A multi-beam collaborative micro-cutting system for two-dimensional materials

Abstract

This invention relates to the field of laser cutting technology, specifically a multi-beam collaborative micro-cutting system for two-dimensional materials. The system includes a mounting platform, a cutting device, a substrate, a clamp, and an adjustment mechanism. The cutting device is mounted above the mounting platform, the substrate on which the workpiece is placed is located below the cutting device, the clamp is mounted above the substrate, and the adjustment mechanism is installed at the substrate and clamp. When the workpiece is positioned by the clamp, a negative pressure adsorption channel is simultaneously deployed, thereby cooling and adsorbing the bottom of the workpiece using Bernoulli's principle. This ensures uniform clamping of the workpiece while improving the stability of laser cutting.

Description

Technical Field

[0001] This invention relates to the field of laser cutting technology, specifically a multi-beam collaborative micro-cutting system for two-dimensional materials. Background Technology

[0002] The multi-beam collaborative micro-cutting system for two-dimensional materials is a high-precision processing platform integrating multi-beam laser collaborative control, microscopic imaging, and precision motion control technologies. It is a cutting system specifically designed for the processing needs of two-dimensional materials (such as graphene and transition metal sulfides). Through the synergistic effect of multiple laser beams, this system achieves non-contact, high-precision cutting and patterning of two-dimensional materials at the microscopic scale, making it applicable to fields such as microelectronics, optoelectronics, and flexible devices.

[0003] Currently, in multi-beam laser cutting, suction cups or clamps are commonly used for fixation. However, two-dimensional materials (such as graphene films) have limited tensile strength, and traditional fixation methods often result in uneven stress distribution on the material, leading to stress concentration and material breakage. For example, the uneven pressure from rigid clamps or vacuum adsorption can cause excessive local stress and breakage. In addition, since the commonly used substrates are stainless steel or aluminum, which have high thermal conductivity, the laser heat can be rapidly transferred to non-processed areas of the material, causing oxidation or phase transformation. Furthermore, the heat can be conducted to the material through the substrate, potentially exacerbating thermal damage and causing warping due to thermal expansion of the substrate.

[0004] To address the aforementioned issues, existing technologies typically employ intermittent laser cutting or air cooling to cool the workpiece and substrate. However, since laser cutting is performed from top to bottom, processing the workpiece inevitably affects the substrate. While intermittent laser cutting buffers the heat retention of the substrate, it reduces the efficiency of laser cutting, thereby impacting the efficiency of material processing.

[0005] Based on this, in order to solve the problem that the heat from the laser cutting area is transferred to the substrate during multi-beam laser cutting, causing damage to the substrate and negative impact on the workpiece, thus resulting in low laser cutting efficiency, this invention designs a multi-beam collaborative micro-cutting system for two-dimensional materials. Summary of the Invention

[0006] This invention provides a multi-beam collaborative micro-cutting system for two-dimensional materials, which solves the problem that during multi-beam laser cutting, heat from the laser cutting area is transferred to the substrate, causing substrate damage and negative impact on the workpiece, resulting in low laser cutting efficiency. By positioning the workpiece with a fixture, a negative pressure adsorption channel is simultaneously deployed, and the bottom of the workpiece is cooled and adsorbed through Bernoulli's principle, thereby ensuring uniform clamping of the workpiece and improving the stability of laser cutting.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] The present invention provides a multi-beam collaborative micro-cutting system for two-dimensional materials, comprising a mounting platform, a cutting device, a substrate, a fixture, and an adjustment mechanism. The cutting device is mounted above the mounting platform, the substrate on which the workpiece is placed is located below the cutting device, the fixture is mounted above the substrate, and the adjustment mechanism is mounted at the substrate and the fixture. The fixture drives the adjustment mechanism to adsorb and cool the workpiece using negative pressure airflow.

[0009] Compared to traditional single-layer substrates, different substrates are set here. The material of the substrate remains unchanged, such as stainless steel or aluminum. The size of the substrate is set according to the common size of the workpiece to be processed, as well as the size and type of laser cutting. The fixture mainly plays a positioning role here, ensuring that the two ends of the workpiece are in the position required for laser cutting. At the same time, by pressing from above, the workpiece can be stabilized and fixed to a certain extent.

[0010] Preferably, the substrate has a three-layer structure, consisting of a contact layer, a cooling layer, and an airflow layer from top to bottom. The airflow layer is located directly below the substrate, and the cooling layer has a negative pressure hole that connects the contact layer and the airflow layer.

[0011] The cooling layer can conduct the high temperature of the contact layer to the airflow layer, and then carry it out with the continuous flow of air. The airflow layer can form a negative pressure adsorption on the workpiece through the negative pressure holes.

[0012] Preferably, the clamp includes a fixed frame, a clamping plate, a support plate, and an electric telescopic rod. The fixed frame is installed on both sides of the base plate, the clamping plate is installed on the fixed frame, the support plate passes through the fixed frame and is located below the clamping plate, and the electric telescopic rod is installed at both ends of the support plate.

[0013] The clamping plate and the fixing frame are hinged by a pivot. In order to ensure that the clamping plate can maintain contact with the contact layer and have a restorative effect, the two are hinged by a torsion spring, thereby ensuring that it can be used multiple times and improving the utilization rate of the fixture.

[0014] Preferably, the adjustment mechanism includes a movable groove, a connecting rod, a push rod, a baffle plate, and a return spring. The movable groove is formed on the clamping plate, the connecting rod is installed in the movable groove, the push rod is installed at the cooling layer, the baffle plate is installed at the negative pressure hole and is symmetrical about the negative pressure hole axis, and the return spring is installed at the end of the push rod away from the baffle plate.

[0015] The shielding plate is made of a material with good thermal conductivity, such as copper, which outperforms aluminum or stainless steel. This allows it to open the negative pressure holes during processing, enabling direct negative pressure adsorption on the bottom of the workpiece. Furthermore, it can shield the negative pressure holes after the workpiece is laser-cut, preventing debris from falling from the substrate surface into the airflow layer. This avoids the accumulation of impurities that could affect the gas flow, cooling, and negative pressure adsorption effects of the airflow layer.

[0016] Preferably, the negative pressure holes are arranged at an angle, and the edges of the negative pressure holes are rounded. By setting the negative pressure holes at an angle, the airflow path is optimized, thereby increasing the effect of negative pressure adsorption. On the other hand, the rounded edges facilitate the one-way cleaning of impurities falling into the negative pressure holes.

[0017] Preferably, the shielding plate is provided with a cooling surface, which is arc-shaped, and the ends of the cooling surface are spliced ​​together when the clamp is not working.

[0018] By setting an arc-shaped cooling surface, the cold air when the fixture is started can be stored on the cooling surface, thereby improving the thermal stability of the contact layer.

[0019] Preferably, the airflow layer is provided with a wind-gathering plate, the edge of the wind-gathering plate corresponds to the bottom of the negative pressure hole, and a guide surface is provided on the opposite side of the wind-gathering plate.

[0020] By setting up a concentrator, the path for gas flow is increased, thus ensuring sufficient heat exchange between the cooling layer and the contact layer. On the other hand, the uniformity of the gas flow area ensures the stability of negative pressure adsorption.

[0021] Preferably, a compression spring is installed at the other end of the clamping plate, and a positioning plate is installed at the other end of the compression spring. The positioning plates on the same clamping plate are arranged opposite to each other. This avoids the problem of workpiece locking ring caused by excessive lateral clamping force, and also allows the negative pressure adsorption effect to be greater than the clamping force of the compression spring, thereby making the workpiece fixation more uniform.

[0022] Preferably, the airflow layer is provided with a double-forked air duct at its end, and the substrate is provided with a collection groove at its front end. By setting the double-forked air duct, the airflow in the airflow layer can flow laterally during operation to form a negative pressure adsorption, thereby fixing the workpiece. When not in operation, the gas flows upward through the double-forked air duct and then blows in the opposite direction of the airflow through the lateral air outlet, thereby blowing impurities on the contact layer surface into the collection groove.

[0023] The beneficial effects of this invention are as follows:

[0024] 1. The present invention proposes a multi-beam collaborative micro-cutting system for two-dimensional materials. By setting up a fixture, a positioning function is provided to ensure that both ends of the workpiece are located at the desired laser cutting position. At the same time, the workpiece is stabilized by pressing from above, which provides a certain degree of fixation. Meanwhile, the fixture's thermal conductivity can transfer heat from the substrate to the workpiece, thereby preventing deformation of the uncut areas of the workpiece due to heat, which would affect the workpiece quality. In addition, the fixture synchronously drives the adjustment mechanism, which enables the workpiece to be fixed by negative pressure adsorption, while directly cooling the workpiece, thereby improving the cooling effect between the workpiece and the substrate.

[0025] 2. The present invention proposes a multi-beam collaborative micro-cutting system for two-dimensional materials. When the support plate is located at the end of the clamping plate, the support plate and the clamping plate are only in contact. At this time, the clamping plate acts like a lever. When the electric telescopic rod moves the support plate upward, the support plate causes the end of the clamping plate to tilt upward. Then the front end of the clamping plate will press the workpiece downward, thereby assisting in the positioning and fixing of the workpiece. This ensures that both ends of the workpiece are positioned and fixed, which facilitates laser cutting.

[0026] 3. The present invention proposes a multi-beam collaborative micro-cutting system for two-dimensional materials. The wedge-shaped surface of the connecting rod moves away from the wedge-shaped groove of the push rod, causing the push rod to move to both sides under the action of a return spring. Simultaneously, this moves the baffle plate to both sides. The return spring is a tension spring. After the electric telescopic rod releases the workpiece from the clamp, the wedge-shaped surface at the bottom of the connecting rod, in conjunction with the wedge-shaped groove, moves the push rod towards the center, thereby causing the baffle plate to block the negative pressure hole. The baffle plate can, on the one hand, expand the negative pressure hole during processing, allowing direct negative pressure adsorption on the bottom of the workpiece; on the other hand, it can block the negative pressure hole after the workpiece laser cutting is completed, preventing debris from the substrate surface from falling into the airflow layer and avoiding impurity accumulation that could affect the gas flow, cooling, and negative pressure adsorption effects of the airflow layer. Furthermore, after the work is completed, closing the baffle plate directly cools the negative pressure hole, rapidly cooling the contact layer and improving the cooling effect of the base layer. Attached Figure Description

[0027] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are one embodiment of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0029] Figure 2 This is a schematic diagram of the substrate of the present invention;

[0030] Figure 3 This is a schematic diagram of the fixture in this invention;

[0031] Figure 4 This is a schematic diagram of the adjustment mechanism of the present invention;

[0032] Figure 5 yes Figure 4 Enlarged view of point A in the middle;

[0033] Figure 6 yes Figure 4 Enlarged view of point B in the middle;

[0034] Figure 7 This is a schematic diagram of the negative pressure hole;

[0035] Figure 8 yes Figure 7 Enlarged view of point C in the middle;

[0036] Figure 9 It is a cross-sectional view of the airflow layer.

[0037] In the diagram: 1. Placement platform; 2. Cutting device; 3. Substrate; 31. Contact layer; 32. Cooling layer; 321. Negative pressure hole; 33. Airflow layer; 331. Air concentrator; 3311. Guide surface; 4. Fixture; 41. Fixing frame; 42. Clamping plate; 421. Compression spring; 422. Positioning plate; 43. Support plate; 44. Electric telescopic rod; 5. Adjustment mechanism; 51. Movable groove; 52. Connecting rod; 521. Wedge-shaped surface; 53. Push rod; 531. Wedge-shaped groove; 54. Baffle plate; 541. Cooling surface; 55. Return spring; 6. Double-forked air duct; 7. Collection trough. Detailed Implementation

[0038] To better understand the above solution, the technical solution will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] like Figure 1 As shown, the present invention provides a multi-beam collaborative micro-cutting system for two-dimensional materials, including a mounting platform 1, a cutting device 2, a substrate 3, a clamp 4, and an adjustment mechanism 5. The cutting device 2 is installed above the mounting platform 1, the substrate 3 on which the workpiece is placed is located below the cutting device 2, the clamp 4 is installed above the substrate 3, and the adjustment mechanism 5 is installed at the substrate 3 and the clamp 4. The clamp 4 drives the adjustment mechanism 5 to adsorb and cool the workpiece using negative pressure airflow.

[0040] The cutting device 2 is a multi-beam laser cutting device, arranged above the mounting platform 1. The laser device is a prior art technology, which uses optical elements such as beam splitters and mirrors to divide a single laser beam into multiple sub-beams. Each sub-beam is precisely synchronized in space and time to form a synergistic light field. By adjusting parameters such as laser power, pulse width, and repetition frequency, the energy distribution of the multi-beams is optimized to ensure cutting efficiency and accuracy. At the same time, a spatial light modulator or diffractive optical element is used to shape the beams to achieve cutting of complex patterns. Microscopic imaging and positioning utilize an integrated high-resolution microscope to acquire the surface morphology and processing status of the two-dimensional material in real time. Image processing algorithms automatically identify material edges, defects, or preset cutting paths and feed them back to the control system. Combined with microscopic imaging and motion control, the processing path is dynamically adjusted to ensure cutting accuracy. By combining multi-beam collaboration and microscopic imaging, the limitations of accuracy and efficiency in traditional single-beam laser processing are overcome, improving the effect of laser cutting.

[0041] Compared to the traditional single-layer substrate 3, this section uses a different substrate 3. The material of the substrate 3 remains unchanged, such as stainless steel or aluminum. The size of the substrate 3 is set according to the common size of the workpiece to be processed, as well as the size and type of laser cutting. The clamp 4 mainly plays a positioning role here, ensuring that both ends of the workpiece are in the position required for laser cutting. At the same time, by pressing from above, the workpiece can be stabilized, which plays a certain role in fixing it. In addition, by utilizing its own thermal conductivity, heat from the substrate 3 can be transferred to the workpiece, thereby preventing the un-laser-cut areas of the workpiece from deforming due to heat, thus affecting the quality of the workpiece. Furthermore, the clamp 4 simultaneously drives the adjustment mechanism 5, which enables the workpiece to be fixed by negative pressure adsorption, while directly cooling the workpiece, thereby improving the cooling effect between the workpiece and the substrate 3.

[0042] like Figure 2 As shown, the substrate 3 has a three-layer structure, consisting of a contact layer 31, a cooling layer 32, and an airflow layer 33 from top to bottom. The airflow layer 33 is located directly below. The cooling layer 32 has a negative pressure hole 321 that passes through it. The negative pressure hole 321 connects the contact layer 31 and the airflow layer 33. The negative pressure holes 321 are arranged in an array. The airflow speed introduced by the airflow layer 33 is controlled in multiple stages.

[0043] Compared to the single-layer structure of existing technologies, the three-layer substrate 3 with different functions can superimpose their functions. By using the contact layer 31 to support the workpiece and resist deformation, the workpiece can be kept in a stable state during laser cutting. The cooling layer 32 can conduct the high temperature of the contact layer 31 to the airflow layer 33, and then carry it out with the continuous flow of air. The airflow layer 33 can form a negative pressure adsorption on the workpiece through the negative pressure hole 321, thereby clamping the workpiece. At the same time, the airflow layer 33 can continuously carry away heat through the continuous flow of its own gas, thereby improving the cooling effect on the contact layer 31 and the workpiece.

[0044] Meanwhile, the inlet air velocity of the airflow layer 33 is related to the magnitude of the negative pressure adsorption force. Different inlet air velocities can be set according to different workpiece sizes (mainly thickness). Thus, when processing thick workpieces, the adsorption force of negative pressure adsorption is increased by accelerating the gas flow velocity. In turn, different negative pressure adsorption forces can be provided according to different workpiece thicknesses, further improving the negative pressure adsorption effect. At the same time, the problem of excessive adsorption force causing deformation of two-dimensional materials is avoided when processing thin sheets.

[0045] like Figure 3 As shown, the clamp 4 includes a fixed frame 41, a clamping plate 42, a support plate 43, and an electric telescopic rod 44. The fixed frame 41 is installed on both sides of the base plate 3, the clamping plate 42 is installed on the fixed frame 41, the support plate 43 passes through the fixed frame 41 and is located below the clamping plate 42, and the electric telescopic rod 44 is installed at both ends of the support plate 43.

[0046] The fixing frame 41 mainly serves as a support and installation unit. The fixing frame 41 allows the clamping plate 42 to move relative to the contact layer 31. The clamping plate 42 and the fixing frame 41 are hinged by a pivot. In order to ensure that the clamping plate 42 can maintain contact with the contact layer 31 and has a recovery effect, the two are hinged by a torsion spring, thereby ensuring that it can be used multiple times and improving the utilization rate of the fixture 4. The support plate 43 is located at the end of the clamping plate 42. The support plate 43 and the clamping plate 42 are only in contact. At this time, the clamping plate 42 is like a lever. When the electric telescopic rod 44 drives the support plate 43 to move upward, the support plate 43 drives the end of the clamping plate 42 to tilt upward. Then the front end of the clamping plate 42 will press the workpiece downward, thereby assisting in the positioning and fixing of the workpiece. This ensures that both ends of the workpiece are positioned and fixed, which facilitates laser cutting.

[0047] like Figure 4-6As shown, the adjustment mechanism 5 includes a movable groove 51, a connecting rod 52, a push rod 53, a baffle plate 54, and a return spring 55. The movable groove 51 is formed on the clamping plate 42. The connecting rod 52 is installed in the movable groove 51. The push rod 53 is installed at the cooling layer 32. The baffle plate 54 is installed at the negative pressure hole 321 and is symmetrical about the negative pressure hole 321. The return spring 55 is installed at the end of the push rod 53 away from the baffle plate 54.

[0048] When the clamping plate 42 acts like a lever, with its end tilted upwards and its front end downwards, the connecting rod 52 connected to the clamping plate 42 will also move upwards synchronously. However, since the upward movement positions are different, and the distance between the hinge point and the different upward movement points is also different, a movable groove 51 is provided to ensure that the connecting rod 52 can always remain in a vertical state. This movable groove 51 is inclined upwards from the end of the clamping block to the front end, so that when the clamping block is folded, it can keep the connecting rod 52 moving upwards by a certain distance, thereby allowing the connecting rod 52 to carry... When the push rod 53 operates, the connection between the connecting rod 52 and the push rod 53 can be in various ways, such as through a support rod hinged at both ends, or other methods. Similarly, a wedge-shaped groove 531 can be provided on the push rod 53, and the bottom of the connecting rod 52 is a wedge-shaped surface 521. The wedge-shaped groove 531 and the wedge-shaped surface 521 are interference-fitted. As the wedge-shaped surface 521 of the connecting rod 52 moves away from the wedge-shaped groove 531 of the push rod 53, the push rod 53 is driven to move to both sides under the action of the return spring 55, simultaneously causing the baffle plate 54 to move to both sides. The return spring 55 is a tension spring. After the electric telescopic rod 44 drives the clamp 4 to release the workpiece, the wedge-shaped surface 521 at the bottom of the connecting rod 52 will cooperate with the wedge-shaped groove 531 to drive the push rod 53 to move towards the center, thereby driving the baffle plate 54 to block the negative pressure hole 321. The baffle plate 54 is made of a material with good thermal conductivity, such as copper, which has better performance than aluminum or stainless steel. On the one hand, it can open the negative pressure hole 321 during processing to directly perform negative pressure adsorption on the bottom of the workpiece. On the other hand, it can block the negative pressure hole 321 after the workpiece is laser-cut, so that the debris on the surface of the substrate 3 will not fall from the negative pressure hole 321 into the airflow layer 33, avoiding the accumulation of impurities that affect the gas flow, cooling and negative pressure adsorption effect of the airflow layer 33. In addition, after the work is completed, the baffle plate 54 can be closed to directly cool the negative pressure hole 321, thereby rapidly cooling the temperature of the contact layer 31 and improving the cooling effect of the base layer.

[0049] like Figure 7 As shown, the negative pressure hole 321 is arranged at an angle, and the edges of the negative pressure hole 321 are rounded.

[0050] By setting the negative pressure hole 321 at an angle, on the one hand, the airflow path is optimized, thereby changing the pressure difference and flow velocity distribution between the top and bottom of the negative pressure hole 321, thus increasing the negative pressure adsorption effect. On the other hand, the rounded corners facilitate the one-way cleaning of impurities falling into the negative pressure hole 321, thereby avoiding impurity blockage and affecting the negative pressure effect.

[0051] The shielding plate 54 is provided with a cooling surface 541, which is arc-shaped. When the clamp 4 is not working, the ends of the cooling surface 541 are spliced ​​together.

[0052] By setting an arc-shaped cooling surface 541, the cold air when the clamp 4 is started can be stored in the cooling surface 541, so that when the baffle 54 moves to both sides, it can exchange the heat of the contact layer 31 on both sides of the negative pressure hole 321, thereby improving the thermal stability of the contact layer 31.

[0053] like Figure 9 As shown, the airflow layer 33 is provided with a wind-gathering plate 331 inside, the edge of the wind-gathering plate 331 corresponds to the bottom of the negative pressure hole 321, and a guide surface 3311 is provided on the opposite side of the wind-gathering plate 331.

[0054] By setting the air-concentrating plate 331, the airflow has a smaller diameter at the beginning and end, thereby improving the negative pressure clamping effect at both ends of the workpiece. This ensures that the two sides will not lift up when the middle part is laser-cut. The guide surface 3311 is arc-shaped, which on the one hand increases the gas flow path, thereby ensuring that the cooling layer 32 can fully exchange heat with the contact layer 31. On the other hand, it can ensure the stability of negative pressure adsorption by ensuring the uniformity of the gas flow area, avoiding the problem of weak local negative pressure adsorption leading to local fixation. The initial flow velocity of the airflow should be increased at this point to avoid the velocity decreasing after increasing the flow path, thus preventing negative pressure adsorption.

[0055] like Figure 8 As shown, a compression spring 421 is installed at the other end of the clamping plate 42, and a positioning plate 422 is installed at the other end of the compression spring 421. The positioning plates 422 on the same clamping plate 42 are arranged opposite to each other.

[0056] By setting the positioning plate 422 and the compression spring 421, the clamping plate 42 can clamp the workpiece when it comes into contact with the workpiece. The compression spring 421 squeezes the workpiece, which avoids the problem of the workpiece locking ring caused by excessive lateral clamping force. On the other hand, it can also make the negative pressure adsorption effect greater than the clamping force of the compression spring 421, thereby making the workpiece more evenly fixed and improving the cutting effect of laser cutting.

[0057] like Figure 7 As shown, the airflow layer 33 has a double-forked air duct 6 at its end, and the substrate 3 has a collection groove 7 at its front end.

[0058] By setting up the double-forked air duct 6, the airflow in the airflow layer 33 flows laterally during operation to form a negative pressure adsorption, thereby fixing the workpiece. When not in operation, the gas flows upward through the double-forked air duct 6 and then blows in the opposite direction of the airflow through the lateral air outlet, thereby blowing impurities on the surface of the contact layer 31 into the collection groove 7. At the same time, with the baffle plate 54, it is ensured that impurities will not fall into the negative pressure hole 321, thereby improving the efficiency of the next laser cutting.

[0059] The two valves in the double-fork channel can be driven by sensors, thus realizing the principle of switching.

[0060] When laser cutting is required, the operator adjusts the multi-beam laser cutting device 2 and the built-in microscopic equipment, then places the workpiece on the contact layer 31. By activating the electric telescopic rod 44, the support plate 43 moves upward. As the support plate 43 moves upward, the end of the clamping plate 42 moves upward. Since the clamping plate 42 is hinged to the fixing frame 41, the lever principle causes the front end of the clamping plate 42 to move downward. This, in turn, compresses, positions, and initially fixes both ends of the workpiece through the compression spring 421 and the positioning plate 422. During the flipping process of the clamping plate 42, the clamping plate 42... Movement occurs within the movable groove 51, that is, the end of the connecting rod 52 slides within the movable groove 51 while keeping the connecting rod 52 in a vertical state. Then the connecting rod 52 will gradually move upward, so that the wedge surface 521 of the connecting rod 52 disengages from the wedge groove 531 of the push rod 53. At this time, the return spring 55 will drive the push rod 53 to stretch to both ends, thereby driving the baffle plate 54 to open the negative pressure hole 321. At this time, when the airflow flows through the airflow layer 33, the airflow will, on the one hand, carry away the heat conducted from the contact layer 31 to the airflow layer 33 through the cooling layer 32, and on the other hand, form a negative pressure, thereby further fixing the workpiece.

[0061] After laser cutting is completed, the operator uses the electric telescopic rod 44 to reset the clamp 4. At this time, the wedge-shaped surface 521 on the connecting rod 52 will cooperate with the wedge-shaped groove 531, and drive the push rod 53 back to the initial position. This will then drive the baffle plate 54 to block the negative pressure hole 321. The switch at the double-fork channel is changed by the sensor, and the airflow layer 33 can be continuously ventilated. The gas in the airflow layer 33 will flow upward through the double-fork air duct 6, and then blow in the opposite direction of the airflow through the horizontal air outlet. This will blow the impurities on the surface of the contact layer 31 into the collection groove 7. At the same time, with the baffle plate 54, it is ensured that the impurities will not fall into the negative pressure hole 321, thus achieving the effect of collecting impurities and cooling the surface of the contact layer 31.

[0062] The foregoing has shown and described the basic principles and beneficial effects of the present invention. However, the present invention is not limited to the above embodiments. Various changes and modifications can be made to the present invention without departing from its effects and scope. All such changes and modifications fall within the scope of the present invention as claimed, which is defined by the appended claims and their equivalents.

Claims

1. A multi-beam collaborative micro-cutting system for two-dimensional materials, characterized in that: It includes a mounting platform, a cutting device, a substrate, a clamp, and an adjustment mechanism. The cutting device is installed above the mounting platform, the substrate on which the workpiece is placed is located below the cutting device, the clamp is installed above the substrate, and the adjustment mechanism is installed at the substrate and the clamp. The clamp drives the adjustment mechanism to use airflow negative pressure to adsorb and cool the workpiece. The substrate has a three-layer structure, consisting of a contact layer, a cooling layer, and an airflow layer from top to bottom. The airflow layer is located directly below. The cooling layer has negative pressure holes that connect the contact layer and the airflow layer. The negative pressure holes are arranged in an array. The airflow speed introduced into the airflow layer is controlled in multiple stages. The fixture includes a fixed frame, a clamping plate, a support plate, and an electric telescopic rod. The fixed frame is installed on both sides of the base plate, the clamping plate is installed on the fixed frame, the support plate passes through the fixed frame and is located below the clamping plate, and the electric telescopic rod is installed at both ends of the support plate. The adjustment mechanism includes a movable groove, a connecting rod, a push rod, a baffle plate, and a return spring. The movable groove is opened on the clamping plate, the connecting rod is installed in the movable groove, the push rod is installed at the cooling layer, the baffle plate is installed at the negative pressure hole and is symmetrical about the negative pressure hole axis, and the return spring is installed at the end of the push rod away from the baffle plate. When the end of the clamping plate tilts upward and the front end tilts downward, the connecting rod connected to the clamping plate will also move upward synchronously. The movable groove is designed to keep the connecting rod in a vertical position. The movable groove tilts upward from the end of the clamping block to the front end, so that when the clamping block is folded, the connecting rod can be moved upward a certain distance, thus enabling the connecting rod to drive the push rod to work. By moving the wedge-shaped surface of the connecting rod away from the wedge-shaped groove of the push rod, the push rod is driven to move to both sides by the action of the return spring, and at the same time, the baffle plate moves to both sides. After the electric telescopic rod drives the fixture to release the workpiece, the wedge-shaped surface at the bottom of the connecting rod will move the push rod towards the center through the cooperation of the wedge groove, thus causing the baffle plate to block the negative pressure hole.

2. The multi-beam collaborative micro-cutting system for two-dimensional materials according to claim 1, characterized in that: The negative pressure holes are arranged at an angle, and the edges of the negative pressure holes are rounded.

3. The multi-beam collaborative micro-cutting system for two-dimensional materials according to claim 1, characterized in that: The push rod has a wedge-shaped groove, and the bottom of the connecting rod is a wedge-shaped surface. The wedge groove and the wedge surface are interference-fitted.

4. The multi-beam collaborative micro-cutting system for two-dimensional materials according to claim 1, characterized in that: The baffle plate has a cooling surface, which is arc-shaped. When the clamp is not working, the ends of the cooling surface are joined together.

5. The multi-beam collaborative micro-cutting system for two-dimensional materials according to claim 1, characterized in that: An airflow layer is equipped with an air-gathering plate, the edge of which corresponds to the bottom of the negative pressure hole, and a guide surface is provided on the opposite side of the air-gathering plate.

6. The multi-beam collaborative micro-cutting system for two-dimensional materials according to claim 1, characterized in that: A compression spring is installed at the other end of the clamping plate, and a positioning plate is installed at the other end of the compression spring. The positioning plates on the same clamping plate are arranged opposite each other.

7. A multi-beam collaborative micro-cutting system for two-dimensional materials according to claim 1, characterized in that: The airflow layer has a double-forked air duct at the end and a collection groove at the front end of the substrate.

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