Heat pump heating laminating machine coupled with flat plate heat pipe technology

Abstract

The invention discloses a heat pump heating laminating machine coupled with a flat plate heat pipe technology, and relates to the technical field of solar cell modules. The laminating machine comprises a heating plate, a chamber lifting system, an upper chamber, a lower chamber, a heat pump system, a vacuum system and a plurality of valves, wherein the heating plate is used for uniformly heating an assembly to be laminated; the upper chamber is used for uniformly pressurizing the to-be-laminated assembly; the chamber lifting system is used for driving the heating plate and the upper chamber to move in the vertical direction; the lower chamber is used for bearing a to-be-laminated assembly and providing a vacuum environment for the to-be-laminated assembly; the heat pump system is used for conveying a circulating working medium to the plane heat pipe in the heating plate; the vacuum system is used for changing the pressure intensity in the upper chamber and the lower chamber; and the valves are respectively arranged on pipelines between the upper chamber and the vacuum system and between the lower chamber and the vacuum system, and are used for controlling the opening and closing of the pipelines. The heating temperature of different areas of the assembly can be rapidly adjusted in real time, and the problem that the sealing performance and the adhesion performance of the assembly are reduced due to uneven heating is effectively solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of solar cell modules, and particularly relates to a heat pump heating laminator coupled with a flat heat pipe technology. Background Art

[0002] Laminators are widely used in the encapsulation process of solar cell modules. During the lamination process, the laminator stacks tempered glass, EVA film, silicon wafers, EVA film, and backsheet (or tempered glass) into a whole, making it have high light transmittance, high sealing performance, and high photoelectric conversion efficiency.

[0003] Existing laminators are divided into two types according to the heating method: heat-conducting oil heating and electric heating. The principle of heat-conducting oil heating is to use the temperature of high-temperature heat-conducting oil to heat the plate. In a long-term working environment, this type of laminator will have an oil leakage phenomenon, resulting in the laminator being unable to work all-weather, and even causing the wafers to become brittle or displaced. The principle of electric heating is to directly use electricity to heat the heating plate. However, due to the contact between the edge of the hot pressing plate and the environment, the problem of uneven temperature distribution on the hot pressing plate will occur, manifested as lower temperature around and higher temperature in the central area, which will lead to serious consequences such as insufficient cross-linking of the EVA film, bubbles or deformation in the solar cell module.

[0004] Therefore, there is an urgent need in the art for a laminator with controllable temperature to ensure the lamination effect and improve the lamination efficiency. Summary of the Invention

[0005] To solve the problems existing in the prior art, the present invention provides a heat pump heating laminator coupled with a flat heat pipe technology, which can uniformly heat the workpiece, effectively transfer pressure, and improve the encapsulation quality.

[0006] The technical solution of the present invention is as follows:

[0007] In a first aspect, the present invention provides a heat pump heating laminator coupled with a flat heat pipe technology, including a heating plate, a chamber lifting system, an upper chamber, a lower chamber, a heat pump system, a vacuum system, and a plurality of valves. The heating plate is used to uniformly heat the solar cell module to be laminated. The heating plate is embedded with a heating film group, which is composed of a heating plate outer frame, edge heat pipes, and a central heat pipe, and is used to control the heating temperature of the edge and the center of the solar cell module to be laminated respectively. The chamber lifting system is connected to the upper cover of the laminator to drive the heating plate and the upper chamber to move in the vertical direction. The upper chamber is used to uniformly press the solar cell module to be laminated. The lower chamber is used to carry the solar cell module to be laminated and provide a vacuum environment for the solar cell module to be laminated. The heat pump system is connected to the flat heat pipes in the heating plate through heat-insulating pipes to transport circulating working fluid for the flat heat pipes. The vacuum system is connected to the upper and lower chambers through pipes and valves to change the pressure in the chambers.

[0008] Optionally, the laminator further includes a floating joint, which is connected to the chamber lifting system and the upper cover of the laminator, and can absorb the slight misalignment error of the upper chamber during vertical movement, ensuring that the upper chamber uniformly presses the component to be laminated during lamination.

[0009] Optionally, the heating plate is equipped with flat heat pipes, and there is a capillary core structure inside the flat heat pipes. The capillary core structure can quickly collect the liquefied circulating working fluid inside the flat heat pipes and transport it back to the heat pump system.

[0010] Optionally, the flat heat pipes are divided into two parts. One part is the edge heat pipes arranged along the edge of the heating plate, and the other part is the central heat pipes arranged in the center of the heating plate for heating the middle part of the component to be laminated. The two parts are jointly used to control the heating temperature of the component to be laminated in a zoning manner.

[0011] Optionally, the upper chamber is sealed by a heat transfer plate, an upper lamination frame, and a silica gel plate. The heat transfer plate is located above the upper chamber and is used to uniformly transfer the heat generated by the heating plate to the component to be laminated through the silica gel plate. The heat transfer plate and the upper lamination frame are sealed by a sealing silica gel strip; the silica gel plate is located below the upper chamber and is used to provide pressure to the component to be laminated during lamination. The silica gel plate is tightly connected to the upper lamination frame; wherein a temperature sensor is embedded in the heat transfer plate to real-time feedback the thermal field distribution of the component to be laminated;

[0012] The lower chamber is jointly composed of a lower lamination frame, the lower bottom plate of the laminator, and a silica gel plate. The silica gel plate is located above the lower lamination frame, and the lower bottom plate of the laminator is located below the lower lamination frame.

[0013] Optionally, the heat pump system is respectively connected to the edge heat pipes and the central heat pipes through heat-insulating pipelines, and is used to adjust the temperature of the circulating working fluid in the edge heat pipes and the central heat pipes, so as to real-time adjust the heating temperature of different regions of the component to be laminated; wherein, the edge heat pipes and the central heat pipes are respectively connected to different heat pumps in the heat pump system to control the temperature of different regions of the component to be laminated.

[0014] Optionally, the circulating working fluid used by the heat pump system can undergo a phase change at the temperature when the adhesive film of the component to be laminated undergoes crosslinking, and the phase-changed circulating working fluid flows back to the heat pump system through the capillary core in the flat heat pipe.

[0015] Optionally, the heat pump system uses external waste heat as a heat source to improve economic and environmental benefits.

[0016] In a second aspect, the present invention provides a heat pump heating lamination method coupled with flat heat pipe technology, which is applied to the above laminator and includes the following steps:

[0017] Component feeding stage: Turn on the vacuum system, adjust the pressure in the lower chamber to atmospheric pressure and the upper chamber to a vacuum state. Lay the component to be laminated in the high-temperature cloth and put them together into the lower chamber. Then, the chamber lifting system drives the heating plate and the upper chamber to descend together until the silica gel plate tightly adheres to the lower lamination frame and makes the lower chamber in a sealed state;

[0018] Preheating and pre-pressing stage: Keep the vacuum system on, adjust the lower chamber to a vacuum state, then increase the pressure in the upper chamber and the final pressure is less than atmospheric pressure, so that the silica gel plate performs preliminary pressing on the component to be laminated. At the same time, turn on the heat pump system and control the temperature of the circulating working fluid to match the temperature at which the adhesive film in the component to be laminated melts. The component to be laminated realizes pre-fitting and fixing under the condition of preliminary heating and pressing, avoiding the internal structure of the component to be laminated from shifting due to too fast heating and pressing;

[0019] Circulating heating stage: Keep the vacuum system on, the lower chamber is still in a full vacuum state, adjust the pressure in the upper chamber to atmospheric pressure, and the silica gel plate fully extrudes the component to be laminated. At this time, control the temperature of the circulating working fluid in the heat pump system to match the cross-linking temperature of the adhesive film in the component to be laminated. During the heating process, a real-time temperature field of the component to be laminated is constructed through the feedback signal of the temperature sensor in the heat transfer plate. The heat pump system adjusts the temperature of the circulating working fluid in the edge heat pipe and the central heat pipe in real time according to the real-time temperature field of the component to be laminated, avoiding voids or decreased viscosity caused by uneven heating of the adhesive film inside the component to be laminated;

[0020] Component discharging stage: After the lamination process is completed, keep the vacuum system on, adjust the upper chamber to a full vacuum state, adjust the pressure in the lower chamber to atmospheric pressure, and the chamber lifting system drives the heating plate and the upper chamber to rise together. Finally, the silica gel plate leaves the lower lamination frame, and the laminated component to be laminated is taken out.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0022] 1) The heating plate of the present invention has an edge heat pipe for heating the edge of the component to be laminated and a central heat pipe for heating the middle part of the component to be laminated. The inlets and outlets of the edge heat pipe and the central heat pipe are respectively connected to different heat pumps in the heat pump system, realizing temperature control of different regions of the component to be laminated, and at the same time avoiding problems such as deformation of the silica gel plate and uneven lamination pressure caused by uneven heat distribution;

[0023] 2) The heat transfer plates of the present invention are embedded with temperature sensors, and the temperature sensors are evenly distributed in the peripheral edges and central regions of the heat transfer plates, which can monitor the temperatures of different regions of the component to be laminated during the lamination process, and at the same time transmit the monitoring data to the heat pump system. The heat pump system adjusts the temperatures of the circulating working fluids in the edge heat pipes and the central heat pipes through a variable-frequency compressor, so as to adjust the heating temperatures of different regions of the component to be laminated in real time;

[0024] 3) Both the edge heat pipes and the central heat pipes use flat heat pipe technology to form the working fluid circulation of the heat pump system. The flat heat pipe technology has the advantages of high heat transfer efficiency, simple structure, energy conservation, etc., and can eliminate local overheating of the component to be laminated in a short time and compensate for the heat dissipation at the edge of the component to be laminated. Description of the Drawings

[0025] Figure 1 is a schematic structural diagram of a heat pump heating laminator device coupling flat heat pipe technology provided by an embodiment of the present invention;

[0026] Figure 2 is Figure 1 a partial enlarged view of the heating plate in

[0027] Figure 3 is Figure 1 a schematic diagram of the vacuum pump and pipeline externally connected to the upper chamber and the lower chamber in

[0028] Figure 4 is a schematic flow chart of a heat pump heating lamination method coupling flat heat pipe technology provided by an embodiment of the present invention.

[0029] Description of the Reference Numerals

[0030] 1 - Heating plate; 2 - Chamber lifting system; 3 - Upper chamber; 4 - Lower chamber; 5 - Component to be laminated; 6 - Heat pump system; 11 - Heating module; 12 - Upper cover of the laminator; 21 - Base of the laminator; 22 - Hydraulic piston; 23 - Floating joint; 31 - Heat transfer plate; 32 - Upper lamination frame; 33 - Silicone plate; 41 - Lower lamination frame; 42 - Lower bottom plate of the laminator; 61 - Edge heat pipe working fluid inlet pipe; 62 - Edge heat pipe working fluid outlet pipe; 63 - Central heat pipe working fluid inlet pipe; 64 - Central heat pipe working fluid outlet pipe; 111 - Outer frame of the heating plate; 112 - Edge heat pipe; 113 - Central heat pipe; V1 - Vacuum valve of the lower chamber; V2 - Vacuum valve of the upper chamber; V3 - Inflation valve of the lower chamber; V4 - Inflation valve of the upper chamber. Detailed Embodiments

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0033] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0034] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0035] First embodiment

[0036] In order to achieve efficient and uniform heating of components by the laminator and to avoid problems such as decreased sealing and adhesion of components due to uneven heating during the lamination process, this embodiment provides a heat pump heating laminator coupled with flat plate heat pipe technology, such as Figure 1 As shown, it shows the composition of the heat pump heating laminator coupled with flat-plate heat pipe technology. The heat pump heating laminator coupled with flat-plate heat pipe technology mainly includes a heating plate 1, a chamber lifting system 2, an upper chamber 3, a lower chamber 4, a vacuum system and a heat pump system 6.

[0037] The laminator also has a laminator upper cover 12 and a laminator lower base plate 42; a heating module 11 is embedded in the heating plate 1 for uniformly heating the component 5 to be laminated. The heating plate 1 is directly connected and fixed to the laminator upper cover 12. The laminator upper cover 12 is also connected to the chamber lifting system 2, and the laminator upper cover 12 controls the vertical up and down movement of the heating plate 1 and the upper chamber 3 through the chamber lifting system 2.

[0038] As Figure 2 shown, the heating module 11 is composed of a heating plate outer frame 111, edge heat pipes 112 and a central heat pipe 113. The heating plate outer frame 111 is used to protect and fix the heat pipes. The edge heat pipes 112 are fixed at the edge of the heating module 11 for heating the edge of the component 5 to be laminated. The central heat pipe 113 is fixed in the center of the heating module 11 and is arranged in a reciprocating form to facilitate providing a uniform and stable heat source for the component 5 to be laminated. It should be noted that the inlets and outlets of the edge heat pipes 112 and the central heat pipe 113 are respectively connected to different heat pumps in the heat pump system to control the temperature respectively, so as to control the temperature of different areas of the component 5 to be laminated, and at the same time avoid problems such as the deformation of the silica gel plate and uneven lamination pressure caused by uneven heat distribution.

[0039] The laminator also includes a floating joint 23, and the chamber lifting system 2 is jointly composed of a laminator base 21, a hydraulic cylinder and a hydraulic piston 22. The floating joint 23 can absorb the small misalignment error between the hydraulic cylinder and the upper chamber 3 to ensure that the silica gel plate 33 contacts each area of the component 5 to be laminated simultaneously during the lamination process to uniformly press it. The hydraulic piston 22 is arranged in the hydraulic cylinder and can be driven by hydraulic oil to move axially back and forth along the inner wall of the hydraulic cylinder, that is, to move vertically; the hydraulic piston 22 drives the heating plate and the upper chamber to move vertically.

[0040] The upper chamber 3 is sealed by a heat transfer plate 31, an upper lamination frame 32 and a silica gel plate 33. The heat transfer plate 31 is located above the upper chamber. The heat transfer plate 31 is used to uniformly transfer the heat generated by the heating module 11 to the component 5 to be laminated through the silica gel plate 33 and can reduce heat loss. The upper lamination frame 32 is made of steel and is sealed with the heat transfer plate 31 through a sealing silica gel strip to ensure the sealing performance inside the upper chamber 3. The silica gel plate 33 is located below the upper chamber. The silica gel plate 33 is closely connected to the upper lamination frame 32 and is used to provide pressure for the component 5 to be laminated during lamination.

[0041] The lower chamber 4 is jointly composed of a lower lamination frame 41, a laminator lower base plate 42 and the silica gel plate 33 when pressing downwards, and is used to carry the component 5 to be laminated and provide a sealed environment for it to ensure that all the air inside the component 5 to be laminated is pumped out completely; among them, the silica gel plate 33 is located above the lower lamination frame 41, and the laminator lower base plate 42 is located below the lower lamination frame 41.

[0042] As Figure 3As shown, both the upper chamber 3 and the lower chamber 4 have vacuum holes and inflation holes, and are both connected to the vacuum system through pipelines. At the same time, the pipelines connecting the lower chamber 4 to the vacuum system are respectively provided with a lower chamber vacuum valve V1 and a lower chamber inflation valve V3, and the pipelines connecting the upper chamber 3 to the vacuum system are respectively provided with an upper chamber vacuum valve V2 and an upper chamber inflation valve V4, which are used to control the pressures in the upper and lower chambers respectively.

[0043] Referring to Figure 1 and Figure 2 , the heat pump system 6 of the laminator of the present invention has an edge heat pipe working fluid inlet pipe 61, an edge heat pipe working fluid outlet pipe 62, a central heat pipe working fluid inlet pipe 63 and a central heat pipe working fluid outlet pipe 64. Among them, the edge heat pipe working fluid inlet pipe 61 and the edge heat pipe working fluid outlet pipe 62 are respectively connected to the inlet end and the outlet end of the edge heat pipe 112 closest to the heating plate outer frame 111 of the heating plate 1, and the central heat pipe working fluid inlet pipe 63 and the central heat pipe working fluid outlet pipe 64 are respectively connected to the inlet end and the outlet end of the central heat pipe 113 evenly distributed in the center of the heating plate 1, so as to perform zonal heating on the to-be-laminated assembly 5 and avoid problems such as the decrease in sealing performance, the generation of bubbles, and the incomplete cross-linking process of the adhesive film in the assembly due to less heat received at the edge of the to-be-laminated assembly 5.

[0044] Preferably, a temperature sensor is embedded in the heat transfer plate 31, and the temperature sensors are evenly distributed in the four peripheral edges and the central regions of the heat transfer plate, so as to monitor the temperatures of different regions of the to-be-laminated assembly 5 during the lamination process, and at the same time transmit the monitoring data to the heat pump system 6. The heat pump system 6 adjusts the temperatures of the circulating working fluids in the edge heat pipe 112 and the central heat pipe 113 through a variable frequency compressor, so as to adjust the heating temperatures of different regions of the to-be-laminated assembly 5 in real time.

[0045] Preferably, the heat pump system 6 further includes an evaporator, and the evaporator can obtain heat sources from external waste heat. The sources of waste heat include sewage that may be generated in a solar cell module production line, power plant cooling water, industrial wastewater, etc., and also include groundwater, soil, air, etc. Any waste heat that can be recovered and supplied to the heat pump system 6 is applicable to the present invention, so as to improve the economic and environmental benefits of the present invention.

[0046] Preferably, both the edge heat pipe 112 and the central heat pipe 113 use the flat heat pipe technology. The heat pump system 6 first sends the heated circulating working fluid into the edge heat pipe 112 and the central heat pipe 113 through the edge heat pipe working fluid inlet pipe 61 and the central heat pipe working fluid inlet pipe 63. At this time, the circulating working fluid is high-temperature steam. After heating the laminate assembly 5, the circulating working fluid condenses into a liquid circulating working fluid. At this time, the liquid circulating working fluid is quickly collected into the edge heat pipe working fluid outlet pipe 62 and the central heat pipe working fluid outlet pipe 64 through the capillary core structure in the edge heat pipe 112 and the central heat pipe 113, and finally enters the heat pump system 6 for re-heat exchange. The gaseous circulating working fluid after heat exchange re-enters the edge heat pipe 112 and the central heat pipe 113, thus forming the working fluid cycle of the heat pump system 6. This flat heat pipe technology has the advantages of high heat transfer efficiency, simple structure, energy conservation, etc., and can eliminate local overheating of the laminate assembly 5 in a short time and compensate for the edge heat dissipation of the laminate assembly 5.

[0047] Preferably, the present invention does not limit the specific working fluid in the heat pump system 6, and any working fluid used for heat pumps and microchannel flat heat pipes is applicable to the present invention. These circulating working fluids can undergo a phase change near the temperature at which the adhesive film in the laminate assembly 5 crosslinks, and after condensation, they flow back into the heat pump system 6 through the capillary core in the flat heat pipe.

[0048] Second Embodiment

[0049] This embodiment provides a laminating method for a heat pump heating laminator coupled with flat heat pipe technology. This method includes the steps as Figure 4 shown: component feeding stage S1, preheating and pre-pressing stage S2, circulating heating stage S3, and component discharging stage S4.

[0050] The following is an explanation of each step.

[0051] Component feeding stage S1

[0052] Turn on the vacuum system, keep the lower chamber inflation valve V3 open, the lower chamber vacuum valve V1 closed, the upper chamber vacuum valve V2 open, and the upper chamber inflation valve V4 closed. At this time, the pressure in the lower chamber 4 is atmospheric pressure, the upper chamber 3 is in a vacuum state. Lay the laminate assembly 5 in the high-temperature cloth, and then put them together into the lower chamber 4 of the laminator. The chamber lifting system 2 slowly descends, driving the heating plate 1 and the upper chamber 3 to descend together until the upper laminating frame 32 tightly fits the silicone plate 33 on the lower laminating frame 41. At this time, the chamber lifting system pauses to move, making the lower chamber 4 in a sealed state, that is, keeping the laminator in a sealed state;

[0053] Preheating and pre-pressing stage S2

[0054] Keep the vacuum system on. Open the lower chamber vacuum valve V1 and close the lower chamber inflation valve V3 to fully discharge the air and dust around the laminate assembly 5. At the same time, close the upper chamber vacuum valve V2 to prevent the air in the lower chamber 4 from flowing back into the upper chamber 3. When the vacuum degrees of the upper and lower chambers are close, slowly open the upper chamber inflation valve V4. At this time, the pressure in the upper chamber 3 gradually increases. During this process, the silica gel plate 33 applies preliminary pressure to the laminate assembly 5. At the same time, turn on the heat pump system 6 and control the circulating temperature of the working fluid near the melting temperature of the adhesive film in the laminate assembly 5 (when the laminate assembly 5 is a solar cell assembly to be laminated, since the melting temperature of the adhesive film of the solar cell assembly to be laminated is 80 °C, at this time, the circulating temperature of the working fluid in the edge heat pipe is 85 - 90 °C, and the circulating temperature of the working fluid in the central heat pipe is 80 - 85 °C). The laminate assembly 5 realizes pre-bonding and fixing under the condition of preliminary heating and pressurization, avoiding the problem that the internal structure of the laminate assembly 5 is displaced due to too fast pressurization and heating;

[0055] Circulating heating stage S3

[0056] Keep the vacuum system on. The lower chamber 4 is still in a full vacuum state, and the pressure in the upper chamber 3 reaches atmospheric pressure. The silica gel plate 33 fully squeezes the laminate assembly 5. At this time, control the circulating temperature of the working fluid in the heat pump system 6 near the crosslinking temperature of the adhesive film in the laminate assembly 5 (when the laminate assembly 5 is a solar cell assembly to be laminated, since the crosslinking temperature of the adhesive film of the solar cell assembly to be laminated is 130 °C, at this time, the circulating temperature of the working fluid in the edge heat pipe is 140 - 145 °C, and the circulating temperature of the working fluid in the central heat pipe is 135 - 140 °C). During the heating process, construct the real-time temperature field of the laminate assembly 5 through the feedback signal of the temperature sensor in the heat insulation plate 31. The heat pump system adjusts the circulating temperature of the working fluid in the edge heat pipe 112 and the central heat pipe 113 in real time according to the real-time temperature field of the laminate assembly 5. Due to inevitable heat loss at the edges of the upper chamber 3 and the lower chamber 4 of the laminator, generally, set the temperature of the edge heat pipe 112 in the range of 140 - 145 °C and the temperature of the central heat pipe 113 in the range of 135 °C - 140 °C. This temperature setting can compensate for the edge heat loss of the laminate assembly 5 and avoid problems such as voids or decreased viscosity caused by uneven heating of the adhesive film inside the laminate assembly 5.

[0057] If the real-time temperature field changes subsequently, control the heat pump system 6 to adjust the working fluid temperatures flowing through the edge heat pipe 112 and the central heat pipe 113 respectively to achieve uniform surface temperature of the laminate assembly 5.

[0058] Component unloading stage S4

[0059] After the lamination process is completed, keep the vacuum system on, open the lower chamber inflation valve V3, close the lower chamber vacuum valve V1, close the upper chamber inflation valve V4, open the upper chamber vacuum valve V2. When the upper chamber 3 is in a full vacuum state and the lower chamber 4 is inflated to atmospheric pressure, the chamber lifting system 2 slowly rises, driving the heating plate 1 and the upper chamber 3 to rise vertically together, and finally making the silica gel plate 33 leave the lower lamination frame 41, and taking out the laminated component 5 to be laminated that has been laminated.

[0060] The above embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent of the present invention. For those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention.

Claims

1. A heat pump heating laminator coupled with flat plate heat pipe technology, characterized in that: include: A heating plate, used to evenly heat the components to be laminated; The upper chamber is used to uniformly pressurize the components to be laminated; The chamber lifting system is used to drive the heating plate and the upper chamber to move in the vertical direction; The lower chamber is used to carry the components to be laminated and provide a vacuum environment for the components to be laminated; A heat pump system is connected to the planar heat pipe in the heating plate through an insulation pipe and is used to transport circulating medium to the planar heat pipe; A vacuum system, connected to the upper chamber and the lower chamber through pipelines, for changing the pressure in the chamber; A plurality of valves are respectively arranged on the pipelines between the upper chamber and the vacuum system and the lower chamber and the vacuum system, and are used to control the opening and closing of the pipelines.

2. The heat pump heating laminator coupled with flat plate heat pipe technology as claimed in claim 1, characterized in that: Also includes: The floating joints are connected to the chamber lifting system and the upper cover of the laminator respectively, which can absorb the slight misalignment error of the upper chamber during the vertical movement and ensure that the upper chamber is evenly pressurized on the components to be laminated during the lamination process.

3. The heat pump heating laminator coupled with flat plate heat pipe technology as claimed in claim 1, characterized in that: The planar heat pipe has a capillary wick structure inside, and the capillary wick structure can collect the liquefied circulating working fluid inside the planar heat pipe and transport it back to the heat pump system.

4. The heat pump heating laminator coupled with flat plate heat pipe technology as claimed in claim 3, characterized in that: The planar heat pipe is divided into two parts, one is the edge heat pipe arranged along the edge of the heating plate, and the other is the central heat pipe arranged in the center of the heating plate for heating the middle part of the laminated component. The two parts are used together to control the heating temperature of the laminated component in a zoned manner.

5. The heat pump heating laminator coupled with flat plate heat pipe technology as claimed in claim 3, characterized in that: The upper chamber is sealed by a heat transfer plate, an upper lamination frame and a silicone plate. The heat transfer plate is located above the upper chamber and is used to evenly transfer the heat generated by the heating plate to the component to be laminated through the silicone plate. The heat transfer plate and the upper lamination frame are sealed by a sealing silicone strip. The silicone plate is located below the upper chamber and is used to provide pressure to the component to be laminated during lamination. The silicone plate is closely connected to the upper lamination frame. A temperature sensor is embedded in the heat transfer plate to provide real-time feedback on the thermal field distribution of the component to be laminated. The lower chamber is composed of a lower lamination frame, a lower bottom plate of a laminator and a silicone plate. The silicone plate is located above the lower lamination frame, and the lower bottom plate of the laminator is located below the lower lamination frame.

6. The heat pump heating laminator coupled with flat plate heat pipe technology as claimed in claim 4, characterized in that: The heat pump system is connected to the edge heat pipe and the central heat pipe respectively through insulation pipes, and is used to adjust the temperature of the circulating working medium in the edge heat pipe and the central heat pipe, so as to adjust the heating temperature of different areas of the assembly to be laminated in real time; wherein the edge heat pipe and the central heat pipe are respectively connected to different heat pumps in the heat pump system, so as to control the temperature of different areas of the assembly to be laminated.

7. The heat pump heating laminator coupled with flat plate heat pipe technology as claimed in claim 1, characterized in that: The circulating working fluid used in the heat pump system can undergo a phase change at a temperature when the adhesive film of the laminated assembly undergoes cross-linking, and the circulating working fluid after the phase change flows back to the heat pump system through the capillary core in the planar heat pipe.

8. The heat pump heating laminator coupled with flat plate heat pipe technology as claimed in claim 1, characterized in that: The heat pump system uses external waste heat as a heat source to improve economic and environmental benefits.

9. A heat pump heating lamination method coupled with flat plate heat pipe technology, used for the heat pump heating lamination machine coupled with flat plate heat pipe technology as claimed in claim 5, characterized in that: The following steps are involved: Component feeding stage: turn on the vacuum system, adjust the pressure of the lower chamber to atmospheric pressure and the upper chamber to a vacuum state, lay the components to be laminated in the high-temperature cloth, and put them into the lower chamber together, then the chamber lifting system drives the heating plate and the upper chamber to descend together until the silicone plate is tightly attached to the lower lamination frame and the lower chamber is sealed; Preheating and prepressing stage: keep the vacuum system turned on, adjust the lower chamber to a vacuum state, then increase the pressure in the upper chamber and make the final pressure less than the atmospheric pressure, so that the silicone plate performs preliminary pressurization on the component to be laminated, and at the same time start the heat pump system, control the temperature of the circulating medium to a temperature that matches the melting temperature of the film in the component to be laminated, and pre-bond and fix the component to be laminated under the initial heating and pressurization conditions to avoid displacement of the internal structure of the component to be laminated due to excessive pressurization and heating; Circulation heating stage: keep the vacuum system open, the lower chamber is still in a full vacuum state, adjust the upper chamber pressure to atmospheric pressure, and fully squeeze the component to be laminated with the silicone plate. At this time, the temperature of the circulating medium in the heat pump system is controlled to match the cross-linking temperature of the film in the component to be laminated. During the heating process, the feedback signal of the temperature sensor in the heat transfer plate is used to build a real-time temperature field of the component to be laminated. The heat pump system adjusts the circulating medium temperature of the edge heat pipe and the central heat pipe in real time according to the real-time temperature field of the component to be laminated, so as to avoid gaps or viscosity reduction in the component to be laminated due to uneven heating of the film. Component unloading stage: After the lamination process is completed, keep the vacuum system open, adjust the upper chamber to a full vacuum state, adjust the lower chamber pressure to atmospheric pressure, and the chamber lifting system drives the heating plate and the upper chamber to rise together, eventually making the silicone plate leave the lower lamination frame and take out the laminated components.

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