Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including dielectric layers and inner electrode layers and floating electrode layers, the inner electrode layers and the floating electrode layers being alternately arranged in a first direction; and an outer electrode disposed on the body, and the inner electrode layer includes a first electrode pattern including a first main portion and a first auxiliary portion and a second electrode pattern spaced apart from the first electrode pattern, the floating electrode layer includes a third electrode pattern, the first electrode pattern including a second main portion and a second auxiliary portion, and the third electrode pattern includes a third main portion and a third auxiliary portion. The multilayer electronic component according to an example embodiment of the present disclosure may allow an electric field to be formed in a first direction and an additional electric field to be formed in a second direction and / or a third direction between the inner electrode layer and the floating electrode layer to counteract stress formed in the stress concentration region, thereby improving reliability (including BDV characteristics) of the multilayer electronic component.

Description

[0001] This application claims the benefit of priority of Korean Patent Application No. 10-2023-0195551, filed with the Korean Intellectual Property Office on December 28, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic component. Background Art

[0003] A multi-layer ceramic capacitor (MLCC), a type of multi-layer electronic component, is a chip capacitor that is mounted on printed circuit boards of various types of electronic products (such as image display devices including liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smart phones, mobile phones, on-vehicle chargers (OBCs) of electric vehicles, and DC-DC converters) and is used to charge or discharge from them.

[0004] When a voltage is applied to a multi-layer ceramic capacitor, due to the electrostriction phenomenon of the dielectric layer, stress concentration may occur inside the multi-layer ceramic capacitor, which may lead to a reduction in the reliability (including BDV characteristics) of the multi-layer ceramic capacitor.

[0005] In the past, attempts have been made to mitigate the electrostriction phenomenon by introducing a floating electrode layer structure.

[0006] However, although the internal electrode structure with a conventional floating electrode layer can achieve the effect of mitigating stress concentration to a certain extent by completely distributing the voltage, the stress caused by electrostriction can be concentrated at the corners where electrode patterns of different polarities are stacked on top of each other in the stacking direction of the internal electrodes. Therefore, even when a floating electrode layer is introduced, the reliability (including BDV characteristics) may deteriorate, and this phenomenon may be further exacerbated when the multi-layer ceramic capacitor is operated at a high voltage.

[0007] Therefore, in the internal electrode structure with a floating electrode layer, structural improvement is needed to mitigate the phenomenon of stress concentration caused by electrostriction at the corners where electrode patterns of different polarities are stacked on top of each other in the stacking direction of the internal electrodes. Summary of the Invention

[0008] One aspect of the present disclosure is to mitigate the phenomenon of stress concentration caused by electrostriction at the corners where electrode patterns of different polarities are stacked on top of each other in the stacking direction of the internal electrodes in an internal electrode structure with a floating electrode layer.

[0009] However, the aspects of the present disclosure are not limited to the above, and can be more easily understood during the description of specific embodiments of the present disclosure.

[0010] A multi-layer electronic component according to an exemplary embodiment of the present disclosure may include: a main body including a dielectric layer and inner electrode layers and floating electrode layers, the inner electrode layers and the floating electrode layers being alternately arranged in a first direction, and the dielectric layer being interposed between the inner electrode layers and the floating electrode layers, and the main body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; and an outer electrode provided on the main body, and the inner electrode layer may include a first electrode pattern connected to the third surface and a second electrode pattern connected to the fourth surface and spaced apart from the first electrode pattern in the second direction, the floating electrode layer may include a third electrode pattern spaced apart from the third surface, the fourth surface, the fifth surface, and the sixth surface, the first electrode pattern may include a first main portion and a first auxiliary portion, the first auxiliary portion being spaced apart from the first main portion in the third direction on both sides of the first main portion in the third direction, the second electrode pattern may include a second main portion and a second auxiliary portion, the second auxiliary portion being spaced apart from the second main portion in the third direction on both sides of the second main portion in the third direction, and the third electrode pattern may include a third main portion and a third auxiliary portion, the third auxiliary portion being spaced apart from the third main portion in the third direction on both sides of the third main portion in the third direction.

[0011] A multi-layer electronic component according to an exemplary embodiment of the present disclosure may include: Inner electrode layers disposed in a main body of the multi-layer electronic component along a length-width plane, and the inner electrode layers include: a first electrode pattern including a first main portion and a first auxiliary portion, the first auxiliary portion being spaced apart from the first main portion on both sides of the first main portion in a width direction, the first main portion and the first auxiliary portion being exposed through a first side surface of the main body; and a second electrode pattern spaced apart from the first electrode pattern in a length direction and including a second main portion and a second auxiliary portion, the second auxiliary portion being spaced apart from the second main portion on both sides of the second main portion in the width direction, the second main portion and the second auxiliary portion being exposed through a second side surface of the main body opposite to the first side surface; And a floating electrode layer spaced apart from the inner electrode layers in a thickness direction by a dielectric layer, and the floating electrode layer includes a third main portion and a third auxiliary portion, the third auxiliary portion being spaced apart from the third main portion on both sides of the third main portion in the width direction, the floating electrode layer being spaced apart from all surfaces of the main body.

[0012] One of the various effects of the present disclosure is that in a multilayer electronic component including an inner electrode layer and a floating electrode layer, the reliability (including BDV characteristics) of the multilayer electronic component is improved by controlling the shape of the electrode patterns included in the inner electrode layer and the floating electrode layer and eliminating the stress concentrated at the corners where the electrode patterns having different polarities are stacked on top of each other in the stacking direction of the inner electrodes.

[0013] The advantages and effects of the present disclosure are not limited to the foregoing, and can be more easily understood during the process of describing specific exemplary embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 A perspective view of a multilayer electronic component according to an exemplary embodiment of the present disclosure is schematically shown; Figure 2 is a cross-sectional view taken along line I-I' of Figure 1 ; Figure 3 is a cross-sectional view taken along line II-II' of Figure 1 ; Figure 4 is a cross-sectional view taken along line III-III' of Figure 1 ; Figure 5A A plan view of an inner electrode layer disposed on a dielectric layer according to an exemplary embodiment is schematically shown, and Figure 5B a plan view of a floating electrode layer disposed on a dielectric layer according to an exemplary embodiment is schematically shown; Figure 6A Regions where electrostrictive stress concentration of electrode patterns in a multilayer electronic component according to a comparative example are shown, and Figure 6B regions where electrostrictive stress concentration of electrode patterns in a multilayer electronic component according to an inventive example are shown; and Figure 7 A perspective exploded view of a main body according to an exemplary embodiment is schematically shown. DETAILED DESCRIPTION

[0015] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to specific exemplary embodiments and the accompanying drawings. However, the exemplary embodiments of the present disclosure can be illustrated in many different forms and should not be construed as limited to the specific embodiments set forth herein. The exemplary embodiments disclosed herein are provided for those skilled in the art to better interpret the present disclosure. Therefore, in the drawings, for clarity, the shapes and dimensions of elements may be exaggerated, and the same reference numerals will always be used to denote the same or similar elements.

[0016] In addition, to clearly describe the present disclosure in the drawings, content irrelevant to the description is omitted, and the dimensions (e.g., thickness) of each component shown in the drawings are arbitrarily shown for ease of description, but the present disclosure is not limited thereto. In addition, the same reference numerals are used to describe components having the same functions within the same scope of thought. Throughout the specification, unless otherwise specified, when a part "includes" or "comprises" a certain component, this indicates that other components are not excluded and other components may be further included.

[0017] In the drawings, the first direction may be defined as the stacking direction or the thickness direction, the second direction may be defined as the length direction, and the third direction may be defined as the width direction.

[0018] Figure 1 A perspective view of a multi-layer electronic component according to an exemplary embodiment of the present disclosure is schematically shown.

[0019] Figure 2 is a cross-sectional view taken along line I-I' of Figure 1 .

[0020] Figure 3 is a cross-sectional view taken along line II-II' of Figure 1 .

[0021] Figure 4 is a cross-sectional view taken along line III-III' of Figure 1 .

[0022] Figure 5A A plan view of an inner electrode layer disposed on a dielectric layer according to an exemplary embodiment is schematically shown, and Figure 5B a plan view of a floating electrode layer disposed on a dielectric layer according to an exemplary embodiment is schematically shown.

[0023] Figure 6A shows the region of electrostrictive stress concentration of an electrode pattern in a multi-layer electronic component according to a comparative example, and Figure 6B shows the region of electrostrictive stress concentration of an electrode pattern in a multi-layer electronic component according to an inventive example.

[0024] Figure 7 A perspective exploded view of a main body according to an exemplary embodiment is schematically shown.

[0025] Hereinafter, reference will be made to Figures 1 to 7A detailed description is given of a multilayer electronic component 100 according to an exemplary embodiment of the present disclosure and various variant embodiments thereof. Additionally, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") is described as an example of the multilayer electronic component, but the present disclosure is not limited thereto, and the present disclosure can also be applied to various multilayer electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors.

[0026] The multilayer electronic component 100 according to an exemplary embodiment of the present disclosure may include: a body 110 including a dielectric layer 111 and inner electrode layers 121 and floating electrode layers 122, the inner electrode layers 121 and the floating electrode layers 122 being alternately arranged in a first direction and the dielectric layer being interposed between the inner electrode layers 121 and the floating electrode layers 122, and the body 110 including a first surface 1 and a second surface 2 that face each other in the first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface and the second surface and face each other in a second direction perpendicular to the first direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface to the fourth surface and face each other in a third direction perpendicular to the first direction and the second direction; and external electrodes 130 and 140 provided on the body, and the inner electrode layer 121 may include a first electrode pattern 11 connected to (e.g., exposed to) the third surface and a second electrode pattern 12 connected to (e.g., exposed to) the fourth surface and spaced apart from the first electrode pattern in the second direction, the floating electrode layer 122 may include a third electrode pattern 13 spaced apart from the third surface to the sixth surface, the first electrode pattern 11 may include a first main portion 11a and a first auxiliary portion 11b, the first auxiliary portion 11b being spaced apart from the first main portion 11a in the third direction on both sides of the first main portion 11a in the third direction, the second electrode pattern 12 may include a second main portion 12a and a second auxiliary portion 12b, the second auxiliary portion 12b being spaced apart from the second main portion 12a in the third direction on both sides of the second main portion 12a in the third direction, and the third electrode pattern 13 may include a third main portion 13a and a third auxiliary portion 13b, the third auxiliary portion 13b being spaced apart from the third main portion 13a in the third direction on both sides of the third main portion 13a in the third direction.

[0027] The body 110 may include a dielectric layer 111, inner electrode layers 121, and floating electrode layers 122.

[0028] More specifically, the body 110 may include a dielectric layer 111 and inner electrode layers 121 and floating electrode layers 122, the inner electrode layers 121 and the floating electrode layers 122 being alternately arranged in a first direction and the dielectric layer 111 being interposed between the inner electrode layers 121 and the floating electrode layers 122.

[0029] The specific shape of the body 110 is not particularly limited, but as Figure 1As shown, the main body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Due to the shrinkage of the ceramic particles included in the main body 110 during the sintering process, the main body 110 may not have a hexahedral shape with completely straight lines, but may generally have a hexahedral shape.

[0030] The main body 110 may include a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first to fourth surfaces and face each other in a third direction.

[0031] In the present disclosure, the first direction may refer to the direction in which the inner electrode layer 121 and the floating electrode layer 122 are alternately arranged and the dielectric layer 111 is interposed between the inner electrode layer 121 and the floating electrode layer 122, that is, the stacking direction of the inner electrode layer 121, the floating electrode layer 122, and the dielectric layer 111. The second direction may refer to the direction perpendicular to the first direction, and the third direction may refer to the direction perpendicular to both the first direction and the second direction.

[0032] Since the edge regions of the dielectric layer 111 where the inner electrode layer and the floating electrode layer are not provided overlap each other in the first direction, a step difference may occur due to the thickness of the inner electrode layer and the floating electrode layer. Therefore, the corners connecting the first surface to the third to sixth surfaces may have a shape that contracts toward the center of the main body 110 in the first direction based on the first surface, and / or the corners connecting the second surface to the third to sixth surfaces may have a shape that contracts toward the center of the main body 110 in the first direction based on the second surface. Optionally, due to the shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that contracts toward the center of the main body 110 in the first direction based on the first surface, and / or the corners connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that contracts toward the center of the main body 110 in the first direction based on the second surface. Optionally, in order to prevent cracking defects, the corners of the main body 110 connecting each surface may be rounded by performing a separate process, so that the corners connecting the first surface to the third to sixth surfaces and / or the corners connecting the second surface to the third to sixth surfaces may have a rounded shape.

[0033] The dielectric layers 111 forming the main body 110 may be formed in multiple layers, and in a state where the multiple dielectric layers 111 are sintered, adjacent dielectric layers 111 may be integrated to an extent that it is difficult to distinguish the boundary between adjacent dielectric layers 111 without using a scanning electron microscope (SEM). The number of stacked dielectric layers 111 is not particularly limited and may be determined in consideration of the size of the multilayer electronic component. For example, 400 or more dielectric layers may be stacked to form the main body.

[0034] The dielectric layer 111 may be formed by manufacturing a ceramic slurry containing ceramic particles, an organic solvent, and a binder, coating the ceramic slurry on a carrier film and drying it to prepare a green sheet, and then sintering the green sheet. The ceramic particles are not particularly limited as long as sufficient electrostatic capacitance can be obtained using them, and for example, barium titanate (BaTiO3)-based particles may be used as the ceramic particles. For a more specific example, the ceramic particles may be one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1- y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0035] When barium titanate (BaTiO3)-based particles are used as the raw material for forming the dielectric layer 111, the sintered dielectric layer 111 may include Ba and Ti.

[0036] The average thickness of the dielectric layer 111 is not particularly limited.

[0037] To achieve miniaturization and high capacitance of the multilayer electronic component 100, the average thickness of the dielectric layer 111 may be 0.35 μm or less, and to improve the reliability of the multilayer electronic component 100 at high temperature and high voltage, the average thickness of the dielectric layer 111 may be 20 μm or more.

[0038] The average thickness of the dielectric layer 111 may be measured by an image obtained by scanning the cross-sections in the third direction and the first direction of the main body 110 with a scanning electron microscope (SEM).

[0039] For example, the average thickness of the dielectric layer 111 can be obtained as follows: Among the dielectric layers extracted from an image obtained by scanning a cross-section in the length direction and the thickness direction cut at the central portion in the width direction of the main body 110 with a scanning electron microscope (SEM), with respect to a total of five dielectric layers (including the one dielectric layer closest to the point where the center line in the length direction of the main body and the center line in the thickness direction of the main body intersect, and two dielectric layers located above the one dielectric layer and two dielectric layers located below the one dielectric layer), based on the point where the center line in the thickness direction of the main body intersects the one dielectric layer as a reference point, five points are set on the one dielectric layer (i.e., the reference point and two points located at equal intervals to the left of the reference point centered on the reference point and two points located at equal intervals to the right of the reference point), and five points that are stacked in the thickness direction with the above five points of the one dielectric layer are respectively set on each of the other four dielectric layers. Then, the thicknesses of the five dielectric layers at these points are measured, and their average value is calculated.

[0040] When a voltage is applied to the multilayer electronic component 100, due to the electrostriction phenomenon in the material of the dielectric layer, deformations such as contraction and expansion of the multilayer electronic component 100 may occur. When a high voltage is applied to the multilayer electronic component 100 or when BaTiO3 is used as the material for the dielectric layer, the electrostriction phenomenon may be further enhanced.

[0041] On the other hand, when a voltage is applied to the multilayer electronic component 100, the following deformations may occur: The multilayer electronic component 100 may expand in the first direction and may contract in the second and third directions to form an electric field in the first direction. In addition, the stress caused by the deformation of the multilayer electronic component 100 may concentrate on the boundary between the region where the electrostatic capacitance is formed and the region where the electrostatic capacitance is not formed, which may be a cause of cracks generated in the multilayer electronic component 100.

[0042] Referring to Figure 5A , the inner electrode layer 121 may include a first electrode pattern 11 connected to (e.g., exposed to) the third surface 3 and a second electrode pattern 12 connected to (e.g., exposed to) the fourth surface 4 and spaced apart from the first electrode pattern 11 in the second direction. However, the present disclosure is not limited thereto, and the first electrode pattern and the second electrode pattern may also be exposed from other surfaces of the main body.

[0043] Referring to Figure 5B , the floating electrode layer 122 may include a third electrode pattern 13 spaced apart from the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6.

[0044] Therefore, as Figure 2 and Figure 5A and Figure 5BAs shown, the main body 110 may include capacitor forming portions Ac1 and Ac2. In the capacitor forming portions Ac1 and Ac2, the inner electrode layer 121 and the floating electrode layer 122 are stacked on top of each other in the first direction, and the capacitor forming portions Ac1 and Ac2 may include: a first capacitor forming portion Ac1, in which the first electrode pattern 11 and the third electrode pattern 13 are stacked on top of each other in the first direction; and a second capacitor forming portion Ac2, in which the second electrode pattern 12 and the third electrode pattern 13 are stacked on top of each other in the first direction. In this case, since the first electrode pattern 11 and the second electrode pattern 12 are spaced apart from each other in the second direction, the first capacitor forming portion Ac1 and the second capacitor forming portion Ac2 may be spaced apart from each other.

[0045] Since this structure corresponds to a structure in which a plurality of capacitors are connected in series with each other and then connected in parallel as a whole again, the effect of dividing the voltage can be obtained, and thus the electrostriction phenomenon of the multilayer electronic component can be alleviated.

[0046] Referring to Figure 7 , the main body 110 may be formed by: repeatedly stacking the inner electrode layer and the floating electrode layer in the first direction, and the dielectric layer 111 is interposed between the inner electrode layer and the floating electrode layer. The covering portions 112 and 113 may be disposed on the upper surface and the lower surface of the following region in the first direction: in this region, the inner electrode layer and the floating electrode layer are repeatedly stacked in the first direction, and the dielectric layer 111 is interposed between the inner electrode layer and the floating electrode layer.

[0047] There is no particular limitation on the materials for forming the inner electrode layer 121 and the floating electrode layer 122, and materials having excellent conductivity may be used. For example, the inner electrode layer 121 and the floating electrode layer 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys.

[0048] Each of the inner electrode layer 121 and the floating electrode layer 122 may be formed by printing a conductive paste on a ceramic green sheet, and the printing method may be a screen printing method or a gravure printing method, but the present disclosure is not limited thereto.

[0049] There is no particular limitation on the thickness of the inner electrode layer and the floating electrode layer.

[0050] In order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the average thickness of the inner electrode layer and the floating electrode layer may be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 at high temperature and high voltage, the average thickness of the inner electrode layer and the floating electrode layer may be 3 μm or more.

[0051] The method for measuring the average thickness of the inner electrode layer and the floating electrode layer is not particularly limited. For example, the average thickness of the inner electrode layer (or the floating electrode layer) can be obtained as follows: among the inner electrode layers (or the floating electrode layer) extracted from the image obtained by scanning a cross-section in the length direction and the thickness direction cut at the central portion in the width direction of the main body 110 with a scanning electron microscope (SEM), with respect to a total of five inner electrode layers (or the floating electrode layer) (including the one inner electrode layer (or the floating electrode layer) closest to the intersection point of the center line in the length direction of the main body and the center line in the thickness direction of the main body, and two inner electrode layers (or the floating electrode layer) located above the one inner electrode layer (or the floating electrode layer) and two inner electrode layers (or the floating electrode layer) located below the one dielectric layer), based on the intersection point of the center line in the thickness direction of the main body and the first electrode pattern or the second electrode pattern (or the floating electrode layer) in the one inner electrode layer as a reference point, five points are set on the first electrode pattern or the second electrode pattern (or the floating electrode layer) in the one inner electrode layer (i.e., the reference point and two points located at equal intervals to the left of the reference point centered on the reference point and two points located at equal intervals to the right of the reference point), and five points that are stacked in the thickness direction with the above five points of the first electrode pattern or the second electrode pattern (or the floating electrode layer) in the one inner electrode layer are respectively set on each of the other four inner electrode layers (or the floating electrode layer), and then the thicknesses of the five inner electrode layers (or the floating electrode layer) at these points are measured, and their average value is calculated.

[0052] Referring to Figure 2 , the main body 110 may include covering portions 112 and 113 disposed on the upper and lower portions of the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2 in the first direction.

[0053] The covering portions 112 and 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2 in the thickness direction, respectively, and may be substantially used to prevent damage to the inner electrode due to physical stress or chemical stress.

[0054] The covering portions 112 and 113 do not include electrode patterns and may include a dielectric material same as the dielectric material of the dielectric layer 111. That is, the covering portions 112 and 113 may include a ceramic material and may include, for example, a barium titanate (BaTiO3)-based ceramic material.

[0055] The thicknesses of the covering portions 112 and 113 do not need to be particularly limited. For example, the average thickness of the covering portions 112 and 113 may be from 10 μm to 300 μm. The average thickness of the covering portions 112 and 113 may be the average value of the first-direction dimensions of the covering portions 112 and 113 measured at five points that are equally spaced from each other above and below the upper and lower portions of the first capacitor forming portion Ac1 and the second capacitor forming portion Ac2.

[0056] The edge portions 114 and 115 may be provided on the side surfaces of the first capacitor forming portion Ac1 and the second capacitor forming portion Ac2.

[0057] Referring Figure 4 , the edge portions 114 and 115 may be provided on the two side surfaces in the width direction of the first capacitor forming portion Ac1 and the second capacitor forming portion Ac2.

[0058] As Figure 3 and Figure 4 shown, in a cross section obtained by cutting the main body 110 in the width direction and the thickness direction, the edge portions 114 and 115 may refer to the regions between the two ends of the first electrode pattern 11 and the second electrode pattern 12 in the third direction and the outer surface of the main body 110, or may refer to the regions between the two ends of the third electrode pattern 13 in the third direction and the outer surface of the main body 110.

[0059] The edge portions 114 and 115 may be used to prevent damage to the internal electrodes due to physical stress or chemical stress.

[0060] The edge portions 114 and 115 may be formed by: forming the main portions and the auxiliary portions of the first electrode pattern to the third electrode pattern by coating a conductive paste on a ceramic green sheet.

[0061] The widths of the edge portions 114 and 115 do not need to be particularly limited. For example, the widths of the edge portions 114 and 115 may be 5 μm or more, and when the multilayer electronic component is of a size of 3225 (length × width: 3.2 mm × 2.5 mm) or more, the widths of the edge portions 114 and 115 may be 300 μm or more.

[0062] The average width of the edge portions 114 and 115 may refer to the average dimensions in the third direction of the regions where the internal electrode layer and the floating electrode layer are spaced apart from the fifth surface and the average dimensions in the third direction of the regions where the internal electrode layer and the floating electrode layer are spaced apart from the sixth surface, and may be the average value of the third-direction dimensions of the edge portions 114 and 115 measured at five points that are equally spaced from each other on the side surfaces of the first capacitor forming portion Ac1 and the second capacitor forming portion Ac2.

[0063] The external electrodes 130 and 140 may be provided on the third surface 3 and the fourth surface 4 of the main body 110.

[0064] The outer electrodes 130 and 140 may include a first outer electrode 130 and a second outer electrode 140. The first outer electrode 130 and the second outer electrode 140 are respectively disposed on the third surface 3 and the fourth surface 4 of the main body 110 and are respectively connected to the first electrode pattern 11 and the second electrode pattern 12. Specifically, the first outer electrode 130 may be disposed on the third surface 3 and may be connected to the first electrode pattern 11, and the second outer electrode 140 may be disposed on the fourth surface 4 and may be connected to the second electrode pattern 12.

[0065] In this exemplary embodiment, a structure in which the multi-layer electronic component 100 has two outer electrodes 130 and 140 is described, but the number or shape of the outer electrodes 130 and 140 may be changed according to the shape of the inner electrode layer and the floating electrode layer or other purposes.

[0066] The outer electrodes 130 and 140 may be formed of any material (such as a metal) as long as the material has conductivity, and the specific materials of the outer electrodes 130 and 140 may be determined in consideration of electrical characteristics, structural stability, etc. In addition, the outer electrodes 130 and 140 may have a multi-layer structure.

[0067] For example, the outer electrodes 130 and 140 may include an electrode layer disposed on the main body 110 and a plating layer formed on the electrode layer.

[0068] For a more specific example of the electrode layer, the electrode layer may be a sintered electrode including a conductive metal and glass or a resin-based electrode including a conductive metal and a resin.

[0069] In addition, the electrode layer may be in a form in which a sintered electrode and a resin-based electrode are sequentially formed on the main body. In addition, the electrode layer may be formed by transferring a sheet including a conductive metal to the main body, or may be formed by transferring a sheet including a conductive metal to the sintered electrode. In addition, the electrode layer may be formed as a plating layer, or may be a layer formed by a sputtering method or a deposition method such as an atomic layer deposition (ALD) method.

[0070] A material having excellent conductivity may be used as the conductive metal included in the electrode layer, and there is no particular limitation. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0071] The plating layer is used to improve the mounting characteristics. The type of the plating layer is not particularly limited, and may be a plating layer including one or more of Ni, Sn, Pd, and their alloys, and may be formed of multiple layers.

[0072] For a more specific example of the coating layer, the coating layer may be a Ni coating layer or a Sn coating layer, or may be a form in which the Ni coating layer and the Sn coating layer are sequentially formed on the electrode layer, or may be a form in which the Sn coating layer, the Ni coating layer, and the Sn coating layer are sequentially formed on the electrode layer. Additionally, the coating layer may include a plurality of Ni coating layers and / or a plurality of Sn coating layers. Additionally, the coating layer may be a form in which the Ni coating layer and the Pd coating layer are sequentially formed on the electrode layer.

[0073] The size of the multilayer electronic component 100 does not need to be particularly limited. According to the present disclosure, since it is beneficial to achieve miniaturization and high capacitance, the multilayer electronic component 100 can be applied to small-sized IT (information technology) products, and since the multilayer electronic component 100 can ensure high reliability in various environments, it can be applied to automotive electrical products that require high reliability.

[0074] Referring to Figure 6A , the inner electrode layer and the floating electrode layer of the multilayer electronic component according to the comparative example include electrode patterns 11', 12', and 13' that are provided only with the main part and do not have a separate auxiliary part.

[0075] In this case, when a voltage is applied, stress may concentrate at the corners where the electrode patterns with different polarities are stacked on top of each other, and in Figure 6A , the stress concentration region is denoted as P'.

[0076] When a voltage is applied to the multilayer electronic component according to the comparative example, an electric field is formed in the first direction in the region where the first electrode pattern 11' and the third electrode pattern 13' are stacked on top of each other in the first direction, and an electric field is formed in the first direction in the region where the second electrode pattern 12' and the third electrode pattern 13' are stacked on top of each other in the first direction. Therefore, in the multilayer electronic component, stress concentration regions P' can be formed on the boundary surface between the capacitance forming portion and the edge portion and on the boundary surface between the capacitance forming portion and the non-capacitance forming portion.

[0077] Referring to Figure 6B , the multilayer electronic component according to the inventive example includes an inner electrode layer 121 and a floating electrode layer 122. The inner electrode layer 121 includes a first electrode pattern 11 and a second electrode pattern 12 that are spaced apart from each other in the second direction. In Figure 6B , the dielectric layer provided between the inner electrode layer and the floating electrode layer is not shown.

[0078] In Figure 6B , the stress concentration region is denoted as P. In the multilayer electronic component 100 according to the exemplary embodiment of the present disclosure, the electric field formed in the first direction between the inner electrode layer 121 and the floating electrode layer 122 can also be formed in the second direction and / or the third direction, thereby canceling the effect acting on Figure 6BThe stress on the stress concentration region P indicated in

[0079] Specifically, referring to Figure 6B , in the multi-layer electronic component 100 according to an exemplary embodiment of the present disclosure, the first electrode pattern 11 may include a first main portion 11a and a first auxiliary portion 11b. The first auxiliary portion 11b is spaced apart from the first main portion 11a in the third direction on both sides of the first main portion 11a in the third direction. The second electrode pattern 12 may include a second main portion 12a and a second auxiliary portion 12b. The second auxiliary portion 12b is spaced apart from the second main portion 12a in the third direction on both sides of the second main portion 12a in the third direction. And the third electrode pattern 13 may include a third main portion 13a and a third auxiliary portion 13b. The third auxiliary portion 13b is spaced apart from the third main portion 13a in the third direction on both sides of the third main portion 13a in the third direction, so as to form an electric field of the second direction component and the third direction component in the stress concentration region P. Therefore, compared with the conventional situation where tensile stress is concentrated in the first direction and compressive stress is concentrated in the second and third directions, in the multi-layer electronic component 100 according to an exemplary embodiment of the present disclosure, some additional compressive stress can be generated in the first direction and some additional tensile stress can be generated in the second and third directions, so that the stress acting on Figure 6B the stress concentration region P shown in

[0080] can be offset to improve the reliability (including BDV characteristics) of the multi-layer electronic component 100.

[0081] In the exemplary embodiment, the first auxiliary portion 11b may be connected to the third surface 3, and the second auxiliary portion 12b may be connected to the fourth surface 4. Therefore, an electric field in the second direction can also be formed between the first auxiliary portion 11b and the second auxiliary portion 12b, thereby further improving the effect of offsetting the stress acting on the stress concentration region.

[0082] When each of the separation distances WS in the third direction between the first main part 11a and the first auxiliary part 11b, the separation distance WS in the third direction between the second main part 12a and the second auxiliary part 12b, and the separation distance WS in the third direction between the third main part 13a and the third auxiliary part 13b is less than 100 μm, due to process errors during printing, there may be a problem that the auxiliary part and the main part overlap each other. And when each of the separation distances WS in the third direction between the first main part 11a and the first auxiliary part 11b, the separation distance WS in the third direction between the second main part 12a and the second auxiliary part 12b, and the separation distance WS in the third direction between the third main part 13a and the third auxiliary part 13b is greater than 200 μm, there may be a problem of capacitance reduction.

[0083] Therefore, in the exemplary embodiment, each of the separation distances WS in the third direction between the first main part 11a and the first auxiliary part 11b, the separation distance WS in the third direction between the second main part 12a and the second auxiliary part 12b, and the separation distance WS in the third direction between the third main part 13a and the third auxiliary part 13b can be adjusted to be greater than or equal to 100 μm and less than or equal to 200 μm, thereby preventing the problem of capacitance reduction of the multilayer electronic component 100 and the problem that the auxiliary part and the main part overlap each other.

[0084] In the exemplary embodiment, the ratio of the third-direction width WA of the first auxiliary part 11b and the second auxiliary part 12b to the third-direction separation distance WM between the third-direction ends of the first main part 11a and the second main part 12a and the fifth surface 5 or the sixth surface 6 can satisfy being greater than or equal to 1 / 8 and less than or equal to 1 / 3.

[0085] In the exemplary embodiment, the first auxiliary part 11b and the second auxiliary part 12b can be spaced apart from each other in the second direction. Therefore, the first auxiliary part 11b and the second auxiliary part 12b can be electrically insulated from each other.

[0086] In the exemplary embodiment, the length LA by which the first auxiliary part 11b and the second auxiliary part 12b are spaced apart from each other in the second direction can be substantially the same as the separation distance FG between the first main part 11a and the second main part 12a in the second direction.

[0087] When the separation distance FG between the first main part 11a and the second main part 12a in the second direction is too short, the stress compensation effect according to the exemplary embodiment of the present disclosure may be reduced. Therefore, the separation distance FG between the first main part 11a and the second main part 12a in the second direction and the separation distance LM between the third main part 13a and the third surface 3 or the fourth surface 4 in the second direction can satisfy LM > 0.35FG.

[0088] When the third auxiliary part 13b is not spaced apart from the third surface 3 and the fourth surface 4, the first external electrode 130 provided on the third surface 3 and the second external electrode 140 provided on the fourth surface 4 may be electrically connected to each other. Accordingly, in the exemplary embodiment, the third auxiliary part 13b may be spaced apart from the third surface 3 and the fourth surface 4 to prevent the first external electrode 130 and the second external electrode 140 from being electrically connected to each other.

[0089] In the exemplary embodiment, the first auxiliary part 11b, the second auxiliary part 12b, and the third auxiliary part 13b may be spaced apart from the fifth surface 5 and the sixth surface 6. This may block a path through which external moisture may penetrate into the inner electrode layer 121 and the floating electrode layer 122, thereby improving the moisture resistance reliability of the multilayer electronic component 100.

[0090] In the exemplary embodiment, the corners of the first main part 11a, the corners of the second main part 12a, and the corners of the third main part 13a may have a rounded shape. Accordingly, stress concentrated at a specific position of the electrode pattern may be alleviated, thereby further improving the improvement effect of the reliability (including the BDV characteristic) of the multilayer electronic component 100.

[0091] In the exemplary embodiment, the dielectric layer 111 may include Ba and Ti. When the dielectric layer 111 is formed of a paraelectric dielectric corresponding to EIA class 1, the electrostriction phenomenon may occur slightly or hardly at all even when a voltage is applied. However, when the dielectric layer 111 is formed of a ferroelectric dielectric corresponding to EIA class 2, for example, when the dielectric layer 111 includes Ba and Ti, deformation caused by the electrostriction phenomenon may occur to a measurable degree, and this deformation may be a cause of generating stress inside the multilayer electronic component 100.

[0092] According to an exemplary embodiment of the present disclosure, even when the dielectric layer 111 includes Ba and Ti, stress applied to a stress concentration region may be offset. That is, when the dielectric layer 111 includes Ba and Ti, the improvement effect of the reliability (including the BDV characteristic) according to the exemplary embodiment of the present disclosure may be further improved.

[0093] Although the exemplary embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments and drawings, but is defined by the appended claims. Accordingly, those of ordinary skill in the art may make various substitutions, modifications, or changes without departing from the scope of the present disclosure defined by the appended claims, and these substitutions, modifications, or changes should be construed as being included within the scope of the present disclosure.

[0094] In addition, the expression "exemplary embodiments" used in the present disclosure does not mean the same embodiments and is provided to emphasize and explain different unique features. However, the embodiments presented above do not exclude the implementation by combining the features of another embodiment. For example, although an item described in a specific embodiment is not described in another embodiment, unless there is a description contrary to or contradictory to that item in the other embodiment, that item can be understood as being related to the description in the other embodiment.

[0095] In the present disclosure, terms are only used to describe specific embodiments and are not intended to limit the present disclosure. Unless the context clearly indicates otherwise, the singular form may also include the plural form.

Claims

1. A multilayer electronic component comprising: a body, comprising a dielectric layer and an inner electrode layer and a floating electrode layer, the inner electrode layer and the floating electrode layer being alternately arranged in a first direction, the dielectric layer being interposed between the inner electrode layer and the floating electrode layer, and the body comprising a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; as well as an outer electrode, disposed on the body, wherein the inner electrode layer includes a first electrode pattern connected to the third surface and a second electrode pattern connected to the fourth surface and spaced apart from the first electrode pattern in the second direction, The floating electrode layer includes a third electrode pattern spaced apart from the third surface, the fourth surface, the fifth surface, and the sixth surface, The first electrode pattern includes a first main portion and a first auxiliary portion, the first auxiliary portion being spaced apart from the first main portion in the third direction on both sides of the first main portion in the third direction, The second electrode pattern includes a second main portion and a second auxiliary portion, the second auxiliary portion being spaced apart from the second main portion in the third direction on both sides of the second main portion in the third direction, and The third electrode pattern includes a third main portion and a third auxiliary portion spaced apart from the third main portion in the third direction on both sides of the third main portion in the third direction.

2. The multilayer electronic component according to claim 1, wherein The first auxiliary portion is connected to the third surface, and the second auxiliary portion is connected to the fourth surface.

3. The multilayer electronic component according to claim 1, wherein: The first auxiliary portion and the second auxiliary portion are spaced apart in the second direction.

4. The multilayer electronic component according to claim 1, wherein: The third auxiliary portion is spaced apart from the third surface and the fourth surface.

5. The multilayer electronic component according to claim 1, wherein The first auxiliary portion, the second auxiliary portion, and the third auxiliary portion are spaced apart from the fifth surface and the sixth surface.

6. The multilayer electronic component according to claim 1, wherein: The main body includes: a first capacitance forming portion, in which the first electrode pattern and the third electrode pattern overlap each other in the first direction; and a second capacitance forming portion, in which the second electrode pattern and the third electrode pattern overlap each other in the first direction.

7. The multilayer electronic component according to claim 6, wherein: The first capacitance forming portion and the second capacitance forming portion are spaced apart from each other in the second direction.

8. The multilayer electronic component according to claim 1, wherein A separation distance between the first main portion and the first auxiliary portion in the third direction is in a range of 100 μm to 200 μm, A separation distance between the second main portion and the second auxiliary portion in the third direction is in a range of 100 μm to 200 μm, and A separation distance between the third main portion and the third auxiliary portion in the third direction is in a range of 100 μm to 200 μm.

9. The multilayer electronic component according to claim 1, wherein: A ratio of the third direction widths of the first auxiliary portion and the second auxiliary portion to a third direction separation distance between third direction ends of the first main portion and the second main portion and the fifth surface or the sixth surface is in a range of 1 / 8 to 1 / 3.

10. The multilayer electronic component according to claim 1, wherein When a separation distance between the first main portion and the second main portion in the second direction is defined as FG, and a separation distance between the third main portion and the third surface or the fourth surface in the second direction is defined as LM, Satisfies LM>0.35FG.

11. The multilayer electronic component according to claim 1, wherein Corners of the first main portion, corners of the second main portion, and corners of the third main portion have rounded shapes.

12. The multilayer electronic component according to claim 1, wherein The dielectric layer includes Ba and Ti.

13. The multilayer electronic component according to claim 1, wherein The dielectric layer has an average thickness of 20 μm or more.

14. A multilayer electronic component comprising: an inner electrode layer, arranged in a body of the multilayer electronic component along a length-width plane, and comprising: a first electrode pattern, comprising a first main portion and a first auxiliary portion, the first auxiliary portion being spaced apart from the first main portion on both sides of the first main portion in a width direction, the first main portion and the first auxiliary portion being exposed through a first side surface of the body; and a second electrode pattern, spaced apart from the first electrode pattern in a length direction, and comprising a second main portion and a second auxiliary portion, the second auxiliary portion being spaced apart from the second main portion on both sides of the second main portion in the width direction, the second main portion and the second auxiliary portion being exposed through a second side surface of the body opposite to the first side surface; and A floating electrode layer is separated from the inner electrode layer in the thickness direction by a dielectric layer, and the floating electrode layer includes a third main portion and a third auxiliary portion, the third auxiliary portion is separated from the third main portion on both sides of the third main portion in the width direction, and the floating electrode layer is separated from all surfaces of the body.

15. The multilayer electronic component according to claim 14 further comprises external electrodes, which are arranged on the first side surface and the second side surface of the body and are respectively connected to a portion of the first electrode pattern exposed through the first side surface and a portion of the second electrode pattern exposed through the second side surface.

16. The multilayer electronic component according to claim 14, wherein: The inner electrode layer and the floating electrode layer are spaced apart from surfaces of the body that are opposite to each other in the thickness direction by the dielectric layer.

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