Tin immersion device for inductance coil

Abstract

The invention provides a tin immersion device for inductance coils, and relates to a tin immersion device, the tin immersion device comprises a tin immersion positioning tool, the tin immersion positioning tool comprises a first side base plate, a sleeve pressing plate and a second side base plate which are sequentially distributed in parallel, the first side base plate is provided with multiple sets of core columns which are linearly distributed side by side, the inductance coils sleeve the core columns in a one-to-one correspondence mode, and the second side base plate is provided with multiple sets of core columns. A core hole which is connected outside the core column in a guiding and sleeving mode is formed in the sleeve pressing plate, guide columns are further arranged on the first side base plate to be connected with the sleeve pressing plate in a sleeving mode, four sets of jacking springs which are correspondingly connected outside the four sets of guide columns in a sleeving mode are further arranged between the sleeve pressing plate and the first side base plate, and guide sleeves which are connected outside the guide columns in a guiding mode are arranged on the second side base plate. The automatic tin immersion device is used for solving the problems that in the prior art, batch tin immersion operation is complex, and taking-out is inconvenient after tin immersion is conducted, and through automatic design, manual intervention can be reduced, the production efficiency can be improved, and the tin immersion time can be shortened.

Description

Technical Field

[0001] The present invention relates to a tin dipping device, in particular to a tin dipping device for inductance coils. Background Art

[0002] An inductance coil is an electronic component that works based on the principle of electromagnetic induction. It is usually wound by multiple turns of wire, and the wire is coated with an insulating layer. By passing an electric current, a magnetic field is formed. When connecting to other components, the pin terminals of the inductance coil need to be subjected to tin dipping treatment first and then connected to other components through soldering to ensure the tightness and reliability of the connection. The main function of the tin dipping process is to coat a tin layer on the metal surface to prevent metal oxidation and promote soldering.

[0003] In existing tin dipping equipment, a crossbeam design is usually adopted. As shown in the coil support structure for a patent tin dipping machine (publication number CN217316297U), multiple inductance coils to be dipped are directly hung on the crossbeam support for batch tin dipping treatment. However, in the actual production process, it is found that this design is rather cumbersome in batch loading of coils, and the coils after tin dipping are not taken out quickly enough, so it will also affect the efficiency of mass production. Summary of the Invention

[0004] In order to solve the above technical problems, the purpose of the present invention is to provide a tin dipping device for inductance coils, which is used to solve the problems of complex batch tin dipping operation and inconvenient taking out after tin dipping in the prior art. Through an automated design, the present invention can reduce manual intervention, improve production efficiency, shorten the tin dipping time, and at the same time ensure the stable tin dipping quality of the coils.

[0005] The present invention provides the following technical solutions:

[0006] A tin dipping device for inductance coils includes a tin dipping positioning tooling. The tin dipping positioning tooling includes a side substrate one, a sleeve pressing plate, and a side substrate two that are sequentially and parallelly distributed. A plurality of groups of core columns are arranged in a linear and side-by-side manner on the side substrate one, and the inductance coils are sleeved on the core columns one by one. Core holes are formed on the sleeve pressing plate and are sleeved on the core columns in a guiding manner. Four guide columns are arranged in a rectangular distribution at the four corners of the side substrate one. Guide holes are also formed on the sleeve pressing plate and are in guiding connection with the guide columns. Four groups of top pressure springs are correspondingly sleeved outside the four groups of guide columns between the sleeve pressing plate and the side substrate one. A guide sleeve is arranged on the side substrate two and is in guiding connection outside the guide columns. The side substrate one and the side substrate two are also driven by a pulling cylinder. The pulling cylinder is used to adjust the distance between the side substrate one and the side substrate two, and drive the guide sleeve to press the sleeve pressing plate to compress the top pressure springs to limit the inductance coils between the sleeve pressing plate and the side substrate two;

[0007] At this point, when it is necessary to take out the inductor coil after tin dipping, only the pulling cylinders located at the left and right ends of the side substrate 1 and the side substrate 2 need to be started, so that the distance between the side substrate 1 and the side substrate 2 is enlarged. Then, the sleeve pressing plate can drive the inductor coil on one side to move towards the end of the core column under the action of the top pressing spring until the inductor coil is separated from the core column. At this time, the core column can fall into the device below for receiving the inductor coil, thereby improving the efficiency of mass production of products.

[0008] Preferably, two sets of sealing plates are further arranged on the side substrate 1. The sealing plates are vertically distributed with the side substrate 1, and U-shaped grooves through which the connection heads of the inductor coil pass are also arranged on the sealing plates.

[0009] The arrangement of the sealing plates can ensure that when the pin connection heads of the inductor coil are tin dipped, the tin liquid will not splash onto the inductor coil, playing a certain protective role. The arrangement of the two sets of sealing plates can correspond to the situation of the pin connection heads at both ends.

[0010] Preferably, an end block is further arranged at the end of the guide post, and an end groove for guiding connection with the end block is also arranged in the guide sleeve. Therefore, when the pulling cylinder drives the side substrate 2 away from the side substrate 1, even when it is separated from the side substrate 1, it can ensure that the sleeve pressing plate will not be separated from the guide post under the top pressure of the top pressing spring, so as to improve the stability of the tooling.

[0011] Preferably, linear T-shaped guide bars are further arranged on the outer sides of the side substrate 1 and the side substrate 2. The tin dipping device for the inductor coil further includes a set of rotating column groups. At least two sets of installation grooves are evenly arranged along the circumference of the rotating column groups. Two sets of relatively arranged T-shaped guide grooves are arranged in each set of installation grooves, and the two sets of relatively arranged T-shaped guide grooves are correspondingly slidably connected with the two T-shaped guide bars of a set of tin dipping positioning tooling.

[0012] At this point, it can be ensured that a set of tin dipping positioning tooling can slide into a set of installation grooves from one end of the rotating column group, and then can rotate to the tin dipping station along with the rotating column group. At the tin dipping station, when the tin liquid tank is lifted by the top cylinder for tin dipping operation, it can also perform the feeding operation of the next set of tin dipping positioning tooling and the discharging operation after tin dipping at the feeding station at the same time, so as to achieve a more efficient mass production operation.

[0013] Preferably, there are four mounting grooves on the rotating column group, and the rotating column group is driven to rotate by a rotating motor located at one end. When the mounting groove rotates to the topmost position, it is at the loading station. At the loading station, the T-shaped guide groove is used to receive the soldering immersion positioning tooling pushed to the mounting groove during loading. In addition, two limiting cylinders for limiting the two ends of the T-shaped guide bar are provided in the mounting groove. When the leading end of the T-shaped guide bar slides to abut against the driving end of one limiting cylinder, the driving end of the other limiting cylinder extends to abut against the trailing end of the T-shaped guide bar, thus completing the limiting of the loading. After loading, the soldering immersion positioning tooling rotates with the rotating column group and is positioned at the inspection station, soldering station, and unloading station in sequence to perform the inspection, soldering, and unloading operations of the inductor coil.

[0014] Preferably, at the inspection station, an inspection camera is provided for taking pictures of the inductor coil to detect whether it has been loaded. At the soldering station, the solder bath is lifted by a top cylinder so that the solder submerges the lead connection head of the inductor coil. At the unloading station, a unloading push rod is provided for pushing the soldering immersion positioning tooling out of the T-shaped guide groove and into the unloading guide groove.

[0015] After unloading is completed, the rotating column group rotates 90° again so that the empty mounting groove returns to the loading station again. At this time, the soldering immersion positioning tooling in the loading guide groove is pushed into the mounting groove by the loading push rod, and a limiting cylinder in the mounting groove extends again to limit the soldering immersion positioning tooling pushed into the mounting groove by the loading push rod, thereby completing the cycle. This cycle is applicable to the case where there are two lead connection heads at one end of the coil.

[0016] Preferably, at the inspection station, it is replaced with an operation that combines turning over and feeding. At the loading station, the loading guide groove is docked with the T-shaped guide groove, and the loading push rod is used to push the soldering immersion positioning tooling in the loading guide groove into the T-shaped guide groove. After the loading push rod pushes each group of soldering immersion positioning tooling, the rotating column group then rotates 90°. After the loading push rod continuously pushes three groups of soldering immersion positioning tooling for feeding, when the rotating column group continues to rotate 90° so that the loading guide groove is docked with the T-shaped guide groove, the loading push rod pauses feeding once. And when it pauses feeding three times in a row, when the rotating column group continues to rotate 90° so that the loading guide groove is docked with the T-shaped guide groove, the loading push rod continues to perform the feeding operation. After pausing feeding at the loading station, when the empty mounting groove rotates to the inspection station, an operation of turning over and feeding is performed.

[0017] Preferably, at the unloading station, a set of movable guide grooves is also aligned between the fixed unloading guide groove and the mounting groove. The movable guide groove is installed at the driving end of the reciprocating cylinder through a U-shaped bracket. The reciprocating cylinder is used to drive the movable guide groove to reciprocate between the inspection station and the unloading station, and a reciprocating push rod for pushing the movable guide groove to move back and forth is also provided on the U-shaped bracket.

[0018] When each group of tin dipping positioning tooling drives the inductance coil to enter the movable guide groove for the first time by the reciprocating push rod, the reciprocating cylinder drives the movable guide groove to move linearly to the detection station so that the movable guide groove is docked with the installation groove. Then, the reciprocating push rod pushes the tin dipping positioning tooling in the movable guide groove back to the empty installation groove at the detection station. Then, the reciprocating cylinder drives the movable guide groove back to the blanking station again. And when this group of tin dipping positioning tooling drives the inductance coil to enter the movable guide groove for the second time by the reciprocating push rod, the blanking push rod continues to push the tin dipping positioning tooling in the movable guide groove into the blanking guide groove; thus, the tin dipping situation when the two groups of lead connection heads are at both ends of the coil can be completed.

[0019] That is, at the loading station, after feeding three times in succession, a state is formed where there is tin dipping positioning tooling at the detection station, tin dipping station, and blanking station. At this time, the loading station is in an empty state. After corresponding detection, tin dipping, and blanking operations are completed at the detection station, tin dipping station, and blanking station, the rotating column group continues to rotate 90°. At the same time, the movable guide groove at the blanking station will also linearly return the first-entering tin dipping positioning tooling to the detection station. At this time, the direction of the pin connection head of the inductance coil is reversed. When the reversed inductance coil rotates 90° again with the rotating column group and enters the tin dipping station, tin dipping of the pin connection head on the other side of the inductance coil can be achieved. And after the movable guide groove continuously sends back the tin dipping positioning tooling three times, the tin dipping positioning tooling received by the movable guide groove when it returns to the blanking station again is the tin dipping positioning tooling after secondary tin dipping. At this time, the blanking push rod installed on one side of the blanking guide groove can continue to push the tin dipping positioning tooling in the movable guide groove into the blanking guide groove. And after three consecutive blanking operations are completed, the operation of returning the movable guide groove to the detection station for reverse feeding continues. At this time, compared with the traditional method of manually taking out the inductance coil, reversing it, and then continuing tin dipping, it is more convenient and faster, and the tin dipping stability is also better.

[0020] The beneficial effects of the present invention are as follows: A tin dipping device for inductance coils provided by the present invention is used to solve the problems of complex batch tin dipping operations and inconvenient taking out after tin dipping in the prior art. And through automated design, the present invention can reduce manual intervention, improve production efficiency, shorten the tin dipping time, and at the same time ensure the stable tin dipping quality of the coil; specifically, when it is necessary to take out the inductance coil after tin dipping, only need to start the pulling cylinders at the left and right ends of the side substrate one and side substrate two on the side, so that the distance between the side substrate one and the side substrate two is enlarged. Then, the sleeve pressing plate can drive the inductance coil on one side to move towards the end of the core column under the drive of the top pressure spring until the inductance coil is separated from the core column. At this time, the core column can fall into the device below for receiving the inductance coil, thereby improving the production efficiency of product batch production.

[0021] At the same time, the present invention is also compatible with batch tinning operations at one or both ends of the terminal; specifically, by adding a rotating column group, it can be ensured that a group of tinning positioning tools can slide into a group of installation grooves from one end of the rotating column group, and then can be rotated to the tinning station with the rotating column group. At the tinning station, when the tin liquid tank is lifted by the top cylinder for tinning, the next group of tinning positioning tools can be loaded at the loading station and the unloading operation after tinning can be carried out, so as to achieve more efficient batch production operations. After unloading is completed, the rotating column group is rotated again by 90° to make the vacant installation groove return to the loading station again. At this time, the tinning positioning tool is pushed to the installation groove by the loading push rod in the loading guide groove. The rotation of the loading rod and the rotation of the loading rod together will complete the reciprocating cycle. The reciprocating cycle at this time is suitable for the situation where two sets of lead terminals are at one end of the coil; and for the situation where two sets of lead terminals are at both ends of the coil, it is set at the detection station and replaced with an operation with flipping and feeding. At the loading station, after the loading rod pushes a set of tinning positioning fixtures, the rotating column group rotates 90°. After the loading rod pushes three sets of tinning positioning fixtures in succession, the rotating column group continues to rotate 90° so that the loading guide groove and the T-shaped guide groove are docked. The loading rod pauses the feeding once, and after the feeding is paused three times in a row, the rotating column group continues to rotate 90° so that When the feeding guide groove is butted against the T-shaped guide groove, the feeding push rod continues to perform the feeding operation, and after pausing the feeding at the feeding station, the vacant installation groove performs the flip feeding operation when it rotates to the detection station, that is, at the feeding station, after three consecutive feedings, a state is formed in which there are tin dipping positioning tooling at the detection station, the tin dipping station, and the unloading station. At this time, the feeding station is vacant. At this time, after the corresponding detection, tin dipping and unloading operations are completed at the detection station, the tin dipping station, and the unloading station, the rotating column group continues to rotate 90°, and the active guide groove at the unloading station will also be received by the tin dipping positioning tooling that enters for the first time and return to the detection station in a straight line. At this time, the direction of the pin terminal of the inductor coil is reversed. When it is reversed When the inductor coil rotates 90° with the rotating column group and enters the tin dipping station again, the pin terminal head on the other side of the inductor coil can be tinned, and after the movable guide groove has sent back the tin dipping positioning tooling three times in a row, the movable guide groove returns to the unloading station to undertake the tin dipping positioning tooling after the second tin dipping is completed. At this time, the unloading push rod installed on one side of the unloading guide groove can continue to push the tin dipping positioning tooling in the movable guide groove into the unloading guide groove, and after three consecutive unloadings are completed, the movable guide groove continues to return to the inspection station for the flipping and feeding operation. At this time, compared with the traditional method of manually taking out the inductor coil, reversing, and continuing tin dipping, it is simpler and faster, and the tin dipping stability is also better. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are used to provide a further understanding of the present invention and form a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention. In the accompanying drawings:

[0023] Figure 1 is a front view structural schematic diagram of the inductance coil sleeved outside the core column on one side of the sleeve pressing plate in the present invention;

[0024] Figure 2 is a top view structural schematic diagram of the tin dipping positioning tooling;

[0025] Figure 3 is Figure 1 a structural schematic diagram of the case where two sets of sealing plates are added in

[0026] Figure 4 is Figure 1 a structural schematic diagram of the case where two sets of sealing plates are added in

[0027] Figure 5 is Figure 2 a structural schematic diagram of the case where T-shaped guide bars are arranged on the outer sides of the side substrate one and the side substrate two in

[0028] Figure 6 is a structural schematic diagram of the case when both sides of the tin dipping positioning tooling are docked with the feeding guide groove and the installation groove;

[0029] Figure 7 is a sectional view of the rotating column group structure during the operation in the case where two sets of lead connection heads are at one end of the coil (in the figure, A and B are the position schematics of the two sets of lead connection heads);

[0030] Figure 8 is a sectional view of the rotating column group structure during the operation in the case where two sets of lead connection heads are at both ends of the coil (in the figure, A and B are the position schematics of the two sets of lead connection heads);

[0031] Figure 9 is a structural schematic diagram of the movable guide groove;

[0032] The marks in the figure:

[0033] 1. Tin dipping positioning tooling; 2. Rotating column group; 3. Installation groove; 4. T-shaped guide groove; 5. Loading station; 6. Detection station; 7. Tin dipping station; 8. Unloading station; 9. Limit cylinder; 10. Tin bath; 11. Loading guide groove; 12. Movable guide groove; 13. U-shaped bracket; 14. Reciprocating cylinder; 15. Reciprocating push rod; 101. Side substrate one; 102. Sleeve pressing plate; 103. Side substrate two; 104. Core column; 105. Inductive coil; 106. Guide post; 107. Top compression spring; 108. Guide sleeve; 109. Pulling cylinder; 110. Sealing plate; 111. U-shaped groove; 112. End block; 113. T-shaped guide bar; 151. Pushing cylinder; 152. Top push rod. Detailed implementation mode

[0034] Embodiment 1

[0035] As Figure 1-2 shown, a tin dipping device for inductive coils, in this embodiment, includes a tin dipping positioning tooling 1. The tin dipping positioning tooling 1 includes a side substrate one 101, a sleeve pressing plate 102 and a side substrate two 103 which are sequentially and parallelly distributed. On the side substrate one 101, there are multiple groups of core columns 104 arranged in a straight line and side by side. The inductive coils 105 are sleeved on the core columns 104 one by one. On the sleeve pressing plate 102, there are core holes that are guidingly sleeved outside the core columns 104. At the four corners of the side substrate one 101, there are also four guide posts 106 arranged in a rectangle. On the sleeve pressing plate 102, there are also guide holes that are guidingly connected to the guide posts 106. And between the sleeve pressing plate 102 and the side substrate one 101, there are also four groups of top compression springs 107 correspondingly sleeved outside the four groups of guide posts 106. On the side substrate two 103, there is a guide sleeve 108 that is guidingly connected outside the guide posts 106. And between the side substrate one 101 and the side substrate two 103, it is also driven by a pulling cylinder 109. The pulling cylinder 109 is used to adjust the distance between the side substrate one 101 and the side substrate two 103, and drives the guide sleeve 108 to press the sleeve pressing plate 102 to compress the top compression springs 107 to limit the inductive coils 105 between the sleeve pressing plate 102 and the side substrate two 103;

[0036] Up to this point, when it is necessary to take out the inductive coils 105 after tin dipping, only need to start the pulling cylinders 109 located at the left and right ends of the side substrate one 101 and the side substrate two 103, so that the distance between the side substrate one 101 and the side substrate two 103 is enlarged. Then the sleeve pressing plate 102 can drive one side of the inductive coils 105 to move towards the end of the core column 104 under the drive of the top compression springs 107 until the inductive coils 105 are separated from the core columns 104. At this time, the core columns 104 can fall into the device below for receiving the inductive coils 105, thereby improving the efficiency of mass production of products.

[0037] An end block 112 is further provided at the end of the guide post 106, and an end groove for guiding connection with the end block 112 is also provided in the guide sleeve 108. Therefore, when the pulling cylinder 109 drives the side substrate two 103 away from the side substrate one 101, even when it is separated from the side substrate one 101, it can ensure that the sleeve pressing plate 102 will not be separated from the guide post 106 under the pressing of the top pressure spring 107, so as to improve the stability of the tooling.

[0038] Embodiment 2

[0039] As Figure 3-4 shown, a tin dipping device for an inductance coil. In this embodiment, it is a further limitation based on Embodiment 1. Among them, two sets of sealing plates 110 are further provided on the side substrate one 101. The sealing plates 110 are vertically distributed with the side substrate one 101, and a U-shaped groove 111 for the connection head of the inductance coil 105 to pass through is also opened on the sealing plates 110;

[0040] The setting of the sealing plates 110 can ensure that when the pin connection head of the inductance coil 105 is dipped in tin, the tin liquid will not splash onto the inductance coil 105, playing a certain protective role. And the setting of the two sets of sealing plates 110 can correspond to the situation of the pin connection heads at both ends.

[0041] Embodiment 3

[0042] As Figure 5-7 shown, a tin dipping device for an inductance coil. In this embodiment, it is a further limitation based on Embodiment 1. A linear T-shaped guide bar 113 is also provided on the outer sides of the side substrate one 101 and the side substrate two 103. This tin dipping device for an inductance coil further includes a set of rotating column groups 2. At least two sets of mounting grooves 3 are evenly opened along the circumferential direction of the rotating column groups 2. Two sets of oppositely arranged T-shaped guide grooves 4 are provided in each set of mounting grooves 3. The two sets of oppositely arranged T-shaped guide grooves 4 are correspondingly slidably connected with the two T-shaped guide bars 113 of a set of tin dipping positioning tooling 1;

[0043] Thus, it can be ensured that after a set of tin dipping positioning tooling 1 slides into a set of mounting grooves 3 from one end of the rotating column group 2, it can then rotate to the tin dipping station 7 along with the rotating column group 2. At the tin dipping station 7, when the tin liquid tank 10 is lifted by the top cylinder for tin dipping operation, it can also perform the feeding operation of the next set of tin dipping positioning tooling 1 and the discharging operation after tin dipping at the feeding station 5 at the same time, so as to achieve a more efficient batch production operation.

[0044] The mounting grooves 3 on the rotating column group 2 are provided with four groups, and the rotating column group 2 is driven to rotate by a rotating motor located at one end. When the mounting groove 3 rotates to the topmost position, it is at the loading station 5. At the loading station 5, the T-shaped guide groove 4 is used to receive the dip soldering positioning tooling 1 pushed into the mounting groove 3 during loading. Two limit cylinders 9 are also arranged in the mounting groove 3 for limiting the two ends of the T-shaped guide bar 113. When the leading end of the T-shaped guide bar 113 slides to abut against the driving end of a limit cylinder 9, the driving end of the other limit cylinder 9 extends to push against the trailing end of the T-shaped guide bar 113, thus completing the limit of loading. After loading, the dip soldering positioning tooling 1 rotates with the rotating column group 2 and is positioned at the detection station 6, dip soldering station 7, and unloading station 8 in sequence to perform the detection, dip soldering, and unloading operations of the inductor coil 105.

[0045] At the detection station 6, a detection camera is provided for photographing and detecting whether the inductor coil 105 is loaded. At the dip soldering station 7, the molten tin tank 10 is lifted by a top cylinder so that the molten tin submerges the lead connection head of the inductor coil 105. At the unloading station 8, a unloading push rod is provided for pushing the dip soldering positioning tooling 1 out of the T-shaped guide groove 4 and into the unloading guide groove. The unloading push rod consists of a push cylinder 151 that performs linear drive back and forth and a top push rod 152 that can perform lifting operations at the driving end of the push cylinder 151. The driving directions of the push cylinder 151 and the top push rod 152 are vertically arranged. Similarly, the structures of the loading push rod and the reciprocating push rod 15 are also like this. Thus, during unloading, the push cylinder 151 can realize linear drive back and forth along the unloading guide groove, and the top push rod 152 is used to lift to support the thrust of the dip soldering positioning tooling 1 when the dip soldering positioning tooling 1 advances, and can be lowered to a low position when returning to avoid interfering with the movement of the dip soldering positioning tooling 1;

[0046] After unloading is completed, the rotating column group 2 rotates 90° again to make the empty mounting groove 3 return to the loading station 5 again. At this time, the dip soldering positioning tooling 1 is pushed into the mounting groove 3 by the loading push rod in the loading guide groove 11, and a limit cylinder 9 in the mounting groove 3 extends again to limit the dip soldering positioning tooling 1 pushed into the mounting groove 3 by the loading push rod, so as to complete the cycle. At this time, the reciprocation is applicable to the case where two lead connection heads are at one end of the coil.

[0047] Embodiment 4

[0048] As Figure 8-9As shown, a soldering tin dipping device for an inductance coil. In this embodiment, it is a further limitation based on Embodiment 3. At the detection station 6, it is replaced with an operation that combines turning over and feeding. At the loading station 5, the loading guiding groove 11 is docked with the T-shaped guiding groove 4. The loading push rod is used to push the soldering tin dipping positioning tooling 1 in the loading guiding groove 11 into the T-shaped guiding groove 4. After the loading push rod pushes a group of soldering tin dipping positioning tooling 1 each time, the rotating column group 2 then rotates 90°. And after the loading push rod continuously pushes three groups of soldering tin dipping positioning tooling 1 for feeding, when the rotating column group 2 continues to rotate 90° so that the loading guiding groove 11 is docked with the T-shaped guiding groove 4, the loading push rod pauses feeding once. And when it pauses feeding three times in a row, when the rotating column group 2 continues to rotate 90° so that the loading guiding groove 11 is docked with the T-shaped guiding groove 4, the loading push rod then continues to perform the feeding operation. And after pausing feeding at the loading station 5, when the empty mounting groove 3 rotates to the detection station 6, the operation of turning over and feeding is performed.

[0049] At the unloading station 8, a set of movable guiding grooves 12 are also aligned between the fixed unloading guiding groove and the mounting groove 3. The movable guiding grooves 12 are installed at the driving end of the reciprocating cylinder 14 through the U-shaped bracket 13. The reciprocating cylinder 14 is used to drive the movable guiding grooves 12 to reciprocate between the detection station 6 and the unloading station 8. And a reciprocating push rod 15 for pushing the movable guiding grooves 12 to move back and forth is also provided on the U-shaped bracket 13;

[0050] When each group of soldering tin dipping positioning tooling 1 drives the inductance coil 105 to be first pushed into the movable guiding grooves 12 by the reciprocating push rod 15, the reciprocating cylinder 14 drives the movable guiding grooves 12 to move linearly to the detection station 6 so that the movable guiding grooves 12 are docked with the mounting groove 3. Then the reciprocating push rod 15 pushes the soldering tin dipping positioning tooling 1 in the movable guiding grooves 12 back into the empty mounting groove 3 at the detection station 6. Then the reciprocating cylinder 14 drives the movable guiding grooves 12 to return to the unloading station 8 again. And when this group of soldering tin dipping positioning tooling 1 drives the inductance coil 105 to be pushed into the movable guiding grooves 12 by the reciprocating push rod 15 for the second time, the unloading push rod then continues to push the soldering tin dipping positioning tooling 1 in the movable guiding grooves 12 into the unloading guiding groove; thus, the soldering tin dipping situation when two sets of lead connection heads are at both ends of the coil can be completed.

[0051] That is, at the loading station 5, after feeding three times in succession, a state is formed where the soldering positioning tooling 1 exists at the inspection station 6, the soldering station 7, and the unloading station 8. At this time, the loading station 5 is in an empty state. After corresponding inspection, soldering, and unloading operations are completed at the inspection station 6, the soldering station 7, and the unloading station 8, the rotating column group 2 continues to rotate 90°. At the same time, the movable guide groove 12 at the unloading station 8 will also linearly return the first-entering soldering positioning tooling 1 to the inspection station 6. At this time, the direction of the pin connection head of the inductance coil 105 is reversed. When the reversed inductance coil 105 rotates 90° again with the rotating column group 2 and enters the soldering station 7, soldering of the pin connection head on the other side of the inductance coil 105 can be achieved. After the movable guide groove 12 sends back the soldering positioning tooling 1 three times in succession, the soldering positioning tooling 1 received by the movable guide groove 12 when it returns to the unloading station 8 again is the soldering positioning tooling 1 after secondary soldering is completed. At this time, the unloading push rod installed on one side of the unloading guide groove can continue to push the soldering positioning tooling 1 in the movable guide groove 12 into the unloading guide groove. After three consecutive unloading operations are completed, the movable guide groove 12 continues to return to the inspection station 6 for reverse feeding operation. At this time, compared with the traditional method of manually removing the inductance coil 105, reversing it, and then continuing soldering, it is more convenient, faster, and the soldering stability is also better.

[0052] The working principle of the present invention is as follows: A soldering device for an inductance coil provided by the present invention is used to solve the problems of complex batch soldering operations and inconvenient removal after soldering in the prior art. Through an automated design, the present invention can reduce manual intervention, improve production efficiency, shorten the soldering time, and ensure the stable soldering quality of the coil. Specifically, when it is necessary to remove the inductance coil 105 after soldering, only the pull cylinders 109 at the left and right ends of the side substrate one 101 and the side substrate two 103 need to be started, so that the distance between the side substrate one 101 and the side substrate two 103 is enlarged. Then, the sleeve pressing plate 102 can drive the inductance coil 105 on one side to move towards the end of the core column 104 under the drive of the top pressure spring 107 until the inductance coil 105 is separated from the core column 104. At this time, the core column 104 can fall into the device below for receiving the inductance coil 105, thereby improving the production efficiency of mass production of products.

[0053] Meanwhile, the present invention can also be compatible with and adapt to the batch soldering operation of the terminal at one or both ends. Specifically, by adding a rotating column group 2, it can be ensured that a set of soldering positioning tooling 1 can slide into a set of mounting grooves 3 from one end of the rotating column group 2, and then can rotate to the soldering station 7 along with the rotating column group 2. At the soldering station 7, when the solder bath 10 is lifted by the top cylinder for soldering operation, the feeding operation of the next set of soldering positioning tooling 1 and the discharging operation after soldering can be carried out at the feeding station 5 at the same time, so as to achieve a more efficient batch production operation. After the discharging is completed, the rotating column group 2 rotates 90° again to make the empty mounting groove 3 return to the feeding station 5 again. At this time, the soldering positioning tooling 1 in the feeding guide groove 11 is pushed into the mounting groove 3 by the feeding push rod, and a set of limit cylinders 9 in the mounting groove 3 extend again to limit the soldering positioning tooling 1 fed by the feeding push rod, so as to complete the cycle. At this time, the cycle is applicable to the situation where two sets of lead terminals are at one end of the coil;For the case where the two sets of lead terminals are at both ends of the coil, it is set at the detection station 6, replaced with an operation that combines turning over the feeding. At the feeding station 5, after the feeding push rod pushes a set of tin-dipping positioning tooling 1 each time, the rotating column group 2 then rotates 90°. After the feeding push rod continuously pushes three sets of tin-dipping positioning tooling 1 for feeding, when the rotating column group 2 continues to rotate 90° so that the feeding guide groove 11 is docked with the T-shaped guide groove 4, the feeding push rod pauses the feeding once. And when the feeding is paused three times in a row, when the rotating column group 2 continues to rotate 90° so that the feeding guide groove 11 is docked with the T-shaped guide groove 4, the feeding push rod then continues the feeding operation. After pausing the feeding at the feeding station 5, the empty mounting groove 3 performs the turning-over feeding operation when it rotates to the detection station 6. That is, at the feeding station 5, after feeding three times in a row, a state is formed where there is tin-dipping positioning tooling 1 at the detection station 6, the tin-dipping station 7, and the discharging station 8. At this time, the feeding station 5 is in an empty state. After completing the corresponding detection, tin-dipping, and discharging operations at the detection station 6, the tin-dipping station 7, and the discharging station 8, the rotating column group 2 continues to rotate 90°. At the same time, the movable guide groove 12 at the discharging station 8 also linearly returns the first-entering tin-dipping positioning tooling 1 to the detection station 6. At this time, the direction of the pin terminals of the inductance coil 105 is reversed. When the reversed inductance coil 105 rotates 90° again with the rotating column group 2 and enters the tin-dipping station 7, the tin-dipping of the pin terminals on the other side of the inductance coil 105 can be realized. And after the movable guide groove 12 continuously sends back the tin-dipping positioning tooling 1 three times, the tin-dipping positioning tooling 1 received by the movable guide groove 12 when it returns to the discharging station 8 again is the tin-dipping positioning tooling 1 after the secondary tin-dipping is completed. At this time, the discharging push rod installed on one side of the discharging guide groove can continue to push the tin-dipping positioning tooling 1 in the movable guide groove 12 into the discharging guide groove. And after discharging three times in a row, the turning-over feeding operation of the movable guide groove 12 returning to the detection station 6 is continued. At this time, compared with the traditional method of manually taking out the inductance coil 105, reversing it, and then continuing the tin-dipping, it is more simple and fast, and the tin-dipping stability is also better.

[0054] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A soldering dipping device for an inductance coil, characterized in that, It includes a tin dipping positioning tooling (1). The tin dipping positioning tooling (1) includes a side substrate one (101), a sleeve pressing plate (102) and a side substrate two (103) which are sequentially and parallelly distributed. A plurality of groups of core columns (104) arranged side by side in a straight line are provided on the side substrate one (101). Inductance coils (105) are sleeved on the core columns (104) one by one. Core holes guidingly sleeved outside the core columns (104) are formed on the sleeve pressing plate (102). Four guide columns (106) distributed in a rectangle are further provided at the four corners of the side substrate one (101). Guide holes guidingly connected with the guide columns (106) are further formed on the sleeve pressing plate (102). And four groups of top pressure springs (107) correspondingly sleeved outside the four groups of guide columns (106) are arranged between the sleeve pressing plate (102) and the side substrate one (101). A guide sleeve (108) guidingly connected outside the guide columns (106) is provided on the side substrate two (103). And the side substrate one (101) and the side substrate two (103) are driven by a pulling cylinder (109). The pulling cylinder (109) is used to adjust the distance between the side substrate one (101) and the side substrate two (103), and drives the guide sleeve (108) to press the sleeve pressing plate (102) to compress the top pressure springs (107) so as to limit the inductance coils (105) between the sleeve pressing plate (102) and the side substrate two (103).

2. The tin dipping device for an inductance coil according to claim 1, characterized in that, Two groups of sealing plates (110) are further provided on the side substrate one (101). The sealing plates (110) are vertically distributed with the side substrate one (101). And U-shaped grooves (111) through which the connection heads of the inductance coils (105) pass are formed on the sealing plates (110).

3. The dipping tin device for an inductance coil according to claim 1, characterized in that, End blocks (112) are further provided at the ends of the guide columns (106). End grooves guidingly connected with the end blocks (112) are further provided in the guide sleeves (108).

4. A soldering tin dipping device for an inductance coil according to claim 1, characterized in that, Straight T-shaped guide bars (113) are further provided on the outer sides of the side substrate one (101) and the side substrate two (103). The tin dipping device for the inductance coils further includes a group of rotating column groups (2). At least two groups of mounting grooves (3) are evenly formed in the circumferential direction of the rotating column groups (2). Two groups of oppositely arranged T-shaped guide grooves (4) are arranged in each group of mounting grooves (3). The two groups of oppositely arranged T-shaped guide grooves (4) are correspondingly and slidably connected with the two T-shaped guide bars (113) of a group of tin dipping positioning tooling (1).

5. The dipping tin device for an inductance coil according to claim 4, characterized in that, The mounting grooves (3) on the rotating column group (2) are provided with four groups, and the rotating column group (2) is driven to rotate by a rotating motor at one end. When the mounting groove (3) rotates to the topmost position, it is at the feeding station (5). At the feeding station (5), the T-shaped guide groove (4) is used to receive the solder dipping positioning tooling (1) pushed to the mounting groove (3) during feeding. Two limiting cylinders (9) for limiting the two ends of the T-shaped guide bar (113) are also arranged in the mounting groove (3). When the leading end of the T-shaped guide bar (113) slides to abut against the driving end of a group of limiting cylinders (9), the driving end of the other group of limiting cylinders (9) extends to push against the trailing end of the T-shaped guide bar (113). After feeding, the solder dipping positioning tooling (1) rotates with the rotating column group (2) and is positioned at the detection station (6), the solder dipping station (7), and the discharging station (8) in sequence to perform the detection, solder dipping, and discharging operations of the inductor coil (105).

6. The dipping tin device for an inductance coil according to claim 5, characterized in that, At the detection station (6), a detection camera for photographing and detecting whether the inductor coil (105) is fed is provided. At the solder dipping station (7), the solder bath (10) is lifted by a top cylinder so that the solder submerges the lead connection head of the inductor coil (105). At the discharging station (8), a discharging push rod for pushing the solder dipping positioning tooling (1) out of the T-shaped guide groove (4) and into the discharging guide groove is provided.

7. A soldering tin dipping device for an inductance coil according to claim 5, characterized in that, At the detection station (6), it is replaced with an operation that combines turning over and feeding. At the feeding station (5), the feeding guide groove (11) is docked with the T-shaped guide groove (4). The feeding push rod is used to push the solder dipping positioning tooling (1) in the feeding guide groove (11) into the T-shaped guide groove (4). After the feeding push rod pushes each group of solder dipping positioning tooling (1), the rotating column group (2) then rotates 90°. After the feeding push rod continuously pushes three groups of solder dipping positioning tooling (1) for feeding, when the rotating column group (2) continues to rotate 90° to make the feeding guide groove (11) dock with the T-shaped guide groove (4), the feeding push rod pauses the feeding once. And when the feeding is paused three times in a row, when the rotating column group (2) continues to rotate 90° to make the feeding guide groove (11) dock with the T-shaped guide groove (4), the feeding push rod then continues the feeding operation. After pausing the feeding at the feeding station (5), when the empty mounting groove (3) rotates to the detection station (6), the operation of turning over and feeding is performed.

8. A soldering tin dipping device for an inductance coil according to claim 7, characterized in that, At the discharging station (8), a group of movable guide grooves (12) are also aligned between the fixed discharging guide groove and the mounting groove (3). The movable guide groove (12) is installed at the driving end of a reciprocating cylinder (14) through a U-shaped bracket (13). The reciprocating cylinder (14) is used to drive the movable guide groove (12) to reciprocate between the detection station (6) and the discharging station (8). A reciprocating push rod (15) for pushing the movable guide groove (12) to move back and forth is also arranged on the U-shaped bracket (13); When each group of tin dipping positioning tooling (1) drives the inductor coil (105) to be pushed into the movable guide groove (12) for the first time by the reciprocating push rod (15), the reciprocating cylinder (14) drives the movable guide groove (12) to move linearly to the detection station (6) so that the movable guide groove (12) is docked with the installation groove (3). Then, the reciprocating push rod (15) pushes the tin dipping positioning tooling (1) in the movable guide groove (12) back into the vacant installation groove (3) at the detection station (6). Then, the reciprocating cylinder (14) drives the movable guide groove (12) back to the blanking station (8) again. And when this group of tin dipping positioning tooling (1) drives the inductor coil (105) to be pushed into the movable guide groove (12) for the second time by the reciprocating push rod (15), the blanking push rod continues to push the tin dipping positioning tooling (1) in the movable guide groove (12) into the blanking guide groove.

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