Apparatus and method for processing substrate

Abstract

The present invention discloses a substrate processing method and a substrate processing apparatus, and more particularly, a substrate processing apparatus which processes a substrate by adjusting an air flow supplied to a processing space. The substrate processing apparatus includes: a housing having an upper wall and providing an internal space; a processing container provided in the internal space and providing a processing space having an open top; a support unit for supporting the substrate in the processing space; a liquid supply unit for supplying a processing liquid on the substrate supported by the support unit; an exhaust unit for exhausting the processing space; a fan for supplying a downdraft into the internal space; and an airflow distribution unit provided below the fan and above the processing container and distributing the downflow to the internal space, in which the airflow distribution unit is provided to distribute the downflow in a mode selected from a first mode and a second mode, and in the first mode and the second mode, flows of the downflow are different from each other.

Description

Technical Field

[0001] The present invention relates to a substrate processing method and a substrate processing apparatus, and more particularly, to a substrate processing apparatus that processes a substrate by adjusting an air flow supplied to a processing space. Background Art

[0002] Semiconductor processes include processes of cleaning a thin film, foreign substances, particles, etc. on a substrate. These processes are achieved by: placing the substrate on a rotating head with an upward or downward patterned side, supplying a processing liquid to the substrate while the rotating head rotates, and then drying the wafer. In these processes, a downward air flow is supplied to the chamber through a fan filter unit (FFU) to control the atmosphere in the chamber. Since various types of processing liquids are used and the characteristics of each processing liquid are different, the atmosphere in the chamber required for each processing liquid is also different. However, the downward air flow is supplied to the substrate without a separate distribution device. Therefore, there is a problem that the flow of the downward air flow cannot be controlled according to the type of the processing liquid. Summary of the Invention

[0003] The present invention is dedicated to providing a substrate processing apparatus and method that can improve substrate processing efficiency when processing a substrate by supplying a processing liquid with adjusted temperature and concentration to the substrate.

[0004] The present invention is dedicated to providing a substrate processing apparatus and method that can shorten the time required to control the concentration of a processing liquid in a supply tank structure that adjusts the concentration of the processing liquid by evaporation of water.

[0005] The problems to be solved by the present invention are not limited to the above problems, and those skilled in the art will clearly understand the unmentioned problems through the following description.

[0006] An exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus including: a housing having an upper wall and providing an internal space; a processing container disposed in the internal space and providing a processing space having an open top; a support unit for supporting the substrate in the processing space; a liquid supply unit for supplying a processing liquid onto the substrate supported by the support unit; an exhaust unit for exhausting the processing space; a fan for supplying a downward air flow into the internal space; and an air flow distribution unit disposed below the fan and above the processing container and distributing the downward air flow into the internal space, wherein the air flow distribution unit is configured to distribute the downward air flow in a mode selected from a first mode and a second mode, and in the first mode and the second mode, the flow of the downward air flow can be provided differently from each other.

[0007] According to an exemplary embodiment of the present invention, the airflow distribution unit includes: a fixed plate; a moving plate stacked on the fixed plate; and a driver for driving the moving plate. The fixed plate has: a first region formed with a plurality of first holes penetrating in the vertical direction; and a second region surrounding the first region and having a plurality of second holes penetrating in the vertical direction. The moving plate includes a plurality of third holes penetrating in the vertical direction. The moving plate is arranged to be movable between a first position and a second position. When viewed from above, the first position is the position where the moving plate overlaps with the first region, and the second position may be the position where the moving plate deviates from the first region.

[0008] According to an exemplary embodiment of the present invention, the aperture ratio per unit area of the first holes in the first region may be different from the aperture ratio per unit area of the second holes in the second region.

[0009] According to an exemplary embodiment of the present invention, the aperture ratio per unit area of the first holes in the first region may be greater than the aperture ratio per unit area of the second holes in the second region.

[0010] According to an exemplary embodiment of the present invention, the first holes, the second holes, and the third holes have the same diameter.

[0011] According to an exemplary embodiment of the present invention, the moving plate includes a first plate and a second plate. The first plate and the second plate are arranged to be movable in a direction towards each other or in a direction opposite to each other, and the driver may be arranged to move the first plate and the second plate between the first position and the second position.

[0012] According to an exemplary embodiment of the present invention, compared with the second mode, the first mode allows the flow of the descending airflow to be concentrated in the processing space.

[0013] According to an exemplary embodiment of the present invention, the second mode provides the flow of the airflow in the internal space more uniformly than the first mode.

[0014] According to an exemplary embodiment of the present invention, in the first mode, when viewed from above, the moving plate may be located in the second region, and the third holes overlap with the second holes.

[0015] According to an exemplary embodiment of the present invention, in the second mode, when viewed from above, the moving plate may be located in the first region, and the third holes overlap with the first holes.

[0016] According to an exemplary embodiment of the present invention, the driver moves the moving plate to the first position when the processing liquid is the first liquid, and moves the moving plate to the second position when the processing liquid is the second liquid.

[0017] According to an exemplary embodiment of the present invention, when the substrate is treated with the first liquid, more fumes are generated compared to the second liquid, and when the substrate is treated with the second liquid, a lower humidity may be required compared to the first liquid.

[0018] According to an exemplary embodiment of the present invention, the first region has a circular shape, and when viewed from above, the size of the first region corresponds to the opening of the processing container, and the downward airflow flows into the processing space through the opening.

[0019] An exemplary embodiment of the present invention provides a method for treating a substrate by using a substrate processing apparatus, the substrate processing apparatus including a housing providing an internal space and a chamber disposed in the internal space and providing a processing space for processing the substrate, the method including: a first processing operation of treating the substrate by supplying a first liquid to the substrate located in the processing space in a state where a downward airflow is supplied to the internal space and the processing space; a second processing operation of treating the substrate by supplying a second liquid to the substrate in a state where the downward airflow is supplied to the internal space and the processing space, wherein in the second processing operation, the downward airflow flows into the processing space more strongly than in the first processing operation, and in the second processing operation, the upward airflow flows into the internal space and the processing space more uniformly than in the first processing operation.

[0020] According to an exemplary embodiment of the present invention, in the first processing operation, the downward airflow flowing into the processing space flows through the plurality of injection holes more than the downward airflow flowing into the internal space other than the processing space.

[0021] According to an exemplary embodiment of the present invention, in the second processing operation, the downward airflow flows into the processing space through the plurality of injection holes having the same diameter.

[0022] According to an exemplary embodiment of the present invention, compared to the second processing operation, during the first processing operation, fumes are further discharged from the processing space, and during the second processing operation, the humidity of the processing space can be maintained lower than that of the first processing operation.

[0023] An exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a housing having an upper wall and providing an internal space; a processing container disposed in the internal space, having an open top and providing a processing space; a support unit for supporting and rotating the substrate in the processing space; a liquid supply unit for supplying a processing liquid onto the substrate supported by the support unit; an exhaust unit for exhausting the processing space; a fan placed on the upper wall of the housing and supplying a downward airflow into the internal space; and an airflow distribution unit disposed below the fan and above the processing container and distributing the downward airflow into the internal space, wherein the airflow distribution unit is configured to distribute the downward airflow into the internal space in a mode selected from a first mode and a second mode, in which the flow of the downward airflow is differently arranged in the first mode and the second mode, the airflow distribution unit includes: a fixed plate; a moving plate stacked on the fixed plate; and a driver for moving the moving plate, the fixed plate having: a first region in which a plurality of first holes penetrating in a vertical direction are formed; and a second region surrounding the first region and having a plurality of second holes penetrating in a vertical direction, and the aperture ratio per unit area of the first holes in the first region may be greater than the aperture ratio per unit area of the second holes in the second region.

[0024] According to an exemplary embodiment of the present invention, when the processing liquid is a first liquid, the airflow distribution unit operates in a first mode, in which the moving plate is located in the second region and the second holes and the third holes overlap, and when the processing liquid is a second liquid, the airflow distribution unit operates in a second mode, and in the second mode, the moving plate may be located in the first region and the first holes and the third holes overlap.

[0025] According to an exemplary embodiment of the present invention, the first liquid is a processing liquid that generates more fumes than the second liquid during substrate processing, and the second liquid may be a processing liquid that requires a lower humidity in the processing space than the first liquid when processing the substrate.

[0026] According to an exemplary embodiment of the present invention, the downward airflow flowing into the processing space and the internal space may be provided differently according to the processing liquid.

[0027] In addition, according to an exemplary embodiment of the present invention, the downward airflow flowing through the processing space and the internal space may be provided uniformly.

[0028] In addition, according to an exemplary embodiment of the present invention, when processing the substrate with a sulfuric acid peroxide mixture (SPM), the downward airflow may be more concentratedly provided to the processing space.

[0029] In addition, according to an exemplary embodiment of the present invention, the processing space may be set to a low humidity.

[0030] In addition, according to an exemplary embodiment of the present invention, the fumes generated by the processing liquid can be discharged more effectively.

[0031] The effects of the present invention are not limited to the above effects, and those skilled in the art will clearly understand the effects not mentioned through this specification and the accompanying drawings. Description of the Drawings

[0032] Figure 1 is a top plan view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0033] Figure 2 is schematically showing Figure 1 an exemplary embodiment of the liquid processing chamber of

[0034] Figure 3 is showing Figure 2 the gas flow distribution unit of

[0035] Figure 4 is showing Figure 3 the fixing plate of the gas flow distribution unit of

[0036] Figure 5 is a view showing the gas flow distribution unit in the first mode when viewed from above.

[0037] Figure 6 is showing Figure 5 the cross-sectional view of the cross-section of the gas flow distribution unit of

[0038] Figure 7 is a view showing the gas flow distribution unit in the second mode when viewed from above.

[0039] Figure 8 is showing Figure 7 the cross-sectional view of the cross-section of the gas flow distribution unit of

[0040] Figure 9 is a cross-sectional view showing a cross-section of the substrate processing apparatus, in which the gas flow distribution unit operates in the first mode during the first processing operation.

[0041] Figure 10 is a cross-sectional view showing a cross-section of the substrate processing apparatus, in which the gas flow distribution unit operates in the second mode during the second processing operation.

[0042] Figure 11 shows a substrate processing method according to an exemplary embodiment of the present invention. Detailed Description

[0043] Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The exemplary embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following exemplary embodiments. These exemplary embodiments are provided to more comprehensively explain the present invention to those of ordinary skill in the art. Therefore, the shapes of the elements in the drawings are exaggerated to emphasize a clearer description.

[0044] Figure 1 is a top plan view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0045] Referring to Figure 1 , the substrate processing apparatus includes a transfer module 10, a processing module 20, and a controller 30. According to an exemplary embodiment, the transfer module 10 and the processing module 20 are arranged along one direction. Hereinafter, the arrangement direction of the transfer module 10 and the processing module 20 will be referred to as a first direction 92, and when viewed from above, the direction perpendicular to the first direction 92 will be referred to as a second direction 94, and the direction perpendicular to both the first direction 92 and the second direction 94 will be referred to as a third direction 96.

[0046] The transfer module 10 transfers the substrate W from the container 80 that houses the substrate W to the processing module 20, and houses the substrate W that has been completely processed in the processing module 20 in the container 80. The length direction of the transfer module 10 is set in the second direction 94. The transfer module 10 includes a load port 12 and a transfer frame 14. Based on the transfer frame 14, the load port 12 is located on the side opposite to the processing module 20. The container 80 that houses the substrate W is placed on the load port 12. The load port 12 can be provided in plurality, and the plurality of load ports 12 can be arranged along the second direction 94.

[0047] As the container 80, a hermetic container such as a front-opening unified pod (FOUP) can be used. The container 80 can be placed on the load port 12 by a transfer device (not shown), such as an overhead transfer device, an overhead conveyor, or an automated guided vehicle, or an operator.

[0048] A transfer robot 120 is provided on the transfer frame 14. A guide rail 140 having a length direction in the second direction 94 is provided inside the transfer frame 14, and the transfer robot 120 can be provided to be movable on the guide rail 140. The transfer robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 can be provided to be movable back and forth, rotatable about the third direction 96, and movable along the third direction 96. A plurality of hands 122 are provided to be spaced apart in the vertical direction, and the hands 122 can move back and forth independently of each other.

[0049] The processing module 20 includes a buffer unit 200, a transfer chamber 300, and a processing chamber 400. The buffer unit 200 provides a space for temporarily holding the substrate W when loading the substrate W into the processing module 20 and unloading the substrate W from the processing module 20. The processing chamber 400 performs a processing procedure of liquid processing on the substrate W by supplying liquid to the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200 and the liquid processing chamber 400.

[0050] The transfer chamber 300 can be arranged such that the length direction is the first direction 92. The buffer unit 200 can be arranged between the indexing module 10 and the transfer chamber 300. A plurality of liquid processing chambers 400 are provided, and can be arranged on the side of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 can be arranged along the second direction 94. The buffer unit 200 can be located at one end of the transfer chamber 300.

[0051] According to this example, the liquid processing chambers 400 are respectively arranged on both sides of the transfer chamber 300. On both sides of the transfer device 300, the liquid processing devices 400 can be arranged in an array of A×B (where A and B are each a natural number of 1 or greater than 1) along the first direction 92 and the third direction 96.

[0052] The transfer chamber 300 includes a transfer robot 320. A guide rail 340 having a length direction along the first direction 92 is provided in the transfer chamber 300, and the transfer robot 320 can be arranged to be movable on the guide rail 340. The transfer robot 320 includes a hand 322 for placing the substrate W, and the hand 322 can be arranged to be movable back and forth, rotatable about the third direction 96, and movable along the third direction 96. A plurality of hands 322 are arranged at intervals in the vertical direction, and the hands 322 can move back and forth independently of each other.

[0053] The buffer unit 200 includes a plurality of buffers 220, and the substrate W is placed on the buffers 220. The buffers 220 can be arranged at intervals from each other in the third direction 96. The front and back of the buffer unit 200 are open. The front is the surface facing the indexing module 10, and the back is the surface facing the transfer chamber 300. The indexing robot 120 can approach the buffer unit 200 through the front, and the transfer robot 320 can approach the buffer unit 100 through the back.

[0054] Figure 2 is schematically shown Figure 1 of an exemplary embodiment of the liquid processing chamber 400. Referring to Figure 2 , the liquid processing chamber 400 includes a housing 410, a cup portion 420, a support unit 440, a nozzle unit 460, a lifting unit 480, a fan filter unit 490, an air flow distribution unit 1400, and a controller.

[0055] The housing 410 is provided in a substantially rectangular parallelepiped shape. The cup portion 420, the support unit 440, and the liquid supply unit 460 are provided in the housing 410.

[0056] The cup portion 420 has a processing space with an open top, in which the substrate W is liquid-processed. The support unit 440 supports the substrate W in the processing space. The liquid supply unit 460 supplies liquid onto the substrate W supported by the support unit 440. The liquid can be provided in multiple types and can be sequentially supplied onto the substrate W. The lifting unit 480 adjusts the relative height between the cup portion 420 and the support unit 440.

[0057] According to this example, the cup portion 420 includes a plurality of recovery containers 422, 424, and 426. The recovery containers 422, 424, and 426 each have a recovery space for recovering the liquid used for processing the substrate. The recovery containers 422, 424, and 426 are each provided in an annular shape around the support unit 440. When the liquid processing process is in progress, the processing liquid scattered by the rotation of the substrate W is introduced into the recovery space through the inlets 422a, 424a, and 426a of the respective recovery containers 422, 424, and 426. According to this example, the cup portion 420 includes a first recovery container 422, a second recovery container 424, and a third recovery container 426. The first recovery container 422 is provided around the support unit 440, the second recovery container 424 is provided around the first recovery container 422, and the third recovery container 426 is provided around the second recovery container 424. The second inlet 424a for introducing liquid into the second recovery container 424 can be located above the first inlet 422a for introducing liquid into the first recovery container 422, and the third inlet 426a for introducing liquid into the third recovery container 426 can be located above the second inlet 426a.

[0058] The support unit 440 includes a support plate 442 and a drive shaft 444. The upper surface of the support plate 442 can be provided in a substantially circular shape and can have a diameter larger than the diameter of the substrate W. In the central portion of the support plate 442, a support pin 442a is provided to support the rear surface of the substrate W, and the upper end of the support pin 442a protrudes from the support plate 442 such that the substrate W is spaced apart from the support plate 442 by a certain distance. Chuck pins 442b are provided at the edge of the support plate 442. The chuck pins 442b are provided to protrude upward from the support plate 442 and support the lateral portions of the substrate W such that when the substrate W rotates, the substrate W does not separate from the support unit 440. The drive shaft 444 is driven by a driver 446, is connected to the center of the bottom surface of the substrate W, and rotates the support plate 442 relative to its central axis.

[0059] The nozzle unit 460 includes a first nozzle 462 and a second nozzle 464. The first nozzle 462 supplies a first liquid onto the substrate W. According to this example, when processing the substrate, the first liquid may require an atmosphere with a lower humidity compared to the second liquid. In addition, the first liquid can be isopropyl alcohol (IPA). The second nozzle 464 supplies a second liquid onto the substrate W. According to an exemplary embodiment, more fumes may be generated in the second liquid compared to the first liquid. The second liquid can be a mixture of a sulfuric acid mixture (SPM).

[0060] The first nozzle 462 and the second nozzle 464 are respectively supported on different arm portions 461, and the arm portions 461 can move independently. Optionally, the first nozzle 462 and the second nozzle 464 can be mounted on the same arm portion and move simultaneously.

[0061] Optionally, in addition to the first nozzle 462 and the second nozzle 464, the liquid supply unit can further include one or more nozzles. The additional nozzles can supply different types of processing liquids to the substrate. For example, other types of processing liquids can be acid solutions or alkaline solutions for removing foreign substances on the substrate. In addition, another type of processing liquid can be an alcohol with a surface tension lower than that of water. For example, the alcohol can be isopropyl alcohol.

[0062] The lifting unit 480 moves the cup portion 420 in the vertical direction. By moving the cup portion 420 up and down, the relative height between the cup portion 420 and the substrate W changes. Therefore, since the recovery containers 422, 424, and 426 for recovering the processing liquid change according to the type of liquid supplied to the substrate W, the liquids can be separated and recovered. Different from the description, the cup portion 420 can be fixedly installed, and the lifting unit 480 can move the support unit 440 in the vertical direction.

[0063] The fan filter unit (FFU) 490 forms a downward air flow in the internal space of the housing 410. The fan filter unit 490 includes an air flow supply pipeline 491, a fan 492, and a filter 493. The air flow supply pipeline 491 is connected to the housing 410. The air flow supply pipeline 491 supplies external air to the housing 410. The filter 493 filters pollutants or specific chemical components from the air supplied by the air flow supply pipeline 491. The fan 492 is installed on the upper surface of the housing 410. The fan 492 is located in the central area of the upper surface of the housing 410. The fan 492 forms a downward air flow in the internal space of the housing 410. The fan 492 introduces air from the air flow supply pipeline 491 so that the air flows downward.

[0064] Figure 3 is Figure 2 a schematic diagram of the air flow distribution unit, Figure 4 is Figure 3 a schematic diagram of the fixing plate of the air flow distribution unit.

[0065] The air flow distribution unit 1400 controls the flow of the downward air flow provided by the fan 492. The air flow distribution unit 1400 is provided below the fan 492. In addition, the air flow distribution unit 1400 is provided above the processing container 420. The air flow distribution unit 1400 is provided near the fan 492. The air flow distribution unit 1400 includes a fixed plate 1410, a moving plate 1420, and a driver 1430. The fixed plate 1410 and the moving plate 1420 are provided by being stacked in the vertical direction. According to this example, the moving plate 1420 can be provided above the fixed plate 1410. The moving plate 1420 is provided adjacent to the fixed plate 1410. The moving plates can be spaced apart from each other by a small interval to prevent friction between the moving plate 1420 and the fixed plate 1410 when the moving plate 1420 moves relative to the fixed plate.

[0066] Referring to Figure 3 and Figure 4 , the fixed plate 1410 is set in a rectangular plate shape. The fixed plate 1410 includes a first region A1 and a second region A2. The first region A1 is located in the central region of the fixed plate 1410. When viewed from above, the first region A1 can be set as the region corresponding to the opening formed by the processing container 420. The first region A1 can be centered on the central axis of the support unit 440. According to this example, the first region A1 can be set as a circle. A plurality of first holes 1411 are formed in the first region A1. The first holes 1411 are formed to penetrate the upper and lower portions of the first region A1.

[0067] The second region A2 is provided to surround the first region A1. A plurality of second holes 1412 are formed in the second region A2. The second holes 1412 are formed to penetrate the upper and lower portions of the fixed plate 1410. The aperture ratio of the first holes 1411 in the first region A1 is set to be different from the aperture ratio per unit area of the second holes 1412 in the second region A2. According to the present exemplary embodiment, the aperture ratio of the second holes 1412 in the second region A2 is set to be lower than the aperture ratio per unit area of the first holes 1411 in the first region A1. According to this example, the diameters of the first holes 1411 and the second holes 1412 can be set to be the same, and the density of the second holes 1412 in the second region A2 can be lower than the density of the first holes 1411. For example, in the first region A1, the first holes 1411 are arranged in a lattice shape, in the second region A2, the second holes 1412 are arranged in a lattice shape, and the interval between the first holes 1411 can be formed to be narrower than the interval between the second holes 1412.

[0068] The movable plate 1420 can be set to have the same size as the first region A1. The movable plate 1420 can move between a first position B1 and a second position B2. When viewed from above, the first position B1 is the position where the movable plate 1420 is completely deviated from the first region A1. For example, when viewed from above, the second position B1 can overlap with the second region A2. The movable plate 1420 can be set to have a size corresponding to the first region A1. When viewed from above, the second position B2 is the position where the movable plate 1420 completely overlaps with the first region A1.

[0069] The movable plate 1420 includes a plurality of third holes 1423 vertically passing through the movable plate 1420. In the movable plate 1420, the aperture ratio per unit area of the third holes 1423 is different from the aperture ratio per unit area of the first holes 1411 in the first region A1. In the movable plate 1420, the aperture ratio per unit area of the third holes 1423 can be equal to the aperture ratio per unit area of the second holes 1412 in the second region A2. The third holes 1423 can be set to have the same diameter as the first holes 1411 and the second holes 1412. The third holes 1423 can be arranged in a lattice shape in the movable plate 1420. In addition, when the movable plate 1420 is in the second position B2, in the region where the movable plate 1420 and the second region A2 overlap each other when viewed from above, the third holes 1423 formed in the movable plate 1420 and the second holes 1412 formed in the second region A1 are set in the same pattern and size. When the movable plate 1420 is in the second position A2, when viewed from above, all the third holes 1423 formed in the movable plate 1420 completely overlap with some of the first holes 1411 formed in the first region A1. However, another part of the first holes 1411 formed in the first region A1 is blocked by the movable plate 1420. Even though the aperture ratios of the movable plate 1420 and the first region A1 are different, the downward air flow passing through the third holes 1423 can pass through the first holes 1411. According to this example, the movable plate 1420 includes a first plate 1421 and a second plate 1422. The first plate 1421 and the second plate 1422 can be moved by a driver described later. The first plate 1421 and the second plate 1422 are arranged to be movable in directions away from or close to each other. The first plate 1421 and the second plate 1422 are arranged to be movable between the first position B1 and the second position B2. According to this example, the first plate 1421 and the second plate 1422 are away from each other at the first position B1. At the second position B2, the first plate 1421 and the second plate 1422 are in contact with each other.

[0070] The driver 1430 moves the movable plate 1420 on the fixed plate 1410. According to this example, the driver 1430 moves the first plate 1421 and the second plate 1422. In addition, according to this example, a motor can be used as the driver 1430. Optionally, a cylinder can be used as the driver 1430.

[0071] The air flow distribution unit 1400 distributes the downward air flow in a mode selected from the first mode M1 and the second mode M2. In the first mode M1 and the second mode M2, the flow pattern of the downward air flow is different.

[0072] Figure 5 and Figure 6 are a schematic diagram and a cross-sectional view of the air flow distribution unit in the first mode when viewed from above, Figure 7 and Figure 8 are a schematic diagram and a cross-sectional view of the air flow distribution unit in the second mode when viewed from above. Figures 5 to 8 The dashed lines shown in are used to indicate the first position B1 or the second position B2.

[0073] The first mode M1 is a mode for providing a more uniform downward air flow in the internal space than the second mode M2. Compared with the first mode M1, the second mode M2 is a mode that allows the downward air flow to concentrate in the processing space.

[0074] Referring to Figure 5 and Figure 6 , in the first mode M1, the driver 1430 moves the first plate 1421 and the second plate 1422 in a direction away from each other. The first plate 1421 and the second plate 1422 are located at the first position B1. Therefore, all the first holes 1411 in the first area A1 are open. In addition, since all the second holes 1412 in the area of the second area A2 overlapping with the moving plate 1420 overlap with the third holes 1423, all the second holes 1412 formed in the second area A1 are open. The downward air flow passes through the first holes 1411 in the first area A1. In addition, the downward air flow passes through the second holes 1412 in the second area A2 and the third holes 1423 of the moving plate 1420. As described above, since the second holes 1412 and the third holes 1423 are set to coincide with each other at the first position B1, the downward air flow passing through the second holes 1412 can directly pass through the third holes 1423. In the first mode M1, the downward air flow directly passes through the first area A1. Since the aperture ratio of the first area A1 is set to be larger than the aperture ratio of the second area A2 and the moving plate 1420, more downward air flow can flow. For example, since the first area A1 has a size corresponding to the opening size of the processing container 420 and is set at a position corresponding to the opening position of the processing container 220, the downward air flow can be concentrated in the processing container 420.

[0075] Referring to Figure 7 and Figure 8, in the second mode M2, the moving plate 1420 is located at the second position B2. In the second mode M2, the first plate 1421 and the second plate 1422 are in contact with each other. Therefore, all the second holes 1412 formed in the second region A2 are open, but only some of the first holes 1411 formed in the first region are open. The downward airflow formed by the fan 492 passes through the second holes 1412 and the third holes 1423. The downward airflow passing through the third holes 1423 passes through the first holes 1411. Since the third holes 1423 and the first holes 1411 are formed by overlapping each other, the downward airflow passing through the third holes 1425 can pass through the first holes 1411. Since the second region A2 where the second holes 1412 are formed and the moving plate 1420 where the third holes 1423 are formed have the same aperture ratio, the downward airflow is continuously distributed to the internal space. When the downward airflow is continuously distributed, the atmosphere of the internal space can be continuously maintained.

[0076] Next, a method of processing a substrate by using a substrate processing apparatus according to an exemplary embodiment of the present invention will be described. Figure 9 and Figure 10 are diagrams showing the airflow in a liquid processing chamber according to an exemplary embodiment of the present invention in a first processing operation and a second processing operation. The airflow distributed by the airflow distribution unit 1400 is shown by a plurality of arrows.

[0077] As Figure 11 shown, a substrate processing method according to an exemplary embodiment of the present invention includes a first processing operation S10 and a second processing operation S20. The first processing operation S10 and the second processing operation S20 may be processes of supplying a first liquid and a second liquid to a substrate W at different time points. According to an exemplary embodiment, the first liquid and the second liquid are sequentially supplied to the substrate W. The first liquid and the second liquid may be continuously supplied, and another liquid may be supplied between the supply of the first liquid and the supply of the second liquid.

[0078] Referring to Figure 9 , in the first processing operation S10, the substrate W is processed by supplying a first liquid to the substrate W located in the processing space in a state where a downward airflow is provided to the internal space and the processing space. In the first processing operation S10, the substrate is processed by supplying a first liquid to the substrate located in the processing space in a state where a downward airflow is provided to the internal space and the processing space. In this case, in the first processing operation S10, the airflow distribution unit 1400 operates in the first mode M1. In the first processing operation S10, the downward airflow flows more uniformly into the internal space and the processing space than in the second processing operation S20. The first liquid may be a chemical liquid. For example, the first liquid may be a mixed liquid containing a sulfuric acid and hydrogen peroxide mixture (SPM).

[0079] Referring toFigure 10 In the second processing operation S20, the substrate W is processed by supplying a second liquid to the substrate W while a downward air flow is supplied to the internal space and the processing space. In the second processing operation S20, the substrate is processed by supplying a second liquid to the substrate while a downward air flow is supplied to the internal space and the processing space. In this case, in the second processing operation S20, the air flow distribution unit 1400 operates in the second mode M2. In the second processing operation S20, the downward air flow flows more strongly into the processing space than in the first processing operation S10. The second liquid may be an organic solvent. For example, the organic solvent may be isopropyl alcohol (IPA). When processing the substrate W with an organic solvent, a lower humidity environment may be required than when processing the substrate with SPM. The air flow distribution unit 1400 operates in the first mode M1 to evenly distribute the downward air flow to the internal space, thereby maintaining the internal space in a low humidity environment. SPM generates more fumes than organic solvents. The fumes are easily dispersed to the outside of the processing container. In the second mode M2, the downward air flow is concentrated in the processing space to prevent the fumes generated in the processing space from spreading to the outside of the processing container through the upper part of the processing space.

[0080] In the above example, an example in which the moving plate 1420 is divided into two plates 1421 and 1422 has been described. However, the present invention is not limited thereto, and the moving plate 1420 may be provided as a single plate or divided into three or more plates.

[0081] In addition, in the above example, the present invention has been described based on the case where the moving plate 1420 is provided on the fixed plate 1410 as an example. However, the present invention is not limited thereto, and the moving plate 1420 may also be provided below the fixed plate 1410. Therefore, a support member (not shown) for supporting the moving plate 1420 may be provided.

[0082] In addition, in the above example, the present invention has been described based on the case where the first solution is isopropyl alcohol and the second solution is SPM. However, the types of the first solution and the second solution are not limited thereto.

[0083] In addition, in the above example, the present invention has been described by taking the case of supplying the second solution after the first solution as an example. However, the present invention is not limited thereto, and only the first solution or the second solution may be supplied.

[0084] In addition, in the above example, the present invention has been described based on the case where the moving plate overlaps the second region A2 of the fixed plate 1410 at the second position B2. However, the present invention is not limited thereto, and the moving plate 1420 may be moved to a region that does not overlap the fixed plate 1410 at the second position B2.

[0085] In addition, in the above example, the present invention has been described based on a process of providing a cleaning liquid as a processing liquid and using the cleaning liquid to clean the substrate W. However, the present exemplary embodiment is not limited to the cleaning process, but can be applied to various substrate processing processes using liquids, such as an etching process, an ashing process, and a developing process.

[0086] The above detailed description illustrates the present invention. In addition, the above description shows and describes exemplary embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, within the scope of the present invention concept disclosed herein, within the scope equivalent to the written disclosure, and / or within the scope of the art or knowledge, changes or modifications can be made. The above exemplary embodiments describe the best state of realizing the technical spirit of the present invention, and various changes can be made in the specific application fields and uses of the present invention. Therefore, the above detailed description of the present invention is not intended to limit the present invention to the disclosed exemplary embodiments. In addition, the appended claims should also be construed as including other exemplary embodiments.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: a housing having an upper wall and providing an interior space; a processing container disposed in the inner space and providing a processing space having an open top; a supporting unit for supporting a substrate in the processing space; a liquid supply unit for supplying a processing liquid onto the substrate supported by the support unit; an exhaust unit for exhausting the processing space; a fan for supplying a downdraft of air into the interior space; as well as an air flow distribution unit, which is disposed below the fan and above the processing container and distributes the descending air flow to the inner space, wherein the airflow distribution unit is configured to distribute the downflow in a mode selected from a first mode and a second mode, and In the first mode and the second mode, the flow of the downdraft is provided differently from each other.

2. The device according to claim 1, wherein the air flow distribution unit comprises: Fixed plate; a moving plate stacked on the fixed plate; as well as a driver for driving the moving plate, and The fixing plate has: a first region having a plurality of first holes formed therein extending therethrough in a vertical direction; and A second region, which surrounds the first region and has a plurality of second holes penetrating in a vertical direction, The movable plate includes a plurality of third holes penetrating in the vertical direction, The movable plate is configured to be movable between a first position and a second position, and When viewed from above, the first position is a position where the moving plate overlaps the first region, and the second position is a position where the moving plate deviates from the first region. 3 . The apparatus according to claim 2 , wherein an aperture ratio per unit area of ​​the first holes in the first region is different from an aperture ratio per unit area of ​​the second holes in the second region. 4 . The apparatus according to claim 2 , wherein an aperture ratio per unit area of ​​the first holes in the first region is greater than an aperture ratio per unit area of ​​the second holes in the second region.

5. The apparatus of claim 3, wherein the first hole, the second hole, and the third hole have the same diameter.

6. The apparatus according to claim 2, wherein the moving plate comprises a first plate and a second plate, The first plate and the second plate are arranged to be movable in directions toward each other or in directions opposite to each other, and The drive is configured to move the first plate and the second plate between the first position and the second position.

7. The apparatus of claim 1, wherein the first mode allows the flow of the downdraft to be concentrated in the processing space compared to the second mode.

8. The device according to claim 7, wherein: The second mode provides a more uniform flow of airflow in the interior space than the first mode.

9. The apparatus of claim 2, wherein in the first mode, when viewed from above, the moving plate is located in the second area, and the third hole overlaps the second hole.

10. The device of claim 9, wherein in the second mode, when viewed from above, the moving plate is located in the first area, and The third hole overlaps with the first hole.

11. The device according to claim 4, wherein: The driver moves the moving plate to the first position when the treatment liquid is a first liquid, and moves the moving plate to the second position when the treatment liquid is a second liquid.

12. The apparatus of claim 11, wherein when the substrate is treated with the first liquid, more smoke is generated than with the second liquid, and Compared to the first liquid, low humidity is required when treating the substrate with the second liquid.

13. The device according to claim 2, wherein the first area has a circular shape, and When viewed from above, the first area has a size corresponding to an opening of the processing container through which the downflow flows into the processing space.

14. A method for processing a substrate by using a substrate processing apparatus, the substrate processing apparatus comprising a housing providing an internal space and a chamber placed in the internal space and providing a processing space for processing the substrate, the method comprising: a first processing operation of processing the substrate by supplying a first liquid to the substrate located in the processing space in a state where a downward air flow is provided to the inner space and the processing space; a second processing operation of processing the substrate by supplying a second liquid to the substrate in a state where a downward air flow is provided to the inner space and the processing space, wherein in the first treatment operation, the downdraft flows more strongly toward the treatment space than in the second treatment operation, and In the second processing operation, the downflow flows toward the inner space and the processing space more uniformly than in the first processing operation. 15 . The method of claim 14 , wherein in the first processing operation, the downflow flowing into the processing space flows through a plurality of injection holes more than the downflow flowing into the internal space other than the processing area. 16 . The method according to claim 15 , wherein in the second treatment operation, the downflow flows into the treatment space through a plurality of injection holes having the same diameter.

17. The method of claim 16, wherein fumes are further exhausted from the processing space during the first processing operation compared to the second processing operation, and During the second processing operation, the humidity of the processing space is maintained lower than the humidity of the first processing operation.

18. An apparatus for processing a substrate, the apparatus comprising: a housing having an upper wall and providing an interior space; a processing container disposed in the internal space, having an opening with an open top, and providing a processing space; a supporting unit for supporting and rotating the substrate in the processing space; a liquid supply unit for supplying a processing liquid onto the substrate supported by the support unit; an exhaust unit for exhausting the processing space; a fan placed on the upper wall of the housing and supplying a descending airflow into the inner space; as well as an air flow distribution unit, which is disposed below the fan and above the processing container and distributes the descending air flow to the inner space, wherein the airflow distribution unit is configured to distribute the downflow to the interior space in a mode selected from a first mode and a second mode, In the first mode and the second mode, The air flow distribution unit comprises: Fixed plate; A movable plate stacked on the fixed plate; and a driver for moving the moving plate, and The fixing plate has: a first region having a plurality of first holes formed therein extending therethrough in a vertical direction; and a second region surrounding the first region and having a plurality of second holes penetrating in a vertical direction, and An aperture ratio per unit area of ​​the first holes in the first region is greater than an aperture ratio per unit area of ​​the second holes in the second region.

19. The apparatus according to claim 18, wherein: When the treatment liquid is the first liquid, the air flow distribution unit operates in the first mode, In the first mode, the moving plate is located in the second area, the second hole and the third hole overlap, and When the treatment liquid is a second liquid, the air flow distribution unit operates in the second mode, and In the second mode, the moving plate is located in the first area, and the first hole and the third hole overlap.

20. The apparatus of claim 19, wherein the first liquid is a processing liquid that generates more smoke than the second liquid during substrate processing, and The second liquid is a processing liquid that needs to have a lower humidity than the first liquid in the processing space when processing the substrate.

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