Mono flash single bare die test method, system, device, equipment and medium

Abstract

The embodiment of the invention discloses a Mono flash single bare die testing method, system, device and equipment and a medium, and relates to the technical field of semiconductor testing. The method comprises the following steps: determining a test program corresponding to a die to be tested, and loading the test program into an ATE computer; determining a needle card corresponding to the to-be-tested die, placing the to-be-tested die on a loading platform, and connecting the to-be-tested die with the needle card; installing a test fixture on an ATE test head, and connecting the needle card with the test fixture; and running the test program in the ATE computer, and testing the die to be tested. Therefore, the embodiment of the invention has universality, can perform various different types of tests on different types of to-be-tested dies, and is high in efficiency and wide in applicability.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor testing technologies, and in particular, to a method, system, device, equipment and medium for testing a single bare die of Mono flash. Background Art

[0002] Single-board flash memory (Mono flash) is a high-density flash memory architecture that integrates multiple independent dies. It achieves large-capacity storage by stacking or arranging multiple bare dies on a single packaging substrate. In the semiconductor manufacturing process, a bare die refers to an independent chip unit that has been cut from a silicon wafer (wafer) and is not yet packaged. The testing and failure analysis (FA) of bare dies are important links to ensure the reliability of chips: on the one hand, electrical testing needs to be performed on the original bare dies after wafer cutting to screen qualified units; on the other hand, for the failed packaged chips, de-encapsulation treatment is required to expose the bare die and locate the failed die and the failure type of the failed die.

[0003] However, the current industry's testing solutions for single bare dies have significant limitations: firstly, traditional test circuit boards usually only support a limited type of test items (such as basic function verification), and it is difficult to cover test requirements with high signal quality requirements and measurement accuracy requirements (such as ICC power consumption test, Erase test, Program test, etc.); secondly, the test hardware (such as probe cards, fixtures) is bound to specific models or generations of Nand Flash chips, resulting in poor compatibility and inability to adapt to diverse chip designs; thirdly, the test process relies on manual replacement of hardware and reconfiguration of parameters, with low efficiency and prone to introducing operation errors. These problems seriously restrict the flexibility and generality of the testing link in the Mono flash manufacturing process. Summary of the Invention

[0004] Embodiments of the present invention provide a method, system, device, equipment and medium for testing a single bare die of Mono flash, aiming to solve the technical problems of large limitations and low efficiency in the existing single bare die testing solutions.

[0005] In a first aspect, embodiments of the present invention provide a method for testing a single bare die of Mono flash, which includes:

[0006] Determine the test program corresponding to the die to be tested, and load the test program into the ATE computer;

[0007] Determine the probe card corresponding to the die to be tested, place the die to be tested on the loading platform, and connect the die to be tested to the probe card;

[0008] Install a test fixture on the ATE test head and connect the needle card to the test fixture;

[0009] Run the test program in the ATE computer to test the die to be tested.

[0010] A further technical solution thereof is that determining the test program corresponding to the die to be tested includes:

[0011] Obtain the type of the die to be tested;

[0012] Based on the type of the die to be tested, determine the test program corresponding to the die to be tested.

[0013] A further technical solution thereof is that determining the needle card corresponding to the die to be tested includes:

[0014] Obtain the type of the die to be tested;

[0015] Based on the type of the die to be tested, determine the needle card corresponding to the die to be tested.

[0016] A further technical solution thereof is that connecting the die to be tested to the needle card includes;

[0017] Align the pins of the needle card with the PAD of the die to be tested;

[0018] Adjust the distance between the pins of the needle card and the die to be tested so that the pins of the needle card are pressed tightly against the PAD of the die to be tested.

[0019] A further technical solution thereof is that both the needle card and the test fixture are provided with interface sockets, and both ends of a connecting wire are respectively plugged into the interface sockets of the needle card and the test fixture to connect the needle card to the test fixture.

[0020] A further technical solution thereof is that when replacing and testing different types of dies to be tested, load the corresponding test program in the ATE computer and replace the corresponding needle card for testing.

[0021] Second aspect, an embodiment of the present invention provides a Mono flash single bare die test system. The Mono flash single bare die test system includes an ATE computer, an ATE test head, a test fixture, a connecting wire, a loading platform, and a probe card. The ATE computer is connected to the ATE test head, and the test fixture is loaded on the ATE test head. Two ends of the connecting wire are respectively connected to the test fixture and the probe card. The loading platform is used to load the die to be tested, and the probe card is used to connect to the die to be tested. Among them, the Mono flash single bare die test system is used to execute the Mono flash single bare die test method as described in the first aspect.

[0022] Third aspect, an embodiment of the present invention further provides a Mono flash single bare die test device, which includes units for executing the above method.

[0023] Fourth aspect, an embodiment of the present invention further provides a computer device, which includes a memory and a processor. A computer program is stored on the memory, and when the processor executes the computer program, the above method is implemented.

[0024] Fifth aspect, an embodiment of the present invention further provides a computer-readable storage medium. The storage medium stores a computer program, and when the computer program is executed by a processor, the above method can be implemented.

[0025] An embodiment of the present invention provides a Mono flash single bare die test method, system, device, equipment, and medium. Among them, the method includes: determining a test program corresponding to the die to be tested, and loading the test program into the ATE computer; determining a probe card corresponding to the die to be tested, placing the die to be tested on the loading platform, and connecting the die to be tested to the probe card; installing a test fixture on the ATE test head, and connecting the probe card to the test fixture; running the test program in the ATE computer to test the die to be tested. It can be seen that the embodiment of the present invention has generality, can implement various different types of tests for different types of dies to be tested, has high efficiency, wide applicability, and strong generality. Description of the Drawings

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0027] Figure 1A schematic flowchart of a Mono flash single bare die testing method provided by an embodiment of the present invention;

[0028] Figure 2 A schematic structural diagram of a Mono flash single bare die testing system provided by an embodiment of the present invention.

[0029] Figure 3 A schematic block diagram of a computer device provided by an embodiment of the present invention. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0031] It should be understood that when used in this specification and the appended claims, the terms "comprises" and "comprising" indicate the presence of the described features, wholes, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their combinations.

[0032] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in this specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are intended to include the plural forms.

[0033] It should be further understood that the term "and / or" used in this specification of the present invention and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0034] As used in this specification and the appended claims, the term "if" can be interpreted as "when", "once", "in response to a determination", or "in response to a detection" according to the context. Similarly, the phrase "if a determination" or "if a [described condition or event] is detected" can be interpreted as meaning "once a determination is made", "in response to a determination", "once a [described condition or event] is detected", or "in response to a detection of a [described condition or event]" according to the context.

[0035] Please refer to Figure 2, an embodiment of the present invention provides a Mono flash single bare die test system. The Mono flash single bare die test system includes an ATE computer 10, an ATE test head 20, a test fixture 30, a connection line 40, a loading platform 50, and a probe card 60.

[0036] The ATE computer 10 is connected to the ATE test head 20, and the test fixture 30 is loaded on the ATE test head 20; both ends of the connection line 40 are respectively connected to the test fixture 30 and the probe card 60. The loading platform 50 is used to load the die 70 to be tested, and the probe card 60 is used to connect to the die 70 to be tested. The Mono flash single bare die test system is used to execute the Mono flash single bare die test method provided by the embodiment of the present invention.

[0037] Specifically, referring to Figure 1 , an embodiment of the present invention provides a Mono flash single bare die test method. As Figure 1 shown, the method includes the following steps:

[0038] S1, determine the test program corresponding to the die to be tested, and load the test program into the ATE computer.

[0039] In specific implementation, the embodiment of the present invention can implement various types of tests on the die to be tested, and can implement Open short test, Leakage test, Reset test, ReadTemp test, ReadFlash ID test, Read UID test, ScanFBB test, Erase test, Program test, ICC current test, etc.

[0040] A corresponding test program is pre-written for each test. Each die to be tested corresponds to a test program based on its test items. The test program can be one or more, and the present invention does not specifically limit this.

[0041] In the present invention, the test program required for the die to be tested is loaded into the ATE computer.

[0042] In some embodiments, the above step "determine the test program corresponding to the die to be tested" specifically includes: obtaining the type of the die to be tested; based on the type of the die to be tested, determining the test program corresponding to the die to be tested.

[0043] In specific implementation, a corresponding relationship between the type of the chip and the test program is established in advance. After that, after determining the type of the chip, the test program corresponding to the die to be tested is determined based on the type of the chip and the corresponding relationship.

[0044] Understandably, the type of the chip can be determined by user input or based on the identification information of the chip. The present invention does not specifically limit this.

[0045] S2. Determine the needle card corresponding to the die to be tested, place the die to be tested on the loading platform, and connect the die to be tested with the needle card.

[0046] In specific implementation, different dies to be tested need to be connected using different needle cards. In the embodiments of the present invention, determine the needle card corresponding to the die to be tested, place the die to be tested on the loading platform, and connect the die to be tested with the needle card.

[0047] Connect the die to be tested with the needle card. The specific implementation method is as follows: Align the pins of the needle card with the PADs of the die to be tested; adjust the distance between the pins of the needle card and the die to be tested so that the pins of the needle card tightly contact the PADs of the die to be tested.

[0048] Specifically, the needle card is placed on a liftable lifting device, and by adjusting the height of the lifting device, the pins of the needle card tightly contact the PADs of the die to be tested.

[0049] In some embodiments, the above step of "determine the needle card corresponding to the die to be tested" specifically includes: obtaining the type of the die to be tested; based on the type of the die to be tested, determine the needle card corresponding to the die to be tested.

[0050] In specific implementation, a corresponding relationship between the type of the chip and the needle card is established in advance. After that, after determining the type of the chip, based on the type of the chip and the corresponding relationship, determine the needle card corresponding to the die to be tested.

[0051] Understandably, the type of the chip can be determined by user input or based on the identification information of the chip. The present invention does not specifically limit this.

[0052] S3. Install a test fixture on the ATE test head and connect the needle card with the test fixture.

[0053] In specific implementation, load the test fixture onto the ATE test head so that the test fixture is electrically connected to the ATE test head.

[0054] Furthermore, both the needle card and the test fixture are provided with interface sockets, and both ends of a connecting wire are respectively plugged into the interface sockets of the needle card and the test fixture to connect the needle card with the test fixture.

[0055] S4. Run the test program in the ATE computer to test the die under test.

[0056] In specific implementation, the ATE computer is connected to the ATE test head. Run the test program in the ATE computer, and the ATE computer sends test instructions to the test fixture to implement the test on the die under test.

[0057] When replacing and testing different types of dies under test, load the corresponding test program in the ATE computer and replace the corresponding needle card for testing. It can be seen that the embodiments of the present invention are universal, capable of performing various different types of tests on different types of dies under test, with high efficiency and wide applicability.

[0058] It should be noted that the replacement of the needle card can be carried out manually or automatically. The present invention does not limit this.

[0059] The embodiments of the present invention propose a Mono flash single die test method, including: determining the test program corresponding to the die under test and loading the test program into the ATE computer; determining the needle card corresponding to the die under test, placing the die under test on the loading platform, and connecting the die under test to the needle card; installing a test fixture on the ATE test head and connecting the needle card to the test fixture; running the test program in the ATE computer to test the die under test. It can be seen that the embodiments of the present invention are universal, capable of performing various different types of tests on different types of dies under test, with high efficiency and wide applicability.

[0060] The technical effects of the present invention include:

[0061] Due to hardware limitations, existing designs only have a limited number of test items with relatively low signal quality requirements (Read Flash ID and Scan capacity test), and new test items cannot be added according to requirements. This test solution utilizes the sufficient channel resources, powerful data processing capabilities, and relatively stable input and output signal capabilities of the ATE tester to implement tests on test items with relatively high signal quality requirements, achieve precise screening of dies, and can implement Open / short test, Leakage test, Reset test, Read Temp test, Read Flash ID test, Read UID test, Scan FBB test, Erase test, Program test, ICC current test, etc.

[0062] The existing design only supports certain specific types of Nand Flash tests, with great application limitations; this test solution can cover various types of NandFlash tests in the industry, without being restricted by models and generations.

[0063] This test solution is a combined design of an ATE test machine and a bare die loading platform, which includes an ATE computer (for writing ATE programs), an ATE test head, an ATE test fixture, connecting wires, a loading platform, and a probe card. The ATE test fixture realizes the connection between the test machine resources and the bare die through the connecting wires and the probe card. According to the chip characteristics, the corresponding ATE test program is written on the ATE computer. The test program controls the input and output of the ATE test machine resources, and the ATE test machine resources are connected to the bare die, so as to realize the control of the driving and comparison of the bare die signals and achieve the purpose of testing.

[0064] Corresponding to the above Mono flash single bare die test method, the present invention also provides a Mono flash single bare die test device. The Mono flash single bare die test device includes units for executing the above Mono flash single bare die test method, and the Mono flash single bare die test device can be configured in terminals such as desktop computers, tablet computers, laptops, etc. Specifically, the Mono flash single bare die test device includes:

[0065] A loading unit for determining the test program corresponding to the die to be tested and loading the test program into the ATE computer;

[0066] A determining unit for determining the probe card corresponding to the die to be tested, placing the die to be tested on the loading platform, and connecting the die to be tested with the probe card;

[0067] A connecting unit for installing a test fixture on the ATE test head and connecting the probe card with the test fixture;

[0068] A testing unit for running the test program in the ATE computer to test the die to be tested.

[0069] In some embodiments, such as this embodiment, the determining the test program corresponding to the die to be tested includes:

[0070] Obtaining the type of the die to be tested;

[0071] Based on the type of the die to be tested, determining the test program corresponding to the die to be tested.

[0072] In some embodiments, such as this embodiment, the determining the probe card corresponding to the die to be tested includes:

[0073] Obtain the type of the die to be tested;

[0074] Based on the type of the die to be tested, determine the probe card corresponding to the die to be tested.

[0075] In some embodiments, such as this embodiment, the connecting the die to be tested with the probe card includes;

[0076] Align the pins of the probe card with the PADs of the die to be tested;

[0077] Adjust the distance between the pins of the probe card and the die to be tested so that the pins of the probe card are pressed against and in contact with the PADs of the die to be tested.

[0078] In some embodiments, such as this embodiment, both the probe card and the test fixture are provided with interface sockets, and both ends of a connecting wire are respectively plugged into the interface sockets of the probe card and the test fixture to connect the probe card with the test fixture.

[0079] In some embodiments, such as this embodiment, when replacing and testing different types of dies to be tested, load the corresponding test program in the ATE computer and replace the corresponding probe card for testing.

[0080] It should be noted that those skilled in the art can clearly understand that the specific implementation processes of the above Mono flash single bare die testing device and each unit can refer to the corresponding descriptions in the foregoing method embodiments. For the convenience and conciseness of description, they will not be elaborated herein.

[0081] The above Mono flash single bare die testing device can be implemented in the form of a computer program, and this computer program can run on a computer device as shown in Figure 3 shown.

[0082] Please refer to Figure 3 , Figure 3 is a schematic block diagram of a computer device provided by an embodiment of the present application. This computer device 500 can be a terminal or a server. Among them, the terminal can be an electronic device with a communication function such as a smart phone, a tablet computer, a notebook computer, a desktop computer, a personal digital assistant, and a wearable device. The server can be an independent server or a server cluster composed of multiple servers.

[0083] This computer device 500 includes a processor 502, a memory, and a network interface 505 connected through a system bus 501. Among them, the memory can include a non-volatile storage medium 503 and an internal memory 504.

[0084] The non-volatile storage medium 503 can store an operating system 5031 and a computer program 5032. When the computer program 5032 is executed, it can cause the processor 502 to execute a Mono flash single bare die testing method.

[0085] The processor 502 is used to provide computing and control capabilities to support the operation of the entire computer device 500.

[0086] The internal memory 504 provides an environment for the operation of the computer program 5032 in the non-volatile storage medium 503. When the computer program 5032 is executed by the processor 502, it can cause the processor 502 to execute a Mono flash single bare die testing method.

[0087] The network interface 505 is used for network communication with other devices. Those skilled in the art can understand that the above structure is only a block diagram of some structures related to the solution of the present application, and does not constitute a limitation on the computer device 500 to which the solution of the present application is applied. The specific computer device 500 may include more or fewer components than those shown in the figure, or combine some components, or have different component arrangements.

[0088] Wherein, the processor 502 is used to run the computer program 5032 stored in the memory to implement a Mono flash single bare die testing method, which specifically includes the following steps:

[0089] Determine the test program corresponding to the die to be tested, and load the test program into the ATE computer;

[0090] Determine the probe card corresponding to the die to be tested, place the die to be tested on the loading platform, and connect the die to be tested with the probe card;

[0091] Install a test fixture on the ATE test head, and connect the probe card with the test fixture;

[0092] Run the test program in the ATE computer to test the die to be tested.

[0093] In some embodiments, such as this embodiment, the determining the test program corresponding to the die to be tested includes:

[0094] Obtain the type of the die to be tested;

[0095] Based on the type of the die to be tested, determine the test program corresponding to the die to be tested.

[0096] In some embodiments, such as this embodiment, the determining the probe card corresponding to the die to be tested includes:

[0097] Obtain the type of the die to be tested;

[0098] Based on the type of the die to be tested, determine the probe card corresponding to the die to be tested.

[0099] In some embodiments, such as this embodiment, the connecting the die to be tested with the probe card includes;

[0100] Align the pins of the probe card with the PADs of the die to be tested;

[0101] Adjust the distance between the pins of the probe card and the die to be tested so that the pins of the probe card are pressed into contact with the PADs of the die to be tested.

[0102] In some embodiments, such as this embodiment, both the probe card and the test fixture are provided with interface sockets, and both ends of a connecting wire are respectively plugged into the interface sockets of the probe card and the test fixture to connect the probe card with the test fixture.

[0103] In some embodiments, such as this embodiment, when testing different types of dies to be tested, load the corresponding test program in the ATE computer and replace the corresponding probe card for testing.

[0104] It should be understood that in the embodiments of the present application, the processor 502 may be a central processing unit (CPU), and the processor 502 may also be other general-purpose processors, digital signal processors (DSPs), application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0105] Those of ordinary skill in the art can understand that all or part of the processes of the methods in the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a storage medium, and the storage medium is a computer-readable storage medium. The computer program is executed by at least one processor in the computer system to implement the flow steps of the embodiments of the above methods.

[0106] Therefore, the present invention also provides a storage medium. The storage medium may be a computer-readable storage medium. The storage medium stores a computer program. When the computer program is executed by a processor, the processor executes a Mono flash single bare die testing method, which specifically includes the following steps:

[0107] Determine the test program corresponding to the die to be tested, and load the test program into the ATE computer;

[0108] Determine the probe card corresponding to the die to be tested, place the die to be tested on the loading platform, and connect the die to be tested with the probe card;

[0109] Install a test fixture on the ATE test head, and connect the probe card with the test fixture;

[0110] Run the test program in the ATE computer to test the die to be tested.

[0111] In some embodiments, such as this embodiment, the determining the test program corresponding to the die to be tested includes:

[0112] Obtain the type of the die to be tested;

[0113] Based on the type of the die to be tested, determine the test program corresponding to the die to be tested.

[0114] In some embodiments, such as this embodiment, the determining the probe card corresponding to the die to be tested includes:

[0115] Obtain the type of the die to be tested;

[0116] Based on the type of the die to be tested, determine the probe card corresponding to the die to be tested.

[0117] In some embodiments, such as this embodiment, the connecting the die to be tested with the probe card includes;

[0118] Align the pins of the probe card with the PAD of the die to be tested;

[0119] Adjust the distance between the pins of the probe card and the die to be tested so that the pins of the probe card are pressed against and in contact with the PAD of the die to be tested.

[0120] In some embodiments, such as this embodiment, both the probe card and the test fixture are provided with interface sockets, and both ends of a connecting wire are respectively plugged into the interface sockets of the probe card and the test fixture to connect the probe card with the test fixture.

[0121] In some embodiments, such as this embodiment, when replacing and testing different types of dies under test, a corresponding test program is loaded in the ATE computer, and a corresponding probe card is replaced for testing.

[0122] The storage medium is a physical, non-transitory storage medium, such as a USB flash drive, a portable hard drive, a read-only memory (ROM), a magnetic disk, or an optical disc, etc., which are all physical storage media that can store program codes. The computer-readable storage medium can be non-volatile or volatile.

[0123] Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of each example have been generally described according to their functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present invention.

[0124] In several embodiments provided by the present invention, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of each unit is only a logical function division, and there can be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0125] The steps in the method embodiments of the present invention can be adjusted, combined, and deleted according to actual needs. The units in the device embodiments of the present invention can be combined, divided, and deleted according to actual needs. In addition, the functional units in each embodiment of the present invention can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit.

[0126] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions to enable a computer device (which can be a personal computer, a terminal, or a network device, etc.) to execute all or part of the steps of the methods described in each embodiment of the present invention.

[0127] In the above embodiments, the descriptions of the various embodiments each have their own focuses. For parts not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0128] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, provided that these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to encompass these changes and modifications.

[0129] As described above, the above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A Mono flash single bare die testing method, characterized in that: include: Determine the test program corresponding to the die to be tested, and load the test program into the ATE computer; Determine the needle card corresponding to the die to be tested, place the die to be tested on a loading platform, and connect the die to be tested to the needle card; Install a test fixture on the ATE test head, and connect the pin card to the test fixture; The test program is run in the ATE computer to test the die to be tested.

2. The Mono flash single bare die testing method according to claim 1, characterized in that: The step of determining the test program corresponding to the die to be tested includes: Obtain the type of the die to be tested; Based on the type of the die to be tested, a test program corresponding to the die to be tested is determined.

3. The Mono flash single bare die testing method according to claim 1, characterized in that: The step of determining the pin card corresponding to the die to be tested includes: Obtain the type of the die to be tested; Based on the type of the die to be tested, a pin card corresponding to the die to be tested is determined.

4. The Mono flash single bare die testing method according to claim 1, characterized in that: The step of connecting the die to be tested to the pin card includes: Align the pins of the pin card with the PAD of the die to be tested; The distance between the pins of the needle card and the die to be tested is adjusted so that the pins of the needle card are pressed and contacted with the PAD of the die to be tested.

5. The Mono flash single bare die testing method according to claim 1, characterized in that: The pin card and the test fixture are both provided with interface sockets, and the two ends of the connecting wire are respectively plugged into the interface sockets of the pin card and the test fixture to connect the pin card with the test fixture.

6. The Mono flash single bare die testing method according to claim 1, characterized in that: When changing to test different types of dies to be tested, a corresponding test program is loaded into the ATE computer, and a corresponding pin card is replaced for testing.

7. A Mono flash single bare die test system, characterized in that: The invention comprises an ATE computer, an ATE test head, a test fixture, a connecting line, a loading platform and a pin card; the ATE computer is connected to the ATE test head, and the test fixture is loaded on the ATE test head; two ends of the connecting line are respectively connected to the test fixture and the pin card, the loading platform is used to load the die to be tested, and the pin card is used to connect to the die to be tested, wherein the Mono flash single bare die test system is used to execute the Mono flash single bare die test method as described in any one of claims 1 to 6.

8. A Mono flash single bare die testing device, characterized in that: The method comprises a unit for executing the method according to any one of claims 1 to 6.

9. A computer device, characterized in that: The computer device includes a memory and a processor, the memory stores a computer program, and the processor implements the method according to any one of claims 1 to 6 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 6 can be implemented.

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