Probe fixing ceramic module for chip testing and manufacturing process thereof

Abstract

The invention relates to the technical field of probe testing, in particular to a probe fixing ceramic module for chip testing and a manufacturing process thereof, and the manufacturing process comprises the steps: thinning a machinable ceramic plate to a specified thickness, and preliminarily positioning the thinned ceramic plate on a clamp table; determining the positioning position of the upper pin module or the lower pin module on the ceramic plate and the trepanning position of each hole site according to a preset standard component; pins are installed at the positioning positions, the ceramic plate is inserted into the pins, and punching machining is conducted on the front face of the ceramic plate; after the front face is machined, the ceramic plate is turned over by 180 degrees in the X-axis direction and inserted into the pins, and cavity digging and microgroove machining are conducted on the back face of the ceramic plate; and cutting the processed upper pin module or lower pin module from the ceramic plate. The probe fixing module specially aiming at the unique structural characteristics of the Kelvin probe in the chip testing process can be designed and manufactured.

Description

Technical Field

[0001] This application relates to the technical field of probe testing, and particularly to a probe fixing ceramic module for chip testing and its manufacturing process. Background Art

[0002] With the continuous development of integrated circuit technology and the advancement of chips towards high density and high performance, the importance of chip testing technology has become increasingly prominent. During the chip production process, the accuracy and stability of testing equipment are directly related to the quality and yield of products. Among them, the probe, as a key contact component in chip testing, its fixing and positioning accuracy has attracted much attention. In recent years, in response to the demand for high-precision testing, various special probes and their fixing modules have emerged continuously. Among them, the Kelvin probe has gradually attracted attention due to its unique electrical characteristics and structural features, and has been widely used in high-precision chip testing scenarios. As Figure 1 shown, the upper end of the Kelvin probe adopts a blade head design, presenting a waist-shaped structure for precise connection with the circuit board of the chip under test; while the lower module is designed as a circle for stable docking with the PCB board. The design of the entire probe has been optimized in adaptation to the integrated chip, aiming to meet the needs of diverse testing platforms and improve the overall testing efficiency and reliability.

[0003] Currently, the existing probe fixing modules are mainly designed according to the structural characteristics of ordinary probes, and their fixing methods and connection modes are based on the single geometric shape of conventional probes. Since these modules are not specifically optimized for the completely different blade heads and round heads at both ends of the probe, it is difficult to meet the special requirements of the Kelvin probe for fixing accuracy and connection stability during chip testing.

[0004] Therefore, how to design and manufacture a probe fixing module specifically for the unique structural characteristics of the Kelvin probe during chip testing has become the main technical problem to be solved urgently at present. Summary of the Invention

[0005] This application provides a probe fixing ceramic module for chip testing and its manufacturing process, which can design and manufacture a probe fixing module specifically for the unique structural characteristics of the Kelvin probe during chip testing. This application provides the following technical solutions:

[0006] In the first aspect, this application provides a probe fixing ceramic module for chip testing, including an upper needle module and a lower needle module;

[0007] A waist-shaped groove is provided on the upper needle module, and a circle of waist-shaped probe holes is provided on the periphery around the opposite side of the waist-shaped groove;

[0008] A waist-shaped groove is also provided on the lower needle module, and a circle of circular probe holes is provided on the periphery around the opposite side of the waist-shaped groove.

[0009] In a specific feasible implementation, a guiding hole is further opened at the center of the surface of the waist-shaped groove of the upper needle module, and two adjusting holes and two locking holes are respectively opened in the directions around the guiding hole.

[0010] In a specific feasible implementation, in the upper needle module, the guiding hole is located at the center point of the connection line of the two locking holes, and the guiding hole is located at the center point of the connection line of the two adjusting holes.

[0011] In a specific feasible implementation, a guiding hole is further opened at the center of the surface of the waist-shaped groove of the lower needle module, and two adjusting holes and two locking holes are respectively opened in the directions around the guiding hole.

[0012] In a specific feasible implementation, in the lower needle module, the guiding hole is located at the center point of the connection line of the two locking holes, and the guiding hole is located at the center point of the connection line of the two adjusting holes.

[0013] In a second aspect, the present application provides a manufacturing process for a probe fixing ceramic module for chip testing, adopting the following technical solution:

[0014] A manufacturing process for a probe fixing ceramic module for chip testing includes:

[0015] Thin the thickness of the machinable ceramic plate to a specified thickness, and drill auxiliary holes in the thinned ceramic plate and preliminarily position it on the fixture table;

[0016] Determine the positioning position of the upper needle module or the lower needle module on the ceramic plate and the drilling positions of each hole according to a preset standard part;

[0017] Install a pin at the positioning position, insert the ceramic plate on the pin and perform grooving processing on the front surface of the ceramic plate;

[0018] After the front surface is processed, turn the ceramic plate over and insert it on the pin, and perform drilling processing on the back surface of the ceramic plate;

[0019] Cut the processed upper needle module or lower needle module from the ceramic plate.

[0020] In a specific feasible implementation, the determining the positioning position of the upper needle module or the lower needle module on the ceramic plate and the opening positions of each hole according to a preset standard part includes:

[0021] After the ceramic plate is thinned and preliminarily positioned, use the preset standard part to determine the accurate position of the upper needle module or the lower needle module on the ceramic plate, and at the same time clarify the opening positions of each probe hole.

[0022] In a specific feasible implementation, the steps of installing pins at the positioning positions, inserting the ceramic plate on the pins, and performing hole machining on the front surface of the ceramic plate include:

[0023] Simultaneously machine four auxiliary holes on the front surface of the ceramic plate to provide auxiliary positioning for the probe holes, and all holes are kept concentric and coaxial.

[0024] To sum up, the beneficial effects of this application at least include:

[0025] (1) This design method of dividing into modules and structures not only effectively solves the limitation that traditional probe fixing modules are only applicable to a single probe geometry, but also realizes stable and efficient fixing and connection of the overall probe during the chip testing process by specifically matching different structures at both ends, significantly improving the test accuracy and system reliability.

[0026] (2) Through precise thinning of the ceramic plate and precise positioning and machining of the front and back surfaces based on preset standard parts, pins, and auxiliary holes, combined with reverse mirror correction and precision cutting, it ensures that the probe holes (waist-shaped and circular) are concentric and coaxial and accurately aligned, thus realizing high-precision machining and stable assembly of the probe fixing ceramic module, effectively adapting to the special structures of the upper blade head and lower round head of the probe in chip testing, and significantly improving the structural integrity and connection reliability of the module.

[0027] By dividing the probe fixing ceramic module into an upper probe module and a lower probe module, aiming at the characteristics of different geometric structures at both ends of the Kelvin probe, a customized fixing scheme is proposed to solve the problem that traditional modules are difficult to meet the fixing requirements of both the blade head and the round head at the same time. The waist-shaped probe hole perfectly matches the waist-shaped structure of the upper blade head of the probe, so as to ensure accurate positioning and stable fixing of the probe when connecting to the circuit board of the chip to be tested. The circular probe hole also enables the round head structure at the lower end of the probe to be firmly and reliably connected to the PCB board.

[0028] The above description is only an overview of the technical solution of this application. In order to be able to more clearly understand the technical means of this application and implement it according to the content of the specification, the following takes the preferred embodiments of this application and describes them in detail in conjunction with the accompanying drawings as follows. Brief Description of the Drawings

[0029] Figure 1 is a schematic structural diagram of the Kelvin probe in the background technology of this application.

[0030] Figure 2 is a schematic overall structural diagram of the upper probe module in the probe fixing ceramic module for chip testing in the embodiment of this application.

[0031] Figure 3It is a schematic diagram of the overall structure of the lower module in the probe fixing ceramic module for chip testing in the embodiments of the present application.

[0032] Figure 4 It is a flowchart of the manufacturing process of the probe fixing ceramic module for chip testing in the embodiments of the present application.

[0033] Reference numerals: 1, fixture table; 2, upper needle module; 21, waist-shaped probe hole; 3, lower needle module; 31, circular probe hole; 4, guide hole; 5, adjustment hole; 6, locking hole. Detailed implementation manners

[0034] The following will further describe in detail the specific implementation manners of the present application in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present application, but are not used to limit the scope of the present application.

[0035] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe in detail the specific implementation manners of the present application in conjunction with the drawings. It can be understood that the specific embodiments described herein are only used to explain the present application, rather than limiting the present application. Additionally, it should be noted that for the sake of description, only parts related to the present application rather than all structures are shown in the drawings. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0036] The terms "including" and "having" and any variations thereof in the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products, or devices.

[0037] Referring to "embodiment" herein means that the specific features, structures, or characteristics described in conjunction with the embodiment can be included in at least one embodiment of the present application. The phrase appears in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0038] The embodiments of the present application disclose a probe fixing ceramic module for chip testing.

[0039] Refer to Figure 2 and Figure 3 , the probe fixing ceramic module for chip testing includes an upper needle module 2 and a lower needle module 3, wherein as Figure 2As shown, a waist-shaped groove is formed on the upper needle module 2, and a circle of waist-shaped probe holes 21 are formed around the top surface of the waist-shaped groove. As Figure 3 shown, a waist-shaped groove is also formed on the lower needle module 3. Different from the upper needle module 2, a circle of circular probe holes 31 are formed around the opposite side of the waist-shaped groove. By dividing the probe fixing ceramic module into the upper needle module 2 and the lower needle module 3, aiming at the characteristics of different geometric structures at both ends of the Kelvin probe, a customized fixing scheme is proposed to solve the problem that the traditional module is difficult to meet the fixing requirements of both the blade head and the round head at the same time. The waist-shaped probe holes 21 are perfectly matched with the waist-shaped structure of the upper end of the probe with a blade head, so as to ensure that the probe can achieve accurate positioning and stable fixing when connecting with the circuit board of the chip to be measured. The circular probe holes 31 also enable the round head structure at the lower end of the probe to be firm and reliable when connecting with the PCB board. This design method of dividing the module and the structure not only effectively solves the limitation that the traditional probe fixing module is only applicable to a single probe geometry, but also realizes the stable and efficient fixing and connection of the whole probe during the chip testing process by specifically matching the different structures at both ends, significantly improving the testing accuracy and system reliability.

[0040] Referring to Figure 2 and Figure 3 , except for the above differences, the structures of the upper needle module 2 and the lower needle module 3 are the same. Therefore, only the upper needle module 2 will be taken as an example for detailed description below. A guiding hole 4 is also formed at the center of the top surface of the waist-shaped groove of the upper needle module 2. Two adjusting holes 5 and two locking holes 6 are respectively formed in the directions around the guiding hole 4. The guiding hole 4 is located at the center point of the connection line of the two locking holes 6 and at the center point of the connection line of the two adjusting holes 5. The guiding hole 4 is used to place the guiding block during the chip testing process, and the locking hole 6 is used to cooperate with the locking bolt to fix the guiding block on the upper needle module 2, and the adjusting hole 5 is used to cooperate with the adjusting bolt to accurately adjust the position of the guiding block after fixing the guiding block.

[0041] The embodiment of the present application also discloses a manufacturing process of a probe fixing ceramic module for chip testing based on the above, and the process is as follows:

[0042] Step S1: Thin the thickness of the machinable ceramic plate to a specified thickness, and preliminarily position the thinned ceramic plate on the fixture table.

[0043] In step S1, first, select a suitable ceramic plate material, and thin the thickness of the ceramic plate to a preset standard thickness by mechanical grinding or other suitable processes. The purpose of this step is to ensure the uniform overall size of the ceramic plate and lay a good foundation for subsequent high-precision processing. Auxiliary holes are drilled in the thinned ceramic plate and are preliminarily fixed on the fixture table 1 through pins, and the pins ensure its flatness and stability for subsequent precision processing.

[0044] Step S2: Determine the positioning positions of the upper needle module or the lower needle module on the ceramic plate and the opening positions of each hole according to the preset standard parts.

[0045] In step S2, after the ceramic plate is thinned and preliminarily positioned, use the preset standard parts to determine the accurate positions of the upper needle module 2 or the lower needle module 3 on the ceramic plate, and at the same time clarify the opening positions of each probe hole. The standard parts provide accurate reference data to ensure that the positions of each hole can fully match the design requirements during the subsequent processing, thereby improving the positioning accuracy and matching degree after product assembly.

[0046] Step S3: Install pins at the positioning positions, insert the ceramic plate on the pins and perform opening processing on the front surface of the ceramic plate.

[0047] In step S3, according to the positioning positions of the upper needle module 2 or the lower needle module 3 determined in step S2, install pins on the ceramic plate to play a role in fixing the ceramic plate and avoid positioning errors caused by vibration or movement during the processing. Subsequently, on the front surface of the ceramic plate, use precision processing methods such as laser and drilling to perform opening corresponding to the preset probe hole positions. After the front surface processing is completed, the formed probe holes can initially meet the requirements of the upper needle module 2 or the lower needle module 3.

[0048] On the front surface of the ceramic plate, not only are the probe holes processed, but also four auxiliary holes are processed at the same time. The purpose of setting the four auxiliary holes is to provide auxiliary positioning for the probe holes to ensure that all holes are concentric and coaxial (that is, the centers and axes of the holes are the same), so that the positioning of the processed probe holes is very accurate.

[0049] Step S4: After the front surface processing, flip the ceramic plate and insert it on the pins, and perform opening processing on the back surface of the ceramic plate.

[0050] In step S4, after the front surface processing is completed, flip the ceramic plate and use the pins for precise positioning again to ensure that it still remains consistent with the initial positioning after flipping. Then, perform opening processing again on the back surface of the ceramic plate according to the preset hole positions. This step ensures that the hole positions on the front and back surfaces can be accurately aligned, so that each connection part can be precisely matched during the final assembly of the module, meeting the precise docking requirements between the probe and the circuit board and the PCB.

[0051] Since the ceramic plate needs to be flipped during the back surface processing, the processed pattern will produce a mirror effect. To solve this problem, after cutting off the mirror image formed by the flipping, through enlarged inspection, it is determined that the center of the probe hole processed on the front surface is consistent with the center of the reference fixed hole on the back surface. This step ensures that the hole positions processed before and after are strictly aligned, thus guaranteeing the structural accuracy and assembly quality of the probe fixing module.

[0052] Step S5: Cut the processed upper needle module or lower needle module from the ceramic plate.

[0053] In step S5, after the hole opening process is completed on both the front and back sides, the processed ceramic plate is cut according to a predetermined contour using laser cutting or precision mechanical cutting technology to separate the independent upper needle module 2 or lower needle module 3. During the cutting process, it is necessary to ensure smooth edges and precise dimensions to ensure the structural integrity of the module and the reliability of subsequent assembly. Finally, the ceramic module obtained through this series of steps can fully meet the high-precision and high-stability requirements for probe fixation during the chip testing process.

[0054] In summary, this manufacturing process ensures the concentricity and precise alignment of the probe holes (waist-shaped and circular) through precise thinning of the ceramic plate, precise positioning processing on both the front and back sides based on preset standard parts, pins, and auxiliary holes, combined with reverse side mirror correction and precision cutting. Thus, it realizes the high-precision processing and stable assembly of the probe fixation ceramic module, effectively adapts to the special structure of the upper blade head and lower round head of the probe in chip testing, and significantly improves the structural integrity and connection reliability of the module.

[0055] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0056] The above embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A probe fixing ceramic module for chip testing, characterized in that: It includes an upper needle module and a lower needle module; The upper needle module is provided with a waist-shaped groove, and a circle of waist-shaped probe holes is provided on the opposite sides of the waist-shaped groove; The lower needle module is also provided with a waist-shaped groove, and a circle of circular probe holes is provided on the four sides opposite to the waist-shaped groove.

2. The probe fixing ceramic module for chip testing according to claim 1, characterized in that: A guide hole is also provided at the center of the waist-shaped groove of the upper needle module, and two adjustment holes and two locking holes are respectively provided in directions around the guide hole.

3. The probe fixing ceramic module for chip testing according to claim 2, characterized in that: In the upper needle module, the guide hole is located at the center point of the line connecting the two locking holes, and the guide hole is located at the center point of the line connecting the two adjusting holes.

4. The probe fixing ceramic module for chip testing according to claim 1, characterized in that: A guide hole is also provided at the center of the waist-shaped groove of the lower needle module, and two adjustment holes and two locking holes are respectively provided in directions around the guide hole.

5. The probe fixing ceramic module for chip testing according to claim 4, characterized in that: In the lower needle module, the guide hole is located at the center point of the line connecting the two locking holes, and the guide hole is located at the center point of the line connecting the two adjusting holes.

6. A manufacturing process for a probe fixing ceramic module for chip testing, characterized in that: include: Thinning the thickness of the machinable ceramic plate to a specified thickness, and preliminarily positioning the thinned ceramic plate on a fixture table; Determine the positioning position of the upper needle module or the lower needle module on the ceramic plate and the opening position of each hole according to the preset standard parts; Install pins at the positioning position, insert the ceramic plate on the pins and perform hole processing on the front side of the ceramic plate; After the front side is processed, the ceramic plate is turned over and inserted on the pins, and the back side of the ceramic plate is processed with holes; The processed upper needle module or lower needle module is cut from the ceramic plate.

7. The manufacturing process of the probe fixing ceramic module for chip testing according to claim 6, characterized in that: The method of determining the positioning position of the upper needle module or the lower needle module on the ceramic plate and the opening position of each hole according to the preset standard parts includes: After the ceramic plate is thinned and preliminarily positioned, the preset standard parts are used to determine the exact position of the upper needle module or the lower needle module on the ceramic plate, and the opening position of each probe hole is also clarified.

8. The manufacturing process of the probe fixing ceramic module for chip testing according to claim 7, characterized in that: The method of installing a pin at a positioning position, inserting a ceramic plate on the pin, and performing hole processing on the front side of the ceramic plate includes: Four auxiliary holes are processed simultaneously on the front side of the ceramic plate to provide auxiliary positioning for the probe hole, and all the holes are kept concentric and coaxial.

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