Electrostatic discharge test method and device, computer equipment and storage medium

Abstract

The invention relates to an electrostatic discharge test method and device, computer equipment and a storage medium. The method comprises the following steps: acquiring a scanning image of a wafer to be detected; performing image recognition processing on the scanned image to obtain label information and welding pad information; determining a device range corresponding to the to-be-tested device according to the label information; determining a welding pad position corresponding to the to-be-tested device based on a welding pad range in the device range; determining test parameters corresponding to the to-be-tested device according to the device type; and performing an electrostatic discharge test on the to-be-tested device based on the welding pad position and the test parameters. The label information and the welding pad information are determined through image recognition, so that the position of the welding pad is determined, and finally the electrostatic discharge test is performed on the to-be-tested devices through the test parameters, so that the test of all the to-be-tested devices on the to-be-tested wafer is completed, the one-by-one point change test does not need to be manually performed, and the test efficiency is relatively high.

Description

Technical Field

[0001] This application relates to the technical field of wafer testing, and particularly to an electrostatic discharge testing method, device, computer device, and storage medium. Background Art

[0002] With the reduction of process dimensions, the R & D difficulty of ESD (Electro-Static Discharge) protection devices increases. When a semiconductor foundry's process platform is under R & D, a large number of wafer-level ESD protection devices need to be tested and evaluated. In the existing wafer testing machines, only point-by-point testing can be carried out manually, which is time-consuming and has low testing efficiency. Summary of the Invention

[0003] Based on this, it is necessary to provide an electrostatic discharge testing method, device, computer device, and storage medium with high testing efficiency for the above technical problems.

[0004] In a first aspect, this application provides an electrostatic discharge testing method. It is applied to the electrostatic discharge testing of a wafer to be tested, where the wafer to be tested includes multiple devices to be tested, and the wafer to be tested further includes a device label corresponding to each device to be tested;

[0005] The method includes: obtaining a scanned image of the wafer to be tested; performing image recognition processing on the scanned image to obtain label information and pad information; where the label information includes a device type and a label range corresponding to the device label, and the pad information includes a pad range corresponding to the pad; determining a device range corresponding to the device to be tested according to the label information; determining a pad position corresponding to the device to be tested based on the pad range located within the device range; determining a test parameter corresponding to the device to be tested according to the device type; and performing an electrostatic discharge test on the device to be tested based on the pad position and the test parameter.

[0006] In one of the embodiments, the step of determining a device range corresponding to the device to be tested according to the label information includes: determining a preset recognition range according to the device type; in the case where there are at least two label ranges within the preset recognition range, gradually reducing the preset recognition range until there is exactly one label range within the preset recognition range; and taking the reduced preset recognition range as the device range corresponding to the device to be tested.

[0007] In one embodiment, the step of determining the pad position corresponding to the device under test based on the pad range within the device range includes: determining the pad range within the device range as the target pad range; and taking the center position of all the target pad ranges as the pad position corresponding to the device under test.

[0008] In one embodiment, the step of performing an electrostatic discharge test on the device under test based on the pad position and the test parameters includes: connecting a test probe to the corresponding pad based on the pad position; and performing an electrostatic discharge test on the device under test through the test probe according to the test parameters.

[0009] In one embodiment, the method further includes: obtaining a temperature setting parameter; and heating the wafer under test to a preset temperature based on the temperature setting parameter.

[0010] In one embodiment, after the step of determining the device range corresponding to the device under test according to the label information, the method further includes: determining and storing a device image from the scanned image according to the device range.

[0011] In one embodiment, after the step of determining the device range corresponding to the device under test according to the label information, the method further includes: displaying the device range corresponding to the device under test based on a device selection instruction; and performing an electrostatic discharge test on the device under test based on configuration parameters.

[0012] In a second aspect, the present application further provides an electrostatic discharge test device. Applied to the electrostatic discharge test of a wafer under test, the wafer under test includes a plurality of devices under test, and the wafer under test further includes device labels corresponding to each device under test;

[0013] The device includes: an image acquisition module for acquiring a scanned image of the wafer under test; an image recognition module for performing image recognition processing on the scanned image to obtain label information and pad information; wherein the label information includes a device type and a label range corresponding to the device label, and the pad information includes a pad range corresponding to the pad; a device range determination module for determining a device range corresponding to the device under test according to the label information; a pad position determination module for determining a pad position corresponding to the device under test based on the pad range within the device range; a test parameter determination module for determining test parameters corresponding to the device under test according to the device type; and an electrostatic discharge test module for performing an electrostatic discharge test on the device under test based on the pad position and the test parameters.

[0014] In a third aspect, the present application also provides a computer device. The computer device includes a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, the steps of the above method are implemented.

[0015] In a fourth aspect, the present application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon, and when the computer program is executed by a processor, the steps of the above method are implemented.

[0016] For the above electrostatic discharge testing method, device, computer device and storage medium, by performing image recognition processing on the obtained scanned image of the wafer to be tested, label information and pad information are obtained, then the device range corresponding to the device to be tested is determined according to the label information, and the pad position corresponding to the device to be tested is determined based on the pad range within the device range. Then, the test parameters corresponding to the device to be tested are determined according to the device type, and finally, the electrostatic discharge test is performed on the device to be tested based on the determined pad position and test parameters. Since the present application uses image recognition to determine the label information and pad information, thereby completing the determination of the pad position, and finally performing the electrostatic discharge test on the device to be tested through the test parameters, the testing of all devices to be tested on the wafer to be tested is completed, without the need for manual point-by-point testing one by one, and the testing efficiency is relatively high. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 It is a schematic flowchart of the electrostatic discharge testing method in an embodiment;

[0019] Figure 2 It is a schematic flowchart of determining the device range in an embodiment;

[0020] Figure 3 It is a layout schematic diagram of a two-terminal device in an embodiment;

[0021] Figure 4 For Figure 3 It is a schematic diagram of the determined device range in the embodiment;

[0022] Figure 5 It is a layout schematic diagram of a two-terminal device in another embodiment;

[0023] Figure 6Schematic diagram for determining the device range of a three-terminal device in an embodiment;

[0024] Figure 7 Schematic diagram for determining the device range of a four-terminal device in an embodiment;

[0025] Figure 8 Schematic flowchart for determining the pad position in an embodiment;

[0026] Figure 9 Schematic flowchart for performing an electrostatic discharge test in an embodiment;

[0027] Figure 10 Schematic flowchart for heating a wafer under test in an embodiment;

[0028] Figure 11 Schematic flowchart for an electrostatic discharge test method in another embodiment;

[0029] Figure 12 Schematic diagram of the modules of an electrostatic discharge test device in an embodiment;

[0030] Figure 13 Internal structure diagram of a computer device in an embodiment. Detailed implementation manners

[0031] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0032] The electrostatic discharge test method provided by the embodiments of the present application is applied to the electrostatic discharge test of a wafer under test. The wafer under test includes a plurality of devices under test, and the wafer under test also includes device labels corresponding to each device under test. Generally, the types of the plurality of devices under test on a wafer under test are the same, and their shapes and sizes are also the same. The plurality of devices under test are arranged and distributed on the wafer under test, and a device label is correspondingly arranged beside each device under test to distinguish different devices under test. In some embodiments, a wafer under test may also include various different types of devices under test, and parameters such as the number of pads, pad positions, device sizes, and device shapes of different types of devices under test are different.

[0033] In one embodiment, as Figure 1 shown, a method for electrostatic discharge testing is provided. Taking this method applied to an electrostatic discharge test device as an example, the method includes the following steps:

[0034] Step S110, obtaining a scanned image of the wafer under test.

[0035] Specifically, the electrostatic discharge test equipment can scan the surface of the wafer under test through a camera to obtain a scanned image. The camera can capture all the images of the entire surface of the wafer under test at one time or only capture partial images of the partial surface of the wafer under test. Correspondingly, the scanned image can also be all the images or partial images of the surface of the wafer under test. When the scanned image is a partial image of the surface of the wafer under test, the electrostatic discharge test equipment can scan different positions of the wafer under test in turn by moving the camera or moving the wafer under test, so as to complete the scanning of the entire surface of the wafer under test. It can be understood that the scanned image needs to include a complete image of at least one device under test.

[0036] Step S120: Perform image recognition processing on the scanned image to obtain label information and pad information.

[0037] Specifically, after the electrostatic discharge test equipment obtains the scanned image of the wafer under test, it performs image recognition processing on the scanned image to obtain label information and pad information. The label information includes the device type and label range corresponding to the device label, and the pad information includes the pad range corresponding to the pad. The electrostatic discharge test equipment can identify the device label and pad of the device under test accurately by recognizing the scanned image. When recognizing the device label, the letters and numbers of the device label can be recognized, such as GGNMOS01, PNPA011, DIODE21, etc., which correspond to the device type of the device under test. At the same time, the area occupied by the device label on the surface of the wafer under test, that is, the label range, can also be recognized. When recognizing the pad, the user can input the shape and size of the pad in advance, such as a square with a size of 100*100 microns. When a figure with the corresponding shape and size is recognized, it can be determined as a pad, and the pad range is the area occupied by the pad on the surface of the wafer under test.

[0038] Step S130: Determine the device range corresponding to the device under test according to the label information.

[0039] Specifically, the label information includes the device type and label range corresponding to the device label. Since the shape and size of the device under test on the surface of the wafer under test are designed in advance and the relative position between the device label and the device under test is also determined, after determining the type of the current device under test through the device type, the shape and size of the device under test can be determined. Then, according to the position information of the label range and the preset relative position between the device label and the device under test, the device range of the current device under test can be determined.

[0040] Step S140: Determine the pad position corresponding to the device under test based on the pad range located within the device range.

[0041] Specifically, the device range includes the entire device under test. Therefore, the pads of the current device under test are also within its device range. At this time, the pad range located within the device range of the current device under test is screened out from all the pad ranges recognized from the image, and it is used as the pad range corresponding to the device under test. Then, the pad positions are determined according to the pad range, and the pad positions are used to determine the positions where the test probes contact the pads.

[0042] Step S150: Determine the test parameters corresponding to the device under test according to the device type.

[0043] Specifically, the electrostatic discharge test equipment will also determine the type of the device under test to be tested currently according to the device type in the label information. Different device types correspond to different test parameters. For example, the test parameters include the number of pads to be tested, the magnitude of the voltage and current to be applied to the pads, etc.

[0044] Step S160: Perform an electrostatic discharge test on the device under test based on the pad positions and test parameters.

[0045] Specifically, after the electrostatic discharge test equipment determines the pad positions and test parameters, it will perform an electrostatic discharge test on the corresponding device under test. After repeating the above steps, the electrostatic discharge test can be performed on all the devices under test on the wafer under test in sequence. The electrostatic discharge test can be one or more of TLP (Transmission Line Pulse), HBM (Human Body Model), MM (Machine Model), and CDM (Component Charge Model) tests.

[0046] In the above electrostatic discharge test method, through image recognition processing of the scanned image of the wafer under test obtained, the label information and pad information are obtained. Then, the device range corresponding to the device under test is determined according to the label information, and the pad positions corresponding to the device under test are determined based on the pad range located within the device range. Then, the test parameters corresponding to the device under test are determined according to the device type. Finally, an electrostatic discharge test is performed on the device under test based on the determined pad positions and test parameters. Since the present application uses image recognition to determine the label information and pad information, thereby completing the determination of the pad positions, and finally performing an electrostatic discharge test on the device under test through the test parameters, the testing of all the devices under test on the wafer under test is completed, without the need for manual point-by-point testing one by one, and the testing efficiency is relatively high.

[0047] In one embodiment, as Figure 2 shown, in step S130, the step of determining the device range corresponding to the device under test according to the label information includes:

[0048] Step S131: Determine a preset recognition range according to the device type.

[0049] Specifically, after the electrostatic discharge test equipment obtains the label information from the scanned image, it first determines the preset recognition range to be selected according to the device type in the label information. Different device types correspond to different preset recognition ranges. When setting the preset recognition range, the preset recognition range needs to be greater than or equal to the range of the corresponding device under test, and at least one device under test is included in the preset recognition range.

[0050] Step S132: When there are at least two label ranges within the preset recognition range, gradually reduce the preset recognition range until there is exactly one label range within the preset recognition range.

[0051] Specifically, since there may be certain differences in the size range of devices under the same device type, in this embodiment, the preset recognition range is set relatively large, and there are at least two label ranges within the preset recognition range. When there are two label ranges, the preset recognition range can be gradually reduced along the direction where the two labels are close, and stop reducing the preset recognition range when the extra label range is exactly not within the preset recognition range. At this time, there is exactly one label range within the preset recognition range.

[0052] Step S133: Use the reduced preset recognition range as the device range corresponding to the device under test.

[0053] Specifically, after completing the adjustment of the preset recognition range, use the reduced preset recognition range as the device range corresponding to the current device under test, and then screen the pad range corresponding to the device under test according to the device range, so as to determine the pad position.

[0054] The following uses a specific embodiment to describe in detail the steps of adjusting the preset recognition range of the present application. As Figure 3 shown, both the device under test 1 and the device under test 2 are two-terminal devices, that is, the device under test 1 is correspondingly provided with PAD1 and PAD2, and the device under test 2 is correspondingly provided with PAD3 and PAD4. In this embodiment, it is necessary to determine the device range corresponding to the device under test 1. After recognizing the device label 1 of the device under test 1, the preset recognition range is set as a rectangular area of 1 PAD in the Y direction and 6 PADs in the X direction of the device label 1. If the device label 2 is recognized within the preset recognition range, the image range needs to be reduced. When positioning the preset recognition range, it is aligned with the upper left corner of the label range of the device label 1 (as Figure 3As shown by the dashed box in the figure, at this time, there are two label ranges, namely device label 1 and device label 2, within the preset recognition range. Therefore, it is necessary to gradually reduce the preset recognition range. When reducing the preset recognition range, it is first reduced along the direction from device label 2 towards device label 1. When it is reduced to a state where there is exactly only device label 1 within the preset recognition range, the reduction of the preset recognition range stops. At this time, the reduced preset recognition range is as shown by the dashed box in Figure 4 . The reduced preset recognition range is the device range of the device under test 1. When subsequently screening the pad range, the pad ranges within the device range are PAD1 and PAD2. Based on the pad ranges of PAD1 and PAD2, the pad positions corresponding to the device under test 1 can be determined. As shown in Figure 5 , when the PADs of the two-terminal device are arranged longitudinally, swapping the ranges of X and Y in Figure 2 can obtain the corresponding preset recognition range. Through a recognition logic similar to the above, the device range of the device under test 1 as shown by the dashed box in Figure 5 can be obtained. It can be understood that within the preset recognition range, if there are other device labels in both the horizontal and vertical directions of the current device label, at this time, the preset recognition range can be gradually reduced in the horizontal and vertical directions respectively until there is exactly one label range within the preset recognition range. As shown in Figure 6 , it is a three-terminal device, and the preset recognition range is set as a rectangular area with 6 PADs in the X direction and 3 PADs in the Y direction. Through the above steps, the determination of the device range of the three-terminal device can also be completed. As shown in Figure 7 , it is a four-terminal device, and the preset recognition range is set as a rectangular area with 6 PADs in the X direction and 4 PADs in the Y direction. Through the above steps, the determination of the device range of the four-terminal device can also be completed. By sequentially determining the device ranges of the devices under test on the wafer under test, the device ranges of all devices under test can be obtained.

[0055] In one embodiment, as shown in Figure 8 , in step S140, the step of determining the pad position corresponding to the device under test based on the pad range within the device range includes:

[0056] Step S141, determining the pad range within the device range as the target pad range;

[0057] Step S142, taking the central position of all the target pad ranges as the pad position corresponding to the device under test.

[0058] Specifically, after determining the device range of the device under test, the pad ranges within the device range are screened out and used as the target pad range of the current device under test. Finally, the central position of all the target pad ranges is taken as the pad position corresponding to the device under test. For example, as shown in Figure 4As shown, after determining the device range of the device under test 1, the pad range within the device range of the device under test 1 is screened out, that is, PAD1 and PAD2, and it is used as the target pad range. Then, the central positions of the target pad range are calculated respectively, that is, the central positions of PAD1 and PAD2, and they are used as the pad positions corresponding to the device under test. After determining the pad positions, the test probes can be moved to the corresponding positions to contact the pads, so as to perform an electrostatic discharge test on the device under test.

[0059] In one embodiment, as Figure 9 shown, in step S160, the step of performing an electrostatic discharge test on the device under test based on the pad position and test parameters includes:

[0060] Step S161, connecting the test probe to the corresponding pad based on the pad position;

[0061] Step S162, performing an electrostatic discharge test on the device under test through the test probe according to the test parameters.

[0062] Specifically, after the electrostatic discharge test equipment obtains the pad position, it will control the movement of the test probe, so as to move the test probe to the corresponding pad position and connect the test probe to the pad. Then, according to the obtained test parameters, a corresponding current and voltage are applied to the device under test through the test probe, so as to complete the electrostatic discharge test on the device under test. Specific examples are as Figure 4 shown. When the device under test is a two-terminal device, in the test parameters, PAD1 of the device under test 1 is connected to a low potential and PAD2 is connected to a high potential; as Figure 6 shown. When the device under test is a three-terminal device, in the test parameters, PAD1 of the device under test 1 is connected to a low potential, PAD2 is connected to a high potential, and PAD3 is connected to a low potential; as Figure 7 shown. When the device under test is a four-terminal device, in the test parameters, PAD1 of the device under test 1 is connected to a low potential, PAD2 is connected to a high potential, PAD3 is connected to a low potential, and PAD4 is connected to a bias voltage. It can be understood that the user can input the test parameters corresponding to each device type into the electrostatic discharge test equipment through the user interface, and the corresponding test parameters are called according to the recognized device type in step S150.

[0063] In one embodiment, as Figure 10 shown, the electrostatic discharge test method further includes:

[0064] Step S170, obtaining the temperature setting parameter;

[0065] Step S180, heating the wafer under test to a preset temperature based on the temperature setting parameter.

[0066] Specifically, the electrostatic discharge test equipment in this embodiment has a high-temperature test function. Users can input temperature setting parameters to the electrostatic discharge test equipment through the user interaction interface. After the electrostatic discharge test equipment obtains the corresponding temperature setting parameters, it will heat the wafer under test to a preset temperature (such as 180 °C) according to the obtained temperature setting parameters, so as to complete the electrostatic discharge test of the wafer under test at different temperatures. When heating the wafer under test, the wafer under test is placed on the operating table in the test cavity, and the operating table fixes the wafer under test by suction to prevent the wafer under test from shifting or falling during the test. In this embodiment, by assembling a temperature control module in the cavity, there is no need to repeatedly open the hatch, thus realizing the accuracy and stability of the high and low temperatures of the test environment. In the process of testing and researching a large number of ESD protection devices, it has the advantages of high efficiency and can shorten the research and development cycle.

[0067] In one embodiment, in step S130, after the step of determining the device range corresponding to the device under test according to the label information, the electrostatic discharge test method further includes: determining and storing the device image from the scanned image according to the device range.

[0068] Specifically, in this embodiment, after determining the device range of the current device under test according to the label information, an image showing the device under test will be intercepted from the scanned image according to the device range and used as the device image, and then the device image will be stored for subsequent research use.

[0069] In one embodiment, as Figure 11 shown, in step S130, after the step of determining the device range corresponding to the device under test according to the label information, the electrostatic discharge test method further includes:

[0070] Step S210, displaying the device range corresponding to the device under test based on the device selection instruction;

[0071] Step S220, performing an electrostatic discharge test on the device under test based on the configuration parameters.

[0072] Specifically, in this embodiment, after determining the device range of the device under test on the wafer under test, the device under test to be tested can be manually selected, and the corresponding configuration parameters can be manually input to perform an electrostatic discharge test on the device under test. For example, the user can input a device selection instruction to the electrostatic discharge test equipment through the user interaction interface to select the corresponding device under test. At the same time, the image in the device range of the corresponding device under test will also be displayed on the display screen. Based on the content displayed on the display screen, the user manually configures the test parameters of the device under test to obtain the corresponding configuration parameters. After the electrostatic discharge test equipment receives the corresponding configuration parameters, it will perform an electrostatic discharge test on the device under test.

[0073] It should be understood that although the steps in the flowcharts involved in the above-described embodiments are shown in sequence according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear description in this article, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-described embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or steps or stages in other steps.

[0074] Based on the same inventive concept, an embodiment of the present application further provides an electrostatic discharge test device for implementing the above-mentioned electrostatic discharge test method. The solution provided by this device to solve the problem is similar to the solution described in the above method. Therefore, the specific limitations in one or more embodiments of the electrostatic discharge test device provided below can refer to the limitations on the electrostatic discharge test method in the above text, and will not be repeated here.

[0075] In one embodiment, as Figure 12 shown, an electrostatic discharge test device is provided, including: an image acquisition module 310, an image recognition module 320, a device range determination module 330, a pad position determination module 340, a test parameter determination module 350, and an electrostatic discharge test module 360, where:

[0076] The image acquisition module 310 is configured to acquire a scanned image of a wafer to be tested;

[0077] The image recognition module 320 is configured to perform image recognition processing on the scanned image to obtain label information and pad information; wherein, the label information includes a device type and a label range corresponding to the device label, and the pad information includes a pad range corresponding to the pad;

[0078] The device range determination module 330 is configured to determine a device range corresponding to the device to be tested according to the label information;

[0079] The pad position determination module 340 is configured to determine a pad position corresponding to the device to be tested based on the pad range located within the device range;

[0080] The test parameter determination module 350 is configured to determine test parameters corresponding to the device to be tested according to the device type;

[0081] The electrostatic discharge test module 360 is configured to perform an electrostatic discharge test on the device to be tested based on the pad position and the test parameters.

[0082] The above electrostatic discharge test device performs image recognition processing on the scanned image of the wafer under test to obtain label information and pad information, then determines the device range corresponding to the device under test according to the label information, determines the pad position corresponding to the device under test based on the pad range within the device range, then determines the test parameters corresponding to the device under test according to the device type, and finally performs an electrostatic discharge test on the device under test based on the determined pad position and test parameters. Since the present application uses image recognition to determine label information and pad information, thereby completing the determination of the pad position, and finally performs an electrostatic discharge test on the device under test through test parameters, thus completing the test of all devices under test on the wafer under test, without manually performing point-by-point testing one by one, and the test efficiency is relatively high.

[0083] Each module in the above electrostatic discharge test device can be implemented in whole or in part by software, hardware, and their combination. The above-mentioned modules can be embedded in the processor of the computer device in hardware form or independent of it, or stored in the memory of the computer device in software form, so that the processor can call and execute the operations corresponding to the above-mentioned modules.

[0084] In one embodiment, the device range determination module 330 is further configured to determine a preset recognition range according to the device type; in the case where there are at least two label ranges within the preset recognition range, gradually reduce the preset recognition range until there is exactly one label range within the preset recognition range; and use the reduced preset recognition range as the device range corresponding to the device under test.

[0085] In one embodiment, the pad position determination module 340 is further configured to determine the pad range within the device range as the target pad range; and use the central position of all the target pad ranges as the pad position corresponding to the device under test.

[0086] In one embodiment, the electrostatic discharge test module 360 is further configured to connect the test probe to the corresponding pad based on the pad position; and perform an electrostatic discharge test on the device under test through the test probe according to the test parameters.

[0087] In one embodiment, the electrostatic discharge test device further includes a heating module, configured to obtain a temperature setting parameter; and heat the wafer under test to a preset temperature based on the temperature setting parameter.

[0088] In one embodiment, the electrostatic discharge test device further includes an image storage module, configured to determine and store a device image from the scanned image according to the device range.

[0089] In one embodiment, the electrostatic discharge test device further includes a configuration test module, configured to display the device range corresponding to the device under test based on a device selection instruction; and perform an electrostatic discharge test on the device under test based on configuration parameters.

[0090] In one embodiment, a computer device is provided. The computer device may be a terminal, and its internal structural diagram may be as shown in Figure 13 . The computer device includes a processor, a memory, an input / output interface, a communication interface, a display unit, and an input device. Among them, the processor, the memory, and the input / output interface are connected through a system bus, and the communication interface, the display unit, and the input device are connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The input / output interface of the computer device is used to exchange information between the processor and external devices. The communication interface of the computer device is used to communicate with external terminals in a wired or wireless manner. The wireless manner can be implemented through WIFI, a mobile cellular network, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it implements an electrostatic discharge test method. The display unit of the computer device is used to form a visually visible picture, which may be a display screen, a projection device, or a virtual reality imaging device. The display screen may be a liquid crystal display screen or an electronic ink display screen. The input device of the computer device may be a touch layer covering the display screen, or a button, a trackball, or a touchpad provided on the computer device housing, or an external keyboard, touchpad, or mouse, etc.

[0091] Those skilled in the art can understand that Figure 13 the structure shown in is only a block diagram of some structures related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine some components, or have different component arrangements.

[0092] In one embodiment, a computer device is provided, including a memory and a processor. A computer program is stored in the memory, and when the processor executes the computer program, the steps in the above method embodiments are implemented.

[0093] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the processor executes the computer program, the steps in the above method embodiments are implemented.

[0094] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, database, or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memories. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The databases involved in the embodiments provided in the present application can include at least one of relational databases and non-relational databases. Non-relational databases can include distributed databases based on blockchain, etc., without limitation. The processors involved in the embodiments provided in the present application can be general-purpose processors, central processors, graphics processors, digital signal processors, programmable logic devices, data processing logics based on quantum computing, etc., without limitation.

[0095] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0096] The above-described embodiments merely represent several implementation manners of the present application. Their descriptions are relatively specific and detailed, but they should not be construed as limiting the patent scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. An electrostatic discharge test method, characterized in that, An electrostatic discharge test applied to a wafer under test, wherein the wafer under test includes a plurality of devices under test, and the wafer under test further includes a device label corresponding to each device under test. The method includes: Obtaining a scanned image of the wafer under test; Performing image recognition processing on the scanned image to obtain label information and pad information; wherein, the label information includes a device type and a label range corresponding to the device label, and the pad information includes a pad range corresponding to the pad; Determining a device range corresponding to the device under test according to the label information; Determining a pad position corresponding to the device under test based on the pad range located within the device range; Determining test parameters corresponding to the device under test according to the device type; Performing an electrostatic discharge test on the device under test based on the pad position and the test parameters.

2. The electrostatic discharge test method according to claim 1, characterized in that, The step of determining a device range corresponding to the device under test according to the label information includes: Determining a preset recognition range according to the device type; In the case where there are at least two of the label ranges within the preset recognition range, gradually reducing the preset recognition range until there is exactly one of the label ranges within the preset recognition range; Taking the reduced preset recognition range as the device range corresponding to the device under test.

3. The electrostatic discharge test method according to claim 1, wherein The step of determining a pad position corresponding to the device under test based on the pad range located within the device range includes: Determining the pad range located within the device range as a target pad range; Taking the center position of all the target pad ranges as the pad position corresponding to the device under test.

4. The electrostatic discharge test method according to claim 1, characterized in that The step of performing an electrostatic discharge test on the device under test based on the pad position and the test parameters includes: Connecting a test probe to the corresponding pad based on the pad position; Performing an electrostatic discharge test on the device under test through the test probe according to the test parameters.

5. The electrostatic discharge test method according to any one of claims 1 to 4, characterized in that The method further includes: Obtaining a temperature setting parameter; Heating the wafer under test to a preset temperature based on the temperature setting parameter.

6. The electrostatic discharge test method according to claim 5, wherein, After the step of determining a device range corresponding to the device under test according to the label information, the method further includes: Determining and storing a device image from the scanned image according to the device range.

7. The electrostatic discharge test method according to claim 5, wherein After the step of determining a device range corresponding to the device under test according to the label information, the method further includes: Displaying the device range corresponding to the device under test based on a device selection instruction; Performing an electrostatic discharge test on the device under test based on configuration parameters.

8. An electrostatic discharge test device, characterized in that, An electrostatic discharge test applied to a wafer under test, wherein the wafer under test includes a plurality of devices under test, and the wafer under test further includes a device label corresponding to each device under test. The apparatus includes: An image acquisition module for obtaining a scanned image of the wafer under test; An image recognition module for performing image recognition processing on the scanned image to obtain label information and pad information; wherein, the label information includes a device type and a label range corresponding to the device label, and the pad information includes a pad range corresponding to the pad; A device range determination module, configured to determine a device range corresponding to the device under test according to the label information; A pad position determination module, configured to determine a pad position corresponding to the device under test based on the pad range located within the device range; A test parameter determination module, configured to determine test parameters corresponding to the device under test according to the device type; An electrostatic discharge test module, configured to perform an electrostatic discharge test on the device under test based on the pad position and the test parameters; 9. A computer device, comprising a memory and a processor, the memory storing a computer program, characterized in that, When the processor executes the computer program, the steps of the electrostatic discharge test method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, the steps of the electrostatic discharge test method according to any one of claims 1 to 7 are implemented.

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