Manufacturing method of polishing wandering star wheel

Abstract

The present application provides a method for manufacturing a polishing wandering star wheel capable of suppressing deformation of a substrate after a plurality of through holes are formed by irradiation of laser light. A method for manufacturing a polishing wandering star wheel in which a plurality of fabrication holes are formed by irradiating laser light along a machining path set on a circular substrate made of metal, the method including: irradiating laser light from a start position set in a cut-out region to a constant point set on the machining path; irradiating laser light around the machining path from the constant point until the constant point is reached, and retracting from the constant point towards the inner side of the cutting area; the constant point is set at a position where a reference ray, which is a ray extending in the radial direction from the center point of the substrate, intersects the processing path, and the angle of an angle formed by the reference ray and a first ray passing through the center point of the substrate and the center point of the cut-off region is set to 0 degree or a predetermined angle.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a planetary wheel for grinding. Background Art

[0002] Generally, in a grinding apparatus for grinding the surface of a workpiece such as a semiconductor wafer, glass, crystal, or various mechanical components, a planetary wheel is used for holding the workpiece.

[0003] Here, in order to manufacture a planetary wheel, first, a base material made of a thin plate material such as stainless steel or titanium is cut into a circular shape to form a disk-shaped substrate. Next, a laser is irradiated along a processing path set on the substrate to cut out a plurality of through holes such as planetary wheel holes or process holes. After that, the surface of the substrate is ground after heat treatment to complete (for example, refer to Patent Document 1 or Patent Document 2).

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2004 - 148497

[0007] Patent Document 2: Japanese Unexamined Patent Application Publication No. 11 - 347924 Summary of the Invention

[0008] Problems to be Solved by the Invention

[0009] However, in order to cut out through holes from the substrate, it is necessary to preset start and end points on the processing path, and irradiate the laser along the processing path for one round from the start and end points until reaching the start and end points again. However, in the conventional method for manufacturing a planetary wheel for grinding, the setting of the position of the start and end points has not been fully studied. Therefore, it is difficult to suppress the deformation generated on the substrate by forming a plurality of through holes, and it is necessary to remove the deformation generated on the substrate by long-time grinding.

[0010] The present invention has been made in view of the above problems, and its object is to provide a method for manufacturing a planetary wheel for grinding, which can suppress the deformation of the substrate after forming a plurality of through holes by irradiating a laser.

[0011] Means for Solving the Problems

[0012] In order to achieve the above object, in the method for manufacturing a planetary wheel for grinding according to the present invention, a laser is irradiated along a machining path set on a circular substrate made of metal to cut the substrate and form a plurality of through holes. The method for manufacturing a planetary wheel for grinding is characterized by having the following steps: irradiating the laser from a starting position set within a cutting region surrounded by the machining path until an end point set on the machining path, irradiating the laser along the machining path for one full revolution until reaching the end point, and irradiating the laser from the end point toward the inside of the cutting region and then retracting; the end point is set at a position where a reference ray intersects the machining path, the reference ray is a ray extending radially from the center point of the substrate, and the angle of the angle formed with a first ray passing through the center point of the substrate and the center point of the cutting region is set to 0 degrees or a specified angle.

[0013] Effects of the Invention

[0014] By the method for manufacturing a planetary wheel for grinding according to the present invention, deformation of the substrate after forming a plurality of through holes by irradiating the laser can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a top view showing the structure of the planetary wheel of Example 1.

[0016] Figure 2 It is a flowchart showing the manufacturing sequence of the planetary wheel of Example 1.

[0017] Figure 3 It is a flowchart showing the cutting process sequence of the process hole of Example 1.

[0018] Figure 4 It is an explanatory diagram showing the machining path, starting position, end point, and laser irradiation path set on the planetary wheel.

[0019] Figure 5 It is an explanatory diagram explaining the setting method of the end point of Example 1.

[0020] Figure 6 It is an explanatory diagram explaining the setting position of the end point.

[0021] Figure 7 It is an explanatory diagram explaining the setting position of the end point.

[0022] Figure 8 It is an explanatory diagram when the region where the process hole is formed is divided into a plurality of regions.

[0023] Figure 9 It is an explanatory diagram explaining the setting position of the end point in the planetary wheel (first sample) of the comparative example.

[0024] Figure 10 It is a table showing the ratio of the grinding area of each sample after the grinding process has been carried out for a specified time.

[0025] Figure 11A It is an explanatory drawing explaining the setting positions of the start and end points in the second sample.

[0026] Figure 11B It is an explanatory drawing explaining the setting positions of the start and end points in the third sample.

[0027] Explanation of reference numerals

[0028] 1: Planetary wheel for grinding,

[0029] 10: Substrate,

[0030] 20: Workpiece hole (through hole),

[0031] 30: Process hole (through hole). Detailed implementation mode

[0032] Hereinafter, based on Figure 1 Example 1 shown, the implementation mode of the manufacturing method of the planetary wheel for grinding of the present invention will be described.

[0033] The planetary wheel for grinding (hereinafter referred to as "planetary wheel 1") manufactured by the manufacturing method of Example 1 has a circular substrate 10, a plurality of workpiece holes 20 formed in the substrate 10, and a plurality of process holes 30.

[0034] The substrate 10 is a thin plate member made of a metal such as stainless steel or titanium. The substrate 10 is circular in a top view. In addition, teeth 10a are formed on the entire outer peripheral edge of the substrate 10.

[0035] The workpiece hole 20 is a through hole formed by irradiating the substrate 10 with a laser and cutting a part of the substrate 10. When grinding a workpiece, the workpiece is arranged inside the workpiece hole 20. The number, shape, and arrangement of the workpiece holes 20 can be set arbitrarily. In Figure 1 In the example shown, three workpiece holes 20 that are circular and of the same size in a top view are formed equidistantly along the circumferential direction with the center point O of the substrate 10 as the center. In addition, when a plurality of workpiece holes 20 are formed in the substrate 10, each workpiece hole 20 can be of a different shape or size. In addition, the inner peripheral edge of the workpiece hole 20 can be lined with plastic.

[0036] The process hole 30 is a through hole formed by irradiating the substrate 10 with a laser and cutting a part of the substrate 10. The process hole 30 is a through hole formed outside the workpiece hole 20 in the substrate 10, and is formed to discharge the slurry during workpiece grinding or to suppress the deformation of the substrate 10, etc. The number, shape, and arrangement of the process holes 30 can be set arbitrarily. In Figure 1In the example shown, three process holes 30 that are circular and of the same size when viewed from above are formed at equal intervals along the circumferential direction with the center point O of the substrate 10 as the center, at positions that do not coincide with the workpiece hole 20. In addition, when a plurality of process holes 30 are formed in the substrate 10, each process hole 30 may also have a different shape or size.

[0037] The manufacturing method of the planet gear 1 of Embodiment 1 proceeds in the order shown in the Figure 2 flowchart.

[0038] That is, in step S1, a base material made of a thin metal sheet material for machining into the planet gear 1 is prepared, and the process proceeds to step S2. The material of the base material can be arbitrarily selected, such as stainless steel or titanium.

[0039] In step S2, after the preparation of the base material in step S1, the substrate 10 is cut out from the base material, and the process proceeds to step S3. The substrate 10 is cut out by irradiating a laser along a pre-set outer shape path on the base material.

[0040] In step S3, after the substrate 10 is cut out in step S2, the removal process of the workpiece hole 20 is performed, and the process proceeds to step S4. In the removal process of the workpiece hole 20, first, at a specified position on the substrate 10, a processing path corresponding to the shape of the workpiece hole 20, a start position located inside the processing path, and start and end points located on the processing path are set. In addition, the positions of the start position and the start and end points can be arbitrarily set according to the shape or configuration of the workpiece hole 20. Then, the laser is irradiated from the start position until the end point, and the laser is irradiated around the substrate 10 along the processing path for one week from the end point until the end point is reached. After irradiating the laser from the end point toward the inside of the processing path and then retracting, the workpiece hole 20 is cut out from the substrate 10.

[0041] In step S4, after the removal process of the workpiece hole 20 in step S3, the removal process of the process hole 30 (through hole) is performed, and the process proceeds to step S5. In addition, the removal process of the process hole 30 is described later using the Figure 3 flowchart shown.

[0042] In step S5, after the removal process of the process hole 30 in step S4, the substrate 10 with all through holes cut out is heat-treated, and the process proceeds to step S6. In addition, the heat treatment is, for example, annealing.

[0043] In step S6, after the heat treatment in step S5, the substrate 10 is cooled, and then, the front and back surfaces of the substrate 10 are respectively polished, and the process ends. Among them, the polishing process is performed until the deformation of the substrate 10 is removed and both the front and back surfaces of the substrate 10 become flat.

[0044] The cutting process of the process hole 30 in step S4 is carried out in the order shown by Figure 3 the flowchart.

[0045] That is, in step S41, a machining path 101 corresponding to the shape of the process hole 30 and a start position 102 are set at a specified position on the substrate 10 (refer to Figure 4 ), and step S42 is entered. In Embodiment 1, as Figure 4 shown, the machining path 101 is annular, and the cutting area 100 surrounded by the machining path 101 is circular in a top view. In addition, the start position 102 is set at an arbitrary position within the cutting area 100 surrounded by the machining path 101. Furthermore, the machining path 101 and the start position 102 are not physically attached to the substrate 10, but are set by calculation based on the center point O of the substrate 10, etc.

[0046] In step S42, after setting the machining path 101 and the start position 102 in step S41, an end point 103 is set on the machining path 101 (refer to Figure 4 ), and step S43 is entered. Among them, as Figure 5 shown, the end point 103 is set at the position α where the reference ray L intersects the machining path 101, and the reference ray L is a ray extending radially from the center point O of the substrate 10. The reference ray L is a straight line that coincides with the first ray L1 passing through the center point O of the substrate 10 and the center point O1 of the cutting area 100 or is inclined at a specified angle with respect to the first ray L1, and the angle θ formed by the first ray L1 and the reference ray L is set to 0 degrees or a specified angle.

[0047] That is, the angle θ formed by the first ray L1 and the reference ray L can be set arbitrarily. Therefore, for example, as Figure 6 shown, the angle θ can be set to 0 degrees, and the reference ray L passes through the center point O of the substrate 10 and the center point O1 of the cutting area 100 and coincides with the first ray L1. In this case, the end point 103 is set at the position α where the reference ray L passing through the center point O of the substrate 10 and the center point O1 of the cutting area 100 intersects the machining path 101.

[0048] In addition, as Figure 7 shown, the angle θ can be set to the angle at which the reference ray L becomes the tangent of the machining path 101. That is, the reference ray L becomes a straight line tangent to the machining path 101 at the position α where the straight line L2 intersects the machining path 101, and the straight line L2 passes through the center point O1 of the cutting area 100 and is orthogonal to the first ray L1. In this case, the end point 103 is set at the position α where the reference ray L passing through the center point O of the substrate 10 and tangent to the machining path 101 is tangent to the machining path 101.

[0049] Moreover, as Figure 8 shown, the plurality of process holes 30 can be distinguished by arbitrarily setting a plurality of regions A on the substrate 10, and the angle of the angle θ is different for each region A.

[0050] Moreover, as Figure 5 or Figure 6 shown, when there are two positions α where the reference ray L intersects the machining path 101, any one of the two positions α is set as the start / end point 103.

[0051] In step S43, after the setting of the start / end point 103 in step S42, as Figure 4 indicated by the dotted arrow in, the substrate 10 is irradiated with laser light from the start position 102 to the start / end point 103, and step S44 is entered. Herein, the path of irradiating the laser light from the start position 102 to the start / end point 103 can be arbitrarily set. In addition, the moving speed (cutting speed) of the laser can be arbitrarily set, and it can be a constant speed or can vary according to the position.

[0052] In step S44, after irradiating the laser light from the start position 102 to the start / end point 103 in step S43, as Figure 4 indicated by the solid arrow in, the substrate 10 is irradiated with laser light from the start / end point 103 along the machining path 101 for one round until reaching the start / end point 103, and step S45 is entered. Herein, the moving speed (cutting speed) of the laser can be arbitrarily set, and it can be a constant speed or can vary according to the position.

[0053] In step S45, after irradiating the laser light from the start / end point 103 to the start / end point 103 in step S44, as Figure 4 indicated by the dash-dotted arrow in, the laser light is irradiated from the start / end point 103 toward the inside of the cutting region 100 and then retracted, and the process ends. Herein, the moving speed (cutting speed) of the laser can be arbitrarily set, and it can be a constant speed or can vary according to the position. In addition, "retraction" means stopping the irradiation of the laser light at an appropriate position inside the cutting region 100.

[0054] Hereinafter, the operation of the manufacturing method of the planetary gear 1 of the first embodiment will be described.

[0055] In the manufacturing method of the planet gear 1 of Embodiment 1, when cutting the process holes 30 (through holes) from the substrate 10, the start and end points 103 set on the machining path 101 are set at the position α where the reference ray L intersects the machining path 101. The reference ray L is a ray extending radially from the center point O of the substrate 10, and the angle θ formed with the first ray L1 passing through the center point O of the substrate 10 and the center point O1 of the cutting area 100 is set to 0 degrees or a specified angle.

[0056] That is, in the manufacturing method of the planet gear 1 of Embodiment 1, regardless of the configuration of the plurality of process holes 30, the plurality of start and end points 103 are set to be radially dispersed around the center point O of the substrate 10. Therefore, when forming the plurality of process holes 30 by laser processing, each process hole 30 is cut out from a radial position based on the center point O of the substrate 10. Thus, in the manufacturing method of Embodiment 1, when irradiating laser along the machining path 101 and cutting out the process holes 30 from the substrate 10, the positions where the heat generated by the laser stays can be regularly distributed. Moreover, the residual stress in the substrate 10 can be reduced or regularly distributed.

[0057] As a result, the manufacturing method of Embodiment 1 can suppress the deformation or warping generated on the substrate 10 due to the formation of the process holes 30 and improve the flatness of the substrate 10. Moreover, compared with the following situation, for example, in the planet gear 1X as shown in Figure 9 where the start and end point 103 is set at the right end point of the machining path 101 in a plan view in the circular cutting area 100 that becomes the process hole 30, the deformation of the substrate 10 can be reduced, and the grinding processing time for making the substrate 10 flat can be shortened.

[0058] Figure 10 Shown are the ratios of the grinding areas of the front and back surfaces of the substrate 10 in the first to third samples in the case where after heat-treating the substrate 10 after forming the process holes 30, a grinding process is performed for a specified same time (about 30 minutes). In addition, the "grinding area" refers to the area of the part where the deformation of the substrate 10 is substantially removed by grinding and the deviation of flatness is within the specified range.

[0059] Among them, when the substrate 10 is ground, the flatness (undulation) of the part where the deformation of the substrate 10 has been removed changes. Moreover, when there is no deviation in the flatness of the front surface of the substrate 10, the deformation of the substrate 10 is small and it is ground evenly. That is, in Figure 10 the larger the value, the larger the grinding area and the more appropriately it is ground.

[0060] The first sample is the planet gear 1X (refer to Figure 9), the cutting area 100 of the process hole 30 is circular in a top view. Among all the cutting areas 100, in a top view, the terminal point 103 is always set at the right end point of the machining path 101. Additionally, the second sample is the planet gear 1A (refer to Figure 11A ), the cutting area 100 of the process hole 30 is circular in a top view. Among all the cutting areas 100, the reference ray L passing through the center point O of the substrate 10 and the center point O1 of the cutting area 100 and coinciding with the first ray L1 intersects the machining path 101, and the terminal point 103 is always set at the position α on the side closer to the center point O of the substrate 10. Additionally, the third sample is the planet gear 1B (refer to Figure 11B ), the cutting area 100 of the process hole 30 is circular in a top view. Among all the cutting areas 100, the reference ray L passing through the center point O of the substrate 10 and the center point O1 of the cutting area 100 and coinciding with the first ray L1 intersects the machining path 101, and the terminal point 103 is always set at the position α on the side farther from the center point O of the substrate 10.

[0061] According to Figure 10 's table, in the first sample, regardless of whether it is the front or back surface, the proportion of the grinding area is about 35%. Therefore, it can be known that in the first sample, the deviation of flatness is large, and the grinding process cannot be evenly performed with a specified grinding time (30 minutes).

[0062] In contrast, in the second sample, the proportion of the grinding area is more than 70%, and in the third sample, the proportion of the grinding area is about 60%. Therefore, it shows that in the second sample and the third sample, the deviation of the flatness of the substrate 10 after processing the process hole 30 can be suppressed, and even with a specified grinding time (30 minutes), the surface of the substrate 10 can be ground approximately evenly.

[0063] Thus, when the terminal point 103 is set at the position α where the reference ray L passing through the center point O of the substrate 10 and the center point O1 of the cutting area 100 intersects the machining path 101, that is, it can be known that the manufacturing method of the planetary gear for grinding in Example 1 can suppress the deformation or warping of the substrate 10 after forming the process hole 30 by irradiating laser.

[0064] Additionally, in the second sample and the third sample, the cutting area 100 is circular in a top view, and the reference ray L determined when setting the terminal point 103 passes through the center point O of the substrate 10 and the center point O1 of the cutting area 100.

[0065] That is, the terminal point 103 is set at the position where the reference ray L passing through the center point O of the substrate 10 and the center point O1 of the cutting area 100 intersects the machining path 101. Thus, as Figure 11A andFigure 11B As shown, it is possible to easily radially disperse the positions of the start and end points 103 around the center point O of the substrate 10 in a top-down view. Thus, the retention of heat during laser irradiation can be regularly distributed, suppressing deformation of the substrate 10.

[0066] In addition, the angle of the angle θ formed by the reference ray L and the first ray L1 can be adjusted for the cutting area 100, as Figure 7 shown, set to an angle such that the reference ray L becomes a tangent to the processing path 101 in a top-down view. In other words, the reference ray L can be a ray that is tangent to the processing path 101 at the position where the straight line L2 intersects the processing path 101, and the straight line L2 passes through the center point O1 of the cutting area 100 and is orthogonal to the first ray L1. That is, the start and end points 103 can be set at the position where the straight line L2 intersects the processing path 101, and the straight line L2 passes through the center point O1 of the cutting area 100 and is orthogonal to the first ray L1.

[0067] Even in this case, it is possible to easily radially disperse the start and end points 103 around the center point O of the substrate 10 in a top-down view, making the retention of heat during laser irradiation regularly distributed. Moreover, deformation of the substrate 10 can be suppressed.

[0068] Above, the manufacturing method of the planetary wheel for grinding of the present invention has been described based on Example 1, but the specific structure is not limited to this example, and design changes and additions are allowed within the scope not exceeding the gist of the invention of each claim.

[0069] In the manufacturing method of Example 1, an example where the through hole formed in the substrate 10 is the process hole 30 is shown. However, the through hole cut by irradiating the substrate 10 with a laser is not limited to the process hole 30, and can also be the workpiece hole 20. In addition, it can also be a through hole other than the workpiece hole 20 or the process hole 30.

[0070] In addition, in the manufacturing method of Example 1, an example where the process hole 30 as the through hole is circular in a top-down view is shown. However, the shape of the through hole (process hole 30) is not limited to circular, and for example, it can also be elliptical, hexagonal, pentagonal, rectangular, square, etc. in a top-down view, or a slit-shaped long hole shape. Even if the shape of the through hole is a shape other than circular in a top-down view, the first ray and the reference ray can be set by setting the center point O1 of the cutting area 100.

[0071] In addition, in Figure 7In the example shown, the cutout area 100 of the process hole 30 is circular in a top view, and the reference ray L is tangent to the machining path 101 at the position where the straight line L2 intersects the machining path 101. However, as described above, the shape of the process hole 30 (through hole) is not limited to a circle. Therefore, the reference ray L may also intersect the machining path 101 at the position where the straight line L2 intersects the machining path 101.

Claims

1. A method for manufacturing a planetary wheel for grinding, comprising irradiating a circular substrate made of metal with a laser along a processing path set on the substrate to cut the substrate to form a plurality of through holes, wherein the method for manufacturing a planetary wheel for grinding comprises the following steps: irradiating the laser beam from a starting position set in a cutting area surrounded by the processing path to an end point set on the processing path, irradiating the laser from the starting and ending points along the processing path in one circle until reaching the starting and ending points, and irradiating the laser from the starting and ending points toward the inside of the resection area and retreating; The starting and ending points are set at positions where a reference ray intersects the processing path, the reference ray is a ray extending radially from the center point of the substrate, and the angle formed by the reference ray and the first ray passing through the center point of the substrate and the center point of the resection area is set to 0 degrees or a specified angle.

2. The method for manufacturing a grinding planetary wheel according to claim 1, characterized in that: The reference ray passes through the center point of the substrate and the center point of the cut-out area, and is consistent with the first ray.

3. The method for manufacturing a grinding planetary wheel according to claim 1, characterized in that: The reference ray intersects or is tangent to the processing path at a position where a straight line passing through the center point of the resection area and being orthogonal to the first ray intersects the processing path.

Images