Multi-beam collaborative microdissection processing system for two-dimensional material

Abstract

The invention relates to the technical field of laser cutting, in particular to a multi-beam collaborative microdissection machining system for two-dimensional materials, which comprises a placement platform, a cutting device, a substrate, a clamp and an adjusting mechanism, the cutting device is mounted above the placement platform, the substrate for placing a workpiece is positioned below the cutting device, and the clamp and the adjusting mechanism are mounted on the placement platform. The clamp is installed above the base plate, the adjusting mechanism is installed at the position of the base plate and the clamp, a negative pressure adsorption channel is synchronously unfolded when a workpiece is positioned through the clamp, then the bottom of the workpiece is cooled and adsorbed through the Bernoulli principle, and therefore the stability of laser cutting is improved while the workpiece is evenly clamped.

Description

Technical Field

[0001] The present invention relates to the technical field of laser cutting, and specifically to a multi-beam collaborative micro-cutting processing system for two-dimensional materials. Background Art

[0002] The multi-beam collaborative micro-cutting processing system for two-dimensional materials is a high-precision processing platform integrating multi-beam laser collaborative control, microscopic imaging and precision motion control technologies. It is a cutting system specifically designed for the processing requirements of two-dimensional materials (such as graphene, transition metal sulfides, etc.). Through the collaborative action of multiple beams of laser, this system realizes non-contact, high-precision cutting and patterning processing of two-dimensional materials at the microscopic scale, and is thus applicable to fields such as microelectronics, optoelectronics and flexible devices.

[0003] When performing multi-beam laser cutting, suction cups or fixtures are usually used for fixation. However, the tensile strength of two-dimensional materials (such as graphene films) is limited, and traditional fixation methods usually result in uneven stress on the material, leading to mechanical stress concentration and material damage - for example, uneven pressure from rigid fixture materials or vacuum adsorption causes excessive local stress on the material and results in damage; in addition, since the commonly used substrates are stainless steel or aluminum with relatively high thermal conductivity, on the one hand, the laser heat will be quickly transferred to the non-processing area of the material, causing material oxidation or phase change; on the other hand, the heat is conducted to the material through the substrate, which may exacerbate the thermal damage of the material, resulting in material warping due to substrate thermal expansion, etc.

[0004] To solve the above problems, the prior art usually uses intermittent laser cutting or air cooling to cool the workpiece and the substrate. However, since laser cutting is from top to bottom, processing the workpiece will inevitably affect the substrate at this time. Although intermittent laser cutting buffers the heat retention of the substrate, it will reduce the efficiency of laser cutting, thereby affecting the efficiency of material processing.

[0005] Based on this, to solve the problems that during multi-beam laser cutting, the heat in the laser cutting area is transferred to the substrate, causing substrate damage and negative counter-effects on the workpiece, and thus resulting in low laser cutting efficiency, the present invention designs a multi-beam collaborative micro-cutting processing system for two-dimensional materials. Summary of the Invention

[0006] The multi-beam collaborative micro-cutting processing system for two-dimensional materials provided by the present invention solves the problems that during multi-beam laser cutting, the heat in the laser cutting area is transferred to the substrate, causing substrate damage and negative counter-effects on the workpiece, and thus resulting in low laser cutting efficiency. When positioning the workpiece with a fixture, a negative pressure adsorption channel is synchronously opened, and then the bottom of the workpiece is cooled and adsorbed through the Bernoulli principle, so that while the workpiece is evenly clamped, the stability of laser cutting is improved.

[0007] In order to achieve the above object, the present invention provides the following technical solutions:

[0008] The present invention provides a multi-beam collaborative micro-cutting processing system for two-dimensional materials, including a placement platform, a cutting device, a substrate, a clamp and an adjustment mechanism. The cutting device is installed above the placement platform, the substrate for placing the workpiece is located below the cutting device, the clamp is installed above the substrate, and the adjustment mechanism is installed at the substrate and the clamp. The clamp drives the adjustment mechanism to use the negative pressure of the airflow to adsorb and cool the workpiece.

[0009] Compared with the traditional single-layer substrate, a different substrate is set here. The material of the substrate does not change, such as stainless steel or aluminum, and the size of the substrate is set according to the common size of the workpiece to be processed, and also according to the size and type of laser cutting. The fixture here mainly plays a positioning role to ensure that both ends of the workpiece can be located at the required laser cutting position. At the same time, by pressing from above, the workpiece can be stabilized and fixed to a certain extent.

[0010] Preferably, the substrate is a three-layer structure, which includes a contact layer, a cooling layer and an airflow layer from top to bottom. The airflow layer is located directly below. The cooling layer is penetrated by a negative pressure hole, and the negative pressure hole connects the contact layer and the airflow layer.

[0011] The high temperature of the contact layer can be transferred to the airflow layer through the cooling layer, and then brought out with the continuous flow of the airflow. The airflow layer can form negative pressure adsorption on the workpiece through the negative pressure holes.

[0012] Preferably, the clamp includes a fixing frame, a clamping plate, a support plate, and an electric telescopic rod, wherein the fixing frame is installed on both sides of the base plate, the clamping plate is installed on the fixing frame, the support plate passes through the fixing frame and is located below the clamping plate, and the electric telescopic rod is installed at both ends of the support plate.

[0013] The clamp and the fixing frame are hinged by a rotating shaft. In order to facilitate the clamp to maintain contact with the contact layer and have a recovery effect, the two are hinged by a torsion spring, thereby ensuring that they can be used multiple times and improving the utilization rate of the clamp.

[0014] Preferably, the adjustment mechanism includes a movable groove, a connecting rod, a push rod, a baffle plate and a return spring, the movable groove is opened on the clamping plate, the connecting rod is installed in the movable groove, the push rod is installed at the cooling layer, the baffle plate is installed at the negative pressure hole and is symmetrical about the axis of the negative pressure hole, and the return spring is installed at the end of the push rod away from the baffle plate.

[0015] The baffle is made of a material with good heat conduction, such as copper, whose performance is superior to that of aluminum or stainless steel. On the one hand, it can form negative pressure holes during processing, so as to directly perform negative pressure adsorption on the bottom of the workpiece. On the other hand, it can block the negative pressure holes after the laser cutting of the workpiece is completed, so that the debris on the surface of the substrate will not fall into the air flow layer from the negative pressure holes, avoiding the accumulation of impurities and affecting the gas circulation and cooling and negative pressure adsorption effects of the air flow layer.

[0016] Preferably, the negative pressure holes are arranged obliquely, and the edges of the negative pressure holes are rounded. By setting the negative pressure holes to be obliquely arranged, on the one hand, the air flow path is optimized, so as to increase the effect of negative pressure adsorption. On the other hand, combined with rounding, it is convenient for the impurities falling into the negative pressure holes to form one-way cleaning.

[0017] Preferably, a cooling surface is provided on the baffle, and the cooling surface is arranged in an arc shape. When the fixture is not working, the termination points of the cooling surface are spliced.

[0018] By setting the arc-shaped cooling surface, the cold air when the fixture is started can be stored on the cooling surface, improving the heat stability of the contact layer.

[0019] Preferably, a wind gathering plate is provided inside the air flow layer, the edge of the wind gathering plate corresponds to the bottom of the negative pressure hole, and a guiding surface is provided on the opposite side of the wind gathering plate.

[0020] By setting the wind gathering plate, on the one hand, the path of gas circulation is increased, so as to ensure that the cooling layer can fully exchange heat with the contact layer. On the other hand, the stability of negative pressure adsorption can be ensured through the uniformity of the gas circulation area.

[0021] Preferably, a compression spring is installed at the other end of the clamping plate, and a positioning plate is installed at the other end of the compression spring. The positioning plates on the same clamping plate are arranged oppositely. On the one hand, it avoids the problem of workpiece locking caused by excessive lateral clamping force. On the other hand, it can also make the effect of negative pressure adsorption greater than the clamping force of the compression spring, so that the fixation of the workpiece is more uniform.

[0022] Preferably, a double-fork air duct is provided at the end of the air flow layer, and a collection groove is provided at the front end of the substrate. By setting the double-fork air duct, the air flow in the air flow layer flows horizontally during work to form negative pressure adsorption, so as to fix the workpiece. When not working, the gas flows upward through the double-fork air duct and then blows towards the opposite direction of the air flow through the horizontal air outlet, so as to blow the impurities on the surface of the contact layer into the collection groove.

[0023] The beneficial effects of the present invention are as follows:

[0024] 1. A multi-beam collaborative micro-cutting processing system for two-dimensional materials proposed by the present invention uses a fixture for positioning to ensure that both ends of the workpiece can be located at the positions where laser cutting is required. At the same time, by pressing from above, the workpiece can be stabilized and fixed to a certain extent. Meanwhile, due to its own thermal conductivity, the heat at the substrate can be transferred to the workpiece, thereby preventing the un-laser-cut area of the workpiece from deforming due to heat, which affects the quality of the workpiece. In addition, the fixture synchronously drives the adjustment mechanism, so that while the workpiece is fixed by negative pressure adsorption, it directly cools the workpiece, thereby improving the cooling effect of the workpiece and the substrate.

[0025] 2. A multi-beam collaborative micro-cutting processing system for two-dimensional materials proposed by the present invention. When the support plate is located at the end of the clamping plate, the support plate and the clamping plate are only in contact. At this time, the clamping plate is like a lever. When the electric telescopic rod drives the support plate to move upward, the support plate drives the end of the clamping plate to tilt upward, then the front end of the clamping plate will squeeze the workpiece downward, thereby assisting in positioning and fixing the workpiece, so that both ends of the workpiece are positioned and fixed, which is convenient for laser cutting.

[0026] 3. A multi-beam collaborative micro-cutting processing system for two-dimensional materials proposed by the present invention. By moving the wedge surface of the connecting rod away from the wedge groove of the push rod, the push rod is driven by the action of the return spring to move to both sides, and at the same time drives the baffle to move to both sides; the return spring here is a tension spring. After the electric telescopic rod drives the fixture to release the workpiece, at this time, the wedge surface at the bottom of the connecting rod will drive the push rod to move towards the center through the cooperation with the wedge groove, and then drive the baffle to block the negative pressure holes; on the one hand, the baffle can expand the negative pressure holes during processing, so as to directly perform negative pressure adsorption on the bottom of the workpiece, and on the other hand, it can block the negative pressure holes after the workpiece is laser cut, so that the debris on the surface of the substrate will not fall into the air flow layer from the negative pressure holes, avoiding the accumulation of impurities and affecting the gas flow cooling and negative pressure adsorption effects of the air flow layer; in addition, after the work is completed, by closing the baffle, the baffle directly cools the negative pressure holes, so that the temperature of the contact layer can be quickly cooled, thereby improving the cooling effect of the base layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are one embodiment of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0028] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0029] Figure 2 It is a schematic diagram of the substrate of the present invention;

[0030] Figure 3 It is a schematic diagram of the fixture of the present invention;

[0031] Figure 4 It is a schematic diagram of the adjustment mechanism of the present invention;

[0032] Figure 5 It is Figure 4 The enlarged view of location A in;

[0033] Figure 6 It is Figure 4 The enlarged view of location B in;

[0034] Figure 7 It is a schematic diagram of the negative pressure hole;

[0035] Figure 8 It is Figure 7 The enlarged view of location C in;

[0036] Figure 9 It is the cross-sectional view of the air flow layer.

[0037] In the figure: 1. Placement platform; 2. Cutting device; 3. Substrate; 31. Contact layer; 32. Cooling layer; 321. Negative pressure hole; 33. Air flow layer; 331. Wind gathering plate; 3311. Guide surface; 4. Fixture; 41. Fixed frame; 42. Clamping plate; 421. Compression spring; 422. Positioning plate; 43. Support plate; 44. Electric telescopic rod; 5. Adjustment mechanism; 51. Moving groove; 52. Connecting rod; 521. Wedge surface; 53. Push rod; 531. Wedge groove; 54. Baffle plate; 541. Cooling surface; 55. Return spring; 6. Double-fork air duct; 7. Collection tank. Specific embodiments

[0038] In order to better understand the above solution, the above technical solution will be described in detail below in conjunction with the specification drawings and specific embodiments.

[0039] As Figure 1 shown, a multi-beam collaborative micro-cutting processing system for two-dimensional materials provided by the present invention includes a placement platform 1, a cutting device 2, a substrate 3, a fixture 4 and an adjustment mechanism 5. The cutting device 2 is installed above the placement platform 1, the substrate 3 for placing the workpiece is located below the cutting device 2, the fixture 4 is installed above the substrate 3, the adjustment mechanism 5 is installed at the substrate 3 and the fixture 4, and the fixture 4 drives the adjustment mechanism 5 to adsorb and cool the workpiece by air flow negative pressure.

[0040] The cutting device 2 is multi-beam laser cutting and is arranged above the placement platform 1. The laser device is a prior art. It divides a single beam of laser into multiple sub-beams through optical elements such as beam splitters and mirrors. Each sub-beam is precisely synchronized in space and time to form a synergistic light field. By adjusting parameters such as the power, pulse width, and repetition frequency of the laser, the energy distribution of the multi-beams is optimized to ensure cutting efficiency and precision. At the same time, a spatial light modulator or diffractive optical element is used to shape the beam to achieve the cutting of complex patterns. Microscopic imaging and positioning utilize an integrated high-resolution microscope to obtain the surface topography and processing status of two-dimensional materials in real time. Through image processing algorithms, the material edge, defects, or preset cutting paths are automatically identified and fed back to the control system. At the same time, by combining microscopic imaging and motion control, the dynamic adjustment of the processing path is realized to ensure cutting precision. Through the combination of multi-beam synergy and microscopic imaging, the accuracy and efficiency limitations of traditional single-beam laser processing are broken through, and the effect of laser cutting is improved.

[0041] Compared with the traditional single-layer substrate 3, different substrates 3 are provided here. The material of the substrate 3 remains unchanged, such as stainless steel or aluminum, etc. The size of the substrate 3 is set according to the common size of the workpiece to be processed, and is also set according to the size, category, etc. of the laser cutting. The fixture 4 mainly plays a positioning role here to ensure that both ends of the workpiece can be located at the positions where laser cutting is required. At the same time, by using the pressing method from above, the workpiece can be stabilized and play a fixing role to a certain extent. At the same time, due to its own heat conductivity, the heat at the substrate 3 can be transferred to the workpiece, thereby preventing the un-laser-cut area of the workpiece from being deformed by heat, which affects the quality of the workpiece. In addition, the fixture 4 synchronously drives the adjustment mechanism 5, so that while the workpiece is fixed by negative pressure adsorption, it directly cools the workpiece, thereby improving the cooling effect of the workpiece and the substrate 3.

[0042] As Figure 2 shown, the substrate 3 is a three-layer structure, which are, from top to bottom, a contact layer 31, a cooling layer 32, and an air flow layer 33. The air flow layer 33 is located directly below. The cooling layer 32 is penetrated with negative pressure holes 321. The negative pressure holes 321 communicate the contact layer 31 and the air flow layer 33. The negative pressure holes 321 are arranged in an array, and the air flow velocity introduced into the air flow layer 33 is multi-level controlled.

[0043] Compared with the single-layer structure of the prior art, the three-layer substrates 3 with different functions can superimpose their functions on each other. By using the contact layer 31 to support the workpiece and resist deformation, the stability of the workpiece during laser cutting can be ensured. The cooling layer 32 can conduct the high temperature of the contact layer 31 to the air flow layer 33, and then be carried out with the continuous flow of the air flow. The air flow layer 33 can form a negative pressure adsorption on the workpiece through the negative pressure holes 321, thereby clamping the workpiece. At the same time, the air flow layer 33 can continuously remove heat through the continuous circulation of its own gas, thereby improving the cooling effect on the contact layer 31 and the workpiece.

[0044] At the same time, the introduced air flow velocity of the air flow layer 33 is related to the magnitude of the negative pressure adsorption force. According to the different sizes (mainly thickness) of the workpieces, different intake velocities can be set. Thus, when processing thick workpieces, by increasing the gas flow velocity, the adsorption force of the negative pressure adsorption can be increased. Furthermore, different negative pressure adsorption forces can be provided according to the thickness of different workpieces, further improving the negative pressure adsorption effect. At the same time, it can avoid the problem of excessive adsorption force during the processing of thin sheets, which may cause deformation of two-dimensional materials.

[0045] As Figure 3 shown, the fixture 4 includes a fixed frame 41, a clamping plate 42, a support plate 43, and an electric telescopic rod 44. The fixed frame 41 is installed on both sides of the substrate 3. The clamping plate 42 is installed on the fixed frame 41. The support plate 43 penetrates the fixed frame 41 and is located below the clamping plate 42. The electric telescopic rod 44 is installed at both ends of the support plate 43.

[0046] The fixed frame 41 mainly plays a role in support and installation. The fixed frame 41 enables the clamping plate 42 to have a moving height relative to the contact layer 31. Between the clamping plate 42 and the fixed frame 41, the two are hinged through a rotating shaft. In order to facilitate the clamping plate 42 to keep in contact with the contact layer 31 and have a restoring effect, the two are hinged through a torsion spring, thereby ensuring that it can be used multiple times and improving the utilization rate of the fixture 4; the support plate 43 is located at the end of the clamping plate 42. The support plate 43 is only in contact with the clamping plate 42. At this time, the clamping plate 42 is like a lever. When the electric telescopic rod 44 drives the support plate 43 to move upward, the support plate 43 drives the end of the clamping plate 42 to tilt upward. Then the front end of the clamping plate 42 will squeeze the workpiece downward, thereby assisting in positioning and fixing the workpiece, so that both ends of the workpiece are positioned and fixed, and thus facilitating laser cutting.

[0047] As Figures 4 - 6As shown, the adjusting mechanism 5 includes a movable groove 51, a connecting rod 52, a push rod 53, a baffle plate 54 and a return spring 55. The movable groove 51 is opened on the clamping plate 42, the connecting rod 52 is installed in the movable groove 51, the push rod 53 is installed at the cooling layer 32, the baffle plate 54 is installed at the negative pressure hole 321, and is symmetrical about the axis of the negative pressure hole 321, and the return spring 55 is installed at the end of the push rod 53 away from the baffle plate 54.

[0048] When the clamp plate 42 is like a lever, with the end tilted upward and the front end downward, the connecting rod 52 connected to the clamp plate 42 will also move upward synchronously. However, due to the different upward positions and the different distances between the hinge points and the different upward points, an active groove 51 is provided so that the connecting rod 52 can always remain in a vertical state. The active groove 51 is inclined upward from the end of the clamp block to the front end, so that when the clamp block is folded, the connecting rod 52 can be kept moving up a certain distance, so that the connecting rod 52 can bring The push rod 53 is driven to work. The connection mode between the connecting rod 52 and the push rod 53 can be various, such as through a support rod hinged at both ends, or other modes. A wedge-shaped groove 531 can also be opened on the push rod 53. The bottom of the connecting rod 52 is a wedge-shaped surface 521. The wedge-shaped groove 531 and the wedge-shaped surface 521 are interference fit. The wedge-shaped surface 521 of the connecting rod 52 is away from the wedge-shaped groove 531 of the push rod 53, so that the push rod 53 is driven by the reset spring 55 to move to both sides, and at the same time, the shielding plate 54 is driven to move to both sides. The return spring 55 is a tension spring, and after the electric telescopic rod 44 drives the clamp 4 to release the workpiece, the wedge-shaped surface 521 at the bottom of the connecting rod 52 will cooperate with the wedge-shaped groove 531 to drive the push rod 53 to move toward the center, thereby driving the shielding plate 54 to block the negative pressure hole 321; the shielding plate 54 is made of a material with good thermal conductivity, such as copper, and its performance is better than that of aluminum or stainless steel. On the one hand, the negative pressure hole 321 can be expanded during processing, thereby directly performing negative pressure adsorption on the bottom of the workpiece, and on the other hand, the negative pressure hole 321 can be blocked after the laser cutting of the workpiece is completed, so that the debris on the surface of the substrate 3 will not fall from the negative pressure hole 321 into the airflow layer 33, avoiding the accumulation of impurities affecting the gas circulation cooling and negative pressure adsorption effect of the airflow layer 33; in addition, after the work is completed, the shielding plate 54 can be closed, and the shielding plate 54 can directly cool the negative pressure hole 321, so that the temperature of the contact layer 31 is quickly cooled, thereby improving the cooling effect of the base layer.

[0049] like Figure 7 As shown, the negative pressure hole 321 is arranged obliquely, and the edge of the negative pressure hole 321 is rounded.

[0050] By setting the negative pressure holes 321 to be inclined, on the one hand, by optimizing the air flow path, the pressure difference and flow velocity distribution above the negative pressure holes 321 and at the bottom ends of the negative pressure holes 321 are changed, thereby increasing the negative pressure adsorption effect. On the other hand, in cooperation with rounding, it is convenient for impurities falling into the negative pressure holes 321 to form one-way cleaning, thereby avoiding impurity blockage and affecting the negative pressure effect.

[0051] A cooling surface 541 is provided on the shielding plate 54. The cooling surface 541 is arc-shaped. When the fixture 4 is not working, the termination points of the cooling surface 541 are spliced.

[0052] By providing the arc-shaped cooling surface 541, the cold air when the fixture 4 is started can be stored on the cooling surface 541, so that when the shielding plate 54 moves to both sides, the heat of the contact layers 31 on both sides of the negative pressure holes 321 can be exchanged, thereby improving the heat stability of the contact layers 31.

[0053] As Figure 9 As shown, a wind gathering plate 331 is provided inside the air flow layer 33. The edge of the wind gathering plate 331 corresponds to the bottom of the negative pressure holes 321. A guiding surface 3311 is provided on the opposite side of the wind gathering plate 331.

[0054] By providing the wind gathering plate 331, the caliber of the air flow is smaller at the start and end, thereby improving the negative pressure clamping effect at both ends of the workpiece, so that when laser cutting the middle part, it can be ensured that both sides will not warp. The guiding surface 3311 is arc-shaped. On the one hand, it increases the air flow path, thereby ensuring sufficient heat exchange between the cooling layer 32 and the contact layer 31. On the other hand, it can ensure the stability of negative pressure adsorption through the uniformity of the gas flow area, avoiding the problem of weak local negative pressure adsorption resulting in loose local fixation. At this point, the initial flow velocity of the air flow should be increased to avoid a decrease in velocity after increasing the flow path, resulting in inability to perform negative pressure adsorption.

[0055] As Figure 8 As shown, a compression spring 421 is installed at the other end of the clamping plate 42. The other end of the compression spring 421 is installed with a positioning plate 422. The positioning plates 422 on the same clamping plate 42 are arranged oppositely.

[0056] By providing the positioning plate 422 and the compression spring 421, when the clamping plate 42 contacts the workpiece, it can clamp the workpiece. Through the elastic extrusion of the compression spring 421, on the one hand, it avoids the problem of workpiece locking due to excessive lateral clamping force. On the other hand, it can also make the negative pressure adsorption effect greater than the clamping force of the compression spring 421, so that the fixation of the workpiece is more uniform and the cutting effect of laser cutting the workpiece is improved.

[0057] As Figure 7 As shown, a double-fork air duct 6 is provided at the end of the air flow layer 33, and a collection groove 7 is provided at the front end of the substrate 3.

[0058] By setting up the double-fork air duct 6, the air flow in the air flow layer 33 circulates horizontally during operation to form negative pressure adsorption, thereby fixing the workpiece. When not working, the gas flows upward through the double-fork air duct 6, and then blows in the opposite direction of the air flow through the horizontal air outlet, thereby blowing the impurities on the surface of the contact layer 31 into the collection tank 7. At the same time, with the cooperation of the shielding plate 54, it is ensured that the impurities will not fall into the negative pressure holes 321, thereby improving the efficiency of the next laser cutting.

[0059] The two valves of the double-fork channel here can be driven by sensors, thereby realizing the principle of a changeover switch.

[0060] When laser cutting of the workpiece is required, the staff adjusts the multi-beam laser cutting device 2 and the built-in microscopic device. Subsequently, the workpiece is placed on the contact layer 31. By starting the electric telescopic rod 44, the support plate 43 is driven to move upward. When the support plate 43 moves upward, the end of the clamping plate 42 will be driven to move upward. Since the clamping plate 42 is hinged to the fixing frame 41, under the action of the lever principle, the front end of the clamping plate 42 is driven to move downward, thereby squeezing, positioning and initially fixing the two ends of the workpiece through the compression spring 421 and the positioning plate 422. During the flipping process of the clamping plate 42, movement occurs in the movable groove 51 opened on the clamping plate 42, that is, the end of the connecting rod 52 slides in the movable groove 51, and the connecting rod 52 is kept in a vertical state. Therefore, the connecting rod 52 will gradually move upward, so that the wedge surface 521 of the connecting rod 52 disengages from the wedge groove 531 of the push rod 53. At this time, the return spring 55 will drive the push rod 53 to stretch towards both ends, thereby driving the shielding plate 54 to open the negative pressure holes 321. At this time, when the air flow circulates in the air flow layer 33, on the one hand, the air flow will take away the heat conducted from the contact layer 31 to the air flow layer 33 through the cooling layer 32, and on the other hand, negative pressure will be formed, thereby further fixing the workpiece.

[0061] After the laser cutting is completed, the staff drives the fixture 4 to reset through the electric telescopic rod 44. At this time, the wedge surface 521 on the connecting rod 52 will cooperate with the wedge groove 531 to drive the push rod 53 back to the initial position again, thereby driving the shielding plate 54 to block the negative pressure holes 321. By changing the switch at the double-fork channel through the sensor, at this time, the air flow layer 33 can continue to ventilate, and the gas in the air flow layer 33 will flow upward through the double-fork air duct 6, and then blow in the opposite direction of the air flow through the horizontal air outlet, thereby blowing the impurities on the surface of the contact layer 31 into the collection tank 7. At the same time, with the cooperation of the shielding plate 54, it is ensured that the impurities will not fall into the negative pressure holes 321, thereby achieving the effect of collecting impurities and cooling the surface of the contact layer 31.

[0062] The basic principles and beneficial effects of the present invention have been shown and described above. At the same time, the present invention is not limited by the above embodiments. Without departing from the effects and scope of the present invention, various changes and improvements will occur to the present invention, and these changes and improvements all fall within the scope of the present invention claimed. The scope of the present invention claimed is defined by the appended claims and their equivalents.

Claims

1. A multi-beam collaborative microdissection processing system for two-dimensional materials, characterized by: The invention comprises a placement platform (1), a cutting device (2), a substrate (3), a clamp (4) and an adjustment mechanism (5), wherein the cutting device (2) is installed above the placement platform (1), the substrate (3) on which a workpiece is placed is located below the cutting device (2), the clamp (4) is installed above the substrate (3), the adjustment mechanism (5) is installed between the substrate (3) and the clamp (4), and the clamp (4) drives the adjustment mechanism (5) to utilize the negative pressure of airflow to adsorb and cool the workpiece.

2. The multi-beam coordinated microdissection processing system for two-dimensional materials according to claim 1, characterized in that: The substrate (3) is a three-layer structure, which comprises, from top to bottom, a contact layer (31), a cooling layer (32) and an airflow layer (33). The airflow layer (33) is located directly below. The cooling layer (32) is penetrated by a negative pressure hole (321). The negative pressure hole (321) connects the contact layer (31) and the airflow layer (33). The negative pressure holes (321) are arranged in an array. The airflow velocity introduced into the airflow layer (33) is controlled in multiple stages.

3. The multi-beam coordinated microdissection processing system for two-dimensional materials according to claim 2, characterized in that: The clamp (4) comprises a fixing frame (41), a clamping plate (42), a support plate (43), and an electric telescopic rod (44); the fixing frame (41) is mounted on both sides of the base plate (3); the clamping plate (42) is mounted on the fixing frame (41); the support plate (43) passes through the fixing frame (41) and is located below the clamping plate (42); and the electric telescopic rod (44) is mounted on both ends of the support plate (43).

4. The multi-beam coordinated microdissection processing system for two-dimensional materials according to claim 3, characterized in that: The adjusting mechanism (5) comprises a movable groove (51), a connecting rod (52), a push rod (53), a baffle plate (54) and a return spring (55); the movable groove (51) is provided on the clamping plate (42); the connecting rod (52) is installed in the movable groove (51); the push rod (53) is installed at the cooling layer (32); the baffle plate (54) is installed at the negative pressure hole (321) and is symmetrical about the axis of the negative pressure hole (321); and the return spring (55) is installed at one end of the push rod (53) away from the baffle plate (54).

5. The multi-beam coordinated microdissection processing system for two-dimensional materials according to claim 4, characterized in that: The negative pressure hole (321) is arranged obliquely, and the edge of the negative pressure hole (321) is rounded.

6. The multi-beam coordinated microdissection processing system for two-dimensional materials according to claim 4, characterized in that: The push rod (53) is provided with a wedge-shaped groove (531), the bottom of the connecting rod (52) is a wedge-shaped surface (521), and the wedge-shaped groove (531) and the wedge-shaped surface (521) are interference-fitted.

7. The multi-beam coordinated microdissection processing system for two-dimensional materials according to claim 4, characterized in that: The shielding plate (54) is provided with a cooling surface (541), the cooling surface (541) is arranged in an arc shape, and the end points of the cooling surface (541) are spliced ​​together when the clamp (4) is not working.

8. The multi-beam coordinated microdissection processing system for two-dimensional materials according to claim 3, characterized in that: An air gathering plate (331) is provided inside the air flow layer (33), the edge of the air gathering plate (331) corresponds to the bottom of the negative pressure hole (321), and a guide surface (3311) is provided on the opposite side of the air gathering plate (331).

9. The multi-beam coordinated microdissection processing system for two-dimensional materials according to claim 3, characterized in that: A compression spring (421) is installed at the other end of the clamping plate (42), and a positioning plate (422) is installed at the other end of the compression spring (421). The positioning plates (422) on the same clamping plate (42) are arranged opposite to each other.

10. The multi-beam coordinated microdissection processing system for two-dimensional materials according to claim 8, characterized in that: A double-forked air duct (6) is provided at the end of the air flow layer (33), and a collecting groove (7) is provided at the front end of the base plate (3).

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