Nondestructive testing system for internal resistance of semiconductor refrigerator

Abstract

The invention provides a nondestructive testing system for internal resistance of a semiconductor refrigerator, which is used in the technical field of semiconductors and comprises a base plate, a transverse testing mechanism and a longitudinal testing mechanism, wherein the transverse testing mechanism comprises transverse ejector pins which are oppositely arranged, the longitudinal testing mechanism comprises a longitudinal ejector pin and a first transverse moving assembly, and the longitudinal ejector pin faces a gap between the transverse ejector pins and is connected to the driving end of the first transverse moving assembly; and the transverse ejector pin and the longitudinal ejector pin are respectively used for connecting copper columns at three ends of the semiconductor cooler and a resistance detector. According to the invention, the internal resistance of the semiconductor refrigerator can be connected to the detection circuit from zero to all, and the state of the semiconductor refrigerator can be more accurately judged from the trend of change consistency; by arranging the longitudinal assembly, the first transverse moving assembly and the second transverse moving assembly, the device can be suitable for semiconductor coolers of different specifications; detection is fast, operation is convenient, errors caused by human intervention are reduced, and detection result accuracy and detection efficiency are improved.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor technology, and particularly relates to a non-destructive internal resistance detection system for a semiconductor cooler. Background Art

[0002] At present, in various fields such as national defense, aviation, aerospace, 5G communication, scientific research, commercial instrument equipment, etc., highly reliable and long-life semiconductor coolers are widely used. Semiconductor coolers play an important cooling role in equipment such as CCD / CMOS detectors, lasers, microwave devices, and optical communication devices. Especially for detectors, lasers, and microwave devices dominated by optical media, once the semiconductor cooler fails, it will cause serious impacts on single-device and even whole-device equipment. Therefore, it is necessary to strictly detect the quality of semiconductor coolers.

[0003] Chinese Patent with publication number CN109060874A discloses a method and system for detecting the installation quality of a semiconductor thermoelectric cooler. During the operation of the TEC to be measured under a preset voltage, M cold surface temperature values and M hot surface temperature values are obtained, and M temperature difference values are obtained to characterize whether the current, voltage, and temperature difference of the TEC to be measured meet the detection requirements. Although this method can detect the cold surface temperature, hot surface temperature, temperature difference, voltage, and current of the semiconductor cooler, it can only test the nominal internal resistance of the TEC and cannot accurately identify the fault state of the semiconductor cooler after undergoing electrical aging, temperature cycling, and other uses. Summary of the Invention

[0004] To solve the above technical problems, the present invention provides a non-destructive internal resistance detection system for a semiconductor cooler, which realizes the detection of different local and total internal resistances of the semiconductor cooler without damaging the semiconductor cooler, and can more accurately judge the state of the semiconductor cooler from the trend of change consistency.

[0005] The technical solution adopted by the present invention is: a non-destructive internal resistance detection system for a semiconductor cooler, including a base plate, a transverse testing mechanism, and a longitudinal testing mechanism provided on the base plate; wherein, the transverse testing mechanism includes relatively arranged transverse thimbles, the longitudinal testing mechanism includes a longitudinal thimble and a first transverse movement component, the longitudinal thimble faces the gap between the transverse thimbles and is connected to the driving end of the first transverse movement component, and can move along a direction parallel to the transverse thimbles under the action of the first transverse movement component; the transverse thimbles and the longitudinal thimble are respectively used to connect the copper columns at three ends of the semiconductor cooler to a resistance detector.

[0006] Further, the longitudinal testing mechanism further includes a longitudinal translation component and a longitudinal moving seat. The longitudinal translation component is disposed on the first transverse translation component, and the longitudinal moving seat is disposed on the longitudinal translation component and approaches or moves away from the transverse testing mechanism under the action of the longitudinal translation component; the longitudinal ejector pin is disposed on the longitudinal moving seat.

[0007] Further, the first transverse translation component includes a first mounting seat disposed on the base plate. The first mounting seat is provided with a first transverse lead screw and a first transverse slide rail; the longitudinal translation component is connected to one end of the first transverse lead screw and is slidably connected to the first transverse slide rail.

[0008] Further, the longitudinal translation component includes a second mounting seat. The second mounting seat is provided with a longitudinal slide rail and a longitudinal lead screw. The longitudinal lead screw is perpendicular to the first transverse lead screw. The longitudinal moving seat is connected to one end of the longitudinal lead screw and is slidably connected to the longitudinal slide rail.

[0009] Further, the transverse testing mechanism includes a transverse fixed seat, a transverse moving seat, and a second transverse translation component; the transverse moving seat is connected to the driving end of the second transverse translation component and approaches or moves away from the transverse fixed seat under the action of the second transverse translation component; the transverse ejector pins are respectively disposed on the transverse fixed seat and the transverse moving seat.

[0010] Further, the second transverse translation component includes a third mounting seat. The third mounting seat is provided with a second transverse lead screw and a second transverse slide rail; the second transverse lead screw is parallel to the first transverse lead screw. The transverse moving seat is connected to one end of the second transverse lead screw and is slidably connected to the second transverse slide rail.

[0011] Further, a positioning seat is provided between the transverse fixed seat and the transverse moving seat. The positioning seat is detachably disposed on the base plate and is used for carrying the semiconductor refrigerator.

[0012] Further, the longitudinal slide rail, the first transverse slide rail, and the second transverse slide rail are all provided with scale marks.

[0013] Further, a switch and signal transmission terminals are further provided on the base plate. The switch and the signal transmission terminals are respectively electrically connected to the longitudinal ejector pin, the transverse ejector pin, and the resistance detector.

[0014] Further, the resistance detector is connected to a computer for real-time displaying, processing, and storing the detection data of the resistance detector.

[0015] The advantages and positive effects of the present invention are:

[0016] (1) By setting up a longitudinal detection mechanism and a transverse detection mechanism, the transverse thimble and the longitudinal thimble are effectively connected to the copper columns at the three ends of the semiconductor cooler respectively, and the longitudinal thimble is moved along one end of the semiconductor cooler, so that the internal resistance of the semiconductor cooler is connected from zero to all into the detection circuit. Without damaging the semiconductor cooler, different parts and the total internal resistance of the semiconductor cooler are detected, the internal resistance data and its change trend are obtained, and the state of the semiconductor cooler can be judged more accurately from the trend of change consistency, the cooler with potential hazards can be identified more scientifically and reliably, and the detection accuracy and the reliability of the semiconductor cooler are improved.

[0017] (2) By setting up a longitudinal component, a first transverse movement component and a second transverse movement component, the distance between the transverse thimble and the longitudinal thimble can be adjusted according to the specifications of the semiconductor cooler to be detected, an effective connection with the copper column is formed, the connectivity of the detection circuit and the accuracy of the data are ensured, and the practicability and the applicable range of the system are enhanced.

[0018] (3) By using the screening and data processing functions of a computer, coolers with potential hazards can be effectively identified, and the detection data can be automatically recorded and stored; the detection is fast, easy to operate, the error caused by human intervention is reduced, and the accuracy of the detection result and the detection efficiency are improved. Description of the Drawings

[0019] Figure 1 is a schematic structural diagram of a specific embodiment of the present invention;

[0020] Figure 2 is a schematic connection diagram of the transverse thimble and the longitudinal thimble of a specific embodiment of the present invention;

[0021] Figure 3 is a schematic structural diagram of the longitudinal test mechanism and the transverse test mechanism of a specific embodiment of the present invention;

[0022] Figure 4 is a schematic connection diagram of the detection circuit of a specific embodiment of the present invention.

[0023] In the figure:

[0024] 1. Base plate; 2. Longitudinal testing mechanism; 21. Longitudinal thimble; 22. Longitudinal moving seat; 23. First transverse movement assembly; 231. First mounting seat; 232. First transverse lead screw; 233. First transverse slide rail; 24. Longitudinal movement assembly; 241. Second mounting seat; 242. Longitudinal lead screw; 243. Longitudinal slide rail; 3. Transverse testing mechanism; 31. Transverse thimble; 32. Transverse fixed seat; 33. Transverse moving seat; 34. Second transverse movement assembly; 341. Second transverse lead screw; 342. Second transverse slide rail; 343. Third mounting seat; 4. Switch; 5. Signal transmission terminal; 6. Semiconductor cooler; 7. Positioning seat; 8. Resistance detector; 9. Computer. Detailed implementation manners

[0025] The embodiments of the present invention will be described below with reference to the accompanying drawings.

[0026] The present application provides a non-destructive resistance detection system for a semiconductor cooler, which is used to detect the internal resistance of the semiconductor cooler; the semiconductor cooler in the present application is composed of a ceramic substrate and BiTe thermoelectric materials. Due to the different physical properties of each part of the materials, there are huge differences in the processes of electric conduction and heat conduction in different materials, resulting in the formation of electric stress and thermal stress at the connection interfaces between different materials. Under the continuous action of periodic or steady electric stress and thermal stress, the solder joints at the connection interfaces will undergo fatigue, resulting in an increase in contact resistance, weakening the cooling performance of the semiconductor cooler, and even causing open circuit failure in severe cases. Existing research shows that the linear expansion difference at the connection interface between the ceramic substrate and BiTe thermoelectric materials is the main reason for the increase in the internal resistance creep of the cooler, and the increase in the internal resistance creep of the cooler will also lead to uneven distribution of the internal resistance. Therefore, the state of the semiconductor cooler can be judged by detecting the internal resistance of the semiconductor cooler. By detecting the internal resistance of the semiconductor cooler in the full range, the present application can effectively identify the coolers with potential hazards. Especially after the semiconductor cooler has undergone screening such as electrical aging and temperature cycling, the change in the internal resistance of different regions of the semiconductor cooler can be effectively judged. From the trend of change consistency, the state of the semiconductor cooler can be judged more accurately, improving the accuracy of detection and ensuring the reliability of the semiconductor cooler.

[0027] As Figures 1-4As shown in the figure, the present application proposes a non-destructive internal resistance detection system for a semiconductor cooler, which includes a base plate 1, a lateral testing mechanism 3 and a longitudinal testing mechanism 2 arranged on the base plate 1. Among them, the lateral testing mechanism 3 includes laterally opposed thimbles 31, and the longitudinal testing mechanism 2 includes a longitudinal thimble 21 and a first lateral translation assembly 23. The longitudinal thimble 21 faces the gap between the laterally opposed thimbles 31. The longitudinal thimble 21 is connected to the driving end of the first lateral translation assembly 23 and can move along a direction parallel to the laterally opposed thimbles 31 under the action of the first lateral translation assembly 23. The laterally opposed thimbles 31 and the longitudinal thimble 21 are used to connect the copper posts at the three ends of the semiconductor cooler 6 to the resistance detector 8.

[0028] As Figure 2 shown in the figure, the copper posts of the semiconductor cooler 6 are located between two ceramic substrates. The resistance detector 8 is connected to the two laterally opposed thimbles 31 and a longitudinal thimble 21 through leads respectively. The two laterally opposed thimbles 31 and a longitudinal thimble 21 are respectively connected to the copper posts at the three ends of the semiconductor cooler 6 to form three parallel detection circuits. Among them, the two laterally opposed thimbles 31 are respectively connected to the two copper posts at the opposite ends of the semiconductor cooler 6, and the longitudinal thimble 21 is connected to the copper post at the other end of the semiconductor cooler 6. The laterally opposed thimbles 31 and the longitudinal thimble 21 are generally distributed in a triangular shape on the three sides of the semiconductor cooler 6. The principle is that by adjusting the position of the longitudinal thimble 21 through the first lateral translation assembly 23, it moves along a direction parallel to the two laterally opposed thimbles 31, so as to connect the longitudinal thimble 21 to different copper posts at one end of the semiconductor cooler 6. The moving range of the longitudinal thimble 21 can cover the entire length of one end of the semiconductor cooler 6. Thus, by moving the longitudinal thimble 21, the internal resistance of the semiconductor cooler 6 is connected from zero to the whole into the detection circuit. By comparing the detected internal resistance data and its change trend, the state of the semiconductor cooler 6 can be judged.

[0029] The longitudinal testing mechanism 2 in the present application further includes a longitudinal translation assembly 24 and a longitudinal moving seat 22. The longitudinal translation assembly 24 is arranged on the first lateral translation assembly 23, and the longitudinal moving seat 22 is arranged on the longitudinal translation assembly 24 and approaches or moves away from the lateral testing mechanism 3 under the action of the longitudinal translation assembly 24. The longitudinal thimble 21 is arranged on the longitudinal moving seat 22. By arranging the longitudinal translation assembly 24, the longitudinal thimble 21 can be driven to move forward or backward relative to the lateral testing mechanism 3, and the two moving routes are perpendicular to each other, so as to adjust the longitudinal thimble 21 according to the specifications of different semiconductor coolers 6 to make it effectively contact the copper posts of the semiconductor cooler 6, so as to complete the detection of the internal resistance of different parts of different specifications of the semiconductor cooler 6.

[0030] In this application, the vertical ejector pin 21 and the horizontal ejector pin 31 adopt the spring ejector pin structure. The end part in contact with the copper column can adopt a cylindrical, spherical or pointed structure, which is not limited here. The spring connecting the end part is always in a slightly pressed state, so that the vertical ejector pin 21 always maintains contact with the copper column during the left-right movement along the conductor cooler, to ensure good connectivity of the detection circuit. At the same time, the contact surfaces of the vertical ejector pin 21 and the horizontal ejector pin 31 with the copper column meet the minimum resistance requirement for forming the detection circuit. The vertical ejector pin 21 and the horizontal ejector pin 31 are prior arts and will not be elaborated here.

[0031] In a specific embodiment, as Figure 2 shown, the first lateral translation assembly 23 includes a first mounting seat 231 disposed on the base plate 1. The first mounting seat 231 is provided with a first lateral lead screw 232 and a first lateral slide rail 233. The longitudinal translation assembly 24 is connected to one end of the first lateral lead screw 232 and is slidably connected to the first lateral slide rail 233. Specifically, the first lateral slide rail 233 is disposed on both sides of the top end of the first mounting seat 231 and protrudes from the top surface of the first mounting seat 231. The first mounting seat 231 and the first lateral slide rail 233 are provided with vertical side walls opposite to and spaced from each other. One end of the first lateral lead screw is threadedly connected to the vertical side wall, and the other end is rotatably connected to the longitudinal translation assembly 24. By rotating the first lateral lead screw 232, the first lateral lead screw 232 can move inward or outward relative to the vertical inner wall, thereby driving the longitudinal translation assembly 24 to slide along the first lateral slide rail 233, realizing the left-right movement of the vertical ejector pin 21. At the same time, the vertical side wall also has a limiting function to limit the movement range of the longitudinal translation assembly 24. A limit pin is also provided at one end of the first lateral slide rail 233 away from the vertical side wall.

[0032] In this embodiment, the longitudinal translation assembly 24 includes a second mounting seat 241. The second mounting seat 241 is provided with a longitudinal slide rail 243 and a longitudinal lead screw 242. The longitudinal lead screw 242 is perpendicular to the first lateral lead screw 232. The longitudinal moving seat 22 is connected to one end of the longitudinal lead screw 242 and is slidably connected to the longitudinal slide rail 243. Specifically, a groove matching the first lateral guide rail is provided at the bottom of the second mounting seat 241 and is fitted on the upper part of the first mounting seat 231. A longitudinal slide rail 243 protrudes from the top of the second mounting seat 241, and the longitudinal slide rail 243 is perpendicular to the first lateral slide rail 233. Another vertical side wall is provided at one end of the second mounting seat 241 away from the lateral test mechanism 3. One end of the longitudinal lead screw 242 is threadedly connected to the vertical side wall, and the other end is rotatably connected to the longitudinal moving seat 22. By rotating the longitudinal lead screw 242, the longitudinal lead screw 242 can approach or move away from the lateral test mechanism 3, thereby driving the longitudinal moving seat 22 to approach or move away from the lateral test mechanism 3, realizing the front-back movement of the vertical ejector pin 21. A limit pin is also provided at one end of the longitudinal slide rail 243 away from the vertical side wall, which cooperates with the vertical side wall to realize the limitation of the longitudinal moving seat 22.

[0033] Further, as Figure 2 shown, the lateral testing mechanism 3 includes a lateral fixed seat 32, a lateral moving seat 33, and a second lateral translation component 34; the lateral moving seat 33 is connected to the driving end of the second lateral translation component 34 and approaches or moves away from the lateral fixed seat 32 under the action of the second lateral translation component 34; lateral ejector pins 31 are respectively arranged on the lateral fixed seat 32 and the lateral moving seat 33; specifically, the lateral fixed seat 32 and the second lateral translation component 34 are relatively and spacedly arranged on the base plate 1. By driving the second lateral translation component 34 to drive the lateral moving seat 33 to move, the distance between the lateral moving seat 33 and the lateral fixed seat 32 can be adjusted, which is not only more convenient for placing the semiconductor cooler 6 to be detected between the two, but also can adjust the distance between the lateral ejector pins 31 according to the specifications of the semiconductor cooler 6, so that the lateral ejector pins 31 are in close contact with the copper columns, ensuring the effective connection of the detection circuit.

[0034] In a specific embodiment, the above-mentioned second lateral translation component 34 includes a third mounting seat 343, and the third mounting seat 343 is provided with a second lateral lead screw 341 and a second lateral slide rail 342; the second lateral lead screw 341 is parallel to the first lateral lead screw 232, and the lateral moving seat 33 is connected to one end of the second lateral lead screw 341 and is slidably connected to the second lateral slide rail 342. Specifically, the third mounting seat 343 is arranged on one side of the base plate 1 parallel to the first mounting seat 231. The two ends of the third mounting seat 343 are spaced and protrude with the second lateral slide rails 342, and the second lateral lead screw 341 is arranged between the second lateral slide rails 342; a vertical side wall is also provided at one end of the third mounting seat 343 away from the lateral fixed seat 32. One end of the second lateral lead screw 341 is threadedly connected to the vertical side wall, and the other end is rotatably connected to the lateral moving seat 33. By means of the second lateral lead screw 341, the second lateral lead screw 341 can approach or move away from the lateral fixed seat 32, and further drive the lateral moving seat 33 to approach or move away from the lateral fixed seat 32, so as to adjust the distance between the lateral ejector pins 31, so that the lateral ejector pins 31 are in close contact with the copper columns of the semiconductor cooler 6 and are applicable to semiconductor coolers 6 of different specifications; a limit pin is also provided at one end of the second lateral slide rail 342 away from the vertical side wall, which cooperates with the vertical side wall to realize the limit of the lateral moving seat 33.

[0035] Preferably, the internal resistance non-destructive testing system of the semiconductor cooler 6 in the present application further includes a thimble seat for installing the horizontal thimble 31 and the vertical thimble 21; in a specific embodiment, the thimble seat is an L-shaped structure, including a vertical surface and a horizontal surface, wherein the horizontal thimble 31 and the vertical thimble 21 are both threadedly connected to the vertical surface of the thimble seat; one of the thimble seats directly serves as the horizontal fixing seat 32, and its horizontal surface is detachably connected to the base plate 1 through a fastener; the horizontal surfaces of the other two thimble seats are respectively installed on the horizontal moving seat 33 and the vertical moving seat 22 through fasteners; the vertical surfaces of the thimble seats are arranged opposite to each other, and the horizontal surfaces all face away from each other; preferably, the vertical surfaces are aligned with the corresponding edges of the horizontal moving seat 33 and the vertical moving seat 22.

[0036] In a specific embodiment, the base plate 1 is subjected to insulation treatment, the thimble seat is made of polyimide, machinable ceramic or organic plastic non-metallic material, the horizontal thimble 31 and the vertical thimble 21 are made of gold-plated parts, and the threaded connection parts between the horizontal thimble 31, the vertical thimble 21 and the thimble seat are coated with GD414 silicone rubber to prevent the horizontal thimble 31 and the vertical thimble 21 from loosening and falling off, and to achieve insulated connection between the horizontal thimble 31, the vertical thimble 21 and the thimble parts.

[0037] Preferably, a positioning seat 7 is provided between the horizontal fixing seat 32 and the horizontal moving seat 33 in the present application. The positioning seat 7 is detachably arranged on the base plate 1 and is used for carrying the semiconductor cooler 6. Preferably, the positioning seat 7 has a variety of different specifications, and each positioning seat 7 can be matched with a semiconductor cooler 6 of a set specification, so that when the semiconductor cooler 6 is placed on the positioning seat 7, the positions of the copper columns are matched with the heights of the horizontal thimble 31 and the vertical thimble 21.

[0038] Furthermore, scale marks are provided on the longitudinal slide rail 243, the first horizontal slide rail 233 and the second horizontal slide rail in the present application for measuring the feed amounts of the first horizontal lead screw 232, the second horizontal lead screw 341 and the longitudinal lead screw 242; in a specific embodiment, the first horizontal lead screw 232, the second horizontal lead screw 341 and the longitudinal lead screw 242 are all made of special chrome-plated alloy, and their precision and scale are the same as those of a micrometer, with a feed precision of 0.001 mm; by setting the scale marks, the second horizontal lead screw 341 can be conveniently adjusted to move the horizontal moving seat 33 to the target adjustment position so that the distance between the horizontal thimbles 31 meets the requirements for connecting with a semiconductor cooler 6 of a set specification. Similarly, the first horizontal lead screw 232 and the longitudinal lead screw 242 can also be more conveniently adjusted to move the vertical moving seat 22 to the target adjustment position so that the vertical thimble 21 is effectively connected to the copper column of the semiconductor cooler 6.

[0039] As Figure 3 、 Figure 4As shown, a switch 4 and signal transmission terminals 5 are further provided on the base plate 1. The switch 4 and the signal transmission terminals 5 are respectively electrically connected to the longitudinal ejector pin 21, the transverse ejector pin 31, and the resistance detector 8, forming a detection circuit form of double-pass and double-break, which is convenient for starting and stopping control of the detection system. The switch 4 and the signal transmission terminals 5 are turned on during testing and turned off after testing is completed.

[0040] As Figure 4 shown, the resistance detector 8 is connected to a computer 9, which is used to display and store the detection data of the resistance detector 8 in real time, and process and screen the detection data, providing a scientific and reliable basis for judging the state of the semiconductor cooler 6.

[0041] In the present application, the base plate 1 is respectively provided with screw holes that cooperate with the first mounting seat 231, the third mounting seat 343, the transverse fixing seat 32, and the positioning seat 7. During the installation and debugging process, first, it is necessary to ensure the perpendicularity of the vertical surface of the ejector pin seat to the base plate 1, the parallelism of the transverse ejector pin 31 and the longitudinal ejector pin 21 to the base plate 1, as well as the parallelism, perpendicularity between the transverse ejector pin 31 and the longitudinal ejector pin 21, and the parallelism of the bearing surface of the positioning seat 7 to the base plate 1. Subsequently, the semiconductor cooler 6 is placed on the bearing surface of the positioning seat 7. In the initial state, the distance between the transverse ejector pins 31 is greater than the width of the opposite ends of the semiconductor cooler 6. By rotating the second transverse lead screw 341, the transverse ejector pin 31 on the transverse moving seat 33 is moved closer to the other transverse ejector pin 31, and both transverse ejector pins 31 are in close contact with the copper posts at the corresponding ends of the semiconductor cooler 6. Subsequently, rotate the first transverse lead screw 232 to move the longitudinal ejector pin 21 to the starting point of the other end of the semiconductor cooler 6, and rotate the longitudinal lead screw 242 to move the longitudinal ejector pin 21 closer to and in close contact with the copper post at the other end of the cooler. Turn on the resistance detector 8, the switch 4, and the signal transmission terminals 5, and continue to rotate the first transverse lead screw 232 to move the longitudinal ejector pin 21 along the other end of the cooler until it reaches the end point of the other end of the semiconductor cooler 6, completing the detection of the internal resistance of the semiconductor cooler 6.

[0042] The above has described the embodiments of the present invention in detail, but the content described is only the preferred embodiments of the present invention and cannot be considered as limiting the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the present invention application should still fall within the scope covered by the patent of the present invention.

Claims

1. A semiconductor refrigerator internal resistance nondestructive testing system, characterized in that: It comprises a base plate and a transverse testing mechanism and a longitudinal testing mechanism arranged on the base plate; wherein the transverse testing mechanism comprises transverse ejectors arranged opposite to each other, and the longitudinal testing mechanism comprises longitudinal ejectors and a first transverse movement assembly, wherein the longitudinal ejectors face the gap between the transverse ejectors and are connected to the driving end of the first transverse movement assembly, and can move in a direction parallel to the transverse ejectors under the action of the first transverse movement assembly; the transverse ejectors and the longitudinal ejectors are respectively used to connect the copper columns at the three ends of the semiconductor cooler to the resistance detector.

2. The semiconductor refrigerator internal resistance nondestructive testing system according to claim 1, characterized in that: The longitudinal testing mechanism also includes a longitudinal movement component and a longitudinal moving seat. The longitudinal movement component is arranged on the first transverse movement component, and the longitudinal moving seat is arranged on the longitudinal movement component and approaches or moves away from the transverse testing mechanism under the action of the longitudinal movement component; the longitudinal ejector pin is arranged on the longitudinal moving seat.

3. The semiconductor refrigerator internal resistance nondestructive testing system according to claim 2, characterized in that: The first transverse movement assembly includes a first mounting seat arranged on the base plate, and the first mounting seat is provided with a first transverse screw rod and a first transverse slide rail; the longitudinal movement assembly is connected to one end of the first transverse screw rod and is slidably connected to the first transverse slide rail.

4. The semiconductor refrigerator internal resistance nondestructive testing system according to claim 3, characterized in that: The longitudinal movement assembly includes a second mounting seat, which is provided with a longitudinal slide rail and a longitudinal screw rod. The longitudinal screw rod is perpendicular to the first transverse screw rod. The longitudinal movable seat is connected to one end of the longitudinal screw rod and is slidably connected to the longitudinal slide rail.

5. The semiconductor refrigerator internal resistance nondestructive testing system according to claim 3 or 4, characterized in that: The transverse testing mechanism includes a transverse fixed seat, a transverse movable seat and a second transverse moving assembly; the transverse movable seat is connected to the driving end of the second transverse moving assembly and moves closer to or away from the transverse fixed seat under the action of the second transverse moving assembly; the transverse ejector pins are respectively arranged on the transverse fixed seat and the transverse movable seat.

6. The semiconductor cooler internal resistance nondestructive testing system according to claim 5, characterized in that: The second transverse movement assembly includes a third mounting seat, and the third mounting seat is provided with a second transverse screw rod and a second transverse slide rail; the second transverse screw rod is parallel to the first transverse screw rod, and the transverse movement seat is connected to one end of the second transverse screw rod and is slidably connected to the second transverse slide rail.

7. The semiconductor cooler internal resistance nondestructive testing system according to claim 5, characterized in that: A positioning seat is provided between the transverse fixed seat and the transverse movable seat. The positioning seat is detachably arranged on the base plate and is used to carry the semiconductor refrigerator.

8. The semiconductor refrigerator internal resistance nondestructive testing system according to claim 6 or 7, characterized in that: The longitudinal slide rail, the first transverse slide rail and the second transverse slide rail are all provided with scale marks.

9. The semiconductor cooler internal resistance nondestructive testing system according to any one of claim 8, characterized in that: The base plate is also provided with a switch and a signal transmission terminal, and the switch and the signal transmission terminal are electrically connected to the longitudinal ejector pin, the transverse ejector pin and the resistance detector respectively.

10. The semiconductor refrigerator internal resistance nondestructive testing system according to any one of claims 1 to 4, 6, 7 and 9, characterized in that: The resistance detector is connected to a computer for real-time display, processing and storage of detection data of the resistance detector.

Images