Laser processing method and device and storage medium

Abstract

The invention discloses a laser machining method and device and a storage medium, and relates to the technical field of laser machining, and the laser machining method comprises the steps that the target position of a laser focus at the machining moment is determined, the target deflection angle of a galvanometer at the machining moment is determined according to the target position, and the machining moment is any moment in a preset machining period; acquiring a preset linear velocity of the laser focus in a preset processing period, and determining a target angular velocity of the galvanometer at the processing moment according to the preset linear velocity and the target deflection angle; and based on the target deflection angle and the target angular velocity, generating a galvanometer control signal at the processing moment, and controlling the galvanometer to deflect at the processing moment according to the galvanometer control signal so as to control the deflection angle of the galvanometer at the processing moment as the target deflection angle and control the angular velocity of the galvanometer at the processing moment as the target angular velocity. The problem of machining quality fluctuation caused by uneven energy input in the prior art is solved, the machining precision is improved, and the quality consistency of laser machining workpieces is guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of laser processing, and particularly relates to a laser processing method, device, and storage medium. Background Art

[0002] During the laser processing, the laser path is controlled by a high-speed deflecting galvanometer, and the beam is focused by an F-theta lens to achieve non-contact laser processing. However, during the actual laser processing, due to the geometric projection effect caused by the change of the galvanometer deflection angle, the laser intensity actually output to the workpiece to be processed is inconsistent, resulting in energy density fluctuations, causing problems such as uneven melting depth and unstable weld quality. The existing methods use open-loop control or single-parameter control of the galvanometer deflection, lacking dynamic compensation for the laser focus speed and coordinated processing of the non-linear response of the galvanometer, and it is difficult to maintain the consistency of laser processing when the galvanometer deflects at high speed. Especially in scenarios such as the welding of power battery tabs and precision micro-hole processing, defects such as false welding, overburning, or contour distortion are likely to occur.

[0003] Therefore, there is currently a lack of a laser processing control method that solves the problem of processing quality fluctuations caused by uneven energy input by coordinating the galvanometer control in real time.

[0004] The above content is only used to assist in understanding the technical solution of the present application, and does not represent an admission that the above content is prior art. Summary of the Invention

[0005] The main purpose of the present application is to provide a laser processing method, device, and storage medium, aiming to solve the technical problem that the uneven input of laser energy caused by controlling the galvanometer deflection by fixed parameters leads to fluctuations in processing quality in the prior art.

[0006] To achieve the above purpose, the present application proposes a laser processing method, and the laser processing method includes: Determine the target position of the laser focus at the processing moment, and determine the target deflection angle of the galvanometer at the processing moment according to the target position, where the processing moment is any moment within a preset processing cycle; Obtain the preset linear velocity of the laser focus within the preset processing cycle, and determine the target angular velocity of the galvanometer at the processing moment according to the preset linear velocity and the target deflection angle; Generate a galvanometer control signal at the processing moment based on the target deflection angle and the target angular velocity, and control the galvanometer to deflect at the processing moment according to the galvanometer control signal, so as to control the deflection angle of the galvanometer at the processing moment to be the target deflection angle, and to control the angular velocity of the galvanometer at the processing moment to be the target angular velocity.

[0007] In some embodiments, generating the galvanometer control signal at the machining moment based on the target deflection angle and the target angular velocity, and controlling the galvanometer to deflect at the machining moment according to the galvanometer control signal includes: Generating a position control signal at the machining moment based on the target deflection angle; Obtaining the target correction coefficient corresponding to the machining moment, and generating an angular velocity control signal at the machining moment based on the target angular velocity and the target correction coefficient, where the target correction coefficient is used to correct the target angular velocity; Generating a galvanometer control signal at the machining moment according to the position control signal and the angular velocity control signal, and controlling the galvanometer to deflect at the machining moment according to the galvanometer control signal to perform laser machining on the workpiece to be machined.

[0008] In some embodiments, determining the target deflection angle of the galvanometer at the machining moment according to the target position includes: Calculating the target deflection angle of the galvanometer corresponding to the target position at the machining moment by using a geometric calculation formula based on the laser propagation path and the positional relationship between the galvanometer and the workpiece, where the geometric calculation formula is determined based on the laser propagation path and the positional relationship between the galvanometer and the workpiece.

[0009] In some embodiments, determining the target position of the laser focus at the machining moment includes: Obtaining the machining path data of the workpiece to be machined in the preset machining cycle; Performing interpolation calculation on the machining path data to obtain the positions of the laser focus at each moment in the preset machining cycle, and determining the target position of the laser focus at the machining moment from the positions of the laser focus at each moment in the preset machining cycle.

[0010] In some embodiments, generating the angular velocity control signal at the machining moment based on the target angular velocity and the target correction coefficient includes: Obtaining the corresponding relationship between the galvanometer deflection angle and the correction coefficient set in advance, and determining the target correction coefficient at the machining moment based on the target deflection angle and the corresponding relationship; Determining the adjusted target angular velocity of the galvanometer at the machining moment based on the target correction coefficient and the target angular velocity; Performing signal conversion on the adjusted target angular velocity to obtain the angular velocity control signal at the machining moment, where the angular velocity control signal carries the adjusted target angular velocity so as to control the galvanometer to deflect at the target angular velocity at the machining moment.

[0011] In some embodiments, controlling the galvanometer to deflect at the processing moment according to the galvanometer control signal includes: Encoding the galvanometer control signal into differential control information, and sending the differential control information to the galvanometer through a differential line, where the differential control information is used to instruct the galvanometer to decode and extract the target deflection angle and the adjusted target angular velocity; Based on the target deflection angle, controlling the deflection angle of the galvanometer at the processing moment, and based on the adjusted target angular velocity, controlling the galvanometer to deflect at the target angular velocity at the processing moment.

[0012] In some embodiments, after controlling the galvanometer to deflect at the processing moment according to the galvanometer control signal, it further includes: Obtaining the current deflection angle of the galvanometer at the current moment and the target deflection angle of the galvanometer corresponding to the current moment; Determining the galvanometer deflection angle deviation between the current deflection angle and the target deflection angle corresponding to the current moment, and generating an angle adjustment instruction corresponding to the galvanometer deflection angle deviation; Adjusting the deflection angle of the galvanometer at the current moment according to the angle adjustment instruction.

[0013] In some embodiments, obtaining the preset linear velocity of the laser focus within the preset processing cycle includes: Obtaining the material physical data, processing process data, and environmental temperature of the workpiece to be processed; Processing the material physical data, the processing process data, and the environmental temperature of the workpiece to be processed based on a heat conduction model to obtain a preset linear velocity.

[0014] In addition, to achieve the above object, the present application further provides a laser processing device, where the laser processing device includes: A deflection angle determination module, configured to determine the target position of the laser focus at the processing moment, and determine the target deflection angle of the galvanometer at the processing moment according to the target position, where the processing moment is any moment within the preset processing cycle; An angular velocity determination module, configured to obtain the preset linear velocity of the laser focus within the preset processing cycle, and determine the target angular velocity of the galvanometer at the processing moment according to the preset linear velocity and the target deflection angle; A control module, configured to generate a galvanometer control signal at the machining moment based on the target deflection angle and the target angular velocity, and control the galvanometer to deflect at the machining moment according to the galvanometer control signal, so as to control the deflection angle of the galvanometer at the machining moment to be the target deflection angle, and control the angular velocity of the galvanometer at the machining moment to be the target angular velocity.

[0015] In addition, to achieve the above object, the present application further provides a laser processing device, which includes: a memory, a processor, and a computer program stored on the memory and executable on the processor, and the computer program is configured to implement the steps of the laser processing method as described above.

[0016] In addition, to achieve the above object, the present application further provides a storage medium, which is a computer-readable storage medium, and a computer program is stored on the storage medium, and when the computer program is executed by a processor, the steps of the laser processing method as described above are implemented.

[0017] In addition, to achieve the above object, the present application further provides a computer program product, which includes a computer program, and when the computer program is executed by a processor, the steps of the laser processing method as described above are implemented.

[0018] One or more technical solutions provided by the present application have at least the following technical effects: By determining the target position of the laser focus at the machining moment, calculating the target deflection angle that the galvanometer needs to reach at the machining moment, and combining the set preset linear velocity and the target deflection angle, the target angular velocity that the galvanometer needs to reach at the machining moment is determined. A galvanometer control signal is generated according to the target deflection angle and the target angular velocity, which is used to drive the galvanometer to reach the specified angular position (i.e., the target deflection angle) at the machining moment and control the galvanometer to reach the specified deflection speed (i.e., the target angular velocity) at the machining moment. According to the galvanometer control signal, the deflection angle and angular velocity of the galvanometer at the machining moment are controlled, and the deflection angle and angular velocity of the galvanometer are driven and adjusted to the target values, so as to control the deflection angle of the galvanometer at the machining moment to be the target deflection angle and control the angular velocity of the galvanometer at the machining moment to be the target angular velocity, so that the position of the laser focus at the machining moment is the target position and the linear velocity at the machining moment is the preset linear velocity. By continuously controlling the galvanometer at each moment within the preset machining cycle, dynamically coordinating the galvanometer position and angular velocity control, eliminating the linear velocity fluctuation caused by the change of the galvanometer deflection angle, so that the laser focus moves along a predetermined path and maintains a constant linear velocity (i.e., the preset linear velocity) within the preset machining cycle, ensuring the uniform distribution of laser energy on the workpiece surface, solving the problem of machining quality fluctuation caused by uneven energy input in the prior art, improving the machining accuracy and ensuring the quality consistency of laser processed workpieces. Description of the Drawings

[0019] The accompanying drawings here are incorporated into the specification and form a part of this specification, showing embodiments consistent with this application, and are used together with the specification to explain the principles of this application.

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the following will briefly introduce the accompanying drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 Schematic diagram of the scenario of laser processing provided for the embodiments of this application; Figure 2 Schematic flow diagram of the laser processing method provided for the embodiments of this application; Figure 3 Schematic diagram of the module structure of the laser processing device provided for the embodiments of this application; Figure 4 Schematic diagram of the device structure of the hardware operating environment involved in the laser processing method in the embodiments of this application. Detailed implementation manners

[0022] It should be understood that the specific embodiments described here are only used to explain the technical solutions of this application and are not used to limit this application.

[0023] To better understand the technical solutions of this application, the following will be described in detail in combination with the specification drawings and specific implementation manners.

[0024] The main solution of the embodiments of this application is: determining the target position of the laser focus at the processing moment, determining the target deflection angle of the galvanometer at the processing moment according to the target position, where the processing moment is any moment within a preset processing cycle; obtaining the preset linear velocity of the laser focus within the preset processing cycle, and determining the target angular velocity of the galvanometer at the processing moment according to the preset linear velocity and the target deflection angle; generating a galvanometer control signal at the processing moment based on the target deflection angle and the target angular velocity, and controlling the galvanometer to deflect at the processing moment according to the galvanometer control signal, so as to control the deflection angle of the galvanometer at the processing moment to be the target deflection angle, and to control the angular velocity of the galvanometer at the processing moment to be the target angular velocity.

[0025] In this embodiment, for the convenience of description, the following will be elaborated with the laser processing equipment recognized as the execution subject.

[0026] Refer to Figure 1 , Figure 1Schematic diagram of the laser processing scenario provided for this application. During laser processing, the laser processing equipment dynamically controls the focal position and linear velocity of the laser beam through a high-speed deflecting galvanometer. The galvanometer is driven by a precision motor to rotate the lens, changing the laser reflection angle, so that the laser focus forms a predetermined trajectory (such as a cutting or welding path) on the workpiece surface. During laser processing, according to the preset program, a galvanometer deflection angle command is generated. The laser beam moves at a microsecond-level speed under the drive of the galvanometer to achieve non-contact precision processing. By replacing the traditional mechanical motion platform with rapid galvanometer scanning, micron-level positioning accuracy can be maintained within a large area (such as 300×300 mm), which is suitable for efficient processing of complex graphics in fields such as microelectronics and precision molds, and at the same time avoids damage or vibration interference caused by physical contact with the workpiece.

[0027] However, during the actual laser processing process, the change in the galvanometer deflection angle will cause the geometric projection effect, resulting in the deviation of the actual laser focus speed on the workpiece to be processed from the preset value, inconsistent laser intensity output to the workpiece to be processed, causing energy density fluctuations, and resulting in problems such as uneven melt depth and unstable weld quality. Existing methods use open-loop control or single-parameter control of the galvanometer deflection. Fixed parameters cannot adapt to complex welding paths and changing working conditions, lacking dynamic compensation for the laser focus speed and collaborative processing of the non-linear response of the galvanometer, resulting in inconsistent movement speeds of the laser focus on the workpiece, and thus causing uneven energy input, making it difficult to maintain laser processing consistency during high-speed galvanometer deflection. Especially in scenarios such as power battery tab welding and precision micro-hole processing, defects such as virtual welding, overburning, or contour distortion are likely to occur.

[0028] The present application provides a solution. Based on the target position of the laser focus at any moment (i.e., "processing moment") within each preset processing cycle, the target deflection angle that the galvanometer needs to reach at the processing moment, i.e., the target deflection angle, can be determined through geometric relationships. By determining the accurate target deflection angle of the galvanometer at the processing moment, the laser beam is guided to the correct position. Obtain a constant preset linear velocity of the laser focus on the workpiece to be processed. The preset linear velocity is designed to ensure that the laser focus moves at a consistent speed along a predetermined path throughout the laser processing, thereby achieving uniform energy input and ensuring the consistency of the welding quality. According to the preset linear velocity and the target deflection angle, determine the target angular velocity of the galvanometer at the processing moment; based on the target deflection angle and the target angular velocity, generate a galvanometer control signal at the processing moment, and control the deflection of the galvanometer at the processing moment according to the galvanometer control signal, so that the laser focus moves along the predetermined processing path and maintains a constant preset linear velocity. Traditional methods use constant angular velocity or open-loop position control, ignoring the geometric projection effect, resulting in a reduced linear velocity in the edge region and uneven energy input. The present application accurately controls the deflection angle and angular velocity of the galvanometer, maintains the constant linear velocity of the laser focus, and ensures that the laser focus accurately moves along the predetermined path, eliminates the linear velocity fluctuation caused by the change in the deflection angle of the galvanometer, ensures uniform energy input per unit area on the workpiece to be processed, avoids local overheating or energy shortage caused by speed changes, solves the problem of processing quality fluctuation caused by uneven energy input in the prior art, improves the processing accuracy, and ensures the quality consistency of laser processed workpieces.

[0029] It should be noted that the execution subject of this embodiment can be a computing service device with data processing, network communication, and program running functions, such as a tablet computer, a personal computer, a mobile phone, etc., or a laser processing device that can implement the above functions. Hereinafter, taking the laser processing device as an example, this embodiment and the following embodiments will be described.

[0030] Based on this, the embodiment of the present application provides a laser processing method, referring to Figure 2 , Figure 2 which is a schematic flowchart of the first embodiment of the laser processing device method of the present application.

[0031] In this embodiment, the laser processing method includes steps 201 to 203: Step 201, determine the target position of the laser focus at the processing moment, and determine the target deflection angle of the galvanometer at the processing moment according to the target position. The processing moment is any moment within the preset processing cycle.

[0032] Specifically, the laser focus is the smallest light spot formed on the surface of the workpiece to be processed after the laser beam passes through the focusing system, and it is the actual action point for laser processing. The processing moment is any time point within a preset processing cycle. Each preset processing cycle can be divided into multiple processing moments to achieve fine control of the laser path. The target position is the ideal coordinate position set on the workpiece to be processed by the laser focus at a specific processing moment. The galvanometer can include a pair of mirrors (X-axis and Y-axis) that can quickly adjust the angle to change the direction of the laser beam. The target deflection angle is the specific deflection angle that the galvanometer needs to reach at the processing moment in order to make the laser focus reach the target position at the corresponding processing moment.

[0033] In some embodiments, the target positions of the laser focus at each processing moment within the preset processing cycle can be extracted according to a pre-set laser processing path or processing pattern. For each processing moment, the target deflection angle that the galvanometer needs to reach at that processing moment can be calculated based on the geometric relationship between the target position and the galvanometer. Traditional methods rely on fixed parameters to control the deflection angle of the galvanometer, which is difficult to cope with complex processing paths and changing working conditions, resulting in uneven input of laser energy and affecting the processing quality. By dynamically determining the target position of the laser focus and calculating the target deflection angle of the galvanometer accordingly, it helps to accurately control the position of the laser focus and can better adapt to complex processing paths and changing working environments.

[0034] In addition, before determining the target position of the laser focus at the processing moment, it also includes: calibrating the installation of the galvanometer.

[0035] Specifically, the galvanometer is a key component in the laser processing equipment for controlling the deflection of the laser beam. During laser processing, the laser beam needs to be accurately focused on the specified position on the surface of the workpiece. If there is a deviation in the installation of the galvanometer, for example, due to manufacturing tolerances, assembly errors, etc., the actual installation position of the galvanometer deviates from its theoretical design position, then the propagation direction of the laser beam after being reflected by the galvanometer will deviate from the expected path, which can cause the laser focus to not accurately fall on the target position on the surface of the workpiece, thus affecting the processing accuracy.

[0036] Specifically, first determine the origin of the galvanometer system; calibrate the movement of the galvanometer in the X-axis and Y-axis directions to ensure that when a specific angle instruction is sent as a control signal, the laser focus can accurately move to the expected position. This process can include measuring the actual displacement of the laser light spot under different instructions and adjusting the coordinate parameters according to the measurement results to reduce or eliminate any deviation. By calibrating the installation position and coordinates of the galvanometer, the coordinate system in the laser processing equipment can be matched with the actual physical position of the galvanometer, which helps the laser beam to accurately reach the target position.

[0037] Step 202: Obtain the preset linear velocity of the laser focus within a preset processing cycle. Based on the preset linear velocity and the target deflection angle, determine the target angular velocity of the galvanometer at the processing moment.

[0038] Specifically, the preset linear velocity of the laser focus is the desired velocity at which the laser focus moves along the processing path on the surface of the workpiece to be processed, and it is a key parameter to ensure processing quality and efficiency. The preset linear velocity of the laser focus directly affects the rate at which laser energy is input to the workpiece surface and affects processing effects such as melt depth and cutting width. The target deflection angle is the angle by which the galvanometer needs to deflect at a certain processing moment, which is used to control the propagation direction of the laser beam so that the laser focus reaches the target position. The target angular velocity is the angular velocity required for the galvanometer to adjust its reflection angle, which is used to control the laser focus to move at the preset linear velocity.

[0039] In some embodiments, the ideal moving velocity of the laser focus on the workpiece surface, that is, the preset linear velocity, can be determined according to processing requirements (such as material type, cutting or welding depth, etc.). Based on the preset linear velocity and the target deflection angle, calculate the target angular velocity that the galvanometer needs to reach at the processing moment. Specifically, the target angular velocity that the galvanometer needs to reach at the processing moment can be calculated according to the following formula:

[0040] where, is the target angular velocity of the galvanometer at the processing moment, is the target deflection angle of the mirror at the processing moment, is the preset linear velocity of the laser focus, and f is the focal length of the galvanometer system.

[0041] By dynamically calculating the target angular velocity of the galvanometer at the processing moment, compensating for the linear velocity attenuation caused by the change in the deflection angle of the galvanometer, the linear velocity of the laser focus on the workpiece surface can be made constant, avoiding uneven energy input caused by linear velocity fluctuations, and eliminating processing quality problems such as inconsistent melt depth and rough cutting edges. Determining the target angular velocity of the galvanometer at the processing moment according to the preset linear velocity and the target deflection angle, and dynamically adjusting the velocity and path of the laser focus according to actual processing requirements, rather than relying on fixed parameter settings, helps to ensure high-quality output when facing complex processing tasks, improve processing accuracy and efficiency, and enhance the adaptability and flexibility of the laser processing equipment.

[0042] Step 203: Generate a galvanometer control signal at the processing moment based on the target deflection angle and the target angular velocity, and control the galvanometer to deflect at the processing moment according to the galvanometer control signal, so as to control the deflection angle of the galvanometer at the processing moment to be the target deflection angle and control the angular velocity of the galvanometer at the processing moment to be the target angular velocity.

[0043] Specifically, the galvanometer control signal is an electrical signal used to drive the movement of the galvanometer motor, which can be an analog voltage signal or a digital pulse width modulation (PWM) signal. The galvanometer control signal contains the deflection angle and angular velocity information of the galvanometer at the processing moment to ensure that the galvanometer moves along the expected trajectory and at the predetermined speed.

[0044] In some embodiments, the calculated target deflection angle and target angular velocity are converted into specific galvanometer control signals, which can be voltage, current or other forms of instructions. The galvanometer control signal is sent to the galvanometer control system of the laser processing equipment, and the galvanometer control system accurately adjusts the position and angular velocity of the galvanometer according to the received galvanometer control signal, drives and adjusts the deflection angle of the galvanometer to the target deflection angle, and drives and adjusts the angular velocity of the galvanometer to the target angular velocity.

[0045] In some embodiments, the galvanometer is also equipped with a high-precision sensor that can real-time feedback the actual state of the galvanometer. During the whole processing process, the actual state of the galvanometer is continuously monitored and compared with the expected target value. If a deviation is found, dynamic adjustment can be performed through a control algorithm to ensure the processing quality.

[0046] Based on the laser processing method provided in this application, by determining the target position of the laser focus at any moment (i.e., the processing moment) within each preset processing cycle, the deflection angle that the galvanometer needs to reach at the processing moment, i.e., the target deflection angle, can be determined based on the geometric relationship. By determining the accurate target deflection angle of the galvanometer at the processing moment, the laser beam is guided to the correct position. Obtain the constant preset linear velocity of the laser focus on the workpiece to be processed. The preset linear velocity is designed to ensure that the laser focus moves at a consistent speed along the predetermined path during the whole laser processing process, so as to achieve uniform energy input and ensure the consistency of the welding quality. According to the preset linear velocity and the target deflection angle, determine the target angular velocity of the galvanometer at the processing moment; based on the target deflection angle and the target angular velocity, generate the galvanometer control signal at the processing moment, and control the deflection of the galvanometer at the processing moment according to the galvanometer control signal, so that the laser focus moves along the predetermined processing path and maintains the constant preset linear velocity. The traditional method uses a constant angular velocity or open-loop position control, ignoring the geometric projection effect, resulting in a decrease in the linear velocity in the edge area and uneven energy input. This application accurately controls the deflection angle and angular velocity of the galvanometer, maintains the constant linear velocity of the laser focus and ensures that the laser focus accurately moves along the predetermined path, eliminates the linear velocity fluctuation caused by the change of the galvanometer deflection angle, ensures the uniform energy input per unit area on the workpiece to be processed, avoids local overheating or energy shortage caused by speed changes, solves the problem of processing quality fluctuation caused by uneven energy input in the prior art, improves the processing accuracy and ensures the quality consistency of the laser processed workpiece.

[0047] In some embodiments, based on the target deflection angle and the target angular velocity, a galvanometer control signal at the machining moment is generated, and the galvanometer is controlled to deflect at the machining moment according to the galvanometer control signal, including: Generating a position control signal at the machining moment based on the target deflection angle; Obtaining a target correction coefficient corresponding to the machining moment, and generating an angular velocity control signal at the machining moment based on the target angular velocity and the target correction coefficient, where the target correction coefficient is used to correct the target angular velocity; Generating a galvanometer control signal at the machining moment according to the position control signal and the angular velocity control signal, and controlling the galvanometer to deflect at the machining moment according to the galvanometer control signal.

[0048] Specifically, the position control signal is an electrical signal used to drive the galvanometer motor, which can be an analog voltage signal or a digital PWM signal. The position control signal contains the deflection angle information of the galvanometer at the machining moment and is used to ensure that the galvanometer moves along the expected trajectory. The angular velocity control signal is an electrical signal used to control the angular velocity of the galvanometer. The angular velocity control signal contains the angular velocity information of the galvanometer at the machining moment and is used to accurately drive the galvanometer motor to deflect at the established target angular velocity. The target correction coefficient is an adjustment parameter set according to the deflection angle of the galvanometer and is used to optimize the angular velocity control signal to adapt to different machining conditions.

[0049] As an example, the target deflection angle is converted into a corresponding electrical signal, that is, the position control signal. For example, for a specific galvanometer motor, there is a certain linear relationship between the rotation angle and the input voltage. The target deflection angle can be converted into a suitable voltage signal through a pre-calibrated coefficient to drive the galvanometer to rotate to the target position at the machining moment. After determining the target angular velocity of the galvanometer at the machining moment, the target correction coefficient corresponding to the machining moment is introduced to correct and optimize the angular velocity. The target correction coefficient is positively correlated with the deflection angle of the galvanometer. The corrected target angular velocity is converted into a corresponding electrical signal, that is, the angular velocity control signal. The position control signal and the angular velocity control signal are integrated and processed to generate a galvanometer control signal at the machining moment, and the galvanometer control signal is transmitted to the galvanometer control system. After receiving the galvanometer control signal, the galvanometer control system accurately controls the galvanometer to deflect at the machining moment according to the instruction of the galvanometer control signal, so that the galvanometer can quickly and stably reach the target position (target deflection angle) and the target angular velocity, thereby realizing the precise guidance of the laser beam and performing laser processing on the workpiece to be processed. Through precise position and angular velocity control, it is ensured that the position and movement speed of the laser focus on the workpiece surface meet the processing requirements, effectively reducing the problem of uneven energy distribution caused by inaccurate galvanometer movement, further improving the effect and stability of laser processing, and improving the processing accuracy and quality.

[0050] In some embodiments, determining the target deflection angle of the galvanometer at the machining moment according to the target position includes: According to the target position, use a geometric calculation formula to calculate the target deflection angle of the galvanometer corresponding to the target position at the machining moment, where the geometric calculation formula is determined based on the laser propagation path and the positional relationship between the galvanometer and the workpiece.

[0051] Specifically, the target position is the predetermined coordinate position of the laser focus on the workpiece surface, which is obtained based on the design drawing or the machining path planning. The target position is the specific position where the laser focus should be focused at the corresponding machining moment. The target deflection angle is the specific angle to which the galvanometer needs to be adjusted in order to make the laser focus reach the target position. The target deflection angle is calculated based on geometric relationships and is used to guide the direction of the galvanometer reflecting the laser beam. The geometric calculation formula is a mathematical model describing the relationship between the laser propagation path and the relative position of the galvanometer-workpiece, and is used to map the target position to the target deflection angle of the galvanometer. The laser propagation path is the optical path starting from the laser source, passing through the optical system of the laser processing equipment (such as the galvanometer, etc.), and finally reaching the workpiece surface. The positional relationship between the galvanometer and the workpiece is the relative position and direction relationship between the galvanometer and the workpiece, including information such as distance and angle, which is very important for calculating the target deflection angle.

[0052] As an example, when a specific target position is given (the target position that the laser focus should reach at a certain machining moment during the machining process), use an appropriate geometric calculation formula to calculate the angle value to which the galvanometer needs to be adjusted, that is, the target deflection angle. For example, in a two-dimensional space, the target deflection angle of the galvanometer at the machining moment can be calculated through trigonometric functions. By accurately determining the target deflection angle of the galvanometer, the laser can be accurately focused on the target position at the corresponding moment, avoiding the problem of the laser focus deviating from the target position due to inaccurate deflection angle of the galvanometer, and improving the accuracy of laser processing.

[0053] In some embodiments, determining the target position of the laser focus at the machining moment includes: Obtain the machining path data of the workpiece to be machined in a preset machining cycle; Perform interpolation calculation on the machining path data to obtain the positions of the laser focus at each moment in the preset machining cycle, and determine the target position of the laser focus at the machining moment from the positions of the laser focus at each moment in the preset machining cycle.

[0054] Specifically, the machining path data of the workpiece to be machined is all relevant information about the moving trajectory of the laser focus on the surface of the workpiece to be machined, and can be represented in the form of a series of discrete coordinate points or mathematical expressions. The machining path data of the workpiece to be machined contains the position sequence that the laser beam needs to pass through during the machining process, and is the basis for determining the position of the laser focus.

[0055] As an example, for the laser processing task of a workpiece to be processed, the optimal movement path of the laser focus can be calculated through algorithms with the help of computer-aided design (CAD) and computer-aided manufacturing (CAM) software, and the processing path data of the workpiece to be processed in the preset processing cycle can be obtained. Interpolation calculation is performed on the obtained processing path data of the workpiece to be processed in the preset processing cycle. Within the preset processing cycle, interpolation nodes are determined according to the time interval or processing accuracy requirements, and interpolation calculation is performed at the interpolation nodes to obtain the position information of the laser focus at each moment. The interpolation methods can include linear interpolation, spline interpolation, and polynomial interpolation, etc. For each specific processing moment, the target position where the laser focus should be located is determined. By accurately determining the target position of the laser focus at the processing moment, it helps to accurately focus the laser beam on the specified position on the workpiece surface and avoid processing errors caused by position deviation.

[0056] In some embodiments, based on the target deflection angle, a position control signal for the processing moment is generated, including: The target deflection angle is subjected to signal conversion to obtain the position control signal for the processing moment, wherein the position control signal carries the target deflection angle so that the deflection angle of the galvanometer at the processing moment is the target deflection angle.

[0057] Exemplarily, a signal conversion module can be used to convert the value of the target deflection angle into a corresponding electrical signal, that is, the position control signal, according to a specific mathematical model and rules. The signal conversion module is built-in with a conversion algorithm and circuit that match the characteristics of the galvanometer. For example, the galvanometer control system can adopt linear proportional conversion to map the angle value (target deflection angle) proportionally to the corresponding voltage value. At the same time, during the conversion process, the signal is amplified, shaped, etc. to ensure that the intensity and stability of the signal meet the control requirements of the galvanometer, so that the position control signal accurately carries the target deflection angle information. Through precise signal conversion, the target deflection angle is converted into an electrical signal recognizable by the galvanometer control system, realizing precise control of the galvanometer, ensuring that the deflection angle of the galvanometer at the processing moment is accurate, and thus ensuring that the laser focus can accurately reach the target position, improving the accuracy and precision of laser processing.

[0058] In some embodiments, based on the target angular velocity and the target correction coefficient corresponding to the processing moment, an angular velocity control signal for the processing moment is generated, including: Obtain the corresponding relationship between the preset deflection angle of the galvanometer and the correction coefficient, and based on the target deflection angle and the corresponding relationship, determine the target correction coefficient at the processing moment; Based on the target correction coefficient and the target angular velocity, determine the adjusted target angular velocity of the galvanometer at the processing moment; Perform signal conversion on the adjusted target angular velocity to obtain the angular velocity control signal at the machining moment, where the angular velocity control signal carries the adjusted target angular velocity, so as to enable the galvanometer to deflect at the target angular velocity at the machining moment.

[0059] Specifically, the corresponding relationship between the preset galvanometer deflection angle and the correction coefficient is a correspondence table established through the analysis and statistics of the physical characteristics, working environment of the galvanometer, and a large amount of experimental data during the test stage of the laser processing equipment. The corresponding relationship can be a mathematical model or a discrete data table. The adjusted target angular velocity is the angular velocity value adjusted by the target correction coefficient, which is more in line with the actual processing requirements and helps to keep the linear velocity of the laser focus constant.

[0060] During the laser processing, the target deflection angle of the galvanometer at the machining moment is obtained in real time. According to the preset corresponding relationship, the target correction coefficient corresponding to the target deflection angle is determined by means of lookup or calculation. For example, if the target deflection angle is 30°, it can be known through looking up the corresponding relationship that the target correction coefficient corresponding to the deflection angle of 30° is 1.2. The obtained target correction coefficient can be multiplied by the preset target angular velocity to obtain the adjusted target angular velocity. The calculation formula is: adjusted target angular velocity = target angular velocity × target correction coefficient. For example, if the target angular velocity is 100 rad / s and the target correction coefficient is 1.2, then the adjusted target angular velocity is 120 rad / s. By introducing the target correction coefficient to correct the target angular velocity and considering various factors in the actual operation of the galvanometer, the angular velocity is made more in line with the processing requirements. Perform signal conversion on the adjusted target angular velocity and convert it into an electrical signal form suitable for the galvanometer control system to recognize to obtain the angular velocity control signal. For example, if the adjusted target angular velocity is a digital quantity, it can be converted into an analog voltage signal through a digital-to-analog converter. The angular velocity control signal carries the information of the adjusted target angular velocity and is used to indicate how the galvanometer adjusts the deflection angular velocity at the machining moment to reach the target angular velocity. By dynamically adjusting the angular velocity, the moving speed of the laser beam on the workpiece surface is made more uniform, ensuring the uniform distribution of laser energy on the workpiece surface, avoiding the problem of uneven laser energy input caused by unstable angular velocity, and improving the processing accuracy and quality.

[0061] In some embodiments, controlling the galvanometer to deflect at the machining moment according to the galvanometer control signal to perform laser processing on the workpiece to be processed includes: Encoding the galvanometer control signal into differential control information and sending the differential control information to the galvanometer through a differential line. The differential control information is used to instruct the galvanometer to decode and extract the target deflection angle and the adjusted target angular velocity; Based on the target deflection angle, control the deflection angle of the galvanometer at the machining moment, and based on the adjusted target angular velocity, control the galvanometer to deflect at the target angular velocity at the machining moment.

[0062] Specifically, the differential control information is a data packet obtained by encoding the galvanometer control signal using an anti-interference signal encoding method. By converting the signal into a differential signal for transmission, it helps to reduce noise interference and improve the reliability of transmission. Through differential encoding technology, information such as the target deflection angle and the adjusted target angular velocity in the galvanometer control signal can be encapsulated according to specific formats and rules for stable and efficient transmission in the differential line, reducing interference and errors during signal transmission. The differential line is a physical line used to transmit differential data packets, which consists of two mutually twisted wires. The differential line transmits information through the signal difference between the two wires, which can effectively suppress common-mode interference, improve the anti-interference ability and transmission quality of signal transmission, and ensure that the galvanometer control signal can be transmitted to the galvanometer accurately and without error.

[0063] As an example, parameters such as the target deflection angle and the adjusted target angular velocity in the galvanometer control signal can be collected and quantized, converted into digital signal form, and the digital signal can be encapsulated into differential control information according to pre-set encoding rules and formats. The encoded differential control information is sent to the galvanometer through the differential line. During the sending process, the two wires of the differential line respectively transmit the positive and negative signals of the differential signal, and the receiving end restores the original data by comparing the signal differences between the two wires. After receiving the differential control information, the galvanometer can perform preprocessing operations such as amplification and filtering on the received differential control information to improve the signal-to-noise ratio. And according to the pre-set decoding rules and formats, the differential control information is decoded to extract key information such as the target deflection angle and the adjusted target angular velocity.

[0064] After obtaining the target deflection angle, the galvanometer control system calculates the corresponding drive signal according to the value of the target deflection angle, so that the galvanometer rotates according to the specified direction and speed, driving the lens of the galvanometer to deflect. In addition, the galvanometer control system can also monitor the actual deflection angle of the galvanometer in real time, compare it with the target deflection angle, and adjust the drive signal through a feedback control algorithm to ensure that the deflection angle of the galvanometer can quickly and accurately reach the target deflection angle. While controlling the deflection angle of the galvanometer, the angular velocity of the galvanometer is controlled according to the adjusted target angular velocity. Specifically, it can be achieved through a speed control algorithm. For example, a Proportional-Integral-Derivative (PID) controller is used. The PID controller calculates the corresponding control quantity according to the difference between the adjusted target angular velocity and the actual angular velocity of the galvanometer, and adjusts the power supply voltage or current according to the control quantity, so that the angular velocity of the galvanometer can quickly and stably reach the adjusted target angular velocity.

[0065] By encoding the galvanometer control signal into a differential data packet and transmitting it through a differential line, common-mode interference and electromagnetic interference can be effectively suppressed, the reliability and anti-interference ability of signal transmission can be improved, which is helpful for the accurate transmission of the galvanometer control signal and ensures the normal progress of laser processing. By decoding and extracting the differential data packet, key information such as the target deflection angle and the adjusted target angular velocity is obtained and applied to the control process of the galvanometer, so that the deflection angle and angular velocity of the galvanometer can be accurately controlled, enabling the laser focus to accurately reach the specified position on the workpiece surface, making the distribution of laser energy on the workpiece surface more uniform, and improving the quality and accuracy of laser processing.

[0066] In some embodiments, after controlling the galvanometer to deflect at the processing moment according to the galvanometer control signal, it further includes: Obtaining the current deflection angle of the galvanometer at the current moment and the target deflection angle corresponding to the current moment of the galvanometer; Determining the galvanometer deflection angle deviation between the current deflection angle and the target deflection angle corresponding to the current moment, and generating an angle adjustment instruction corresponding to the galvanometer deflection angle deviation; Adjusting the deflection angle of the galvanometer at the current moment according to the angle adjustment instruction.

[0067] Specifically, the current deflection angle is the deflection angle that the galvanometer has reached at the current moment during actual operation, which reflects the actual state of the galvanometer. The real-time state of the galvanometer can be monitored and fed back in real time through sensors (such as encoders) built into the galvanometer to obtain the actual position information of the galvanometer during the processing, that is, the current deflection angle. The target deflection angle is determined by the laser processing path planning and is the ideal deflection angle that the galvanometer should reach at a specific processing moment. The target deflection angle is a pre-calculated expected value used to guide the movement of the galvanometer. The deviation of the galvanometer deflection angle is the difference between the current deflection angle and the target deflection angle corresponding to the current moment, which reflects the deviation degree between the actual movement state and the expected movement state of the galvanometer.

[0068] Exemplarily, the current deflection angle of the galvanometer at the current moment can be collected through an angle sensor connected to the galvanometer. At the same time, the target deflection angle corresponding to the current moment of the galvanometer is obtained, and the difference between the current deflection angle and the target deflection angle is calculated to obtain the deviation of the galvanometer deflection angle. The deviation of the galvanometer deflection angle reflects the gap between the current state and the ideal state of the galvanometer. The PID algorithm can be used to generate an angle adjustment instruction corresponding to the deviation of the galvanometer deflection angle in combination with factors such as the physical characteristics, movement state, and processing accuracy requirements of the galvanometer. The angle adjustment instruction specifies the direction and amplitude that the galvanometer needs to adjust to reduce the deflection angle deviation. After receiving the angle adjustment instruction, the galvanometer control system precisely controls the galvanometer according to the information in the angle adjustment instruction. Specifically, by adjusting parameters such as the supply voltage, current, or pulse frequency of the galvanometer, the galvanometer mirror can be rotated in the specified direction and amplitude, thereby realizing the adjustment of the deflection angle of the galvanometer at the current moment. During the adjustment process, the deflection angle of the galvanometer is continuously monitored until the deflection angle deviation meets the preset accuracy requirements.

[0069] In some embodiments, obtaining the preset linear velocity of the laser focus within a preset processing cycle includes: Obtaining the material physical data, processing process data, and ambient temperature of the workpiece to be processed; Processing the material physical data, processing process data, and ambient temperature of the workpiece to be processed based on the heat conduction model to obtain the preset linear velocity.

[0070] Specifically, the material physical data of the workpiece to be processed may include the thermal conductivity, specific heat capacity, density, melting point, thermal expansion coefficient, etc. of the material. The processing process data may include laser power, pulse frequency, pulse width, spot diameter, protective gas type, etc. The ambient temperature is the temperature of the processing environment, and the ambient temperature affects the thermal equilibrium state of the workpiece and the laser system.

[0071] As an example, obtain the material physical data and processing technology data of the workpiece to be processed, and measure the actual environmental temperature at the processing site. According to the known material physical data, processing technology data and environmental temperature, consider the relationship between laser energy input and material temperature change, establish a heat conduction model suitable for the current application scenario, perform simulation calculations based on the heat conduction model, and evaluate the temperature field distribution generated when the laser acts on the material surface at different linear speeds and its impact on the material. By repeatedly adjusting the linear speed value and observing its effect until the optimal linear speed, that is, the preset linear speed, is obtained, so that the laser energy can be evenly distributed on the processing path, ensuring that the material reaches the ideal processing state without overheating or insufficiency.

[0072] It should be noted that the above example is only for understanding the present application and does not constitute a limitation on the laser processing method of the present application. Based on this technical concept, more forms of simple transformations are within the protection scope of the present application.

[0073] The present application also provides a laser processing device. Please refer to Figure 3 , the laser processing device includes: A deflection angle determination module 301, configured to determine the target position of the laser focus at the processing moment, and determine the target deflection angle of the galvanometer at the processing moment according to the target position, where the processing moment is any moment within a preset processing cycle; An angular velocity determination module 302, configured to obtain the preset linear speed of the laser focus within a preset processing cycle, and determine the target angular velocity of the galvanometer at the processing moment according to the preset linear speed and the target deflection angle; A control module 303, configured to generate a galvanometer control signal at the processing moment based on the target deflection angle and the target angular velocity, and control the galvanometer to deflect at the processing moment according to the galvanometer control signal, so as to control the deflection angle of the galvanometer at the processing moment to be the target deflection angle, and to control the angular velocity of the galvanometer at the processing moment to be the target angular velocity.

[0074] The laser processing device provided by the present application adopts the laser processing method in the above embodiment, which can solve the technical problem in the prior art that the laser energy input is uneven and the processing quality fluctuates due to controlling the deflection of the galvanometer by fixed parameters. Compared with the prior art, the beneficial effects of the laser processing device provided by the present application are the same as those of the laser processing method provided by the above embodiment, and other technical features in the laser processing device are the same as those disclosed in the method of the above embodiment, and will not be elaborated here.

[0075] The present application provides a laser processing device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the laser processing method in Embodiment 1 above.

[0076] Reference is made below Figure 4 , which shows a schematic structural diagram of a laser processing device suitable for implementing the embodiments of the present application. The Figure 4 shown laser processing device is only an example and should not impose any limitation on the functions and usage scope of the embodiments of the present application.

[0077] As Figure 4 shown, the laser processing device may include a processing device 1001 (such as a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1002 or a program loaded from a storage device 1003 into a random access memory (RAM) 1004. In the random access memory 1004, various programs and data required for the operation of the laser processing device are also stored. The processing device 1001, the read-only memory 1002, and the random access memory 1004 are connected to each other through a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Generally, the following systems may be connected to the input / output interface 1006: an input device 1007 including, for example, a touch screen, a touchpad, a keyboard, a mouse, an image sensor, a microphone, an accelerometer, a gyroscope, etc.; an output device 1008 including, for example, a liquid crystal display (LCD), a speaker, a vibrator, etc.; a storage device 1003 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 1009. The communication device 1009 can allow the laser processing device to communicate with other devices wirelessly or wiredly to exchange data. Although the figure shows a laser processing device with various systems, it should be understood that it is not required to implement or have all the shown systems. Instead, more or fewer systems may be implemented or had.

[0078] In particular, according to the embodiments disclosed in the present application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, the embodiments disclosed in the present application include a computer program product, which includes a computer program carried on a computer-readable medium. The computer program contains program codes for executing the methods shown in the flowcharts. In such an embodiment, the computer program can be downloaded and installed from a network through a communication device, or installed from a storage device 1003, or installed from a read-only memory 1002. When the computer program is executed by a processing device 1001, the above functions defined in the methods of the embodiments disclosed in the present application are executed.

[0079] The laser processing equipment provided by the present application adopts the laser processing method in the above embodiments, and can solve the technical problem in the prior art that the deflection of the galvanometer is controlled by fixed parameters, resulting in uneven input of laser energy and fluctuating processing quality. Compared with the prior art, the beneficial effects of the laser processing equipment provided by the present application are the same as those of the laser processing method provided by the above embodiments, and other technical features in the laser processing equipment are the same as those disclosed in the method of the previous embodiment, and will not be elaborated here.

[0080] It should be understood that the various parts disclosed in the present application can be implemented by hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0081] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present application, and all of them should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

[0082] The present application provides a computer-readable storage medium with computer-readable program instructions (i.e., computer programs) stored thereon, and the computer-readable program instructions are used to execute the laser processing method in the above embodiments.

[0083] The computer-readable storage medium provided by this application can be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or components, or any combination of the above. More specific examples of computer-readable storage media can include, but are not limited to: electrical connections with one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above. In this embodiment, the computer-readable storage medium can be any tangible medium that contains or stores a program, and this program can be used by or in combination with an instruction execution system, device, or component. The program code contained on the computer-readable storage medium can be transmitted by any appropriate medium, including but not limited to: wires, optical cables, RF (radio frequency), etc., or any suitable combination of the above.

[0084] The above computer-readable storage medium can be included in a laser processing device; or it can exist separately without being assembled into the laser processing device.

[0085] The above computer-readable storage medium carries one or more programs. When the one or more programs are executed by a laser processing device, the laser processing device is caused to: determine the target position of the laser focus at the processing moment, determine the target deflection angle of the galvanometer at the processing moment, where the processing moment is any moment within a preset processing cycle; obtain the preset linear velocity of the laser focus within the preset processing cycle, and determine the target angular velocity of the galvanometer at the processing moment based on the preset linear velocity and the target deflection angle; generate a galvanometer control signal at the processing moment based on the target deflection angle and the target angular velocity, and control the deflection of the galvanometer at the processing moment according to the galvanometer control signal, so as to control the deflection angle of the galvanometer at the processing moment to be the target deflection angle, and to control the angular velocity of the galvanometer at the processing moment to be the target angular velocity.

[0086] Computer program code for performing the operations of this application can be written in one or more programming languages or combinations thereof. The above-mentioned programming languages include object-oriented programming languages such as Java, Smalltalk, C++, and also include conventional procedural programming languages such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, executed as an independent software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer can be connected to the user's computer through any kind of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or it can be connected to an external computer (for example, by using an Internet service provider to connect through the Internet).

[0087] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of the code, and this module, program segment, or part of the code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than that marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, and the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0088] The modules described in the embodiments of this application can be implemented in software or in hardware. Among them, the name of the module does not constitute a limitation to the unit itself in some cases.

[0089] The readable storage medium provided in this application is a computer-readable storage medium. The computer-readable storage medium stores computer-readable program instructions (i.e., computer programs) for performing the above-mentioned laser processing method, and can solve the technical problem in the prior art that the deflection of the galvanometer is controlled by fixed parameters, resulting in uneven input of laser energy and fluctuating processing quality. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as those of the laser processing method provided in the above embodiments, and will not be elaborated here.

[0090] The present application also provides a computer program product, including a computer program which, when executed by a processor, implements the steps of the laser processing method as described above.

[0091] The computer program product provided by the present application can solve the technical problem in the prior art that the deflection of the galvanometer is controlled by fixed parameters, resulting in uneven input of laser energy and fluctuating processing quality. Compared with the prior art, the beneficial effects of the computer program product provided by the present application are the same as those of the laser processing method provided by the above embodiments, and will not be elaborated here.

[0092] The above are only partial embodiments of the present application, and do not limit the patent scope of the present application accordingly. Any equivalent structural transformation made under the technical concept of the present application by using the content of the specification and drawings of the present application, or any direct / indirect application in other related technical fields, is included in the patent protection scope of the present application.

Claims

1. A laser processing method, characterized in that, The laser processing method includes: Determining a target position of a laser focus at a processing moment, and determining a target deflection angle of a galvanometer at the processing moment according to the target position, where the processing moment is any moment within a preset processing cycle; Obtaining a preset linear velocity of the laser focus within the preset processing cycle, and determining a target angular velocity of the galvanometer at the processing moment according to the preset linear velocity and the target deflection angle; Generating a galvanometer control signal at the processing moment based on the target deflection angle and the target angular velocity, and controlling the galvanometer to deflect at the processing moment according to the galvanometer control signal, so as to control the deflection angle of the galvanometer at the processing moment to be the target deflection angle, and to control the angular velocity of the galvanometer at the processing moment to be the target angular velocity.

2. The laser processing method according to claim 1, characterized in that, The generating a galvanometer control signal at the processing moment based on the target deflection angle and the target angular velocity, and controlling the galvanometer to deflect at the processing moment according to the galvanometer control signal includes: Generating a position control signal at the processing moment based on the target deflection angle; Obtaining a target correction coefficient corresponding to the processing moment, and generating an angular velocity control signal at the processing moment based on the target angular velocity and the target correction coefficient, where the target correction coefficient is used to correct the target angular velocity; Generating a galvanometer control signal at the processing moment according to the position control signal and the angular velocity control signal, and controlling the galvanometer to deflect at the processing moment according to the galvanometer control signal.

3. The laser processing method according to claim 1, characterized in that, The determining a target deflection angle of a galvanometer at the processing moment according to the target position includes: Calculating a target deflection angle of the galvanometer corresponding to the target position at the processing moment by using a geometric calculation formula according to the target position, where the geometric calculation formula is determined based on a laser propagation path and a positional relationship between the galvanometer and a workpiece.

4. The laser processing method according to claim 1, wherein The determining a target position of a laser focus at a processing moment includes: Obtaining processing path data of a workpiece to be processed within the preset processing cycle; Performing interpolation calculation on the processing path data to obtain positions of the laser focus at each moment within the preset processing cycle, and determining the target position of the laser focus at the processing moment from the positions of the laser focus at each moment within the preset processing cycle.

5. The laser processing method according to claim 2, characterized in that, The generating an angular velocity control signal at the processing moment based on the target angular velocity and the target correction coefficient includes: Obtaining a corresponding relationship between a deflection angle of a galvanometer and a correction coefficient set in advance, and determining the target correction coefficient at the processing moment based on the target deflection angle and the corresponding relationship; Determining an adjusted target angular velocity of the galvanometer at the processing moment based on the target correction coefficient and the target angular velocity; Performing signal conversion on the adjusted target angular velocity to obtain the angular velocity control signal at the processing moment, where the angular velocity control signal carries the adjusted target angular velocity, so as to control the galvanometer to deflect at the processing moment at the target angular velocity.

6. The laser processing method according to claim 5, characterized in that, Controlling the galvanometer to deflect at the processing moment according to the galvanometer control signal includes: Encoding the galvanometer control signal into differential control information, and sending the differential control information to the galvanometer through a differential line. The differential control information is used to instruct the galvanometer to decode and extract the target deflection angle and the adjusted target angular velocity; Based on the target deflection angle, controlling the deflection angle of the galvanometer at the processing moment, and based on the adjusted target angular velocity, controlling the galvanometer to deflect at the target angular velocity at the processing moment.

7. The laser processing method according to claim 1, wherein, After controlling the galvanometer to deflect at the processing moment according to the galvanometer control signal, it further includes: Obtaining the current deflection angle of the galvanometer at the current moment and the target deflection angle corresponding to the current moment of the galvanometer; Determining the galvanometer deflection angle deviation between the current deflection angle and the target deflection angle corresponding to the current moment, and generating an angle adjustment instruction corresponding to the galvanometer deflection angle deviation; Adjusting the deflection angle of the galvanometer at the current moment according to the angle adjustment instruction.

8. The laser processing method according to claim 1, wherein Obtaining the preset linear velocity of the laser focus within the preset processing cycle includes: Obtaining the material physical data, processing process data and environmental temperature of the workpiece to be processed; Processing the material physical data, the processing process data and the environmental temperature of the workpiece to be processed based on a heat conduction model to obtain a preset linear velocity.

9. A laser processing device, characterized in that, The device includes: a memory, a processor, and a computer program stored on the memory and executable on the processor. The computer program is configured to implement the steps of the laser processing method according to any one of claims 1 to 8.

10. A storage medium, characterized in that, The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, it implements the steps of the laser processing method according to any one of claims 1 to 8.

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