Radiator and immersion tank using same

Abstract

The invention provides a radiator and an immersion tank using the radiator. The immersion tank comprises a first condensation tank and a radiator. The plurality of plates and the first working fluid are located in the first condensation tank. The radiator comprises a condensation assembly and a plurality of heat exchange assemblies. The condensation assembly is assembled outside the first condensation tank in the first direction, the condensation assembly is provided with a second condensation tank, and the second working fluid flows through the second condensation tank. Each heat exchange assembly extends in the first direction, the first tail end of each heat exchange assembly is inserted into the first condensation groove, and the second tail end of each heat exchange assembly is inserted into the condensation assembly.

Description

Technical Field

[0001] The present invention relates to a radiator and an immersion tank, and particularly to a radiator and an immersion tank with good heat dissipation effect. Background Art

[0002] With the advent of the era of artificial intelligence (AI) and 5G, high-computing-power systems for high-performance computing (HPC) have begun to flourish. The power consumption of central processing units (CPUs) and graphics processing units (GPUs) used in high-computing-power systems has rapidly increased. Currently, chips with a power consumption of over 400W have become popular, and the maximum power consumption of future chips will reach 1000W.

[0003] For chips with a power consumption of over 400W, heat dissipation is a field being explored in the current industry technology; among them, for chips with a power consumption of over 1000W, two-phase immersion cooling technology is one of the few solutions.

[0004] The requirements of two-phase immersion cooling technology are "ultra-high heat dissipation capacity" and "ultra-low power usage effectiveness (PUE) performance".

[0005] The condensing heat exchanger is one of the main sources of cooling energy consumption. Therefore, improving the performance of the condensing heat exchanger can further enhance the power usage efficiency performance of the two-phase immersion cooling system.

[0006] In existing immersion cooling architectures, the condensing heat exchangers are mostly coil heat exchangers, finned tube heat exchangers, or plate heat exchangers. The condensing performance of these condensing heat exchangers is acceptable, but due to their shapes, the pressure loss of the cooling water inside the tubes is relatively large, and a pump with a large horsepower is required to drive it, resulting in relatively large cooling energy consumption, which is not conducive to improving the power usage efficiency and heat exchange efficiency. Summary of the Invention

[0007] The present invention provides a radiator with good heat dissipation effect.

[0008] The present invention provides a working immersion tank capable of performing a large amount of heat exchange.

[0009] A heat sink of the present invention is adapted to be assembled in a first condensation tank of an immersion tank along a first direction. The heat sink includes a condensation component and a plurality of heat exchange components. The condensation component has a second condensation tank, and a working fluid flows through the second condensation tank; each heat exchange component extends along the first direction, and a first end of each heat exchange component is adapted to be inserted into the first condensation tank, and a second end of each heat exchange component is inserted into the condensation component.

[0010] An immersion tank of the present invention includes a first condensation tank and the above-mentioned heat sink. A plurality of circuit boards and a first working fluid are located in the first condensation tank, and the condensation component of the above-mentioned heat sink is assembled outside the first condensation tank along the first direction, wherein the condensation component has a second condensation tank, and a second working fluid flows through the second condensation tank. A first end of each heat exchange component of the heat sink is inserted into the first condensation tank, and a second end of each heat exchange component is inserted into the condensation component.

[0011] In one embodiment, the above-mentioned first working fluid is a dielectric liquid, and the second working fluid is water.

[0012] In one embodiment, the boiling point of the above-mentioned first working fluid is between 20 and 80 degrees Celsius.

[0013] In one embodiment, the above-mentioned condensation component further includes a pump and a cooling pipeline, wherein the second condensation tank is connected to the cooling pipeline, and the pump is connected to the cooling pipeline.

[0014] In one embodiment, the above-mentioned condensation component further includes a vapor chamber (VC) cooling plate, and the heat exchange component is inserted into the vapor chamber cooling plate.

[0015] In one embodiment, the above-mentioned vapor chamber cooling plate is the bottom of the second condensation tank.

[0016] In one embodiment, the above-mentioned condensation component further includes a vapor chamber cooling plate, and a first end or a second end of the heat exchange component is integrally formed with the vapor chamber cooling plate.

[0017] In one embodiment, the above-mentioned vapor chamber cooling plate is arranged between the first condensation tank and the second condensation tank.

[0018] In one embodiment, the above-mentioned heat exchange component includes a heat pipe, a vapor chamber plate or a high thermal conductivity metal.

[0019] In one embodiment, the above-mentioned heat sink further includes a plurality of fins, and the normal direction of the fins is parallel to the first direction, and the heat exchange component is arranged through the fins.

[0020] In one embodiment, the above-mentioned heat exchange components are arranged at ordered intervals or are offset from each other.

[0021] In one embodiment, the above-mentioned radiator further includes a spray head disposed above the second condensation tank, and the spray head sprays the second working fluid onto the second end from above the heat exchange component.

[0022] In one embodiment, the above-mentioned kit has a surface roughness.

[0023] In one embodiment, the above-mentioned radiator further includes a plurality of kits disposed in the second condensation tank, and the second end of the heat exchange component is sleeved into the corresponding kit.

[0024] In one embodiment, the above-mentioned radiator further includes a thermal interface material disposed between the mutually sleeved kits and the heat exchange component.

[0025] In one embodiment, the above-mentioned radiator further includes a plurality of fixing rings, and the heat exchange component passes through the corresponding fixing rings to be fixed to the second condensation tank.

[0026] In one embodiment, the above-mentioned radiator further includes a plurality of water film agitators, and each water film agitator is distributed on the corresponding heat exchange component along the first direction.

[0027] Based on the above, in the radiator of the present invention and the immersion tank using this radiator, through the boiling / evaporation behavior of the first working fluid and combined with the extremely high heat conduction efficiency of the heat exchange component, a large amount of heat exchange work between systems can be carried out without dense pipelines. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic diagram of a radiator according to an embodiment of the present invention;

[0029] Figure 2A is for Figure 1 the schematic diagram of applying the radiator in an immersion tank;

[0030] Figure 2B is for Figure 2A the three-dimensional schematic diagram;

[0031] Figure 3 is the three-dimensional schematic diagram of the radiator;

[0032] Figure 4A is the schematic diagram of the orderly and spaced arrangement of the heat exchange components;

[0033] Figure 4B is the schematic diagram of the heat exchange components being offset from each other;

[0034] Figure 5 is the schematic diagram of using a heat pipe heat sink as the bottom of the second condensation tank;

[0035] Figure 6Schematic diagram of the use of the isothermal cooling plate between the first condensation tank and the second condensation tank;

[0036] Figure 7 Schematic diagram of the use of multiple fins in a radiator;

[0037] Figure 8A Schematic diagram of another embodiment of the radiator;

[0038] Figure 8B For Figure 8A Schematic diagram of another variant of the radiator;

[0039] Figure 8C For Figure 8A 、 Figure 8B Top view;

[0040] Figure 9A Schematic diagram of another variant of the radiator;

[0041] Figure 9B Schematic diagram of the kit sleeved on the second end of the heat exchange component having a surface roughness;

[0042] Figure 10 Schematic diagram of the use of a water film agitator in the radiator;

[0043] Figure 11A And Figure 11B Schematic diagram of an embodiment where another kit is coated at the second end of the heat exchange component;

[0044] Figure 11C Schematic diagram of the radiator further including a foamed metal partition.

[0045] 100, 100’, 100”, 100”’, 100””: Radiator

[0046] 110: Condensation component

[0047] 111: Second condensation tank

[0048] 111a: Bottom surface of the tank

[0049] 112: Pump

[0050] 113: Cooling pipeline

[0051] 114, 114’, 114”: Isothermal cooling plate

[0052] 120, 120’, 120”: Heat exchange component

[0053] 121, 121’, 121”: First end

[0054] 122, 122’, 122”: Second end

[0055] 130, 130’: Kit

[0056] 140: Thermal interface material

[0057] 150: Fixed ring

[0058] 160: Fin

[0059] 170: Spraying head

[0060] 180: Water film agitator

[0061] 190: Partition board

[0062] 200: Immersion tank

[0063] 210: First condensation tank

[0064] 210a: Tank top surface

[0065] 300: Circuit board

[0066] A1: First direction

[0067] F1: First working fluid

[0068] F2: Second working fluid

[0069] R1: Dense foaming area

[0070] R2: Loose foaming area Detailed implementation manners

[0071] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same component symbols are used in the drawings and the description to represent the same or similar parts.

[0072] Figure 1 Schematic diagram of a radiator according to an embodiment of the present invention Figure 2A For Figure 1 The schematic diagram of applying the radiator in an immersion tank, and Figure 2B For Figure 2A The three-dimensional schematic diagram.

[0073] Please refer to Figure 1 , Figure 2A And Figure 2B, the immersion tank 200 of this embodiment includes a first condensation tank 210 and a radiator 100. A plurality of motherboard 300 of the server and a first working fluid F1 are located in the first condensation tank 210, and the motherboard 300 is immersed in the first working fluid F1. The motherboard 300 can be a printed circuit board (PCB), and each motherboard 300 has a plurality of chips that generate high heat due to operation. The radiator 100 is assembled to the first condensation tank 210 along a first direction A1. More specifically, the radiator 100 can be assembled above the first condensation tank 210. The radiator 100 of this embodiment includes a condensation component 110 and a plurality of heat exchange components 120. The condensation component 110 includes a second condensation tank 111, a pump 112, and a cooling pipeline 113. The second condensation tank 111 is connected to the cooling pipeline 113, and the pump 112 is connected to the cooling pipeline 113. The second working fluid F2 flows in the cooling pipeline 113 and the second condensation tank 111 due to the operation of the pump 112. Each heat exchange component 120 extends along the first direction A1. The first end 121 of each heat exchange component 120 is inserted into the first condensation tank 210 for heat exchange, and the second end 122 of each heat exchange component 120 is inserted into the condensation component 110.

[0074] The above-mentioned first working fluid F1 is a dielectric liquid with a boiling point between 20 and 80 degrees Celsius, and the second working fluid F2 is water.

[0075] The operation of the immersion tank 200 will be described in detail below.

[0076] The heat emitted by the electronic components on the motherboard 300 placed in the first condensation tank 210 of the immersion tank 200 heats the first working fluid F1, causing the first working fluid F1 to evaporate into steam. The steam flows upward and exchanges heat with the first end 121 of the heat exchange component 120 inserted into the first condensation tank 210 from above the first condensation tank 210.

[0077] The operation of the pump 112 causes the second working fluid F2 to flow into the second condensation tank 111 from the cooling pipeline 113, contact the second end 122 of the heat exchange component 120, and then flow out of the second condensation tank 111. Through the heat exchange and circulating flow of the second working fluid F2, the heat conducted from the first end 121 of the heat exchange component 120 is transferred to the outside of the second condensation tank 111 for heat dissipation. Therefore, through the release of energy, the heat exchange component 120 undergoes a phase change and is converted into a lower temperature. The steam of the first working fluid F1 that touches its first end 121 undergoes a phase change and condenses into liquid beads on the surface due to the low temperature of the heat exchange component 120, and the liquid beads drip back into the lower first working fluid F1 again.

[0078] Compared with the coiled tube type, finned tube type or plate type heat exchangers used in the prior art, in this embodiment, a heat pipe in the shape of a tube column is selected as the heat exchange component 120. Since the heat pipe has excellent heat transfer ability and a simple shape and structure, it reduces the uneven efficiency caused by the large temperature difference between the front and rear ends of pipelines such as coiled tube type and finned tube type. Therefore, it can perform efficient heat exchange between both ends of the heat exchange component 120 and the radiator 100 and the condensation tank 210, thereby improving the overall heat dissipation effect of the radiator 100 and the immersion tank 200.

[0079] In addition, because the shape of the heat pipe is relatively simple, it can be directly inserted into the first condensation tank 210, and the assembly method is relatively simple. Moreover, when using a single heat pipe as the heat exchange component 120, if the heat exchange component 120 is damaged, malfunctioning or needs to be repaired, only the single heat pipe can be replaced, and there is no need to replace the entire radiator 100, which further improves the cost-effectiveness.

[0080] Figure 3 It is a three-dimensional schematic diagram of the radiator. Please refer to Figure 3 , in this embodiment, the number of heat exchange components 120 in the exemplary example is 5, and four of the heat exchange components 120 form a rectangle, and one heat exchange component 120 is located at the center point position of the rectangle formed by these four heat exchange components 120, forming a staggered arrangement. The number of heat exchange components 120 used and the arrangement method can be selected according to actual needs and designs, and are not limited to the number of uses and the arrangement method exemplified in this embodiment. Specifically, the number of heat exchange components 120 used will be affected by factors such as the size of the first condensation tank 210, the size of the second condensation tank 111, the size of the heat exchange component 120, the heat emitted by the heat source on the motherboard 300, the selection of the first working fluid F1 and the second working fluid F2.

[0081] The following will describe other implementation variations of the radiator 100.

[0082] Figure 4A It is a schematic diagram of the orderly spaced arrangement of the heat exchange components 120, and Figure 4B is a schematic diagram of the staggered arrangement of the heat exchange components 120. As Figure 4A shown, the heat exchange components 120 can be arranged in such a way that four of the heat exchange components 120 form a rectangle and one heat exchange component 120 is located at the center point position of the rectangle formed by these four heat exchange components 120. Among them, the four heat exchange components 120 forming the rectangle are arranged orderly at the same interval distance in pairs; or as Figure 4B shown, the heat exchange components 120 can also be arranged in a staggered manner, and the distance between any two adjacent heat exchange components 120 can be the same or different. Specifically, the arrangement method of the heat exchange components 120 can be changed according to actual heat dissipation requirements.

[0083] Figure 5 Schematic diagram of using a heat pipe vapor chamber as the bottom of the second condensation tank. Please also refer to Figure 2A 、 Figure 2B and Figure 5 In the embodiment as shown in Figure 5 a heat pipe vapor chamber 114 can be used at the bottom of the second condensation tank 111, and the heat exchange component 120 is inserted into the heat pipe vapor chamber 114. Specifically, the bottom of the second condensation tank 111 may have an open opening, and the heat pipe vapor chamber 114 is assembled to the second condensation tank 111 to close the opening, serving as the bottom part of the second condensation tank 111. Through an open opening on the top surface 210a of the first condensation tank 210 that has the same size as the heat pipe vapor chamber 114, the second condensation tank 111 equipped with the heat pipe vapor chamber 114 is assembled. In this exemplary architecture, the steam flowing upward in the first condensation tank 210 can directly exchange heat with the heat pipe vapor chamber 114 over a larger area, and the conversion efficiency is further improved.

[0084] Figure 6 Schematic diagram of the application of a heat pipe vapor chamber between the first condensation tank and the second condensation tank. Please also refer to Figure 2A 、 Figure 2B and Figure 6 In another embodiment, a heat pipe vapor chamber 114 can be provided between the first condensation tank 210 and the second condensation tank 111, and the heat exchange component 120 is inserted into the heat pipe vapor chamber 114.

[0085] Specifically, the heat pipe vapor chamber 114 is directly assembled to the bottom surface 111a of the second condensation tank 111, and another surface of the heat pipe vapor chamber 114 can contact the top surface 210a of the first condensation tank 210. The surface of the heat pipe vapor chamber 114 close to the second condensation tank 111 can extend in size and be designed with heat dissipation fins or bumps, which are not shown in the figure.

[0086] As in the embodiments of Figure 5 and Figure 6 by using the heat pipe vapor chamber 114, the heat transferred from the heat exchange component 120 can be evenly diffused, effectively improving the overall heat dissipation effect of the radiator 100. The heat pipe vapor chamber 114 can be a heat pipe assembly, which has a cavity, and the cavity can be filled with a phase change working fluid.

[0087] Please continue to refer to Figure 5, the radiator 100 further includes a plurality of kits 130 disposed in the second condensation tank 111, and the second end 122 of the heat exchange component 120 is inserted into the corresponding kit 130. The arrangement of the kits 130 helps to further secure the heat exchange component 120 in the second condensation tank 111 and also serves as a protection mechanism to prevent the second working fluid F2 from leaking along the heat exchange component 120 and penetrating into the first condensation tank 210. In addition, the outer surface of the kit 130 can be made with concave and convex structures as required, so that the fluid flowing through the outer surface of the kit 130 forms a disturbance, enhancing the heat exchange capacity.

[0088] In one embodiment, a thermal interface material TIM (such as thermal interface material paste) 140 can be provided between the mutually sleeved kit 130 and the heat exchange component 120 to bring the heat exchange component 120 into contact with the kit 130.

[0089] Furthermore, the radiator 100 further includes a plurality of fixing rings 150, where the fixing rings 150 are disposed on the bottom surface 111a of the second condensation tank 111 facing the top of the first condensation tank 210, and the heat exchange component 120 passes through the corresponding fixing rings 150 to be fixed in the second condensation tank 111.

[0090] Figure 7 Schematic diagram of a plurality of fins applied to the radiator 100. As Figure 7 shown, the radiator 100 further includes a plurality of fins 160 sleeved on the heat exchange component 120, where the normal direction of the fins 160 is parallel to the first direction A1, and the length of the fins 160 can be configured with long and short ends according to the water flow at the inlet of the cooling pipeline 113, which is beneficial for the working fluid F2 to enter the fins for contact. The arrangement of the fins 160 helps to enhance the contact between the fluid inside the second condensation tank 111 and the fins 160, thereby improving the overall heat dissipation effect of the radiator 100.

[0091] Figure 8A Schematic diagram of another embodiment of the radiator. As Figure 8A shown, the difference between this embodiment and the foregoing embodiment is that: Figure 8A In the shown radiator 100', the heat exchange component 120' includes two parts, where the part with the second end 122' inserted into the second condensation tank 111 is formed integrally with the isothermal cooling plate 114', and the part with the first end 121' is fixed to the bottom of the second condensation tank 111 through the fixing ring 150 and contacts the isothermal cooling plate 114'. Heat dissipation fins 160 are provided on the heat exchange component 120'.

[0092] Figure 8B For Figure 8A Another variant of the radiator. Please refer to Figure 8B , different from the Figure 8A embodiment is thatFigure 8B In the radiator 100” shown, the part where the heat exchange component 120” and the heat spreader 114” are integrally formed has a first end 121” inserted into the first condensation groove 210 (shown in Figure 2A ). Heat dissipation fins 160 are provided on the heat exchange component 120”. And Figure 8C is Figure 8A and Figure 8B is a top view of. It can be seen from Figure 8A , Figure 8B and Figure 8C that the number of the first ends 121’, 121” of the heat exchange component 120 located in the first condensation groove 210 (shown in Figure 2A ) may not be the same as the number of the second ends 122’, 122” inserted into the second condensation groove 111, and can be increased or decreased according to the heat dissipation requirements.

[0093] Figure 9A is another variant of the radiator. Please refer to Figure 9A . In one embodiment, the radiator 100”’ further includes a sprinkler head 170 disposed above the interior of the second condensation groove 111, wherein the sprinkler head 170 sprays a second working fluid F2 onto the second end 122 from above the heat exchange component 120. Through the cooling design of directly spraying or impacting the second end 122 of the heat exchange component 120, the cooling effect can be more concentrated at the second end 122, ensuring that the second end 122 can be quickly cooled and strengthening the heat dissipation effect.

[0094] Figure 9B is a schematic diagram of the surface roughness of the kit sleeved on the second end of the heat exchange component 120. Please also refer to Figure 9A and Figure 9B . The kit 130 sleeved at the second end 122 has surface roughness, and the design of the kit 130 having surface roughness can strengthen the heat dissipation effect when the liquid flow passes through the second end 122. The liquid flow passing through the second end 122 here includes the second working fluid F2 flowing into and out of the second condensation groove 111 from the cooling pipeline 113 and / or the second working fluid F2 sprayed from the sprinkler head 170 towards the second end 122. The kit 130 can be made of a metal material with good heat dissipation.

[0095] Figure 10 is a schematic diagram of the application of a water film agitator in the radiator. As shown in Figure 10As shown, in one embodiment, the above-mentioned radiator 100 further includes a plurality of water film agitators 180. Each water film agitator 180 is distributed on the tube wall of the corresponding heat exchange component 120 along the tube wall direction of the heat exchange component 120 or the first direction A1. The water film agitator 180 can be used to block and break the film layer formed on the surface of the middle and the first end 121 at the rear section of the first working fluid F1 on the heat exchange component 120, thereby increasing the heat exchange efficiency.

[0096] Figure 11A and Figure 11B FIG. is a schematic diagram of an embodiment in which another kit is coated at the second end of the heat exchange component. Please also refer to Figure 11A and Figure 11B , the kit 130' is made of foamed metal, and it has a dense foamed area R1 and a loose foamed area R2. The dense foamed area R1 is arranged around the circumferential surface of the second end 122, and the loose foamed area R2 covers the edge of the second end 122.

[0097] The density or looseness of the foamed area is obtained by comparing the foaming conditions of these two areas. Specifically, the foaming structure of the loose foamed area R2 is looser than that of the dense foamed area R1. The covering of the dense foamed area R1 helps to improve the heat dissipation effect of the circumferential surface of the second end 122 of the heat exchange component 120, while the loose foamed area R2 covering the edge of the second end 122 can further agitate the second working fluid F2 to enhance the convection effect of the second working fluid F2.

[0098] Therefore, the use of the kit 130' can more effectively improve the overall heat dissipation effect of the radiator 100.

[0099] Figure 11C FIG. is a schematic diagram of a radiator further including a foamed metal partition. In Figure 11C the shown embodiment, a partition 190 is further provided in the second condensation tank 111, and this partition 190 can be made of foamed metal. The setting of the partition 190 can change the flow field of the second working fluid F2, create agitation, and thus enable a more uniform heat exchange between the kit 130' and the second working fluid F2. In addition, using foamed metal to make the partition 190, the partition 190 has a plurality of pores, so it can avoid the situation of forming a fluid dead zone behind the partition 190 when the fluid flows through the partition 190 in the prior art. The shape and arrangement of the above-mentioned partition 190 are not limited to the rectangular upright shape shown in the figure, and can be appropriately designed according to requirements.

[0100] As can be seen from the above, the heat sink of the present invention can have various different implementation manners, and their purposes are all to further improve the heat dissipation effect. Therefore, it can be expected that those skilled in the art, under the technical inspiration of this specification, have reasons and are able to find ways to increase or decrease components according to actual needs on the basic structure of the heat sink to obtain a better heat dissipation effect.

[0101] In summary, in the heat sink of the present invention and the immersion tank using this heat sink, through the boiling / evaporation behavior of the first working fluid and combined with the extremely high heat conduction efficiency of the heat exchange component, a large amount of heat exchange work between systems can be carried out without dense pipelines.

[0102] In addition, only heat exchange occurs between the first working fluid in the first condensation tank and the second working fluid in the second condensation tank, and there is no physical liquid circulation exchange.

[0103] Furthermore, the heat exchange component is selected as a heat pipe with a simple shape and structure or a heat pipe isothermal plate in a flat plate shape, which has the advantages of being easy to assemble and disassemble and convenient for maintenance and management. Moreover, a single damaged heat exchange component can be disassembled and assembled and repaired, rather than the whole set being disassembled and replaced. Therefore, it is convenient for users to disassemble and assemble and saves costs.

[0104] The positions of the inlet and outlet of the above cooling pipeline and the number of inlet and outlet pipe fittings are not limited to those shown in the schematic diagram and can be changed according to requirements.

[0105] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An immersion tank, characterized in that, Comprising: A first condensation tank, in which a plurality of circuit boards and a first working fluid are located; A radiator, comprising: A condensation assembly assembled outside the first condensation tank along a first direction, the condensation assembly having a second condensation tank, and a second working fluid flowing through the second condensation tank; And A plurality of heat exchange assemblies, wherein each heat exchange assembly extends along the first direction, and a first end of each heat exchange assembly is plugged into the first condensation tank, and a second end of each heat exchange assembly is plugged into the condensation assembly.

2. The immersion tank according to claim 1, wherein The first working fluid is a dielectric liquid, and the second working fluid is water.

3. The immersion tank according to claim 1, characterized in that, The boiling point of the first working fluid is between 20 and 80 degrees Celsius.

4. The immersion tank according to claim 1, characterized in that, The condensation assembly further includes a pump and a cooling pipeline, wherein the second condensation tank is connected to the cooling pipeline, and the pump is connected to the cooling pipeline.

5. The immersion tank according to claim 1, wherein The condensation assembly further includes an isothermal cooling plate, and the heat exchange assembly is plugged into the isothermal cooling plate.

6. The immersion tank according to claim 5, characterized in that, The isothermal cooling plate is the bottom of the second condensation tank.

7. The immersion tank according to claim 5, wherein The isothermal cooling plate is disposed between the first condensation tank and the second condensation tank.

8. The immersion tank according to claim 1, characterized in that, The condensation assembly further includes an isothermal cooling plate, and the first end or the second end of the heat exchange assembly is integrally formed with the isothermal cooling plate.

9. The immersion tank according to claim 1, wherein The heat exchange assembly includes a heat pipe, an isothermal plate or a high heat conduction metal.

10. The immersion tank according to claim 1, wherein, The radiator further includes a plurality of fins, and the normal direction of the fins is parallel to the first direction, and the heat exchange assembly is disposed through the fins.

11. The immersion tank according to claim 1, wherein The heat exchange assemblies are arranged at intervals or are offset from each other.

12. The immersion tank according to claim 1, characterized in that, The radiator further includes a sprinkler head disposed above the second condensation tank, and the sprinkler head sprays the second working fluid onto the second end from above the heat exchange assembly.

13. The immersion tank according to claim 1, characterized in that, The radiator further includes a plurality of kits disposed in the second condensation tank, and the second end of the heat exchange assembly is sleeved into the corresponding kit.

14. The immersion tank according to claim 13, wherein The kit has a surface roughness.

15. The immersion tank according to claim 14, characterized in that, The radiator further includes a thermal interface material disposed between the mutually sleeved kit and the heat exchange assembly.

16. The immersion tank according to claim 1, characterized in that, The radiator further includes a plurality of fixing rings, and the heat exchange assembly passes through the corresponding fixing ring to be fixed to the second condensation tank.

17. The immersion tank according to claim 1, characterized in that, The radiator further includes a plurality of water film agitators, and each water film agitator is distributed along the first direction on each corresponding heat exchange assembly.

18. A radiator adapted to be assembled along a first direction to a first condensation tank of an immersion tank, the radiator comprising: A condensation assembly having a second condensation tank, and a working fluid flowing through the second condensation tank; And A plurality of heat exchange assemblies, wherein each heat exchange assembly extends along the first direction, and a first end of each heat exchange assembly is adapted to be plugged into the first condensation tank, and a second end of each heat exchange assembly is plugged into the condensation assembly.

19. The radiator according to claim 18, wherein, The working fluid is water.

20. The radiator according to claim 18, wherein, The condensation assembly further includes a pump and a cooling pipeline, wherein the second condensation tank is connected to the cooling pipeline, and the pump is connected to the cooling pipeline.

21. The radiator according to claim 18, characterized in that, The condensation assembly further includes an isothermal cooling plate, and the heat exchange assembly is plugged into the isothermal cooling plate.

22. The radiator according to claim 21, wherein The isothermal cooling plate is the bottom of the second condensation tank.

23. The radiator according to claim 18, characterized in that, The condensation assembly further includes an isothermal cooling plate, and the first end or the second end of the heat exchange assembly is integrally formed with the isothermal cooling plate.

24. The radiator according to claim 18, characterized in that, The heat exchange assembly includes a heat pipe, a heat spreader or a high heat conduction metal.

25. The radiator according to claim 18, wherein, It further includes a plurality of fins, and the normal direction of the fins is parallel to the first direction, and the heat exchange assembly is disposed through the fins.

26. The radiator according to claim 18, wherein, The heat exchange assemblies are arranged at intervals or are offset from each other.

27. The radiator according to claim 18, wherein, It further includes a spray head, which is arranged above the second condensation tank, and the spray head sprays the second working fluid on the second end from above the heat exchange assembly.

28. The radiator according to claim 18, wherein, It further includes a plurality of sleeves, which are arranged in the second condensation tank, and the second end of the heat exchange assembly is sleeved into the corresponding sleeve.

29. The radiator according to claim 28, wherein, The sleeve has a surface roughness.

30. The radiator according to claim 29, characterized in that, It further includes a thermal interface material, which is arranged between the sleeve and the heat exchange assembly that are sleeved with each other.

31. The radiator according to claim 18, wherein, It further includes a plurality of fixing rings, and the heat exchange assembly passes through the corresponding fixing ring to be fixed to the second condensation tank.

32. The radiator according to claim 18, wherein It further includes a plurality of water film agitators, and each water film agitator is distributed along the first direction on each corresponding heat exchange assembly.

Images