Electronic device

Abstract

The invention discloses electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises a first shell, a fan and a key, the first shell comprises a body and a frame body, the frame body is arranged along the edge of the body, the body is provided with a containing groove and an air channel, the frame body is provided with an air inlet hole and an air outlet hole, and the air inlet hole is communicated with the air outlet hole through the air channel; the fan is arranged in the containing groove and can drive airflow in the air channel to move from the air inlet hole to the air outlet hole. The key is arranged in the air inlet hole and / or the air outlet hole and can move relative to the frame body.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and particularly relates to an electronic device. Background Art

[0002] Currently, with the improvement of users' performance requirements for electronic devices, electronic devices need to be configured with chips with higher power consumption. The chips are arranged on a circuit board, but the chips with higher power consumption also cause the heat generation of the chips to increase, which requires improving the heat dissipation efficiency of the electronic devices.

[0003] In the related art, to improve the heat dissipation efficiency of electronic devices, a fan is configured inside the electronic device, and air inlet holes and air outlet holes are independently arranged on the surface of the housing of the electronic device. The fan drives the air flow inside the electronic device to flow from the air inlet holes to the air outlet holes, thereby realizing active heat dissipation of heat-generating devices such as circuit board components. However, independently arranging the air inlet holes and air outlet holes on the surface of the housing will result in poor integrity of the housing appearance. Summary of the Invention

[0004] This application aims to provide an electronic device, at least solving the problem of poor integrity of the housing appearance.

[0005] To solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of this application provides an electronic device, including a first housing, a fan, and a key; the first housing includes a main body and a frame, the frame is arranged along the edge of the main body, the main body is provided with a receiving groove and an air duct, the frame is provided with an air inlet hole and an air outlet hole, and the air inlet hole is communicated with the air outlet hole through the air duct; the fan is arranged in the receiving groove and can drive the air flow in the air duct to move from the air inlet hole to the air outlet hole; the key is arranged at the air inlet hole and / or the air outlet hole and can move relative to the frame.

[0007] In the embodiment of this application, the main body is provided with an air duct, the frame is provided with an air inlet hole and an air outlet hole, and the air inlet hole is communicated with the air outlet hole through the air duct, thereby forming a path for gas circulation inside the first housing, enabling the gas inside the first housing to circulate more quickly with the gas outside the first housing. The electronic device further includes a fan, the fan is arranged in the receiving groove, and the fan can drive the air flow in the air duct to move from the air inlet hole to the air outlet hole, thereby driving the gas in the air duct to exchange with the gas outside the electronic device, realizing heat dissipation of the internal components of the electronic device. The key is arranged at the air inlet hole and / or the air outlet hole, so that the mounting hole of the key is reused with the air inlet hole, and / or the mounting hole of the key is reused with the air outlet hole, thereby reducing the impact of the air outlet hole and the air inlet hole on the overall appearance of the electronic device, improving the integrity of the appearance of the electronic device, and further improving the consistency and aesthetics of the appearance of the electronic device.

[0008] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned by practice of the present application. Description of the Drawings

[0009] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the description of embodiments in conjunction with the following drawings, in which:

[0010] Figure 1 is an exploded view of an electronic device according to an embodiment of the present application;

[0011] Figure 2 is a cross-sectional view of an electronic device according to an embodiment of the present application;

[0012] Figure 3 is one of the partial schematic diagrams of an electronic device according to an embodiment of the present application;

[0013] Figure 4 is another partial schematic diagram of an electronic device according to an embodiment of the present application;

[0014] Figure 5 is yet another partial schematic diagram of an electronic device according to an embodiment of the present application;

[0015] Figure 6 is an assembly schematic diagram of a metal sheet and a heat dissipation component according to an embodiment of the present application;

[0016] Figure 7 is a schematic diagram of a heat dissipation component according to an embodiment of the present application;

[0017] Figure 8 is one of the partial schematic diagrams of an electronic device at the volume key according to an embodiment of the present application;

[0018] Figure 9 is one of the partial schematic diagrams of an electronic device at the power key according to an embodiment of the present application;

[0019] Figure 10 is another partial schematic diagram of an electronic device according to an embodiment of the present application;

[0020] Figure 11 is another partial schematic diagram of an electronic device at the power key according to an embodiment of the present application;

[0021] Figure 12 is another partial schematic diagram of an electronic device at the volume key according to an embodiment of the present application;

[0022] Figure 13 is yet another partial schematic diagram of an electronic device according to an embodiment of the present application;

[0023] Figure 14Sixth partial schematic diagram of an electronic device according to an embodiment of the present application;

[0024] Figure 15 Seventh partial schematic diagram of an electronic device according to an embodiment of the present application.

[0025] Reference numerals:

[0026] 100 First housing, 110 Body, 112 Accommodating groove, 120 Frame, 122 Mounting hole, 130 Air duct, 140 Air inlet hole, 150 Air outlet hole, 200 Fan, 210 Second housing, 212 Protrusion, 220 Fan blade, 300 Bracket, 310 Metal sheet, 312 Support portion, 314 Heat conducting portion, 320 Frame body, 400 Circuit board assembly, 410 Circuit board, 420 Chip, 500 Heat dissipation component, 510 Heat dissipation fin, 520 Heat dissipation channel, 610 Heat conducting adhesive, 620 Shielding cover, 622 Opening, 630 Air duct plate, 632 Limit post, 640 Button, 642 Limit buckle, 644 Limit groove, 646 Trigger portion, 650 Volume key, 652 First contact, 654 Second contact, 660 Power key, 662 Third contact, 710 Screen assembly, 720 Heat dissipation graphite sheet, 730 Heat dissipation vapor chamber, 740 Cover body, 810 First flexible circuit board, 820 Second flexible circuit board, 830 Third flexible circuit board, 840 Fourth flexible circuit board. Detailed implementation manners

[0027] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary only for explaining the present application and should not be construed as limiting the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.

[0028] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0029] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0030] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0031] The following will describe Figures 1 to 15 an electronic device according to an embodiment of the present application.

[0032] As Figure 1 , Figure 2 and Figure 3 shown, an electronic device according to some embodiments of the present application includes a first housing 100, a fan 200, and a button 640; the first housing 100 includes a body 110 and a frame 120, the frame 120 is disposed along the edge of the body 110, the body 110 is provided with a receiving groove 112 and an air duct 130, the frame 120 is provided with an air inlet hole 140 and an air outlet hole 150, and the air inlet hole 140 is communicated with the air outlet hole 150 through the air duct 130; the fan 200 is disposed in the receiving groove 112 and is capable of driving the air flow in the air duct 130 to move from the air inlet hole 140 to the air outlet hole 150; the button 640 is disposed at the air inlet hole 140 and / or the air outlet hole 150 and is capable of moving relative to the frame 120.

[0033] In this embodiment, as Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5As shown in the figure, the electronic device includes a first housing 100. The first housing 100 includes a main body 110 and a frame 120. The frame 120 is disposed along the edge of the main body 110. The frame 120 and the main body 110 jointly support various components of the electronic device. The main body 110 is provided with an air duct 130. The frame 120 is provided with an air inlet hole 140 and an air outlet hole 150. The air inlet hole 140 is communicated with the air outlet hole 150 through the air duct 130, thereby forming a path for gas circulation within the first housing 100, enabling the gas inside the first housing 100 to circulate more quickly with the gas outside the first housing 100. The electronic device further includes a fan 200. The fan 200 is disposed in the receiving groove 112. The fan 200 can drive the airflow in the air duct 130 to move from the air inlet hole 140 to the air outlet hole 150, thereby driving the gas in the air duct 130 to exchange with the gas outside the electronic device, achieving heat dissipation for the internal components of the electronic device. A button 640 is disposed at the air inlet hole 140 and / or the air outlet hole 150, such that the mounting hole 122 of the button 640 is reused with the air inlet hole 140, or the mounting hole 122 of the button 640 is reused with the air outlet hole 150, or the mounting hole 122 simultaneously reuses the air inlet hole 140 and the air outlet hole 150, thereby reducing the impact of the air outlet hole 150 and the air inlet hole 140 on the overall appearance of the electronic device, enhancing the integrity of the appearance of the electronic device, and further enhancing the consistency and aesthetic feeling of the appearance of the electronic device.

[0034] Further, as Figure 1 , Figure 8 and Figure 9 shown, the mounting hole 122 is a partial area of the air inlet hole 140, or the mounting hole 122 is a partial area of the air outlet hole 150. The button 640 is disposed in the mounting hole 122 and can move relative to the frame 120. The mounting hole 122 can mount and position the button 640, enhancing the stability of the button 640 during the use of the electronic device. The button 640 is disposed at the air inlet hole 140 and / or the air outlet hole 150, reducing the number of openings on the frame 120, being beneficial to the sealing of the electronic device, and reducing the difficulty of dust and water prevention for the electronic device.

[0035] Specifically, the air inlet hole 140 and the air outlet hole 150 can be rectangular holes, circular holes, square holes, semi-circular holes, waist-shaped holes or runway holes.

[0036] As Figure 1 and Figure 8 shown, the air inlet areas of the air inlet hole 140 can be multiple. The multiple air inlet areas are distributed on both sides of the button 640 in the thickness direction of the electronic device. Some air inlet areas can also be arranged on both sides of the button 640 in the length direction of the electronic device. The air inlet area can also be the gap between the button 640 and the side wall of the air inlet hole 140.

[0037] As Figure 1 and Figure 9As shown, the air outlet area of the air outlet hole 150 can be multiple, and the multiple air outlet areas are distributed on both sides of the button 640 in the thickness direction of the electronic device. Some of the air outlet areas can also be arranged on both sides of the button 640 in the length direction of the electronic device. The air outlet area can also be the gap between the button 640 and the side wall of the air outlet hole 150.

[0038] Specifically, the air inlet hole 140 and the air outlet hole 150 can be opened only at the position where the button 640 is located, and the air inlet hole 140 and the air outlet hole 150 are not opened at other positions on the frame 120.

[0039] The air inlet hole 140 and the air outlet hole 150 can also be opened at the position where the button 640 is located, and at the same time, the air inlet hole 140 and / or the air outlet hole 150 can also be opened at the remaining positions of the frame 120.

[0040] According to some embodiments of the present application, as Figure 1 、 Figure 2 and Figure 3 shown, the electronic device further includes an air duct plate 630 and a cover body 740. The air duct plate 630 is disposed on one side of the main body 110 close to the cover body 740 and extends from the air inlet hole 140 to the air outlet hole 150. The cover body 740 covers the first housing 100, and the air duct plate 630, the cover body and the main body 110 enclose an air duct 130.

[0041] In this embodiment, the electronic device further includes an air duct plate 630 and a cover body 740. The air duct plate 630, the cover body and the main body 110 enclose an air duct 130. The inside of the electronic device defines a path for gas flow through the air duct plate 630, thereby accelerating the gas flow speed inside the electronic device and improving the heat dissipation efficiency of the electronic device. And by enclosing the air duct 130 with the air duct plate 630, the cover body and the main body 110, the structure of the air duct 130 is simplified, and the assembly difficulty of the electronic device is reduced. The air duct plate 630 extends from the air inlet hole 140 to the air outlet hole 150, so that the air duct 130 enclosed by the air duct plate 630 and the main body 110 can guide the air flow entering the inside of the electronic device from the air inlet hole 140 to flow towards the air outlet hole 150, realizing the guidance of the gas inside the electronic device.

[0042] According to some embodiments of the present application, as Figure 10 、 Figure 11 and Figure 12 shown, the button 640 is provided with a limit buckle 642, the limit buckle 642 is provided with a limit groove 644, and the limit groove 644 extends along the movement direction of the button 640 ( Figure 10 the direction indicated by the arrow A in Figure 10 ); the air duct plate 630 is provided with a limit post 632, and the limit post 632 is located in the limit groove 644.

[0043] In this embodiment, the button 640 is provided with a limit buckle 642. The limit buckle 642 is provided with a limit groove 644 extending along the moving direction of the button 640. The air duct plate 630 is provided with a limit post 632. The limit post 632 is within the limit groove 644. The limit post 632 can guide and limit the movement of the button 640, improving the stability of the button 640 during use. And since the limit post 632 is provided on the air duct plate 630, the limit post 632 can be manufactured together with the air duct plate 630. The electronic device can no longer be provided with a separate button bracket, simplifying the structure of the electronic device and reducing the assembly difficulty of the electronic device.

[0044] Further, the air duct plate 630 and the limit post 632 are of an integral structure.

[0045] Integrating the air duct plate 630 and the limit post 632 into an integral structure can save two button brackets for the power button 660 and the volume button 650 compared with the technical solution of separately providing a button bracket, saving costs and simplifying the assembly process of the electronic device at the same time.

[0046] According to some embodiments of the present application, as Figure 10 、 Figure 11 and Figure 12 shown, the button 640 is provided with a trigger portion 646; the number of trigger portions 646 is multiple, and the multiple trigger portions 646 are respectively arranged on both sides of the limit buckle 642; or the limit buckle 642 is multiple, and the multiple limit buckles 642 are respectively arranged on both sides of the trigger portion 646.

[0047] In this embodiment, the button 640 is provided with a trigger portion 646. The multiple trigger portions 646 are respectively arranged on both sides of the limit buckle 642, so that the button 640 can be used as the volume button 650. When the trigger portions 646 on both sides of the limit buckle 642 are triggered, they are respectively used to increase and decrease the volume.

[0048] The limit buckles 642 of the button 640 are multiple, and the multiple limit buckles 642 are respectively arranged on both sides of the trigger portion 646, so that the button 640 can be used as the power button 660. When the trigger portion 646 is triggered, it is used to turn on or off the electronic device.

[0049] According to some embodiments of the present application, as Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5As shown, the electronic device further includes a bracket 300, a circuit board assembly 400, and a heat dissipation component 500. The bracket 300 is disposed within the first housing 100; the circuit board assembly 400 is disposed on the bracket 300; the heat dissipation component 500 is disposed within the air duct 130. Among them, the bracket 300 includes a metal sheet 310. The metal sheet 310 is located on one side of the circuit board assembly 400 and extends into the air duct 130 and is connected to the heat dissipation component 500.

[0050] In this embodiment, as Figure 1 , Figure 2 and Figure 3 shown, the electronic device further includes a bracket 300 and a circuit board assembly 400. The bracket 300 is disposed within the first housing 100, and the circuit board assembly 400 is disposed on the bracket 300, thereby realizing the support of the circuit board assembly 400 and improving the stability of the electronic device during operation.

[0051] The electronic device further includes a heat dissipation component 500. The heat dissipation component 500 is disposed within the air duct 130. The bracket 300 includes a metal sheet 310. The metal sheet 310 is located on one side of the circuit board assembly 400 and extends into the air duct 130 and is connected to the heat dissipation component 500. The heat generated by the circuit board assembly 400 during operation can be transferred to the heat dissipation component 500 through the metal sheet 310. The heat dissipation component 500 is within the air duct 130, and the heat carried by the heat dissipation component 500 can be transferred to the gas within the air duct 130. The fan 200 drives the gas carrying heat within the air duct 130 to flow from the air outlet hole 150 to the outside of the electronic device, realizing the heat dissipation of the circuit board assembly 400. The circuit board assembly 400 is connected to the heat dissipation component 500 through the metal sheet 310, and the heat dissipation component 500 is disposed within the air duct 130, which improves the heat exchange efficiency between the circuit board assembly 400 and the air within the air duct 130, thereby improving the heat dissipation effect of the electronic device. And the circuit board assembly 400 is connected to the heat dissipation component 500 through the metal sheet 310. While the metal sheet 310 improves the strength of the bracket 300, it realizes the heat transfer between the circuit board assembly 400 and the heat dissipation component 500, thereby improving the heat dissipation efficiency of the electronic device while simplifying the structure of the electronic device. The heat dissipation component 500 is disposed within the air duct 130. After the heat generated by the circuit board assembly 400 is transferred to the heat dissipation component 500, the heat dissipation component 500 has a larger contact area with the gas within the air duct 130, further accelerating the heat exchange efficiency between the circuit board assembly 400 and the gas within the air duct 130 and improving the heat dissipation effect of the circuit board assembly 400.

[0052] Further, the metal sheet 310 is a steel sheet, an iron sheet, an aluminum sheet, a copper sheet, or an alloy sheet.

[0053] Further, the electronic device includes a mobile phone, a tablet computer, a smart wearable device, a laptop computer, or a drone.

[0054] According to some embodiments of the present application, the button 640 includes a volume button 650 and a power button 660; the volume button 650 is disposed at one of the air inlet hole 140 and the air outlet hole 150; the power button 660 is disposed at the other of the air inlet hole 140 and the air outlet hole 150.

[0055] In this embodiment, the volume button 650 is used to adjust the volume of the electronic device, and the power button 660 is used to control the power-on or power-off of the electronic device.

[0056] Specifically, the air inlet hole 140 is disposed on the housing 120, on the side of the housing 120 where the volume button 650 is installed, and the air outlet hole 150 is disposed on the housing 120, on the side of the housing 120 where the power button 660 is installed.

[0057] The air inlet hole 140 may also be on the side of the housing 120 where the power button 660 is installed, and the air outlet hole 150 is on the side of the housing 120 where the volume button 650 is installed.

[0058] Further, the volume button 650 is an exterior part of the volume button module. The volume button module further includes a switching device and a flexible circuit board, and the flexible circuit board of the volume button module is connected to the main board.

[0059] The power button 660 is an exterior part of the power button module. The power button module further includes a switching device and a flexible circuit board, and the flexible circuit board of the power button module is connected to the main board.

[0060] A fan slot is provided on the body 110, and the fan 200 is installed in the fan slot.

[0061] Further, a limiting slot 644 for a flexible printed circuit (FPC) of components such as the volume button 650, the power button 660, and the fan 200 is provided on the body 110.

[0062] The volume button 650, the power button 660, and the fan 200 are each electrically connected to the patch spring on the main board using a flexible circuit board.

[0063] According to some embodiments of the present application, such as Figure 13 、 Figure 14 and Figure 15As shown, the volume keys 650 include a first contact 652 and a second contact 654. The electronic device further includes a first flexible circuit board 810 and a second flexible circuit board 820. The first contact 652 is connected to the circuit board assembly 400 through the first flexible circuit board 810, and the second contact 654 is connected to the circuit board assembly 400 through the second flexible circuit board 820. The power button 660 includes a third contact 662. The electronic device further includes a third flexible circuit board 830. The third contact 662 is connected to the circuit board assembly 400 through the third flexible circuit board 830.

[0064] In this embodiment, the first contact 652 of the volume key 650 is connected to the circuit board assembly 400 through the first flexible circuit board 810, and the second contact 654 of the volume key 650 is connected to the circuit board assembly 400 through the second flexible circuit board 820. When the user presses the side of the volume key 650 where the first contact 652 is provided, the volume key 650 communicates with the circuit board assembly 400 through the first flexible circuit board 810. When the user presses the side of the volume key 650 where the second contact 654 is provided, the volume key 650 communicates with the circuit board assembly 400 through the second flexible circuit board 820, so that the user can control the electronic device to adjust the volume through the volume key 650.

[0065] The third contact 662 of the power button 660 is connected to the circuit board assembly 400 through the third flexible circuit board 830. When the user presses the power button 660, the power button 660 communicates with the circuit board assembly 400 through the third flexible circuit board 830, so that the user can control the electronic device to turn on or off through the power button 660.

[0066] Further, the fan 200 is connected to the main board through a fourth flexible circuit board 840.

[0067] Further, there are two protrusions on the side of the housing 120 where the volume keys 650 are provided. The flexible circuit boards of the volume + and volume - switch devices of the volume keys 650 pass through these protrusions and then converge to one place to be connected to the main board spring pieces. That is, the first flexible circuit board 810 and the second flexible circuit board 820 pass through the protrusions, and then the first flexible circuit board 810 and the second flexible circuit board 820 converge to one place and are electrically connected to the spring pieces on the circuit board assembly 400.

[0068] There is one protrusion on the side of the housing 120 where the power button 660 is provided. The flexible circuit board of the power button 660 passes through this protrusion and then is electrically connected to the main board spring piece. That is, the third flexible circuit board 830 passes through the protrusion and then is electrically connected to the spring piece of the circuit board assembly 400.

[0069] The main body 110 is provided with a first mounting groove, a second mounting groove, and a third mounting groove. The first flexible circuit board 810 is disposed in the first mounting groove, the second flexible circuit board 820 is disposed in the second mounting groove, and the third flexible circuit board 830 is disposed in the third mounting groove.

[0070] The flexible circuit board of the fan 200 exits from below the fan 200, one end is connected to the rotor of the fan 200, and the other end is electrically connected to the main board elastic piece.

[0071] According to some embodiments of the present application, as Figure 1 , Figure 2 , Figure 6 and Figure 7 shown, the heat dissipation component 500 is disposed between the fan 200 and the air outlet hole 150. The heat dissipation component 500 includes heat dissipation fins 510. The number of the heat dissipation fins 510 is multiple. The multiple heat dissipation fins 510 are arranged in parallel. There is a heat dissipation channel 520 between two adjacent heat dissipation fins 510 among the multiple heat dissipation fins 510. The heat dissipation channel 520 extends from the fan 200 to the air outlet hole 150.

[0072] In this embodiment, the heat dissipation component 500 is disposed between the fan 200 and the air outlet hole 150. The gas blown out from the air outlet end of the fan 200 will flow to the heat dissipation component 500, which speeds up the air flow speed on the surface of the heat dissipation component 500, and then speeds up the heat exchange speed between the heat dissipation component 500 and the gas, further improving the heat exchange efficiency between the heat dissipation component 500 and the gas in the air duct 130; and the gas will form high-temperature gas carrying heat after flowing through the heat dissipation component 500. Since the heat dissipation component 500 is disposed between the fan 200 and the air outlet hole 150, the high-temperature gas carrying heat will flow out of the electronic device through the air outlet hole 150, shortening the flow path of the high-temperature gas inside the electronic device, and then reducing the influence of the high-temperature gas on each component inside the electronic device. The heat dissipation component 500 includes multiple heat dissipation fins 510, which further increases the contact area between the heat dissipation component 500 and the gas in the air duct 130, improves the heat exchange rate between the heat dissipation component 500 and the gas in the air duct 130, and further improves the heat dissipation effect of the electronic device.

[0073] Furthermore, the heat dissipation fin 510 is a plate-like structure. The heat dissipation component 500 is a metal part. For example, the heat dissipation component 500 can be an aluminum structural part or a copper structural part.

[0074] According to some embodiments of the present application, as Figure 1 , Figure 2 and Figure 6 shown, the bracket 300 further includes a frame body 320. The metal sheet 310 includes a support portion 312 and a heat conduction portion 314; the support portion 312 is connected to the frame body 320; the heat conduction portion 314 is connected to the support portion 312 and is attached to one side of the heat dissipation component 500.

[0075] In this embodiment, the bracket 300 further includes a frame body 320. The metal sheet 310 includes a supporting portion 312, and the supporting portion 312 is connected to the frame body 320. Thus, the overall strength of the bracket 300 is enhanced through the supporting portion 312. During the use of the electronic device, the bracket 300 can more stably support the circuit board assembly 400, improving the stability of the circuit board assembly 400 during the use of the electronic device. The metal sheet 310 further includes a heat-conducting portion 314, and the heat-conducting portion 314 is connected to the supporting portion 312. The heat generated by the circuit board assembly 400 can be transferred to the heat dissipation component 500 through the supporting portion 312 and the heat-conducting portion 314, improving the heat transfer speed between the circuit board assembly 400 and the heat dissipation component 500. The heat-conducting portion 314 is attached to one side of the heat dissipation component 500, increasing the contact area between the heat-conducting portion 314 and the heat dissipation component 500, enhancing the tightness of the contact between the heat-conducting portion 314 and the heat dissipation component 500, and accelerating the heat exchange speed between the heat-conducting portion 314 and the heat dissipation component 500, further improving the heat dissipation efficiency of the circuit board assembly 400.

[0076] Furthermore, the frame body 320 and the metal sheet 310 are of an integrally injection-molded structure.

[0077] According to some embodiments of the present application, as Figure 1 and Figure 5 shown, the circuit board assembly 400 includes a circuit board 410 and a chip 420. The circuit board 410 is disposed on the frame body 320. The chip 420 is disposed on the circuit board 410, and the supporting portion 312 is attached to the chip 420.

[0078] In this embodiment, the circuit board assembly 400 includes a circuit board 410, and the circuit board 410 is disposed on the frame body 320. The support for the circuit board 410 is achieved through the frame body 320, improving the stability of the circuit board 410 during the use of the electronic device. The circuit board assembly 400 further includes a chip 420, and the chip 420 is disposed on the circuit board 410. The supporting portion 312 is attached to the chip 420, accelerating the heat exchange speed between the chip 420 and the supporting portion 312 and improving the heat dissipation efficiency of the chip 420. Since the chip 420 is the main heat source of the electronic device, effectively improving the heat dissipation efficiency of the chip 420 can enhance the overall heat dissipation efficiency of the electronic device and reduce the temperature rise during the use of the electronic device. Moreover, since the performance of the chip 420 is greatly affected by temperature, effectively improving the heat dissipation efficiency of the chip 420 can enhance the performance of the electronic device, thereby improving the quality of the electronic device.

[0079] Specifically, when the electronic device is operating, the chip 420 generates heat. The heat generated by the chip 420 is transferred to the metal sheet 310 by the thermal conductive adhesive 610, and then transferred from the metal sheet 310 to the heat dissipation component 500. The heat exchanges with the gas in the air duct 130 on the heat dissipation component 500, and the gas after heat exchange is discharged from the electronic device through the air outlet hole 150. As a result, the heat of high heat sources such as the chip 420 is fully transferred to the air duct 130, and the gas in the air duct 130 is used to carry away the heat as much as possible, greatly improving the heat dissipation effect and enhancing the performance of the mobile phone.

[0080] The chip 420 can be a central processing unit (CPU).

[0081] Specifically, the circuit board 410 is the main board of the electronic device.

[0082] According to some embodiments of the present application, as Figure 1 、 Figure 2 and Figure 5 shown, the electronic device further includes a thermal conductive adhesive 610, and the thermal conductive adhesive 610 is disposed between the chip 420 and the support portion 312.

[0083] In this embodiment, the electronic device further includes a thermal conductive adhesive 610, and the thermal conductive adhesive 610 is disposed between the chip 420 and the support portion 312, further accelerating the heat exchange rate between the chip 420 and the support portion 312 and enhancing the heat dissipation efficiency of the chip 420.

[0084] According to some embodiments of the present application, as Figure 1 、 Figure 2 and Figure 5 shown, the electronic device further includes a shielding cover 620, the shielding cover 620 is disposed on one side of the circuit board 410 close to the metal sheet 310, the shielding cover 620 is provided with an opening 622, and the chip 420 is disposed in the opening 622.

[0085] In this embodiment, the shielding cover 620 is provided with an opening 622, and the chip 420 is disposed in the opening 622, so that the chip 420 can cross the shielding cover 620 and be in direct contact with the support portion 312, further accelerating the heat exchange rate between the chip 420 and the support portion 312 and enhancing the heat dissipation efficiency of the chip 420.

[0086] According to some embodiments of the present application, as Figure 1 、 Figure 2 、 Figure 4 and Figure 5 shown, the fan 200 includes a second housing 210 and a fan blade 220. The second housing 210 is provided with a protrusion 212 protruding toward the air duct plate 630, and the protrusion 212 abuts against the air duct plate 630; the fan blade 220 is disposed in the second housing 210.

[0087] In this embodiment, the fan 200 includes a second housing 210 and fan blades 220. The fan blades 220 are disposed within the second housing 210, and thus the second housing 210 is used to support and protect the fan blades 220, improving the stability of the fan blades 220 during operation. The second housing 210 is provided with a protrusion 212 protruding towards the air duct plate 630, and the protrusion 212 abuts against the air duct plate 630, such that the second housing 210 supports the air duct plate 630 through the protrusion 212, enhancing the strength of the air duct plate 630 and reducing the probability of significant deformation of the air duct plate 630 when subjected to an external force.

[0088] Specifically, the number of the protrusions 212 is multiple, and the multiple protrusions 212 are distributed on the surface of the second housing 210 on the side close to the air duct plate 630.

[0089] An air inlet of the fan 200 is provided on the side of the second housing 210 close to the air duct plate 630, and the multiple protrusions 212 are arranged around the air inlet.

[0090] The number of the protrusions 212 can be two, three or five. The second housing 210 supports the air duct plate 630 through the protrusions 212, which can ensure the height of the Z - direction air inlet space between the bottom surface of the air duct plate 630 and the fan 200 and also play a supporting role. When the fan 200 of the electronic device is pressed, it can prevent the central area of the first housing 100 from collapsing, prevent interference between the central area of the first housing 100 and the fan blades 220, and further reduce the probability of abnormal noise generation in the electronic device.

[0091] Specifically, the fan 200 is a micro - centrifugal fan module, and its size can be 15mm×15mm×3.5mm.

[0092] According to some embodiments of the present application, as Figure 2 shown, the air outlet holes 150 and the air inlet holes 140 are symmetrically arranged.

[0093] In this embodiment, the air outlet holes 150 and the air inlet holes 140 are symmetrically arranged, such that the air duct 130 inside the electronic device has a shorter path from the air inlet holes 140 to the air outlet holes 150, and the bending area of the air duct 130 is reduced, making the flow of gas in the air duct 130 smoother and further improving the heat dissipation effect of the electronic device.

[0094] According to some embodiments of the present application, as Figure 1 shown, the electronic device further includes a screen assembly 710, a heat - dissipating graphite sheet 720, a heat - dissipating vapor chamber 730, and a cover 740.

[0095] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0096] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A first shell, the first shell comprising a body and a frame, the frame being arranged along an edge of the body, the body being provided with a receiving groove and an air duct, the frame being provided with an air inlet and an air outlet, the air inlet being connected with the air outlet through the air duct; A fan, the fan being disposed in the receiving slot and capable of driving the airflow in the air duct to move from the air inlet to the air outlet; A button is arranged at the air inlet and / or the air outlet and can move relative to the frame.

2. The electronic device according to claim 1, characterized in that: Also includes: A cover body, the cover body is disposed on the first shell; An air duct plate is arranged on a side of the main body close to the cover body, extending from the air inlet to the air outlet, and the air duct plate, the cover body and the main body surround the air duct.

3. The electronic device according to claim 2, characterized in that: The button is provided with a limit buckle, the limit buckle is provided with a limit slot, and the limit slot extends along the movement direction of the button; The air duct plate is provided with a limiting column, and the limiting column is located in the limiting groove.

4. The electronic device according to claim 3, characterized in that: The button is provided with a trigger part; There are multiple trigger parts, and the multiple trigger parts are respectively arranged on both sides of the limit buckle; or There are multiple limit buckles, and the multiple limit buckles are respectively arranged on both sides of the trigger part.

5. The electronic device according to any one of claims 1 to 4, characterized in that: Also includes: a bracket, wherein the bracket is disposed in the first shell; A circuit board assembly, wherein the circuit board assembly is arranged on the bracket; A heat dissipation component, wherein the heat dissipation component is arranged in the air duct; Wherein, the bracket includes a metal sheet, which is located on one side of the circuit board assembly and extends into the air duct and is connected to the heat dissipation component.

6. The electronic device according to claim 5, characterized in that: The buttons include: a volume button, the volume button being disposed at one of the air inlet and the air outlet; A power button is disposed at the other of the air inlet and the air outlet.

7. The electronic device according to claim 6, characterized in that: The volume key includes a first contact and a second contact, and the electronic device also includes a first flexible circuit board and a second flexible circuit board, the first contact is connected to the circuit board assembly through the first flexible circuit board, and the second contact is connected to the circuit board assembly through the second flexible circuit board; The power button includes a third contact point, and the electronic device also includes a third flexible circuit board, and the third contact point is connected to the circuit board assembly through the third flexible circuit board.

8. The electronic device according to claim 5, characterized in that: The heat dissipation component is disposed between the fan and the air outlet, and the heat dissipation component includes: The heat dissipation fins are multiple in number and are arranged in parallel. A heat dissipation channel is provided between two adjacent heat dissipation fins among the multiple heat dissipation fins, and the heat dissipation channel extends from the fan to the air outlet.

9. The electronic device according to claim 5, characterized in that: The bracket further comprises a frame body, and the metal sheet comprises: A support portion, the support portion being connected to the frame; The heat conducting part is connected to the supporting part and is attached to one side of the heat dissipating component.

10. The electronic device according to any one of claims 2 to 4, characterized in that: The fan comprises: A second housing, wherein the second housing is provided with a protrusion protruding toward the air duct plate, and the protrusion abuts against the air duct plate; The fan blades are arranged in the second shell.

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