A micro-through hole quality detection method and system based on data model feedback

Abstract

The present invention discloses a micro-via quality inspection method and system based on data model feedback, which relates to the field of semiconductor inspection technology. The method comprises obtaining micro-via image data, grayscale processing the micro-via image data, and binarizing the processed grayscale image to obtain micro-via binary image data. Based on the micro-via binary image data, two-dimensional binary image data of the micro-via is obtained. The present invention performs a rough inspection of the micro-via using the shortest diameter of the micro-via, thereby improving monitoring efficiency and avoiding waste of resources. The method obtains point cloud spacing information using minimum defect size information and the shortest diameter of the micro-via, thereby achieving dynamic adjustment of point cloud model construction and improving model accuracy. The method further analyzes the micro-via using a micro-via contour curve function, rather than directly comparing the micro-via aperture with the production standard, thereby avoiding misjudgment of the micro-via and improving the efficiency of micro-via quality inspection.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor detection technology, and in particular to a micro-through hole quality detection method and system based on data model feedback. Background Art

[0002] In modern manufacturing, especially in the fields of semiconductors, electronics, aerospace, etc., micro-via processing is extremely critical. Taking semiconductor manufacturing as an example, the micro-vias in the chip are responsible for connecting different circuit layers, and their quality affects signal transmission and chip performance. In electronic equipment in the aerospace field, the quality of micro-vias is related to the reliability and safety of the equipment. With the development of the manufacturing industry, the requirements for the accuracy, efficiency, and degree of automation of micro-via quality inspection are constantly improving. The quality of micro-vias is directly related to the electrical performance and signal transmission quality of the chip after packaging. Therefore, micro-via inspection in advanced packaging has become a vital part of the semiconductor inspection process.

[0003] Currently, there is still a problem in the quality inspection of micro-vias, which is that the quality of micro-vias cannot be accurately assessed based on the scanned images of the micro-vias. When inspecting a large number of micro-vias, the accuracy of the inspection of each micro-via cannot be ensured. If each micro-via is inspected, the inspection efficiency will be low. For example, when the micro-vias are inspected by probe contact, the inspection efficiency is low and the micro-vias may be damaged. There is also no way to further analyze the inspection data and dynamically adjust the inspection settings according to the actual inspection conditions. Summary of the Invention

[0004] In order to solve the above technical problems, a micro-through hole quality detection method and system based on data model feedback are provided. This technical solution solves the problem raised in the above background technology that it is impossible to accurately evaluate the quality of micro-through holes based on the scanned images of the micro-through holes. When a large number of micro-through holes are detected, the accuracy of the detection of each micro-through hole cannot be ensured. If each micro-through hole is detected, the detection efficiency will be low. For example, when the micro-through hole is detected by probe contact, the detection efficiency is low and the micro-through hole may be damaged. It is impossible to further analyze the detection data and it is impossible to dynamically adjust the detection settings according to the actual detection conditions.

[0005] In order to achieve the above objects, the technical solution adopted by the present invention is:

[0006] A micro-through hole quality detection method based on data model feedback, comprising:

[0007] Acquire micro-through-hole image data, wherein the micro-through-hole image data includes micro-through-hole two-dimensional image data and micro-through-hole three-dimensional image data;

[0008] grayscale processing is performed on the micro-through-hole image data, and the processed grayscale image is binarized to obtain micro-through-hole binary image data;

[0009] Acquire two-dimensional binary image data of the micro-through hole according to the binary image data of the micro-through hole, wherein the two-dimensional binary image data of the micro-through hole represents plane data of the micro-through hole, including position information and opening shape information of the micro-through hole;

[0010] According to the two-dimensional binary image data of the micro-through hole, a two-dimensional model of the micro-through hole is obtained based on the point cloud model;

[0011] Determine whether the micro-through-hole diameter meets the production standard based on the two-dimensional micro-through-hole model. If not, the micro-through-hole is unqualified. If so, obtain three-dimensional binary image data of the micro-through-hole based on the binary image data of the micro-through-hole, wherein the three-dimensional binary image data of the micro-through-hole includes an image of the micro-through-hole sidewall.

[0012] According to the three-dimensional binary image data of the micro-through hole, the hole depth and hole wall of the micro-through hole are detected to determine whether the micro-through hole meets the production standard. If not, the micro-through hole is unqualified. If so, the micro-through hole is qualified.

[0013] Preferably, the step of obtaining a two-dimensional micro-through-hole model based on the point cloud model according to the two-dimensional binary image data of the micro-through-hole specifically includes:

[0014] According to the two-dimensional binary image data of the micro-through hole, the contour information of the micro-through hole is obtained based on contour recognition;

[0015] According to the micro-through hole contour information, any two positions in the micro-through hole edge contour are connected to obtain the micro-through hole contour feature line segment;

[0016] Measure the length of the characteristic line segments of the micro-through hole profile, and take the characteristic line segment of the micro-through hole profile with the largest length as the longest diameter of the micro-through hole;

[0017] Taking the longest diameter of the micro-through hole as the reference, the micro-through hole contour characteristic line segment perpendicular to the longest diameter of the micro-through hole and with the shortest length is taken as the shortest diameter of the micro-through hole;

[0018] Based on the micro-via production standard, the micro-via standard diameter and the micro-via diameter difference threshold are obtained;

[0019] Based on the micro-via standard diameter and the micro-via diameter difference threshold, determine whether the shortest diameter of the micro-via meets the production standard. If not, the micro-via is unqualified and marked. If so, obtain minimum defect size information based on the micro-via process technology. The minimum defect size information represents the minimum size of a non-negligible defect in the micro-via;

[0020] Obtain point cloud spacing information based on the minimum defect size information and the shortest diameter of the micro-through hole;

[0021] According to the point cloud spacing information and the two-dimensional binary image data of the micro-through hole, a point cloud model is constructed to obtain a two-dimensional model of the micro-through hole.

[0022] Preferably, obtaining point cloud spacing information based on the minimum defect size information and the shortest diameter of the micro-through hole specifically includes:

[0023] According to the micro-through hole standard diameter and the micro-through hole diameter difference threshold, the maximum tolerance diameter of the micro-through hole and the minimum tolerance diameter of the micro-through hole are obtained;

[0024] The maximum tolerance diameter of the micro-via hole and the standard diameter of the micro-via hole are used as the first diameter threshold of the micro-via hole, and the minimum tolerance diameter of the micro-via hole and the standard diameter of the micro-via hole are used as the second diameter threshold of the micro-via hole;

[0025] According to the minimum defect size information and based on the Nyquist sampling theorem, basic point cloud spacing information is obtained, where the basic point cloud spacing is half of the minimum defect size;

[0026] Obtaining point cloud spacing information according to the first micro-via diameter threshold, the second micro-via diameter threshold, the shortest micro-via diameter, and basic point cloud spacing information;

[0027] If the shortest diameter of the micro-through hole is within the second diameter threshold of the micro-through hole, the basic point cloud spacing is used as the average point cloud spacing when constructing the point cloud model;

[0028] If the shortest diameter of the micro-through hole is within the first diameter threshold of the micro-through hole, the difference between the shortest diameter of the micro-through hole and the standard diameter of the micro-through hole is used as the diameter deviation value;

[0029] The ratio of the diameter deviation value to the standard diameter of the micro-through hole is used as the diameter deviation coefficient;

[0030] According to the diameter deviation coefficient and the basic point cloud spacing, the adjustment point cloud spacing is obtained based on the dynamic reduction coefficient method;

[0031] The adjusted point cloud spacing is used as the average point cloud spacing when constructing the point cloud model;

[0032] The adjustment of the point cloud spacing is specifically as follows:

[0033]

[0034] Where D is the adjusted point cloud spacing, D0 is the basic point cloud spacing, w is the diameter deviation coefficient, d min is the shortest diameter of the micro-through hole, and d0 is the standard diameter of the micro-through hole.

[0035] Preferably, the adjusting the point cloud spacing as the average point cloud spacing when constructing the point cloud model further includes:

[0036] Obtain image resolution information based on the micro-through-hole image data and device parameters;

[0037] According to the image resolution information, the adjusted point cloud spacing is compared with the image resolution to determine whether the adjusted point cloud spacing meets the point cloud model spacing setting standard;

[0038] If the adjusted point cloud spacing is greater than the image resolution, the adjusted point cloud spacing is in accordance with the point cloud model spacing setting standard, and the adjusted point cloud spacing is used as the average point cloud spacing when constructing the point cloud model.

[0039] If the adjusted point cloud spacing is smaller than the image resolution, the adjusted point cloud spacing does not meet the point cloud model spacing setting standard, and the image resolution is used as the average point cloud spacing when constructing the point cloud model.

[0040] Preferably, judging whether the micro-through hole diameter meets the production standard based on the micro-through hole two-dimensional model specifically includes:

[0041] According to the micro-through-hole two-dimensional model, based on the Cartesian coordinate system, the micro-through-hole coordinate data is obtained, wherein the micro-through-hole coordinate data represents the coordinate data of the point located at the edge contour of the micro-through-hole in the micro-through-hole two-dimensional model;

[0042] According to the micro-through hole coordinate data, based on data fitting, a micro-through hole contour curve function is obtained;

[0043] If the longest diameter of the micro-through hole is equal to the shortest diameter of the micro-through hole, then the micro-through hole contour curve function is obtained based on the shortest diameter of the micro-through hole and the circle equation;

[0044] If the longest diameter of the micro-through hole is not equal to the shortest diameter of the micro-through hole, the micro-through hole contour curve function is obtained by fitting the ellipse equation based on the random Hough transform and the least squares method according to the micro-through hole coordinate data;

[0045] According to the micro-through hole profile curve function, the major axis information and the minor axis information of the micro-through hole profile are obtained;

[0046] Based on the micro-through hole production standard, a micro-through hole ellipticity coefficient and an edge roughness threshold are obtained, wherein the micro-through hole ellipticity coefficient represents the maximum major axis / minor axis ratio allowed in micro-through hole production;

[0047] According to the micro-through hole contour major axis information, micro-through hole contour minor axis information and micro-through hole ellipticity coefficient, determine whether the micro-through hole diameter meets the production standard; if the ratio of the micro-through hole contour major axis to the micro-through hole contour minor axis is greater than the micro-through hole ellipticity coefficient, the micro-through hole is unqualified and marked; if the ratio of the micro-through hole contour major axis to the micro-through hole contour minor axis is less than the micro-through hole ellipticity coefficient, obtain the sampling length information based on the micro-through hole edge roughness standard;

[0048] Obtain image resolution information, and based on the image resolution, obtain lateral step information;

[0049] According to the sampling length information and the horizontal step information, the sampling point number information is obtained;

[0050] According to the sampling point number information, the micro-through hole coordinate data is screened to obtain the sampling point coordinate information;

[0051] Based on the polar coordinate system, the sampling point coordinates and the micro-through hole profile curve function are converted to obtain the sampling point polar coordinate information and the micro-through hole profile curve polar coordinate function;

[0052] Taking the polar angle in the polar coordinates of the sampling point as a reference, obtaining the polar coordinate information of the contour point corresponding to the sampling point in the polar coordinate function of the micro-through hole contour curve, wherein the polar angle of the sampling point is the same as that of the contour point;

[0053] The difference between the sampling point coordinates and the contour point polar coordinates is used as the radial deviation value to obtain radial deviation data;

[0054] According to the radial deviation data, the edge roughness of the micro-through hole is obtained;

[0055] Based on the micro-through hole edge roughness and edge roughness threshold, it is judged whether the micro-through hole aperture meets the production standard. If the micro-through hole edge roughness is greater than the edge roughness threshold, the micro-through hole is unqualified and marked. If the micro-through hole edge roughness is less than the edge roughness threshold, the micro-through hole aperture is qualified.

[0056] Preferably, the detecting of the micro-through hole depth and hole wall according to the micro-through hole three-dimensional binary image data specifically includes:

[0057] Acquiring substrate thickness information and substrate roughness information, wherein the substrate thickness information includes thickness information of each layer in the substrate;

[0058] Based on the application requirements of the micro-through hole, the calibrated hole depth information corresponding to each micro-through hole is obtained, where the calibrated hole depth is the thickness of the substrate that the micro-through hole needs to penetrate;

[0059] Obtaining a micro-through hole depth threshold based on the calibrated hole depth information and substrate roughness;

[0060] Obtaining micro-through-hole depth information based on micro-through-hole three-dimensional binary image data;

[0061] According to the micro-via hole depth information and the micro-via hole depth threshold, it is judged whether the micro-via hole depth meets the production standard. If the micro-via hole depth exceeds the micro-via hole depth threshold, the micro-via hole is unqualified and marked. If the micro-via hole depth does not exceed the micro-via hole depth threshold, the micro-via hole depth meets the production standard.

[0062] Obtaining micro-through-hole sidewall taper angle information based on micro-through-hole three-dimensional binary image data;

[0063] Based on the micro-via production standards, obtain the micro-via sidewall taper angle tolerance information;

[0064] Based on the micro-via sidewall taper angle information and the micro-via sidewall taper angle tolerance information, it is determined whether the micro-via sidewall meets the production standard. If the micro-via sidewall taper angle exceeds the micro-via sidewall taper angle tolerance, the micro-via is unqualified and marked. If the micro-via sidewall taper angle does not exceed the micro-via sidewall taper angle tolerance, the micro-via depth meets the production standard.

[0065] Furthermore, a micro-through-hole quality inspection system based on data model feedback is proposed to implement the above-mentioned inspection method, including:

[0066] The main control module is used to determine whether the shortest diameter of the micro-through hole meets the production standard based on the micro-through hole standard diameter and the micro-through hole diameter difference threshold, and to compare the adjusted point cloud spacing with the image resolution according to the image resolution information to determine whether the adjusted point cloud spacing meets the point cloud model spacing setting standard. According to the micro-through hole contour major axis information, micro-through hole contour minor axis information and micro-through hole ellipticity coefficient, it is determined whether the micro-through hole diameter meets the production standard. According to the micro-through hole edge roughness and edge roughness threshold, it is determined whether the micro-through hole diameter meets the production standard. According to the micro-through hole three-dimensional binary image data, the micro-through hole depth and hole wall are detected to determine whether the micro-through hole meets the production standard. According to the micro-through hole coordinate data Based on data fitting, a micro-through-hole contour curve function is obtained. According to the micro-through-hole contour curve function, the long axis information and the short axis information of the micro-through-hole contour are obtained. According to the sampling point number information, the micro-through-hole coordinate data is screened to obtain the sampling point coordinate information. Based on the polar coordinate system, the sampling point coordinates and the micro-through-hole contour curve function are converted to obtain the sampling point polar coordinate information and the micro-through-hole contour curve polar coordinate function. The polar angle in the polar coordinate of the sampling point is used as a reference to obtain the polar coordinate information of the contour point corresponding to the sampling point in the polar coordinate function of the micro-through-hole contour curve. The difference between the sampling point coordinate and the contour point polar coordinate is used as the radial deviation value to obtain the radial deviation data. According to the radial deviation data, the edge roughness of the micro-through-hole is obtained.

[0067] An information acquisition module is configured to acquire micro-through-hole image data, micro-through-hole two-dimensional image data, and micro-through-hole three-dimensional image data, perform grayscale processing on the micro-through-hole image data, and perform binarization conversion on the processed grayscale image to acquire micro-through-hole binary image data; obtain micro-through-hole contour information based on the micro-through-hole two-dimensional binary image data and contour recognition; obtain image resolution information based on the micro-through-hole image data and device parameters; and obtain lateral step information based on the image resolution;

[0068] An image processing module is configured to connect any two positions in the edge contour of the micro-through-hole according to the micro-through-hole contour information to obtain a characteristic line segment of the micro-through-hole contour, obtain the longest diameter and the shortest diameter of the micro-through-hole according to the characteristic line segment of the micro-through-hole contour, obtain point cloud spacing information according to the minimum defect size information and the shortest diameter of the micro-through-hole, construct a point cloud model according to the point cloud spacing information and the two-dimensional binary image data of the micro-through-hole, and obtain a two-dimensional model of the micro-through-hole;

[0069] The display module interacts with the main control module and is used to display the micro-through-hole binary image data, the micro-through-hole two-dimensional model, the micro-through-hole contour curve function and the marking information of the micro-through-hole.

[0070] Optionally, the main control module specifically includes:

[0071] A control unit, the control unit being configured to obtain a micro-through-hole profile curve function based on the micro-through-hole coordinate data and data fitting, obtain micro-through-hole profile major axis information and micro-through-hole profile minor axis information based on the micro-through-hole profile curve function, screen the micro-through-hole coordinate data based on the sampling point number information, obtain sampling point coordinate information, convert the sampling point coordinates and the micro-through-hole profile curve function based on a polar coordinate system, obtain sampling point polar coordinate information and the micro-through-hole profile curve polar coordinate function, obtain contour point polar coordinate information corresponding to the sampling point in the micro-through-hole profile curve polar coordinate function based on the polar angle in the sampling point polar coordinates as a reference, use the difference between the sampling point coordinates and the contour point polar coordinates as a radial deviation value, obtain radial deviation data, and obtain micro-through-hole edge roughness based on the radial deviation data;

[0072] An information receiving unit, which interacts with the information acquisition module and the image processing module to receive data and transmit it to the judgment unit;

[0073] A judgment unit is configured to judge whether the shortest diameter of the micro-through hole meets the production standard based on the micro-through hole standard diameter and the micro-through hole diameter difference threshold, judge whether the adjusted point cloud spacing meets the point cloud model spacing setting standard based on the image resolution information, judge whether the micro-through hole aperture meets the production standard based on the micro-through hole contour major axis information, the micro-through hole contour minor axis information and the micro-through hole ellipticity coefficient, judge whether the micro-through hole aperture meets the production standard based on the micro-through hole edge roughness and the edge roughness threshold, and judge whether the micro-through hole meets the production standard based on the micro-through hole three-dimensional binary image data.

[0074] Optionally, the information acquisition module specifically includes:

[0075] a first acquisition unit, configured to acquire micro-through-hole image data, micro-through-hole two-dimensional image data, and micro-through-hole three-dimensional image data, perform grayscale processing on the micro-through-hole image data, and perform binarization conversion on the processed grayscale image to acquire micro-through-hole binary image data;

[0076] The second acquisition unit is used to obtain micro-through-hole contour information based on contour recognition according to the micro-through-hole two-dimensional binary image data, obtain image resolution information based on the equipment parameters according to the micro-through-hole image data, and obtain lateral step information based on the image resolution.

[0077] Optionally, the image processing module specifically includes:

[0078] An image processing unit is used to connect any two positions in the edge contour of the micro-through-hole according to the micro-through-hole contour information to obtain a characteristic line segment of the micro-through-hole contour, and obtain the longest diameter and the shortest diameter of the micro-through-hole according to the characteristic line segment of the micro-through-hole contour;

[0079] The model construction unit is used to obtain point cloud spacing information based on the minimum defect size information and the shortest diameter of the micro-through hole, and to construct a point cloud model based on the point cloud spacing information and the two-dimensional binary image data of the micro-through hole to obtain a two-dimensional model of the micro-through hole.

[0080] Compared with the prior art, the present invention has the following beneficial effects:

[0081] The present invention proposes a micro-through-hole quality inspection method and system based on data model feedback. The method performs rough inspection of micro-through-holes through the shortest diameter of the micro-through-holes, thereby improving monitoring efficiency and avoiding waste of resources. The method obtains point cloud spacing information through the minimum defect size information and the shortest diameter of the micro-through-holes, realizes dynamic adjustment of point cloud model construction, and improves model accuracy. The method further analyzes the micro-through-holes through the micro-through-hole contour curve function instead of directly comparing the micro-through-hole diameter with the production standard, thereby avoiding misjudgment of the micro-through-holes and improving the efficiency of micro-through-hole quality inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0082] Figure 1 This is a flow chart of a micro-through hole quality detection method based on data model feedback proposed by the present invention;

[0083] Figure 2 A flow chart for obtaining a two-dimensional micro-through hole model in the present invention;

[0084] Figure 3 This is a flowchart for obtaining point cloud spacing information in the present invention;

[0085] Figure 4 This is a flow chart for obtaining the edge roughness of micro-through holes in the present invention;

[0086] Figure 5 This is a structural block diagram of a micro-through-hole quality detection system based on data model feedback proposed by the present invention. DETAILED DESCRIPTION

[0087] The following description is intended to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are merely examples, and those skilled in the art may conceive of other obvious variations.

[0088] Reference Figure 1 - Figure 4 As shown, a micro-through hole quality detection method based on data model feedback in an embodiment of the present invention includes:

[0089] Acquire micro-through-hole image data, wherein the micro-through-hole image data includes micro-through-hole two-dimensional image data and micro-through-hole three-dimensional image data;

[0090] grayscale processing is performed on the micro-through-hole image data, and the processed grayscale image is binarized to obtain micro-through-hole binary image data;

[0091] Acquire two-dimensional binary image data of the micro-through hole according to the binary image data of the micro-through hole, wherein the two-dimensional binary image data of the micro-through hole represents plane data of the micro-through hole, including position information and opening shape information of the micro-through hole;

[0092] According to the two-dimensional binary image data of the micro-through hole, a two-dimensional model of the micro-through hole is obtained based on the point cloud model;

[0093] Specifically, according to the two-dimensional binary image data of the micro-through hole, based on the point cloud model construction, a two-dimensional model of the micro-through hole is obtained, which specifically includes:

[0094] According to the two-dimensional binary image data of the micro-through hole, the contour information of the micro-through hole is obtained based on contour recognition;

[0095] According to the micro-through hole contour information, any two positions in the micro-through hole edge contour are connected to obtain the micro-through hole contour feature line segment;

[0096] Measure the length of the characteristic line segments of the micro-through hole profile, and take the characteristic line segment of the micro-through hole profile with the largest length as the longest diameter of the micro-through hole;

[0097] Taking the longest diameter of the micro-through hole as the reference, the micro-through hole contour characteristic line segment perpendicular to the longest diameter of the micro-through hole and with the shortest length is taken as the shortest diameter of the micro-through hole;

[0098] Based on the micro-via production standard, the micro-via standard diameter and the micro-via diameter difference threshold are obtained;

[0099] Based on the micro-via standard diameter and the micro-via diameter difference threshold, determine whether the shortest diameter of the micro-via meets the production standard. If not, the micro-via is unqualified and marked. If so, obtain minimum defect size information based on the micro-via process technology. The minimum defect size information represents the minimum size of a non-negligible defect in the micro-via;

[0100] Obtain point cloud spacing information based on the minimum defect size information and the shortest diameter of the micro-through hole;

[0101] According to the point cloud spacing information and the two-dimensional binary image data of the micro-through hole, a point cloud model is constructed to obtain a two-dimensional model of the micro-through hole.

[0102] In this solution, the micro-through-hole contour information is obtained based on contour recognition through the two-dimensional binary image data of the micro-through-hole. According to the micro-through-hole contour information, any two positions in the edge contour of the micro-through-hole are connected to obtain the micro-through-hole contour feature line segment. The micro-through-hole contour feature line segment with the longest length is used as the longest diameter of the micro-through-hole. With the longest diameter of the micro-through-hole as the benchmark, the micro-through-hole contour feature line segment perpendicular to the longest diameter of the micro-through-hole and with the shortest length is used as the shortest diameter of the micro-through-hole. According to the micro-through-hole standard diameter and the micro-through-hole diameter difference threshold, it is judged whether the shortest diameter of the micro-through-hole meets the production standard. If not, the micro-through-hole is unqualified and marked. If so, the minimum defect size information is obtained based on the micro-through-hole process technology. According to the minimum defect size information and the shortest diameter of the micro-through-hole, the point cloud spacing information is obtained; according to the point cloud spacing information and the two-dimensional binary image data of the micro-through-hole, a point cloud model is constructed to obtain a two-dimensional model of the micro-through-hole;

[0103] It is understandable that the aperture of microvias is often directly related to the electrical performance and signal transmission quality of the chip after packaging. Therefore, the detection of microvia aperture is the top priority of microvia quality detection. By comparing the standard diameter of the microvia and the microvia diameter difference threshold, the microvia aperture quality can be quickly judged, avoiding the subsequent precise detection steps of the microvia, saving resources and improving detection efficiency.

[0104] It should be noted that, in this embodiment, the microvia aperture threshold is set according to the application scenario of the microvia, and the standard diameter of the microvia takes the middle value of the threshold range. For example, for TSV (through silicon via), the front-end process (FEOL) TSV: the diameter is usually 2-4μm, mainly used in high-density interconnection scenarios (such as 3DIC integration), the back-end process (BEOL) TSV: the diameter range is 5-20μm, and the standard diameter for TGV (through glass via) is 10-100μm.

[0105] Specifically, based on the minimum defect size information and the shortest diameter of the micro-via, the point cloud spacing information is obtained, including:

[0106] According to the micro-through hole standard diameter and the micro-through hole diameter difference threshold, the maximum tolerance diameter of the micro-through hole and the minimum tolerance diameter of the micro-through hole are obtained;

[0107] The maximum tolerance diameter of the micro-via hole and the standard diameter of the micro-via hole are used as the first diameter threshold of the micro-via hole, and the minimum tolerance diameter of the micro-via hole and the standard diameter of the micro-via hole are used as the second diameter threshold of the micro-via hole;

[0108] According to the minimum defect size information and based on the Nyquist sampling theorem, basic point cloud spacing information is obtained, where the basic point cloud spacing is half of the minimum defect size;

[0109] Obtaining point cloud spacing information according to the first micro-via diameter threshold, the second micro-via diameter threshold, the shortest micro-via diameter, and basic point cloud spacing information;

[0110] If the shortest diameter of the micro-through hole is within the second diameter threshold of the micro-through hole, the basic point cloud spacing is used as the average point cloud spacing when constructing the point cloud model;

[0111] If the shortest diameter of the micro-through hole is within the first diameter threshold of the micro-through hole, the difference between the shortest diameter of the micro-through hole and the standard diameter of the micro-through hole is used as the diameter deviation value;

[0112] The ratio of the diameter deviation value to the standard diameter of the micro-through hole is used as the diameter deviation coefficient;

[0113] According to the diameter deviation coefficient and the basic point cloud spacing, the adjustment point cloud spacing is obtained based on the dynamic reduction coefficient method;

[0114] The adjusted point cloud spacing is used as the average point cloud spacing when constructing the point cloud model;

[0115] The adjustment of the point cloud spacing is specifically as follows:

[0116]

[0117] Where D is the adjusted point cloud spacing, D0 is the basic point cloud spacing, w is the diameter deviation coefficient, d min is the shortest diameter of the micro-through hole, and d0 is the standard diameter of the micro-through hole.

[0118] In this solution, the maximum tolerance diameter of the micro-through hole and the standard diameter of the micro-through hole are used as the first diameter threshold of the micro-through hole, and the minimum tolerance diameter of the micro-through hole and the standard diameter of the micro-through hole are used as the second diameter threshold of the micro-through hole. According to the minimum defect size information and based on the Nyquist sampling theorem, the basic point cloud spacing information is obtained. According to the first diameter threshold of the micro-through hole, the second diameter threshold of the micro-through hole, the shortest diameter of the micro-through hole and the basic point cloud spacing information, the point cloud spacing information is obtained.

[0119] It can be understood that in advanced packaging technology, the standard diameter of microvias (such as TSV and TGV) and their diameter difference threshold (i.e., the tolerance range allowed by the process) are key parameters affecting interconnection density and reliability. In this solution, the minimum tolerance diameter of the microvia and the standard diameter of the microvia are used as the second diameter threshold of the microvia, that is, the allowable range of diameters lower than the standard diameter is used as the second diameter threshold of the microvia (negative tolerance range), and the maximum tolerance diameter of the microvia and the standard diameter of the microvia are used as the first diameter threshold of the microvia, that is, the allowable range of diameters higher than the standard diameter is used as the first diameter threshold of the microvia (positive tolerance range). If the diameter of the microvia is in the negative tolerance range, Then defects such as burrs may appear. Therefore, half of the minimum defect size (such as the minimum burr height that cannot be ignored, etc.) and the basic point cloud spacing are used as the average point cloud spacing when constructing the point cloud model, ensuring that the model can accurately reflect the actual condition of the micro-via. If the micro-via diameter is within the positive tolerance range, insufficient solder filling (void risk), hole wall stress concentration (crack tendency), and local expansion deformation (abnormal ellipticity) may occur. At this time, in order to ensure the accuracy of the model, the point cloud spacing needs to be further adjusted. Therefore, in this scheme, the dynamic reduction coefficient method is used to adjust the point cloud spacing according to the deviation between the shortest diameter of the micro-via and the standard diameter of the micro-via.

[0120] Specifically, adjusting the point cloud spacing as the average point cloud spacing when building the point cloud model also includes:

[0121] Obtain image resolution information based on the micro-through-hole image data and device parameters;

[0122] According to the image resolution information, the adjusted point cloud spacing is compared with the image resolution to determine whether the adjusted point cloud spacing meets the point cloud model spacing setting standard;

[0123] If the adjusted point cloud spacing is greater than the image resolution, the adjusted point cloud spacing is in accordance with the point cloud model spacing setting standard, and the adjusted point cloud spacing is used as the average point cloud spacing when constructing the point cloud model.

[0124] If the adjusted point cloud spacing is smaller than the image resolution, the adjusted point cloud spacing does not meet the point cloud model spacing setting standard, and the image resolution is used as the average point cloud spacing when constructing the point cloud model.

[0125] In this solution, by comparing the adjusted point cloud spacing with the image resolution, it is determined whether the adjusted point cloud spacing meets the point cloud model spacing setting standard. It can be understood that the setting of the point cloud spacing affects the accuracy of the point cloud model. However, if the adjusted point cloud spacing is smaller than the image resolution, it is impossible to obtain the accurate position relationship of adjacent points in the point cloud model based on the image, and it is impossible to determine the exact position of each point in the point cloud model. Therefore, it is necessary to detect the point cloud spacing to determine whether it meets actual needs.

[0126] Determine whether the micro-through-hole diameter meets the production standard based on the two-dimensional micro-through-hole model. If not, the micro-through-hole is unqualified. If so, obtain three-dimensional binary image data of the micro-through-hole based on the binary image data of the micro-through-hole, wherein the three-dimensional binary image data of the micro-through-hole includes an image of the micro-through-hole sidewall.

[0127] Specifically, based on the two-dimensional model of the micro-through hole, determine whether the micro-through hole diameter meets the production standards, including:

[0128] According to the micro-through-hole two-dimensional model, based on the Cartesian coordinate system, the micro-through-hole coordinate data is obtained, wherein the micro-through-hole coordinate data represents the coordinate data of the point located at the edge contour of the micro-through-hole in the micro-through-hole two-dimensional model;

[0129] According to the micro-through hole coordinate data, based on data fitting, a micro-through hole contour curve function is obtained;

[0130] If the longest diameter of the micro-through hole is equal to the shortest diameter of the micro-through hole, then the micro-through hole contour curve function is obtained based on the shortest diameter of the micro-through hole and the circle equation;

[0131] If the longest diameter of the micro-through hole is not equal to the shortest diameter of the micro-through hole, the micro-through hole contour curve function is obtained by fitting the ellipse equation based on the random Hough transform and the least squares method according to the micro-through hole coordinate data;

[0132] According to the micro-through hole profile curve function, the major axis information and the minor axis information of the micro-through hole profile are obtained;

[0133] Based on the micro-through hole production standard, a micro-through hole ellipticity coefficient and an edge roughness threshold are obtained, wherein the micro-through hole ellipticity coefficient represents the maximum major axis / minor axis ratio allowed in micro-through hole production;

[0134] According to the micro-through hole contour major axis information, micro-through hole contour minor axis information and micro-through hole ellipticity coefficient, determine whether the micro-through hole diameter meets the production standard; if the ratio of the micro-through hole contour major axis to the micro-through hole contour minor axis is greater than the micro-through hole ellipticity coefficient, the micro-through hole is unqualified and marked; if the ratio of the micro-through hole contour major axis to the micro-through hole contour minor axis is less than the micro-through hole ellipticity coefficient, obtain the sampling length information based on the micro-through hole edge roughness standard;

[0135] Obtain image resolution information, and based on the image resolution, obtain lateral step information;

[0136] According to the sampling length information and the horizontal step information, the sampling point number information is obtained;

[0137] According to the sampling point number information, the micro-through hole coordinate data is screened to obtain the sampling point coordinate information;

[0138] Based on the polar coordinate system, the sampling point coordinates and the micro-through hole profile curve function are converted to obtain the sampling point polar coordinate information and the micro-through hole profile curve polar coordinate function;

[0139] Taking the polar angle in the polar coordinates of the sampling point as a reference, obtaining the polar coordinate information of the contour point corresponding to the sampling point in the polar coordinate function of the micro-through hole contour curve, wherein the polar angle of the sampling point is the same as that of the contour point;

[0140] The difference between the sampling point coordinates and the contour point polar coordinates is used as the radial deviation value to obtain radial deviation data;

[0141] According to the radial deviation data, the edge roughness of the micro-through hole is obtained;

[0142] Based on the micro-through hole edge roughness and edge roughness threshold, it is judged whether the micro-through hole aperture meets the production standard. If the micro-through hole edge roughness is greater than the edge roughness threshold, the micro-through hole is unqualified and marked. If the micro-through hole edge roughness is less than the edge roughness threshold, the micro-through hole aperture is qualified.

[0143] In this scheme, based on the micro-through-hole coordinate data and data fitting, the micro-through-hole contour curve function is obtained. According to the micro-through-hole contour major axis information, micro-through-hole contour minor axis information and micro-through-hole ellipticity coefficient, it is judged whether the micro-through-hole aperture meets the production standard. If not, the micro-through-hole is marked as unqualified. If it meets the standard, the roughness of the micro-through-hole edge is further tested.

[0144] It is understandable that in micro-via opening design, the standard opening is usually defined as a circle, which is based on the following process requirements:

[0145] Electroplating uniformity: Circular openings ensure uniform flow of the plating solution, avoiding voids or stress concentration during copper filling (for example, in AMD graphics card TSV redundancy design, the shape of the through-hole directly affects the electroplating reliability)

[0146] Signal integrity: Regular openings reduce electromagnetic field distortion, especially in high-speed signal transmission (such as HBM memory), where aperture deviations exceeding ±2μm may cause impedance mismatch.

[0147] However, in the actual production process, microvia openings will inevitably produce certain changes, such as oval shapes. Therefore, in actual microvia quality inspection, microvias with non-circular openings are not directly marked as unqualified. For example, in TSMC CoWoS packaging, the interposer TSV allows for slight oval shapes, but needs to be dynamically monitored through optical profilometers + SPC statistical control. Therefore, in this embodiment, the microvia ellipticity coefficient and edge roughness threshold are set according to the microvia application requirements, for example:

[0148]

[0149] It should be noted that in this embodiment, 0.08 mm is selected as the sampling length based on the parameters recommended by the ISO 1997 standard. For image acquisition equipment, the lateral step distance represents the minimum distance at which features can be identified in the image captured by the device, that is, the definition of resolution. If the distance is smaller than this, the image features cannot be identified. Therefore, the ratio of the sampling length to the lateral step distance is used as the number of sampling points, which complies with the national production standard ISO 1997.

[0150] In this embodiment, if the longest diameter of the micro-through hole is equal to the shortest diameter of the micro-through hole, the micro-through hole is circular, and the data is fitted according to the conventional circular function expression to obtain the micro-through hole contour curve function. If the longest diameter of the micro-through hole is not equal to the shortest diameter of the micro-through hole, the micro-through hole is elliptical, and the data is fitted based on the elliptical equation to obtain the micro-through hole contour curve function.

[0151] According to the three-dimensional binary image data of the micro-through hole, the hole depth and hole wall of the micro-through hole are detected to determine whether the micro-through hole meets the production standard. If not, the micro-through hole is unqualified. If so, the micro-through hole is qualified.

[0152] Specifically, based on the three-dimensional binary image data of the micro-through hole, the hole depth and hole wall are detected, including:

[0153] Acquiring substrate thickness information and substrate roughness information, wherein the substrate thickness information includes thickness information of each layer in the substrate;

[0154] Based on the application requirements of the micro-through hole, the calibrated hole depth information corresponding to each micro-through hole is obtained, where the calibrated hole depth is the thickness of the substrate that the micro-through hole needs to penetrate;

[0155] Obtaining a micro-through hole depth threshold based on the calibrated hole depth information and substrate roughness;

[0156] Obtaining micro-through-hole depth information based on micro-through-hole three-dimensional binary image data;

[0157] According to the micro-via hole depth information and the micro-via hole depth threshold, it is judged whether the micro-via hole depth meets the production standard. If the micro-via hole depth exceeds the micro-via hole depth threshold, the micro-via hole is unqualified and marked. If the micro-via hole depth does not exceed the micro-via hole depth threshold, the micro-via hole depth meets the production standard.

[0158] Obtaining micro-through-hole sidewall taper angle information based on micro-through-hole three-dimensional binary image data;

[0159] Based on the micro-via production standards, obtain the micro-via sidewall taper angle tolerance information;

[0160] Based on the micro-via sidewall taper angle information and the micro-via sidewall taper angle tolerance information, it is determined whether the micro-via sidewall meets the production standard. If the micro-via sidewall taper angle exceeds the micro-via sidewall taper angle tolerance, the micro-via is unqualified and marked. If the micro-via sidewall taper angle does not exceed the micro-via sidewall taper angle tolerance, the micro-via depth meets the production standard.

[0161] In this solution, based on the three-dimensional binary image data of the micro-via hole, the micro-via hole depth information is obtained. According to the micro-via hole depth information and the micro-via hole depth threshold, it is judged whether the micro-via hole depth meets the production standard. According to the three-dimensional binary image data of the micro-via hole, the micro-via hole sidewall taper angle information is obtained. According to the micro-via hole sidewall taper angle information and the micro-via hole sidewall taper angle tolerance information, it is judged whether the micro-via hole sidewall meets the production standard.

[0162] It's no secret that microvia diameter directly impacts interconnect density, signal transmission performance, and mechanical strength. For example, in TSMC's CoWoS technology, the aperture accuracy of microbumps (μBmps) and through-silicon vias (TSVs) determines the interconnect density and electrical performance of the chip stack.1 Excessive aperture deviation can lead to signal delays, short circuits, or mechanical stress concentration.6 Therefore, detailed aperture inspection is a key step in ensuring package reliability. Regarding hole depth and wall inspection, in mature processes, laser drilling (such as CO2 lasers or UV / YAG lasers) generally provides relatively stable depth control.10 The probability of hole depth deviation is low. Hole wall roughness may affect electroplating fill quality, but process optimization (such as chemical cleaning and plating solution parameter control) can significantly reduce the rejection rate.14 Under stable processes, simple spot checks can cover risks. Aperture accuracy generally reflects the stability of process equipment (such as the focusing accuracy and parameter control of the laser drilling machine). If the aperture meets the standard, it indicates stable equipment operation, indirectly indicating a high degree of consistency in hole depth and wall thickness.10

[0163] For example, in Intel's glass substrate technology, strict control of the TGV (through glass via) aperture is achieved at a 75μm pitch, and its process stability also ensures a pass rate of 2 for hole depth and hole wall. Therefore, in this solution, when the micro-through hole aperture inspection is qualified, only the hole depth and hole wall cone angle are used to inspect the micro-through hole depth and hole wall, which improves the inspection efficiency while ensuring the accuracy of the inspection.

[0164] In this embodiment, the product of the calibrated hole depth and the substrate roughness is used as the allowable hole depth deviation, and the micro-through hole depth threshold is set according to the hole depth deviation, specifically:

[0165]

[0166] Where T1 and T2 are the micro-through hole depth thresholds, T0 is the calibration hole depth, and Q is the roughness;

[0167] If the micro-through hole depth T∈[T1, T2], then the hole depth of the micro-through hole meets the production standard.

[0168] The micro-via sidewall taper angle tolerance needs to be set according to the micro-via production process. The micro-via sidewall taper angle tolerance in different application scenarios is also different. For example:

[0169]

[0170] Reference Figure 5 As shown, further, combined with the above-mentioned micro-through hole quality detection method based on data model feedback, a micro-through hole quality detection system based on data model feedback is proposed, including:

[0171] The main control module is used to determine whether the shortest diameter of the micro-through hole meets the production standard based on the micro-through hole standard diameter and the micro-through hole diameter difference threshold, and to compare the adjusted point cloud spacing with the image resolution according to the image resolution information to determine whether the adjusted point cloud spacing meets the point cloud model spacing setting standard. According to the micro-through hole contour major axis information, micro-through hole contour minor axis information and micro-through hole ellipticity coefficient, it is determined whether the micro-through hole diameter meets the production standard. According to the micro-through hole edge roughness and edge roughness threshold, it is determined whether the micro-through hole diameter meets the production standard. According to the micro-through hole three-dimensional binary image data, the micro-through hole depth and hole wall are detected to determine whether the micro-through hole meets the production standard. According to the micro-through hole coordinate data Based on data fitting, a micro-through-hole contour curve function is obtained. According to the micro-through-hole contour curve function, the long axis information and the short axis information of the micro-through-hole contour are obtained. According to the sampling point number information, the micro-through-hole coordinate data is screened to obtain the sampling point coordinate information. Based on the polar coordinate system, the sampling point coordinates and the micro-through-hole contour curve function are converted to obtain the sampling point polar coordinate information and the micro-through-hole contour curve polar coordinate function. The polar angle in the polar coordinate of the sampling point is used as a reference to obtain the polar coordinate information of the contour point corresponding to the sampling point in the polar coordinate function of the micro-through-hole contour curve. The difference between the sampling point coordinate and the contour point polar coordinate is used as the radial deviation value to obtain the radial deviation data. According to the radial deviation data, the edge roughness of the micro-through-hole is obtained.

[0172] An information acquisition module is configured to acquire micro-through-hole image data, micro-through-hole two-dimensional image data, and micro-through-hole three-dimensional image data, perform grayscale processing on the micro-through-hole image data, and perform binarization conversion on the processed grayscale image to acquire micro-through-hole binary image data; obtain micro-through-hole contour information based on the micro-through-hole two-dimensional binary image data and contour recognition; obtain image resolution information based on the micro-through-hole image data and device parameters; and obtain lateral step information based on the image resolution;

[0173] An image processing module is configured to connect any two positions in the edge contour of the micro-through-hole according to the micro-through-hole contour information to obtain a characteristic line segment of the micro-through-hole contour, obtain the longest diameter and the shortest diameter of the micro-through-hole according to the characteristic line segment of the micro-through-hole contour, obtain point cloud spacing information according to the minimum defect size information and the shortest diameter of the micro-through-hole, construct a point cloud model according to the point cloud spacing information and the two-dimensional binary image data of the micro-through-hole, and obtain a two-dimensional model of the micro-through-hole;

[0174] The display module interacts with the main control module and is used to display the micro-through-hole binary image data, the micro-through-hole two-dimensional model, the micro-through-hole contour curve function and the marking information of the micro-through-hole.

[0175] Main control module, specifically including:

[0176] A control unit, the control unit being configured to obtain a micro-through-hole profile curve function based on the micro-through-hole coordinate data and data fitting, obtain micro-through-hole profile major axis information and micro-through-hole profile minor axis information based on the micro-through-hole profile curve function, screen the micro-through-hole coordinate data based on the sampling point number information, obtain sampling point coordinate information, convert the sampling point coordinates and the micro-through-hole profile curve function based on a polar coordinate system, obtain sampling point polar coordinate information and the micro-through-hole profile curve polar coordinate function, obtain contour point polar coordinate information corresponding to the sampling point in the micro-through-hole profile curve polar coordinate function based on the polar angle in the sampling point polar coordinates as a reference, use the difference between the sampling point coordinates and the contour point polar coordinates as a radial deviation value, obtain radial deviation data, and obtain micro-through-hole edge roughness based on the radial deviation data;

[0177] An information receiving unit, which interacts with the information acquisition module and the image processing module to receive data and transmit it to the judgment unit;

[0178] A judgment unit is configured to judge whether the shortest diameter of the micro-through hole meets the production standard based on the micro-through hole standard diameter and the micro-through hole diameter difference threshold, judge whether the adjusted point cloud spacing meets the point cloud model spacing setting standard based on the image resolution information, judge whether the micro-through hole aperture meets the production standard based on the micro-through hole contour major axis information, the micro-through hole contour minor axis information and the micro-through hole ellipticity coefficient, judge whether the micro-through hole aperture meets the production standard based on the micro-through hole edge roughness and the edge roughness threshold, and judge whether the micro-through hole meets the production standard based on the micro-through hole three-dimensional binary image data.

[0179] Information acquisition module, specifically including:

[0180] a first acquisition unit, configured to acquire micro-through-hole image data, micro-through-hole two-dimensional image data, and micro-through-hole three-dimensional image data, perform grayscale processing on the micro-through-hole image data, and perform binarization conversion on the processed grayscale image to acquire micro-through-hole binary image data;

[0181] The second acquisition unit is used to obtain micro-through-hole contour information based on contour recognition according to the micro-through-hole two-dimensional binary image data, obtain image resolution information based on the equipment parameters according to the micro-through-hole image data, and obtain lateral step information based on the image resolution.

[0182] Image processing module, specifically including:

[0183] An image processing unit is used to connect any two positions in the edge contour of the micro-through-hole according to the micro-through-hole contour information to obtain a characteristic line segment of the micro-through-hole contour, and obtain the longest diameter and the shortest diameter of the micro-through-hole according to the characteristic line segment of the micro-through-hole contour;

[0184] The model construction unit is used to obtain point cloud spacing information based on the minimum defect size information and the shortest diameter of the micro-through hole, and to construct a point cloud model based on the point cloud spacing information and the two-dimensional binary image data of the micro-through hole to obtain a two-dimensional model of the micro-through hole.

[0185] In summary, the advantages of the present invention are: the micro-through-hole is roughly detected by the shortest diameter of the micro-through-hole, which improves the monitoring efficiency and avoids the waste of resources; the point cloud spacing information is obtained by the minimum defect size information and the shortest diameter of the micro-through-hole, which realizes the dynamic adjustment of the point cloud model construction and improves the accuracy of the model; the micro-through-hole contour is fitted to obtain the micro-through-hole contour curve function, and the micro-through-hole is further analyzed by the micro-through-hole contour curve function, instead of directly comparing the micro-through-hole aperture with the production standard, thereby avoiding the misjudgment of the micro-through-hole and improving the efficiency of micro-through-hole quality detection.

[0186] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions merely illustrate the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A micro-through hole quality detection method based on data model feedback, characterized in that: include: Acquire micro-through-hole image data, wherein the micro-through-hole image data includes micro-through-hole two-dimensional image data and micro-through-hole three-dimensional image data; grayscale processing is performed on the micro-through-hole image data, and the processed grayscale image is binarized to obtain micro-through-hole binary image data; Acquire two-dimensional binary image data of the micro-through hole according to the binary image data of the micro-through hole, wherein the two-dimensional binary image data of the micro-through hole represents plane data of the micro-through hole, including position information and opening shape information of the micro-through hole; According to the two-dimensional binary image data of the micro-through hole, a two-dimensional model of the micro-through hole is obtained based on the point cloud model; Determine whether the micro-through-hole diameter meets the production standard based on the two-dimensional micro-through-hole model. If not, the micro-through-hole is unqualified. If so, obtain three-dimensional binary image data of the micro-through-hole based on the binary image data of the micro-through-hole, wherein the three-dimensional binary image data of the micro-through-hole includes an image of the micro-through-hole sidewall. According to the three-dimensional binary image data of the micro-through hole, the hole depth and hole wall of the micro-through hole are inspected to determine whether the micro-through hole meets the production standard. If not, the micro-through hole is unqualified; if so, the micro-through hole is qualified; The method of obtaining a two-dimensional micro-through-hole model based on the point cloud model according to the two-dimensional binary image data of the micro-through-hole specifically includes: According to the two-dimensional binary image data of the micro-through hole, the contour information of the micro-through hole is obtained based on contour recognition; According to the micro-through hole contour information, any two positions in the micro-through hole edge contour are connected to obtain the micro-through hole contour feature line segment; Measure the length of the characteristic line segments of the micro-through hole profile, and take the characteristic line segment of the micro-through hole profile with the largest length as the longest diameter of the micro-through hole; Taking the longest diameter of the micro-through hole as the reference, the micro-through hole contour characteristic line segment perpendicular to the longest diameter of the micro-through hole and with the shortest length is taken as the shortest diameter of the micro-through hole; Based on the micro-via production standard, the micro-via standard diameter and the micro-via diameter difference threshold are obtained; Based on the micro-via standard diameter and the micro-via diameter difference threshold, determine whether the shortest diameter of the micro-via meets the production standard. If not, the micro-via is unqualified and marked. If so, obtain minimum defect size information based on the micro-via process technology. The minimum defect size information represents the minimum size of a non-negligible defect in the micro-via; Obtain point cloud spacing information based on the minimum defect size information and the shortest diameter of the micro-through hole; According to the point cloud spacing information and the two-dimensional binary image data of the micro-through hole, a point cloud model is constructed to obtain a two-dimensional model of the micro-through hole.

2. A micro-through hole quality detection method based on data model feedback according to claim 1, characterized in that: The step of obtaining point cloud spacing information based on the minimum defect size information and the shortest diameter of the micro-through hole specifically includes: According to the micro-through hole standard diameter and the micro-through hole diameter difference threshold, the maximum tolerance diameter of the micro-through hole and the minimum tolerance diameter of the micro-through hole are obtained; The maximum tolerance diameter of the micro-via hole and the standard diameter of the micro-via hole are used as the first diameter threshold of the micro-via hole, and the minimum tolerance diameter of the micro-via hole and the standard diameter of the micro-via hole are used as the second diameter threshold of the micro-via hole; According to the minimum defect size information and based on the Nyquist sampling theorem, basic point cloud spacing information is obtained, where the basic point cloud spacing is half of the minimum defect size; Obtaining point cloud spacing information according to the first micro-via diameter threshold, the second micro-via diameter threshold, the shortest micro-via diameter, and basic point cloud spacing information; If the shortest diameter of the micro-through hole is within the second diameter threshold of the micro-through hole, the basic point cloud spacing is used as the average point cloud spacing when constructing the point cloud model; If the shortest diameter of the micro-through hole is within the first diameter threshold of the micro-through hole, the difference between the shortest diameter of the micro-through hole and the standard diameter of the micro-through hole is used as the diameter deviation value; The ratio of the diameter deviation value to the standard diameter of the micro-through hole is used as the diameter deviation coefficient; According to the diameter deviation coefficient and the basic point cloud spacing, the adjustment point cloud spacing is obtained based on the dynamic reduction coefficient method; The adjusted point cloud spacing is used as the average point cloud spacing when constructing the point cloud model; The adjustment of the point cloud spacing is specifically as follows: Where D is the distance between the adjusted point clouds, is the basic point cloud spacing, is the diameter deviation coefficient, is the shortest diameter of the micro-through hole, It is the standard diameter of micro through hole.

3. A micro-through hole quality detection method based on data model feedback according to claim 2, characterized in that: The adjusting the point cloud spacing as the average point cloud spacing when constructing the point cloud model further includes: Obtain image resolution information based on the micro-through-hole image data and device parameters; According to the image resolution information, the adjusted point cloud spacing is compared with the image resolution to determine whether the adjusted point cloud spacing meets the point cloud model spacing setting standard; If the adjusted point cloud spacing is greater than the image resolution, the adjusted point cloud spacing is in accordance with the point cloud model spacing setting standard, and the adjusted point cloud spacing is used as the average point cloud spacing when constructing the point cloud model. If the adjusted point cloud spacing is smaller than the image resolution, the adjusted point cloud spacing does not meet the point cloud model spacing setting standard, and the image resolution is used as the average point cloud spacing when constructing the point cloud model.

4. The micro-through hole quality detection method based on data model feedback according to claim 1, characterized in that: The determining whether the micro-through hole diameter meets the production standard based on the micro-through hole two-dimensional model specifically includes: According to the micro-through-hole two-dimensional model, based on the Cartesian coordinate system, the micro-through-hole coordinate data is obtained, wherein the micro-through-hole coordinate data represents the coordinate data of the point located at the edge contour of the micro-through-hole in the micro-through-hole two-dimensional model; According to the micro-through hole coordinate data, based on data fitting, a micro-through hole contour curve function is obtained; If the longest diameter of the micro-through hole is equal to the shortest diameter of the micro-through hole, then the micro-through hole contour curve function is obtained based on the shortest diameter of the micro-through hole and the circle equation; If the longest diameter of the micro-through hole is not equal to the shortest diameter of the micro-through hole, the micro-through hole contour curve function is obtained by fitting the ellipse equation based on the random Hough transform and the least squares method according to the micro-through hole coordinate data; According to the micro-through hole profile curve function, the major axis information and the minor axis information of the micro-through hole profile are obtained; Based on the micro-through hole production standard, a micro-through hole ellipticity coefficient and an edge roughness threshold are obtained, wherein the micro-through hole ellipticity coefficient represents the maximum major axis / minor axis ratio allowed in micro-through hole production; According to the micro-through hole contour major axis information, micro-through hole contour minor axis information and micro-through hole ellipticity coefficient, determine whether the micro-through hole diameter meets the production standard; if the ratio of the micro-through hole contour major axis to the micro-through hole contour minor axis is greater than the micro-through hole ellipticity coefficient, the micro-through hole is unqualified and marked; if the ratio of the micro-through hole contour major axis to the micro-through hole contour minor axis is less than the micro-through hole ellipticity coefficient, obtain the sampling length information based on the micro-through hole edge roughness standard; Obtain image resolution information, and based on the image resolution, obtain lateral step information; According to the sampling length information and the horizontal step information, the sampling point number information is obtained; According to the sampling point number information, the micro-through hole coordinate data is screened to obtain the sampling point coordinate information; Based on the polar coordinate system, the sampling point coordinates and the micro-through hole profile curve function are converted to obtain the sampling point polar coordinate information and the micro-through hole profile curve polar coordinate function; Taking the polar angle in the polar coordinates of the sampling point as a reference, obtaining the polar coordinate information of the contour point corresponding to the sampling point in the polar coordinate function of the micro-through hole contour curve, wherein the polar angle of the sampling point is the same as that of the contour point; The difference between the sampling point coordinates and the contour point polar coordinates is used as the radial deviation value to obtain radial deviation data; According to the radial deviation data, the edge roughness of the micro-through hole is obtained; Based on the micro-through hole edge roughness and edge roughness threshold, it is judged whether the micro-through hole aperture meets the production standard. If the micro-through hole edge roughness is greater than the edge roughness threshold, the micro-through hole is unqualified and marked. If the micro-through hole edge roughness is less than the edge roughness threshold, the micro-through hole aperture is qualified.

5. The micro-through hole quality detection method based on data model feedback according to claim 4, characterized in that: The detecting of the micro-through hole depth and hole wall according to the micro-through hole three-dimensional binary image data specifically includes: Acquiring substrate thickness information and substrate roughness information, wherein the substrate thickness information includes thickness information of each layer in the substrate; Based on the application requirements of the micro-through hole, the calibrated hole depth information corresponding to each micro-through hole is obtained, where the calibrated hole depth is the thickness of the substrate that the micro-through hole needs to penetrate; Obtaining a micro-through hole depth threshold based on the calibrated hole depth information and substrate roughness; Obtaining micro-through-hole depth information based on micro-through-hole three-dimensional binary image data; According to the micro-via hole depth information and the micro-via hole depth threshold, it is judged whether the micro-via hole depth meets the production standard. If the micro-via hole depth exceeds the micro-via hole depth threshold, the micro-via hole is unqualified and marked. If the micro-via hole depth does not exceed the micro-via hole depth threshold, the micro-via hole depth meets the production standard. Obtaining micro-through-hole sidewall taper angle information based on micro-through-hole three-dimensional binary image data; Based on the micro-via production standards, obtain the micro-via sidewall taper angle tolerance information; Based on the micro-via sidewall taper angle information and the micro-via sidewall taper angle tolerance information, it is determined whether the micro-via sidewall meets the production standard. If the micro-via sidewall taper angle exceeds the micro-via sidewall taper angle tolerance, the micro-via is unqualified and marked. If the micro-via sidewall taper angle does not exceed the micro-via sidewall taper angle tolerance, the micro-via depth meets the production standard.

6. A micro-through hole quality detection system based on data model feedback, used to implement the detection method according to any one of claims 1 to 5, characterized in that: include: The main control module is used to determine whether the shortest diameter of the micro-through hole meets the production standard based on the micro-through hole standard diameter and the micro-through hole diameter difference threshold, and to compare the adjusted point cloud spacing with the image resolution according to the image resolution information to determine whether the adjusted point cloud spacing meets the point cloud model spacing setting standard. According to the micro-through hole contour major axis information, micro-through hole contour minor axis information and micro-through hole ellipticity coefficient, it is determined whether the micro-through hole diameter meets the production standard. According to the micro-through hole edge roughness and edge roughness threshold, it is determined whether the micro-through hole diameter meets the production standard. According to the micro-through hole three-dimensional binary image data, the micro-through hole depth and hole wall are detected to determine whether the micro-through hole meets the production standard. According to the micro-through hole coordinate data Based on data fitting, a micro-through-hole contour curve function is obtained. According to the micro-through-hole contour curve function, the long axis information and the short axis information of the micro-through-hole contour are obtained. According to the sampling point number information, the micro-through-hole coordinate data is screened to obtain the sampling point coordinate information. Based on the polar coordinate system, the sampling point coordinates and the micro-through-hole contour curve function are converted to obtain the sampling point polar coordinate information and the micro-through-hole contour curve polar coordinate function. The polar angle in the polar coordinate of the sampling point is used as a reference to obtain the polar coordinate information of the contour point corresponding to the sampling point in the polar coordinate function of the micro-through-hole contour curve. The difference between the sampling point coordinate and the contour point polar coordinate is used as the radial deviation value to obtain the radial deviation data. According to the radial deviation data, the edge roughness of the micro-through-hole is obtained. An information acquisition module is configured to acquire micro-through-hole image data, micro-through-hole two-dimensional image data, and micro-through-hole three-dimensional image data, perform grayscale processing on the micro-through-hole image data, and perform binarization conversion on the processed grayscale image to acquire micro-through-hole binary image data; obtain micro-through-hole contour information based on the micro-through-hole two-dimensional binary image data and contour recognition; obtain image resolution information based on the micro-through-hole image data and device parameters; and obtain lateral step information based on the image resolution; An image processing module is configured to connect any two positions in the edge contour of the micro-through-hole according to the micro-through-hole contour information to obtain a characteristic line segment of the micro-through-hole contour, obtain the longest diameter and the shortest diameter of the micro-through-hole according to the characteristic line segment of the micro-through-hole contour, obtain point cloud spacing information according to the minimum defect size information and the shortest diameter of the micro-through-hole, construct a point cloud model according to the point cloud spacing information and the two-dimensional binary image data of the micro-through-hole, and obtain a two-dimensional model of the micro-through-hole; The display module interacts with the main control module and is used to display the micro-through-hole binary image data, the micro-through-hole two-dimensional model, the micro-through-hole contour curve function and the marking information of the micro-through-hole.

7. The micro-through hole quality detection system based on data model feedback according to claim 6, characterized in that: The main control module specifically includes: A control unit, the control unit being configured to obtain a micro-through-hole profile curve function based on the micro-through-hole coordinate data and data fitting, obtain micro-through-hole profile major axis information and micro-through-hole profile minor axis information based on the micro-through-hole profile curve function, screen the micro-through-hole coordinate data based on the sampling point number information, obtain sampling point coordinate information, convert the sampling point coordinates and the micro-through-hole profile curve function based on a polar coordinate system, obtain sampling point polar coordinate information and the micro-through-hole profile curve polar coordinate function, obtain contour point polar coordinate information corresponding to the sampling point in the micro-through-hole profile curve polar coordinate function based on the polar angle in the sampling point polar coordinates as a reference, use the difference between the sampling point coordinates and the contour point polar coordinates as a radial deviation value, obtain radial deviation data, and obtain micro-through-hole edge roughness based on the radial deviation data; An information receiving unit, which interacts with the information acquisition module and the image processing module to receive data and transmit it to the judgment unit; A judgment unit is configured to judge whether the shortest diameter of the micro-through hole meets the production standard based on the micro-through hole standard diameter and the micro-through hole diameter difference threshold, judge whether the adjusted point cloud spacing meets the point cloud model spacing setting standard based on the image resolution information, judge whether the micro-through hole aperture meets the production standard based on the micro-through hole contour major axis information, the micro-through hole contour minor axis information and the micro-through hole ellipticity coefficient, judge whether the micro-through hole aperture meets the production standard based on the micro-through hole edge roughness and the edge roughness threshold, and judge whether the micro-through hole meets the production standard based on the micro-through hole three-dimensional binary image data.

8. The micro-through hole quality detection system based on data model feedback according to claim 6, characterized in that: The information acquisition module specifically includes: a first acquisition unit, configured to acquire micro-through-hole image data, micro-through-hole two-dimensional image data, and micro-through-hole three-dimensional image data, perform grayscale processing on the micro-through-hole image data, and perform binarization conversion on the processed grayscale image to acquire micro-through-hole binary image data; The second acquisition unit is used to obtain micro-through-hole contour information based on contour recognition according to the micro-through-hole two-dimensional binary image data, obtain image resolution information based on the equipment parameters according to the micro-through-hole image data, and obtain lateral step information based on the image resolution.

9. The micro-through hole quality detection system based on data model feedback according to claim 6, characterized in that: The image processing module specifically includes: An image processing unit is used to connect any two positions in the edge contour of the micro-through-hole according to the micro-through-hole contour information to obtain a characteristic line segment of the micro-through-hole contour, and obtain the longest diameter and the shortest diameter of the micro-through-hole according to the characteristic line segment of the micro-through-hole contour; The model construction unit is used to obtain point cloud spacing information based on the minimum defect size information and the shortest diameter of the micro-through hole, and to construct a point cloud model based on the point cloud spacing information and the two-dimensional binary image data of the micro-through hole to obtain a two-dimensional model of the micro-through hole.

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