Electromagnetic wave modulation structure preparation method and electromagnetic wave modulation structure

Abstract

The invention provides an electromagnetic wave modulation structure preparation method and an electromagnetic wave modulation structure, and relates to the technical field of sub-wavelength electromagnetic regulation and control. The method comprises the following steps: preparing a wave-absorbing layer on a first dielectric layer based on the wave-absorbing requirement of electromagnetic waves; the wave absorbing layer comprises metal wires and resistor patches which are periodically arranged; preparing a wave-transparent layer on the second dielectric layer based on the wave-transparent requirement of the electromagnetic wave; the wave-transparent layer comprises a randomly arranged metal mesh structure; and overlapping a third dielectric layer on the first dielectric layer on which the wave absorbing layer is overlapped and the second dielectric layer on which the wave transparent layer is overlapped, and carrying out packaging treatment to obtain the electromagnetic wave modulation structure. According to the structure, a wave absorbing layer is arranged on a first target surface, close to a second dielectric layer, of a first dielectric layer, and the wave absorbing layer comprises metal wires and resistor patches which are periodically arranged; a wave-transparent layer is arranged on a second target surface, close to the third dielectric layer, of the second dielectric layer; the wave-transparent layer comprises a metal mesh structure which is arranged randomly.

Description

Technical Field

[0001] The present application relates to the field of sub-wavelength electromagnetic regulation technologies, and in particular, to a method for preparing an electromagnetic wave modulation structure and an electromagnetic wave modulation structure. Background Art

[0002] Absorbing and transmitting integrated structure materials are often used in electromagnetic windows with low scattering characteristics. For electromagnetic waves within the operating frequency band of an antenna, low-loss transmission characteristics are required, while for electromagnetic waves outside the operating frequency band, absorption is needed to reduce the probability of being detected by a radar, achieving low detectability for single or multi-station radars.

[0003] Absorbing and transmitting integrated structure materials are usually realized by an absorbing layer and a frequency-selective transmitting layer. In order to achieve broadband absorption and high transmission within the band for traditional absorbing and transmitting integrated structure materials, their absorbing layers often have complex metal pattern units, and lumped resistors are welded onto the patterns, resulting in their opaque characteristics. However, with the development of modern optoelectronic and communication systems towards integration and multi-functionality, higher requirements are put forward for the visible light transparency characteristics of radar absorbing materials. By grating a structure with a high metal coverage rate, it is a way to achieve compatibility among wave absorption, wave transmission, and visible light transparency. However, the high-order diffraction generated by the periodically arranged grating structure will lead to a decline in optical imaging performance, resulting in poor light transmission performance and working performance of the absorbing and transmitting integrated structure, and being unable to meet the current detection requirements. Summary of the Invention

[0004] In view of this, the purpose of the embodiments of the present application is to provide a method for preparing an electromagnetic wave modulation structure and an electromagnetic wave modulation structure to improve the problems of poor light transmission performance and poor working performance of the existing absorbing and transmitting integrated structure.

[0005] To solve the above problems, in a first aspect, the embodiments of the present application provide a method for preparing an electromagnetic wave modulation structure, including:

[0006] Based on the wave absorption requirement of electromagnetic waves, an absorbing layer is prepared on a first dielectric layer; wherein, the absorbing layer includes periodically arranged metal wires and resistance patches;

[0007] Based on the wave transmission requirement of electromagnetic waves, a transmitting layer is prepared on a second dielectric layer; wherein, the transmitting layer includes randomly arranged metal grating structures;

[0008] A third dielectric layer is stacked on the first dielectric layer with the absorbing layer and the second dielectric layer with the transmitting layer, and encapsulation processing is performed to obtain an electromagnetic wave modulation structure.

[0009] In the above implementation process, an absorbing layer and a transmitting layer can be respectively prepared on different dielectric layers based on the absorbing requirement and transmitting requirement of electromagnetic waves. The absorbing layer is provided with periodically arranged metal wires and resistive patches to efficiently absorb electromagnetic waves and achieve the absorbing function. The transmitting layer is provided with a metal mesh structure to reflect and transmit electromagnetic waves and achieve the transmitting function. And the package process is carried out by stacking the third dielectric layer to obtain a complete and structurally stable electromagnetic wave modulation structure. Moreover, in order to reduce the adverse impact of high-order diffraction generated by the metal mesh structure on the optical imaging performance, the metal mesh structure in the transmitting layer is randomly distributed to reduce the adverse impact brought by high-order diffraction, effectively improving the optical imaging performance of the electromagnetic wave modulation structure, thereby optimizing the working performance of the electromagnetic wave modulation structure, being applicable to various different types of detection devices, and meeting the detection requirements of various different scenarios.

[0010] Optionally, based on the transmitting requirement of electromagnetic waves, preparing a transmitting layer on the second dielectric layer includes:

[0011] Determining the transmitting requirement according to the reflection and transmission conditions of electromagnetic waves in the working state;

[0012] Determining the transmitting structure of the transmitting layer according to the transmitting requirement of electromagnetic waves;

[0013] Based on the transmitting structure, three-dimensionally printing the transmitting layer on the first dielectric layer.

[0014] In the above implementation process, the transmitting requirement corresponding to the transmitting function can be determined according to the preset reflection and transmission conditions of electromagnetic waves in the working state, so as to determine the transmitting structure of the transmitting layer that meets the transmitting requirement and can provide the corresponding transmitting function according to the transmitting requirement of electromagnetic waves. Then, taking the transmitting structure as a reference, the corresponding transmitting layer is prepared on the first dielectric layer by three-dimensional printing. The transmitting structure can be designed according to the actual working conditions, so that the transmitting layer can achieve different types of transmitting functions required in different detection scenarios, and the transmitting layer is prepared by three-dimensional printing, effectively reducing the high manufacturing cost, long processing cycle caused by methods such as lithography, and the adverse situation of resistance incompatibility caused by welding, further optimizing the optical performance and stability of the electromagnetic wave modulation structure.

[0015] Optionally, the transmitting structure of the transmitting layer includes the random parameters and performance parameters of the metal mesh structure;

[0016] Determining the transmitting structure of the transmitting layer according to the transmitting requirement of electromagnetic waves includes:

[0017] Based on the wave transmission requirement, multiple random parameters of the metal mesh grid structure are determined by combining an optimization algorithm; among them, the random parameters include the number, shape, grid width, size parameters, and central position parameters of each metal mesh grid structure; multiple size parameters are distributed within a set size range, and multiple central position parameters are distributed within a set position area;

[0018] Based on the wave transmission requirement and the random parameters, the performance parameters of multiple metal mesh grid structures are determined; among them, the performance parameters include the light transmittance, diffraction characteristics, and electromagnetic shielding efficiency of the metal mesh grid structure.

[0019] In the above implementation process, the wave transmission structure of the wave transmission layer includes various parameters of the metal mesh grid structure that reflects electromagnetic waves. According to the wave transmission requirement, multiple random parameters of the randomly distributed metal mesh grid structures can be automatically determined by combining the corresponding optimization algorithm, and according to the wave transmission requirement and the random parameters, the performance parameters of multiple randomly distributed metal mesh grid structures are further determined to design the number, shape, size, position, function, etc. of the metal mesh grid structure. It can automatically design various types of parameters of the metal mesh grid structure according to the actual wave transmission requirement and the optimization algorithm, so that multiple metal mesh grid structures can present a random distribution structure without manual design, effectively reducing the adverse situation that the optimization is easily trapped in the local optimal solution when manually designing and optimizing the random distribution structure, and optimizing the optical performance of the wave transmission layer.

[0020] Optionally, the wave transmission layer further includes: a periodically distributed transmission region; the wave transmission structure further includes the shape parameters of the transmission region;

[0021] According to the wave transmission requirement of the electromagnetic wave, determining the wave transmission structure of the wave transmission layer further includes:

[0022] In the distribution region of the metal mesh grid structure, based on the wave transmission requirement, the shape parameters of the periodically distributed transmission region are determined.

[0023] In the above implementation process, the wave transmission layer further includes a periodically distributed transmission region that performs frequency-selective transmission on the electromagnetic wave. Correspondingly, the wave transmission structure can also include the relevant parameters of the transmission region. In the determined distribution region of the metal mesh grid structure, according to the actual wave transmission requirement, the shape parameters of the periodically distributed transmission region can be determined to design the shape, position, size, etc. of the transmission region. A corresponding transmission region can be set in the metal mesh grid structure to realize the selective reflection function and wave transmission function of the wave transmission layer, meeting the functional requirements of various different detection scenarios.

[0024] Optionally, based on the wave absorption requirement of the electromagnetic wave, an absorbing layer is prepared on the first dielectric layer, including:

[0025] According to the wave absorption requirement of the electromagnetic wave in the working state, the wave absorption structure of the absorbing layer is determined;

[0026] Based on the wave-absorbing structure, a wave-absorbing layer is three-dimensionally printed on the first dielectric layer.

[0027] In the above implementation process, according to the wave absorption requirements of electromagnetic waves under the preset working state, the wave absorption structure of the wave-absorbing layer that can provide the corresponding wave absorption function can be determined. Then, based on the wave absorption structure, the corresponding wave-absorbing layer can be prepared on the second dielectric layer by three-dimensional printing. The wave absorption structure can be designed according to the actual working conditions, so that the wave-absorbing layer can achieve different types of wave absorption functions required in different detection scenarios, and the wave-absorbing layer is prepared by three-dimensional printing, effectively reducing the adverse effects on transparency caused by methods such as welding, and further optimizing the optical performance and stability of the electromagnetic wave modulation structure.

[0028] Optionally, the wave absorption structure of the wave-absorbing layer includes the arrangement parameters of metal wires and the pattern parameters of resistive patches;

[0029] According to the wave absorption requirements of electromagnetic waves under the working state, determining the wave absorption structure of the wave-absorbing layer includes:

[0030] Matching the equivalent impedance of the wave-absorbing layer with the characteristic impedances of the first dielectric layer and the second dielectric layer under the working state to obtain the wave absorption requirements of electromagnetic waves;

[0031] Based on the wave absorption requirements, determining the arrangement parameters of metal wires; wherein, the arrangement parameters include the material, line width, thickness, two-dimensional periodic arrangement pattern, and position of the metal wires;

[0032] Based on the wave absorption requirements and the arrangement parameters, determining the pattern parameters of resistive patches; wherein, the pattern parameters include the shape, size, material, and setting position of the resistive patches.

[0033] In the above implementation process, the wave absorption structure of the wave-absorbing layer includes various parameters of metal wires and resistive patches for absorbing electromagnetic waves. The equivalent impedance of the wave-absorbing layer can be matched with the characteristic impedances of the first and second dielectric layers under the working state to determine the wave absorption requirements that meet the working wave absorption function. Then, based on the wave absorption requirements, the arrangement parameters of metal wires are determined, and combined with the wave absorption requirements and the determined arrangement parameters, the pattern parameters of the resistive patches arranged on the metal wires are determined to design the positions, patterns, materials, etc. of the metal wires and resistive patches. The wave absorption requirements that meet the wave absorption function can be determined according to impedance matching, and various parameters of metal wires and resistive patches are determined based on the wave absorption requirements, so that the metal wires and resistive patches can form a wave-absorbing layer for realizing broadband wave absorption, effectively improving the rationality of the wave absorption structure and optimizing the optical performance of the wave-absorbing layer.

[0034] Optionally, the method further includes:

[0035] Testing the electromagnetic wave modulation structure to obtain test parameters;

[0036] If it is determined that the test parameters do not meet the preset functional conditions, modify the wave-absorbing layer and / or the wave-transmitting layer.

[0037] In the above implementation process, a simulation function test can be performed on the prepared electromagnetic wave modulation structure to obtain test parameters reflecting its functional conditions, and the test parameters are compared with the preset functional conditions. If the test parameters do not meet the preset functional conditions, it indicates that the wave-absorbing function and / or the wave-transmitting function of the electromagnetic wave modulation structure do not meet the usage requirements. The wave-absorbing layer and / or the wave-transmitting layer can be modified according to the actual functional conditions, and the function test is continued after the modification until the test parameters meet the preset functional conditions, which indicates that the wave-absorbing function and the wave-transmitting function of the electromagnetic wave modulation structure meet the usage requirements and can be put into mass production for normal use. Through the device test method, the abnormal conditions during the operation of the electromagnetic wave modulation structure are effectively reduced, and the yield rate of the electromagnetic wave modulation structure is improved.

[0038] In a second aspect, an embodiment of the present application further provides an electromagnetic wave modulation structure, which includes: a first dielectric layer, a second dielectric layer, and a third dielectric layer stacked in sequence;

[0039] Wherein, a wave-absorbing layer is provided on a first target surface of the first dielectric layer close to the second dielectric layer, and the wave-absorbing layer includes periodically arranged metal wires and resistance patches;

[0040] A wave-transmitting layer is provided on a second target surface of the second dielectric layer close to the third dielectric layer; the wave-transmitting layer includes a randomly arranged metal mesh grid structure.

[0041] In the above implementation process, the electromagnetic wave modulation structure includes a first dielectric layer, a second dielectric layer, and a third dielectric layer stacked in sequence. A wave-absorbing layer is provided on a first target surface of the first dielectric layer close to the second dielectric layer, and periodically arranged metal wires and resistance patches are provided in the wave-absorbing layer to efficiently absorb electromagnetic waves and achieve the wave-absorbing function. A wave-transmitting layer is provided on a second target surface of the second dielectric layer close to the third dielectric layer, and a metal mesh grid structure is provided in the wave-transmitting layer to reflect and transmit electromagnetic waves and achieve the wave-transmitting function. Moreover, in order to reduce the adverse effects of high-order diffraction generated by the metal mesh grid structure on the optical imaging performance, the metal mesh grid structure in the wave-transmitting layer is randomly distributed to reduce the adverse effects brought by high-order diffraction through the random distribution structure, effectively improving the optical imaging performance of the electromagnetic wave modulation structure.

[0042] Optionally, the first dielectric layer, the second dielectric layer, and the third dielectric layer include a transparent substrate;

[0043] The first thickness of the first dielectric layer and the second thickness of the second dielectric layer are determined based on the wave-absorbing requirements of electromagnetic waves;

[0044] The third thickness of the third dielectric layer is determined based on the wave transmission requirement of the electromagnetic wave.

[0045] In the above implementation process, in order to achieve the transmission of microwave signals and the visible light transparency characteristic, the first dielectric layer, the second dielectric layer, and the third dielectric layer can all be set as transparent substrates. Moreover, since the first dielectric layer and the second dielectric layer jointly determine the impedance matching characteristic of the wave absorption layer, the first thickness of the first dielectric layer and the second thickness of the second dielectric layer can both be determined according to the wave absorption requirement of the electromagnetic wave, and the third thickness of the third dielectric layer can be determined according to the wave transmission requirement of the electromagnetic wave. It is possible to set dielectric layers with different thicknesses according to different functional requirements, so as to meet the corresponding wave absorption, wave transmission, and reflection functional requirements according to the dielectric layers with different thicknesses.

[0046] Optionally, the profile parameters of the first dielectric layer, the second dielectric layer, and the third dielectric layer are the same;

[0047] The first dielectric layer provided with the wave absorption layer and the second dielectric layer provided with the wave transmission layer are aligned and connected through a connecting member;

[0048] The second dielectric layer provided with the wave transmission layer and the third dielectric layer are aligned and connected through a connecting member.

[0049] In the above implementation process, the profile parameters of multiple dielectric layers are the same. The first dielectric layer and the adjacent second dielectric layer can be connected to each other through a connecting member, and the second dielectric layer and the adjacent third dielectric layer can be connected to each other through a connecting member, so as to realize the overall multi-layer aligned stacking structure through the same profile and the connecting method, reduce the adverse situations such as the decline of wave absorption and wave transmission performance caused by the position misalignment of the multi-layer structure, and effectively improve the stability and effectiveness of the electromagnetic wave modulation structure packaging structure.

[0050] In summary, the embodiments of the present application provide a method for preparing an electromagnetic wave modulation structure and an electromagnetic wave modulation structure, which design a wave absorption layer with a wave absorption function and a wave transmission layer with a wave transmission function. In order to reduce the adverse influence of the high-order diffraction generated by the metal mesh grating structure on the optical imaging performance, the metal mesh grating structure in the wave transmission layer is randomly distributed, so as to reduce the adverse influence brought by the high-order diffraction through the random distribution structure, effectively improve the optical imaging performance of the electromagnetic wave modulation structure, and thus optimize the working performance of the electromagnetic wave modulation structure, which is applicable to various different types of detection devices and meets the detection requirements of various different scenarios. Description of the Drawings

[0051] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments of the present application. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other relevant drawings can also be obtained based on these drawings.

[0052] Figure 1 Flow schematic diagram of a method for preparing an electromagnetic wave modulation structure provided by an embodiment of the present application;

[0053] Figure 2 Detailed flow schematic diagram of step S200 provided by an embodiment of the present application;

[0054] Figure 3 Detailed flow schematic diagram of step S220 provided by an embodiment of the present application;

[0055] Figure 4 Another detailed flow schematic diagram of step S220 provided by an embodiment of the present application;

[0056] Figure 5 Detailed flow schematic diagram of step S100 provided by an embodiment of the present application;

[0057] Figure 6 Detailed flow schematic diagram of step S110 provided by an embodiment of the present application;

[0058] Figure 7 Another flow schematic diagram of a method for preparing an electromagnetic wave modulation structure provided by an embodiment of the present application;

[0059] Figure 8 Cross-sectional structure schematic diagram of an electromagnetic wave modulation structure provided by an embodiment of the present application;

[0060] Figure 9 Structure schematic diagram of an absorbing layer provided by an embodiment of the present application;

[0061] Figure 10 Structure schematic diagram of a wave-transmitting layer provided by an embodiment of the present application;

[0062] Figure 11 Transmission and reflection curve graph provided by an embodiment of the present application.

[0063] Icon: 510 - First dielectric layer; 511 - Absorbing layer; 5111 - Metal wire; 5112 - Resistive patch; 520 - Second dielectric layer; 521 - Wave-transmitting layer; 5211 - Metal mesh grid structure; 5212 - Transmission region; 530 - Third dielectric layer. Detailed implementation manners

[0064] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts belong to the scope protected by the embodiments of the present application.

[0065] In order to achieve high transmission in the band while realizing broadband absorption, the existing integrated absorbing and transmitting structure materials often have complex metal pattern units in the absorbing layer, and lumped resistors are welded on the patterns, resulting in the characteristic of opacity. However, with the development of modern optoelectronic and communication systems towards integration and multi-functionality, higher requirements are put forward for the visible light transparency of radar absorbing materials, and opaque substrates will have an adverse impact on the absorbing function. By grating the structure with a high metal coverage rate, it is a way to achieve the compatibility of absorbing, transmitting and visible light transparency. However, the high-order diffraction generated by the grating structure will lead to a decline in the optical imaging performance. Therefore, the current integrated absorbing and transmitting structure has low transparency and poor optical imaging performance, resulting in poor working performance of the integrated absorbing and transmitting structure and unable to meet the current detection requirements.

[0066] To solve the above problems, the embodiments of the present application provide a method for preparing an electromagnetic wave modulation structure and an electromagnetic wave modulation structure, which designs an absorbing layer with an absorbing function and a transmitting layer with a transmitting function. In order to reduce the adverse impact of the high-order diffraction generated by the metal grating structure on the optical imaging performance, the metal grating structure in the transmitting layer is randomly distributed to reduce the adverse impact brought by the high-order diffraction, effectively improving the optical imaging performance of the electromagnetic wave modulation structure, thereby optimizing the working performance of the electromagnetic wave modulation structure, being applicable to various different types of detection devices, and meeting the detection requirements of various different scenarios.

[0067] Please refer to Figure 1 , Figure 1 , which is a schematic flowchart of a method for preparing an electromagnetic wave modulation structure provided by the embodiments of the present application. The method may include steps S100-S300.

[0068] Step S100, prepare an absorbing layer on the first dielectric layer based on the absorbing requirements of electromagnetic waves.

[0069] Among them, according to the actual wave absorption requirements of electromagnetic waves, an absorbing layer with wave absorption function can be prepared on the first dielectric layer. The absorbing layer includes periodically arranged metal wires and resistive patches. The periodically arranged metal wires can form a ring-shaped sub-wavelength resonance structure, and by setting a plurality of resistive patches on the resonance structure, the corresponding microwave wave absorption function can be realized. The absorbing layer can efficiently absorb electromagnetic waves through the periodically arranged metal wires and resistive patches to realize the corresponding wave absorption function.

[0070] Optionally, the wave absorption requirements may include requirement conditions characterizing different wave absorption performances, such as different wave absorption bandwidth ranges, etc. The wave absorption requirements may include conditions restricting the materials, shapes, resistivity, etc. of the metal wires and electronic patches to meet the wave absorption performance requirements in different scenarios.

[0071] Step S200, based on the wave transmission requirements of electromagnetic waves, a wave transmission layer is prepared on the second dielectric layer.

[0072] Among them, according to the actual wave transmission requirements of electromagnetic waves, a wave transmission layer with wave transmission function can be prepared on the second dielectric layer. The wave transmission layer includes a randomly arranged metal mesh structure to reflect and transmit electromagnetic waves to realize the wave transmission function. And, in order to reduce the adverse effects of high-order diffraction generated by the metal mesh structure on the optical imaging performance, the metal mesh structure in the wave transmission layer is randomly distributed to reduce the adverse effects brought by high-order diffraction, effectively improving the optical imaging performance of the electromagnetic wave modulation structure.

[0073] Optionally, the wave transmission requirements may include requirement conditions characterizing different wave transmission performances, such as different wave transmission bandwidth ranges, etc. The wave transmission requirements may include conditions restricting the materials, shapes, reflectivity, etc. of the metal mesh structure to meet the wave transmission performance requirements in different scenarios.

[0074] Step S300, a third dielectric layer is stacked on the first dielectric layer with the absorbing layer and the second dielectric layer with the wave transmission layer, and packaging treatment is performed to obtain an electromagnetic wave modulation structure.

[0075] Among them, the first dielectric layer, the absorbing layer, the second dielectric layer and the wave transmission layer are stacked in sequence. In order to reduce the adverse effects caused by the direct contact between the wave transmission layer and other external devices, a third dielectric layer can also be stacked on the wave transmission layer of the second dielectric layer and packaging treatment is performed to isolate the wave transmission layer from other external devices through the third dielectric layer, and a complete and integrated electromagnetic wave modulation structure is prepared by means of packaging treatment.

[0076] In Figure 1 the shown embodiment, the working performance of the electromagnetic wave modulation structure can be optimized, which is applicable to various different types of detection devices and meets the detection requirements of various different scenarios.

[0077] Optionally, please refer toFigure 2 , Figure 2 This is a detailed flowchart of step S200 provided by an embodiment of the present application. Step S200 may include steps S210 - S230.

[0078] Step S210: Determine the wave - transmission requirement according to the reflection and transmission conditions of electromagnetic waves in the working state.

[0079] Among them, the wave - transmission requirement corresponding to the wave - transmission function can be determined according to the preset reflection and transmission conditions of electromagnetic waves in the working state. The working state can be the state preset for the electromagnetic - wave modulation structure based on simulation tests, etc., to simulate the actual working conditions of the electromagnetic - wave modulation structure. The working state can be determined according to the actual working scenario, the detection device where the electromagnetic - wave modulation structure is located, etc. The detection device can include various types of radar devices.

[0080] Step S220: Determine the wave - transmission structure of the wave - transmission layer according to the wave - transmission requirement of the electromagnetic wave.

[0081] Among them, the wave - transmission structure of the wave - transmission layer that meets the wave - transmission requirement and can provide the corresponding wave - transmission function can be determined according to the wave - transmission requirement of the electromagnetic wave.

[0082] Optionally, the wave - transmission structure may include various design structures of the wave - transmission layer, such as the shape, size, arrangement position, etc. of the metal mesh - grid structure in the wave - transmission layer.

[0083] Step S230: Based on the wave - transmission structure, three - dimensionally print the wave - transmission layer on the first dielectric layer.

[0084] Among them, for the processing and preparation of the fine metal mesh - grid structure, in the prior art, the lithography processing technology is usually used, with a long processing cycle and low raw - material utilization rate. Moreover, in the welding connection method, there is a problem of welding incompatibility between the metal mesh - grid processing and the lumped resistance. Therefore, in order to reduce the processing cycle, reduce the preparation cost, and achieve resistance compatibility, the present application takes the wave - transmission structure as the benchmark and prepares the corresponding wave - transmission layer on the first dielectric layer by three - dimensional printing.

[0085] Exemplarily, the metal material can be printed onto the substrate of the second dielectric layer through the pneumatic direct - writing printing technology, and then solidified and formed through sintering and other treatments to obtain the metal mesh - grid structure.

[0086] In Figure 2 the shown embodiment, the wave - transmission structure can be designed according to the actual working conditions, so that the wave - transmission layer can achieve different types of wave - transmission functions required in different detection scenarios, and the wave - transmission layer is prepared by three - dimensional printing, effectively reducing the high preparation cost and long processing cycle caused by lithography and other methods, as well as the adverse situation of resistance incompatibility caused by welding, and further optimizing the optical performance and stability of the electromagnetic - wave modulation structure.

[0087] Optionally, the wave - transmitting structure of the wave - transmitting layer may include various parameters of a metal mesh grating structure that reflects electromagnetic waves. For example, the random parameters and performance parameters of the metal mesh grating structure. Please refer to Figure 3 , Figure 3 FIG. is a detailed flowchart of step S220 provided by an embodiment of the present application. Step S220 may include steps S221 - S222.

[0088] Step S221: Based on the wave - transmitting requirements, combine an optimization algorithm to determine the random parameters of multiple metal mesh grating structures.

[0089] Among them, according to the wave - transmitting requirements, the random structures of multiple randomly distributed metal mesh grating structures can be automatically determined by combining the corresponding optimization algorithm. The random parameters may include the number, shape, grating width, size parameters, and central position parameters of each metal mesh grating structure. And it should be noted that multiple size parameters are distributed within a set size range, and multiple central position parameters are distributed within a set position area.

[0090] Exemplarily, the shape of the metal mesh grating structure may include various types of shapes such as circular and regular polygons. The number of metal mesh grating structures may include the overall number of metal mesh grating structures arranged on the second dielectric layer. Due to the random distribution characteristics of multiple metal mesh grating structures, the size of each metal mesh grating structure may vary. Taking the circular metal mesh grating structure as an example, the size parameter of each metal mesh grating structure, that is, the diameter of each metal mesh grating structure may vary. The central position parameter of each metal mesh grating structure is its center position. Multiple size parameters are all distributed within a set size range, and multiple central position parameters are distributed within a set position area. For example, multiple diameters are set within 0.1 mm - 0.6 mm, and the central position parameters of multiple circular metal mesh grating structures are distributed within a set position area such as a grid, so that multiple metal mesh grating structures can present a relatively uniform random distribution, reducing the reflection function defects caused by too large differences between multiple metal mesh grating structures.

[0091] It should be noted that the optimization algorithm can be of various types. For example, a weighted objective function or a multi - objective function related to its multiple optical performances can be designed, and optimization algorithms such as genetic algorithms and simulated annealing algorithms are used to optimize the objective function to obtain various random parameters of the metal mesh grating structure, realizing an automatic random distribution design without the need for manual random parameter setting, effectively improving the rationality of the random distribution of the metal mesh grating structure.

[0092] Step S222: Based on the wave - transmitting requirements and random parameters, determine the performance parameters of multiple metal mesh grating structures.

[0093] Among them, according to the wave transmission requirements and random parameters, the performance parameters of multiple randomly distributed metal mesh grating structures can be further determined to design the number, shape, size, position, function, etc. of the metal mesh grating structures. The performance parameters may include the light transmittance, diffraction characteristics, and electromagnetic shielding efficiency of the metal mesh grating structures.

[0094] Exemplarily, the performance parameters of the metal mesh grating structures can also be adjusted in combination with the accuracy of three-dimensional printing.

[0095] In Figure 3 the illustrated embodiment, various different types of parameters of the metal mesh grating structures can be automatically designed according to the actual wave transmission requirements and optimization algorithms, so that multiple metal mesh grating structures can present a random distribution structure without manual design, effectively reducing the adverse situation that the optimization is prone to fall into a local optimal solution when manually designing and optimizing the random distribution structure, and optimizing the optical performance of the wave transmission layer.

[0096] It should be noted that, in order to achieve the frequency-selective wave transmission function, the wave transmission layer may further include periodically distributed transmission regions that perform frequency-selective transmission of electromagnetic waves. Correspondingly, the wave transmission structure may also include relevant parameters of the transmission regions, such as the shape parameters of the transmission regions. Among them, the transmission region is the region where there is no distribution of metal mesh grating structures for realizing the transmission function, and the shape parameters of the transmission region may include various types of data such as the shape, side length parameters, and central position of the transmission region.

[0097] Optionally, please refer to Figure 4 , Figure 4 which is a detailed flowchart of another step S220 provided by the embodiment of the present application. Step S220 may further include step S223.

[0098] Step S223, in the distribution region of the metal mesh grating structures, based on the wave transmission requirements, determine the shape parameters of the periodically distributed transmission regions.

[0099] Among them, in the determined distribution region of the metal mesh grating structures, according to the actual wave transmission requirements, the shape parameters of the transmission regions can be determined to design the shape, position, size, etc. of the transmission regions.

[0100] Exemplarily, the periodically distributed transmission regions can be set to various periodic distribution shapes such as a cross structure or a ring structure. After determining the metal mesh grating structures and the transmission regions therein, the metal mesh grating structures can be fabricated on the second dielectric layer by three-dimensional printing to reduce the adverse situation that there are other substances in the transmission regions.

[0101] It should be noted that the wave-absorbing layer can be designed to match the characteristic impedance of the first dielectric layer and the second dielectric layer, and can achieve efficient absorption of incident electromagnetic waves within a certain bandwidth. The wave-transmitting layer has two functions. On the one hand, for electromagnetic waves outside the wave-transmitting frequency band, it can totally reflect the electromagnetic waves through the metal mesh structure and cooperate with the wave-absorbing layer to achieve high absorption of electromagnetic waves. On the other hand, for electromagnetic waves that need to be transmitted, it can be transmitted through the transmission area with low insertion loss without loss.

[0102] In Figure 4 the illustrated embodiment, corresponding transmission areas can be set in the metal mesh structure to realize the reflection function and wave-transmitting function of the wave-transmitting layer, and meet the functional requirements of various different detection scenarios.

[0103] Optionally, please refer to Figure 5 , Figure 5 which is a detailed flowchart of step S100 provided by an embodiment of the present application. Step S100 may include steps S110-S120.

[0104] Step S110, determine the wave-absorbing structure of the wave-absorbing layer according to the wave-absorbing requirements of electromagnetic waves in the working state.

[0105] Among them, according to the preset wave-absorbing requirements of electromagnetic waves in the working state, the wave-absorbing structure of the wave-absorbing layer that can provide the corresponding wave-absorbing function can be determined. The working state can be a state preset according to the electromagnetic wave modulation structure determined by simulation tests, etc., to simulate the actual working conditions of the electromagnetic wave modulation structure. The working state can be determined according to the actual working scenario, the detection device where the electromagnetic wave modulation structure is located, etc.

[0106] Step S120, based on the wave-absorbing structure, three-dimensionally print the wave-absorbing layer on the first dielectric layer.

[0107] Among them, considering that the processing and preparation of sub-wavelength structures with unit sizes in millimeters and structural line widths in micrometers usually require the use of printed circuit boards, that is, PCB processing technology, which is realized by soldering lumped resistors on metal structures. This soldering processing method is only applicable to metal structures with larger sizes, and for the connection of fine metal wires and resistor materials, the soldering processing method has poor stability and will greatly affect the transparency of the first dielectric layer. Therefore, in the present application, based on the wave-absorbing structure, the corresponding wave-absorbing layer is prepared on the second dielectric layer by three-dimensional printing.

[0108] Optionally, since the processing involves two different materials, namely the high-conductivity metal material that constitutes the metal wire and the high-resistivity resistive material that constitutes the resistive patch, a multi-material three-dimensional printing device can be used for the printing and processing of the metal wire and the loss resistor. First, using the pneumatic direct writing printing technology, the two materials are respectively subjected to 3D printing direct writing and patterned arrangement on the first dielectric layer, and the metal wire and the resistive patch are printed on the transparent substrate formed by the first dielectric layer according to the designed structural pattern. The resistive patch is symmetrically arranged on the zigzag metal wire structure. For example, for the square loop metal wire structure, the resistive patch is arranged at the four vertices of the square loop or at the midpoints of each side. Secondly, in order to improve the conductivity of the metal wire, the thickness of the metal wire can also be increased by direct writing lamination while keeping the wire width of the metal wire unchanged. Finally, the first dielectric layer is placed on the heating plane, and the printed pattern is sintered on the substrate at a high temperature of 300°C to 500°C to be cured and formed, and is attached to the first dielectric layer to prepare the absorbing layer. Moreover, using multi-material three-dimensional printing for the processing of microstructures and resistors can also effectively solve the problem of incompatibility between the processing of the metal mesh grid and the lumped resistor welding in the welding scheme, and improve the processing efficiency.

[0109] Exemplarily, the high-conductivity metal material used for printing can be a composite metal paste, such as gold, silver, copper paste, etc., and the high-resistivity resistive material used can be a composite carbon paste with a specific sheet resistance.

[0110] Optionally, the high-conductivity metal paste can use a silver paste composed of nanoscale silver particles and a thermosetting resin, and its conductivity is greater than 6.25×10 6 S / m. The high-resistivity resistive material can use a carbon paste composed of conductive carbon particles and an organic conductive material, with a sheet resistance of about 150Ω / sq to 300Ω / sq and a resistive film thickness of 10 to 30μm.

[0111] In Figure 5 the illustrated embodiment, the absorbing structure can be designed according to the actual working conditions so that the absorbing layer can achieve different types of absorbing functions required in different detection scenarios, and the absorbing layer is prepared by three-dimensional printing, effectively reducing the adverse effects on transparency caused by methods such as welding, and further optimizing the optical performance and stability of the electromagnetic wave modulation structure.

[0112] Optionally, the absorbing structure of the absorbing layer includes various parameters of the metal wire and the resistive patch that absorb electromagnetic waves, such as the arrangement parameters of the metal wire and the pattern parameters of the resistive patch. Please refer to Figure 6 , Figure 6 which is a detailed flowchart of a step S110 provided by an embodiment of the present application, and step S110 may include steps S111-S113.

[0113] Step S111: Based on the matching of the equivalent impedance of the wave-absorbing layer in the working state with the characteristic impedances of the first dielectric layer and the second dielectric layer, obtain the wave absorption requirements of the electromagnetic wave.

[0114] Among them, the equivalent impedance of the wave-absorbing layer in the working state can be matched with the characteristic impedances of the first dielectric layer and the second dielectric layer to determine the wave absorption requirements for meeting the wave absorption function required for work. The wave absorption requirements that can provide this equivalent impedance can be determined by designing an equivalent impedance that matches the characteristic impedances of the first dielectric layer and the second dielectric layer.

[0115] Step S112: Based on the wave absorption requirements, determine the arrangement parameters of the metal wires.

[0116] Among them, the corresponding arrangement parameters of the metal wires can be determined according to the wave absorption requirements. The arrangement parameters can include the material, line width, thickness, two-dimensional periodic arrangement pattern, and position of the metal wires.

[0117] Exemplarily, the material of the metal wires can include various types of highly conductive metal pastes. The line width of the metal wires can include the planar width of the metal wires on the plane of the first dielectric layer. The thickness of the metal wires can include the raised height of the metal wires compared to the plane of the first dielectric layer. The two-dimensional periodic arrangement pattern can include the pattern of the ring-shaped sub-wavelength resonance structure formed by the zigzag metal wires. The position of the metal wires can be set at the edge of the first dielectric layer so that the microwave signal can pass through the middle of the first dielectric layer normally.

[0118] Step S113: Based on the wave absorption requirements and the arrangement parameters, determine the pattern parameters of the resistive patches.

[0119] Among them, since the resistive patches are fixed on the metal wires, the pattern parameters of the resistive patches arranged on the metal wires can be determined by combining the wave absorption requirements and the determined arrangement parameters, so as to design the positions, patterns, materials, etc. of the metal wires and the resistive patches. The pattern parameters can include the shape, size, material, and setting position of the resistive patches.

[0120] Exemplarily, the shape of the resistive patch can be a rectangular patch, and the corresponding length and width dimensions can be 0.1 - 0.3 mm. The material of the resistive patches can include resistive materials with high resistivity, such as composite carbon paste, etc. The setting position of the resistive patches can include the positions where the resistive patches are fixed on the metal wires. For example, 4 resistive patches are respectively fixed at the four vertices or the midpoints of each side of the metal wires, etc.

[0121] Exemplarily, two materials, namely highly conductive composite silver paste and high-resistance composite carbon paste, can be printed on the quartz glass of the first dielectric layer by three-dimensional printing. After the metal wires are processed by lamination and thickening, they are sintered and formed at a high temperature of about 300 °C. Among them, the conductivity of the composite silver paste is 6.25×10 6S / m, the thickness of the metal wire is 10 μm, the sheet resistance of the composite carbon paste is 180 Ω / sq, and the film thickness is 17 μm. The size of the quartz glass of the first dielectric layer is 300 mm × 300 mm × 5 mm, the overall size of the two-dimensional metal pattern is 297.5 mm × 297.5 mm, and the distance between the metal pattern and each edge of the quartz glass is 1.25 mm.

[0122] In Figure 6 In the illustrated embodiment, the absorbing requirements that meet the absorbing function can be determined according to impedance matching, and various parameters of the metal wire and the resistance patch can be determined based on the absorbing requirements, so that the metal wire and the resistance patch can form an absorbing layer that realizes broadband absorption, effectively improving the rationality of the absorbing structure and optimizing the optical performance of the absorbing layer.

[0123] Optionally, please refer to Figure 7 , Figure 7 which is a schematic flowchart of another method for preparing an electromagnetic wave modulation structure provided by an embodiment of the present application. This method may further include steps S410-S420.

[0124] Step S410, testing the electromagnetic wave modulation structure to obtain test parameters.

[0125] Among them, the prepared electromagnetic wave modulation structure can be subjected to a simulation function test to obtain test parameters reflecting its functional conditions.

[0126] Exemplarily, through a variety of simulation software, combined with the corresponding working band, for example, testing the test parameters of the electromagnetic wave modulation structure in the 0-25 GHz band, the test parameters may include schematic diagrams of simulation results of corresponding transmission / reflection characteristics, the absorption rate of microwaves, the diffraction order distribution diagram under plane light irradiation, and other various data.

[0127] Step S420, if it is determined that the test parameters do not meet the preset function conditions, modify the absorbing layer and / or the wave-transmitting layer.

[0128] Among them, the test parameters can be compared with the preset function conditions. When the test parameters do not meet the preset function conditions, it means that the absorbing function and / or the wave-transmitting function of the electromagnetic wave modulation structure do not meet the usage requirements. The absorbing layer and / or the wave-transmitting layer can be modified according to the actual functional conditions, and the functional test is continued after the modification until the test parameters meet the preset function conditions, which means that the absorbing function and the wave-transmitting function of the electromagnetic wave modulation structure meet the usage requirements and can be put into mass production for normal use.

[0129] Optionally, the preset function conditions can be the conditional situations calculated based on the actual situation of the electromagnetic wave modulation structure, and can include various limiting conditions such as the absorption rate threshold, the transmittance threshold, the wiring trend of the transmission / reflection characteristics, and the diffraction order distribution trend.

[0130] In Figure 7 the illustrated embodiment, through device testing, the abnormal conditions during the operation of the electromagnetic wave modulation structure are effectively reduced, and the yield of the electromagnetic wave modulation structure is improved.

[0131] Please refer to Figure 8 , Figure 8 which is a schematic cross-sectional structure diagram of an electromagnetic wave modulation structure provided by an embodiment of the present application. The electromagnetic wave modulation structure includes: a first dielectric layer 510, a second dielectric layer 520, and a third dielectric layer 530 stacked in sequence.

[0132] Among them, an absorbing layer 511 is disposed on a first target surface of the first dielectric layer 510 close to the second dielectric layer 520. The absorbing layer 511 includes periodically arranged metal wires and resistance patches to efficiently absorb electromagnetic waves and achieve the absorbing function. A transmitting layer 521 is disposed on a second target surface of the second dielectric layer 520 close to the third dielectric layer 530; the transmitting layer 521 includes a randomly arranged metal mesh structure to reflect and transmit electromagnetic waves and achieve the transmitting function. Moreover, in order to reduce the adverse effects of high-order diffraction generated by the metal mesh structure on the optical imaging performance, the metal mesh structure in the transmitting layer 521 is randomly distributed to reduce the adverse effects brought by high-order diffraction through the random distribution structure, effectively improving the optical imaging performance of the electromagnetic wave modulation structure.

[0133] It should be noted that in order to achieve the transmission of microwave signals and the visible light transparency characteristics, the first dielectric layer 510, the second dielectric layer 520, and the third dielectric layer 530 may include a transparent substrate, and the transparent substrate may be a transparent dielectric material with high light transmittance, such as transparent quartz glass, soda-lime glass, PMMA, etc.

[0134] Optionally, the first dielectric layer 510, the second dielectric layer 520, and the third dielectric layer 530 may be set as a hard transparent substrate material, such as high-temperature resistant quartz glass, whose microwave dielectric constant is 3.75 and the dielectric loss is 0.001, and its performance can be maintained for a long time at a high temperature of 1000°C.

[0135] Optionally, since the first dielectric layer 510 and the second dielectric layer 520 jointly determine the impedance matching characteristics of the absorbing layer 511, therefore, the first thickness d1 of the first dielectric layer 510 and the second thickness d2 of the second dielectric layer 520 can both be determined based on the absorbing requirements of electromagnetic waves, and the third thickness d3 of the third dielectric layer 530 can be determined based on the transmitting requirements of electromagnetic waves. Different thicknesses of dielectric layers can be set according to different functional requirements to meet the corresponding absorbing, transmitting, or reflecting function requirements according to the different thicknesses of the dielectric layers.

[0136] Exemplarily, in the electromagnetic wave modulation structure provided in the above embodiment, the thickness of the first dielectric layer 510 can be set to 3 - 7 mm. Among them, the thickness of the second dielectric layer 520 can be set to 3 - 7 mm, and the thickness of the third dielectric layer 530 for encapsulation and isolation can be set to 1 - 2 mm.

[0137] Optionally, the wave - transmitting layer 521 can also be disposed on the third target surface of the third dielectric layer 530 close to the second dielectric layer 520. With the second dielectric layer 520 as the isolation layer between the wave - transmitting layer 521 and the wave - absorbing layer 511, the thickness of the third dielectric layer 530 can be set according to the wave - transmitting requirements of the wave - transmitting layer 521.

[0138] It should be noted that, among them, the contour parameters of the first dielectric layer 510, the second dielectric layer 520, and the third dielectric layer 530 are the same. The contour parameters can include parameters such as the shape and side length of the dielectric layer. For example, all three dielectric layers are set as squares with a side length of 5 mm.

[0139] Among them, the first dielectric layer 510 provided with the wave - absorbing layer 511 and the second dielectric layer 520 provided with the wave - transmitting layer 521 are aligned and connected through a connecting member. The second dielectric layer 520 provided with the wave - transmitting layer 521 and the third dielectric layer 530 are aligned and connected through a connecting member. The first dielectric layer 510 and the adjacent second dielectric layer 520 can be connected to each other through a connecting member, and the second dielectric layer 520 and the adjacent third dielectric layer 530 can be connected to each other through a connecting member, so as to realize the overall multi - layer aligned stacking structure through the same contour and the alignment connection method, reducing adverse situations such as the decline of wave - absorbing and wave - transmitting performance caused by the position misalignment of the multi - layer structure, and effectively improving the stability and effectiveness of the packaging structure of the electromagnetic wave modulation structure.

[0140] Exemplarily, the connecting member can include various types of liquid transparent adhesives, such as high - transparency epoxy resin glue and other transparent glues, so as to combine and bond multiple dielectric layers with the same contour through the connecting member without affecting the normal passage of microwave signals.

[0141] It should be noted that the electromagnetic wave modulation structure provided in this application can be disposed in various types of detection devices, and the detection device can include multiple electromagnetic wave modulation structures.

[0142] Please refer to Figure 9 - Figure 10 , Figure 9 which is a schematic structural diagram of a wave - absorbing layer provided by an embodiment of this application. Figure 10 which is a schematic structural diagram of a wave - transmitting layer provided by an embodiment of this application, where p is the side length of the dielectric layer. Figure 9A square ring structure is formed by a zigzag metal wire 5111, and a square resistance patch 5112 is connected to the exact middle of each side of the square ring. The line width of the zigzag metal wire 5111 is w1, the distance between two vertices of each side of the formed square ring is l1, the bending length of each turn of the zigzag line is l2, and the side length of the square resistance patch 5112 is d. Figure 10 In it, a periodic cross-shaped transmission area 5212 is loaded on the metal mesh grid structure 5211 of randomly arranged circular rings, the cross length is l3, and the width is l4.

[0143] In this application, the prepared electromagnetic wave modulation structure can be simulated and tested by a full-wave simulation software. In the case of perpendicular incidence of TE (transverse electric wave) / TM (transverse magnetic wave), the reflection coefficient S varying with frequency 11 , the transmission coefficient varying with frequency is S 21 . The calculation formula for the absorption rate varying with frequency is A = 1 - |S 11 | 2 - |S 21 | 2 . On the one hand, for the electromagnetic waves in the absorption frequency band, the absorption structure of the absorbing layer 511 can be reasonably optimized and designed so that its impedance within the set absorption band frequency range matches the impedance of the surrounding first dielectric layer 510. At the same time, the frequency-selective transmission structure of the transmitting layer 521 is designed so that it approximates a metal reflecting surface within this frequency band range, so that the electromagnetic waves resonate in the medium and the energy is absorbed in the form of ohmic loss by reflecting back and forth, making the reflectivity R = |S 11 | 2 and the transmittance T = |S 21 | 2 both approach 0, so that A approaches 1, achieving high absorption. On the other hand, for the electromagnetic waves in the transmitting frequency band, the square resistance patch and the zigzag line structure of the impedance surface absorbing layer 511 jointly generate a transmitting resonance frequency point, enabling the electromagnetic waves to pass through without loss. At the same time, by designing the transmitting structure of the transmitting layer 521, it has the characteristic of band-pass transmission within this frequency band range, that is, the transmittance T = |S 21 | 2 approaches 1. Under the combined action of the absorbing layer 511 and the transmitting layer 521, the electromagnetic control function of absorption and transmission integration can be realized.

[0144] An electromagnetic simulation software can be used to simulate and design the electromagnetic wave modulation structure. A set of optimized design data can include: p = 3.5 mm, w1 = 0.02 mm, l1 = 3.32 mm, l2 = 0.16 mm, d = 0.1 mm, l3 = 3.1 mm, l4 = 0.5 mm, and the sheet resistance of the resistance patch is 180 Ω / sq.

[0145] Under the above random parameters, please refer to Figure 11 , Figure 11 which is a transmission and reflection curve diagram provided by an embodiment of the present application. Figure 11 In Figure 11 , the abscissa is Frequency, and the ordinate is Reflection / Transmission. When the incident electromagnetic wave is in the range of 0 - 25 GHz, the electromagnetic wave modulation structure provided by the present application has an absorption rate of more than 90% for electromagnetic waves in the range of 2.8 - 11.2 GHz, a transmittance of more than 90% for electromagnetic waves in the range of 20.8 - 22.4 GHz, and similar transmission / reflection characteristics for TE and TM polarized incident waves. Therefore, it has good polarization stability.

[0146] The randomly distributed metal mesh grating structure in the wave - transmitting layer 521 of the electromagnetic wave modulation structure of the present application can be realized by generating a series of overlapping rings with sizes and distributions varying within a certain random range, and the genetic algorithm is combined with the weighted objective function value to optimize the optical properties of the metal mesh grating, including the visible light transmittance and the high - order diffraction energy distribution characteristics. The line width of the metal mesh grating can be optimized to w2 = 0.005 mm. The simulated normalized zero - order diffraction light intensity is 96.7%, the highest secondary diffraction light intensity is 0.0005%, and the high - order diffraction energy is evenly distributed, having good optical properties. Through theoretical calculation, the visible light transmittance of the entire microwave - absorbing, wave - transmitting, and visible - light - transparent integrated structure functional material is higher than 70%, having good visible light transmittance.

[0147] Since the principle of solving problems by the electromagnetic wave modulation structure in the embodiment of the present application is similar to that of the embodiment of the method for preparing the electromagnetic wave modulation structure described above, the implementation of the electromagnetic wave modulation structure in this embodiment can refer to the description in the embodiment of the method for preparing the electromagnetic wave modulation structure above, and the repeated parts will not be elaborated.

[0148] In several embodiments provided in this application, it should be understood that the structures disclosed in this application can also be implemented in other ways. The structural embodiments described above are merely illustrative. For example, the block diagrams in the drawings show the possible architectures, functions, and operations of the structures according to multiple embodiments of this application. In this regard, each block in the block diagram can represent a module, a program segment, or a part of code, and the module, program segment, or part of code contains one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than that marked in the drawings. For example, two consecutive blocks can actually be executed substantially in parallel, and they can sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram, as well as combinations of block diagrams, can be implemented by a dedicated hardware-based system for performing the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

[0149] The above are only the embodiments of this application and are not used to limit the protection scope of this application. For those skilled in the art, this application can have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of this application shall be included in the protection scope of this application. It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0150] The above is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in this application and should be covered by the protection scope of this application.

[0151] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or device. Without further limitation, the elements defined by the statement "comprising..." do not exclude the presence of additional identical elements in the process, method, article, or device comprising the said elements.

Claims

1. A method for preparing an electromagnetic wave modulation structure, characterized in that: The method comprises: Based on the electromagnetic wave absorption requirement, an absorbing layer is prepared on the first dielectric layer; wherein the absorbing layer includes periodically arranged metal wires and resistor patches; Based on the requirement of electromagnetic wave transmission, a wave-transmitting layer is prepared on the second dielectric layer; wherein the wave-transmitting layer includes a randomly arranged metal grid structure; A third dielectric layer is stacked on the first dielectric layer stacked with the wave absorbing layer and the second dielectric layer stacked with the wave transmitting layer, and packaging is performed to obtain an electromagnetic wave modulation structure.

2. The method according to claim 1, characterized in that The method of preparing a wave-transmitting layer on the second dielectric layer based on the wave-transmitting requirement of electromagnetic waves includes: Determining the wave transmission requirement according to the reflection and transmission conditions of the electromagnetic waves in the working state; Determining the wave-transmitting structure of the wave-transmitting layer according to the wave-transmitting requirement of the electromagnetic wave; Based on the wave-transmitting structure, the wave-transmitting layer is three-dimensionally printed on the first medium layer.

3. The method according to claim 2, characterized in that The wave-transmitting structure of the wave-transmitting layer includes random parameters and performance parameters of the metal grid structure; The step of determining the wave-transmitting structure of the wave-transmitting layer according to the wave-transmitting requirement of the electromagnetic wave comprises: Based on the wave transmission requirement, the random parameters of the plurality of metal grid structures are determined in combination with the optimization algorithm; wherein the random parameters include the number and shape of the metal grid structures, the grid width, size parameters and center position parameters of each of the metal grid structures; the plurality of size parameters are distributed within a set size range, and the plurality of center position parameters are distributed within a set position area; Based on the wave transmission requirement and the random parameters, a plurality of performance parameters of the metal mesh structure are determined; wherein the performance parameters include light transmittance, diffraction characteristics and electromagnetic shielding efficiency of the metal mesh structure.

4. The method according to claim 3, characterized in that The wave-transmitting layer further includes: periodically distributed transmission areas; the wave-transmitting structure further includes shape parameters of the transmission areas; The step of determining the wave-transmitting structure of the wave-transmitting layer according to the wave-transmitting requirement of the electromagnetic wave further comprises: In the distribution area of ​​the metal grid structure, the shape parameters of the periodically distributed transmission area are determined based on the wave transmission requirement.

5. The method according to claim 1, characterized in that The wave absorbing layer is prepared on the first dielectric layer based on the wave absorbing requirement of electromagnetic waves, including: Determining the wave absorbing structure of the wave absorbing layer according to the wave absorbing requirement of the electromagnetic wave in the working state; Based on the wave absorbing structure, the wave absorbing layer is three-dimensionally printed on the first medium layer.

6. The method according to claim 5, characterized in that The absorbing structure of the absorbing layer includes the arrangement parameters of the metal wires and the pattern parameters of the resistor patch; The step of determining the wave absorbing structure of the wave absorbing layer according to the wave absorbing requirement of the electromagnetic wave in the working state comprises: According to the matching of the equivalent impedance of the absorbing layer in the working state with the characteristic impedances of the first dielectric layer and the second dielectric layer, the absorbing requirement of the electromagnetic wave is obtained; Based on the wave absorption requirement, determining the arrangement parameters of the metal wire; wherein the arrangement parameters include the material, line width, thickness, periodic arrangement two-dimensional pattern and position of the metal wire; Based on the wave absorption requirements and the arrangement parameters, pattern parameters of the resistor patch are determined; wherein the pattern parameters include the shape, size, material and setting position of the resistor patch.

7. The method according to any one of claims 1 to 6, characterized in that The method further comprises: Testing the electromagnetic wave modulation structure to obtain test parameters; If it is determined that the test parameter does not meet the preset functional conditions, the wave absorbing layer and / or the wave transmitting layer are modified.

8. An electromagnetic wave modulation structure, characterized in that: The electromagnetic wave modulation structure comprises: a first dielectric layer, a second dielectric layer and a third dielectric layer stacked in sequence; Wherein, a wave absorbing layer is arranged on the first target surface of the first dielectric layer close to the second dielectric layer, and the wave absorbing layer includes periodically arranged metal wires and resistor patches; A wave-transmitting layer is disposed on the second target surface of the second dielectric layer close to the third dielectric layer; the wave-transmitting layer includes a randomly arranged metal grid structure.

9. The electromagnetic wave modulation structure according to claim 8, characterized in that: The first medium layer, the second medium layer and the third medium layer include a transparent substrate; The first thickness of the first dielectric layer and the second thickness of the second dielectric layer are determined based on the electromagnetic wave absorption requirement; The third thickness of the third dielectric layer is determined based on the electromagnetic wave transmission requirement.

10. The electromagnetic wave modulation structure according to claim 8, characterized in that: The profile parameters of the first dielectric layer, the second dielectric layer and the third dielectric layer are the same; The first dielectric layer provided with the wave absorbing layer and the second dielectric layer provided with the wave transmitting layer are aligned and connected by a connecting member; The second medium layer provided with the wave-transmitting layer and the third medium layer are aligned and connected through the connecting member.

Images