Package structure and manufacturing method thereof

Abstract

The embodiment of the invention provides a packaging structure and a manufacturing method thereof. The packaging structure comprises a packaging main body and a reinforcing structure. A package body includes a chip and has a front side and a back side opposite to each other in a first direction and a sidewall connecting the front side and the back side, where a side of the package body on which the chip is disposed is the front side of the package body. The reinforcing structure at least comprises a first reinforcing part, and the first reinforcing part is connected to the side wall of the packaging main body and surrounds the packaging main body in the direction parallel to the main surface of the packaging main body.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a packaging structure and a manufacturing method thereof. Background Art

[0002] Integrated circuit (IC) chips are widely used in various electronic devices, and the integrated circuit chips can be packaged through semiconductor packaging technology. In a semiconductor packaging structure, due to the possible difference in the coefficient of thermal expansion (CTE) between different materials, the packaging structure may be warped and deformed under certain temperature conditions, which may further affect the device performance of the packaging structure and even cause the failure of the packaging structure.

[0003] Therefore, how to reduce or avoid the warping of the packaging structure is an important research topic in this field. Summary of the Invention

[0004] According to at least one embodiment of the present disclosure, a packaging structure and a manufacturing method thereof are provided, which can avoid or greatly reduce the warping of the packaging structure, thereby improving the device performance and reliability of the packaging structure.

[0005] At least one embodiment of the present disclosure provides a packaging structure, which includes a packaging body and a reinforcing structure. The packaging body includes a chip and has a front side and a back side opposite to each other in a first direction and side walls connecting the front side and the back side, wherein the side of the packaging body provided with the chip is the front side of the packaging body. The reinforcing structure at least includes a first reinforcing portion, and the first reinforcing portion is joined to the side wall of the packaging body and surrounds the packaging body in a direction parallel to the main surface of the packaging body.

[0006] At least one embodiment of the present disclosure provides a manufacturing method of a packaging structure, including: providing a packaging body, the packaging body including a chip and having a front side and a back side opposite to each other in a first direction; providing a carrier plate and placing the reinforcing structure on the carrier plate; and picking up the packaging body and joining the packaging body to the reinforcing structure to form the packaging structure, wherein the reinforcing structure at least includes a first reinforcing portion, and the first reinforcing portion is joined to the side wall of the packaging body and surrounds the packaging body in a direction parallel to the main surface of the packaging body. Brief Description of the Drawings

[0007] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings described below only relate to some embodiments of the present disclosure and do not limit the present disclosure.

[0008] Figure 1 Schematic cross-sectional view showing a packaging structure according to some embodiments of the present disclosure.

[0009] Figures 2A to 2D Schematic plan view showing a packaging structure according to some embodiments of the present disclosure.

[0010] Figures 3 to 9 Schematic illustration of each step in a method of manufacturing a packaging structure according to some embodiments of the present disclosure.

[0011] Figure 10 Schematic cross-sectional view showing a packaging structure according to some other embodiments of the present disclosure.

[0012] Figure 11 Schematic bottom view showing a packaging structure according to some other embodiments of the present disclosure.

[0013] Figures 12 to 21 Schematic cross-sectional view showing a packaging structure according to still some other embodiments of the present disclosure.

[0014] Figure 22A Simulation nephogram of the packaging structure of the first comparative example in the first set of simulation tests conducted at a temperature of 25°C. Figure 22B and Figure 22C Respectively show the simulation nephograms of the packaging structures of some embodiments of the present disclosure in the first set of simulation tests conducted at a temperature of 25°C.

[0015] Figure 23A Simulation nephogram of the packaging structure of the first comparative example in the first set of simulation tests conducted at a temperature of 260°C. Figure 23B and Figure 23C Respectively show the simulation nephograms of the packaging structures of some embodiments of the present disclosure in the first set of simulation tests conducted at a temperature of 260°C.

[0016] Figure 24A Simulation nephogram of the packaging structure of the second comparative example in the second set of simulation tests conducted at a temperature of 25°C. Figure 24B and Figure 24C Respectively show the simulation nephograms of the packaging structures of some embodiments of the present disclosure in the second set of simulation tests conducted at a temperature of 25°C.

[0017] Figure 25A Simulation nephogram of the packaging structure of the second comparative example in the second set of simulation tests conducted at a temperature of 260°C. Figure 25B and Figure 25C Respectively show the simulation nephograms of the packaging structures of some embodiments of the present disclosure in the second set of simulation tests conducted at a temperature of 260°C.

[0018] Figure 26AShows the simulation nephogram of the package structure of the third comparative example in the third group of simulation tests conducted at a temperature of 25°C. Figure 26B and Figure 26C Respectively show the simulation nephograms of the package structures of some embodiments of the present disclosure in the third group of simulation tests conducted at a temperature of 25°C.

[0019] Figure 27A Shows the simulation nephogram of the package structure of the third comparative example in the third group of simulation tests conducted at a temperature of 260°C. Figure 27B and Figure 27C Respectively show the simulation nephograms of the package structures of some embodiments of the present disclosure in the third group of simulation tests conducted at a temperature of 260°C. Detailed implementation manners

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0021] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the ordinary meanings understood by those of ordinary skill in the art to which the present disclosure pertains. The "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are only used to distinguish different components. The terms such as "including" or "comprising" mean that the elements or items appearing before the term cover the elements or items listed after the term and their equivalents, without excluding other elements or items. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0022] The ball grid array (BGA) packaging technology is a high-density surface packaging technology for integrated circuits. At the bottom of the BGA package, tin alloy solder balls arranged in an array are usually used as pins. The BGA package is usually mounted on a printed circuit board (PCB) through a surface mount technology (SMT). The flip chip ball grid array (FCBGA) is a type of BGA package and is widely used in the packaging of various high-performance chips.

[0023] In the FCBGA process, reflow soldering is usually used to gradually increase the temperature to make the solder reflux in a molten state, forming solder joints between the chip and the package substrate and between the package substrate and the PCB, thereby achieving electrical connections between the chip and the package substrate and between the package substrate and the PCB. However, due to possible CTE mismatches between different materials in the FCBGA package structure, the package structure may warp and deform during high-temperature reflow soldering. When the warping degree is too large, it may further cause defects such as bridging short circuits, not-wet open circuits, and head-in-pillow effects in the solder balls after the package structure is mounted on the PCB, thereby affecting the device performance, such as causing device failure. Generally, the zero-warp temperature (i.e., the steady-state temperature) of the FCBGA package is between 100°C and 200°C. When the temperature is higher or lower than the steady-state temperature, the JEDEC standard defines two types of warping deformations: "smiling face" (concave deformation) and "crying face" (convex deformation).

[0024] In view of the above problems, embodiments of the present disclosure provide a package structure and a manufacturing method thereof. The package structure includes a package body and a reinforcing structure. The package body includes a chip and has a front side and a back side that are opposite to each other in a first direction and side walls connecting the front side and the back side. The side of the package body where the chip is disposed is the front side of the package body. The reinforcing structure at least includes a first reinforcing portion, and the first reinforcing portion is joined to the side wall of the package body and surrounds the package body in a direction parallel to the main surface of the package body.

[0025] In the package structure and the manufacturing method thereof according to the embodiments of the present disclosure, by providing a reinforcing structure, warping of the package structure can be reduced or avoided under various temperature conditions (e.g., temperatures higher or lower than the steady-state temperature range), thereby avoiding problems such as device failure caused by warping and improving the device performance and reliability of the package structure. Hereinafter, the package structure according to the embodiments of the present disclosure will be described by taking the FCBGA package as an example.

[0026] Figure 1 A schematic cross-sectional view showing a package structure according to some embodiments of the present disclosure. Figures 2A to 2D A schematic top view showing a package structure according to some embodiments of the present disclosure.

[0027] Refer to Figure 1, in some embodiments, the encapsulation structure 500a includes an encapsulation body 50a and a reinforcement structure 200. The encapsulation body 50a includes a chip 110, and has a front side FS and a back side BS that face each other in a first direction D1, and sidewalls 50s connecting the front side and the back side. In some embodiments, the side of the encapsulation body 50a where the chip 110 is disposed is referred to as the front side FS of the encapsulation body 50a. The reinforcement structure 200 at least includes a first reinforcement portion 200a, and the first reinforcement portion 200a is joined to the sidewalls 50s of the encapsulation body 50a and surrounds the encapsulation body in a direction parallel to the main surface of the encapsulation body (e.g., a horizontal direction including a second direction D2 and a third direction D3). In some embodiments, the first reinforcement portion 200a continuously extends in the first direction D1 to cover (e.g., completely cover) the entire sidewalls of the encapsulation body. For example, the surface area of the first reinforcement portion 200a that is close to or faces the encapsulation body may be greater than or equal to the sidewall area of the encapsulation body. For example, the orthographic projection of the sidewalls of the encapsulation body on a reference plane parallel to the sidewalls is located within the orthographic projection of the first reinforcement portion on the reference plane.

[0028] In some embodiments, the encapsulation body 50a is a flip-chip package and includes an encapsulation substrate 100, a chip 110, and a reinforcement member 130; the encapsulation substrate 100 has a first side a1 and a second side a2 that face each other in a first direction D1. The first side a1 and the second side a2 of the encapsulation substrate 100 correspond to the front side FS and the back side BS of the encapsulation body 50a, respectively. For example, the chip 110 is disposed on the first side a1 of the encapsulation substrate 100 and is electrically connected to the encapsulation substrate 100. The second side a2 of the encapsulation substrate 100 is located at or is the back side BS of the encapsulation body 50a. The reinforcement member 130 is located on the first side a1 of the encapsulation substrate 100 and may at least include a reinforcement joint portion 130a. For example, the reinforcement joint portion 130a is joined to an edge portion of the encapsulation substrate 100. The chip 110 may be located in a region surrounded by the reinforcement member 130 in a direction parallel to the main surface of the encapsulation substrate (e.g., a horizontal direction including a second direction D2 and a third direction D3). The first direction D1 is perpendicular to the main surfaces of the encapsulation substrate and the encapsulation body, and the second direction D2 and the third direction D3 are both perpendicular to the first direction D1, that is, parallel to the main surfaces of the encapsulation body and the encapsulation substrate, and intersect with each other, for example, are perpendicular to each other. It should be understood that the direction "D2 / D3" marked in the cross-sectional view represents the second direction D2 or the third direction D3.

[0029] In some embodiments, the sidewall 50s of the encapsulation body 50a includes the sidewall 100s of the encapsulation substrate 100 and the sidewall 130s of the reinforcement joint 130a. The first reinforcement portion 200a of the reinforcement structure 200 may continuously extend in the first direction D1 and be joined to the sidewall 100s of the encapsulation substrate 100 and the sidewall 130s of the reinforcement joint 130a. For example, the first reinforcement portion 200a may be attached to the sidewall of the encapsulation body 50a (i.e., the sidewalls of both the encapsulation substrate and the reinforcement joint) through an adhesive layer 210.

[0030] In some embodiments, the chip 110 is mounted on the first side of the encapsulation substrate 100 and is electrically connected to the encapsulation substrate 100 through a plurality of conductive connectors 112. The conductive connectors 112 may include conductive bumps and / or solder balls, etc. For example, the chip 110 may include a substrate and a device layer. The substrate may be a semiconductor substrate, such as a silicon substrate. For example, the device layer may include active devices such as transistors, passive devices such as capacitors, or a combination thereof, as well as an interconnection structure, etc. The conductive connectors 112 may be disposed on the side of the device layer away from the substrate and provide an electrical connection between the chip and the encapsulation substrate. The side of the chip 110 where the conductive connectors 112 are provided may be referred to as the active side or the front side of the chip, and the side opposite to the front side may be referred to as the back side of the chip 110. That is, the active side of the chip 110 faces the encapsulation substrate 100 and is electrically connected to the encapsulation substrate 100 through a plurality of conductive connectors 112. In some embodiments, the chip 110 may be a digital signal processor (DSP) chip, a graphic processing unit (GPU), an application specific integrated circuit (ASIC) chip, a system on chip (SoC), etc. It should be understood that the above chip types are only illustrative, and the chip type can be selected according to product design and requirements, and the present disclosure does not limit this.

[0031] In some embodiments, the package substrate 100 may include a core layer 10, a build-up layer 11, a build-up layer 12, a solder mask 13, and a solder mask 15. In a direction perpendicular to the main surface of the package substrate 100 (e.g., the first direction D1), the build-up layer 11 and the build-up layer 12 are located on opposite sides of the core layer 10, and the solder mask 13 and the solder mask 15 are respectively located on a side of the build-up layer 11 and the build-up layer 12 away from the core layer 10. In some embodiments, the core layer 10 includes a core dielectric layer and a conductive structure; the core dielectric layer may include resin materials such as epoxy resin and / or materials such as glass fiber or similar materials, and the present disclosure does not limit the material type of the core layer. The conductive structure in the core layer 10 may include conductive vias penetrating the core dielectric layer and / or conductive layers (e.g., including conductive lines) located on opposite sides of the core dielectric layer.

[0032] The build-up layer 11 and the build-up layer 12 may each include one or more dielectric layers and conductive layers stacked on top of each other, one or more conductive layers are embedded in the dielectric layers, and the conductive members in the one or more conductive layers may be electrically connected to the conductive structure in the core layer 10, and the conductive members located in different layers may be connected to each other through conductive vias penetrating the dielectric layers. For example, the dielectric layers in the build-up layer may include prepreg, and the prepreg may include resin materials and glass fiber, etc.; alternatively, the dielectric layers in the build-up layer may also include Ajinomoto Buildup Film (ABF), but the present disclosure is not limited thereto. In some embodiments, the solder mask 13 and the solder mask 15 may each have one or more openings (not shown) to expose some of the conductive members (e.g., conductive pads) in the build-up layers 11 and 12 for further electrical connection. For example, at least some of the conductive pads (not shown) exposed by the solder mask 13 are electrically connected to the conductive connector 112, and then connected to the chip through the conductive connector.

[0033] In some embodiments, the sidewalls of the plurality of material layers (e.g., the above-mentioned core layer, build-up layer, solder mask, etc.) of the package substrate 100 may be substantially aligned with each other in the first direction D1, and the sidewall 100s of the package substrate 100 includes the sidewalls of the plurality of material layers.

[0034] In some embodiments, the sidewalls 130s of the reinforcement joint 130a of the reinforcement member 130 may be substantially aligned with the sidewalls 100s of the package substrate 100 in the first direction D1. For example, the reinforcement member 130 may be attached to the edge portion of the package substrate 100 through the adhesive layer 128. In some embodiments, the sidewalls of the adhesive layer 128 may also be aligned with the sidewalls 100s of the package substrate 100 and the sidewalls 130s of the reinforcement member 130 in the first direction D1. In other embodiments, the reinforcement member 130 may also be joined to the package substrate 100 in other ways.

[0035] In some embodiments, the first reinforcement portion 200a of the reinforcement structure 200 may be attached to the sidewalls 100s of the package substrate 100 and the sidewalls 130s of the reinforcement joint 130a through the adhesive layer (or referred to as the first adhesive layer) 210. The materials of the reinforcement structure 200 and the reinforcement member 130 may be the same or different; the materials of the adhesive layer 210 and the adhesive layer 128 may be the same or different. For example, the reinforcement structure 200 and the reinforcement member 130 may each include a metallic material, such as at least one selected from pure metals such as gold, silver, copper, iron, aluminum, zinc, tin, lead, cobalt, nickel, tungsten, chromium, molybdenum, titanium, manganese, zirconium and their alloy materials. For example, the adhesive layer 210 and the adhesive layer 128 may each be selected from at least one of organic material adhesives (such as epoxy resins, phenols, polyacrylates, polyvinyl acetates, etc.) and inorganic compound adhesives (such as silicate, phosphate, oxide, nitride and other inorganic material adhesives). It should be understood that the materials of the reinforcement structure and the adhesive layer listed above are only illustrative, and the present disclosure is not limited thereto.

[0036] In some embodiments, the thicknesses of the first reinforcement portion 200a and the adhesive layer 210 may be selected according to the product design and requirements of the package structure, and the thickness of the first reinforcement portion 200a may be the same as or different from the thickness of the reinforcement member 130, and the thickness of the adhesive layer 210 may be the same as or different from the thickness of the adhesive layer 128. It should be understood that the thickness of each material layer refers to the thickness in the direction perpendicular to its extension direction. For example, the thicknesses of the first reinforcement portion 200a and the adhesive layer 210 refer to the thickness in the direction parallel to the main surface of the package substrate (for example, the second direction D2 or the third direction D3); the thicknesses of the reinforcement member 130 (for example, its reinforcement joint 130a) and the adhesive layer 128 refer to the thickness in the direction perpendicular to the main surface of the package substrate (for example, the first direction D1).

[0037] In some embodiments, the orthographic projection of the encapsulation substrate 100 and the reinforcement joint portion 130a on a reference plane parallel to the sidewall 100s of the encapsulation substrate is located within the orthographic projection of the reinforcement structure 200 on the reference plane. The height of the reinforcement structure 200 in a first direction D1 perpendicular to the main surface of the encapsulation substrate may be greater than or equal to the height of the sidewall 50s of the encapsulation body 50a in the first direction D1; the height of the sidewall 50s of the encapsulation body 50a in the first direction D1 may be defined, for example, by the distance in the first direction D1 between the surface of the reinforcement joint portion 130a remote from the encapsulation substrate and the surface of the second side (i.e., the side remote from the reinforcement joint portion) a2 of the encapsulation substrate 100. The sidewall 100s of the encapsulation substrate 100, the sidewall 130s of the reinforcement joint layer 130a, and the sidewalls of the adhesive layer 128 located between the encapsulation substrate and the reinforcement joint layer may be completely covered by the reinforcement structure 200.

[0038] For example, as Figure 1 shown, the height H1 of the reinforcement structure 200 in the first direction D1 may be substantially equal to the distance L1 in the first direction D1 between the surface of the reinforcement joint portion 130a remote from the encapsulation substrate and the surface of the second side of the encapsulation substrate 100. The reinforcement structure 200 has a first surface 201 and a second surface 202 that are opposite to each other in the first direction D1. In some embodiments, the first surface of the reinforcement structure 200 is substantially flush with the surface of the reinforcement joint portion 130a remote from the encapsulation substrate 100 in a direction parallel to the main surface of the encapsulation substrate (e.g., a horizontal direction including the second direction D2), and the second surface 202 of the reinforcement structure 200 is substantially flush with the surface of the second side a2 of the encapsulation substrate 100 in a direction parallel to the main surface of the encapsulation substrate (e.g., the horizontal direction of the second direction D2). In alternative embodiments, the reinforcement structure 200 may also protrude slightly from the surface of the reinforcement joint portion 130a remote from the encapsulation substrate and / or slightly from the surface of the second side of the encapsulation substrate in the first direction.

[0039] In an embodiment where the sidewall 100s of the encapsulation substrate 100 and the sidewall 130s of the reinforcement joint 130a are substantially aligned in the first direction D1, the first reinforcement portion 200a may have a substantially uniform width. For example, the first reinforcement portion 200 includes a first reinforcement sub-portion 21 and a second reinforcement sub-portion 22. The first reinforcement sub-portion 21 at least covers the sidewall 100s of the encapsulation substrate 100, and the second reinforcement sub-portion 22 at least covers the sidewall 130s of the reinforcement joint 130a. That is, the first reinforcement sub-portion 21 overlaps the encapsulation substrate 100 in a direction parallel to the main surface of the encapsulation substrate; the second reinforcement sub-portion 22 overlaps the reinforcement joint 130a in a direction parallel to the main surface of the encapsulation substrate. It should be understood that the first reinforcement sub-portion 21 and the second reinforcement sub-portion 22 of the first reinforcement portion 200a are connected to each other and may be integrally formed. In some embodiments, the first reinforcement sub-portion 21 and the second reinforcement sub-portion 22 may have the same width W, which is the width in a direction parallel to the main surface of the encapsulation substrate (e.g., the second direction D2 or the third direction D3).

[0040] Figures 2A to 2D FIG. shows a schematic plan view of an encapsulation structure 500a according to some embodiments of the present disclosure. For the sake of simplicity and clarity of the drawing, a plurality of components of the encapsulation body 50a are not specifically shown in the plan view.

[0041] In some embodiments, the encapsulation body 50a has a plurality of sidewalls, each of which includes the corresponding sidewalls of both the encapsulation substrate and the reinforcement member (e.g., the sidewalls substantially perpendicular to the main surface of the encapsulation substrate); the first reinforcement portion of the reinforcement structure may include a plurality of sidewall reinforcement portions, and each sidewall reinforcement portion is joined to the corresponding sidewall of the encapsulation body, for example, attached to the corresponding sidewall of the encapsulation body through a sidewall adhesive layer. The sidewall reinforcement portions and the sidewalls of the encapsulation body may be arranged in a one-to-one correspondence, for example. Each sidewall reinforcement portion includes the above-mentioned first reinforcement sub-portion and second reinforcement sub-portion that are connected to each other and covers the sidewalls of both the encapsulation substrate and the reinforcement member. In some embodiments, different sidewall reinforcement portions in the reinforcement structure may be separated from each other (i.e., not in direct contact). For example, different sidewall reinforcement portions may be joined to each other, for example, bonded to each other through a sidewall adhesive layer, so as to increase the structural stability of the reinforcement structure and the overall encapsulation structure.

[0042] In some embodiments, the sidewalls of the encapsulation body include a first sidewall and a second sidewall; the first sidewall extends along a first direction and a second direction, and the second sidewall extends along the first direction and a third direction. The first reinforcing portion includes a first sidewall reinforcing portion and a second sidewall reinforcing portion. The first sidewall reinforcing portion is attached to the first sidewall of the encapsulation body through a first sidewall adhesive layer, and the second sidewall reinforcing portion is attached to the second sidewall of the encapsulation body through a second sidewall adhesive layer. For example, the first sidewall reinforcing portion and the second sidewall reinforcing portion are separated from each other. For example, the first sidewall reinforcing portion and the second sidewall reinforcing portion are also joined to each other through at least one of the first sidewall adhesive layer and the second sidewall adhesive layer.

[0043] Reference Figure 1 and Figures 2A to 2D , for example, the sidewalls 50s of the encapsulation body 50a include a first sidewall S1 and a second sidewall S2. Each first sidewall S1 of the encapsulation body 50a may include the first sidewall of the encapsulation substrate 100 and the first sidewall of the reinforcement joint portion 130a; each second sidewall S2 of the encapsulation body 50a may include the second sidewall of the encapsulation substrate 100 and the second sidewall of the reinforcement joint portion 130a. The reinforcing structure 200 may include a first sidewall reinforcing portion P1 and a second sidewall reinforcing portion P2. Viewed from a plan view, the first sidewall S1 and the second sidewall S2 extend in different directions and may intersect each other. For example, the first sidewall S1 of the encapsulation body and the first sidewall reinforcing portion P1 may extend along the second direction D2, and the second sidewall S2 of the encapsulation body and the second sidewall reinforcing portion P2 may extend along the third direction D3.

[0044] In some embodiments, viewed from a plan view, the encapsulation body 50a is square, and its first sidewall S1 includes sidewalls S1a and S1b that are parallel to each other, extend along the second direction D2, and are opposite to each other in the third direction D3. Its second sidewall S2 includes sidewalls S2a and S2b that are parallel to each other, extend along the third direction D3, and are opposite to each other in the second direction D2. Correspondingly, the first sidewall reinforcing portion P1 includes sidewall reinforcing portions P1a and P1a that are parallel to each other, extend along the second direction D2, and are opposite to each other in the third direction D3; the second sidewall reinforcing portion P2 includes sidewall reinforcing portions P2a and P2b that are parallel to each other, extend along the third direction D3, and are opposite to each other in the second direction D2.

[0045] Reference Figure 1 and Figures 2A to 2D, the adhesive layer 210 includes adhesive layers 1a, 1b, 2a, and 2b. For example, the sidewall reinforcing portion P1a is attached to the sidewall S1a of the package body 50a through the adhesive layer 1a; the sidewall reinforcing portion P1b is attached to the sidewall S1b of the package body 50a through the adhesive layer 1b; the sidewall reinforcing portion P2a is attached to the sidewall S2a of the package body 50a through the adhesive layer 2a; the sidewall reinforcing portion P2b is attached to the sidewall S2b of the package body 50a through the adhesive layer 2b. In some embodiments, the adhesive layers 1a and 1b can be referred to as the first sidewall adhesive layers; the adhesive layers 2a and 2b can be referred to as the second sidewall adhesive layers.

[0046] In some embodiments, the plurality of sidewall reinforcing portions P1a, P1b, P2a, and P2b are separated from each other (i.e., not in direct contact with each other), and can be, for example, independent metal blocks. For example, adjacent sidewall reinforcing portions among the plurality of sidewall reinforcing portions can be bonded to each other through at least one of the first sidewall adhesive layer and the second sidewall adhesive layer, thereby improving the overall structural stability of the reinforcing structure.

[0047] In some embodiments, the surface area of each sidewall reinforcing portion close to the sidewall of the package body can be greater than or equal to the area of the corresponding sidewall of the package body to which it is attached, and each sidewall of the package body can be covered (e.g., completely covered) by the sidewall reinforcing portion. For example, the extension length of each sidewall reinforcing portion in the direction parallel to the main surface of the package substrate (e.g., the second direction or the third direction) can be at least equal to the extension length of the corresponding sidewall of the package body to which it is attached in the said direction. The extension length of one or more sidewall reinforcing portions in the direction parallel to the main surface of the package substrate can be greater than the extension length of the corresponding sidewall of the package body to which it is attached in the said direction, so that the one or more sidewall reinforcing portions can also extend beyond the edge of the corresponding sidewall of the package body and extend to join with adjacent sidewall reinforcing portions. In some embodiments, the first sidewall reinforcing portion and the second sidewall reinforcing portion that intersect each other can have sidewalls or edges aligned in the extension direction of one of them, where the extension direction of the sidewall reinforcing portion refers to the extension direction in the plan view, i.e., the extension direction parallel to the main surface of the package substrate.

[0048] Figures 2A to 2D Schematically shows the situation where a plurality of sidewall reinforcing portions are attached to the sidewalls of the package body through the adhesive layer and are joined to each other.

[0049] As Figure 2AAs shown, in some examples, the extension lengths of the second sidewall reinforcing portions P2a and P2b in the third direction D3 are substantially equal to the extension lengths of the second sidewalls S2a and S2b of the package body 50a in the third direction D3, and the two opposite sidewalls of the second sidewall reinforcing portion in the third direction D3 are substantially aligned with the first sidewalls S1a and S1b of the package body 50a in the second direction D2. The extension lengths of the first sidewall reinforcing portions P1a and P1b in the second direction D2 are greater than the extension lengths of the first sidewalls S1a and S1b of the package body 50a in the second direction D2. The first sidewall reinforcing portion P1a extends beyond the corresponding edge of the package body in the second direction D2 and is further joined to the second sidewall reinforcing portions P2a and P2b through the adhesive layer 1a. The first sidewall reinforcing portion P1b extends beyond the corresponding edge of the package body in the second direction D2 and is further joined to the second sidewall reinforcing portions P2a and P2b through the adhesive layer 1b. In some embodiments, the two opposite sidewalls of each first sidewall reinforcing portion P1 in the second direction D2 may be respectively aligned with the sidewalls of the sidewall reinforcing portions P2a and P2b that are away from the package body and extend in the third direction D3 in the third direction D3.

[0050] As Figure 2B As shown, in some examples, the extension length of the sidewall reinforcing portion P2b in the third direction D3 is substantially equal to the extension length of the second sidewall S2b of the package body 50a in the third direction D3, and the two opposite sidewalls of the sidewall reinforcing portion P2b in the third direction D3 are substantially aligned with the first sidewalls S1a and S1b of the package body 50a in the second direction D2. The extension lengths of the first sidewall reinforcing portions P1a and P1b in the second direction D2 are greater than the extension lengths of the first sidewalls S1a and S1b of the package body 50a in the second direction D2; one ends of the first sidewall reinforcing portions P1a and P1b extend beyond the corresponding edges of the package body in the second direction D2 and are respectively joined to the sidewall reinforcing portion P2b through the adhesive layers 1a and 1b; the sidewalls of the other ends of the first sidewall reinforcing portions P1a and P1b may be substantially aligned with the second sidewall S2a of the package body 50a in the third direction D3. In some embodiments, the extension length of the sidewall reinforcing portion P2a in the third direction D3 is greater than the extension length of the sidewall S2a of the package body 50a in the third direction D3; the sidewall reinforcing portion P2a may extend beyond the opposite edge of the package body in the third direction D3 and is further joined to the sidewall reinforcing portions P1a and P1b through the adhesive layer 2a. For example, the two opposite sidewalls of the sidewall reinforcing portion P2a in the third direction D3 may be respectively aligned with the sidewalls of the sidewall reinforcing portions P1a and P1b that are away from the package body and extend in the second direction D2 in the second direction D2.

[0051] As Figure 2CAs shown, in some examples, the extending lengths of the first sidewall reinforcing portions P1a and P1b in the second direction D2 are substantially equal to the extending lengths of the first sidewalls S1a and S1b of the encapsulation body 50a in the second direction D2, and the two opposite sidewalls of the first sidewall reinforcing portion in the second direction D2 are substantially aligned with the second sidewalls S2a and S2b of the encapsulation body 50a in the third direction D3. The extending lengths of the second sidewall reinforcing portions P2a and P2b in the third direction D3 are greater than the extending lengths of the second sidewalls S2a and S2b of the encapsulation body 50a in the third direction D3. The second sidewall reinforcing portions can extend beyond the corresponding edges of the encapsulation body in the third direction D3 and are further joined to the first sidewall reinforcing portions P1a and P1b through an adhesive layer. In some embodiments, the two opposite sidewalls of each second sidewall reinforcing portion P2 in the third direction D3 can be respectively aligned with the sidewalls of the sidewall reinforcing portions P1a and P1b that are away from the encapsulation body and extend along the second direction D2 in the second direction D2.

[0052] As Figure 2D shown, in some examples, the extending length of the sidewall reinforcing portion P2b in the third direction D3 is substantially equal to the extending length of the second sidewall S2b of the encapsulation body 50a in the third direction D3, and the two opposite sidewalls of the sidewall reinforcing portion P2b in the third direction D3 are substantially aligned with the first sidewalls S1a and S1b of the encapsulation body 50a in the second direction D2. The extending lengths of the first sidewall reinforcing portions P1a and P1b in the second direction D2 are greater than the extending lengths of the first sidewalls S1a and S1b of the encapsulation body 50a in the second direction D2; at least one end of the first sidewall reinforcing portions P1a and P1b extends beyond the corresponding edge of the encapsulation body in the second direction D2. For example, one end of the sidewall reinforcing portion P1a can extend beyond the sidewall S2b of the encapsulation body in the second direction D2 and can be further joined to the sidewall reinforcing portion P2b through a first adhesive layer 1a; the sidewall of the other end of the sidewall reinforcing portion P1a can be substantially aligned with the sidewall S2a of the encapsulation body in the third direction D3. For example, the sidewall reinforcing portion P1b can extend beyond the opposite edge of the encapsulation body in the second direction D2 and can be further joined to the sidewall reinforcing portion P2b and the sidewall reinforcing portion P2a through a first adhesive layer 1b. In some embodiments, the extending length of the sidewall reinforcing portion P2a in the third direction D3 is greater than the extending length of the sidewall S2a of the encapsulation body 50a in the third direction D3; one end of the sidewall reinforcing portion P2a can extend beyond the sidewall S1a of the encapsulation body in the third direction D3 and can be further joined to the sidewall reinforcing portion P1a through a second adhesive layer 2a; the sidewall of the other end of the sidewall reinforcing portion P2a can be substantially aligned with the sidewall S1b of the encapsulation body in the second direction D2 and is joined to the sidewall reinforcing portion P2a.

[0053] It should be understood that Figures 2A to 2DThe planar shape of the package body shown and the arrangement of the plurality of sidewall reinforcing portions are taken as examples for illustration, and the present disclosure is not limited thereto. In other embodiments, the package body may also have other shapes, and the arrangement of the plurality of sidewall reinforcing portions may be adaptively adjusted according to the shape of the package body such that sidewall reinforcing portions are provided on each sidewall of the package body. Adjacent sidewall reinforcing portions may be joined to each other. In the above example, every two adjacent sidewall reinforcing portions are joined to each other; in alternative embodiments, one or more groups of adjacent sidewall reinforcing portions may also not be joined to each other.

[0054] Return reference Figure 1 , in some embodiments, the reinforcing member 130 may be a reinforcing lid (lid) SL and further includes a top cover portion 130b1 and a connecting portion 130c. For example, the top cover portion 130b1 may extend in a direction parallel to the main surface of the package substrate and may be attached to the surface of the chip 110 on the side away from the package substrate through a thermal interface material (TIM). In some embodiments, the reinforcing lid may also be used as a heat dissipation lid. The top cover portion 130b1 is connected to the reinforcing joint portion 130a through the connecting portion 130c, and the chip 110 may be located in the region enclosed by the reinforcing lid and the package substrate. In some embodiments, the top cover portion 130b1 and the reinforcing joint portion 130a may be at different horizontal heights relative to the main surface of the package substrate 100, and the connecting portion 130c may be, for example, inclined, but the present disclosure is not limited thereto.

[0055] In some embodiments, relative to the surface of the first side a1 of the package substrate 100, the surface of the reinforcing joint portion 130a on the side away from the package substrate and the first surface 201 of the first reinforcing portion in the reinforcing structure are at a lower horizontal height than the surface of the chip 110 on the side away from the package substrate. That is, in the first direction D1 perpendicular to the main surface of the package substrate, the distance between the surface of the reinforcing joint portion 130a on the side away from the package substrate and the surface of the first side a1 of the package substrate 100 and the distance between the first surface 201 of the first reinforcing portion and the surface of the first side a1 of the package substrate 100 are less than the distance between the surface of the chip 110 on the side away from the package substrate and the surface of the first side a1 of the package substrate, but the present disclosure is not limited thereto. For example, in other embodiments, relative to the surface of the first side a1 of the package substrate 100, the surface of the reinforcing joint portion 130a on the side away from the package substrate and the first surface 201 of the first reinforcing portion in the reinforcing structure may also be flush with or higher than the surface of the chip 110 on the side away from the package substrate.

[0056] In some embodiments, the encapsulation body 50a of the encapsulation structure 500a further includes an underfill layer 115. The underfill layer 115 fills the space between the chip 110 and the encapsulation substrate 100 and surrounds and protects a plurality of conductive connectors 112. In some embodiments, a conductive connector 150 is disposed on a side of the encapsulation substrate 100 away from the chip 110. The conductive connector 150 is electrically connected to the chip 110 through the encapsulation substrate 100, and the encapsulation structure 500a can be further connected to other encapsulation components or electronic components through the conductive connector 150, but the present disclosure is not limited thereto. The conductive connector 150 may include solder balls, such as BGA. In some embodiments, the encapsulation structure 500a can be further connected to a circuit board (not shown), such as a printed circuit board (PCB). For example, when the encapsulation structure 500a is mounted on the circuit board, the circuit board is located on a side of the encapsulation substrate 100 away from the chip 110 in the first direction D1, and the conductive connector 150 is located between the circuit board and the encapsulation substrate to provide electrical connection between the encapsulation structure and the circuit board.

[0057] In some embodiments, an additional device 120 may further be disposed on the encapsulation substrate 100. The additional device 120 may be or include an electronic device such as a capacitor, and the present disclosure does not limit the type of the additional device. The electronic device 120 is electrically connected to the encapsulation substrate 100 and can be coupled to the chip 110a. In some embodiments, the electronic device 120 and the chip 110a are disposed on the same side of the encapsulation substrate 100, but the present disclosure is not limited thereto. In other embodiments, the additional device 120 and the chip 110a may also be disposed on opposite sides of the encapsulation substrate 100. It should be understood that the position and number of the additional devices 120 shown in the figure are only illustrative, and the present disclosure is not limited thereto. In this document, the encapsulation body refers to the components in the encapsulation structure other than the reinforcing structure and the adhesive layer for joining the reinforcing structure; that is, the conductive connector 150 and the electronic device 120 also belong to the encapsulation body.

[0058] Embodiments of the present disclosure provide a method for manufacturing an encapsulation structure, including: providing an encapsulation body including a chip and having a front side and a back side opposite to each other in a first direction; providing a carrier plate and placing a reinforcing structure on the carrier plate; and picking up the encapsulation body and joining the encapsulation body to the reinforcing structure to form an encapsulation structure, where the reinforcing structure at least includes a first reinforcing portion that joins to a side wall of the encapsulation body and surrounds the encapsulation body in a direction parallel to a main surface of the encapsulation body.

[0059] In some embodiments, picking up a package body and bonding the package body to a reinforcement structure includes: picking up the package body, aligning a first sidewall of the package body with a first sidewall reinforcement portion, and bonding the first sidewall of the package body to the first sidewall reinforcement portion, thereby forming an intermediate package structure including the package body and the first sidewall reinforcement portion; and picking up the intermediate package structure, aligning a second sidewall of the package body with a second sidewall reinforcement portion, and bonding the intermediate package structure to the second sidewall reinforcement portion.

[0060] Figures 3 to 9 Schematic structural views showing steps in a method of manufacturing a package structure according to some embodiments of the present disclosure, where Figures 3 to 5 、 Figure 6A 、 Figure 7A 、 Figure 8 and Figure 9 are side views or cross-sectional views, Figure 6B and Figure 7B are top views.

[0061] Referring to Figure 3 , in some embodiments, a package body 50a is provided and placed on a carrier 60. For example, multiple package bodies 50a can be placed on the carrier 60, and the packaging process can be performed on multiple package bodies simultaneously, thereby forming multiple package structures simultaneously and improving production efficiency. It should be understood that for the sake of simplicity of the drawings, the specific structure of the package body 50a is not shown in Figures 3 to 9 , and the structure of the package body 50a can be referred to the relevant content above.

[0062] For example, when the package body 50a includes a package substrate, a chip, and a reinforcement member, after the formation process of the package body 50a is completed, the package body 50a is placed on the carrier 60 with its side facing up; the said side of the package body 50a can be one of its multiple sidewalls. That is to say, one of the multiple sidewalls of the package body 50a faces up, and the other of the multiple sidewalls (e.g., sidewall S1 or S2) faces the carrier 60. The formation process of the package body 50a can include mounting the chip to the package substrate, and bonding the reinforcement member to the package substrate, etc.

[0063] Referring to Figure 4 and Figure 5 , a picking process is performed to pick up the package body 50a from the carrier 60. For example, the pick-up head 61 is moved above the carrier 60, and then the pick-up head 61 is lowered towards the carrier 60 to suck up the package body 50a.

[0064] Figure 6A and Figure 6B Schematically show a schematic side view and a top view of placing a reinforcement structure 200 on another carrier. Figure 7A andFigure 7B A schematic side view and a top view schematically showing the formation of an adhesive layer on a reinforcing structure on another carrier board.

[0065] Reference Figure 6A and Figure 6B , provide another carrier board 70, and place the reinforcing structure 200 on the carrier board 70. Each reinforcing structure 200 shown in this step can be a sidewall reinforcing part (e.g., a metal block) in the first reinforcing part 200a, and the size of the sidewall reinforcing part corresponds to the size of the sidewall of the corresponding package body away from the pick-up head. The number of reinforcing structures 200 placed on the carrier board 70 can be the same as the number of package bodies 50a picked up by the pick-up head. Figure 5 in

[0066] Reference Figure 7A and Figure 7B , form an adhesive layer 210 on the reinforcing structure 200. For example, the adhesive layer 210 can be applied on the reinforcing structure 200 through a dispensing process. In this step, the size of the adhesive layer 210 (e.g., the width, area, etc. in the direction parallel to the main surface of the carrier board) can be smaller than the size of the corresponding reinforcing structure 200.

[0067] In some embodiments, Figure 5 the step of picking up the package body shown and Figures 6A to 7B the steps shown can be carried out synchronously. Alternatively, before picking up the package body, for example, while any one or more of the steps in Figures 3 to 5 are being carried out, the steps shown in Figures 6A to 7B can be carried out synchronously to improve production efficiency.

[0068] Reference Figure 8 , bond the package body 50a picked up by the pick-up head 61 to the reinforcing structure 200. For example, the pick-up head 61 can be controlled to move above the reinforcing structure 200 on the carrier board 70, then place the package body 50a above the corresponding reinforcing structure 200 and align the package body 50a with the reinforcing structure 200. The pick-up head 61 can apply a downward (i.e., toward the reinforcing structure) mechanical force to the package body 50a so that the package body 50a adheres to the reinforcing structure 200 through the adhesive layer 210. During the bonding process, the adhesive layer 210 is subjected to the extrusion force from the package body 50a and / or the reinforcing structure, so that it can extend between the package body and the reinforcing structure. In some embodiments, after the bonding is completed, the area of the adhesive layer 210 in the direction parallel to the main surface of the carrier board can be substantially the same as the area of the reinforcing structure 200.

[0069] Reference Figure 9 , remove the pick-up head 61, thus completing the attachment of one sidewall of the package body 50a to the corresponding sidewall reinforcing part and forming an intermediate package structure. In some embodiments, the above steps can be repeated.Figures 3 to 9 such that each surface of the encapsulation body 50a that needs to be joined to the reinforcement structure is joined to the corresponding reinforcement portion. In some embodiments, after attaching the encapsulation body 50a and multiple reinforcement portions of the reinforcement structure, a curing process may be further performed to cure the adhesive layer and form the encapsulation structure 500a.

[0070] Figure 10 FIG. shows a schematic cross-sectional view of an encapsulation structure 500b according to some other embodiments of the present disclosure; Figure 11 FIG. shows a schematic bottom view of an encapsulation structure 500b according to some other embodiments of the present disclosure. The encapsulation structure 500b is similar to the encapsulation structure 500a, except that: the reinforcement structure of the encapsulation structure 500b further includes a second reinforcement portion. The following will describe in detail the differences of the encapsulation structure 500b, and other features of the encapsulation structure 500b may refer to the content described for the encapsulation structure 500a.

[0071] Refer to Figure 10 and Figure 11 , in some embodiments, in the encapsulation structure 500b, the reinforcement structure 200 includes a first reinforcement portion 200a and a second reinforcement portion 200b. The first reinforcement portion 200a is attached to multiple side walls of the encapsulation body 50a through the adhesive layer 210. The second reinforcement portion 200b may be disposed on the back side BS of the encapsulation body 50a and joined to the edge portion of the encapsulation body. For example, the second reinforcement portion 200b is disposed on the second side a2 of the encapsulation substrate 100 and joined to the edge portion of the encapsulation substrate 100. For example, the second reinforcement portion 200b may be attached to the edge portion of the encapsulation substrate 100 through an adhesive layer (or referred to as a second adhesive layer) 220. In some embodiments, the first reinforcement portion 200a and the second reinforcement portion 200b may be joined to each other. The thickness and width of the second reinforcement portion 200b and the thickness and width of the adhesive layer 220 may be selected according to product design and requirements, and the thickness of the second reinforcement portion 200b may be the same as or different from the thickness of the first reinforcement portion 200a, and the thickness of the adhesive layer 220 may be the same as or different from the thickness of the adhesive layer 210.

[0072] The material of the second reinforcement portion 200b may be the same as or different from the material of the first reinforcement portion 200a. The material of the adhesive layer 220 may be the same as or different from the material of the adhesive layer 210. For example, the second reinforcement portion 200b includes a metal material, such as at least one selected from pure metals such as gold, silver, copper, iron, aluminum, zinc, tin, lead, cobalt, nickel, tungsten, chromium, molybdenum, titanium, manganese, zirconium and their alloy materials. For example, the adhesive layer 220 may be selected from at least one of organic material adhesives (such as epoxy resin, phenol aldehyde, polyacrylate, polyvinyl acetate adhesives) and inorganic compound adhesives (such as silicate, phosphate, oxide, nitride inorganic material adhesives).

[0073] In some embodiments, the height H2 of the first reinforcing portion 200a in the first direction D1 perpendicular to the main surface of the package substrate may be greater than the height of the side wall 50s of the package body, that is, greater than the distance L1 between the surface of the reinforcement joint 130a on the side away from the package substrate and the surface of the second side of the package substrate 100 in the first direction D1. For example, the first surface 201 of the first reinforcing portion 200a is substantially flush with the surface of the reinforcement joint 130a on the side away from the package substrate in a direction parallel to the main surface of the package substrate, while the second surface 202 of the first reinforcing portion 200a and the surface of the second side a2 of the package substrate 100 are at different horizontal heights. For example, the first reinforcing portion 200a protrudes (i.e., extends beyond) the surface of the second side of the package substrate in the first direction D1 (e.g., the direction away from the reinforcement joint), that is, the distance of the second surface 202 of the first reinforcing portion 200a from the surface of the first side a1 of the package substrate in the first direction D1 is greater than the distance of the surface of the second side a2 of the package substrate from the surface of its first side a1 in the first direction D1.

[0074] The first reinforcing portion 200a and the second reinforcing portion 200b may be joined to each other by at least one of the first adhesive layer and the second adhesive layer. For example, the portion of the first reinforcing portion 200a that extends beyond the surface of the second side of the package substrate may be attached to the second reinforcing portion 200b by at least one of the adhesive layer 210 and the adhesive layer 220.

[0075] Reference Figure 10 and Figure 11 In some embodiments, the second reinforcing portion 200b may be annular, and the annulus corresponds to the planar shape of the package body (e.g., its package substrate). That is, the planar contour of the second reinforcing portion 200b is consistent with the planar contour of the package body (e.g., the package substrate), for example, substantially the same. For example, when the planar shape of the package body is square, the second reinforcing portion 200b is square-annular, and when the planar shape of the package body is other shapes such as circular, the planar shape of the second reinforcing portion 200b is annular with other corresponding shapes such as circular.

[0076] For example, the second reinforcing portion 200b may have an inner side wall IS and an outer side wall OS that are opposite to each other in a direction parallel to the main surface of the package substrate; a plurality of conductive connectors 150 may be located in the region surrounded by the inner side wall IS of the second reinforcing portion 200b. The outer side wall OS of the second reinforcing portion 200b may be substantially aligned with the side wall of the package body 50a (e.g., the side wall of the package substrate 100 or the side walls of both the package substrate 100 and the reinforcement joint 130a) in the first direction D1. The first reinforcing portion 200a may be joined to the outer side wall OS of the second reinforcing portion 200b.

[0077] In some embodiments, the first reinforcing portion 200a and the second reinforcing portion 200b are separated from each other and joined to each other through an adhesive layer. That is, a part of the adhesive layer may be located between the first reinforcing portion 200a and the second reinforcing portion 200b. In some embodiments, the plurality of sidewall reinforcing portions of the first reinforcing portion 200a are respectively joined to corresponding portions of the second reinforcing portion 200b. For example, the plurality of sidewall reinforcing portions are respectively attached to the corresponding portions of the second reinforcing portion 200b through corresponding adhesive layers.

[0078] For example, the second reinforcing portion 200b includes a plurality of portions extending along the second direction D2 and the third direction D3. The plurality of portions are respectively joined to the edge portions of the encapsulation substrate extending along the second direction D2 and the direction D3, and are joined to corresponding sidewall reinforcing portions. The plurality of portions of the second reinforcing portion 200b are connected to each other and may be integrally formed. That is, there is no interface between the plurality of portions of the second reinforcing portion 200b. This can improve the structural stability of the second reinforcing portion 200b.

[0079] In some embodiments, the surface of the second reinforcing portion 200b on the side away from the encapsulation substrate and the second surface 202 of the first reinforcing portion 200a may be substantially flush in a direction parallel to the main surface of the encapsulation substrate (for example, a horizontal direction including the second direction D2 and the third direction D3).

[0080] In Figure 11 the plan view of the shown encapsulation structure 500b, the first reinforcing portion 200a is configured in the same manner as Figure 2A shown, but it should be understood that the first reinforcing portion 200a in the encapsulation structure 500b may also be configured in Figures 2B to 2D or other suitable manners.

[0081] In some embodiments, the manufacturing method of the encapsulation structure 500b is similar to that of the encapsulation structure 500a, and the difference is only that: in the manufacturing method of the encapsulation structure 500b, it further includes joining the second reinforcing portion to the back side of the encapsulation body, and in some embodiments, it further includes joining the second reinforcing portion and the first reinforcing portion to each other.

[0082] For example, in the manufacturing method of the encapsulation structure, picking up the encapsulation body and joining the encapsulation body to the reinforcing structure includes: picking up the encapsulation body such that the back side of the encapsulation body faces the second reinforcing portion, and joining the back side of the encapsulation body to the second reinforcing portion to form an intermediate encapsulation structure; and picking up the intermediate encapsulation structure such that the sidewall of the encapsulation body faces the first reinforcing portion, and joining the first reinforcing portion to the sidewall of the encapsulation body, or joining the first reinforcing portion to the sidewalls of both the encapsulation body and the second reinforcing portion. In this embodiment, the encapsulation body may be joined to the second reinforcing portion first and then to the first reinforcing portion, but the present disclosure is not limited thereto.

[0083] In the encapsulation structure 500b, the outer sidewall OS of the second reinforcing portion is aligned with the corresponding sidewall of the encapsulation body, and the first reinforcing portion protrudes from the surface of the second side of the encapsulation substrate to be joined to the second reinforcing portion, but the present disclosure is not limited thereto. In an alternative embodiment, the second surface 202 of the first reinforcing portion 200a is substantially flush with the surface of the second side of the encapsulation substrate in a direction parallel to the main surface of the encapsulation substrate, and the second reinforcing portion 200b can further extend beyond the sidewall of the encapsulation body in a direction parallel to the main surface of the encapsulation substrate and extend to be joined to the second surface 202 of the first reinforcing portion 200a. For example, the portion of the second reinforcing portion 200a protruding beyond the sidewall of the encapsulation body in a direction parallel to the main surface of the encapsulation substrate can be attached to the second surface 202 of the first reinforcing portion 200a by at least one of the first adhesive layer and the second adhesive layer (e.g., the second adhesive layer); in this example, the outer sidewall OS of the second reinforcing portion 200b can be substantially aligned with the sidewall of the first reinforcing portion 200a away from the encapsulation body and extending along the first direction D1 in the first direction D1. In some embodiments, the encapsulation body can be joined to the first reinforcing portion first and then to the second reinforcing portion.

[0084] Figure 12 FIG. shows a schematic cross-sectional view of an encapsulation structure 500c according to still other embodiments of the present disclosure. The encapsulation structure 500c is similar to the encapsulation structure 500a, except that: in the reinforcing structure of the encapsulation structure 500c, the first reinforcing sub-portion and the second reinforcing sub-portion of the first reinforcing portion have different widths.

[0085] Refer to Figure 12 , in some embodiments, the sidewall 130s of the reinforcing joint 130a of the reinforcing member 130 and the sidewall 100s of the encapsulation substrate 100 may not be aligned in the first direction D1 perpendicular to the main surface of the encapsulation substrate. For example, the sidewall 130s of the reinforcing member 130 is offset toward the chip 110 in a direction parallel to the main surface of the encapsulation substrate (e.g., the second direction D2 or the third direction D3) with respect to the sidewall 100s of the encapsulation substrate 100. That is, in a direction parallel to the main surface of the encapsulation substrate, the distance between the sidewall 130s of the reinforcing member 130s and the chip 110 is less than the distance between the corresponding sidewall 100s of the encapsulation substrate 100 and the chip 110. In some embodiments, the reinforcing structure 200 can further extend to cover a partial surface of the first side a1 of the encapsulation substrate 100.

[0086] For example, the reinforcement joint portion 130a is joined to the edge portion of the package substrate 100, and the end portion of the package substrate 100 between the edge portion and the side wall 100s is not covered by the reinforcement joint portion 130a. For example, the first reinforcement portion 200a of the reinforcement structure 200 may also be joined to the surface of the end portion of the package substrate 100 located on the first side a1. The first reinforcement portion 200a may be attached to the side wall 100s of the package substrate 100 and a partial surface of its first side a1 (i.e., the surface of the end portion) and the side wall 130s of the reinforcement member 130 through the adhesive layer 210. In some embodiments, one or more (e.g., all) of the multiple side walls of the reinforcement member 130 are respectively offset relative to the corresponding side walls of the package substrate. Correspondingly, one or more side wall reinforcement portions of the first reinforcement portion 200a further extend to join the end portion of the package substrate not covered by the reinforcement member.

[0087] For example, the portions of the adhesive layer 210 corresponding to the one or more side wall reinforcement portions (i.e., Figures 2A - 2D one or more of the adhesive layers 1a, 1b, 2a, 2b shown in) may each continuously extend along the corresponding side wall of the package substrate 100 and the surface of the first side of its end portion, as well as the side wall 130s of the adhesive layer 128 and the reinforcement joint portion 130a; one or more side wall reinforcement portions of the first reinforcement portion 200a are attached to the side wall of the package substrate and a partial surface of its first side, as well as the side wall of the reinforcement joint portion through the corresponding adhesive layer.

[0088] In some embodiments, the first reinforcement portion 200a includes a first reinforcement sub - portion 21 and a second reinforcement sub - portion 22. The first reinforcement sub - portion 21 overlaps at least with the package substrate 100 in a direction parallel to the main surface of the package substrate and is joined to the side wall of the package substrate. The second reinforcement sub - portion 22 overlaps at least with the reinforcement joint portion 130a in a direction parallel to the main surface of the package substrate, and is joined to the side wall of the reinforcement joint portion 130a and a partial surface of the first side a1 of the package substrate. In some embodiments, the width W2 of the second reinforcement sub - portion 22 in a direction parallel to the main surface of the package substrate (e.g., the second direction D2 or the third direction D3) is greater than the width W1 of the first reinforcement sub - portion 21 in the direction parallel to the main surface of the package substrate (e.g., the second direction D2 or the third direction D3).

[0089] In some embodiments, the sides of the first reinforcement sub - portion 21 and the second reinforcement sub - portion 22 away from the side walls of the package substrate and the reinforcement member may be substantially aligned with each other in a first direction D1 perpendicular to the main surface of the package substrate, and the side of the second reinforcement sub - portion 22 facing the reinforcement joint portion protrudes from the side wall of the first reinforcement sub - portion 21 close to the package substrate in a direction parallel to the main surface of the package substrate. In some embodiments, the second reinforcement sub - portion 22 may overlap with the end portion of the package substrate 100 in the first direction D1 perpendicular to the main surface of the package substrate.

[0090] In this embodiment, similar to the encapsulation structure 500a, the height H1 of the first reinforcing portion 200a may be approximately equal to the distance L1 in the first direction D1 between the surface of the reinforcement joint portion 130a away from the encapsulation substrate and the surface of the second side of the encapsulation substrate 100. The first surface 201 of the first reinforcing portion 200a may be substantially flush with the surface of the reinforcement joint portion 130a away from the encapsulation substrate in a direction parallel to the main surface of the encapsulation substrate, and the second surface 202 of the first reinforcing portion 200a may be substantially flush with the surface of the second side a2 of the encapsulation substrate 100 in a direction parallel to the main surface of the encapsulation substrate.

[0091] In this embodiment, the first reinforcing sub-portion and the second reinforcing sub-portion of each sidewall reinforcing portion may also be integrally formed, and the method of forming the first reinforcing portion on the encapsulation body is the same as that of the foregoing embodiment, which will not be elaborated herein.

[0092] Figure 13 FIG. shows a schematic cross-sectional view of an encapsulation structure 500d according to still some other embodiments of the present disclosure. The encapsulation structure 500d is similar to the encapsulation structure 500c, except that: the first reinforcing sub-portion and the second reinforcing sub-portion of the first reinforcing portion in the reinforcing structure of the encapsulation structure 500d have different widths.

[0093] Reference Figure 13 , in some embodiments, in the encapsulation structure 500d, the reinforcing structure 200 includes a first reinforcing portion 200a and a second reinforcing portion 200b. The structure of the second reinforcing portion 200b and its positional relationship with the first reinforcing portion 200a are similar to those of the foregoing embodiment, which will not be elaborated herein.

[0094] In some embodiments, the first reinforcing portion 200a of the encapsulation structure 500d is similar to the first reinforcing portion structure of the encapsulation structure 500c, except that in the encapsulation structure 500d, the first reinforcing portion 200a is further joined to the second reinforcing portion 200b.

[0095] For example, in this embodiment, the sidewall 130s of the reinforcement joint portion 130a of the reinforcement member 130 is offset toward the chip 110 in a direction parallel to the main surface of the encapsulation substrate with respect to the sidewall 100s of the encapsulation substrate 100, such that the end portion of the encapsulation substrate is not covered by the reinforcement member 130. The second reinforcing sub-portion 22 of the first reinforcing portion 200a further extends to join with the surface of the end portion of the encapsulation substrate located on the first side a1, and the width W2 of the second reinforcing sub-portion 22 may be greater than the width W1 of the first reinforcing sub-portion 21. Other related features of the first reinforcing portion 200a may be referred to the descriptions of the encapsulation structures 500b and 500c in the foregoing embodiments, which will not be elaborated herein.

[0096] In the encapsulation structures 500a to 500d, the reinforcement member 130 uses a reinforcement cover, but the present disclosure is not limited thereto. The reinforcement member 130 may also use other types of reinforcement members, for example, it may be a reinforcement top hat, a stiffener, or any other suitable type of reinforcement member, as long as the reinforcement member covers the edge portion of the encapsulation substrate on the encapsulation substrate to prevent warping thereof.

[0097] Figure 14 , Figure 15 , Figure 16 , Figure 17 Schematic cross-sectional views of encapsulation structures 600a, 600b, 600c, and 600d according to other embodiments of the present disclosure are respectively shown. The encapsulation structures 600a to 600d are respectively similar to the foregoing encapsulation structures 500a to 500d, except that the reinforcement member 130 in the encapsulation structures 600a to 600d uses a reinforcement top hat.

[0098] Referring Figures 14 to 17 , in some embodiments, the reinforcement member 130 uses a reinforcement top hat SH and may include a reinforcement joint portion 130a and a hat part 130b2. The hat part 130b2 may also be referred to as a top cover part. The reinforcement joint portion 130a is annular and may extend in a first direction D1 perpendicular to the main surface of the encapsulation substrate to the same height as the hat part 130b2 and is connected to the hat part 130b2. The hat part 130b2 may extend in a direction parallel to the main surface of the encapsulation substrate to be directly connected to the reinforcement joint portion 130a. The hat part 130b2 is attached to the surface of the chip 110 on the side away from the encapsulation substrate 100 through a thermal interface material layer 131.

[0099] In some embodiments, the surfaces of the reinforcement joint portion 130a and the hat part 130b2 on the side away from the encapsulation substrate may be substantially flush in a direction parallel to the main surface of the encapsulation substrate. The reinforcement structure 200 is joined to the side wall 100s of the encapsulation substrate 100 and the side wall 130s of the reinforcement joint portion 130a. In some embodiments, the first surface 201 of the first reinforcement portion 200a of the reinforcement structure 200 may be substantially flush with the surfaces of both the reinforcement joint portion 130a and the hat part 130b2 of the reinforcement member 130 on the side away from the encapsulation substrate in a direction parallel to the main surface of the encapsulation substrate.

[0100] In these embodiments, with respect to the surface of the first side a1 of the encapsulation substrate 100, the surface of the reinforcement joint 130a on the side away from the encapsulation substrate and the first surface 201 of the first reinforcement portion are at a higher level than the surface of the chip 110 on the side away from the encapsulation substrate. That is, in the first direction D1 perpendicular to the main surface of the encapsulation substrate, the distance between the surface of the reinforcement joint 130a on the side away from the encapsulation substrate and the surface of the first side a1 of the encapsulation substrate 100 and the distance between the first surface 201 of the first reinforcement portion and the surface of the first side a1 of the encapsulation substrate 100 are greater than the distance between the surface of the chip 110 on the side away from the encapsulation substrate and the surface of the first side a1 of the encapsulation substrate.

[0101] The other features in the encapsulation structures 600a to 600d are respectively substantially the same as the relevant features in the foregoing encapsulation structures 500a to 500d, and reference may be made to the description of the encapsulation structures 500a to 500d above, which will not be repeated here.

[0102] Figure 18 、 Figure 19 、 Figure 20 、 Figure 21 Schematic cross-sectional views of encapsulation structures 700a, 700b, 700c, and 700d according to some other embodiments of the present disclosure are respectively shown. The encapsulation structures 700a to 700d are respectively similar to the foregoing encapsulation structures 500a to 500d, except that the reinforcement members 130 in the encapsulation structures 700a to 700d adopt stiffeners.

[0103] Refer to Figures 18 to 21 , in some embodiments, the reinforcement member 130 adopts a stiffener SF, and may only include the reinforcement joint 130a without including the top cover portion. The reinforcement joint 130a is joined to the edge portion of the encapsulation substrate and is annular. The chip 110 may be located in the region surrounded by the reinforcement joint 130a in the direction parallel to the main surface of the encapsulation substrate. In this embodiment, the surface of the chip 110 on the side away from the encapsulation substrate 100 may be exposed.

[0104] Relative to the surface of the first side a1 of the encapsulation substrate 100, the surface of the reinforcement joint 130a away from the encapsulation substrate and the surface of the chip 110 away from the encapsulation substrate may be at the same or different levels. For example, in the first direction D1 perpendicular to the main surface of the encapsulation substrate, the distance between the surface of the reinforcement joint 130a away from the encapsulation substrate and the surface of the first side a1 of the encapsulation substrate 100 may be greater than, less than, or approximately equal to the distance between the surface of the chip 110 away from the encapsulation substrate and the surface of the first side a1 of the encapsulation substrate 100. The first surface 201 of the first reinforcement portion 200a of the reinforcement structure 200 may be substantially flush with the surface of the reinforcement joint 130a away from the encapsulation substrate in a direction parallel to the main surface of the encapsulation substrate.

[0105] The other features of the encapsulation structures 700a to 700d are respectively substantially the same as the relevant features of the encapsulation structures 500a to 500d, and reference may be made to the description of the encapsulation structures 500a to 500d above, which will not be elaborated herein.

[0106] In the encapsulation structure of the embodiments of the present disclosure, by providing a reinforcement structure at least on the side wall of the encapsulation body, warping of the encapsulation structure can be avoided or significantly reduced, thereby improving the device performance and reliability of the encapsulation structure. For example, it is possible to avoid defects such as bridging short circuits of conductive connectors (e.g., solder balls), solder non-wetting open circuits, and pillow effects caused by warping after the encapsulation structure is mounted on a PCB, thereby ensuring an effective connection between the encapsulation structure and the PCB and improving the device performance and reliability.

[0107] In the encapsulation structure, the reinforcement member provided on the front side of the encapsulation structure can also be beneficial to reducing the warping of the encapsulation structure; theoretically, it is also possible to optimize the warping of the encapsulation structure by increasing the dimensions such as the thickness and width of the reinforcement member (e.g., its reinforcement joint) and / or replacing the material of the reinforcement member. However, in the case where the space on the front side of the encapsulation structure is limited, the thickness that the reinforcement member can increase is limited; moreover, since space needs to be reserved on the surface of the encapsulation substrate for arranging additional devices such as capacitors, the width that the reinforcement joint can increase is also limited; and replacing the material of the reinforcement member may increase the cost. That is to say, the effect of reducing warping by improving the reinforcement member is limited. By providing a reinforcement structure in the encapsulation structure of the embodiments of the present disclosure to avoid or reduce encapsulation warping, there is no need to be restricted by the above-mentioned space limitations, and common metal materials can be used to form the reinforcement structure, so that a significant reduction in encapsulation warping can be achieved at a relatively low cost.

[0108] To more intuitively characterize the optimization of the encapsulation structure of the present application for device warping, taking the FCBGA encapsulation as an example, the encapsulation structures of each embodiment are modeled and simulated to compare and test the warping conditions of these encapsulation structures before and after adding the reinforcement structure.

[0109] For example, through the first group of simulation tests, the warpage conditions of the package structures of the first comparative example and the package structures 500a and 500b of the embodiments of the present disclosure are compared; through the second group of simulation tests, the warpage conditions of the package structures of the second comparative example and the package structures 600a and 600b of the embodiments of the present disclosure are compared; through the third group of simulation tests, the warpage conditions of the package structures of the third comparative example and the package structures 700a and 700b of the embodiments of the present disclosure are compared. In each group of simulation tests, the reinforcing structure is removed from the package structure of the comparative example compared with the package structure of the embodiment of the present disclosure, that is, the structure of the package body in the package structure of the comparative example is the same as that of the package structure of the embodiment of the present disclosure. The dimensions of the relevant components of each package structure in the simulation test are shown in Table 1 below. It should be understood that the same components in each package structure in the same group of simulation tests use the same dimensions.

[0110] Table 1:

[0111] Component name Dimensions of the corresponding material Reinforcement cover SL Length * width * thickness = 47.5 mm * 47.5 mm * 1 mm, reinforcement joint width = 4 mm Reinforcement top cap SH Length * width * thickness = 47.5 mm * 47.5 mm * 1 mm, reinforcement joint width = 4 mm Reinforcement member SF Length * width * thickness = 47.5 mm * 47.5 mm * 1 mm, reinforcement joint width = 4 mm First reinforcement part 200a Thickness = 1 mm Adhesive layer 210 Thickness = 0.1 mm Second reinforcement part 200b Thickness = 0.2 mm; width = 0.4 mm Adhesive layer 220 Thickness = 0.1 mm Thermal interface material 131 Length * width * thickness = 24.4 mm * 10.2 mm * 0.08 mm Chip 110 Length * width * thickness = 25.7 mm * 10.7 mm * 0.8 mm Underfill layer 115 Length * width * thickness = 25.7 mm * 10.7 mm * 0.06 mm Adhesive layer 128 Thickness = 0.1 mm; width = 4 mm Package substrate 100 Length * width * thickness = 47.5 mm * 47.5 mm * 1.5 mm

[0112] In Table 1, the length and width of each component refer to the corresponding dimensions in the direction parallel to the main surface of the package substrate, that is, the dimensions in the plan view; the thickness of each component is the thickness (or height) of the component material in the direction perpendicular to its extending direction. For example, the thicknesses of the first reinforcing part 220a and the adhesive layer 210 refer to their thicknesses in the direction parallel to the main surface of the package substrate. The thicknesses of the second reinforcing part 200b and the adhesive layer 220 refer to their thicknesses in the direction perpendicular to the main surface of the package substrate. The width of the second reinforcing part 200b refers to its width in the direction parallel to the main surface of the package substrate.

[0113] Considering that the absolute value of the warpage of the package structure is the largest at room temperature and high temperature, the simulation tests are carried out at room temperature (25 °C) and high temperature (260 °C) to test the warpage values of the package structures of various embodiments of the present disclosure and the package structures of the corresponding comparative examples at the above temperatures.

[0114] Figure 22A 、 Figure 22B 、 Figure 22C Respectively show the simulation nephograms of the package structure of the first comparative example, the package structure 500a, and the package structure 500b in the first group of simulation tests carried out at a temperature of 25 °C. Figure 23A 、 Figure 23B 、 Figure 23CThe simulation nephograms of the encapsulation structure of the first comparative example, the encapsulation structure 500a, and the encapsulation structure 500b of the first group of simulation tests conducted at a temperature of 260°C are respectively shown. It should be noted that the simulation nephograms of the encapsulation structures shown in the present disclosure only show the simulation nephograms of the encapsulation structures from the central region (for example, the left region in the figure) to an edge region (the right region in the figure), and do not show the entire region of the encapsulation structure. Table 2 shows the results of the first group of simulation tests, which specifically shows the warpage values of the encapsulation structure of the first comparative example, the encapsulation structure 500a, and the encapsulation structure 500b at temperatures of 25°C and 260°C.

[0115] Table 2:

[0116]

[0117] It should be understood that when the warpage value of the encapsulation structure is 0, it represents that the encapsulation structure has no warpage; when the warpage value of the encapsulation structure is a non-zero value, the closer the warpage value is to 0, that is, the smaller the absolute value of the warpage value, the lower the warpage degree of the structure. When the warpage value of the encapsulation structure is a positive value, the encapsulation structure shows a frowning face (i.e., convex deformation) warpage, and the smaller the warpage value, the lower the warpage degree; when the warpage value of the encapsulation structure is a negative value, the encapsulation structure shows a smiling face (i.e., concave deformation) warpage, and the larger the warpage value (i.e., the smaller the absolute value), the lower the warpage degree.

[0118] As Figures 22A to 22C and shown in Table 2, under low-temperature conditions such as room temperature (for example, 25°C), the encapsulation structure of the first comparative example shows a frowning face warpage. Although the encapsulation structures 500a and 500b of the embodiments of the present disclosure also show a frowning face warpage, the warpage degrees of the encapsulation structures 500a and 500b are significantly reduced. Specifically, as shown in Table 2, under low-temperature conditions, compared with the encapsulation structure of the first comparative example, the warpage of the encapsulation structure 500a is optimized (i.e., reduced) by about 25%, and the warpage of the encapsulation structure 500b is optimized (i.e., reduced) by about 25.4%.

[0119] As Figures 23A to 23C and shown in Table 2, under high-temperature conditions (for example, 260°C), the encapsulation structure of the first comparative example shows a smiling face (i.e., concave deformation) warpage. Although the encapsulation structures 500a and 500b of the embodiments of the present disclosure also show a smiling face warpage, the warpage degrees of the encapsulation structures 500a and 500b are significantly reduced. Specifically, as shown in Table 2, under high-temperature conditions, compared with the encapsulation structure of the first comparative example, the warpage of the encapsulation structure 500a is optimized (i.e., reduced) by about 12.4%, and the warpage of the encapsulation structure 500b is optimized (i.e., reduced) by about 13.6%.

[0120] From Figures 22A to 23CAs can be seen from Table 2, under the same temperature conditions, the warpage degrees of the encapsulation structures 500a and 500b of the present disclosure embodiments are lower than those of the encapsulation structure of the first comparative example. Therefore, by providing the reinforcement structure, the encapsulation warpage can be significantly reduced. On the other hand, under the same temperature conditions, the absolute values of the warpage values of the encapsulation structure 500b are smaller than those of the encapsulation structure 500a; that is, the warpage degree of the encapsulation structure 500b is lower than that of the encapsulation structure 500a. This is because in the encapsulation structure 500a, the reinforcement structure only includes the first reinforcement part joined to the encapsulation body, while in the encapsulation structure 500b, the reinforcement structure includes the first reinforcement part and also includes the second reinforcement part provided on the back side of the encapsulation body; in the encapsulation structure 500b, by providing the second reinforcement part, the warpage of the encapsulation structure can be further reduced.

[0121] Figure 24A 、 Figure 24B 、 Figure 24C Respectively show the simulation nephograms of the encapsulation structure of the second comparative example, the encapsulation structure 600a, and the encapsulation structure 600b in the second group of simulation tests conducted at a temperature of 25°C. Figure 25A 、 Figure 25B 、 Figure 25C Respectively show the simulation nephograms of the encapsulation structure of the second comparative example, the encapsulation structure 600a, and the encapsulation structure 600b in the second group of simulation tests conducted at a temperature of 260°C. Table 3 shows the results of the second group of simulation tests, which specifically shows the warpage values of the encapsulation structure of the second comparative example, the encapsulation structure 600a, and the encapsulation structure 600b at temperatures of 25°C and 260°C.

[0122] Table 3:

[0123]

[0124] As Figures 24A to 24C As shown in Table 3, under low-temperature conditions such as room temperature (for example, 25°C), the encapsulation structure of the second comparative example shows a frowning warpage. Although the encapsulation structures 600a and 600b of the present disclosure embodiments also show a frowning warpage, the warpage degrees of the encapsulation structures 600a and 600b are significantly reduced. Specifically, as shown in Table 3, under low-temperature conditions, compared with the encapsulation structure of the second comparative example, the warpage of the encapsulation structure 600a is optimized (i.e., reduced) by about 26.1%, and the warpage of the encapsulation structure 600b is optimized (i.e., reduced) by about 26.7%.

[0125] As Figures 25A to 25CAs shown in Table 3, at high temperature conditions (e.g., 260 °C), the encapsulation structure of the second comparative example warps into a smiling face (i.e., concave deformation). Although the encapsulation structures 600a and 600b of the embodiments of the present disclosure also show smiling face warping, the degree of warping of the encapsulation structures 600a and 600b is significantly reduced. Specifically, as shown in Table 3, at high temperature conditions, compared with the encapsulation structure of the second comparative example, the warping of the encapsulation structure 600a is optimized (i.e., reduced) by about 15.8%, and the warping of the encapsulation structure 600b is optimized (i.e., reduced) by about 17%.

[0126] From Figures 24A to 25C and Table 3, it can be seen that under the same temperature conditions, the degrees of warping of the encapsulation structures 600a and 600b of the embodiments of the present disclosure are both lower than that of the encapsulation structure of the second comparative example. Therefore, by setting the reinforcement structure, the encapsulation warping can be significantly reduced. On the other hand, under the same temperature conditions, the absolute value of the warping value of the encapsulation structure 600b is smaller than that of the encapsulation structure 600a; that is, the degree of warping of the encapsulation structure 600b is lower than that of the encapsulation structure 600a. This is because in the encapsulation structure 600a, the reinforcement structure only includes the first reinforcement part joined to the encapsulation body, while in the encapsulation structure 600b, the reinforcement structure includes the first reinforcement part and also includes the second reinforcement part provided on the back side of the encapsulation body; in the encapsulation structure 600b, by setting the second reinforcement part, the warping of the encapsulation structure can be further reduced.

[0127] Figure 26A 、 Figure 26B 、 Figure 26C respectively show the simulation nephograms of the encapsulation structure of the third comparative example, the encapsulation structure 700a, and the encapsulation structure 700b in the third group of simulation tests conducted at a temperature of 25 °C. Figure 27A 、 Figure 27B 、 Figure 27C respectively show the simulation nephograms of the encapsulation structure of the third comparative example, the encapsulation structure 700a, and the encapsulation structure 700b in the third group of simulation tests conducted at a temperature of 260 °C. Table 4 shows the results of the third group of simulation tests, which specifically shows the warping values of the encapsulation structure of the third comparative example, the encapsulation structure 700a, and the encapsulation structure 700b at temperatures of 25 °C and 260 °C.

[0128] Table 4:

[0129]

[0130] As Figures 26A to 26CAs shown in Table 4, at low temperatures such as room temperature (e.g., 25°C), the encapsulation structure of the third comparative example shows a frowning warpage. Although the encapsulation structures 700a and 700b of the embodiments of the present disclosure also show frowning warpage, the degree of warpage of the encapsulation structures 700a and 700b is significantly reduced. Specifically, as shown in Table 4, at low temperature conditions, compared with the encapsulation structure of the third comparative example, the warpage optimization (i.e., reduction) of the encapsulation structure 700a is about 10.3%, and the warpage optimization (i.e., reduction) of the encapsulation structure 700b is about 11%.

[0131] As Figures 27A to 27C As shown in Table 4, at high temperature conditions (e.g., 260°C), the encapsulation structure of the third comparative example shows a smiling face (i.e., concave deformation) warpage. Although the encapsulation structures 700a and 700b of the embodiments of the present disclosure also show smiling face warpage, the degree of warpage of the encapsulation structures 700a and 700b is significantly reduced. Specifically, as shown in Table 4, at high temperature conditions, compared with the encapsulation structure of the third comparative example, the warpage optimization (i.e., reduction) of the encapsulation structure 700a is about 9.1%, and the warpage optimization (i.e., reduction) of the encapsulation structure 700b is about 10.8%.

[0132] From Figures 26A to 27C As can be seen from Table 4, under the same temperature conditions, the warpage degrees of the encapsulation structures 700a and 700b of the embodiments of the present disclosure are both lower than that of the encapsulation structure of the third comparative example. Therefore, by setting the reinforcing structure, the encapsulation warpage can be significantly reduced. On the other hand, under the same temperature conditions, the absolute value of the warpage value of the encapsulation structure 700b is smaller than the absolute value of the warpage value of the encapsulation structure 700a; that is, the warpage degree of the encapsulation structure 700b is lower than that of the encapsulation structure 700a. This is because in the encapsulation structure 700a, the reinforcing structure only includes the first reinforcing portion bonded to the encapsulation body, while in the encapsulation structure 700b, the reinforcing structure includes the first reinforcing portion and also includes the second reinforcing portion provided on the back side of the encapsulation body; in the encapsulation structure 700b, by setting the second reinforcing portion, the warpage of the encapsulation structure can be further reduced.

[0133] Combining the above simulation test results, it can be seen that compared with the encapsulation structure without the reinforcing structure in the comparative example, the encapsulation structures of various embodiments of the present disclosure can significantly reduce the encapsulation warpage by setting the reinforcing structure, thereby improving the performance and reliability of the device.

[0134] In the above embodiments, the concept of the present application is described by taking the flip-chip encapsulation as an example. It should be understood that the concept of the present disclosure for reducing or avoiding the encapsulation warpage by setting the reinforcing structure on the encapsulation body can be applied to any type of encapsulation structure, such as other types of encapsulation structures such as fan-out packages, and the present disclosure does not limit the type of the encapsulation structure.

[0135] The following points need to be explained:

[0136] (1) In the accompanying drawings of the embodiments of the present disclosure, only the structures related to the embodiments of the present disclosure are involved, and other structures can refer to the general design.

[0137] (2) Without conflict, the features in the same embodiment and different embodiments of the present disclosure can be combined with each other.

[0138] The above is only the specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of changes or substitutions, which should all be covered by the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. An encapsulation structure, comprising: An encapsulation body, including a chip, and having a front side and a back side that are opposite to each other in a first direction and side walls connecting the front side and the back side, wherein the side of the encapsulation body where the chip is disposed is the front side of the encapsulation body; And A reinforcement structure, at least including a first reinforcement portion, the first reinforcement portion being joined to the side wall of the encapsulation body and surrounding the encapsulation body in a direction parallel to the main surface of the encapsulation body.

2. The encapsulation structure according to claim 1, wherein the encapsulation body further includes: An encapsulation substrate, having a first side and a second side that are opposite to each other in the first direction, wherein the chip is disposed on the first side of the encapsulation substrate and is electrically connected to the encapsulation substrate, and the second side of the encapsulation substrate is located on the back side of the encapsulation body; And A reinforcement member, located on the first side of the encapsulation substrate, and including a reinforcement joint portion, the reinforcement joint portion being joined to the edge portion of the encapsulation substrate, and the chip being located in an area surrounded by the reinforcement member in a direction parallel to the main surface of the encapsulation substrate, wherein the side wall of the encapsulation body includes the side wall of the encapsulation substrate and the side wall of the reinforcement joint portion.

3. The encapsulation structure according to claim 1 or 2, wherein the first reinforcement portion is attached to the side wall of the encapsulation body through a first adhesive layer.

4. The encapsulation structure according to claim 2, wherein the orthographic projections of the encapsulation substrate and the reinforcement joint portion on a reference plane parallel to the side wall of the encapsulation substrate are located within the orthographic projection of the reinforcement structure on the reference plane.

5. The encapsulation structure according to claim 4, wherein the height of the reinforcement structure in the first direction is greater than or equal to the distance in the first direction between the surface of the side of the reinforcement joint portion away from the encapsulation substrate and the surface of the second side of the encapsulation substrate.

6. The encapsulation structure according to claim 2, wherein the reinforcement structure has a first surface and a second surface that are opposite to each other in the first direction, and the first surface of the reinforcement structure is flush with the surface of the side of the reinforcement joint portion away from the encapsulation substrate in a direction parallel to the main surface of the encapsulation substrate.

7. The encapsulation structure according to claim 6, wherein The second surface of the reinforcement structure is flush with the surface of the second side of the encapsulation substrate in a direction parallel to the main surface of the encapsulation substrate; or In the first direction, the distance between the second surface of the reinforcement structure and the surface of the first side of the encapsulation substrate is greater than the distance between the surface of the second side and the surface of the first side of the encapsulation substrate.

8. The encapsulation structure according to claim 2, wherein the side wall of the reinforcement joint portion is flush with the side wall of the encapsulation substrate in the first direction perpendicular to the main surface of the encapsulation substrate; or The side wall of the reinforced joint portion is offset toward the chip with respect to the side wall of the package substrate in a direction parallel to the main surface of the package substrate, and the reinforcing structure further extends to cover a partial surface of the first side of the package substrate.

9. The package structure according to any one of claims 2, 4-8, wherein the first reinforcing portion includes: a first reinforcing sub-portion that overlaps the package substrate in a direction parallel to the main surface of the package substrate; and a second reinforcing sub-portion that overlaps the reinforced joint portion in a direction parallel to the main surface of the package substrate, and the first reinforcing sub-portion and the second reinforcing sub-portion are connected to each other.

10. The package structure according to claim 9, wherein the width of the second reinforcing sub-portion in a direction parallel to the main surface of the package substrate is greater than or equal to the width of the first reinforcing sub-portion in a direction parallel to the main surface of the package substrate.

11. The package structure according to claim 1 or 2, wherein the side wall of the package body includes a first side wall and a second side wall, the first side wall extends along the first direction and the second direction, the second side wall extends along the first direction and the third direction, the second direction and the third direction are perpendicular to the first direction, parallel to the main surface of the package body, and intersect with each other; the first reinforcing portion includes a first side wall reinforcing portion and a second side wall reinforcing portion, the first side wall reinforcing portion is joined to the first side wall of the package body through a first side wall adhesive layer, and the second side wall reinforcing portion is joined to the second side wall of the package body through a second side wall adhesive layer.

12. The package structure according to claim 11, wherein the first side wall reinforcing portion and the second side wall reinforcing portion are separated from each other.

13. The package structure according to claim 11, wherein the first side wall reinforcing portion and the second side wall reinforcing portion are joined to each other through at least one of the first side wall adhesive layer and the second side wall adhesive layer.

14. The package structure according to any one of claims 1, 2, 4-8, wherein the reinforcing structure further includes a second reinforcing portion, the second reinforcing portion is disposed on the back side of the package body and joined to an edge portion of the package body, and the first reinforcing portion and the second reinforcing portion are joined to each other.

15. The package structure according to claim 14, wherein the second reinforcing portion is annular and integrally formed.

16. The package structure according to claim 14, wherein the first reinforcing portion is attached to the side wall of the package body through a first adhesive layer; the second reinforcing portion is attached to the back side of the package body through a second adhesive layer; and the first reinforcing portion and the second reinforcing portion are joined to each other through at least one of the first adhesive layer and the second adhesive layer.

17. The package structure according to claim 1, wherein the reinforcing member further includes a top cover portion, the top cover portion is connected to the reinforced joint portion and attached to the surface of the chip on the side away from the package substrate.

18. A manufacturing method of a packaging structure, comprising: providing a packaging body, the packaging body including a chip and having a front side and a back side that are opposite to each other in a first direction; providing a carrier board and placing a reinforcing structure on the carrier board; and picking up the packaging body and bonding the packaging body to the reinforcing structure to form the packaging structure, wherein the reinforcing structure at least includes a first reinforcing portion, and the first reinforcing portion is bonded to a side wall of the packaging body and surrounds the packaging body in a direction parallel to a main surface of the packaging body.

19. The manufacturing method of the packaging structure according to claim 18, wherein the side wall of the packaging body includes a first side wall and a second side wall, the first side wall extends along the first direction and a second direction, the second side wall extends along the first direction and a third direction, the second direction and the third direction are perpendicular to the first direction, parallel to the main surface of the packaging body, and intersect with each other; the first reinforcing portion includes a first side wall reinforcing portion and a second side wall reinforcing portion, and picking up the packaging body and bonding the packaging body to the reinforcing structure includes: picking up the packaging body, making the first side wall of the packaging body face the first side wall reinforcing portion, and bonding the first side wall of the packaging body to the first side wall reinforcing portion, thereby forming an intermediate packaging structure including the packaging body and the first side wall reinforcing portion; and picking up the intermediate packaging structure, making the second side wall of the packaging body face the second side wall reinforcing portion, and bonding the intermediate packaging structure to the second side wall reinforcing portion.

20. The manufacturing method of the packaging structure according to claim 18, wherein the reinforcing structure further includes a second reinforcing portion, and picking up the packaging body and bonding the packaging body to the reinforcing structure includes: picking up the packaging body, making the back side of the packaging body face the second reinforcing portion, and bonding the back side of the packaging body to the second reinforcing portion to form an intermediate packaging structure; and picking up the intermediate packaging structure, making the side wall of the packaging body face the first reinforcing portion, and bonding the first reinforcing portion to the side wall of the packaging body, or bonding the first reinforcing portion to the side walls of both the packaging body and the second reinforcing portion.

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