Substrate working device and substrate working method

Abstract

The invention provides a substrate working apparatus and a substrate working method. Provided is a substrate working device that can be reduced in size. The substrate working device is provided with: a substrate placement unit having a placement surface on which a substrate is placed; a drive unit that rotates the substrate mounting unit; a work unit (104L) and a work unit (104R) that perform a first work, which is a work performed on the long side of the substrate when the substrate is in the first arrangement state, and a second work, which is a work performed on the short side of the substrate when the substrate is in the second arrangement state; a changing unit that changes the interval between the working unit (104L) and the working unit (104R); and a control unit. The control unit executes, after the first operation and before the second operation, an arrangement change process for switching the state of the substrate from the first arrangement state to the second arrangement state, and in the arrangement change process, the change unit widens the interval between the operation units (104L, 104R) and then causes the drive unit to rotate the substrate placement unit on which the substrate is placed.

Description

Technical Field

[0001] The present disclosure relates to a substrate working device or the like that performs an operation of crimping a component to a substrate. Background Art

[0002] In the past, a component crimping system for crimping an electronic component (hereinafter simply referred to as a "component") to a substrate such as a liquid crystal panel has been provided. This component crimping system crimps the component to an end portion of the liquid crystal panel with an ACF (Anisotropic Conductive Film, anisotropic conductive film) as an anisotropic conductive member interposed therebetween. That is, the component crimping system includes: a substrate working device that pastes the ACF to an end portion of the liquid crystal panel; and another substrate working device that mounts the component on a portion of the liquid crystal panel to which the ACF has been pasted and crimps it to the liquid crystal panel.

[0003] In Patent Document 1, a tape attaching device is disclosed as a substrate working device for pasting an ACF to a substrate. This tape attaching device includes two attaching assemblies for attaching an ACF, that is, an anisotropic conductive tape, to the substrate.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: JP-A-2006-53182

[0007] However, in the tape attaching device of Patent Document 1 described above, there is a problem that the device may be enlarged. Summary of the Invention

[0008] Therefore, in the present disclosure, a substrate working device or the like that can achieve miniaturization is provided.

[0009] A substrate working device according to one aspect of the present disclosure includes: a substrate placing portion having a placing surface for placing a substrate having a first side and a second side intersecting the first side, and capable of rotating about a rotation axis extending in a normal direction of the placing surface; a driving portion that rotates the substrate placing portion; two working portions that perform a first operation and a second operation, the first operation being an operation performed on the first side when the substrate is in a first configuration state, and the second operation being an operation performed on the second side when the substrate is in a second configuration state; a changing portion that changes an interval between the two working portions; and a control portion that controls the driving portion and the changing portion. The control portion performs a configuration change process of switching a state of the substrate from the first configuration state to the second configuration state after the first operation and before the second operation. In the configuration change process, after widening the interval between the two working portions by the changing portion, the driving portion rotates the substrate placing portion on which the substrate is placed.

[0010] In addition, these general or specific manners can be implemented by a system, a method, an integrated circuit, a computer program, or a recording medium such as a computer-readable CD-ROM, or can be implemented by any combination of a system, a method, an integrated circuit, a computer program, and a recording medium. In addition, the recording medium can also be a non-transitory recording medium.

[0011] Effects of the Invention

[0012] The substrate processing apparatus of the present disclosure can achieve miniaturization of the apparatus.

[0013] Further advantages and effects in one aspect of the present disclosure will become clear from the specification and the drawings. The related advantages and / or effects are provided separately by several embodiments and the features described in the specification and the drawings, but it is not necessary to provide all of them in order to obtain one or more of the same features. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a diagram showing a schematic configuration of a component mounting line in an embodiment.

[0015] Figure 2 It is a top view of a component mounting line in an embodiment.

[0016] Figure 3 It is a diagram showing an example of a pasting mechanism of a pasting portion in an embodiment.

[0017] Figure 4 It is a diagram showing an example of a pasting portion in an embodiment.

[0018] Figure 5 It is a block diagram showing a functional configuration of a substrate processing apparatus in an embodiment.

[0019] Figure 6 It is a diagram schematically showing an example of a configuration change process in an embodiment.

[0020] Figure 7 It is a flowchart showing an example of a configuration change process of a control unit in an embodiment.

[0021] Figure 8 It is a diagram schematically showing another example of a configuration change process in an embodiment.

[0022] Figure 9 It is a flowchart showing another example of a configuration change process of a control unit in an embodiment.

[0023] Figure 10 It is a flowchart showing an example of a processing operation of a substrate processing apparatus in an embodiment.

[0024] Figure 11 This is a diagram schematically showing an example of configuration change processing in a modified example of an embodiment.

[0025] Description of Reference Numerals

[0026] 1 Component mounting line

[0027] 3 Substrate

[0028] 4 Electrode portion

[0029] 5 Component

[0030] 10 Substrate loading section

[0031] 11, 23, 37, 49, 51 Carriage

[0032] 20 Bonding section

[0033] 21, 31, 41 Substrate moving mechanism

[0034] 30 Pre - crimping section

[0035] 32 Component mounting mechanism

[0036] 33 Component supply section

[0037] 33a Supply reel

[0038] 33b Punching section

[0039] 33c Movable carriage

[0040] 33d Track

[0041] 34 Crimping tool

[0042] 35 Component transfer section

[0043] 36 Support section

[0044] 40 Final crimping section

[0045] 50 Substrate unloading section

[0046] 60 Conveyor section

[0047] 100 Substrate processing device

[0048] 101 Control section

[0049] 102 Substrate placement section

[0050] 103 Driving section

[0051] 104L, 104R Processing section

[0052] 105 Change section

[0053] 211 X-axis workbench

[0054] 212 Y-axis workbench

[0055] 213 Z-axis workbench

[0056] 220L, 220R pasting mechanism assembly

[0057] 221 Tape supply reel

[0058] 223 Pasting head

[0059] 224 Pasting support stage

[0060] 225 Tape cutting assembly

[0061] 228 X-axis rail mechanism

[0062] 229 Pasting base

[0063] tp tape component Detailed implementation manner

[0064] The substrate processing device according to the first aspect of the present disclosure includes: a substrate placement unit having a placement surface for placing a substrate having a first side and a second side intersecting the first side, and capable of rotating about a rotation axis extending in the normal direction of the placement surface; a driving unit for rotating the substrate placement unit; two processing units for performing a first process and a second process, the first process being a process performed on the first side when the substrate is in a first configuration state, and the second process being a process performed on the second side when the substrate is in a second configuration state; a changing unit for changing the interval between the two processing units; and a control unit for controlling the driving unit and the changing unit. The control unit performs a configuration change process of switching the state of the substrate from the first configuration state to the second configuration state after the first process and before the second process. In the configuration change process, after widening the interval between the two processing units by the changing unit, the driving unit rotates the substrate placement unit on which the substrate is placed.

[0065] Accordingly, by widening the gap between the two operation units, a space can be provided between the two operation units for at least a part of the rotating substrate to enter. Therefore, the length in the depth direction of the substrate processing apparatus can be shortened. The depth direction is perpendicular to the direction in which the two operation units are arranged and parallel to the substrate. For example, in the absence of such a space, in order to prevent interference between the two operation units and the rotating substrate, a gap needs to be provided in the depth direction between the two operation units and the rotating substrate. However, in the first mode described above, due to the presence of the above space, at least a part of the rotating substrate can enter the space, thereby suppressing interference between the two operation units and the rotating substrate. Therefore, the distance from the two operation units to the rotating substrate in the above depth direction can be shortened. As a result, the length in the depth direction of the substrate processing apparatus can be shortened. Thus, miniaturization of the substrate processing apparatus can be achieved.

[0066] In addition, in the substrate processing apparatus according to the second mode, the control unit may switch the operation mode of the configuration change process to a first operation mode and a second operation mode. In the first operation mode, after widening the gap between the two operation units by the changing unit, the driving unit rotates the substrate mounting unit on which the substrate is mounted. In the second operation mode, the driving unit rotates the substrate mounting unit on which the substrate is mounted without widening the gap between the two operation units by the changing unit. Additionally, the second mode may be subordinate to the first mode.

[0067] Accordingly, in a case where interference does not occur between the two operation units and the rotating substrate even without widening the gap between the two operation units, the configuration change process can be performed in the second operation mode, and the time required for the configuration change process can be shortened.

[0068] In addition, in the substrate processing apparatus according to the third mode, the control unit may switch the operation mode based on substrate information related to the substrate. Additionally, the third mode may be subordinate to the second mode.

[0069] Accordingly, the switching of the operation mode can be appropriately performed.

[0070] In addition, in the substrate processing apparatus according to the fourth mode, the substrate information may indicate the size of the substrate and the position of the substrate on the mounting surface. When the control unit performs the configuration change process in the second operation mode based on the size and position of the substrate indicated in the substrate information, it determines whether at least one of the two operation units and the rotating substrate interferes. If it is determined that interference occurs, the operation mode is switched to the first operation mode. If it is determined that no interference occurs, the operation mode is switched to the second operation mode. Additionally, the fourth mode may be subordinate to the third mode.

[0071] Thus, since the size and position of the substrate are used to determine whether at least one of the two working units interferes with the rotating substrate, the determination can be made accurately. Therefore, the operation mode can be switched more appropriately.

[0072] In the substrate working device according to the fifth aspect, the changing section may change the interval by moving the two working sections, respectively. The fifth aspect may be any one of the first aspect to the fourth aspect.

[0073] Thus, since the two working parts are moved separately, the time required for changing the interval can be shortened. That is, when only one of the two working parts is moved, it is necessary to move the one over a long distance, so a long time is required to change the interval. However, in the fifth embodiment, since the two working parts are moved separately, the time required for changing the interval can be reduced to, for example, half compared to the case where only one of the two working parts is moved.

[0074] In the substrate operation device according to the sixth aspect, the first operation and the second operation may be operations of attaching an anisotropic conductive film (ACF) to the substrate. The sixth aspect may be any one of the first to fifth aspects.

[0075] This makes it possible to miniaturize a device (eg, a bonding unit) for attaching the ACF to the substrate.

[0076] Hereinafter, embodiments will be described in detail with reference to the drawings.

[0077] In addition, the embodiments described below all show general or specific examples. The numerical values, shapes, materials, constituent elements, configuration positions of constituent elements, connection forms, steps, order of steps, etc. shown in the following embodiments are examples, and the main purpose is not to limit the present disclosure. In addition, among the constituent elements in the following embodiments, the constituent elements that are not recorded in the independent claims representing the highest concept are described as arbitrary constituent elements. In addition, each figure is a schematic diagram and is not necessarily strictly illustrated. In addition, in each figure, the same structural member is marked with the same figure mark.

[0078] (Implementation Method)

[0079] [Schematic structure of component mounting line]

[0080] Figure 1 It is a diagram showing a schematic structure of a component mounting line in this embodiment.

[0081] The component mounting line 1 in this embodiment is a system for manufacturing products such as display panels (i.e., mounting substrates) by mounting components 5 on substrates 3 such as liquid crystal panels and organic EL (Electro-Luminescence) panels. Additionally, the component 5 is, for example, an electronic component such as a drive circuit. Furthermore, the component mounting line 1 is also referred to as a component crimping system.

[0082] As Figure 1 shown, such a component mounting line 1 includes a substrate loading section 10, an adhesive section 20, a pre-crimping section 30, a final crimping section 40, and a substrate unloading section 50. The substrate loading section 10, the adhesive section 20, the pre-crimping section 30, the final crimping section 40, and the substrate unloading section 50 are connected in this order.

[0083] The substrate loading section 10 receives the rectangular substrate 3 transported in by an operator or another device on the upstream side. Then, it transports this substrate 3 to the adhesive section 20 on the downstream side.

[0084] The adhesive section 20 receives the substrate 3 transported out from the substrate loading section 10, and pastes an adhesive member such as ACF on each of a plurality of electrode portions 4 located at the periphery of the substrate 3. Then, it transports the substrate 3 with the adhesive member pasted thereon to the pre-crimping section 30. Additionally, each of the plurality of electrode portions 4 is composed of, for example, a plurality of electrodes.

[0085] The pre-crimping section 30 receives the substrate 3 transported out from the adhesive section 20, mounts the component 5 on the portion of the substrate 3 where the adhesive member is pasted, and performs pre-crimping. Then, it transports the substrate 3 with the component 5 pre-crimped thereon to the final crimping section 40.

[0086] The final crimping section 40 receives the substrate 3 transported out from the pre-crimping section 30, and performs final crimping (also referred to as thermal crimping) on the component 5 pre-crimped on this substrate 3. Then, it transports the substrate 3 that has undergone this final crimping to the substrate unloading section 50.

[0087] The substrate unloading section 50 receives the substrate 3 transported out from the final crimping section 40. It transports the substrate 3 received at the substrate unloading section 50 to the downstream side.

[0088] In this way, the component mounting line 1 executes a component mounting operation of mounting the components 5 on a plurality of electrode portions 4 provided at the periphery of the loaded substrate 3, and transports the substrate 3 with the components 5 mounted thereon as a mounting substrate from the substrate unloading section 50.

[0089] [Detailed Structure of Component Mounting Line]

[0090] Figure 2 is a top view of the component mounting line 1 in this embodiment. Specifically, Figure 2This shows the structure of the component mounting line 1 as viewed from above. Additionally, in this embodiment, the conveyance direction of the substrate 3, which is the left-right direction, is referred to as the X-axis direction, the vertical direction, which is the up-down direction, is referred to as the Z-axis direction, and the direction perpendicular to the X-axis direction and the Z-axis direction, which is the depth direction, is referred to as the Y-axis direction. Furthermore, the negative side and the positive side of the X-axis direction respectively correspond to the upstream side and the downstream side of the conveyance direction of the substrate 3, the negative side and the positive side of the Z-axis direction respectively correspond to the lower side and the upper side of the vertical direction, and the negative side and the positive side of the Y-axis direction respectively correspond to the near front side and the back side, or the front side and the rear side of the depth direction.

[0091] The substrate loading section 10 includes a base 1a for placing the loaded substrate 3. A stage 11 for placing the substrate 3 is provided on the base 1a of the substrate loading section 10. The stage 11 moves up and down in the Z-axis direction relative to the base 1a. In addition, a plurality of suction holes 11a are provided on the upper surface of the stage 11. Such a stage 11 holds the substrate 3 loaded on the stage 11 from an operator or other upstream devices by vacuum suction through the suction holes 11a by a suction device such as a pump (not shown).

[0092] The pasting section 20 has the function of performing the pasting operation of pasting an ACF as an adhesive member on the electrode portion 4 of the substrate 3. The pasting section 20 includes a substrate moving mechanism 21 and a pasting mechanism 22.

[0093] The substrate moving mechanism 21 is a mechanism for moving the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a stage 23. In the substrate moving mechanism 21, the X-axis table, the Y-axis table, the Z-axis table, and the stage 23 are stacked in order from below on the base 1b.

[0094] The Y-axis table extends in the Y-axis direction and moves freely in the X-axis direction on the X-axis table. The Z-axis table moves freely in the Y-axis direction on the Y-axis table, and causes the stage 23 provided on the upper part to move up and down in the Z-axis direction and rotate around the Z-axis.

[0095] In addition, a plurality of suction holes 23a are provided on the upper surface of the stage 23, and the stage 23 holds the substrate 3 placed on its upper surface by vacuum suction. In this way, the substrate moving mechanism 21 adsorbs and holds the substrate 3 and moves it in the horizontal plane (specifically, the X-axis direction and the Y-axis direction), moves up and down in the vertical direction (i.e., the Z-axis direction), and rotates around the Z-axis.

[0096] The pasting mechanism 22 has, above the base 1b, for example, two pasting mechanism components arranged in the X-axis direction. Each pasting mechanism component includes: an ACF supply unit for supplying ACF; a pasting head for pasting ACF on the substrate 3; and a pasting support stage disposed below the pasting head. Such two pasting mechanism components respectively paste the ACF supplied from the ACF supply unit at positions corresponding to the plurality of electrode portions 4 on the substrate 3 supported by the pasting support stage by raising and lowering the pasting head.

[0097] The pre-crimping unit 30 performs a pre-crimping operation of mounting the component 5 on the region where the ACF is pasted on the substrate 3 (i.e., the crimping target portion) and performing pre-crimping. The pre-crimping unit 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, a component supply unit 33, and a component transfer unit 35.

[0098] The substrate moving mechanism 31 has the same structure as the substrate moving mechanism 21 of the pasting unit 20. Specifically, the substrate moving mechanism 31 has a stage 37 for holding the substrate 3. A plurality of suction holes 37a are provided on the upper surface of the stage 37. The substrate moving mechanism 31 holds the substrate 3 placed on the stage 37 by performing vacuum suction through its plurality of suction holes 37a. In addition, the substrate moving mechanism 31 has functions of moving the stage 37 that adsorbs and holds the substrate 3 in the horizontal plane, raising and lowering in the vertical direction, and rotating around the Z axis. The substrate moving mechanism 31 positions the region where the ACF is pasted on the substrate 3 held by adsorption above the support portion 36 of the support stage that is the component mounting mechanism 32 through the movement and rotation of the stage 37.

[0099] The component supply unit 33 extends from the rear of the base 1b to the inside of the component mounting mechanism 32 (i.e., the positive Y-axis direction). For example, the component supply unit 33 includes: a supply reel 33a wound with a tape member such as a TCP (Tape Carrier Package) assembled with components; a punching section 33b; a movable stage 33c; and a track 33d. Such a component supply unit 33 sequentially supplies the components 5 from the tape member through the activities of these components.

[0100] The component transfer unit 35 moves the component 5 supplied from the component supply unit 33 toward the crimping tool 34 included in the component mounting mechanism 32.

[0101] The component mounting mechanism 32 is provided on the base 1b and includes a crimping tool 34 and a support portion 36.

[0102] The support portion 36 is a long-shaped member that supports the substrate 3 from below. That is, the support portion 36 supports from below a predetermined portion of the substrate 3 held by the stage 37, which is the crimping target portion. In addition, this crimping target portion is the portion where the ACF is pasted on the substrate 3.

[0103] The crimping tool 34 holds the component 5 and crimps the component 5 onto the upper surface of the substrate 3 supported by the support portion 36. That is, the crimping tool 34 crimps the component 5 onto the crimping target portion of the substrate 3. Specifically, the crimping tool 34 moves up and down in the Z-axis direction, adsorbs (i.e., picks up) the component 5 that has been moved by the component transfer portion 35 from above. Then, the crimping tool 34 pre-crimps the component 5 onto the substrate 3 by mounting the adsorbed component 5 on the ACF and pressing it together with the substrate 3 onto the support portion 36. Additionally, the pre-crimping portion 30 may also be provided with a mechanism for rotating the direction of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees.

[0104] The formal crimping portion 40 performs a formal crimping operation (also referred to as a thermocompression bonding operation) of formally crimping (i.e., thermocompression bonding) the component 5 that has been pre-crimped onto the substrate 3 by the pre-crimping portion 30 onto the substrate 3. As a result, the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. Such a formal crimping portion 40 includes a substrate moving mechanism 41 and a crimping mechanism 42.

[0105] The substrate moving mechanism 41 has the same structure as the substrate moving mechanism 21 of the pasting portion 20. Specifically, the substrate moving mechanism 41 has a stage 49. A plurality of suction holes 49a are provided on the upper surface of the stage 49. The substrate moving mechanism 41 holds the substrate 3 placed on the stage 49 by vacuum suction through its plurality of suction holes 49a. In addition, the substrate moving mechanism 41 has the functions of moving the stage 49 that adsorbs and holds the substrate 3 in the horizontal plane, moving up and down in the vertical direction, and rotating around the Z-axis. The substrate moving mechanism 41 moves and rotates the stage 49 to position the region of the substrate 3 pre-crimped with the component 5 above the crimping support portion of the crimping mechanism 42.

[0106] The crimping mechanism 42 presses the component 5 of the substrate 3 against the crimping support portion side with a heated head. As a result, the component 5 is formally crimped, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF.

[0107] The substrate unloading portion 50 has the function of vacuum-adsorbing and holding the substrate 3 transported from the formal crimping portion 40 on the stage 51. The substrate 3 held in the substrate unloading portion 50 is unloaded to other devices on the downstream side, or taken out by an operator from the stage 51. The stage 51 moves up and down in the Z-axis direction relative to the base 1c. In addition, a plurality of suction holes 51a are provided on the upper surface of the stage 51, and the stage 51 vacuum-adsorbs and holds the substrate 3 transferred from the formal crimping portion 40 on its upper surface.

[0108] The transfer unit 60 is a device for transferring the substrate 3. Specifically, the transfer unit 60 has a function of sequentially transferring (moving) the substrate 3 transported into the substrate loading unit 10 to the pasting unit 20, the pre - crimping unit 30, the final crimping unit 40, and the substrate unloading unit 50 in this order. The transfer unit 60 is disposed in the front region (i.e., the negative side in the Y - axis direction) of the pasting unit 20, the pre - crimping unit 30, and the final crimping unit 40.

[0109] The transfer unit 60 includes substrate transfer mechanisms 62A, 62B, 62C, and 62D that are sequentially arranged from the upstream side on a moving base 61 that extends in the X - axis direction across the base 1a, the base 1b, and the base 1c. The substrate transfer mechanisms 62A - 62D each include a base portion 63 and one or more arm assemblies 64. In the present embodiment, an example is shown in which the substrate transfer mechanisms 62A - 62D each include two arm assemblies 64. The base portion 63 is provided on the moving base 61 and is movable freely in the X - axis direction. On the base portion 63, two arm assemblies 64 are arranged side by side in the X - axis direction. The arm assembly 64 vacuum - adsorbs the substrate 3 from above.

[0110] The substrate transfer mechanisms 62A - 62D each move to a substrate transfer position where they vacuum - adsorb the substrate 3 held by the carriers 11, 23, 37, 49, 51 from above, and receive or transfer the substrate 3 from / to the ascending / descending carriers 11, 23, 37, 49, 51. For example, the substrate transfer mechanism 62A receives the substrate 3 placed on the carrier 11 of the substrate loading unit 10 and transfers it to the carrier 23 of the pasting unit 20. In addition, for example, the substrate transfer mechanism 62B receives the substrate 3 from the carrier 23 of the pasting unit 20 and transfers it to the carrier 37 of the pre - crimping unit 30. In addition, for example, the substrate transfer mechanism 62C receives the substrate 3 from the carrier 37 of the pre - crimping unit 30 and transfers it to the carrier 49 of the final crimping unit 40. In addition, for example, the substrate transfer mechanism 62D receives the substrate 3 from the carrier 49 of the final crimping unit 40 and transfers it to the carrier 51 of the substrate unloading unit 50.

[0111] [Details of the Pasting Unit (Substrate Working Device)]

[0112] Figure 3 This is a diagram showing an example of the pasting mechanism 22 of the pasting unit 20 in the present embodiment. Specifically, Figure 3 It schematically shows the appearance of the pasting mechanism 22 as viewed from the negative side in the Y - axis direction.

[0113] The pasting mechanism 22 includes: two pasting mechanism components 220L and 220R; an X - axis rail mechanism 228; and a pasting base 229.

[0114] The pasting base 229 is a base for supporting the two pasting mechanism components 220L and 220R.

[0115] The X-axis rail mechanism 228 is disposed along the X-axis direction on the upper surface of the bonding base 229. On this X-axis rail mechanism 228, two bonding mechanism assemblies 220L and 220R are freely placed so as to move along the X-axis direction. In addition, the X-axis rail mechanism 228 includes a changing portion for changing the interval between the two bonding mechanism assemblies 220L and 220R.

[0116] The two bonding mechanism assemblies 220L and 220R are mechanisms for bonding ACF to the substrate 3 and have the same structure as each other. For example, the bonding mechanism assembly 220L includes a tape supply reel 221, a tape recovery portion 222, a bonding head 223, a bonding support stage 224, and a tape cutting assembly 225.

[0117] The tape supply reel 221 is a reel around which a tape member tp is wound. The tape member tp is composed of a base tape and an ACF tape laminated on the base tape. The above-mentioned ACF is an ACF chip cut from the ACF tape. The tape member tp is released from the tape supply reel 221 by the drive of one or more rollers. Such a tape supply reel 221 and one or more rollers can be said to constitute the above-mentioned ACF supply portion.

[0118] The tape cutting assembly 225 cuts the ACF tape among the tape members tp released from the tape supply reel 221 by moving the cutter in the vertical direction. That is, the tape cutting assembly 225 semi-cuts the tape member tp. The ACF chip is formed by this cutting.

[0119] The bonding support stage 224 is a stage for supporting the peripheral portion of the substrate 3 from below.

[0120] The bonding head 223 moves up and down. Specifically, the bonding head 223 presses the tape member tp passing through between the bonding support stage 224 against the peripheral portion of the substrate 3 supported by the bonding support stage 224 by descending. That is, the bonding head 223 presses the tape member tp against the peripheral portion of the substrate 3 and the bonding support stage 224 side. At this time, the above-mentioned ACF chip is formed on the lower surface of the base tape of the pressed tape member tp. In addition, an electrode portion 4 is formed on the peripheral portion of the substrate 3. Therefore, this ACF chip is pressed against the electrode portion 4 of the substrate 3 and bonded, and is peeled off from the base tape. The base tape from which the ACF chip has been peeled off is recovered into the tape recovery portion 222 as the tape member tp is released.

[0121] Figure 4 It is a diagram showing an example of the bonding portion 20 in the present embodiment. Specifically, Figure 4 FIG. (a) schematically shows the appearance of the bonding portion 20 when viewed from the positive side in the X-axis direction, Figure 4 FIG. (b) schematically shows the appearance of a part of the bonding portion 20 when viewed from the positive side in the Z-axis direction.

[0122] AsFigure 4 As shown in (a) of [reference], the pasting part 20 includes: a pasting base 229; a substrate moving mechanism 21 and an X-axis rail mechanism 228 disposed on the pasting base 229; and two pasting mechanism assemblies 220L and 220R mounted on the X-axis rail mechanism 228. In addition, in Figure 4 In (a) of [reference], the pasting mechanism assembly 220L is located on the negative side in the X-axis direction relative to the pasting mechanism assembly 220R and is blocked by the pasting mechanism assembly 220R.

[0123] As Figure 4 As shown in (a) and (b) of [reference], the substrate moving mechanism 21 includes an X-axis workbench 211, a Y-axis workbench 212, a Z-axis workbench 213, and a stage 23. The X-axis workbench 211 is, for example, in a rail shape and is disposed on the pasting base 229 along the X-axis direction. The Y-axis workbench 212 is, for example, in a rail shape and is disposed on the X-axis workbench 211 in a state parallel to the Y-axis direction and is freely movable in the X-axis direction. The Z-axis workbench 213 is disposed on the Y-axis workbench 212 and is freely movable in the Y-axis direction, causing the stage 23 provided on the upper part to move up and down in the Z-axis direction and rotate around the Z-axis. A substrate 3 is placed on the stage 23 and adsorbed and held. Such a substrate moving mechanism 21 moves the substrate 3 adsorbed and held on the stage 23 in the X-axis direction, Y-axis direction, and Z-axis direction, and further rotates the substrate 3 around the Z-axis.

[0124] For example, the substrate moving mechanism 21 rotates and moves the substrate 3 so that the peripheral portion of the substrate 3 adsorbed and held on the stage 23 is placed on the pasting support stage 224 and is supported from below by the pasting support stage 224. A plurality of electrode portions 4 are formed on the peripheral portion of the substrate 3.

[0125] The tape cutting assembly 225 of the pasting mechanism assembly 220R has a baffle 225a and a cutter 225b. The cutter 225b clamps the tape member tp between it and the baffle 225a by rising and presses and cuts the ACF tape of the tape member tp. Then, as described above, when the substrate 3 is supported by the pasting support stage 224, the peripheral portion of the substrate 3 enters a state between the pasting head 223, the baffle 225a, the tape member tp, and the pasting support stage 224.

[0126] Figure 5 It is a block diagram showing the functional structure of the substrate working device in the present embodiment.

[0127] The substrate working device 100 in the present embodiment includes a control unit 101, a substrate placement unit 102, a drive unit 103, a working unit 104L, a working unit 104R, and a change unit 105. In the present embodiment, such a substrate working device 100 is configured as the pasting part 20.

[0128] The substrate mounting portion 102 is a component that has a mounting surface for mounting the substrate 3 and can rotate about a rotation axis extending in the normal direction of the mounting surface. Further, the substrate 3 has a first side and a second side that intersects the first side. If the substrate 3 is a rectangular plate, the first side is one of the long side and the short side, and the second side is the other of the long side and the short side. In a specific example, such a substrate mounting portion 102 and the mounting surface are the stage 23 included in the substrate moving mechanism 21 and the upper surface of the stage 23.

[0129] The drive unit 103 moves and rotates the substrate mounting portion 102. In a specific example, the drive unit 103 includes the X-axis stage 211, the Y-axis stage 212, and the Z-axis stage 213 in the substrate moving mechanism 21. Further, the drive unit 103 has an actuator such as a motor, and moves and rotates the substrate mounting portion 102 by the driving force of the actuator.

[0130] The working units 104L and 104R perform: the first operation of performing an operation on the first side when the substrate 3 is in the first configuration state; and the second operation of performing an operation on the second side when the substrate 3 is in the second configuration state. In a specific example, the working units 104L and 104R are the bonding mechanism components 220L and 220R included in the bonding portion 20. In this case, the first operation is an operation of attaching an ACF (i.e., an ACF chip) to the first side of the substrate 3, and the second operation is an operation of attaching an ACF to the second side of the substrate 3. Further, the first side on which the operation is performed is specifically the peripheral portion of the substrate 3 having one or more electrode portions 4 arranged along the first side of the substrate 3. Similarly, the second side on which the operation is performed is specifically the peripheral portion of the substrate 3 having one or more electrode portions 4 arranged along the second side of the substrate 3. Further, the operation of attaching the ACF to the substrate 3 can also be said to be an operation of pressing the ACF against the substrate 3.

[0131] The changing unit 105 changes the interval between the working unit 104L and the working unit 104R. In a specific example, the changing unit 105 is included in the X-axis rail mechanism 228 of the bonding portion 20. Further, the changing unit 105 has an actuator such as a motor, and moves at least one of the working unit 104L and the working unit 104R along the X-axis rail mechanism 228 by the driving force of the actuator.

[0132] The control unit 101 controls the drive unit 103, the working units 104L and 104R, and the changing unit 105. Specifically, the control unit 101 performs a configuration change process of switching the state of the substrate 3 from the first configuration state to the second configuration state after the above-described first operation and before the second operation. In this configuration change process, the control unit 101 widens the interval between the working unit 104L and the working unit 104R by the changing unit 105, and then causes the drive unit 103 to rotate the substrate mounting unit 102 on which the substrate 3 is placed. The first configuration state is the state of the substrate 3 in which the first operation can be performed. For example, when the substrate working device 100 is the pasting unit 20, it is the state in which the first side of the substrate 3 is disposed between the pasting head 223, the tape member tp, and the pasting support stage 224. The second configuration state is the state of the substrate 3 in which the second operation can be performed. For example, when the substrate working device 100 is the pasting unit 20, it is the state in which the second side of the substrate 3 is disposed between the pasting head 223, the tape member tp, and the pasting support stage 224.

[0133] [Configuration change process]

[0134] Figure 6 is a diagram schematically showing an example of the configuration change process. In addition, Figure 6 in (a) to (c) shows the states of the working unit 104L, the working unit 104R, and the substrate 3 as viewed from the positive side in the Z-axis direction. In addition, in the following examples, the first side is the long side and the second side is the short side. In addition, the one-dot chain line passing through Figure 6 in (a) to (c) represents the midpoint or the line symmetry axis between the working unit 104L and the working unit 104R in the X-axis direction.

[0135] For example, as shown in Figure 6 (a), the control unit 101 moves and rotates the substrate mounting unit 102 by controlling the drive unit 103 so that the substrate 3 becomes the first configuration state. When the substrate 3 is in the first configuration state, the substrate mounting unit 102 (for example, the central position of the substrate mounting unit 102) is located at the position L in the Y-axis direction. In addition, since the position L is the position of the substrate mounting unit 102 for operating on the long side of the substrate 3, it is also referred to as the long-side working position. Then, when the substrate 3 is in the first configuration state, the long side of the substrate 3 is disposed on the positive side in the Y-axis direction and along the X-axis direction, and is further disposed between the pasting head 223, the tape member tp, and the pasting support stage 224. In addition, in Figure 6 , the pasting head 223, the tape member tp, and the pasting support stage 224 are not shown for the sake of visibility, and the members of the working unit 104L and the working unit 104R that are located at substantially the same height as the substrate 3 are shown.

[0136] Furthermore, the control unit 101 sets the interval between the operation unit 104L and the operation unit 104R to the first interval through the control change unit 105. For example, the first interval is substantially the same as the interval between the two electrode units 4 arranged along the long side of the substrate 3.

[0137] When the substrate 3 is in such a first configuration state, the control unit 101 takes the attachment of the ACF to the two electrode units 4 of the substrate 3 as the first operation, and causes the operation unit 104L and the operation unit 104R to execute simultaneously, for example. Furthermore, while causing the substrate 3 to move in the X-axis direction by controlling the drive unit 103, the control unit 101 causes the operation unit 104L and the operation unit 104R to repeatedly execute this first operation. Thereby, the ACF is attached to all the electrode units 4 located on the long side of the substrate 3.

[0138] Next, the control unit 101 changes the state of the substrate 3 from the first configuration state to the second configuration state. At this time, as shown in (b) of Figure 6 , the control unit 101 causes the change unit 105 to widen the interval between the operation unit 104L and the operation unit 104R. For example, the change unit 105 widens this interval by causing the operation unit 104L and the operation unit 104R to move in directions away from each other respectively. That is, the control unit 101 causes the operation unit 104L and the operation unit 104R to retract. In addition, the control unit 101 moves the substrate mounting unit 102 to the position M in the Y-axis direction and rotates it 90 degrees around the Z-axis by controlling the drive unit 103. The position M can be a predetermined position for rotating the substrate 3. In addition, since the position M is a position for rotating the substrate 3, it is also called a rotation position. For example, the control unit 101 moves the substrate mounting unit 102 a distance A1 in the negative Y-axis direction by controlling the drive unit 103, thereby moving the substrate mounting unit 102 from the position L to the position M. That is, the control unit 101 causes the substrate mounting unit 102 to retract. Then, after widening the interval between the operation unit 104L and the operation unit 104R through the change unit 105, the control unit 101 causes the drive unit 103 to perform the rotation of the substrate mounting unit 102. Thereby, the substrate 3 rotates. When the center of the substrate 3 is on the rotation axis of the substrate mounting unit 102, the substrate 3 rotates about this center.

[0139] Here, if the interval between the operation unit 104L and the operation unit 104R is not widened, the rotating substrate 3 may collide with the operation unit 104L and the operation unit 104R respectively. Specifically, when the substrate working device 100 is the pasting unit 20, the substrate 3 may collide with the tape cutting assembly 225 located at the same height as the substrate 3. However, in the present embodiment, as described above, since the interval between the operation unit 104L and the operation unit 104R is widened, the substrate 3 can rotate without colliding with the operation unit 104L and the operation unit 104R.

[0140] like Figure 6 The substrate 3 rotates as in (b), and the control unit 101 Figure 6 As shown in (c) of FIG. 1 , the substrate mounting portion 102 is moved to position N in the Y-axis direction by controlling the driving portion 103 while the short side of the substrate 3 is along the X-axis direction. For example, the control portion 101 controls the driving portion 103 to move the substrate mounting portion 102 to the negative side of the Y-axis direction by a distance D1, thereby moving the substrate mounting portion 102 from position M to position N. In addition, since position N is the position of the substrate mounting portion 102 that operates on the short side of the substrate 3, it is also called the short side operation position. By moving the substrate 3, the substrate 3 is in the second configuration state. When the substrate 3 is in the second configuration state, the short side of the substrate 3 is configured to be located on the positive side of the Y-axis direction and along the X-axis direction, and further configured between the pasting head 223 and the belt member tp and the pasting support stage 224. Then, the control portion 101 sets the interval between the working portion 104L and the working portion 104R to the second interval by narrowing the interval between the working portion 104L and the working portion 104R. For example, the changing unit 105 moves the working unit 104L and the working unit 104R toward each other to narrow the interval. The second interval is substantially the same as the interval between the two electrode units 4 arranged along the short side of the substrate 3. In addition, at this time, the control unit 101 can move the substrate mounting unit 102 in the X-axis direction so that the pasting heads 223 of the working unit 104L and the working unit 104R are opposite to the electrode unit 4.

[0141] When the substrate 3 is in the second configuration state, the control unit 101 makes the working unit 104L and the working unit 104R perform the second operation simultaneously, for example, by attaching the ACF to the two electrode portions 4 of the substrate 3. Furthermore, the control unit 101 controls the driving unit 103 to move the substrate 3 along the X-axis direction, and makes the working unit 104L and the working unit 104R repeatedly perform the second operation. Thus, the ACF is attached to all the electrode portions 4 located on the short sides of the substrate 3.

[0142] Thus, in the present embodiment, since the interval between the widening operation unit 104L and the operation unit 104R is widened, a space into which at least a part of the rotating substrate 3 can enter can be provided between the operation unit 104L and the operation unit 104R. Therefore, the length in the depth direction, i.e., the Y-axis direction, of the substrate processing apparatus 100 can be shortened. For example, in the case where there is no such space, in order to prevent the operation unit 104L and the operation unit 104R from interfering with the rotating substrate 3, a gap needs to be provided in the Y-axis direction between the operation unit 104L and the operation unit 104R and the rotating substrate 3. However, in the present embodiment, due to the above-mentioned space, at least a part of the rotating substrate 3 can enter this space, thereby suppressing the interference between the operation unit 104L and the operation unit 104R and the rotating substrate 3. Therefore, the distance from the operation unit 104L and the operation unit 104R to the rotating substrate 3 in the Y-axis direction can be shortened. As a result, the length of the substrate processing apparatus 100 in the Y-axis direction can be shortened. Thus, miniaturization of the substrate processing apparatus 100 can be achieved. In addition, through this miniaturization, the operation unit 104L and the operation unit 104R can be arranged closer to the front side of the substrate processing apparatus 100. For this reason, an operator can easily access the operation unit 104L and the operation unit 104R from the front side of the substrate processing apparatus 100 for maintenance, and the accessibility and maintainability can be improved. Furthermore, due to the above-mentioned space, as long as the substrate mounting unit 102 is moved by a distance A1 in the Y-axis direction, the substrate 3 can be rotated, and compared with the case where there is no such space, the distance by which the substrate mounting unit 102 is moved in the Y-axis direction can be shortened. As a result, the time required to move the substrate mounting unit 102 can be shortened, and improvement in operation efficiency can be achieved.

[0143] In addition, in the present embodiment, the first operation and the second operation are respectively operations of pasting ACF on the substrate 3. Thereby, the pasting unit 20 for pasting ACF on the substrate 3 can be miniaturized.

[0144] In addition, in the present embodiment, the changing unit 105 changes the interval by moving the operation unit 104L and the operation unit 104R respectively. Thus, since the operation unit 104L and the operation unit 104R are moved respectively, the time required to change the interval can be shortened. That is, in the case where only one of the operation unit 104L and the operation unit 104R is moved, a long distance needs to be moved for that one, so a long time is required to change the interval. However, in the present embodiment, since the operation unit 104L and the operation unit 104R are moved respectively, the time required to change the interval can be reduced, for example, to half compared with the case where only one is moved.

[0145] In addition, in Figure 6 the example of Figure 6As shown in (b) thereof, the drive unit 103 moves the substrate placement unit 102 in the negative Y-axis direction and rotates the substrate placement unit 102. However, before rotating the substrate placement unit 102, the substrate placement unit 102 may be moved in the X-axis direction. For example, the drive unit 103 can move the substrate placement unit 102 in the X-axis direction to align the position of the rotation axis of the substrate placement unit 102 with the midpoint position between the operation unit 104L and the operation unit 104R in the X-axis direction. Thereby, interference between the operation unit 104L and the operation unit 104R and the rotating substrate 3 can be effectively suppressed.

[0146] In addition, in Figure 6 the example, the rotation center of the substrate placement unit 102 coincides with the center of the substrate 3, but they may not coincide. When the rotation center of the substrate placement unit 102 and the center of the substrate 3 do not coincide, the substrate 3 rotates around the Z-axis with a point located at a position different from the center of the substrate 3 as the center. Therefore, in this case, the rotation radius of the substrate 3 becomes longer than when the rotation center coincides with the center of the substrate 3. For this reason, it is necessary to widen the interval between the operation unit 104L and the operation unit 104R more, or it is necessary to move the substrate placement unit 102 in the negative Y-axis direction by a distance longer than the distance A1.

[0147] Figure 7 is a flowchart showing an example of the configuration change process of the control unit 101. In addition, an example of this configuration change process is Figure 6 the example shown.

[0148] When the first operation of the operation unit 104L and the operation unit 104R ends, the control unit 101 controls the drive unit 103 to retract the substrate placement unit 102 on which the substrate 3 is placed (step S11). That is, the drive unit 103 retracts the substrate placement unit 102 when the substrate 3 rotates so that the substrate 3 does not collide with, in other words, does not interfere with the operation unit 104L and the operation unit 104R. Specifically, as Figure 6 shown in (b) thereof, the drive unit 103 moves the substrate placement unit 102 in the negative Y-axis direction by a distance A1 to place the substrate placement unit 102 at the position M (i.e., the rotation position).

[0149] Next, the control unit 101 controls the change unit 105 to retract the operation unit 104L and the operation unit 104R (step S12). That is, the change unit 105 retracts the operation unit 104L and the operation unit 104R when the substrate 3 rotates so that the substrate 3 does not collide with, in other words, does not interfere with the operation unit 104L and the operation unit 104R. Specifically, as Figure 6As shown in (b) thereof, the changing unit 105 widens the interval between the working unit 104L and the working unit 104R by moving the working unit 104L and the working unit 104R away from each other in the X-axis direction. That is, the interval between the working unit 104L and the working unit 104R is widened from the above-mentioned first interval.

[0150] Next, the control unit 101 rotates the substrate mounting unit 102 on which the substrate 3 is mounted by, for example, 90 degrees by controlling the driving unit 103 (step S13). By this rotation, the long side of the substrate 3 changes from the state along the X-axis direction to the state along the Y-axis direction, and conversely, the short side of the substrate 3 changes from the state along the Y-axis direction to the state along the X-axis direction.

[0151] Next, the control unit 101 moves the substrate mounting unit 102 on which the substrate 3 is mounted by controlling the driving unit 103 (step S14). Specifically, as Figure 6 shown in (c) thereof, the driving unit 103 moves the substrate mounting unit 102 by a distance D1 in the negative Y-axis direction to dispose the substrate mounting unit 102 at the position N (i.e., the short-side working position).

[0152] Then, the control unit 101 changes the interval between the working unit 104L and the working unit 104R by controlling the changing unit 105 (step S15). Specifically, as Figure 6 shown in (c) thereof, the changing unit 105 narrows the interval between the working unit 104L and the working unit 104R by moving the working unit 104L and the working unit 104R closer to each other in the X-axis direction. As a result, the interval between the working unit 104L and the working unit 104R is set to the above-mentioned second interval.

[0153] In addition, in the Figure 6 and Figure 7 example, the first side of the substrate 3 is the long side and the second side of the substrate 3 is the short side, but it can be reversed, that is, the first side is the short side and the second side is the long side. That is, it is also possible to perform the second operation on the long side of the substrate 3 after performing the first operation on the short side of the substrate 3. In addition, it is also possible not to perform the Figure 7 processing of step S11. In this case, in step S12, the interval between the working unit 104L and the working unit 104R is further widened so that even if the substrate mounting unit 102 rotates in the state of being located at the position L, the substrate 3 does not interfere with the working unit 104L and the working unit 104R. In addition, the distance A1 by which the substrate mounting unit 102 moves in step S11 and the distances by which the working unit 104L and the working unit 104R move in step S12 are set so that the substrate 3 does not interfere with the working unit 104L and the working unit 104R during the rotation in step S13. In addition, in Figure 7In this case, after the process of step S14, the process of step S15 is performed. However, as long as the substrate 3 does not interfere with the operation units 104L and 104R, the process of step S14 may also be performed after the process of step S15.

[0154] In addition, in Figure 6 and Figure 7 example, the substrate mounting unit 102 moves to position M and rotates, and then moves to position N. The substrate mounting unit 102 may also move to position N through position M and rotate at position N. In this case, since the substrate mounting unit 102 and the substrate 3 rotate closer to the front side than the substrate processing device 100, when there is a structure of the substrate processing device 100 in this near front side, the possibility of interference between the substrate 3 and the structure increases. Therefore, if the substrate mounting unit 102 rotates at position M, compared with rotating at position N, the possibility of interference of the substrate 3 can be suppressed.

[0155] Figure 8 is a diagram schematically showing another example of the configuration change process. In addition, Figure 8 (a) to (c) show the states of the operation units 104L, 104R, and the substrate 3 observed from the positive side in the Z-axis direction. In addition, in the following examples, the first side is the long side and the second side is the short side. In addition, Figure 8 shows an example of the configuration change process in which the state of the substrate 3 can be changed from the first configuration state to the second configuration state without the operation units 104L and 104R retracting. In addition, the dash-dot line passing through a point in the vertical direction through Figure 8 (a) to (c) represents the midpoint or line symmetry axis of the operation units 104L and 104R in the X-axis direction.

[0156] For example, the control unit 101 is the same as the example of Figure 6 (a), and as shown in Figure 8 (a), the substrate mounting unit 102 is moved and rotated by controlling the drive unit 103 so that the substrate 3 is in the first configuration state. Further, the control unit 101 sets the interval between the operation units 104L and 104R to the first interval by controlling the change unit 105. In addition, in Figure 8 , it is also the same as Figure 6 , the paste head 223, the tape member tp, and the paste support stage 224 are not shown for the sake of visibility, and the members of the operation units 104L and 104R located at substantially the same height as the substrate 3 are shown.

[0157] When the substrate 3 is in such a first configuration state, the control unit 101 takes the attachment of the ACF to the two electrode portions 4 of the substrate 3 as the first operation, and causes the operation units 104L and 104R to execute simultaneously, for example. Further, while moving the substrate 3 in the X-axis direction by controlling the drive unit 103, the control unit 101 causes the operation units 104L and 104R to repeatedly execute this first operation. Thereby, the ACF is attached to all the electrode portions 4 on the long side of the substrate 3.

[0158] Next, the control unit 101 changes the state of the substrate 3 from the first configuration state to the second configuration state. At this time, as shown in (b) of Figure 8 , the control unit 101 causes the drive unit 103 to move the substrate mounting unit 102 without widening the interval between the operation unit 104L and the operation unit 104R by the changing unit 105. Specifically, the control unit 101 moves the substrate mounting unit 102 to the position M in the Y-axis direction by controlling the drive unit 103. For example, the control unit 101 moves the substrate mounting unit 102 a distance A2 in the negative Y-axis direction by controlling the drive unit 103, thereby moving the substrate mounting unit 102 from the position L to the position M. That is, the control unit 101 retracts the substrate mounting unit 102. Then, the control unit 101 causes the changing unit 105 to narrow the interval between the operation unit 104L and the operation unit 104R. That is, the control unit 101 causes the changing unit 105 to narrow the interval between the operation unit 104L and the operation unit 104R to set this interval as the second interval. For example, the changing unit 105 narrows this interval by causing the operation unit 104L and the operation unit 104R to move toward each other. After that, the control unit 101 causes the drive unit 103 to execute the rotation of the substrate 3. That is, the control unit 101 rotates the substrate mounting unit 102 90 degrees around the Z-axis by controlling the drive unit 103. Thereby, the substrate 3 rotates. When the center of the substrate 3 is on the rotation axis of the substrate mounting unit 102, the substrate 3 rotates about its center.

[0159] Here, for example, when the size of the substrate 3 placed on the substrate mounting unit 102 is small, even without the retraction of the operation units 104L and 104R, that is, even without widening their interval, the substrate 3 can rotate without interfering with the operation units 104L and 104R. Therefore, in Figure 8In the example of (b), the control unit 101 determines in advance whether interference will occur between the operation units 104L and 104R and the substrate 3. In a specific example, the control unit 101 can determine whether interference occurs at the time point when the first operation on the long side of the substrate 3 ends, or can determine whether interference occurs when the substrate placement unit 102 moves to the position M. Then, if the control unit 101 determines that no interference occurs, it does not cause the change unit 105 to execute the retraction of the operation units 104L and 104R and instead causes the drive unit 103 to execute the rotation of the substrate placement unit 102.

[0160] Then, if Figure 8 the substrate 3 rotates as in Figure 8 (b), the control unit 101, as shown in

[0161] (c), controls the drive unit 103 in a state where the short side of the substrate 3 is along the X-axis direction, so as to move the substrate placement unit 102 to the position N in the Y-axis direction. For example, the control unit 101 controls the drive unit 103 to move the substrate placement unit 102 a distance D2 in the negative Y-axis direction, thereby moving the substrate placement unit 102 from the position M to the position N. By this movement of the substrate 3, the substrate 3 becomes the second configuration state. In addition, at this time, the control unit 101 can move the substrate placement unit 102 in the X-axis direction so that the bonding heads 223 of the operation units 104L and 104R face the electrode portions 4 respectively. Figure 8 In addition, in the Figure 8 example, as shown in

[0162] (b), the drive unit 103 moves the substrate placement unit 102 in the negative Y-axis direction and rotates the substrate placement unit 102, but before rotating the substrate placement unit 102, the substrate placement unit 102 can be moved in the X-axis direction. For example, the drive unit 103 can move the substrate placement unit 102 in the X-axis direction so that the position of the rotation axis of the substrate placement unit 102 in the X-axis direction coincides with the midpoint position between the operation units 104L and 104R. Thereby, interference between the operation units 104L and 104R and the rotating substrate 3 can be effectively suppressed. Figure 8 In addition, in the

[0163] Figure 9It is a flowchart showing another example of the configuration change process of the control unit 101. Additionally, this other example of the configuration change process is Figure 8 the example shown.

[0164] When the first operation of the operation unit 104L and the operation unit 104R ends, the control unit 101 retracts the substrate mounting unit 102 on which the substrate 3 is placed by controlling the drive unit 103 (step S21). That is, when the substrate 3 rotates, the drive unit 103 retracts the substrate mounting unit 102 so that the substrate 3 does not collide with, in other words, does not interfere with the operation unit 104L and the operation unit 104R. Specifically, as Figure 8 shown in (b) of, the drive unit 103 can arrange the substrate mounting unit 102 at position M (i.e., the rotation position) by moving the substrate mounting unit 102 a distance A2 in the negative Y-axis direction.

[0165] Next, the control unit 101 changes the interval between the operation unit 104L and the operation unit 104R by controlling the change unit 105 (step S22). Specifically, as Figure 8 shown in (b) of, the change unit 105 narrows the interval between the operation unit 104L and the operation unit 104R by moving the operation unit 104L and the operation unit 104R closer to each other along the X-axis direction. As a result, the interval between the operation unit 104L and the operation unit 104R is set to the above-mentioned second interval.

[0166] Next, the control unit 101 rotates the substrate mounting unit 102 on which the substrate 3 is placed, for example, 90 degrees by controlling the drive unit 103 (step S23). Through this rotation, the long side of the substrate 3 changes from the state along the X-axis direction to the state along the Y-axis direction, and conversely, the short side of the substrate 3 changes from the state along the Y-axis direction to the state along the X-axis direction.

[0167] Then, the control unit 101 moves the substrate mounting unit 102 on which the substrate 3 is placed by controlling the drive unit 103 (step S24). Specifically, as Figure 8 shown in (c) of, the drive unit 103 arranges the substrate mounting unit 102 at position N (i.e., the short-side operation position) by moving the substrate mounting unit 102 a distance D2 in the negative Y-axis direction.

[0168] In addition, in the Figure 8 and Figure 9 example, the first side of the substrate 3 is the long side and the second side of the substrate 3 is the short side, but it can also be the other way around, where the first side is the short side and the second side is the long side. That is, it is also possible to perform the second operation on the long side of the substrate 3 after performing the first operation on the short side of the substrate 3. Additionally, it is also possible not to perform Figure 9Processing of step S21. For example, if the control unit 101 determines that even when the substrate placement unit 102 rotates while in the position L, the substrate 3 does not interfere with the working unit 104L and the working unit 104R, the processing of step S21 may not be performed. In addition, the distance A2 by which the substrate placement unit 102 moves in step S21 is set so that the substrate 3 does not interfere with the working unit 104L and the working unit 104R during the rotation in step S23. In addition, Figure 9 The order of the three processes of steps S22, S23, and S24 shown is not limited to this, and any order may be used as long as the substrate 3 does not interfere with the working unit 104L and the working unit 104R.

[0169] In addition, in Figure 8 and Figure 9 In the example, the substrate placement unit 102 moves to the position M and rotates, and then moves to the position N, but the substrate placement unit 102 may also move through the position M to the position N and rotate at the position N.

[0170] Figure 10 is a flowchart showing an example of the processing operation of the substrate processing apparatus 100.

[0171] First, the control unit 101 of the substrate processing apparatus 100 causes the working unit 104L and the working unit 104R to perform the first operation (step S1). That is, the control unit 101 previously causes the drive unit 103 to move and rotate the substrate placement unit 102 so that the substrate 3 is in the first configuration state, and further, the interval between the working unit 104L and the working unit 104R is set to the first interval by the control change unit 105. After that, the control unit 101 causes the drive unit 103 to perform the movement of the substrate placement unit 102 in the X-axis direction while causing the working unit 104L and the working unit 104R to perform the attachment of the ACF to the long side of the substrate 3.

[0172] Next, the control unit 101 determines whether interference occurs between the substrate 3 and the working unit 104L and the working unit 104R due to the rotation of the substrate 3 when the substrate placement unit 102 is in the position M (step S2). Here, if the control unit 101 determines that interference occurs (step S2 "Yes"), it performs the configuration change process in the first operation mode (step S10). The configuration change process in the first operation mode is Figure 6 The configuration change process shown is a process of changing the state of the substrate 3 from the first configuration state to the second configuration state by retracting the working unit 104L and the working unit 104R. In addition, Figure 7 The flowchart shows the details of the processing of this step S10.

[0173] On the other hand, if the control unit 101 determines that interference does not occur (step S2 “No”), it executes the configuration change process in the second operation mode (step S20). The configuration change process in the second operation mode is Figure 8 The configuration change process shown is a process of changing the state of the substrate 3 from the first configuration state to the second configuration state without retracting the operation units 104L and 104R. In addition, Figure 9 The flowchart of represents the details of the process of step S20.

[0174] Then, after the control unit 101 performs the process of step S10 or S20, it causes the operation units 104L and 104R to execute the second operation. That is, the control unit 101 causes the drive unit 103 to move the substrate placement unit 102 in the X-axis direction, and at the same time causes the operation units 104L and 104R to attach the ACF to the short side of the substrate 3.

[0175] In this way, in the present embodiment, the control unit 101 switches the operation mode of the configuration change process to the first operation mode and the second operation mode. In the first operation mode, after the control unit 101 widens the interval between the operation units 104L and 104R by the change unit 105, it causes the drive unit 103 to rotate the substrate placement unit 102 on which the substrate 3 is placed. In the second operation mode, the control unit 101 causes the drive unit 103 to rotate the substrate placement unit 102 on which the substrate 3 is placed without widening the interval between the operation units 104L and 104R by the change unit 105. Thus, in the case where the operation units 104L and 104R do not interfere with the rotating substrate 3 even without widening the interval between the operation units 104L and 104R, the configuration change process can be performed in the second operation mode, and the time required for the configuration change process can be shortened.

[0176] Here, the control unit 101 can switch the above operation mode based on the substrate information related to the substrate 3. Thereby, the switching of the operation mode can be appropriately performed.

[0177] In addition, the substrate information represents, for example, the size of the substrate 3 and the position of the substrate 3 on the placement surface of the substrate placement unit 102. Additionally, the substrate information may further represent the shape of the substrate 3. Moreover, the position of the substrate 3 represents the relative position of the substrate 3 with respect to the substrate placement unit 102. When the control unit 101 performs the configuration change process in the second operation mode based on the size and position of the substrate 3 shown in the substrate information, it determines whether at least one of the operation units 104L and 104R interferes with the rotating substrate 3. Additionally, the control unit 101 can determine the position of the substrate placement unit 102 and the positions of the operation units 104L and 104R respectively, and also determine whether at least one of the operation units 104L and 104R and the rotating substrate 3 interferes based on these positions. The position of the substrate placement unit 102 is, for example, position M. Then, when the control unit 101 determines interference, it switches the operation mode to the first operation mode, and when it determines no interference, it switches the operation mode to the second operation mode. Thus, since the size and position of the substrate 3 are used in the determination of whether at least one of the operation units 104L and 104R interferes with the rotating substrate 3, this determination can be made correctly. For this reason, the switching of the operation mode can be performed more appropriately. That is, it is possible to balance the miniaturization of the substrate working device 100 and the shortening of the time required for the configuration change process.

[0178] In addition, the substrate working method in the present embodiment is a substrate working method performed by a substrate working device 100 including the operation units 104L and 104R and the substrate placement unit 102, and includes a first operation process, a configuration change process, and a second operation process. In the first operation process, the substrate 3 has a first side and a second side intersecting the first side. When the substrate 3 placed on the placement surface of the substrate placement unit 102 is in the first configuration state, the operation units 104L and 104R perform a first operation on the first side. In the configuration change process, after the first operation process, the state of the substrate 3 is switched from the first configuration state to the second configuration state. In the second operation process, when the substrate 3 is in the second configuration state, the operation units 104L and 104R perform a second operation on the second side. Additionally, in this configuration change process, after widening the interval between the operation unit 104L and the operation unit 104R, the substrate placement unit 102 carrying the substrate 3 is rotated about a rotation axis extending in the normal direction of the placement surface, thereby switching the state of the substrate 3 from the first configuration state to the second configuration state. In such a substrate working method, the same effects as those of the substrate working device 100 can be achieved.

[0179] (Modification example)

[0180] In the above-described embodiment, the substrate processing apparatus 100 includes one substrate placement unit 102 and one drive unit 103, respectively. In this modified example, the substrate processing apparatus 100 includes two substrate placement units 102 and two drive units 103, respectively. That is, the substrate processing apparatus 100 in this modified example includes: a substrate placement unit 102 and a drive unit 103 for the operation unit 104L; and a substrate placement unit 102 and a drive unit 103 for the operation unit 104R.

[0181] Figure 11 FIG. is a diagram schematically showing an example of the configuration change process in this modified example. In addition, Figure 11 (a) to (c) of FIG. show the states of the operation unit 104L, the operation unit 104R, and the substrate 3 as viewed from the positive side in the Z-axis direction. In addition, in the following examples, the first side is the long side and the second side is the short side. In addition, a dashed line passing through a point in (a) to (c) of FIG. longitudinally represents the midpoint or line symmetry axis between the operation unit 104L and the operation unit 104R in the X-axis direction. Figure 11 (a) to (c) of FIG. show the states of the operation unit 104L, the operation unit 104R, and the substrate 3 as viewed from the positive side in the Z-axis direction. In addition, in the following examples, the first side is the long side and the second side is the short side. In addition, a dashed line passing through a point in (a) to (c) of FIG. longitudinally represents the midpoint or line symmetry axis between the operation unit 104L and the operation unit 104R in the X-axis direction.

[0182] For example, as shown in (a) of FIG. Figure 11 , substrates 3 are placed on the two substrate placement units 102, respectively, and these substrates 3 are set to the first configuration state. That is, the control unit 101 controls the two drive units 103 to move and rotate the two substrate placement units 102 so that the two substrates 3 are in the first configuration state. When the two substrates 3 are in the first configuration state, the two substrate placement units 102 are located at the position L in the Y-axis direction. Then, when the two substrates 3 are in the first configuration state, the long sides of these substrates 3 are arranged on the positive side in the Y-axis direction and along the X-axis direction. Further, the long side of the substrate 3 processed by the operation unit 104L is arranged between the paste head 223 and the tape member tp and the paste support stage 224 included in the operation unit 104L. Similarly, the long side of the substrate 3 processed by the operation unit 104R is arranged between the paste head 223 and the tape member tp and the paste support stage 224 included in the operation unit 104R. In addition, in Figure 11 , similar to Figure 6 and the like, the paste head 223, the tape member tp, and the paste support stage 224 are not shown for the sake of visibility, and the members located at substantially the same height as the substrate 3 among the operation unit 104L and the operation unit 104R are shown.

[0183] Furthermore, the control unit 101 adjusts the positions of the working units 104L and 104R in the X-axis direction through the control change unit 105 so that the bonding heads 223 of the working units 104L and 104R face the electrode portions 4 of the substrate 3 respectively. Alternatively, the control unit 101 adjusts the positions of the two substrates 3 in the X-axis direction by controlling the two driving units 103 so that the bonding heads 223 of the working units 104L and 104R face the electrode portions 4 of the substrate 3 respectively.

[0184] When the two substrates 3 are in such a first configuration state, the control unit 101 takes the attachment of the ACF to the electrode portions 4 of the two substrates 3 as the first operation and causes the working units 104L and 104R to execute it simultaneously, for example. Furthermore, while causing the two substrates 3 to move in the X-axis direction by controlling the two driving units 103, the control unit 101 causes the working units 104L and 104R to repeatedly execute this first operation. Thereby, the ACF is attached to all the electrode portions 4 on the long sides of the two substrates 3.

[0185] Next, the control unit 101 changes the state of the two substrates 3 from the first configuration state to the second configuration state. At this time, the control unit 101 moves the two substrate mounting units 102 to the position M in the Y-axis direction and rotates them 90 degrees around the Z-axis by controlling the two driving units 103. For example, the control unit 101 moves the two substrate mounting units 102 to the negative side in the Y-axis direction by controlling the two driving units 103, thereby moving the two substrate mounting units 102 from the position L to the position M. Then, the control unit 101 causes the two driving units 103 to execute the rotation of the two substrate mounting units 102. Thereby, the two substrates 3 rotate. When the centers of the two substrates 3 are located on the rotation axes of the substrate mounting units 102 on which the substrates 3 are mounted, the substrates 3 rotate about the centers.

[0186] If the two substrates 3 rotate as in Figure 11 (b), the control unit 101, as shown in Figure 11 (c), moves the two substrate mounting units 102 to the position N in the Y-axis direction by controlling the two driving units 103 in a state where the short sides of the two substrates 3 are along the X-axis. For example, the control unit 101 moves the two substrate mounting units 102 to the negative side in the Y-axis direction by controlling the two driving units 103, thereby moving the two substrate mounting units 102 from the position M to the position N. Due to the movement of the two substrates 3, the two substrates 3 become the second configuration state. When the two substrates 3 are in the second configuration state, the short sides of the two substrates 3 are arranged on the positive side in the Y-axis direction and along the X-axis, and further, are arranged between the bonding head 223, the tape member tp, and the bonding support stage 224.

[0187] Furthermore, the control unit 101 adjusts the positions of the working units 104L and 104R in the X-axis direction through the control change unit 105 so that the bonding heads 223 of the working units 104L and 104R face the electrode portions 4 located on the short sides of the substrate 3. Alternatively, the control unit 101 adjusts the positions of the two substrates 3 in the X-axis direction by controlling the two driving units 103 so that the bonding heads 223 of the working units 104L and 104R face the electrode portions 4 located on the short sides of the substrate 3.

[0188] When the two substrates 3 are in such a second configuration state, the control unit 101 performs the attachment of the ACF to the electrode portions 4 of the two substrates 3 as the second operation, and causes the working units 104L and 104R to execute simultaneously, for example. Furthermore, the control unit 101 controls the driving unit 103 to move the two substrates 3 in the X-axis direction while causing the working units 104L and 104R to repeatedly perform the second operation. Thereby, the ACF is attached to all the electrode portions 4 located on the short sides of the two substrates 3.

[0189] As described above, the substrate working apparatus and the substrate working method according to one or more modes have been described based on the above-described embodiments and their modified examples. However, the present disclosure is not limited to the embodiments and the modified examples. As long as it does not deviate from the gist of the present disclosure, the solutions obtained by various modifications conceived by those skilled in the art to the above-described embodiments and their modified examples, and the forms constructed by combining the constituent elements in the above-described embodiments and their modified examples are also included in the scope of the present disclosure.

[0190] For example, in the above-described embodiments and their modified examples, the substrate 3 is a liquid crystal panel, and the component 5 is pre-pressed and finally pressed onto the liquid crystal panel, but the substrate 3 may also be a substrate other than the liquid crystal panel.

[0191] In addition, in the above-described embodiments and their modified examples, the substrate working apparatus 100 is the bonding unit 20, but it may also be the pre-pressing unit 30 or the final pressing unit 40. When the substrate working apparatus 100 is the pre-pressing unit 30, the first operation and the second operation are operations of pre-pressing the component 5 onto the substrate 3. In addition, when the substrate working apparatus 100 is the final pressing unit 40, the first operation and the second operation are operations of finally pressing the component 5 onto the substrate 3.

[0192] In addition, in the above-described embodiments and their modifications, all or part of the constituent elements such as the control unit 101 may be configured by dedicated hardware or may be implemented by executing a software program suitable for the constituent elements. The control unit 101 may also be implemented by a program execution unit such as a CPU (Central Processing Unit) or a processor reading out and executing a software program recorded on a recording medium such as an HDD (Hard Disk Drive) or a semiconductor memory. For example, the program execution unit may cause the substrate processing device 100 to execute Figure 7 , Figure 9 and Figure 10 each step shown.

[0193] In addition, the control unit 101 may be constituted by one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit. The one or more electronic circuits may include, for example, semiconductor devices, ICs (Integrated Circuits), or LSIs (Large Scale Integrations). The IC or LSI may be integrated in one chip or may be integrated in a plurality of chips. Here, although referred to as an IC or LSI, the name may change depending on the degree of integration, and may be called a system LSI, a VLSI (Very Large Scale Integration), or a ULSI (Ultra Large Scale Integration). In addition, an FPGA (Field Programmable Gate Array) that can be post-programmed after manufacturing of the LSI can also be used for the same purpose.

[0194] Industrial Applicability

[0195] The present disclosure can be utilized, for example, in a substrate processing device included in a component mounting line for manufacturing liquid crystal displays.

Claims

1. A substrate operation device, comprising: A substrate placement portion having a placement surface for placing a substrate having a first side and a second side intersecting the first side, and being rotatable about a rotation axis extending in a normal direction of the placement surface; A driving unit that rotates the substrate mounting unit; Two operation sections, performing a first operation and a second operation, wherein the first operation is an operation performed on the first side when the substrate is in a first configuration state, and the second operation is an operation performed on the second side when the substrate is in a second configuration state; a changing section for changing the interval between the two working sections; and a control unit that controls the driving unit and the changing unit, The control unit performs a configuration change process of switching the state of the substrate from the first configuration state to the second configuration state after the first operation and before the second operation, In the arrangement change process, after the changing unit is caused to widen the interval between the two working units, the driving unit is caused to rotate the substrate mounting unit on which the substrate is mounted.

2. The substrate working device according to claim 1, wherein: the control unit switches the operation mode of the configuration change process between a first operation mode and a second operation mode, In the first operation mode, after the change unit is caused to widen the interval between the two working units, the drive unit is caused to rotate the substrate mounting unit on which the substrate is mounted. In the second operation mode, the driving unit is caused to rotate the substrate mounting unit on which the substrate is mounted without causing the changing unit to increase the interval between the two working units.

3. The substrate working device according to claim 2, wherein: The control unit switches the operation mode based on substrate information related to the substrate.

4. The substrate working device according to claim 3, wherein: The substrate information indicates the size of the substrate and the position of the substrate on the mounting surface. The control unit performs the following processing: determining whether at least one of the two working units interferes with the rotating substrate when the configuration change process is performed in the second action mode based on the size of the substrate and the position of the substrate indicated in the substrate information, When it is determined that there is interference, the operation mode is switched to the first operation mode, and when it is determined that there is no interference, the operation mode is switched to the second operation mode.

5. The substrate working device according to any one of claims 1 to 4, wherein: The changing unit changes the interval by moving the two working units respectively.

6. The substrate working device according to claim 1, wherein: The first operation and the second operation are operations of attaching an anisotropic conductive film ACF to the substrate.

7. A substrate operation method, performed by a substrate operation device having two operation units and a substrate placement unit, The substrate operation method comprises: A first operation step, when a substrate having a first side and a second side intersecting the first side and placed on the placement surface of the substrate placement portion is in a first configuration state, the two operation portions perform a first operation on the first side; a configuration changing step of switching the state of the substrate from the first configuration state to a second configuration state after the first operation step; and In a second operation step, when the substrate is in the second configuration state, the two operation units perform a second operation on the second side. In the configuration change step, after widening the interval between the two working parts, the substrate mounting part mounting the substrate is rotated around a rotation axis extending in the normal direction of the mounting surface, thereby switching the state of the substrate from the first configuration state to the second configuration state.

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