A method, device, electronic device and storage medium for solder ball simulation analysis

Abstract

The present application provides a solder ball simulation analysis method, device, electronic device and storage medium, which are applied to the field of computer technology. After creating a coaxial body, a signal solder ball model and a signal return plane, the coaxial body is connected to the signal solder ball model according to a preset contact area, and the equivalent dielectric constant of the coaxial body is adjusted to make the impedance of the coaxial body match the target impedance of the test signal. Further, the simulation signal ports are respectively connected to the coaxial body and the signal return plane, a test signal is output through the simulation signal ports, and the test impedances of the signal solder ball model in an air environment and a target cold liquid environment are respectively obtained. Finally, the signal solder ball model is corrected according to the test impedance. By this method, the simulation analysis of the solder ball in different operating environments can be realized, and a reference basis for correcting the signal solder ball model can be provided, which helps the solder ball meet the performance requirements in different operating environments.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a solder ball simulation analysis method, device, electronic device and storage medium. Background Art

[0002] With the continuous development of computer technology, a new generation of high-performance servers has been widely used. While high-performance servers provide users with better computing services, they also bring severe challenges to the thermal design costs of servers.

[0003] The existing technology uses immersion liquid cooling to solve the heat dissipation problem of high-performance servers, which can better balance the server performance and thermal design cost. However, the existing technology's research on immersion liquid cooling often focuses on improving thermal efficiency, and ignores the impact of the change in the equivalent dielectric constant of the operating environment on signal transmission when the server working environment changes from air to cold liquid. In particular, for the solder ball structure directly exposed to the operating environment, it is more affected by the operating environment. Therefore, how to simulate and analyze the solder ball under different operating environments, correct the solder ball structure, and ensure that the solder ball can meet the performance requirements under different operating environments has become one of the problems that technical personnel in this field need to solve urgently. Summary of the invention

[0004] In view of this, the present application is committed to providing a solder ball simulation analysis method, device, electronic device and storage medium to simulate and analyze the solder balls and correct the solder balls according to the analysis results to ensure that the solder balls can meet the performance requirements under different operating environments.

[0005] In a first aspect, the present application provides a solder ball simulation analysis method, comprising:

[0006] Create coaxial body, signal solder ball model and signal reflow plane;

[0007] Connecting the coaxial body to the signal solder ball model according to a preset contact area, and adjusting the equivalent dielectric constant of the coaxial body so that the impedance of the coaxial body matches the target impedance of the test signal;

[0008] Connecting the simulation signal port to the coaxial body and the signal return plane respectively;

[0009] Outputting the test signal through the simulation signal port, and respectively obtaining the test impedance of the signal solder ball model in an air environment and a target cold liquid environment;

[0010] The signal solder ball model is modified according to the test impedance.

[0011] In an alternative embodiment, the test impedance includes a first test impedance obtained in an air environment and a second test impedance obtained in the target cold liquid environment;

[0012] Correcting the signal solder ball model according to the test impedance includes:

[0013] If the first test impedance meets the preset impedance deviation requirement and the second test impedance does not meet the preset impedance deviation requirement, adjust the size of the signal solder ball model;

[0014] If both the first test impedance and the second test impedance meet the preset impedance deviation requirement, determine that the signal solder ball corresponding to the signal solder ball model is allowed to be used in the cold liquid.

[0015] In an alternative embodiment, adjusting the size of the signal solder ball model includes:

[0016] While maintaining the preset contact area unchanged, adjust at least one of the diameter and the soldering height of the signal solder ball model.

[0017] In an alternative embodiment, creating the coaxial body, the signal solder ball model, and the signal return plane includes:

[0018] Create a corresponding signal solder ball model according to the layout information of the ball grid array to which the signal solder ball belongs. The signal solder ball model includes a symmetrically arranged first contact surface and a second contact surface;

[0019] Create a first coaxial body and a first signal return plane corresponding to the first contact surface, and a second coaxial body and a second signal return plane corresponding to the second contact surface.

[0020] In an alternative embodiment, the process of creating any one of the signal return planes includes:

[0021] According to the layout information, determine whether there is a reflow solder ball arranged within a preset range centered on the signal solder ball;

[0022] If there is a reflow solder ball within the preset range, create a reflow solder ball model corresponding to the reflow solder ball, and create the signal return plane based on the reflow solder ball model;

[0023] If there is no reflow solder ball within the preset range, create a reflow solder ball model within the preset range, and create the signal return plane based on the reflow solder ball model.

[0024] In an alternative embodiment, the solder ball simulation analysis method provided in the first aspect of the present application further includes: correcting the size of the reflow solder ball model according to the size of the signal solder ball model.

[0025] In an alternative embodiment, the solder ball simulation analysis method provided in the first aspect of the present application further includes: creating a simulation signal source and connecting the simulation signal source to the simulation signal port;

[0026] Outputting the test signal through the simulation signal port includes:

[0027] Controlling the simulation signal source to output the test signal through the simulation signal port.

[0028] In a second aspect, the present application provides a solder ball simulation analysis device, including:

[0029] A first modeling unit for creating a coaxial body, a signal solder ball model, and a signal return plane; connecting the coaxial body to the signal solder ball model according to a preset contact area, and adjusting the equivalent dielectric constant of the coaxial body so that the impedance of the coaxial body matches the target impedance of the test signal; connecting the simulation signal port to the coaxial body and the signal return plane respectively;

[0030] A test unit for outputting the test signal through the simulation signal port and respectively obtaining the test impedance of the signal solder ball model in an air environment and a target cold liquid environment;

[0031] A first correction unit for correcting the signal solder ball model according to the test impedance.

[0032] In a third aspect, the present application provides an electronic device, including a memory, a processor, and a computer program stored on the memory and executed by the processor. When the processor executes the computer program, the steps of the solder ball simulation analysis method according to any one of the first aspects of the present application are implemented.

[0033] In a fourth aspect, the present application provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the solder ball simulation analysis method according to any one of the first aspects of the present application are implemented.

[0034] Based on the above, for the solder ball simulation analysis method provided by this application, after creating the coaxial body, the signal solder ball model, and the signal return plane, the coaxial body is connected to the signal solder ball model according to a preset contact area, and the equivalent dielectric constant of the coaxial body is adjusted to make the impedance of the coaxial body match the target impedance of the test signal. Further, the simulation signal ports are respectively connected to the coaxial body and the signal return plane, the test signal is output through the simulation signal ports, and the test impedances of the signal solder ball model in the air environment and the target cold liquid environment are respectively obtained. Finally, the signal solder ball model is corrected according to the test impedance. Through this method, the simulation analysis of the solder ball in different operating environments can be realized, and a reference basis for correcting the signal solder ball model can be provided, which helps the solder ball meet the performance requirements in different operating environments.

[0035] Further, the simulation signal ports are connected to the signal solder ball model through the coaxial body. Since the impedance of the coaxial body matches the target impedance of the test signal, it can ensure that the coaxial body does not affect the transmission of the test signal. At the same time, through the coaxial body, the external interference introduced by directly connecting the simulation signal ports to the signal solder ball model can be avoided, thereby ensuring the reliability and accuracy of the simulation results. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to these drawings.

[0037] Figure 1 It is a schematic flowchart of a solder ball simulation analysis method provided by this application.

[0038] Figure 2 It is a schematic diagram of the solder ball simulation structure provided by this application.

[0039] Figure 3 It is a schematic diagram of the contact surface between the signal solder ball model and the coaxial body.

[0040] Figure 4a and Figure 4b It is a schematic diagram of two positional relationships between the coaxial body and the signal return plane.

[0041] Figure 5 It is a schematic flowchart of another solder ball simulation analysis method provided by this application.

[0042] Figure 6 It is a schematic diagram of the structure of a solder ball simulation analysis device provided by this application.

[0043] Figure 7It is a schematic structural diagram of another solder ball simulation analysis device provided by this application.

[0044] Figure 8 It is a schematic structural diagram of yet another solder ball simulation analysis device provided by this application.

[0045] Figure 9 It is a schematic structural diagram of an electronic device provided by this application. Detailed implementation manners

[0046] Next, the technical solutions in the embodiments of this application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

[0047] As mentioned above, the prior art's research on immersion liquid cooling focuses on improving thermal efficiency. When the server working environment changes from air to cold liquid, there is still a lack of sufficient research on the impact of the change in the equivalent dielectric constant of the operating environment on signal transmission. Especially for the solder ball structure directly exposed to the operating environment, it is more affected by the operating environment, and there is an obvious lack of attention in the industry in this field. Therefore, how to perform simulation analysis on solder balls in different operating environments, modify the solder ball structure, and ensure that the solder balls can meet the performance requirements in different operating environments has become an urgent problem for those skilled in the art.

[0048] To solve the above problems, this application provides a solder ball simulation analysis method to achieve simulation analysis of solder balls in different operating environments and provide a reference basis for modifying the signal solder ball model, which helps the solder balls meet the performance requirements in different operating environments.

[0049] The solder ball simulation analysis method provided by this application is applied to an electronic device, which can be a local server, a laptop, a PC (personal computer), or other electronic devices that can run software programs to execute the solder ball simulation analysis method provided by this application. Of course, in some cases, it can also be a server on the network side.

[0050] See Figure 1 , the solder ball simulation analysis method provided by this application includes the following steps:

[0051] S100. Create a coaxial body, a signal solder ball model, and a signal return plane.

[0052] In practical applications, a Ball Grid Array (BGA) includes various component structures such as vias and pads, and is connected to signal solder balls and reflow solder balls. The method provided in this application mainly analyzes the performance of signal solder balls in different application environments. Therefore, it is first necessary to create a signal solder ball model corresponding to the signal solder balls. In an alternative embodiment, the BGA is designed based on the BGA layout information in the chip design process. The BGA layout information includes the design information of each component structure of the BGA, such as the external dimensions, layout positions, and connection relationships. Based on this, a signal solder ball model can be created according to the design information related to the signal solder balls recorded in the BGA layout information. In practical applications, the design information related to the signal solder balls includes the maximum center distance of the solder balls and the height after soldering. Of course, it can also include other information related to creating the signal solder ball model, which will not be elaborated here one by one. Without exceeding the core idea of this application, it also belongs to the scope protected by this application.

[0053] Furthermore, considering the role of signal solder balls in the chip architecture, it can be known that signal solder balls are usually used to connect two structural layers in a chip in practical applications. This means that signal solder balls include two symmetric contact surfaces. Therefore, when creating a signal solder ball model, it should also include a first contact surface and a second contact surface that are symmetrically arranged.

[0054] In related technologies, when performing simulation analysis on a BGA, the simulation signal port used to output test signals is usually directly connected to the signal solder ball model. This simulation method is likely to introduce interference between the solder ball model and the simulation signal port, thereby affecting the accuracy of the simulation results. To solve this problem, this application provides a coaxial body. The simulation signal port and the signal solder ball model are connected through the coaxial body, that is, one end of the coaxial body is connected to the simulation signal port, and the other end is connected to the signal solder ball model. It should be emphasized that the coaxial body provided in this application is used to achieve signal transmission between the simulation signal port and the signal solder ball model, and the equivalent dielectric constant of the coaxial body is adjustable to meet the transmission requirements of different test signals. As for the specific configuration process of the coaxial body, reference can be made to the relevant content of S110, which will not be elaborated here for the time being.

[0055] As mentioned above, the signal solder ball model includes a first contact surface and a second contact surface. To fully simulate the operating scenario of the signal solder ball, it is necessary to create a first coaxial body corresponding to the first contact surface and a second coaxial body corresponding to the second contact surface. It should be noted that the first contact surface and the second base surface need to be connected by a coaxial body. Therefore, the actual sizes of the first contact surface and the second contact surface can be adjusted according to requirements in subsequent steps. As for the length of the coaxial body, it can be determined according to the wavelength of the test signal and other factors, such as the distance between differential signal lines, which will not be elaborated here.

[0056] In the simulation analysis method provided in this application, the signal return plane is mainly used to cooperate with the signal simulation port to provide a complete signal transmission path for the test signal. Referring to the creation process of the coaxial body described above, the signal return plane also includes a first signal return plane corresponding to the first contact surface of the signal solder ball model and a second signal return plane corresponding to the second contact surface of the signal solder ball model. It should be noted that the signal return plane provided in this application is an ideal conductor, and no loss will occur when the test signal is transmitted therein, and the signal return plane will not introduce any impurity signals.

[0057] The composition structure of the BGA also includes reflow solder balls. First of all, it should be noted that in terms of the solder ball structure, there is no difference between the signal solder ball and the reflow solder ball. The difference between the two is only limited to their different functions in the BGA structure. As mentioned above, the signal solder ball is mainly used to transmit signals. It can be understood that any signal corresponds to a reference ground, and a corresponding signal transmission loop is required to complete the transmission. This is exactly the function of the reflow solder ball, that is, to provide a reference ground and form a signal transmission loop.

[0058] Based on the above content, the aforementioned first signal return plane and second signal return plane can be created based on the reflow solder ball model, that is, the signal return plane is connected to the reflow solder ball model, so as to realize the functions of providing a reference ground and a signal return path through the reflow solder ball model.

[0059] Based on the layout information of the BGA, there is no fixed rule for the layout of the reflow solder balls and signal solder balls. Therefore, for any signal solder ball, it may be necessary to cooperate with a reflow solder ball at a relatively far distance to complete signal transmission. If the signal return plane is created according to the actual layout of the signal solder ball and the reflow solder ball, it may lead to an overly complex model structure and have no positive impact on the simulation results. Based on this, in the simulation analysis method provided in this application, when creating any of the aforementioned signal return planes, first, according to the layout information of the BGA structure, determine whether there is a reflow solder ball within a preset range centered on the signal solder ball. If there is a reflow solder ball within the preset range, create a reflow solder ball model corresponding to the reflow solder ball according to the BGA layout information, and create a signal return plane based on the reflow solder ball model. On the contrary, if there is no reflow solder ball within the preset range, in order to avoid creating a signal return plane with an overly complex structure and a too long path, first create a reflow solder ball model within the preset range, and create a signal return plane based on the newly created reflow solder ball model, so as to better realize the test signal transmission. As for the size of the preset range, it can be considered in combination with factors such as the layout information of the BGA and the complexity of the model. This application does not limit the specific setting of the preset range.

[0060] Taking the test signal as a differential signal (requiring two transmission paths) as an example, the simulation model created in this application may include as follows Figure 2 The shown structure. It can be seen that in order to match the transmission requirements of the differential signal, the model includes two signal solder ball models, and each signal solder ball model corresponds to two symmetrically arranged coaxial bodies, namely the first coaxial body and the second coaxial body. Correspondingly, it includes two signal return planes. It can be understood that in the Figure 2 Shown simulation model, the coaxial bodies on the same side share the signal return plane on the same side. When using other test signals for testing, a matching simulation analysis model can be created according to the specific test requirements of the test signal and the BGA layout information. Figure 2 The shown structure is only for illustrative purposes. In actual applications, a simulation analysis model can be created according to the method provided in this application and specific non-simulation analysis requirements.

[0061] S110. Connect the coaxial body to the signal solder ball model according to the preset contact area, and adjust the equivalent dielectric constant of the coaxial body so that the impedance of the coaxial body matches the target impedance of the test signal.

[0062] Combined with the subsequent content, it can be known that this application can correct the size of the signal solder ball model according to the simulation analysis result. To ensure the accuracy of the analysis result, it is required that the size of the contact surface between the coaxial body and the signal solder ball model remains unchanged. Therefore, before connecting the coaxial body to the signal solder ball model, configure the preset contact area between the coaxial body and the signal solder ball model, and connect the coaxial body to the signal solder ball model according to this preset contact area. Correspondingly, when adjusting the size of the signal solder ball model subsequently, keep this preset contact area unchanged. For the specific value of the preset contact area, it can be determined by combining factors such as the impedance requirements of the test signal, the adjustment range of the equivalent node constant of the coaxial body, and the design dimensions of the signal solder ball model and the coaxial body. Any value that can meet the test requirements is optional. Without exceeding the core idea of this application, it also belongs to the scope protected by this application. Combined with Figure 3 Shown, the first contact surface corresponds between the same signal solder ball model and the first coaxial body. Correspondingly, the second contact surface corresponds between the same signal solder ball model and the second coaxial body. The sizes of the first contact surface and the second contact surface are both the aforementioned preset contact area and remain unchanged during the simulation process.

[0063] It is understandable that in the actual structure of the BGA, there is no coaxial body provided. The purpose of setting the coaxial body in this application is to eliminate the interference signals that may be introduced by the direct connection between the simulation signal port and the signal solder ball model. Therefore, it is necessary to further configure the coaxial body to achieve the above purpose. Before performing the simulation analysis on the signal solder ball, the test signals to be used have been determined. Based on this, the signal transmission rate and the target impedance corresponding to the simulation signal can be determined. For example, for the PCIe5.0 signal, its signal transmission rate is 32 Gbps and the target impedance is 85 Ω. By configuring the equivalent dielectric constant of the coaxial body, the impedance of the coaxial body can be changed until the impedance of the coaxial body matches the target impedance of the test signal, that is, the deviation from the target impedance of the test signal is within the preset impedance deviation range (the ideal situation is that the two are the same). Similar to the aforementioned signal return plane, the coaxial body provided in this application is also an ideal conductor. By configuring the preset contact area and adjusting the equivalent dielectric constant, the energy loss generated during the transmission of the test signal on the coaxial body can be excluded, and the influence of the introduction of the coaxial body on the simulation results of the solder ball model can be avoided.

[0064] Combined with Figure 2 As shown, in the case where the test signal is a differential signal, two signal solder ball models are required, and correspondingly, two sets of coaxial bodies need to be created. The creation mode between each set of coaxial bodies and the signal return plane can adopt two modes. Specifically, refer to Figure 4a As shown, the two coaxial bodies can be surrounded together by the signal return plane, that is, created in a split form, or it can also be adopted Figure 4b As shown in the figure, each of the two coaxial bodies is surrounded by the signal return plane respectively, that is, created in a single-ended form. Either of the two methods can be arbitrarily selected, as long as the requirements of the aforementioned preset contact area and target impedance are met.

[0065] S120. Connect the simulation signal ports to the coaxial body and the signal return plane respectively.

[0066] After the above steps, the creation and configuration of the simulation model have been completed, and the connection between the simulation signal port, the coaxial body, and the signal return plane can be further established. It should be noted that for the creation or invocation of the simulation signal port, it can be implemented based on related technologies, and this application does not make specific limitations on this.

[0067] S130. Output the test signal through the simulation signal port, and respectively obtain the test impedance of the signal solder ball model in the air environment and the target cold liquid environment.

[0068] Control the simulation signal port to output a test signal, perform a passive test on the simulation model created in the previous step, and obtain the test impedance of the signal solder ball model. It should be emphasized that the test process is divided into two operating environments, namely the air environment and the target liquid cooling environment. Among them, the target liquid cooling environment can be any liquid cooling environment that a BGA structure may apply, and can be specifically determined based on actual test requirements. During the actual test process, the simulation of different operating environments can be changed by configuring the parameters of the test scenario. The specific process can refer to the relevant technology and will not be elaborated here.

[0069] Obtain the test impedance of the signal solder ball model in the air environment as the first test impedance. Correspondingly, obtain the test impedance of the signal solder ball model in the target liquid cooling environment as the second test impedance.

[0070] S140. Modify the signal solder ball model according to the test impedance.

[0071] Specifically, if the obtained first test impedance meets the preset impedance deviation requirement and the second test impedance does not meet the preset impedance deviation requirement, it can be explained that the equivalent dielectric constants of the target cold liquid and air differ greatly. The current signal solder ball only meets the use requirements in the air environment and does not meet the use requirements in the target liquid cooling environment. It is necessary to further adjust the size of the signal solder ball model. As mentioned above, when modifying the size of the signal solder ball model, the contact surface between the signal solder ball model and the coaxial body needs to be maintained. Therefore, it is necessary to adjust the size of the signal solder ball model while maintaining the preset contact area. Specifically, at least one of the diameter and the soldering height of the signal solder ball model can be adjusted. It can be understood that during the adjustment process of the signal solder ball model, relevant information in the BGA layout information, such as the maximum center distance between signal solder balls, can also be referred to, which will not be elaborated here. If the change in the external dimensions of the coaxial body is caused during the process of adjusting the size of the signal model, it is necessary to synchronously adjust the equivalent dielectric constant of the coaxial body to maintain the impedance of the coaxial body matching the target impedance of the test signal.

[0072] After completing the above adjustments, S130 can be executed again. After multiple adjustment tests, until both the first test impedance and the second test impedance meet the preset impedance deviation requirements. As for the specific range of the preset impedance deviation, it can be determined by combining factors such as the actual transmission requirements of the test signal. This application does not make specific limitations on this.

[0073] Furthermore, if both the first test impedance and the second test impedance meet the preset impedance deviation requirements, it can be determined that the signal solder ball corresponding to the signal solder ball model is allowed to be used in the cold liquid. At the same time, it can also be determined that the target cold liquid has a small impact on signal transmission, and the system used in the air environment can be directly applied to the target cold liquid.

[0074] Of course, if the first test impedance does not meet the preset impedance deviation requirement, the signal solder ball model also needs to be corrected according to the foregoing method.

[0075] It can be understood that in the related art, in order to verify whether a signal solder ball can operate in a target cold liquid environment, usually only the operation process of the signal solder ball in the target cold liquid environment is tested. Different from the related art, the simulation analysis method provided in this application corrects the signal solder ball model based on the test impedance of the signal solder ball model in the air environment and the target liquid cooling environment. Considering that the liquid cooling environment belongs to a complex medium environment compared with the air environment, the equivalent dielectric constant of liquid cooling can vary with the specific cold liquid used, and the equivalent dielectric constant directly affects the impedance of the signal solder ball. Based on this, the first test impedance measured in the air environment can be used as an analysis reference. According to the first test impedance, it can be determined whether to optimize the solder ball size or replace the target cold liquid (that is, the target cold liquid is only suitable as a heat dissipation medium and cannot meet the signal transmission requirements). Further, after replacing the cold liquid, all simulation analyses are in an uncertain state. To achieve the required impedance, there are too many adjustment directions. The first test impedance in the air environment can be used as a reference basis.

[0076] In practical applications, the signal solder ball and the reflow solder ball may be in the same plane. If only the size of the signal solder ball model is corrected according to the above steps, it will result in different sizes of the signal solder ball and the reflow solder ball, bringing difficulties to the further application of the BGA structure. Therefore, as a preferred implementation manner, after completing the correction of the signal solder ball model, the size of the reflow solder ball model can be further corrected according to the size of the signal solder ball model, so that the signal solder ball and the reflow solder ball have the same size.

[0077] In summary, the solder ball simulation analysis method provided in this application respectively obtains the test impedance of the signal solder ball model in the air environment and the target liquid cooling environment, and corrects the signal solder ball model according to the test impedance, which can realize the simulation analysis of the solder ball in different operating environments and provide a reference basis for the correction of the signal solder ball model, helping the solder ball to meet the performance requirements in different operating environments.

[0078] Further, the simulation signal port is connected to the signal solder ball model through a coaxial body. Since the impedance of the coaxial body matches the target impedance of the test signal, it can ensure that the coaxial body does not affect the transmission of the test signal. At the same time, through the coaxial body, the external interference amount introduced by directly connecting the simulation signal port to the signal solder ball model can be avoided, thereby ensuring the reliability and accuracy of the simulation results.

[0079] This application also provides another solder ball simulation analysis method. See Figure 5 As shown, the solder ball simulation analysis method provided in this embodiment specifically includes the following steps.

[0080] S200. Create a coaxial body, a signal solder ball model, and a signal return plane.

[0081] In an alternative embodiment, S200 can be implemented with reference to Figure 1 the relevant content of S100 in the illustrated embodiment, which will not be repeated here.

[0082] S210. Connect the coaxial body to the signal solder ball model according to a preset contact area, and adjust the equivalent dielectric constant of the coaxial body so that the impedance of the coaxial body matches the target impedance of the test signal.

[0083] In an alternative embodiment, S210 can be implemented with reference to Figure 1 the relevant content of S110 in the illustrated embodiment, which will not be repeated here.

[0084] S220. Connect the simulation signal ports to the coaxial body and the signal return plane respectively.

[0085] In an alternative embodiment, S220 can be implemented with reference to Figure 1 the relevant content of S120 in the illustrated embodiment, which will not be repeated here.

[0086] S230. Create a simulation signal source and connect the simulation signal source to the simulation signal port.

[0087] The simulation analysis method provided in this embodiment is intended to perform active simulation on the simulation model constructed in the foregoing steps. Therefore, a simulation signal source is created in this step, and the simulation signal source can output a test signal. After the creation of the simulation signal source is completed, the obtained simulation signal source is connected to the simulation signal port. As for the specific creation process of the simulation signal source, it can be implemented based on related technologies, and this application does not make specific limitations thereon.

[0088] S240. Control the simulation signal source to output a test signal through the simulation signal port, and respectively obtain the test impedance of the signal solder ball model in an air environment and a target cold liquid environment.

[0089] After establishing the connection relationship between the simulation signal source and the simulation signal port, the simulation signal source can be controlled to output a test signal through the simulation signal port, and the test impedance of the signal solder ball model in an air environment and a target cold liquid environment can be obtained. As for the process of obtaining the test impedance of the signal solder ball model in different operating environments, it can be implemented with reference to Figure 1 the relevant content of S130 in the illustrated embodiment, which will not be elaborated here.

[0090] Further, since it is an active test, the simulation signal source can also be controlled to perform more specific tests on the simulation model to obtain test parameters in the corresponding test environment. The specific test process can be carried out in combination with relevant technologies and the specific implementation of the simulation signal source, which will not be elaborated here.

[0091] S250. Modify the signal solder ball model according to the test impedance.

[0092] In an optional implementation, S250 can be implemented with reference to Figure 1 the relevant content of S140 in the embodiment shown, which will not be repeated here.

[0093] Further, if other test results are also obtained during the active test process, the signal solder ball model and the reflow solder ball model can be further modified according to the other test results.

[0094] In summary, the solder ball simulation analysis method provided in this embodiment can perform active analysis on the signal solder ball model. Compared with the passive analysis performed in the foregoing embodiments, the obtained analysis results are more accurate, and various parameters can be tested, so as to more comprehensively analyze the performance of the signal solder ball in different operating environments, and can provide a more reliable reference basis for the modification of the signal solder ball.

[0095] Next, the solder ball simulation analysis device provided by the present invention will be introduced. The solder ball simulation analysis device provided by the present invention belongs to the same inventive concept as the solder ball simulation analysis method provided in the embodiments of the present application, and can execute the solder ball simulation analysis method provided in any embodiment of the present application, and has corresponding functional modules and beneficial effects for executing the solder ball simulation analysis method. For technical details not described in detail in this embodiment, reference can be made to the solder ball simulation analysis method provided in the embodiments of the present application, which will not be elaborated here.

[0096] See Figure 6 , Figure 6 which is a structural block diagram of a solder ball simulation analysis device provided by the present application. The solder ball simulation analysis device provided in this embodiment includes the following components.

[0097] The first modeling unit 10 is used to create a coaxial body, a signal solder ball model, and a signal reflow plane; connect the coaxial body to the signal solder ball model according to a preset contact area, and adjust the equivalent dielectric constant of the coaxial body so that the impedance of the coaxial body matches the target impedance of the test signal; connect the simulation signal ports to the coaxial body and the signal reflow plane respectively;

[0098] The test unit 20 is used to output a test signal through the simulation signal port, and respectively obtain the test impedance of the signal solder ball model in the air environment and the target cold liquid environment;

[0099] The first correction unit 30 is configured to correct the signal solder ball model according to the test impedance.

[0100] The present application also provides another solder ball simulation analysis device. Refer to Figure 7 as shown, based on the Figure 6 embodiment shown, the solder ball simulation analysis device provided in this embodiment further includes:

[0101] The second modeling unit 40 creates a simulation signal source and connects the simulation signal source to the simulation signal port.

[0102] Among them, the test unit 20 is configured to control the simulation signal source to output a test signal through the simulation signal port, and respectively obtain the test impedance of the signal solder ball model in an air environment and a target cold liquid environment.

[0103] Furthermore, the present application also provides another solder ball simulation analysis device. Refer to Figure 8 , based on the Figure 6 embodiment shown, the solder ball simulation analysis device provided in this embodiment further includes:

[0104] The second correction unit 50 is configured to correct the size of the reflow solder ball model according to the size of the signal solder ball model.

[0105] Next, refer to Figure 9 to describe the electronic device provided in the embodiment of the present invention. The electronic device provided in this embodiment may include: at least one processor 100, at least one communication interface 200, at least one memory 300, and at least one communication bus 400;

[0106] In the embodiment of the present invention, the number of the processor 100, the communication interface 200, the memory 300, and the communication bus 400 is at least one, and the processor 100, the communication interface 200, and the memory 300 complete mutual communication through the communication bus 400; obviously, Figure 9 the communication connection schematic diagram of the processor 100, the communication interface 200, the memory 300, and the communication bus 400 shown is only optional;

[0107] Optionally, the communication interface 200 may be an interface of a communication module, such as an interface of a GSM module; the processor 100 may be a central processing unit CPU, or a specific integrated circuit ASIC (Application Specific Integrated Circuit), or one or more integrated circuits configured to implement the embodiment of the present invention.

[0108] The memory 300 may include high-speed RAM memory and may also include non-volatile memory, such as at least one disk memory.

[0109] Among them, the processor 100 is specifically configured to execute the application programs in the memory to implement the steps of the solder ball simulation analysis method described above.

[0110] In some embodiments, the present embodiment also provides a computer-readable storage medium, such as a floppy disk, an optical disk, a hard disk, a flash memory, a USB flash drive, an SD (Secure Digital Memory Card) card, an MMC (Multimedia Card) card, etc. One or more instructions for implementing the above steps are stored in the computer-readable storage medium. When the one or more instructions are executed by one or more processors, the processor executes the solder ball simulation analysis method described above. For the relevant specific implementation, please refer to the foregoing description and will not be elaborated here.

[0111] In addition to the above methods and devices, the embodiments of the present application may also be a computer program product, which includes computer program instructions. When the computer program instructions are run by a processor, the processor executes the steps in the solder ball simulation analysis method according to various embodiments of the present application described in the above content of this specification.

[0112] The computer program product can be written in any combination of one or more programming languages to write program code for performing the operations of the embodiments of the present application. The programming languages include object-oriented programming languages, such as Java, C++, etc., and also include conventional procedural programming languages, such as the "C" language or similar programming languages. The program code can be executed entirely on the user computing device, partially on the user device, executed as an independent software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0113] Those skilled in the art can understand that the content disclosed in the present disclosure can have various variations and improvements. For example, the various devices or components described above can be implemented by hardware, or can be implemented by software, firmware, or some or all of the combinations of the three.

[0114] In addition, although the present disclosure makes various references to certain units in the system according to the embodiments of the present disclosure, however, any number of different units can be used and run on the client and / or server. The units are only illustrative, and different aspects of the system and method can use different units.

[0115] Flowcharts are used in this disclosure to illustrate the steps of the methods according to the embodiments of this disclosure. It should be understood that the steps before or after do not necessarily have to be carried out precisely in order. On the contrary, they can be carried out in reverse order or various steps can be processed simultaneously. Also, other operations can be added to these processes.

[0116] Those of ordinary skill in the art can understand that all or part of the steps in the above methods can be completed by instructing relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium, such as a read-only memory, etc. Optionally, all or part of the steps of the above embodiments can also be implemented using one or more integrated circuits. Correspondingly, each module / unit in the above embodiments can be implemented in the form of hardware or in the form of a software functional module. This disclosure is not limited to any specific combination of hardware and software.

[0117] Unless otherwise defined, all terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure belongs. It should also be understood that terms such as those defined in a general dictionary should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense, unless explicitly defined as such herein.

[0118] The above is an illustration of this disclosure and should not be considered a limitation thereof. Although several exemplary embodiments of this disclosure have been described, those skilled in the art will readily understand that many modifications can be made to the exemplary embodiments without departing from the novel teachings and advantages of this disclosure. Therefore, all such modifications are intended to be included within the scope of this disclosure as defined by the claims. It should be understood that the above is an illustration of this disclosure and should not be considered limited to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included within the scope of the appended claims. This disclosure is defined by the claims and their equivalents.

Claims

1. A method for solder ball simulation analysis, characterized in that, Including: Create a coaxial body, a signal solder ball model, and a signal return plane; Connect the coaxial body to the signal solder ball model according to a preset contact area, and adjust the equivalent dielectric constant of the coaxial body so that the impedance of the coaxial body matches the target impedance of the test signal; Connect the simulation signal ports to the coaxial body and the signal return plane respectively; Output the test signal through the simulation signal ports, and respectively obtain the test impedances of the signal solder ball model in an air environment and a target cold liquid environment; Modify the signal solder ball model according to the test impedance.

2. The method according to claim 1, characterized in that The test impedance includes a first test impedance obtained in an air environment and a second test impedance obtained in the target cold liquid environment; Modifying the signal solder ball model according to the test impedance includes: If the first test impedance meets the preset impedance deviation requirement and the second test impedance does not meet the preset impedance deviation requirement, adjust the size of the signal solder ball model; If both the first test impedance and the second test impedance meet the preset impedance deviation requirement, determine that the signal solder ball corresponding to the signal solder ball model is allowed to be used in the cold liquid.

3. The method according to claim 2, characterized in that, Adjusting the size of the signal solder ball model includes: While maintaining the preset contact area unchanged, adjust at least one of the diameter and the soldering height of the signal solder ball model.

4. The method according to claim 1, characterized in that, The creating of the coaxial body, the signal solder ball model, and the signal return plane includes: Create a corresponding signal solder ball model according to the layout information of the ball grid array to which the signal solder ball belongs. The signal solder ball model includes a symmetrically arranged first contact surface and a second contact surface; Create a first coaxial body and a first signal return plane corresponding to the first contact surface, and a second coaxial body and a second signal return plane corresponding to the second contact surface.

5. The method according to claim 4, characterized in that The process of creating any one of the signal return planes includes: According to the layout information, determine whether there is a reflow solder ball within a preset range centered on the signal solder ball; If there is a reflow solder ball within the preset range, create a reflow solder ball model corresponding to the reflow solder ball, and create the signal return plane based on the reflow solder ball model; If there is no reflow solder ball within the preset range, create a reflow solder ball model within the preset range, and create the signal return plane based on the reflow solder ball model.

6. The method according to claim 5, wherein Also included: Modify the size of the reflow solder ball model according to the size of the signal solder ball model.

7. The method according to any one of claims 1 to 6, characterized in that Also included: Create a simulation signal source and connect the simulation signal source to the simulation signal ports; Outputting the test signal through the simulation signal ports includes: Controlling the simulation signal source to output the test signal through the simulation signal ports.

8. A solder ball simulation analysis device, characterized in that, Including: A first modeling unit for creating a coaxial body, a signal solder ball model, and a signal return plane; Connect the coaxial body to the signal solder ball model according to a preset contact area, and adjust the equivalent dielectric constant of the coaxial body so that the impedance of the coaxial body matches the target impedance of the test signal; Connect the simulation signal ports to the coaxial body and the signal return plane respectively; A test unit for outputting the test signal through the simulation signal port and respectively obtaining the test impedance of the signal solder ball model in an air environment and a target cold liquid environment; A first correction unit for correcting the signal solder ball model according to the test impedance.

9. An electronic device, comprising a memory, a processor, and a computer program stored on the memory and executed by the processor, characterized in that When the processor executes the computer program, the steps of the solder ball simulation analysis method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, the steps of the solder ball simulation analysis method according to any one of claims 1 to 7 are implemented.

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