LED lamp bead and preparation method thereof, backlight module

Abstract

The present invention discloses an LED lamp bead and its preparation method, and a backlight module, which relate to the field of semiconductor optoelectronic devices. The LED lamp bead includes: a substrate; an LED chip, which is fixed on the substrate; a light distribution component, which is provided with a light distribution channel and a receiving hole; the light distribution component is fixedly connected to the substrate; the receiving hole and the substrate enclose a receiving cavity for receiving the LED chip; a light-scattering component, which is provided with multiple light outlets; the light-scattering component is fixedly connected to the light distribution component; one end of the light distribution channel is connected to the receiving cavity, and the other end is connected to the light outlet, so that the light emitted by the LED chip is distributed through the light distribution channel and then emitted through the light outlet. The implementation of the present invention can increase the light-emitting angle of the LED lamp bead.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor optoelectronic devices, and in particular to an LED lamp bead and a preparation method thereof, and a backlight module. Background Art

[0002] Conventional LEDs typically have good directionality (strong light at the center and weak light at the edges), but their narrow beam angle results in uneven light distribution, making them difficult to meet the need for uniform illumination over a wide area. On the other hand, existing display backlight modules typically consist of a substrate, LEDs, a lens, and a diffuser. The narrower the LED beam angle, the stronger the light intensity directly above the LED and the weaker the light intensity at the edges, resulting in alternating bright and dark light, or uneven light mixing. To address this, the spacing between the LEDs needs to be reduced so that the edges of the two LEDs overlap, achieving the same luminous intensity as directly above the LEDs. This reduction in LED spacing requires a larger number of LEDs. Furthermore, to achieve uniform light mixing without reducing the LED spacing, the distance between the LEDs and the diffuser (the light mixing distance) needs to be increased to allow the light from the edges of the LEDs to overlap further away. This results in a thicker backlight module. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a flip-chip LED lamp bead and a preparation method thereof, which can increase the light-emitting angle of the LED lamp bead.

[0004] Another technical problem to be solved by the present invention is to provide a backlight module.

[0005] In order to solve the above problems, the present invention discloses an LED lamp bead, which includes:

[0006] substrate;

[0007] An LED chip is fixed on the substrate;

[0008] A light distribution component having a light distribution channel and a receiving hole; the light distribution component is fixedly connected to the substrate; the receiving hole and the substrate enclose a receiving cavity for receiving the LED chip; and

[0009] a light-scattering component having a plurality of light outlets; the light-scattering component is fixedly connected to the light-distributing component;

[0010] One end of the light distribution channel is communicated with the accommodating cavity, and the other end is communicated with the light outlet, so that the light emitted by the LED chip is distributed through the light distribution channel and then emitted through the light outlet.

[0011] As an improvement to the above technical solution, the cross section of the light-scattering component is rectangular, and a plurality of light outlets are distributed in an array on its surface;

[0012] The light outlets are distributed along a first direction and / or a second direction of the light scattering component; the first direction is perpendicular to the second direction.

[0013] As an improvement to the above technical solution, the accommodating hole is hemispherical;

[0014] The longitudinal section of the light outlet is in an inverted trapezoidal shape.

[0015] As an improvement to the above technical solution, the light outlet includes a first light outlet and a second light outlet, wherein the projection of the first light outlet on the substrate is located inside the projection of the accommodating hole on the substrate; and the projection of the second light outlet on the substrate is located outside the projection of the accommodating hole on the substrate.

[0016] The light distribution channel includes a first light distribution channel and a second light distribution channel, the first light distribution channel is used to connect the first light outlet and the accommodating cavity, and the second light distribution channel is used to connect the second light outlet and the accommodating cavity;

[0017] The width of the first light distribution channel is maintained consistent from the side of the accommodating cavity to the side of the first light outlet, and the width of the second light distribution channel gradually increases from the side of the accommodating cavity to the side of the second light outlet.

[0018] As an improvement to the above technical solution, the accommodating hole and the light distribution channel are both filled with a fluorescent body formed by curing fluorescent glue;

[0019] The light outlet is filled with a diffuser formed by curing diffuser glue; the diffuser glue includes silicone resin and diffuser particles, and the content of the diffuser particles in the diffuser glue is 1wt%~5wt%; the diffuser particles are PMMA microspheres, PS microspheres or silicone resin particles.

[0020] Correspondingly, the present invention also discloses a method for preparing an LED lamp bead, which is used to prepare the above-mentioned LED lamp bead, and comprises:

[0021] forming a light outlet on the first substrate to obtain a light-scattering component;

[0022] forming a receiving hole and a light distribution channel on the second substrate to obtain a light distribution component;

[0023] Fixing the LED chip to the substrate to obtain a first intermediate;

[0024] The first intermediate body is fixedly connected to the light distribution component and the light scattering component to obtain an LED lamp bead.

[0025] As an improvement to the above technical solution, the step of forming a light outlet on the first substrate to obtain a light-scattering component includes:

[0026] providing a first substrate;

[0027] A plurality of light outlets penetrating the first substrate are formed on the first substrate to obtain a second intermediate;

[0028] forming a first adhesive layer on the surface of the second intermediate;

[0029] Filling the light outlet with astigmatism glue and curing it to form a light diffuser;

[0030] The first adhesive layer is removed to obtain a light-scattering component.

[0031] As an improvement to the above technical solution, the step of forming the accommodating hole and the light distribution channel on the second substrate to obtain the light distribution component includes:

[0032] providing a second substrate;

[0033] forming a receiving hole on one side of the second substrate;

[0034] forming a light distribution channel communicating with the accommodating hole on a side of the second substrate facing away from the accommodating hole to obtain a third intermediate;

[0035] A reflective layer is formed on the surfaces of the accommodating hole and the light distribution channel to obtain a light distribution component.

[0036] As an improvement to the above technical solution, the step of fixedly connecting the first intermediate body with the light distribution component and the light scattering component to obtain the LED lamp bead includes:

[0037] fixedly connecting the light-scattering component and the light-distributing component to obtain a fourth intermediate body;

[0038] injecting packaging glue or fluorescent glue into the receiving hole and the light distribution channel of the fourth intermediate body to obtain a fifth intermediate body;

[0039] forming a second adhesive layer on the substrate of the first intermediate to obtain a sixth intermediate;

[0040] The fifth intermediate and the sixth intermediate are bonded together, and the fluorescent glue or packaging glue is cured to obtain an LED lamp bead.

[0041] Correspondingly, the present invention also discloses a backlight module, which includes the above-mentioned LED lamp beads.

[0042] The implementation of the present invention has the following beneficial effects:

[0043] The LED lamp bead in one embodiment of the present invention includes a substrate, an LED chip, a light distribution component and a light scattering component. The light distribution component is provided with a receiving hole and a light distribution channel, which is fixedly connected to the substrate. The receiving hole and the substrate enclose a receiving cavity, and the LED chip is arranged in the receiving cavity. The light scattering component is fixedly connected to the light distribution component and is provided with a plurality of light outlets. One end of the light distribution channel is connected to the receiving cavity, and the other end is connected to the light outlet. Based on the above structure, the light emitted by the LED chip can be distributed to the light outlet through the light distribution channel, which forms a surface light source with uniform light output, thereby effectively improving the lighting effect. At the same time, the number of LED chips used in the backlight module based on the LED lamp bead is reduced, and the cost and power consumption of the backlight module are reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 Schematic diagram of the cross-sectional structure of an LED lamp bead in one embodiment of the present invention;

[0045] Figure 2 1 is a schematic top view of the structure of a light-scattering component in one embodiment of the present invention;

[0046] Figure 3 2 is a schematic cross-sectional view of the second intermediate after step S14 in one embodiment of the present invention;

[0047] Figure 4 This is a schematic cross-sectional view of the third intermediate after step S23 in one embodiment of the present invention;

[0048] Figure 5 2 is a schematic cross-sectional view of the fifth intermediate after step S42 in one embodiment of the present invention;

[0049] Figure 6 It is a schematic diagram of the principle of bonding the fifth intermediate and the sixth intermediate in step S44 in one embodiment of the present invention.

[0050] In the figure, 1 is a substrate, 2 is an LED chip, 3 is a light distribution component, 31 is a receiving hole, 32 is a light distribution channel, 321 is a first light distribution channel, 322 is a second light distribution channel, 4 is a light scattering component, 41 is a light outlet, 411 is a first light outlet, 412 is a second light outlet, 5 is a receiving cavity, 6 is a phosphor, 7 is a light scattering body, 110 is a first base material, 120 is a first adhesive layer, 200 is a second base material, 300 is a fifth intermediate, 400 is a sixth intermediate, and 410 is a second adhesive layer. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solutions and advantages of the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. In addition, it should be understood that the specific embodiments described herein are merely used to explain the present application and are not intended to limit the present application.

[0052] In the description of this application, it should be understood that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.

[0053] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the described features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0054] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0055] See also Figure 1One embodiment of the present invention discloses an LED lamp bead, which includes a substrate 1, an LED chip 2, a light distribution component 3 and a light scattering component 4. The light distribution component 3 is provided with a receiving hole 31 and a light distribution channel 32. One side of the light distribution component 3 is fixedly connected to the substrate 1, and the receiving hole 31 and the substrate 1 are enclosed to form a receiving cavity 5, and the LED chip 2 is arranged in the receiving cavity 5. The other side of the light distribution component 3 is fixedly connected to the light scattering component 4, and the light scattering component 4 is provided with a plurality of light outlets 41. One end of the light distribution channel 32 is connected to the receiving cavity 5, and the other end is connected to the light outlet 41. Based on the above structure, the light emitted by the LED chip 2 can be distributed to the light outlet 41 through the light distribution channel 32, which forms a surface light source with uniform light output, thereby effectively improving the lighting effect. At the same time, the number of LED chips 2 used in the backlight module based on the LED lamp bead is reduced, and the cost and power consumption of the backlight module are reduced.

[0056] Specifically, substrate 1 is a BT substrate, FR-4 substrate, or ceramic substrate commonly used in the art, but is not limited thereto. LED chip 2 can be a blue LED chip, a green LED chip, a red LED chip, or a violet LED chip, but is not limited thereto. Preferably, LED chip 2 is a blue LED chip, which has the characteristics of high brightness and low energy consumption.

[0057] Specifically, the light distribution component 3 is made of materials such as PMMA (polymethyl methacrylate), PC (polycarbonate), and PS (polystyrene). To ensure effective light distribution, the light distribution component 3 can be made entirely of a highly reflective material, or a reflective layer (not shown) can be provided on the surfaces of the light distribution channel 32 and the receiving hole 31 of the light distribution component 3. This reflective layer can be a white paint layer or a metal layer to increase light reflectivity and thus enhance the brightness of the LED lamp beads. Preferably, in some embodiments, the light distribution component 3 is a highly reflective PC sheet material produced by melt extrusion after adding reflective fillers (such as TiO2 or aluminum powder) to the PC raw material. Furthermore, the light distribution channel 32 and the receiving hole 31 are both provided with a reflective layer. This reflective layer is an Al metal layer deposited by chemical vapor deposition, which further enhances light utilization.

[0058] Specifically, the receiving hole 31 is defined on one side of the light distribution component 3. Its depth is less than the thickness of the light distribution component 3 to ensure that light emitted by the LED chip 2 is distributed through the light distribution channel 32. The longitudinal cross-section of the receiving hole 31 can be, but is not limited to, rectangular, semicircular (or nearly semicircular), elliptical, arched, or trapezoidal. The cross-section of the receiving hole 31 can be, but is not limited to, rectangular, circular, or elliptical. It should be noted that the longitudinal cross-section in this disclosure refers to a cross-section along the thickness of the substrate 1 (or LED chip 2), while the cross-section refers to a cross-section parallel to the plane of the substrate 1. The size, cross-section, and longitudinal cross-section of the receiving hole 31 can be determined based on factors such as the number of LED chips 2 and the layout of the connecting circuits. In some embodiments, the LED lamp bead includes three LED chips 2: a red LED chip, a green LED chip, and a blue LED chip. The receiving hole 31 is generally hemispherical in shape, meaning that its cross-section is circular and its longitudinal cross-section is semicircular.

[0059] Specifically, the LED chip 2 is disposed within the housing cavity 5 formed by the housing hole 31 and the substrate 1 and secured thereto by welding or bonding. The interior of the housing cavity 5 may also be filled with encapsulating glue or fluorescent glue to enhance the light efficiency and protect the chip. Preferably, in some embodiments, both the housing cavity 5 and the light distribution channel 32 are filled with a phosphor 6 formed by curing the fluorescent glue.

[0060] Specifically, one end of the light distribution channel 32 is connected to the receiving hole 31, and the other end is connected to the light outlet 41. The inner wall of the channel is smooth and is provided with a reflective layer to reduce light loss. The shape, number and distribution position of the light distribution channel 32 can be set according to specific application requirements. In some embodiments, the longitudinal section of the light distribution channel 32 is linear, and the multiple light distribution channels 32 are radially distributed, that is, the multiple light distribution channels 32 extend radially from the center of the receiving hole 31 to the surrounding area. This distribution method can improve the uniformity of light distribution. Specifically, the cross-section of the light distribution channel 32 may be circular or elliptical, but is not limited thereto. Preferably, in some embodiments, the receiving hole 31 is hemispherical, and the spacing between one ends of the multiple light distribution channels 32 is evenly distributed on the spherical surface of the receiving hole 31.

[0061] Specifically, the light-scattering component 4 can be made of materials such as PMMA, PC, and PS. A light outlet 41 is provided on the surface of the light-scattering component 4 to allow light to escape. The light outlet 41 can be a solid, light-transmissive structure in the shape of a concave lens, or it can be a through-hole structure, but is not limited to these. Furthermore, to prevent light leakage, the light-scattering component 4 can reflect light other than that directed toward the light outlet 41. For example, a highly reflective filler can be used to design the light-scattering component 4 as a whole with a high reflectivity, or a reflective layer can be provided on the side of the light outlet. The light-scattering component 4 is generally plate-shaped, with a cross-section that can be circular, elliptical, or rectangular, depending on the shape of the substrate 1 and the number and shape of the LED chips 2. Preferably, in some embodiments, the light outlet 41 is filled with a diffuser 7 formed by curing a light-scattering adhesive. The light-scattering adhesive comprises a silicone resin and light-scattering particles, with the light-scattering particles comprising 1 wt% to 5 wt%. The light-scattering particles can be PMMA microspheres, PS microspheres, or silicone resin particles. The main function of the diffuser 7 is to make the light distribution more uniform through refraction and scattering, thereby improving the display effect.

[0062] Specifically, depending on the light distribution requirements, the cross-section of the light outlet 41 can be circular, elongated, square, or wavy, but is not limited to these. The longitudinal cross-section of the light outlet 41 can be rectangular or trapezoidal, but is not limited to these. Preferably, in some embodiments, the longitudinal cross-section of the light outlet 41 is an inverted trapezoidal shape, which can further optimize the light diffusion effect and prevent glare; it can also improve light uniformity and optimize the display effect.

[0063] Preferably, in some embodiments, see Figure 2 The light-diffusing component 4 has a rectangular cross-section and is arrayed with multiple light outlets 41 along its surface. These outlets 41 are distributed along a first direction (lengthwise) and / or a second direction (widthwise) of the light-diffusing component 4; the first direction is perpendicular to the second direction. This distribution further increases the LED's beam angle.

[0064] Preferably, in some embodiments, see Figure 1The light outlet 41 includes a first light outlet 411 and a second light outlet 412. The projection of the first light outlet 411 on the substrate 1 is located inside the projection of the accommodating hole 31 on the substrate 1; the projection of the second light outlet 412 on the substrate 1 is located outside the projection of the accommodating hole 31 on the substrate 1; the light distribution channel 32 includes a first light distribution channel 321 and a second light distribution channel 322. The first light distribution channel 321 is used to connect the first light outlet 411 with the accommodating cavity 5, and the second light distribution channel 322 is used to connect the second light outlet 412 with the accommodating cavity 5. The width of the first light distribution channel 321 remains consistent from the side of the accommodating cavity 5 to the side of the first light outlet 411, and the width of the second light distribution channel 322 gradually increases from the side of the accommodating cavity 5 to the side of the second light outlet 412. Through this design, not only the light distribution is effectively controlled, but also the overall brightness and color uniformity are significantly improved, ensuring high-quality display effects at different viewing angles.

[0065] Correspondingly, the present invention also discloses a method for preparing an LED lamp bead, which is used to prepare the above-mentioned LED lamp bead, and specifically comprises the following steps:

[0066] S1: forming a light outlet on a first substrate to obtain a light-scattering component;

[0067] Specifically, the first substrate 110 can be a substrate with high reflectivity as a whole, such as a PC sheet produced by melt extrusion after adding reflective fillers (such as TiO2, aluminum powder, etc.) to PC resin; it can also be a PMMA material with high light transmittance.

[0068] Specifically, forming the light outlet 41 may refer to opening a hole in the first substrate 110 to form a through hole penetrating the first substrate 110 ; it may also refer to forming a concave lens structure at some positions by controlling the shape of the mold during the molding process to disperse light, but is not limited thereto.

[0069] Preferably, in some embodiments, step S1 includes:

[0070] S11: providing a first substrate;

[0071] Specifically, the first substrate 110 is a PC board with high reflectivity, which is prepared by a melt extrusion process.

[0072] S12: Opening a plurality of light outlets penetrating the first substrate on the first substrate to obtain a second intermediate;

[0073] Specifically, a hole is drilled on the first substrate 110 to form the light outlet 41 .

[0074] S13: forming a first adhesive layer on the surface of the second intermediate;

[0075] Specifically, the first adhesive layer 120 is a UV film, but is not limited thereto. Figure 3 The first adhesive layer 120 covers one side of the second intermediate body. More specifically, when the longitudinal section of the light outlet 41 is an inverted trapezoid, the first adhesive layer 120 covers one side of its short bottom. By forming a UV film, it can prevent the light outlet 41 from overflowing during the injection of the diffuser glue, thereby optimizing the specific morphology of the diffuser.

[0076] S14: Filling the light outlet with astigmatism glue and curing it to form a astigmatism body;

[0077] Specifically, the astigmatism adhesive is a transparent resin containing astigmatism particles. The transparent resin may be, but is not limited to, epoxy resin or silicone resin. The astigmatism particles may be, but are not limited to, silica particles, barium sulfate particles, PMMA microspheres, PS microspheres, or silicone resin particles. Preferably, in some embodiments, the astigmatism adhesive includes silicone resin and astigmatism particles, with the content of the astigmatism particles in the astigmatism adhesive being 1-5wt%. The astigmatism particles may be PMMA microspheres, PS microspheres, or silicone resin particles.

[0078] After the light outlet 41 is filled with the diffusion glue, it can be cured by UV irradiation, high temperature curing, etc., but is not limited thereto. Preferably, in some embodiments, curing is achieved by baking at 120° C. to 150° C. for 1 hour to 2 hours.

[0079] S15: removing the first adhesive layer to obtain a light-scattering component.

[0080] S2: forming a receiving hole and a light distribution channel on the second substrate to obtain a light distribution component;

[0081] Specifically, the second substrate 200 can be a substrate with high reflectivity as a whole, such as a PC sheet produced by melt extrusion process after adding reflective fillers (such as TiO2, aluminum powder, etc.) to PC resin; it can also be a PMMA material with high light transmittance.

[0082] Specifically, the accommodating hole 31 and the light distribution channel 32 may be formed by a cutting process, for example, by a laser cutting process, but is not limited thereto.

[0083] Preferably, in some embodiments, step S2 includes:

[0084] S21: providing a second substrate;

[0085] Specifically, the second substrate 200 is a PC board with high reflectivity, which is prepared by a melt extrusion process.

[0086] S22: forming a receiving hole on one side of the second substrate;

[0087] Specifically, the receiving hole 31 is formed on the second substrate 200 by a laser cutting process, but is not limited thereto.

[0088] S23: forming a light distribution channel on a side of the second substrate facing away from the receiving hole, with one end connected to the receiving hole, to obtain a third intermediate;

[0089] Specifically, the light distribution channel 32 can be formed by mechanical drilling, laser cutting and other processes, but is not limited thereto. The structure of the third intermediate obtained in this step is as follows: Figure 4 shown.

[0090] S24: forming a reflective layer on the surfaces of the receiving hole and the light distribution channel;

[0091] Specifically, the entire third intermediate body can be immersed in reflective coating to form a reflective layer (not shown in the figure), or a reflective layer can be deposited on the inner surface of the receiving hole 31 and the light distribution channel 32 by chemical vapor deposition, but is not limited thereto.

[0092] S3: Fixing the LED chip to the substrate to obtain a first intermediate;

[0093] Specifically, the LED chip 2 can be fixed on the substrate 1 by welding or conductive adhesive bonding, but is not limited thereto.

[0094] It should be noted that, in the present invention, steps S1, S2, and S3 are not prioritized and can be performed simultaneously or sequentially in any order, but are not limited thereto.

[0095] S4: The first intermediate body is fixedly connected to the light distribution component and the light scattering component to obtain an LED lamp bead.

[0096] Specifically, the first intermediate body may be connected to the light distribution component and the light scattering component in sequence, but is not limited thereto. Preferably, in some embodiments, step S4 includes:

[0097] S41: fixedly connecting the light-scattering component and the light-distributing component to obtain a fourth intermediate body;

[0098] Specifically, adhesive may be coated on the surface of the light-scattering component, and then the light-scattering component is bonded to the light distribution component 3 , but the present invention is not limited thereto.

[0099] S42: injecting packaging glue or fluorescent glue into the receiving hole and the light distribution channel of the fourth intermediate body to obtain a fifth intermediate body;

[0100] Specifically, in some embodiments, fluorescent glue or packaging glue is injected into the receiving hole 31 and the light distribution channel 32 of the fourth intermediate body to obtain the fifth intermediate body 300. The structure of the fifth intermediate body 300 is as follows: Figure 5 shown.

[0101] S43: forming a second adhesive layer on the substrate of the first intermediate to obtain a sixth intermediate;

[0102] Specifically, see Figure 6 , the second adhesive layer 410 is distributed in the area outside the receiving hole 31 .

[0103] S44: Bond the fifth intermediate and the sixth intermediate, and solidify the fluorescent glue or the packaging glue to obtain the LED lamp bead.

[0104] Specifically, see Figure 6 The sixth intermediate body 400 and the fifth intermediate body 300 are bonded together by a second adhesive layer 410 provided on the sixth intermediate body 400 , but the present invention is not limited thereto.

[0105] Preferably, in some embodiments, after curing is completed, the method further includes cutting the obtained LED lamp beads into individual lamp beads, but is not limited thereto.

[0106] Accordingly, the present invention also discloses a backlight module comprising the aforementioned LED lamp beads and a backplate for supporting and securing the LED lamp beads. Specifically, the LED lamp beads of the present invention can achieve a light emission angle exceeding 170°, which significantly reduces the thickness of the backlight module and eliminates the need for lenses.

[0107] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0108] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A method for preparing LED lamp beads, characterized in that: include: A light outlet is formed on a first substrate to obtain a light-scattering component; wherein the first substrate is a PC sheet prepared by a melt extrusion process; the light outlet is filled with a light-scattering body formed by curing a light-scattering adhesive; the light-scattering adhesive comprises a silicone resin and light-scattering particles, the light-scattering particles being present in the light-scattering adhesive at a content of 1 wt% to 5 wt%; the light-scattering particles are PMMA microspheres, PS microspheres, or silicone resin particles; A light distribution component is obtained by forming a receiving hole and a light distribution channel on a second substrate; wherein the second substrate is a PC sheet prepared by a melt extrusion process, and the receiving hole and the light distribution channel are formed by a laser cutting process; the receiving hole and the light distribution channel are both filled with a phosphor formed by solidifying a fluorescent glue; a reflective layer is provided on the surface of the light distribution channel and the receiving hole; and a plurality of the light distribution channels extend radially around the receiving hole. Fixing the LED chip to the substrate to obtain a first intermediate; The first intermediate body is fixedly connected to the light distribution component and the light scattering component to obtain an LED lamp bead; Among them, the accommodating hole and the substrate are combined to form an accommodating cavity for accommodating the LED chip; one end of the light distribution channel is connected to the accommodating cavity, and the other end is connected to the light outlet, so that the light emitted by the LED chip is distributed through the light distribution channel and then emitted through the light outlet.

2. The method for preparing an LED lamp bead according to claim 1, wherein: The cross section of the light-scattering component is rectangular, and a plurality of light outlets are distributed in an array on its surface; The light outlets are distributed along a first direction and / or a second direction of the light scattering component; the first direction is perpendicular to the second direction.

3. The method for preparing an LED lamp bead according to claim 2, wherein: The accommodating hole is hemispherical; the longitudinal section of the light outlet is in an inverted trapezoidal shape.

4. The method for preparing an LED lamp bead according to claim 3, wherein: The light outlet includes a first light outlet and a second light outlet, wherein the projection of the first light outlet on the substrate is located inside the projection of the accommodating hole on the substrate; and the projection of the second light outlet on the substrate is located outside the projection of the accommodating hole on the substrate; The light distribution channel includes a first light distribution channel and a second light distribution channel, the first light distribution channel is used to connect the first light outlet and the accommodating cavity, and the second light distribution channel is used to connect the second light outlet and the accommodating cavity; The width of the first light distribution channel is maintained consistent from the side of the accommodating cavity to the side of the first light outlet, and the width of the second light distribution channel gradually increases from the side of the accommodating cavity to the side of the second light outlet.

5. The method for preparing an LED lamp bead according to claim 1, wherein: The step of forming a light outlet on the first substrate to obtain a light-scattering component includes: providing a first substrate; Opening a plurality of light outlets penetrating the first substrate on the first substrate to obtain a second intermediate; forming a first adhesive layer on the surface of the second intermediate; Filling the light outlet with astigmatism glue and curing it to form a light diffuser; The first adhesive layer is removed to obtain a light-scattering component.

6. The method for preparing an LED lamp bead according to claim 1, wherein: The step of forming the accommodating hole and the light distribution channel on the second substrate to obtain the light distribution component includes: providing a second substrate; forming a receiving hole on one side of the second substrate; forming a light distribution channel communicating with the accommodating hole on a side of the second substrate facing away from the accommodating hole to obtain a third intermediate; A reflective layer is formed on the surfaces of the accommodating hole and the light distribution channel to obtain a light distribution component.

7. The method for preparing an LED lamp bead according to claim 1, wherein: The step of fixedly connecting the first intermediate body with the light distribution component and the light scattering component to obtain the LED lamp bead comprises: fixedly connecting the light-scattering component and the light-distributing component to obtain a fourth intermediate body; injecting packaging glue or fluorescent glue into the receiving hole and the light distribution channel of the fourth intermediate body to obtain a fifth intermediate body; forming a second adhesive layer on the substrate of the first intermediate to obtain a sixth intermediate; The fifth intermediate and the sixth intermediate are bonded together, and the fluorescent glue or packaging glue is cured to obtain an LED lamp bead.

8. An LED lamp bead, characterized in that: The LED lamp bead is prepared by the preparation method according to any one of claims 1 to 7.

9. A backlight module, characterized in that: It includes the LED lamp bead as claimed in claim 8.

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