Position positioning method and system applied to SSD (Solid State Disk) assembly

Abstract

The invention relates to the field of electronic manufacturing, and discloses a position positioning method and system applied to SSD assembly, and the method comprises the steps: firstly obtaining basic parameters and assembly environment information of a to-be-assembled SSD, obtaining data through position detection, analyzing the position change mode of the to-be-assembled SSD, mining a region positioning demand and quantitative demand relation, constructing a positioning adjustment system, and carrying out the positioning adjustment of the to-be-assembled SSD; the method comprises the following steps: determining a to-be-positioned area, analyzing the characteristics and positioning improvement trend of the to-be-positioned area, constructing a position information map, identifying key positioning points and potential positioning problems to calculate a position deviation rate, assembling a positioning detection module and an SSD to obtain an assembled SSD, analyzing the working environment of the assembled SSD, monitoring positioning state parameters, and finally generating a scheme capable of optimizing SSD assembling and positioning. According to the invention, quick positioning of parts in the SSD assembling process can be improved.

Description

Technical Field

[0001] The present invention relates to a position positioning method and system applied to SSD assembly, belonging to the field of electronic manufacturing. Background Art

[0002] In the field of electronic manufacturing, with the rapid development of information technology, as a key device for data storage, the solid-state drive (SSD) has witnessed an explosive growth in market demand. SSDs are widely used in various electronic devices, such as laptop computers, desktop computers, servers, and industrial control computers, playing a core supporting role in ensuring the fast reading and writing of data and the smooth operation of the devices.

[0003] At the present stage, in the process of SSD assembly, there are many limitations in the position positioning methods for each component. On the one hand, traditional positioning means mostly rely on manual operations, determining the installation positions of components by the naked eye observation and experience of workers. This not only has low efficiency but also is extremely prone to positioning errors due to human factors, thus affecting the overall performance and quality stability of the SSD. Although some existing semi-automatic positioning technologies reduce the manual burden to a certain extent, they often only perform isolated positioning operations on a single or a few components, lacking systematic overall consideration. There is a lack of effective connection and coordination between different assembly links, and the data generated in each step is difficult to share and integrate, unable to provide accurate position references for subsequent assembly processes. Therefore, a position positioning method applied to SSD assembly is needed to improve the rapid positioning of components during SSD assembly. Summary of the Invention

[0004] The present invention provides a position positioning method and system applied to SSD assembly, and its main purpose is to improve the rapid positioning of components during SSD assembly.

[0005] To achieve the above object, a position positioning method applied to SSD assembly provided by the present invention includes:

[0006] Obtaining the basic parameters and assembly environment information of the SSD to be assembled, based on the basic parameters and assembly environment information, performing position detection on the SSD to be assembled to obtain position detection data, and based on the position detection data, analyzing the position change pattern of the SSD to be assembled during the assembly process;

[0007] Mining the regional positioning requirements under the position change pattern, analyzing the quantitative requirement relationship corresponding to the regional positioning requirements, and combining the quantitative requirement relationship with the assembly state of the SSD to be assembled to construct a positioning adjustment system corresponding to the SSD to be assembled;

[0008] Based on the positioning adjustment system, determine the area to be positioned during the SSD assembly process, identify the regional features corresponding to the area to be positioned, analyze the positioning improvement trend corresponding to the area to be positioned based on the regional features, and construct a position information map corresponding to the SSD based on the positioning improvement trend;

[0009] Identify the key positioning points in the position information map, analyze the historical positioning records corresponding to the key positioning points, identify the potential positioning problems in the historical positioning records, and calculate the position deviation rate of the SSD to be assembled during the assembly process based on the potential positioning problems;

[0010] Based on the position deviation rate, perform a fitting process on a preset positioning detection module and the SSD to be assembled to obtain an assembled SSD, analyze the working environment corresponding to the assembled SSD, monitor the positioning status parameters corresponding to the assembled SSD in real time based on the working environment, and generate a position positioning scheme corresponding to the SSD to be assembled based on the positioning status parameters.

[0011] Optionally, the analysis of the position change pattern of the SSD to be assembled during the assembly process based on the position detection data includes:

[0012] Determine the zero-assembly components corresponding to the SSD to be assembled;

[0013] Based on the position detection data, identify the initial coordinate information corresponding to the zero-assembly components;

[0014] Track the component assembly process corresponding to the zero-assembly components based on the initial coordinate information;

[0015] Analyze the real-time displacement of the components corresponding to the component assembly process;

[0016] Analyze the position change pattern of the SSD to be assembled during the assembly process based on the real-time displacement.

[0017] Optionally, the excavation of the regional positioning requirements under the position change pattern includes:

[0018] Identify the frequently displaced areas in the position change pattern;

[0019] Extract the component features corresponding to the components in the frequently displaced areas;

[0020] Based on the component features, judge the regional sensitivity corresponding to the frequently displaced areas;

[0021] Analyze the functional relevance in the frequently displaced areas based on the regional sensitivity;

[0022] Based on the functional relevance, explore the regional positioning requirements under the position change pattern.

[0023] Optionally, the constructing the positioning adjustment system corresponding to the SSD to be assembled by combining the quantitative requirement relationship with the assembly state of the SSD to be assembled includes:

[0024] Identify the current assembly process and the information of the assembled components in the assembly state;

[0025] Based on the quantitative requirement relationship, extract the key positioning parameters corresponding to the current assembly process;

[0026] Compare the information of the assembled components with the key positioning parameters to obtain the position deviation data;

[0027] According to the position deviation data, plan the assembly adjustment path corresponding to the SSD to be assembled;

[0028] Based on the assembly adjustment path, construct the positioning adjustment system corresponding to the SSD to be assembled.

[0029] Optionally, the analyzing the positioning improvement trend corresponding to the area to be positioned based on the area characteristics includes:

[0030] Identify the core characteristic indicators in the area characteristics;

[0031] Based on the core characteristic indicators, retrieve the preset assembly case library to obtain assembly cases;

[0032] Extract the positioning optimization strategies in the assembly cases;

[0033] Based on the positioning optimization strategies, compare the working condition differences between the area to be positioned and the corresponding area in the assembly cases;

[0034] According to the working condition differences, analyze the positioning improvement trend corresponding to the area to be positioned.

[0035] Optionally, the constructing the position information map corresponding to the SSD based on the positioning improvement trend includes:

[0036] Determine the trend positioning nodes in the positioning improvement trend;

[0037] Query the connection logic between the trend positioning nodes;

[0038] Analyze the connection architecture corresponding to the connection logic;

[0039] Based on the connection architecture, construct the position information map corresponding to the SSD.

[0040] Optionally, identifying key positioning points in the position information map includes:

[0041] Extracting position attribute points in the position information map;

[0042] Rating the importance of the position attribute points to obtain rated attribute points;

[0043] Calculating the attribute point weights corresponding to the rated attribute points;

[0044] Identifying key positioning points in the position information map based on the attribute point weights.

[0045] Optionally, calculating the attribute point weights corresponding to the rated attribute points includes:

[0046] Calculating the attribute point weights corresponding to the rated attribute points using the following formula:

[0047]

[0048] where WP represents the attribute point weight corresponding to the rated attribute point, m represents the number of types of influencing factor types corresponding to the rated attribute point, j represents the quantity index corresponding to the influencing factor type, a j represents the weight coefficient of the jth type of influencing factor, q j represents the evaluation score of the jth type of influencing factor, and B represents the score difference between the current importance score and the average importance score of the rated attribute point.

[0049] Optionally, calculating the position deviation rate of the SSD to be assembled during the assembly process based on the potential positioning problem includes:

[0050] Calculating the position deviation rate of the SSD to be assembled during the assembly process using the following formula:

[0051]

[0052] where PD represents the position deviation rate of the SSD to be assembled during the assembly process, n represents the number of types of potential positioning problems, k represents the quantity index of the potential positioning problems, γ k represents the problem weight coefficient of the kth potential positioning problem, D k (t) represents the deviation change function of the kth potential positioning problem with the assembly time t, O represents the number of external influencing factors, l represents the quantity index of the external influencing factors, δ l represents the factor weight coefficient of the lth external influencing factor, and E l represents the quantification value of the lth external influencing factor on the position deviation.

[0053] To solve the above problems, the present invention also provides a position positioning system applied to SSD assembly, and the system includes:

[0054] A mode analysis module, configured to obtain the basic parameters and assembly environment information of the SSD to be assembled, perform position detection on the SSD to be assembled based on the basic parameters and assembly environment information to obtain position detection data, and analyze the position change mode of the SSD to be assembled during the assembly process based on the position detection data;

[0055] A system construction module, configured to mine the regional positioning requirements under the position change mode, analyze the quantitative requirement relationship corresponding to the regional positioning requirements, and construct a positioning adjustment system corresponding to the SSD to be assembled by combining the quantitative requirement relationship with the assembly state of the SSD to be assembled;

[0056] A map construction module, configured to determine the area to be positioned corresponding to the SSD assembly process based on the positioning adjustment system, identify the area features corresponding to the area to be positioned, analyze the positioning improvement trend corresponding to the area to be positioned based on the area features, and construct a position information map corresponding to the SSD based on the positioning improvement trend;

[0057] A deviation rate calculation module, configured to identify the key positioning points in the position information map, analyze the historical positioning records corresponding to the key positioning points, identify the potential positioning problems in the historical positioning records, and calculate the position deviation rate of the SSD to be assembled during the assembly process based on the potential positioning problems;

[0058] A solution generation module, configured to perform a fitting process on a preset positioning detection module and the SSD to be assembled based on the position deviation rate to obtain an assembled SSD, analyze the working environment corresponding to the assembled SSD, monitor the positioning state parameters corresponding to the assembled SSD in real time based on the working environment, and generate a position positioning solution corresponding to the SSD to be assembled based on the positioning state parameters.

[0059] Compared with the problems described in the background art, the present invention can assist in adjusting the assembly process by obtaining the basic parameters of the SSD to be assembled and the assembly environment information, such as temperature, humidity, and electrostatic environment data, and can guide the adoption of corresponding protection measures to ensure the assembly quality. The combination of the two provides a solid data foundation for the subsequent position detection and positioning system construction, making the entire SSD assembly process more systematic. By mining the regional positioning requirements under the position change mode, the present invention can accurately focus on the key areas where position deviations are likely to occur during SSD assembly, allocate resources in advance, such as arranging more experienced workers or equipment with higher precision, to ensure the assembly quality of these sensitive areas, thereby making the entire assembly process smoother and more efficient. Further, based on the positioning adjustment system, the present invention determines the area to be positioned corresponding to the SSD assembly process and identifies the regional characteristics corresponding to the area to be positioned, which can focus resources on key parts, such as deploying high-precision equipment and professional manpower, to specifically ensure the assembly accuracy of these sensitive areas and improve the overall quality. It helps to understand the component characteristics and assembly difficulties in advance, optimize the process accordingly, and improve the efficiency. Further, by identifying the key positioning points in the position information map, the present invention helps to optimize the assembly process. Workers can clarify the priority and sequence of assembly based on the key positioning points, avoid confusion, reduce assembly errors, and ensure the stable assembly and operation of the SSD. Finally, based on the position deviation rate, the present invention performs a fitting process on the preset positioning detection module and the SSD to be assembled to obtain the assembled SSD, which can improve the assembly accuracy. By considering the position deviation rate, it can ensure the precise fitting of the positioning detection module and the SSD, reduce performance problems caused by improper assembly, and ensure the product quality. Precise fitting can make the SSD more stable and reliable during operation and reduce the failure rate. Therefore, the position positioning method and system applied to SSD assembly provided by the embodiments of the present invention can improve the rapid positioning of components during the SSD assembly process. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 FIG. is a schematic flowchart of a position positioning method applied to SSD assembly provided by an embodiment of the present invention;

[0061] Figure 2 FIG. is a schematic diagram of modules for implementing the position positioning system applied to SSD assembly provided by an embodiment of the present invention.

[0062] The implementation, functional features, and advantages of the present invention will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0063] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0064] The embodiment of the present application provides a position positioning method applied to SSD assembly. The execution subject of the position positioning method applied to SSD assembly includes, but is not limited to, at least one of electronic devices such as a server, a terminal, etc. that can be configured to execute the method provided by the embodiment of the present application. In other words, the position positioning method applied to SSD assembly can be executed by software or hardware installed on a terminal device or a server device. The server includes, but is not limited to: a single server, a server cluster, a cloud server, or a cloud server cluster, etc.

[0065] Embodiment 1:

[0066] Referring to Figure 1 As shown, it is a schematic flowchart of a position positioning method applied to SSD assembly provided by an embodiment of the present invention. In this embodiment, the position positioning method applied to SSD assembly includes:

[0067] S1. Obtain the basic parameters and assembly environment information of the SSD to be assembled, perform position detection on the SSD to be assembled based on the basic parameters and assembly environment information to obtain position detection data, and analyze the position change pattern of the SSD to be assembled during the assembly process based on the position detection data.

[0068] By obtaining the basic parameters and assembly environment information of the SSD to be assembled, the present invention can help adjust the assembly process, such as temperature and humidity, electrostatic environment data, and can guide the adoption of corresponding protection measures to ensure the assembly quality. The combination of the two provides a solid data foundation for subsequent position detection and positioning system construction, making the entire SSD assembly process more systematic.

[0069] Among them, the SSD to be assembled refers to the state where the assembly has not been completed and the components are waiting to be assembled. It will become a complete and normally working solid-state drive product through a series of assembly processes and is the main object of operation for this position positioning method and system. The basic parameters refer to the key data related to the physical and performance aspects of the SSD itself, including but not limited to the size and shape specifications of the SSD, which are crucial for determining its spatial occupancy and adaptability in the assembly equipment; the storage capacity. Different capacity SSDs may have different internal chip layouts, which will affect the component matching during assembly; the interface type, such as SATA, NVMe and other interface forms, determines the connection method with other hardware and the required connection components, as well as the main control chip model, flash memory chip model, etc.; the assembly environment information refers to the external condition information during the SSD assembly process, such as the temperature and humidity data in the workshop. Extreme temperature and humidity may affect the performance of electronic components and the characteristics of assembly materials, such as the viscosity of glue and the quality of welding, etc.; the electrostatic protection level. Since the SSD belongs to electronic precision equipment, static electricity may damage the internal electronic components. Understanding the environmental static electricity situation helps to take appropriate electrostatic protection measures; the light intensity and light type (such as natural light or light of a specific frequency). In some high-precision assembly links, specific lighting conditions can help workers observe the details and assembly positions of components more clearly. Optionally, the acquisition of the basic parameters and assembly environment information of the SSD to be assembled can be achieved through the design of automation tools. For example, the design files generated by EDA tools are used to obtain the basic parameters of the SSD, such as the connection relationship between chips, circuit layout and other information.

[0070] Furthermore, based on the basic parameters and assembly environment information, the present invention performs position detection on the SSD to be assembled to obtain position detection data, which can fully consider the influence of environmental factors on the assembly accuracy, make the position detection more in line with the actual working conditions, and thus effectively avoid positioning deviations caused by environmental interference.

[0071] Among them, the position detection data refers to a set of quantitative information obtained through specific detection means and used to accurately describe the actual position state of the SSD to be assembled in the current assembly environment, including the three-dimensional coordinate values of each component to determine its specific orientation in space; the relative displacement amount and angular deviation value between components, intuitively presenting the accuracy of the mutual position; and the deviation data obtained by comparing with the standard assembly position model. These data provide key basis for evaluating the accuracy of SSD assembly, analyzing the position change trend and constructing a precise positioning scheme, and are indispensable basic elements for realizing an efficient and high-quality SSD assembly process. Optionally, the position detection of the SSD to be assembled can be achieved through the RFID-assisted positioning method. For example, RFID tags are attached to the key components of the SSD, and RFID readers are arranged around the assembly area to obtain the position detection data.

[0072] Furthermore, based on the position detection data, the present invention analyzes the position change pattern of the SSD to be assembled during the assembly process, can anticipate in advance the possible position deviations in the SSD assembly process, and thus timely adjust the process parameters or assembly techniques to avoid product quality problems caused by the accumulation of position deviations, such as poor interface connection, component interference, etc. By accurately grasping the position change law, the assembly sequence and path can be optimized, and the assembly efficiency can be improved.

[0073] Among them, the position change pattern refers to the regular position change trend summarized by comprehensively considering the real-time displacement of each sub-assembled component during the entire component assembly process. For example, the main control chip usually has a small translation in the X and Y directions after the chip mounting process for position calibration, and the flash memory chip has a certain sinking change in the Z-axis direction during the welding process accompanied by heating and cooling.

[0074] As an embodiment of the present invention, analyzing the position change pattern of the SSD to be assembled during the assembly process based on the position detection data includes: determining the sub-assembled components corresponding to the SSD to be assembled; identifying the initial coordinate information corresponding to the sub-assembled components based on the position detection data; tracking the component assembly process corresponding to the sub-assembled components based on the initial coordinate information; analyzing the real-time displacement of the components corresponding to the component assembly process; and analyzing the position change pattern of the SSD to be assembled during the assembly process based on the real-time displacement.

[0075] Among them, the sub-assembled components refer to the individual independent components that make up the SSD to be assembled but have not been assembled and integrated, such as the main control chip, flash memory chip, circuit board, interface connector, etc.; the initial coordinate information refers to the spatial position data of the sub-assembled components relative to a preset coordinate system in the unassembled state before the start of assembly obtained by using specific measurement means, such as machine vision, laser measurement, etc., usually presented in the form of three-dimensional coordinates, including the specific coordinate values on the X, Y, and Z axes; the component assembly process refers to a series of ordered operation steps followed to assemble each sub-assembled component into a complete SSD, covering the whole process from the preparation of the basic circuit board to the chip mounting, welding, interface installation, and housing encapsulation; the real-time displacement refers to the real-time and dynamic position movement information of the sub-assembled components relative to their initial coordinate positions during the execution of the component assembly process, including the direction vector of movement (such as moving 5 millimeters along the positive X-axis), the numerical value of the moving distance (such as translating 3 millimeters), and the change in the rotation angle (such as rotating 10 degrees clockwise around the Z-axis).

[0076] Further, the determination of the zero-assembly components corresponding to the SSD to be assembled can be achieved through a three-dimensional model recognition method. For example, by importing the design model of the SSD, each component in the model is automatically recognized and decomposed into independent zero-assembly components. The recognition of the initial coordinate information corresponding to the zero-assembly components can be achieved through a laser measurement device. For example, a laser displacement sensor is used to emit a laser beam onto the surface of the component, and the distance is measured based on the characteristic changes of the reflected light. The spatial position of the component is constructed through multi-point measurement to determine the initial coordinates. The tracking of the component assembly process corresponding to the zero-assembly components can be achieved through a production management system. For example, when the component enters the production line, it is entered into the system by scanning the code or other means, and the PMS tracks and displays its current process status in real time to determine the component assembly process. The tracking of the component assembly process corresponding to the zero-assembly components can be achieved through a laser interferometry method. For example, a laser interferometer is used to emit a laser beam onto the component, and the micro-displacement of the component is measured based on the changes in the interference fringes. The real-time displacement situation is obtained through the micro-displacement change data. The analysis of the position change pattern of the SSD to be assembled during the assembly process can be achieved through data mining algorithms. For example, algorithms such as cluster analysis and association rule mining.

[0077] S2. Mine the regional positioning requirements under the position change pattern, analyze the quantitative requirement relationship corresponding to the regional positioning requirements, and combine the quantitative requirement relationship with the assembly state of the SSD to be assembled to construct a positioning adjustment system corresponding to the SSD to be assembled.

[0078] By mining the regional positioning requirements under the position change pattern, the present invention can accurately focus on the key areas where position deviations are likely to occur during SSD assembly, allocate resources in advance, such as arranging more experienced workers or higher-precision equipment, to ensure the assembly quality of these sensitive areas, thereby making the entire assembly process more smooth and efficient.

[0079] Among them, the regional positioning requirements refer to the specific requirements for position accuracy, positioning methods, positioning tools, etc. in the assembly of this area, determined after comprehensively considering the characteristics, sensitivity, and functional relevance of the frequently displaced areas.

[0080] As an embodiment of the present invention, the mining of the regional positioning requirements under the position change pattern includes: identifying the frequently displaced areas in the position change pattern; extracting the component characteristics corresponding to the components within the frequently displaced areas; based on the component characteristics, judging the regional sensitivity corresponding to the frequently displaced areas; based on the regional sensitivity, analyzing the functional relevance in the frequently displaced areas; and based on the functional relevance, mining the regional positioning requirements under the position change pattern.

[0081] The frequently displaced area refers to the spatial range where the components move relatively frequently according to the position change pattern analyzed from the position detection data during the assembly process of the SSD to be assembled. For example, in the chip mounting and subsequent fine-tuning process, the area around the main control chip needs to be repeatedly calibrated, and the area is displaced multiple times in a short period of time in the X, Y, and Z axis directions. The area around the main control chip belongs to the frequently displaced area; the component characteristics refer to the physical, chemical, and functional characteristics of the components in the frequently displaced area. For example, the component characteristics of the flash memory chip include a thin and light appearance structure, a precise pin layout, a functional attribute of storing data, and an electrical characteristic that is extremely sensitive to static electricity. The regional sensitivity refers to the degree of assembly positioning accuracy required for the frequently displaced area. If a slight positional deviation of components in an area can cause the SSD to fail and its performance to drop significantly, such as in the interface connection area, a few microns of misalignment can hinder data transmission, then the sensitivity of this area is high. On the contrary, if the displacement within a certain range does not affect the basic functions of the SSD, the sensitivity is low. The functional relevance refers to the intrinsic connection between the components in the frequently displaced area and the overall functional realization of the SSD. For example, the frequently displaced area where the main control chip is located is responsible for coordinating core functions such as data reading and writing, instruction transmission, etc. in the SSD, and works closely with areas such as the flash memory chip and the cache chip.

[0082] Furthermore, the identification of the frequent displacement area in the position change pattern can be achieved by setting a threshold, for example, when the number of displacements exceeds a certain value or the standard deviation of the displacement distance is greater than a certain value, the corresponding area is marked as a frequent displacement area; the extraction of component features corresponding to the parts in the frequent displacement area can be achieved by optical detection and measurement tools, such as: using high-resolution microscopes, profilometers and other equipment to detect parts and obtain component features; the judgment of the regional sensitivity corresponding to the frequent displacement area can be achieved by finite element analysis tools, such as: performing finite element analysis on the frequent displacement area of ​​the SSD shell, when the shell is partially displaced, observing whether its internal structure is squeezed or deformed, so as to judge the sensitivity; the analysis of the functional relevance in the frequent displacement area can be achieved by correlation analysis algorithms, such as: Pearson correlation coefficient, mutual information and other algorithms; the mining of regional positioning needs under the position change pattern can be achieved by MADA methods, such as: using MADA methods (such as hierarchical analysis method, TOPSIS method, etc.) to comprehensively evaluate and mine the most suitable regional positioning needs.

[0083] By analyzing the quantitative requirement relationships corresponding to the regional positioning requirements, the present invention can accurately quantify the vague regional positioning requirements, clarify the specific numerical standards for each key region in terms of position accuracy, displacement allowable range, etc., provide a precise target guidance for the assembly operation, reduce human judgment errors, accurately allocate the input of high-precision equipment, professional technicians, etc., avoid resource waste on the premise of ensuring quality, and improve the assembly efficiency.

[0084] Among them, the quantitative requirement relationship refers to the mutual association and constraint conditions among a series of parameters that can be measured by specific numerical values determined based on the regional positioning requirements during the SSD assembly process. For example, for a sensitive frequently displaced region, its positioning accuracy requirement is accurate to the micron level, which forms a quantitative requirement relationship with numerical parameters such as the dimensional tolerance of components within this region, the assembly clearance, and the performance indicators of the final SSD (such as the interface connection accuracy corresponding to the stability requirement of the data transfer rate). Optionally, the analysis of the quantitative requirement relationship corresponding to the regional positioning requirements can be achieved through relationship analysis tools, such as tools like SPSS, Minitab, etc.

[0085] Furthermore, by combining the quantitative requirement relationship with the assembly state of the SSD to be assembled, the present invention constructs a positioning adjustment system corresponding to the SSD to be assembled, which can flexibly adjust the positioning according to the real-time assembly situation, ensure that each assembly stage precisely conforms to the quantitative standard, avoid the cumulative error generated due to the progress of the assembly process, and optimize the allocation of resources at different assembly nodes with the precise quantitative requirements as the guide, thereby improving the assembly efficiency and cost-effectiveness.

[0086] Among them, the assembly state refers to the actual situation of the SSD to be assembled and its various components at a specific moment during the SSD assembly process, covering specific information in multiple aspects. From a physical perspective, it includes the position information of the assembled components, such as the coordinates and angles of the chips already installed on the circuit board in three-dimensional space, as well as the relative position relationship between the components; it also involves the connection state of the components, such as the quality of the welding points, the tightness of the interface connections, etc. The positioning adjustment system refers to a comprehensive system that integrates a series of processes and mechanisms from identifying the assembly state, extracting key parameters, judging deviations to planning adjustment paths, and can dynamically and precisely ensure that each component is positioned according to the quantitative requirement relationship according to the real-time situation during the SSD assembly process.

[0087] As an embodiment of the present invention, the construction of the positioning and adjustment system corresponding to the SSD to be assembled by combining the quantitative requirement relationship with the assembly state of the SSD to be assembled includes: identifying the current assembly link and the information of the assembled components in the assembly state; extracting the key positioning parameters corresponding to the current assembly link based on the quantitative requirement relationship; comparing the information of the assembled components with the key positioning parameters to obtain the position deviation data; planning the assembly adjustment path corresponding to the SSD to be assembled according to the position deviation data; and constructing the positioning and adjustment system corresponding to the SSD to be assembled based on the assembly adjustment path.

[0088] Among them, the current assembly link refers to a specific operation step or process stage being carried out at a certain moment in the continuous process of SSD assembly. For example, it is the stage where the main control chip has just completed chip mounting and is undergoing solder joint quality inspection, or the transition stage after the flash memory chip welding is completed and before the housing encapsulation is carried out, etc.; the information of the assembled components refers to the information covering the characteristics and mutual relationships of those components that have completed part of the assembly, including the physical positions of the installed components, such as the precise three-dimensional coordinates and rotation angles of the main control chip on the circuit board; the connection states of the components, such as the firmness of the chip pin welding and the tightness of the interface fit; and the relative layout between the components, such as the spacing and arrangement direction of different chips on the circuit board, etc.; the key positioning parameters refer to the core position limiting elements related to the assembly accuracy and performance of the SSD extracted for a specific current assembly link according to the pre-determined quantitative requirement relationship. Taking the flash memory chip welding link as an example, the key positioning parameters may include the maximum allowable displacement of the chip in the X, Y, and Z axis directions, the minimum safety distance from surrounding components such as capacitors and resistors, and the perpendicularity tolerance of the chip plane relative to the circuit board reference plane after welding, etc.; the position deviation data refers to the difference information that can quantitatively reflect the deviation of the actual assembly position from the ideal state obtained by carefully comparing the information of the assembled components with the corresponding key positioning parameters. For example, it is found through measurement that the actual position of a certain chip is 0.1 mm more than the requirement of the key positioning parameter in the X axis direction. This 0.1 mm and similar differences in other coordinate axes and angles are the position deviation data; the assembly adjustment path is a series of operation routes and step sequences planned based on the obtained position deviation data, taking into account factors such as the equipment conditions, operation space, and process feasibility at the assembly site to correct the position deviation of the components and bring the SSD assembly back on track.

[0089] Further, the recognition of the current assembly process and the information of the assembled components in the assembly state can be achieved through object detection algorithms, such as: YOLO, Faster R-CNN and other algorithms; the extraction of the key positioning parameters corresponding to the current assembly process can be achieved through a database management system, such as: MySQL, Oracle, etc.; the comparison of the information of the assembled components and the key positioning parameters can be achieved through data visualization tools, such as: Matplotlib, Tableau and other tools; the planning of the assembly adjustment path corresponding to the SSD to be assembled can be achieved through path planning algorithms, such as: A* algorithm, Dijkstra algorithm and other algorithms; the construction of the positioning adjustment system corresponding to the SSD to be assembled can be achieved through architecture design methods, such as: hierarchical architecture, microservices architecture and other methods.

[0090] S3. Based on the positioning adjustment system, determine the area to be positioned corresponding to the SSD during the assembly process, identify the area features corresponding to the area to be positioned, analyze the positioning improvement trend corresponding to the area to be positioned based on the area features, and construct the position information map corresponding to the SSD based on the positioning improvement trend.

[0091] Based on the positioning adjustment system of the present invention, the area to be positioned corresponding to the SSD during the assembly process is determined, and the area features corresponding to the area to be positioned are identified, which can focus resources on key parts, such as deploying high-precision equipment and professional manpower, and specifically guarantee the assembly accuracy of these sensitive areas, improve the overall quality, help to understand the component characteristics and assembly difficulties in advance, and optimize the process accordingly to improve efficiency.

[0092] Among them, the area to be positioned refers to a specific spatial range in the SSD assembly process that is judged according to the positioning adjustment system and has a key impact on the assembly accuracy and product performance and requires precise position control. For example, the welding area between the main control chip and the circuit board, a tiny position deviation can cause poor electrical connection and affect data transmission, and this area is the area to be positioned; the area feature refers to the unique property of the area to be positioned that is different from other areas. Physically, it includes the shape size, material hardness, surface roughness, etc. of the components. For example, in the area where the flash memory chip is located, the chip is thin and light, the pins are fine, and it is sensitive to static electricity. These are all its area features. Optionally, the determination of the area to be positioned corresponding to the SSD during the assembly process can be achieved through a fault tree analysis method, such as: if data reading errors occur frequently, after analysis, it can be found that it may be a connection problem between the main control chip and the flash memory chip, and then determine the main control chip welding area and the peripheral circuit connection area of the flash memory chip as the areas to be positioned; the identification of the area features corresponding to the area to be positioned can be achieved through finite element analysis tools, such as: ANSYS, ABAQUS and other tools.

[0093] Furthermore, based on the regional features, the present invention analyzes the positioning improvement trend corresponding to the area to be positioned, can accurately adapt to the process, and pertinently adjusts the positioning method and tools according to the physical and electrical characteristics of the area. For example, the visual positioning accuracy is optimized for the high-precision chip area to improve the assembly accuracy.

[0094] The positioning improvement trend refers to the trend of which direction should be adjusted and optimized in terms of positioning method, positioning tool, assembly process and quality control for the current area to be positioned after comprehensively considering various factors such as core characteristic indicators, reference of assembly cases, and analysis of working condition differences.

[0095] As an embodiment of the present invention, analyzing the positioning improvement trend corresponding to the area to be positioned based on the regional features includes: identifying the core characteristic indicators in the regional features; retrieving a preset assembly case library based on the core characteristic indicators to obtain assembly cases; extracting the positioning optimization strategies in the assembly cases; comparing the working condition differences between the area to be positioned and the corresponding area in the assembly cases based on the positioning optimization strategies; and analyzing the positioning improvement trend corresponding to the area to be positioned according to the working condition differences.

[0096] Among them, the core characteristic indicators are the characteristic parameters that are screened out from the regional characteristics possessed by the area to be located and play a key decisive role in the positioning accuracy, stability of this area and the performance of the final SSD product. For example, for the welding area of the SSD main control chip, its core characteristic indicators include the pitch accuracy of the chip pins, the fitting requirements between the pins and the circuit board pads, the thermal sensitivity of this area during the welding process, etc.; the preset assembly case library refers to a database that is pre-constructed and stores a large amount of information on past SSD assembly instances, covering the success and failure cases of various different models and batches of SSDs in different assembly links and different working conditions. Each case details a variety of data such as the details of the area to be located, the adopted assembly process, the equipment and tools used, and the quality feedback of the final product; the assembly case refers to the historical SSD assembly instance that is matched and screened from the preset assembly case library according to the identified core characteristic indicators and has similar characteristics to the current area to be located. For example, if the current area to be located is the flash chip pasting area of a new type of SSD, through the retrieval of core characteristic indicators (such as chip size, pasting accuracy requirements, characteristics of the surrounding circuit layout, etc.), the pasting assembly process record of this area of a previous similar SSD product is found, and this selected historical instance is the assembly case; the positioning optimization strategy refers to a series of methods, measures and corresponding operation processes implemented for a specific area to be located in the assembly case, which can effectively improve the positioning quality, overcome assembly problems and ensure product performance; the working condition difference refers to the differences found in multiple aspects by comparing the actual working conditions of the current area to be located with the conditions of the corresponding area in the past assembly extracted from the assembly case, specifically covering assembly environmental factors, such as changes in workshop temperature and humidity, and differences in electromagnetic interference intensity; there are also differences in the characteristics of the components themselves, for example, the material tolerance range of new batches of components is smaller and the surface roughness is different.

[0097] Further, the identification of the core characteristic indicators in the regional characteristics can be achieved through the principal component analysis algorithm. For example, through PCA analysis, it is found that the chip size and flatness are the main components, and they are taken as the core characteristic indicators; the extraction of the positioning optimization strategy in the assembly case can be achieved through the keyword extraction algorithm, such as algorithms like TF-IDF; the comparison of the working condition differences between the area to be located and the corresponding area in the assembly case can be achieved through the fishbone diagram analysis method. For example, the fishbone diagrams of the current area to be located and the corresponding area in the assembly case are respectively drawn, and the factors affecting the working conditions are divided into several categories such as personnel, equipment, materials, methods, and environment; the analysis of the positioning improvement trend corresponding to the area to be located can be achieved through simulation analysis tools, such as tools like Arena and Witness.

[0098] Based on the above-mentioned positioning improvement trend, the present invention constructs a position information map corresponding to the SSD, which can visually present the positioning dynamics of each region of the SSD, visualize complex improvement directions and requirements, facilitate engineers to quickly grasp the key positioning points, and improve decision-making efficiency.

[0099] Among them, the position information map refers to an information carrier that comprehensively displays the position panorama, associated details, and dynamic evolution trend of the key regions of the SSD by using graphical and digital tools to integrate trend positioning nodes, connection logics, and connection architectures.

[0100] As an embodiment of the present invention, constructing the position information map corresponding to the SSD based on the above-mentioned positioning improvement trend includes: determining the trend positioning nodes in the positioning improvement trend; querying the connection logics between the trend positioning nodes; analyzing the connection architectures corresponding to the connection logics; and constructing the position information map corresponding to the SSD based on the connection architectures.

[0101] Among them, the trend positioning nodes refer to the key position identification points that play a decisive role in improving the performance of the SSD product and optimizing the assembly accuracy under the guidance of the positioning improvement trend. For example, in order to reduce signal transmission delay, the precise solder joint position after re-planning the connection part between the pins of the main control chip and the circuit board pads; or the optimal fitting position of the heat dissipation module inside the SSD housing re-determined to enhance the heat dissipation efficiency. The connection logic refers to the internal law that represents the mutual association and transitional connection of each trend positioning node in different dimensions. From the physical assembly dimension, it is the sequential dependence relationship of components during assembly at each node. For example, the main control chip must be installed and fixed first to accurately position the cache chip with assembly accuracy requirements. At the electrical function level, it covers logics such as signal transmission paths and power distribution directions. The connection architecture refers to the abstract structural layout mode summarized according to the connection logic, depicting the overall organizational form of the trend positioning nodes and their connections. Common ones include the star architecture, with the main control chip as the core, and many storage, cache, and other nodes interacting with it are radially connected to ensure centralized data processing and distribution; the bus architecture, such as a data bus connecting multiple storage nodes with similar functions to achieve efficient parallel data reading and writing; and the hierarchical architecture, with the circuit board nodes responsible for basic support as the bottom layer, and the functional nodes such as chips carried are hierarchically arranged.

[0102] Further, the determination of the trend positioning nodes in the positioning improvement trend can be achieved through CAD tools, such as: AutoCAD, SolidWorks, etc.; the query of the connection logic between the trend positioning nodes can be achieved through graph theory algorithms, such as: Dijkstra algorithm, AI algorithm, etc.; the analysis of the connection architecture corresponding to the connection logic can be achieved through structural analysis methods, such as: function decomposition diagram, sequence diagram, etc.; the construction of the position information graph corresponding to the SSD can be achieved through data visualization tools, such as: Tableau, PowerBI, etc.

[0103] S4. Identify the key positioning points in the position information graph, analyze the historical positioning records corresponding to the key positioning points, identify the potential positioning problems in the historical positioning records, and calculate the position deviation rate of the SSD to be assembled during the assembly process based on the potential positioning problems.

[0104] By identifying the key positioning points in the position information graph, the present invention helps to optimize the assembly process. Workers can clarify the priority and sequence of assembly based on the key positioning points, avoid confusion, reduce assembly mistakes, and ensure the stable assembly and operation of the SSD.

[0105] Among them, the key positioning point refers to the core position point selected from the entire position information graph, which plays a crucial role in aspects such as the performance, assembly quality, and stable operation of the SSD. For example, the precise installation position of the main control chip, the connection points of key signal transmission lines, etc. all belong to key positioning points.

[0106] As an embodiment of the present invention, the identification of the key positioning points in the position information graph includes: extracting the position attribute points in the position information graph; performing an importance rating on the position attribute points to obtain the rated attribute points; calculating the attribute point weights corresponding to the rated attribute points; and identifying the key positioning points in the position information graph based on the attribute point weights.

[0107] Among them, the position attribute point refers to, in the position information map corresponding to the SSD, the set of various information contained in each node that reflects the characteristics related to its own position. This information covers the coordinate position and spatial orientation at the physical level, as well as the hierarchical relationship in the entire SSD assembly structure, and the associations in terms of function, electrical connection, mechanical fit, etc. with the components represented by the surrounding nodes. The rating attribute point refers to the result obtained by evaluating the importance of the position attribute point according to certain evaluation criteria and rules. By comprehensively considering factors such as the degree of influence of the area involved in the position attribute point on the performance of the SSD product, the key degree during the assembly process, and the severity of the impact on the overall function in case of a failure, an appropriate importance level is assigned to form the rating attribute point. The attribute point weight value refers to a value further quantified based on the rating attribute point, which presents the importance level represented by the rating attribute point in a mathematical way for subsequent comparison and screening operations. According to the pre-set weight calculation rules, different importance levels are mapped to specific numerical intervals. The higher the rating attribute point, the higher the numerical weight value is usually assigned, so that the importance of each position-related point can be intuitively reflected by the numerical size.

[0108] Further, the extraction of the position attribute points in the position information map can be achieved through graph traversal algorithms, such as DFS, BFS, etc. algorithms; the importance rating of the position attribute points can be achieved through the fuzzy comprehensive evaluation method, such as determining the evaluation factor set, such as factors related to the SSD including product function realization, reliability, cost control, etc.; establishing the evaluation grade set, such as dividing it into three importance levels: high, medium, and low, so as to obtain the rating attribute points; the calculation of the attribute point weight value corresponding to the rating attribute point can be achieved through the following calculation formula; the identification of the key positioning points in the position information map can be achieved through the centrality algorithm, such as finding that the key connection nodes of the flash chip play a key hub role in the data transmission path through the centrality algorithm and identifying them as key positioning points.

[0109] As an embodiment of the present invention, the calculation of the attribute point weight value corresponding to the rating attribute point includes:

[0110] Calculate the attribute point weight value corresponding to the rating attribute point using the following formula:

[0111]

[0112] Among them, WP represents the attribute point weight value corresponding to the rating attribute point, m represents the number of types of influence factor types corresponding to the rating attribute point, j represents the quantity index corresponding to the influence factor type, a j represents the weight coefficient of the j-th type of influence factor type, qj represents the evaluation score of the jth type of influencing factor, and B represents the score difference between the current importance score and the average importance score of the rating attribute point.

[0113] Specifically, the attribute point weight refers to a value further quantified based on the rating attribute point, which presents the importance level represented by the rating attribute point in a mathematical way for subsequent operations such as comparison and screening; the influencing factor type refers to the classification of various factors that can affect the importance of the rating attribute point. For example, when evaluating the rating attribute point of a product component, the influencing factor types may include different aspects such as performance indicators, reliability indicators, cost factors, and market demand; the weight coefficient refers to the quantified value of the importance degree assigned to each type of influencing factor, which reflects the relative importance of different influencing factor types in the comprehensive evaluation of the rating attribute point; the evaluation score refers to the quantified score of the influence degree of each type of influencing factor on the rating attribute point according to specific evaluation criteria and methods. For example, for the influencing factor type of performance indicators, if it is found through testing that the rating attribute point performs excellently in terms of performance, then its corresponding evaluation score will be higher; the score difference refers to the difference between the current importance score and the average importance score of the rating attribute point. The current importance score refers to the importance score obtained by the rating attribute point in the current evaluation environment, and the average importance score refers to the average value of the importance scores of all relevant rating attribute points.

[0114] By analyzing the historical positioning records corresponding to the key positioning points, the present invention can identify potential positioning problems in the historical positioning records, trace past positioning mistakes, understand the deviations that occurred at the key positioning points through the analysis of historical data, which helps to optimize the positioning strategy. After discovering potential problems, the method can be adjusted accordingly to improve the accuracy of subsequent positioning.

[0115] Among them, the historical positioning record refers to a record of a series of positioning operations and their results performed on key positioning points in the past operation process, which includes but is not limited to the time of each positioning, the positioning method adopted, the positioning coordinates obtained, the environmental conditions during positioning, and the operating status at the time; the potential positioning problem refers to factors hidden in the historical positioning record that may cause inaccurate or unreliable positioning, which may include the limitations of the positioning method, the interference of environmental factors on positioning, positioning deviations caused by equipment aging, irregular links in the operating process, etc. Optionally, the analysis of the historical positioning records corresponding to the key positioning points can be achieved through statistical analysis tools, such as: R, Python and other tools; the identification of potential positioning problems in the historical positioning records can be achieved through outlier detection algorithms, such as: isolation forest algorithm, Z-score and other algorithms.

[0116] Furthermore, based on the potential positioning problem, the present invention calculates the position deviation rate of the SSD to be assembled during the assembly process, so as to estimate the assembly risk in advance. By calculating the deviation rate through analysis of the potential positioning problem, possible assembly defects can be known in advance, which is helpful to optimize the assembly process. According to the deviation rate data, the assembly steps or tools can be adjusted in a targeted manner to improve the assembly accuracy.

[0117] The position deviation rate refers to a quantitative indicator of the degree to which the position of the SSD to be assembled deviates from the ideal position due to potential positioning problems and external influencing factors during the assembly process.

[0118] As an embodiment of the present invention, the calculating the position deviation rate of the SSD to be assembled during the assembly process based on the potential positioning problem includes:

[0119] The position deviation rate of the SSD to be assembled during the assembly process is calculated using the following formula:

[0120]

[0121] Wherein, PD represents the position deviation rate of the SSD to be assembled during the assembly process, n represents the number of types of the potential positioning problems, k represents the number index of the potential positioning problems, and γ k Denotes the problem weight coefficient of the kth potential positioning problem, D k (t) represents the deviation function of the kth potential positioning problem with the assembly time t, O represents the number of external influencing factors, l represents the number index of external influencing factors, δ l represents the factor weight coefficient of the lth external influencing factor, E l It represents the quantitative value of the position deviation caused by the lth external influencing factor.

[0122] Specifically, the problem weight coefficient refers to a quantitative value representing the degree of importance assigned to each potential positioning problem type, which reflects the relative importance of different potential positioning problem types when comprehensively evaluating the position deviation rate; the deviation change function refers to the variation law of the position deviation of the k-th potential positioning problem type with the assembly time; the external influencing factors refer to the factors from the external environment or other relevant conditions during the assembly process of the SSD to be assembled, which will affect the assembly position of the SSD. For example, temperature, humidity, the accuracy of the assembly equipment, the technical level of the operator, etc. all belong to the external influencing factors; the factor weight coefficient refers to a quantitative value representing the degree of importance assigned to each external influencing factor, which reflects the relative importance of different external influencing factors when comprehensively evaluating the position deviation rate; the quantitative value refers to a quantitative representation of the specific influence degree of the first external influencing factor on the position deviation, which is a value obtained by quantifying according to the actual situation of the external influencing factor and the influence magnitude on the assembly position deviation.

[0123] S5. Based on the position deviation rate, perform a fitting process between a preset positioning detection module and the SSD to be assembled to obtain an assembled SSD. Analyze the working environment corresponding to the assembled SSD. Based on the working environment, monitor in real time the positioning state parameters corresponding to the assembled SSD. Based on the positioning state parameters, generate a position positioning scheme corresponding to the SSD to be assembled.

[0124] Based on the position deviation rate, the present invention performs a fitting process between a preset positioning detection module and the SSD to be assembled to obtain an assembled SSD, which can improve the assembly accuracy. By considering the position deviation rate, it can ensure the precise fitting of the positioning detection module and the SSD, reduce performance problems caused by improper assembly, guarantee the product quality, and the precise fitting can make the SSD more stable and reliable during operation and reduce the failure rate.

[0125] Among them, the preset positioning detection module refers to a component specifically designed to assist and ensure the accurate positioning of the SSD during the assembly process. Its purpose is to accurately detect and adjust the position of the SSD through its own functions during assembly to ensure that the SSD can be accurately installed according to the design requirements; the assembled SSD refers to the finished product obtained after the SSD to be assembled is fitted with the preset positioning detection module. In this process, the positioning detection module is used to handle the position deviation problem of the SSD to be assembled, so that the SSD can be accurately installed on the corresponding carrier (such as a circuit board, a storage device housing, etc.), and finally form a solid-state storage device that can work normally, has stable performance and meets the design specifications. Optionally, the fitting process of the preset positioning detection module and the SSD to be assembled can be realized through a vision positioning system. For example, images of the SSD to be assembled and the positioning detection module are taken by a camera, and the position and posture of the two are analyzed using image processing algorithms, and then accurate fitting is carried out.

[0126] Furthermore, by analyzing the working environment corresponding to the assembled SSD, the present invention can discover potential risks in advance. For example, environmental factors such as temperature and humidity can affect the performance of the SSD, so corresponding measures can be taken in advance, which helps to optimize the design of the SSD, adjust the heat dissipation, protection and other functional designs of the SSD according to the characteristics of the working environment, and improve the product adaptability.

[0127] Among them, the working environment refers to the sum of various surrounding conditions when the assembled SSD is actually running and in use, including but not limited to physical factors such as temperature range (the change interval from low temperature to high temperature), humidity level (the degree from dry to humid), air pressure conditions (pressure conditions at different altitudes); electromagnetic environment such as the intensity of the electromagnetic field, frequency range and interference source situation existing around; mechanical environment such as the vibration amplitude, frequency generated during equipment operation, and the impact force that can be received; chemical environment such as the concentration of harmful gases and acidity in the air; and the layout of the working space, heat dissipation conditions, dust particle concentration, etc. Optionally, the analysis of the working environment corresponding to the assembled SSD can be realized through data analysis algorithms, such as clustering analysis algorithms, time series analysis algorithms, etc.

[0128] Furthermore, based on the working environment, the present invention can monitor the positioning status parameters corresponding to the assembled SSD in real time, which can ensure the accuracy of data reading and writing. In a complex and changeable working environment, such as an area with frequent vibrations or abnormal temperature and humidity, the positioning deviation of the SSD can be detected in time to avoid data reading and writing errors caused by inaccurate positioning.

[0129] Among them, the positioning status parameter refers to a series of quantitative indicators used to describe the position status of the assembled SSD in the working environment, including spatial position parameters, such as the coordinate position of the SSD in three-dimensional space (x, y, and z-axis coordinates), which are used to determine whether the SSD has undergone translation relative to the installation reference position; attitude angle parameters, such as pitch angle, roll angle, and yaw angle, which can reflect whether the SSD has undergone attitude changes such as tilting and rotation; displacement change rate parameters, which are used to measure the speed of position change of the SSD. For example, when subjected to vibration or external impact, the displacement change rate can be used to timely understand its dynamic position change. Optionally, the real-time monitoring of the positioning status parameters corresponding to the assembled SSD can be achieved through data fusion algorithms, such as: Kalman Filter, EKF and other algorithms.

[0130] Furthermore, based on the positioning status parameters, the present invention generates a position positioning scheme for the SSD to be assembled, which can improve the assembly accuracy. According to the parameters obtained by real-time monitoring, the initial installation position and attitude of the SSD in the device are accurately planned to avoid the risk of subsequent data loss or read / write errors.

[0131] Among them, the position positioning scheme refers to a detailed plan for the SSD to be assembled, covering multiple key elements. It clarifies the specific physical position of the SSD in the target device or system architecture, including the precise coordinate values in three-dimensional space (such as x, y, and z coordinates with reference to a certain reference point), determines its installation orientation layout. At the same time, the scheme details the installation attitude of the SSD, that is, angle parameters such as pitch angle, roll angle, and yaw angle, to ensure its best adaptation state with surrounding components during operation. It also involves the fixing method, such as the specific specifications, quantity, and tightening torque of using screws for fastening, or other fixing means such as using clips and adhesives to ensure the SSD is firmly installed. In addition, according to the positioning status parameters, it will also include suggestions for adjusting the installation environment, such as adding shock pads to cope with the vibration environment and arranging heat sinks to improve the thermal environment. Optionally, the generation of the position positioning scheme corresponding to the SSD to be assembled can be achieved through scheme generation tools, such as: Trello, SolidWorks and other tools.

[0132] Compared with the problems described in the background art, the present invention can assist in adjusting the assembly process by obtaining the basic parameters of the SSD to be assembled and the assembly environment information, such as temperature, humidity, and electrostatic environment data, and can guide the adoption of corresponding protection measures to ensure the assembly quality. The combination of the two provides a solid data foundation for the subsequent position detection and positioning system construction, making the entire SSD assembly process more systematic. By mining the regional positioning requirements under the position change mode, the present invention can accurately focus on the key areas where position deviation is likely to occur during SSD assembly, and allocate resources in advance, such as arranging more experienced workers or equipment with higher precision, to ensure the assembly quality of these sensitive areas, thereby making the entire assembly process smoother and more efficient. Further, based on the positioning adjustment system, the present invention determines the area to be positioned corresponding to the SSD assembly process and identifies the regional characteristics corresponding to the area to be positioned, which can focus resources on key parts, such as deploying high-precision equipment and professional manpower, to specifically ensure the assembly accuracy of these sensitive areas and improve the overall quality. It helps to understand the component characteristics and assembly difficulties in advance, optimize the process accordingly, and improve the efficiency. Further, by identifying the key positioning points in the position information map, the present invention helps to optimize the assembly process. Workers can clarify the priority and sequence of assembly based on the key positioning points, avoid confusion, reduce assembly errors, and ensure the stable assembly and operation of the SSD. Finally, based on the position deviation rate, the present invention performs a fitting process on the preset positioning detection module and the SSD to be assembled to obtain the assembled SSD, which can improve the assembly accuracy. By considering the position deviation rate, it can ensure the precise fitting of the positioning detection module and the SSD, reduce performance problems caused by improper assembly, and ensure the product quality. Precise fitting can make the SSD more stable and reliable during operation and reduce the failure rate. Therefore, the position positioning method and system applied to SSD assembly provided by the embodiments of the present invention can improve the rapid positioning of components during the SSD assembly process.

[0133] Embodiment 2:

[0134] As Figure 2 shown, it is a functional module diagram of a position positioning system applied to SSD assembly according to the present invention.

[0135] The position positioning system 200 applied to SSD assembly according to the present invention can be installed in an electronic device. According to the functions achieved, the position positioning system applied to SSD assembly can include a mode analysis module 201, a system construction module 202, a map construction module 203, a deviation rate calculation module 204, and a solution generation module 205. The modules of the present invention can also be referred to as units, which refer to a series of computer program segments that can be executed by the processor of an electronic device and can complete fixed functions, and are stored in the memory of the electronic device.

[0136] In the embodiments of the present invention, the functions of each module / unit are as follows:

[0137] The pattern analysis module 201 is configured to obtain the basic parameters and assembly environment information of the SSD to be assembled, perform position detection on the SSD to be assembled based on the basic parameters and assembly environment information to obtain position detection data, and analyze the position change pattern of the SSD to be assembled during the assembly process based on the position detection data;

[0138] The system construction module 202 is configured to mine the regional positioning requirements under the position change pattern, analyze the quantitative requirement relationship corresponding to the regional positioning requirements, and construct a positioning adjustment system corresponding to the SSD to be assembled by combining the quantitative requirement relationship with the assembly state of the SSD to be assembled;

[0139] The map construction module 203 is configured to determine the area to be positioned corresponding to the SSD during the assembly process based on the positioning adjustment system, identify the area features corresponding to the area to be positioned, analyze the positioning improvement trend corresponding to the area to be positioned based on the area features, and construct a position information map corresponding to the SSD based on the positioning improvement trend;

[0140] The deviation rate calculation module 204 is configured to identify the key positioning points in the position information map, analyze the historical positioning records corresponding to the key positioning points, identify the potential positioning problems in the historical positioning records, and calculate the position deviation rate of the SSD to be assembled during the assembly process based on the potential positioning problems;

[0141] The solution generation module 205 is configured to perform a fitting process on a preset positioning detection module and the SSD to be assembled based on the position deviation rate to obtain an assembled SSD, analyze the working environment corresponding to the assembled SSD, monitor the positioning state parameters corresponding to the assembled SSD in real time based on the working environment, and generate a position positioning solution corresponding to the SSD to be assembled based on the positioning state parameters.

[0142] Specifically, each module in the position positioning system 200 applied to SSD assembly in the embodiments of the present invention adopts the same technical means as those in the Figure 1 position positioning method applied to SSD assembly described above, and can produce the same technical effects, which will not be elaborated here.

[0143] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention.

[0144] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A method for positioning a position in SSD assembly, characterized in that: The method comprises: Obtaining basic parameters and assembly environment information of the SSD to be assembled, performing position detection on the SSD to be assembled based on the basic parameters and assembly environment information to obtain position detection data, and analyzing a position change pattern of the SSD to be assembled during the assembly process based on the position detection data; Mining the regional positioning requirements under the position change mode, analyzing the quantitative demand relationship corresponding to the regional positioning requirements, combining the quantitative demand relationship with the assembly state of the SSD to be assembled, and constructing a positioning adjustment system corresponding to the SSD to be assembled; Based on the positioning adjustment system, determine the corresponding area to be positioned in the SSD assembly process, identify the regional features corresponding to the area to be positioned, analyze the positioning improvement trend corresponding to the area to be positioned based on the regional features, and construct a position information map corresponding to the SSD based on the positioning improvement trend; Identify key positioning points in the position information map, analyze historical positioning records corresponding to the key positioning points, identify potential positioning problems in the historical positioning records, and calculate the position deviation rate of the SSD to be assembled during the assembly process based on the potential positioning problems; Based on the position deviation rate, the preset positioning detection module is assembled with the SSD to obtain the assembled SSD, and the working environment corresponding to the assembled SSD is analyzed. Based on the working environment, the positioning state parameters corresponding to the assembled SSD are monitored in real time. Based on the positioning state parameters, a position positioning solution corresponding to the SSD to be assembled is generated.

2. The method for positioning a position in SSD assembly as claimed in claim 1, characterized in that: The analyzing, based on the position detection data, a position change pattern of the SSD to be assembled during the assembly process includes: Determine the zero assembly components corresponding to the SSD to be assembled; Based on the position detection data, identifying the initial coordinate information corresponding to the zero assembly component; Based on the initial coordinate information, tracking the component assembly process corresponding to the zero assembly component; Analyze the real-time displacement of components in the component assembly process; Based on the real-time displacement situation, the position change pattern of the SSD to be assembled during the assembly process is analyzed.

3. The method for positioning a position in SSD assembly as claimed in claim 1, characterized in that: The mining of the regional positioning requirements under the position change mode includes: identifying frequent displacement regions in the position change pattern; Extracting component features corresponding to components in the frequent displacement area; Based on the component characteristics, determining the regional sensitivity corresponding to the frequent displacement area; Analyzing the functional relevance in the frequently displaced regions based on the regional sensitivity; Based on the functional association, regional positioning requirements in the position change pattern are mined.

4. The method for positioning a position in SSD assembly as claimed in claim 1, characterized in that: The step of combining the quantitative demand relationship with the assembly state of the SSD to be assembled to construct a positioning adjustment system corresponding to the SSD to be assembled includes: Identify the current assembly link and assembled component information in the assembly state; Based on the quantitative demand relationship, extract key positioning parameters corresponding to the current assembly link; Comparing the assembled component information with key positioning parameters to obtain position deviation data; Planning an assembly adjustment path corresponding to the SSD to be assembled according to the position deviation data; Based on the assembly adjustment path, a positioning adjustment system corresponding to the SSD to be assembled is constructed.

5. The method for positioning a position in SSD assembly as claimed in claim 1, characterized in that: The analyzing the positioning improvement trend corresponding to the area to be positioned based on the area characteristics includes: Identify the core characteristic indicators in the characteristics of the region; Based on the core characteristic index, a preset assembly case library is retrieved to obtain an assembly case; Extracting a positioning optimization strategy in the assembly case; Based on the positioning optimization strategy, comparing the working condition difference between the area to be positioned and the corresponding area in the assembly case; According to the working condition differences, the positioning improvement trend corresponding to the area to be positioned is analyzed.

6. The method for positioning a position in SSD assembly as claimed in claim 1, characterized in that: The constructing a location information map corresponding to the SSD based on the positioning improvement trend includes: Determining a trend positioning node in the positioning improvement trend; Query the connection logic between the trend positioning nodes; Analyzing the connection architecture corresponding to the connection logic; Based on the connection architecture, a location information map corresponding to the SSD is constructed.

7. The method for positioning a position in SSD assembly as claimed in claim 1, characterized in that: The identifying key positioning points in the location information map includes: Extracting location attribute points in the location information map; Rating the importance of the location attribute points to obtain rating attribute points; Calculating the attribute point weight corresponding to the rating attribute point; Based on the attribute point weights, key positioning points in the location information map are identified.

8. The method for positioning a position in SSD assembly as claimed in claim 1, characterized in that: The calculating the attribute point weight corresponding to the rating attribute point includes: The attribute point weight corresponding to the rating attribute point is calculated using the following formula: Among them, WP represents the attribute point weight corresponding to the rating attribute point, m represents the number of types of influencing factors corresponding to the rating attribute point, j represents the number index corresponding to the influencing factor type, a j represents the weight coefficient of the jth influencing factor type, q j represents the evaluation score of the jth type of influencing factor, and B represents the score difference between the current importance score of the rating attribute point and the average importance score.

9. The method for positioning a position in SSD assembly as claimed in claim 1, characterized in that: The calculating, based on the potential positioning problem, the position deviation rate of the SSD to be assembled during the assembly process includes: The position deviation rate of the SSD to be assembled during the assembly process is calculated using the following formula: Wherein, PD represents the position deviation rate of the SSD to be assembled during the assembly process, n represents the number of types of the potential positioning problems, k represents the number index of the potential positioning problems, and γ k Denotes the problem weight coefficient of the kth potential positioning problem, D k (t) represents the deviation function of the kth potential positioning problem with the assembly time t, O represents the number of external influencing factors, l represents the number index of external influencing factors, δ l represents the factor weight coefficient of the lth external influencing factor, E l It represents the quantitative value of the position deviation caused by the lth external influencing factor.

10. A positioning system for SSD assembly, characterized in that: The system comprises: A pattern analysis module, used to obtain basic parameters and assembly environment information of the SSD to be assembled, perform position detection on the SSD to be assembled based on the basic parameters and assembly environment information to obtain position detection data, and analyze the position change pattern of the SSD to be assembled during the assembly process based on the position detection data; A system construction module, used to mine the regional positioning requirements under the position change mode, analyze the quantitative demand relationship corresponding to the regional positioning requirements, combine the quantitative demand relationship with the assembly state of the SSD to be assembled, and construct a positioning adjustment system corresponding to the SSD to be assembled; A map construction module is used to determine the corresponding area to be positioned in the SSD assembly process based on the positioning adjustment system, and identify the regional features corresponding to the area to be positioned, analyze the positioning improvement trend corresponding to the area to be positioned based on the regional features, and construct a position information map corresponding to the SSD based on the positioning improvement trend; A deviation rate calculation module, used to identify key positioning points in the position information map, analyze historical positioning records corresponding to the key positioning points, identify potential positioning problems in the historical positioning records, and calculate the position deviation rate of the SSD to be assembled during the assembly process based on the potential positioning problems; A solution generation module is used to assemble the preset positioning detection module and the SSD to be assembled based on the position deviation rate to obtain an assembled SSD, analyze the working environment corresponding to the assembled SSD, monitor the positioning state parameters corresponding to the assembled SSD in real time based on the working environment, and generate a position positioning solution corresponding to the SSD to be assembled based on the positioning state parameters.

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