Laser processing device, system and method

Abstract

The invention discloses a laser processing device, system and method. The laser processing device comprises a light splitting assembly, a nozzle and a shell. The light splitting assembly is arranged in the shell and used for forming different laser spots at the front position and the rear position of the surface of a to-be-machined workpiece in the machining advancing direction so that the to-be-machined workpiece can be synchronously machined and cleaned at the front position and the rear position. The nozzle is arranged on the light emitting side of the shell, and a through laser channel is formed in the nozzle and used for allowing laser to pass through and forming a machining laser spot and a cleaning laser spot on the surface of the workpiece to be machined. Light splitting and reflection can be carried out through the light splitting assembly, two different laser spots are formed on the surface of the workpiece to be machined, and therefore welding and cleaning are completed in sequence through one-time machining technology, and the machining efficiency is improved; and in the welding process, no extra protective gas needs to be introduced or little protective gas is introduced to prevent the welding seam from being oxidized.

Description

Technical Field

[0001] The present invention belongs to the technical field of laser processing, and particularly relates to a laser processing device, system and method. Background Art

[0002] With the rapid development of modern industrial technology, laser welding, as an efficient, precise and environmentally friendly joining technology, has been widely applied in many fields such as aerospace, automotive manufacturing, electronic communication, medical devices, etc. Laser welding uses a high-energy density laser beam as a heat source to quickly melt and solidify the welded materials, thereby achieving a firm connection of the materials.

[0003] In laser welding technology, the welding torch, as the output and focusing device of the laser beam, its performance directly determines the quality and efficiency of welding. Traditional welding torch designs often only focus on the welding function and cannot integrate the cleaning function.

[0004] In recent years, many improved laser welding torches have emerged, which can simultaneously achieve welding and cleaning functions. However, when switching functions, it is necessary to manually disassemble and replace the focusing lens, change the position of the focusing lens manually, and also manually replace the nozzles corresponding to welding and cleaning. It is impossible to use the same set of nozzles to perform both welding and cleaning simultaneously, and the operation is very cumbersome and time-consuming, affecting the duration and complexity during the processing. In addition, when existing laser welding torches perform welding, a shielding gas needs to be provided, which is used to protect the atmosphere at the welding position and isolate it from the air to prevent the welding position from being oxidized by the air during welding. Summary of the Invention

[0005] In view of this, the present invention provides a laser processing device, system and method.

[0006] To solve the above technical problems, the technical solution adopted by the present invention is as follows:

[0007] A laser processing device includes: a beam splitting component, a nozzle, and a housing;

[0008] The beam splitting component is arranged in the housing and is used to form different laser spots at two different positions in the front and back on the surface of the workpiece to be processed along the processing traveling direction, so as to simultaneously perform processing and cleaning on the workpiece to be processed at the two different positions respectively;

[0009] The nozzle is arranged on the light output side of the housing, and a through laser channel is arranged inside the nozzle, which is used to allow the laser to pass through and form a processing laser spot and a cleaning laser spot on the surface of the workpiece to be processed.

[0010] Preferably, it further includes a light guide rod, and the light guide rod is arranged before the laser light incident side of the beam splitting component and is used to conduct the laser to the beam splitting component.

[0011] Preferably, the beam splitting component is specifically configured to split the conducted laser into a first path of laser for cleaning at a first position and a second path of laser for welding at a second position.

[0012] Preferably, the beam splitting component is specifically configured to split the conducted laser into a third path of laser for cleaning at a third position and a fourth path of laser for cutting at a fourth position.

[0013] Preferably, the beam splitting component includes a beam splitter and a galvanometer;

[0014] The beam splitter is configured to reflect and transmit the conducted laser. Among them, after reflection, a first path of laser is formed and a laser spot for cleaning is formed at a first position on the surface of the workpiece to be processed. After transmission, it reaches the galvanometer and forms a second path of laser after being reflected by the galvanometer. The second path of laser forms a laser spot for welding at a second position on the surface of the workpiece to be processed.

[0015] Preferably, the beam splitting component includes a beam splitter and a galvanometer;

[0016] The beam splitter is configured to split the conducted laser into reflection and transmission. Among them, after reflection, a third path of laser is formed and a laser spot for cleaning is formed at a third position on the surface of the workpiece to be processed. After transmission, it reaches the galvanometer and forms a fourth path of laser after being reflected by the galvanometer. The fourth path of laser forms a laser spot for cutting at a fourth position on the surface of the workpiece to be processed.

[0017] Preferably, the galvanometer is further configured to match the weld width or cutting seam width required by the workpiece to be processed by adjusting the position or changing the swing amplitude.

[0018] Preferably, it further includes an adjustment component connected to the beam splitter for adjusting the position of the beam splitter so as to adjust the position and energy distribution formed by different laser spots on the surface of the workpiece to be processed.

[0019] A laser processing method, which includes a processing process and a cleaning process. The method includes:

[0020] Forming different laser spots at two different positions in the front and back on the surface of the workpiece to be processed along the processing advancing direction. The different laser spots are formed by reflecting, transmitting, and then reflecting the laser through the beam splitting component;

[0021] Synchronously performing processing and cleaning on the workpiece to be processed at the two different positions in the front and back respectively.

[0022] A laser processing system, which includes a laser generation device and a laser processing device;

[0023] The laser generation device is connected to the laser processing device, and is used to generate laser and transmit it to the laser processing device;

[0024] Alternatively, the system includes a laser generation device, a functional air compressor, and a laser processing device;

[0025] The laser generation device is connected to the laser processing device, and is used to generate laser and transmit it to the laser processing device. The functional air compressor is used to generate compressed air and transport it to the vicinity of the nozzle to blow away dust.

[0026] Implementing the embodiments of the present invention will at least have the following beneficial effects:

[0027] Through the beam splitting component, the present invention can perform beam splitting and reflection, and form two different laser spots on the surface of the workpiece to be processed, so that the welding and cleaning processes are completed successively in one processing step, and the processing efficiency is greatly improved compared with the case of performing welding and cleaning processes separately; in addition, it also makes it unnecessary to introduce additional protective gas or introduce less protective gas during the welding process to prevent the weld from oxidizing, greatly reducing the use cost. Specifically, for example, no protective gas needs to be provided during welding. After the first spot (welding laser spot) completes welding of the workpiece to be processed, the second spot (cleaning laser spot) immediately cleans the weld, so as to achieve the required weld quality and aesthetic requirements. Or, a small amount of protective gas is provided during welding. After the first spot completes welding, the second spot immediately cleans the weld, so as to achieve the required weld quality and aesthetic requirements. Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0029] Figure 1 It is a schematic structural diagram of a laser processing device in an embodiment.

[0030] Figure 2 It is a schematic diagram of the laser optical path of a laser processing device in an embodiment.

[0031] Figure 3 For Figure 2 It is an enlarged schematic diagram of two laser spots formed by the laser beam on the surface of the workpiece to be processed in

[0032] Figure 4 It is a schematic diagram of the laser optical path of a laser processing device in another embodiment.

[0033] Among them, 1 - beam splitting component, 2 - nozzle, 3 - housing, 4 - light guide rod;

[0034] 11 - beam splitting sheet, 12 - galvanometer. Specific implementation manner

[0035] In the drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and cannot be construed as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0036] It should be noted that in this article, the term "comprising", "including" or any other variant thereof is intended to cover non - exclusive inclusion, so that a process, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of another identical element in the process, article or device including that element.

[0037] The following will be combined with Figures 1 to 4 to further explain the laser processing device involved in the present invention in detail.

[0038] In an embodiment of a laser processing device, as Figures 1 - 3 shown, the laser processing device includes: a beam splitting component 1, a nozzle 2, and a housing 3;

[0039] The beam splitting component 1 is arranged inside the housing 3 and is used to form different laser spots at two different positions in the front and back on the surface of the workpiece to be processed along the processing advancing direction, so as to synchronously process and clean the workpiece to be processed at the two different positions; the nozzle 2 is arranged on the light - emitting side of the housing 3, and a through - hole laser channel is arranged inside the nozzle 3 for allowing the laser to pass through and form a welding laser spot and a cleaning laser spot on the surface of the workpiece to be processed.

[0040] It should be noted that Figure 1 shows the structure of a handheld laser welding gun, but the present invention is not limited to the field of handheld laser welding guns. The present invention is equally applicable to the laser head structure in the field of non - handheld welding equipment, so it also belongs to the protection scope of the present invention.

[0041] In this embodiment, the laser processing device can split and reflect light through the beam splitting component 1, and form different laser spots at different positions on the surface of the workpiece to be processed, thereby completing the welding process and the cleaning process simultaneously. Moreover, it is not necessary to additionally introduce a shielding gas or introduce less shielding gas during the welding process to isolate air and prevent the weld from oxidizing. Also, the same nozzle is used without replacing the nozzle 3 to perform the welding process and the cleaning process simultaneously.

[0042] In an embodiment of a laser processing device, the laser processing device further includes a light guide rod 4, and the light guide rod 4 is arranged before the laser incident side of the beam splitting component 1 for conducting laser to the beam splitting component 1.

[0043] Specifically, the beam splitting component 1 is specifically configured to split the conducted laser into a first path of laser for cleaning at the first position and a second path of laser for welding at the second position.

[0044] It should be noted that the distance between the centers of the first position and the second position is 2 mm ± 1 mm, that is, the distance between the centers of the cleaning laser spot and the welding laser spot is 2 mm ± 1 mm.

[0045] In an embodiment of a laser processing device, the beam splitting component 1 includes a beam splitter 11 and a galvanometer 12;

[0046] The beam splitter 11 is used to split and reflect the conducted laser. Among them, the first path of laser is reflected to the first position on the surface of the workpiece to be processed to form a laser spot for cleaning, and after passing through and being reflected by the galvanometer 12 after transmission, a second path of laser is formed. The second path of laser forms a laser spot for welding at the second position on the surface of the workpiece to be processed.

[0047] Exemplarily, when welding is required, the beam splitting component 1 reflects part of the laser to form a first path of laser.

[0048] The first path of laser is focused on the first position on the surface of the workpiece to be processed to form a laser spot for cleaning.

[0049] By adjusting the power and focusing degree of the laser, precise welding of the workpiece can be achieved to form a high-quality weld.

[0050] Simultaneously with or subsequent to cleaning is the welding process. The beam splitting component 1 also transmits another part of the laser to form a second path of laser.

[0051] The transmitted second laser beam will be further adjusted by the galvanometer 12 and finally form a laser spot for welding at the second position on the surface of the workpiece to be processed, so as to remove residues such as oxides, soot and chips generated during the welding process and make the weld surface smoother and neater.

[0052] It should be noted that along the welding direction, that is, the forward direction on the workpiece to be processed, there is a welding laser spot for welding. Behind the laser spot for welding is the cleaning laser spot for cleaning. It is equivalent that the welding laser spot and the cleaning laser spot are in the front and back positions. For the same position, the welding laser spot is formed first, that is, welding is carried out first. As the process progresses, the cleaning laser spot is then formed, that is, cleaning is carried out later.

[0053] However, from the perspective of the entire process, the welding process and the cleaning process are carried out synchronously, and there is no need to carry out a separate cleaning process after welding is completed.

[0054] Furthermore, the galvanometer 12 is also used to change the swing amplitude by adjusting the position to match the weld width required by the workpiece to be processed.

[0055] Exemplarily, the galvanometer 12 mainly consists of a swingable mirror and an actuator for driving the mirror to swing.

[0056] In the laser processing device, the galvanometer 12 guides the laser beam to a specific position. By quickly and precisely swinging the mirror, the laser beam can scan a predetermined trajectory on the workpiece surface, thereby realizing the welding process.

[0057] Furthermore, the beam splitting component 1 further includes an adjustment component, which is connected to the beam splitting plate 11 and is used to adjust the incident angle and set position of the beam splitting plate 11 so as to adjust the position and energy distribution formed by different laser spots on the surface of the workpiece to be processed.

[0058] Exemplarily, the adjustment component changes the incident angle of the beam splitting plate 11: The adjustment of the incident angle directly affects the angle at which the laser beam enters the beam splitting plate 11, and further affects the path and direction of the laser beam after beam splitting.

[0059] By precisely controlling the incident angle, it can be ensured that the laser beam is accurately split into two paths: one path is for welding and the other path is for cleaning.

[0060] The adjustment of the incident angle can also help optimize the focusing effect of the laser beam on the surface of the workpiece to be processed and improve the quality of welding and cleaning.

[0061] The adjustment component changes the set position of the beam splitting plate 11, thereby adjusting the optical path length during the beam splitting process of the laser and affecting the energy distribution and spot size of the laser.

[0062] It should be noted that the setting position is to adjust the distance between the beam splitter 11 and the light guide rod 4, which can also be said to adjust the front and back positions of the beam splitter 1 in the first direction.

[0063] That is, by moving the beam splitter 11 back and forth, the center point distance between the first position and the second position is adjusted, that is, the center point distance between the welding laser spot and the cleaning laser spot.

[0064] By adjusting the front and back positions of the beam splitter 11, the energy ratio of the two laser beams can be flexibly controlled to meet the requirements of different welding and cleaning tasks.

[0065] Adjusting the front and back positions can also help compensate for the laser energy loss caused by factors such as workpiece material and thickness, ensuring the consistency and stability of welding and cleaning.

[0066] It should be noted that Figure 3 For magnification, the welding laser spot and the cleaning laser spot formed on the surface of the workpiece to be processed are schematically drawn.

[0067] In the direction of welding progress, the welding laser spot is located in front of the cleaning laser spot, which ensures that welding is performed first and then cleaning is carried out. That is, after the first laser beam completes welding, the second laser beam with 10% ± 5% of the laser energy reflected by the beam splitter 11 is used to clean the weld seam, and a bright, smooth surface quality is obtained.

[0068] In another embodiment of the laser processing device, as Figure 1 、 4 shown, the laser processing device includes: a beam splitting assembly 1, a nozzle 2, and a housing 3;

[0069] The beam splitting assembly 1 is arranged in the housing 3 and is used to form different laser spots at two different positions on the surface of the workpiece to be processed along the processing progress direction, so as to sequentially complete the cutting and cleaning of the workpiece to be processed; the nozzle 2 is arranged on the light output side of the housing 3 and is used for both the cutting process and the cleaning process. Therefore, there is no need to replace the nozzle 3 during the cutting process and the cleaning process.

[0070] The nozzle 3 is internally provided with a through laser channel to enable the laser to pass through and be emitted.

[0071] In this embodiment, the laser processing device can split and reflect light through the beam splitting assembly 1, and form different laser spots at two different positions on the surface of the workpiece to be processed, so as to simultaneously complete the cutting process and the cleaning process, and the same nozzle is used without replacing the nozzle 3 to perform the cutting process and the cleaning process simultaneously.

[0072] In another embodiment of the laser processing device, the laser processing device further includes a light guide rod 4, which is arranged before the laser incident side of the beam splitting component 1 and is used to conduct the laser to the beam splitting component 1.

[0073] Specifically, the beam splitting component 1 is specifically configured to split the conducted laser into a third path of laser for cleaning at the third position and a fourth path of laser for cutting at the fourth position.

[0074] It should be noted that the center point distance between the third position and the fourth position is 2mm ± 1mm, that is, the center point distance between the cleaning laser spot and the cutting laser spot is 2mm ± 1mm.

[0075] In another embodiment of the laser processing device, the beam splitting component 1 includes a beam splitting plate 11 and a galvanometer 12;

[0076] The beam splitting plate 11 is used to split and reflect the conducted laser. Among them, the third path of laser is reflected to the third position on the surface of the workpiece to be processed to form a laser spot for cleaning, and after passing through and being reflected by the galvanometer 12 after transmission, it forms a fourth path of laser, and the fourth path of laser forms a laser spot for cutting at the fourth position on the surface of the workpiece to be processed.

[0077] Exemplarily, when cutting is required, the beam splitting component 1 will reflect part of the laser to form a third path of laser.

[0078] The first path of laser will be focused on the first position on the surface of the workpiece to be processed to form a laser spot for cleaning.

[0079] By adjusting the power and focusing degree of the laser, precise cutting of the workpiece can be achieved, forming smooth and neat cutting edges.

[0080] Simultaneously with or subsequent to cleaning is the cutting process. The beam splitting component 1 will also transmit another part of the laser to form a fourth path of laser.

[0081] The transmitted third path of laser will be further adjusted by the galvanometer 12 and finally form a laser spot for cleaning at the third position on the surface of the workpiece to be processed to remove residues such as oxides, soot, and chips generated during the cutting process, making the cutting edge smoother and neater.

[0082] It should be noted that along the cutting direction, that is, the advancing direction on the workpiece to be processed, there is a laser spot for cutting (which can also be called the cutting spot). Behind the laser spot for cutting is the laser spot for cleaning (which can also be called the cleaning laser spot). It is equivalent to the cutting spot and the cleaning laser spot being in a front-back position. For the same position, the cutting spot is formed first, that is, cutting is carried out first. As the process advances, the cleaning laser spot is then formed, that is, cleaning is carried out later.

[0083] However, from the perspective of the entire process, the cutting process and the cleaning process are carried out simultaneously, and there is no need to carry out a separate cleaning process after the cutting process is completed.

[0084] In another embodiment, the beam splitter 11 is further configured to split and reflect the conducted laser. Among them, the third laser beam is reflected to the surface of the workpiece to be processed to form a laser spot for cleaning, and after passing through, it reaches the galvanometer 12 and forms a fourth laser beam after being reflected by the galvanometer;

[0085] The galvanometer 12 is configured to form a laser spot for cutting on the surface of the workpiece to be processed with the fourth laser beam.

[0086] Furthermore, the galvanometer 12 is further configured to change the swing amplitude by adjusting the position to match the cutting seam width required by the workpiece to be processed.

[0087] Exemplarily, the galvanometer 12 mainly consists of a swingable mirror and an actuator for driving the mirror to swing.

[0088] In the laser processing device, the galvanometer 12 guides the laser beam to a specific position. By quickly and precisely swinging the mirror, the laser beam can scan a predetermined trajectory on the workpiece surface, thereby achieving cleaning.

[0089] Furthermore, the beam splitting assembly 1 further includes an adjustment assembly, which is connected to the beam splitter 11 and is configured to adjust the incident angle and the setting position of the beam splitter 11 to adjust the position and energy distribution formed by different laser spots on the surface of the workpiece to be processed.

[0090] Exemplarily, the adjustment assembly changes the incident angle of the beam splitter 11: The adjustment of the incident angle directly affects the angle at which the laser beam enters the beam splitter 11, and further affects the path and direction of the laser beam after being split.

[0091] By precisely controlling the incident angle, it can be ensured that the laser beam is accurately divided into two paths: one path is for the cutting process, and the other path is for the cleaning process.

[0092] The adjustment of the incident angle can also help optimize the focusing effect of the laser beam on the surface of the workpiece to be processed and improve the quality of welding and cleaning.

[0093] The adjustment component changes the front - rear position of the beam splitter 11, thereby adjusting the optical path length during the beam splitting of the laser, affecting the energy distribution and spot size of the laser.

[0094] It should be noted that the set position is to adjust the distance between the beam splitter 11 and the light - guiding rod 4, which can also be said to adjust the front - rear position of the beam splitter 1 along the first direction.

[0095] That is, by moving the beam splitter 11 back and forth, the center - point distance between the third position and the fourth position is adjusted, that is, the center - point distance between the welding laser spot and the cleaning laser spot.

[0096] By adjusting the front - rear position of the beam splitter 11, the energy ratio of the two - path laser can be flexibly controlled to meet the requirements of different cutting and cleaning tasks.

[0097] The adjustment of the front - rear position can also help compensate for the laser energy loss caused by factors such as workpiece material and thickness, ensuring the consistency and stability of cutting and cleaning.

[0098] The following further elaborates on the laser processing method involved in the present invention.

[0099] In an embodiment of a laser processing method, the laser processing method includes:

[0100] Forming different laser spots at two different front - rear positions on the surface of the workpiece to be processed along the processing advancing direction, and the different laser spots are formed by the beam splitting component 1 through reflection, transmission and then reflection of the laser;

[0101] Synchronously performing welding and cleaning on the workpiece to be processed at the two different front - rear positions.

[0102] Specifically, under the synchronous action of the two laser spots, the oxidized and blackened part of the surface of the weld formed during the previous laser spot welding is effectively removed by the subsequent cleaning laser spot, the surface of the workpiece is cleaned, and the weld quality and aesthetics are also improved to meet the requirements.

[0103] Precisely because the present application can perform the welding process and the cleaning process synchronously, one welding process not only completes the welding but also the cleaning process, and it also makes it unnecessary to introduce additional shielding gas or less shielding gas during the welding process to isolate air and prevent weld oxidation.

[0104] In an embodiment of a laser processing method, the laser processing method includes:

[0105] Forming different laser spots at two different front - rear positions on the surface of the workpiece to be processed along the processing advancing direction, and the different laser spots are formed by the beam splitting component through reflection, transmission and then reflection of the laser;

[0106] Cutting and cleaning of the workpiece to be processed are synchronously carried out at the two different positions before and after respectively.

[0107] Specifically, under the synchronous action of two laser spots, the oxidized and blackened parts at the edges of the cutting seams formed during the previous laser spot cutting are effectively removed by the subsequent cleaning laser spot. The surface of the workpiece is cleaned, and the quality and appearance of the cutting seams are also improved to meet the requirements.

[0108] Precisely because the present application can synchronously perform the cutting process and the cleaning process, the cutting process not only completes the cutting but also the cleaning process in one pass. This also enables no need to additionally introduce a protective gas or less protective gas during the cutting process to isolate the air and prevent oxidation of the cutting seams.

[0109] In an embodiment of a laser processing system, the system includes a laser generating device and a laser processing device; the laser generating device is connected to the laser processing device for generating laser and transmitting it to the laser processing device.

[0110] The laser processing device adopts the setting of the above embodiment.

[0111] In a laser processing system, the system includes a laser generating device, a functional air compressor and a laser processing device;

[0112] The laser generating device is connected to the laser processing device for generating laser and transmitting it to the laser processing device, and the functional air compressor is used for generating compressed air and delivering it near the nozzle to blow away the soot.

[0113] Since the present invention adopts the method of welding (or cutting) first and then cleaning, after welding is completed, the oxidized parts on the welds (or on the edges of the cutting seams) are effectively removed by the subsequent cleaning step. In this way, there is no need to provide a protective gas during welding (or cutting) to prevent oxidation. During the process, the functional air compressor is used to blow out air, which is completely different from the prior art that needs to blow the protective gas through a nitrogen cylinder or a nitrogen generator. The air blown out by the functional air compressor is used to blow away the soot generated during welding, cutting and cleaning, replacing the blown protective gas in the prior art, and greatly reducing the cost.

[0114] The functional air compressor can be set as a small compressor and integrated into the system.

[0115] The laser processing device adopts the setting of the above embodiment.

[0116] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0117] The above embodiments only express several implementation manners of the present invention, and the description is relatively specific and detailed, but it cannot be understood as a limitation to the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A laser processing device, characterized in that, Comprising: A beam splitting component, a nozzle, and a housing; The beam splitting component is disposed within the housing and is configured to form different laser spots at two different positions, front and back, on the surface of a workpiece to be processed along the processing travel direction, so as to synchronously perform processing and cleaning of the workpiece to be processed at the two different positions respectively; The nozzle is disposed on the light-emitting side of the housing. A through laser channel is provided inside the nozzle for allowing laser to pass through and form a processing laser spot and a cleaning laser spot on the surface of the workpiece to be processed.

2. The laser processing device according to claim 1, characterized in that, It further includes a light guide rod, which is disposed before the laser incident side of the beam splitting component and is used for conducting laser to the beam splitting component.

3. The laser processing apparatus according to claim 1, wherein The beam splitting component is specifically configured to split the conducted laser into a first path of laser for cleaning at a first position and a second path of laser for welding at a second position.

4. The laser processing apparatus according to claim 1, characterized in that, The beam splitting component is specifically configured to split the conducted laser into a third path of laser for cleaning at a third position and a fourth path of laser for cutting at a fourth position.

5. The laser processing device according to claim 1, characterized in that, The beam splitting component includes a beam splitter and a galvanometer; The beam splitter is used for reflecting and transmitting the conducted laser. Among them, the reflected laser forms a first path of laser and forms a laser spot for cleaning at a first position on the surface of the workpiece to be processed. The transmitted laser reaches the galvanometer and forms a second path of laser after being reflected by the galvanometer. The second path of laser forms a laser spot for welding at a second position on the surface of the workpiece to be processed.

6. The laser processing device according to claim 1, characterized in that, The beam splitting component includes a beam splitter and a galvanometer; The beam splitter is used for splitting and reflecting and transmitting the conducted laser. Among them, the reflected laser forms a third path of laser and forms a laser spot for cleaning at a third position on the surface of the workpiece to be processed. The transmitted laser reaches the galvanometer and forms a fourth path of laser after being reflected by the galvanometer. The fourth path of laser forms a laser spot for cutting at a fourth position on the surface of the workpiece to be processed.

7. The laser processing apparatus according to claim 5 or 6, characterized in that, The galvanometer is further configured to match the weld width or cutting seam width required by the workpiece to be processed by adjusting the position or changing the swing amplitude.

8. The laser processing apparatus according to claim 5, wherein It further includes an adjustment component, which is connected to the beam splitter and is used for adjusting the position of the beam splitter so as to adjust the positions and energy distributions of different laser spots formed on the surface of the workpiece to be processed.

9. A laser processing method, which includes a processing process and a cleaning process, is characterized in that, The method includes: Forming different laser spots at two different positions, front and back, on the surface of a workpiece to be processed along the processing travel direction. The different laser spots are formed by reflecting, transmitting, and then reflecting the laser by the beam splitting component; Synchronously performing processing and cleaning of the workpiece to be processed at the two different positions respectively.

10. A laser processing system, characterized in that, The system includes a laser generating device and a laser processing device as described in any one of claims 1 - 8; The laser generating device is connected to the laser processing device and is used for generating laser and transmitting it to the laser processing device; Alternatively, the system includes a laser generating device, a functional air compressor, and a laser processing device as described in any one of claims 1 - 8; The laser generating device is connected to the laser processing device and is used for generating laser and transmitting it to the laser processing device. The functional air compressor is used for generating compressed air and delivering it near the nozzle to blow away the dust.

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