Composite acoustic vibration transduction sound head and passive monitoring device
Through the use of composite vibration transducer sound heads, the reliability and cost problems caused by the single equipment fault detection method in the prior art are solved, and the joint acquisition and analysis of vibration and sound signals are realized, and the accuracy and efficiency of fault detection are improved.
Patent Information
- Application Number
- CN202510347583.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-24
- Publication Date
- 2025-06-27
AI Technical Summary
In the prior art, the equipment fault detection method is carried out in a single manner, resulting in high reliability and cost of the analysis results, and the degree of equipment damage or failure cannot be accurately judged.
A composite acoustic and vibration transducer sound head is adopted, which consists of a dual-mode diaphragm mechanical vibration system, an acoustic sound pickup module and a signal amplification module. By sharing a customized dual-mode transducer diaphragm, the joint acquisition and analysis of vibration signals and sound signals are realized.
The simultaneous acquisition and analysis of equipment vibration and sound signals is realized, which improves the accuracy and efficiency of fault detection and reduces detection costs.
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Figure CN120213202A_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the present disclosure relate to the technical field of acoustic and vibration detection, and more particularly to a composite acoustic and vibration transducer head and a passive monitoring device. Background Art
[0002] Disclosing the information of this background art section is only intended to enhance the understanding of the overall background of the present disclosure, and is not necessarily regarded as an admission or any form of implication that this information constitutes related art that has become well-known to those of ordinary skill in the art.
[0003] Fault detection in industrial production processes, pipeline fault detection, noise environment monitoring, vibration source monitoring, etc. are particularly important for industrial production, which is conducive to realizing automated and intelligent management in fields such as environmental protection and industry.
[0004] Taking equipment fault detection as an example, rotating machinery such as motors, fans, pumps, etc. play a key role in industrial production. Their operating states directly affect production efficiency and quality. When monitoring rotating machinery, vibration analysis and acoustic detection often complement each other. The current common practice in the industry is to install vibration sensors and acoustic sensors at key parts of the equipment respectively to simultaneously collect vibration signals and sound signals. This requires a large number of sensor components, increasing costs, and there is interference between them during the separate collection process. When analyzing the results, only the influence of vibration or sound can be analyzed separately. However, for equipment damage and faults, they are the result of the combined action of these two factors. Analyzing them separately cannot accurately determine the degree of equipment damage or faults, which is not conducive to industrial production.
[0005] For this application scenario, the present invention proposes a composite acoustic and vibration transducer head, which replaces the original vibration sensor and acoustic sensor that need to be installed. This transducer device mainly consists of three parts, including a bimodal diaphragm mechanical vibration system, an acoustic pickup module, and a signal amplification module, where the vibration sensing and acoustic pickup modules share a customized bimodal transducer diaphragm. The passive monitoring device composed of the composite acoustic and vibration transducer head also cooperates with an environmental micro-energy collection and management chip, and uses a low-power data analysis and processing module to complete the collection, monitoring, and analysis of equipment vibration and sound signals. Vibration signals can reflect the mechanical vibration characteristics of the equipment, while sound signals contain the acoustic information during equipment operation. For example, when the bearing wears, the vibration signal will show abnormal peaks at specific frequencies (such as the fault frequencies of the inner ring, outer ring, and rolling elements of the bearing), and at the same time, the sound signal will also change within the corresponding frequency range, manifested as changes in the pitch, loudness, and timbre of the sound. By jointly analyzing the vibration and acoustic signals, the degree and type of bearing faults can be judged more accurately. Summary of the Invention
[0006] To this end, embodiments of the present disclosure provide a composite acoustic-vibration transducer sound head and a passive monitoring device to solve the problems of affecting the reliability of result analysis and increasing costs caused by the single method of analyzing equipment failures in related technologies.
[0007] To achieve the above object, the embodiments of the present disclosure provide the following technical solutions:
[0008] In the first aspect of the embodiments of the present disclosure, a composite acoustic-vibration transducer sound head is provided, including
[0009] A bimodal diaphragm mechanical vibration system: for collecting vibration signals;
[0010] An acoustic pickup module: for collecting sound signals;
[0011] A bimodal diaphragm mechanical vibration system: for converting vibration signals and / or sound signals into force signals for output, realizing signal transduction;
[0012] The bimodal diaphragm mechanical vibration system includes a vibration cavity. A piezoelectric film is provided at the end of the vibration cavity, a vibration induction module is provided at the bottom of the vibration cavity opposite to the piezoelectric film, and a copper ring is provided outside the piezoelectric film.
[0013] In one embodiment, the bimodal diaphragm mechanical vibration system includes an acoustic-force-magnetic-electric transduction structure: for converting the received sound signal into an electrical signal for output;
[0014] The acoustic pickup module includes a piezoelectric transduction structure: for performing force-electric energy conversion on the received vibration signal and outputting an electrical signal.
[0015] In one embodiment, the acoustic-force-magnetic-electric transduction structure couples the sound, force, and electricity of the received sound signal to form an output signal;
[0016] The piezoelectric transduction structure performs electric power conversion on the received vibration signal and outputs an electrical signal;
[0017] The bimodal diaphragm mechanical vibration system converts the received sound signal into the kinetic energy of the diaphragm itself, cuts the magnetic induction line, generates an electromotive force, and converts the sound signal into an electrical signal:
[0018] Due to the action of the vibration signal on it, the bimodal diaphragm mechanical vibration system will deform, generate a piezoelectric effect, cause the relative displacement of the positive and negative charge centers, and thus appear bound charges with opposite signs on the two opposite surfaces of the material. The generation of this charge is proportional to the applied pressure, and the vibration and / or pressure signal is converted into an electrical signal.
[0019] In one embodiment, the material of the piezoelectric film is a composite acoustic metamaterial, and the thickness of the diaphragm is less than or equal to 30 μm.
[0020] In one embodiment, the material of the piezoelectric film is polyphenylene sulfide film or polyethylene terephthalate film.
[0021] In the second aspect of the embodiments of the present disclosure, a passive monitoring device is provided, including the above-mentioned composite acoustic vibration transducer head;
[0022] A sensor system, including a sensor chip, an integrated signal amplification circuit, and a signal output circuit;
[0023] The sensor system is connected to the composite acoustic vibration transducer head.
[0024] According to the embodiments of the present disclosure, it has the following advantages: a dual-mode diaphragm mechanical vibration system: used to convert vibration signals and / or sound signals into electrical signals for output, realizing signal acquisition and transmission; the dual-mode diaphragm mechanical vibration system includes a vibration cavity, a piezoelectric film is provided at the end of the vibration cavity, a vibration induction module is provided at the bottom of the vibration cavity opposite to the piezoelectric film, and a copper ring is provided outside the piezoelectric film. By setting the dual-mode diaphragm mechanical vibration system, this sensor can receive sound signals and vibration signals simultaneously, and convert the two signals into electrical signals for output. Its structure realizes the simultaneous acquisition and output of the two signals. Therefore, the dual-mode signal acquisition method can be used to realize unsupervised AI abnormal sound detection, which is beneficial to the synchronization of subsequent analysis, and further realizes better analysis of the performance of industrial equipment in two types of noises to accurately confirm the fault situation, improve the accuracy of inspection, and reduce the detection cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the related art, the following will briefly introduce the drawings required for use in the description of the embodiments or the related art. Obviously, the drawings in the following description are only exemplary, and for those of ordinary skill in the art, without creative efforts, other implementation drawings can be obtained according to the provided drawings.
[0026] The structures, ratios, sizes, etc. illustrated in this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limited conditions for the implementation of the present disclosure. Therefore, they do not have technical essence. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present disclosure can produce and the purposes that can be achieved, should still fall within the scope that the technical content disclosed in the present disclosure can cover.
[0027] Figure 1 It is a schematic structural diagram of a composite acoustic vibration transducer head shown according to an exemplary embodiment;
[0028] Figure 2 Schematic structural diagram of a dual-modal diaphragm mechanical vibration system in a transducer head shown according to an exemplary embodiment;
[0029] Figure 3 Combined sectional view of a piezoelectric diaphragm in a transducer head shown according to an exemplary embodiment;
[0030] Figure 4 Schematic structural diagram of force analysis of a piezoelectric thin film in a transducer head shown according to an exemplary embodiment;
[0031] Figure 5 Schematic structural principle diagram of a passive monitoring device shown according to an exemplary embodiment.
[0032] In the figure: 1, vibration cavity; 2, piezoelectric thin film; 3, vibration induction module; 4, copper ring. Specific implementation manners
[0033] The following specific embodiments illustrate the implementation manners of the present disclosure. Those skilled in the art can easily understand other advantages and effects of the present disclosure from the content disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope protected by the present disclosure.
[0034] Terms such as "upper", "lower", "left", "right", "middle", etc. cited in this specification are only for the convenience of clear narration, rather than to limit the scope in which the present disclosure can be implemented. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope in which the present disclosure can be implemented.
[0035] Taking equipment fault detection as an example, rotating machinery such as motors, fans, pumps, etc. plays a key role in industrial production. Their operating states directly affect production efficiency and quality. When monitoring rotating machinery, vibration analysis and acoustic detection often complement each other. The current common practice in the industry is: by installing vibration sensors and acoustic sensors at key parts of the equipment respectively to collect vibration signals and sound signals simultaneously. This requires a large number of sensor components, increasing costs, and there are interferences between the separate collection processes. When analyzing the results, only the influence of vibration or sound can be analyzed separately. However, for equipment damage and faults, they are the result of the combined action of the two factors. Analyzing separately cannot accurately determine the degree of equipment damage or faults, which is not conducive to industrial production.
[0036] For this application scenario, the present invention proposes a composite acoustic-vibration transducer sound head, which replaces the original vibration sensor and acoustic sensor that need to be installed. This transducer device mainly consists of three parts, including a dual-mode diaphragm mechanical vibration system, an acoustic pickup module, and a signal amplification module. Among them, the vibration sensing and acoustic pickup modules share a customized dual-mode transducer diaphragm. The passive monitoring device composed of the composite acoustic-vibration transducer sound head is also combined with an ambient micro-energy collection and management chip, and uses a low-power data analysis and processing module to complete the acquisition, monitoring, and analysis of the device vibration and sound signals. The vibration signal can reflect the mechanical vibration characteristics of the device, while the sound signal contains the acoustic information during the operation of the device. For example, when the bearing is worn, the vibration signal will show abnormal peaks at specific frequencies (such as the fault frequencies of the inner ring, outer ring, and rolling elements of the bearing), and at the same time, the sound signal will also change within the corresponding frequency range, manifested as changes in the pitch, loudness, and timbre of the sound. By jointly analyzing the vibration and acoustic signals, the fault degree and type of the bearing can be judged more accurately.
[0037] Embodiment 1;
[0038] As Figures 1-4 shown, in the first aspect of the embodiments of the present disclosure, a composite acoustic-vibration transducer sound head is provided, including
[0039] A dual-mode diaphragm mechanical vibration system: used to collect vibration signals;
[0040] An acoustic pickup module: used to collect sound signals;
[0041] A dual-mode diaphragm mechanical vibration system: used to convert vibration signals and / or sound signals into force signals for output, realizing signal transduction;
[0042] The dual-mode diaphragm mechanical vibration system includes a vibration cavity. A piezoelectric thin film is provided at the end of the vibration cavity, a vibration induction module is provided at the bottom of the vibration cavity opposite to the piezoelectric thin film, and a copper ring is provided outside the piezoelectric thin film.
[0043] By setting the dual-mode diaphragm mechanical vibration system, this sensor can receive both sound signals and vibration signals simultaneously, and convert the two signals into electrical signals for output. Its structure realizes the simultaneous acquisition and output of the two signals. Therefore, the dual-mode signal acquisition method can be used to realize unsupervised AI abnormal sound detection, which is beneficial to the synchronization of subsequent analysis, and further realizes better analysis of the performance of industrial equipment in two types of noises and accurate confirmation of fault conditions, improving the accuracy of inspection and reducing the detection cost.
[0044] In one embodiment, the dual-mode diaphragm mechanical vibration system includes an acoustic-force-magnetic-electric transducer structure: converting the received sound signal into an electrical signal for output;
[0045] The acoustic pickup module includes a piezoelectric transducer structure: which converts the received vibration signal into a force-electricity signal and outputs an electric signal.
[0046] Specifically, a theoretical analysis model combining a complete sound-force-magnetism-electricity transducer structure and a piezoelectric transducer structure is established. The transducer structure of the passive acoustic vibration composite sensor involves multi-disciplinary coupling of acoustics, mechanics, and electricity. When analyzing its acoustic performance, multi-objective trade-offs need to be achieved and the constraint conditions in each field vary greatly.
[0047] When the vibration model of the circular diaphragm is of the thin plate type, more complex types of strain caused by elastic stress will occur when the thin plate bends. For example, when the plate is laterally compressed, it will elongate longitudinally. Therefore, the ratio of the lateral compression to the longitudinal elongation per unit length is defined as the Poisson's ratio, denoted as μ. The Poisson's ratio causes the Young's modulus of the circular thin plate to equivalently change from Y to Y / (1 - μ 2 ). Equation (2-1) is the free vibration equation of a thin plate with in-plane tension and no damping.
[0048]
[0049] Among them, represents the stiffness of the circular thin plate, η represents the deformation of the thin plate during vibration, and the residual internal stress of the thin plate is σ, Assume that the solution of the equation (the deformation of the thin plate during vibration) satisfies η(r, θ, t) = η(r, θ)e jωt , then Equation (2-1) can be expressed as Equation (2-2). ω represents the angular frequency of the circular thin plate vibration.
[0050]
[0051] Solving Equation (2-2) gives the vibration displacement amplitude and angular frequency of the circular thin plate as shown in Equations (2-3) and (2-4).
[0052]
[0053] In Equations (2-3) and (2-4),
[0054]
[0055] Equation (2-5) is the characteristic frequency of the circular thin plate.
[0056]
[0057] In Equation (2-5), Y, μ, and ρ respectively represent the Young's modulus, Poisson's ratio, and density of the circular thin plate. Kmn is the coefficient of the mn-th vibration mode. When m = n = 0, k00 = 3.196. Equation (2-6) is the fundamental vibration frequency of a circular thin plate.
[0058]
[0059] Equation (2-6) shows that, under fixed parameter conditions, the fundamental frequency of a circular thin plate is inversely proportional to the square of the radius and directly proportional to the thickness. Continuing the analysis of the forced vibration of the thin plate, assume that the circular thin plate is subjected to a sound wave with a sound pressure of p = p a e jωt . Pa is the amplitude of the sound pressure, and Rm represents the damping coefficient during the vibration of the thin plate. Equation (2-7) is the forced vibration equation of the circular thin plate.
[0060]
[0061] Equation (2-8) is the solution of the forced vibration equation of the thin plate.
[0062]
[0063] In the case of small deflection bending, the deformation of the diaphragm has a linear relationship with the external pressure. For a compound acoustic vibration sensor, its vibration model belongs to the large deflection problem of a clamped circular plate under the action of a large area transverse load and an initial in-plane tensile load. Under the dual action of the initial tension and bending stress, the theoretical analysis model of the diaphragm transitions from a thin plate type to a thin film type. Therefore, whether to choose a circular thin plate model or a circular thin film model actually depends on the tension coefficient, and the tension coefficient K is expressed as
[0064]
[0065] As shown in Equation 2-9, the tension coefficient K is used to characterize the magnitude relationship between the residual stress and stiffness in the diaphragm. When K < 1, the theoretical model of the diaphragm is approximately a circular thin plate, η s (r, t) ≈ η plate (r, t). When 1 < K < 20, the theoretical model is approximately the small deflection bending of the circular thin plate vibration (i.e., the displacement of the diaphragm satisfies less than 30% of the diaphragm thickness), and the displacement η s satisfies When K > 20, the theoretical model of the diaphragm is approximately a circular thin film, η s (r, t) ≈ η mem (r, t).
[0066] The research results show that: (1) The slight stretching of the diaphragm exhibits a highly non-linear response, and the degree of non-linearity decreases with the increase of the stretching ratio. (2) On the premise that other parameters remain unchanged, when the deformation radius is twice the initial value, the response actually becomes linear. (3) As the radial stretching or vibration displacement increases, the frequency-displacement response converges to the same frequency upper limit. The above results explain the displacement amplitude accuracy of the low-order model for large-vibration elastic membranes.
[0067] In one embodiment, the acoustic-force-magnetic-electric transducer structure couples the sound, force, and electricity of the received sound signal to form an output signal;
[0068] The piezoelectric transducer structure performs force-electric conversion on the received vibration signal and outputs an electric signal;
[0069] The dual-mode diaphragm receives the sound signal, converts it into the kinetic energy of the diaphragm itself, cuts the magnetic induction line, generates an electromotive force, and converts the sound signal into an electric signal:
[0070] At the same time, due to the vibration signal acting on the dual-mode diaphragm, it will deform, generate the piezoelectric effect, cause the relative displacement of the positive and negative charge centers, and thus appear bound charges with opposite signs on the two opposite surfaces of the material. The generation of this charge is proportional to the applied pressure, and the vibration and / or pressure signal is converted into an electric signal.
[0071] In one embodiment, the material of the piezoelectric thin film is a composite acoustic metamaterial, and the thickness of the diaphragm is less than or equal to 30 μm.
[0072] In one embodiment, the material of the piezoelectric thin film is polyphenylene sulfide thin film or polyethylene terephthalate thin film.
[0073] Among them, as Figure 4 shown, when the vibration membrane mechanical vibration system is not affected by external forces, the internal and external pressures of the acoustic-vibration composite sensor are the same, and it does not deform nor generate the piezoelectric effect, and the resultant force acting on the piezoelectric thin film is equal to zero. When a sound wave or vibration signal is incident, the vibration membrane mechanical vibration system is affected by the sound pressure p = p a e j(ωt-kr) . Assuming the diaphragm area is S, a resultant force F = [(P0 + p) - P0]S = pS is generated on the diaphragm. Under the action of this force, the diaphragm vibrates. Using the principle of the passive acoustic-vibration composite sensor, the vibration displacement is converted into an AC voltage output, and measuring this output voltage can determine the corresponding sound pressure in the sound field. If the incident direction of the sound wave forms an angle with the normal of the microphone diaphragm, and the linear dimension of the diaphragm cannot be ignored. Formula (2-10) is the sound pressure intensity acting on the microphone diaphragm.
[0074] F = ∫ S pdS (2-10)
[0075] Equation (2-11) is the resultant force received by the principle of the passive acoustic-vibration composite sensor.
[0076]
[0077] Embodiment 2:
[0078] As Figure 5 shown, in the second aspect of the implementation manner of the present disclosure, a passive detection device is provided, including the above-mentioned composite acoustic-vibration transducer head;
[0079] A sensor system, including a sensor chip, an integrated signal amplification circuit, and a signal output circuit;
[0080] The sensor system is connected to the composite acoustic-vibration transducer head.
[0081] It is an application scenario where a composite acoustic-vibration transducer microphone can be applied. An abnormal sound monitoring system is constructed through multi-dimensional sensors to realize the analysis of industrial voiceprints. The system is designed as follows: 1. A group of multi-dimensional sensors are composed of composite acoustic-vibration transducers and visual microphones, and multiple groups of multi-dimensional sensors form a sensor array to collect force, sound, and visual signals.
[0082] When the piezoelectric conversion method performs energy conversion, an initial voltage difference needs to be formed to perform the energy conversion for device power supply; the magnetoelectric conversion method generates energy by vibrating a conductor to cut the magnetic induction line. Currently, piezoelectric conversion and magnetoelectric conversion with relatively high energy density are widely used. Vibration energy harvesting has been applied in a certain range in industrial and indoor scenarios. For example, during the operation of equipment such as motors, gearboxes, and pumps in factories, slight vibrations will be generated, and piezoelectric materials can be used to collect and store this micro-vibration energy to obtain energy sufficient to support the operation of low-power sensors.
[0083] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "including", "comprising", or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article, or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or elements inherent to such process, method, article, or device. Without further limitations, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article, or device including the said element.
[0084] Although the present disclosure has been described in detail above with general descriptions and specific embodiments, modifications or improvements can be made thereto based on the present disclosure, which will be apparent to those skilled in the art. Therefore, these modifications or improvements made without departing from the spirit of the present disclosure all fall within the scope of protection required by the present disclosure.
Claims
1. A composite acoustic vibration transducer head, characterized in that: include Dual-mode diaphragm mechanical vibration system: used to collect vibration signals; Acoustic pickup module: used to collect sound signals; Dual-mode diaphragm mechanical vibration system: used to convert vibration signals and / or sound signals into force signal output to achieve signal transduction; The composite acoustic vibration transducer head comprises a vibration cavity, a piezoelectric film is arranged at the end of the vibration cavity, a vibration sensing module is arranged at the bottom of the vibration cavity opposite to the piezoelectric film, and a copper ring is arranged outside the piezoelectric film.
2. The composite acoustic vibration transducer head according to claim 1, characterized in that: The dual-mode diaphragm mechanical vibration system includes an acoustic-mechanical-magnetic-electric transducer structure: converting received sound signals into electrical signals for output; The acoustic pickup module includes a piezoelectric transducer structure: the received vibration signal is converted into force-electric energy to output an electrical signal.
3. The composite acoustic vibration transducer head according to claim 2, characterized in that: The acoustic-force-magnetic-electric transducer structure couples the acoustic, force and electricity of the received sound signal to form an output signal; The piezoelectric transducer structure converts the received vibration signal into an electrical signal. The bimodal diaphragm receives the sound signal, converts it into the kinetic energy of the diaphragm itself, cuts the magnetic induction line, generates electromotive force, and converts the sound signal into an electrical signal: At the same time, the bimodal diaphragm will deform due to the vibration signal acting on it, generating a piezoelectric effect, causing the positive and negative charge centers to shift relative to each other, resulting in bound charges of opposite signs appearing on the two opposite surfaces of the material. The generation of this charge is proportional to the applied pressure, and the vibration and / or pressure signal is converted into an electrical signal.
4. The composite acoustic vibration transducer head according to claim 3, characterized in that: The material of the piezoelectric film is a composite acoustic metamaterial, and the thickness of the film is less than or equal to 30 μm.
5. The composite acoustic vibration transducer head according to claim 1, characterized in that: The material of the piezoelectric film is polyphenylene sulfide film or polyethylene terephthalate film.
6. A passive monitoring device, characterized in that: The composite acoustic vibration transducer head as described in claims 1 to 5 is a passive monitoring device that can work without an external power supply; A sensor system, including a sensor chip, an integrated signal amplification circuit, and a signal output circuit; The sensor system is connected to the composite acoustic vibration transducer head.