Design method for solving display screen blackening caused by high-brightness backlight lamp socket heating

Abstract

The invention relates to the technical field of display screens, and discloses a design method for solving display screen blackening caused by heating of a high-brightness backlight lamp socket, which comprises the following steps: S1, bending an iron frame structure where the lamp socket is located, and forming a double-sided heat conduction path through contact between the front side and the back side of the iron frame structure and a heat source, the method comprises the steps of S1, arranging a flexible printed circuit board, S2, coating the back face of the flexible printed circuit board of a light bar with heat dissipation glue, S3, arranging a dynamic heat management system in a lamp socket area, S4, adding a heat insulation layer between an iron frame and a display screen, and S5, rapidly dispersing heat through a heat dissipation structure which is used for reducing the risk that the display screen becomes black due to high temperature. By optimizing an iron frame structure and using high-thermal-conductivity silica gel, the thermal resistance amplitude of a lamp socket area is effectively reduced by not less than 50%, and the heat dredging efficiency of the lamp socket area is improved by not less than 30%, so that heat can be quickly transferred and uniformly diffused to the surrounding environment, the problem of heat accumulation is remarkably reduced, and the service life of the lamp socket area is prolonged. And the local overheating risk caused by high temperature in the equipment is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of display screens, and specifically provides a design method for solving the problem that the display screen turns black due to the heat generation of the lamp socket of a high-brightness backlight source. Background Art

[0002] A display screen is a device that presents information such as images, texts, videos, etc. through optical, electronic, or mechanical means. It is widely used in multiple fields such as computers, mobile phones, televisions, and electronic devices. The types and technologies of display screens are different, and they have different characteristics and advantages according to the needs of application scenarios.

[0003] In high-brightness backlight display devices, a large amount of heat is generated in the lamp socket area due to the high-brightness operation of the light source, which becomes one of the main sources of heat accumulation in the device. The accumulation of heat in the lamp socket area will cause a local temperature rise, which not only causes thermal stress on the display screen but also may cause the surface temperature of the display screen to rise too high, resulting in a blackening phenomenon and affecting the display effect.

[0004] In the prior art, to solve the heat dissipation problem in the lamp socket area, an iron frame structure is usually combined with a heat dissipation material for heat conduction. There are tiny gaps at the contact interface between the iron frame and the lamp socket heat source, and these gaps will significantly increase the interface thermal resistance, resulting in a decrease in the heat transfer efficiency. The structural design of the iron frame in the prior art does not fully consider problems such as heat distribution and uniform diffusion requirements, resulting in uneven heat dissipation, heat accumulation, and local overheating. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a design method for solving the problem that the display screen turns black due to the heat generation of the lamp socket of a high-brightness backlight source, and solves the problems of high thermal resistance, uneven heat transfer, and low heat dissipation efficiency, resulting in uneven heat dissipation, heat accumulation, and local overheating.

[0006] To achieve the above objectives, the present invention is realized through the following technical solutions: A design method for solving the problem that the display screen turns black due to the heat generation of the lamp socket of a high-brightness backlight source, including the following steps: S1. By performing a bending design on the iron frame structure where the lamp socket is located, a double-sided heat conduction path is formed by contacting the heat source on both the front and back sides. The bending is used to enable both the front and back sides of the iron frame to contact the heat source, and the heat is dissipated through double-sided heat conduction; S2. Coat a heat dissipation adhesive on the back of the flexible printed circuit board of the lamp strip, and tightly adhere the FPC lamp strip to the iron frame through a pressing process. The hot pressing process is used to improve the heat conduction performance; S3. Set up a dynamic thermal management system in the lamp socket area to reduce the system temperature through real-time temperature monitoring, intelligent power adjustment, and active heat dissipation components; S4. Add a heat insulation layer between the iron frame and the display screen to isolate the direct thermal impact of the high-temperature area on the display screen; S5. Rapidly dissipate heat through a heat dissipation structure, which is used to reduce the risk of the display screen turning black due to high temperature.

[0007] Preferably, in S1, the bent area of the iron frame corresponds to the heat source areas of the lamp socket and the FPC light bar. The bending angle ranges from 90° to 135°. The contact area between the front and back sides of the bent iron frame and the heat source accounts for more than 80% of the total heat source area. The iron frame is made of a high thermal conductivity material, and the high thermal conductivity material includes galvanized iron sheet or aluminum alloy.

[0008] Preferably, in S2, the heat dissipation glue is high thermal conductivity silica gel, and the high thermal conductivity silica gel includes thermal grease, thermal silica gel sheet or thermal silica gel pad. Its thermal conductivity is not less than 3W / m·K. The thickness of the heat dissipation glue layer is controlled within 0.2mm - 0.3mm, and the pressure during hot pressing is controlled within 1N / cm² - 3N / cm². Hot pressing is used to ensure full adhesion of the heat dissipation glue to the FPC light bar and the iron frame.

[0009] Preferably, in S3, the dynamic thermal management system includes a thermistor and a microprocessor. The thermistor is used to monitor the temperature of the lamp socket area in real time. When the temperature exceeds the set threshold, the microprocessor dynamically adjusts the light source power to 60% - 80% of the initial power through a drive circuit.

[0010] Preferably, in S3, the dynamic thermal management system further includes an active heat dissipation component. When the temperature exceeds 70°C, the active heat dissipation component starts to cool down. The active heat dissipation component includes a micro fan or a thermoelectric cooler.

[0011] Preferably, in S4, the heat insulation layer material is high temperature resistant transparent polycarbonate or aluminosilicate-based ceramic fiber film. The thickness of the heat insulation layer is controlled within 0.5mm - 2mm, and the thermal conductivity is less than 0.5W / m·K. The heat insulation layer is used to isolate the influence of the heat of the iron frame on the display screen.

[0012] Preferably, in S1 - S5, the heat dissipation path and dynamic control are used to reduce the temperature of the lamp socket area by no less than 15°C and the surface temperature of the display screen by no less than 20%, so as to reduce the phenomenon of the display screen turning black.

[0013] Preferably, in S1 - S5, the heat transfer performance of the heat dissipation structure satisfies the following formula: The heat transferred per unit time Is proportional to the thermal conductivity The effective area of the heat conduction path And the temperature difference between the heat source and the environment And its mathematical expression is: ; .

[0014] Preferably, in S2 and S3, the thermal resistance of the FPC light bar is reduced by no less than 50%, the operating temperature of the light bar is reduced by no less than 15°C, and the heat dissipation system can continuously and stably operate for more than 500 hours within the ambient temperature range of 25°C - 60°C.

[0015] Preferably, in S1 - S5, the heat conduction efficiency of the lamp socket is improved by no less than 30% as shown by the thermal simulation results, the surface temperature of the display screen is significantly reduced, and the blackening phenomenon caused during the long-term use of the display screen is prevented.

[0016] The present invention provides a design method for solving the problem that the display screen turns black due to the heat generation of the lamp socket of the high-brightness backlight source. It has the following beneficial effects: 1. By optimizing the iron frame structure and the use of high thermal conductivity silica gel, the present invention effectively reduces the thermal resistance amplitude of the lamp socket area by no less than 50% and improves the heat conduction efficiency of the lamp socket area by no less than 30%. This enables heat to be quickly transferred and evenly diffused to the surrounding environment, significantly reducing the heat accumulation problem and avoiding the risk of local overheating inside the device caused by high temperature.

[0017] 2. Combining the setting of the heat insulation layer, the real-time adjustment of the dynamic thermal management system, and the synergistic effect of the active heat dissipation components, the present invention reduces the surface temperature of the display screen by more than 20°C. By optimizing the heat transfer path, the long-term temperature on the surface of the display screen is controlled within a safe range, reducing the problems of screen material aging and performance decline caused by high temperature and extending the service life of the device.

[0018] 3. The present invention effectively controls the operating temperature of the display screen in the high-brightness backlight source device through the heat dissipation system, avoiding the phenomenon that the display screen turns black due to overheating during long-term operation. By reducing the heat load of the lamp socket area and the display screen surface, the present invention ensures the stability of the display effect, enabling the device to operate in high-brightness and high-temperature environments for a long time without damaging the display quality. Description of the Drawings

[0019] Figure 1 It is a flowchart of the method of the present invention; Figure 2 It is a schematic diagram of the iron frame bending of the present invention. Detailed Embodiments

[0020] Next, the technical solutions of the present invention will be clearly and completely described in conjunction with the drawings of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] Please refer to the appendix Figure 1 - Appendix Figure 2 , the embodiment of the present invention provides a design method for solving the problem that the display screen turns black due to the heat generation of the lamp socket of the high-brightness backlight source, including the following steps: S1. Through the bending design of the iron frame structure where the lamp socket is located, a double-sided heat conduction path is formed by contacting both the front and back sides with the heat source. The bending is used to enable both the front and back sides of the iron frame to contact the heat source, and the heat is dissipated through double-sided heat conduction; S2. Coat a heat dissipation glue on the back of the flexible printed circuit board of the lamp strip, and tightly adhere the FPC lamp strip to the iron frame through a pressurization process. The hot pressing process is used to improve the heat conduction performance; S3. Set a dynamic thermal management system in the lamp socket area to reduce the system temperature through real-time temperature monitoring, intelligent power adjustment, and active heat dissipation components; S4. Add a heat insulation layer between the iron frame and the display screen to isolate the direct thermal impact of the high-temperature area on the display screen; S5. Rapidly evacuate the heat through a heat dissipation structure, and the heat dissipation structure is used to reduce the risk of the display screen turning black due to high temperature.

[0022] In S1, the bending area of the iron frame corresponds to the heat source areas of the lamp socket and the FPC lamp strip. The bending angle range is 90 - 135°, and the contact area between the front and back sides of the bent iron frame and the heat source accounts for more than 80% of the total heat source area. The iron frame is made of a high thermal conductivity material, and the high thermal conductivity material includes galvanized iron sheet or aluminum alloy.

[0023] Specifically, the bending angle range of the iron frame is limited between 90° and 135°. This range can ensure that the mechanical strength of the iron frame is not significantly affected and can provide a sufficient heat conduction path in terms of physical structure. The front and back sides of the bent iron frame are closely attached to the heat source areas of the lamp socket and the FPC lamp strip, and the contact area between the iron frame and the heat source accounts for more than 80% of the total heat source area, thereby maximizing the heat transfer efficiency; The selection range of high thermal conductivity materials includes but is not limited to galvanized iron sheet or aluminum alloy. The galvanized iron sheet has good thermal conductivity, high corrosion resistance, and low cost, and is suitable for large-scale production environments. Aluminum alloy, due to its relatively high thermal conductivity usually between 150 - 250 W / m·K and low density, becomes another preferred material, especially suitable for application scenarios with high requirements for heat dissipation performance. In addition, to further improve the heat dissipation efficiency of the iron frame, a thermal conductive coating can be applied to its surface, such as a coating based on alumina or graphene. This coating can further reduce the contact thermal resistance and increase the heat dissipation efficiency to the external environment; For the bending process of this design, the iron frame is processed through precise molds during production. The design of the mold needs to ensure a moderate bending radius to avoid affecting the thermal conductivity due to excessive stress concentration of the material caused by bending. At the same time, during the bending process, a numerically controlled bending device is used to ensure the accuracy of the bending angle through a multi-axis control system, and the bending angle error is controlled within ±1°, so as to ensure the precise fit of the iron frame on the heat source contact surface.

[0024] In S2, the heat dissipation glue is high thermal conductivity silicone, which includes thermal grease, thermal silicone sheet or thermal silicone pad, with a thermal conductivity not lower than 3W / m·K. The thickness of the heat dissipation glue layer is controlled within 0.2mm - 0.3mm, and the pressure during hot pressing is controlled within 1N / cm² - 3N / cm². Hot pressing is used to ensure full adhesion of the heat dissipation glue to the FPC light bar and the iron frame.

[0025] Specifically, the high thermal conductivity silicone includes thermal grease, thermal silicone sheet or thermal silicone pad. These materials all have excellent thermal conductivity and flexibility, and can adapt to the surfaces of heat sources with different shapes and achieve close fitting. Thermal grease is a semi-fluid material with good fluidity and gap filling properties, suitable for small-area or irregular-shaped thermal interfaces. Thermal silicone sheets and thermal silicone pads have higher structural stability, are suitable for larger-area thermal interfaces, and can provide uniform heat conduction performance. No matter which form of high thermal conductivity silicone is selected, its thermal conductivity is not lower than 3W / m·K, which can effectively meet the heat conduction requirements of the high-brightness backlight lamp socket and the FPC light bar; The coating or laying thickness of the heat dissipation glue is strictly controlled within the range of 0.2mm to 0.3mm. This thickness can provide sufficient gap filling while avoiding excessive heat dissipation glue causing an increase in thermal resistance or material waste. After the heat dissipation glue is coated or laid, by applying a pressure of 1N / cm² to 3N / cm², the heat dissipation glue can make full contact with the surfaces of the FPC light bar and the iron frame, minimizing the contact thermal resistance to the greatest extent. The pressing process can be carried out using a press or a special fixture, and the application of pressure needs to be uniform and continuous to ensure the stability of the adhesion effect; The heat of the FPC light bar can be efficiently transferred to the iron frame through the heat dissipation glue and further dissipated to the environment. Experimental tests show that when using high thermal conductivity silicone as the thermal interface material, the reduction in interface thermal resistance exceeds 50%, and the operating temperature of the light bar decreases by no less than 15°C compared to when no heat dissipation glue is used, thus significantly improving the heat dissipation performance of the display screen and ensuring long-term stable operation in a high-brightness environment.

[0026] In S3, the dynamic thermal management system includes a thermistor and a microprocessor. The thermistor is used to monitor the temperature of the lamp socket area in real time. When the temperature exceeds the set threshold, the microprocessor dynamically adjusts the light source power to 60% - 80% of the initial power through a drive circuit.

[0027] Specifically, as a temperature detection component, the thermistor is arranged at a position near the heat source in the lamp socket area to be able to monitor the temperature change of the heat source in real time and accurately. The thermistor selects a model with a fast thermal response speed and high measurement accuracy, usually having positive temperature coefficient (PTC) or negative temperature coefficient (NTC) characteristics, and its resistance value will change significantly with temperature change. Through the real-time monitoring of the thermistor, the temperature information of the lamp socket area can be fed back to the microprocessor in the form of an electrical signal; The microprocessor, as the core control unit, analyzes and judges the temperature signal fed back by the thermistor in real time through a preset algorithm. When it is detected that the temperature in the lamp socket area exceeds the set safety threshold, for example, 60°C to 70°C, the microprocessor immediately activates the dynamic adjustment mechanism to control the drive circuit to reduce the light source power. The adjustment range of the light source power is controlled by a preset ratio, and the light source power is reduced from the initial power to 60% - 80%. The specific adjustment value is adjusted in stages according to the actual over-temperature situation of the lamp socket temperature. Through this dynamic power adjustment mechanism, the heat generation in the lamp socket area can be significantly reduced, avoiding the continuous increase of temperature.

[0028] In S3, the dynamic thermal management system further includes an active heat dissipation component. When the temperature exceeds 70°C, the active heat dissipation component starts to cool down. The active heat dissipation component includes a micro fan or a thermoelectric cooler.

[0029] Specifically, the active heat dissipation component realizes the active cooling of the overheated area through a micro fan or a thermoelectric cooler. The micro fan promotes air flow mechanically and quickly takes away the heat in the lamp socket area through the principle of forced convection heat dissipation; The thermoelectric cooler utilizes the Peltier effect to generate a temperature difference at both ends of the thermoelectric cooler through electrical energy drive. The cold end absorbs the heat of the lamp socket, and the hot end releases the heat to the environment through the heat sink; The operation of the active heat dissipation component is controlled by the dynamic thermal management system. When the thermistor detects that the temperature in the lamp socket area exceeds 70°C, the temperature signal is transmitted to the microprocessor, and the microprocessor issues a start command according to the set logic. The micro fan or the thermoelectric cooler immediately starts to work, and the heat in the lamp socket area can be diffused or absorbed in time, and the temperature gradually drops back to the set safety range. By setting the active heat dissipation component, the present invention can effectively meet the heat dissipation requirements under extreme working conditions in the high-brightness backlight device, enabling the device to maintain stability during long-term high-load operation. At the same time, this design is simple and efficient and is applicable to various types of display devices.

[0030] In S4, the heat insulation layer material is high-temperature resistant transparent polycarbonate or aluminosilicate-based ceramic fiber film. The thickness of the heat insulation layer is controlled within 0.5 mm - 2 mm, and the thermal conductivity is less than 0.5 W / m·K. The heat insulation layer is used to isolate the influence of the heat of the iron frame on the display screen.

[0031] Specifically, the material selected for the heat insulation layer should have low thermal conductivity, high heat resistance, and good mechanical properties. Transparent polycarbonate has excellent high-temperature resistance, and its heat-resistant temperature can usually reach 120°C to 150°C. At the same time, it has certain mechanical strength and optical transparency, which can maintain the visual effect of the display screen while effectively insulating heat; The thickness of the heat insulation layer is designed to be between 0.5 mm and 2 mm. This thickness range can not only ensure the heat insulation effect but also reduce the volume and weight of the material, avoiding burden on the overall structure of the device. The installation position of the heat insulation layer is between the iron frame and the display screen. The heat insulation layer is firmly fixed on the surface of the iron frame by means of adhesives or mechanical fixation, so that it covers the heat conduction area between the iron frame and the display screen. The material of the heat insulation layer has good flexibility, can adapt to the slight deformation of the iron frame, and at the same time ensure its close fit with the iron frame and the display screen to reduce the interface thermal resistance. Through the selection of low-thermal-conductivity materials and reasonable thickness design, the heat insulation layer effectively isolates the thermal influence of the iron frame on the display screen, ensuring the stability and long-term use performance of the device. This design has excellent heat insulation effect and is easy to implement, and is suitable for the heat management requirements of various high-brightness backlight display devices.

[0032] In S1 - S5, the heat dissipation path and dynamic control are used to reduce the temperature of the lamp socket area by no less than 15°C and the temperature of the display screen surface by no less than 20%, which is used to reduce the phenomenon of the display screen turning black.

[0033] Specifically, through the combination of bending the iron frame and high-thermal-conductivity materials such as galvanized iron sheets or aluminum alloys, a double-sided heat dissipation path is achieved. The tightly contacted bent iron frame with the heat source area enables the heat generated by the lamp socket and the FPC lamp strip to be efficiently conducted to the iron frame and evenly dispersed. The high thermal conductivity of the iron frame significantly reduces the heat accumulation in the lamp socket area, laying a foundation for the subsequent work of the heat dissipation components; The combination of optimizing the heat dissipation path and dynamic control achieves a significant cooling effect. Experimental tests show that the temperature of the lamp socket area is reduced by no less than 15°C, and the temperature of the display screen surface is reduced by no less than 20%. This not only effectively reduces the phenomenon of the display screen turning black due to high temperature but also improves the long-term use reliability of the device in a high-brightness environment, achieving the effect of extending the service life of the device.

[0034] In S1 - S5, the heat transfer performance of the heat dissipation structure satisfies the following formula: The heat transferred per unit time is proportional to the thermal conductivity, the effective area of the heat conduction path, and the temperature difference between the heat source and the environment. Its mathematical expression is: ; .

[0035] Specifically, the heat dissipation structure designed based on this formula can significantly improve the heat transfer efficiency. The structure combining the iron frame bending and the heat dissipation glue enables the heat in the lamp socket area to quickly spread to the iron frame and achieve efficient heat dissipation through the heat exchange between the iron frame and the external environment. When in use, not only is the heat conduction efficiency in the lamp socket area increased by 30% per unit time, but also the temperature in the lamp socket area is significantly reduced (not less than 15°C), and at the same time, the temperature reduction on the surface of the display screen reaches more than 20°C.

[0036] In S2 and S3, the reduction in the thermal resistance of the FPC light bar is not less than 50%, the reduction in the operating temperature of the light bar is not less than 15°C, and the heat dissipation system can continuously and stably operate for more than 500 hours within the ambient temperature range of 25°C - 60°C.

[0037] Specifically, the reduction in the thermal resistance of the FPC light bar is not less than 50%, the reduction in the operating temperature of the light bar is not less than 15°C, and the heat dissipation system can continuously and stably operate for more than 500 hours within the ambient temperature range of 25°C - 60°C. To achieve the best heat transfer effect, the thermal conductivity of the heat dissipation glue is set not less than 3 W / m·K, and the coating thickness is controlled between 0.2 mm and 0.3 mm. By applying a pressing pressure of 1 N / cm² to 3 N / cm², the interface adhesion between the heat dissipation glue, the FPC light bar, and the iron frame is sufficient to form an efficient heat conduction path. This design enables the reduction in the thermal resistance of the FPC light bar to reach more than 50%, and the heat can be quickly transferred to the iron frame and further diffused. Within the ambient temperature range of 25°C to 60°C, after the heat dissipation system continuously operates for 500 hours, the heat dissipation performance of the light bar and the display screen does not show obvious attenuation, and the temperature control performance remains stable. The stability of the heat dissipation system benefits from the collaborative optimization of the multi-layer heat dissipation structure, including the double-sided heat conduction path of the high-thermal-conductivity iron frame, the reduction effect of the interface thermal resistance of the high-thermal-conductivity silica gel, and the comprehensive regulation of the dynamic thermal management and the active heat dissipation components. Combining with the dynamic thermal management system, by real-time monitoring the temperature of the light bar and adjusting the light source power, the generation of heat in the light bar is reduced. When the operating temperature of the light bar approaches the set threshold, the dynamic adjustment system activates the power limit and adjusts the light source power to 60% - 80% of the initial power, which has the effect of reducing the accumulation of thermal energy from the source.

[0038] In S1 - S5, the results of the thermal simulation show that the improvement in the heat conduction efficiency of the lamp socket is not less than 30%, the surface temperature of the display screen is significantly reduced, and the phenomenon of blackening during long-term use of the display screen is prevented.

[0039] Specifically, through the optimized design of the heat dissipation path and the application of materials, the heat in the lamp socket can be efficiently conducted and evenly diffused, improving the overall heat dissipation performance. The improvement in the heat conduction efficiency of the lamp socket is not less than 30%, effectively solving the problem of performance degradation caused by heat accumulation during the long-term operation of high-brightness backlight devices. Through the structural design combining the bending of the iron frame and high - thermal - conductivity silicone, the thermal resistance is significantly reduced, and the heat conduction path in the lamp socket area is optimized. At the same time, the synergistic effect of the dynamic thermal management system and the active heat dissipation component further improves the heat dissipation efficiency, ensuring efficient thermal management performance under different ambient temperature conditions; The surface temperature of the display screen is significantly reduced. Compared with the traditional heat dissipation system, the temperature drop is not less than 20 °C, enabling the display screen to operate stably for a long time in high - brightness and high - temperature environments. In addition, due to the effective control of the surface temperature of the display screen, the present invention significantly inhibits the blackening phenomenon generated by the high - brightness backlight device during long - term use. The optimized heat dissipation system can remain stable in the high - temperature test of continuous operation for more than 500 hours, without any blackening of the display screen or performance degradation; Through the efficient heat dissipation and temperature control design, the present invention not only improves the heat dissipation performance of the lamp socket, but also effectively reduces the surface temperature of the display screen, greatly extending the service life of the device.

[0040] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A design method for solving the problem of blackening of the display screen caused by heating of the high-brightness backlight source, characterized in that: The following steps are involved: S1. The iron frame structure where the lamp holder is located is bent to form a double-sided heat conduction path by contacting the heat source on both the front and back sides. The bending is used to make both the front and back sides of the iron frame contact the heat source and conduct heat through double-sided heat conduction. S2. Apply heat dissipation glue on the back of the flexible printed circuit board of the light bar, and adhere the FPC light bar to the iron frame tightly through a pressurizing process. The hot pressing process is used to improve the heat conduction performance; S3. Set up a dynamic thermal management system in the lamp port area to reduce the system temperature through real-time temperature monitoring, intelligent power regulation and active heat dissipation components; S4. Add a heat insulation layer between the iron frame and the display screen to isolate the direct heat impact of the high temperature area on the display screen; S5. The heat is quickly dissipated through a heat dissipation structure, wherein the heat dissipation structure is used to reduce the risk of the display screen turning black due to high temperature.

2. A design method for solving the problem of blackening of the display screen caused by heating of the high-brightness backlight source lamp port according to claim 1, characterized in that: In S1, the bending area of ​​the iron frame corresponds to the heat source area of ​​the lamp holder and the FPC light strip, the bending angle range is 90-135°, and the contact area between the front and back sides of the bent iron frame and the heat source accounts for more than 80% of the total area of ​​the heat source. The iron frame is made of high thermal conductivity material, and the high thermal conductivity material includes galvanized iron plate or aluminum alloy.

3. A design method for solving the problem of blackening of the display screen caused by heating of the high-brightness backlight source lamp port according to claim 1, characterized in that: In S2, the heat dissipation adhesive is a high thermal conductivity silicone, and the high thermal conductivity silicone includes thermal conductive silicone grease, thermal conductive silicone sheet or thermal conductive silicone pad, and its thermal conductivity is not less than 3W / m·K. The thickness of the heat dissipation adhesive layer is controlled at 0.2mm-0.3mm, and the pressure is controlled at 1N / cm²-3N / cm² by pressurization. Hot pressing is used to fully adhere the heat dissipation adhesive to the FPC light strip and the iron frame.

4. A design method for solving the problem of blackening of the display screen caused by heating of the high-brightness backlight source lamp port according to claim 1, characterized in that: In S3, the dynamic thermal management system includes a thermistor and a microprocessor. The thermistor is used to monitor the temperature of the lamp holder area in real time. When the temperature exceeds a set threshold, the microprocessor dynamically adjusts the light source power to 60%-80% of the initial power through a driving circuit.

5. The design method for solving the problem of blackening of the display screen caused by heating of the high-brightness backlight source lamp port according to claim 1, characterized in that: In S3, the dynamic thermal management system further includes an active heat dissipation component. When the temperature exceeds 70° C., the active heat dissipation component starts cooling. The active heat dissipation component includes a micro fan or a thermoelectric cooling sheet.

6. A design method for solving the problem of blackening of the display screen caused by heating of the high-brightness backlight source lamp port according to claim 1, characterized in that: In S4, the insulation layer material is high temperature resistant transparent polycarbonate or aluminum silicate based ceramic fiber film, the thickness of the insulation layer is controlled at 0.5mm-2mm, the thermal conductivity is less than 0.5W / m·K, and the insulation layer is used to isolate the influence of the heat of the iron frame on the display screen.

7. A design method for solving the problem of blackening of the display screen caused by heating of the high-brightness backlight source lamp port according to claim 1, characterized in that: In S1-S5, the heat dissipation path and dynamic control are used to reduce the temperature of the lamp port area by no less than 15°C and the surface temperature of the display screen by no less than 20%, so as to reduce the blackening of the display screen.

8. The design method for solving the problem of blackening of the display screen caused by heating of the high-brightness backlight source lamp port according to claim 1, characterized in that: In S1-S5, the heat transfer performance of the heat dissipation structure satisfies the following formula: Heat transferred per unit time Thermal conductivity , effective area of ​​heat conduction path and the temperature difference between the heat source and the environment Proportional, its mathematical expression is: ； 。 9. The design method for solving the problem of blackening of the display screen caused by heating of the high-brightness backlight source lamp port according to claim 1, characterized in that: In S2 and S3, the thermal resistance of the FPC light bar is reduced by not less than 50%, the operating temperature of the light bar is reduced by not less than 15°C, and the heat dissipation system can operate stably and continuously for more than 500 hours in an ambient temperature range of 25°C-60°C.

10. The design method for solving the problem of blackening of the display screen caused by heating of the high-brightness backlight source lamp port according to claim 1, characterized in that: In S1-S5, the thermal simulation results show that the heat conduction efficiency of the lamp socket is improved by no less than 30%, the surface temperature of the display screen is significantly reduced, and the blackening phenomenon of the display screen during long-term use is prevented.

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