Test pad

By designing the groove and body limit structure on the circuit board test pad, the problem of slippage of the probe contact part is solved, the risk of wear and short circuit is reduced, and the reliability and efficiency of the test are improved.

CN120224550APending Publication Date: 2025-06-27CHIPBOND TECH
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Patent Information

Application Number
CN202410092618.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-12-27
Filing Date
2024-01-23
Publication Date
2025-06-27

AI Technical Summary

Technical Problem

When the carrier plate is warped, the probe contacts are prone to slip, resulting in test failure and increased friction and wear, which may lead to short circuits and lower product yields.

Method used

A test pad is designed that includes grooves to limit slippage of the probe contact portion, the width of the groove is not greater than the outer diameter of the contact portion, and through the design of the body and the limit portion, ensuring that the groove surrounds the body and the limit portion surrounds the groove to prevent the contact portion from slipping out.

Benefits of technology

It effectively avoids the probe contact part slipping out of the test pad, reduces friction and wear, reduces the risk of short circuit, and improves the reliability and efficiency of the test.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to a test pad, which is arranged on a carrier plate together with at least one circuit, is used for being contacted with a contact part of a probe, and comprises a groove which is used for limiting the contact part so as to prevent the contact part from sliding out of the test pad.
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Description

Technical Field

[0001] The present invention relates to a test pad, which is disposed on a carrier board (such as a flexible substrate, a glass substrate, a silicon substrate, etc.) together with at least one circuit to form a circuit board. The groove of the test pad can prevent the contact portion of the probe from slipping out of the test pad when contacting the test pad. Background Art

[0002] Please refer to Figures 1 to 3 , the conventional circuit board 10 has a carrier board 11 and a circuit layer 12. The circuit layer 12 has at least one circuit 12a and at least one test pad 12b. And a part of the circuit of the circuit layer 12 (not shown in the figure) is covered by a solder mask layer 13. When the carrier board 11 warps, the test pad 12b will bend or tilt along with the carrier board 11.

[0003] Please refer to Figure 2 and Figure 3 , when the carrier board 11 warps, if the probe 20 of a test mechanism (not shown in the figure, such as a probe card Probecard, etc.) contacts the test pad 12b for testing, the contact portion 21 of the probe 20 will slip out of the test pad 12b, resulting in a test failure. To prevent the contact portion 21 from slipping out of the test pad 12b, the pressure of the probe 20 pressing the test pad 12b is increased to force the probe 20 to press the test pad 12b. However, relatively, the friction between the contact portion 21 and the test pad 12b is also increased, thereby causing wear of the contact portion 21 and the test pad 12b, and thus reducing the service life of the probe 20 and the circuit board 10.

[0004] In addition, when the pressure of pressing the test pad 12b is increased, the friction between the contact portion 21 and the test pad 12b will also increase, and thus wear particles (not shown in the figure) of the contact portion 21 and / or the test pad 12b are generated. If the wear particles adhere to the contact portion 21 or the test pad 12b, it will cause a short circuit of the test mechanism or the circuit board 10, thereby reducing the product yield and the test efficiency. Moreover, to avoid the occurrence of a short circuit, the cleaning frequency of the probe 20 must be increased, thus reducing the test efficiency. Summary of the Invention

[0005] The main object of the present invention is to provide a test pad, which is disposed on a carrier board, and the groove of the test pad can prevent the contact portion of the probe from slipping out of the test pad.

[0006] A test pad of the present invention is disposed on a carrier board together with at least one circuit. The test pad is used for the contact portion of the probe to contact. The test pad includes at least one groove, and the groove is used to limit the contact portion from slipping out of the test pad. And the test pad has a side edge for the contact portion to contact.

[0007] Preferably, the width of the groove is not greater than the outer diameter of the contact portion.

[0008] Preferably, it further includes a body and a limiting portion, and the groove is located between the body and the limiting portion.

[0009] Preferably, the groove surrounds the body.

[0010] Preferably, the limiting portion surrounds the groove.

[0011] Preferably, the area of the body is not less than the area of the groove.

[0012] Preferably, the body is connected to the circuit, and the edge of the limiting portion is connected to the circuit.

[0013] Preferably, the body is connected to the circuit, and the edge of the limiting portion is connected to the body.

[0014] Preferably, the limiting portion is connected to the circuit by its edge, the test pad further includes a connecting rib, two sides of the connecting rib are respectively connected to the body and the limiting portion, a first axis passes through the limiting portion, the connecting rib and the body, a second axis passes through the limiting portion, the groove and the body, and there is an included angle between the first axis and the second axis.

[0015] Preferably, the limiting portion is connected to the circuit by its edge, the test pad further includes a connecting rib, two sides of the connecting rib are respectively connected to the body and the limiting portion, a first axis passes through the limiting portion, the connecting rib and the body, a second axis passes through the limiting portion, the groove and the body, and the first axis is parallel to the second axis.

[0016] Preferably, the groove includes a plurality of unconnected sectional grooves, and there is at least one connecting rib between two adjacent sectional grooves, and two sides of the connecting rib are respectively connected to the body and the limiting portion.

[0017] Preferably, the connecting rib is located at the corner of the body.

[0018] Preferably, the shape of the groove is selected from various solid geometric shapes, and the area of the body of the test pad is not less than the area of the groove.

[0019] When the contact portion of the probe contacts the test pad in the present invention, the contact portion is restricted by the groove to solve the problem that the contact portion slides out of the test pad. Description of the Drawings

[0020] Figure 1 : Schematic diagram of a conventional circuit board and test pad.

[0021] Figure 2 : Schematic diagram of a conventional test pad.

[0022] Figure 3 : Cross-sectional view of a conventional test pad.

[0023] Figure 4 : Schematic diagram of the circuit board and test pad of the present invention.

[0024] Figure 5 : Schematic diagram of the test pad of the present invention.

[0025] Figure 6 : Cross-sectional view of the test pad of the present invention.

[0026] Figures 7 to 11 : Schematic diagram of the test pad of the present invention.

[0027]

Description of Main Component Symbols

[0028] 10: Circuit board 11: Carrier board

[0029] 12: Circuit layer 12a: Circuit

[0030] 12b: Test pad 13: Solder mask layer

[0031] 20: Probe 21: Contact part

[0032] 100: Circuit board 110: Carrier board

[0033] 120: Test pad 121: Body

[0034] 121a: Corner 122: Groove

[0035] 122a: Side edge 122b: Section groove

[0036] 122c: Connecting rib 123: Limiting part

[0037] 123a: End edge 130: Circuit

[0038] 140: Solder mask layer A: Included angle

[0039] D: Outer diameter W: Width

[0040] X: First axis Y: Second axis Detailed Description of the Invention

[0041] Please refer to Figures 4 to 6, a test pad 120 of the present invention is disposed on a carrier board 110 together with at least one circuit 130 to form a circuit board 100. The test pad 120 and the circuit 130 can be formed by etching and other processes on a metal layer (not shown in the figure) disposed on the carrier board 110. And some circuits (not shown in the figure) are covered by a solder mask layer 140. However, the present invention does not limit the manufacturing methods of the test pad 120 and the circuit 130 in this way. The material of the carrier board 110 can be selected from polyimide (PI), polyethylene terephthalate (PET), etc. The test pad 120 is connected to the circuit 130.

[0042] Please refer to Figures 4 to 6 , the test pad 120 is used for the contact portion 21 of the probe 20 of a test mechanism (not shown in the figure, such as a probe card Probe card, etc.) to contact for testing. The test pad 120 includes at least one groove 122, and the groove 122 is used to limit the contact portion 21 from slipping out of the test pad 120. The groove 122 has a side edge 122a. Please refer to Figure 5 , Figures 7 to 11 , the shape of the groove 122 is selected from various three-dimensional geometric shapes. Please refer to Figure 6 , the groove 122 has a width W, and the width W is not greater than the outer diameter D of the contact portion 21 of the probe 20.

[0043] Please refer to Figure 5 and Figure 6 , the test pad 120 further includes a body 121 and a limiting portion 123. The groove 122 is located between the body 121 and the limiting portion 123. The body 121 is connected to the circuit 130. Please refer to Figure 5 , the groove 122 surrounds the body 121, and the limiting portion 123 surrounds the groove 122. The end edge 123a of the limiting portion 123 is connected to the circuit 130. Preferably, the area of the body 121 is not less than the area of the groove 122. Please refer to Figure 7 , in different embodiments, the end edge 123a of the limiting portion 123 is connected to the body 121.

[0044] Please refer to Figure 5 and Figure 6 , when the contact portion 21 of the probe 20 contacts the test pad 120, the groove 122 restricts the contact portion 21 from slipping out of the test pad 120. And when the probe 20 slips to the groove 122, the contact portion 21 contacts the side edge 122a of the groove 122, so that the probe 20 can still test the test pad 120.

[0045] Please refer to Figure 8, in different embodiments, the limiting portion 123 connects to the circuit 130 at the edge 123a. The test pad 120 further includes a connecting rib 122c. Two sides of the connecting rib 122c are respectively connected to the body 121 and the limiting portion 123. The first axis X passes through the limiting portion 123, the connecting rib 122c and the body 121. The second axis Y passes through the limiting portion 123, the groove 122 and the body 121. There is an included angle A between the first axis X and the second axis Y. Please refer to Figure 9 , the difference between it and Figure 8 is that the first axis X is parallel to the second axis Y.

[0046] Please refer to Figure 9 and Figure 10 , in different embodiments, the groove 122 includes a plurality of non-connected section grooves 122b. There is at least one connecting rib 122c between two adjacent section grooves 122b. Two sides of the connecting rib 122c are respectively connected to the body 121 and the limiting portion 123. Preferably, the connecting rib 122c is located at the corner 121a of the body 121 to increase the strength of the connection between the limiting portion 123 and the body 121, and enable the groove 122 to limit the sliding of the contact portion 21 out of the test pad 120.

[0047] When the contact portion 21 of the probe 20 contacts the test pad 120 in the present invention, the groove 122 restricts the contact portion 21 to prevent the contact portion 21 from sliding out of the test pad 120, solving the problems in the prior art of increasing the pressure of the probe pressing the test pad, resulting in wear, short circuit of the contact portion and the test pad, and increasing the frequency of cleaning the probe.

[0048] The above are only the preferred embodiments of the present invention, and do not impose any formal restrictions on the present invention. Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to equivalent embodiments by using the above-disclosed technical content within the scope of the technical solution of the present invention. However, as long as it does not depart from the content of the technical solution of the present invention, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A test pad, arranged on a carrier board with at least one circuit, the test pad being used for contact with a contact portion of a probe, characterized in that: The test pad comprises at least one groove, and the groove is used for limiting the contact part from sliding out of the test pad. The test pad has a side edge, and the side edge is used for the contact part to contact.

2. The test pad according to claim 1, characterized in that: The width of the groove is not greater than the outer diameter of the contact portion.

3. The test pad according to claim 1, characterized in that: It also includes a body and a limiting portion, and the groove is located between the body and the limiting portion.

4. The test pad according to claim 3, characterized in that: The groove surrounds the body.

5. The test pad according to claim 4, characterized in that: The limiting portion surrounds the groove.

6. The test pad according to claim 3, characterized in that: The area of ​​the body is not less than the area of ​​the groove.

7. The test pad according to claim 3, characterized in that: The main body is connected to the circuit, and the end edge of the limiting portion is connected to the circuit.

8. The test pad according to claim 3, characterized in that: The main body is connected to the circuit, and the end edge of the limiting portion is connected to the main body.

9. The test pad according to claim 3, characterized in that: The limiting portion is connected to the circuit with an end edge, and the test pad further includes a connecting rib, and two sides of the connecting rib are respectively connected to the main body and the limiting portion. The first axis passes through the limiting portion, the connecting rib and the main body, and the second axis passes through the limiting portion, the groove and the main body. There is an angle between the first axis and the second axis.

10. The test pad according to claim 3, characterized in that: The limiting portion is connected to the circuit with an end edge, and the test pad further includes a connecting rib, and two sides of the connecting rib are respectively connected to the body and the limiting portion, a first axis passes through the limiting portion, the connecting rib and the body, and a second axis passes through the limiting portion, the groove and the body, and the first axis is parallel to the second axis.

11. The test pad according to claim 3, characterized in that: The groove includes a plurality of unconnected segment grooves, and at least one connecting rib is provided between two adjacent segment grooves. Two sides of the connecting rib are respectively connected to the main body and the limiting portion.

12. The test pad according to claim 9, characterized in that: The connecting rib is located at a corner of the body.

13. The test pad according to claim 1, characterized in that: The shape of the groove is selected from various three-dimensional geometric shapes, and the area of ​​the main body of the test pad is not less than the area of ​​the groove.