Transfer device, manufacturing method of light-emitting panel and light-emitting panel

Abstract

The invention discloses a transfer device, a manufacturing method of a light-emitting panel and the light-emitting panel. The transfer device comprises a slurry containing part, a clamping body part and a limiting unit, the slurry containing part is provided with a containing cavity used for containing color conversion slurry, and the containing cavity is provided with a discharging port; the clamping main body part is connected to the side, provided with the discharging opening, of the slurry containing part, the clamping main body part is matched with the slurry containing part to form a clamping groove communicating with the discharging opening, and the color conversion slurry in the containing cavity is allowed to enter the clamping groove through the discharging opening; the limiting unit is connected to one side, facing the clamping groove, of the clamping main body part, and the limiting unit is used for limiting the chip unit located in the clamping groove. The transfer device sprays the color conversion slurry on the chip unit to manufacture the color conversion layer while transferring the chip unit, so that the steps of additionally manufacturing the color conversion layer and transferring the color conversion layer to be aligned and adhered to the chip unit are not needed, the technological process is simplified, and it is guaranteed that the color conversion slurry is accurately sprayed on the surface of the chip unit.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and particularly to a transfer device, a manufacturing method of a light-emitting panel, and a light-emitting panel. Background Art

[0002] With the development of display technology, MiniLED and MicroLED display devices have begun to be applied. Usually, a color conversion layer needs to be fabricated on a light-emitting chip through photolithography, printing, etc. to obtain LED chips with different light-emitting colors. At the same time, a large number of LED chips need to be transferred and assembled to manufacture a display device, and the entire process is relatively complex.

[0003] Currently, the entire process of manufacturing LED chips with different light-emitting colors and transferring a large number of chips is relatively complex, and the manufacturing efficiency needs to be improved. Therefore, it is necessary to simplify its manufacturing process to improve the efficiency. Summary of the Invention

[0004] In order to solve the above technical problems existing in the prior art, the present application provides a transfer device, a manufacturing method of a light-emitting module, and a light-emitting panel.

[0005] To solve the above problems, the present application provides a transfer device. The transfer device includes a slurry accommodating portion, a clamping main body portion, and a limiting unit. The slurry accommodating portion has an accommodating cavity for accommodating color conversion slurry, and the accommodating cavity is provided with a discharge port. The clamping main body portion is connected to the side of the slurry accommodating portion having the discharge port. The clamping main body portion and the slurry accommodating portion cooperate to form a clamping groove communicating with the discharge port to allow the color conversion slurry in the accommodating cavity to enter the clamping groove through the discharge port. The limiting unit is connected to the side of the clamping main body portion facing the clamping groove, and the limiting unit is used for limiting the chip unit located in the clamping groove.

[0006] Further, the limiting unit is annular and disposed around the discharge port.

[0007] Further, the limiting unit includes at least a pair of limiting unit groups, and each pair of limiting unit groups includes two sub-limiting units that are opposite and spaced apart.

[0008] Further, the transfer device further includes a control circuit, and the control circuit is connected between the clamping main body portion and the slurry accommodating portion. The control circuit is used for controlling the limiting unit to limit the chip unit.

[0009] Further, the transfer device further includes a pressurizing unit, and the pressurizing unit is connected to the slurry accommodating portion. The pressurizing unit is used for compressing the accommodating cavity to enable the color conversion slurry in the accommodating cavity to enter the clamping groove through the discharge port.

[0010] Further, a plurality of the accommodation cavities are formed in the slurry accommodation part at intervals, a plurality of the clamping grooves are formed in the clamping main body part in cooperation with the slurry accommodation part, each clamping groove communicates with the discharge port of one of the accommodation cavities, the number of the limiting units is plural, each limiting unit is respectively connected to the clamping main body part, and at least one limiting unit is arranged in each clamping groove.

[0011] To solve the above problems, the present application provides a manufacturing method of a light-emitting panel. The manufacturing method includes: in response to the transfer device being located at the clamping station, controlling the limiting unit of the transfer device to limit the chip unit located in the clamping groove; applying the color conversion slurry in the accommodation cavity of the slurry accommodation part to the chip unit through the discharge port to form a color conversion layer; in response to the transfer device moving from the clamping station to the processing station, controlling the limiting unit to release the limiting state of the chip unit, wherein, at the processing station, the chip unit and the electrodes of the target substrate are conductively connected.

[0012] Among them, the step of applying the color conversion slurry in the accommodation cavity of the slurry accommodation part to the chip unit through the discharge port to form a color conversion layer includes: controlling the pressurizing unit of the transfer device to compress the accommodation cavity, so that the color conversion slurry in the accommodation cavity is applied to the chip unit through the discharge port to form a color conversion layer.

[0013] Among them, the manufacturing method includes: filling the accommodation cavity with the color conversion slurry, wherein the color conversion slurry includes a color conversion material, an adhesion glue and anchoring particles.

[0014] To solve the above problems, the present application provides a light-emitting panel. The light-emitting panel includes a target substrate, a chip unit and a color conversion layer, and the light-emitting panel is obtained by the above manufacturing method.

[0015] Different from the prior art, the transfer device of the present application includes a slurry accommodating part, a clamping main body part, and a limiting unit. The slurry accommodating part has an accommodating cavity for accommodating color conversion slurry, and the accommodating cavity is provided with a discharge port; the clamping main body part is connected to the side of the slurry accommodating part where the discharge port is located, and the clamping main body part and the slurry accommodating part cooperate to form a clamping groove communicating with the discharge port to allow the color conversion slurry in the accommodating cavity to enter the clamping groove through the discharge port; the limiting unit is connected to the side of the clamping main body part facing the clamping groove, and the limiting unit is used to limit the chip unit located in the clamping groove. Through the above embodiments, the limiting unit changes the size of the clamping groove, thereby limiting and clamping the side wall of the chip unit on the side wall of the clamping groove. The color conversion slurry in the accommodating cavity enters the clamping groove through the discharge port, so that the color conversion slurry can be sprayed on the surface of the chip unit through the discharge port, enabling the transfer device to spray the color conversion slurry on the chip unit while transferring the chip unit to form a color conversion layer, thus eliminating the need for additional steps of manufacturing the color conversion layer and aligning and adhering the color conversion layer to the chip unit. This greatly simplifies the process and ensures the accurate spraying of the color conversion slurry on the surface of the chip unit. Brief Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0017] Figure 1 It is a schematic structural diagram of the first embodiment of the transfer device provided by the present application;

[0018] Figure 2 is Figure 1 A schematic structural diagram of the transfer device shown in the working state;

[0019] Figure 3 It is a schematic bottom view structural diagram of the first embodiment of the transfer device provided by the present application;

[0020] Figure 4 It is a schematic bottom view structural diagram of the second embodiment of the transfer device provided by the present application

[0021] Figure 5 It is a schematic bottom view structural diagram of the third embodiment of the transfer device provided by the present application;

[0022] Figure 6 It is a schematic structural diagram of the fourth embodiment of the transfer device provided by the present application;

[0023] Figure 7 It is a schematic flowchart of an embodiment of the method for manufacturing a light-emitting panel provided by the present application;

[0024] Figure 8 It is a schematic diagram of the process of an embodiment of the method for manufacturing a light-emitting panel provided by this application;

[0025] Figure 9 It is a schematic diagram of a partial structure of a light-emitting panel obtained by using the method for manufacturing a light-emitting panel provided by this application.

[0026] Reference numerals in the drawings: transfer device 1; slurry accommodating part 10; accommodating cavity 110; discharge port 120; clamping main body part 20; limiting unit 210; limiting unit group 2110; sub-limiting unit 2111; clamping groove 30; control circuit 40; pressurizing unit 50; chip unit 2; target substrate 3; electrode 31; color conversion slurry 4. Detailed implementation manners

[0027] The following will further describe this application in detail in conjunction with the drawings and embodiments. It should be specifically noted that the following embodiments are only used to illustrate this application, but do not limit the scope of this application. Similarly, the following embodiments are only partial embodiments of this application rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

[0028] Referring to "embodiment" in this text means that the specific features, structures or characteristics described in combination with the embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0029] In the description of this application, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "setting", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

[0030] With the development of display technology, micro light-emitting diodes (MiniLED) and MicroLED display devices have begun to be applied. Usually, a color conversion layer needs to be fabricated on a light-emitting chip through photolithography, printing, etc. to obtain LED chips with different emission colors. At the same time, a large number of LED chips need to be transferred and assembled to manufacture a display device, and the entire process is relatively complex.

[0031] At present, the whole process of manufacturing LED chips with different emission colors and transferring a large number of chips is relatively complex, and the production efficiency needs to be improved. Therefore, it is necessary to simplify its manufacturing process to improve the efficiency.

[0032] To solve the related technical problems, the present application provides a transfer device. Refer to Figure 1 and Figure 2 , Figure 1 which is a schematic structural diagram of the first embodiment of the transfer device provided by the present application, Figure 2 and Figure 1 which is a schematic structural diagram of the transfer device shown in the working state.

[0033] The transfer device 1 includes a slurry accommodating part 10 and a clamping main body part 20. The slurry accommodating part 10 has an accommodating cavity 110 for accommodating the color conversion slurry 4, and the accommodating cavity 110 is provided with a discharge port 120; the clamping main body part 20 is connected to one side of the slurry accommodating part 10 where the discharge port 120 is located. The clamping main body part 20 and the slurry accommodating part 10 cooperate to form a clamping groove 30 communicating with the discharge port 120, so as to allow the color conversion slurry 4 in the accommodating cavity 110 to enter the clamping groove 30 through the discharge port 120; the limiting unit 210 is connected to the side of the clamping main body part 20 facing the clamping groove 30, and the limiting unit 210 is used to limit the chip unit 2 located in the clamping groove 30.

[0034] The transfer device 1 can limit and clamp the chip unit 2 by the expansion of the limiting unit 210, and the transfer device 1 can apply the color conversion slurry 4 to the chip unit 2 in the clamping groove 30 through the discharge port 120. The clamping main body part 20 is located below the slurry accommodating part 10, and it has left and right parts located on both sides of the slurry accommodating part 10. The discharge port 120 is located at the bottom wall of the clamping groove 30, and the limiting unit 210 is located on the two side walls of the clamping groove 30, and there is a certain interval between the limiting unit 210 and the bottom of the slurry accommodating part 10, so as to prevent the expansion of the limiting unit 210 from affecting the discharge port 120. When the limiting unit 210 expands, the size of the clamping groove 30 can be reduced, so as to limit and clamp the chip unit 2 located in the clamping groove 30. When the limiting unit 210 contracts and returns, the size of the clamping groove 30 becomes larger, and then the chip unit 2 is released. The limiting unit 210 changes the size of the clamping groove 30 through deformation (expansion or contraction) to limit and clamp or limit and release the chip unit 2. The limiting unit 30 can adopt electrostrictive materials (such as lead zirconate titanate ceramics, generating deformation by energizing and de-energizing), magnetostrictive materials (such as nickel-based alloy magnetostrictive materials, generating a magnetic field by energizing and deforming through the magnetic field), photoinduced electrostrictive materials (such as lead vanadate ceramics, generating deformation by absorbing light sources), etc., as long as it can generate deformation to change the size of the clamping groove 30.

[0035] Through the above embodiments, the limiting unit 210 expands to change the size of the clamping groove 30, thereby limiting and clamping the side surface of the chip unit 2 on the side wall of the clamping groove 30. The color conversion slurry 4 in the accommodation cavity 110 enters the clamping groove 30 through the discharge port 120, so that the color conversion slurry 4 can be sprayed on the surface of the chip unit 2 through the discharge port 120, enabling the transfer device 1 to spray the color conversion slurry 4 on the surface of the chip unit 2 while transferring the chip unit 2 to form a color conversion layer. Thus, there is no need for additional steps of fabricating the color conversion layer and aligning and adhering the transferred color conversion layer to the chip unit 2, which greatly simplifies the process and ensures the precise spraying of the color conversion slurry 4 on the surface of the chip unit 2.

[0036] See Figure 3 、 Figure 4 and Figure 5 , Figure 3 is a schematic bottom view structure diagram of the first embodiment of the transfer device 1 provided by the present application, Figure 4 is a schematic bottom view structure diagram of the second embodiment of the transfer device 1 provided by the present application, Figure 5 is a schematic bottom view structure diagram of the third embodiment of the transfer device 1 provided by the present application.

[0037] Furthermore, the limiting unit 210 is annular and disposed around the discharge port 120, that is, the limiting unit 210 surrounds the side wall of the clamping groove 30, enabling the transfer device 1 to clamp the side surface of the chip unit 2. The top surface of the chip unit 2 is arranged parallel and spaced from the bottom wall of the clamping groove 30, that is, the top surface of the chip unit 2 is parallel and spaced from the discharge port 120, allowing the transfer device 1 to spray the color conversion slurry 4 onto the top surface of the chip unit 2 through the discharge port 120.

[0038] The limiting unit 210 includes at least a pair of limiting unit groups 2110, and each pair of limiting unit groups 2110 includes two sub-limiting units 2111 that are opposite and spaced apart. That is, the limiting unit groups 2110 are disposed on two opposite side walls of the clamping groove 30. The limiting unit groups 2110 can be one pair, two pairs, etc. In one embodiment, one pair of limiting unit groups 2110 is disposed on two opposite side walls of the clamping groove 30. In another embodiment, two pairs of limiting unit groups 2110 are spaced apart on the four side walls of the clamping groove 30. Of course, multiple limiting unit groups 2110 can also be connected to each other and disposed around the side wall of the clamping groove 30, which makes the limiting and clamping of the chip unit 2 more stable. The chip unit 2 has electrode pins, and the size of the limiting unit 210 in the direction of the side wall of the clamping groove 30 is set to be smaller than the thickness of the chip unit 2 excluding the electrode pins, so that the limiting unit 210 acts on the side surface of the chip unit 2, preventing the limiting unit 210 from expanding onto the surface of the chip unit 2 and thus avoiding affecting the spraying of the color conversion slurry 4 on the top surface of the chip unit 2.

[0039] The transfer device 1 further includes a control circuit 40, which is connected between the clamping main body 20 and the slurry accommodating part 10. The control circuit 40 is used to control the limiting of the limiting unit 210. The control circuit 40 is electrically connected to the limiting unit 210 and is clamped between the bottom of the slurry accommodating part 10 and the limiting unit 210. By energizing and de-energizing the limiting unit 210 through the control circuit 40, the limiting unit 210 expands or contracts to achieve the limiting clamping or limiting release of the chip unit 2. It should be noted that in order for the transfer device 1 to better clamp and release the chip unit 2, the maximum size of the clamping groove 30 (before the limiting unit 210 expands) is larger than the size of the chip unit 2, and the maximum size of the clamping groove 30 can be set within the range from the size of the chip unit 2 to 1.2 times the size of the chip unit 2; the minimum size of the clamping groove 30 (after the limiting unit 210 is fully expanded) should be smaller than the size of the chip unit 2 so that the clamping main body 20 can apply a clamping force to the chip unit 2, and the minimum size of the clamping groove 30 can be set between 0.8 times the size of the chip unit 2 and the size of the chip unit.

[0040] The transfer device 1 further includes a pressurizing unit 50, which is connected to the slurry accommodating part 10. The pressurizing unit 50 is used to compress the accommodating cavity 110 so that the color conversion slurry 4 in the accommodating cavity 110 enters the clamping groove 30 through the discharge port 120. Preferably, the pressurizing unit 50 is arranged above the accommodating cavity 110 opposite to the discharge port 120. The pressurizing unit 50 can also be set as an electrostrictive material, which expands by electrifying to compress the color conversion slurry 4 in the accommodating cavity 110 so that the color conversion slurry 4 sprays out through the discharge port 120; the pressurizing unit 50 can also be set as an electrically controlled slider, which compresses the accommodating cavity 110 through circuit control. It should be noted that the size of the discharge port 120 is small. Without the action of external force when the pressurizing unit 50 does not work, the color conversion slurry 4 at the discharge port 120 will not drip from the discharge port 120 because the intermolecular force is greater than its own gravity, similar to the capillary principle. The number of the discharge ports 120 is multiple, and they are arranged at equal intervals on the bottom wall of the clamping groove 30 so that the color conversion slurry 4 can be sprayed more evenly on the top surface of the chip unit 2.

[0041] See Figure 6 , Figure 6 is a schematic structural diagram of the fourth embodiment of the transfer device provided by the present application.

[0042] In some embodiments, the slurry accommodating part 10 is formed with a plurality of accommodating cavities 110 arranged at intervals, the clamping main body 20 cooperates with the slurry accommodating part 10 to form a plurality of clamping grooves 30, each clamping groove 30 communicates with the discharge port 120 of one accommodating cavity 110, the number of the limiting units 210 is multiple, each limiting unit 210 is respectively connected to the clamping main body 20, and each clamping groove 30 has at least one limiting unit 210.

[0043] By providing a plurality of clamping grooves 30, the transfer device 1 can clamp and transfer multiple chip units 2 at one time. The number of clamping grooves 30 can be 3, 4, 5, etc.; each clamping groove 30 is correspondingly arranged with a discharge port 120 and a receiving cavity 110, and each limiting unit 210 is arranged on the side wall of each clamping groove 30. Multiple chip units 2 are usually arranged at intervals on a substrate, and the size of the clamping main body 20 between two adjacent clamping grooves 30 is set to be smaller than the interval size between two chip units 2, so as to facilitate the transfer device 1 to clamp and transfer multiple chip units 2 at the same time.

[0044] In summary, the transfer device 1 changes the size of the clamping groove 30 by the expansion of the limiting unit 210, so as to limit and clamp the side surface of the chip unit 2 on the side wall of the clamping groove 30. The color conversion paste 4 in the receiving cavity 110 enters the clamping groove 30 through the discharge port 120, so that the color conversion paste 4 can be sprayed on the surface of the chip unit 2 through the discharge port 120, so that the transfer device 1 sprays the color conversion paste 4 on the surface of the chip unit 2 while transferring the chip unit 2 to form a color conversion layer, thus eliminating the need for additional steps of forming a color conversion layer and aligning and adhering the color conversion layer to the chip unit 2. This greatly simplifies the process and at the same time ensures the accurate spraying of the color conversion paste 4 on the surface of the chip unit 2.

[0045] See Figure 7 and Figure 8 , Figure 7 FIG. is a schematic flow chart of an embodiment of a method for manufacturing a light-emitting panel provided by the present application, Figure 8 FIG. is a schematic diagram of an embodiment of a process for manufacturing a light-emitting panel provided by the present application.

[0046] To solve the related technical problems, the present application provides a method for manufacturing a light-emitting panel, and the manufacturing method includes steps S701 to S703.

[0047] Step S701: In response to the transfer device 1 being located at the clamping station, control the limiting unit 210 of the transfer device 1 to limit the chip unit 2 located in the clamping groove 30.

[0048] Multiple chip units 2 are stored on a temporary substrate at intervals. One side of the chip unit 2 has electrode pins. A plurality of electrodes 31 are provided on the target substrate 3 corresponding to the multiple chip units 2. It is necessary to transfer the chip unit 2 to the target substrate 3 so that the electrode pins and the electrodes 31 are aligned and connected. When transferring the chip unit 2, first move the transfer device 1 to align it with the chip unit 2, and then move the transfer device 1 so that the chip unit 2 is located in the clamping groove 30, that is, the transfer device 1 is located at the clamping station. Then, the limiting unit 210 is energized through the control circuit 40 to expand and limit and clamp the chip unit 2. It should be noted that there is a certain interval between the surface of the chip unit 2 and the discharge port 120, that is, there is a certain interval between the chip unit 2 and the bottom wall of the clamping groove 30, so as to facilitate the production of subsequent processes. The transfer device 1 can be provided with one clamping groove 30 or multiple clamping grooves 30; the on-off state of the limiting unit 210 in each clamping groove 30 is controlled by the control circuit 40, so that the transfer device 1 with multiple clamping grooves 30 can synchronously clamp multiple chip units 2, or can control some clamping grooves 30 to work to clamp one or part of the chip units 2.

[0049] Step S702: Apply the color conversion paste 4 in the accommodation cavity 110 of the paste accommodation part 10 to the chip unit 2 through the discharge port 120 to form a color conversion layer.

[0050] The chip unit 2 has a good alignment with the discharge port 120 in the clamping groove 30, and the color conversion paste 4 can be accurately applied to the surface of the chip unit 2, so that the formed color conversion layer and the chip unit 2 maintain a good alignment. The transfer device 1 can not only limit and clamp the chip unit 2, but also process and manufacture the color conversion layer on the chip unit 2.

[0051] Step S703: In response to the transfer device 1 moving from the clamping station to the processing station, control the limiting unit 210 to release the limiting state of the chip unit 2. Among them, at the processing station, the chip unit 2 and the electrode 31 of the target substrate 3 are conductively connected.

[0052] The processing station is the position of the electrode 31 on the target substrate 3 corresponding to the electrode pins of the chip unit 2. The chip unit 2 is in conductive connection by contacting the electrode pins with the electrode 31 of the target substrate 3. When the transfer device 1 with multiple clamping grooves 30 clamps multiple chip units 2 and transfers them to the target substrate 3, if the electrodes 31 corresponding to each chip unit 2 are not adjacent, the transfer device 1 can be moved to one of the processing stations, the corresponding clamping groove 30 releases the corresponding chip unit 2, and the remaining clamping grooves 30 continue to clamp the corresponding chip units 2. Then the transfer device 1 continues to move to the next processing station to release the corresponding chip unit 2, and this operation is repeated until all the chip units 2 are transferred to the corresponding processing stations and are in conductive connection with the electrodes 31 on the target substrate 3, enabling the transfer device 1 to work flexibly. It should be noted that step S702 can also be placed after step S703, that is, first move the chip unit 2 from the clamping station to the processing station, and then apply the color conversion paste 4 on the chip unit 2 to form a color conversion layer.

[0053] Further, the step of applying the color conversion paste in the accommodation cavity of the paste accommodation part to the chip unit through the discharge port to form a color conversion layer includes: controlling the pressurizing unit of the transfer device to compress the accommodation cavity, so that the color conversion paste in the accommodation cavity is applied to the chip unit through the discharge port to form a color conversion layer.

[0054] The color conversion paste 4 is evenly sprayed on the surface of the chip unit 2 through multiple discharge ports 120. Under the action of surface tension, the color conversion paste 4 spreads evenly on the surface of the chip unit 2. Then the transfer device 1 is removed and the color conversion paste 4 is cured to obtain a color conversion layer, and the color conversion layer can adhere well to the chip unit 2. This enables the transfer device 1 to accurately fabricate a color conversion layer on the surface of the chip unit 2 synchronously when transferring the chip unit 2 from the temporary storage substrate to the target substrate 3, without the need to separately fabricate a color conversion layer and align it with the transfer of the chip unit 2, simplifying the manufacturing process and synchronously improving the alignment accuracy between the color conversion layer and the chip unit 2.

[0055] It should be noted that when the transfer device 1 is provided with a plurality of clamping grooves 30, the pressurizing units 50 corresponding to the plurality of clamping grooves 30 can work synchronously, and the color conversion slurry 4 can be sprayed on the surfaces of the plurality of chip units 2 synchronously. When it is inconvenient for the transfer device 1 to spray the color conversion slurry 4 on the plurality of chip units 2, one of the pressurizing units 50 corresponding to the clamping groove 30 can be made to work first, and the color conversion slurry 4 can be sprayed on the surface of the corresponding chip unit 2. Then, the transfer device 1 can be controlled to move to the next processing station, and the chip unit 2 in the corresponding clamping groove 30 can be released and the corresponding pressurizing unit 50 can be made to work to spray the color conversion slurry 4 in the corresponding accommodation cavity 110; that is, the transfer device 1 can simultaneously apply the color conversion slurry 4 in the plurality of accommodation cavities 110 to the plurality of chip units 2, or the transfer device 1 can sequentially apply the color conversion slurry 4 in the plurality of accommodation cavities 110 to the plurality of chip units 2.

[0056] Generally, the transfer device 1 needs to perform transfer processing on a plurality of chip units 2. After one chip unit 2 is transferred and processed, the transfer device 1 moves to the next clamping station to clamp and transfer the next chip unit 2, that is, after step S703 is executed, it returns to step S701.

[0057] Furthermore, the method for manufacturing a light-emitting panel further includes: filling the accommodation cavity 110 with the color conversion slurry 4, wherein the color conversion slurry 4 includes a color conversion material, an adhesive, and anchoring particles. The color conversion material can be a quantum dot material or a color resist material. The quantum dot material or the color resist material can receive light and convert it into light of various colors, such as red, green, blue, orange, etc. The adhesive is used to enable the color conversion slurry 4 to adhere to the chip unit 2. The adhesive can be selected as an ultraviolet light-curing adhesive (UV adhesive). During the process of the transfer device 1 transferring the chip unit 2 from the clamping station to the processing station, the color conversion slurry 4 in the accommodation cavity 110 can be simultaneously applied to the surface of the chip unit 2, and the chip unit 2 can be temporarily adhered by the adhesive in the color conversion slurry 4, further preventing the chip unit 2 from falling off during the transfer process. The anchoring particles are used to make the color conversion slurry 4 spread more evenly on the surface of the chip unit 2. The adhesive has a certain fluidity, and the anchoring particles cause the adhesive to adhere near them, so that the color conversion slurry 4 spreads more evenly on the surface of the chip unit 2. The anchoring particles can be selected as silica particles. The color conversion material, the adhesive, and the anchoring particles are mixed to obtain the color conversion slurry 4. The proportion of the adhesive in the color conversion slurry 4 is preferably 10%-30%, and the proportion of the anchoring particles in the color conversion slurry 4 is preferably 5%-15%.

[0058] In some embodiments, the color conversion materials are selected as the first color conversion material, the second color conversion material, and the third color conversion material that receive light and convert it into red, green, and blue light. When the transfer device 1 is provided with a plurality of accommodation cavities 110, the first color conversion material, the second color conversion material, and the third color conversion material can be filled into the plurality of accommodation cavities 110 respectively, or one or two of the color conversion materials can be filled into all the accommodation cavities 110. By flexibly filling the color conversion materials into the plurality of accommodation cavities 110 to adapt to different situations, the numbers of the transfer device 1, the accommodation cavities 110, and the clamping grooves 30 can all be set to be plural, such as 3, 4, 5, etc. By flexibly combining the numbers of the transfer device 1, the accommodation cavities 110, and the clamping grooves 30 and flexibly filling the first color conversion material, the second color conversion material, and the third color conversion material into the accommodation cavities 110, the transfer device 1 can flexibly transfer a plurality of chip units 2. For example, in some embodiments, two transfer devices 1 are provided, each transfer device 1 is provided with an accommodation cavity 110 and a clamping groove 30, and the first color conversion material and the second color conversion material are filled into the accommodation cavities 110 in the two transfer devices 1 respectively; in some embodiments, one transfer device 1 is provided, three clamping grooves 30 and three accommodation cavities 110 are provided in one transfer device 1, and the first color conversion material, the second color conversion material, and the third color conversion material are filled into the three accommodation cavities 110 respectively.

[0059] The chip unit 2 can emit light by itself. The chip unit 2 can be a light-emitting chip that emits red light, green light, blue light, etc. In one embodiment, the chip units 2 are uniformly selected as light-emitting chips that emit blue light. At this time, when preparing the color conversion paste 4, since the chip unit 2 itself emits blue light, no color conversion material is needed, and only the adhesive and the anchoring particles need to be mixed to obtain the color conversion paste 4, so that the blue light emitted by the chip unit 2 passes through the color conversion paste 4 and emits light.

[0060] See Figure 9 , Figure 9 is a partial structural schematic diagram of a light-emitting panel obtained by using the method for manufacturing a light-emitting panel provided in the present application.

[0061] After all the chip units 2 are transferred to the target substrate 3 through the transfer device 1 and the electrode pins of the chip units 2 are in conductive connection with the electrodes 31, the electrode pins of the chip units 2 and the electrodes 31 are welded and fixed. Finally, a resin material is coated on the target substrate 3 to form a packaging layer to cover the chip units 2. The resin material is preferably a black resin to avoid light crosstalk between the chip units 2 and weaken the reflection of ambient light, and at the same time can package and protect the chip units 2 and the color conversion paste 4.

[0062] In summary, in the manufacturing method provided by the present application, the limiting unit 210 in the clamping groove 30 of the transfer device 1 expands to limit and clamp the chip unit 2, so that the transfer device 1 clamps and transfers the chip unit 2 from the temporary substrate to the target substrate 3. The transfer device 1 can spray the color conversion paste 4 located in the accommodation cavity 110 onto the chip unit 2 located in the clamping groove 30 through the discharge port 120, so as to synchronously and precisely spray the color conversion paste 4 on the surface of the chip unit 2 by using the transfer device 1 to manufacture the color conversion layer, avoiding the process of separately manufacturing the color conversion layer and aligning and adhering the color conversion layer to the chip unit 2, simplifying the manufacturing process steps, and at the same time ensuring the alignment degree between the color conversion layer and the chip unit 2.

[0063] The present application also provides a light-emitting panel, which includes a target substrate, a chip unit, and a color conversion layer, and the light-emitting panel is obtained by the above manufacturing method.

[0064] In the description of the present application, the descriptions referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0065] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0066] Any process or method description shown in the flowchart or described in other ways herein can be understood as representing a module, segment, or part of code including one or more executable instructions for implementing a specific logical function or process, and the scope of the preferred embodiments of the present application includes additional implementations, where the functions can be executed in a substantially simultaneous manner or in a reverse order according to the involved functions, rather than in the order shown or discussed, which should be understood by those skilled in the art to which the embodiments of the present application belong.

[0067] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a definite ordered listing of executable instructions for implementing logical functions, which can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device (which can be a personal computer, a server, a network device, or other systems that can fetch and execute instructions from the instruction execution system, apparatus, or device). For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of the computer-readable medium include the following: an electrical connection portion having one or more wirings (electronic device), a portable computer diskette (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium can even be paper or other suitable medium on which the program can be printed, as the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpretation, or otherwise processing as appropriate, and then storing it in a computer memory.

[0068] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A transfer device, characterized in that: The transfer device comprises: A slurry containing part, comprising a containing cavity for containing the color conversion slurry, wherein the containing cavity is provided with a discharge port; A clamping body connected to the side of the slurry receiving part having the discharge port, wherein the clamping body cooperates with the slurry receiving part to form a clamping groove communicating with the discharge port, so as to allow the color conversion slurry in the receiving cavity to enter the clamping groove through the discharge port; A limiting unit is connected to a side of the clamping body portion facing the clamping groove, and the limiting unit is used to limit the chip unit located in the clamping groove.

2. The transfer device according to claim 1, characterized in that The limiting unit is annular and is arranged around the discharge port.

3. The transfer device according to claim 1, characterized in that The limiting unit includes at least one pair of limiting unit groups, and each pair of the limiting unit groups includes two sub-limiting units that are arranged opposite to each other and at an interval.

4. The transfer device according to claim 1, characterized in that: The transfer device further includes a control circuit, which is connected between the clamping body and the slurry containing portion, and is used to control the limiting unit to limit the chip unit.

5. The transfer device according to claim 1, characterized in that: The transfer device further includes a pressurizing unit, which is connected to the slurry receiving portion and is used to compress the receiving cavity so that the color conversion slurry in the receiving cavity enters the clamping groove through the discharge port.

6. The transfer device according to any one of claims 1 to 5, characterized in that: The slurry holding portion is formed with a plurality of spaced-apart holding cavities, the clamping body portion cooperates with the slurry holding portion to form a plurality of clamping grooves, each of the clamping grooves is connected to the discharge port of a holding cavity, there are a plurality of limiting units, each of the limiting units is respectively connected to the clamping body portion, and each of the clamping grooves has at least one limiting unit.

7. A method for manufacturing a light-emitting panel, characterized in that: The production method comprises: In response to the transfer device according to any one of claims 1 to 6 being located at a clamping station, controlling a limiting unit of the transfer device to limit a chip unit located in the clamping groove; Applying the color conversion slurry in the containing cavity of the slurry containing part to the chip unit through the discharge port to form a color conversion layer; In response to the transfer device moving from the clamping station to the processing station, the limiting unit is controlled to release the limiting state of the chip unit, wherein at the processing station, the chip unit and the electrodes of the target substrate are conductively connected.

8. The method according to claim 7, characterized in that: The step of applying the color conversion slurry in the containing cavity of the slurry containing part to the chip unit through the discharge port to form a color conversion layer comprises: The pressurizing unit of the transfer device is controlled to compress the accommodating cavity, so that the color conversion slurry in the accommodating cavity is applied to the chip unit through the discharge port to form the color conversion layer.

9. The manufacturing method according to claim 7, characterized in that: The production method comprises: The color conversion slurry is filled into the accommodation cavity, wherein the color conversion slurry includes a color conversion material, an adhesive and anchoring particles.

10. A light-emitting panel, characterized in that: The light-emitting panel comprises a target substrate, a chip unit and a color conversion layer, and the light-emitting panel is obtained by the manufacturing method according to any one of claims 7 to 9.

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