Wafer clamping force adjustment system, wafer clamping mechanism, wafer processing machine and wafer clamping control method

Abstract

The embodiments of the present application relate to the field of wafer transport technology and provide a wafer clamping force adjustment system, a wafer clamping mechanism, a wafer processing machine, and a wafer clamping control method. In the embodiments of the present application, during the wafer clamping process, a larger force is first applied to the wafer. When the wafer moves to a preset position, a smaller force is applied to the wafer until the wafer is transported to abut against a front end stop, thereby preventing the wafer from contacting the front end stop with excessive force, which may cause the wafer to break.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of wafer transfer technology, and in particular to a wafer clamping force adjustment system, a wafer clamping mechanism, a wafer processing machine, and a wafer clamping control method. Background Art

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form a cylindrical single crystal. The silicon ingot is then ground, polished, and sliced to form a silicon wafer, also known as a wafer. In semiconductor technology, wafers undergo a series of processing steps to produce integrated circuit devices such as chips and driver circuits.

[0003] Wafer transfer is the core link in semiconductor manufacturing. During the semiconductor manufacturing process, wafers need to be transferred from the wafer boat to the process chamber. Generally, they need to undergo multiple transfers, such as from the wafer boat to the transfer chamber, and from the transfer chamber to the process chamber. After the process is completed, they are returned to the wafer boat.

[0004] However, in many manufacturing processes, such as debonding, wafer handling speed is the primary factor limiting machine throughput. While the robot's end-arm uses a clamping mechanism to ensure highly reliable and safe wafer handling, the clamping force cannot be adjusted. The high clamping force during wafer transfer and capture can easily lead to wafer breakage and potentially downtime during wafer transfer.

[0005] Therefore, the art urgently needs a wafer clamping force adjustment system, a wafer clamping mechanism, a wafer processing machine and a wafer clamping control method to solve the above technical problems. Summary of the Invention

[0006] In order to solve or at least partially solve the above-mentioned technical problems, the embodiments of the present application first provide a wafer clamping force adjustment system, which can adjust the clamping force applied to the wafer by the wafer clamping mechanism during the wafer clamping process, so as to ensure the safety of the wafer transfer (handling) process, reduce the risk of wafer transfer downtime, and reduce the risk of wafer breakage.

[0007] The embodiments of the present application also provide a wafer clamping mechanism, a wafer processing machine, and a wafer clamping control method.

[0008] In order to solve the above technical problems, the embodiments of the present application provide the following technical solutions:

[0009] In a first aspect, an embodiment of the present application provides a wafer clamping force adjustment system for adjusting the clamping force applied to a wafer, the wafer clamping force adjustment system comprising:

[0010] A cylinder, wherein the output shaft of the cylinder is drivingly connected to the wafer clamping mechanism, the cylinder has a cavity inside, a piston is provided at the rear end of the cylinder, and a first air vent and a second air vent are provided along the direction of the movement path of the output shaft of the cylinder, respectively, and the piston slides between the first air vent and the second air vent;

[0011] a first solenoid valve, wherein the air outlet of the first solenoid valve is connected to the first air vent, and the air inlet of the first solenoid valve is connected to the air source;

[0012] a second solenoid valve, wherein the vent outlet of the second solenoid valve is connected to the second vent;

[0013] A third solenoid valve, wherein the air outlet of the third solenoid valve is connected to the air inlet of the second solenoid valve, the exhaust hole of the third solenoid valve is connected to the pressure reducing valve, and the air inlet of the third solenoid valve is connected to the air source.

[0014] In one embodiment of the first aspect, a through hole is formed on the output shaft of the cylinder, and the wafer clamping force adjustment system further includes:

[0015] a central control unit, the central control unit being electrically connected to the first solenoid valve, the second solenoid valve, and the third solenoid valve;

[0016] An optical sensor is electrically connected to the central control unit and is arranged on the moving path of the output shaft of the cylinder to detect a position signal of the output shaft of the cylinder and feed the position signal back to the central control unit.

[0017] In a second aspect, an embodiment of the present application provides a wafer clamping mechanism, comprising the wafer clamping force adjustment system described above, and comprising:

[0018] A wafer fixing mechanism for placing the wafer;

[0019] a propulsion mechanism, spaced apart from the wafer fixing mechanism, wherein the propulsion mechanism can move relatively close to or away from the wafer fixing mechanism on a movement path of the propulsion mechanism to fix or release the wafer between the wafer fixing mechanism and the propulsion mechanism;

[0020] The output shaft of the cylinder is connected to the propulsion mechanism, and the wafer clamping force adjustment system is configured to change the propulsion force of the propulsion mechanism when the propulsion mechanism approaches or moves away from the wafer fixing mechanism.

[0021] In one embodiment of the second aspect, the wafer fixing mechanism includes:

[0022] base plate;

[0023] A front end stopper is provided along the front end edge of the base plate, and the propulsion mechanism gradually moves the front end stopper toward the wafer to make the front end of the wafer contact the front end stopper.

[0024] In one embodiment of the second aspect, the front end stopper is hinged to the base plate, and the wafer clamping mechanism further includes:

[0025] a buffer spring, the two ends of which are respectively connected to the end of the front end stopper away from the propulsion mechanism and the bottom plate;

[0026] When the front end stopper contacts the wafer, the thrust of the propulsion mechanism is transmitted to the buffer spring.

[0027] In one embodiment of the second aspect, on the moving path of the output shaft of the cylinder, the front end stopper has at least two protrusions that are symmetrical and spaced apart about the central axis of the base plate, and the end surface of the protrusion facing the propulsion mechanism is arc-shaped.

[0028] In one embodiment of the second aspect, a plurality of bosses are provided on the bottom plate, the bottom ends of the bosses are embedded in the bottom plate, the top ends of the bosses at least partially protrude outside the bottom plate, and the plurality of bosses are distributed in a point-like manner on the surface of the bottom plate.

[0029] In one embodiment of the second aspect, the propulsion mechanism includes:

[0030] A cylinder fork, the cylinder fork being drivingly connected to the wafer clamping force adjustment system;

[0031] The roller module is arranged at the end of the cylinder fork away from the wafer clamping force adjustment system. The end of the roller module facing the wafer has an arc surface to adapt to the edge of the wafer.

[0032] In one embodiment of the second aspect, the roller module includes:

[0033] A mounting bracket is provided at an end of the cylinder fork away from the wafer clamping force adjustment system;

[0034] Two groups of rollers are on the moving path of the output shaft of the cylinder. The two groups of rollers are symmetrical about the central axis of the wafer fixing mechanism and are movably arranged on the mounting bracket.

[0035] In a third aspect, an embodiment of the present application provides a wafer processing machine, comprising the wafer clamping mechanism described above, including: a machine; the machine is provided with a wafer fixing mechanism, a propulsion mechanism, and a wafer clamping force adjustment system.

[0036] In a fourth aspect, an embodiment of the present application provides a wafer clamping control method, which uses the wafer clamping mechanism described above to clamp and control the wafer, comprising:

[0037] Acquiring a first position signal of a wafer to be processed by using an optical sensor;

[0038] Based on the first position signal, the propulsion mechanism is activated, and the wafer clamping force adjustment system is used to control the propulsion mechanism to move the wafer from the initial position toward the wafer fixing mechanism with a first load;

[0039] When the propulsion mechanism moves to a preset position, a second position signal is obtained, and the wafer clamping force adjustment system is started based on the second position signal to control the propulsion mechanism to move the wafer from the preset position toward the wafer fixing mechanism with a second load, wherein the first load is greater than the second load.

[0040] Compared with the prior art, the embodiments of the present application have the following beneficial effects.

[0041] The implementation method of the embodiment of the present application includes a wafer clamping force adjustment system. During the process of clamping the wafer, a larger force is first applied to the wafer. When the wafer moves to a preset position, a smaller force is applied to the wafer until the wafer is transported to abut against the front end stop, thereby avoiding excessive force between the wafer and the front end stop, which may cause wafer breakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] To more clearly illustrate the implementation of the embodiments of the present application, the following briefly introduces the relevant drawings. It should be understood that the drawings described below are only used to illustrate some implementations of the embodiments of the present application, and those skilled in the art can also obtain many other technical features and connection relationships not mentioned herein based on these drawings.

[0043] Figure 1 A schematic structural diagram of a transfer device provided in an embodiment of the present application;

[0044] Figure 2 A schematic diagram of a wafer clamping force adjustment system provided in an embodiment of the present application;

[0045] Figure 3 A schematic diagram of a wafer clamping mechanism provided in an embodiment of the present application;

[0046] Figure 4 A schematic structural diagram of a front end stopper provided in an embodiment of the present application;

[0047] Figure 5 A schematic diagram of a structure in which a boss contacts a wafer provided in an embodiment of the present application;

[0048] Figure 6 This is a flow chart of a wafer clamping control method provided in an embodiment of the present application.

[0049] Meaning of reference numerals:

[0050] 1. Front end stopper; 2. Boss; 3. Wafer; 4. Bottom plate; 41. Buffer spring; 5. Roller; 6. Optical sensor; 7. Cylinder; 71. Output shaft; 72. Piston; 81. First solenoid valve; 82. Second solenoid valve; 83. Third solenoid valve; 201. Machine; 202. Robot; 300. Wafer clamping mechanism; 10. Wafer fixing mechanism; 20. Propulsion mechanism; 30. Wafer clamping force adjustment system; 40. Through hole; M1. First air vent; M2. Second air vent. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of them. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the embodiments of this application.

[0052] The following will be combined with the appended examples of the present application Figures 1-6 , the technical solutions in the embodiments of this application are described in detail.

[0053] In the semiconductor manufacturing sector, process innovations have led to the extensive application of intelligent material handling systems (AMHS). The core value of this system lies in building a complete wafer 3 flow network, organically integrating complex production equipment into modular production clusters, and achieving precise scheduling and automated transportation of wafer 3 products throughout the processing flow.

[0054] The intelligent production platform architecture comprises three core elements: a cluster of process modules, an intelligent transport network, and a temporary storage coordination system. Each process module is essentially a collection of equipment for a specific process stage, responsible for completing the key steps in the transformation of wafers from substrate to finished product. Notably, these modules are divided according to semiconductor device manufacturing requirements, breaking down the complete process flow into specialized processing stages through process decomposition.

[0055] In terms of specific process implementation, wafer 3 production undergoes dozens of precision steps, including but not limited to surface finishing, chemical etching, ion doping, thin film deposition, and other key technical links. Each process module is physically connected via an intelligent transport network, forming a complete production chain. This transport network has a dual transport function: standard containers are used for transport between modules, and individual wafer 3 processing is performed within the module. This design ensures both batch processing efficiency and the stringent cleanliness requirements of precision machining.

[0056] The use of standardized carriers is a key feature of intelligent production. Front-opening unpacking units (FOUPs) are used as wafer carriers. Their internal design complies with SEMI standards and features a precision slot structure, safely accommodating 25 wafers. Carriers are color-coded to distinguish between different process stages, a visual management method that effectively reduces the risk of material mix-ups. The intelligent conveying network, equipped with automated robotic arms and intelligent conveyor tracks, enables precise transfer of carriers between process modules.

[0057] To coordinate the production pace of each process module, the system utilizes automated storage depots as buffer hubs. These three-dimensional storage systems are equipped with intelligent scheduling algorithms that dynamically adjust the supply of wafer carriers based on real-time production data. Each depot features dual-channel interfaces: a material channel for cross-module carrier scheduling and a process channel for connecting to specific production equipment. This dual-channel design ensures seamless integration between the logistics and production systems.

[0058] At the device interaction level, the system is equipped with a precision wafer retrieval device. This device integrates a visual positioning system and a robot 202, capable of extracting carriers from the storage and accurately sorting individual wafers 3 onto the process stage. This design allows each process module to maintain independent operation while achieving collaborative production through a central control system. Of particular note is the intelligent conveying network's distributed control architecture, enabling each conveying node to make autonomous decisions, significantly improving the stability and flexibility of system operations.

[0059] This intelligent production system achieves a leap in manufacturing efficiency through three innovative designs: modular process clusters optimize equipment layout, an intelligent logistics network shortens material turnover, and a dynamic buffer mechanism balances capacity differences between processes. These technological innovations collectively establish an efficient production paradigm for modern semiconductor manufacturing and provide critical technical support for the industry's transition to intelligent manufacturing.

[0060] In the above system, one of the most important production links is the transfer of wafer 3. Figure 1 The robot 202 is explained as an example. Figure 1In the transfer equipment shown, the machine 201 serves as a working scene. The machine 201 is equipped with a dual-station robot 202. The robot 202 is equipped with a clamp or adsorption device adapted to the wafer box. The robot 202 extends into the wafer box and, according to instructions, clamps or adsorbs the wafer 3 to be processed in the wafer box to the end of the robot 202, and transfers it to the wafer clamping mechanism described in this article through a multi-axis freedom robot arm.

[0061] In one embodiment, Figure 2 、 Figure 3 As shown, the embodiment of the present application provides a specific wafer clamping force adjustment system 30 for adjusting the clamping force applied by the wafer clamping mechanism 300 to the wafer 3, the wafer clamping force adjustment system 30 comprises: a cylinder 7, the output shaft 71 of the cylinder 7 is in transmission connection with the wafer clamping mechanism 300, the cylinder 7 has a cavity (not marked in the figure) inside, a piston 72 is provided at the tail end of the cylinder 7, and a first vent M1 and a second vent M2 connected to the cavity are respectively provided on the moving path of the output shaft 71 of the cylinder 7, the piston 72 is in the first vent M1 and the second vent M2 connected to the cavity are respectively provided, and the piston 72 is in the first vent M1 and the second vent M2 connected to the cavity are respectively provided. Slide between the air vent M1 and the second air vent M2; the first solenoid valve 81, the air outlet of the first solenoid valve 81 is connected to the first air vent M1, and the air inlet of the first solenoid valve 81 is connected to the air source; the second solenoid valve 82, the air outlet of the second solenoid valve 82 is connected to the second air vent M2; the third solenoid valve 83, the air outlet of the third solenoid valve 83 is connected to the air inlet of the second solenoid valve 82, the exhaust hole of the third solenoid valve 83 is connected to the pressure reducing valve (not marked in the figure), and the air inlet of the third solenoid valve 83 is connected to the air source.

[0062] In this embodiment, to improve the accuracy of the wafer clamping force adjustment system 30 controlling the propulsion mechanism 20, the wafer clamping force adjustment system 30 can use a cylinder 7 as an output power source. For example, a cylinder 7 is provided, wherein a piston 72 is movably disposed within a cavity within the cylinder 7. The piston 72 is connected to the propulsion mechanism 20 via an output shaft 71. A first air vent M1 and a second air vent M2 are provided in the cavity, interconnecting the cavity. The piston 72 slides between the first air vent M1 and the second air vent M2 in the direction of the output shaft 71's movement. The principle is that the thrust of the cylinder 7 is calculated using the formula F=P*S, where P is the gas pressure in the piston 72 and S is the surface area of the piston 72. The thrust of the cylinder 7 is proportional to the gas pressure. Therefore, if air is admitted to the first air vent M1, the piston 72 moves toward the second air vent M2, and the output shaft 71 controls the propulsion mechanism 20 to move away from the wafer holding mechanism 10. On the contrary, when air enters the second vent M2 and air exits the first vent M1 , the piston 72 moves toward the first vent M1 , and the output shaft 71 controls the propulsion mechanism 20 to approach the wafer fixing mechanism 10 , thereby clamping the wafer 3 .

[0063] In order to improve the accuracy of the movement of the output shaft 71, a first electromagnetic valve 81, a second electromagnetic valve 82, and a third electromagnetic valve 83 may be provided. Figure 2 As shown, when clamping begins, the C-path gas enters the cavity, the B-path gas is cut off, the A-path gas is cut off, the third solenoid valve 83 is energized, the second solenoid valve 82 is energized, the first solenoid valve 81 is not energized, the first solenoid valve 81 is in the exhaust state, the output shaft 71 of the cylinder 7 moves forward, the front of the piston 72 is exhausted, the rear of the piston 72 is inhaled, and the output shaft 71 pushes the propulsion mechanism 20 toward the wafer fixing mechanism 10.

[0064] A sensor may be provided. During the process of the propulsion mechanism 20 pushing the wafer 3 from its initial position to the predetermined position of the wafer securing mechanism 10, the sensor is triggered and a feedback signal is generated. The B-channel gas enters the chamber, the C-channel gas is cut off, the A-channel gas is cut off, the third solenoid valve 83 is de-energized, the second solenoid valve 82 is energized, and the first solenoid valve 81 is de-energized. The first solenoid valve 81 is in an exhaust state. At this time, the exhaust port of the third solenoid valve 83 is connected to a pressure reducing valve. Because there is a pressure reducing valve in the B-channel gas, the pressure is lower than the pressure of the C-channel gas, which slows the exhaust of the front of the piston 72. This reduces the movement speed or load of the propulsion mechanism 20, and reduces the speed at which the wafer 3 is transported until the wafer 3 is transported to abut the wafer securing mechanism 10. This prevents excessive contact between the wafer 3 and the wafer securing mechanism 10, which could result in wafer 3 breakage. In one embodiment, the sensor may be a position sensor.

[0065] When the clamping needs to be released, the gas in path A enters the cavity, the gas in path B is cut off, the gas in path C is cut off, the first solenoid valve 81 is energized, the second solenoid valve 82 can be energized or not energized, the third solenoid valve 83 is not energized, the third solenoid valve 83 is in the exhaust state, the output shaft 71 of the cylinder 7 moves backward, the rear of the piston 72 is exhausted, the front of the piston 72 is inhaled, and the output shaft 71 pushes the propulsion mechanism 20 away from a clamping structure.

[0066] Specifically, in order to more accurately control the movement of the propulsion mechanism 20, a through hole 40 is provided on the output shaft 71, and the wafer clamping force adjustment system 30 further includes a central control unit and an optical sensor 6. The central control unit is electrically connected to the first solenoid valve 81, the second solenoid valve 82, and the third solenoid valve 83. The optical sensor 6 is electrically connected to the central control unit, and the optical sensor 6 is arranged on the moving path of the output shaft 71 of the cylinder 7. When the output shaft 71 moves to a preset position, the light beam emitted by the optical sensor 6 passes through the through hole 40, triggering the induction to generate a position signal and feeding it back to the central control unit. Based on the position signal, the central control unit closes the third solenoid valve 83 and the first solenoid valve 81, and starts the second solenoid valve 82, so that the piston 72 moves slowly toward the propulsion mechanism 20.

[0067] In this embodiment, a through hole 40 can be opened on the output shaft 71, and the sensor is selected as an optical sensor 6, such as a beam-type fiber optic optical sensor 6. The output end of the optical sensor 6 is set on the movement path of the output shaft 71, and when the output shaft 71 advances a certain displacement, the through hole 40 is opposite to the optical sensor 6. The light beam at the output end of the optical sensor 6 passes through the through hole 40 and is reflected, triggering the optical sensor 6 to generate a corresponding position signal. The central control unit controls the opening and closing of the first solenoid valve 81, the second solenoid valve 82, and the third solenoid valve 83 based on the position signal to realize the adjustable force function of the propulsion mechanism 20.

[0068] In another embodiment, Figure 3-5 As shown, an embodiment of the present application provides a wafer clamping mechanism 300, wherein the wafer clamping mechanism 300 includes the above-mentioned wafer clamping force adjustment system 30 and includes:

[0069] A wafer fixing mechanism 10, for placing the wafer 3;

[0070] The propulsion mechanism 20 is spaced apart from the wafer fixing mechanism 10. On the movement path of the propulsion mechanism 20, the propulsion mechanism 20 can be relatively close to or away from the wafer fixing mechanism 10 to fix or release the wafer 3 between the clamping structure and the propulsion mechanism 20;

[0071] The output shaft 71 of the cylinder 7 is connected to the propulsion mechanism 20, and the wafer clamping force adjustment system 30 is configured to change the propulsion force of the propulsion mechanism 20 when the propulsion mechanism 20 approaches or moves away from the wafer fixing mechanism 10;

[0072] The wafer clamping force adjustment system 30 is connected to the propulsion mechanism 20 and is configured to change the propulsion force of the propulsion mechanism 20 when the propulsion mechanism 20 approaches or moves away from the wafer fixing mechanism 10 .

[0073] In this embodiment, the wafer fixing mechanism 10 is mainly used to place the wafer 3. After the wafer fixing mechanism 10 initially obtains the wafer 3 to be processed, the position of the wafer 3 on the wafer fixing mechanism 10 is inaccurate, and the wafer 3 is not fixed according to the preset accuracy. Therefore, it is necessary to use the propulsion mechanism 20 to move the wafer 3 toward the wafer fixing mechanism 10 to fix the wafer 3. The propulsion mechanism 20 pushes the wafer 3 from the initial position to the wafer fixing mechanism 10. The propulsion mechanism 20 is provided with a cylinder assembly. After the propulsion mechanism 20 pushes the wafer 3 from the initial position to the predetermined position of the wafer fixing mechanism 10, a constant thrust is applied to fix the wafer 3 between the wafer fixing mechanism 10 and the propulsion mechanism 20.

[0074] During the clamping process, the clamping force formed between the propulsion mechanism 20 and the wafer fixing mechanism 10 cannot be adjusted. The wafer 3 is transferred to the wafer fixing mechanism 10 and obtained by the wafer fixing mechanism 10, which is prone to the risk of wafer 3 breakage and the risk of wafer 3 transmission downtime. For this reason, the embodiment of the present application provides a wafer clamping force adjustment system 30, which is connected to the propulsion mechanism 20 and is configured to change the propulsion force of the propulsion mechanism 20 when the propulsion mechanism 20 approaches or moves away from the wafer fixing mechanism 10. For example, after the propulsion mechanism 20 moves a preset displacement, the wafer clamping force adjustment system 30 reduces the load of the propulsion mechanism 20, so that the wafer 3 moves slowly closer to the wafer fixing mechanism 10. Of course, a sensor, such as a position sensor, can also be set. In the process of the propulsion mechanism 20 pushing the wafer 3 from the initial position to the predetermined position of the wafer fixing mechanism 10, the sensor is triggered and a feedback signal is fed back. The wafer clamping force adjustment system 30 dynamically adjusts the parameters of the propulsion mechanism 20 based on the sensor feedback signal to adjust the load of the propulsion mechanism 20 on its movement path. For example, the propulsion mechanism 20 moves to the sensor position and triggers the sensor. The sensor generates a signal, and the wafer clamping force adjustment system 30 reduces the movement parameters of the propulsion mechanism 20, such as speed and propulsion load parameters, so that the speed at which the wafer 3 is transmitted is reduced until the wafer 3 is transported to abut against the wafer fixing mechanism 10, so as to avoid excessive contact between the wafer 3 and the wafer clamping mechanism 10, resulting in wafer 3 breakage.

[0075] Specifically, to ensure that the wafer 3 is precisely clamped, in an embodiment of the present application, the wafer fixing mechanism 10 includes a base plate 4 and a front stopper 1. The front stopper 1 is disposed along the front edge of the base plate 4, and the propulsion mechanism 20 gradually moves the front stopper 1 toward the wafer 3, so that the front end of the wafer 3 contacts the front stopper 1.

[0076] In this embodiment, the base plate 4 is a ceramic part, the main purpose of which is to place the wafer 3, and it can also serve as a chassis for electrostatic adsorption; a plurality of front end blocks 1 are provided, and are respectively protruded along the edge of the end of the base plate 4. In the process of transporting the wafer 3, the robot manipulator 202 is equipped with a clamp adapted to the wafer box, which can also be an adsorption device. First, the robot takes out the wafer 3 from the wafer box and places the wafer 3 on the base plate 4. The distance between the wafer 3 and the front end block 1 is generally about 1-5 mm, and the distance between the wafer 3 and the propulsion mechanism 20 is generally about 1-5 mm. The propulsion mechanism 20 gradually moves forward, and the wafer 3 moves forward. Finally, the wafer 3 contacts the front end block 1 on the base plate 4, the propulsion mechanism 20 stops moving, and the wafer 3 is clamped.

[0077] Please refer to Figure 4Specifically, the front end stopper 1 is hingedly connected to the base plate 4, and the wafer clamping mechanism 300 further includes a buffer spring 41. The ends of the buffer spring 41 are respectively connected to the end of the front end stopper 1 facing away from the propulsion mechanism 20 and the base plate 4. When the front end stopper 1 contacts the wafer 3, the thrust of the propulsion mechanism 20 is transmitted to the buffer spring 41.

[0078] In order to further prevent the wafer 3 from breaking, the front end stopper 1 can be hinged to the base plate 4. For example, the front end stopper 1 is set to swing, and its swing amplitude is less than 1°, and a buffer spring 41 is connected to the hinge position between the front end stopper 1 and the base plate 4. The distance between the wafer 3 and the propulsion mechanism 20 is generally about 1-5 mm. The propulsion mechanism 20 moves forward, and the wafer 3 moves forward. Finally, the wafer 3 contacts the front end stopper 1 on the base plate 4. The front end stopper 1 is slightly swung by the force, and the force transmitted by the propulsion mechanism 20 is transferred to the buffer spring 41. The buffer spring 41 buffers and reduces the kinetic energy between the wafer 3 and the front end stopper 1, and the propulsion mechanism 20 stops moving, and the wafer 3 is clamped.

[0079] Please refer to Figure 5 As shown, specifically, along the travel path of the output shaft 71 of the cylinder 7, the front end stopper 1 has at least two protrusions symmetrically spaced apart about the central axis of the base plate 4. The end faces of the protrusions facing the propulsion mechanism 20 are arc-shaped. To ensure uniform force on the wafer 3 after it abuts the front end stopper, the front end stopper 1 can be provided with two groups of protrusions, spaced symmetrically from side to side. The wafer 3 is shaped like a cylindrical slice. Therefore, after the wafer 3 abuts the protrusions of the front end stopper 1, the two groups of protrusions of the front end stopper 1 respectively contact the wafer 3 symmetrically, ensuring uniform force on the left and right sides of the wafer 3 and preventing wafer 3 from breaking.

[0080] Moreover, in order to make the front end stopper 1 contact the edge of the wafer 3 more evenly, the end face of the protrusion facing the propulsion mechanism 20 is arc-shaped, and the arc edge of the wafer 3 is in adaptive contact with the arc surface of the protrusion, ensuring that the wafer 3 is evenly stressed and avoiding wafer 3 from breaking.

[0081] Specifically, the bottom plate 4 is provided with a plurality of bosses 2 , the bottom ends of the bosses 2 are embedded in the bottom plate 4 , the top ends of the bosses 2 at least partially protrude outside the bottom plate 4 , and the plurality of bosses 2 are distributed in a point-like manner on the surface of the bottom plate 4 .

[0082] In order to reduce the contact area between the base plate 4 and the wafer 3, a number of bosses 2 can be provided on the base plate 4. The bottom end of the boss 2 is embedded in the base plate 4, and the top end of the boss 2 at least partially protrudes to the outside of the base plate 4. After the wafer 3 is placed on the base plate 4, the point-distributed bosses 2 are used to support the wafer 3 to avoid direct contact between the base plate 4 and the wafer 3, which would damage the cleanliness of the surface of the wafer 3.

[0083] Specifically, the propulsion mechanism 20 includes a cylinder fork (not labeled in the figure) and a roller module. The cylinder fork is drivingly connected to the wafer clamping force adjustment system 30. The roller module is located at the end of the cylinder fork away from the wafer clamping force adjustment system 30. The end of the roller module facing the wafer 3 has a curved surface to adapt to the edge of the wafer 3.

[0084] The propulsion mechanism 20 has a cylinder fork and a roller module. One end of the cylinder fork is transmission-connected to the wafer clamping force adjustment system 30, and the other end of the cylinder fork is installed with the roller module. The roller module has an arc-shaped end to adapt to the edge of the wafer 3 and abut against it, so that it fits more closely with the edge of the wafer 3 to avoid forming a sharp angle contacting the wafer 3. During the process of transporting wafer 3, the robot manipulator 202 is equipped with a clamp adapted to the wafer box. First, the robot takes out wafer 3 from the wafer box and places wafer 3 on the base plate 4. The distance between wafer 3 and the front end stopper 1 is generally about 1-5 mm, and the distance between wafer 3 and the propulsion mechanism 20 is generally about 1-5 mm. The propulsion mechanism 20 moves forward, and the end of the arc-shaped surface of the roller module contacts wafer 3, and adjusts the position of wafer 3 in the process of pushing wafer 3 to move, so that wafer 3 is slowly aligned, and wafer 3 moves forward. Finally, wafer 3 contacts the front end stopper 1 on the base plate 4, and the protrusion of the front end stopper 1 symmetrically contacts wafer 3. The propulsion mechanism 20 stops moving, and wafer 3 is clamped.

[0085] Specifically, the roller module includes a mounting bracket (not marked in the figure) and two sets of rollers 5. In the moving path of the output shaft 71 of the cylinder 7, the two sets of rollers 5 are symmetrical about the central axis of the wafer fixing mechanism 10 and are movably mounted on the mounting bracket.

[0086] In this embodiment, in order to further improve the performance of the roller module in correcting the position deviation of the wafer 3, a mounting bracket can be provided, and two sets of rollers 5 can be provided. The two sets of rollers 5 are symmetrical to each other, and each roller 5 can rotate on its own axis. During the process of transporting the wafer 3, the robot manipulator 202 is equipped with a clamp adapted to the wafer box. First, the robot removes the wafer 3 from the wafer box and places the wafer 3 on the base plate 4. The distance between the wafer 3 and the front end stopper 1 is generally about 1-5 mm. The distance between the wafer 3 and the pushing mechanism 20 is generally about 1-5 mm. The pushing mechanism 20 moves forward, and the ends of the arc-shaped surfaces of the two sets of rollers 5 contact the wafer 3 and adjust the position of the wafer 3 in the process of pushing the wafer 3 to move. If there is a left and right position deviation of the wafer 3, the position where the roller 5 is connected to the cylinder fork is the axis of the roller 5 itself. The roller 5 can rotate about its own axis. The roller 5 slowly moves the wafer 3 with a larger deviation to the position of the other roller 5 according to its own rotation properties, and slowly adjusts the position of the wafer 3 so that the two sets of rollers 5 are in uniform contact with the wafer 3, and the contact position is also symmetrical on the left and right, so that the wafer 3 is slowly corrected and the wafer 3 moves forward. Finally, the wafer 3 contacts the front end stopper 1 on the bottom plate 4, and the protrusion of the front end stopper 1 symmetrically contacts the wafer 3. The pushing mechanism 20 stops moving, and the wafer 3 is clamped to ensure that the wafer 3 is evenly stressed and to avoid wafer 3 breakage.

[0087] In the initial state, the wafer 3 is taken out of the wafer box and placed on the base plate 4. The distance between the wafer 3 and the front end stopper 1 is generally about 1-5 mm, and the distance between the wafer 3 and the propulsion mechanism 20 is generally about 1-5 mm. When air is taken in by the second air vent M2, the air is discharged from the first air vent M1, and the piston 72 moves toward the first air vent M1. The output shaft 71 controls the propulsion mechanism 20 to approach the wafer fixing mechanism 10, and the propulsion mechanism 20 moves forward. The ends of the arc-shaped surfaces of the two sets of rollers 5 both contact the wafer 3, and adjust the position of the wafer 3 in the process of pushing the wafer 3 to move. If there is a left-right position deviation of the wafer 3, the roller 5 slowly moves the wafer 3 with a larger deviation to the position of the other roller 5 according to its own rotation properties, and slowly adjusts the position of the wafer 3 so that the two sets of rollers 5 are in uniform contact with the wafer 3, and the contact position is also symmetrical on the left and right, so that the wafer 3 is slowly corrected and the wafer 3 moves forward.

[0088] When the output shaft 71 advances a certain amount of displacement, the through hole 40 faces the optical sensor 6, and the light beam at the output end of the optical sensor 6 passes through the through hole 40 and is reflected, triggering the optical sensor 6, generating a corresponding position signal and outputting it to the central control unit. The B-way gas enters the cavity, the C-way gas is cut off, the A-way gas is cut off, and the central control unit controls the third solenoid valve 83 to be de-energized, the second solenoid valve 82 to be energized, and the first solenoid valve 81 to be de-energized. The first solenoid valve 81 is in the exhaust state. At this time, the exhaust hole of the third solenoid valve 83 is connected to the pressure reducing valve. There is a pressure reducing valve in the body, and the pressure is lower than the C-line gas pressure, which makes the front of the piston 72 exhaust slowly, reducing the moving speed or load of the propulsion mechanism 20, and reducing the speed at which the wafer 3 is transported until the wafer 3 is transported to abut against the wafer fixing mechanism 10. The protrusions of the front end stopper 1 can be set in two groups, and the left and right intervals are symmetrical. The shape of the wafer 3 is a cylindrical thin slice. Therefore, after the wafer 3 abuts against the protrusions of the front end stopper 1, the two groups of protrusions of the front end stopper 1 are symmetrically in contact with the wafer 3, ensuring that the left and right sides of the wafer 3 are evenly stressed, avoiding wafer 3 from breaking.

[0089] Not only that, in order to make the front end block 1 contact with the edge of the wafer 3 more evenly, the end face of the front end block 1 facing the propulsion mechanism 20 is arc-shaped, and the arc edge of the wafer 3 is in adaptive contact with the arc surface of the front end block 1, ensuring that the wafer 3 is evenly stressed and avoiding wafer 3 from breaking.

[0090] When the processing of wafer 3 is completed, wafer 3 needs to be placed in a specific position and wafer 3 needs to be released. Then, the central control unit controls the gas of path A to enter the cavity, the gas of path B is cut off, the gas of path C is cut off, the first solenoid valve 81 is energized, the second solenoid valve 82 can be energized or not energized, the third solenoid valve 83 is not energized, the third solenoid valve 83 is in the exhaust state, the output shaft 71 of the cylinder 7 moves backward, the rear of the piston 72 is exhausted, the front of the piston 72 is inhaled, and the output shaft 71 pushes the propulsion mechanism 20 away from a clamping structure.

[0091] The present application also provides a wafer processing machine 201 that utilizes the wafer clamping mechanism 300 described above, including: a machine 201, wherein the wafer fixing mechanism 10, the propulsion mechanism 20, and the wafer clamping force adjustment system 30 are all disposed on the machine 201. The specific structure of the wafer clamping mechanism 300 is similar to that of the aforementioned embodiments. Since the wafer processing machine 201 utilizes all the technical solutions of all the aforementioned embodiments, it at least has all the beneficial effects brought about by the technical solutions of the aforementioned embodiments, which will not be described in detail here.

[0092] like Figure 6 As shown, an embodiment of the present application further provides a wafer clamping control method, which uses the above-mentioned wafer clamping mechanism 300 to clamp and control the wafer 3, and includes:

[0093] Step S100: using the optical sensor 6 to obtain a first position signal of the wafer 3 to be processed;

[0094] Step S200 , starting the propulsion mechanism 20 based on the first position signal, and controlling the propulsion mechanism 20 to move the wafer 3 from the initial position toward the wafer fixing mechanism 10 with a first load through the wafer clamping force adjustment system 30 ;

[0095] Step S300: When the propulsion mechanism 20 moves to the preset position, a second position signal is obtained, and the wafer clamping force adjustment system 30 is controlled to start based on the second position signal, and the propulsion mechanism 20 is controlled to move the wafer 3 from the preset position toward the wafer fixing mechanism 10 with a second load, wherein the first load is greater than the second load.

[0096] In this embodiment, the wafer clamping mechanism 300 employs the aforementioned wafer clamping force adjustment system 30. The wafer clamping control method of this embodiment is implemented based on the wafer clamping mechanism 300 described above. Therefore, the aforementioned description of the wafer clamping mechanism 300 can be used to describe this method, and the same content will not be expanded upon.

[0097] In this embodiment, after the wafer 3 is taken out and placed on the base plate 4, the distance between the wafer 3 and the front end stopper 1 is generally about 1-5 mm, and the distance between the wafer 3 and the propulsion mechanism 20 is generally about 1-5 mm. The wafer clamping force adjustment system 30 (or the central control unit) records its batch, process parameters and other information based on the first position signal, automatically matches the processing program, and controls the propulsion mechanism 20 and the wafer clamping force adjustment system 30, for example, controls the first solenoid valve 81, the second solenoid valve 82, and the third solenoid valve 83 mentioned above, so that the second air vent M2 is inlet, and the first air vent M1 is outlet, so that the piston 72 moves toward the first air vent M1, and the output shaft 71 controls the movement of the piston 72. The propulsion mechanism 20 is controlled to be close to the wafer fixing mechanism 10, and the propulsion mechanism 20 moves forward. The ends of the arc-shaped surfaces of the two sets of rollers 5 both contact the wafer 3, and adjust the position of the wafer 3 in the process of pushing the wafer 3 to move. If there is a left and right position deviation of the wafer 3, the roller 5 slowly moves the wafer 3 with a larger deviation to the position of the other roller 5 according to its own rotation properties, and slowly adjusts the position of the wafer 3 so that the two sets of rollers 5 are in uniform contact with the wafer 3, and the contact positions are also symmetrical on the left and right, so that the wafer 3 is slowly corrected and the wafer 3 moves forward.

[0098] In this embodiment, a through hole 40 can be opened on the output shaft 71 of the wafer clamping force adjustment system 30 in the propulsion mechanism 20, and the sensor is selected as an optical sensor 6, such as a beam-type fiber optic optical sensor 6. The output end of the optical sensor 6 is set on the movement path of the output shaft 71, and when the output shaft 71 advances a certain displacement, the through hole 40 is opposite to the optical sensor 6. The light beam at the output end of the optical sensor 6 passes through the through hole 40 and is reflected, triggering the optical sensor 6 to generate a corresponding second position signal. The central control unit controls the opening and closing of the first solenoid valve 81, the second solenoid valve 82, and the third solenoid valve 83 based on the position signal to realize the adjustable force function of the propulsion mechanism 20.

[0099] When the output shaft 71 advances a certain amount of displacement, the through hole 40 faces the optical sensor 6, and the light beam at the output end of the optical sensor 6 passes through the through hole 40 and is reflected, triggering the optical sensor 6, generating a corresponding second position signal and outputting it to the central control unit. The B-path gas enters the cavity, the C-path gas is cut off, the A-path gas is cut off, and the central control unit controls the third solenoid valve 83 to be de-energized, the second solenoid valve 82 to be energized, and the first solenoid valve 81 to be de-energized. The first solenoid valve 81 is in the exhaust state. At this time, the exhaust hole of the third solenoid valve 83 is connected to the pressure reducing valve. There is a pressure reducing valve in the body, and the pressure is lower than the C-line gas pressure, which makes the exhaust of the front of the piston 72 slow, reducing the moving speed (or load) of the propulsion mechanism 20, and reducing the speed at which the wafer 3 is transported until the wafer 3 is transported to abut against the wafer fixing mechanism 10. The protrusions of the front end stopper 1 can be set in two groups, and the left and right intervals are symmetrical. The shape of the wafer 3 is a cylindrical thin slice. Therefore, after the wafer 3 abuts against the protrusions of the front end stopper 1, the two groups of protrusions of the front end stopper 1 are symmetrically in contact with the wafer 3, ensuring that the left and right sides of the wafer 3 are evenly stressed, thereby avoiding wafer 3 from breaking.

[0100] Of course, multiple physical identifiers can also be set on the output shaft 71. During the displacement of the output shaft 71, the optical sensor 6 identifies different physical identifiers and generates different position signals. It is not necessary to stick to the method of opening a through hole 40 on the output shaft 71 as an identification identifier.

[0101] To sum up, during the clamping process of wafer 3, the clamping force on wafer 3 is changed from large to small by adjusting the air path system of cylinder 7, thereby solving the defect that wafer 3 is easily broken when being transferred to the clamping structure and obtained by the clamping structure, and causing the risk of wafer 3 being transferred and downtime.

[0102] Although the embodiments of the present application have been described in conjunction with specific features and embodiments thereof, it is obvious that various modifications and combinations may be made thereto without departing from the spirit and scope of the embodiments of the present application. Accordingly, this specification and the drawings are merely illustrative of the embodiments of the present application as defined, and are deemed to have covered any and all modifications, variations, combinations or equivalents within the scope of the embodiments of the present application. Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the embodiments of the present application. Thus, if these modifications and variations of the embodiments of the present application fall within the scope of the embodiments of the present application and their equivalents, the embodiments of the present application are also intended to include these modifications and variations.

Claims

1. A wafer clamping force adjustment system for adjusting the clamping force applied to a wafer (3) during the process of transporting the wafer (3) to abut against a wafer fixing mechanism (10), characterized in that: The wafer clamping force adjustment system (30) comprises: A cylinder (7), wherein an output shaft (71) of the cylinder (7) is in driving connection with a wafer clamping mechanism (300), wherein a cavity is provided inside the cylinder (7), a piston (72) is provided at the tail end of the cylinder (7), and a first air vent (M1) and a second air vent (M2) communicating with the cavity are provided along the direction of the moving path of the output shaft (71) of the cylinder (7), and the piston (72) slides between the first air vent (M1) and the second air vent (M2); a first solenoid valve (81), wherein the air outlet of the first solenoid valve (81) is connected to the first air vent (M1), and the air inlet of the first solenoid valve (81) is connected to the air source; a second solenoid valve (82), wherein the vent outlet of the second solenoid valve (82) is connected to the second vent (M2); a third solenoid valve (83), wherein the air outlet of the third solenoid valve (83) is connected to the air inlet of the second solenoid valve (82), the exhaust hole of the third solenoid valve (83) is connected to the pressure reducing valve, and the air inlet of the third solenoid valve (83) is connected to the air source; When the wafer (3) begins to be clamped, the second solenoid valve (82) and the third solenoid valve (83) are energized, the first solenoid valve (81) is de-energized and in an exhaust state, the output shaft (71) moves forward, the front of the piston (72) is exhausted and the rear is inhaled; When the wafer (3) is pushed to a predetermined position of the wafer fixing mechanism (10), the first solenoid valve (81) and the third solenoid valve (83) are de-energized, the second solenoid valve (82) is energized, the first solenoid valve (81) is in an exhaust state, and the front of the piston (72) is exhausted slowly, so that the speed at which the wafer (3) is transported is reduced until the wafer (3) abuts against the wafer fixing mechanism (10).

2. The wafer clamping force adjustment system according to claim 1, wherein: A through hole (40) is provided on the output shaft (71) of the cylinder (7), and the wafer clamping force adjustment system (30) further comprises: a central control unit, the central control unit being electrically connected to the first solenoid valve (81), the second solenoid valve (82), and the third solenoid valve (83); An optical sensor (6) is electrically connected to the central control unit, and the optical sensor (6) is arranged on the moving path of the output shaft (71) of the cylinder (7) and is used to detect the position signal of the output shaft (71) of the cylinder (7) and feed it back to the central control unit.

3. A wafer clamping mechanism, characterized in that: The wafer clamping mechanism (300) comprises a wafer clamping force adjustment system (30) as claimed in claim 1 or 2, and comprises: A wafer fixing mechanism (10) for placing the wafer (3); a propulsion mechanism (20) spaced apart from the wafer fixing mechanism (10); and on a movement path of the propulsion mechanism (20), the propulsion mechanism (20) can be relatively close to or away from the wafer fixing mechanism (10) to fix or release the wafer (3) between the wafer fixing mechanism (10) and the propulsion mechanism (20); The output shaft (71) of the cylinder (7) is connected to the propulsion mechanism (20), and the wafer clamping force adjustment system (30) is configured to change the propulsion force of the propulsion mechanism (20) when the propulsion mechanism (20) approaches or moves away from the wafer fixing mechanism (10).

4. The wafer clamping mechanism according to claim 3, wherein: The wafer fixing mechanism (10) comprises: bottom plate (4); A front end stopper (1) is provided along the front end edge of the base plate (4), and the propulsion mechanism (20) gradually moves the front end stopper (1) toward the wafer (3) to make the front end of the wafer (3) contact the front end stopper (1).

5. The wafer clamping mechanism according to claim 4, wherein: The front end stopper (1) is hinged to the base plate (4), and the wafer clamping mechanism (300) further comprises: A buffer spring (41), wherein both ends of the buffer spring (41) are respectively connected to an end of the front end stopper (1) facing away from the propulsion mechanism (20) and the bottom plate (4); When the front end stopper (1) contacts the wafer (3), the thrust of the propulsion mechanism (20) is transmitted to the buffer spring (41).

6. The wafer clamping mechanism according to claim 5, wherein: On the moving path of the output shaft (71) of the cylinder (7), the front end stopper (1) has at least two protrusions that are symmetrical and spaced apart about the central axis of the base plate (4), and the end surfaces of the protrusions facing the propulsion mechanism (20) are arc-shaped.

7. The wafer clamping mechanism according to claim 6, wherein: A plurality of bosses (2) are provided on the bottom plate (4), the bottom ends of the bosses (2) are embedded in the bottom plate (4), the top ends of the bosses (2) at least partially protrude outside the bottom plate (4), and the plurality of bosses (2) are distributed in a dotted manner on the surface of the bottom plate (4).

8. The wafer clamping mechanism according to claim 3, wherein: The propulsion mechanism (20) comprises: A cylinder fork, the cylinder fork being drivingly connected to the wafer clamping force adjustment system (30); A roller module is provided at the end of the cylinder fork away from the wafer clamping force adjustment system (30), and the end of the roller module facing the wafer (3) has an arc-shaped surface to adapt to the edge of the wafer (3).

9. The wafer clamping mechanism according to claim 8, wherein: The roller module comprises: A mounting bracket, arranged at an end of the cylinder fork away from the wafer clamping force adjustment system (30); Two groups of rollers (5) are on the moving path of the output shaft (71) of the cylinder (7), and the two groups of rollers (5) are symmetrical about the central axis of the wafer fixing mechanism (10) and are movably arranged on the mounting bracket.

10. A wafer processing machine comprising the wafer clamping mechanism according to any one of claims 3 to 9, characterized in that: include: A machine platform (201); the machine platform (201) is provided with a wafer fixing mechanism (10), a propulsion mechanism (20), and a wafer clamping force adjustment system (30).

11. A wafer clamping control method, comprising: using a wafer clamping mechanism (300) as claimed in any one of claims 3 to 9 to perform clamping control on a wafer (3), characterized in that: include: An optical sensor (6) is used to obtain a first position signal of the wafer (3) to be processed; Based on the first position signal, the propulsion mechanism (20) is activated, and the wafer clamping force adjustment system (30) controls the propulsion mechanism (20) to move the wafer (3) from an initial position toward the wafer fixing mechanism (10) with a first load; When the propulsion mechanism (20) moves to a preset position, a second position signal is obtained, and based on the second position signal, the wafer clamping force adjustment system (30) is controlled to start, and the propulsion mechanism (20) is controlled to move the wafer (3) from the preset position toward the wafer fixing mechanism (10) with a second load, wherein the first load is greater than the second load.

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