Substrate processing apparatus and transport method

Abstract

The substrate processing apparatus according to the present invention processes a substrate that can be transported so as to be housed in a cassette, and comprises: at least one transport block in which the substrate is transported; a substrate processing module for processing the substrate; and a cassette conveying mechanism configured to be capable of conveying the cassette between a transfer position set on an outer side surface of the substrate processing apparatus and a feed-in and feed-out position at which feed-in and feed-out are performed to the inside of the substrate processing apparatus, the cassette conveying mechanism comprising: a placement part on which the cassette is placed; and a moving mechanism that moves the cartridge placed on the placement portion.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a conveying method. Background Art

[0002] In Patent Document 1, there is disclosed a substrate processing apparatus that takes out a substrate from a carrier for accommodating and conveying a plurality of substrates and processes the substrate. In the substrate processing apparatus described in Patent Document 1, a ceiling conveying device is used to convey the carrier to and from a loading port where the carrier is fed in and out, and the ceiling conveying device can move along a line formed on the ceiling of a clean room in which the substrate processing apparatus is provided.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2014-116464 Summary of the Invention

[0006] Technical Problem to be Solved by the Invention

[0007] The technology of the present invention improves the conveying efficiency of a cassette to a substrate processing apparatus.

[0008] Technical Solution for Solving the Technical Problem

[0009] One aspect of the present invention is a substrate processing apparatus that processes a substrate that can be conveyed in a cassette, including: at least one conveying block that conveys the substrate inside; a substrate processing module that processes the substrate; and a cassette conveying mechanism that is configured to be able to convey the cassette between a handover position set on an outer side surface of the substrate processing apparatus and a feed-in / out position for feeding in and out of the inside of the substrate processing apparatus, the cassette conveying mechanism including: a placement portion that places the cassette; and a moving mechanism that moves the cassette placed on the placement portion.

[0010] Advantages of the Invention

[0011] According to the present invention, it is possible to improve the conveying efficiency of a cassette to a substrate processing apparatus. Brief Description of the Drawings

[0012] Figure 1 It is a plan view schematically showing a structural example of the substrate processing apparatus of the present embodiment.

[0013] Figure 2 It is a perspective view showing a structural example of the substrate processing apparatus of the present embodiment.

[0014] Figure 3 It is a perspective view schematically showing a structural example of a cassette conveying mechanism that moves on a horizontal plane.

[0015] Figure 4 It is a perspective view schematically showing a structural example of a cassette conveying mechanism that moves on a vertical plane.

[0016] Figure 5 It is a flowchart showing the conveyance process of the cassette.

[0017] Figure 6 It is an explanatory view showing the avoidance position of the cassette in the substrate processing apparatus.

[0018] Figure 7 It is an explanatory view showing the avoidance position of the cassette in the substrate processing apparatus.

[0019] Figure 8 It is a flowchart showing the conveyance process of the cassette.

[0020] Figure 9 It is a flowchart showing the conveyance process of the cassette.

[0021] Figure 10 It is a perspective view showing another structural example of the substrate processing apparatus.

[0022] Figure 11 It is a perspective view showing another structural example of the substrate processing apparatus. Detailed Description of the Invention

[0023] A cassette (Foup, Front Opening Unified Pod) is a storage container capable of storing a plurality of, for example, 25 semiconductor substrates (hereinafter simply referred to as "substrates") in one lot. As disclosed as an example in Patent Document 1, a ceiling conveying device (OHT: Overhead Hoist Transport) that moves along a track provided on the ceiling surface of a clean room is used to convey the cassette to a substrate processing apparatus.

[0024] However, in the case of using such a ceiling conveying device, the arrangement of the loading ports of the substrate processing apparatus is limited to the movable range of the ceiling conveying device, in other words, directly below the track, and the degree of freedom in arranging the substrate processing apparatus becomes small. In addition, when sending out the cassette from the substrate processing apparatus, in order to convey the cassette C, it is necessary to wait for the ceiling conveying device to arrive, which may cause a decrease in throughput (productivity).

[0025] The technology of the present invention has been completed in view of the above circumstances, and can improve the conveying efficiency of the cassette to the substrate processing apparatus. Hereinafter, with reference to the drawings, the substrate processing apparatus of the present embodiment and the method for conveying the cassette using the substrate processing apparatus will be described. In addition, in this specification and the drawings, elements having substantially the same functional structure are denoted by the same reference numerals, and repeated description is omitted.

[0026] <Substrate Processing Apparatus>

[0027] First, the structure of the substrate processing apparatus according to the present embodiment will be described. Figure 1 And Figure 2 FIG. and FIG. are respectively a plan view and a perspective view showing a schematic structure of the substrate processing apparatus 1 according to the present embodiment. Among them, a wafer is an example of a substrate.

[0028] The substrate processing apparatus 1 has a structure in which an atmospheric portion 10 and a reduced-pressure portion 11 are integrally connected via a load lock module 20. The atmospheric portion 10 includes an atmospheric module that processes and / or transports the substrate W in an atmospheric atmosphere. The reduced-pressure portion 11 includes a reduced-pressure module (vacuum module) that processes and / or transports the substrate W in a reduced-pressure (vacuum) atmosphere.

[0029] The load lock module 20 has a load lock chamber (not shown) configured to be able to temporarily hold the substrate W therein. The load lock chamber is provided to communicate the internal space of the atmospheric portion 10 with the internal space of the reduced-pressure portion 11 via a substrate transfer port (not shown). In addition, the load lock chamber is configured to be able to switch the inside to an atmospheric atmosphere and a reduced-pressure atmosphere (vacuum state). That is, the load lock module 20 is configured to be able to appropriately transfer the substrate W between the atmospheric portion 10 in the atmospheric atmosphere and the reduced-pressure portion 11 in the reduced-pressure atmosphere.

[0030] The atmospheric portion 10 has an atmospheric transfer block 30 and a loading / unloading block 31. The loading / unloading block 31 is configured to be lower than the atmospheric transfer block 30 by a certain height, and a plurality of, for example, five loading ports 32 are provided on the upper surface of the loading / unloading block 31. The loading ports 32 are loading / unloading positions for feeding and discharging the substrate W to and from the substrate processing apparatus 1, and each can mount and store a cassette C containing a plurality of (for example, 25 in one batch) substrates W.

[0031] The atmospheric transfer block 30 is formed of a rectangular housing inside, and the inside of the housing is maintained in an atmospheric atmosphere. A substrate transfer mechanism (not shown) is arranged inside the atmospheric transfer block 30. A plurality of, for example, five substrate transfer ports 33 are formed on one side surface of the long side of the atmospheric transfer block 30 that constitutes the negative Y-axis direction, and the above-described loading ports 32 are arranged in correspondence with the substrate transfer ports 33 respectively. The load lock module 20 is arranged on the other side surface of the long side of the atmospheric transfer block 30 that constitutes the positive Y-axis direction.

[0032] The reduced-pressure portion 11 has a vacuum transfer block 40 and a substrate processing module 50. The inside of the vacuum transfer block 40 and the substrate processing module 50 is configured to be able to be maintained in a reduced-pressure (vacuum) atmosphere respectively. In addition, in the present embodiment, a plurality of, for example, seven substrate processing modules 50 are connected to one vacuum transfer block 40. In addition, the number and arrangement of the substrate processing modules 50 are not limited to the present embodiment and can be set arbitrarily.

[0033] The vacuum transfer block 40 is composed of a rectangular housing. Inside the vacuum transfer block 40, a substrate transfer mechanism (not shown) is arranged. On the long side surfaces of the vacuum transfer block 40 that form the positive and negative X-axis directions, a plurality of, for example, three substrate transfer ports (not shown) are formed, and a substrate processing module 50 is respectively connected to each of the substrate transfer ports. On one short side surface of the vacuum transfer block 40 that forms the positive Y-axis direction, a substrate transfer port (not shown) is also formed, and a substrate processing module 50 is connected. In addition, a load lock module 20 is arranged on the other short side surface of the vacuum transfer block 40 that forms the negative Y-axis direction.

[0034] The substrate processing module 50 performs desired processing on the substrate W transferred from the vacuum transfer block 40. The type and structure of the substrate processing module 50 are not particularly limited, and for example, any structure such as a coating and developing module or a plasma processing module can be adopted.

[0035] As Figure 2 shown, a cassette transfer mechanism 60 for transferring the cassette C transferred from the ceiling transfer mechanism 100 described later to the loading port 32 is provided in the substrate processing apparatus 1. The cassette transfer mechanism 60 includes a horizontal plane motor 61, a horizontal transfer unit 63, a vertical plane motor 65, and a vertical transfer unit 67.

[0036] As Figure 1 and Figure 2 shown, the horizontal plane motor 61 includes a first horizontal plane motor 61a on the atmosphere transfer block 30 and a second horizontal plane motor 61b on the loading and unloading block 31, and they are respectively arranged in a manner of being laid on the upper surfaces of the atmosphere transfer block 30 and the loading and unloading block 31. Since the first horizontal plane motor 61a and the second horizontal plane motor 61b have the same structure, in the following description, they are sometimes collectively referred to as the "horizontal plane motor 61" for simplicity.

[0037] As Figure 3 shown, a plurality of coils 62 (first coils) are arranged inside the horizontal plane motor 61. The coils 62 generate a magnetic field by supplying current from a power supply (not shown). The power supplied to each of the plurality of coils 62 is preferably configured to be independently controllable by, for example, the control unit 2 described later.

[0038] At a desired position on the outer side surface of the substrate processing apparatus 1, in the illustrated example, at the end of the first horizontal plane motor 61a on the atmosphere transfer block 30 that is on the negative X-axis side and the positive Y-axis side, a transfer position A1 for performing the transfer of the cassette C with the ceiling transfer mechanism 100 described later is set. Therefore, at least the set position of the transfer position A1 in the atmosphere transfer block 30 is arranged directly below the track R for transferring the ceiling transfer mechanism 100 described later.

[0039] The horizontal conveyance unit 63 is formed of a columnar body (therefore, a rectangular columnar body in the illustrated example) having, for example, substantially the same cross-sectional shape as the cassette C in a plan view. The cassette C can be placed on the upper surface of the horizontal conveyance unit 63. Accordingly, the horizontal conveyance unit 63 constitutes the "placement part" of the technology of the present invention. Further, a plurality of permanent magnets 64 are arranged in the horizontal conveyance unit 63. Moreover, the horizontal conveyance unit 63 is magnetically levitated on the horizontal plane motor 61 by the magnetic field generated by the coil 62. The amount of floating of the horizontal conveyance unit 63 with respect to the horizontal plane motor 61 can be controlled by the magnitude of the current supplied to the coil 62. Further, the horizontal conveyance unit 63 moves and rotates on the horizontal plane motor 61 by the magnetic field generated by the coil 62. Accordingly, in the present embodiment, the horizontal plane motor 61 and the horizontal conveyance unit 63 may be collectively referred to as the "moving mechanism" of the technology of the present invention.

[0040] As Figure 2 shown, the vertical plane motors 65 are provided at desired positions on the sides of the air conveyance block 30. In the illustrated example, they are respectively provided on the side on the negative Y-axis direction side connected to the loading / unloading block 31 and on the side on the negative X-axis direction side. As Figure 4 shown, a plurality of coils 66 (second coils) are arranged inside the vertical plane motors 65. The coils 66 generate a magnetic field by supplying current from a power source (not shown). The power supplied to each of the plurality of coils 66 is preferably configured to be independently controllable under the control of, for example, the control unit 2 described later.

[0041] The vertical conveyance unit 67 includes a first vertical conveyance unit 67a disposed on the side on the negative Y-axis direction side of the air conveyance block 30 and a second vertical conveyance unit 67b disposed on the side on the negative X-axis direction side of the air conveyance block 30. The first vertical conveyance unit 67a and the second vertical conveyance unit 67b have the same structure, and thus, in the following description, they may be collectively and simply referred to as the "vertical conveyance unit 67".

[0042] The vertical conveyance unit 67 includes a placement portion 68 having, for example, substantially the same cross-sectional shape as the cassette C in a plan view, and a moving portion 69 that is provided to hang down from an end of the placement portion 68 so as to face the vertical plane motor 65.

[0043] The cassette C can be placed on the upper surface of the placement portion 68. In addition, a plurality of coils 68a are arranged on the placement portion 68. Moreover, in the placement portion 68, the horizontal conveyance unit 63 is magnetically levitated above by the magnetic field generated by the coils 68a. Further, it is configured that in the substrate processing apparatus 1, the horizontal conveyance unit 63 can be transferred between the horizontal surface motor 61 and the placement portion 68 under the control of the control unit 2 described later. The floating amount of the horizontal conveyance unit 63 relative to the placement portion 68 can be controlled by the magnitude of the current supplied to the coils 68a. In addition, the horizontal conveyance unit 63 moves and rotates on the placement portion 68 by the magnetic field generated by the coils 68a.

[0044] The moving portion 69 is composed of a plane facing the vertical surface motor 65. A plurality of permanent magnets 69a are arranged on the moving portion 69. Moreover, the moving portion 69 is magnetically levitated along the surface direction of the vertical surface motor 65 by the magnetic field generated by the coil 66 of the vertical surface motor 65. Therefore, the vertical conveyance unit 67 moves along the vertical surface motor 65 by the magnetic field generated by the coil 66.

[0045] With such a structure, the first vertical conveyance unit 67a is configured to control the power supplied to each of the coils 62, 66, and 68a under the control of the control unit 2, and can move the horizontal conveyance unit 63 on which the cassette C is placed between the atmospheric conveyance block 30 and the loading / unloading block 31.

[0046] In addition, the second vertical conveyance unit 67b is configured to control the power supplied to each of the coils 62, 66, and 68a under the control of the control unit 2, and can temporarily hold the cassette C on the side of the atmospheric conveyance block 30 and standby. Therefore, the second vertical conveyance unit 67b has a structure as a buffer mechanism for the cassette C.

[0047] Therefore, the cassette conveyance mechanism 60 conveys the cassette C conveyed from the ceiling conveyance mechanism 100 between the transfer position A1 and the loading port 32 (the loading / unloading position of the substrate W).

[0048] As Figure 1As shown, a control unit 2 is provided in the substrate processing apparatus 1. The control unit 2 processes computer-executable commands for causing the substrate processing apparatus 1 to execute various steps described in the present invention. The control unit 2 can be configured to control each element of the substrate processing apparatus 1 to execute various steps described herein. In one embodiment, part or all of the control unit 2 may be included in the substrate processing apparatus 1. The control unit 2 may include a processing unit 2a1, a storage unit 2a2, and a communication interface 2a3. The control unit 2 is implemented by a computer 2a, for example. The processing unit 2a1 can be configured to be able to read a program from the storage unit 2a2 and perform various control actions by executing the read program. The program may be pre-stored in the storage unit 2a2 or may be acquired via a medium when needed. The acquired program is stored in the storage unit 2a2 and read and executed by the processing unit 2a1 from the storage unit 2a2. The medium can be various storage media readable by the computer 2a or a communication line connected to the communication interface 2a3. The processing unit 2a1 may be a CPU (Central Processing Unit). The storage unit 2a2 may include a RAM (Random Access Memory), a ROM (Read Only Memory), an HDD (Hard Disk Drive), an SSD (Solid State Drive), or a combination thereof. The communication interface 2a3 can communicate with the substrate processing apparatus 1 via a communication line such as a LAN (Local Area Network). In addition, the above storage medium may be temporary or non-temporary.

[0049] Above the substrate processing apparatus 1 configured as described above, as Figure 2 shown, for example, a ceiling transfer mechanism 100 is provided. The ceiling transfer mechanism 100 can move along a track R provided on the ceiling surface of the clean room in which the substrate processing apparatus 1 is disposed. The ceiling transfer mechanism 100 can transfer a cassette C between the substrate processing apparatus 1 and other substrate processing apparatuses 1 provided outside the substrate processing apparatus 1, and can approach (reach, accessible) the transfer position A1 set on the top surface of the atmospheric transfer block 30 from above to transfer the cassette C.

[0050] <Method of Transferring Cassette>

[0051] Next, a detailed method of transferring the cassette C in the substrate processing apparatus 1 configured as described above will be described. Figure 5 is a flowchart showing the flow of transfer of the cassette C containing the unprocessed substrate W.

[0052] First, the ceiling conveyor mechanism 100 that holds the cassette (hereinafter, for convenience, this cassette to be conveyed is referred to as "cassette C1") containing a plurality of unprocessed substrates W moves above the transfer position A1 of the first horizontal plane motor 61a provided in the substrate processing apparatus 1 ( Figure 5 step S1). At the transfer position A1, the horizontal transfer unit 63 on which no other cassette (hereinafter, for convenience, referred to as "other cassette C2") is placed is waiting in advance, and the cassette C1 is directly transferred from the ceiling conveyor mechanism 100 to this horizontal transfer unit 63 ( Figure 5 step S2).

[0053] After the cassette C1 is transferred to the horizontal transfer unit 63, next, current is supplied to the coil 62 of the first horizontal plane motor 61a to magnetically levitate the horizontal transfer unit 63, and the horizontal movement of the horizontal transfer unit 63 is started. In addition, and, the placement state of the other cassette C2 at the loading port 32 of the loading and unloading block 31 is acquired, in other words, the free information of the loading port 32 is acquired ( Figure 5 step S3).

[0054] When there is no free space at the loading port 32, that is, when all five loading ports 32 are already loaded with other cassettes C2, the horizontal transfer unit 63 on which the cassette C1 is placed is moved to the placement portion 68 of the second vertical transfer unit 67b ( Figure 5 step S4). At this time, the current supply to the coil 68a of the placement portion 68 can be started in advance before the cassette C1 is transferred to the placement portion 68, or can be started simultaneously with the transfer of the cassette C1 to the placement portion 68. After that, by supplying current to the coil 66, the second vertical transfer unit 67b moves along the vertical plane motor 65, and the cassette C1 (horizontal transfer unit 63) transferred to the placement portion 68 temporarily waits at the desired standby position until a free space is generated at the loading port 32.

[0055] When there is a free space at the loading port 32 in step S3, or when a free space is generated at the loading port 32 after temporarily waiting using the second vertical transfer unit 67b, the horizontal transfer unit 63 on which the cassette C1 is placed is moved to the placement portion 68 of the first vertical transfer unit 67a ( Figure 5 step S5). At this time, the current supply to the coil 68a of the placement portion 68 can be started in advance before the cassette C1 is transferred to the placement portion 68, or can be started simultaneously with the transfer of the cassette C1 to the placement portion 68. After that, by supplying current to the coil 66, the first vertical transfer unit 67a moves along the vertical plane motor 65, whereby the cassette C1 (horizontal transfer unit 63) transferred to the placement portion 68 descends to the height position of the loading and unloading block 31.

[0056] After the first vertical transfer unit 67a is lowered, subsequently, the horizontal transfer unit 63 on which the cassette C1 is placed is moved toward the second horizontal plane motor 61b ( Figure 5 step S6). At this time, the current supply to the coil 62 of the second horizontal plane motor 61b can be started in advance before the cassette C1 is transferred to the second horizontal plane motor 61b, or can be started simultaneously with the transfer of the cassette C1 to the second horizontal plane motor 61b. By supplying current to the coil 62, the cassette C1 (horizontal transfer unit 63) transferred to the second horizontal plane motor 61b is magnetically levitated and moved on the second horizontal plane motor 61b, and is placed on the loading port 32 of the object to be transferred ( Figure 5 step S7). After that, the substrate transfer port 33 of the atmospheric transfer block 30 is opened, and the unprocessed substrate W in the cassette C1 is sent into the substrate processing apparatus 1 by a substrate transfer mechanism (not shown), and various processes are performed on the substrate W in the substrate processing module 50.

[0057] In addition, when the cassette C is transferred from the placement portion 68 of the first vertical transfer unit 67a to the loading port 32, for example, when the loading port 32 of the object to be transferred is at the center in the X-axis direction of the loading and unloading block 31, there is a possibility that other cassettes C placed on other loading ports 32 may interfere. That is, it may not be possible to appropriately transfer the cassette C1 to the corresponding loading port 32.

[0058] Regarding this point, as Figure 6 shown, an avoidance position for other cassettes C2 can be formed in the loading and unloading block 31. The other cassettes C2 can be formed, for example, on the opposite side of the substrate transfer port 33 with respect to the loading port 32 (the negative Y-axis side of the loading port 32) as Figure 6 shown, or can be formed above the loading port 32 (the positive Z-axis side of the loading port 32) as Figure 7 shown. For example, a lifting mechanism 70 for lifting and lowering other cassettes C2 in the vertical direction by magnetic levitation is also provided. In addition, Figure 6 and Figure 7 are an example.

[0059] In addition, for example, regarding this point, the first vertical transfer unit 67a can also be configured to be able to directly approach all the loading ports 32 independently. In this case, the number of the first vertical transfer units 67a arranged on the side surface on the negative Y-axis side of the atmospheric transfer block 30 can be only one, or can be multiple to correspond to the multiple loading ports 32 respectively.

[0060] Figure 8 is a flowchart showing the conveyance process of the cassette C1 that has become empty due to the discharge of the substrate W after step S7.

[0061] The cassette C1 emptied due to the discharge of the substrate W is temporarily standby in the buffer mechanism during the period before the processing of the multiple substrates W originally stored in the cassette C1 is completed. That is, first, by supplying current to the coil 62, the horizontal transfer unit 63 holding the empty cassette C1 is magnetically levitated and moved on the second horizontal plane motor 61b ( Figure 8 step T1), and is transferred to the placement portion 68 of the first vertical transfer unit 67a ( Figure 8 step T2). At this time, when another cassette C2 is placed at another loading port 32 on the transfer path of the cassette C1, as Figure 6 、 Figure 7 shown, the other cassette C2 is temporarily moved to the avoidance position.

[0062] After the horizontal transfer unit 63 is transferred to the placement portion 68, then, by supplying current to the coil 66, the first vertical transfer unit 67a is magnetically levitated and moved along the vertical plane motor 65, and rises to the height position of the atmospheric transfer block 30. Next, the horizontal transfer unit 63 holding the cassette C1 is moved toward the first horizontal plane motor 61a ( Figure 8 step T3), and further the horizontal transfer unit 63 is transferred to the placement portion 68 of the second vertical transfer unit 67b ( Figure 8 step T4).

[0063] After that, by supplying current to the coil 66, the horizontal transfer unit 63 (cassette C1) transferred to the placement portion 68 of the second vertical transfer unit 67b is magnetically levitated and moved along the vertical plane motor 65, and temporarily stands by at the desired standby position until the processing of the substrate W is completed.

[0064] In addition, in the example of the flowchart shown in Figure 8 , the cassette C1 is temporarily standby in the second vertical transfer unit 67b (buffer mechanism) provided on the side in the X-axis direction of the atmospheric transfer block 30. However, the standby position of the cassette C1 is not limited thereto. For example, in the case where an avoidance position is formed near the loading port 32 as shown in Figure 6 、 Figure 7 , the cassette C1 can be temporarily standby at the avoidance position.

[0065] After that, when the processing of the multiple substrates W originally stored in the cassette C1 is completed, the standby cassette C1 (horizontal transfer unit 63) moves back onto the loading port 32 again ( Figure 8 step T5), and then, the processed substrate W is returned from the inside of the substrate processing apparatus 1 to the empty cassette C1 via the substrate transfer port 33. In addition, the transfer method for transferring the cassette C1 from the standby position to the loading port 32 is performed in the reverse order of the transfer method shown in Figure 8 .

[0066] Next, Figure 9It is a flowchart showing the process of transporting the cassette C1 that has become empty due to the discharge of the substrate W.

[0067] First, by supplying current to the coil 62, the cassette C1 to which the processed substrate W has been returned is magnetically levitated and moved on the second horizontal plane motor 61b ( Figure 9 step P1), and is transferred to the placement portion 68 of the first vertical transfer unit 67a ( Figure 9 step P2). At this time, when another cassette C2 is placed at another loading port 32 on the transport path of the cassette C1, as Figure 6 、 Figure 7 shown, the other cassette C2 is temporarily moved to the avoidance position.

[0068] After the horizontal transfer unit 63 is transferred to the placement portion 68, then, by supplying current to the coil 66, the first vertical transfer unit 67a is magnetically levitated and moves along the vertical plane motor 65, rising to the height position of the atmospheric transport block 30. Then, the horizontal transfer unit 63 carrying the cassette C1 is moved toward the first horizontal plane motor 61a ( Figure 9 step P3). In addition, when moving the horizontal transfer unit 63 from this loading port 32 to the first horizontal plane motor 61a, the operation information of the ceiling transfer mechanism 100 for sending out the cassette C1 from the substrate processing apparatus 1 is acquired ( Figure 9 step P4).

[0069] When the ceiling transfer mechanism 100 is not idle, that is, for example, during the transport operation of another cassette C2, the horizontal transfer unit 63 carrying the cassette C1 is moved to the placement portion 68 of the second vertical transfer unit 67b ( Figure 9 step P5). After that, by supplying current to the coil 66, the second vertical transfer unit 67b moves along the vertical plane motor 65, and the cassette C1 (horizontal transfer unit 63) transferred to the placement portion 68 temporarily stands by at the desired standby position until the ceiling transfer mechanism 100 becomes idle.

[0070] When the ceiling transfer mechanism 100 is idle in step P4, or when the ceiling transfer mechanism 100 becomes idle after temporarily standing by using the second vertical transfer unit 67b, the horizontal transfer unit 63 carrying the cassette C1 is moved to the transfer position A1 set on the first horizontal plane motor 61a ( Figure 9 step P6). After that, the cassette C1 at the transfer position A1 is transferred to the ceiling transfer mechanism 100 that is directly close to this transfer position A1 ( Figure 9 step P7).

[0071] The transport of the cassette C in the substrate processing apparatus 1 is performed as described above.

[0072] As described above, in the substrate processing apparatus 1 of the present invention, the cassette transfer mechanism 60 provided in the substrate processing apparatus 1 can be used to freely transfer the cassette C conveyed by the ceiling transfer mechanism 100 along the motors (horizontal plane motor 61 and vertical plane motor 65) provided on the outer surface of the substrate processing apparatus 1. Therefore, the cassette C conveyed by the ceiling transfer mechanism 100 does not need to directly approach the loading port 32 as shown in Patent Document 1. As long as it can approach the transfer position A1 that can be set at any position in the substrate processing apparatus 1, the cassette C can then be appropriately transferred to the loading port 32 using the cassette transfer mechanism 60.

[0073] Thus, at least only the transfer position A1 needs to be arranged directly below the movable range of the ceiling transfer mechanism 100, that is, directly below the track R. There is no need to set the loading port 32 within the movable range of the ceiling transfer mechanism 100. In addition, as described above, the transfer position A1 can be set at any position in the substrate processing apparatus 1. Therefore, the installation location of the substrate processing apparatus 1 in the clean room is not affected by the movable range of the ceiling transfer mechanism 100 and can be arranged arbitrarily. As a result, the degree of freedom in setting the substrate processing apparatus 1 is increased, and the layout efficiency of the substrate processing apparatus 1 in the clean room can be improved.

[0074] In addition, according to the above-described embodiment, the movement of the cassette C can be independently performed in the substrate processing apparatus 1 without relying on the ceiling transfer mechanism 100. Therefore, when it is necessary to move the cassette C, there is no need to wait for the ceiling transfer mechanism 100 to arrive. Thus, the substrate processing in the substrate processing apparatus 1 is not limited by the ceiling transfer mechanism 100, and the throughput can be significantly increased.

[0075] In addition, according to the substrate processing apparatus 1 of the technology of the present invention, the cassette C can be made to standby on the side of the substrate processing apparatus 1 by magnetic levitation. In other words, the standby position of the cassette C is not limited to the upper surface of the apparatus and can be set on any surface such as the side of the apparatus. Therefore, the degree of freedom in setting the standby position is greatly increased.

[0076] In addition, in a conventional substrate processing apparatus, for example, as shown in Patent Document 1, since the ceiling transfer mechanism directly approaches the loading port, the simultaneous placement quantity (transfer quantity) of the cassette C in the substrate processing apparatus is limited to the same quantity as the loading port. In this regard, in the substrate processing apparatus of the technology of the present invention, the cassette C can be made to standby at an arbitrary position using the second vertical transfer unit 67b. Therefore, the number of cassettes C that can be simultaneously held and standby in the substrate processing apparatus 1 can be more than the number of loading ports 32, thereby further increasing the throughput of the substrate processing.

[0077] In addition, in the above-described embodiment, as Figure 2As shown, the horizontal plane motor 61 is disposed only on the upper surfaces of the atmosphere transport block 30 and the loading / unloading block 31 of the atmosphere section 10. In other words, the transport range (moving range) for horizontally transporting the cassette C by the cassette transport mechanism 60 is set only on the upper surface of the atmosphere section 10. However, the arrangement of the horizontal plane motor 61 is not limited to Figure 2 the example shown.

[0078] Specifically, for example Figure 10 as shown, an additional horizontal plane motor 161 may also be disposed above the decompression section 11, on the back side of the substrate processing apparatus 1. In this case, the additional horizontal plane motor 161 may be directly disposed on the upper surfaces of the vacuum transport block 40 and the substrate processing module 50, or as Figure 10 shown, by mounting the additional horizontal plane motor 161 between the upper surface of the atmosphere transport block 30 and the upper surface of the substrate processing module 50, it can be arranged at a distance from the upper surface of the vacuum transport block 40.

[0079] In addition, when a plurality of substrate processing apparatuses 1 are arranged side by side in a clean room, as Figure 10 shown, an additional horizontal plane motor 161 may also be mounted between one substrate processing apparatus 1 and another substrate processing apparatus 1.

[0080] In this way, by arranging the additional horizontal plane motor 161, the transport range for transporting the cassette C by the cassette transport mechanism 60 is expanded, and the setting freedom of the transfer position A1 for transferring the cassette C with the ceiling transport mechanism 100 can be improved. As a result, the setting freedom of the substrate processing apparatus 1 is further improved.

[0081] In addition, in the above embodiment, the case where the cassette transport mechanism 60 transports the cassette C by magnetic levitation on the upper surface of the substrate processing apparatus 1 has been described as an example. However, as long as the cassette C can be transported to the loading port of the substrate processing apparatus 1 independently of the ceiling transport mechanism 100, the structure of the cassette transport mechanism 60 is not limited thereto.

[0082] Specifically, for example, instead of magnetic levitation, the cassette C may be transported by a moving mechanism including wheels, a power source such as a battery, a power source, and a steering mechanism. A pedestal serving as a placement portion is provided above the wheels, and the cassette C can be placed thereon. In this way, even when the cassette C is transported using wheels or the like instead of magnetic levitation, at least it is not necessary to arrange the loading port 32 directly below the track R of the ceiling transport mechanism 100, the setting freedom of the substrate processing apparatus 1 is improved, and the arrangement efficiency of the substrate processing apparatus 1 in the clean room can be improved.

[0083] In addition, in the above-described embodiment, the substrate W is fed in and out between the cassette C placed on the loading port 32 and the inside of the substrate processing apparatus 1 via the substrate transfer port 33. However, the feeding method for feeding the substrate W into the substrate processing apparatus 1 is not limited to this.

[0084] Figure 11 FIG. 4 is a perspective view showing a schematic configuration of a substrate processing apparatus 200 provided with a lifting mechanism 210 for feeding a cassette C (substrate W) therein. In addition, in the substrate processing apparatus 200, elements having substantially the same functional configuration as those of the above-described substrate processing apparatus 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0085] The substrate processing apparatus 200 of another embodiment includes a lifting mechanism 210, a vacuum transfer block 40, a substrate processing module 50, and a cassette transfer mechanism 60. The cassette transfer mechanism 60 transfers the cassette C at least on the upper surface of the vacuum transfer block 40 by the above-described method.

[0086] The lifting mechanism 210 places the cassette C received from the cassette transfer mechanism 60 therein, and transfers (lifts and lowers) the substrate W between the outside of the substrate processing apparatus 200 in an atmospheric atmosphere and the inside of the substrate processing apparatus 200 (vacuum transfer block 40) in a reduced-pressure atmosphere. In addition, the lifting mechanism 210 is configured to be able to switch the inside to an atmospheric atmosphere and a reduced-pressure atmosphere (vacuum state). Therefore, it can be said that the lifting mechanism 210 in the present embodiment includes a structure integrally having the functions of the atmospheric transfer block 30, the loading / unloading block 31, and the loading lock module 20 in the above-described substrate processing apparatus 1. Therefore, in the present embodiment, the lifting mechanism 210 constitutes a loading / unloading position for loading and unloading the substrate W with respect to the substrate processing apparatus 200.

[0087] In the substrate processing apparatus 200, first, the cassette C received from the ceiling transfer mechanism 100 is transferred to the lifting mechanism 210 by the horizontal transfer unit 63 of the cassette transfer mechanism 60. Next, the lid of the cassette C is opened to communicate the inside of the cassette C with the inside of the lifting mechanism 210, and then the inside of the lifting mechanism 210 (cassette C) is depressurized. Next, one or more substrates W are received from the inside of the cassette C, and the received substrates W are lowered (transferred) from the height position on the upper surface of the substrate processing apparatus 200 to the height position inside the vacuum transfer block 40 (i.e., the inside of the substrate processing apparatus 200). The substrate W fed into the inside of the substrate processing apparatus 200 temporarily waits in the inside of the lifting mechanism 210 or in a stocker provided inside the substrate processing apparatus 200 independently of the lifting mechanism 210, and then is transferred to the substrate processing module 50 via the vacuum transfer block 40 to perform a desired process.

[0088] The cassette C that has become empty after discharging all the substrates W then waits at a buffer position formed on the outer surface of the substrate processing apparatus 200 until the processing of the discharged substrate W is completed. Specifically, the empty cassette C is conveyed from the elevating mechanism 210 to the vertical conveyance unit 67 by the horizontal conveyance unit 63. Then, the vertical conveyance unit 67 moves it along a vertical surface motor (omitted in Figure 11 ) provided on the side surface of the substrate processing apparatus 200 to a predetermined buffer position B (see Figure 11 ), and waits at this buffer position.

[0089] It should be considered that the embodiments disclosed herein are illustrative in all respects and not restrictive. The above embodiments can be omitted, replaced, or changed in various ways without departing from the claimed technical solutions and their gists.

[0090] Explanation of Reference Numerals

[0091] 1 Substrate processing apparatus

[0092] 30 Atmosphere conveyance block

[0093] 31 Loading / unloading block

[0094] 32 Loading port

[0095] 40 Vacuum conveyance block

[0096] 50 Substrate processing module

[0097] 60 Cassette conveyance mechanism

[0098] 61 Horizontal surface motor

[0099] 62 Coil

[0100] 63 Horizontal conveyance unit

[0101] 64 Permanent magnet

[0102] 100 Ceiling conveyance mechanism

[0103] A1 Handover position

[0104] C Cassette

[0105] W Substrate.

Claims

1. A substrate processing device, characterized in that: The substrate processing device processes substrates that are transported in a manner that allows them to be received in a cassette, and includes: at least one transport block for transporting the substrate therein; A substrate processing module for processing the substrate; and a box conveying mechanism configured to convey the box between a delivery position set on the outer side of the substrate processing device and a carrying position for carrying the box into and out of the substrate processing device; The box conveying mechanism comprises: a mounting portion on which the cartridge is mounted; and A moving mechanism moves the cartridge placed on the placement portion.

2. The substrate processing device according to claim 1, characterized in that: The box conveying mechanism comprises: a horizontal plane motor, comprising a plurality of first coils disposed on an upper surface of the conveying block; and The horizontal conveying unit is capable of moving on the horizontal plane motor in a state of being magnetically suspended on the horizontal plane motor due to the effect of the magnetic field generated by the first coil.

3. The substrate processing device according to claim 2, characterized in that: The box conveying mechanism also includes: A vertical plane motor, comprising a plurality of second coils disposed on a side surface of the conveying block; and A vertical conveying unit can be moved along the vertical plane motor under the action of the magnetic field generated by the second coil.

4. The substrate processing device according to claim 2 or 3, characterized in that: It also includes an additional horizontal plane motor, which is mounted between the upper surface of the conveying block and the upper surface of the substrate processing module.

5. The substrate processing device according to claim 2 or 3, characterized in that: The device further includes an additional horizontal plane motor that is mounted between the upper surface of the substrate processing device and the upper surface of another substrate processing device that processes substrates that can be transported in a manner stored in a cassette.

6. The substrate processing device according to claim 1, characterized in that: A lifting mechanism is provided, the lifting mechanism being configured to be able to lift the box between a height position on the upper surface of the conveying block and a height position inside the conveying block, The lifting mechanism is configured to be able to switch the interior between an air atmosphere and a vacuum atmosphere.

7. The substrate processing device according to claim 1, characterized in that: The cassette can be transported between the outside of the substrate processing apparatus and the delivery position using a ceiling transport mechanism.

8. A method for conveying a box capable of being conveyed to a substrate processing device, characterized in that: The substrate processing device comprises: at least one transport block in which a substrate to be processed is transported; A substrate processing module for processing the substrate; and a box conveying mechanism configured to convey the box between a delivery position set on the outer side of the substrate processing device and a carrying position for carrying the box into and out of the substrate processing device; The delivery method comprises: The step of delivering the box conveyed from outside the substrate processing device to the box conveying mechanism at the handover position; The step of moving the box conveying mechanism from the handover position to the delivery position; and A step of delivering the substrates stored in the cassette to the substrate processing device at the carrying-in / carrying-out position.

9. The conveying method according to claim 8, characterized in that: The step of moving the box conveying mechanism comprises: Processing of supplying current to a horizontal plane motor, wherein the horizontal plane motor comprises a plurality of first coils disposed on an upper surface of the conveying block; A process of magnetically levitating the horizontal transport unit carrying the cassette on the horizontal plane motor by means of a magnetic field generated by the first coil; and The process of controlling the current supplied to the plurality of the first coils to move the horizontal transport unit on the horizontal motor.

10. The conveying method according to claim 9, characterized in that: The step of moving the box conveying mechanism also includes: Processing of supplying current to a plumb plane motor, wherein the plumb plane motor includes a plurality of second coils disposed on a side of the conveying block; and The process of controlling the current supplied to the plurality of the second coils to move the vertical conveying unit along the vertical plane motor.

11. The conveying method according to claim 10, characterized in that: The process further includes: when another box is placed at the delivery position, before the box is moved to the delivery position, the box is temporarily placed on standby at the buffer position; The buffer position is formed on a side surface of the conveying block.

12. The conveying method according to claim 8, characterized in that: The cassette is transported between the outside of the substrate processing apparatus and the delivery position using a ceiling transport mechanism.

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