Multi-layer board pressing equipment and multi-layer board pressing process for circuit board production

Abstract

The invention discloses multilayer board pressing equipment and a multilayer board pressing process for circuit board production. The multilayer board pressing equipment for circuit board production comprises a base station, a pressing device and a film covering device. The film covering device comprises an unwinding roller, a clamping assembly, a film covering support, a left side film covering transferring assembly and a right side film covering transferring assembly. The film covering support is fixed to the base table, the unwinding roller and the clamping assembly are located above the right side and below the left side of the film covering support respectively, and the left side film covering transferring assembly and the right side film covering transferring assembly are arranged on the film covering support. The driving assembly is used for independently driving each left side film covering transferring rod and each right side film covering transferring rod. According to the multi-layer board pressing equipment and the multi-layer board pressing process for circuit board production, the traditional processing thought of equally cutting coiled prepregs is abandoned, the prepregs are prevented from wrinkling in the stacking process, the film covering procedure and the pressing procedure are achieved on one station and do not need to be moved, and the pressing effect is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board production, and particularly to a multi-layer board pressing device and a multi-layer board pressing process for printed circuit board production. Background Art

[0002] During the production process of printed circuit boards, one of the processes is to press multi-layer boards. First, the inner-layer printed circuit boards are subjected to browning treatment, aiming to form a uniform browning film with specific roughness and chemical activity on the copper surface, enhance the bonding force between the inner-layer circuits and the prepreg, and prevent delamination; next, according to the designed number of layers, the browned inner-layer printed circuit boards and prepregs are laminated to ensure accurate positioning of each layer; finally, the laminated multi-layer boards are placed in a pressing machine, and the prepregs are melted and flowed under the action of high temperature and high pressure to firmly bond each layer of printed circuit boards to form a multi-layer board structure.

[0003] In the traditional pressing process of multi-layer boards, first, a roll of prepreg is equally cut by a cutting machine to obtain several single prepregs of the required size. One inner-layer printed circuit board is placed on a platform, and then a prepreg is stacked on it. Then, another inner-layer printed circuit board is placed, and then another prepreg is stacked. This process is repeated to alternately stack multiple inner-layer printed circuit boards and multiple prepregs together to obtain a semi-finished product to be pressed. After obtaining the semi-finished product, it is also necessary to move the semi-finished product to the pressing station and then place it in a pressing machine for pressing. During the moving process, the inner-layer printed circuit boards are also prone to displacement, resulting in poor pressing.

[0004] As can be seen from the above, the above pressing process is cumbersome, and the roll of prepreg needs to be equally cut. During the lamination process, the soft prepreg is extremely prone to wrinkling, which affects the pressing effect and is prone to defective products. Summary of the Invention

[0005] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a multi-layer board pressing device and a multi-layer board pressing process for printed circuit board production, abandoning the traditional processing idea of equally cutting a roll of prepreg, preventing the prepreg from wrinkling during the lamination process, and enabling the film covering process and the pressing process to be realized at one station without moving, improving the pressing effect.

[0006] The purpose of the present invention is achieved through the following technical solutions:

[0007] A multi-layer board pressing device for printed circuit board production includes: a base, a pressing device located directly above the base, and a film covering device located between the base and the pressing device;

[0008] The film laminating device includes: an unwinding roller, a clamping assembly, a film laminating bracket, a left film laminating transfer assembly, and a right film laminating transfer assembly; the film laminating bracket is fixed on the base, the unwinding roller and the clamping assembly are respectively located above the right side and below the left side of the film laminating bracket, and the left film laminating transfer assembly and the right film laminating transfer assembly are arranged on the film laminating bracket; the left film laminating transfer assembly includes a plurality of left film laminating transfer rods arranged at intervals in the height direction, and the right film laminating transfer assembly includes a plurality of right film laminating transfer rods arranged at intervals in the height direction;

[0009] Wherein, the film laminating device further includes a driving assembly, and the driving assembly is used to individually drive each of the left film laminating transfer rods and each of the right film laminating transfer rods, so that each of the left film laminating transfer rods and each of the right film laminating transfer rods independently move back and forth between the left side and the right side of the film laminating bracket.

[0010] In one embodiment, the film laminating bracket includes a front support plate and a rear support plate that are parallel and spaced apart from each other, and a plurality of corresponding sliding guide grooves are formed in both the front support plate and the rear support plate;

[0011] Both ends of each of the left film laminating transfer rods are respectively slidably arranged in one of the sliding guide grooves of the front support plate and the rear support plate, both ends of each of the right film laminating transfer rods are respectively slidably arranged in one of the sliding guide grooves of the front support plate and the rear support plate, and the sliding tracks of each of the left film laminating transfer rods and each of the right film laminating transfer rods are independent and do not interfere with each other.

[0012] In one embodiment, the driving assembly includes a plurality of rodless cylinders, and each of the rodless cylinders is used to drive the corresponding left film laminating transfer rod or the right film laminating transfer rod to reciprocate along the corresponding sliding guide groove.

[0013] In one embodiment, a pressing accommodation groove is provided on the base, and the pressing accommodation groove is located between the front support plate and the rear support plate.

[0014] In one embodiment, the multi-layer board pressing device for printed circuit board production further includes a left board feeding manipulator and a right board feeding manipulator, and the left board feeding manipulator and the right board feeding manipulator are respectively located on the left side and the right side of the base.

[0015] A multi-layer board pressing process for printed circuit board production, which is realized based on the above-mentioned multi-layer board pressing device for printed circuit board production, includes the following steps:

[0016] Step 1, place the rolled-up prepreg in the unwinding roller, unwind the rolled-up prepreg in the unwinding roller, and fasten one end of the rolled-up prepreg on the clamping assembly;

[0017] Step 2: Place the first inner layer circuit board on the base, and the driving component drives the left film covering transfer rod at the bottom layer to move from the left to the right, so that the prepreg covers the first inner layer circuit board;

[0018] Step 3: Stack the second inner layer circuit board on the first inner layer circuit board. The second inner layer circuit board and the first inner layer circuit board are separated by the prepreg. The driving component drives the right film covering transfer rod at the bottom layer to move from the right to the left, so that the prepreg covers the second inner layer circuit board;

[0019] Step 4: Stack the third inner layer circuit board on the second inner layer circuit board. The third inner layer circuit board and the second inner layer circuit board are separated by the prepreg. The driving component drives the left film covering transfer rod at the second bottom layer to move from the left to the right, so that the prepreg covers the third inner layer circuit board;

[0020] Step 5: Stack the fourth inner layer circuit board on the third inner layer circuit board. The fourth inner layer circuit board and the third inner layer circuit board are separated by the prepreg. The driving component drives the right film covering transfer rod at the second bottom layer to move from the right to the left, so that the prepreg covers the third inner layer circuit board;

[0021] Step 6: And so on, so that multiple inner layer circuit boards and prepregs are alternately stacked;

[0022] Step 7: The pressing device presses the multiple inner layer circuit boards and multiple prepregs that are alternately stacked to obtain a multi-layer board semi-finished product with the target number of layers;

[0023] Step 8: Take out the multi-layer board semi-finished product from the base and remove the redundant prepreg at the edge to obtain the multi-layer board finished product.

[0024] The multi-layer board pressing equipment and multi-layer board pressing process for circuit board production of the present invention abandon the traditional processing idea of equally dividing and cutting the rolled prepreg, prevent the prepreg from wrinkling during the stacking process, and enable the film covering process and the pressing process to be realized at one station without moving, improving the pressing effect. Description of the Drawings

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, so they should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0026] Figure 1 Schematic diagram of a multi-layer board lamination device for circuit board production according to an embodiment of the present invention;

[0027] Figure 2 is Figure 1 Stereogram of the film laminating device shown;

[0028] Figure 3 is Figure 1 Plan view of the film laminating device shown;

[0029] Figure 4 Schematic diagram (1) of laminating an inner layer circuit board using the film laminating device;

[0030] Figure 5 Schematic diagram (2) of laminating an inner layer circuit board using the film laminating device;

[0031] Figure 6 Schematic diagram (3) of laminating an inner layer circuit board using the film laminating device;

[0032] Figure 7 Schematic diagram (4) of laminating an inner layer circuit board using the film laminating device;

[0033] Figure 8 Schematic diagram of taking out the multi-layer board semi-finished product from the base. Detailed implementation manners

[0034] For the convenience of understanding the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the disclosure of the present invention can be understood more thoroughly and comprehensively.

[0035] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be a middle element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only embodiments.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0037] As shown Figure 1 in the figure, the present invention discloses a multi-layer board pressing device 10 for circuit board production, which includes: a base 20, a pressing device 30 located directly above the base 20, and a film covering device 40 located between the base 20 and the pressing device 30.

[0038] Next, the specific structure of the film covering device 40 will be described:

[0039] As shown Figure 2 in the figure, the film covering device 40 includes: a unwind roller 100 (as shown Figure 1 in the figure), a clamping assembly 200, a film covering bracket 300, a left film covering transfer assembly 400, and a right film covering transfer assembly 500. The film covering bracket 300 is fixed on the base 20. The unwind roller 100 and the clamping assembly 200 are respectively located above the right side and below the left side of the film covering bracket 300. The left film covering transfer assembly 400 and the right film covering transfer assembly 500 are arranged on the film covering bracket 300. As shown Figure 3 in the figure, the left film covering transfer assembly 400 includes a plurality of left film covering transfer rods 410 arranged at intervals in the height direction, and the right film covering transfer assembly 500 includes a plurality of right film covering transfer rods 510 arranged at intervals in the height direction.

[0040] As shown Figure 2 in the figure, the film covering device 40 further includes a driving assembly 600. The driving assembly 600 is used to drive each left film covering transfer rod 410 and each right film covering transfer rod 510 separately, so that each left film covering transfer rod 410 and each right film covering transfer rod 510 can move back and forth independently between the left side and the right side of the film covering bracket 300.

[0041] As shown Figure 2 in the figure, specifically, the film covering bracket 300 includes a front support plate 310 and a rear support plate 320 that are parallel and spaced apart from each other. The front support plate 310 and the rear support plate 320 are both provided with a plurality of corresponding sliding guide grooves 330 (as shown Figure 3 in the figure).

[0042] Both ends of each left film covering transfer rod 410 are slidably arranged in one of the sliding guide grooves 330 of the front support plate 310 and the rear support plate 320 (as shown Figure 3 in the figure), and both ends of each right film covering transfer rod 510 are slidably arranged in one of the sliding guide grooves 330 of the front support plate 310 and the rear support plate 320 (as shown Figure 3 in the figure). The sliding tracks of each left film covering transfer rod 410 and each right film covering transfer rod 510 are independent and do not interfere with each other (as shown Figure 3 in the figure).

[0043] As shown Figure 2As shown, in the present invention, the driving assembly 600 includes a plurality of rodless cylinders 610, and each rodless cylinder 610 is used to drive the corresponding left film laminating transfer rod 410 or right film laminating transfer rod 510 to reciprocate along the corresponding sliding guide groove 330. For example, in this practical example, the number of left film laminating transfer rods 410 is three, and the number of right film laminating transfer rods 510 is three. Then, the number of rodless cylinders 610 to be equipped is six, and the six rodless cylinders 610 drive their respective transfer rods to reciprocate independently in the track.

[0044] In the present invention, a pressing accommodation groove 21 is provided on the base 20 (as Figure 2 shown), and the pressing accommodation groove 21 is located between the front support plate 310 and the rear support plate 320. By providing the pressing accommodation groove 21, the inner layer circuit board can be accurately positioned.

[0045] Furthermore, the multi-layer board pressing device 10 for circuit board production of the present invention further includes a left board feeding manipulator (not shown in the figure) and a right board feeding manipulator (not shown in the figure). The left board feeding manipulator and the right board feeding manipulator are respectively located on the left and right sides of the base 20, and the left board feeding manipulator and the right board feeding manipulator are used to transfer the inner layer circuit boards from the left and right sides to the base 20 respectively.

[0046] The present invention also discloses a multi-layer board pressing process for circuit board production, which is implemented based on the above-mentioned multi-layer board pressing device 10 for circuit board production, and includes the following steps:

[0047] Step 1, place the rolled-up prepreg 11 in the unwinding roller 100, unwind the rolled-up prepreg 11 in the unwinding roller 100, and fasten one end of the rolled-up prepreg 11 to the clamping assembly 200.

[0048] In the present invention, the unwinding roller 100 and the clamping assembly 200 are respectively located above the right side and below the left side of the film laminating bracket 300. Unwind the rolled-up prepreg 11 in the unwinding roller 100, pull the rolled-up prepreg 11 obliquely from the upper right corner to the lower left corner, and use the clamping assembly 200 to fasten one end of the rolled-up prepreg 11 to prepare for the subsequent smooth film lamination; it should be noted that the unwinding roller 100 and the clamping assembly 200 can also be respectively arranged above the left side and below the right side of the film laminating bracket 300. The ultimate goal is to make the unwound prepreg 11 obliquely cross the film laminating bracket 300 to prepare for the subsequent smooth film lamination.

[0049] Step 2, as Figure 4As shown, place the first inner layer circuit board 12 on the base 20. The driving assembly 600 drives the left film transfer rod 410 at the bottom layer to move from the left to the right, so that the prepreg 11 covers the first inner layer circuit board 12. Here, it should be explained that the left film transfer rod 410 at the bottom layer is the rod closest to the base 20. Counting up along the height direction, it can be understood as the second last, the third last, and so on, and so forth;

[0050] Step three, as Figure 5 shown, stack the second inner layer circuit board 12 on top of the first inner layer circuit board 12. The second inner layer circuit board 12 and the first inner layer circuit board 12 are spaced apart by the prepreg 11. The driving assembly 600 drives the right film transfer rod 510 at the bottom layer to move from the right to the left, so that the prepreg 11 covers the second inner layer circuit board 12. Here, it should be explained that the right film transfer rod 510 at the bottom layer is the rod closest to the base 20. Counting up along the height direction, it can be understood as the second last, the third last, and so on, and so on; In this embodiment, the left board feeding manipulator can be used to feed the inner layer circuit board from the left, so as to improve the overall mechanical automation level;

[0051] In this step, when stacking the second inner layer circuit board 12 on top of the first inner layer circuit board 12, since the inner layer circuit board has a certain weight, the inner layer circuit board presses on the prepreg 11, and the prepreg 11 is under pressure. Its unwinding roller 100 will adaptively unwind a certain length of prepreg, so that the second inner layer circuit board 12 and the first inner layer circuit board 12 can be completely covered with the prepreg;

[0052] Step four, as Figure 6 shown, stack the third inner layer circuit board 12 on top of the second inner layer circuit board 12. The third inner layer circuit board 12 and the second inner layer circuit board 12 are spaced apart by the prepreg 11. The driving assembly 600 drives the left film transfer rod 410 at the second last layer to move from the left to the right, so that the prepreg 11 covers the third inner layer circuit board 12. In this embodiment, the right board feeding manipulator can be used to feed the inner layer circuit board from the right, so as to improve the overall mechanical automation level;

[0053] Step five, stack the fourth inner layer circuit board 12 on top of the third inner layer circuit board 12. The fourth inner layer circuit board 12 and the third inner layer circuit board 12 are spaced apart by the prepreg 11. The driving assembly 600 drives the right film transfer rod 420 at the second last layer to move from the right to the left, so that the prepreg 11 covers the third inner layer circuit board 12;

[0054] Step Six, and so on, so that multiple inner-layer circuit boards 12 and prepregs 11 are alternately laminated (as Figure 7 shown); it should be noted here that the base 20 is provided with a lamination receiving groove 21, and the lamination receiving groove 21 has the function of guiding and limiting the inner-layer circuit board 12. In this way, during the process of laminating multiple inner-layer circuit boards 12, the multiple inner-layer circuit boards 12 can be neatly laminated together under the action of the lamination receiving groove 21;

[0055] Step Seven, the lamination device 30 performs a lamination process on the multiple alternately laminated inner-layer circuit boards 12 and multiple prepregs 11 to obtain a multi-layer board semi-finished product with the target number of layers;

[0056] Step Eight, take out the multi-layer board semi-finished product from the base 20 (as Figure 8 shown), and remove the excess prepregs 11 at the edges to obtain a multi-layer board finished product. Tools such as scissors can be used to cut off the prepregs 11 that were originally still connected together, which facilitates taking out the multi-layer board semi-finished product from the base 20.

[0057] When the next film lamination is required, each left-side film transfer rod 410 and right-side film transfer rod 510 are reset under the drive of the rodless cylinder.

[0058] As can be seen from the above, by setting the film lamination device 40, the present invention abandons the traditional processing idea of equally dividing and cutting a roll of prepreg. A number of left-side film transfer rods 410 and a number of right-side film transfer rods 510 move along their respective tracks under the drive of the drive assembly 600, and the prepreg 11 at the unwind roller 100 is uncut and unwound. Each layer of prepreg 11 is tightened to a certain extent under the action of the left-side film transfer rod 410 and the right-side film transfer rod 510, so that each layer of prepreg 11 is flat and does not wrinkle, improving the lamination effect.

[0059] Furthermore, in the present invention, the film lamination process and the lamination process are carried out at the same station. After the film lamination process is completed, there is no need to move the material again to perform lamination, preventing the inner-layer circuit board from shifting and resulting in poor lamination.

[0060] The above embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A multilayer board pressing device for circuit board production, characterized in that: include: A base, a pressing device located directly above the base, and a coating device located between the base and the pressing device; The coating device comprises: an unwinding roller, a clamping assembly, a coating support, a left coating transfer assembly, and a right coating transfer assembly; the coating support is fixed on the base, the unwinding roller and the clamping assembly are respectively located on the upper right side and the lower left side of the coating support, and the left coating transfer assembly and the right coating transfer assembly are arranged on the coating support; the left coating transfer assembly comprises a plurality of left coating transfer rods arranged in sequence along the height direction, and the right coating transfer assembly comprises a plurality of right coating transfer rods arranged in sequence along the height direction; Wherein, the coating device also includes a driving component, which is used to drive each of the left coating transfer rods and each of the right coating transfer rods individually, so that each of the left coating transfer rods and each of the right coating transfer rods can move back and forth independently between the left and right sides of the coating support.

2. The multilayer board pressing device for circuit board production according to claim 1, characterized in that: The membrane-covered support comprises a front support plate and a rear support plate which are parallel to each other and spaced apart, and the front support plate and the rear support plate are both provided with a plurality of one-to-one corresponding sliding guide grooves; The two ends of each left-side coating transfer rod are respectively slidably disposed in one of the sliding guide grooves of the front support plate and the rear support plate, and the two ends of each right-side coating transfer rod are respectively slidably disposed in one of the sliding guide grooves of the front support plate and the rear support plate, and the sliding tracks of each left-side coating transfer rod and each right-side coating transfer rod are independent and do not interfere with each other.

3. The multilayer board pressing device for circuit board production according to claim 2, characterized in that: The driving assembly includes a plurality of rodless cylinders, each of which is used to drive the corresponding left-side coating transfer rod or the right-side coating transfer rod to reciprocate along the corresponding sliding guide groove.

4. The multilayer board pressing device for circuit board production according to claim 2 or 3, characterized in that: The base is provided with a pressing accommodating groove, and the pressing accommodating groove is located between the front supporting plate and the rear supporting plate.

5. The multilayer board pressing device for circuit board production according to claim 1, characterized in that: The multilayer board pressing device for circuit board production also includes a left-side board feeding robot and a right-side board feeding robot, and the left-side board feeding robot and the right-side board feeding robot are respectively located on the left and right sides of the base.

6. A multilayer board lamination process for circuit board production, characterized in that: The multilayer board pressing device for circuit board production according to any one of claims 1 to 5 is implemented, comprising the following steps: Step 1, placing the rolled prepreg in a reel, and unwinding the rolled prepreg in the reel so that one end of the rolled prepreg is fastened to the clamping assembly; Step 2: Place the first inner layer circuit board on the base, and drive the left coating transfer rod of the bottom layer to move from the left side to the right side, so that the prepreg is covered on the first inner layer circuit board; Step 3: stack the second inner layer circuit board on the first inner layer circuit board, the second inner layer circuit board and the first inner layer circuit board are separated by the prepreg, and the driving component drives the right coating transfer rod of the bottom layer to move from the right side to the left side, so that the prepreg covers the second inner layer circuit board; Step 4: stack the third inner layer circuit board on the second inner layer circuit board, the third inner layer circuit board and the second inner layer circuit board are separated by the prepreg, and the driving component drives the left film transfer rod of the second to last layer to move from the left side to the right side, so that the prepreg covers the third inner layer circuit board; Step 5: stack the fourth inner layer circuit board on the third inner layer circuit board, the fourth inner layer circuit board and the third inner layer circuit board are separated by the prepreg, and the driving component drives the right film transfer rod of the second to last layer to move from the right side to the left side, so that the prepreg covers the third inner layer circuit board; Step 6, and so on, so that multiple inner layer circuit boards and prepregs are alternately stacked; Step 7: The laminating device performs laminating processing on the multiple inner layer circuit boards and multiple prepregs that are alternately stacked, so as to obtain a multilayer semi-finished product with a target number of layers; Step eight, taking out the semi-finished multilayer board from the base, removing the excess prepreg at the edge, and thus obtaining a finished multilayer board.

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