Laser processing device

Abstract

The present invention relates to a laser processing device for laser processing a workpiece to be processed, comprising a processing unit, which includes a supporting member, a receiving cavity, and a liquid supply device, wherein the supporting member is used to fix the workpiece to be processed and is disposed in the receiving cavity; the liquid supply device is connected to the receiving cavity to provide a high-pressure liquid environment to the receiving cavity; during operation, the receiving cavity contains high-pressure flowing liquid; a laser unit, which includes a movable laser emitting device, which is used to emit a laser beam to the workpiece to be processed; a magnetic unit, which is used to apply a coupling magnetic field with adjustable intensity to the processing surface of the workpiece to be processed; and a control unit, which is electrically connected to the processing unit, the laser unit, and the magnetic unit. The present invention can effectively improve the size accuracy and shape accuracy of micro-holes on the surface of the workpiece, thereby producing high-quality micro-deep holes.

Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, and in particular to a laser processing device. Background Art

[0002] Laser processing is a technology that uses high-energy-density laser beams to perform precision processing on materials, including cutting, welding, drilling, engraving, and surface treatment. Its high precision, non-contact nature, high efficiency, and flexibility make it widely used in industrial manufacturing, electronics, medical care, aerospace, and other fields. Although laser processing is a non-contact process that avoids tool wear and can process high-hardness and brittle materials, it can produce relatively complex graphic structures. However, due to the large heat-affected zone (the heat-affected zone is the area of ​​the substrate that is heated but not melted during high-temperature processing), thin-walled parts are prone to thermal deformation, recast layers, and microcracks. This is especially true when processing high-density hole clusters, where the heat accumulation effect is significant.

[0003] The shortcomings of the existing technology are that during the processing of micro-holes on the surface of the workpiece, plasma shielding will also limit the depth-to-width ratio of the processed fine holes. Specifically, due to the plasma sputtering and the dynamic behavior of the molten pool, the quality of the hole wall will be uneven, which in turn affects the geometric accuracy and surface roughness of the deep hole. The shape of the hole formed by the processing may also be irregular; in addition, the expansion of the plasma will also interfere with the focusing characteristics of the laser, thereby affecting the dimensional accuracy and shape accuracy of the processing; the plasma plume will cause a rough recast layer to form on the material surface and pollute the air.

[0004] Therefore, it is urgent to develop a new laser processing device to solve the above-mentioned defects. Summary of the Invention

[0005] To this end, the technical problem to be solved by the present invention is to overcome the deficiencies in the prior art and provide a laser processing device that can effectively improve the size accuracy and shape accuracy of the micro-holes on the surface of the workpiece, thereby preparing high-quality micro-deep holes.

[0006] In order to solve the above technical problems, the present invention provides a laser processing device for laser processing a workpiece, comprising:

[0007] A processing unit includes a supporting member, a receiving cavity, and a liquid supply device. The supporting member is used to fix the workpiece to be processed and is disposed in the receiving cavity. The liquid supply device is in communication with the receiving cavity to provide a high-pressure liquid environment to the receiving cavity. During operation, the receiving cavity has a high-pressure flowing liquid.

[0008] A laser unit comprising a movable laser emitting device for emitting a laser beam to the workpiece to be processed;

[0009] a magnetic unit, which is arranged around the accommodating cavity and is used to apply a coupling magnetic field with adjustable strength to the processing surface of the workpiece to be processed;

[0010] A control unit is electrically connected to the processing unit, the laser unit and the magnetic unit. The control unit controls the laser emitting device to move to a specified position and controls the magnetic unit to apply a coupling magnetic field to the workpiece to be processed. The high-pressure liquid environment can suppress the interference of the plasma generated during the laser processing on the laser beam.

[0011] In one embodiment of the present invention, the liquid supply device includes a high-pressure water supply machine, a water inlet pipe and a water outlet pipe. The accommodating cavity is connected to the high-pressure water supply machine through the water inlet pipe and the water outlet pipe. The high-pressure water supply machine can drive the liquid in the accommodating cavity to circulate.

[0012] In one embodiment of the present invention, the accommodating cavity includes a detachable main body and a cover, the main body has an opening arranged toward the laser emitting device, and the cover is connected to the opening to close the accommodating cavity.

[0013] In one embodiment of the present invention, the magnetic unit includes a magnet assembly and a magnet assembly control module, and the magnet assembly control module is connected to the magnet assembly to control an input current of the magnet assembly.

[0014] In one embodiment of the present invention, the magnet assembly includes a first magnet, a second magnet and a third magnet, the first magnet is located above the workpiece to be processed, and when in operation, the laser beam emitted by the laser emitting device passes through the first magnet and is incident on the workpiece to be processed; the second magnet and the third magnet are relatively arranged on both sides of the accommodating cavity, and are respectively located on both sides of the workpiece to be processed; when in operation, the liquid in the accommodating cavity flows along a first direction, and the second magnet and the third magnet are relatively arranged along a second direction, and the second direction is perpendicular to the first direction.

[0015] In one embodiment of the present invention, the first magnet comprises a solenoid, the second magnet comprises an electromagnet, and the third magnet comprises an electromagnet.

[0016] In one embodiment of the present invention, the solenoid is arranged on the upper surface of the accommodating cavity, and the axial direction of the solenoid is perpendicular to the processing surface of the workpiece to be processed; the projection area of ​​the solenoid along the height direction is larger than the area of ​​the processing surface of the workpiece to be processed.

[0017] In one embodiment of the present invention, the workpiece to be processed is fixedly disposed on the bottom of the accommodating cavity through the supporting member.

[0018] In one embodiment of the present invention, a moving mechanism is further included, and the moving mechanism is connected to the laser emitting device to drive the laser emitting device to move to a designated position; the moving mechanism includes a robot.

[0019] In one embodiment of the present invention, the liquid comprises deionized water.

[0020] The above technical solution of the present invention has the following advantages over the prior art:

[0021] The laser processing device described in the present invention is used to perform micro-group deep hole machining on a workpiece. Specifically, the laser processing device comprises a machining unit, a laser unit, a magnetic unit, and a control unit. The machining unit includes a support, a chamber, and a liquid supply device. During operation, the workpiece to be processed is placed on the support, which secures the workpiece to ensure stability during laser processing. The supporting member is arranged in the accommodating cavity. During the processing, the accommodating cavity is filled with high-pressure liquid. By setting a magnetic unit, a coupling magnetic field with adjustable magnetic field strength is generated in the vertical direction of the processing surface of the workpiece to be processed. The plasma is constrained and accelerated by the coupling magnetic field, so that the constrained plasma will reduce the interference with the laser beam. At the same time, the constrained plasma will be accelerated by the coupling magnetic field, and the accelerated and constrained plasma is used to collide with the processing surface of the workpiece to be processed at high speed to achieve material removal, thereby preparing high-quality fine deep holes; in addition, since a high-pressure liquid environment is formed in the accommodating cavity, the interference of plasma on the laser beam can be effectively suppressed, and the flowing liquid can carry away the tiny residues splashed by the plasma plume during the processing process, effectively promoting the cooling of the melting zone and the heat-affected zone, thereby improving the surface quality of the workpiece to be processed, improving the dimensional accuracy and shape accuracy of the fine holes, and effectively improving the aspect ratio of the fine deep holes. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings, wherein:

[0023] Figure 1 It is a schematic diagram of the overall structure of a preferred embodiment of the present invention.

[0024] Figure 2 It is a schematic diagram of the overall structure of the preferred embodiment of the present invention when the cover is removed.

[0025] Figure 3 It is a structural schematic diagram of a supporting body according to a preferred embodiment of the present invention.

[0026] Figure 4yes Figure 3 A partial enlarged schematic diagram.

[0027] Figure 5 Schematic diagram of the force exerted on electrons in a magnetic field according to a preferred embodiment of the present invention.

[0028] Figure 6 It is a schematic diagram of the motion trajectory of electrons in a magnetic field according to a preferred embodiment of the present invention.

[0029] Explanation of the reference numerals in the accompanying drawings in the specification: 1. Supporting member; 10. Bottom plate; 11. Receiving groove; 2. Accommodating cavity; 20. Main body; 21. Cover body; 3. Liquid supply device; 30. High-pressure water supply machine; 31. Water inlet pipe; 32. Water outlet pipe; 4. Laser emitting device; 5. Magnetic unit; 51. First magnet; 52. Second magnet; 53. Third magnet; 6. Moving mechanism. DETAILED DESCRIPTION

[0030] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0031] Reference Figures 1 to 6 As shown, the present invention discloses a laser processing device for laser processing a workpiece to be processed.

[0032] The laser processing device includes a processing unit, which includes a support member 1, a receiving chamber 2, and a liquid supply device 3. During operation, the workpiece to be processed is placed on the support member 1, which can secure the workpiece to ensure that it remains stable during laser processing. The support member 1 is disposed within the receiving chamber 2.

[0033] Furthermore, the liquid supply device 3 is interconnected with the accommodating cavity 2 to provide a high-pressure liquid environment to the accommodating cavity 2 and maintain a stable pressure of the liquid in the accommodating cavity 2; when working, there is high-pressure flowing liquid in the accommodating cavity 2.

[0034] The laser machining device further includes a laser unit, which includes a movable laser emitting device 4. The laser emitting device 4 is driven to move to a working area, and the laser emitting device 4 is capable of emitting a laser beam to the workpiece to be processed so as to perform laser processing on the workpiece to be processed.

[0035] The laser machining device further includes a magnetic unit 5, which is arranged around the accommodating cavity 2 and is used to apply a coupling magnetic field with adjustable strength in a vertical direction of the machining surface of the workpiece to be machined;

[0036] The laser machining device also includes a control unit electrically connected to the machining unit, the laser unit, and the magnetic unit. The control unit controls the movement of the laser emitting device 4 to a specified position and the operation of the magnetic unit 5, thereby generating the coupling magnetic field toward the machining surface of the workpiece. Simultaneously, the high-pressure liquid environment within the accommodating chamber 2 can suppress interference with the laser beam caused by plasma during laser machining.

[0037] From this, it can be seen that the laser processing device to be protected by this invention is used for performing micro-group deep hole processing on a workpiece to be processed. Specifically, the laser processing device comprises a processing unit, a laser unit, a magnetic unit, and a control unit. The processing unit includes a support, a accommodating chamber, and a liquid supply device. During operation, the workpiece to be processed is placed on the support, which can fix the workpiece to ensure that the workpiece remains stable during the laser processing process. The supporting member is arranged in the accommodating cavity. During the processing, the accommodating cavity is filled with high-pressure liquid. By setting a magnetic unit, a coupling magnetic field with adjustable magnetic field strength is generated in the vertical direction of the processing surface of the workpiece to be processed. The plasma is constrained and accelerated by the coupling magnetic field, so that the constrained plasma will reduce the interference with the laser beam. At the same time, the constrained plasma will be accelerated by the coupling magnetic field, and the accelerated and constrained plasma is used to collide with the processing surface of the workpiece to be processed at high speed to achieve material removal, thereby preparing high-quality fine deep holes; in addition, since a high-pressure liquid environment is formed in the accommodating cavity, the interference of plasma on the laser beam can be effectively suppressed, and the flowing liquid can carry away the tiny residues splashed by the plasma plume during the processing process, effectively promoting the cooling of the melting zone and the heat-affected zone, thereby improving the surface quality of the workpiece to be processed, improving the dimensional accuracy and shape accuracy of the fine holes, and effectively improving the aspect ratio of the fine deep holes.

[0038] As a preferred embodiment, the liquid supply device 3 includes a high-pressure water supply machine 30, a water inlet pipe 31 and a water outlet pipe 32. The accommodating cavity 2 is connected to the high-pressure water supply machine 30 through the water inlet pipe 31 and the water outlet pipe 32. Specifically, a first opening and a second opening are provided on the accommodating cavity 2, the water inlet pipe 31 is connected to the first opening, and the water outlet pipe 32 is connected to the second opening.

[0039] The high-pressure water supply unit 30 is capable of driving the circulation of liquid within the accommodating chamber 2 while ensuring that the liquid maintains a stable pressure. The flowing, high-pressure liquid can suppress interference with the laser beam caused by the plasma. Furthermore, the flowing liquid can remove tiny debris splashed during processing by the plasma plume, promoting cooling of the molten zone and heat-affected zone, thereby improving the quality of the processed surface. The liquid comprises deionized water.

[0040] As a preferred embodiment, the high-pressure water supply machine 30 is a variable frequency constant pressure water supply machine.

[0041] Specifically, the accommodating cavity 2 includes a detachable main body 20 and a cover 21. The main body 20 has an upward opening, and the cover 21 is connected to the opening to close the accommodating cavity 2. It should be noted that the cover 21 is made of a material that can be penetrated by laser.

[0042] As a preferred embodiment, the magnetic unit 5 includes a magnet assembly and a magnet assembly control module. The magnet assembly control module is connected to the magnet assembly to control the input current of the magnet assembly, and by controlling the input current of the magnet assembly, the size of the output coupling magnetic field of the magnet assembly is controlled.

[0043] Among them, the magnet assembly includes a first magnet 51, a second magnet 52 and a third magnet 53. The first magnet 51 is located above the workpiece to be processed. When working, the laser beam emitted by the laser emitting device 4 passes through the first magnet 51 and is incident on the processing surface of the workpiece to be processed.

[0044] Furthermore, the second magnet 52 and the third magnet 53 are disposed oppositely on either side of the accommodating chamber 2, and are located on either side of the workpiece to be processed. During operation, the liquid within the accommodating chamber 2 is driven to flow in a first direction, and the second magnet 52 and the third magnet 53 are disposed oppositely in a second direction, which is perpendicular to the first direction.

[0045] Furthermore, the first magnet 51 includes but is not limited to a solenoid, the second magnet 52 includes an electromagnet, and the third magnet 53 includes an electromagnet.

[0046] As a preferred embodiment, the solenoid is arranged on the upper surface of the accommodating cavity 2, specifically, the solenoid is arranged on the cover body 21, and the axial direction of the solenoid is perpendicular to the processing surface of the workpiece to be processed; in order to ensure the comprehensiveness of the magnetic field coverage and improve the strength of the coupled magnetic field, the projection area of ​​the solenoid along the height direction is larger than the area of ​​the processing surface of the workpiece to be processed.

[0047] Specifically, during operation, the control unit sends a control signal to the magnet assembly control module, which controls the first magnet 51, the second magnet 52, and the third magnet 53 to excite and form a coupled magnetic field, which acts on the surface of the workpiece to be processed, thereby confining and accelerating the plasma. The magnet assembly control module adjusts the current flowing into the first magnet 51, the second magnet 52, and the third magnet 53 to adjust the magnetic field strength of the coupled magnetic field, facilitating operation and control.

[0048] It should be noted that the current passed through the first magnet 51, the second magnet 52 and the third magnet 53 is direct current; in this way, a first magnetic field is generated by the first magnet 51, a second magnetic field is generated by the second magnet 52, and a third magnetic field is generated by the third magnet 53, and the first magnetic field, the second magnetic field and the third magnetic field are superimposed to construct a coupled magnetic field.

[0049] During operation, the workpiece to be processed is fixed to the bottom of the accommodating cavity 2 by the supporting member 1. The supporting member 1 is installed at the bottom center of the main body 20 by fasteners. The supporting member 1 can withstand the impact of high-pressure flowing deionized water without shaking.

[0050] As a preferred embodiment, the supporting member 1 includes a base plate 10 and a receiving groove 11. The base plate 10 is installed at the bottom center of the main body 20 by bolts. The receiving groove is arranged on the upper surface of the base plate 10. The workpiece to be processed is fixed in the receiving groove 11 to avoid movement during laser processing, thereby ensuring stability and processing effect.

[0051] As a preferred embodiment, the laser processing device further includes a moving mechanism 6, which is connected to the laser emitting device 4 to drive the laser emitting device 4 to move to a specified position. The moving mechanism 6 includes but is not limited to a robot.

[0052] The moving mechanism 6 is communicatively connected to the control unit, whereby the control unit can control the robot to drive the laser emitting device 4 to move, thereby facilitating maintaining the distance between the laser emitting device 4 and the processing surface at a constant value, that is, the defocus amount is a constant value, thereby ensuring that the material removal rate remains unchanged, making the processing more stable, and further improving the processing quality.

[0053] Reference Figure 3 As shown, in this embodiment, the X direction is defined as the width direction of the workpiece to be processed, the Y direction is defined as the length direction of the workpiece to be processed, and the Z direction is defined as the thickness direction of the workpiece to be processed.

[0054] The X direction is parallel to the second direction, and the Y direction is parallel to the first direction.

[0055] As a preferred embodiment, along the Z direction, the distance from the laser emitting device 4 to the processing surface remains unchanged, that is, the defocus amount is a constant value.

[0056] The robot has the degree of freedom of translation along the X direction, the Y direction, and the Z direction, and the degree of freedom of swinging.

[0057] Preferably, the deionized water in the chamber 2 has a pressure of 30 bar and flows through the central area of ​​the chamber 2 at a rate of 4 liters / minute. This configuration allows the deionized water to remove tiny debris splashed during processing by the plasma plume, promoting cooling of the molten zone and heat-affected zone. Furthermore, the high pressure within the chamber 2 effectively suppresses plasma expansion, further reducing interference with the laser beam and ensuring stable laser beam intensity during laser processing.

[0058] As a preferred embodiment, the parameters of the laser emitting device 4 are: one scan along the scanning direction X, a scanning speed of 1 mm / s, a focused spot of 100 μm, and a pulse frequency of 50 kHz. The parameters of the micron-scale hole produced in the workpiece to be machined are: hole diameter of 100 μm, hole depth of 100 μm.

[0059] Combine Figure 4 、 Figure 5 as well as Figure 6 As shown, in some embodiments, the magnetic field B2 generated by the first magnet 51 (solenoid) passes perpendicularly through the surface of the workpiece to be processed, that is, the XY plane; the magnetic field B1 generated by the second magnet 52 (electromagnet) and the third magnet 53 (electromagnet) passes perpendicularly through the YZ plane.

[0060] Specifically, refer to Figure 4 and Figure 5 As shown, magnetic field B2 exerts a Lorentz force F1 perpendicular to the magnetic flux lines of magnetic field B2 on the electrons in the plasma, causing them to move in a circular motion around the magnetic flux lines, but does not restrict their displacement parallel to the magnetic flux lines. At the same time, magnetic field B1 exerts a Lorentz force F2 perpendicular to the magnetic flux lines of magnetic field B1 on the electrons in the plasma, causing them to move in a circular motion around the solenoid.

[0061] Furthermore, the electron is subjected to the combined force F of the Lorentz force of the magnetic field B2 and the magnetic field B1, and will move in a downward spiral.

[0062] Since plasma contains not only electrons but also ions, where electrons are negatively charged and ions are positively charged, the direction of the force on ions is opposite to that on electrons.

[0063] Furthermore, the ions will make an upward spiral motion;

[0064] In this way, the upward-spiraling ions and downward-spiraling electrons fuse to form a plasma current. This plasma current interacts with its own magnetic field, creating a pinch effect that shrinks and narrows the plasma current channel. This confines the plasma and accelerates the electrons downward, making it easier to remove material from the workpiece surface.

[0065] In the description of the present invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0066] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0067] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A laser processing device for laser processing a workpiece, characterized in that: include, A processing unit includes a supporting member, a receiving cavity, and a liquid supply device. The supporting member is used to fix the workpiece to be processed and is disposed in the receiving cavity. The liquid supply device is in communication with the receiving cavity to provide a high-pressure liquid environment to the receiving cavity. During operation, the receiving cavity has a high-pressure flowing liquid. A laser unit comprising a movable laser emitting device for emitting a laser beam to the workpiece to be processed; a magnetic unit, which is arranged around the accommodating cavity and is used to apply a coupling magnetic field with adjustable strength to the processing surface of the workpiece to be processed; The magnetic unit includes a magnet assembly and a magnet assembly control module, wherein the magnet assembly control module is connected to the magnet assembly to control an input current of the magnet assembly; The magnet assembly includes a first magnet, a second magnet, and a third magnet. The first magnet is located above the workpiece to be processed. During operation, the laser beam emitted by the laser emitting device passes through the first magnet and is incident on the workpiece to be processed. The second magnet and the third magnet are relatively arranged on both sides of the accommodating cavity and are respectively located on both sides of the workpiece to be processed. During operation, the liquid in the accommodating cavity flows along a first direction, and the second magnet and the third magnet are relatively arranged along a second direction, which is perpendicular to the first direction. The first magnet comprises a solenoid, the second magnet comprises an electromagnet, and the third magnet comprises an electromagnet; a control unit electrically connected to the machining unit, the laser unit, and the magnetic unit, the control unit controlling the laser emitting device to move to a specified position and controlling the magnetic unit to apply a coupling magnetic field to the workpiece to be machined; The liquid supply device includes a high-pressure water supply machine, a water inlet pipe, and a water outlet pipe. The accommodating cavity is connected to the high-pressure water supply machine through the water inlet pipe and the water outlet pipe. The high-pressure water supply machine can drive the liquid in the accommodating cavity to circulate; The accommodating cavity includes a detachable main body and a cover, the main body has an opening arranged toward the laser emitting device, and the cover is connected to the opening to close the accommodating cavity; The solenoid is arranged on the upper surface of the accommodating cavity, the axial direction of the solenoid is perpendicular to the processing surface of the workpiece to be processed, and the axial direction of the solenoid is perpendicular to the first direction and the second direction; the area of ​​the projection of the solenoid along the height direction is larger than the area of ​​the processing surface of the workpiece to be processed.

2. A laser processing device according to claim 1, characterized in that: The workpiece to be processed is fixedly arranged on the bottom of the accommodating cavity through the supporting member.

3. The laser processing device according to claim 1, characterized in that: It also includes a moving mechanism, which is connected to the laser emitting device to drive the laser emitting device to move to a specified position; the moving mechanism includes a robot.

4. A laser processing device according to any one of claims 1 to 3, characterized in that: The liquid includes deionized water.

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