Substrate processing apparatus

Abstract

The present invention relates to a substrate processing apparatus, comprising: a cup having a processing space therein; a support unit for supporting the substrate in the processing space; a guide ring unit located in the processing space, surrounding the substrate placed on the support unit and guiding the processing liquid scattered from the substrate into the cup body; a liquid supply unit for supplying a processing liquid to the substrate; and a driver; the support unit includes: a rotary chuck on which the substrate is placed and which is rotatable; and a chuck pin disposed on the rotary chuck and supporting the substrate at a side portion of the substrate; the guide ring unit is provided to be movable in a vertical direction with respect to the rotary chuck, and the chuck pin is provided to be movable between a support position supporting an end portion of the substrate placed on the rotary chuck and a spaced position spaced apart from the end portion of the substrate placed on the rotary chuck. And the driver moves the guide ring relative to the rotary chuck and simultaneously moves the chuck pin between the support position and the spaced position.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus including a support unit capable of simultaneously driving a guide ring unit and a chuck pin. Background Art

[0002] The semiconductor process includes a process of cleaning a film, foreign matter, particles, etc. on a substrate. The cleaning process is performed by placing the substrate on a rotating chuck and supplying a processing liquid to the upper surface of the substrate while the rotating chuck is rotating. In this case, since the film deposited on the bottom surface of the substrate acts as foreign matter in subsequent processes, a cleaning process is also performed on the lower surface of the substrate to remove unnecessary films and other foreign matters. When cleaning the bottom surface of the substrate, a rear nozzle for spraying the processing liquid onto the bottom surface of the substrate needs to be provided.

[0003] During the rotation of the rotating chuck, the processing liquid is scattered. The scattered liquid is collected by a cup surrounding the rotating chuck to prevent contamination and to recycle or dispose of the wafer. Since there are various types of processing liquids, different cups are required to separate and collect the processing liquids when collecting the processing liquids. However, in order to prevent interference between the rotating chuck and the cup when the substrate is loaded onto and unloaded from the rotating chuck, the rotating chuck and the cup are spaced apart by a certain distance. Due to this interval, there is a problem that the processing liquid scattered from the rotating chuck cannot be collected by an appropriate cup.

[0004] Therefore, a guide ring can be provided adjacent to the rotating chuck to guide the scattered processing liquid to an appropriate cup. However, when the guide ring is provided, there is a problem that it is difficult to transfer the substrate due to interference between the guide ring and the substrate. In addition, when a rear nozzle for discharging the processing liquid to the lower surface of the substrate is provided in the rotating chuck, it is difficult to transfer the substrate by adjusting the height of the rotating chuck. Summary of the Invention

[0005] The present invention aims to provide a substrate processing apparatus capable of solving interference between a transfer robot and a guide ring when loading a substrate into a rotating chuck or unloading the substrate from the rotating chuck.

[0006] The present invention also aims to provide a substrate processing apparatus capable of transferring a substrate without adjusting the height of a rotating chuck in a substrate processing apparatus provided with a guide ring and a rear nozzle.

[0007] The present invention also aims to provide a substrate processing apparatus capable of increasing the separation and recovery rate of various processing liquids.

[0008] The problems to be solved by the present invention are not limited to the above problems, and those skilled in the art can clearly understand the problems not mentioned from the following description.

[0009] Exemplary embodiments of the present invention provide a substrate processing apparatus, the apparatus comprising: a cup having a processing space therein; a support unit for supporting a substrate within the processing space; a guide ring unit located in the processing space, surrounding the substrate placed on the support unit, and guiding the processing liquid scattered from the substrate into the cup; a liquid supply unit for supplying the processing liquid to the substrate; and a driver; wherein the support unit includes: a rotating chuck on which the substrate is placed and which is capable of rotating; and chuck pins provided on the rotating chuck and supporting the substrate at side portions of the substrate; the guide ring unit is arranged to be movable in a vertical direction relative to the rotating chuck, the chuck pins are arranged to be movable between a support position and a spaced position, the support position supporting an end portion of the substrate placed on the rotating chuck, and the spaced position being spaced apart from the end portion of the substrate placed on the rotating chuck, and the driver moves the guide ring relative to the rotating chuck and simultaneously moves the chuck pins between the support position and the spaced position.

[0010] According to an exemplary embodiment of the present invention, the guide ring is movable between a processing position and a waiting position, the processing position being a position where a relative height with respect to the rotating chuck is higher than the waiting position, and the chuck pins may be arranged such that when the guide ring moves from the waiting position to the processing position, the chuck pins move from the spaced position to the support position.

[0011] According to an exemplary embodiment of the present invention, the chuck pins may be arranged such that when the guide ring moves from the processing position to the waiting position, the chuck pins move from the support position to the spaced position.

[0012] According to an exemplary embodiment of the present invention, the cup includes: an inner cup; an intermediate cup surrounding the inner cup; and an outer cup surrounding the intermediate cup, and the guide ring may be arranged to guide the processing liquid scattered from the substrate into a space selected from a space between the inner cup and the intermediate cup and a space between the intermediate cup and the outer cup.

[0013] According to an exemplary embodiment of the present invention, the apparatus may further include: a pin drive link connected to the driver; wherein the chuck pins are moved by the pin drive link, and the pin drive link may include: a first link to which the chuck pins are coupled; and a second link pivotally coupled to the first link and mounted in the guide ring.

[0014] According to an exemplary embodiment of the present invention, the device may further include: an elastic member; wherein, the elastic member is installed below the guide ring support and is configured to be in a compressed state at the processing position so as to apply an elastic force toward the guide ring.

[0015] According to an exemplary embodiment of the present invention, the guide ring includes: an upper ring; a lower ring, the lower ring facing the upper ring in the vertical direction; and an intermediate ring, the intermediate ring being disposed between the upper ring and the lower ring, and the upper ring, the intermediate ring, and the lower ring can be fixed to each other by fixing rods.

[0016] According to an exemplary embodiment of the present invention, the driver and the guide ring unit may be separately provided.

[0017] According to an exemplary embodiment of the present invention, the processing liquid is provided as a first processing liquid or a second processing liquid different from the first processing liquid, and the liquid supply unit includes: a first nozzle for discharging the first processing liquid onto the upper surface of the substrate; and a second nozzle for discharging the second processing liquid onto the lower surface of the substrate, and the first processing liquid and the second processing liquid can be separated and recovered by the guide ring.

[0018] According to an exemplary embodiment of the present invention, the device includes: a cup body having a processing space therein; a support unit for supporting a substrate in the processing space; a guide ring unit located in the processing space, surrounding the substrate placed on the support unit, and guiding the processing liquid scattered from the substrate into the cup body; a liquid supply unit for supplying the processing liquid to the substrate; and a first driver for driving the guide ring; wherein, the guide ring unit includes: a guide ring for guiding the processing liquid scattered from the substrate into the cup body; and a guide ring support, the guide ring being installed in the guide ring support, and the first driver is connected to the guide ring support; the support unit includes: a rotating chuck on which the substrate is placed and the rotating chuck is capable of rotating; and a chuck pin provided on the rotating chuck and supporting the substrate at the side of the substrate; and a pin driving link coupled to the chuck pin, and the pin driving link drives the chuck pin to approach or move away from the substrate supported by the rotating chuck, and the driving of the pin driving link and the first driver can operate in coordination.

[0019] According to an exemplary embodiment of the present invention, the chuck pin moves in a direction approaching the substrate placed on the rotating chuck when the guide ring is raised, and can move in a direction away from the substrate placed on the rotating chuck when the guide ring is lowered.

[0020] According to an exemplary embodiment of the present invention, the pin driving link includes: a first link coupled to the chuck pin; and a second link connected to the first link and mounted on the guide ring support, and the first link and the second link and the second link and the guide ring support can be pivotally coupled to each other.

[0021] According to an exemplary embodiment of the present invention, the device may further include: an elastic member; wherein the elastic member may be mounted below the guide ring support and is set to be in a compressed state at the processing position to apply an elastic force toward the guide ring support.

[0022] According to an exemplary embodiment of the present invention, the support unit includes: a rotating shaft for supporting the rotating chuck at the center of the bottom surface of the rotating chuck; a second driver for providing a rotational force to the rotating shaft; a first plate to which the guide ring support is connected and the first plate is arranged to surround the rotating shaft; and a second plate connected to the first driver and arranged to surround the first plate, and the first plate is formed with a first protrusion and a first groove, the second plate is formed with a second groove corresponding to the shape and position of the first protrusion and a second protrusion corresponding to the shape and position of the first groove, when viewed from above, the first groove and the second groove are arranged such that a partial area overlaps when the first plate rotates, and when the rotating chuck rotates, the first plate and the second plate can be spaced apart from each other.

[0023] According to an exemplary embodiment of the present invention, a plurality of chuck pins are provided, the plurality of chuck pins are respectively coupled to a plurality of first links, the plurality of first links are respectively connected to a plurality of second links, and the plurality of second links can be mounted on the guide ring support.

[0024] According to an exemplary embodiment of the present invention, the processing liquid is provided as a first processing liquid or a second processing liquid different from the first processing liquid. The cup body includes: an inner cup surrounding the support unit; an intermediate cup surrounding the inner cup; and an outer cup surrounding the intermediate cup. The inner cup, the intermediate cup, and the outer cup are stacked on one another. The inner cup is provided with a first inlet through which the second processing liquid is scattered. The inner cup and the intermediate cup are combined with each other to provide a second inlet through which the first processing liquid or the second processing liquid is scattered. The intermediate cup and the outer cup are combined with each other to provide a third inlet through which the first processing liquid is scattered. The guiding ring includes: an upper ring; a lower ring facing the upper ring in the vertical direction; and an intermediate ring disposed between the upper ring and the lower ring. The upper ring, the intermediate ring, and the lower ring are fixed to each other by fixing rods and can be positioned such that during the processing of the substrate, the first processing liquid or the second processing liquid is scattered onto the first inlet, the second inlet, or the third inlet.

[0025] According to an exemplary embodiment of the present invention, the liquid supply unit may include: a first nozzle for discharging the first processing liquid onto the upper surface of the substrate; and a second nozzle for discharging the second processing liquid onto the lower surface of the substrate.

[0026] According to an exemplary embodiment of the present invention, the device includes: a cup body having a processing space therein; a support unit for supporting a substrate within the processing space; a guide ring unit located in the processing space, surrounding the substrate placed on the support unit, and guiding the processing liquid scattered from the substrate into the cup body; a liquid supply unit including a first nozzle for discharging the first processing liquid onto the upper surface of the substrate and a second nozzle for discharging the second processing liquid onto the bottom surface of the substrate; and a driving unit for driving the guide ring unit and the support unit; wherein, the support unit includes: a rotating chuck on which the substrate is placed and which can rotate; chuck pins provided on the rotating chuck and supporting the substrate at the side of the substrate; a rotating shaft for supporting the rotating chuck at the center of the bottom surface of the rotating chuck; and a pin driving link connected to the chuck pins and driving the chuck pins to approach or move away from the substrate supported by the rotating chuck; and the guide ring unit includes: a guide ring for guiding the processing liquid scattered from the substrate into the cup body; and a guide ring support member in which the guide ring is installed and to which a first driver is connected; and the driving unit includes: a first driver for driving the guide ring unit; a second driver for driving the support unit; a first plate to which the guide ring support member is connected and which is arranged to surround the rotating shaft; and a second plate connected to the first driver and arranged to surround the first plate; and the pin driving link includes: a first link connected to the chuck pins; and a second link connected to the first link and installed on the guide ring support member, the first link and the second link being arranged to pivot at the connection point connecting the first link and the second link, the second link and the guide ring support member being arranged to pivot at the installation point where the second link is installed on the guide ring support, when the guide ring unit is lowered, the chuck pins move in a direction away from the substrate, and when the guide ring unit is raised, the chuck pins move in a direction close to the substrate, the first plate is formed with a first protrusion and a first groove, the second plate is formed with a second groove corresponding to the shape and position of the first protrusion and a second protrusion corresponding to the shape and position of the first groove, when viewed from above, the first groove and the second groove can be arranged such that a partial area thereof overlaps when the first plate rotates.

[0027] According to an exemplary embodiment of the present invention, the device may further include: an elastic member; wherein, the elastic member may be installed below the guide ring support and is configured to be in a compressed state at the processing position to apply an elastic force toward the guide ring support.

[0028] According to an exemplary embodiment of the present invention, the cup body includes: an inner cup surrounding the support unit; an intermediate cup surrounding the inner cup; and an outer cup surrounding the intermediate cup, the inner cup, the intermediate cup, and the outer cup are stacked on top of each other, the inner cup is provided with a first inlet through which the second processing liquid is scattered, the inner cup and the intermediate cup are combined with each other to provide a second inlet through which the first processing liquid or the second processing liquid is scattered, the intermediate cup and the outer cup are combined with each other to provide a third inlet through which the first processing liquid is scattered; the guide ring includes: an upper ring; a lower ring facing the upper ring in the vertical direction; and an intermediate ring disposed between the upper ring and the lower ring, and the upper ring, the intermediate ring, and the lower ring are fixed to each other by fixing rods and can be positioned such that during the processing of the substrate, the first processing liquid or the second processing liquid is scattered onto the first inlet, the second inlet, or the third inlet.

[0029] According to an exemplary embodiment of the present invention, the vertical movement of the rotating chuck and the horizontal movement of the chuck pin can be performed simultaneously.

[0030] In addition, according to an exemplary embodiment of the present invention, interference between the transfer robot and the guide ring can be eliminated when the substrate is loaded onto or unloaded from the rotating chuck.

[0031] In addition, according to an exemplary embodiment of the present invention, the separation and recovery rate of various processing liquids can be improved.

[0032] In addition, according to an exemplary embodiment of the present invention, the substrate can be transferred without adjusting the height of the rotating chuck in the substrate processing equipment provided with the guide ring and the rear nozzle.

[0033] The effects of the present invention are not limited to the effects described above, and those effects not described will be apparent to those skilled in the art from this specification and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] After reading the detailed description in conjunction with the drawings, various features and advantages of the non-limiting exemplary embodiments of this specification may become apparent. The drawings are for illustrative purposes only and should not be construed as limiting the scope of the claims. For clarity, various dimensions in the drawings may be exaggerated.

[0035] Figure 1 is a top plan view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0036] Figure 2 is schematically showing Figure 1 a schematic diagram of an exemplary embodiment of a liquid processing chamber.

[0037] Figure 3 shows in more detail Figure 2 a schematic diagram of a support unit and a guide ring unit in the liquid processing chamber.

[0038] Figure 4 is a schematic diagram showing the moving direction of a pin driving link when a chuck pin moves from a spaced position to a support position.

[0039] Figure 5 shows when Figure 3 a schematic diagram of an exemplary embodiment of a pin driving link when a chuck pin in is in a spaced position.

[0040] Figure 6 shows when Figure 3 a schematic diagram of a state as viewed from above when a first plate and a second plate in are in a first position.

[0041] Figure 7 shows when Figure 3 a schematic diagram of a state as viewed from above when a first plate and a second plate in are in a second position.

[0042] Figure 8 is a schematic diagram showing the appearance of a support unit and a guide ring unit when the guide ring unit is in a waiting position and the chuck pin is in a spaced position.

[0043] Figure 9 is a schematic diagram showing a support unit and a guide ring unit when the guide ring unit is in a processing position and the chuck pin is in a support position. Detailed Description

[0044] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms, and that neither should be construed to limit the scope of the present disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies have not been described in detail.

[0045] The terms used herein are for the purpose of describing particular exemplary embodiments only and are not intended to be limiting. As used herein, unless the context clearly dictates otherwise, the singular forms may also be intended to include the plural forms when no quantity is specified. The terms "comprising," "including," and "having" are inclusive and thus specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Unless specifically identified as an order of execution, the method steps, processes, and operations described herein should not be construed as necessarily requiring them to be performed in the particular order discussed or illustrated. It should also be understood that additional or alternative steps may be employed.

[0046] When an element or layer is referred to as being "on," "engaged to," "connected to," or "coupled to" another element or layer, it can be directly "on," "engaged to," "connected to," or "coupled to" the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," or "directly coupled to" another element or layer, intervening elements or layers may not be present. Other words used to describe the relationship between elements (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.) should be interpreted in a similar manner. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0047] Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply a sequence or order. Thus, the first element, component, region, layer, or section discussed below may be referred to as the second element, component, region, layer, or section without departing from the teachings of the exemplary embodiments.

[0048] To facilitate the description of the relationship between one element or feature shown in the figures and another element or feature, spatial relative terms may be used herein, such as "inner", "outer", "below", "beneath", "under", "above", and "on". Except for the orientation described in the figures, spatial relative terms may be intended to cover different orientations of the device during use or operation. For example, if the device in the figures is flipped, an element described as "below" or "beneath" other elements or features will be oriented "above" the other elements or features. Thus, the exemplary term "below" can cover both upward and downward orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein are to be interpreted accordingly.

[0049] When the terms "same" or "identical" are used in the description of the exemplary embodiments, it should be understood that there may be some imprecision. Thus, when an element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within manufacturing or operating tolerances (e.g., ±10%).

[0050] When the terms "about" or "substantially" are used in conjunction with a numerical value, it should be understood that the associated numerical value includes manufacturing or operating tolerances near the stated value (e.g., ±10%). Additionally, when the words "generally" and "substantially" are used in conjunction with a geometry, it should be understood that precision of the geometry is not required, but the latitude of the shape is within the scope of the present disclosure.

[0051] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this exemplary embodiment belongs. It should also be understood that terms (including terms defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0052] In this exemplary embodiment, the wafer is described as an example of an object to be processed. However, the technical spirit of the present invention can also be applied to devices for processing other types of substrates other than wafers as objects to be processed.

[0053] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0054] Figure 1 is a top plan view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0055] Reference Figure 1, the substrate processing apparatus includes an indexing module 10, a processing module 20, and a controller 30. According to an exemplary embodiment, the indexing module 10 and the processing module 20 are arranged in one direction. Hereinafter, the arrangement direction of the indexing module 10 and the processing module 20 is referred to as a first direction 92, a direction perpendicular to the first direction 92 when viewed from the top is referred to as a second direction 94, and a direction perpendicular to both the first direction 92 and the second direction 94 is referred to as a third direction 96.

[0056] The indexing module 10 transfers the substrate W from the container 80 accommodating the substrate W to the processing module 20, and accommodates the substrate W processed by the processing module 20 into the container 80. The longitudinal direction of the indexing module 10 is arranged in the second direction 94. The indexing module 10 includes a loading port 12 and an indexing frame 14. With respect to the indexing frame 14, the loading port 12 is located on a side opposite to the processing module 20. The container 80 accommodating the substrate W is placed on the loading port 12. A plurality of loading ports 12 may be provided, and the plurality of loading ports 12 may be arranged along the second direction 94.

[0057] A sealed container such as a front opening pod (FOUP) may be used as the container 80. The container 80 may be placed on the load port 12 by a transfer device (not shown) such as an overhead conveyor, an overhead conveyor, or an AGV, or by an operator.

[0058] The indexing frame 14 is provided with an indexing robot 120. A guide rail 140 whose longitudinal direction is provided in the second direction 94 is provided in the indexing frame 14, and the indexing robot 120 may be provided to be movable on the guide rail 140. The indexing robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 may be provided to be movable forward and backward, rotatable about the third direction 96, and movable along the third direction 96. A plurality of hands 322 are provided at intervals in the up-down direction, and the hands 322 may be movable forward and backward independently of each other.

[0059] The process module 20 includes a buffer unit 200, a transfer chamber 300, and a processing chamber 400. The buffer unit 200 provides a space in which a substrate W loaded into the process module 20 and a substrate W unloaded from the process module 20 temporarily stay. The processing chamber 400 performs a process of liquid treatment on the substrate W by supplying liquid onto the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200 and the liquid treatment chamber 400.

[0060] The longitudinal direction of the transfer chamber 300 may be set in the first direction 92. The buffer unit 200 may be provided between the index module 10 and the transfer chamber 300. A plurality of liquid processing chambers 400 may be provided, and may be provided at a side portion of the transfer chamber 300. The liquid processing chambers 400 and the transfer chamber 300 may be provided along the second direction 94. The buffer unit 200 may be located at one end of the transfer chamber 300.

[0061] According to an example, the liquid treatment chambers 400 are respectively disposed on both sides of the transfer chamber 300. On one side of the transfer chamber 300, the liquid treatment chambers 400 may be arranged in an A×B arrangement (each of A and B is a natural number of 1 or greater) along the first direction 92 and the third direction 96.

[0062] The transfer chamber 300 includes a transfer robot 320. A guide rail 340 having a longitudinal direction in a first direction 92 is provided in the transfer chamber 300, and the transfer robot 320 may be provided to be movable on the guide rail 340. The transfer robot 320 includes a hand 322 on which a substrate W is placed, and the hand 322 may be provided to be movable forward and backward, rotatable about a third direction 96, and movable along the third direction 96. A plurality of hands 322 are provided at intervals in the up-and-down direction, and the hands 322 may be movable forward and backward independently of each other.

[0063] The buffer unit 200 includes a plurality of buffers 220 on which the substrate W is placed. The buffers 220 may be arranged to be spaced apart from each other along the third direction 96. The front and rear of the buffer unit 200 are open. The front is a surface facing the index module 10, and the rear is a surface facing the transfer chamber 300. The index robot 120 may approach the buffer unit 200 through the front, and the transfer robot 320 may approach the buffer unit 200 through the rear.

[0064] Figure 2 It is schematically shown Figure 1 Schematic diagram of an exemplary embodiment of a liquid processing chamber. Figure 3 is shown in more detail Figure 2 Schematic diagram of the support unit and guide ring unit in the liquid handling chamber. Figure 2 and Figure 3 The liquid processing chamber 400 includes a housing 410, a cup body 420, a lifting unit 430, a liquid supply unit 440, a supporting unit 450, a guide ring unit 460, a driving unit 480 and a controller.

[0065] The housing 410 is provided in a substantially rectangular parallelepiped shape. The housing provides an internal space. Components to be described below may be provided in the housing 410. An opening (not shown) provided as a passage for the substrate W may be formed in a side portion of the housing 410.

[0066] The cup body 420 has a processing space with an open top, and the substrate W is subjected to liquid processing in the processing space. The relative height between the cup body 420 and the supporting unit 450 is adjusted by the lifting unit 430 .

[0067] According to an example, the cup body 420 includes a plurality of cups 422, 424, and 426. Each of the cups 422, 424, and 426 has a recovery space for recovering liquid used to process the substrate. Each of the cups 422, 424, and 426 is arranged in an annular shape around the support unit 450. When the liquid treatment process is in progress, the treatment liquid scattered by the rotation of the substrate W is introduced into the recovery space through the inlets 422a, 424a, and 426a of each of the cups 422, 424, and 426. According to an exemplary embodiment, the cup body 420 includes an inner cup 422, a middle cup 424, and an outer cup 426. The inner cup 422 is arranged to surround the support unit 430, the middle cup 424 is arranged to surround the inner cup 422, and the outer cup 426 is arranged to surround the middle cup 424. The second inlet 424a for introducing the liquid into the middle cup 424 may be disposed above the first inlet 422a for introducing the liquid into the inner cup 422, and the third inlet 426a for introducing the liquid into the outer cup 426 may be disposed above the second inlet 424a. The first discharge pipe 422b may be connected to the bottom of the inner cup 422, wherein the treated liquid recovered through the first inlet 422a is discharged through the first discharge pipe 422b. The second discharge pipe 424b may be connected to the bottom of the middle cup 424, wherein the treated liquid recovered through the second inlet 424a is discharged through the second discharge pipe 424b. The third discharge pipe 426b may be connected to the bottom of the outer cup 426, wherein the treated liquid recovered through the third inlet 426a is discharged through the third discharge pipe 426b.

[0068] The lifting unit 430 moves the cup body 420 in the up and down direction. By the up and down movement of the cup body 420, the relative height between the cup body 420 and the substrate W changes. Therefore, since the cups 422, 424 and 426 for recovering the process liquid are changed according to the type of liquid supplied to the substrate W, the liquid can be separated and recovered.

[0069] The liquid supply unit 440 includes a first nozzle 441 and a second nozzle 442. The first nozzle 441 supplies the first processing liquid to the upper surface of the substrate W supported by the chuck pin 432. The first nozzle 441 is supported by a nozzle support 443. The nozzle support 443 moves the nozzle between the processing position and the waiting position. At the processing position, the first nozzle 441 supplies the first processing liquid to the substrate W placed on the rotating chuck 451, and the nozzle 441 that has completed the supply of the first processing liquid waits in the waiting position. According to an exemplary embodiment, the first processing liquid may be chemical or ultrapure. The second nozzle 442 may be set as a rear nozzle. When the second nozzle 442 is set as a rear nozzle, the second nozzle 442 is mounted on the upper surface of the rotating chuck 451 to be described later. In addition, a through hole for mounting the rear nozzle may also be formed in the center of the rotating chuck 451. The second nozzle 442 supplies the second processing liquid to the bottom surface of the substrate W supported by the chuck pin 432. According to an example, the second processing liquid may be ultrapure.

[0070] The support unit 450 supports the substrate W in the processing space. The support unit 450 includes a rotation chuck 451 , a chuck pin 452 , a rotation shaft 453 , and a pin driving link 454 .

[0071] The spin chuck 451 supports the substrate W. The upper surface of the spin chuck 451 is set to a substantially circular shape and may have a larger diameter than the substrate W. A support pin 451a for supporting the rear surface of the substrate W is provided at a central portion of the spin chuck 451. A plurality of support pins 451a are provided. The support pins 451a are arranged such that their combination has an annular shape as a whole. The support pin 452a is provided so that its upper end protrudes from the spin chuck 451, so that the substrate W is spaced apart from the spin chuck 451 by a predetermined distance.

[0072] The chuck pins 452 support the side portion of the substrate W so that the substrate W does not separate from the support unit 450 when the substrate W rotates. The chuck pins 452 are provided at the edge portion of the rotating chuck 451. The chuck pins 452 are provided to be farther away from the center of the rotating chuck 451 than the support pins 451a. The chuck pins 452 are provided to protrude upward from the rotating chuck 451. A plurality of chuck pins 452 are provided. The chuck pins 452 are provided to be movable between a supporting position C1 and a spacing position C2. The supporting position C1 is a position where the chuck pins 452 support the end of the substrate W placed on the rotating chuck 452. When a process is performed on the substrate W, the chuck pins 452 are located at the supporting position C2. The spacing position C1 is a position where the chuck pins 452 are spaced apart from the substrate W. When the substrate W is loaded into or unloaded from the supporting unit 450, the chuck pins 452 are located at the spacing position C1. According to an example, the chuck pin 452 may be configured to linearly move between the supporting position C1 and the spacing position C2.

[0073] The rotation shaft 453 is provided so as to be controllable to rotate by the second driver 452. The rotation shaft 453 is fixedly coupled to the center of the bottom surface of the rotation chuck 451. Therefore, the second driver 456 to be described later may rotate the rotation chuck 451.

[0074] Figure 4 is a schematic diagram showing the moving direction of the pin driving link when the chuck pin moves from the spacing position to the supporting position. Figure 5 It shows that Figure 3 Schematic diagram of an exemplary embodiment of a pin drive link when the chuck pin is in a spaced position. Figure 4 and Figure 5 The pin driving link 454 moves the chuck pin 452 between the supporting position C1 and the spacing position C2. The pin driving link 454 is provided in a number corresponding to the number of the chuck pins 452. The pin driving link 454 includes a first link 4541 and a second link 4542.

[0075] The first link 4541 includes a portion parallel to the first direction 92 (hereinafter referred to as "horizontal portion 4541a") and a portion parallel to the third direction 96 (hereinafter referred to as "vertical portion 4541b"). According to an example, the first link 4541 may be configured as shape. One end of the horizontal portion 4541a and one end of the vertical portion 4541b may be fixedly coupled to each other or integrally provided. The chuck pin 452 is coupled to the other end of the horizontal portion 4541a. In addition, the horizontal portion 4541a may be installed in a horizontal movement guide 455 provided in the rotating chuck 451. The second connecting rod 4542 is coupled to the other end of the vertical portion 4542a.

[0076] The second connecting rod 4542 can be set as a connecting rod. The second connecting rod 4542 is connected to the guide ring support 462 to be described later. The first connecting rod 4541, the second connecting rod 4542 and the second connecting rod 4542 can be pivotally connected to the guide ring support 462 respectively. Therefore, when the guide ring support 462 moves along the third direction 96 or the fourth direction 98 (hereinafter referred to as "up and down movement"), the second connecting rod 4542 also moves together, but since the vertical position of the first connecting rod 4541 is fixed by the guide member 455, the second connecting rod 4542 can make the first connecting rod 4541 move horizontally while performing the pivoting movement. According to the example, the spacing position C1 can be the position where the guide ring support 462 is located at the lowest part inside the rotating chuck 451. In addition, the spacing position C1 can be the position where the angle θ between the first connecting rod 4541 and the second connecting rod 4542 is the maximum. The support position C2 may be the position where the guide ring support 462 is located at the topmost position inside the rotating chuck 451. In addition, the support position C2 may be the position where the angle θ between the first link 4541 and the second link 4542 is the smallest.

[0077] Re-reference Figure 2 and Figure 3 , the guide ring unit 460 may include a guide ring 461 and a guide ring support 462. The guide ring 461 may be disposed adjacent to the rotating chuck 451. The guide ring 461 may be disposed around the rotating chuck 451. The guide ring 461 may be disposed to be tilted downward in a direction away from the rotating chuck 451. In addition, one end of the guide ring 461 may be disposed to be tilted again toward the fourth direction 98. Therefore, the guide ring may be disposed to be tilted in a two-stage tilted shape.

[0078] The guide ring 461 includes an upper ring 461a, an intermediate ring 461b, a lower ring 461c and a fixed rod 461d. The upper ring 461a, the intermediate ring 461b and the lower ring 461c are arranged to overlap when viewed from above. The upper ring 461a is located above the intermediate ring 461b. The intermediate ring 461b is located between the upper ring 461a and the lower ring 461c. The lower ring 461c is located at a position facing the upper ring in the up-down direction. The lower ring 461c, the intermediate ring 461b and the upper ring 461a are positioned in the order of the lower ring 461c, the intermediate ring 461b and the upper ring 461a along the third direction 96. The upper ring 461a, the intermediate ring 461b and the lower ring 461c are connected to the fixed rod 461d. The fixed rod 461d can be arranged to penetrate the edge area of ​​the upper ring 461a, the intermediate ring 461b and the lower ring 461c along the third direction 96. In addition, the guide ring support 462 may be connected to the fixing rod 461d.

[0079] The guide ring support 462 is located below the guide ring 461. The guide ring 461 is mounted on the guide ring support 462 by a fixing rod 461d. The guide ring support 462 penetrates the lower end of the rotating chuck 451 and is inserted into the rotating chuck 451. The second connecting rod 4542 and the guide ring support 462 are pivotally connected to the inside of the rotating chuck 451. According to an example, the guide ring support 462 has an annular structure 462a, which can be located at the center of the inside of the rotating chuck 451, and a plurality of second connecting rods 4542 are pivotally connected to the annular structure 462a. An extension portion 462b is formed on the guide ring support 462. The extension portion 426b has a shape extending from a portion of the guide ring support 462 inserted into the support plate 451 along the fourth direction 98. The extension portion 462b is connected to the first driver 481. The guide ring support 462 may include a plurality of extension portions 462b. When a plurality of extensions 462b are provided, the extensions 462b and the pin drive links 454 may cross each other within the rotating chuck 451. In the example, three pin drive links 454 and three extensions 462b are provided, respectively, and when viewed from above, the pin drive links 454 and the extensions 462b are arranged at 120 degrees, the extension 462b-1 is provided between the pin drive links 454-1 and the pin drive links 454-2, and the pin drive links 454-2 may be provided between the extensions 462b-1 and the extensions 462b-2. In addition, an elastic member 470 may be installed in the portion 462b existing inside the rotating chuck 451 in the portion extending in the fourth direction.

[0080] The elastic member 470 may be arranged to be in a compressed state in the fourth direction 98. One end of the elastic member 470 may be arranged to contact the lower wall of the rotating chuck 451. The other end of the elastic member 470 may be arranged to contact the guide ring support 462. According to an example, the elastic member 470 may be arranged as a spring, and the extension portion 462b may be inserted into the spring. Therefore, the guide ring unit 460 may be lifted along the third direction 96 under the elastic force of the elastic member 470.

[0081] The driving unit 480 may include a first driver 481 and a second driver 482. The first driver 481 is connected to the guide ring support 462. The guide ring support 462 may be vertically moved by the first driver 481. According to an example, the first driver 481 may be provided as a cylinder. The first driver 481 moves the guide ring unit 460 between the waiting position P1 and the processing position P2. The waiting position P1 may be a position where the guide ring unit 60 descends. The waiting position P1 may be a position where the relative height of the rotary chuck 451 is low. The waiting position P1 may be a position where the substrate W is not interfered with the transfer robot 320 that transfers the substrate W when the substrate W is loaded to or unloaded from the rotary chuck 451. The processing position P2 may be a position where the guide ring unit 460 is raised. The processing position P2 may be a position where the relative height relative to the rotary chuck 451 is higher than the relative height of the waiting position P1. The processing position P2 is a position where the processing liquid scattered when the substrate W is processed can be separated and guided. The second driver 482 provides a rotational force to the rotating shaft 483. Therefore, while the substrate W supported by the spin chuck 481 is rotated, liquid processing can be performed.

[0082] The driving unit 480 may further include a first plate 483 and a second plate 484. In this case, the first plate 483 may be connected to the guide ring support 462, and the second plate 484 may be connected to the first driver 482. The first plate 483 may have a shape around the rotation axis 453. The first plate 483 may be provided as an annular plate. A first protrusion 483a and a first groove 483a may be formed on the outside of the first plate 483. A plurality of first protrusions 483a and a plurality of first grooves 483a may be provided. The second plate 484 may be provided as an annular plate. The second plate 484 may have a shape around the first plate. The second plate 484 may be located above the first plate 483. The second plate 484 may be provided to be spaced apart from the first plate 483 in the third direction 96. A second groove 484a may be formed on the inner side of the second plate 484, the position and shape of which correspond to the first protrusion. In addition, the second protrusion 484a may be formed in a shape corresponding to the first groove 483a at a position corresponding to the first groove 483a. Therefore, the first plate 483 and the second plate 484 may form a keyway structure. The first plate 483 may be rotated together with the rotation chuck 451 by the second driver 482 . Figure 6 It shows that Figure 3 A schematic diagram showing a state in which the first plate and the second plate are in a first position as viewed from above, Figure 7 It shows that Figure 3 Schematic diagram of the state when the first plate and the second plate are in the second position as viewed from above. Figure 6 and Figure 7, when the first plate 483 rotates, the first protrusion 483a and the second protrusion 484a may overlap each other partially or completely. This position is defined as the first position R1. In addition, the position where the first protrusion 483a and the second protrusion 484a do not overlap is defined as the second position R2. According to an exemplary embodiment, the first plate 483 and the second plate 484 may always be located at the first position R1 except when managing or replacing the rotating chuck 451.

[0083] A process of loading a substrate W, processing the substrate W, and unloading the substrate W by using the substrate processing apparatus according to an exemplary embodiment of the present invention will be described below.

[0084] Figure 8 is a schematic diagram showing the appearance of the support unit and the guide ring unit when the guide ring unit is located at the waiting position and the chuck pin is located at the spacing position, Figure 9 is a schematic diagram showing the support unit and the guide ring unit when the guide ring unit is located at the processing position and the chuck pin is located at the supporting position. Figure 8 and Figure 9 , the first plate 483 is rotated to be positioned at the first position R1 so as to load the substrate W. The first driver 481 moves the second plate 484 along the fourth direction 98. The second plate 484 contacts the first plate 434 while moving along the fourth direction 98. Since the first protrusion 483a and the second protrusion 484a overlap each other when viewed from above, the first plate 483 may descend when the second plate 484 descends along the fourth direction 98. When the first plate descends, the guide ring support 462 and the guide ring 461 mounted on the guide ring support 462 also descend. When the guide ring support 462 descends, the second connecting rod 4542 coupled to the guide ring support 462 also descends. According to an example, the second connecting rod 4542 may rotate in a clockwise direction around the coupling portion with the first connecting rod 4541. At the same time, the second connecting rod 4542 pushes the first connecting rod 4541 in a direction away from the rotation chuck 451. By the movement of the first link 4541, the chuck pin 452 is spaced apart from the rotary chuck 451. Therefore, the guide ring unit 460 is located at the waiting position P1, and the chuck pin 452 is located at the spaced position C2. Subsequently, the substrate W is loaded. The substrate W is supported by the support pins 451a on the rotary chuck 451.

[0085] When loading the substrate W, the first driver 481 moves the first plate 483 in the third direction 98 to load the substrate W. The first plate 483 can be moved upward to a distance spaced apart from the second plate 484. At the same time, the second plate 484 can be raised in the third direction 96 by the elastic member 470 to lift the guide ring support 462. The guide ring support 462 is raised and positioned at the processing position P2. When the guide ring support 462 is raised, the second link 4542 is also raised. For example, the second link 4542 can rotate counterclockwise relative to the coupling portion with the first link 4541. At the same time, the second link 4542 pulls the first link 4541 in the direction toward the rotary chuck 451. Through the movement of the first link 4541, the chuck pin 452 moves to the support position C1. The chuck pin 452 receives the substrate W from the support pin 451a and supports the end of the substrate W.

[0086] When loading the substrate W, the liquid supply unit 440 supplies the first processing liquid to the upper surface of the substrate W and supplies the second processing liquid to the bottom surface of the substrate W. While or after supplying the first processing liquid and the second processing liquid, the second driver 482 rotates the rotary chuck 451. Accordingly, the substrate W will undergo liquid processing. The first processing liquid and the second processing liquid may scatter from the substrate W. The scattered first processing liquid and second processing liquid are separated and guided by the guide ring 461 and separated and recovered from the cup 420.

[0087] When the substrate processing is completed, the substrate W is unloaded. The unloading of the substrate W is performed by a process opposite to the loading of the substrate W. The unloading of the substrate W is performed by the same process as the process of loading the substrate onto the rotary chuck 451. When the guide ring unit 460 is again positioned at the waiting position P1 and the chuck pin 452 is positioned at the spaced position C2, the substrate W is unloaded by the transfer robot 320.

[0088] According to an exemplary embodiment of the present invention, by installing the guide ring unit 460 between the rotary chuck 451 and the cup 420, the separation and recovery rate of the processing liquid can be improved. In addition, even when the guide ring unit 460 is provided, when the substrate W is loaded into the support unit 450 or unloaded from the support unit 450, the chuck pin 452 moves to the spaced position C2, and at the same time, the guide ring unit 450 moves to the lower portion of the rotary chuck 451, so that interference between the guide ring unit 450 and the transfer robot 320 can be eliminated.

[0089] In addition, since the chuck pin 452 and the guide ring unit 460 are simultaneously driven by one first driver 481 without installing a separate driver, the complexity of the structure can be avoided.

[0090] In addition, since the elastic member 470 applies an elastic force to the guide ring unit 460 in the third direction 96, it is possible to prevent the guide ring unit 460 from lowering or the chuck pin 452 from moving away from the support position C1.

[0091] In addition, since the support unit 450 is fixed during the transfer of the substrate W, a post-nozzle can be provided for the support unit 450.

[0092] In the above example, the present invention has been described based on an example in which only the first nozzle is provided as a nozzle for supplying the processing liquid to the upper surface of the substrate W. However, the present invention is not limited thereto, and a plurality of nozzles may be provided to supply the processing liquid to the upper surface of the substrate W. In addition, the additional nozzles are supported by different arms and can move independently. Alternatively, the first nozzle 452 and the additional nozzles may be mounted on the same arm and move simultaneously.

[0093] In addition, in the above example, the present invention has been described based on an example in which the substrate W is processed using the processing liquid. However, the present invention is not limited thereto, and a configuration for injecting a drying gas onto the substrate W may be further added to dry the processing liquid.

[0094] Furthermore, in the above example, the present invention has been described based on an example in which the extension portion 462b is integrally provided with the guide ring support 462. However, the present invention is not limited thereto, and the extension portion 462b may be provided as a separate structure and connected in parallel to the guide ring support 462.

[0095] It should be understood that exemplary embodiments are disclosed herein, and other variations are possible. The individual elements or features of a particular exemplary embodiment are generally not limited to that particular exemplary embodiment, but are interchangeable and can be used, where applicable, in selected exemplary embodiments even if not specifically shown or described. Such modifications should not be regarded as departing from the spirit and scope of the present invention, and all such modifications that would be obvious to a person of ordinary skill in the art are intended to be included within the scope of the appended claims.

Claims

1. A substrate processing device, comprising: a cup body having a processing space therein; a supporting unit, the supporting unit being used to support a substrate in the processing space; a guide ring unit, the guide ring unit being located in the processing space, surrounding the substrate placed on the supporting unit, and guiding the processing liquid scattered from the substrate into the cup body; a liquid supply unit, the liquid supply unit being used to supply the processing liquid to the substrate; as well as Driver; The support unit comprises: a spin chuck on which the substrate is placed and on which the spin chuck is capable of rotating; and a chuck pin disposed on the rotary chuck and supporting the substrate at a side of the substrate; The guide ring unit is configured to be movable in the up-down direction relative to the rotary chuck. The chuck pin is arranged to be movable between a supporting position supporting an end of the substrate placed on the rotary chuck and a spaced position spaced apart from the end of the substrate placed on the rotary chuck, and The drive moves a guide ring relative to the rotary chuck and simultaneously moves the chuck pin between the support position and the spaced position.

2. The apparatus of claim 1, wherein the guide ring is movable between a processing position and a waiting position, The processing position is a position whose relative height relative to the spin chuck is higher than the waiting position, and The chuck pin is configured such that when the guide ring moves from the waiting position to the processing position, the chuck pin moves from the spacing position to the supporting position.

3. The apparatus of claim 2, wherein the chuck pin is configured to move from the supporting position to the spacing position when the guide ring moves from the processing position to the waiting position.

4. The apparatus of claim 1, wherein the cup comprises: Inner cup; a middle cup, the middle cup surrounding the inner cup; as well as an outer cup surrounding the middle cup, and The guide ring is configured to guide the processing liquid scattered from the substrate into a space selected from a space between the inner cup and the middle cup and a space between the middle cup and the outer cup.

5. The device of claim 3, further comprising: a pin drive link connected to the driver; wherein the chuck pin drives the connecting rod to move through the pin, The pin drive connecting rod comprises: a first link to which the chuck pin is coupled; and A second link is pivotally connected to the first link and mounted in the guide ring.

6. The device of claim 3, further comprising: Elastic components; Wherein, the elastic component is installed below the guide ring support and is arranged to be in a compressed state at the processing position to apply an elastic force toward the guide ring.

7. The apparatus of claim 1, wherein the guide ring comprises: Sheung Wan; a lower ring, the lower ring facing the upper ring in the up-down direction; as well as an intermediate ring disposed between the upper ring and the lower ring, and The upper ring, the middle ring, and the lower ring are fixed to each other by fixing rods.

8. The apparatus of claim 1, wherein the driver and the guide ring unit are separately provided.

9. The apparatus of claim 1, wherein the treatment liquid is provided as a first treatment liquid or a second treatment liquid different from the first treatment liquid, The liquid supply unit comprises: a first nozzle, the first nozzle being used to discharge the first processing liquid onto an upper surface of the substrate; as well as a second nozzle, the second nozzle being used to discharge the second processing liquid onto the lower surface of the substrate, and The first processing liquid and the second processing liquid are separated and recovered by the guide ring.

10. A substrate processing device, comprising: a cup body having a processing space therein; a supporting unit, the supporting unit being used to support a substrate in the processing space; a guide ring unit, the guide ring unit being located in the processing space, surrounding the substrate placed on the supporting unit, and guiding the processing liquid scattered from the substrate into the cup body; a liquid supply unit, the liquid supply unit being used to supply the processing liquid to the substrate; as well as a first driver, the first driver being used to drive the guide ring; Wherein, the guide ring unit comprises: a guide ring for guiding the processing liquid scattered from the substrate into the cup body; and a guide ring support in which the guide ring is mounted and to which the first drive is connected; The support unit comprises: a spin chuck on which the substrate is placed and on which the spin chuck is capable of rotating; and a chuck pin disposed on the rotation chuck and supporting the substrate at a side of the substrate; and a pin driving link coupled to the chuck pin, and the pin driving link drives the chuck pin to approach or move away from the substrate supported by the rotary chuck, and The pin drive link operates in conjunction with the drive of the first actuator.

11. The apparatus of claim 10, wherein the chuck pin moves in a direction approaching the substrate placed on the rotary chuck when the guide ring is raised, and moves in a direction away from the substrate placed on the rotary chuck when the guide ring is lowered.

12. The apparatus of claim 11, wherein the pin drive link comprises: a first connecting rod, the first connecting rod being coupled to the chuck pin; as well as a second link connected to the first link and mounted on the guide ring support, and The first link and the second link as well as the second link and the guide ring support are pivotally coupled to each other.

13. The device of claim 12, further comprising: Elastic components; Wherein, the elastic component is installed below the guide ring support and is arranged to be in a compressed state at the processing position so as to apply an elastic force toward the guide ring support.

14. The apparatus of claim 10, wherein the support unit comprises: a rotation shaft for supporting the rotation chuck at the center of the bottom surface of the rotation chuck; a second driver, the second driver being used to provide a rotational force to the rotation shaft; a first plate to which the guide ring support is connected and which is disposed about the rotation axis; as well as a second plate connected to the first driver and arranged to surround the first plate, and The first plate is formed with a first protrusion and a first groove, The second plate is formed with a second groove corresponding to the shape and position of the first protrusion and a second protrusion corresponding to the shape and position of the first groove, When viewed from above, the first groove and the second groove are arranged so that partial areas thereof overlap when the first plate rotates, and When the spin chuck rotates, the first plate and the second plate are spaced apart from each other.

15. The apparatus of claim 10, wherein the chuck pin is provided in plurality, A plurality of chuck pins are respectively connected to a plurality of first connecting rods, The plurality of first connecting rods are respectively connected to the plurality of second connecting rods, and A plurality of second connecting rods are mounted on the guide ring support.

16. The apparatus of claim 10, wherein the treatment liquid is provided as a first treatment liquid or a second treatment liquid different from the first treatment liquid, The cup body comprises: an inner cup, the inner cup surrounding the support unit; a middle cup, the middle cup surrounding the inner cup; as well as an outer cup, the outer cup surrounding the middle cup, The inner cup, the middle cup and the outer cup are stacked on top of each other, The inner cup is provided with a first inlet, and the second treatment liquid is scattered through the first inlet. The inner cup and the middle cup are combined with each other to provide a second inlet, through which the first treatment liquid or the second treatment liquid is scattered. The middle cup and the outer cup are combined with each other to provide a third inlet, through which the first treatment liquid is scattered, The guide ring comprises: Sheung Wan; a lower ring, the lower ring facing the upper ring in the up-down direction; and an intermediate ring disposed between the upper ring and the lower ring, and The upper ring, the middle ring, and the lower ring are fixed to each other by fixing rods and are positioned so that the first processing liquid or the second processing liquid is scattered to the first inlet, the second inlet, or the third inlet during processing of the substrate.

17. The apparatus of claim 16, wherein the liquid supply unit comprises: a first nozzle, the first nozzle being used to discharge the first processing liquid onto an upper surface of the substrate; as well as The second nozzle is used to discharge the second processing liquid onto the lower surface of the substrate.

18. A substrate processing device, comprising: a cup body having a processing space therein; a supporting unit, the supporting unit being used to support a substrate in the processing space; a guide ring unit, the guide ring unit being located in the processing space, surrounding the substrate placed on the supporting unit, and guiding the processing liquid scattered from the substrate into the cup body; a liquid supply unit including a first nozzle for discharging the first processing liquid onto an upper surface of the substrate and a second nozzle for discharging the second processing liquid onto a bottom surface of the substrate; as well as A driving unit, the driving unit is used to drive the guide ring unit and the supporting unit; Wherein, the support unit comprises: A rotating chuck on which the substrate is placed and on which the rotating chuck is capable of rotating; a chuck pin disposed on the rotary chuck and supporting the substrate at a side of the substrate; a rotation shaft for supporting the spin chuck at the center of a bottom surface of the spin chuck; and a pin driving link coupled to the chuck pin and driving the chuck pin to move toward or away from the substrate supported by the rotary chuck; and The guide ring unit comprises: a guide ring for guiding the processing liquid scattered from the substrate into the cup body; and a guide ring support in which the guide ring is mounted and to which the first drive is connected; and The driving unit comprises: A first driver, the first driver is used to drive the guide ring unit; a second driver, the second driver being used to drive the supporting unit; a first plate to which the guide ring support is connected and which is disposed about the rotation axis; and a second plate connected to the first driver and disposed around the first plate; and The pin drive connecting rod comprises: a first connecting rod coupled to the chuck pin; and a second connecting rod connected to the first connecting rod and mounted on the guide ring support, The first link and the second link are arranged to pivot at a connection point connecting the first link and the second link, The second link and the guide ring support are arranged to pivot at a mounting point where the second link is mounted on the guide ring support, When the guide ring unit is lowered, the chuck pin moves in a direction away from the substrate, and when the guide ring unit is raised, the chuck pin moves in a direction close to the substrate, The first plate is formed with a first protrusion and a first groove, The second plate is formed with a second groove corresponding to the shape and position of the first protrusion and a second protrusion corresponding to the shape and position of the first groove, When viewed from above, the first groove and the second groove are arranged so that partial areas thereof overlap when the first plate is rotated.

19. The device of claim 18, further comprising: Elastic components; Wherein, the elastic component is installed below the guide ring support and is arranged to be in a compressed state at the processing position to apply an elastic force toward the guide ring support.

20. The apparatus of claim 19, wherein the cup comprises: an inner cup, the inner cup surrounding the support unit; a middle cup, the middle cup surrounding the inner cup; as well as an outer cup, the outer cup surrounding the middle cup, The inner cup, the middle cup and the outer cup are stacked on top of each other, The inner cup is provided with a first inlet, and the second treatment liquid is scattered through the first inlet. The inner cup and the middle cup are combined with each other to provide a second inlet, through which the first treatment liquid or the second treatment liquid is scattered. The middle cup and the outer cup are combined with each other to provide a third inlet, and the first treatment liquid is scattered through the third inlet; The guide ring comprises: Sheung Wan; a lower ring, the lower ring facing the upper ring in the up-down direction; and an intermediate ring disposed between the upper ring and the lower ring, and The upper ring, the middle ring, and the lower ring are fixed to each other by fixing rods and are positioned so that the first processing liquid or the second processing liquid is scattered to the first inlet, the second inlet, or the third inlet during processing of the substrate.

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