Dynamic thermal protection structure and method of deformable heat exchanger

Abstract

The invention discloses a dynamic thermal protection structure and method for a deformable heat exchanger, and the structure comprises a heat source chip, an integrated circuit board, a controller, a heat pipe supporting piece, a fan-shaped heat dissipation film and a butt joint locking mechanism, the core of the device is that the high-radiance fan-shaped film made of a graphene composite material is adopted, and a bidirectional folding and unfolding mode is adopted; synchronous folding and unfolding of the multiple fan-shaped films are achieved through a controller according to the heat source heat dissipation requirement in a rotating mode, a round face is formed after complete tensioning and unfolding, the multiple fan-shaped films are fixed through a butt joint locking structure at the tail end, the multiple fan-shaped films are kept to be tightly attached after tightening, and the large-flexibility structure characteristics of large area span, light weight, weak damping and the like are achieved; the mass and the size of the radiator can be effectively reduced, and the radiating surface area is dynamically adjusted through temperature change, so that the main radiating area is changed, and the radiating efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of aerospace electronic equipment, and particularly relates to a deformable heat exchanger thermal protection structure and method. Background Art

[0002] In the prior art, the heat dissipation problem of high-power chips in the space optoelectronic equipment cabin has not been solved. In the space environment, due to the vacuum condition restricting the feasibility of convective heat dissipation, heat dissipation mainly relies on heat conduction and radiation. Traditional heat dissipation solutions, such as aluminum heat spreaders and microchannel fluid loops, have problems such as large weight, insufficient heat transfer capacity, and poor reliability. In addition, with the continuous increase in chip power consumption, the heat dissipation of a single chip can reach 80W, and such a high heat flux density heat dissipation requirement poses extremely high requirements on the heat dissipation system.

[0003] Traditional space thermal protection structures usually adopt fixed heat sinks or heat pipe technologies. Although these methods can meet the heat dissipation requirements to a certain extent, they often seem inadequate when facing high power density and dynamic heat loads. Especially for the space optoelectronic equipment cabin, due to the particularity of its working environment (such as vacuum, microgravity, extreme temperature, etc.), traditional heat dissipation methods are difficult to achieve efficient heat conduction and radiation heat dissipation.

[0004] However, the application of existing deformable heat dissipation structures in the space environment still faces many challenges. For example, how to achieve efficient heat conduction and radiation heat dissipation in a vacuum environment, how to ensure the stability and reliability of the heat dissipation structure during the deployment and contraction processes, and how to achieve dynamic adjustment of the heat dissipation area through intelligent control, etc. Summary of the Invention

[0005] Object of the Invention: The present invention provides a deformable heat exchanger thermal protection structure and method, which solves the problem of dynamic change of the heat source of the space optoelectronic control circuit under the variable mission environment of the space station, realizes the dynamic adjustment of the heat dissipation area and efficient heat dissipation, and ensures the stable operation of the equipment in the extreme space environment.

[0006] Technical solution: A dynamic thermal protection structure of a deformable heat exchanger proposed by the present invention includes a controller, a heat pipe support, a connecting member, a fan-shaped heat dissipation film, and a docking and locking mechanism; both sides of the connecting member are provided with a two-way folding film sub-mechanism, the two-way folding film sub-mechanism is symmetrically arranged with respect to the connecting member, and the two-way folding film sub-mechanism includes a heat pipe support, a fan-shaped heat dissipation film, and a docking and locking mechanism; the heat pipe support includes an L-shaped heat pipe and a support heat pipe fixed on the L-shaped heat pipe, the fan-shaped heat dissipation film is fixed on the upper ends of the L-shaped heat pipes on both sides, the docking and locking mechanism is fixed on the upper end of the outermost L-shaped heat pipe, the lower end of the outermost L-shaped heat pipe is movably connected to the controller, the controller is connected to the outermost heat pipe support through a connecting rod, the connecting rod is coaxially arranged with a gear, and the two gears are meshed to control the rotation of the outermost heat pipe support; when the two-way folding film sub-mechanism is unfolded, the controller controls several of the heat pipe supports to open, the heat pipe supports drive the fan-shaped heat dissipation films to open, and several of the fan-shaped heat dissipation films form a circular film surface; when the two-way folding film sub-mechanism is closed, after the docking and locking mechanism is unlocked, the controller controls the several heat pipe supports to close, the heat pipe supports are located on both sides of the connecting member, and the fan-shaped heat dissipation films are folded between the heat pipe supports on both sides.

[0007] Preferably, it further includes an integrated circuit board, and there is thermal grease with a thermal conductivity of 8.0 - 12.0 (W / (m·K)) between the integrated circuit board and the heat pipe support.

[0008] Preferably, the fan-shaped heat dissipation film is made of a graphene composite material, and a ceramic coating or a carbon-based coating is coated on the surface of the fan-shaped heat dissipation film.

[0009] Preferably, the two support heat pipes are cross-fixed at both ends of the L-shaped heat pipe.

[0010] Preferably, hinges are provided on both sides of the L-shaped heat pipe, the upper end of the L-shaped heat pipe is connected to the fan-shaped heat dissipation film through a hinge, and the lower end of the L-shaped heat pipe is connected to the connecting member and other heat pipe supports through a hinge.

[0011] Preferably, the docking and locking mechanism is a shape lock release mode, including a card slot and a wedge block, and the card slot and the wedge block are cooperatively locked.

[0012] Preferably, a heat source chip is provided below the integrated circuit board, and several heat pipe supports are provided above, and the controller is fixed on the integrated circuit board and located outside the lower ends of the several heat pipe supports.

[0013] Preferably, a temperature monitoring device is provided on the integrated circuit board.

[0014] A dynamic thermal protection method for a deformable heat exchanger includes the following steps: First, the heat source chip generates heat, and the temperature enters multiple heat pipe supports; the heat pipe supports conduct the heat into the fan-shaped heat dissipation film; at the same time, the temperature change of the integrated circuit board is monitored; according to the temperature change, the controller controls the transmission device to drive the heat pipe supports to perform two-way folding and unfolding, adjusting the unfolding degree of the high-emissivity fan-shaped heat dissipation film; the heat is conducted from the heat pipe supports into the fan-shaped heat dissipation film and finally radiates into the cabin shell or outer space through thermal radiation.

[0015] Beneficial effects: The present invention proposes a dynamic thermal protection structure and method for a deformable heat exchanger. This structure is suitable for radiation heat dissipation structures in the space environment. Using graphene composite materials and ceramic / carbon-based coatings, the radiation heat dissipation efficiency is significantly improved compared with traditional metal radiators. Through the design of chain heat pipe supports (L-shaped heat pipes + hinges) and folding fan-shaped films, a smaller mass and volume are achieved, realizing the dynamic adjustment of the heat dissipation area and efficient heat dissipation, meeting the lightweight requirements of spacecraft. Through the heat pipe support structure and temperature monitoring, the heat dissipation area can be adjusted in real time according to the temperature change of the heat source, thereby minimizing the mass and volume of the radiator while ensuring the stable operation of the equipment. A trapezoidal elastic locking mechanism is also adopted to ensure long-term stable operation in the extreme temperature, vacuum, and vibration environments in space, avoiding the problem of easy loosening and failure of traditional mechanical structures.

[0016] The technical solution of the present invention is not only applicable to the space optoelectronic equipment cabin but also can be widely applied to other spacecraft and space equipment that require efficient thermal management, having important engineering application value and broad market prospects. Brief Description of the Drawings

[0017] Figure 1 It is a schematic diagram of the dynamic thermal protection structure of the space optoelectronic equipment cabin by the deformable heat exchanger described in the present invention;

[0018] Figure 2 It is a schematic diagram of the closed state of the heat pipe support;

[0019] Figure 3 It is a schematic diagram of the heat pipe support structure;

[0020] Figure 4 It is a schematic diagram of the connection structure between the controller and the heat pipe support;

[0021] Figure 5 It is a schematic diagram of the docking and locking mechanism. Detailed Embodiment

[0022] Combined with Figure 1Schematic diagram of the overall structure of the present invention as shown. It can be seen that a deformable heat exchanger dynamic thermal protection structure of the present invention includes: a heat source chip 1, an integrated circuit board 2, a controller 3, a heat pipe support 4, a connecting member 5, a fan-shaped heat dissipation film 6, and a docking and locking mechanism 7.

[0023] Heat is generated by the heat source chip 1 mounted on the space optoelectronic integrated circuit. The heat source chip 1 generates heat in specific tasks. For a single space computing unit, the maximum power may reach 80 W.

[0024] In order to quickly transfer this heat into the heat dissipation body to protect the heat source chip 1, a high-performance thermal conductive silicone grease, such as a silicone grease added with boron nitride, silicon carbide or nano-fillers, with a thermal conductivity of 8.0 - 12.0 (W / (m·K)) and low volatility, is filled between the integrated circuit board 2 and the heat pipe support 4 as a heat transfer component, which is suitable for heat conduction in high power density and vacuum environments.

[0025] Heat enters the evaporation section of the heat pipe support 4 through solid heat conduction. The heat pipe, as a heat transfer component and a support, is used to reduce the thermal resistance to achieve a reduction in thermal resistance, and utilizes the phase change of the internal liquid to achieve efficient heat transfer. The heat reaches the condensation section of the heat pipe that supports multiple fan-shaped heat dissipation films 6 from the evaporation section in contact with the integrated circuit board, and then enters multiple fan-shaped heat dissipation films 6 through solid heat conduction.

[0026] Figure 2 Schematic diagram of the closed state of the heat pipe support. It can be seen that the bidirectional folding film sub-mechanisms are symmetrically distributed on the metal heat conduction connecting member 5, and are respectively unfolded in different directions simultaneously. A single bidirectional folding film sub-mechanism is completely unfolded by about 180°. Each six fan-shaped heat dissipation films 6 and three heat pipe supports 4 form a bidirectional folding film sub-mechanism.

[0027] Figure 3 Schematic diagram of the heat pipe support structure. As shown in the figure, each heat pipe support 4 is composed of an L-shaped heat pipe 4-1 and two support heat pipes 4-2. On the premise of ensuring the overall strength of the structure, it is made as lightweight as possible. Hinges are installed at both the lower end and the upper end of the L-shaped heat pipe 4-1. The lower end of the L-shaped heat pipe 4-1 is connected to other heat pipe supports 4 and the connecting member 5 through hinges, and the upper end of the L-shaped heat pipe 4-1 forms a chain structure with the fan-shaped heat dissipation film 6. In this way, it can not only ensure that the heat pipe support 4 and the fan-shaped heat dissipation film 6 make a circular motion around the center of the circle during the unfolding process of the fan-shaped film 6, but also make the volume of the fan-shaped heat dissipation film 6 small and the shape regular when it is retracted.

[0028] Each section of the fan-shaped heat dissipation film 6 is fixed to the heat pipe supports 4 on both sides through hinges. After multiple fan-shaped heat dissipation films 6 are unfolded, they jointly form a circular film surface. However, due to the existence of the thickness of the connecting member, it is impossible to form a complete circle. Therefore, the central angle of the twelve fan-shaped heat dissipation films 6 is less than 30°.

[0029] The sector-shaped heat dissipation film 6 is made of a graphene composite material, and a ceramic coating or a carbon-based coating is coated on the surface of the sector-shaped heat dissipation film 6, so that the emissivity is close to that of an ideal black body (the emissivity is greater than 0.9). At the same time, the flexible sector-shaped structure brought by the material also increases the effective heat dissipation area.

[0030] A docking and locking mechanism 7 is fixed on the structures of the two outermost heat pipe support members 4. Figure 4 It is a docking and locking mechanism. When fully unfolded, the docking and locking mechanism 7 comes into contact. The docking and locking mechanism 7 adopts a trapezoidal locking and unlocking mode, including a clamping groove and a wedge block. The clamping groove and the two clamping arms itself have a certain elasticity, and both sides of the clamping arms are supported by springs and provide elasticity. At the beginning of docking, the wedge block squeezes the right clamping arm, widening the distance between the clamping grooves and squeezing into the clamping grooves, and finally tightly fitting with the inner wall of the clamping grooves. At the same time, the design of the inner width and outer narrow shape of the clamping grooves enables it to provide a certain locking force to prevent the docking from loosening due to disturbance. It is used for the fixed locking of the fully unfolded bidirectional folding film.

[0031] A controller 3 is integrated on the integrated circuit board 2, which is used to receive the temperature signal of the integrated circuit board 2, so as to drive the synchronous bidirectional folding movement of the heat pipe support member 4, so that multiple sector-shaped heat dissipation films 6 form a circular surface after being fully tensioned and unfolded, and keep the multiple sector-shaped heat dissipation films 6 close to each other when being tightened.

[0032] As Figure 4 shown, the controller 3 is integrated in the circuit board to achieve rotational movement. There is a connecting rod 3-1 outside, which is coaxially fixed with the gear 3-2. Two gears 3-2 are meshed to realize the control of a pair of bidirectionally rotating gears 3-2 by one controller 3. The two gears 3-2 are respectively fixed on the two outermost sections of the heat pipe support member 4 through the connecting rod 3-1. The rotation of the gears 3-2 provides torque to pull the two outermost sections of the heat pipe support member 4 to rotate, and then drives the hinges on the heat pipe support member 4 to achieve multi-stage movement and unfolding. The controller 3 is connected to the structures of the two outermost heat pipe support members 4 to achieve synchronous bidirectional unfolding or contraction. The movement of the heat pipe support member 4 is controlled by the controller 3 integrated in the space optoelectronic integrated circuit board 2. The degree of unfolding is considered according to the monitored temperature of the heat source chip to achieve the required radiation heat dissipation area and adapt to the complex thermal environment in the space environment.

Claims

1. A dynamic thermal protection structure of a deformable heat exchanger, characterized in that: The invention comprises a controller (3), a heat pipe support (4), a connector (5), a fan-shaped heat dissipation film (6) and a docking locking mechanism (7); two sides of the connector (5) are provided with bidirectional folding film sub-mechanisms, the bidirectional folding film sub-mechanisms are symmetrically arranged with respect to the connector (5), and the bidirectional folding film sub-mechanisms comprise a heat pipe support (4) and a fan-shaped heat dissipation film (6); the heat pipe support (4) comprises an L-shaped heat pipe (4-1) and a supporting heat pipe (4-2) fixed on the L-shaped heat pipe (4-1); the fan-shaped heat dissipation film (6) is fixed to the upper ends of the L-shaped heat pipes (4-1) on both sides; the docking locking mechanism (7) is fixed to the upper end of the outermost L-shaped heat pipe (4-1); the controller (3) is connected to the outermost L-shaped heat pipe (4-1) through a connecting rod (3-1). The heat pipe support (4) is connected to the heat pipe support member (4), the connecting rod (3-1) and the gear (3-2) are coaxially arranged, and the two gears (3-2) are meshed to control the outermost heat pipe support member (4) to rotate; when the bidirectional folding film sub-mechanism is unfolded, the controller (3) controls the plurality of heat pipe support members (4) to open, and the heat pipe support members (4) drive the fan-shaped heat dissipation film (6) to open, and the plurality of fan-shaped heat dissipation films (6) form a circular film surface; when the bidirectional folding film sub-mechanism is closed, the docking locking mechanism (7) is unlocked and the controller (3) controls the plurality of heat pipe support members (4) to close, the heat pipe support members (4) are located on both sides of the connecting member (5), and the fan-shaped heat dissipation film (6) is folded between the heat pipe support members (4) on both sides.

2. The dynamic heat protection structure of the deformable heat exchanger according to claim 1, characterized in that: It also comprises an integrated circuit board (2), wherein thermal conductive silicone grease is provided between the integrated circuit board (2) and the heat pipe support (4), and the thermal conductivity coefficient is 8.0-12.0 (W / (m·K)).

3. The dynamic heat protection structure of the deformable heat exchanger according to claim 1, characterized in that: The fan-shaped heat dissipation film (6) is made of a graphene composite material, and the surface of the fan-shaped heat dissipation film (6) is coated with a ceramic coating or a carbon-based coating.

4. The dynamic heat protection structure of the deformable heat exchanger according to claim 1, characterized in that: The two supporting heat pipes (4-2) are cross-fixed on both ends of the L-shaped heat pipe (4-1).

5. The dynamic heat protection structure of the deformable heat exchanger according to claim 1, characterized in that: Hinges are provided on both sides of the L-shaped heat pipe (4-1); the upper end of the L-shaped heat pipe (4-1) is connected to the fan-shaped heat dissipation film (6) via the hinge; and the lower end of the L-shaped heat pipe (4-1) is connected to the connecting piece (5) and other heat pipe supporting pieces (4) via the hinge.

6. The dynamic heat protection structure of the deformable heat exchanger according to claim 1, characterized in that: The docking locking mechanism (7) is a shape lock release mode, comprising a clamping slot and a wedge block, and the clamping slot and the wedge block cooperate to lock.

7. The dynamic heat protection structure of the deformable heat exchanger according to claim 2, characterized in that: A heat source chip (1) is provided below the integrated circuit board, and a plurality of heat pipe support members (4) are provided above the integrated circuit board. The controller (3) is fixed on the integrated circuit board (2) and is located outside the lower ends of the plurality of heat pipe support members (4).

8. The dynamic heat protection structure of the deformable heat exchanger according to claim 7, characterized in that: The integrated circuit board (2) is provided with a temperature monitoring device.

9. A dynamic thermal protection method for a deformable heat exchanger according to claim 7, characterized in that: The method comprises the following steps: firstly, a heat source chip (1) generates heat when in operation, and the temperature enters into a plurality of heat pipe supports (4); the heat pipe supports (4) conduct the heat into a fan-shaped heat dissipation film (6); at the same time, the temperature change of the integrated circuit board is monitored; according to the temperature change, a controller (3) controls a transmission device to drive the heat pipe supports (4) to perform bidirectional folding and unfolding, thereby adjusting the unfolding degree of the high emissivity fan-shaped heat dissipation film (6); the heat is conducted from the heat pipe supports (4) into the fan-shaped heat dissipation film (6), and finally enters the cabin shell or the external space through heat radiation.

10. Application of a dynamic heat protection structure of a deformable heat exchanger according to any one of claims 1 to 8 in heat dissipation of spacecraft and space equipment.

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