Welding device and welding strip equipment comprising same

Abstract

The invention relates to a welding device and welding strip equipment comprising the welding device. The welding device comprises: a table for supporting a solar cell and a wire; a main body facing the stage; and a plurality of heaters positioned on a bottom surface of the main body so as to face the solar cells and the wires, in which the table includes a first cooling unit positioned in a region corresponding to the bottom surfaces of the solar cells and the wires loaded on the table.

Description

Technical Field

[0001] The present invention relates to a soldering device and a tabbing device including the soldering device. Background Art

[0002] A solar cell is formed by arranging a p-n junction diode on a substrate. When the solar cell is irradiated with sunlight, excitons of electron-hole pairs are generated, and as the excitons are separated, electrons move to the n layer, holes move to the p layer, and thus photovoltaic power is generated at the p-n junction portion. The tabbing process is a process of arranging wires on a plurality of solar cells and electrically connecting the plurality of solar cells to form a single solar cell module.

[0003] A tabbing device is a bonding device for connecting a plurality of solar cells and includes a soldering device. When a wire is arranged on a solar cell, the soldering device melts solder on the wire, thereby electrically connecting the solar cell and the wire. This soldering process must include a cooling process to cool the melted solder, but the conventional tabbing device performs natural cooling at room temperature without a separate cooling structure, and thus the cooling consumes a long time. Summary of the Invention

[0004] Technical Problem

[0005] The present invention aims to provide a soldering device including a structure for cooling a solar cell and a wire coated with solder, and a tabbing device including the soldering device.

[0006] Technical Solution

[0007] The soldering device includes: a stage for supporting a solar cell and a wire; a main body facing the stage; and a plurality of heaters positioned on a bottom surface of the main body to face the solar cell and the wire, wherein the stage includes a first cooling unit positioned in a region corresponding to bottom surfaces of the solar cell and the wire mounted on the stage.

[0008] When the plurality of heaters irradiate the solar cell and the wire mounted on the stage with light, the stage may emit air from the first cooling unit at a position where the stage faces the plurality of heaters or at a position where the stage does not overlap with the plurality of heaters to cool the solar cell and the wire.

[0009] The first cooling unit may include: a lower air inlet; a first lower plate having a flow path through which air is introduced from the lower air inlet; and a second lower plate having a top surface on which the solar cell and the wire are mounted, an air distribution flow path communicating with the flow path of the first lower plate, and a plurality of air nozzles communicating with the air distribution flow path and emitting air toward the solar cell and the wire.

[0010] The first cooling units may be positioned in the same number and at intervals corresponding to the plurality of wires mounted on the stage.

[0011] The soldering device may further include a second cooling unit positioned on the bottom surface of the main body and emitting air toward the solar cell and the wire mounted on the stage.

[0012] The second cooling unit may include: an upper air inlet; a first upper panel having a flow path through which air is introduced from the upper air inlet; and a second upper panel positioned on the bottom surface of the first upper panel and including a plurality of air nozzles communicating with the flow path.

[0013] The plurality of air nozzles may be alternately positioned with the plurality of heaters in one direction.

[0014] The first upper panel may include: a pair of air supply ports corresponding to the upper air inlet; an air distribution flow path formed on the bottom surface of the first upper panel and communicating with the pair of air supply ports; and a plurality of air distribution slits extending from the air distribution flow path and overlapping the plurality of air nozzles of the second upper panel.

[0015] The plurality of air nozzles provided in the first cooling unit and the plurality of air nozzles provided in the second cooling unit may be spaced apart from each other in different directions.

[0016] The solder ribbon device includes: a solar cell supply device that supplies solar cells; a wire transport device spaced apart from the solar cell supply device and supplying a plurality of wires; a wire jig transport device spaced apart from the solar cell supply device and the wire transport device and supplying a wire jig that supports the solar cell and the wire; a moving device that supplies the solar cell and the wire jig to the wires arranged on the wire transport device; and a soldering device that allows the solar cell and the wire jig to be mounted on the wires and then solders the solar cell and the wire, wherein the soldering device is the soldering device according to any one of claims 1 to 9.

[0017] The soldering tape device may further include an impregnation unit that coats or plates the plurality of wires with solder and supplies the wires to the wire transport device.

[0018] Advantageous Effects

[0019] Since the soldering device and the soldering tape device including the soldering device melt the solder on the solar cell and the wires and then emit air to cool the solder, the time required for the soldering tape process can be reduced.

[0020] Since the soldering device and the soldering tape device including the soldering device use the first cooling unit provided in the stage supporting the solar cell and the wires to emit air toward the bottom surfaces of the solar cell and the wires, the solar cell and the wires can be effectively cooled.

[0021] Since the soldering device and the soldering tape device including the soldering device use the second cooling unit other than the first cooling unit to emit air toward the top surfaces of the solar cell and the wires, the solar cell and the wires can be effectively cooled. Description of the Drawings

[0022] Figure 1 is a schematic diagram of the soldering tape device.

[0023] Figure 2 shows the state of connecting the solar cell and the wires.

[0024] Figure 3 shows the soldering process of the soldering device.

[0025] Figure 4 shows the stage of the soldering device.

[0026] Figure 5 shows the first cooling unit of the stage.

[0027] Figure 6 shows the main body.

[0028] Figure 7 shows the bottom surface of the second cooling unit.

[0029] Figure 8 shows the second cooling unit.

[0030] Figure 9 is an exploded perspective view of the bottom surfaces of the first upper panel and the second upper panel.

[0031] Optimal Embodiment of the Present Invention

[0032] The welding device includes: a stage for supporting a solar cell and a wire; a main body facing the stage; and a plurality of heaters positioned on the bottom surface of the main body to face the solar cell and the wire, wherein the stage includes a first cooling unit positioned in a region corresponding to the bottom surfaces of the solar cell and the wire mounted on the stage. Detailed implementation

[0033] Hereinafter, the present disclosure will be described with reference to the embodiments shown in the drawings. The embodiments of the present disclosure are not limited to the embodiments described in this specification and may have different forms. Therefore, the embodiments will be described below with reference to the drawings to describe aspects and features of the present invention.

[0034] The present disclosure includes various embodiments and modification examples, and specific embodiments of the present disclosure are shown in the drawings and described below. However, the present disclosure is not limited to the embodiments and includes all modifications, equivalents, or alternatives included in the spirit and scope of the present invention.

[0035] When an element or layer is referred to as "above" another element or layer, or "connected" or "coupled" to another element or layer, the element or layer can be directly connected or directly coupled to the other element or layer. Optionally, one or more elements or layers may be additionally present therebetween. When an element or layer is referred to as "directly above" another element or layer, "directly connected to" or "directly coupled to" another element or layer, no other intervening element or layer may be present therebetween. For example, when a first element is described as "coupled" or "connected" to a second element, the first element can be directly coupled or directly connected to the second element, or the first element can be indirectly coupled or indirectly connected to the second element through one or more intervening elements.

[0036] For clarity of illustration, the dimensions of various elements, layers, etc. in the drawings may be exaggerated. The same reference numerals may refer to the same elements. As used in this specification, the term "and / or" includes any and all combinations of one or more of the associated listed items. Further, when describing embodiments of the present disclosure, the use of "may" is related to "one or more embodiments of the present invention". When following a list of elements, expressions such as "at least one" and "any one" may modify the entire list of elements, but not individual elements in the list. For example, the expression "at least one of a, b, or c" may refer to only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof. As used in this specification, the terms "use", "using", and "used" may be understood to be synonymous with the terms "utilize", "utilizing", and "utilized", respectively. As used in this specification, the terms "substantially", "about", and "similar" are used as approximate terms and not as terms of degree, and are intended to describe the inherent deviations in measured or calculated values that would be recognized by a person of ordinary skill in the art.

[0037] In this specification, although terms such as "first", "second", "third", etc. may be used to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, without departing from the disclosure of the exemplary embodiments, a first element, first component, first region, first layer, or first section described below may be referred to as a second element, second component, second region, second layer, or second section.

[0038] For ease of description, spatial relative terms such as "below", "lower", "above", "upper", etc. may be used in this specification to describe the relationship of one element to another element (other elements), the relationship of a feature of one element to a feature (features) of another element (other elements), or the function (functions) depicted in the drawings. In addition to the directions depicted in the figures, spatial relative terms may include other directions of the device during use or operation. For example, when the device in the figures is flipped, an element described as "below" or "on the lower part of" another element or feature may then be oriented "above" or "on the upper part of" the other element or feature. Thus, the term "below" may include both upward and downward directions. The device may be oriented in other directions (rotated 90 degrees or oriented in another direction), and the spatial relative terms used in this specification should be interpreted accordingly.

[0039] The terms used in this specification are only for describing the embodiments of the present invention and are not intended to limit the present invention. As used in this specification, the singular forms may include the plural forms unless the context clearly indicates otherwise. When used in this specification, the terms "comprises", "has" and "includes" specify the presence of the clearly described features, wholes, steps, operations, elements and / or components, and do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their combinations.

[0040] In the case of embodiments that can be implemented by a process, a specific process sequence may be executed in an order different from the described order. For example, two sequentially described processes may be executed simultaneously or substantially simultaneously, or may be executed in an order opposite to the described order.

[0041] Figure 1 is a schematic diagram of the solder ribbon device 1, Figure 2 showing the state of connecting the solar cell C and the wire W, Figure 3 showing the soldering process of the soldering device 10, Figure 4 showing the stage 100 of the soldering device 10, Figure 5 showing the first cooling unit 110 of the stage 100, Figure 6 showing the main body 200, and Figure 7 showing the bottom surface of the second cooling unit 210, and is Figure 6 an enlarged view of part A of Figure 8 showing the second cooling unit 210, and Figure 9 is an exploded perspective view of the bottom surfaces of the first top panel 213 and the second top panel 214.

[0042] The solder ribbon device 1 is a device for connecting the solar cell C and the wire W to form a solar cell module. The solar cell C has a semiconductor bonding region with a p-n junction surface, and when a certain amount of energy or more is applied thereto, an electromotive force is generated to convert light energy into electrical energy. The material of the semiconductor included in the solar cell C is not particularly limited, and silicon (monocrystalline silicon, polycrystalline silicon or amorphous silicon), gallium arsenide, cadmium telluride, cadmium sulfide, indium phosphide, copper indium gallium selenide (CIGS), organic dyes or mixtures thereof can be used.

[0043] The wire W is a conductor for electrically connecting a plurality of solar cells C, and connects the front surface and the back surface of adjacent solar cells C. For example, the wire W can be electrically connected to the solar cell C by a soldering process. Optionally, the wire W can be electrically connected to the solar cell C with a conductive adhesive (ECA).

[0044] The wire fixture J holds the wire W such that when the solar cell C and the wire W are connected, the wire W does not float or deviate from the designated position. For example, as Figure 1 shown, in a state where the wire W is arranged on the wire transport device 40, the wire fixture J can be mounted on the wire transport device 40 to press the wire W. Optionally, the wire fixture J can be supported and transported by the moving device 50 to be described below.

[0045] For example, as Figure 1 shown, the soldering tape device 1 can include a soldering device 10, a solar cell transport device 20, a solar cell supply device 30, a wire transport device 40, a moving device 50, and a wire fixture transport device 60.

[0046] The soldering device 10 is positioned to perform the end process of the soldering tape device 1 and connect the wire W and the solar cell C to form a solar cell module. For example, when the solar cell C is mounted on the wire W, the soldering device 10 can melt the solder and then cool the solder to electrically connect the solar cell C and the wire W. The soldering device 10 will be described below.

[0047] The solar cell transport device 20 is positioned on one side of the soldering tape device 1 and transports the solar cell C to the solar cell supply device 30. For example, as Figure 1 shown, the solar cell transport device 20 can receive the solar cell C from the outside or pick up the solar cell C loaded in a magazine or the like and transport the solar cell C to the solar cell supply device 30. For example, the solar cell transport device 20 can be a conveyor for transporting the solar cell C in one direction. In addition, Figure 1 it is shown that there is one solar cell transport device 20, but the present invention is not limited thereto. The number of solar cell transport devices 20 can be two or more.

[0048] The solar cell supply device 30 divides the solar cell C received from the solar cell transport device 20 into corresponding appropriate sizes and transports the divided solar cell C to the moving device 50. For example, the solar cell supply device 30 can include a dicing cutter 31 and a stage 33.

[0049] The dicing cutter 31 divides the solar cell C received from the solar cell transport device 20 into solar cells C corresponding to sizes suitable for the solar cell module. For example, the dicing cutter 31 can irradiate the top surface of the solar cell C with a laser and then use a scribing device to divide the solar cell C into a plurality of solar cells C.

[0050] The stage 33 moves to a pre-specified position while supporting the divided solar cell C, enabling the moving device 50 to support the solar cell C. The stage 33 can move in the directions of three axes including the X-axis, Y-axis, and Z-axis, and rotate about the Z-axis to correct the position of the solar cell C. In addition, besides the solar cell C, the stage 33 can also support the wire clamp J. That is, the wire clamp J transported by the wire clamp transport device 60 described below is mounted on the stage 33, and the moving device 50 can support the solar cell C and the wire clamp J, and mount the solar cell C and the wire clamp J on the wire W.

[0051] The wire transport device 40 can be spaced apart from the solar cell supply device 30. The wire transport device 40 can transport a plurality of wires W. For example, the wire transport device 40 is a conveyor belt extending in a direction perpendicular to the moving direction of the cell-clamp transport unit 55, and can transport a plurality of wires W (e.g., six or more). The wires W can be spaced apart from each other by a predetermined interval. In this case, a welding material (e.g., solder) can be coated or plated on the wire W to be supplied to the wire transport device 40. For example, the embodiment can also include an impregnation unit (not shown) for coating or plating the wire W with the welding material, and the wire W passing through the impregnation unit can be supplied to the wire transport device 40. For example, when the cell-clamp transport unit 55 moves the solar cell C and the wire clamp J toward the wire W, the wire transport device 40 stops for a moment to allow the solar cell C and the wire clamp J to be mounted on the wire W. Then, the wire transport device 40 can operate again to transport the wire W.

[0052] The moving device 50 moves the solar cell C and the wire clamp J to the wire W. For example, as Figure 1 shown, the moving device 50 can be positioned across the wire transport device 40 and the wire clamp transport device 60. That is, in a plan view, the moving device 50 can overlap with the wire transport device 40 and the wire clamp transport device 60. In addition, the moving device 50 can include a first support member 51, a second support member 53, and a cell-clamp transport unit 55 that moves along the first support member 51.

[0053] The first support member 51 is a frame extending longitudinally across the wire clamp transport device 60 and the wire transport device 40, and both ends of the first support member 51 can be connected to the second support member 53. The second support member 53 can extend in a direction intersecting the first support member 51, and the first support member 51 can adjust the position of the cell-clamp transport unit 55 while moving in the longitudinal direction of the second support member 53.

[0054] The battery-jig transport unit 55 can move in the longitudinal direction of the first support 51, support the solar cell C and the wire jig J, and install the solar cell C and the wire jig J on the wire W. For example, the battery-jig transport unit 55 can simultaneously support or separately support the solar cell C and the wire jig J installed on the stage 33. In addition, the battery-jig transport unit 55 can install the supported solar cell C and the wire jig J on the wire W, which is installed on the wire transport device 40.

[0055] The wire clamp transport device 60 may be spaced apart from the solar cell supply device 40 and the wire transport device 50. The wire clamp transport device 60 receives the wire clamps J and transports the wire clamps J to the moving device 50. The wire clamp transport device 60 moves the plurality of wire clamps J toward the stage 33 and stops the wire clamps J at the end portion adjacent to the stage 33. In this state, a transfer device (not shown) may transfer the wire clamps J onto the stage 33.

[0056] refer to Figure 1 and Figure 2 , a ribbon bonding process using a ribbon bonding apparatus 1 having a wire W, a solar cell C, and a wire fixture J will be described.

[0057] First, when the wire W is supplied by the wire transport device 40 (see Figure 2 (a)), the mobile device 50 installs the paired solar cells C and the wire clamp J on the wire W (see Figure 2 Then, the wire transport device 40 installs other wires W on the solar cell C (see Figure 2 (c)), and the moving device 50 installs the paired solar cells C and the wire clamps J on the other wires W (see Figure 2 (d)). In addition, the wire transport device 40 installs other wires W on the solar cell C (see Figure 2 (e)), and the moving device 50 installs another pair of solar cells C and wire clamps J on the other wires W (see Figure 2 (f)). Therefore, the solar cell C and the wire W can be electrically connected, and the wire clamp J can support the wire W until the welding process to prevent the wire W from deviating from the specified position.

[0058] The welding device 10 may heat the solar cell C and the wire W. For example, the welding device 10 may heat the solder on the surface of the wire W to a temperature that melts the solder. Therefore, the wire W and the solar cell C may be thermally bonded by the melted solder and physically and electrically connected.

[0059] refer to Figures 3 to 9, the welding apparatus 10 may include a stage 100, a main body 200, and a heater 300.

[0060] The stage 100 supports the solar cell C and the wire W. For example, the stage 100 receives the solar cell C, the wire W, and the wire jig J that supports the solar cell C and the wire W from the wire transfer device 40, and supports the solar cell C, the wire W, and the wire jig J. Here, the solar cell C, the wire W, and the wire jig J mounted on the stage 100 may have Figure 2 the form shown in. In addition, the stage 100 may support the solar cell C and the wire W, and move the solar cell C and the wire W to a designated position.

[0061] The stage 100 may be in the form of a conveyor. For example, the stage 100 may be part of the conveyor of the wire transfer device 40 or a separate conveyor connected to the conveyor of the wire transfer device 40.

[0062] In another embodiment, the stage 100 may move independently. For example, the stage 100 is a shuttle transfer device, and may transfer the solar cell C and the wire W while reciprocating between the end portion of the wire transfer device 40 and the discharge position. For example, the stage 100 may move to the wire transfer device 40 to receive the solar cell C and the wire W, and move to a position corresponding to the main body 200 for the welding process. After the welding process is completed, the stage 100 may move to the discharge position.

[0063] For example, the stage 100 may cool the solder, the solar cell C, and the wire W that are melted during the welding process. For example, as Figure 3 shown in, after the solder is melted on the solar cell C and the wire W, the stage 100 may cool the solar cell C and the wire W at a position below the main body 200. Optionally, as Figure 3 shown in, the stage 100 may move to a position where the stage 100 does not overlap with the main body 200, and then cool the melted solder, the solar cell C, and the wire W. Therefore, the time required for natural cooling of the melted solder can be reduced.

[0064] For example, the stage 100 may include a first cooling unit 110. The first cooling unit 110 may emit air toward a solar cell C and a wire W on which solder is melted to cool the solar cell C and the wire W. For example, when a plurality of heaters 300 irradiate the solar cell C and the wire W mounted on the stage 100 with light or apply heat to the solar cell C and the wire W to melt the applied solder, the first cooling unit 110 may emit air at a position of the stage 100 facing the plurality of heaters 300 to cool the melted solder, the solar cell C, and the wire W. Optionally, in a state where the stage 100 is moved to a position where the stage 100 does not overlap with the plurality of heaters 300, the first cooling unit 110 may emit air to cool the melted solder, the solar cell C, and the wire W.

[0065] For example, the first cooling unit 110 may jet air toward the bottom surfaces of the solar cell C and the wire W mounted on the stage 100. For example, the first cooling unit 110 may support the solar cell C and the wire W and emit air toward the bottom surfaces of the solar cell C and the wire W to cool the solar cell C and the wire W.

[0066] For example, the first cooling unit 110 may include a lower air inlet 111, a first lower plate 112, and a second lower plate 113.

[0067] The lower air inlet 111 is positioned on the bottom surface of the first cooling unit 110 and may supply cooling air. For example, as shown in Figure 4 , the lower air inlet 111 is positioned on the bottom surface of the first cooling unit 110 to overlap the center of the first cooling unit 110 and may be connected to an air supply source (not shown). The lower air inlet 111 may be connected to an air distribution flow path 1131 through an air supply flow path 1121 provided in the first lower plate 112.

[0068] The lower air inlet 111 is positioned on the bottom surface of the first lower plate 112, and the first lower plate 112 has an air supply flow path 1121 communicating with the lower air inlet 111 therein. One end of the air supply flow path 1121 may communicate with the lower air inlet 111, and the other end may communicate with the air distribution flow path 1131. Accordingly, the air introduced into the lower air inlet 111 from the air supply source may be introduced into the air distribution flow path 1131 through the air supply flow path 1121 and emitted toward the solar cell C and the wire W through an air nozzle 1132.

[0069] For example, the number of the first lower plates 112 may be the same as the number of the wires W. For example, when the number of the wires W corresponding to one solar cell C is six, the number of the first lower plates 112 may be six. Each of the first lower plates 112 may have an independent air supply flow path 1121, and the lower air inlet 111 may be arranged corresponding to each air supply flow path 1121. Therefore, the first lower plates 112 may selectively and independently emit air at positions corresponding to the plurality of wires W to cool the solder, the solar cell C, and the wires W.

[0070] The second lower plate 113 may directly support the solar cell C and the wires W, and may be positioned on the first lower plate 112. For example, as Figure 4 shown, the second lower plate 113 may be positioned on the first lower plate 112 and support the wires W, the solar cell C, and the wire fixture J stacked in sequence in the height direction. The second lower plate 113 may emit air toward the wires W and the solar cell C to cool the molten solder.

[0071] For example, the second lower plate 113 may include an air distribution flow path 1131 and air nozzles 1132. As Figure 4 shown, the air distribution flow path 1131 may extend in the longitudinal direction of the second lower plate 113 and may be positioned inside the second lower plate 113. In addition, the air distribution flow path 1131 may communicate with the air supply flow path 1121.

[0072] A plurality of air nozzles 1132 may be positioned on the top surface of the second lower plate 113 and communicate with the air distribution flow path 1131. The plurality of air nozzles 1132 may be spaced apart from each other in the longitudinal direction of the second lower plate 113. Therefore, when air is supplied from an air supply source, the air introduced along the air distribution flow path 1131 is emitted through the plurality of air nozzles 1132 to cool the molten solder, the solar cell C, and the wires W.

[0073] For example, the number of the second lower plates 113 may be the same as the number of the wires W. For example, when the number of the wires W corresponding to one solar cell C is six, the number of the second lower plates 113 may be six. Each of the second lower plates 113 may have an independent air distribution flow path 1131 and independent air nozzles 1132, and may be connected to the air supply flow path 1121 of each first lower plate 112. Therefore, the second lower plates 113 may selectively and independently emit air at positions corresponding to the plurality of wires W to cool the molten solder, the solar cell C, and the wires W.

[0074] For example, as Figure 5As shown, a plurality of second lower plates 113 may be spaced apart from each other in one direction (e.g., in a direction perpendicular to the direction of movement of the solar cell C and the wire W). The plurality of second lower plates 113 may be spaced apart from each other by an interval W1, and the intervals between the second lower plates 113 may be the same. Here, the interval W1 is the interval between the wires W, and the wires W may be arranged on each second lower plate 113. That is, the second lower plates 113 have the same number and interval as the plurality of wires W for the solar cell C, thereby effectively cooling the solder, the solar cell C, and the wires W.

[0075] For example, a plurality of air nozzles 1132 may be spaced apart from each other by an interval L1. The interval L1 may vary based on the length of the solar cell C. For example, the interval L1 may be in the range of 5% to 15% of the length of the solar cell C (in the direction of movement of the solar cell C and the wire W). When the interval L1 is less than 5% of the length of the solar cell C, the number of air nozzles 1132 becomes excessive, and thus the pressure of the air ejected from the air nozzles 1132 may be insufficient, and interference may occur between adjacent air nozzles 1132. In addition, when the interval L1 exceeds 15% of the length of the solar cell C, the interval between the air nozzles 1132 becomes excessive, and thus it is difficult to uniformly cool the solder, the solar cell C, and the wires W.

[0076] In addition, the number of air nozzles 1132 is not particularly limited. For example, as Figure 5 shown, two or more (especially 7 or more) air nozzles 1132 may be provided on one side centered on the support frame 130.

[0077] For example, the air nozzles 1132 may have a diameter larger than the width of the wires W to effectively cool the molten solder.

[0078] For example, the stage 100 may include a main frame 120 and a support frame 130.

[0079] As Figure 4 shown, the main frame 120 is positioned below the first cooling unit 110 and supports other components of the stage 100. The support frame 130 is positioned on the main frame 120 and connects the first cooling unit 110 to the main frame 120. For example, the support frame 130 is positioned at the center of the stage 100, extends in the width direction, and has a bottom surface positioned on the main frame 120 and a top surface capable of supporting the second lower plates 113.

[0080] For example, a plurality of first cooling units 110 may be provided. For example, as Figure 4As shown, the first cooling units 110 may be positioned symmetrically with respect to each other, one on one side of the support frame 130 and one on the other side of the support frame 130. Each first cooling unit 110 may support and cool one or more solar cells C.

[0081] For example, one first cooling unit 110 may support and cool a plurality of solar cells C. For example, one first cooling unit 110 may support and cool two or more solar cells C and the wires W and wire clamps J corresponding to the solar cells C on their top surfaces.

[0082] The stage 100 may further include an exhaust flow path 140. The exhaust flow path 140 is positioned inside the stage 100 and may discharge the air that is introduced through the lower air inlet 111 and cools the solder, the solar cells C, and the wires W to the outside of the apparatus. For example, as Figure 4 shown, the exhaust flow path 140 is positioned inside the first lower plate 112 and may communicate with the air supply flow path 1121 and / or the air distribution flow path 1131. When the injection of air for cooling is completed from the lower air inlet 111, some of the injected air may be discharged to the outside of the stage 100 while being emitted through the air nozzles 1132, and the remaining air may be re-introduced into the air distribution flow path 1131 and then discharged to the outside of the stage 100 through the exhaust flow path 140.

[0083] With this structure, since the stage 100 that supports the solar cells C and the wires W performs the function of cooling the solder, the solar cells C, and the wires W, the soldering apparatus 10 may reduce the time required for cooling and solidification. In addition, since the soldering apparatus 10 emits air from the surface directly below the solar cells C and the wires W, it is possible to effectively cool the solder, the solar cells C, and the wires W. In addition, the soldering apparatus 10 may cool the solder, the solar cells C, and the wires W intensively and independently by providing the second lower plates 113 equal in number to the wires W.

[0084] The main body 200 is positioned to face the stage 100 and may apply heat to the solar cells C and the wires W mounted on the stage 100. Specifically, the main body 200 may heat the solder positioned on the surface of the wire W until the temperature at which the solder melts.

[0085] For example, the main body 200 may cool the solar cells C and the wires W mounted on the stage 100. For example, the main body 200 may use the heater 300 to irradiate the solar cells C and the wires W with light to melt the solder on the wires W and then emit air to cool the solar cells C and the wires W.

[0086] For example, the main body 200 may include a second cooling unit 210. For example, the second cooling unit 210 may be positioned inside the main body 200 to face the bottom surface of the main body 200. For example, the second cooling unit 210 may emit air toward the solder, the solar cell C, and the wire W positioned on the stage 100 to cool the solder, the solar cell C, and the wire W.

[0087] For example, the second cooling unit 210 may include an upper air inlet 211, a connection plate 212, a first upper panel 213, and a second upper panel 214.

[0088] A plurality of upper air inlets 211 are positioned on one side of the second cooling unit 210 and are connected to an air supply source (not shown) from which air is injected. For example, as Figure 8 shown, the plurality of upper air inlets 211 may be positioned at a predetermined interval in the longitudinal direction of the solar cell C. The air injected into the upper air inlet 211 may be emitted to the solder, the solar cell C, and the wire W through the first upper panel 213 and the second upper panel 214.

[0089] For example, two rows of upper air inlets 211 may be positioned at two end portions of the solar cell C in the width direction.

[0090] The connection plate 212 is a member that connects the second cooling unit 210 to the main body 200 and may have a plurality of upper air inlets 211 positioned on one side and a first upper panel 213 positioned on the other side. For example, as Figure 8 shown, the connection plate 212 is a square frame having an empty inner side, and the plurality of upper air inlets 211 may be positioned in two rows on the top surface of the connection plate 212. In addition, the first upper panel 213 may be positioned on the bottom surface of the connection plate 212, and the second upper panel 214 may be positioned below the first upper panel 213.

[0091] For example, the connection plate 212 may have an internal flow path through which the plurality of upper air inlets 211 communicate with the first upper panel 213. The air injected from the upper air inlet 211 may move through the connection plate 212 to the first upper panel 213.

[0092] The first upper panel 213 may be positioned below the connection plate 212. For example, as Figure 8 and Figure 9 shown, two end portions of the first upper panel 213 may be positioned on the bottom surface of the connection plate 212 and are connected to the corresponding pairs of upper air inlets 211.

[0093] For example, the first upper panel 213 may include an air supply port 2131, an air distribution flow path 2132, and an air distribution slit 2133.

[0094] The air supply ports 2131 are positioned on one side and the other side of the first upper panel 213 to correspond to the upper air inlet 211. For example, as Figure 9 shown, the air supply ports 2131 are positioned to correspond to both ends of the air distribution flow path 2132, and the upper air inlet 211 communicates with the air distribution flow path 2132 through the air supply ports 2131.

[0095] The air distribution flow path 2132 is a groove in the bottom surface of the first upper panel 213 and extends in the longitudinal direction of the first upper panel 213, and both ends of the air distribution flow path 2132 are connected to the air supply ports 2131. The air distribution flow path 2132 is connected to a plurality of air distribution slits 2133 to distribute the air introduced through the air supply ports 2131 to the air distribution slits 2133. In addition, the air distribution flow path 2132 may extend in a direction perpendicular to the direction of movement of the solar cell C and the wire W (i.e., in the width direction of the solar cell C).

[0096] For example, the air distribution flow path 2132 may overlap with a plurality of air nozzles 2141 of the second upper panel 214. As Figure 9 shown, the air distribution flow path 2132 overlaps with some of the multiple rows of air nozzles 2141, and thus some of the air introduced into the air distribution flow path 2132 can move to the air distribution slits 2133, and the remaining air can be emitted through the air nozzles 2141 that overlap below the air distribution flow path 2132.

[0097] A plurality of air distribution slits 2133 are positioned on the bottom surface of the first upper panel 213 and extend from one side and the other side of the air distribution flow path 2132. The air distribution slits 2133 distribute the air introduced into the air distribution flow path 2132 in various directions so that the air is emitted to the plurality of air nozzles 2141. For example, as Figure 9 shown, the air distribution slits 2133 may extend in a direction perpendicular to the air distribution flow path 2132 and correspond to a plurality of air nozzles 2141 positioned below the air distribution slits.

[0098] For example, the air distribution slits 2133 may have a depth smaller than that of the air distribution flow path 2132. Since the air distribution slits 2133 (through which air is introduced at a flow rate smaller than that of the air distribution flow path 2132) have a depth smaller than that of the air distribution flow path 2132, the components required for processing can be reduced. In particular, it is possible to prevent the air introduced from the air distribution flow path 2132 from oscillating in the air distribution slits 2133 and forming eddy currents.

[0099] The second upper panel 214 is positioned below the first upper panel 213 and may include a plurality of air nozzles 2141. For example, as Figure 9 shown, the second upper panel 214 is a plate-shaped member positioned below the first upper panel 213 and may include multiple rows of air nozzles 2141. The air nozzles 2141 may be positioned to correspond to the air distribution flow path 2132 and the air distribution slit 2133. Accordingly, the air injected into the upper air inlet 211 may be emitted to the solar cell C and the wire W through the air supply port 2131, the air distribution flow path 2132, the air distribution slit 2133, and the air nozzles 2141.

[0100] For example, one air distribution slit 2133 may correspond to a plurality of air nozzles 2141. For example, one air distribution slit 2133 may correspond to two or more air nozzles 2141.

[0101] For example, the plurality of air nozzles 2141 may be positioned to form multiple rows. As Figure 7 shown, the plurality of air nozzles 2141 may be spaced apart from each other by a distance L2 in one direction (e.g., in the width direction of the solar cell C) to form a row. In addition, the rows of the plurality of air nozzles 2141 may be spaced apart from each other by a distance W2 in the moving direction of the solar cell C and the wire W.

[0102] Here, the distance L2 and the distance W2 may vary based on the size of the solar cell C. For example, the distance L2 may be in the range of 5% to 15% of the width of the solar cell C (in the direction perpendicular to the moving direction of the solar cell C and the wire W). When the distance L2 is less than 5% of the width of the solar cell C, the number of air nozzles 2141 included in a row becomes excessive, and thus the pressure of the air emitted from the air nozzles 2141 may be insufficient, and interference may occur between adjacent air nozzles 2141. In addition, when the distance L2 exceeds 15% of the width of the solar cell C, the interval between the air nozzles 2141 becomes excessive, and thus it is difficult to uniformly cool the solar cell C and the wire W.

[0103] In addition, the interval W2 can be in the range of 10% to 20% of the length of the solar cell C (in the moving direction of the solar cell C and the wire W). When the interval W2 is less than 10% of the length of the solar cell C, the total number of the air nozzles 2141 becomes excessive, and thus the pressure of the air emitted from the air nozzles 2141 may be insufficient, and interference may occur between adjacent rows of the air nozzles 2141. In addition, when the interval W2 exceeds 20% of the length of the solar cell C, the interval between the rows of the air nozzles 2141 becomes excessive, so it is difficult to uniformly cool the solar cell C and the wire W.

[0104] For example, a plurality of air nozzles 2141 can be positioned between the heaters 300. For example, as Figure 6 and Figure 7 shown, the rows of the plurality of air nozzles 2141 and the heaters 300 can be alternately positioned in the moving direction of the solar cell C and the wire W. Therefore, the area cooled by the main body 200 and the area irradiated by the heaters 300 with light overlap, and thus the welding device 10 can be formed to be compact and the curing process can be effectively performed.

[0105] For example, the plurality of air nozzles 1132 provided in the first cooling unit 110 and the plurality of air nozzles 2141 provided in the second cooling unit 210 are spaced apart from each other in different directions. For example, as Figure 5 shown, the plurality of air nozzles 1132 can be spaced apart from each other in a row in a second lower plate 113 in the transporting direction of the wire W. On the other hand, as Figure 7 shown, the plurality of air nozzles 2141 can be spaced apart from each other in a row in a second upper panel 214 in a direction perpendicular to the transporting direction of the wire W.

[0106] For example, the plurality of air nozzles 1132 provided in the first cooling unit 110 and the plurality of air nozzles 2141 provided in the second cooling unit 210 may not overlap with each other. That is, the air nozzles 2141 can be positioned between adjacent air nozzles 1132 so that the cooling areas formed by the air nozzles 1132 and the air nozzles 2141 do not overlap with each other. This configuration can improve the cooling efficiency.

[0107] For example, the main body 200 can cool a plurality of solar cells C and the wires W corresponding to the solar cells C. For example, as Figure 6 shown, the main body 200 can include a plurality of (for example, 4) second cooling units 210, and each second cooling unit 210 can include a pair of first upper panels 213 and second upper panels 214. In addition, the pair of first upper panels 213 and second upper panels 214 can have a size corresponding to one solar cell C.

[0108] The heater 300 is positioned on one side of the main body 200 and irradiates the solar cell C and the wire W coated with solder with light of a specific wavelength to melt the solder. For example, the heater 300 is an ultraviolet lamp that irradiates the solder applied to the wire W with ultraviolet light to melt the solder. A plurality of heaters 300 may be positioned at intervals from each other in the longitudinal direction of the solar cell C. Optionally, the heater 300 may apply heat at a predetermined temperature to melt the solder applied to the wire W.

[0109] Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely examples. Those skilled in the art will be fully aware of various modifications and other equivalent embodiments that can be made from the embodiments. Therefore, the true technical protection scope of the present invention should be determined based on the appended claims.

[0110] The specific technical content described in the embodiments is merely an example and does not limit the technical scope of the embodiments. In order to describe the present invention concisely and clearly, the description of general techniques and configurations in the prior art may be omitted. In addition, the connection or non-connection of the lines between the components shown in the drawings is merely an example of functional connection and / or physical or circuit connection, and in an actual device, it may be represented by various alternative or additional functional connections, physical connections or circuit connections. In addition, components not specifically mentioned (such as "basic" or "important") may not be absolutely necessary components for the application of the present invention.

[0111] Unless otherwise specifically defined, the terms "above", "the" and similar indicative terms used in the description and claims of the present invention may mean both singular and plural. In addition, when describing a range in an embodiment, it is considered that the present invention includes inventions applying each value belonging to the range (unless otherwise described), and it is the same as each individual value constituting the range described in the description of the present invention. In addition, when there is no clear description or contradiction regarding the order of the steps constituting the method according to the embodiment, the steps may be executed in any appropriate order. The embodiment is not necessarily limited to the order of the steps described above. The use of any example or exemplary terms (such as "for example", "etc.") in the embodiment is only intended to describe the embodiment in detail, and does not limit the scope of the embodiment by virtue of these example or exemplary terms, unless otherwise limited by the claims. In addition, those skilled in the art will understand that various modifications, combinations and changes can be made according to the design conditions and factors within the scope of the appended claims or their equivalents.

[0112] Industrial Applicability

[0113] The present invention can be used in industries related to welding devices and tape equipment including such welding devices.

Claims

1. A welding device, comprising: a stage for supporting a solar cell and a wire; a main body facing the stage; and a plurality of heaters positioned on a bottom surface of the main body to face the solar cell and the wire, wherein the stage includes a first cooling unit positioned in a region corresponding to bottom surfaces of the solar cell and the wire mounted on the stage.

2. The welding device according to claim 1, wherein, When the plurality of heaters irradiate the solar cell and the wire mounted on the stage with light, the stage emits air from the first cooling unit at a position of the stage facing the plurality of heaters or at a position of the stage not overlapping with the plurality of heaters to cool the solar cell and the wire.

3. The welding device according to claim 2, wherein, The first cooling unit includes: a lower air inlet; a first lower plate having a flow path through which air is introduced from the lower air inlet; and a second lower plate having a top surface on which the solar cell and the wire are mounted, an air distribution flow path communicating with the flow path of the first lower plate, and a plurality of air nozzles communicating with the air distribution flow path and emitting air toward the solar cell and the wire.

4. The welding device according to claim 3, wherein, The first cooling units are positioned in the same number and at intervals corresponding to a plurality of wires mounted on the stage.

5. The welding device according to claim 1, further comprising a second cooling unit positioned on the bottom surface of the main body and emitting air toward the solar cell and the wire mounted on the stage.

6. The welding device according to claim 5, wherein, The second cooling unit includes: an upper air inlet; a first upper panel having a flow path through which air is introduced from the upper air inlet; and a second upper panel positioned on a bottom surface of the first upper panel and including a plurality of air nozzles communicating with the flow path.

7. The welding device according to claim 6, wherein, The plurality of air nozzles are alternately positioned with the plurality of heaters in one direction.

8. The welding device according to claim 6, wherein, The first upper panel includes: a pair of air supply ports corresponding to the upper air inlet; an air distribution flow path formed on the bottom surface of the first upper panel and communicating with the pair of air supply ports; and a plurality of air distribution slits extending from the air distribution flow path and overlapping with the plurality of air nozzles of the second upper panel.

9. The welding device according to claim 5, wherein, The plurality of air nozzles provided in the first cooling unit and the plurality of air nozzles provided in the second cooling unit are spaced apart from each other in different directions.

10. A solder tape device, comprising: a solar cell supply device for supplying solar cells; a wire transport device spaced apart from the solar cell supply device and supplying a plurality of wires; a wire jig transport device spaced apart from the solar cell supply device and the wire transport device and supplying a wire jig for supporting the solar cell and the wire; a moving device for supplying the solar cell and the wire jig onto the wires arranged on the wire transport device; and A welding device that allows the solar cell and the wire clamp to be mounted on the wire and then welds the solar cell and the wire. Wherein, the welding device is the welding device according to any one of claims 1 to 9.

11. The solder tape device according to claim 10, further comprising an impregnation unit that coats or plates the plurality of wires with solder and supplies the wires to the wire transport device.

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