Semiconductor sorting machine

Abstract

The invention relates to the technical field of automation equipment, and discloses a semiconductor sorting machine which is characterized in that a full Tray feeding area, an empty Tray recycling area, a testing area and a sorting discharging area are divided on a workbench according to processing areas, and then all the areas are regulated and controlled to be in linkage fit through manipulators, so that process integration of feeding, testing and discharging sorting of chips can be achieved, and the working efficiency is improved. Therefore, mechanical and automatic operation in the whole process is achieved, the overall efficiency of chip production can be remarkably improved, the production process is optimized, manpower is saved, and new power is injected to sustainable development of the chip manufacturing industry.

Description

Technical Field

[0001] The present invention relates to the technical field of automated equipment, and particularly to a semiconductor sorter. Background Art

[0002] In the production process before the chips leave the factory, there is a necessary but cumbersome link, that is, workers are required to manually place each chip one by one into a special test carrier for detailed electrical performance testing. After this step is completed, the workers also need to manually operate again to take out the tested chips one by one and carefully sort and classify them according to the test results. The entire operation process not only highly relies on manual participation, but also is cumbersome and complex, resulting in a large consumption of human resources. At the same time, due to the limitations and efficiency bottlenecks of manual operations, the overall production efficiency is relatively low.

[0003] In view of this, in order to effectively improve the work efficiency of the chip testing and sorting links and reduce the excessive dependence on human resources, it is urgent to develop an innovative testing device. This device should be able to integrate multiple processes such as chip loading, electrical testing, and unloading and sorting, and achieve mechanized and automated operations throughout the process. By introducing such high-tech testing equipment, it is expected that the overall efficiency of chip production will be significantly improved, the production process will be optimized, and thus new impetus will be injected into the sustainable development of the chip manufacturing industry.

[0004] The above information is given as background information only to assist in understanding the present disclosure, and does not determine or admit whether any of the above content can be used as the prior art relative to the present disclosure. Summary of the Invention

[0005] The present invention provides a semiconductor sorter to solve the problems existing in the prior art.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A semiconductor sorter includes a workbench, and the workbench is divided into a full Tray loading area, an empty Tray recycling area, a testing area, and a sorting and unloading area according to the processing area;

[0008] The full Tray loading area is used to store a plurality of Tray trays loaded with chips to be tested;

[0009] A chip transfer manipulator is arranged between the full Tray loading area and the testing area, and the chip transfer manipulator is used to transfer the chips in the Tray tray to the testing area;

[0010] The empty Tray recycling area is used to recycle the empty Tray trays after the chips are transferred;

[0011] The test area is used to test the transferred chips;

[0012] A sorting manipulator is arranged between the test area and the sorting and discharging area, and the sorting manipulator is used to transfer the tested chips to the sorting and discharging area;

[0013] The sorting and discharging area is used to store a number of empty Tray trays, and a part of the empty Tray trays are used to load the chips with qualified test results, and the other part of the empty Tray trays are used to load the chips with unqualified test results.

[0014] Further, in the semiconductor sorter, the full Tray loading area includes a loading device and a grasping and waiting device;

[0015] The loading device is used to store a number of Tray trays loaded with chips to be tested, and the Tray trays are stacked; and to provide the Tray trays to the grasping and waiting device;

[0016] The grasping and waiting device is used to store the Tray trays provided by the loading device, and to perform side pushing and positioning on the Tray trays to wait for the chip transfer manipulator to transfer the chips in the Tray trays to the test area.

[0017] Further, in the semiconductor sorter, the loading device includes a first conveying mechanism, a lifting mechanism, a storage tank and a clamping mechanism;

[0018] The storage tank is used to store a number of stacked Tray trays;

[0019] The lifting mechanism is located at the bottom of the storage tank and is used to move up and down through the storage tank to lift or lower the Tray trays in the storage tank;

[0020] The clamping mechanism is located on both sides of the storage tank and is used to extend when the lifting mechanism lifts the Tray trays in the storage tank to clamp the Tray trays except the bottommost Tray tray;

[0021] The lifting mechanism is further used to lower the bottommost Tray tray when the clamping mechanism clamps the Tray trays except the bottommost Tray tray to place it on the first conveying mechanism;

[0022] The first conveying mechanism is used to convey the Tray tray placed thereon to the grasping and waiting device.

[0023] Further, in the semiconductor sorting machine, the grasping and waiting device includes a second conveying mechanism, a side pushing mechanism, and a blocking mechanism;

[0024] The second conveying mechanism is connected to the first conveying mechanism and is used to continue conveying the Tray tray coming from the first conveying mechanism;

[0025] The side pushing mechanism is arranged on one side of the second conveying mechanism and is used to push the Tray tray laterally from the side of the Tray tray to position the Tray tray in the lateral direction, so as to wait for the chip transfer manipulator to transfer the chips in the Tray tray to the test area;

[0026] The blocking mechanism is arranged at the end of the second conveying mechanism and is used to block the second conveying mechanism from continuing to convey the Tray tray.

[0027] Further, in the semiconductor sorting machine, the grasping and waiting device further includes a positioning jaw mechanism;

[0028] The positioning jaw mechanism is arranged on both sides of the second conveying mechanism and is used to press the Tray tray positioned in the lateral direction.

[0029] Further, the semiconductor sorting machine further includes an empty Tray transfer manipulator;

[0030] The empty Tray transfer manipulator can move in the full Tray loading area, the empty Tray recycling area, and the sorting unloading area, and is used to transfer the empty Tray tray after the chips are transferred from the full Tray loading area to the empty Tray recycling area for recycling and storage by the empty Tray recycling area; and is used to transfer the empty Tray tray after the chips are transferred from the full Tray loading area to the sorting unloading area to load the tested chips.

[0031] Further, in the semiconductor sorting machine, the test area includes a third conveying mechanism, a carrier, a test transfer manipulator, and a test mechanism;

[0032] The carrier is arranged on the third conveying mechanism and is provided with a placement position for placing chips;

[0033] The third conveying mechanism is used to convey the carrier and the chips to be tested therein to the test mechanism, and to convey the carrier and the tested chips therein to the sorting unloading area;

[0034] The test transfer manipulator is arranged between the third conveying mechanism and the test mechanism and is used to transfer chips between the carrier and the test mechanism;

[0035] The testing mechanism is used to test the chips.

[0036] Further, in the semiconductor sorter, there are two third transfer mechanisms;

[0037] The two third transfer mechanisms are arranged side by side on both sides of the testing mechanism.

[0038] Further, in the semiconductor sorter, the testing area further includes two first photoelectric induction modules;

[0039] One of the first photoelectric induction modules is arranged parallel to the third transfer mechanism, facing the placement position in the horizontal direction, and can send an induction signal when there is no chip or the chip is placed obliquely at the placement position;

[0040] The other first photoelectric induction module is arranged perpendicular to the third transfer mechanism, facing the placement position in the vertical direction, and can send an induction signal when there is no chip or the chip is placed obliquely at the placement position.

[0041] Further, in the semiconductor sorter, the chip transfer manipulator includes a moving mechanism, a mounting frame, a plurality of variable pitch adjustment modules, and a plurality of suction heads;

[0042] The moving mechanism is used to provide movement in multiple directions;

[0043] The mounting frame is arranged on the moving mechanism and is used to provide a mounting basis for the plurality of variable pitch adjustment modules;

[0044] One suction head is arranged on one variable pitch adjustment module and can move under the drive of the variable pitch adjustment module to adjust the distance between the suction heads.

[0045] Compared with the prior art, the present invention has the following beneficial effects:

[0046] A semiconductor sorter provided by the present invention divides the workbench into a full Tray loading area, an empty Tray recycling area, a testing area, and a sorting and unloading area according to the processing area, and then regulates the linkage cooperation between each area through a manipulator, so that the processes of chip loading, testing, and unloading and sorting can be integrated, and then the mechanized and automated operation of the whole process can be realized. It can not only significantly improve the overall efficiency of chip production, optimize the production process, but also save manpower, injecting new impetus into the sustainable development of the chip manufacturing industry.

[0047] The present invention has other characteristics and advantages, which will be obvious from the accompanying drawings incorporated herein and the subsequent detailed description, or will be described in detail in the accompanying drawings incorporated herein and the subsequent detailed description. These accompanying drawings and the detailed description are used together to explain the specific principles of the present invention. Description of the Drawings

[0048] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required for use in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0049] Figure 1 is a (top view) structural schematic diagram of a semiconductor sorting machine provided by an embodiment of the present invention;

[0050] Figure 2 is one of the (three-dimensional) structural schematic diagrams of a semiconductor sorting machine provided by an embodiment of the present invention;

[0051] Figure 3 is the second of the (three-dimensional) structural schematic diagrams of a semiconductor sorting machine provided by an embodiment of the present invention;

[0052] Figure 4 is a (three-dimensional) structural schematic diagram of the Tray loading area provided by an embodiment of the present invention;

[0053] Figure 5 is a (three-dimensional) structural schematic diagram of the loading device provided by an embodiment of the present invention;

[0054] Figure 6 is a (partial) structural schematic diagram of the loading device provided by an embodiment of the present invention;

[0055] Figure 7 is a (partial) structural schematic diagram of the loading device provided by an embodiment of the present invention;

[0056] Figure 8 is one of the (three-dimensional) structural schematic diagrams of the grasping and waiting device provided by an embodiment of the present invention;

[0057] Figure 9 is the second of the (three-dimensional) structural schematic diagrams of the grasping and waiting device provided by an embodiment of the present invention;

[0058] Figure 10 is one of the (three-dimensional) structural schematic diagrams of the full Tray loading area, empty Tray recycling area, sorting and unloading area, and empty Tray transfer manipulator provided by an embodiment of the present invention;

[0059] Figure 11 It is the second (three-dimensional) structural schematic diagram of the full Tray loading area, empty Tray recycling area, sorting and discharging area, and empty Tray transfer manipulator provided by the embodiment of the present invention;

[0060] Figure 12 It is the (top view) structural schematic diagram of the full Tray loading area, empty Tray recycling area, sorting and discharging area, and empty Tray transfer manipulator provided by the embodiment of the present invention;

[0061] Figure 13 It is the first (partial) structural schematic diagram of the test area provided by the embodiment of the present invention;

[0062] Figure 14 It is the second (partial) structural schematic diagram of the test area provided by the embodiment of the present invention;

[0063] Figure 15 It is the structural schematic diagram of two first photoelectric induction modules provided by the embodiment of the present invention;

[0064] Figure 16 It is the (three-dimensional) structural schematic diagram of the chip transfer manipulator provided by the embodiment of the present invention.

[0065] Reference numerals:

[0066] Workbench 1, full Tray loading area 2, empty Tray recycling area 3, test area 4, sorting and discharging area 5, chip transfer manipulator 6, sorting manipulator 7, Tray 8, empty Tray transfer manipulator 9, first photoelectric induction module 10;

[0067] Loading device 201, grasping and waiting device 202;

[0068] First conveying mechanism 2011, lifting mechanism 2012, storage tank 2013, clamping mechanism 2014, second photoelectric induction module 2015;

[0069] Second conveying mechanism 2021, side pushing mechanism 2022, blocking mechanism 2023, positioning jaw mechanism 2024;

[0070] Third conveying mechanism 401, carrier 402, test transfer manipulator 403, test mechanism 404, placement position 405;

[0071] Moving mechanism 601, mounting frame 602, several variable pitch adjustment modules 603, several suction heads 604. Detailed implementation manners

[0072] To elaborate in detail on the possible application scenarios, technical principles, specific implementable solutions, achievable objectives and effects of this application, etc., the following will be described in detail with reference to the specific examples listed and in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of this application, and thus are only examples and cannot be used to limit the protection scope of this application.

[0073] Reference to "embodiment" herein means that a specific feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of this application. The term "embodiment" that appears in various positions in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or relevance to other embodiments. In principle, in this application, as long as there is no technical contradiction or conflict, the various technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0074] Unless otherwise defined, the meanings of the technical terms used herein are the same as those commonly understood by those skilled in the technical field to which this application belongs; the use of the relevant terms herein is only for describing specific embodiments and is not intended to limit this application.

[0075] In the description of this application, the term "and / or" is an expression used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: there is A, there is B, and there is both A and B at the same time. In addition, the character " / " herein generally represents an "or" logical relationship between the associated objects before and after.

[0076] In this application, terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual quantity, primary-secondary or order relationship, etc. between these entities or operations.

[0077] Without further limitation, in this application, the expressions such as "including", "comprising", "having" or other similar expressions used in a statement are intended to cover non-exclusive inclusion. These expressions do not exclude that there may be additional elements in the process, method or product including the said elements, so that the process, method or product including a series of elements may include not only those defined elements, but also other elements not explicitly listed, or also elements inherent to such process, method or product.

[0078] In this application, expressions such as "greater than", "less than", "exceeding", etc. are understood not to include the number itself; expressions such as "above", "below", "within", etc. are understood to include the number itself. In addition, in the description of the embodiments of this application, the meaning of "multiple" is two or more (including two). Similar expressions related to "many" are also understood in this way, such as "multiple groups", "multiple times", etc., unless otherwise clearly and specifically defined.

[0079] In the description of the embodiments of this application, the spatially related expressions used, such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the specific embodiment or the drawing. It is only for the convenience of describing the specific embodiments of this application or for the reader to understand, rather than indicating or implying that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, it cannot be understood as a limitation to the embodiments of this application.

[0080] Unless otherwise clearly specified or limited, in the description of the embodiments of this application, the terms such as "installed", "connected", "connected", "fixed", "set", etc. should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication inside two components or the interaction relationship between two components. For those skilled in the art to which this application belongs, the specific meanings of the above terms in the embodiments of this application can be understood according to specific situations.

[0081] In view of the defects existing in the above-mentioned prior art, based on the rich practical experience and professional knowledge in the design and manufacturing of this field for many years, and in cooperation with the application of theory, the applicant actively conducts research and innovation in the hope of creating a technology that can solve the defects in the prior art. After continuous research, design, and repeated trial production of samples and improvement, the present invention with practical value is finally created.

[0082] Please refer to Figures 1-3 , an embodiment of the present invention provides a semiconductor sorter, which is ingeniously designed and has comprehensive functions, providing an efficient and automated solution for chip testing and sorting. The sorter mainly consists of a workbench 1, which is carefully divided into four main areas according to the processing flow and functional requirements: a full Tray loading area 2, an empty Tray recycling area 3, a testing area 4, and a sorting and unloading area 5.

[0083] The full Tray loading area 2 is the starting point of the chip testing process. It is specifically used to store the Tray trays 8 that have been loaded with chips to be tested. Before these Tray trays 8 are sent into the sorter, they have been pre-loaded with the chips to be tested and are ready to enter the next stage of the testing process.

[0084] Between the full Tray loading area 2 and the testing area 4, there is a chip transfer manipulator 6. This manipulator 6 plays a crucial role. It is responsible for precisely transferring the chips in the Tray trays 8 in the full Tray loading area 2 to the testing area 4 to prepare for the subsequent testing work.

[0085] The empty Tray recycling area 3 is located on one side of the full Tray loading area 2. Its main function is to recycle the Tray trays 8 that have become empty after the chips have been transferred out. Through timely recycling and processing, it can ensure the cleanliness and orderliness of the workbench and improve the overall work efficiency.

[0086] The testing area 4 is the core area of chip testing. It is equipped with advanced testing equipment and technologies and can conduct comprehensive electrical performance tests on the transferred chips. Here, each chip will undergo strict inspection to ensure that its quality and performance meet the established standards.

[0087] Between the testing area 4 and the sorting and unloading area 5, there is another sorting manipulator 7. The task of this sorting manipulator 7 is to sort the tested chips according to the test results and transfer them to the sorting and unloading area 5. This step is a key link in the chip testing process and determines the final destination and fate of the chips.

[0088] The sorting and unloading area 5 is used to store several empty Tray trays 8. These empty Tray trays 8 will be divided into two categories according to the test results: one category is used to load the chips with good test results, and the other category is used to load the chips with bad test results. Through such classified storage, it is convenient to further process and manufacture the chips subsequently.

[0089] In this embodiment, by dividing the workbench into the full Tray loading area 2, the empty Tray recycling area 3, the testing area 4, and the sorting and unloading area 5 according to the processing areas, and regulating the close and efficient linkage cooperation between the various areas through manipulators, the integration, mechanization, and automation operations of the processes such as chip loading, testing, and sorting and unloading are successfully realized. This innovative design can not only significantly improve the overall efficiency of chip production, optimize the production process, reduce waste and delays in the production process; but also save a large amount of labor costs, reduce the labor intensity and work pressure of workers; and more importantly, inject new impetus and vitality into the sustainable development of the chip manufacturing industry, promoting the progress and development of the entire industry.

[0090] Please refer to again Figures 1-3 and in combination with the reference Figure 4 In an implementation manner of this embodiment, the full Tray loading area 2 includes a loading device 201 and a grasping and waiting device 202; these two parts work together to jointly achieve efficient and automated operation of the chip loading process.

[0091] The loading device 201 is one of the core components of the full Tray loading area 2, and it undertakes the important task of storing and providing the Tray tray 8 loaded with chips to be tested. Specifically, the loading device 201 is designed to be able to accommodate multiple stacked Tray trays 8. Such a design greatly improves the loading efficiency, reduces the frequency of manual replenishment of the Tray tray, and makes the entire loading process more continuous and smooth. When it is necessary to provide the Tray tray 8 to the grasping and waiting device 202, the loading device 201 can quickly and accurately send out the lowermost Tray tray 8 to prepare for the subsequent chip transfer work.

[0092] The grasping and waiting device 202 is another key component of the full Tray loading area 2. It is closely followed by the loading device 201 and is used to store the Tray tray 8 provided by the loading device 201. The grasping and waiting device 202 not only undertakes the task of storing the Tray tray 8, but also has the function of laterally pushing and positioning the Tray tray 8. The design of this function aims to ensure the stability and accuracy of the Tray tray 8 during the grasping and waiting process, so that the chip transfer manipulator 6 can accurately grasp the chips in the Tray tray 8. Through the precise positioning of the grasping and waiting device 202, the grasping success rate of the chip transfer manipulator 6 has been significantly improved, thereby further improving the efficiency and stability of the entire chip testing process.

[0093] In summary, the full Tray loading area 2 in this embodiment realizes efficient and automated operation of the chip loading process through the ingenious design of the loading device 201 and the grasping and waiting device 202. The loading device 201 can accommodate multiple stacked Tray trays 8, improving the loading efficiency; while the grasping and waiting device 202 ensures the accurate grasping of the chip transfer manipulator 6 through precise positioning of the Tray tray 8. The coordinated work of these two parts not only improves the efficiency and stability of the entire chip testing process, but also improves the success rate of transfer.

[0094] Please refer to again Figure 4 and in combination with the reference Figures 5-6, in a specific implementation manner of this embodiment, the loading device 201 is carefully designed to include four main components: the first conveying mechanism 2011, the lifting mechanism 2012, the storage tank 2013, and the clamping mechanism 2014. These four parts work together to jointly achieve the automatic separation and conveying of the Tray tray 8, significantly improving the loading efficiency and stability.

[0095] The storage tank 2013 is a basic component of the loading device 201 and is used to store several stacked Tray trays 8. The size of the storage tank 2013 matches the size of the Tray tray 8 to ensure that it can stably accommodate multiple stacked Tray trays 8 and prevent them from shaking or slipping during storage.

[0096] The lifting mechanism 2012 is located at the bottom of the storage tank 2013 and is a key component for realizing the automatic separation of the Tray tray 8. The lifting mechanism 2012 can move up and down through the storage tank 2013 to lift or lower the Tray tray 8 in the storage tank 2013. Specifically, the lifting mechanism 2012 can adopt a lifting platform driven by a cylinder or a motor, which can precisely control the lifting height to ensure that the Tray tray 8 remains stable during the lifting or lowering process.

[0097] The clamping mechanism 2014 is located on both sides of the storage tank 2013 and is used to extend when the lifting mechanism 2012 lifts the Tray tray 8 in the storage tank 2013 to clamp the remaining Tray trays 8 except the bottommost Tray tray 8. The clamping mechanism 2014 can adopt pneumatic grippers with adjustable clamping force, which can firmly clamp the Tray tray 8 to prevent it from slipping or tilting during the lifting process.

[0098] When the clamping mechanism 2014 clamps the remaining Tray trays 8 except the bottommost Tray tray 8, the lifting mechanism 2012 continues to lower the bottommost Tray tray 8, separates it from the stacked Tray trays 8, and places it on the first conveying mechanism 2011. This collaborative working method ensures the stable separation of the Tray tray 8 and avoids collision or damage during the separation process.

[0099] The first conveying mechanism 2011 is responsible for conveying the Tray tray 8 placed thereon to the grasping and waiting device 202. The first conveying mechanism 2011 can adopt a belt conveying structure with adjustable conveying speed, which can smoothly convey the Tray tray 8 to the specified position.

[0100] In summary, through the ingenious design of the storage tank 2013, the lifting mechanism 2012, the clamping mechanism 2014, and the first conveying mechanism 2011 in this embodiment, the automatic separation and conveyance of the Tray tray 8 are realized. Such a structural design not only improves the feeding efficiency and stability but also provides a reliable guarantee for the subsequent chip testing process.

[0101] Please refer again to Figure 5 and, in combination with reference to Figure 7 In a specific implementation manner of this embodiment, on the basis of the original structure, the feeding device 201 also ingeniously incorporates the second photoelectric induction module 2015, and this addition greatly improves the intelligence and automation level of the device.

[0102] The second photoelectric induction module 2015 is carefully arranged on the top of the storage tank 2013, and its position selection ensures that it can accurately and errorlessly sense the stacking height of the Tray trays 8 in the storage tank 2013. The photoelectric induction technology, with its characteristics of high sensitivity and non-contact measurement, plays an important role in this application.

[0103] Specifically, the second photoelectric induction module 2015 monitors the stacking situation of the Tray trays 8 in the storage tank 2013 in real time by emitting and receiving optical signals. When the stacking height of the Tray trays 8 changes, such as adding or removing a Tray tray 8, the photoelectric induction module can quickly capture this change and transmit the signal to the control system.

[0104] According to the received signal, the control system can adjust the working state of the lifting mechanism 2012 in real time to ensure that the lifting height matches the current stacking height of the Tray trays 8. In this way, not only is the collision or damage of the Tray trays 8 that may be caused by improper lifting height avoided, but also the stability and reliability of the entire feeding process are improved.

[0105] In summary, through the addition of the second photoelectric induction module 2015 in this embodiment, the real-time monitoring and intelligent adjustment of the stacking height of the Tray trays 8 are realized.

[0106] Please refer again to Figure 4 and, in combination with reference to Figures 8-9 In an implementation manner of this embodiment, in a specific implementation manner of this embodiment, the grasping and waiting device 202 is carefully designed to include three main components: the second conveying mechanism 2021, the side-pushing mechanism 2022, and the blocking mechanism 2023. These three parts work together to jointly achieve the precise positioning of the Tray trays 8, providing a stable and reliable basis for the grasping operation of the chip transfer manipulator 6.

[0107] The second transfer mechanism 2021 is the starting part of the grasping and waiting device 202, which is connected to the first transfer mechanism 2011 and is used to continue transferring the Tray tray 8 coming from the first transfer mechanism 2011. To ensure the stability of the Tray tray 8 during the transfer process, the second transfer mechanism 2021 can adopt the same transfer structure as the first transfer mechanism 2011, such as a belt transfer structure. This design not only ensures the stable transfer of the Tray tray 8 but also simplifies the maintenance and operation of the equipment.

[0108] The side-pushing mechanism 2022 is arranged on one side of the second transfer mechanism 2021 and is a key component for realizing the precise positioning of the Tray tray 8. The side-pushing mechanism 2022 is used to push the Tray tray 8 laterally from the side of the Tray tray 8 to position the Tray tray 8 in the lateral direction. Specifically, the side-pushing mechanism 2022 can adopt a push plate driven by a cylinder. By precisely controlling the stroke and thrust of the cylinder, the Tray tray 8 can be pushed to an accurate position. This design ensures that when the chip transfer manipulator 6 grasps the chip, it can accurately align with the chip position in the Tray tray 8, improving the success rate and stability of the grasping.

[0109] The blocking mechanism 2023 is arranged at the end of the second transfer mechanism 2021 and is used to block the second transfer mechanism 2021 from continuing to transfer the Tray tray 8. In this embodiment, the blocking mechanism 2023 can be designed as a baffle that is always raised to ensure that the Tray tray 8 can stay stably after reaching the specified position. Of course, according to actual needs, the blocking mechanism 2023 can also adopt a baffle design driven by a cylinder, so that it can be raised to block the Tray tray 8 when needed and lowered to allow the Tray tray 8 to pass when not needed. This flexible design meets the requirements in different production scenarios.

[0110] In summary, through the ingenious design of the second transfer mechanism 2021, the side-pushing mechanism 2022, and the blocking mechanism 2023 in this embodiment, the grasping and waiting device 202 realizes the precise positioning and stable stay of the Tray tray 8. This structural design not only provides a reliable basis for the grasping operation of the chip transfer manipulator 6 but also improves the efficiency and stability of the entire chip testing process.

[0111] Please refer to again Figures 8-9 , in a specific implementation manner of this embodiment, on the basis of the original structure, the grasping and waiting device 202 is additionally provided with a positioning jaw mechanism 2024, and this addition greatly improves the stability and accuracy of the Tray tray 8 during the positioning process.

[0112] The positioning jaw mechanism 2024 is carefully arranged on both sides of the second conveying mechanism 2021, and its position selection ensures that it can accurately and effectively hold the Tray tray 8 positioned in the lateral direction. The cylinder drive technology plays an important role in this application due to its fast response speed and high control precision.

[0113] Specifically, the positioning jaw mechanism 2024 can adopt a jaw design driven by a cylinder. After the Tray tray 8 is pushed to the lateral positioning position by the side-pushing mechanism 2022, the cylinder of the positioning jaw mechanism 2024 is activated, driving the jaws to press down simultaneously or sequentially from both sides of the Tray tray 8, firmly pressing it on the second conveying mechanism 2021. This holding method not only improves the stability of the Tray tray 8 during the positioning process but also further ensures the accuracy of its position.

[0114] By adding the positioning jaw mechanism 2024, the grasping and waiting device 202 of this embodiment realizes a more firm positioning of the Tray tray 8. This design ensures that when the chip transfer manipulator 6 grasps the chip, the Tray tray 8 can remain absolutely stable and will not undergo small displacements due to external factors (such as air flow, vibration, etc.), thereby improving the success rate and accuracy of the grasping.

[0115] In summary, the grasping and waiting device 202 in this embodiment realizes a more firm and accurate positioning of the Tray tray 8 by adding the positioning jaw mechanism 2024.

[0116] Please refer to Figures 10-12 , in a specific implementation manner of this embodiment, on the basis of the original structure, the semiconductor sorter innovatively introduces an empty Tray transfer manipulator 9. This newly added component greatly improves the automation degree and production efficiency of the semiconductor sorter, realizing the automatic transfer and reuse of the empty Tray tray 8.

[0117] The empty Tray transfer manipulator 9 is designed to be able to move freely within the full Tray loading area 2, the empty Tray recycling area 3, and the sorting unloading area 5. Its multi-axis manipulator structure endows it with the ability to move flexibly in three-dimensional space and can accurately grasp and place the Tray tray 8.

[0118] Specifically, after the empty Tray transfer manipulator 9 completes its task in the full Tray loading area 2, it will grasp the Tray tray 8 that has become empty after the chips are transferred and accurately transfer it to the empty Tray recycling area 3. In the empty Tray recycling area 3, these empty Tray trays 8 will be recycled and stored for subsequent reuse.

[0119] Meanwhile, the empty Tray transfer manipulator 9 also has the function of transferring the empty Tray 8 from the full Tray loading area 2 to the sorting and unloading area 5. In the sorting and unloading area 5, these empty Trays 8 will be used to load the tested chips, thus realizing the chip sorting and unloading process.

[0120] It should be particularly noted that the multi-axis manipulator structure of the empty Tray transfer manipulator 9 is the key to its ability to complete the above tasks flexibly and accurately. This structure not only ensures the stability and accuracy of the Tray 8 during the transfer process, but also improves the automation level and production efficiency of the entire semiconductor sorter.

[0121] By setting up the empty Tray transfer manipulator 9, the semiconductor sorter of this embodiment realizes the automatic transfer and reuse of the empty Tray 8, reduces manual intervention, and improves production efficiency and automation level. This innovative design not only meets the requirements of the semiconductor industry for high-efficiency and automated production, but also provides new ideas and directions for the future development of semiconductor sorters.

[0122] Please refer to Figure 3 and, in combination with reference to Figures 13-14 , in a specific implementation manner of this embodiment, the test area 4 is carefully designed to include four main components: the third transfer mechanism 401, the carrier 402, the test transfer manipulator 403, and the test mechanism 404. These four parts work together to jointly realize the automatic transfer, testing, and result recording of chips, greatly improving the efficiency and accuracy of testing.

[0123] The carrier 402 is a key component in the test area 4. It is set on the third transfer mechanism 401 and is provided with placement positions 405 for placing chips. To meet the requirements of the high-temperature test environment, the carrier 402 can be made of high-temperature resistant materials to ensure that it will not deform or be damaged due to high temperature during use. At the same time, the surface of the carrier 402 is provided with a plurality of precisely machined placement positions 405. These placement positions 405 are carefully designed to be able to stably place the chips to be tested, ensuring the position accuracy and stability of the chips during the testing process.

[0124] The third transfer mechanism 401 is responsible for transferring the carrier 402 and the chips to be tested located therein to the test mechanism 404, and for transferring the tested chips and the carrier 402 to the sorting and unloading area 5. To achieve smooth and precise transfer, the third transfer mechanism 401 can adopt a precision conveyor belt structure. This structure can not only ensure the stability of the carrier 402 during the transfer process, but also flexibly adjust the transfer speed and direction according to the requirements of the test process.

[0125] The test transfer manipulator 403 is arranged between the third transfer mechanism 401 and the test mechanism 404, and it plays an important role in transferring chips between the carrier 402 and the test mechanism 404. To ensure the safety and accuracy of the chips during the transfer process, the test transfer manipulator 403 can adopt a precision manipulator structure. This structure can accurately grasp and place the chips, avoiding damage or position deviation to the chips during the transfer process.

[0126] The test mechanism 404 is the core part of the test area 4, and it is responsible for performing various performance tests on the chips. The test mechanism 404 can include components such as a test socket, test probes, and a test circuit. The test socket is used to fix the chips to ensure their stability during the test process; the test probes are in contact with the pins of the chips to transmit test signals; and the test circuit is responsible for receiving and processing the test signals and recording the test results. Through the coordinated work of these components, the test mechanism 404 can comprehensively and accurately evaluate the performance of the chips, providing reliable data support for subsequent chip sorting and packaging.

[0127] In summary, the test area 4 in this embodiment realizes the automatic transfer, testing, and result recording of chips through the ingenious design of the third transfer mechanism 401, the carrier 402, the test transfer manipulator 403, and the test mechanism 404. This structural design not only improves the efficiency and accuracy of the test but also provides strong support for the automated production in the semiconductor industry.

[0128] Please refer to again Figures 13-14 , in a specific implementation manner of this embodiment, the test area 4 is further optimized in design, where the number of the third transfer mechanisms 401 is increased to two. These two third transfer mechanisms 401 are arranged in parallel on both sides of the test mechanism 404, forming an efficient and parallel chip test processing system.

[0129] It should be noted specifically that these two third transfer mechanisms 401 are the same in structure and function, and they both have the ability to transfer the carrier 402 and the chips smoothly and precisely. By arranging them in parallel, these two third transfer mechanisms 401 can work simultaneously without interference, thus greatly improving the overall working efficiency of the test area 4.

[0130] By setting two parallel third transfer mechanisms 401, the test area 4 of this embodiment realizes the parallel processing of chip testing. Specifically, when the chips on one third transfer mechanism 401 are being tested in the test mechanism 404, the other third transfer mechanism 401 can simultaneously perform the loading or unloading operation of the chips. This way of parallel processing not only reduces the idle time of the test mechanism 404 but also improves the continuity and fluency of the entire test process.

[0131] In addition, the third transfer mechanism 401 arranged in parallel also facilitates the future expansion of the test area 4. If it is necessary to further improve the test efficiency, it can be achieved by adding more third transfer mechanisms 401 and test mechanisms 404, thereby forming a larger and more efficient chip test system.

[0132] In summary, in this embodiment, the test area 4 realizes parallel processing of chip testing by arranging two third transfer mechanisms 401 in parallel, further improving the test efficiency. This design not only meets the requirements of the semiconductor industry for efficient and automated testing, but also provides broad space for the future expansion and upgrade of the test area 4.

[0133] Please refer to Figures 13-14 again, and in combination with Figure 15 , in a specific implementation manner of this embodiment, the design of the test area 4 is further improved, and two first photoelectric induction modules 10 are newly added. These two first photoelectric induction modules 10 are cleverly arranged in the test area 4 to achieve comprehensive and accurate monitoring of the chip placement state.

[0134] One of the first photoelectric induction modules 10 is arranged parallel to the third transfer mechanism 401. In the horizontal direction, it is directly opposite to the placement position 405 on the carrier 402. The main function of this first photoelectric induction module 10 is to detect whether there is a chip on the placement position 405, and whether the chip is placed correctly and without skew. When the placement position 405 is vacant or the chip is placed improperly, this first photoelectric induction module 10 will immediately send out an induction signal to prompt the system that there is an abnormal situation.

[0135] The other first photoelectric induction module 10 is arranged perpendicular to the third transfer mechanism 401. In the vertical direction, it is also directly opposite to the placement position 405. This first photoelectric induction module 10 monitors the placement state of the chip from another angle. It can not only detect the presence or absence of the chip, but also further confirm whether the chip is firmly placed in the placement position 405 without tilting or falling off. Similarly, when an abnormal situation is detected, this first photoelectric induction module 10 will also send out an induction signal in a timely manner.

[0136] By arranging these two first photoelectric induction modules 10 in different directions, the test area 4 of this embodiment realizes all-round and three-dimensional monitoring of the chip placement state. This design ensures the accuracy and reliability of the test process, and effectively avoids test failures or equipment damage caused by improper chip placement.

[0137] When the first optoelectronic induction module 10 detects an abnormal situation, the system will immediately receive an alarm signal and can take corresponding corrective measures. For example, the system can pause the test process and prompt the operator to check and adjust the placement state of the chip; or, the system can also automatically adjust the position of the transfer mechanism to correct the placement deviation of the chip. These measures jointly ensure the smooth progress of the test process and improve the test efficiency and accuracy.

[0138] In summary, in the test area 4 of this embodiment, by adding two first optoelectronic induction modules 10 in different directions, a comprehensive monitoring of the chip placement state is achieved.

[0139] Please refer to Figure 16 , in a specific implementation manner of this embodiment, the chip transfer manipulator 6 is carefully designed to include four main components: a moving mechanism 601, a mounting frame 602, a number of variable pitch adjustment modules 603, and a number of suction heads 604. These four parts work together to jointly achieve the flexible transfer and precise placement of the chip in three-dimensional space.

[0140] The moving mechanism 601 is the core power source of the chip transfer manipulator 6, and it is responsible for providing the ability to move in multiple directions. To achieve this function, the moving mechanism 601 can adopt a multi-axis mechanical structure. This structure can not only move flexibly in three-dimensional space but also ensure the accuracy and stability of the chip during the transfer process. By precisely controlling the movement trajectory and speed of the moving mechanism 601, the chip transfer manipulator 6 can accurately grasp and place the chip, meeting various complex production requirements.

[0141] The mounting frame 602 is arranged on the moving mechanism 601, and it provides a solid mounting foundation for a number of variable pitch adjustment modules 603. To ensure the light weight and stability of the mounting frame 602, lightweight materials can be used, while ensuring that it has sufficient rigidity. In this way, the mounting frame 602 can not only reduce the weight of the entire chip transfer manipulator 6 but also ensure the firm installation and stable operation of the variable pitch adjustment modules 603 and the suction heads 604.

[0142] The variable pitch adjustment module 603 is a key component in the chip transfer manipulator 6, and it is responsible for driving the suction head 604 to move to adjust the distance between the suction heads 604. To achieve this function, the variable pitch adjustment module 603 can adopt a precision slide rail and drive motor structure. This structure can not only precisely control the position of the suction head 604 but also ensure the smoothness and accuracy of the suction head 604 during the movement. By adjusting the distance between the suction heads 604, the chip transfer manipulator 6 can adapt to chips of different specifications, improving the adaptability and flexibility of the equipment.

[0143] The suction head 604 is the component where the chip transfer manipulator 6 directly contacts the chip, and it is responsible for safely grasping and placing the chip. To achieve this function, the suction head 604 can adopt a vacuum adsorption structure. This structure can generate sufficient adsorption force to ensure that the chip will not fall off or be damaged during the transfer process. At the same time, the design of the suction head 604 also considers the contact method and force with the chip surface to ensure that the chip will not be damaged when grasping and placing the chip.

[0144] In summary, through the ingenious design of the movable mechanism 601, the mounting frame 602, the pitch adjustment module 603, and the suction head 604 in this embodiment, the chip transfer manipulator 6 realizes the flexible transfer and precise placement of the chip in three-dimensional space. This design improves the efficiency and accuracy of chip transfer.

[0145] It should be noted that other manipulators can also adopt the same structural design. In addition, in practical applications, this structural design can be appropriately modified and optimized according to specific requirements and scenarios to meet the automation production needs in different fields.

[0146] Although terms such as workbench and manipulator are used more frequently in this application, the possibility of using other terms is not excluded. These terms are only used to more conveniently describe and explain the essence of the present invention; interpreting them as any additional limitation is contrary to the spirit of the present invention.

[0147] A semiconductor sorting machine provided by an embodiment of the present invention divides the workbench into a full Tray loading area, an empty Tray recycling area, a testing area, and a sorting and unloading area according to the processing area, and then controls the linkage cooperation between each area through a manipulator, so as to realize the process integration of chip loading, testing, and unloading and sorting, and further realize the mechanized and automated operation of the whole process. This can not only significantly improve the overall efficiency of chip production, optimize the production process, but also save manpower, injecting new impetus into the sustainable development of the chip manufacturing industry.

[0148] Finally, it should be noted that although the above embodiments have been described in the text and drawings of the specification of this application, the patent protection scope of this application cannot be limited thereby. Any technical solution obtained by replacing or modifying the equivalent structure or equivalent process using the content recorded in the text and drawings of the specification of this application based on the essential concept of this application, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are all included in the patent protection scope of this application.

Claims

1. A semiconductor sorting machine, characterized in that: The workbench (1) is divided into a full tray loading area (2), an empty tray recovery area (3), a testing area (4), and a sorting unloading area (5) according to the processing area; The full tray loading area (2) is used to store a plurality of trays (8) loaded with chips to be tested; A chip transfer robot (6) is provided between the full tray loading area (2) and the test area (4), and the chip transfer robot (6) is used to transfer the chips in the tray (8) to the test area (4); The empty tray recovery area (3) is used to recover the empty tray (8) after the chips are transferred; The test area (4) is used to test the transferred chips; A sorting robot (7) is provided between the test area (4) and the sorting and unloading area (5), and the sorting robot (7) is used to transfer the tested chips to the sorting and unloading area (5); The sorting and unloading area (5) is used to store a plurality of empty trays (8), wherein a portion of the empty trays (8) are used to load chips with good test results, and another portion of the empty trays (8) are used to load chips with bad test results.

2. The semiconductor sorting machine according to claim 1, characterized in that: The full tray loading area (2) comprises a loading device (201) and a grabbing and waiting device (202); The loading device (201) is used for storing a plurality of trays (8) loaded with chips to be tested, wherein the plurality of trays (8) are stacked; and for providing the trays (8) to the grabbing waiting device (202); The grabbing waiting device (202) is used to store the tray (8) provided by the loading device (201), and to push the tray (8) sideways to position it, so as to wait for the chip transfer robot (6) to transfer the chip in the tray (8) to the test area (4).

3. The semiconductor sorting machine according to claim 2, characterized in that: The loading device (201) comprises a first conveying mechanism (2011), a lifting mechanism (2012), a storage tank (2013) and a clamping mechanism (2014); The storage slot (2013) is used to store a plurality of stacked trays (8); The lifting mechanism (2012) is located at the bottom of the storage tank (2013) and is used to pass through the storage tank (2013) to perform lifting and lowering movements so as to lift or lower the tray (8) in the storage tank (2013); The clamping mechanism (2014) is located on both sides of the storage groove (2013) and is used to extend when the lifting mechanism (2012) lifts the tray (8) in the storage groove (2013) so as to clamp the remaining trays (8) except the tray (8) at the bottom; The lifting mechanism (2012) is also used for lowering the Tray tray (8) at the bottom when the clamping mechanism (2014) clamps the remaining Tray trays (8) except the Tray tray (8) at the bottom, so as to place it on the first conveying mechanism (2011); The first conveying mechanism (2011) is used to convey the tray (8) placed thereon to the grabbing waiting device (202).

4. The semiconductor sorting machine according to claim 3, characterized in that: The grabbing and waiting device (202) comprises a second conveying mechanism (2021), a side pushing mechanism (2022) and a blocking mechanism (2023); The second conveying mechanism (2021) is connected to the first conveying mechanism (2011) and is used to continue conveying the tray (8) coming from the first conveying mechanism (2011); The side push mechanism (2022) is arranged on one side of the second conveying mechanism (2021) and is used to push the tray (8) to move laterally from the side of the tray (8) so as to position the tray (8) in a lateral direction so as to wait for the chip transfer robot (6) to transfer the chip in the tray (8) to the test area (4); The blocking mechanism (2023) is arranged at the end of the second conveying mechanism (2021) and is used to block the second conveying mechanism (2021) from continuing to convey the Tray (8).

5. The semiconductor sorting machine according to claim 4, characterized in that: The grabbing and waiting device (202) further comprises a positioning claw mechanism (2024); The positioning claw mechanism (2024) is arranged on both sides of the second conveying mechanism (2021) and is used to press and hold the Tray (8) positioned in the transverse direction.

6. The semiconductor sorting machine according to claim 1, characterized in that: Also includes an empty tray transfer robot (9); The empty tray transfer robot (9) can move within the full tray loading area (2), the empty tray recovery area (3) and the sorting and unloading area (5), and is used to transfer the empty tray (8) after the chips are transferred from the full tray loading area (2) to the empty tray recovery area (3), and to be recovered and stored in the empty tray recovery area (3); and to transfer the empty tray (8) after the chips are transferred from the full tray loading area (2) to the sorting and unloading area (5) to load the tested chips.

7. The semiconductor sorting machine according to claim 1, characterized in that: The testing area (4) comprises a third conveying mechanism (401), a carrier (402), a test transfer robot (403) and a testing mechanism (404); The carrier (402) is arranged on the third conveying mechanism (401) and is provided with a placement position (405) for placing a chip; The third conveying mechanism (401) is used to convey the carrier (402) and the chips to be tested therein to the testing mechanism (404), and to convey the carrier (402) and the tested chips therein to the sorting and unloading area (5); The test transfer robot (403) is arranged between the third conveying mechanism (401) and the test mechanism (404), and is used to transfer chips between the carrier (402) and the test mechanism (404); The testing mechanism (404) is used to test the chip.

8. The semiconductor sorting machine according to claim 7, characterized in that: There are two third transmission mechanisms (401); The two third conveying mechanisms (401) are arranged in parallel on both sides of the testing mechanism (404).

9. The semiconductor sorting machine according to claim 7, characterized in that: The test area (4) also includes two first photoelectric sensing modules (10); One of the first photoelectric sensing modules (10) is arranged parallel to the third conveying mechanism (401) and faces the placement position (405) in the horizontal direction, and can send out a sensing signal when there is no chip on the placement position (405) or the chip is placed crookedly; Another of the first photoelectric sensing modules (10) is arranged perpendicular to the third conveying mechanism (401) and faces the placement position (405) in the vertical direction, and can send out a sensing signal when there is no chip on the placement position (405) or the chip is placed crookedly.

10. The semiconductor sorting machine according to claim 1, characterized in that: The chip transfer robot (6) comprises a movable mechanism (601), a mounting frame (602), a plurality of variable distance adjustment modules (603) and a plurality of suction heads (604); The movable mechanism (601) is used to provide movement in multiple directions; The mounting frame (602) is arranged on the movable mechanism (601) and is used to provide a mounting basis for a plurality of the variable pitch adjustment modules (603); One of the suction heads (604) is arranged on one of the variable distance adjustment modules (603) and can be moved under the drive of the variable distance adjustment module (603) to adjust the distance between the suction heads (604).

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