Adhesive sheet for semiconductor device

Abstract

The adhesive sheet for a semiconductor device according to the present invention comprises: dicing tape-integrated back surface protective films provided at predetermined intervals in the longitudinal direction of a diaphragm; and a support film spaced apart from an outer side of the dicing tape-integrated back surface protective film and including two long sides of the diaphragm, the support film including an adhesive layer and a second dicing tape, the adhesive layer being in contact with the diaphragm, the second dicing tape being formed on the adhesive layer. The second dicing tape protrudes further toward the dicing tape-integrated back surface protective film side than the adhesive layer of the support film.

Description

Technical Field

[0001] The present invention relates to an adhesive sheet for a semiconductor device, and more particularly, to an adhesive sheet for a semiconductor device that can suppress the generation of winding wrinkles when wound into a roll shape. Background Art

[0002] The manufacturing of semiconductor devices is carried out by dividing a wafer into chips and bonding the chips to a substrate, etc. In the manufacturing of such semiconductor devices, when dividing the wafer into chips, a dicing tape for supporting the chips and a die attach film (DAF) for bonding the chips are used. In addition, in recent years, a dicing tape integrated backside protective film that combines the functions of such a dicing tape and a die attach film has been used. Specifically, in the dicing tape integrated backside protective film, a die attach film is laminated on a separator, and a dicing tape is laminated on the die attach film. In addition, in order to bond the dicing tape to a dicing ring frame for cutting, the dicing tape is formed to be larger than the die attach film to cover the die attach film.

[0003] One or more such dicing tape integrated backside protective films are attached at regular intervals along the length direction of the separator. In addition, the separator including the dicing tape integrated backside protective film is wound into a roll shape and stored and transported.

[0004] On the other hand, due to the difference in the height of the dicing tape in the middle part of the die attach film 120 and the height of the dicing tape in the edge part where the die attach film 120 does not exist in the separator, the adhesive sheet for a semiconductor device has a problem of generating wrinkles. Therefore, when winding such an adhesive sheet into a roll shape, it is necessary to suppress the generation of wrinkles. Summary of the Invention

[0005] Problems to be Solved by the Invention

[0006] The problem to be solved by the present invention is to provide an adhesive sheet for a semiconductor device that can suppress the generation of wrinkles when wound.

[0007] Moreover, the problem to be solved by the present invention is to provide an adhesive sheet for a semiconductor device that does not cause problems such as foreign matter scattering and reduced operability while suppressing the generation of wrinkles.

[0008] Solutions to the Problems

[0009] To solve the above technical problems, according to an embodiment of the present invention, there is provided an adhesive sheet for a semiconductor device, the adhesive sheet for a semiconductor device including: a separator; a cutting tape integrated back protective film disposed at a predetermined interval along the length direction of the separator; and a support film spaced apart from the outside of the cutting tape integrated back protective film and including two long sides of the separator, the thickness of the support film being the same as the thickness of a portion of the cutting tape integrated back protective film including an adhesive layer, the support film including a second adhesive layer and a second cutting tape, the second adhesive layer being in contact with the separator, the second cutting tape being formed on the second adhesive layer, and the second cutting tape protruding more toward the cutting tape integrated back protective film side than the second adhesive layer.

[0010] The width of the second adhesive layer in the direction of the cutting tape integrated back protective film may be smaller than the width of the second cutting tape in the direction of the cutting tape integrated back protective film.

[0011] The cutting tape integrated back protective film includes a first adhesive layer and a first cutting tape, the first adhesive layer being in contact with the separator, the first cutting tape being formed on the first adhesive layer, and the second adhesive layer of the support film may be the same as the first adhesive layer of the cutting tape integrated back protective film.

[0012] The cutting tape integrated back protective film includes a first adhesive layer and a first cutting tape, the first adhesive layer being in contact with the separator, the first cutting tape being formed on the first adhesive layer, and the second cutting tape of the support film may be the same as the first cutting tape of the cutting tape integrated back protective film.

[0013] The second cutting tape of the support film includes a second pressure-sensitive adhesive (PSA) layer and a substrate layer formed on the second pressure-sensitive adhesive layer, and the second pressure-sensitive adhesive layer may be formed on the second adhesive layer.

[0014] The support film may be disposed in a direction surrounding a part or the entire outer periphery of the cutting tape integrated back protective film.

[0015] On one surface of the separator, there may be included: the cutting tape integrated back protective film; and one or more unit bodies including the support film.

[0016] The adhesive sheet for a semiconductor device may be wound into a roll shape.

[0017] Advantages of the Invention

[0018] The adhesive sheet for a semiconductor device of the present invention can reduce or eliminate the difference in height between the middle portion of the dicing tape-integrated backside protective film having the first adhesive layer and the edge portion without the first adhesive layer. Thus, even when wound into a roll shape, the generation of wrinkles can be suppressed.

[0019] In addition, since it includes a support film that compensates for the thickness by using the dicing tape-integrated backside protective film, the process can be carried out more economically and effectively.

[0020] Moreover, by adjusting the structure of the support film, even if the support film includes the same substance as the first adhesive layer of the dicing tape-integrated backside protective film, problems such as foreign matter scattering can be prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A diagram briefly showing the structure of an adhesive sheet for a semiconductor device of the prior art.

[0022] Figure 2 A diagram briefly showing the structure of an adhesive sheet for a semiconductor device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0023] The above objects, features, and advantages will be described in detail with reference to the accompanying drawings later. Thus, those of ordinary skill in the technical field to which the present invention pertains can easily implement the technical idea of the present invention. When describing the present invention, if it is determined that the detailed description of the known technology related to the present invention may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to denote the same or similar structural elements.

[0024] Regarding the content not described in this specification, the description of the content that those of ordinary skill in the technical field to which the present invention pertains can fully analogize technically will be omitted.

[0025] In this specification, when any structure is provided "above (or below)" a structural element or "on (or under)" a structural element, it means that any structure is provided in contact with the upper surface (or lower surface) of the structural element, and other structures may be interposed between the structural element and any structure provided on (or under) the structural element.

[0026] Unless otherwise clearly specified in the context, the singular forms used in this specification include the plural forms. In this application, terms such as "composed of" or "including" should not be construed as necessarily including all the various structural elements described in the specification, but should be construed as possibly not including some of the structural elements, or may further include additional structural elements.

[0027] In this specification, terms such as "one side", "the other side", and "both sides" are used to distinguish one structural element from other structural elements, and the structural elements are not limited by the above-mentioned terms.

[0028] Hereinafter, when describing the present invention, detailed descriptions of related well-known technologies that may unnecessarily obscure the gist of the present invention will be omitted.

[0029] Figure 1 FIG. showing an adhesive sheet for a semiconductor device including a conventional dicing tape integrated backside protective film, wherein the dicing tape is pre-diced in a manner matching the shape of a semiconductor device. Refer to Figure 1 , a dicing tape integrated backside protective film is attached to the separator 110, and the dicing tape integrated backside protective film is formed by bonding a die attach film (first adhesive layer, 120) and a dicing tape 130 covering the die attach film. Although Figure 1 one dicing tape integrated backside protective film is disclosed, in fact, one or more dicing tape integrated backside protective films may be attached at regular intervals along the length direction of the separator. In addition, a support film is included, and the support film is spaced apart from the outside of the dicing tape integrated backside protective film and includes two long sides of the separator.

[0030] As Figure 1 shown, in the dicing tape integrated backside protective film, due to the height difference g between the portion where the die attach film and the dicing tape are laminated in the separator and the portion where only the dicing tape is laminated in the separator, a step appears at the boundary between these portions.

[0031] Therefore, when the dicing tape integrated backside protective film is wound into a roll shape, there is a problem that these steps are transferred to the die attach film and the dicing tape, and transfer marks of the steps appear on the die attach film and the dicing tape. In particular, if transfer marks appear on the die attach film, voids may be generated between the die attach film and the semiconductor wafer, thereby reducing the reliability of the semiconductor device.

[0032] An example of the present invention provides an adhesive sheet for a semiconductor device, the adhesive sheet for a semiconductor device including: a separator; a cutting tape integrated back protective film provided at a predetermined interval along the length direction of the separator; and a support film spaced apart from the outside of the cutting tape integrated back protective film and including two long sides of the separator, the thickness of the support film being the same as the thickness of a portion of the cutting tape integrated back protective film including an adhesive layer, the support film including a second adhesive layer and a second cutting tape, the second adhesive layer being in contact with the separator, the second cutting tape being formed on the second adhesive layer, and the second cutting tape protruding more toward the cutting tape integrated back protective film side than the second adhesive layer. Accordingly, by preventing the problem, even when the adhesive sheet for a semiconductor device is wound into a roll shape, wrinkles generated due to transfer can be suppressed. Also, problems such as scattering of foreign substances can be prevented.

[0033] Figure 2 A diagram briefly showing the structure of the adhesive sheet for a semiconductor device according to an embodiment of the present invention.

[0034] Refer to Figure 2 , the adhesive sheet for a semiconductor device of the present invention includes a cutting tape integrated back protective film 260 on a separator 210, the cutting tape integrated back protective film 260 including a first adhesive layer 220 and a first cutting tape 240, and the adhesive sheet for a semiconductor device includes a support film spaced apart from the outside of the cutting tape integrated back protective film 260 and including two long sides of the separator.

[0035] The first adhesive layer 220 is a layer that comes into contact with the separator and functions as a die bonding film. That is, the first adhesive layer 220 adheres to a wafer and bonds and fixes chips divided by cutting. Accordingly, the first adhesive layer 220 may be in a circular film shape. The composition of the adhesive included in the first adhesive layer 220 is not particularly limited as long as it can be used as a die bonding film. For example, epoxy resin, acrylic resin, phenolic resin, polyimide resin, silicone resin, etc. may be used.

[0036] The first adhesive layer 220 can exist in a B-stage state. The "B-stage state" refers to a semi-cured state, specifically, an intermediate state in the curing reaction process of a substance.

[0037] The average thickness of the first adhesive layer 220 may be about 3 μm to 60 μm, but is not limited thereto, and may be set to an appropriate thickness according to the equipment to which the first adhesive layer is applied.

[0038] The first cutting tape 240 supports the wafer during cutting and also serves to adhesively fix the crystal ring. The first cutting tape 240 is formed on the first adhesive layer 220 and can be laminated in a circular film shape with an area larger than that of the first adhesive layer 220 so as to cover the first adhesive layer 220. Thus, the front surface of the first adhesive layer 220 is adhered to the separator 210, and the edge part of the first cutting tape 240 is adhered to the separator to surround the entire outer periphery of the first adhesive layer 220.

[0039] Before the first cutting tape 240 is cured by ultraviolet rays (UV), the first cutting tape 240 maintains a high adhesive force with the first adhesive layer 220. After the first cutting tape is cured by ultraviolet rays, the adhesive force is significantly weakened, enabling the first adhesive layer 220 to be easily peeled off from the first cutting tape 240. Although there are no special restrictions, existing well-known cutting tapes can be used as the cutting tape. The first cutting tape 240 may include a first pressure-sensitive adhesive (PSA) layer and a base material layer formed on the first pressure-sensitive adhesive layer. The first pressure-sensitive adhesive layer may be formed on the first adhesive layer. As the adhesive included in the pressure-sensitive adhesive layer contained in the first cutting tape 240, for example, chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-acrylic acid comonomer, styrene-ethylene-butene or pentene copolymer, polyamide-polyol copolymer, etc., and mixtures thereof can be used.

[0040] The cutting tape integrated back surface protective film 260 includes: the first adhesive layer 220; and the first cutting tape 240 laminated on the first adhesive layer 220. The cutting tape integrated back surface protective film 260 is provided at a predetermined interval along the length direction of the separator.

[0041] The support film 270 is pre-cut from the pre-cut part 250 in a manner matching the form of the semiconductor device and is spaced apart from the outside of the cutting tape integrated back surface protective film. The thickness of the support film 270 is the same as the thickness of the part containing the adhesive layer in the cutting tape integrated back surface protective film, which can eliminate the step generated due to the height difference between the first cutting tape and the second cutting tape. Thus, when the semiconductor device adhesive sheet is wound into a roll shape, the generation of wrinkles when the cutting tape integrated back surface protective film is wound can be suppressed.

[0042] The support film may be disposed in a direction surrounding a part or the entire outer periphery of the integrated back protective film of the cutting tape. Specifically, the support film 270 may be spaced apart from the outside of the integrated back protective film of the cutting tape at a portion other than the central portion in the width direction of the separator to surround the periphery of the integrated back protective film of the cutting tape. The support film may include two long sides of the separator. Also, the support film may extend continuously or intermittently in the length (long side) direction of the separator. Also, the support film may be composed of a plurality of segments that surround a part of the integrated back protective film of the cutting tape. As another example, the support film may be composed of one segment that surrounds the entire integrated back protective film of the cutting tape.

[0043] The support film includes a second adhesive layer 230 that contacts the separator. The second adhesive layer 230 of the support film may be formed together when forming the first adhesive layer of the integrated back protective film of the cutting tape. Accordingly, the second adhesive layer of the support film may be the same as the first adhesive layer of the integrated back protective film of the cutting tape. The second adhesive layer may have the same material and thickness as the first adhesive layer. The second adhesive layer 230 may be in a B-stage state.

[0044] In addition, the support film includes a second cutting tape 245 formed on the second adhesive layer. The second cutting tape 245 of the support film may be formed together when forming the first cutting tape 240 of the integrated back protective film of the cutting tape. Accordingly, the second cutting tape of the support film may be the same as the first cutting tape of the integrated back protective film of the cutting tape. Accordingly, the second cutting tape may have the same material and thickness as the first cutting tape.

[0045] As described above, since the second adhesive layer and the second cutting tape of the support film are respectively the same as the first adhesive layer and the first cutting tape of the integrated back protective film of the cutting tape, no additional material or process for forming the support film is required, and thus, the adhesive sheet for a semiconductor device can be formed more economically and effectively.

[0046] The second cutting tape of the support film includes a second pressure-sensitive adhesive layer and a base material layer formed on the second pressure-sensitive adhesive layer, and the second pressure-sensitive adhesive layer may be formed on the second adhesive layer. The second pressure-sensitive adhesive layer and the base material layer may be the same as the first pressure-sensitive adhesive layer and the base material layer of the integrated back protective film of the cutting tape.

[0047] When viewed from the side of the adhesive sheet for semiconductor devices, the second cutting tape of the support film protrudes more toward the cutting tape integral back protective film side than the second adhesive layer. If the second adhesive layer is composed of the same material as the first adhesive layer of the cutting tape integral back protective film, due to the brittleness of the first adhesive layer and the second adhesive layer, there may be problems such as the first adhesive layer and the second adhesive layer being broken due to pressure or impact during cutting, winding, storage, or movement, resulting in the formation of foreign objects and scattering. The adhesive sheet for semiconductor devices has a structure in which the second cutting tape protrudes more toward the cutting tape integral back protective film side than the second adhesive layer, thereby protecting the second adhesive layer, and thus, the above problems can be prevented.

[0048] The width W2 of the second adhesive layer in the direction of the cutting tape integral back protective film may be smaller than the width W1 of the second cutting tape in the direction of the cutting tape integral back protective film.

[0049] Preferably, the second adhesive layer 230 supports the second cutting tape 245. For this purpose, preferably, the second adhesive layer 230 has a predetermined width. Assuming that the outer edge of the second adhesive layer 230 coincides with the outer edge of the second cutting tape 245, the ratio (W2 / W1) of the width W2 of the second adhesive layer 230 to the width W1 of the second cutting tape 245 may be 0.2 or more and less than 1.0. More preferably, the ratio (W2 / W1) may be 0.3 or more and 0.8 or less.

[0050] The separator is used to adhesively support and wind the cutting tape integral back protective film. There are no special restrictions on the separator. For example, base films such as polyester films, polypropylene films, polyethylene terephthalate films, polyimide films, polyetherimide films, polyethylene naphthalate films, and polymethylpentene films can be used.

[0051] Figure 2 Only the following are shown on one side of the separator: the cutting tape integral back protective film; and a single unit including the support film, but the adhesive sheet for semiconductor devices may include on one side of the separator: the cutting tape integral back protective film; and one or more units including the support film.

[0052] The adhesive sheet for semiconductor devices can be wound into a roll shape for storage and transportation. The adhesive sheet for semiconductor devices has the above characteristics, so that the difference in height between the first cutting tape 240 in the middle part of the cutting tape integrated back protective film where the first adhesive layer 220 exists and the height of the support film can be eliminated, and even when wound into a roll shape, the generation of wrinkles can be suppressed. In addition, the second adhesive layer and the second cutting tape of the support film are the same as the first adhesive layer and the first cutting tape of the cutting tape integrated back protective film respectively. Therefore, no additional substances or processes for forming the support film are required, and thus the adhesive sheet for semiconductor devices can be formed more economically and effectively.

[0053] Moreover, the second cutting tape has a structure that protrudes more toward the cutting tape integrated back protective film side than the second adhesive layer, so that problems such as the formation and scattering of foreign matters can be prevented.

[0054] Example

[0055] Hereinafter, the structure and function of the present invention will be described in more detail through preferred embodiments of the present invention. However, this is presented as a preferred example of the present invention and should not be construed as limiting the present invention in any sense.

[0056] Example 1

[0057] A first adhesive film (manufacturer: Innox Advanced Materials Co., Ltd.) is laminated on a separator (PET), and after a first cutting tape (manufacturer: Innox Advanced Materials Co., Ltd.) is laminated on the first adhesive film, the adhesive sheet for semiconductor devices shown is manufactured through a punching process. Figure 2 Thus, the second adhesive layer of the support film is the same as the first adhesive film, and the second cutting film has the same substance and thickness as the first cutting film.

[0058] In this case, in the support film, the width W1 of the second cutting tape is set to 6.5 mm, and the width W2 of the second adhesive layer is set to 3 mm.

[0059] In addition, a plurality of manufactured adhesive sheets are wound using a winding machine.

[0060] Example 2 and Comparative Examples 1 - 2

[0061] As shown in Table 1, in Example 1, except that the width W2 of the second adhesive layer constituting the support film was variously changed, the adhesive sheet for semiconductor devices was manufactured by the same method as in Example 1.

[0062] In addition, a winding machine is used to wind a plurality of manufactured adhesive sheets.

[0063] Evaluation

[0064] After winding a plurality of adhesive sheets and storing them frozen at normal temperature and at -10°C for 1 day, it was evaluated whether wrinkles occurred and foreign matter scattered. The results are shown in Table 1.

[0065] After winding and storing frozen for 1 day, it was evaluated whether wrinkles occurred by visually inspecting the surface of the product.

[0066] It was evaluated whether foreign matter scattered by visually inspecting the edge portion of the product after punching.

[0067] The width W1 of the second cutting tape and the width W2 of the second adhesive layer in Table 1 represent Figure 2 the widths shown in. The outer edge of the second cutting tape coincides with the outer edge of the second adhesive layer.

[0068] Table 1

[0069]

[0070] Referring to Table 1, in Examples 1 and 2 where the width W1 of the second cutting tape is greater than the width W2 of the second adhesive layer and the second cutting tape protrudes toward the first adhesive layer side, no winding wrinkles occurred during storage at normal temperature and frozen storage, and no foreign matter scattered from the second adhesive layer occurred.

[0071] On the contrary, in Comparative Example 1 where the second adhesive layer was not provided, winding wrinkles occurred during storage at normal temperature and frozen storage. On the other hand, in Comparative Example 2 where the width of the second adhesive layer was the same as the width of the second cutting tape, no winding wrinkles occurred, but foreign matter scattered from the second adhesive layer occurred.

[0072] Therefore, it can be concluded that most preferably, the second cutting tape is stably supported on the second adhesive layer while the second cutting tape protrudes toward the first adhesive layer side.

[0073] Although the present invention has been described in the above manner, the present invention is not limited to the embodiments disclosed in this specification. Obviously, those of ordinary skill in the technical field to which the present invention pertains can make various modifications within the scope of the technical idea of the present invention. And even if the effects of the structure according to the present invention are not explicitly described and explained in the above description of the embodiments of the present invention, the effects predictable from the corresponding structure should also be recognized.

Claims

1. An adhesive sheet for a semiconductor device, characterized in that: include: Diaphragm; a dicing tape integrated back protective film disposed at predetermined intervals along the length direction of the diaphragm; and A support film is separated from the outer side of the dicing tape integrated back protective film and includes two long sides of the diaphragm, The thickness of the support film is the same as the thickness of the portion of the dicing tape integrated back protective film including the adhesive layer, The supporting film includes a second adhesive layer and a second dicing tape, the second adhesive layer is in contact with the diaphragm, and the second dicing tape is formed on the second adhesive layer. The second dicing tape protrudes further toward the dicing tape-integrated back protective film than the second adhesive layer.

2. The adhesive sheet for a semiconductor device according to claim 1, wherein The width of the second adhesive layer in the direction of the dicing tape-integrated back protective film is smaller than the width of the second dicing tape in the direction of the dicing tape-integrated back protective film.

3. The adhesive sheet for a semiconductor device according to claim 1, wherein The dicing tape integrated back protective film includes a first adhesive layer and a first dicing tape, the first adhesive layer is in contact with the diaphragm, and the first dicing tape is formed on the first adhesive layer. The second adhesive layer of the support film is the same as the first adhesive layer of the dicing tape integrated back protective film.

4. The adhesive sheet for a semiconductor device according to claim 1, wherein The dicing tape integrated back protective film includes a first adhesive layer and a first dicing tape, the first adhesive layer is in contact with the diaphragm, and the first dicing tape is formed on the first adhesive layer. The second dicing tape of the support film is the same as the first dicing tape of the dicing tape integrated back protective film.

5. The adhesive sheet for a semiconductor device according to claim 1, wherein The second dicing tape of the supporting film includes a second pressure-sensitive adhesive layer and a base material layer formed on the second pressure-sensitive adhesive layer, the second pressure-sensitive adhesive layer being formed on the second adhesive layer.

6. The adhesive sheet for a semiconductor device according to claim 1, wherein The support film is provided in a direction surrounding a part or the entire periphery of the dicing tape integrated back surface protection film.

7. The adhesive sheet for a semiconductor device according to claim 1, wherein The separator includes, on one side: the dicing tape integrated back protective film; and one or more unit bodies including the support film.

8. The adhesive sheet for a semiconductor device according to claim 1, wherein The adhesive sheet for semiconductor devices is wound into a roll.

Images