Temperature measuring device, cooking utensil and temperature measuring method

Abstract

The embodiment of the invention provides a temperature measuring device which is used for measuring the temperature of an object to be subjected to temperature measurement, a heat conduction channel is formed in the side, close to a contact surface, of the object to be subjected to temperature measurement, the temperature measuring device comprises a first temperature sensor, a second temperature sensor and a processing unit, and the first temperature sensor is arranged in the heat conduction channel; the second temperature sensor is arranged at a measurement position of the heat conduction channel, the measurement position and the object to be subjected to temperature measurement are arranged at intervals, and the processing unit is electrically connected with the first temperature sensor and the second temperature sensor. The first temperature sensor and the second temperature sensor can respectively collect a first temperature value of the contact surface and a second temperature value of the measurement position, and because the measurement position and the object to be subjected to temperature measurement are arranged at an interval, a gradient occurs between the first temperature value and the second temperature value. The processing unit can determine the temperature of the bearing surface according to the gradient information. The temperature measuring device can obtain the temperature of the bearing surface in real time, and the temperature measuring result is reliable. The invention further provides a cooking utensil and a temperature measuring method thereof.

Description

Technical Field

[0001] The present application relates to the technical field of household appliances, and particularly relates to a temperature measuring device, a cooking appliance, and a temperature measuring method. Background Art

[0002] With the progress of technology, household appliances have gradually entered people's lives, and cooking appliances play an indispensable role in people's lives.

[0003] To improve the safety and usage effect of cooking appliances, cooking appliances are usually provided with a temperature measuring device, which can detect the heating temperature of the cooking appliance, etc. The cooking appliance can adjust the power according to the heating temperature to ensure that it is within a safe temperature range, and adjust the heating effect of the cooking appliance according to the temperature. To avoid phenomena such as damage and aging of the housing of the cooking appliance due to heat, the housing of the cooking appliance will use materials with high thermal resistance and high temperature resistance, such as the microcrystalline panel of an induction cooker. The heat is transmitted slowly inside the housing, which can prevent the heat from damaging the components inside the cooking appliance. However, this will also cause a temperature difference between the opposite two sides of the housing. For example, the opposite two sides of the microcrystalline panel. The temperature measuring device is arranged inside the housing, and the temperature measuring device can only measure the inner surface temperature of the housing and cannot measure the outer surface temperature of the housing, etc. The temperature measurement result has limitations. At the same time, it takes time for the temperature to be transmitted, and the temperature measurement result also has hysteresis. Using this temperature measurement result as the control basis for the cooking appliance, it is difficult to ensure the timeliness and accuracy of the operation for the cooking appliance, thereby reducing the safety and usage effect of the cooking appliance. Summary of the Invention

[0004] Embodiments of the present application provide a temperature measuring device, a cooking appliance, and a temperature measuring method to at least partially improve the above technical problems.

[0005] In a first aspect, an embodiment of the present application provides a temperature measuring device. The temperature measuring device is used to measure the temperature of an object to be measured. The object to be measured includes an opposite contact surface and a bearing surface. A heat conduction channel is formed on the side of the object to be measured close to the contact surface. The temperature measuring device includes a first temperature sensor, a second temperature sensor, and a processing unit. The first temperature sensor is arranged in the heat conduction channel and is used to collect a first temperature value of the contact surface. The second temperature sensor is arranged at a measurement position of the heat conduction channel and is used to collect a second temperature value of the measurement position. The measurement position is spaced apart from the object to be measured. The processing unit is electrically connected to the first temperature sensor and the second temperature sensor, and is used to determine the temperature of the bearing surface according to the gradient between the first temperature value and the second temperature value.

[0006] In one embodiment, the processing unit is used to calculate according to the following formula:

[0007]

[0008] Determine the temperature of the bearing surface, where T0 is the temperature value of the bearing surface, T1 is the first temperature value, is the change amount of T1 per unit time, T2 is the second temperature value, R1 is the thermal resistance value of the object to be measured for temperature, R2 is the thermal resistance value of the heat-conducting medium between the contact surface and the measurement position, and C1 is the heat capacity value of the object to be measured for temperature.

[0009] In one embodiment, the processing unit is further configured to determine R1 according to the mapping relationship between R1 and T1 and the mapping relationship therebetween determine C1 according to the mapping relationship between C1 and T1 and the mapping relationship therebetween determine R2 according to the mapping relationship between R2 and T2 and the mapping relationship therebetween where, is the change amount of T2 per unit time.

[0010] In one embodiment, the first temperature sensor is an infrared thermal radiation sensor, and the second temperature sensor is a thermistor sensor.

[0011] In one embodiment, the processing unit further includes a heat insulator, and the heat insulator encloses a heat-conducting channel. One end of the heat-conducting channel is used to contact the contact surface of the object to be measured for temperature to introduce heat flow into the heat-conducting channel, and the heat-conducting channel is filled with a heat-conducting medium.

[0012] In one embodiment, the temperature measuring device further includes a heat-conducting member and a sealing member. The heat-conducting member is a heat-conducting medium disposed between the second temperature sensor and the contact surface. The heat-conducting member has an inner cavity, and the sealing member is used to seal the inner cavity. The second temperature sensor is disposed in the inner cavity, and the first temperature sensor is disposed outside the inner cavity.

[0013] In one embodiment, the heat-conducting medium between the first temperature sensor and the contact surface is air.

[0014] In a second aspect, an embodiment of the present application provides a cooking appliance, including:

[0015] An object to be measured for temperature, which includes a bearing surface and a contact surface opposite to the bearing surface; and

[0016] The temperature measuring device as described in the first aspect above, and one end of the heat-conducting channel of the temperature measuring device contacts the contact surface to introduce heat flow into the heat-conducting channel.

[0017] In one embodiment, the object to be measured for temperature includes a heating panel, and the heating panel includes a bearing surface for carrying a cooking pot and a contact surface. The heat-conducting channel abuts against the contact surface to introduce the heat flow on the heating panel into the heat-conducting channel.

[0018] In one embodiment, the object to be temperature-measured further includes a cookware adapted to be placed on the bearing surface.

[0019] In a third aspect, an embodiment of the present application provides a temperature measurement method, which is applied to the cooking appliance in the second aspect above. The method includes:

[0020] Obtain a first temperature value and a second temperature value;

[0021] Determine the gradient information between the contact surface and the measurement position according to the first temperature value and the second temperature value;

[0022] Determine the temperature of the bearing surface according to the first temperature value and the gradient information.

[0023] In one embodiment, determining the temperature of the bearing surface according to the gradient information includes:

[0024] Determine the temperature of the bearing surface according to the following formula:

[0025]

[0026] Determine the temperature of the bearing surface, where T0 is the temperature value of the bearing surface, T1 is the first temperature value, is the change amount of T1 per unit time, T2 is the second temperature value, R1 is the thermal resistance value located in the object to be temperature-measured, R2 is the thermal resistance value of the heat conduction medium between the contact surface and the measurement position, and C1 is the heat capacity value of the object to be temperature-measured.

[0027] In one embodiment, before determining the temperature of the bearing surface according to the gradient information, the method further includes:

[0028] Determine R1 according to the mapping relationship between R1 and T1 and between, determine C1 according to the mapping relationship between C1 and T1 and between, determine R2 according to the mapping relationship between R2 and T2 and between, where, is the change amount of T2 per unit time.

[0029] In one embodiment, the method further includes:

[0030] Determine the gradient information between the contact surface and the bearing surface according to the first temperature value and the temperature of the bearing surface;

[0031] Determine the temperature of the cookware adapted to be placed on the bearing surface according to the temperature value of the bearing surface and the gradient information between the contact surface and the bearing surface.

[0032] The temperature measuring device and the cooking appliance provided by the embodiments of the present application can support a cooking pot through a heating panel, and heat the cooking pot when the cooking appliance works. Heat is transferred along the object to be measured for temperature, forming a heat flow and being introduced into a heat conduction channel. The temperature of the heat conduction medium in the heat conduction channel decreases along the transmission direction of the heat flow. The first temperature sensor and the second temperature sensor are flexibly arranged in the heat conduction channel. The first temperature sensor and the second temperature sensor can respectively collect the first temperature value of the contact surface and the second temperature value of the measurement position. Since the measurement position is spaced from the object to be measured for temperature, a gradient appears between the first temperature value and the second temperature value. The processing unit can determine the temperature of the bearing surface according to the gradient information. For example, when the object to be measured for temperature can be the heating panel, it is not necessary to open holes in the heating panel, that is, the temperature of the bearing surface of the heating panel can be detected, ensuring the structural performance of the cooking appliance and improving the use safety and protection performance of the cooking appliance. Moreover, the temperature measuring device can obtain the temperature of the bearing surface in real time, and the temperature measurement result has timeliness and reliability. Subsequently, the cooking appliance can adjust parameters such as power in real time according to the temperature value to improve the cooking effect of the cooking appliance.

[0033] In the temperature measuring method provided by the embodiments of the present application, the heat flow is introduced and transmitted between the contact surface and the measurement position. The first temperature value and the second temperature value can be measured at the contact surface and the measurement position respectively. Since the distances between the contact surface and the measurement position and the object to be measured for temperature are not equal, a gradient is formed between the first temperature value and the second temperature value. The gradient information between the contact surface and the measurement position can be determined according to the first temperature value and the second temperature value. According to the gradient information, the temperature information of the object to be measured for temperature can be determined, and thus the effect of cross-medium temperature measurement can be achieved. The temperature measuring device can complete the temperature measurement process without directly contacting the object to be measured for temperature. It can not only ensure the accuracy of the temperature measuring method but also reduce the difficulty of temperature measurement. Description of the Drawings

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained according to these drawings.

[0035] Figure 1 It is a schematic structural diagram of a cooking appliance proposed by an embodiment of the present application;

[0036] Figure 2 It is a schematic structural diagram of another cooking appliance proposed by an embodiment of the present application;

[0037] Figure 3 It is a schematic flow diagram of a temperature measuring method proposed by an embodiment of the present application.

[0038] Reference numerals: cooking appliance 100, object to be temperature-measured 10, heating panel 11, bearing surface 111, contact surface 112, temperature-measuring device 20, heat conduction channel 21, measuring position 211, heat conduction medium 22, heat insulator 23, first temperature sensor 24, second temperature sensor 25, processing unit 26, heat conduction member 27, inner cavity 271, seal 28, cookware 30. Detailed implementation manners

[0039] The following details the implementation manners of the present application, and examples of the implementation manners are shown in the accompanying drawings. The implementation manners described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application.

[0040] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the implementation manners of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the implementation manners of the present application. Obviously, the described implementation manners are only a part of the implementation manners of the present application, rather than all the implementation manners. Based on the implementation manners in the present application, all other implementation manners obtained by those skilled in the art without creative efforts belong to the scope protected by the present application.

[0041] With the progress of technology, household appliances have gradually entered people's lives, and cooking appliances play an indispensable role in people's lives.

[0042] To improve the safety and usage effect of cooking appliances, cooking appliances are usually provided with a temperature-measuring device. The temperature-measuring device can detect the heating temperature of the cooking appliance, etc., to ensure that it is within a safe temperature range, and adjust the heating effect of the cooking appliance according to the temperature. To prevent the outer shell of the cooking appliance from being damaged or aged due to heat, the outer shell of the cooking appliance is made of a material with a large thermal resistance and high temperature resistance. Among them, thermal resistance is a physical quantity used to describe the resistance of a material or structure to heat transfer, that is, the greater the thermal resistance, the smaller its thermal conductivity and the poorer its heat conduction performance. The heat is transmitted slowly inside the outer shell, which can prevent the heat from damaging the components inside the cooking appliance. However, since the temperature-measuring device is arranged inside the outer shell, the measurement result of the temperature-measuring device will be affected by the outer shell, thereby reducing the safety and usage effect of the cooking appliance.

[0043] In the prior art, holes are made at corresponding positions of the outer shell, and the temperature-measuring device is extended into the through holes. The temperature-measuring device can directly contact the object to be temperature-measured to ensure the measurement accuracy of the temperature-measuring device. However, the through holes will damage the structural strength and protection performance of the outer shell, seriously affecting the use safety and service life of the cooking appliance.

[0044] Embodiment

[0045] The present application provides a cooking appliance 100. Please refer to Figure 1, the cooking appliance 100 in this embodiment can be an induction cooker, a microwave oven, a slow cooker, etc. Hereinafter, the induction cooker will be taken as an example to elaborate:

[0046] In this embodiment, please refer to Figure 1 , the cooking appliance 100 may include an object to be temperature measured 10 and a temperature measuring device 20. The object to be temperature measured 10 may be the ceramic glass panel of the induction cooker. In another embodiment, the object to be temperature measured 10 may also be the glass turntable of the microwave oven or the inner pot of the slow cooker, etc., which can be selected according to the specific cooking appliance 100 and heating requirements, etc. Further, the object to be temperature measured 10 may include a bearing surface 111 and a contact surface 112. The bearing surface 111 may be used to bear the cookware 30 or other types of containers, etc. The contact surface 112 is opposite to the bearing surface 111. A heat conduction channel 21 is formed on one side of the object to be temperature measured 10 close to the contact surface 112, and a heat conduction medium 22 is arranged in the heat conduction channel 21. The heat conduction channel 21 may be formed in the temperature measuring device 20. One end of the heat conduction channel 21 is in contact with the contact surface 112 of the object to be temperature measured 10, so that the heat of the object to be temperature measured 10 can be transmitted along the heat conduction channel 21 to form a heat flow.

[0047] When the cooking appliance 100 starts to work, there is heat flow in the object to be temperature measured 10. The heat of the object to be temperature measured 10 can be transmitted through the heat conduction medium 22 to form a heat flow in the heat conduction channel 21. During the heat transmission process, the object to be temperature measured 10 and / or the heat conduction medium 22 absorb part of the heat, and the temperatures of the object to be temperature measured 10 and the heat conduction medium 22 rise. Both the object to be temperature measured 10 and the heat conduction medium 22 have a certain thermal resistance. Therefore, along the flowing direction of the heat flow, the heat flow rate gradually decreases, and the heat in the subsequent heat conduction medium 22 decreases, and the temperature rise amplitude weakens. Furthermore, the temperature of the heat conduction medium 22 farther away from the object to be temperature measured 10 is lower, and the temperature in the heat conduction channel 21 shows a decreasing trend along the direction away from the object to be temperature measured 10. The temperature measuring device 20 can measure the temperature values at at least two positions in the heat conduction channel 21, and the temperature values at multiple positions show a gradient. Combining parameters such as the temperature difference between multiple positions, the thermal resistance, and the thermal resistance of the object to be temperature measured 10, the temperature value of the bearing surface 111 is calculated comprehensively. The cooking appliance 100 can perform subsequent operations according to the temperature value of the bearing surface 111, such as increasing the heating power to improve the heating effect, or reducing the heating power to ensure cooking safety and improve the use effect and safety of the cooking appliance 100.

[0048] It can be understood that in the heat conduction channel 21, the more temperature measuring positions of the temperature measuring device 20, the clearer the temperature distribution in the heat conduction channel 21 obtained, and the higher the temperature measuring accuracy of the temperature measuring device 20.

[0049] Moreover, to enable users to observe more clearly, the cooking appliance 100 may be provided with a display device that can display the temperature value of the bearing surface 111 in real time for the user to observe, facilitating the user's subsequent operations. The cooking appliance 100 may also be provided with an alarm device. When the temperature value of the bearing surface 111 exceeds a preset safe temperature value, the alarm device emits an alarm to remind the user to perform operations such as power off.

[0050] Further, please refer to Figure 1 and Figure 2 , the object 10 to be measured for temperature may include a heating panel 11. For example, the heating panel 11 may be the microcrystalline panel of an induction cooker. The microcrystalline panel has a large thermal resistance and high temperature resistance, which can ensure the cooking safety of the cooking appliance 100. In another embodiment, the heating panel 11 may also be the ceramic inner pot of a slow cooker, etc. Specifically, the heating panel 11 may include a bearing surface 111 and a contact surface 112. Cookware 30, etc. can be placed on the bearing surface 111, and the cooking appliance 100 heats the cookware 30 during operation. The heat conduction channel 21 abuts against the contact surface 112 of the heating panel 11, and the heat of the cookware 30 is transmitted to the bearing surface 111. The heat flow on the heating panel 11 is introduced into the heat conduction channel 21 and continues to be transmitted along the bearing surface 111 to the contact surface 112. The heat conduction channel 21 abuts against the contact surface 112 to introduce the heat flow on the heating panel 11 into the heat conduction channel 21. Furthermore, the heat flow is transmitted in the heat conduction channel 21, Figure 2 The specific flow direction of the heat flow is shown in. The temperature at each position in the heat conduction channel 21 along the heat flow transmission direction shows a decreasing trend. The temperature measuring device 20 can measure the temperature values at at least two positions in the heat conduction channel 21, and the temperature values at multiple positions show a gradient. According to parameters such as the temperature difference between multiple positions, the thermal resistance, and the thermal resistance of the heating panel 11, the temperature value of the bearing surface 111 is comprehensively calculated. The phenomenon of dry burning, etc. of the cooking appliance 100 can be prevented, the use safety of the heating panel 11 can be improved, and the service life of the cooking appliance 100 can be ensured.

[0051] In this embodiment, please continue to refer to Figure 1, the temperature measuring device 20 may include a first temperature sensor 24, a second temperature sensor 25, and a processing unit 26. There is a measurement position 211 in the heat conduction channel 21. The measurement position 211 and the object 10 to be measured for temperature are arranged at intervals. The distance between the contact surface 112 and the measurement position 211 can be selected according to specific different heat conduction media 22, and this embodiment does not make a selection. Exemplarily, when a heat conduction medium 22 with a high heat conduction coefficient is used, the thermal resistance of the heat conduction medium 22 per unit volume is small. The heat transfer rate is large, and the temperature changes of both the contact surface 112 and the measurement position 211 are not obvious. The distance between the object 10 to be measured for temperature and the measurement position 211 can be increased to increase the thermal resistance between the contact surface 112 and the measurement position 211, and then the temperature difference between the contact surface 112 and the measurement position 211 becomes more obvious, which is convenient for subsequent calculations.

[0052] The first temperature sensor 24 is arranged in the heat conduction channel. The first temperature sensor 24 can be used to collect the first temperature value of the contact surface 112. The second temperature sensor 25 is arranged in the heat conduction channel. The second temperature sensor 25 can be used to collect the second temperature value of the measurement position 211. In one implementation manner, the first temperature sensor 24 can be an infrared thermal radiation sensor, and the infrared thermal radiation sensor has advantages such as non-contact, long-distance sensing, high-temperature measurement, and high safety. The first temperature sensor 24 can be arranged at the contact surface 112 or other positions in the heat conduction channel 21. By changing the orientation of the first temperature sensor 24 towards the contact surface 112, the first temperature sensor 24 can collect the first temperature value of the contact surface 112. The second temperature sensor 25 can be a thermistor sensor, and the thermistor sensor has advantages such as high measurement accuracy, a large measurement range, and easy use, and is suitable for the implementation scenario of low-temperature measurement. The second temperature sensor 25 can be arranged at the measurement position 211, and the second temperature sensor 25 can collect the second temperature value. The first temperature value of the contact surface 112 and the second temperature value of the measurement position 211 are different. Affected by the heat flow transfer direction, the temperature value of the contact surface 112 is higher, and the first temperature value is greater than the second temperature value.

[0053] Preferably, to ensure that the first temperature sensor 24 can smoothly obtain the thermal radiation signal of the contact surface 112, the heat conduction medium 22 between the first temperature sensor 24 and the contact surface 112 in this application can be air, avoiding the occlusion of other objects with low heat conduction coefficients to affect the temperature measurement result of the first temperature sensor 24 and improving the reliability of the first temperature sensor 24.

[0054] In one embodiment, the temperature measuring device 20 may further include a heat insulator 23. The heat insulator 23 can be connected to the contact surface 112 by means of fasteners, bonding, etc. The heat insulator 23 encloses a heat conduction channel 21. The heat insulator 23 can prevent external heat from flowing into the heat conduction channel 21, and can also prevent the heat inside the heat conduction channel 21 from diffusing to the outside, reducing the factors affecting the temperature measurement accuracy of the temperature measuring device 20. The heat insulator 23 can improve the transmission effect of the heat flow, and thus can improve the measurement accuracy of the temperature measuring device 20. The heat conduction channel 21 is filled with a heat conduction medium 22. The heat conduction medium 22 can be made of a metal material or a heat conduction ceramic, etc. Such as copper, etc. The metal material has high thermal conductivity and certain heat resistance. The heat conduction ceramic can bear a higher temperature, and the structure of the heat conduction ceramic is more stable, which can improve the stability of the temperature measuring device 20. The shape, size, etc. of the heat conduction medium 22 can be correspondingly set with the heat conduction channel 21, so that the heat conduction channel 21 can cooperate with the heat conduction medium 22. The heat conduction medium 22 can ensure that the heat flow has a definite flow direction, ensure the flow effect of the heat flow, and thus ensure that the temperature values at multiple positions are in a gradient, improving the temperature measurement accuracy of the temperature measuring device 20.

[0055] Preferably, when the thermal resistance of the heat insulator 23 is greater than that of air, the heat conduction medium 22 can be air. The heat flow can still be transmitted through the heat conduction medium 22, and thus the temperature can also be measured through the heat flow rate. It not only ensures the temperature measurement accuracy of the temperature measuring device 20, but also simplifies the structure of the temperature measuring device 20 and reduces the installation difficulty of the cooking device 100.

[0056] Furthermore, since the heat flow of the contact surface 112 can be transmitted to the first temperature sensor 24 through air, the heat flow will also be transmitted to the second temperature sensor 25 along with the air, thereby affecting the reliability of the second temperature sensor 25. And subsequent thermal resistance calculations will also have errors, seriously affecting the temperature measurement accuracy of the temperature measuring device 20. In this embodiment, the temperature measuring device 20 further includes a heat conducting member 27 and a sealing member 28. The heat conducting member 27 can be a heat conduction medium disposed between the second temperature sensor 25 and the contact surface 112. The heat conducting member 27 has a content cavity 271 inside. The sealing member 28 is used to seal the content cavity 271. The measurement position 211 can be disposed inside the content cavity 271, and the second temperature sensor 25 is disposed in the content cavity 271. The heat flow flows into the content cavity 271 along the heat conducting member 27. The second temperature sensor 25 can be disposed at the inner wall of the content cavity 271, and the second temperature sensor 25 can effectively measure the temperature value of the measurement position 211. The first temperature sensor is disposed outside the content cavity 271, and the first temperature sensor and the second temperature sensor 25 can be spaced apart. It can effectively prevent the heat flow outside the content cavity 271 from affecting the temperature measurement accuracy of the second temperature sensor 25, and thus ensure the temperature measurement effect of the temperature measuring device 20.

[0057] In another embodiment, the first temperature sensor 24 and / or the second temperature sensor 25 may be a thermal resistance sensor, a thermocouple sensor, an infrared thermal radiation sensor, or an ultrasonic temperature sensor. Among them, the thermocouple sensor has the advantages of fast response speed, strong anti-interference ability, and high accuracy, and is suitable for high-interference scenarios, and can effectively resist various external interferences. The ultrasonic temperature sensor uses advanced sensing technology to measure in real time, has high measurement accuracy and stable performance, and can be applied to various bad weather conditions. It can be selected according to specific implementation scenarios and implementation requirements, and this embodiment does not limit it. For example, the first temperature sensor 24 and the second temperature sensor 25 can both use non-contact sensors, such as infrared thermal radiation sensors. The first temperature sensor 24 can obtain the first temperature value by detecting the thermal radiation signal, and the second temperature sensor 25 can obtain the second temperature value by detecting the thermal radiation signal.

[0058] The processing unit 26 is electrically connected to the first temperature sensor 24 and the second temperature sensor 25. The processing unit 26 can supply power to and / or transmit signals for the first temperature sensor 24 and the second temperature sensor 25. Information such as the first temperature value and the second temperature value can be respectively transmitted from the first temperature sensor 24 and the second temperature sensor 25 into the processing unit 26.

[0059] Please refer to Figure 1 and Figure 2 , the processing unit 26 can be used to determine the temperature of the bearing surface 111 of the object 10 to be measured according to the gradient between the first temperature value and the second temperature value. The specific content is as follows:

[0060] Taking the contact surface 112 as the heat flow node for simplified analysis, at any moment, for the heat flow Q flowing from the bearing surface 111 to the contact surface 112 in is equal to the heat Q stored in the object 10 to be measured save and the heat flow Q flowing along the heat conduction channel 21 to the measurement position 211 out , and then the following formula can be obtained:

[0061] Q in =Q save +Q out

[0062] For the contact surface 112, according to the heat conduction equation, that is, the thermal resistance value is equal to the temperature difference divided by the heat flow. The inflowing heat flow Q in can be calculated by Q in =(T0 - T1) / R1, where R1 is the thermal resistance value of the heat conduction medium 22 between the bearing surface 111 and the contact surface 112, that is, R1 is the thermal resistance value of the object 10 to be measured.

[0063] The heat Q stored in the object 10 to be measured save For example, at a certain moment, the heat stored in the object 10 to be measured is equal to the temperature change of the object 10 to be measured per unit time multiplied by the heat capacity of the object 10 to be measured. By approximate equivalent simplification, the average temperature of the object 10 to be measured is replaced by the first temperature value T1. Then, we can get in, It is the variation of the first temperature value T1 per unit time, that is, the derivative of the first temperature value T1 with respect to the heating time of the object 10 to be measured.

[0064] For the heat flux Q flowing along the heat conduction channel 21 to the measuring position 211 out According to the heat conduction equation, the thermal resistance is equal to the temperature difference divided by the heat flow. The temperature gradient between the contact surface 112 and the measuring position 211 can be calculated by Q out =(T1-T2) / R2 is calculated.

[0065] Combining the above formulas, we can get the following formula:

[0066]

[0067] Wherein, T0 is the temperature value of the bearing surface 111, T1 is the first temperature value, is the variation of T1 per unit time, T2 is the second temperature value, R1 is the thermal resistance value of the object 10 to be measured, R2 is the thermal resistance value of the heat-conducting medium 22 between the contact surface 112 and the measuring position 211, and C1 is the thermal capacitance value of the object 10 to be measured. In one embodiment, the thermal resistance value R1 of the object 10 to be measured, the thermal resistance value R2 of the heat-conducting medium 22 between the contact surface 112 and the measuring position 211, and the thermal capacitance value C1 of the object 10 to be measured can all be measured in advance, and then transmitted to the processing unit 26 through other devices, or the relevant information can be pre-stored in the processing unit 26 during installation, so as to ensure that the processing unit 26 can accurately calculate the temperature of the object 10 to be measured, thereby improving the accuracy of the temperature measuring device 20.

[0068] The processing unit 26 may be used to Determine the temperature of the bearing surface 111 of the object 10 to be measured for temperature. Subsequently, based on the obtained temperature value of the bearing surface 111, the working state, cooking temperature, etc. of the cooking appliance 100 can be monitored in real time. Exemplarily, when the cooking appliance 100 experiences dry burning or other situations, the temperature of the cookware or the like carried on the bearing surface 111 will rise, and then the temperature of the bearing surface 111 will also rise accordingly. The temperature measuring device 20 can calculate the accurate temperature of the bearing surface 111 through this formula and judge the working state of the cooking appliance 100 based on this temperature. Exemplarily, the processing unit 26 can compare the temperature of the bearing surface 111 with a preset safety temperature. When the temperature of the bearing surface 111 exceeds the safety temperature, it can be determined that the cooking appliance 100 is operating abnormally, and subsequent alarm prompts, power-off protection, etc. can be performed to improve the usage safety of the cooking appliance 100. The temperature value accurately obtained through this formula can be used to improve the usage effect of the temperature measuring device 20 and also improve the usage safety of the cooking appliance 100.

[0069] As the heating duration of the cooking appliance 100 increases, the temperature of the object 10 to be measured for temperature gradually rises, and R1, R2, and C1 may all change due to the influence of temperature. In this embodiment, the processing unit 26 can calibrate R1, R2, and C1 to determine the values of R1, R2, and C1 at different temperatures. Reduce the influence of the working temperature on R1, R2, and C1 and improve the detection accuracy of the temperature measuring device 20.

[0070] In some embodiments, a mapping relationship between R1 and T1 and can be established in advance. Specifically, the mapping relationship between R1 and T1 and can be established in the following manner. During the debugging stage or the assembly stage, the cooking appliance 100 is subjected to a heating test. As the heating time of the cooking appliance 100 increases, the temperature of the object 10 to be measured for temperature gradually rises, and the first temperature value also gradually increases. Multiple different first temperature values and the thermal resistance values of the object 10 to be measured for temperature under the unit time change amount of multiple different first temperature values can be measured. Establish a mapping relationship between the thermal resistance value of the object 10 to be measured for temperature, the first temperature value, and the unit time change amount of the first temperature value Preferably, multiple tests can be performed to obtain more data so that subsequent calibration can be more accurate.

[0071] According to the obtained different first temperature values T1 and the unit time change amount of the first temperature value of the object 10 to be measured for temperature, perform fitting to obtain the mapping relationship between the thermal resistance value of the object 10 to be measured for temperature, the first temperature value, and the unit time change amount of the first temperature value In the subsequent calculation process, the processing unit 26 can calculate based on R1 and T1 and The mapping relationship Determine R1, and calculate in real time the thermal resistance value R1 of the object 10 to be measured at different temperatures and different temperature change amounts. Then, use this thermal resistance value for subsequent calculations, which can obtain a more accurate temperature measurement result, effectively improve the detection accuracy of the temperature measurement device 20, and ensure the reliability and cooking effect of the cooking appliance 100.

[0072] In another embodiment, a mapping relationship between C1 and T1 and can be established in advance. Specifically, the mapping relationship between C1 and T1 and can be established in the following way. During the debugging stage or the assembly stage, the cooking appliance 100 is subjected to a heating test. As the heating duration of the cooking appliance 100 increases, the temperature of the object 10 to be measured gradually rises, and the first temperature value also gradually increases. Measure a plurality of different first temperature values and the heat capacity values of the object 10 to be measured under the unit time change amounts of a plurality of different first temperature values. Establish a mapping relationship between the heat capacity value of the object 10 to be measured, the first temperature value, and the unit time change amount of the first temperature value Preferably, multiple tests can be performed to obtain more data so that subsequent calibration can be more accurate.

[0073] According to the obtained different first temperature values T1 and the unit time change amount of the first temperature value, perform fitting to obtain the mapping relationship between the heat capacity value of the object 10 to be measured, the first temperature value, and the unit time change amount of the first temperature value During subsequent calculation processes, the processing unit 26 can determine C1 according to the mapping relationship between C1 and T1 and Calculate in real time the heat capacity value C1 of the object 10 to be measured at different temperatures and different temperature change amounts, and then use this heat capacity value for subsequent calculations, which can obtain a more accurate temperature measurement result, effectively improve the detection accuracy of the temperature measurement device 20, and ensure the reliability and cooking effect of the cooking appliance 100. In another embodiment, a mapping relationship between R2 and T2 and

[0074] can be established in advance. Specifically, the mapping relationship between R2 and T2 and can be established in the following way The mapping relationship therebetween. During the debugging stage or the assembly stage, the cooking appliance 100 can perform a heating test. As the heating duration of the cooking appliance 100 increases, the temperature of the object 10 to be measured gradually rises, and the first temperature value and the second temperature value also gradually increase. Measure the thermal resistance values of the heat conduction medium 22 between the contact surface 112 and the measurement position 211 under multiple different second temperature values and the unit time change amounts of the multiple different second temperature values. Establish the mapping relationship between the thermal resistance value of the heat conduction medium 22 between the contact surface 112 and the measurement position 211, the second temperature value, and the unit time change amount of the second temperature value. Preferably, multiple tests can be performed to obtain more data so that subsequent calibration can be more accurate.

[0075] According to the obtained different second temperature values T2 and the unit time change amount of the second temperature value of the heat conduction medium 22 between the contact surface 112 and the measurement position 211, perform fitting to obtain the mapping relationship between the thermal resistance value of the heat conduction medium 22 between the contact surface 112 and the measurement position 211, the second temperature value, and the unit time change amount of the second temperature value. In the subsequent calculation process, the processing unit 26 can determine R2 according to the mapping relationship between R2 and T2 and therebetween. Determine R2, calculate in real time the thermal resistance values of the heat conduction medium 22 between the contact surface 112 and the measurement position 211 under different temperatures and different temperature change amounts, and then use this thermal resistance value for subsequent calculations, which can obtain a more accurate temperature measurement result, effectively improve the detection accuracy of the temperature measurement device 20, and ensure the reliability and cooking effect of the cooking appliance 100.

[0076] In this embodiment, please refer to Figure 2, the object 10 to be temperature - measured may further include a cookware 30 adapted to be placed on the bearing surface 111. When the cooking appliance 100 operates, it heats the cookware 30. The heat of the cookware 30 will be transmitted to the heat - conducting channel 21 through the object 10 to be temperature - measured, forming a heat flow. Along the direction of the heat - flow transmission, the temperature of the cookware 30, the first temperature value, and the second temperature value show a gradient in sequence. Through this gradient information, the temperature - measuring device 20 can also measure the temperature of the cookware 30. Further, when the cooking appliance 100 operates to heat the cookware 30, the heat is transmitted from the cookware 30 along the object 10 to be temperature - measured into the heat - conducting channel 21. Then, as the heat - flow direction, the heat - flow gradually decreases, and the heat in the subsequent heat - conducting medium 22 decreases, and the temperature - rising amplitude weakens. Then, the heat - flow transmission between the cookware 30 and the temperature - measuring device 20 is realized. Along the heat - flow transmission direction, the temperature at each position between the cookware 30 and the temperature - measuring device 20 shows a decreasing trend. The temperature - measuring device 20 can measure the temperature values at at least two positions between the cookware 30 and the temperature - measuring device 20, and the temperature values at multiple positions show a gradient. According to the temperature difference between multiple positions, as well as parameters such as the thermal resistance, the thermal resistance of the cookware 30, and the heat capacity, the temperature value of the cookware 30 is comprehensively calculated. The temperature value of the cookware 30 can be used to monitor the cooking process of the cooking appliance 100 in real - time, so that the cooking appliance 100 can adjust the heating power and duration in real - time, etc., to improve the cooking effect. Calculations can be made according to the thermal resistance and heat capacity of different cookware 30, so that the cooking appliance 100 can be adapted to a variety of different cookware 30. While ensuring the temperature - measuring accuracy of the temperature - measuring device 20, the cooking effect and adaptability of the cooking appliance 100 can also be improved.

[0077] Further, the processing unit 26 can also be used to determine the temperature of the cookware 30 according to the gradient between the first temperature value of the contact surface 112 and the temperature value of the bearing surface 111. It can be derived according to the calculation formula of the temperature value of the bearing surface 111 to obtain the calculation formula of the temperature value of the cookware 30. Specifically as follows:

[0078]

[0079] Among them, T is the temperature value of the cookware 30, T0 is the temperature value of the bearing surface 111, is the change amount of T0 per unit time, T1 is the first temperature value, R0 is the thermal resistance value of the cookware 30, R1 is the thermal resistance value of the object 10 to be temperature - measured, and C0 is the heat - capacity value of the cookware 30.

[0080] The processing unit 26 can be used to calculate according to Determine the temperature value of the cookware 30. Among them, the thermal resistance value R0 of the cookware 30, the thermal resistance value R1 of the object 10 to be measured, and the heat capacity value C1 of the cookware 30 can all be measured in advance and then transmitted to the processing unit 26 through other devices, or relevant information can be stored in the processing unit 26 in advance during installation, ensuring that the processing unit 26 can accurately calculate the temperature of the cookware 30 and improving the accuracy of the temperature measuring device 20.

[0081] It is understandable that a mapping relationship can be established between the thermal resistance value R0 and the heat capacity value C1 of the cookware and the temperature T0 of the object to be measured and the temperature change amount of the object to be measured per unit time. The processing unit 26 can calibrate the thermal resistance value and the heat capacity value of the cookware according to this mapping relationship, T0, and to improve the detection accuracy of the temperature measuring device for the temperature of the cookware.

[0082] The cooking appliance 100 provided in this embodiment can carry the cookware 30 through the heating panel 11, and generate heat to heat the cookware 30 when the cooking appliance 100 works. The heat is transferred along the object 10 to be measured, forming a heat flow and being introduced into the heat conduction channel 21. The temperature of the heat conduction medium 22 in the heat conduction channel 21 decreases along the transmission direction of the heat flow. The first temperature sensor 24 and the second temperature sensor 25 are flexibly arranged in the heat conduction channel 21, and the first temperature sensor 24 and the second temperature sensor 25 can respectively collect the first temperature value of the contact surface 112 and the second temperature value of the measurement position 211. Since the measurement position 211 is spaced from the object 10 to be measured, a gradient appears between the first temperature value and the second temperature value. The processing unit 26 can determine the temperature of the bearing surface 111 according to this gradient information. For example, the object 10 to be measured can be the heating panel 11, and the temperature of the bearing surface 111 of the heating panel 11 can be monitored without opening holes in the heating panel 11, ensuring the structural performance of the cooking appliance 100 and improving the use safety and protection performance of the cooking appliance 100. Moreover, the temperature measuring device 20 can obtain the temperature of the bearing surface 111 in real time, and the measurement result has timeliness and reliability. Subsequently, the cooking appliance 100 can adjust parameters such as power in real time according to the temperature value to improve the cooking effect of the cooking appliance 100.

[0083] This embodiment also provides a temperature measuring method, which can be applied to the cooking appliance in the above content. Please refer to Figure 3 The method includes the following steps S110 - S130:

[0084] Step S110: Obtain the first temperature value and the second temperature value.

[0085] Select appropriate first and second temperature sensors. The selection and design of the first and second temperature sensors can be carried out according to the characteristics of specific temperature sensors and implementation scenarios, etc. Moreover, depending on the types of temperature sensors, the arrangement methods of the first and second temperature sensors are different. For example, when the first and second temperature sensors are contact temperature sensors, the first and second temperature sensors can be arranged on the contact surface and the measurement position respectively. Or, when the first temperature sensor is a non-contact temperature sensor, the first temperature sensor can be arranged at any position of the heat conduction channel, and the orientation of the infrared detection structure of the first temperature sensor can be adjusted so that it can obtain the infrared radiation signal of the contact surface to meet the usage requirements of the measuring device.

[0086] The first temperature value of the contact surface can be collected by the first sensor, and the first sensor can transmit the first temperature value to the processing unit. The second temperature value of the measurement position can also be collected by the second sensor, and the second sensor can transmit the second temperature value to the processing unit. The first temperature value and the second temperature value can be used for various applications of the cooking appliance, such as temperature monitoring, control, alarm, etc.

[0087] Exemplarily, when the cooking appliance is working, the heat flow transfers from the object to be measured to the heat conduction medium, and the temperatures of the bearing surface, the contact surface, and the measurement position form a gradient. Both the first temperature value and the second temperature value are less than the temperature of the bearing surface. And when one of the first temperature value and the second temperature value is greater than the safe temperature of the object to be measured, the temperature of the bearing surface has exceeded the safe temperature value, and operations such as power-off control and alarm of the cooking pot can be performed. This can avoid phenomena such as dry burning of the cooking appliance and ensure the safety of using the cooking appliance.

[0088] Step S120: Determine the gradient information between the contact surface and the measurement position according to the first temperature value and the second temperature value.

[0089] Transmit both the first temperature value and the second temperature value to the processing unit. Since the measurement position is spaced from the object to be measured, the first temperature value and the second temperature value are different. The first temperature value and the second temperature value can be compared, and the difference between the first temperature value and the second temperature value can be calculated. And according to the difference between the first temperature value and the second temperature value, information such as the flow direction and heat flow rate of the heat flow can be confirmed. Exemplarily, by comparing the first temperature value and the second temperature value, when the result that the first temperature value is greater than the second temperature value is obtained, the flow direction of the heat flow is from the contact surface to the measurement position. It can be known that the temperature of the object to be measured is still rising, and then it can be confirmed that the cooking appliance is still in the heating state. Moreover, on the premise that the contact surface and the measurement position are relatively fixed, by calculating the magnitude of the difference between the first temperature value and the second temperature value, the temperature change amplitude in the heat conduction channel can be obtained, and then the gradient information between the contact surface and the measurement position can be determined.

[0090] Based on the positional relationship between the contact surface and the measurement position, the first temperature value, and the second temperature value, fitting can be performed to obtain the temperature distribution curve within the heat conduction channel, and further determine the trend of temperature change within the heat conduction channel. The operating state of the cooking appliance can be judged according to the temperature change trend, improving the measurement effect of the temperature measuring device.

[0091] Step S130: Determine the temperature of the bearing surface according to the first temperature value and the gradient information.

[0092] The gradient information may include the first temperature value, the second temperature value, the difference between the first temperature value and the second temperature value, and the flow direction of the heat flow, etc. Further, the temperature of the bearing surface can be determined according to the following formula:

[0093]

[0094] where, T0 is the temperature value of the bearing surface, T1 is the first temperature value, is the change amount of T1 per unit time, T2 is the second temperature value, R1 is the thermal resistance value of the object to be temperature measured, R2 is the thermal resistance value of the heat conduction medium between the contact surface and the measurement position, and C1 is the heat capacity value of the object to be temperature measured.

[0095] After determining the temperature of the bearing surface, subsequent real-time monitoring of the operating state, cooking temperature, etc. of the cooking appliance can be performed according to the obtained temperature value of the bearing surface. Exemplarily, in the case of dry burning of the cooking appliance, the temperature of the cookware carried on the bearing surface will rise, and then the temperature of the bearing surface may rise. The temperature measuring device can calculate the accurate temperature of the bearing surface through this formula and compare it with the safety temperature. When the temperature of the bearing surface exceeds the safety temperature, it can be judged that the cooking appliance is operating abnormally, and subsequent alarm prompts, power-off protection, etc. can be performed to improve the use safety of the cooking appliance. The temperature value accurately obtained through this formula can improve the use effect of the temperature measuring device and also improve the use safety of the cooking appliance.

[0096] In one implementation, before determining the temperature of the object to be temperature measured according to the gradient information, the method further includes: calibrating R1, R2, and C1 to determine the values of R1, R2, and C1 at different temperatures. To improve the detection accuracy of the temperature measuring device and reduce the influence of factors such as temperature on the measurement result.

[0097] In some implementations, a mapping relationship between R1 and T1 and can be established in advance. Specifically, the mapping relationship between R1 and T1 and The mapping relationship therebetween. During the debugging stage or the assembly stage, the cooking appliance can perform a heating test. As the heating time of the cooking appliance increases, the temperature of the object to be temperature-measured gradually rises, and the first temperature value also gradually increases. Multiple different first temperature values and the thermal resistance values of the object to be temperature-measured under the unit time change amounts of multiple different first temperature values can be measured. Establish the mapping relationship between the thermal resistance value of the object to be temperature-measured, the first temperature value, and the unit time change amount of the first temperature value Preferably, multiple tests can be performed to obtain more data so that subsequent calibration can be more accurate.

[0098] According to the obtained different first temperature values T1 and the unit time change amount of the first temperature value of the thermal resistance value R1 of the object to be temperature-measured, perform fitting to obtain the mapping relationship between the thermal resistance value of the object to be temperature-measured, the first temperature value, and the unit time change amount of the first temperature value. During the subsequent calculation of the temperature of the object to be temperature-measured, R1 can be determined according to the mapping relationship between R1 and T1 and the mapping relationship therebetween Determine R1, calculate in real time the thermal resistance value R1 of the object to be temperature-measured under different temperatures and different temperature change amounts, and then use this thermal resistance value for subsequent calculations, which can obtain a more accurate temperature measurement result, effectively improve the detection accuracy of the temperature measurement device, and ensure the reliability and cooking effect of the cooking appliance.

[0099] In another implementation manner, the mapping relationship between C1 and T1 and the mapping relationship therebetween can be established in advance. Specifically, the mapping relationship between C1 and T1 and the mapping relationship therebetween can be established in the following manner. During the debugging stage or the assembly stage, the cooking appliance can perform a heating test. As the heating duration of the cooking appliance increases, the temperature of the object to be temperature-measured gradually rises, and the first temperature value also gradually increases. Measure the heat capacity values of the object to be temperature-measured under multiple different first temperature values and the unit time change amounts of multiple different first temperature values. Establish the mapping relationship between the heat capacity value of the object to be temperature-measured, the first temperature value, and the unit time change amount of the first temperature value Preferably, multiple tests can be performed to obtain more data so that subsequent calibration can be more accurate.

[0100] According to the obtained different first temperature values T1 and the unit time change amount of the first temperature value of the heat capacity value C1 of the object to be temperature-measured, perform fitting to obtain the mapping relationship between the heat capacity value of the object to be temperature-measured, the first temperature value, and the unit time change amount of the first temperature value During the subsequent calculation process, the processing unit can, according to the mapping relationship between C1 and T1 and the mapping relationship therebetween Determine C1, calculate in real time the heat capacity value C1 of the object to be measured at different temperatures and different temperature changes, and then use this heat capacity value for subsequent calculations, which can obtain a more accurate temperature measurement result, effectively improve the detection accuracy of the temperature measurement device 20, and ensure the reliability and cooking effect of the cooking appliance.

[0101] In another embodiment, a mapping relationship between R2 and T2 and can be established in the following specific way. During the debugging or assembly stage, the cooking appliance is heated for testing. As the heating duration of the cooking appliance increases, the temperature of the object to be measured gradually rises, and the first temperature value and the second temperature value also gradually increase. Measure multiple different second temperature values and the thermal resistance values of the heat conduction medium between the contact surface and the measurement position under the unit time change of multiple different second temperature values. Establish a mapping relationship between the thermal resistance value of the heat conduction medium between the contact surface and the measurement position, the second temperature value, and the unit time change of the second temperature value Preferably, multiple tests can be carried out to obtain more data so that subsequent calibration can be more accurate.

[0102] According to the obtained different second temperature values T2 and the unit time change of the second temperature value of the heat conduction medium between the contact surface and the measurement position, perform fitting to obtain the mapping relationship between the thermal resistance value of the heat conduction medium between the contact surface and the measurement position, the second temperature value, and the unit time change of the second temperature value In the subsequent calculation process, the processing unit can determine R2 according to the mapping relationship between R2 and T2 and calculate in real time the thermal resistance value of the heat conduction medium between the contact surface and the measurement position at different temperatures and different temperature changes, and then use this thermal resistance value for subsequent calculations, which can obtain a more accurate temperature measurement result, effectively improve the detection accuracy of the temperature measurement device, and ensure the reliability and cooking effect of the cooking appliance.

[0103] The temperature measurement method in this embodiment can also measure the temperature of the cookware, specifically as follows:

[0104] Determine the gradient information between the contact surface and the object to be measured according to the first temperature value and the temperature of the object to be measured.

[0105] ​​The first temperature value of the contact surface and the temperature of the bearing surface are different. The difference between the first temperature value and the temperature of the bearing surface can be calculated by comparing the two. Moreover, information such as the direction of heat flow and the heat flux can be confirmed according to the difference between the first temperature value and the temperature of the bearing surface. Exemplarily, when comparing the first temperature value of the contact surface with the temperature of the bearing surface and obtaining the result that the first temperature value is greater than the temperature of the bearing surface, the direction of heat flow is along the direction from the cookware to the temperature of the bearing surface. It can be known that the temperature of the object to be measured is still rising, and thus it can be confirmed that the cookware is still in the heating state.

[0106] Determine the temperature of the cookware according to the temperature value of the bearing surface and the gradient between the first temperature value of the contact surface and the temperature value of the bearing surface. Further, it can be determined in accordance with the temperature value of the cookware, where the thermal resistance value R0 of the cookware, the thermal resistance value R1 of the object to be measured, and the heat capacity value C1 of the cookware can all be measured in advance and then transmitted to the processing unit through other devices, or the relevant information can be stored in the processing unit in advance during installation, so as to ensure that the processing unit can accurately calculate the temperature of the cookware and improve the accuracy of the temperature measuring device.

[0107] It can be understood that the calibration of the thermal resistance value and the heat capacity value of the cookware can be carried out according to the mapping relationship between the thermal resistance value and the heat capacity value of the cookware, the temperature of the object to be measured, and the temperature change value of the object to be measured per unit time, so as to improve the detection accuracy of the temperature measuring device for the temperature of the cookware.

[0108] In the temperature measuring method provided in the embodiments of the present application, heat flows between the contact surface and the measurement position. The gradient information between the contact surface and the measurement position can be determined according to the first temperature value and the second temperature value. The temperature information of the object to be measured can be determined according to the gradient information, and thus the effect of cross-media temperature measurement can be achieved. The temperature measuring device can complete the temperature measurement process without directly contacting the object to be measured. It can not only ensure the accuracy of the temperature measuring method but also reduce the difficulty of temperature measurement.

[0109] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A temperature measuring device, characterized in that, The temperature measuring device is used to measure the temperature of an object to be measured. The object to be measured includes an opposite contact surface and a bearing surface. A heat conduction channel is formed on one side of the object to be measured close to the contact surface. The temperature measuring device includes: A first temperature sensor, which is arranged in the heat conduction channel and is used to collect a first temperature value of the contact surface; A second temperature sensor, which is arranged at a measurement position of the heat conduction channel and is used to collect a second temperature value of the measurement position. The measurement position is arranged at an interval from the object to be measured; and A processing unit, which is electrically connected to the first temperature sensor and the second temperature sensor, and is used to determine the temperature of the bearing surface according to the first temperature value and the gradient between the first temperature value and the second temperature value.

2. The temperature measuring device according to claim 1, wherein, The processing unit is used to calculate according to the following formula: Determine the temperature of the bearing surface, where T0 is the temperature value of the bearing surface, T1 is the first temperature value, is the change amount of T1 per unit time, T2 is the second temperature value, R1 is the thermal resistance value of the object to be measured for temperature, R2 is the thermal resistance value of the heat conduction medium between the contact surface and the measurement position, and C1 is the heat capacity value of the object to be measured for temperature.

3. The temperature measuring device according to claim 1, characterized in that, The processing unit is further configured to determine R1 according to the mapping relationship between R1 and T1 and the mapping relationship therebetween determine C1 according to the mapping relationship between C1 and T1 and the mapping relationship therebetween determine R2 according to the mapping relationship between R2 and T2 and the mapping relationship therebetween wherein, is the change amount of T2 per unit time.

4. The temperature measuring device according to claim 1, wherein, The first temperature sensor is an infrared thermal radiation sensor, and the second temperature sensor is a thermistor sensor.

5. The temperature measuring device according to claim 1, characterized in that, The processing unit further includes a heat insulator, which encloses the heat conduction channel. One end of the heat conduction channel is used to contact the contact surface of the object to be measured to introduce heat flow into the heat conduction channel. The heat conduction channel is filled with a heat conduction medium.

6. The temperature measuring device according to claim 5, characterized in that The temperature measuring device further includes a heat conducting member and a sealing member. The heat conducting member is the heat conduction medium arranged between the second temperature sensor and the contact surface. The heat conducting member has an internal cavity. The sealing member is used to seal the internal cavity. The second temperature sensor is arranged in the internal cavity, and the first temperature sensor is arranged outside the internal cavity.

7. The temperature measuring device according to claim 5, characterized in that, The heat conduction medium between the first temperature sensor and the contact surface is air.

8. A cooking appliance, characterized in that, including: An object to be measured, which includes a bearing surface and a contact surface opposite to the bearing surface; and The temperature measuring device according to any one of claims 1-7, wherein one end of the heat conduction channel of the temperature measuring device contacts the contact surface to introduce heat flow into the heat conduction channel.

9. The cooking appliance according to claim 8, characterized in that, The object to be measured includes a heating panel, and the heating panel includes the bearing surface for carrying a cookware and the contact surface. The heat conduction channel abuts against the contact surface to introduce the heat flow on the heating panel into the heat conduction channel.

10. The cooking appliance according to claim 9, wherein The object to be measured further includes a cookware adapted to be carried on the bearing surface.

11. A temperature measurement method, characterized in that, Applied to the cooking appliance according to any one of claims 8-10, the method includes: Obtaining the first temperature value and the second temperature value; Determining gradient information between the contact surface and the measurement position according to the first temperature value and the second temperature value; Determining the temperature of the bearing surface according to the first temperature value and the gradient information.

12. The temperature measurement method according to claim 11, wherein The determining the temperature of the bearing surface according to the gradient information includes: Determining the temperature of the bearing surface according to the following formula: Determine the temperature of the bearing surface, where T0 is the temperature value of the bearing surface, T1 is the first temperature value, is the change amount of T1 per unit time, T2 is the second temperature value, R1 is the thermal resistance value of the object to be measured for temperature, R2 is the thermal resistance value of the heat conduction medium between the contact surface and the measurement position, and C1 is the heat capacity value of the object to be measured for temperature.

13. The temperature measurement method according to claim 12, wherein, Before the determining the temperature of the bearing surface according to the gradient information, the method further includes: According to the mapping relationship between R1 and T1 and determine R1. According to the mapping relationship between C1 and T1 and determine C1. According to the mapping relationship between R2 and T2 and determine R2, where is the change amount of T2 within unit time. determine R2. Determine R2, where is the change amount of T2 within unit time.

14. The temperature measurement method according to claim 12, characterized in that, The method further includes: Determining gradient information between the contact surface and the bearing surface according to the first temperature value and the temperature of the bearing surface; Determine the temperature of the cookware suitable for being borne on the bearing surface according to the temperature value of the bearing surface and the gradient information between the contact surface and the bearing surface.

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