as follows: 1. The present invention detects the glue coating thickness and preparation temperature of the tape during preparation through the real-time imaging unit and the quality control module. When there is a large deviation between the two sets of information, the processing module will extract the data of the real-time imaging unit and the quality control module multiple times. When the error is still very large after multiple extractions, a warning signal will be sent to the manager's mobile phone to alert the manager to conduct inspections. At the same time, commands will be sent to the preparation module and the preparation module to slow down and stop, reducing the problem of unclear quality of the tape manufactured due to damage to the detection mechanism but the equipment still running. 2. The double detection mechanism of the real-time imaging unit and the quality control module of the present invention ensures the accuracy of the detection results. The quality control module can more accurately judge the quality of the double-sided tape by measuring the thickness and detecting the temperature, combined with the data provided by the real-time imaging unit. This helps to reduce the defective rate and improve the consistency and reliability of the product. Description of the Drawings

[0014] Figure 1 It is a schematic diagram of the system flow in the embodiment of the present invention. Specific Embodiments

[0015] The following further describes the specific embodiments of the present invention with reference to the drawings. It should be noted here that the description of these embodiments is for helping to understand the present invention, but does not constitute a limitation to the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0016] Embodiment 1. Please refer to the attached Figure 1 , the present invention provides a technical solution: a high-temperature double-sided tape preparation system, including a preparation module, which is communicatively connected with a preparation module, the preparation module is communicatively connected with a quality control module, the quality control module is communicatively connected with a processing module, and the quality control module will transmit the detection result to the processing module after detection. The processing module will classify the double-sided tape into two types: high-quality and low-quality according to the received data. The processing module is communicatively connected with a packaging module. The preparation module includes an adhesive selection unit and a substrate selection unit. The preparation module includes a coating unit, a drying unit, a conveying unit, a cutting unit, and a real-time imaging unit. The quality control module includes a laser thickness measurement unit and a temperature detection unit, where: A real-time imaging unit that can be converted into four groups of cameras. The four groups of cameras are respectively installed at the feeding port, discharging port, glue coating area, and cutting area of the tape making machine. The real-time images captured by the four groups of cameras can be used to detect the normal operation of the machine. At the same time, by introducing video analysis technology, the captured real-time images are analyzed frame by frame, enabling rapid troubleshooting of faults; A laser thickness measurement unit that uses laser to measure the glue coating thickness of the double-sided tape and transmits the measurement data to the processing module; A temperature detection unit that monitors the temperatures at the glue coating area, curing area, and cutting area in real time and transmits the temperature data to the processing module; A processing module that is used to compare the received temperature information and glue coating thickness information with the set standard values. When the temperature is too high, it will turn on the water-cooled heat dissipation structure until the temperature drops to the standard value. When the glue coating thickness is greater than or less than the standard value, it will control the coating unit to adjust the glue coating thickness at this time.

[0017] Please refer to the appendix Figure 1 , the adhesive selection unit retrieves and compares through the network to select a high-temperature resistant adhesive that can maintain stability and adhesion performance in high-temperature environments. The substrate selection unit can select a high-temperature resistant substrate and clean the substrate to ensure a clean surface. The coating unit uses rollers to evenly coat the adhesive on the surface of the substrate, and the height of the rollers is adjustable to control the glue coating thickness. The drying unit places the substrate coated with the adhesive into the drying chamber and controls the temperature between 50°C and 150°C to dry and cure the glue layer to ensure that the glue layer is firmly bonded to the substrate and not easily peeled off. The conveying unit flips the fixed substrate and then transports it back to the coating unit to coat the other side of the substrate with the adhesive, repeating the steps of coating and drying and curing to ensure uniform glue layers on both sides. The cutting unit is used to cut the dried and cured double-sided tape material into tape shapes as required, and tapes of different widths and lengths can be set according to needs; In this embodiment, the real-time imaging unit can measure the temperature and glue coating thickness through optical measurement technology and transmit the measurement values to the processing module. The processing module simultaneously receives the data from the real-time imaging unit and the quality control module, and compares the two sets of data to calculate whether the difference is too large. The temperature difference calculation formula and the glue thickness calculation formula are as follows: =log - =log - Where D1 and D2 are the temperature difference calculation formula and the glue thickness difference calculation formula respectively, and the numerical units calculated by D1 and D2 are degrees Celsius and millimeters respectively, and respectively represent The sum of the exponential function values with and, and respectively calculate the average value of the exponential function values with . log represents the natural logarithm of this average value. and represent the absolute difference between and and calculate the square root of the absolute difference. Finally, subtract the logarithmic function value from the square root value to obtain the final difference and . When ≤5°C and ≤0.02 mm, the processing module will send a warning signal to the manager's mobile phone to alert the manager to conduct inspections, and at the same time issue commands to the maintenance module and the preparation module to slow down and stop. When ≤5°C and ≤0.02 mm, the processing module will compare the data value transmitted by the real-time imaging unit with the standard value. The comparison formula between the measured value of the processing module and the standard value is as follows: # Define the standard value range lower_tui = 0.05 mm upper_tui = 0.2 mm # Measured value measurement = X # Determine whether the value is within the standard range If lower_tui <= measurement <= upper_tui: # End the command within the standard range and mark this batch of tapes as high-quality print("End the command and mark this batch of tapes as high-quality") else: # Mark this batch of tapes as low-quality if it is not within the standard range print("Mark this batch of tapes as low-quality if it is not within the standard range"): Among them, lower_tui = 0.05 mm and upper_tui = 0.2 mm define the lower and upper limits of the standard value range. In this example, the value of lower_tui is 0.05 mm and the value of upper_tui is 0.2 mm, which means the range of measured values within the standard range is from 0.05 mm to 0.2 mm. measurement = X means that the measured value is set to X. Comparing X with the standard value will result in two outcomes. When the measured value is within the standard value range, the command ends. When the measured value is not within the standard value range, the processing module will control the preparation module to adjust the height of the roller. The error values of the data measured by the real-time imaging unit and the quality control module are relatively small and may be negligible. The real-time imaging unit uses video analysis technology to enable the system to monitor the machine in real time and troubleshoot faults during operation, which not only improves production efficiency but also ensures the reliability and stability of the preparation process.

[0018] During use, the real-time imaging unit and the quality control module detect the coating thickness and preparation temperature of the tape during preparation. When there is a large deviation between the two sets of information, the processing module will extract the data of the real-time imaging unit and the quality control module multiple times. When the error is still very large after multiple extractions, a warning signal will be sent to the manager's mobile phone to alert the manager to conduct inspections. At the same time, commands will be sent to the preparation module and the manufacturing module to slow down and stop, reducing the problem of unclear quality of the tape produced because the detection mechanism is damaged but the equipment is still running.

[0019] Embodiment 2. Please refer to the appendix Figure 1 , the present invention provides a technical solution: a high-temperature double-sided tape preparation system, including a preparation module, which is communicatively connected to a manufacturing module, the manufacturing module is communicatively connected to a quality control module, the quality control module is communicatively connected to a processing module. After detection, the quality control module will transmit the detection results to the processing module. The processing module will classify the double-sided tape into high-quality and low-quality according to the received data. The processing module is communicatively connected to a packaging module. The preparation module includes an adhesive selection unit and a substrate selection unit. The manufacturing module includes a coating unit, a drying unit, a conveying unit, a cutting unit, and a real-time imaging unit. The quality control module includes a laser thickness measurement unit and a temperature detection unit, where: The real-time imaging unit can be converted into four groups of cameras. The four groups of cameras are respectively installed at the feeding port, discharging port, coating place, and cutting place of the tape making machine. The real-time images taken by the four groups of cameras can be used to detect the normal operation of the machine. At the same time, by introducing video analysis technology, frame-by-frame analysis of the taken real-time images can be carried out to achieve rapid troubleshooting of faults; The laser thickness measurement unit measures the coating thickness of the double-sided tape using a laser and transmits the measurement data to the processing module; A temperature detection unit that monitors the temperatures at the glue - applying, curing, and cutting locations in real - time and transmits the temperature data to the processing module; A processing module that compares the received temperature information and glue - applying thickness information with the set standard values. When the temperature is too high, it will turn on the water - cooled heat - dissipation structure until the temperature drops to the standard value. When the glue - applying thickness is greater than or less than the standard value, it will control the coating unit to adjust the glue - applying thickness.

[0020] Please refer to the appendix Figure 1 The processing module is communicatively connected to the packaging module. And the processing module sets the temperature to three groups of standard values according to different processes. The standard temperature during glue - applying is set at 20°C - 40°C, the standard temperature during curing is set at ≤150°C, and the standard temperature during cutting is set at ≤45°C. The processing module sets the thickness standard value during glue - applying to 0.05mm - 0.2mm. The packaging module is used to package the cut high - temperature double - sided tape to ensure the cleanliness of the product. At the same time, it can select compression - resistant packaging materials for convenient transportation and storage. The real - time imaging unit is communicatively connected to the processing module. The real - time imaging unit can measure the glue - applying thickness and the temperatures at the glue - applying, curing, and cutting locations through real - time imaging analysis technology and transmit the data to the processing module for processing. The dual detection of the real - time imaging unit and the quality control module makes the detection results more accurate. The processing module has priority, and the processing module can directly retrieve the real - time images captured by the real - time imaging unit.

[0021] In this embodiment, the processing module sets the temperature standard values to three groups, named as sets Q, W, and E. When the measured value is within the sets of Q, W, and E, no interference is required. When the measured value is not within the sets of Q, W, and E and is greater than the highest value within the sets, the processing module will start the water - cooled structure to reduce the temperature until the temperature drops within the standard value. The adhesive selection unit and the substrate selection unit select high - temperature - resistant adhesives and substrates to ensure the product stability and adhesion performance. The coating unit evenly coats the adhesive on the surface of the substrate. The drying unit controls the temperature to dry and cure the adhesive layer. The conveying unit flips the substrate and transports it back to the coating unit to ensure uniform adhesive layers on both sides. The cutting unit cuts the dried and cured double - sided tape material into tape shapes according to requirements; The functions of the four groups of cameras set by the real - time imaging unit are as follows: The feeding - port camera: monitors the situation of raw materials entering the tape - making machine to ensure the correct supply of raw materials and the smooth progress of the feeding process; The discharging - port camera: monitors the situation of the manufactured double - sided tape output from the discharging port of the tape - making machine to ensure the product quality and production efficiency; The glue - applying - location camera: monitors the uniform coating of the adhesive during the glue - applying process and the control of the glue - applying thickness to ensure the quality of the adhesive layer; Cutting camera: Monitor the cutting condition of the double-sided tape at the cutting position to ensure the cutting accuracy and the consistency of the product shape; In this way, the four groups of cameras can comprehensively monitor each key part of the tape making machine. Through real-time imaging and video analysis technology, the operating state of the machine can be detected more comprehensively, problems can be found in time and troubleshooting can be carried out, improving production efficiency and product quality.

[0022] During use, the double detection mechanism of the real-time imaging unit and the quality control module ensures the accuracy of the detection results. The quality control module can more accurately judge the quality of the double-sided tape by thickness measurement and temperature detection, combined with the data provided by the real-time imaging unit. This helps to reduce the defective rate and improve the consistency and reliability of the product.

[0023] Working principle: First step: Through the adhesive selection unit, conduct a network search and comparison to select a high-temperature resistant adhesive that can maintain stability and adhesion performance in a high-temperature environment, and select one. Subsequently, the substrate selection unit selects a high-temperature resistant substrate and cleans the substrate. Then, the coating unit uses a roller to evenly coat the adhesive on the surface of the substrate. Then, the drying unit puts the substrate coated with the adhesive into the drying chamber, controls the temperature between 50°C and 150°C to dry and cure the adhesive layer, ensuring that the adhesive layer is firmly bonded to the substrate and not easily peeled off. At this time, the conveying unit turns over the fixed substrate and then transports it back to the coating unit to repeat the steps of coating, drying and curing to ensure that the adhesive layers on both sides are uniform; Second step: During the tape manufacturing process, the real-time imaging unit is installed at different positions of the tape making machine to simultaneously capture real-time images for detecting the normal operation of the machine and troubleshooting. Subsequently, the quality control module measures the coating thickness of the double-sided tape, monitors the temperature at the coating, curing and cutting positions in real time, and transmits the data to the processing module. The processing module receives the temperature information and the coating thickness information, compares the data with the set standard values, controls the coating unit to adjust the coating thickness according to the comparison results, sets the temperature standard values according to different processes, and conducts fault handling. Then, the cutting unit cuts the dried and cured double-sided tape material into the shape of the tape as required. Finally, the packaging module packages the cut high-temperature double-sided tape to ensure the product is clean.

[0024] Those skilled in the art should understand that the above-mentioned modules or steps of the present invention can be implemented by a general-purpose computer device. Optionally, they can be implemented by program codes executable by a computing device, so that they can be stored in a storage device and executed by the computing device, or they can be separately made into individual integrated circuit modules, or multiple modules or steps among them can be made into a single integrated circuit module to implement. The present invention is not limited to any specific combination of hardware and software.

[0025] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

[0026] Although the specific implementation manners of the present invention have been described above in conjunction with the accompanying drawings, they do not limit the protection scope of the present invention. Those skilled in the art should understand that based on the technical solutions of the present invention, various modifications or deformations that can be made by those skilled in the art without creative efforts are still within the protection scope of the present invention.

Claims

1. A high-temperature double-sided tape preparation system, comprising a preparation module, characterized in that: The preparation module is connected in communication with the preparation module, the preparation module is connected in communication with the quality control module, the quality control module is connected in communication with the processing module, the quality control module transmits the detection result to the processing module after detection, the processing module classifies the double-sided tape into high-quality and low-quality according to the received data, the processing module is connected in communication with the packaging module, the preparation module includes an adhesive selection unit and a substrate selection unit, the preparation module includes a coating unit, a drying unit, a conveying unit, a cutting unit and a real-time imaging unit, the quality control module includes a laser thickness measurement unit and a temperature detection unit, wherein: The real-time imaging unit can be converted into four sets of cameras, which are installed at the feeding port, discharging port, gluing area and cutting area of ​​the belt making machine respectively. The real-time images taken by the four sets of cameras can be used to detect the normal operation of the machine. By introducing video analysis technology, the real-time images taken are analyzed frame by frame, which can realize rapid troubleshooting of faults. A laser thickness measurement unit, which uses laser to measure the adhesive thickness of the double-sided tape and transmits the measurement data to the processing module; The temperature detection unit monitors the temperature of the gluing, curing and cutting areas in real time and transmits the temperature data to the processing module; The processing module is used to compare the received temperature information and glue thickness information with the set standard value. When the temperature is too high, the water cooling structure will be turned on until the temperature drops to the standard value. When the glue thickness is greater than or less than the standard value, the coating unit will be controlled to adjust the glue thickness.

2. A high temperature double-sided tape preparation system according to claim 1, characterized in that: The adhesive selection unit selects a high temperature resistant adhesive that can maintain stability and adhesion performance in a high temperature environment through network retrieval and comparison. The substrate selection unit can select a high temperature resistant substrate and clean the substrate to ensure a clean surface.

3. A high temperature double-sided tape preparation system according to claim 1, characterized in that: The coating unit uses a roller to evenly coat the adhesive on the surface of the substrate, and the height of the roller is adjustable to control the thickness of the coating. The drying unit puts the substrate coated with the adhesive into a drying chamber and controls the temperature between 50°C and 150°C to dry and solidify the adhesive layer to ensure that the adhesive layer is firmly bonded to the substrate and is not easy to peel off.

4. A high temperature double-sided tape preparation system according to claim 1, characterized in that: The conveying unit turns over the fixed substrate and transfers it to the coating unit again, and coats the substrate on the other side with adhesive, repeating the coating and drying and curing steps to ensure uniform adhesive layers on both sides.

5. A high temperature double-sided tape preparation system according to claim 1, characterized in that: The cutting unit is used to cut the dried and cured double-sided adhesive material into a tape shape as required, and tapes of different widths and lengths can be provided as required.

6. A high temperature double-sided tape preparation system according to claim 1, characterized in that: The processing module is communicatively connected with the packaging module, and the processing module sets the temperature to three groups of standard values ​​according to different processes, sets the standard temperature during gluing to 20°C-40°C, sets the standard temperature during curing to ≤150°C, and sets the standard temperature during cutting to ≤45°C. The processing module sets the standard value of thickness during gluing to 0.05mm-0.2mm.

7. A high temperature double-sided tape preparation system according to claim 1, characterized in that: The packaging module is used to package the cut high-temperature double-sided adhesive tape to ensure the neatness of the product. At the same time, pressure-resistant packaging materials can be selected to facilitate transportation and storage.

8. A high temperature double-sided tape preparation system according to claim 1, characterized in that: The real-time imaging unit is communicatively connected with the processing module. The real-time imaging unit can measure the thickness of the glue coating and the temperature of the glue coating, curing and cutting locations through real-time imaging analysis technology, and transmit the data to the processing module for processing.

9. A high temperature double-sided tape preparation system according to claim 1, characterized in that: The dual detection of the real-time imaging unit and the quality control module makes the detection result more accurate. The processing module has priority, and the processing module can directly retrieve the real-time image taken by the real-time imaging unit.

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