Broadband antenna for wireless broadcast channel

Abstract

The invention relates to a broadband antenna for a wireless broadcast channel. An apparatus may include a plurality of carriers, where each carrier includes a plurality of communication processors, each communication processor disposed over or in a respective carrier of the plurality of carriers and configured to provide a wireless broadcast communication channel, and a plurality of antennas disposed over or in the respective carrier, each antenna is disposed on or in a respective carrier and coupled to a respective communication processor, where each antenna extends into a corner of the respective carrier, and where the carriers in each pair of adjacent carriers are positioned at a distance from each other less than about one wavelength corresponding to a lowest operating frequency.

Description

Technical Field

[0001] Various aspects of the present disclosure generally relate to devices including multiple carriers configured to communicate wirelessly with each other. For example, various aspects relate to dies and printed circuit boards (PCBs) communicating wirelessly with each other. Background Art

[0002] To improve the yield of semiconductor manufacturing and packaging and reduce design costs, multi-carrier (die) architectures and modular designs are often used nowadays. However, communicating between carriers via a wire-based Network-on-package (NoP) introduces relatively high latency because data movement between carriers is not as fast as within a monolithic die. For example, the core-to-core communication latency between cores on the same die may be around 20 ns, while it is around 140 ns when the cores are on different dies / chips. In addition, there are several drawbacks and practical limitations to using state-of-the-art wireless broadcast communication between carriers, especially when the carriers are close to each other, e.g., at distances less than about one wavelength corresponding to the lowest operating frequency.

[0003] In addition, cache write-update protocols, i.e., the broadcast of changes to a cache shared between multiple carriers, may consume a lot more interconnect bandwidth to eliminate system coherence misses. For example, in deep learning based on Convolutional Neural Networks (CNNs), the average contribution of broadcast traffic using multiple carriers may account for 80% or more of the total inference energy and latency of the system, i.e., only 20% or less may be used for the actual computations of CNN execution.

[0004] It is predicted that in the future, the bandwidth density of interconnects may double or triple every two years, thus creating an equivalent of Moore's Law for on-package interconnects, making it difficult for multi-carrier / die-based hardware accelerators to scale towards High-Performance Computing (HPC). Summary of the Invention

[0005] According to an embodiment of the present disclosure, a device is provided, including: a plurality of carriers, the plurality of carriers including: a plurality of communication processors, each communication processor being disposed above or in a corresponding one of the plurality of carriers and configured to provide a wireless communication channel; and a plurality of antennas, each antenna being disposed on or in a corresponding carrier and coupled to the corresponding communication processor, wherein each antenna extends into a corner of the corresponding carrier; wherein, for each pair of adjacent carriers, the corresponding antennas extending into the corresponding corners face each other; and wherein the antennas in each pair of adjacent carriers are positioned at a distance from each other less than about one wavelength, the wavelength corresponding to the lowest operating frequency. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] In the drawings, like reference numerals generally refer to the same parts throughout different views. The drawings are not necessarily to scale, and emphasis is generally placed upon illustrating the principles of the invention. It should be understood that the drawings are illustrative and schematic representations of exemplary aspects of the invention and are not limiting of the invention nor necessarily drawn to scale. In the following description, various embodiments of the invention are described with reference to the following drawings, in which:

[0007] Figure 1 illustrates wireless chip-to-chip broadcast between adjacent dies;

[0008] Figure 2 illustrates an exemplary carrier according to some aspects;

[0009] Figure 3 illustrates an exemplary 2x2x3 die structure according to some aspects;

[0010] Figure 4 illustrates layers of an exemplary die according to some aspects;

[0011] Figure 5 illustrates a cross-sectional view of layers of an exemplary die according to some aspects;

[0012] Figure 6 illustrates channel performance of a top die tier;

[0013] Figure 7 illustrates channel performance of a middle die tier;

[0014] Figure 8 illustrates an exemplary arrangement of adjacent PCBs according to some aspects;

[0015] Figure 9 illustrates an exemplary device according to some aspects. DETAILED DESCRIPTION

[0016] The following detailed description refers to the accompanying drawings, which illustrate by way of example specific details and embodiments in which the invention may be implemented.

[0017] The term "exemplary" is used herein to mean "serving as an example, instance, or illustration". Any embodiment or design described herein as "exemplary" is not necessarily to be construed as more preferred or advantageous than other embodiments or designs.

[0018] The term "above" as used herein with respect to a deposited material formed "above" a particular side or surface may be used to mean that the deposited material may be formed "directly above" the implied side or surface, e.g., in direct contact with the side or surface. The term "above" as used herein with respect to a deposited material formed "above" a particular side or surface may be used to mean that the deposited material may be formed "indirectly above" the implied side or surface, with one or more additional layers disposed between the implied side or surface and the deposited material.

[0019] The terms "at least one" and "one or more" can be understood to include a numerical quantity greater than or equal to one (e.g., one, two, three, four, [...], etc.). The term "plurality" can be understood to include a numerical quantity greater than or equal to two (e.g., two, three, four, five, [...], etc.).

[0020] The words "plural", "multiple", and "many" in the specification and claims clearly refer to a quantity greater than one. Thus, any phrase that explicitly invokes one of the above words that refers to the number of elements (e.g., "a plurality (of elements)", "many (of elements)") clearly refers to more than one of the recited elements. Phrases such as "(a) group", "(a) set", "(a) collection", "(a) series", "(a) sequence", "(a) grouping", etc. in the specification and claims and similar terms (if any) refer to a quantity equal to or greater than one, i.e., one or more. Phrases such as "proper subset", "adjusted subset", and "smaller subset" refer to a subset of a set that is not equal to the set, and by way of example, refer to a subset of a set that contains fewer elements than the set.

[0021] The phrase "at least one" with respect to a group of elements can be used herein to mean at least one element from the group including those elements. For example, the phrase "at least one" with respect to a group of elements can be used herein to mean a selection from the following: one of the listed elements, one of a plurality of the listed elements, a plurality of the individual listed elements, or a plurality of elements of the individual listed elements.

[0022] For example, the terms "processor" or "controller" as used herein can be understood as any kind of technical entity that allows for the handling of data. Data can be handled in accordance with one or more specific functions performed by the processor or controller. Additionally, a processor or controller as used herein can be understood as any kind of circuit, e.g., any kind of analog or digital circuit, and can also be referred to as a "processing circuit", "processing line", etc. A processor or controller can thus be or can include an analog circuit, a digital circuit, a mixed-signal circuit, a logic circuit, a processor, a microprocessor, a central processing unit (CPU), a graphics processing unit (GPU), a digital signal processor (DSP), a field programmable gate array (FPGA), an integrated circuit, an application specific integrated circuit (ASIC), etc., or any combination thereof. Any other kind of implementation of the various functions described in more detail below can also be understood as a processor, controller, or logic circuit. It is to be understood that any two (or more) of the processors, controllers, or logic circuits detailed herein can be implemented as a single entity having equivalent functions, etc., and conversely, any single processor, controller, or logic circuit detailed herein can be implemented as two (or more) separate entities having equivalent functions, etc.

[0023] Compared with communication performed on a single carrier / die, wired communication between carriers (e.g., between adjacent dielets or PCBs) can significantly increase latency.

[0024] One possible solution to reduce the latency that occurs during inter-carrier communication is to use an antenna or a coupler to communicate wirelessly between carriers.

[0025] However, the broadcast antennas previously used and / or conceptualized for wireless-enabled-on-chip (NoC) or network-on-package (NoP) communication have limited practical use, especially when the carriers are close to each other (e.g., the distance between them is less than about one wavelength corresponding to the lowest operating frequency).

[0026] Various examples of prior broadcast antennas include variants of common antennas, e.g., simple zigzag antennas, resonant antennas, electric and magnetic dipoles, and through-silicon via (TSV) antennas.

[0027] For example, a TSV broadcast antenna using silicon as the broadcast channel medium provides only limited practical use.

[0028] Figure 1 Illustrated is wireless chip-to-chip broadcasting between adjacent dies 110, 120, 130, and 140 using antennas 112, 124, 132, and 142, where each antenna has a top-loaded monopole.

[0029] In Figure 1 , antennas 112, 122, 132, and 142 can be positioned / located on the underlying package 100 (or base die). The package 100 can include multiple dies 110, 120, 130, and 140.

[0030] Alternatively, antennas 112, 122, 132, 142 can be disposed on a bridging die located between four adjacent dies 110, 120, 130, 140 ( Figure 1 not shown in Figure 1 ). The bridging die can also be a hybrid die and include transmission lines (

[0031] not shown in Figure 1 ). When the dies / carriers are separated from each other by a "relatively long" distance (e.g., at least 2 wavelengths, approximately 5.5 mm at 110 GHz),

[0032] the structure shown in

[0033] may help reduce latency and / or traffic congestion on the NoP. However, when using a multi-carrier architecture with tight integration (e.g., a distance less than approximately 1 wavelength corresponding to the lowest operating frequency between carriers), the localized wireless broadcast structure may encounter increased overhead and latency.

[0034] Figure 2 Illustrated is an exemplary carrier 200 according to some aspects. Carrier 200 includes a first substrate layer 202, a second substrate layer 204, bonding 206, a driven blind via 208, a reflector through via 210, and an (alternating current) voltage source 212, where the antenna includes the driven blind via 208 and the reflector through via 210. The voltage source 212 is located between the antenna feeder and the ground.

[0035] As can be seen from Figure 2 the antenna including the driven blind via 208 and the reflector through hole 210 is formed in a non-monolithic die.

[0036] The carrier 200 may further include a communication chip / processor 214 that provides a wireless communication channel ( Figure 2 not shown in), and the antenna including the driven blind via 208 and the reflector through hole 210 may be coupled to the communication chip 214 (and / or may be included in the communication chip 214).

[0037] Alternatively, the antenna (feeder) may be formed only on the upper substrate layer 202.

[0038] In the following, embodiments and aspects of the present invention will be described, where adjacent carriers are adjacent stacked dielets arranged on a die. It is to be understood that this is merely illustrative in nature, and the disclosed embodiments and aspects apply to other types of carriers.

[0039] Figure 3 A exemplary 2x2x3 dielet structure 300 in a non-monolithic die is illustrated, where the dielet structure 300 includes four adjacent vertically stacked dielet stacks 310, 320, 330, 340, where each dielet stack includes three dielets positioned on a package (die) 360. Each dielet further includes an antenna 350 located at the corner of the dielet, enabling wireless NoP broadcast. As Figure 3 shown, the dielets are arranged on the package 360 in such a way that their respective corners including the antenna 350 face each other, i.e., are in close proximity to each other.

[0040] These dielet stacks may be positioned on an insert, or on an Embedded Multi-Die Interconnect Bridge (EMIB) on an organic package ( Figure 3 not shown in).

[0041] Dielets at the same level, such as dielets 312, 322, 332, and 342, are capable of wireless communication with each other.

[0042] Each dielet (dielets 312, 314, 316, 322, 324, 326, 332, 334, 336, 342, 344, and 346) of each dielet stack may further include a communication processor and an antenna ( Figure 3 not shown in).

[0043] Alternatively, only the die at one level may include the antenna 350 and the communication processor. For example, only die 312, 322, 332, and 342 (the die at the top of each respective die stack) may include the antenna 350 and the communication processor.

[0044] The antenna 350 may be formed in the non-monolithic die complex in the same manner as the antenna including the driven blind vias 208 and the reflector through vias 210, and is a unique vertically polarized antenna integrated in the die. As can be seen Figure 3 from, the antenna 350 has the type / shape of a bow and arrow, and is positioned at the corners of the die such that they point in the corner direction and the corner direction of the opposite die.

[0045] The antenna 350 is an extremely-wideband (EWB) antenna with a large operating bandwidth of more than 50 GHz (operating between 100 GHz and 200 GHz), and also provides a channel with low group delay variation.

[0046] The antenna 350 thus does not suffer from the typical problems of narrow operating bandwidth and limited angular coverage of wireless broadcast antennas in a tightly integrated multi-die architecture.

[0047] In addition, the provided wireless broadcast channel can support both air-cooling systems and immersion / liquid-cooling systems.

[0048] Figure 3 The exemplary arrangement shown reduces the interconnect delay, as well as the bandwidth and energy required for communication between adjacent dies, and also enables scalable 3D heterogeneous die integration.

[0049] Therefore, Figure 3 the arrangement reduces the delay, bandwidth, and energy consumption in the hardware accelerator. For example, it reduces the delay and energy required for communication between adjacent dies in CNN-based deep learning tasks, thus accelerating such tasks.

[0050] Figure 3 The arrangement also reduces the wiring congestion and additional insertion loss, and also reduces the number of bumps and package balls, thereby potentially reducing the package size.

[0051] By reducing the number of vertical and horizontal interconnects required to connect the dies vertically and horizontally, the space freed up can be reused for other tasks, such as power delivery, more space for circuits, and so on.

[0052] Therefore, Figure 3 the arrangement allows for high data throughput, control, and cache message passing between adjacent dies at the same level / hierarchy.

[0053] In the following, the design and geometry of the antenna and the die will be discussed in detail. It should be understood that the following devices and implementations are of a demonstrative and illustrative nature.

[0054] Figure 4 Layers of an exemplary die 400 according to some aspects are illustrated.

[0055] In general, die 400 can be part of a 2x2xN 3D die array. However, for simplicity, in the following it is assumed that die 400 is part of a 2x2x3 3D die array, where each vertically stacked die stack includes three dies, i.e., in the following it is assumed that die 400 is Figure 3 part of a die array corresponding to the die structure 300 shown in

[0056] Die 400 includes four external ground metal layers 410, 420, 430, and 440 and a glass core 450. Each of the external metal layers 410, 420, 430, 440 is made of, for example, copper Cu. Between the ground metal layers, substrates (layers) 412, 422, 432, 442 are positioned. The substrates (layers) are made of, for example, polyimide PI. The outer layer is a 2-layer redistribution layer (RDL) and can be used to stack the dies, and / or form part of an antenna structure, and / or route signals from each bump of the die. The glass core 450 has at least one glass blind via 470 and glass through-vias (Through-Glass Vias, TGVs) 480. Die 400 also includes a plurality of vias 460 in the substrates (layers) 412, 422, 432, 442.

[0057] Die 400 is not necessarily a symmetric stack as Figure 4 shown, but rather can also be asymmetric, for example having only one top (bottom) metal layer and two bottom (top) outer layers, each outer layer having a substrate and a metal layer.

[0058] Furthermore, the core of die 400 is not necessarily a glass core and can be made of other materials, such as silicon or an organic substrate.

[0059] As an example, die 400 is designed for a glass-based D-band broadcast channel operating from 110 to 170 GHz.

[0060] The glass blind vias 470 and the (one or more) TGVs 480 are used to construct an antenna, e.g., antenna 350, and a surrounding reflector. The driven glass blind vias 470 form the main radiating part of the antenna. In a wired interconnect application, it is not possible to use a glass blind via as part of an antenna structure to achieve wireless broadcast between adjacent dies because this would result in signal disconnection.

[0061] Using glass blind vias as part of the antenna structure simplifies the antenna geometry by reducing the number of redistribution layers occupied by the antenna, thereby also reducing costs. Multiple glass blind vias of unequal lengths in a single (thick) glass core ( Figure 4 not shown in ) can simulate a multi-layer glass substrate.

[0062] Each of the outer metal layers 410, 420, 430, 440 may have a thickness of, for example, 4 μm, and the substrate layers may each have a thickness of, for example, 4 μm. The glass core 450 may have a thickness of, for example, 150 μm and a dielectric constant of 7.7. Thus, the height of a die stack including a vertical stack of three dies 400 may be about 550 μm. The width of the die 400 may be about 2 mm.

[0063] Figure 5 A horizontal cross-sectional view of the layers of the die 400 according to some aspects is shown. Figure 5 A cross-sectional view of the first outer ground layer 510 (corresponding to Figure 4 layer 410), a cross-sectional view of the second outer ground layer 520 (corresponding to Figure 4 layer 420), a cross-sectional view of the core glass layer 550 (corresponding to Figure 4 glass core 450), and cross-sectional views of the third and fourth outer ground layers 530 (corresponding to Figure 4 layers 430 and 440) are shown.

[0064] From Figure 5 it can be seen that a series of (grounded) TGVs 522 are formed on each layer for electrically shorting the ground layers together with the first and second layer vias 460 and the third and fourth layer vias 460 ( Figure 5 not shown in ). This series of TGVs 522 acts as a reflector, impedance transformer, and shaper of the near-field pattern for the coupler.

[0065] An antenna (structure) 526 is formed in all the outer layers 510, 520, and 530. The antenna structure 526 is a 3D vertical pore-like antenna excited by a grounded blind via and outlined by all the TGVs passing through all four metal layers 410, 420, 430, and 440 ( Figure 5 not shown in, only the shape of the antenna is outlined in layer 520). As Figure 5 shown, the antenna 526 may have a "shooting bow and arrow" shape. The main radiation structure of the antenna is the driven glass blind via 524.

[0066] The antenna 526 does not necessarily need to have the Figure 5 "arrow" shape shown in, and may also have different shapes, not necessarily being symmetric.

[0067] The antenna 526 is fed by a co-planar waveguide (CPW) 528 transmission line and is connected to the driven glass via hole 524. The center signal line of the CPW 528 is connected to the driven glass via pad, which is connected to the driven glass via hole 524. The end portion of the CPW 528 can be connected to the RFIC through signal routing.

[0068] There is a triangular metal void 529 around the driven glass via pad, which is located near the corner tip. The void shape 529 prevents the driven glass via hole 524 from being electrically short-circuited and also controls the parasitic capacitance between the first layer 510 and the second layer 520.

[0069] The triangular void shape is an ideal (optimal) shape that allows the driven glass via hole 524 to be closer to the corner tip and enables a low (minimum) channel loss for the wireless link response between multiple antennas 526 (located on adjacent die 400).

[0070] Figure 5 The rectangular void shown on the second layer 520 is typically only used for simulation purposes to excite the antenna and is not necessarily part of the antenna structure.

[0071] The geometric topology of the antenna 526 can support various gap dielectric materials between die, chips (die), packages, PCBs, and / or their hybrids. The supported materials include air, mold / underfill materials, epoxy, silicon, glass, and water.

[0072] As can be seen from the cross-sectional view of the glass core layer 550, the TGV 522 is further divided into a first group of two grounded TGVs 552 and a second group of driven TGVs 554. The first group of two grounded TGVs 552 is located behind the second group of driven TGVs 554. The grounded TGV 552 near the co-planar waveguide (CPW) 528 transmission line is mainly used for impedance matching, while the TGV 554 mainly helps to shape the near-field pattern of the coupler.

[0073] The reflector TGV shape can be optimized by conventional optimization algorithms, such as genetic algorithms, particle swarm algorithms, or CMA evolution strategies.

[0074] However, the optimized reflector shape, together with the triangular metal void and the CPW feeder, is always a variant of the bow shape to enable broadcasting of signals to other / adjacent die stacks with a relatively flat channel amplitude response (e.g., as Figure 3 shown in a three adjacent die stack).

[0075] Furthermore, if the desired power transfer ratios between adjacent chips receiving broadcast signals are different, the bow reflector of the antenna may not be as Figure 5 Shown is symmetrical or mirrored about the CPW feed line.

[0076] from Figure 5 It can also be seen in , that the cutout shapes of the third and fourth outer layers 530 closely follow the bow shape of the reflector TGV. This enables an extremely wideband (ultra-wideband) operating frequency range for the antenna 526, as well as low channel loss and low group delay variation.

[0077] Figure 5 The exemplary design shown can be easily scaled to support vertically stacked die stacks of 4, 5, 10, ..., N levels. In addition, the design can support other substrate materials such as silicon and organic materials.

[0078] In the following, the description of Figure 3 , Figure 4 and Figure 5 Simulation results of a vertically stacked 2x2x3 3D ​​core stack / array.

[0079] Figure 6 The channel performance at the top chiplet level is shown when the antennas of the first chiplet stack 310 are excited. Figure 6 In the simulation results of , only the antenna at the top level (third level) of the chip stack 310 is excited, and the antenna excitation ports on other levels are terminated to a reference impedance (eg, 25 ohms).

[0080] Figure 6 The antenna port number 1 in the scattering parameter plot legend and the group delay plot legend is defined for Figure 3 , antenna port number 2 is defined for the top level 322 of the second chip stack 320 , antenna port number 3 is defined for the top level 332 of the third chip stack 330 , and antenna port number 4 is defined for the top level 342 of the fourth chip stack 340 .

[0081] Figure 6 The scattering parameter S2,1 in is evaluated from antenna port 1 to antenna port 2 (normalized power from antenna port 1 to antenna port 2), Figure 6 The scattering parameter S3,1 in is evaluated from antenna port 1 to antenna port 3, and Figure 6 The scattering parameter S4,1 in is evaluated from antenna port 1 to antenna port 4.

[0082] Figure 6 The “Group Delay 2,1” in the figure indicates the delay from antenna port 1 to antenna port 2, andFigure 6 The "group delay 3,1" in Figure 6 indicates the delay from antenna port 1 to antenna port 3. The appended "(1)" in "group delay" indicates that it is the first mode, i.e., the (fundamental) mode that satisfies (solves) Maxwell's equations and their boundary conditions.

[0083] From Figure 6 it can be seen that the top-level simulation results show a transmission bandwidth exceeding 60 GHz, a broadcast channel loss less than 15 dB in the target frequency range of 110 GHz to 170 GHz, and a group delay variation less than 25 ps ( Figure 6 second figure of Figure 6 ).

[0084] Figure 7 The figure shows the channel performance of the middle die level when the antenna of the first die stack 310 is excited. In Figure 7 the simulation results of Figure 7 , only the antenna of the middle level (second level) of the die stack 310 is excited, and the antenna excitation ports on other levels are terminated to the reference impedance.

[0085] Figure 7 The antenna port number 1 in the legend of the scattering parameter curve and the legend of the group delay curve in Figure 7 is defined for Figure 3 the middle level (not shown) of the first die stack 310 shown in Figure 3 , the antenna port number 2 is defined for the middle level (not shown) of the second die stack 320, the antenna port number 3 is defined for the middle level (not shown) of the third die stack 330, and the antenna port number 4 is defined for the middle level (not shown) of the fourth die stack 340.

[0086] Similar to Figure 6 Figure 7 the scattering parameter S2,1 in Figure 7 is evaluated from antenna port 1 to antenna port 2, Figure 7 the scattering parameter S3,1 in Figure 7 is evaluated from antenna port 1 to antenna port 3, and Figure 7 the scattering parameter S4,1 in Figure 7 is evaluated from antenna port 1 to antenna port 4. Figure 7 The group delay 2,1 in Figure 7 indicates the delay from antenna port 1 to antenna port 2, and Figure 7 the group delay 3,1 in Figure 7 indicates the delay from antenna port 1 to antenna port 3.

[0087] Figure 7 The middle-level simulation results of show a transmission bandwidth exceeding 60 GHz, a broadcast channel loss less than 20 dB in the target frequency range of 110 GHz to 170 GHz, and a group delay variation less than 20 ps (second figure).

[0088] From Figure 7 it can be seen that, similar toFigure 6 Compared with the top - level broadcast situation, the group - delay response of the middle - level broadcast channel is relatively flat.

[0089] The reason for this effect is that the reflected electromagnetic waves from the top die level and the bottom die level "balance" in opposite phases, i.e., they are in (near) a net - zero state. However, some of the "balanced" electromagnetic fields are absorbed at the termination ports of the top and bottom levels. Therefore, Figure 7 the broadcast - channel loss in the middle - level situation of Figure 6 is higher than that in the top - level situation of

[0090] In addition, when the antenna of the first top die 312 is excited, the simulation results of the power - density flow of the top - level die at 140 GHz show a smooth power - density transition at the impedance boundary ( Figure 6 or Figure 7 not shown in

[0091] As a further embodiment, the encapsulation substrate can be a PCB, and wireless broadcast can be performed between adjacent packages or PCBs. In other words, the glass - based EWB vertical - polarization antenna described above for die stacking can also be applied to the package - to - package wireless - broadcast channel between adjacent packages, or can be implemented in a similar manner near the corners of the PCB to provide a broadcast channel between adjacent PCBs.

[0092] Figure 8 An exemplary arrangement 800 of adjacent PCBs 810, 820, 830, and 840 is shown, where each PCB includes a plurality of die stacks 850, e.g., die stacks such as Figure 3 the 2x2x3 3D die stack of

[0093] Each PCB includes additional dies 860 attached to the PCB. The dies 860 serve both as antennas and RFIC dies and are formed in a non - monolithic die complex using hybrid bonding, direct bonding, or other bonding methods. In a similar manner, the arrangement 800 can have an arrangement of semiconductor packages in which a wireless - broadcast channel is implemented. Figure 8 not shown in

[0094] Figure 9 An exemplary device 900 is illustrated according to some aspects.

[0095] In Figure 9 device 900 includes a plurality of carriers 910.

[0096] Each carrier 910 includes a communication processor 920 (disposed on or within the carrier 910) configured to provide wireless communication, and an antenna 930 (disposed on or within the carrier 910) coupled to the communication processor 920. The antenna 930 extends into a corner of the carrier 910, and three adjacent carriers 910 are positioned relative to each other such that their respective antennas 930 extending into their respective corners face each other.

[0097] The antennas 930 are further positioned such that they are "close" to each other, within a range less than about one wavelength corresponding to the lowest operating frequency. For example, for a D-band operating bandwidth (110 GHz to 170 GHz), they are 25, 50, 100, 150, 200, or 250 μm apart from each other.

[0098] Although the above description and the associated figures may depict the electronic device components as separate elements, those skilled in the art will appreciate the various possibilities of combining or integrating the discrete elements into a single element. This can include combining two or more circuits to form a single circuit, mounting two or more circuits onto a common semiconductor chip or housing to form an integrated element, executing discrete software components on a common processor core, and so on. Conversely, those skilled in the art will recognize the possibility of separating a single element into two or more discrete elements, such as splitting a single circuit into two or more separate circuits, separating a semiconductor chip or housing into the discrete elements originally provided thereon, separating a software component into two or more parts and executing each part on a separate processor core, and so on.

[0099] All abbreviations defined in the above description also hold in all claims included herein.

[0100] The following examples disclose various aspects of the present disclosure:

[0101] Example 1 is a device that may include a plurality of carriers. The plurality of carriers may include a plurality of communication processors, each communication processor being disposed above or within a respective one of the plurality of carriers and configured to provide a wireless communication channel, and a plurality of antennas, each antenna being disposed on or within a respective carrier and coupled to the respective communication processor, wherein each antenna extends into a corner of the respective carrier, wherein for each pair of adjacent carriers, the respective antennas extending into the respective corners face each other, and wherein the antennas in each pair of adjacent carriers are positioned such that they are within a range less than about one wavelength from each other, the wavelength corresponding to the lowest operating frequency.

[0102] In Example 2, the subject matter as described in Example 1 may optionally include that each antenna in each pair of adjacent carriers is positioned at the closest distance (as much as possible) from each other.

[0103] In Example 3, the subject matter as described in any one of Examples 1 or 2 may optionally include that the antenna is an extremely wideband EWB antenna having an operating bandwidth greater than 50 GHz.

[0104] In Example 4, the subject matter as described in any one of Examples 1 to 3 may optionally include that each antenna has an arrow-shaped end portion extending into the corners of the carrier.

[0105] In Example 5, the subject matter as described in Example 4 may optionally include that each antenna has an "archer's bow" structure having a coplanar waveguide CPW portion and an arrow-shaped end portion, wherein the CPW portion extends from the central portion of the carrier into the arrow-shaped end portion of the carrier.

[0106] In Example 6, the subject matter as described in any one of Examples 1 to 5 may optionally include that each carrier includes an antenna impedance matching structure.

[0107] In Example 7, the subject matter as described in Example 6 may optionally include that the impedance matching structure further includes a plurality of vias extending into the carrier.

[0108] In Example 8, the subject matter as described in Example 7 may optionally include that the plurality of vias includes through-holes and blind vias.

[0109] In Example 9, the subject matter as described in Example 7 or 8 may optionally include that the plurality of vias includes glass vias and / or glass through-holes.

[0110] In Example 10, the subject matter as described in any one of Examples 1 to 9 may optionally include that each carrier has a multi-layer structure.

[0111] In Example 11, the subject matter as described in any one of Examples 1 to 10 may optionally include that each carrier has a multi-layer structure including a core substrate and at least one structured conductive layer, and each antenna is formed in the structured conductive layer.

[0112] In Example 12, the subject matter as described in Example 11 may optionally include that the core substrate is a glass core.

[0113] In Example 13, the subject matter as described in any one of Examples 11 or 12 may optionally include an additional structured conductive layer opposite to the structured conductive layer.

[0114] In Example 14, the subject matter as described in Examples 11 to 13 may optionally include that at least one structured conductive layer is a redistribution layer.

[0115] In Example 15, the subject matter as described in any one of Examples 11 to 14 may optionally include that the structured conductive layer includes a metal layer and a substrate layer.

[0116] In Example 16, the subject matter as described in any one of Examples 11 to 15 may optionally include that the substrate layer included in the structured conductive layer is made of polyimide.

[0117] In Example 17, the subject matter as described in any one of Examples 11 to 16 may optionally include that each carrier includes at least two upper structured conductive layers and at least one lower structured conductive layer opposite to the upper structured conductive layers.

[0118] In Example 18, the subject matter as described in Example 17 may optionally include that each carrier includes a first uppermost structured conductive layer and a second upper structured conductive layer, and each antenna has an arrow-shaped end portion in the second upper structured conductive layer, the end portion extending into the corner of the carrier, and at least one lower structured conductive layer has a cutout in the region corresponding to the arrow-shaped end portion of the antenna in the second upper structured conductive layer.

[0119] In Example 19, the subject matter as described in Example 17 or 18 may optionally include that each structured conductive layer includes a metal layer and a substrate layer, and the metal layer including the antenna is electrically grounded through a via hole.

[0120] In Example 20, the subject matter as described in Example 19 may optionally include that the via hole connecting the metal layers has a raised shape.

[0121] In Example 21, the subject matter as described in Example 20 may optionally include that the via hole with the raised shape is located near the corner of the carrier.

[0122] In Example 22, the subject matter as described in any one of Examples 19 to 21 may optionally include that the metal layer of the uppermost structured conductive layer includes a coplanar waveguide (CPW) transmission line, wherein the CPW is configured as an antenna feeder on the second upper structured conductive layer, and wherein the center signal line of the CPW feeder is connected to a via pad, and the via pad is connected to a glass blind hole.

[0123] In Example 23, the subject matter as described in Example 22 may optionally include that the center line of the CPW and the second upper structured conductive layer are connected to a void area located on the metal layer of the second upper structured layer.

[0124] In Example 24, the subject matter as described in Example 23 may optionally include that the through - hole connecting the metal layer has a raised shape, the through - hole pad connecting the driven glass blind hole is located (situated) inside the void area, and the void area is located between the raised - shape through - hole and the corner of the carrier.

[0125] In Example 25, the subject matter as described in Example 24 may optionally include that the grounding shape of the metal layer in one of the underlying structured conductive layers has a cut corresponding to (corresponding to the shape formed by) the position of the raised - shape through - hole.

[0126] In Example 26, the subject matter as described in any one of Examples 1 to 25 may optionally include that the plurality of carriers includes a first plurality of die.

[0127] In Example 27, the subject matter as described in Example 26 may optionally include that the first plurality of die are positioned in a common plane.

[0128] In Example 28, the subject matter as described in Example 27 may optionally include three, four, five or more die, and the die are positioned such that for each pair of die, their respective sides including the antenna face each other.

[0129] In Example 29, the subject matter as described in Example 28 may optionally include that the pairs of die are positioned in a symmetric pattern.

[0130] In Example 30, the subject matter as described in any one of Examples 27 to 29 may optionally include a second plurality of die, wherein each die from the first plurality of die is disposed above a corresponding die from the second plurality of die to form a plurality of die stacks.

[0131] In Example 31, the subject matter as described in Example 30 may optionally include that the die including the antenna is at the top of each die stack.

[0132] In Example 32, the subject matter as described in any one of Examples 26 to 31 may optionally include a system carrier for carrying the plurality of die.

[0133] In Example 33, the subject matter as described in any one of Examples 26 to 32 may optionally include a packaging material for encapsulating all die.

[0134] In Example 34, the subject matter as described in any one of Examples 1 to 25 may optionally include that the carrier is a printed circuit board (PCB) or a package.

[0135] In Example 35, the subject matter as described in Example 34 may optionally include that the antenna is formed on a separate antenna chip mounted on the PCB or the package.

[0136] In Example 36, the subject matter as described in Example 35 may optionally include that the antenna chip is mounted in a corner of the PCB or package.

[0137] In Example 37, the subject matter as described in Example 35 or 36 may optionally include that the PCB or package includes a first plurality of die that are positioned to be stacked on top of each other to form a first die stack, and a second plurality of die that are positioned to be stacked on top of each other to form a second die stack, wherein the first die stack and the second die stack are located beside each other, and wherein the die stacks are coupled to the antenna.

[0138] In Example 38, the subject matter as described in any one of Examples 34 to 37 may optionally include that the PCB or package includes additional RFIC die.

[0139] In Example 39, the subject matter as described in any one of Examples 1 to 38 may optionally include that each communication processor is configured to provide a wireless broadcast communication channel.

[0140] Although the present invention has been specifically shown and described with reference to particular embodiments, those skilled in the art should understand that various changes in form and detail may be made thereto without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is thus indicated by the appended claims, and it is therefore intended to embrace all changes that fall within the equivalent meaning and scope of the claims.

Claims

1. A device comprising: A plurality of carriers, the plurality of carriers comprising: a plurality of communication processors, each communication processor being disposed on or in a corresponding carrier among the plurality of carriers and configured to provide a wireless communication channel; and a plurality of antennas, each antenna being disposed on or in a respective carrier and coupled to a respective communication processor, wherein each antenna extends into a corner of the respective carrier; wherein, for each pair of adjacent carriers, respective antennas extending into respective corners face each other; and Therein, the antennas in each pair of adjacent carriers are positioned at a distance from each other that is less than about 1 wavelength, which wavelength corresponds to the lowest operating frequency.

2. The device according to claim 1, wherein: The plurality of antennas are extremely wideband EWB antennas having an operating bandwidth greater than 50 GHz.

3. The device of claim 1, wherein: Each antenna has an arrow-shaped end portion extending into a corner of the carrier.

4. The device of claim 1, wherein: Each carrier includes an antenna impedance matching structure.

5. The device of claim 4, wherein: The antenna impedance matching structure also includes a plurality of through holes extending into the carrier.

6. The device of claim 5, wherein: The plurality of through holes include through holes and blind holes.

7. The device of claim 5, wherein: The plurality of through holes include through glass vias and / or through glass vias.

8. The device of claim 1, wherein: Each carrier has a multi-layer structure.

9. The device according to any one of claims 1 to 8, in, Each carrier has a multilayer structure comprising a core substrate and at least one structured conductive layer, and Wherein, each antenna is formed in the at least one structured conductive layer.

10. The device of claim 9, comprising: A further structured conductive layer opposite the at least one structured conductive layer.

11. The device of claim 10, wherein: Each structured conductive layer includes a metal layer and a substrate layer.

12. The apparatus of claim 9, wherein: Each vector includes: at least two upper structured conductive layers; and At least one lower structured conductive layer is opposite to the upper structured conductive layer.

13. The device of claim 12, wherein: Each vector includes: a first uppermost structured conductive layer and a second upper structured conductive layer; wherein each antenna has an arrow-shaped end portion extending into a corner of the carrier in the second upper structured conductive layer, and The at least one lower structured conductive layer has a cutout in a region corresponding to an arrow-shaped end portion of the antenna in the second upper structured conductive layer.

14. The device of claim 13, wherein: Each structured conductive layer includes a metal layer and a substrate layer, and wherein the metal layer including the antenna is electrically grounded through a via.

15. The apparatus of claim 14, wherein: The metal layer of the uppermost structured conductive layer includes a coplanar waveguide (CPW) transmission line, wherein the CPW is configured as an antenna feed line on the second upper structured conductive layer, and wherein a center signal line of the CPW feed line is connected to a through-hole pad, wherein the through-hole pad is connected to a glass blind via.

16. The device of claim 15, wherein: A center line of the CPW and the second upper structured conductive layer are connected to a void region on the metal layer of the second upper structured layer.

17. The apparatus of any one of claims 1 to 8, wherein: The plurality of carriers includes a first plurality of core particles.

18. The apparatus of claim 17, wherein: The first plurality of core particles are positioned in a common plane.

19. The apparatus of claim 18, comprising: three, four, five or more core particles; and Therein, the core particles are positioned such that for each pair of core particles, their respective corners including the antennas face each other.

20. The apparatus of claim 19, comprising: The second plurality of core particles, Each core particle from the first plurality of core particles is disposed above a corresponding core particle from the second plurality of core particles to form a plurality of core particle stacks.

21. The apparatus of any one of claims 1 to 8, wherein: The plurality of carriers are printed circuit boards PCB.

22. The apparatus of claim 21, wherein: Each antenna is formed on a separate antenna chip mounted in a corner of the PCB.

23. The apparatus of claim 22, wherein: The PCB also includes: a first plurality of core particles positioned on top of each other to form a first core particle stack; and a second plurality of core particles positioned on top of each other to form a second core particle stack; wherein the first core particle stack and the second core particle stack are located next to each other, and The first chip stack and the second chip stack are coupled to the antenna.

24. The apparatus of claim 22, wherein: The PCB includes an additional RFIC die.

25. The apparatus of any one of claims 1 to 8, wherein: Each communication processor is configured to provide a wireless broadcast communication channel.

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