Cap electronic package containing battery

Abstract

The invention relates to a capped electronic package containing a battery. An electronic package with a battery and a method for producing the electronic package use a domed cover that is attached to a substrate with an electronic component, such as a die. The battery is attached to an inner surface of the domed cover and electrically connected to the electronic component via the domed cover.

Description

Technical Field

[0001] The present invention generally relates to the encapsulation of electronic components. Specifically, the present invention relates to an electronic package having a battery. Background Art

[0002] Some electronic components are packaged together with a battery to provide power to an integrated circuit system included in the electronic component. In some packages, a molded battery holder is used to secure the battery to a underlying structure, which may include a die and other electronic components. Summary of the Invention

[0003] An electronic package having a battery and a method for manufacturing an electronic package use a dome lid that is attached to a substrate having an electronic component such as a die. The battery is attached to an inner surface of the dome lid and is electrically connected to the electronic component via the dome lid.

[0004] In an embodiment, the electronic package includes: a substrate; an electronic component attached to the substrate; a dome lid attached to the substrate such that the electronic component is surrounded by the dome lid; and a battery attached to an inner surface of the dome lid and electrically connected to the electronic component via the dome lid.

[0005] In an embodiment, the battery includes a positive side and a negative side, and at least one of the positive side and the negative side of the battery is electrically connected to a trace on the inner surface of the dome lid, and the trace is electrically connected to the electronic component via the substrate.

[0006] In an embodiment, the electronic component is a die physically attached to the substrate and electrically attached to the substrate via bonding wires, and the positive side and the negative side of the battery are electrically connected to conductive traces on the inner surface of the dome lid, and the conductive traces are electrically connected to the die via the substrate and the bonding wires.

[0007] In an embodiment, the electronic package further includes an epoxy resin covering the bonding wires.

[0008] In an embodiment, the electronic component is a die attached to the substrate, and at least one of the positive side and the negative side of the battery is electrically connected to a trace on the inner surface of the dome lid, and the trace is electrically connected to the die via the substrate.

[0009] In an embodiment, one of the positive side and the negative side of the battery is physically attached to the die using a conductive adhesive material such that the die is sandwiched between the battery and the substrate.

[0010] In an embodiment, the conductive adhesive material is electrically connected to at least one conductive via in the die to electrically connect the battery to the substrate.

[0011] In an embodiment, the conductive adhesive material extends to one side of the die and onto the substrate to electrically connect the battery to the substrate.

[0012] In an embodiment, the round top cover is a pre-molded electrically insulating structure.

[0013] In an embodiment, the round top cover is attached to the substrate using a conductive adhesive material that provides an electrical connection between the round top cover and the substrate.

[0014] In an embodiment, the round top cover includes electrical traces on the inner surface of the round top cover that are electrically connected to the battery and the conductive adhesive material.

[0015] In an embodiment, the electronic component is a die, a multi-die component, a stacked die, or a surface mount device (SMD) component.

[0016] In an embodiment, a method for producing an electronic package includes: providing a substrate having an electronic component attached to the substrate; mounting a battery to the inner surface of a round top cover; and attaching the round top cover to the substrate such that the electronic component together with the battery is surrounded by the round top cover and the battery is electrically connected to the electronic component via the round top cover.

[0017] In an embodiment, the battery includes a positive side and a negative side, and mounting the battery includes electrically connecting at least one of the positive side and the negative side of the battery to an electrical trace on the inner surface of the round top cover such that when the round top cover is attached to the substrate, the battery is electrically connected to the electronic component via the substrate.

[0018] In an embodiment, the electronic component is a die physically attached to the substrate and electrically attached to the substrate via bonding wires, and mounting the battery includes electrically connecting the positive side and the negative side of the battery to conductive traces on the inner surface of the round top cover such that when the round top cover is attached to the substrate, the positive side and the negative side of the battery are electrically connected to the die via the substrate and the bonding wires.

[0019] In an embodiment, the electronic component is a die attached to the substrate, and mounting the battery includes electrically connecting at least one of the positive side and the negative side of the battery to an electrical trace on the inner surface of the round top cover such that when the round top cover is attached to the substrate, the battery is electrically connected to the die via the substrate.

[0020] In an embodiment, attaching the round top cover to the substrate includes physically attaching one of the positive side and the negative side of the battery to the die using a conductive adhesive material such that the die is sandwiched between the battery and the substrate.

[0021] In an embodiment, physically attaching one of the positive side and the negative side of the battery to the die includes electrically connecting the conductive adhesive material to at least one conductive via in the die to electrically connect the battery to the substrate.

[0022] In an embodiment, physically attaching one of a positive side and a negative side of a battery to a die includes extending a conductive adhesive material to one side of the die and onto a substrate to electrically connect the battery to the substrate.

[0023] In an embodiment, an electronic package includes: a substrate; a die attached to the substrate; a lid having conductive traces attached to the substrate such that the die is surrounded by the lid and the conductive traces are electrically connected to the substrate; and a battery attached to an inner surface of the lid and electrically connected to the conductive traces of the lid.

[0024] Other aspects of the invention will become apparent from the following detailed description taken in conjunction with the accompanying drawings, which illustrate by way of example the principles of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Depicts an integrated lid electronic package with a battery according to a first embodiment of the invention.

[0026] Figures 2A through 2H Illustrates batch production according to an embodiment of the invention Figure 1 of an integrated lid electronic package.

[0027] Figure 3A Depicts an integrated lid electronic package with a battery according to a second embodiment of the invention.

[0028] Figure 3B Depicts an integrated lid electronic package with a battery according to an alternative embodiment of the invention.

[0029] Figures 4A through 4G Illustrates batch production according to an embodiment of the invention Figure 3A of an integrated lid electronic package.

[0030] Figure 5 Illustrates a flowchart of a method for producing an electronic package, such as Figure 1 , 3A and the integrated lid electronic packages depicted in 3B, according to an embodiment of the invention.

[0031] Throughout the description, like reference numerals may be used to identify like elements. DETAILED DESCRIPTION

[0032] It is readily understood that the components of the embodiments, as generally described herein and shown in the figures, can be arranged and designed in a wide variety of different configurations. Thus, the following more detailed description of the various embodiments represented in the figures is not intended to limit the scope of the present disclosure, but is merely representative of the various embodiments. Although aspects of the embodiments are presented in the figures, the figures are not necessarily drawn to scale unless specifically stated otherwise.

[0033] The invention may be embodied in other specific forms without departing from its spirit or essential characteristics. The described embodiments are to be considered in all respects only as illustrative and not restrictive. Thus, the scope of the invention is indicated by the appended claims rather than by this detailed description. All changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

[0034] References throughout this specification to features, advantages, or similar language do not imply that all of the features and advantages that can be realized with the invention should be present in or in any single embodiment of the invention. On the contrary, the language referring to the features and advantages should be understood to mean that a particular feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the invention. Thus, the discussions of the features, advantages, and similar language throughout this specification may, but do not necessarily, refer to the same embodiment.

[0035] Furthermore, the described features, advantages, and characteristics of the invention may be combined in any suitable manner in one or more embodiments. Those skilled in the relevant art will recognize that, given the description herein, the invention can be practiced without one or more of the specific features or advantages of a particular embodiment. In other instances, additional features and advantages may be recognized in certain embodiments that may not be present in all embodiments of the invention.

[0036] References throughout this specification to "one embodiment," "an embodiment," or similar language mean that a particular feature, structure, or characteristic described in connection with the indicated embodiment is included in at least one embodiment of the invention. Thus, the phrases "in one embodiment," "in an embodiment," and similar language throughout this specification may, but do not necessarily, all refer to the same embodiment.

[0037] One problem with the molded battery holders used in traditional electronic packages is that the battery holders can cause the battery to experience high temperatures, which can significantly reduce the performance of the battery. Additionally, over time, the battery may expand and contract or expand according to the ambient temperature, which can damage the molded battery holders and other components in the package. Furthermore, the battery is typically mounted on a printed circuit board in close proximity to the package components, which can increase the overall size and cost of the package. Finally, traditional packages with batteries may have limitations on the number of components that can be packaged together.

[0038] Accordingly, the embodiments described herein may have advantages over prior methods used in electronic packages with batteries. Figure 1 Depicted is an integrated lid electronic package 100 with a battery 102 according to a first embodiment of the present invention, the lid electronic package solving at least some of the problems described above with respect to conventional electronic packages with molded battery holders. As Figure 1 shown, the integrated lid electronic package 100 uses a dome lid 104 to enclose the battery 102 and at least one die 106 in a compact form factor. Unlike some conventional electronic packages with batteries, the integrated lid electronic package 100 does not use a molded battery holder, which may not be able to handle the potential high temperatures generated by the battery 102 and any expansion / contraction of the battery size over time. Additionally, the battery 102 in the integrated lid electronic package 100 is not positioned laterally adjacent to the die 106 as in some conventional electronic packages, which reduces the overall size of the package with respect to volume, footprint, or both.

[0039] As Figure 1 shown, the integrated lid electronic package 100 includes a substrate 108 to which the die 106 is attached. The substrate may be a printed circuit board or any suitable substrate having electrical traces or connections. The die 106 may be any type of die having an integrated circuit fabricated on or within a semiconductor material. As a non-limiting example, the die is physically attached to the substrate using a bonding material 110 such as epoxy, eutectic material, or solder. In other embodiments, the die may be directly bonded to the substrate using, for example, a soldering process. The die is also electrically connected to the substrate. In this embodiment, bond wires are used to electrically connect the die to the substrate. At least two of these bond wires, such as bond wires 112A and 112B, are used to electrically connect the die to the positive and negative sides of the battery 102, as described below. The bond wires may be exposed or covered with epoxy to protect the wires. This may be achieved by dispensing epoxy over the bond wires and completely or partially over the die 106. In other embodiments, the integrated lid electronic package 100 may include more than one die attached to the substrate 108, such as stacked dies or a multi-die assembly, as well as other electronic components, such as surface mount device (SMD) components.

[0040] The lid 104 is physically attached to the substrate 108 to enclose the die 106 and the battery 102. The lid can be made of any plastic material such as, for example, liquid crystal polymer (LCP), ceramic, or other suitable non-conductive or electrically insulating material. In one or more embodiments, the lid is a pre-molded polymer structure. The lid includes electrical traces 114A and 114B on the inner surface of the lid, i.e., the surface facing the die 106. In one or more embodiments, the electrical traces 114A and 114B are patterned plating or coating, which can be produced by sputtering a conductive material such as copper onto the inner surface of the lid or by using other suitable processes. Patterning the plating to create electrical isolation between the electrical traces 114A and 114B can be achieved by "selectively" etching the plating.

[0041] The battery 102 is attached to the lid 104 via leads 116A and 116B, which provide electrical contacts for the battery. These leads can be pins, clips, or tabs that provide electrical connection to the positive and negative poles of the battery and hold the battery in place. In the illustrated embodiment, the battery 102 is a coin-type battery having a positive side and a negative side. However, the battery can be any type of battery, such as, by way of non-limiting example, a button cell. In the illustrated embodiment, the lead 116A that contacts the negative side of the battery 102 is attached to the electrical trace 114A on the lid 104 using a conductive adhesive material 118 such as, for example, a low-temperature curing conductive adhesive (ECA). Similarly, in the illustrated embodiment, the lead 116B that contacts the positive side of the battery 102 is attached to the electrical trace 114B on the lid 104 using a conductive adhesive material 120, which can be the same material as the conductive adhesive material 118. The lid 104 is also physically attached to the substrate using conductive adhesive materials 122 and 124 such as, for example, ECA. Thus, the negative side of the battery 102 is electrically connected to the die 106 through the lead 116A, the electrical trace 114A, the electrical trace 126A on or within the substrate 108, and the bonding wire 112A. Similarly, the positive side of the battery 102 is electrically connected to the die 106 through the lead 116B, the electrical trace 114B, the electrical trace 126B on or within the substrate 108, and the bonding wire 112B. In other embodiments, the battery 102 can be rotated such that the negative side of the battery is attached to the lid 104 and the positive side of the battery is attached to the substrate 108.

[0042] In one or more alternative embodiments, instead of using the conductive adhesive materials 118, 120, 122, and 124 to bond the battery 102, the lid 104, and / or the substrate 108 together, one or more metallurgical bonding processes can be used to bond these components to form the integrated capped electronic package 100. Non-limiting examples of metallurgical bonding processes that can be used include soldering, welding, and sintering.

[0043] In one or more embodiments, the integrated capped electronic package 100 can be produced in batches. Figures 2A through 2H FIG. shows a process for producing a batch of integrated capped electronic packages according to an embodiment of the present invention.

[0044] The process begins by attaching a plurality of die 206 to a substrate 208 using a bonding material 210, as Figure 2A shown. The die can be any type of die having an integrated circuit fabricated on a semiconductor material. The substrate can be any substrate having electrical traces or connections, such as a printed circuit board. The bonding material for attaching the die to the substrate can be, for example, an epoxy resin, a eutectic material, or solder.

[0045] Next, the die 206 is wire bonded to the substrate 208 using wires 212 to electrically connect the die to specific electrical traces or connections on the substrate, as Figure 2B shown. The electrical traces or connections on the substrate will be electrically connected to a battery.

[0046] Next, the dome lid 204 is provided in a strip form, as Figure 2C shown. The dome lid in strip form can be fabricated using known processes such as a molding process.

[0047] Next, the inner surface of the dome lid 204 in strip form is plated with a conductive material, thereby creating a plating on the inner surface of the dome lid. The plating on the inner surface of the dome lid is then patterned to create isolated conductive traces 114, as Figure 2D shown. Patterning the plating to create isolated conductive traces can be achieved by selectively etching the plating on the inner surface of the dome lid.

[0048] Next, a battery 202 having leads 216 is physically attached to the dome lid 204 using a conductive adhesive material 220 such that the leads are electrically connected to appropriate conductive traces 214 on the inner surface of the dome lid 204, as Figure 2E shown. For example, ECA can be used to physically attach the battery 202 having leads 216 to the dome lid 204 and to electrically connect the leads to appropriate conductive traces 214 on the inner surface of the dome lid.

[0049] Next, the dome lid 204 in strip form having the attached battery 202 is physically attached to the substrate 208 having the attached die 206 using a conductive adhesive material 222 such that the conductive traces 214 on the inner surface of the dome lid are electrically connected via conductive connections on the substrate to appropriate bonding wires 212, as Figure 2FAs shown. For example, an ECA can be used to physically attach the dome lid 204 in the form of a strip to the substrate 208 and electrically connect the conductive traces 214 on the inner surface of the dome lid to the appropriate bonding wires 212 via conductive connections on the substrate.

[0050] Next, the resulting structure in which the dome lid 204 in the form of a strip has been attached to the substrate 208 is then cut to separate the integrated lid-on electronic packages, as Figure 2G shown, which shows the dashed lines where the cuts are made in the structure. A mechanical singulation machine or a laser singulation machine can be used to cut the structure. This singulation step produces individual integrated lid-on electronic packages identical to Figure 1 the integrated lid-on electronic package 100, as Figure 2H shown.

[0051] Figure 3A Depicted is an integrated lid-on electronic package 300 having a battery 302 according to a second embodiment of the present invention. The integrated lid-on electronic package 300 is similar to Figure 1 the integrated lid-on electronic package 100. Thus, the same or similar reference numerals can be used to identify common elements between the two embodiments. The main difference between the two integrated lid-on electronic packages is that the integrated lid-on electronic package 300 includes a die 306 that does not have bonding wires, such as a die that has been attached to the substrate 308 using flip-chip technology, or a die having surface-mount connections, rather than the die 106 that has been wire-bonded to the substrate 108. Thus, for illustrative purposes, the die 306 can be referred to as a flip-chip die 306. The flip-chip die 306 is physically and electrically connected to the substrate using solder balls 330. Then, the interface between the flip-chip die 306 and the substrate 308 is filled with an electrically insulating adhesive material 332, such as an epoxy resin.

[0052] In this embodiment, the battery 302 is physically attached to the flip-chip die 306 using a conductive adhesive material 334, such as an ECA, such that the flip-chip die is sandwiched between the battery and the substrate 308. The conductive adhesive material 334 provides an electrical connection between the negative side of the battery 302 and the flip-chip die 306. In the shown embodiment, the negative side of the battery 302 is connected to the solder ball 330 using a through-silicon via (TSV) 336. However, in an alternative embodiment, the conductive adhesive material 334 is applied to extend to one or more sides of the flip-chip die 306 to contact one or more electrical connections on the substrate 308, as Figure 3B shown.

[0053] For Figure 3A and 3BIn the illustrated embodiment, the integrated lid electronic package 300 uses a dome lid 304 having a single conductive trace 314 that provides an electrical connection between the positive side of the battery 302 and the substrate 308 via a lead 316 that is attached to the conductive trace 314 using a conductive adhesive material 320. In one or more alternative embodiments, the lead 316 is omitted from the integrated lid electronic package 300 and the battery 302 is mounted directly to the dome lid 304. The conductive trace 314 can be formed using a plating on the inner surface of the dome lid 304, and the plating need not be patterned. The dome lid 304 having the conductive trace 314 is physically and electrically connected to the substrate 308 using conductive adhesive materials 322 and 324 that can be an ECA.

[0054] Similar to the integrated lid electronic package 100, in one or more alternative embodiments, instead of using conductive adhesive materials 320, 322, 324, and 334 to bond together the battery 102, the dome lid 104, the flip chip die 306, and / or the substrate 108, one or more metallurgical bonding processes can be used to bond these components to form the integrated lid electronic package 300.

[0055] In one or more embodiments, the integrated lid electronic packages 300 can be produced in batches. Figure 3A Figures 4A through 4G FIG. shows a process for producing a batch of integrated lid electronic packages in accordance with an embodiment of the present invention.

[0056] The process begins by attaching a plurality of flip chip dies 306 having TSVs 336 to the substrate 308 using a flip chip method that includes melting solder balls 330 on the flip chip die and underfilling the interface between the flip chip die and the substrate with an electrically insulating adhesive material 332, as Figure 4A shown. The electrically insulating adhesive material 332 can be any suitable adhesive made with an insulating material, such as epoxy resin as a non-limiting example.

[0057] Next, the dome lids 304 are provided in strip form, as Figure 4B shown. The dome lids 304 in strip form can be manufactured using known processes such as a molding process.

[0058] Next, the inner surface of the dome lids 304 in strip form is plated with a conductive material to produce a plating 314 on the inner surface of the dome lid, as Figure 4C shown. The plating 314 will serve as the single conductive trace for each dome lid 304.

[0059] Next, the battery 302 with leads 316 is physically attached to the round top cover 304 using a conductive adhesive material 320 such that the leads are electrically connected to the plating 314 on the inner surface of the round top cover, as Figure 4D shown. For example, an ECA can be used to physically attach the battery 302 with leads 316 to the round top cover 304 and electrically connect the leads 316 to the plating 314 on the inner surface of the round top cover. In one or more alternative embodiments, the battery 302 without leads 316 is physically attached to the round top cover 304 using a conductive adhesive material 320.

[0060] Next, the round top cover 304 in the form of a strip with the attached battery 302 is physically attached to the substrate 308 with the flip chip die 306 using a substrate-born conductive adhesive material 322. Additionally, the battery 302 is physically attached to the flip chip die 306 using a conductive adhesive material 334, as Figure 4E shown. In this embodiment, the conductive adhesive material 334 is applied only to the top surface of the flip chip die 306 to contact the through-silicon via (TSV) 336, as Figure 4E shown, thereby resulting in an integrated lid-covered electronic package corresponding to Figure 3A the integrated lid-covered electronic package.

[0061] Next, the resulting structure in which the round top cover 304 in the form of a strip has been attached to the substrate 308 is then cut to separate the integrated lid-covered electronic packages, as Figure 4F shown, which shows the dashed lines where the cuts are made in the structure. The structure can be cut using a mechanical singulation machine or a laser singulation machine. This singulation step results in individual integrated lid-covered electronic packages identical to Figure 3A the integrated lid-covered electronic package 300, as Figure 4G shown.

[0062] By a manner similar to the integrated lid-covered electronic package corresponding to Figure 3A the integrated lid-covered electronic package 300, an integrated lid-covered electronic package corresponding to Figure 3B the integrated lid-covered electronic package 300 is manufactured. However, instead of applying the conductive adhesive material 334 to only the top surface of the flip chip die 306, as Figure 4E shown, the conductive adhesive material 334 is applied to the flip chip die 306 to extend from the top surface of the flip chip die to one or more sides of the flip chip die and partially extend on the substrate 308. Then the resulting structure in which the round top cover 304 in the form of a strip has been attached to the substrate 308 is cut to separate the integrated lid-covered electronic packages, thereby resulting in electronic packages identical to Figure 3B the integrated lid-covered electronic package 300.

[0063] Refer to Figure 5The flowchart depicts a method for manufacturing an electronic package, such as integrated lid electronic packages 100 and 300, in accordance with an embodiment of the present invention. At block 502, a substrate is provided having electronic components attached thereto. At block 504, a battery is mounted to the inner surface of a dome lid. At block 506, the dome lid is attached to the substrate such that the electronic components together with the battery are enclosed by the dome lid and the battery is electrically connected to the electronic components via the dome lid.

[0064] Although the steps of the methods are shown and described herein in a particular order, the order of each method's steps may be altered such that certain steps may be performed in a reverse order or such that certain steps may be performed at least partially concurrently with other steps.

[0065] While specific embodiments of the present invention have been described and illustrated, the present invention is not limited to the specific forms or arrangements of components so described and illustrated. The scope of the present invention will be defined by the claims appended hereto and their equivalents.

Claims

1. An electronic package, characterized in that, Comprising: A substrate; An electronic component attached to the substrate; A dome lid attached to the substrate such that the electronic component is surrounded by the dome lid; And A battery attached to the inner surface of the dome lid and electrically connected to the electronic component via the dome lid.

2. The electronic package according to claim 1, wherein The battery includes a positive side and a negative side, and at least one of the positive side and the negative side of the battery is electrically connected to a trace on the inner surface of the dome lid, and the trace is electrically connected to the electronic component via the substrate.

3. The electronic package according to claim 1, characterized in that, The electronic component is a die physically attached to the substrate and electrically attached to the substrate via bonding wires, and the positive side and the negative side of the battery are electrically connected to conductive traces on the inner surface of the dome lid, and the conductive traces are electrically connected to the die via the substrate and the bonding wires.

4. The electronic package according to claim 1, wherein The electronic component is a die attached to the substrate, and at least one of the positive side and the negative side of the battery is electrically connected to a trace on the inner surface of the dome lid, and the trace is electrically connected to the die via the substrate.

5. The electronic package according to claim 4, characterized in that, One of the positive side and the negative side of the battery is physically attached to the die using a conductive adhesive material such that the die is sandwiched between the battery and the substrate.

6. A method for producing an electronic package, characterized in that, The method includes: Providing a substrate having an electronic component attached to the substrate; Mounting a battery to the inner surface of a dome lid; and Attaching the dome lid to the substrate such that the electronic component together with the battery is surrounded by the dome lid and the battery is electrically connected to the electronic component via the dome lid.

7. The method according to claim 6, characterized in that, The battery includes a positive side and a negative side, and mounting the battery includes electrically connecting at least one of the positive side and the negative side of the battery to a trace on the inner surface of the dome lid such that when the dome lid is attached to the substrate, the battery is electrically connected to the electronic component via the substrate.

8. The method according to claim 6, wherein The electronic component is a die physically attached to the substrate and electrically attached to the substrate via bonding wires, and mounting the battery includes electrically connecting the positive side and the negative side of the battery to conductive traces on the inner surface of the dome lid such that when the dome lid is attached to the substrate, the positive side and the negative side of the battery are electrically connected to the die via the substrate and the bonding wires.

9. The method according to claim 6, wherein The electronic component is a die attached to the substrate, and mounting the battery includes electrically connecting at least one of the positive side and the negative side of the battery to a trace on the inner surface of the dome lid such that when the dome lid is attached to the substrate, the battery is electrically connected to the die via the substrate.

10. An electronic package, characterized in that, Comprising: A substrate; A die attached to the substrate; A dome lid having conductive traces attached to the substrate such that the die is surrounded by the dome lid and the conductive traces are electrically connected to the substrate; And A battery attached to the inner surface of the dome lid and electrically connected to the conductive traces of the dome lid.

Images